TW202237505A - Storage device for semiconductor object container - Google Patents

Abstract

A storage device for semiconductor object container includes a main body, an object container, and a door board. The main body has an accommodating space therein, and nitrogen can be filled in the accommodating space. The main body has an opening at a side thereof, and the opening is in spatial communication with the accommodating space. The object container is configured to contain a semiconductor object (e.g., a mask or a wafer), and the door board is connected to the object container. When the object container is disposed in the accommodating space, the door board covers the opening, so that the opening is closed. When the object container is taken out from the accommodating space, the door board leaves the opening, so that the opening is opened. Accordingly, the structure is simplified, the cost is reduced, and the door board can be easily opened or closed.

Description

Semiconductor object container storage device

The invention relates to a storage device for semiconductor object containers, in particular to a storage device capable of accommodating semiconductor object (such as photomasks or wafers, etc.) containers.

Containers such as mask boxes and wafer boxes can be used to place semiconductor objects such as masks and wafers, and are mainly used to prevent semiconductor objects such as masks and wafers from being polluted by external dust particles and chemicals. The above-mentioned semiconductor object container can be further placed in a storage device, and the opening of the storage device is provided with a gate for selectively opening and closing the opening, so that the interior of the storage device can maintain airtightness, so as to input nitrogen or ultra-clean gas etc. The above-mentioned gates need to be driven by a linkage mechanism when opening and closing, which is cumbersome to operate, and the driving structure of the linkage mechanism is complicated, which will also lead to an increase in manufacturing and maintenance costs.

The technical problem to be solved by the present invention is to provide a storage device for semiconductor object containers, which can simplify the structure, reduce the cost, and make the opening and closing of the door panel simple and easy.

In order to solve the above-mentioned technical problems, the present invention provides a storage device for semiconductor object containers, which includes: a body, an accommodating space is formed in the body, an opening is provided on one side of the body, and the opening communicates with the accommodating space; an object A container, the object container can be used to accommodate semiconductor objects; and a door panel, the door panel is connected to the object container, so that the door panel can move synchronously with the object container; wherein when the object container is placed in the accommodation space, the door panel A cover is placed on the opening to close the opening; when the object container is taken out from the accommodating space, the door panel leaves the opening to open the opening.

Preferably, a support is provided in the accommodation space of the main body, and the support can be used to support the object container, so that the object container is arranged in the body at a height.

Preferably, the door panel is provided with a through hole, the through hole is arranged on the door panel close to the bottom side, the through hole runs through the two opposite sides of the door panel, and an open space is formed in the body, the open space and the through hole The holes communicate with each other, the accommodating space and the open space are respectively located at the upper part and the lower part of the main body, and the accommodating space is separated from the open space.

The beneficial effect of the present invention is that the semiconductor object container storage device provided by the present invention includes a body, an object container and a door panel. An accommodating space is formed in the main body, an opening is provided on one side of the main body, and the object container can be used for accommodating semiconductor objects. When the object container is placed in the accommodating space, the door panel cover is placed at the opening to close the opening; when the object container is taken out of the accommodating space, the door panel leaves the opening to open the opening. The present invention can use the movement of the object container to link the door panel, so that the door panel can open and close the opening of the body, so there is no need to set up an additional linkage mechanism to open and close the opening of the storage device, which can simplify the structure, reduce the cost, and make the switch of the door panel Simple and easy.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

The following are specific examples to illustrate the implementation methods disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

[first embodiment]

Please refer to FIG. 1 to FIG. 5 , the present invention provides a semiconductor object container storage device, which includes a body 1 , an object container 2 and a door panel 3 .

The body 1 can be made of plastic and other materials, and its material is not limited. The main body 1 is a hollow body, and its shape is not limited. In this embodiment, the main body 1 is in the shape of a square, and an accommodation space 11 is formed in the main body 1, and nitrogen gas or ultra-clean gas can be filled in the accommodation space 11 Wait. One side (front side) of the main body 1 is provided with an opening 12 , and the opening 12 communicates with the accommodating space 11 , so that the object container 2 can be put into the accommodating space 11 through the opening 12 .

