TWI757132B - Storage device for semiconductor object container - Google Patents

Abstract

A storage device for semiconductor object container includes a main body, an object container, and a door board. The main body has an accommodating space therein, and nitrogen can be filled in the accommodating space. The main body has an opening at a side thereof, and the opening is in spatial communication with the accommodating space. The object container is configured to contain a semiconductor object (e.g., a mask or a wafer), and the door board is connected to the object container. When the object container is disposed in the accommodating space, the door board covers the opening, so that the opening is closed. When the object container is taken out from the accommodating space, the door board leaves the opening, so that the opening is opened. Accordingly, the structure is simplified, the cost is reduced, and the door board can be easily opened or closed.

Description

Semiconductor object container storage device

The present invention relates to a container storage device for semiconductor objects, in particular to a storage device capable of accommodating containers for semiconductor objects (such as photomasks or wafers).

Containers such as mask boxes and wafer boxes can be used to place semiconductor objects such as masks and wafers. They are mainly used to prevent semiconductor objects such as masks and wafers from external dust particles and chemical pollution. The above-mentioned semiconductor object container can be further placed in a storage device, and the opening of the storage device is provided with a gate to selectively open and close the opening, so that the interior of the storage device can be maintained airtight, so that nitrogen gas or ultra-clean can be input. gas etc. The above-mentioned gate needs to be driven by a linkage mechanism when opening and closing, which is troublesome to operate, and the driving structure of the linkage mechanism is complicated, which also leads to an increase in manufacturing and maintenance costs.

The technical problem to be solved by the present invention is to provide a semiconductor object container storage device in view of the shortcomings of the prior art, which can simplify the structure, reduce the cost, and make the opening and closing of the door panel simple and easy.

In order to solve the above-mentioned technical problems, the present invention provides a semiconductor object container storage device, comprising: a main body, a receiving space is formed in the main body, an opening is provided on one side of the main body, and the opening is communicated with the receiving space; an object A container, the object container can be used to accommodate semiconductor objects; and a door panel, the door panel is connected to the object container, so that the door panel can move synchronously with the object container; wherein when the object container is placed in the accommodating space, the door panel The cover is placed at the opening to close the opening; when the object container is taken out from the accommodating space, the door plate leaves the opening to open the opening.

Preferably, a support member is arranged in the accommodating space of the main body, and the support member can be used to support the object container, so that the object container is set up in the main body.

Preferably, a through hole is arranged on the door plate, the through hole is arranged on the door plate near the bottom side, the through hole penetrates the opposite sides of the door plate, and an open space is formed in the body, and the open space and the through hole are formed. The holes communicate with each other, the accommodating space and the open space are respectively located at the upper and lower parts of the body, and the accommodating space is separated from the open space.

The beneficial effect of the present invention is that the semiconductor object container storage device provided by the present invention includes a main body, an object container and a door panel. An accommodating space is formed in the main body, an opening is arranged on one side of the main body, the object container can be used for accommodating semiconductor objects, and the door panel is connected to the object container, so that the door panel can move synchronously with the object container. When the object container is placed in the accommodating space, the door plate cover is placed at the opening to close the opening; when the object container is taken out from the accommodating space, the door plate leaves the opening to open the opening. The invention can use the movement of the object container to link the door panel, so that the door panel can open and close the opening of the main body, so there is no need to set up an additional linkage mechanism to open and close the opening of the storage device, which can simplify the structure, reduce the cost, and make the opening and closing of the door panel easier. Simple and easy.

For a further understanding of the features and technical content of the present invention, please refer to the following detailed descriptions and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.

The following are specific specific examples to illustrate the embodiments disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the accompanying drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[First Embodiment]

Please refer to FIG. 1 to FIG. 5 , the present invention provides a semiconductor object container storage device, which includes a main body 1 , an object container 2 and a door panel 3 .

