TWI751804B - Cooling system of server - Google Patents
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Description
本揭露是有關於一種伺服器的冷卻系統,尤其是有關於一種兩相浸沒式冷卻系統。The present disclosure relates to a cooling system for a server, and more particularly, to a two-phase immersion cooling system.
浸沒式冷卻系統因其較佳的散熱效率,所以被廣泛應用於因為運轉而產生大量廢熱的電子元件之散熱,常見的實施方式例如將伺服器浸泡在液體槽內的介電液中以達到散熱目的。然而,浸沒式冷卻系統內存在之空氣中的水氣會因為冷凝形成冷凝水回到液體槽中,進而與浸泡在介電液中的電子元件接觸,而產生使電子元件損壞的風險。Because of its better heat dissipation efficiency, immersion cooling systems are widely used in the heat dissipation of electronic components that generate a lot of waste heat due to operation. A common implementation is to immerse the server in a dielectric liquid in a liquid tank to achieve heat dissipation. Purpose. However, the moisture in the air existing in the immersion cooling system can form condensed water back into the liquid tank due to condensation, and then contact the electronic components immersed in the dielectric liquid, resulting in the risk of damage to the electronic components.
為了避免空氣中的水氣冷凝而成的冷凝水與電子元件接觸而造成電子元件損壞,目前在液體槽中設置一裝有分子篩(吸水材料)的多孔箱體。多孔箱體內的分子篩可以吸取冷凝於液體槽內的液態水。In order to prevent the condensed water formed by condensation of water vapor in the air from contacting the electronic components and causing damage to the electronic components, a porous box containing molecular sieves (water-absorbing materials) is currently installed in the liquid tank. The molecular sieve in the porous box can absorb the liquid water condensed in the liquid tank.
然而,此多孔箱體僅能吸收與其接觸的水氣或液態水,對於不具主動液體流動的兩相浸沒式冷卻系統而言,不易控制液態水與分子篩接觸,可能發生冷卻系統雖裝有分子篩,但介電液表面仍飄有液態水的狀況,對於除水的效果不強。除此之外,由於多孔箱體放置於液體槽內,將造成液體槽的放大,分子篩的顆粒間亦存在介電液,增加介電液的使用量,導致介電液成本上升並降低系統密度。在目前的壓力控制裝置中,系統將因為壓力變化排出或吸收氣體。在這個狀況下,每當冷卻系統吸取外界新鮮空氣時,將引入額外的水氣,增加冷卻系統中產生液態水的可能並增加元件與液態水接觸的可能。除此之外,由於液態水的潛熱極大,液態水的產生除了對電子元件的危害外,也增加冷卻系統的負荷。However, the porous box can only absorb the water vapor or liquid water in contact with it. For a two-phase immersion cooling system without active liquid flow, it is difficult to control the contact between the liquid water and the molecular sieve. It may happen that although the cooling system is equipped with molecular sieve, However, there is still liquid water floating on the surface of the dielectric liquid, and the effect of removing water is not strong. In addition, since the porous box is placed in the liquid tank, the liquid tank will be enlarged, and there is also a dielectric liquid between the particles of the molecular sieve, which increases the usage of the dielectric liquid, leads to an increase in the cost of the dielectric liquid and reduces the system density. . In current pressure control devices, the system will either expel or absorb gas due to pressure changes. In this condition, each time the cooling system draws in fresh outside air, additional moisture will be introduced, increasing the likelihood of liquid water being generated in the cooling system and increasing the likelihood that components will come into contact with liquid water. In addition, because the latent heat of liquid water is extremely large, the production of liquid water not only harms electronic components, but also increases the load of the cooling system.
因此,如何提出一種可解決上述問題的伺服器的冷卻系統,是目前業界亟欲投入研發資源解決的問題之一。Therefore, how to propose a cooling system for a server that can solve the above problems is one of the problems that the industry is eager to devote to R&D resources to solve.
有鑑於此,本揭露之一目的在於提出一種可有解決上述問題之伺服器的冷卻系統。In view of this, one objective of the present disclosure is to provide a cooling system for a server that can solve the above problems.