A supporter 13 can also be set in the accommodation space 11 of the body 1, the supporter 13 can be arranged in the accommodation space 11 close to both sides (left side, right side), and the supporter 13 can also be arranged in the accommodation space 11 away from On one side (rear) of the opening 12, the supporting member 13 is formed into a U-shape to have better supporting and airtight effects. The support 13 can be used to support the object container 2, so that the object container 2 can be erected and installed in the main body 1, and the support 13 can properly elevate the object container 2, so that one end of a handling device such as a robot arm can be used to extend into Lift the handling object container 2. The article container 2 is placed on the support member 13 , and the bottom side of the article container 2 contacts the top side of the support member 13 , so that the top and bottom of the article container 2 are separated to maintain the better airtightness of the accommodation space 11 .

A plurality of positioning parts 14 can also be set in the body 1, and these positioning parts 14 can be components such as positioning pins, which can be inserted into the bottom of the object container 2 to position the object container 2, that is, the position of the object container 2. The bottom can be provided with a plurality of positioning slots 23 , and one ends of the positioning pieces 14 are respectively inserted into the positioning slots 23 , so that the object container 2 can be stably positioned in the accommodating space 11 .

The object container 2 can be used to accommodate semiconductor objects (such as photomasks or wafers, etc.). The structure and shape of the object container 2 are not limited, and can be changed according to the semiconductor objects carried. In this embodiment, the object container 2 is a square shape, and the object container 2 can include a lower box body 21 and an upper box body 22, and the upper box body 22 is covered on the lower box body 21, so that semiconductor objects can be accommodated in Between the lower box body 21 and the upper box body 22 . In this embodiment, the object container 2 is in the form of opening and closing up and down, but it is not limited thereto. The object container 2 can be various existing containers for storing semiconductor objects.

The door panel 3 is a plate-shaped body, and the shape of the door panel 3 corresponds to the opening 12 of the body 1. In this embodiment, the door panel 3 forms a corresponding square shape with the opening 12 of the body 1, so that the door panel 3 can selectively Opening and closing the opening 12 of the main body 1, when the door panel 3 closes the opening 12, the door panel 3 can touch against the end of the main body 1 where the opening 12 is provided, so that the opening 12 is closed. The door panel 3 is connected to the object container 2. The door panel 3 can be directly or indirectly connected to the object container 2 through other connecting pieces. The structure of the door panel 3 connected to the object container 2 is not limited. In this embodiment, the door panel 3 is directly connected to the object container 2, that is, the door panel 3 can be connected to one side (front side) of the lower box body 21 of the object container 2, and the door panel 3 can be integrally formed or assembled. The lower box body 21 connected to the object container 2 makes the door panel 3 and the object container 2 integrally connected, so the door panel 3 can move synchronously with the object container 2 .

At least one through hole 31 can also be set on the door panel 3, the through hole 31 can be arranged on the door panel 3 near the bottom side, the through hole 31 can be an elongated hole, and the through hole 31 can extend to the door panel 3 near both sides (left side, right side), the through hole 31 runs through the opposite sides of the door panel 3, so that one end of a handling device such as a mechanical arm can extend to the below of the object container 2 through the through hole 31, in order to carry the object container 2.

In this embodiment, an open space 15 is formed in the main body 1, and the open space 15 can communicate with the through hole 31, and one end of a handling device such as a robot arm can extend into the open space of the main body 1 through the through hole 31. 15, in order to carry object container 2. The accommodating space 11 and the open space 15 are respectively located at the upper and lower parts of the main body 1, and the accommodating space 11 is separated from the open space 15, that is, when the object container 2 is placed in the accommodating space 11, the object container 2 can be located in the accommodating space 11 and the open space 15, so that the object container 2 can provide a barrier effect, the object container 2 can separate the accommodating space 11 and the open space 15, so that the accommodating space 11 can maintain proper airtightness, so that nitrogen Or ultra-clean gas can be filled in the containing space 11, and only the open space 15 and the through hole 31 communicate with the outside.

