TWI754832B - Composition for encapsulation of organic light emitting diode and organic light emitting diode display - Google Patents

Abstract

A composition for encapsulation of an organic light emitting diode and an organic light emitting diode display comprising an organic layer formed of the same. The composition includes (A): at least one of a compound of Formula 1, a compound of Formula 2, and a compound of Formula 3; (B): at least one selected from among a non-silicone-based photocurable polyfunctional monomer and a silicone-based photocurable polyfunctional monomer; (C): a photocurable monofunctional monomer; and (D): an initiator, wherein the component (A) is present in an amount of 0.01 parts by weight to 10 parts by weight relative to a total of 100 parts by weight of the components (A), (B), (C) and (D). The definition of Formula 1, Formula 2 and Formula 3 are the same as in detail description.

Description

Composition for encapsulating organic light emitting diode and organic light emitting diode display

The present invention relates to a composition for encapsulating organic light emitting diodes and an organic light emitting diode display including an organic layer formed using the composition.

This application claims the rights of Korean Patent Application No. 10-2018-0103066 filed in the Korean Intellectual Property Office on August 30, 2018, the entire disclosure of which is incorporated herein by reference.

The organic light emitting diode is easily damaged when in contact with external moisture or oxygen, and the reliability is lowered due to the loss of its function. Therefore, the organic light emitting diode must be encapsulated with a composition for encapsulating the organic light emitting diode.

On the other hand, organic light-emitting diodes can be damaged by ultraviolet (ultraviolet, UV) light when exposed to sunlight, resulting in a shortened lifespan. In particular, since organic light emitting diodes used in vehicles are exposed to sunlight for a long time, UV damage becomes an important problem for organic light emitting diodes. In order to block ultraviolet light, the polarizing plate and the adhesive formed on the organic light emitting diode may contain an ultraviolet absorber. However, it is more effective to form an organic layer that will be placed adjacent to the organic light emitting diode to prevent damage to the organic light emitting diode by blocking ultraviolet light from sunlight.

Generally, an encapsulation layer suitable for encapsulating an organic light emitting diode has a multi-layered structure including an inorganic layer and an organic layer. The inorganic and organic layers have different properties and can be alternately stacked on top of each other to improve protection of the organic light emitting diodes.

An object of the present invention is to provide a composition for encapsulating organic light emitting diodes, which can form an organic layer with a good UV blocking effect.

Another object of the present invention is to provide a composition for encapsulating an organic light emitting diode, which can realize an organic layer with a low plasma etching rate.

其中R₁ 、R₂ 、R₃ 、R₄ 、R₅ 、R₆ 、R₇ 、R₈ 、R₉ 、R₁₀ 及n與在本發明的以下說明中所定義的相同。 [式2]

其中R₂₀ 、R₂₁ 及R₂₂ 與在本發明的以下說明中所定義的相同。 [式3]

其中R¹ 、R² 、R³ 及R⁴ 與在本發明的以下說明中所定義的相同。According to one aspect of the present invention, a composition for encapsulating an organic light emitting diode comprises: component A: at least one of the compound of formula 1, the compound of formula 2 and the compound of formula 3; component B: non-polysilicon at least one of an oxygen-based photocurable multifunctional monomer and a silicone-based photocurable multifunctional monomer; component C: a photocurable monofunctional monomer; and component D: an initiator, wherein the compound of Formula 1, At least one of the compound of the formula 2 and the compound of the formula 3: [Formula 1]

wherein R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ and n are the same as defined in the following description of the present invention. [Formula 2]

wherein R ₂₀ , R ₂₁ and R ₂₂ are the same as defined in the following description of the present invention. [Formula 3]

wherein R ¹ , R ² , R ³ and R ⁴ are the same as defined in the following description of the present invention.

According to another aspect of the present invention, there is provided an organic light emitting diode display including an organic layer formed using the composition for encapsulating organic light emitting diodes according to the present invention.

The present invention provides a composition for encapsulating organic light emitting diodes, and the composition can form an organic layer with good ultraviolet blocking effect.

The present invention provides a composition for encapsulating an organic light emitting diode, which can realize an organic layer with a low plasma etching rate.

The embodiments of the present invention will be described in detail with reference to the accompanying drawings to provide those skilled in the art with a thorough understanding of the present invention. It should be understood that the present invention may be practiced in various ways and is not limited to the following examples. In the drawings, parts irrelevant to the description will be omitted for clarity, and the same components will be designated by the same reference numerals throughout the specification.

The term "(meth)acrylic" as used herein refers to acrylic and/or methacrylic.

As used herein, unless otherwise stated, the term "substituted" means that at least one hydrogen atom of a functional group is substituted with the following: halogen (eg F, Cl, Br or I), hydroxy, nitro, cyano, amino group (=NH, =NR, wherein R is a C1 to C10 alkyl), amino ( _-NH2 , -NH(R'), -N(R")(R"'), wherein R', R" and R "' is independently C1 to C10 alkyl), amidino, hydrazine or hydrazone, carboxyl, C1 to C20 alkyl, C6 to C30 aryl, C3 to C30 cycloalkyl, C3 to C30 heteroaryl or C2 to C30 heterocycloalkyl.

As used herein, the term "aryl" refers to a functional group in which all elements of a cyclic substituent have p orbitals and these p orbitals form conjugation. Aryl groups include monocyclic, non-fused polycyclic and fused polycyclic functional groups. As used herein, the term "fused" means that a pair of carbon atoms are shared by adjacent rings. The aryl group also includes a biphenyl group, a terphenyl group, a quaterphenyl group, and the like in which at least two aryl groups are connected to each other through a σ bond. The aryl group may refer to phenyl, naphthyl, anthracenyl, phenanthryl, pyrenyl, enyl, and the like.

As used herein, "alkeneoxy" may include all functional groups in which at least one alkylene group is attached to at least one oxygen atom. For example, alkeneoxy can include (alkylene-oxy) _n -alkylene, (alkylene-oxy-alkylene) _n -alkylene, alkylene-oxy, or -(oxy-alkylene) base) _n - (where n is an integer from 1 to 10).

According to one embodiment, a composition for encapsulating an organic light emitting diode comprises: component A: at least one of the compound of formula 1, the compound of formula 2 and the compound of formula 3; component B: non-polysiloxane system at least one of a photocurable multifunctional monomer and a polysiloxane-based photocurable multifunctional monomer; component C: a photocurable monofunctional monomer; and component D: an initiator, wherein the Based on the total of 100 parts by weight of component A, the component B, the component C and the component D, the compound of the formula 1, the compound of the formula 2 are present in an amount of 0.01 to 10 parts by weight at least one of the compound and the compound of formula 3. Within this content range, the encapsulation composition can reduce the light transmittance at a wavelength of 420 nm (nanometer), preferably at a wavelength of 410 nm, more preferably at a wavelength of 405 nm, thereby improving plasma resistance (plasma resistance) while preventing external ultraviolet light from damaging the organic light-emitting diode. Preferably, based on the total 100 parts by weight of the components of the component A, the component B, the component C and the component D, there may be 1 part by weight to 10 parts by weight, 1 part by weight to 8 parts by weight, 3 parts by weight to 8 parts by weight, such as 0.01 parts by weight, 0.1 parts by weight, 1 part by weight, 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight, 6 parts by weight, 7 parts by weight, At least one of the compound of Formula 1, the compound of Formula 2, and the compound of Formula 3 in an amount of 8 parts by weight, 9 parts by weight, or 10 parts by weight.

Hereinafter, each component of the encapsulation composition according to the present invention will be explained in detail.

( A-1 )Mode 1 compound of

The composition for encapsulating an organic light emitting diode according to the present invention may include the compound of Formula 1.

[Formula 1]

wherein R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ and R ₁₀ are the same or different from each other, and are each independently hydrogen, substituted or unsubstituted C1 to C10 alkyl, substituted or unsubstituted C6 to C10 aryl, amine, halogen, cyano, nitro, group of formula 1-1, group of formula 1-2, group of formula 1-3 or a substituted or unsubstituted C1 to C10 alkyl group having a hydroxyl group.

[Formula 1-1]

[Formula 1-2]

[Formula 1-3]

wherein * represents the attachment site of the aromatic carbon of the compound of formula 1, R ₁₁ is hydrogen or substituted or unsubstituted C1 to C5 alkyl, R ₁₂ is a single bond, substituted or unsubstituted C1 to C10 alkylene or substituted or unsubstituted C6 to C20 arylidene, R ₁₃ , R ₁₄ and R ₁₅ are the same or different from each other, and are each independently substituted or unsubstituted C1 to C10 alkylene group or substituted or unsubstituted C6 to C20 _arylidene , and X1 and X2 are the same or different from each other, and each independently is O, S or NR (R is _hydrogen or substituted or unsubstituted C1 to C5 alkyl), m is an integer from 1 to 6, and n is an integer from 1 to 6.

Preferably, at least one of R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ and R ₁₀ is formula 1-1, formula 1-2 or formula 1 -3 groups.

In one embodiment, the compound of Formula 1 may be represented by at least one of Formulae 1-4 to 1-5.

[Formula 1-4]

[Formula 1-5]

Compounds of formula 1 can be prepared by typical methods known to those skilled in the art.

( A-2 )Mode 2 compound of

The composition for encapsulating an organic light emitting diode according to the present invention may include the compound of Formula 2.