為了達到上述目的,依據本揭露之一實施方式,一種伺服器的冷卻系統包含槽體以及壓力控制裝置。槽體配置以容置介電液。壓力控制裝置用以調節該槽體的壓力。壓力控制裝置包含冷凝器、除濕裝置、儲氣腔以及閥。冷凝器連接至槽體。除濕裝置連接冷凝器。儲氣腔連接除濕裝置。閥連接於除濕裝置與儲氣腔之間。閥配置以導通以及不導通該除濕裝置與該儲氣腔。In order to achieve the above objective, according to an embodiment of the present disclosure, a cooling system for a server includes a tank body and a pressure control device. The tank body is configured to accommodate the dielectric fluid. The pressure control device is used to adjust the pressure of the tank body. The pressure control device includes a condenser, a dehumidifier, an air storage chamber, and a valve. The condenser is connected to the tank. The dehumidifier is connected to the condenser. The air storage chamber is connected to the dehumidification device. The valve is connected between the dehumidification device and the air storage chamber. The valve is configured to conduct and not conduct the dehumidification device and the air storage chamber.
於本揭露的一或多個實施方式中,伺服器的冷卻系統進一步包含氣壓計以及控制器。氣壓計配置以感測槽體內之氣壓值。控制器配置以在氣壓值大於氣壓上限值時使閥不導通除濕裝置與儲氣腔,並配置以在氣壓值小於氣壓上限值時使閥導通除濕裝置與儲氣腔。In one or more embodiments of the present disclosure, the cooling system of the server further includes a barometer and a controller. The barometer is configured to sense the air pressure in the tank. The controller is configured to disable the valve from conducting the dehumidification device and the air storage chamber when the air pressure value is greater than the upper air pressure value, and is configured to enable the valve to conduct the dehumidification device and the air storage chamber when the air pressure value is less than the upper air pressure value.
於本揭露的一或多個實施方式中,控制器還配置以在氣壓值小於氣壓下限值時使閥不導通除濕裝置與儲氣腔。In one or more embodiments of the present disclosure, the controller is further configured to disable the valve from conducting the dehumidification device and the air storage chamber when the air pressure value is less than the air pressure lower limit value.
於本揭露的一或多個實施方式中,伺服器的冷卻系統進一步包含管線。管線之一端連接閥,且閥進一步配置以導通以及不導通除濕裝置與管線。In one or more embodiments of the present disclosure, the cooling system of the server further includes a pipeline. One end of the pipeline is connected to the valve, and the valve is further configured to conduct and not conduct the dehumidification device and the pipeline.
於本揭露的一或多個實施方式中,伺服器的冷卻系統進一步包含氣壓計以及控制器。氣壓計配置以感測槽體內之氣壓值。控制器配置以在氣壓值大於氣壓上限值時使閥不導通除濕裝置與儲氣腔,同時使閥導通除濕裝置與管線。控制器還配置以在氣壓值小於氣壓上限值時使閥導通除濕裝置與儲氣腔,同時使閥不導通除濕裝置與管線。In one or more embodiments of the present disclosure, the cooling system of the server further includes a barometer and a controller. The barometer is configured to sense the air pressure in the tank. The controller is configured to make the valve not conduct the dehumidification device and the air storage chamber when the air pressure value is greater than the upper limit value of the air pressure, and at the same time make the valve conduct the dehumidification device and the pipeline. The controller is further configured to make the valve conduct the dehumidification device and the air storage chamber when the air pressure value is less than the upper limit value of the air pressure, and at the same time make the valve do not conduct the dehumidification device and the pipeline.
於本揭露的一或多個實施方式中,控制器還配置以在氣壓值小於氣壓下限值時使閥導通除濕裝置與管線,同時使閥不導通除濕裝置與儲氣腔。In one or more embodiments of the present disclosure, the controller is further configured to make the valve connect to the dehumidifying device and the pipeline when the air pressure value is less than the lower limit value of the air pressure, while making the valve not connect to the dehumidifying device and the air storage chamber.
於本揭露的一或多個實施方式中,壓力控制裝置進一步包含箱體。並且冷凝器、除濕裝置、閥、儲氣腔以及管線皆位於箱體內。In one or more embodiments of the present disclosure, the pressure control device further includes a casing. And the condenser, dehumidifier, valve, air storage chamber and pipeline are all located in the box.