The body 1 can be made of materials such as plastic, and the material thereof is not limited. The main body 1 is a hollow body, and its appearance is not limited. In this embodiment, the main body 1 is a square body, and a accommodating space 11 is formed in the main body 1. The accommodating space 11 can be filled with nitrogen gas or ultra-clean gas Wait. One side (front side) of the main body 1 is provided with an opening 12 , and the opening 12 communicates with the accommodating space 11 , so that the object container 2 can be placed in the accommodating space 11 through the opening 12 .

A supporting member 13 can also be arranged in the accommodating space 11 of the main body 1 , the supporting member 13 can be arranged in the accommodating space 11 near the two sides (left side and right side), and the supporting member 13 can also be arranged in the accommodating space 11 away from At one side (rear) of the opening 12, the support member 13 is formed into a U shape, so as to have better support and air tightness. The support member 13 can be used to support the object container 2, so that the object container 2 can be erected in the main body 1. The support member 13 can be used to properly elevate the object container 2, so that one end of a handling device such as a robotic arm can be used to extend into the body 1. Lift the transport object container 2. The object container 2 is placed on the support member 13 , and the bottom side of the object container 2 contacts the top side of the support member 13 , so that the top and bottom of the object container 2 are separated to maintain better airtightness of the accommodating space 11 .

The body 1 can also be provided with a plurality of positioning pieces 14 , and the positioning pieces 14 can be components such as positioning pins, which can be inserted into the bottom of the object container 2 to position the object container 2 , that is, the position of the object container 2 . A plurality of positioning grooves 23 may be provided at the bottom, and one end of the positioning members 14 is inserted into the positioning grooves 23 respectively, so that the object container 2 can be stably positioned in the accommodating space 11 .

The object container 2 can be used for accommodating semiconductor objects (such as photomasks or wafers). The structure and shape of the object container 2 are not limited, and can be changed according to the carried semiconductor objects. In this embodiment, the object container 2 is in the shape of a square, and the object container 2 may include a lower box body 21 and an upper box body 22. The upper box body 22 is placed on the lower box body 21, so that semiconductor objects can be accommodated in between the lower box body 21 and the upper box body 22 . In this embodiment, the object container 2 is in a type of up and down opening and closing, but it is not limited, and the object container 2 can be various conventional containers for accommodating semiconductor objects.

The door panel 3 is a plate-like body, and the shape of the door panel 3 corresponds to the opening 12 of the main body 1. In this embodiment, the door panel 3 and the opening 12 of the main body 1 form a corresponding square shape, so that the door panel 3 can selectively When the door panel 3 closes the opening 12, the door panel 3 can abut against the end of the body 1 with the opening 12, so that the opening 12 is closed. The door panel 3 is connected to the object container 2, and the door panel 3 can be directly or indirectly connected to the object container 2 through other connecting parts. The structure of the door panel 3 connected to the object container 2 is not limited. In this embodiment, the door panel 3 is directly connected to the object container 2, that is, the door panel 3 can be connected to one side (front side) of the lower box body 21 of the object container 2, and the door panel 3 can be integrally formed or combined. Connected to the lower box 21 of the object container 2 , the door panel 3 is integrally connected with the object container 2 , so the door panel 3 can move synchronously with the object container 2 .

The door panel 3 can also be provided with at least one through hole 31 , the through hole 31 can be disposed on the door panel 3 near the bottom side, the through hole 31 can be an elongated hole, and the through hole 31 can extend to the door panel 3 near both sides (left side, right side), the through hole 31 runs through the opposite sides of the door panel 3 so that one end of a handling device such as a robotic arm can pass through the through hole 31 and extend to the bottom of the object container 2 for handling the object container 2 .

In this embodiment, an open space 15 is formed in the main body 1 . The open space 15 can communicate with the through hole 31 , and one end of a handling device such as a robot arm can extend into the open space of the main body 1 through the through hole 31 . 15, used to carry the object container 2. The accommodating space 11 and the open space 15 are located at the upper and lower parts of the main body 1, respectively, and the accommodating space 11 is separated from the open space 15, that is, when the object container 2 is placed in the accommodating space 11, the object container 2 can be located in the accommodating space 11 and the open space 15, so that the object container 2 can provide a barrier function, the object container 2 can separate the accommodating space 11 and the open space 15, so that the accommodating space 11 can maintain proper air tightness, so that nitrogen Or, ultra-clean gas or the like can be filled in the accommodating space 11, and only the open space 15 and the through hole 31 are communicated with the outside.