[Formula 2]

或

； R₂₁ 為氫、經取代或未經取代的C1到C50烴基、

或

；且 R₂₂ 及R₂₃ 為經取代或未經取代的C1到C50烴基或者含有至少一個N或O原子團的經取代或未經取代的C1到C50烴基 （R₂₅ 、R₂₆ 、R₂₇ 及R₂₈ 各自獨立地為氫、鹵素基、-CN、-NO₂ 或-NH₂ ， X為-O-或-N-E₁ -， E₁ 為氫、經取代或未經取代的C1到C50烴基、或者含有至少一個F、Cl、Br、I、O、N、S、P或Si原子團的經取代或未經取代的C1到C50烴基、

或

， R₂₄ 為經取代或未經取代的C1到C50烴基或經含有至少一個O或N原子團的經取代或未經取代的C1到C50烴基， Q為直鏈或支鏈的C2到C20伸烷基、含有插入其中的-O-、-NH-或-NR₃₄ -中的至少一者的直鏈或支鏈的C2到C20伸烷基、C5到C10伸環烷基（cycloalkylene group）、對伸苯基（para-phenylene group）、

、

、

、

、

或

， L為C1到C12伸烷基（alkylene group）、C2到C12亞烷基（alkylidene group）、C5到C7伸環烷基、苯亞甲基（benzylidene group）或對伸二甲苯基（p-xylylene group）， *表示式2的化合物的芳族碳的連接位點）。where _R20 is

or

; R ₂₁ is hydrogen, substituted or unsubstituted C1 to C50 hydrocarbyl,

or

and R ₂₂ and R ₂₃ are substituted or unsubstituted C1 to C50 hydrocarbon groups or substituted or unsubstituted C1 to C50 hydrocarbon groups containing at least one N or O atomic group (R ₂₅ , R ₂₆ , R ₂₇ and R ₂₈ is each independently hydrogen, halogen, -CN, -NO ₂ or -NH ₂ , X is -O- or -NE ₁ -, E ₁ is hydrogen, substituted or unsubstituted C1 to C50 hydrocarbyl, or Substituted or unsubstituted C1 to C50 hydrocarbyl groups containing at least one F, Cl, Br, I, O, N, S, P or Si radical,

or

, R ₂₄ is a substituted or unsubstituted C1 to C50 hydrocarbon group or a substituted or unsubstituted C1 to C50 hydrocarbon group containing at least one O or N atomic group, Q is a linear or branched C2 to C20 alkylene group, straight-chain or branched C2 to C20 alkylene group, C5 to C10 cycloalkylene group containing at least one of -O-, -NH- or -NR ₃₄ - inserted therein, right Para-phenylene group,

,

,

,

,

or

, L is C1 to C12 alkylene group, C2 to C12 alkylidene group, C5 to C7 cycloalkylene, benzylidene group or p-xylylene group), * denotes the attachment site of the aromatic carbon of the compound of formula 2).

或

，且*表示式2的化合物的芳族碳的連接位點。具體來說，式2的R₂₀ 可為

。In formula 2, R ₂₀ is

or

, and * denotes the attachment site of the aromatic carbon of the compound of formula 2. Specifically, R ₂₀ of formula 2 can be

.

In R ₂₀ of Formula 2, R ₂₅ , R ₂₆ , R ₂₇ and R ₂₈ are each independently hydrogen, halogen, -CN, -NO ₂ or -NH ₂ . Specifically, in R ₂₀ of Formula 2, R ₂₅ , R ₂₆ , R ₂₇ and R ₂₈ are each independently hydrogen, Cl or Br. More specifically, in R ₂₀ of Formula 2, R ₂₅ and R ₂₆ may all be hydrogen or may be hydrogen and Cl, hydrogen and Br, and R ₂₇ and R ₂₈ may each independently be hydrogen, Cl or Br.

或

。In formula 2, R ₂₁ is hydrogen, substituted or unsubstituted C1 to C50 hydrocarbyl,

or

.

In R ₂₁ of Formula 2, the hydrocarbon group may include a linear or branched alkyl group, a linear or branched alkenyl group, a cycloalkyl group, an arylalkyl group, an aryl group, and the like.

Specifically, in R ₂₁ of Formula 2, the substituted or unsubstituted C1 to C50 hydrocarbon group may be C1 to C24 straight or branched alkyl, C2 to C18 straight or branched alkenyl, C5 to C12 cycloalkyl, C7 to C15 phenylalkyl, phenyl, phenyl with one to four C1 to C4 alkyl substituted on the benzene ring or one to four substituted on the benzene ring C7 to C15 phenylalkyl of C1 to C4 alkyl.

Examples of C1 to C24 straight or branched chain alkyl groups may include methyl, ethyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, tert-amyl, 2-ethylhexyl , tert-octyl, lauryl, tert-dodecyl, tridecyl, n-hexadecyl, n-octadecyl and eicosyl.

Examples of C2 to C18 straight or branched chain alkenyl groups include allyl, pentenyl, hexenyl, dodecenyl, and oleyl. The C2 to C18 straight or branched chain alkenyl group may be an alkenyl group having 3 to 16, specifically 3 to 12 (eg, 2 to 6) carbon atoms.

Examples of C5 to C12 cycloalkyl groups may include cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, and cyclododecyl. Examples of C1 to C4 alkyl substituted C5 to C8 cycloalkyl groups may include methylcyclopentyl, dimethylcyclopentyl, methylcyclohexyl, dimethylcyclohexyl, trimethylcyclohexyl, and tert-butyl cyclohexyl.

Examples of C7-C15 phenylalkyl groups may include benzyl, phenethyl, α-methylbenzyl, and α,α-dimethylbenzyl.

Examples of the phenyl group having one to four C1 to C4 alkyl groups substituted on the benzene ring may include tolyl and xylyl.

In R ₂₁ of Formula 2, R ₂₅ , R ₂₆ , R ₂₇ and R ₂₈ are each independently hydrogen, halogen, -CN, -NO ₂ or -NH ₂ . Specifically, in R ₂₁ of Formula 2, R ₂₅ , R ₂₆ , R ₂₇ and R ₂₈ may each independently be hydrogen, Cl or Br. More specifically, in R ₂₁ of Formula 2, R ₂₅ and R ₂₆ are all hydrogen or hydrogen and Cl, or hydrogen and Br, and R ₂₇ and R ₂₈ may each independently be hydrogen, Cl or Br.

In R ₂₁ of Formula 2, L is a C1 to C12 alkylene group, a C2 to C12 alkylidene group, a C5 to C7 cycloalkylene group, a benzylidene group, or a p-xylylene group.

In Formula 2, R ₂₂ , R ₂₃ and R ₂₄ are substituted or unsubstituted C1 to C50 hydrocarbon groups or substituted or unsubstituted C1 to C50 hydrocarbon groups containing at least one N or O atomic group.

In R ₂₂ , R ₂₃ and R ₂₄ of Formula 2, the hydrocarbon group may include a linear or branched alkyl group, a linear or branched alkenyl group, a cycloalkyl group, an arylalkyl group, an aryl group, and the like.

Specifically, in R ₂₂ , R ₂₃ and R ₂₄ of Formula 2, the substituted or unsubstituted C1 to C50 hydrocarbon group may be C1 to C24 straight or branched alkyl, C2 to C18 straight or branched Chain alkenyl, C5 to C12 cycloalkyl, C7 to C15 phenylalkyl, phenyl, phenyl with one to four C1 to C4 alkyl substituted on the phenyl or phenyl with one to four C1 to C4 alkyl substituted on the phenyl ring Substituted one to three C1 to C4 alkyl C7 to C15 phenylalkyl groups.

Specifically, in R ₂₂ , R ₂₃ and R ₂₄ of Formula 2, the substituted or unsubstituted C1 to C50 hydrocarbon group containing at least one O, N or S atomic group contains at least one O, N or S atomic group as a substitution A radical functional group or contains at least one O, N or S atomic group inserted into the hydrocarbon backbone.

Specifically, in R ₂₂ , R ₂₃ and R ₂₄ of Formula 2, the O, N or S atomic group may include -OH, -OCO-R ₃₁ , -OR ₃₄ , -NCO, -NH ₂ , -O-, -NH-, -NR ₃₄ -, -C(O)-OR ₃₄ , -C(O)-NHR ₃₄ , -C(O)-NR ₃₄ R' ₃₄ , -SR ₃₃ , -NHR ₃₃ , -N( R ₃₃ ) ₂ , -(CH2) _m -CO-X ₁ -(Z) _p -YR ₃₅ and the like.

Here, in R ₂₂ , R ₂₃ and R ₂₄ of Formula 2, R ₃₁ is hydrogen, linear or branched C1 to C18 alkyl, C5 to C12 cycloalkyl, linear or branched C3 to C8 Alkenyl, phenyl, naphthyl or C7 to C15 phenylalkyl.

Here, in R ₂₂ , R ₂₃ and R ₂₄ of Formula 2, R ₃₃ is a linear or branched C1 to C20 alkyl group, a linear or branched C2 to C20 hydroxyalkyl group, a linear or branched chain C3 to C18 alkenyl, C5 to C12 cycloalkyl, C7 to C15 phenylalkyl, phenyl, naphthyl, alkylphenyl substituted with one or two C1 to C4 alkyl groups, or alkylphenyl substituted with one or two C1 to C4 alkyl groups C1 to C4 alkyl substituted naphthyl.

In R ₂₂ , R ₂₃ and R ₂₄ of Formula 2, R ₃₄ and R' ₃₄ are hydrogen or linear or branched C1 to C24 alkyl groups.

More specifically, R ₂₂ , R ₂₃ and R ₂₄ of Formula 2 may be C1 substituted with at least one functional group of -OH, -OCO-R ₃₁ , -OR ₃₄ , -NCO, -NH ₂ and combinations thereof to C24 straight or branched chain alkyl.