When the object container 2 is placed in the receiving space 11 , the door panel 3 covers the opening 12 to close the opening 12 . When the object container 2 is taken out from the receiving space 11 , the door panel 3 leaves the opening 12 for opening the opening 12 . Therefore, the present invention can utilize the movement of the object container 2 to link the door panel 3, so that the door panel 3 can open and close the opening 12, and no additional linkage mechanism is required to open and close the opening 12 of the storage device.

[Second embodiment]

Please refer to Fig. 6 to Fig. 8, the semiconductor object container storage device of this embodiment comprises a body 1, an object container 2 and a door panel 3, this embodiment is substantially the same as the above-mentioned first embodiment, the main difference lies in that In this embodiment, the door panel 3 is connected to the object container 2 through a carrier 32, that is, the door panel 3 can be connected to one side (front side) of the carrier 32, the object container 2 is arranged on the carrier 32, and the object The container 2 can also be properly fixed on the carrier 32. In this embodiment, the lower box body 21 of the object container 2 can be fixed on the carrier 32, so that the door panel 3 can be integrated with the object container 2, so the door panel 3 can be Move in sync with object container 2.

A through hole 31 can also be set on the door panel 3, and the through hole 31 runs through the opposite sides of the door panel 3, and a groove 33 is provided on the bottom side of the carrier 32, and the groove 33 communicates with the through hole 31, so that the mechanical One end of a carrying device such as an arm can extend to the bottom of the object container 2 through the through hole 31 and the groove 33 for carrying the object container 2 .

In this embodiment, an open space 15 is further formed in the body 1. When the object container 2 is placed in the accommodation space 11, the open space 15 can communicate with the through hole 31, and one end of a handling device such as a robot arm can be Through the through hole 31 and the groove 33 , it protrudes into the open space 15 of the main body 1 for transporting the object container 2 . When the object container 2 is placed in the accommodation space 11, the carrier 32 is located between the open space 15 and the accommodation space 11, and the carrier 32 can separate the open space 15 from the accommodation space 11, so that the accommodation space 11 can Maintain proper air tightness.

When the object container 2 is placed in the receiving space 11 , the door panel 3 covers the opening 12 to close the opening 12 . When the object container 2 is taken out from the receiving space 11 , the door panel 3 leaves the opening 12 for opening the opening 12 . Therefore, the present embodiment can also utilize the movement of the object container 2 to link the door panel 3, so that the door panel 3 can open and close the opening 12, and no additional linkage mechanism is required to open and close the opening 12 of the storage device.

A plurality of positioning parts 14 can also be set in the body 1, and these positioning parts 14 can be components such as positioning pins, which can be inserted into the bottom of the carrier 32 to position the carrier 32, that is, the position of the carrier 32. A plurality of positioning slots 34 may be provided at the bottom, and one ends of the positioning members 14 are respectively inserted into the positioning slots 34 , so that the carrier 32 and the object container 2 can be stably positioned in the receiving space 11 .

[Advantageous Effects of Embodiment]

The beneficial effect of the present invention is that the semiconductor object container storage device provided by the present invention includes a body, an object container and a door panel. An accommodating space is formed in the main body, an opening is provided on one side of the main body, and the object container can be used for accommodating semiconductor objects. When the object container is placed in the accommodating space, the door panel cover is placed at the opening to close the opening; when the object container is taken out of the accommodating space, the door panel leaves the opening to open the opening. The present invention can use the movement of the object container to link the door panel, so that the door panel can open and close the opening of the body, so there is no need to set up an additional linkage mechanism to open and close the opening of the storage device, which can simplify the structure, reduce the cost, and make the switch of the door panel Simple and easy.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

1: Ontology 11: storage space 12: opening 13: Support 14: Positioning parts 15: Open space 2: Object container 21: Lower box body 22: Upper box body 23: positioning slot 3: door panel 31: through hole 32: Carrier 33: Groove 34: positioning slot

FIG. 1 is an exploded perspective view of a semiconductor object container storage device according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view from another angle of the semiconductor object container storage device according to the first embodiment of the present invention.