When the object container 2 is placed in the accommodating space 11 , the door panel 3 is placed on the opening 12 to close the opening 12 . When the object container 2 is taken out from the accommodating space 11 , the door panel 3 leaves the opening 12 to open the opening 12 . Therefore, the present invention can utilize the movement of the object container 2 to link the door panel 3 so that the door panel 3 can open and close the opening 12 , and no additional linkage mechanism is required to open and close the opening 12 of the storage device.

[Second Embodiment]

Please refer to FIG. 6 to FIG. 8 , the semiconductor object container storage device of this embodiment includes a main body 1 , an object container 2 and a door panel 3 . This embodiment is substantially the same as the above-mentioned first embodiment, and the main difference lies in the following: In this embodiment, the door panel 3 is connected to the object container 2 through a carrier 32, that is, the door panel 3 can be connected to one side (front side) of the carrier 32. The object container 2 is arranged on the carrier 32, and the object The container 2 can also be properly fixed on the carrier 32. In this embodiment, the lower box 21 of the object container 2 can be fixed on the carrier 32, so that the door panel 3 is connected with the object container 2 as a whole, so the door panel 3 can be Moves synchronously with object container 2.

The door panel 3 can also be provided with a through hole 31, the through hole 31 penetrates through the opposite sides of the door panel 3, and a groove 33 is formed on the bottom side of the carrier 32, and the groove 33 is communicated with the through hole 31 to facilitate mechanical One end of a carrying device such as an arm can extend below the object container 2 through the through hole 31 and the groove 33 for carrying the object container 2 .

In this embodiment, an open space 15 is formed in the main body 1. When the object container 2 is placed in the accommodation space 11, the open space 15 can communicate with the through hole 31, and one end of a handling device such as a robotic arm can be The through hole 31 and the groove 33 extend into the open space 15 of the main body 1 for carrying the object container 2 . When the object container 2 is placed in the accommodating space 11, the carrier 32 is located between the open space 15 and the accommodating space 11, and the carrier 32 can separate the open space 15 from the accommodating space 11, so that the accommodating space 11 can be Maintain proper air tightness.

When the object container 2 is placed in the accommodating space 11 , the door panel 3 is placed on the opening 12 to close the opening 12 . When the object container 2 is taken out from the accommodating space 11 , the door panel 3 leaves the opening 12 to open the opening 12 . Therefore, in this embodiment, the movement of the object container 2 can also be used to link the door panel 3 so that the door panel 3 can open and close the opening 12 , and there is no need to provide an additional linkage mechanism to open and close the opening 12 of the storage device.

The body 1 can also be provided with a plurality of positioning members 14 . The positioning members 14 can be components such as positioning pins, which can be inserted into the bottom of the carrier 32 for positioning the carrier 32 , that is, the position of the carrier 32 . A plurality of positioning grooves 34 may be provided at the bottom, and one end of the positioning members 14 is inserted into the positioning grooves 34 respectively, so that the carrier member 32 and the object container 2 can be stably positioned in the accommodating space 11 .

[Advantageous effects of the embodiment]

The beneficial effect of the present invention is that the semiconductor object container storage device provided by the present invention includes a main body, an object container and a door panel. An accommodating space is formed in the main body, an opening is arranged on one side of the main body, the object container can be used for accommodating semiconductor objects, and the door panel is connected to the object container, so that the door panel can move synchronously with the object container. When the object container is placed in the accommodating space, the door plate cover is placed at the opening to close the opening; when the object container is taken out from the accommodating space, the door plate leaves the opening to open the opening. The invention can use the movement of the object container to link the door panel, so that the door panel can open and close the opening of the main body, so there is no need to set up an additional linkage mechanism to open and close the opening of the storage device, which can simplify the structure, reduce the cost, and make the opening and closing of the door panel easier. Simple and easy.