More specifically, R ₂₂ , R ₂₃ and R ₂₄ of Formula 2 may be C1 to C24 straight or branched chains into which at least one of -O-, -NH-, -NR ₃₄ - and combinations thereof are inserted the alkyl group.

In one embodiment, the alkyl group into which at least one -O- is inserted may be derived from ethylene oxide units, propylene oxide units, or mixtures thereof.

In one embodiment, the alkyl group having at least one -NH- or _-NR34- therein may be derived from repeating units of ethylenediamine.

More specifically, R ₂₂ , R ₂₃ and R ₂₄ of Formula 2 may be C2 to C18 straight or branched chains into which at least one of -O-, -NH-, -NR ₃₄ - and combinations thereof are inserted alkenyl.

More specifically, R ₂₂ , R ₂₃ and R ₂₄ of Formula 2 may be C1 to C24 straight or branched alkanes substituted with at least one functional group in -OH, -OR ₃₄ , -NH ₂ and combinations thereof base.

More specifically, R ₂₂ , R ₂₃ and R ₂₄ of Formula 2 may be -OR ₃₄ , -C(O)-OR ₃₄ , -C(O)-NHR ₃₄ or -C(O)-NR ₃₄ R' ₃₄ .

More specifically, R ₂₂ , R ₂₃ and R ₂₄ of Formula 2 may be -SR ₃₃ , -NHR ₃₃ or -N(R ₃₃ ) ₂ .

More specifically, R ₂₂ , R ₂₃ and R ₂₄ of Formula 2 may be -(CH ₂ ) _m -CO-X ₁ -(Z) _p -YR ₃₅ .

In R ₂₂ , R ₂₃ and R ₂₄ of Formula 2, X ₁ may be -O- or -N(R ₃₆ )-.

In R ₂₂ , R ₂₃ and R ₂₄ of Formula 2, Y may be -O-, -N(R ₃₇ )- or a direct bond.

、

、

、

、

或

（其中*表示連接位點）。In R ₂₂ , R ₂₃ and R ₂₄ of Formula 2, Z is a C2 to C12 alkylene; a C4 to C12 alkylene having one to three N or O atoms or a combination thereof inserted therein; C3 to C12 alkylene C3 to C12 alkylene, butenylene, butynylene, cyclohexylene or phenylene, each substituted with hydroxy;

,

,

,

,

or

(where * denotes the attachment site).

Specifically, when Y in R ₂₂ , R ₂₃ and R ₂₄ of Formula 2 is a direct bond, Z may also be a direct bond.

In R ₂₂ , R ₂₃ and R ₂₄ of Formula 2, m may be 0, 1 or 2.

In R ₂₂ , R ₂₃ and R ₂₄ of Formula 2, p is 1; or when X ₁ and Y are -N(R ₃₆ )- and -N(R ₃₇ )-, respectively, p is 0.

、

、-CO-C(R₃₈ )=C(H)R₃₉ ，或者當Y為-N(R₃₇ )-時與R₃₇ 一起形成-CO-CH=CH-CO-。In R ₂₂ , R ₂₃ and R ₂₄ of formula 2, R ₃₅ is hydrogen, C1 to C12 alkyl,

,

, -CO-C(R ₃₈ )=C(H)R ₃₉ , or together with R ₃₇ when Y is -N(R ₃₇ )- to form -CO-CH=CH-CO-.

Here, in R ₂₂ , R ₂₃ and R ₂₄ of Formula 2, R ₃₈ is hydrogen or methyl, and R ₃₉ is hydrogen, methyl or -CO-X ₁ -R ₄₀ .

或

。Here, in R ₂₂ , R ₂₃ and R ₂₄ of Formula 2, R ₄₀ is hydrogen, C1 to C12 alkyl,

or

.

Here, in R ₂₂ , R ₂₃ and R ₂₄ of Formula 2, R ₃₆ and R ₃₇ are each independently hydrogen, C1 to C12 alkyl, C1 to C12 alkyl having one to three oxygen atoms therein, wherein C3 to C12 alkyl, cyclohexyl, C7 to C15 phenylalkyl having one to three oxygen atoms, and when Z is ethylene, R ₃₆ and R ₃₇ together form ethylene.

或

。In formula 2, X is -O- or -N-(E ₁ )-; E ₁ is hydrogen, substituted or unsubstituted C1 to C50 hydrocarbyl, or contains at least one of F, Cl, Br, I, O , substituted or unsubstituted C1 to C50 hydrocarbon groups of N, S, P or Si radicals,

or

.

In E ₁ of Formula 2, the hydrocarbon group may include a straight-chain or branched-chain alkyl group, a straight-chain or branched-chain alkenyl group, an alkynyl group, a cycloalkyl group, an arylalkyl group, an aryl group, and the like.

Specifically, in E ₁ of Formula 2, the substituted or unsubstituted C1 to C50 hydrocarbon group may be C1 to C24 straight or branched alkyl, C2 to C18 straight or branched alkenyl, C2 to C6 alkynyl, C5 to C12 cycloalkyl, C7 to C15 phenylalkyl, phenyl, naphthyl, phenyl with one to four C1 to C4 alkyl groups substituted on the benzene ring or A C7 to C15 phenylalkyl group of one to four C1 to C4 alkyl groups substituted on the ring.

Specifically, in E ₁ of Formula 2, the substituted or unsubstituted C1 to C50 hydrocarbon group containing at least one F, Cl, Br, I, O, N, S, P or Si atomic group contains at least one F, Cl, Br, I, O, N, S, P or Si radicals as substituent functional groups; or at least one F, Cl, Br, I, O, N, S, P or Si radical inserted into the hydrocarbon backbone.

Specifically, in E ₁ of Formula 2, F, Cl, Br, I, O, N, S, P or Si atomic groups may include -F, -OH, -OR ₄₂ , -NH ₂ , -NHR ₄₂ , -N(R ₄₂ ) ₂ , -NHCOR ₄₃ , -NR42COR ₄₃ , -OCOR ₄₄ , -COR ₄₅ , -SO ₂ R ₄₆ , -PO(R ₄₇ ) _n (R ₄₈ ) _2-n , -Si(R ₄₉ ) _n (R ₅₀ ) _3-n , -Si(R ₄₂ ) ₃ , -N ⁺ (R ₄₂ ) ₃ A ^- , -S ⁺ (R ₄₂ ) ₂ A ^- , -oxiranyl group, -CN, -CF ₃ , -NO ₂ , -NHR ₄₂ , -N(R ₄₂ ) ₂ , -SO ₂ R ₄₆ , -PO(R ₄₇ ) _n (R ₄₈ ) _2-n , -OR ₄₂ , -COR ₄₅ , - R ₄₅ et al.

In E ₁ of Formula 2, n means 0, 1, or 2; ^and A- means a general anion that can be bonded to -N ⁺ or -S ⁺ .

In E ₁ of formula 2, R ₄₂ is linear or branched C1 to C18 alkyl, linear or branched C2 to C18 alkenyl, C5 to C10 cycloalkyl, phenyl, naphthyl, C7 to C15 phenylalkyl or coupling of two _R42 to form a pyrrolidine, piperidine or morpholine structure in which the ring is formed with the N or Si atom.

In E ₁ of Formula 2, R ₄₃ is hydrogen, -OR ₄₂ , -NHR ₄₂ , -N(R ₄₂ ) ₂ or -R ₄₂ .

In E ₁ of Formula 2, R ₄₄ is -OR ₄₂ , -NHR ₄₂ , -N(R ₄₂ ) ₂ or -R ₄₂ .

In E ₁ of Formula 2, R ₄₅ is hydrogen, -OH, -OR ₄₂ , -NHR ₄₂ , -N(R ₄₂ ) ₂ , -O-glycidyl or -R ₄₂ .

In E ₁ of Formula 2, R ₄₆ is -OH, -OR ₄₂ , -NHR ₄₂ or -N(R ₄₂ ) ₂ .

In E ₁ of Formula 2, R ₄₇ is -NH ₂ , -NHR ₄₂ or -N(R ₄₂ ) ₂ .

In E ₁ of Formula 2, R ₄₈ is -OH or -OR ₄₂ .

In E ₁ of Formula 2, R ₄₉ is -Cl or -OR ₄₂ .

In E ₁ of Formula 2, R ₅₀ is a linear or branched C1 to C18 alkyl group.

More specifically, E ₁ of formula 2 can be hydrogen, C1 to C24 linear or branched alkyl, C2 to C18 linear or branched alkenyl, C2 to C6 alkynyl, C5 to C12 cycloalkyl , C7 to C15 phenylalkyl, phenyl or naphthyl.

More specifically, E ₁ of Formula 2 may include -F, -OH, -OR ₄₂ , -NH ₂ , -NHR ₄₂ , -N(R ₄₂ ) ₂ , -NHCOR ₄₃ , -NR ₄₂ COR ₄₃ , - OCOR ₄₄ , -COR ₄₅ , -SO ₂ R ₄₆ , -PO(R ₄₇ ) _n (R ₄₈ ) _2-n , -Si(R ₄₉ ) _n (R ₅₀ ) _3-n , -Si(R ₄₂ ) ₃ , -N ⁺ (R ₄₂ ) ₃ A ^- , -S ⁺ (R ₄₂ ) ₂ A ^- , oxirane and at least one functional group in the combination thereof as a substituent C1 to C24 linear or branched chain Alkyl, C2 to C18 linear or branched alkenyl or C2 to C6 alkynyl. Here, n is 0, 1, or 2; ^and A- is an anion that can be coupled to -N ⁺ or -S ⁺ .