FIG. 3 is a perspective view of a semiconductor object container storage device according to a first embodiment of the present invention.

4 is a perspective view from another angle of the semiconductor object container storage device according to the first embodiment of the present invention.

FIG. 5 is a cross-sectional view of a semiconductor object container storage device according to a first embodiment of the present invention.

FIG. 6 is an exploded perspective view of a storage device for semiconductor object containers according to a second embodiment of the present invention.

FIG. 7 is an exploded perspective view from another angle of the semiconductor object container storage device according to the second embodiment of the present invention.

8 is a cross-sectional view of a semiconductor object container storage device according to a second embodiment of the present invention.

1: Ontology

11: storage space

12: opening

13: Support

14: Positioning parts

15: Open space

2: Object container

21: Lower box body

22: Upper box body

3: door panel

31: through hole

Claims (10)

A semiconductor object container storage device, comprising: A main body, forming an accommodating space in the main body, an opening is provided on one side of the main body, and the opening communicates with the accommodating space; an article container capable of containing semiconductor articles; and a door panel, the door panel is connected to the object container, so that the door panel can move synchronously with the object container; Wherein when the article container is placed in the accommodation space, the door panel cover is placed at the opening to close the opening; when the article container is taken out from the accommodation space, the door panel leaves the opening to open The opening. The semiconductor object container storage device as claimed in claim 1, wherein a support is provided in the accommodation space of the main body, and the support can be used to support the object container, so that the object container is arranged in the body at a height. The semiconductor object container storage device as claimed in claim 2, wherein the object container is placed on the support member, and the bottom side of the object container contacts the top side of the support member, so that the upper side and the lower side of the object container are separated. The semiconductor object container storage device as claimed in claim 1, wherein a plurality of positioning pieces are arranged in the body, and the positioning pieces can be inserted into the bottom of the object container for positioning the object container. The semiconductor object container storage device as described in claim 1, wherein the object container includes a lower box body and an upper box body, the upper box body cover is placed on the lower box body, and the door panel is connected to one of the lower box body side. The semiconductor object container storage device as claimed in claim 1, wherein at least one through hole is provided on the door panel, the through hole is arranged on the door panel near the bottom side, the through hole runs through the two opposite sides of the door panel, and the other part of the body An open space is formed. When the object container is placed in the accommodation space, the open space communicates with the through hole. The accommodation space and the open space are located at the upper and lower parts of the main body respectively, and the accommodation space and the Open space separates. The semiconductor object container storage device according to claim 6, wherein when the object container is placed in the accommodation space, the object container is located between the accommodation space and the open space, and the object container can connect the accommodation space and the Open space separates. The semiconductor article container storage device as claimed in claim 6, wherein the door panel is connected to the article container through a carrier, the door panel is connected to one side of the carrier, and the article container is arranged on the carrier. The semiconductor object container storage device as described in claim 8, wherein the object container includes a lower box body and an upper box body, the upper box body cover is placed on the lower box body, and the lower box body of the object container is fixed on the a bearing member, which connects the door panel and the object container as a whole; when the object container is placed in the accommodation space, the bearing member is located between the open space and the accommodation space; the bearing member can connect the open space to the accommodation space spaced apart. The semiconductor object container storage device as claimed in claim 8, wherein a groove is provided on the bottom side of the carrier, and the groove communicates with the through hole.

Images