The content disclosed above is only a preferred feasible embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

1: Ontology 11: accommodating space 12: Opening 13: Supports 14: Positioning pieces 15: Open Space 2: Object container 21: Lower box 22: Upper box body 23: Positioning slot 3: door panel 31: Through hole 32: Bearer 33: Groove 34: Positioning slot

FIG. 1 is an exploded perspective view of a semiconductor object container storage device according to a first embodiment of the present invention.

2 is an exploded perspective view of the semiconductor object container storage device from another angle according to the first embodiment of the present invention.

FIG. 3 is a perspective view of the semiconductor object container storage device according to the first embodiment of the present invention.

4 is a perspective view of the semiconductor object container storage device from another angle according to the first embodiment of the present invention.

5 is a cross-sectional view of the semiconductor object container storage device according to the first embodiment of the present invention.

6 is an exploded perspective view of a semiconductor object container storage device according to a second embodiment of the present invention.

FIG. 7 is an exploded perspective view of the semiconductor object container storage device from another angle according to the second embodiment of the present invention.

8 is a cross-sectional view of a semiconductor object container storage device according to a second embodiment of the present invention.

1: Ontology

11: accommodating space

12: Opening

13: Supports

14: Positioning pieces

15: Open Space

2: Object container

21: Lower box

22: Upper box body

3: door panel

31: Through hole

Claims (9)

A semiconductor object container storage device, comprising: a main body, a receiving space is formed in the main body, an opening is provided on one side of the main body, the opening is communicated with the holding space; an object container, the object container can be used for accommodating semiconductors object; and a door panel, the door panel is connected to the object container, so that the door panel can move synchronously with the object container; wherein the object container includes a lower box body and an upper box body, and the upper box body cover is placed on the lower box body On the upper side, the door panel is connected to one side of the lower box body; when the object container is placed in the accommodating space, the door panel cover is placed at the opening to close the opening; when the object container is placed in the accommodating space When taken out, the door panel leaves the opening for opening the opening. The semiconductor object container storage device according to claim 1, wherein a support member is arranged in the accommodating space of the body, and the support member can be used to support the object container, so that the object container is erected in the body. The semiconductor object container storage device of claim 2, wherein the object container is placed on the support, and the bottom side of the object container contacts the top side of the support, so that the top and bottom of the object container are separated. The semiconductor object container storage device as claimed in claim 1, wherein a plurality of positioning pieces are arranged in the body, and the positioning pieces can be used to be inserted into the bottom of the object container for positioning the object container. The semiconductor object container storage device as claimed in claim 1, wherein at least one through hole is disposed on the door plate, the through hole is disposed on the door plate near the bottom side, the through hole penetrates through two opposite sides of the door plate, and another inside the body An open space is formed, when the object container is placed in the accommodation space, the open space is communicated with the through hole, the accommodation space and the open space are respectively located at the upper and lower parts of the body, and the accommodation space and the Open spaces are separated. The semiconductor object container storage device as claimed in claim 5, wherein when the object container is placed in the accommodating space, the object container is located between the accommodating space and the open space, and the object container can accommodate the accommodating space and the open space. Open spaces are separated. The semiconductor object container storage device according to claim 5, wherein the door panel is connected to the object container through a carrier, the door panel is connected to one side of the carrier, and the object container is disposed on the carrier. The semiconductor object container storage device as claimed in claim 7, wherein the lower box body of the object container is fixed to the carrier, so that the door panel and the object container are integrally connected, and when the object container is placed in the accommodating space, the A carrier is located between the open space and the accommodating space, and the carrier can separate the open space and the accommodating space. The semiconductor object container storage device as claimed in claim 7, wherein a bottom side of the carrier is provided with a groove, and the groove communicates with the through hole.

Images