More specifically, E ₁ of Formula 2 may be a C 1 to C 24 straight or branched alkane comprising at least one of O-, -S-, -NH-, -NR ₄₂ - and combinations thereof inserted therein C2 to C18 straight or branched chain alkenyl, C2 to C6 alkynyl, C5 to C12 cycloalkyl, C7 to C15 phenylalkyl, phenyl or naphthyl.

More specifically, E ₁ of Formula 2 may include -F, -Cl, -Br, -I, -CN, -CF ₃ , -NO ₂ , -NHR ₄₂ , -N(R ₄₂ ) ₂ , -SO C7 to C15 phenyl group in which at least one of ₂ R ₄₆ , -PO(R ₄₇ ) _n (R ₄₈ ) _2-n , -OH, -OR ₄₂ , -COR ₄₅ , -R ₄₅ and combinations thereof is a substituent Alkyl, phenyl or naphthyl.

In E ₁ of Formula 2, R ₂₁ , R ₂₂ , R ₂₃ , R ₂₄ , R ₂₅ , R ₂₆ , R ₂₇ and R ₂₈ are the same as defined above.

、

、

、

、

或

（其中*表示連接位點）。In formula 2, Q is a straight-chain or branched C2 to C20 alkylene, straight-chain or branched containing at least one of -O-, -NH- or -N(R ₃₄ )- inserted therein C2 to C20 alkylene, C5 to C10 cycloalkylene, p-phenylene,

,

,

,

,

or

(where * denotes the attachment site).

Compounds of formula 2 may be prepared by typical methods known in the art or may be commercially available products.

Specifically, the compound of Formula 2 may be represented by at least one of Formula 2-1 to Formula 2-12.

[Formula 2-1]

[Formula 2-2]

[Formula 2-3]

[Formula 2-4]

[Formula 2-5]

[Formula 2-6]

[Formula 2-7]

[Formula 2-8]

[Formula 2-9]

[Formula 2-10]

[Formula 2-11]

。[Formula 2-12]

.

Compounds of formula 2 may be prepared by typical methods known in the art or may be commercially available products.

( A-3 )Mode 3 compound of

The composition for encapsulating an organic light emitting diode according to the present invention may include the compound of Formula 3.

[Formula 3]

wherein R ¹ is substituted or unsubstituted C1 to C10 alkyl, substituted or unsubstituted C6 to C20 aryl, or substituted or unsubstituted C7 to C20 arylalkyl; R ² is substituted or unsubstituted C6 to C20 aryl; R ³ is substituted or unsubstituted C1 to C10 alkylene or substituted or unsubstituted C1 to C10 alkaneoxy; and R ⁴ is hydrogen or Substituted or unsubstituted C1 to C5 alkyl.

Specifically, in Formula 3, R ¹ may be a substituted or unsubstituted C1 to C10 alkyl group, preferably a substituted or unsubstituted C1 to C5 alkyl group. Specifically, in Formula 3, R ₂ may be a substituted or unsubstituted C6 to C18 aryl group, preferably a substituted or unsubstituted C6 to C12 aryl group. Specifically, in Formula 3, R ³ may be a substituted or unsubstituted C1 to C5 alkylene.

Specifically, the compound of Formula 3 may be represented by at least one of Formula 3-1 to Formula 3-4.

[Formula 3-1]

[Formula 3-2]

[Formula 3-3]

。[Formula 3-4]

.

Compounds of formula 3 can be prepared by typical methods known in the art.

( B ) at least one of a non-silicone-based photocurable multifunctional monomer and a polysiloxane-based photocurable multifunctional monomer

Non-polysiloxane-based photocurable multifunctional monomers do not contain silicon (Si) atoms, and may include substituted or unsubstituted C1 to C20 alkylene groups between (meth)acrylate groups, preferably Unsubstituted C1 to C15 alkylene di(meth)acrylates. Here, the carbon atoms of the alkylene group mean the number of carbon atoms present only in the alkylene group, excluding the carbon atoms in the di(meth)acrylate group. For example, the di(meth)acrylate can be represented by Formula 4.

[Formula 4]

wherein R ⁷ and R ⁸ are each independently hydrogen or methyl; and R ⁹ is a substituted or unsubstituted C1 to C20 alkylene.

For example, in Formula 4, R ⁹ can be an unsubstituted C8 to C12 alkylene. More specifically, the di(meth)acrylate may include octanediol di(meth)acrylate, nonanediol di(meth)acrylate, nonanediol di(meth)acrylate ), decanediol di(meth)acrylate, undecanediol di(meth)acrylate, and dodecanedi(meth)acrylate At least one of dodecanediol di(meth)acrylate.

In other embodiments, in addition to di(meth)acrylate, the non-silicone-based photocurable multifunctional monomer may further include tri(meth)acrylate, tetra(meth)acrylate, penta(meth)acrylate At least one of meth)acrylate and hexa(meth)acrylate is used as a silicon (Si)-free monomer. Tri(meth)acrylates may include tri(meth)acrylates of C3 to C20 triols, tetraols, pentaols or hexaols, such as trimethylolpropane tri(meth)acrylate (trimethylolpropane tri(meth)acrylate) ) acrylate,), pentaerythritol tri (meth) acrylate (pentaerythritol tri (meth) acrylate), dipentaerythritol tri (meth) acrylate (dipentaerythritol tri (meth) acrylate) and the like. Tetra(meth)acrylates may include tetra(meth)acrylates of C4 to C20 tetraols, pentaols or hexaols, such as pentaerythritol tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate (Meth) acrylate (dipentaerythritol tetra (meth) acrylate) and the like. The penta(meth)acrylates may include penta(meth)acrylates of C4 to C20 penta- or hexaols, such as dipentaerythritol penta(meth)acrylate, and the like. The hexa(meth)acrylates may include hexa(meth)acrylates of C4 to C20 hexaols, such as dipentaerythritol hexa(meth)acrylate, and the like.

Based on 100 parts by weight of component A, component B, component C and component D, there may be 10 to 70 parts by weight, preferably 20 to 60 parts by weight, more preferably 30 to 60 parts by weight , For example, 10 parts by weight, 20 parts by weight, 30 parts by weight, 40 parts by weight, 50 parts by weight, 60 parts by weight or 70 parts by weight of non-polysiloxane-based photocurable multifunctional monomers. Within this range, the multifunctional monomer can increase the crosslinking density of the encapsulation composition to increase the strength of a layer formed using the encapsulation composition.

The polysiloxane-based photocurable multifunctional monomer may include Si-containing polysiloxane-based di(meth)acrylate. The encapsulation composition includes a mixture of non-polysiloxane-based di(meth)acrylate and polysiloxane-based di(meth)acrylate as di(meth)acrylate to reduce its viscosity and curing shrinkage.

The polysiloxane-based di(meth)acrylate can be represented by Formula 5.

[Formula 5]

（其中*為元素的連接位點，且Z¹ 為氫或者經取代或未經取代的C1到C30烷基）；且 q為0到30的整數或平均介於0到30範圍內。wherein R ₅₁ and R ₅₂ are the same or different from each other and are each independently a single bond, substituted or unsubstituted C1-C20 alkylene, substituted or unsubstituted C1-C30 alkylene ether, *-N (R ₅₃ )-R ₅₄ -* (* is the attachment site of the element, R ₅₃ is a substituted or unsubstituted C1 to C30 alkyl, and R ₅₄ is a substituted or unsubstituted C1 to C20 alkylene base), substituted or unsubstituted C6 to C30 arylidene, substituted or unsubstituted C7 to C30 arylalkylene, or *-OR ₅₄ -* (* is the attachment site of the element, and R ₅₄ is substituted or unsubstituted C1 to C20 alkylene); Z ₁ , Z ₂ , Z ₃ , Z ₄ , Z ₅ and Z ₆ are the same or different from each other, and each is independently hydrogen, substituted or unsubstituted C1 to C30 alkyl group, substituted or unsubstituted C1 to C30 alkyl ether group, *-N(R ₅₅ )(R ₅₆ ) (* is the attachment site of the element, and R ₅₅ and R ₅₆ are the same as each other or different and each independently hydrogen or substituted or unsubstituted C1 to C30 alkyl), substituted or unsubstituted C1 to C30 alkyl thioether, substituted or unsubstituted C6 to C30 aryl or substituted or unsubstituted C7 to C30 arylalkyl, at least one of Z ₁ , Z ₂ , Z ₃ , Z ₄ , Z ₅ and Z ₆ is a substituted or unsubstituted C6 to C30 aryl base; Y ₁ and Y ₂ are the same or different from each other, and are represented by Formula 6: [Formula 6]

(wherein * is the attachment site of the element and Z1 is hydrogen or a substituted or unsubstituted ^C1 to C30 alkyl); and q is an integer from 0 to 30 or ranges on average from 0 to 30.

Here, the term "single bond" refers to a direct bond ( _Y1 -Si) without any intermediate element between Si and _Y1 , or a direct bond (Si- _Y2 ) between Si and Y2 without any intermediate element ₂ ).