於本揭露的一或多個實施方式中,伺服器的冷卻系統進一步包含風扇組。風扇組設置於箱體上並鄰近冷凝器。In one or more embodiments of the present disclosure, the cooling system of the server further includes a fan set. The fan group is arranged on the box body and adjacent to the condenser.
於本揭露的一或多個實施方式中,除濕裝置進一步包含筒狀結構以及吸濕材料。筒狀結構具有位於相反兩側之接口。吸濕材料設置於筒狀結構中,並配置以吸收水而不吸收介電液。In one or more embodiments of the present disclosure, the dehumidifying device further includes a cylindrical structure and a moisture absorbing material. The cylindrical structure has interfaces on opposite sides. The hygroscopic material is disposed in the cylindrical structure and configured to absorb water but not dielectric fluid.
綜上所述,於本揭露之伺服器的冷卻系統中,氣體皆流經除濕裝置以增加除濕效率並降低槽內氣體濕度,因此相較於習知技術可自根本減少冷凝水產生的可能。除避免液態水對電子元件的危害,亦免除冷凝器冷凝水氣而需要的額外功耗。此外,本揭露之伺服器的冷卻系統藉由閥以控制系統氣壓於預定範圍,以避免系統的氣體量故多或過少。此外,本揭露之伺服器的冷卻系統藉由儲氣腔以儲存除濕後的乾空氣,以利伺服器的冷卻系統維持槽體內環境之乾燥。於本揭露之伺服器的冷卻系統中,由於除濕裝置係設置於槽體外,因此除了可縮小槽體所需的空間以增加冷卻系統的密度之外,還可減少介電液的使用量,從而降低冷卻系統的建置成本。To sum up, in the cooling system of the server of the present disclosure, the gas all flows through the dehumidification device to increase the dehumidification efficiency and reduce the humidity of the gas in the tank, so compared with the conventional technology, the possibility of condensed water can be fundamentally reduced. In addition to avoiding the harm of liquid water to electronic components, it also avoids the extra power consumption required by the condenser to condense water vapor. In addition, the cooling system of the server of the present disclosure uses a valve to control the air pressure of the system within a predetermined range, so as to avoid excessive or excessive air volume in the system. In addition, the cooling system of the server of the present disclosure stores the dehumidified dry air through the air storage chamber, so that the cooling system of the server can maintain the environment in the tank dry. In the cooling system of the server disclosed in the present disclosure, since the dehumidifying device is disposed outside the tank, in addition to reducing the space required for the tank to increase the density of the cooling system, the usage amount of the dielectric fluid can also be reduced, thereby reducing the amount of dielectric fluid used. Reduce the construction cost of the cooling system.
以上所述僅係用以闡述本揭露所欲解決的問題、解決問題的技術手段、及其產生的功效等等,本揭露之具體細節將在下文的實施方式及相關圖式中詳細介紹。The above descriptions are only used to describe the problems to be solved by the present disclosure, the technical means for solving the problems, and their effects, etc. The specific details of the present disclosure will be introduced in detail in the following embodiments and related drawings.
以下將以圖式揭露本揭露之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本揭露。也就是說,在本揭露部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。在所有圖式中相同的標號將用於表示相同或相似的元件。Several embodiments of the present disclosure will be disclosed in the following drawings, and for the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the present disclosure. That is, in some embodiments of the present disclosure, these practical details are unnecessary. In addition, for the purpose of simplifying the drawings, some well-known structures and elements will be shown in a simple and schematic manner in the drawings. The same reference numbers will be used throughout the drawings to refer to the same or similar elements.