R ₅₁ and R ₅₂ may be a C1 to C5 alkylene group or a single bond. Specifically, Z ₁ , Z ₂ , Z ₃ , Z ₄ , Z ₅ and Z ₆ can be C1 to C5 alkyl C6 to C10 aryl groups, wherein Z ₁ , Z ₂ , Z ₃ , Z ₄ , Z ₅ and At least one of Z ₆ may be a C6 to C10 aryl group. More specifically, Z ₁ , Z ₂ , Z ₃ , Z ₄ , Z ₅ and Z ₆ can be C1 to C5 alkyl or C6 to C10 aryl, wherein Z ₁ , Z ₂ , Z ₃ , Z ₄ , Z One, two, three, or _six of ₅ and Z6 may be a C6 to C10 aryl group. More specifically, Z ₁ , Z ₂ , Z ₃ , Z ₄ , Z ₅ and Z ₆ can be methyl, ethyl, propyl, butyl, pentyl, phenyl or naphthyl, wherein Z ₁ , Z One, two, three or six of ₂ , Z ₃ , Z ₄ , Z ₅ and Z ₆ may be phenyl or naphthyl. n may be an integer from 1 to 5.

Specifically, the polysiloxane-based di(meth)acrylate may be represented by any one of Formula 5-1 to Formula 5-6.

[Formula 5-1]

[Formula 5-2]

[Formula 5-3]

[Formula 5-4]

[Formula 5-5]

。[Formula 5-6]

.

The polysiloxane-based di(meth)acrylate may have 100 g/mol to 2,000 g/mol, specifically 200 g/mol to 1,000 g/mol, such as 100 g/mol, 200 g/mol, 300 g/mol mol, 400 g/mol, 500 g/mol, 600 g/mol, 700 g/mol, 800 g/mol, 900 g/mol, 1,000 g/mol, 1100 g/mol, 1200 g/mol, 1300 g/mol mol, 1400 g/mol, 1500 g/mol, 1600 g/mol, 1700 g/mol, 1800 g/mol, 1900 g/mol or 2,000 g/mol weight average molecular weight. Within this range, the encapsulation composition exhibits good deposition characteristics, and an organic layer with a low plasma etch rate can be achieved.

The polysiloxane-based di(meth)acrylate can be prepared by a typical method, or can be obtained from a commercial product. For example, polysiloxane-based di(meth)acrylate can be obtained by reacting a siloxane compound having at least one polysiloxane bond and containing an aryl group with a compound for expanding the carbon number (eg, allyl alcohol), and then It is prepared by reacting with (meth)acryloyl chloride, but not limited thereto. Alternatively, the polysiloxane-based di(meth)acrylate can be prepared by reacting an aryl group-containing siloxane compound having at least one polysiloxane bond with (meth)acryloyl chloride, but is not limited thereto.

Based on 100 parts by weight of component A, component B, component C and component D, there may be 10 to 50 parts by weight, preferably 10 to 40 parts by weight, more preferably 10 to 30 parts by weight , For example, a polysiloxane-based photocurable multifunctional monomer in an amount of 10 parts by weight, 20 parts by weight, 30 parts by weight, 40 parts by weight or 50 parts by weight. Within this range, the encapsulating composition can increase the crosslink density to increase the strength of the layer.

Based on 100 parts by weight of component A, component B, component C and component D, there may be 10 to 80 parts by weight, preferably 20 to 80 parts by weight, more preferably 50 to 80 parts by weight , For example, 10 parts by weight, 20 parts by weight, 30 parts by weight, 40 parts by weight, 50 parts by weight, 60 parts by weight, 70 parts by weight or 80 parts by weight of non-polysiloxane-based photocurable multifunctional monomers and polymers At least one of the silicone-based photocurable multifunctional monomers. Within this content range, the encapsulating composition can increase the crosslinking density to increase the strength of the layer.

( C ) photocurable monofunctional monomer

The photocurable monofunctional monomer is used to increase the photocuring rate of the encapsulating composition. In addition, the photocurable monofunctional monomer can improve the light transmittance of the organic layer, and can reduce the viscosity of the encapsulation composition.

Preferably, the photocurable monofunctional monomer may include a non-polysiloxane-based photocurable monofunctional monomer that does not contain silicon atoms.

The non-polysiloxane-based photocurable monofunctional monomer may include (C1) aromatic mono(meth)acrylate containing aromatic group and (C2) non-aromatic mono(meth)acrylic acid containing no aromatic group at least one of esters. Preferably, the non-polysiloxane-based photocurable monofunctional monomer may be (C1) an aromatic mono(meth)acrylate containing an aromatic group. Compared with non-aromatic mono(meth)acrylates, aromatic mono(meth)acrylates can ensure better UV blocking effect and plasma resistance of the encapsulation composition.

(C1) Aromatic mono(meth)acrylates may include substituted or unsubstituted aromatic group-containing mono(meth)acrylates. Here, the term "aromatic group" means a monocyclic aromatic group or a polycyclic aromatic group including a condensed form and the like, or a form in which monocyclic rings are connected to each other by a σ bond. In this context, an aromatic group is a non-indole-based group that does not contain an indolyl group. For example, aromatic groups can include substituted or unsubstituted C6-C50 aryl groups, substituted or unsubstituted C7-C50 arylalkyl groups, substituted or unsubstituted C3-C50 heteroaryl groups, and substituted or unsubstituted C3-C50 heteroaryl groups At least one of substituted or unsubstituted C3 to C50 heteroarylalkyl. More specifically, the aromatic group may include at least one of the following: phenyl, biphenyl, terphenyl, tetraphenyl, naphthyl, anthracenyl, phenanthryl, fenyl, triphenylene, Tetraphenyl, pyrenyl, benzopyrenyl, pentacenyl group, coronenyl group, ovalenyl group, corannulenyl group, benzyl group, pyridine base, pyrazinyl, pyrimidinyl, pyridazinyl, triazinyl, quinolinyl, isoquinolinyl, quinoxolinyl, acridine, quinazolinyl, cinnolinyl group, phthalazine base, thiazolyl, benzothiazolyl, isoxazolyl, benzisoxazolyl, oxazolyl, benzoxazolyl, pyrazolyl, indazolyl, imidazolyl, benzimidazolyl, purinyl , thienyl, benzothienyl, furyl, benzofuranyl and isobenzofuranyl.

For example, the aromatic mono(meth)acrylate can be represented by Formula 7.

[Formula 7]

wherein R ⁵ is hydrogen or methyl; s is an integer from 0 to 10; and R ⁶ is substituted or unsubstituted C6 to C50 aryl or substituted or unsubstituted C6 to C50 aryloxy.

For example, R can be ^{phenylphenoxyethyl} , phenoxyethyl, benzyl, phenyl, phenylphenoxy, phenoxy, phenethyl, phenylpropyl, phenbutyl, methylbenzene Ethyl, propylphenethyl, methoxyphenethyl, cyclohexylphenethyl, chlorophenethyl, bromophenethyl, methylphenyl, methylethylphenyl, methoxyphenyl, Propylphenyl, cyclohexylphenyl, chlorophenyl, bromophenyl, phenylphenyl group, biphenyl, terphenyl, tetraphenyl, anthracenyl, naphthyl, triphenylene , methylphenoxy, ethylphenoxy, methylethylphenoxy group, methoxyphenoxy, propylphenoxy, cyclohexylphenoxy, chlorophenoxy, bromine Phenoxy, biphenyloxy, terphenyloxy group, quaterphenyloxy group, anthraceneoxy, naphthyloxy or triphenylenyloxy group.

Specifically, the aromatic mono(meth)acrylate may include at least one of the following: 2-phenylphenoxyethyl (meth)acrylate, phenoxyethyl (meth)acrylate, benzene phenyl(meth)acrylate, phenoxy(meth)acrylate, 2-ethylphenoxy(meth)acrylate, benzyl(meth)acrylate, 2-phenoxy(meth)acrylate ) acrylate, 3-phenylpropyl (meth)acrylate, 4-phenylbutyl (meth)acrylate, 2-(2-methylphenyl)ethyl (meth)acrylate, 2-( 3-Methylphenyl)ethyl(meth)acrylate, 2-(4-methylphenyl)ethyl(meth)acrylate, 2-(4-propylphenyl)ethyl(methyl)acrylate ) acrylate, 2-(4-(1-methylethyl)phenyl)ethyl(meth)acrylate, 2-(4-methoxyphenyl)ethyl(meth)acrylate, 2- (4-Cyclohexylphenyl)ethyl(meth)acrylate, 2-(2-chlorophenyl)ethyl(meth)acrylate, 2-(3-chlorophenyl)ethyl(meth)acrylate Acrylate, 2-(4-Chlorophenyl)ethyl(meth)acrylate, 2-(4-Bromophenyl)ethyl(meth)acrylate, 2-(3-phenylphenyl)ethyl (meth)acrylate, 4-(biphenyl-2-yloxy)butyl (meth)acrylate, 3-(biphenyl-2-yloxy)butyl (meth)acrylate, 2-(biphenyl-2-yloxy)butyl(meth)acrylate, 1-(biphenyl-2-yloxy)butyl(meth)acrylate, 4-(biphenyl-2- oxy)propyl(meth)acrylate, 3-(biphenyl-2-yloxy)propyl(meth)acrylate, 2-(biphenyl-2-yloxy)propyl(meth)acrylate yl)acrylate, 1-(biphenyl-2-yloxy)propyl(meth)acrylate, 4-(biphenyl-2-yloxy)ethyl(meth)acrylate, 3-( Biphenyl-2-yloxy)ethyl(meth)acrylate, 2-(biphenyl-2-yloxy)ethyl(meth)acrylate, 1-(biphenyl-2-yloxy) ) ethyl (meth)acrylate, 2-(4-benzylphenyl)ethyl (meth)acrylate, 1-(4-benzylphenyl)ethyl (meth)acrylate and Structural isomers thereof, but not limited thereto. That is, it should be understood that the (meth)acrylates described herein are provided by way of example only, and the present invention is not limited thereto. Furthermore, the (meth)acrylates according to the present invention include all acrylates corresponding to their structural isomers. For example, although 2-phenylethyl (meth)acrylate is mentioned above only by way of example, (meth)acrylates according to the present invention include all 3-phenylethyl (meth)acrylates and 4-Phenyl (meth)acrylate.

Specifically, in Formula 7, s can be an integer from 1 to 5, and R ⁶ can be substituted or unsubstituted phenylphenoxy, substituted or unsubstituted phenylthio, Substituted or unsubstituted biphenylphenoxy or substituted or unsubstituted terphenylphenoxy group, wherein the substituents may be deuterium, C1 to C10 alkyl, C1 to C10 alkoxy , C6 to C18 aryl, C3 to C18 heteroaryl or thiol.

(C2) The non-aromatic mono(meth)acrylate may be a mono(meth)acrylate containing a substituted or unsubstituted C1 to C20 alkyl group. Specifically, the non-aromatic mono(meth)acrylate may be a mono(meth)acrylate containing an unsubstituted linear C1 to C20 alkyl group, more specifically an unsubstituted linear C10 to C20 alkyl group containing Mono(meth)acrylates of C20 alkyl groups. For example, non-aromatic mono(meth)acrylates may include decyl (meth)acrylate, undecyl (meth)acrylate, lauryl (meth)acrylate, tridecyl (meth)acrylate base ester, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, heptadecyl (meth)acrylate, (meth)acrylate ) octadecyl acrylate, nonadecyl (meth)acrylate and eicosyl (meth)acrylate, but not limited thereto.

Based on 100 parts by weight of Component A, Component B, Component C, and Component D, there may be 10 to 60 parts by weight, specifically 15 to 50 parts by weight, more specifically 15 parts by weight To 40 parts by weight, such as 10 parts by weight, 20 parts by weight, 30 parts by weight, 40 parts by weight, 50 parts by weight or 60 parts by weight of photocurable monofunctional monomers, preferably non-polysiloxane photocurable Monofunctional monomer. Within this content range, the encapsulating composition may have low viscosity and increased adhesion.

( D ) initiator

The initiator may include any typical photopolymerization initiator capable of performing a photocuring reaction. For example, photopolymerization initiators may include triazine, acetophenone, benzophenone, thioxanthone, benzoin, phosphorus, oxime initiators, or mixtures thereof.

Phosphorus initiators may include diphenyl(2,4,6-trimethylbenzyl)phosphine oxide, benzyl(diphenyl)phosphine oxide, and mixtures thereof. For example, in compositions according to the present invention, phosphorous initiators may exhibit better initiation performance under long wavelength UV light. These initiators can be used alone or as a mixture thereof.

Based on 100 parts by weight of Component A, Component B, Component C, and Component D, there may be 1 part by weight to 40 parts by weight, specifically 1 part by weight to 10 parts by weight, more specifically 1 part by weight to 9 parts by weight, 1 part by weight to 8 parts by weight, such as 1 part by weight, 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight, 6 parts by weight, 7 parts by weight, 8 parts by weight, 9 parts by weight, Initiator in an amount of 10 parts by weight, 20 parts by weight, 30 parts by weight or 40 parts by weight. Within this range, the initiator undergoes sufficient photopolymerization when exposed to light, and light transmittance deterioration due to unreacted initiator remaining after photopolymerization can be prevented.

The encapsulation composition according to the present invention can be prepared by mixing Component A to Component D. For example, the encapsulating composition can be formed as a solvent-free, solvent-free composition. For example, when the encapsulating composition is a solvent-free composition, the wt % is based on the total weight of components A to D.

The organic layer formed by photocuring the encapsulation composition may have 20% or less, specifically 15% or less, at a wavelength of 420 nm, preferably at a wavelength of 410 nm, more preferably at a wavelength of 405 nm %, more specifically 10% or less light transmittance. Within this range, the organic layer can prevent the lifespan of the organic light emitting diode panel from being shortened due to exposure to sunlight.

The encapsulation composition according to the present invention is a photocurable composition, and can be cured by irradiation with ultraviolet light at 10 mW/cm ² to 500 mW/cm ₂ for 1 to 50 seconds.

The encapsulation composition according to the present invention may have a viscosity of about 7 cP to 50 cP at 25°C±2°C. Within this range, the encapsulation composition can be easily deposited.

The encapsulation composition may have 10% or less, such as 10% or less, 9% or less, 8% or less than 8%, 7% or less, 6% or less, 5% or a plasma etch rate of less than 5%, 4% or less, or 3% or less, as represented by Equation 2. Within this range, the encapsulation composition can prevent the organic layer from being removed by plasma etching when the inorganic layer is formed on the organic layer, thereby improving the reliability of the organic light emitting diode.

The encapsulation composition can be used to encapsulate organic light emitting diodes. Specifically, the encapsulation composition may form an organic layer in an encapsulation structure in which an inorganic layer and an organic layer are sequentially stacked on top of each other. In particular, the encapsulation composition can be used for flexible organic light emitting diode displays.

Encapsulation compositions can be used to encapsulate components used in devices, particularly displays, due to the infiltration of gases or liquids in the surrounding environment (eg, oxygen and/or moisture and/or water vapor in the atmosphere) and due to the preparation of electronic products. The components may suffer from degradation or deterioration due to penetration of the chemicals used in them. Examples of components of an apparatus may include lighting devices, metal sensor pads, microdisc lasers, electrochromic devices, photochromic devices, microelectromechanical systems, solar cells, integrated circuits, electrical charges Coupling devices, light emitting polymers, light emitting diodes, etc., but not limited thereto.

The organic light emitting diode display according to the present invention may include an organic layer formed using the composition for encapsulating organic light emitting diodes according to embodiments of the present invention. Specifically, an organic light emitting diode display may include: an organic light emitting diode; and a barrier stack formed on the organic light emitting diode and including an inorganic layer and an organic layer, which may be used according to embodiments of the present invention The encapsulation composition is formed. Therefore, the organic light emitting diode display can exhibit high reliability.

Next, an organic light emitting diode display according to an embodiment will be explained with reference to FIG. 1 . FIG. 1 is a cross-sectional view of an organic light emitting diode display according to an embodiment of the present invention.

1, the organic light emitting diode display 100 according to this embodiment includes: a substrate 10; an organic light emitting diode 20 formed on the substrate 10; and a barrier stack 30 formed on the organic light emitting diode 20 and An inorganic layer 31 and an organic layer 32 are included, wherein the inorganic layer 31 is adjacent to the organic light emitting diode 20, and the organic layer 32 can be formed using the composition encapsulating the organic light emitting diode according to the embodiment of the present invention.

The substrate 10 may be any substrate as long as the organic light emitting diode can be formed on the substrate. For example, the substrate 10 may be formed of materials such as transparent glass, plastic plates, and silicon or metal substrates.

The organic light emitting diode 20 is generally used in an organic light emitting diode display, and although not shown in FIG. 1 , may include a first electrode, a second electrode, and an electrode formed between the first electrode and the second electrode. organic light-emitting layer. In addition, the organic light emitting layer may have a structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are sequentially stacked, but is not limited thereto.

The barrier stack 30 includes an inorganic layer 31 and an organic layer 32 composed of different components, so as to realize the function of encapsulating the organic light emitting diode.

The inorganic layer 31 contains a different composition from the organic layer 32, thereby complementing the effect of the organic layer. For example, the inorganic layer 31 may comprise a metal; a non-metal; a compound or alloy of at least two metals; a compound or alloy of at least two non-metals; an oxide of a metal or a non-metal; Metal nitrides; metal or non-metal carbides; metal or non-metal oxynitrides; metal or non-metal borides; metal or non-metal oxyborides; metal or non-metal silicides; or mixtures thereof . Metals or non-metals may include silicon (Si), aluminum (Al), selenium (Se), zinc (Zn), antimony (Sb), indium (In), germanium (Ge), tin (Sn), bismuth (Bi) , transition metals and lanthanide metals, but not limited thereto. Specifically, the inorganic layer may include silicon oxide (SiO _x ), silicon nitride (SiN _x ), silicon oxynitride (SiO _x N _y ), zinc selenide (ZnSe), zinc oxide (ZnO), antimony trioxide ( Sb ₂ O ₃ ), aluminum oxide (AlO _x ) including aluminum oxide (Al ₂ O ₃ ), indium oxide (In ₂ O ₃ ), or tin oxide (SnO ₂ ).

The inorganic layer 31 can be deposited by plasma processes or vacuum processes such as sputtering, chemical vapor deposition, plasma chemical vapor deposition, evaporation, sublimation, electron cyclotron resonance-plasma enhanced chemical vapor deposition, and combinations thereof.

The organic and inorganic layers may be alternately deposited to ensure planarization properties of the inorganic layers while preventing defects from one inorganic layer from spreading to other inorganic layers.

The organic layer 32 may be formed by a combination of coating, depositing, and curing the encapsulation composition according to embodiments of the present invention. For example, the organic layer 32 may be formed by coating the encapsulation composition to a thickness of 1 µm to 50 µm, and then curing the composition by irradiating at 10 mW/cm ² to 500 mW/cm ² for 1 second to 50 seconds.

The barrier stack 30 may include any number of organic and inorganic layers. The combination of organic and inorganic layers can vary with the level of resistance to oxygen and/or moisture and/or water vapor and/or chemicals. For example, the organic layer and the inorganic layer may be formed as a total of 10 layers or less, eg, 2 to 7 layers. Specifically, the organic layer and the inorganic layer were formed into a total of 7 layers in the following order: inorganic layer/organic layer/inorganic layer/organic layer/inorganic layer/organic layer/inorganic layer.

In the barrier stack 30, organic and inorganic layers may be alternately deposited. This is because the above-mentioned composition has an influence on the organic layer due to its properties. Thus, the organic and inorganic layers may complement or enhance the encapsulation of the components of the device.

Next, an organic light emitting diode display according to another embodiment will be explained with reference to FIG. 2 . 2 is a cross-sectional view of an organic light emitting diode display according to another embodiment of the present invention.

2, the organic light emitting diode display 200 according to this embodiment includes: a substrate 10; an organic light emitting diode 20 formed on the substrate 10; and a barrier stack 30 formed on the organic light emitting diode 20 and Including an inorganic layer 31 and an organic layer 32, wherein the inorganic layer 31 encapsulates the inner space 40 in which the organic light emitting diode 20 is received, and the organic layer 32 can use the composition for encapsulating the organic light emitting diode according to the embodiment of the present invention form. The organic light emitting diode display 200 according to this embodiment is substantially the same as the organic light emitting diode display 100 according to the above-described embodiment, except that the inorganic layer 31 does not adjoin the organic light emitting diode 20 .

Next, the present invention will be explained in more detail with reference to examples. It should be noted, however, that these examples are provided for illustration only and should not be construed as limiting the invention in any way.

Preparation example 1 : Preparative 1-4 compound of

In a 1,000ml flask equipped with a cooling tube and a stirrer, 300ml of acetone, 39g of triethylamine and 50g of 2,2'-[9,10-anthracenediylbis(oxy)]bisethanol (2,2 '-[9,10-antracendiylbix(oxy)]bisethanol) (Atomax Co., Ltd.), to which 30.2 g of methyl was slowly added while stirring the components at 0°C Acryloyl chloride. Next, the mixture was stirred for 1 hour after raising the temperature of the flask to 40°C. The remaining solvent was removed by distillation, thereby obtaining the compound of Formula 1-4 with a high performance liquid chromatography (HPLC) purity of 96%.

Preparation example 2 : Preparative 3-1 compound of

In a 1,000ml flask equipped with a cooling pipe and a stirrer, 200g of cyanoacetic acid, 320g of 2-hydroxyethyl methacrylate, 600ml of toluene and 3g of concentrated sulfuric acid (Daejung Chemicals & Materials Co., Ltd.)), followed by a nitrogen purge for 30 minutes and heating the flask to 160°C to remove water therefrom. The solvent was removed by distillation, thereby obtaining 2-acrylic acid-2-methyl-2-[(cyanocarbonyl)oxy]ethyl ester (2-cyanoacetoxymethacrylate) with an HPLC purity of 96%. ethyl ester, weight average molecular weight: 197.19 g/mol). ( ¹ H nuclear magnetic resonance, ¹ HNMR): δ6.12,s,1H;δ5.62,s,1H;δ4.45,m,2H;δ4.38,m,2H;δ3. 01,s,2H;δ1.94,s,3H)

In a 500ml flask equipped with a cooling tube and a stirrer, 15.2g KOH, 38g methyl iodide, 50g 2-phenyl-1H-indole-3-carbaldehyde and 150g dimethylformamide (DMF) were placed and placed in It was stirred at room temperature for 12 hours. The solvent was removed by distillation, thereby obtaining 1-methyl-2-phenyl-1H-indole-3-carbaldehyde (weight average molecular weight: 235.28 g/mol) with HPLC purity of 96%. ( ¹ HNMR: δ9.76,s,1H;δ8.46,m,1H;δ7.59,m,3H;δ7.52,m,2H;δ7.42,m,3H;δ3.79,s, 3H)

In a 500ml flask equipped with a cooling tube and a stirrer, 21g of 1-methyl-2-phenyl-1H-indole-3-carbaldehyde, 21.2g of 2-acrylic acid-2-methyl-2-[(cyano carbonyl)oxy]ethyl ester (2-cyanoacetoxyethyl methacrylate), 2.3 g of piperidine and 230 g of pyridine were stirred at room temperature for 12 hours. The solvent was removed by distillation, followed by recrystallization with ethanol, whereby a compound represented by Formula 3-1 and having an HPLC purity of 98% (molecular weight: 414.45 g/mol) was obtained. ( ¹ HNMR: δ8.46,m,1H;δ8.17,s,1H;δ7.59,m,3H;δ7.42,m,5H;δ6.15,s,1H;δ5.62,s, 1H;δ4.51,m,2H;δ4.42,m,2H;δ3.75,s,3H;δ1.96,s,3H)

Preparation example 3 : Preparative 5-2 compound of

In a 1,000ml flask equipped with a cooling pipe and a stirrer, 300ml of ethyl acetate, 21g of 3,3-diphenyl-1,1,5,5-tetramethyltrisiloxane and 43g of olefin were placed in this order Propanol (Darong Chemical Materials Co., Ltd.), followed by a nitrogen purge for 30 minutes. Next, 72 ppm of Pt-loaded carbon black powder (Aldrich GmbH) was added thereto, then the flask was heated to 80°C and the components were stirred for 4 hours. The remaining solvent was removed by distillation, thereby obtaining a compound. 71.5 g of the obtained compound and 39 g of triethylamine were sequentially added to 300 ml of dichloromethane, and then 30.2 g of methacryloyl chloride was slowly added thereto while stirring the mixture at 0°C. The remaining solvent was removed by distillation, thereby obtaining a compound represented by Formula 5-2 and having an HPLC purity of 96%. ( ¹ HNMR: δ7.52,m,6H;δ7.42,m,4H;δ6.25,d,2H;δ6.02,dd,2H;δ5.82,t,1H;δ5.59,d, 2H;δ3.86,m,4H;δ1.52,m,4H;δ0.58,m,4H;δ0.04,m,12H)

Details of components used in Examples and Comparative Examples are as follows.

(A1) Compound of Preparation Example 1 (Compound of Formula 1-4)

(A2) The compound of formula 2 (Tinuvin 970, 6-butyl-2-[2-hydroxy-3-(1-methyl-1-phenethyl)-5-(1,1, 3,3-Tetramethylbutyl)phenyl]pyrrole[3,4-f]benzotriazole-5,7(2H,6H)-dione (6-butyl-2-[2-hydroxy-3 -(1-methyl-1 -phenylethyl)-5-(1,1,3,3-tetramethylbutyl)phenyl]pyrrolo[3,4-f]benzotriazole-5,7(2H,6H)-dion), BASF)

(A3) Compound of Preparation Example 2 (Compound of Formula 3-1)

(A4) Tinalphine 477 (2,4,6-Tris[4-(1-octyloxycarbonyl)ethoxy-2-hydroxyphenyl]-1,3,5-triazine, BASF)

(B1) 1,12-Dodecanediol diacrylate (Sartomer Co., Ltd.)

(B2) 1,9-nonanediol diacrylate (Sartomer Co., Ltd.)

(B3) Compound of Preparation Example 3 (Compound of Formula 5-2)

(C1) Aromatic mono(meth)acrylate (M1142, Miwon Co., Ltd.)

(C2) Lauryl Acrylate (Sadolan Co., Ltd.)

(D) Initiator: Darocur TPO (BASF) (phosphorus initiator)

example 1

3 parts by weight of (A1) the compound of Preparation Example 1, 47 parts by weight of (B1) 1,12-dodecanediol diacrylate, 28 parts by weight of (B3) the compound of Preparation Example 3, and 19 parts by weight The (C1) aromatic mono(meth)acrylate and 3 parts by weight of the (D) initiator were put into a 125ml brown polypropylene bottle, and mixed by a stirrer at room temperature for 3 hours, thereby obtaining an encapsulation composition .

example 2 to instance 6 and a comparative example 1 to the comparative example 4

An encapsulation composition (unit: parts by weight) was prepared in the same manner as in Example 1 except that the contents of the components of Example 1 were changed as listed in Table 1.

The encapsulation compositions prepared in the Examples and Comparative Examples were evaluated with respect to the following properties listed in Table 1. The results are shown in Table 1.

(1) Viscosity (unit: cP): Using a viscometer No. 40 Spindle (Spindle No. 40) (LVDV-IIPro, Brookfield Co., Ltd.) at 25°C, the examples and comparative examples were measured. The viscosity of each encapsulation composition prepared in .

(2) Photocuring rate (unit: %): the intensity of absorption peaks around 1,635cm ^-1 (C=C) and 1,720cm ^-1 (C=O) using Fourier transform infrared (FT- Each package composition was measured with an IR) spectrometer (NICOLET 4700, Thermo Co., Ltd.). Each encapsulation composition was applied to a glass substrate by a sprayer, and then cured by irradiating ultraviolet rays at 100 mW/cm ² for 10 seconds, thereby preparing a sample having a size of 20 cm × 20 cm × 3 µm (width × length × thickness). Next, the intensities of the absorption peaks of the cured film were measured at the vicinity of 1,635 cm ^-1 (C=C) and 1,720 cm ^-1 (C=O) using an FT-IR spectrometer (Nicholit 4700, Thermoelectric Co., Ltd.). . The photocuring rate is calculated by Equation 1:

Light curing rate (%)=｜1-(A/B)｜×100, (Equation 1)

where A is the ratio of the intensity of the absorption peak around 1,635 cm ^-1 to the intensity of the absorption peak around 1,720 cm ^-1 , measured for the cured film, and B is the intensity of the absorption peak around 1,635 cm ^-1 , measured for the encapsulation composition The ratio of the intensity of the absorption peak to the intensity of the absorption peak around 1,720 cm ^-1 .

(3) Plasma etching rate (unit: %): each package composition was deposited on a Si wafer to a predetermined thickness and photocured to form an organic layer, and then the initial deposition height (T1, unit: µm) of the organic layer was measured . The organic layer was subjected to induction coupled plasma (ICP) treatment under the following conditions: ICP power: 2,500W, RE power: 300W, DC bias: 200V, Ar flow rate: 50sccm, Etching time: 1 min and pressure: 10 mTorr, then the height (T2, unit: µm) of the organic layer was measured. The height (thickness) of the organic layer was measured using field emission scanning electron microscopy (FE-SEM) (Hitachi High Technologies Corporation). The plasma etch rate of the organic layer is calculated by Equation 2:

The plasma etching rate (%) of the organic layer=(T1-T2)/T1×100, (Equation 2).

(4) Light transmittance (unit: %): Each encapsulation composition was cured by ultraviolet irradiation under N ₂ conditions to form a 10 μm thick film, and then Lambda 950 (PerkinElmer) was used. Co., Ltd. (Perkin Elmer Co., Ltd.) measured each package composition with respect to light transmittance at a wavelength of 405 nm.

Table 1

As shown in Table 1, the encapsulation composition according to the present invention can achieve an organic layer with good UV blocking effect and low plasma etch rate.

In contrast, the compositions of Comparative Example 1 and Comparative Example 4 in which the content of Component A was not within the scope of the present invention had a high plasma etching rate and an insignificant ultraviolet blocking effect. In addition, the compositions of Comparative Example 2 and Comparative Example 3, which contained other compounds other than Component A, had high plasma etching rates and insignificant ultraviolet blocking effects.

It should be understood that various modifications, changes, alterations and equivalent embodiments can be made by those skilled in the art without departing from the spirit and scope of the present invention.

10‧‧‧Substrate 20‧‧‧Organic Light Emitting Diodes 30‧‧‧Blocker stack 31‧‧‧Inorganic layer 32‧‧‧Organic layer 40‧‧‧Interior Space 100, 200‧‧‧Organic Light Emitting Diode Display

FIG. 1 is a cross-sectional view of an organic light emitting diode display according to an embodiment of the present invention. 2 is a cross-sectional view of an organic light emitting diode display according to another embodiment of the present invention.

10‧‧‧Substrate

20‧‧‧Organic Light Emitting Diodes

30‧‧‧Blocker stack

31‧‧‧Inorganic layer

32‧‧‧Organic layer

100‧‧‧Organic Light Emitting Diode Display

Claims (5)

A composition for encapsulating organic light-emitting diodes, comprising: component A: at least one of the compound of formula 1, the compound of formula 2 and the compound of formula 3; component B: non-polysiloxane-based photocurable polyamide at least one of a functional monomer and a polysiloxane-based photocurable multifunctional monomer; component C: a photocurable monofunctional monomer; and component D: an initiator,

wherein R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ are the same or different from each other, and are each independently hydrogen, substituted or unsubstituted C1 to C10 alkyl, substituted or unsubstituted C6 to C10 aryl, amine, halogen, cyano, nitro, group of formula 1-1, group of formula 1-2, group of formula 1-3 or substituted or unsubstituted C1 to C10 alkyl containing hydroxyl groups:

[Formula 1-2]

wherein * represents the attachment site of the aromatic carbon of the compound of formula 1, R ₁₁ is hydrogen or substituted or unsubstituted C1 to C5 alkyl, R ₁₂ is a single bond, substituted or unsubstituted C1 to C10 alkylene or substituted or unsubstituted C6 to C20 arylidene, R ₁₃ , R ₁₄ and R ₁₅ are the same or different from each other, and are each independently substituted or unsubstituted C1 to C10 alkylene group or a substituted or unsubstituted C6 to C20 aryl group, X ₁ and X ₂ are the same or different from each other, and are each independently O, S or NR, R is hydrogen or a substituted or unsubstituted C1 to C5 alkyl, m is an integer from 1 to 6, and n is an integer from 1 to 6;

where _R20 is

or

, R ₂₁ is hydrogen, substituted or unsubstituted C1 to C50 hydrocarbyl,

or

, R ₂₂ and R ₂₃ are substituted or unsubstituted C1 to C50 hydrocarbon groups or substituted or unsubstituted C1 to C50 hydrocarbon groups containing at least one O, N or S atomic group, R ₂₅ , R ₂₆ , R ₂₇ and R ₂₈ is each independently hydrogen, a halogen group, CN, NO ₂ or NH ₂ , X is -O- or -NE ₁ -, E ₁ is hydrogen, a substituted or unsubstituted C1 to C50 hydrocarbon group containing at least A substituted or unsubstituted C1 to C50 hydrocarbyl group of a F, Cl, Br, I, O, N, S, P or Si radical,

or

, R ₂₄ is a substituted or unsubstituted C1 to C50 hydrocarbon group or a substituted or unsubstituted C1 to C50 hydrocarbon group containing at least one O or N atomic group, Q is a linear or branched C2 to C20 alkylene group, straight-chain or branched C2 to C20 alkylene, C5 to C10 cycloalkylene, p-phenylene, containing at least one of -O-, -NH- or -NR ₃₄ - inserted therein,

,

,

L is C1 to C12 alkylene, C2 to C12 alkylene, C5 to C7 cycloalkylene, benzylidene, or p-xylylene, and * is the attachment to the aromatic carbon of the compound of formula 2 site;

wherein R ¹ is substituted or unsubstituted C1 to C10 alkyl, substituted or unsubstituted C6 to C20 aryl, or substituted or unsubstituted C7 to C20 arylalkyl, and R ² is substituted or unsubstituted C6 to C20 aryl, R ³ is substituted or unsubstituted C1 to C10 alkylene or substituted or unsubstituted C1 to C10 alkaneoxy, and R ⁴ is hydrogen or Substituted or unsubstituted C1 to C5 alkyl groups, wherein the photocurable monofunctional monomer is a non-polysiloxane-based photocurable monofunctional monomer; the non-polysiloxane-based photocurable monofunctional monomer includes At least one of an aromatic mono(meth)acrylate with an aromatic group and a non-aromatic mono(meth)acrylate without an aromatic group; with the component A, the component B, A total of 100 parts by weight of the component C and the component D includes: 0.01 to 10 parts by weight of the component A, 10 to 80 parts by weight of the component B, 10 parts by weight parts to 60 parts by weight of the component C and 1 part to 40 parts by weight of the component D, wherein the organic layer formed by photocuring the composition has 20% or more at a wavelength of 420 nm Light transmittance of less than 20%, and wherein the composition has a plasma etch rate of 10% or less, the plasma etch rate is calculated from Equation 2: [Equation 2] Plasma Etch Rate (% )=(T1-T2)/T1×100 (wherein in Equation 2, T1 is the initial deposition height of the organic layer formed by depositing the composition on a Si wafer and photocuring it , T2 is the height of the organic layer measured after inductively coupled plasma treatment is performed on the organic layer under the following conditions: inductively coupled plasma power: 2,500W, RE power: 300W, DC bias voltage : 200 V, Ar flow rate: 50 sccm, etching time: 1 minute and pressure: 10 mTorr). The composition for encapsulating organic light emitting diodes according to the claim 1, wherein in formula 1, R ₅ and R ₁₀ are each a group of the formula 1-2. The composition for encapsulating organic light emitting diodes according to item 1 of the claimed scope, wherein the compound of formula 1 comprises at least one of the compound of formula 1-4 and the compound of formula 1-5:

The composition for encapsulating organic light emitting diodes according to the claim 1, wherein the polysiloxane-based photocurable multifunctional monomer is represented by formula 5:

wherein R ₅₁ and R ₅₂ are the same or different from each other and are each independently a single bond, substituted or unsubstituted C1-C20 alkylene, substituted or unsubstituted C1-C30 alkylene ether, *-N (R ₅₃ )-R ₅₄ -*, substituted or unsubstituted C6 to C30 arylidene, substituted or unsubstituted C7 to C30 arylalkylene, or *-OR ₅₄ -*, * is elemental The attachment site, R ₅₃ is substituted or unsubstituted C1 to C30 alkyl, and R ₅₄ is substituted or unsubstituted C1 to C20 alkylene; Z ₁ , Z ₂ , Z ₃ , Z ₄ , Z ₅ and Z ₆ are the same or different from each other, and are each independently hydrogen, substituted or unsubstituted C1 to C30 alkyl, substituted or unsubstituted C1 to C30 alkyl ether group, *-N(R ₅₅ )(R ₅₆ ), a substituted or unsubstituted C1 to C30 alkyl thioether group, a substituted or unsubstituted C6 to C30 aryl group, or a substituted or unsubstituted C7 to C30 arylalkyl group, * is the attachment site of the element, and R ₅₅ and R ₅₆ are the same or different from each other and are each independently hydrogen or substituted or unsubstituted C1 to C30 alkyl; Z ₁ , Z ₂ , Z ₃ , Z ₄ , Z At least one of ₅ and Z ₆ is a substituted or unsubstituted C6 to C30 aryl group; Y ₁ and Y ₂ are the same or different from each other, and are represented by formula 6:

wherein * is the attachment site of the element, and Z1 is hydrogen or a substituted or unsubstituted ^C1 to C30 alkyl; and q is an integer from 0 to 30 or ranges from 0 to 30 on average. An organic light emitting diode display, comprising the organic layer formed using the composition for encapsulating organic light emitting diodes as described in any one of items 1 to 4 of the patent application scope.

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