以下將詳細介紹本實施方式之伺服器的冷卻系統100所包含的各元件的結構、功能以及各元件之間的連接關係。The structure and function of each element included in the
如第1圖所示,在本實施方式中,伺服器的冷卻系統100包含槽體110以及壓力控制裝置120。壓力控制裝置120包含冷凝器121、除濕裝置122、儲氣腔125以及閥126。槽體110的一側裝載介電液110a,槽體110的另一側為相對於介電液110a的氣體側110b。冷凝器121連接至槽體110。除濕裝置122連接至冷凝器121。除濕裝置122包含筒狀結構123以及吸濕材料124。筒狀結構123具有位於相反兩側之接口123a以及123b。吸濕材料124設置於除濕裝置122內。吸濕材料124配置以吸收水而不吸收介電液110a。儲氣腔125連接除濕裝置122。閥126連接於除濕裝置122以及儲氣腔125之間。As shown in FIG. 1 , in this embodiment, the
藉由前述結構配置,當槽體110內的介電液110a產生蒸氣時(例如,因電子元件的熱加溫),槽體110內的氣體會抵達冷凝器121而冷凝出介電液110a進而流回槽體110,剩餘的氣體接著抵達吸濕材料124而被吸收其中的水氣。在閥126導通除濕裝置122以及儲氣腔125的情況之下,被吸收水氣的氣體接著進入儲氣腔125,此時在儲氣腔125內之空氣皆為乾空氣。當槽體110內的氣壓因為槽內溫度降低而下降(例如,因電子元件停止熱加溫),儲氣腔125內的乾空氣將經由吸濕材料124以及冷凝器121進入槽體110。With the aforementioned structure and configuration, when the
在一些實施方式中,伺服器的冷卻系統100進一步包含箱體128,且冷凝器121、除濕裝置122、儲氣腔125、閥126以及管線127皆位於箱體128內。在一些實施方式中,伺服器的冷卻系統100進一步包含風扇組129。風扇組129設置於箱體128上。在一些實施方式中,風扇組129鄰近於冷凝器121,以提升冷凝器121的冷凝效率。風扇組129可根據使用者的需要而具有一或多個風扇。In some embodiments, the
如第2圖所示,在本實施方式中,伺服器的冷卻系統100進一步包含控制器C以及氣壓計112。控制器C例如設置於伺服器的冷卻系統100外以控制閥126。氣壓計112配置以量測槽體110內的氣壓值。首先,當氣壓計112偵測到槽體110內的氣壓在一氣壓上限值與一氣壓下限值之間時,控制器C會控制閥126導通除濕裝置122與儲氣腔125,以使得除濕後的乾空氣會持續進入儲氣腔125。接著,當氣壓計112偵測到槽體110內的氣壓大於氣壓上限值時,儲氣腔125也達到可儲存氣體體積的上限,此時氣壓計112會發出訊號至控制器C,隨後控制器C將控制閥126不導通除濕裝置122與儲氣腔125,以將乾空氣儲存於儲氣腔125。隨後,當氣壓計112偵測到槽體110內的氣壓小於氣壓上限值時,此時氣壓計112會發出訊號至控制器C,隨後控制器C將控制閥126導通除濕裝置122與儲氣腔125,以使得儲存於儲氣腔125的乾空氣再經由除濕裝置122以及冷凝器121回到槽體110內。As shown in FIG. 2 , in this embodiment, the
如第1圖以及第2圖所示,在本實施方式中,伺服器的冷卻系統100進一步包含管線127。管線127之一端連接閥126。當氣壓計112偵測到槽體110內的氣壓大於氣壓上限值時,儲氣腔125也達到可儲存氣體體積的上限,此時氣壓計112會發出訊號至控制器C,隨後控制器C將控制閥126不導通除濕裝置122與儲氣腔125,同時控制閥126導通除濕裝置122與管線127以使過多的氣體由管線127散逸至外界,以避免伺服器的冷卻系統100內的氣體過多。當氣壓計112偵測到槽體110內的氣壓小於氣壓上限值時,此時氣壓計112會發出訊號至控制器C,隨後控制器C將控制閥126導通除濕裝置122與儲氣腔125,同時控制閥126不導通除濕裝置122與管線127。As shown in FIGS. 1 and 2 , in this embodiment, the
如第1圖以及第2圖所示,在一些實施方式中,當氣壓計112偵測到槽體110內的氣壓小於一氣壓下限值時,此時氣壓計112會發出訊號至控制器C,隨後控制器C將控制閥126不導通除濕裝置122與儲氣腔125,同時控制閥126導通除濕裝置122與管線127,以進一步使伺服器的冷卻系統100吸收來自外界的空氣而避免伺服器的冷卻系統100內的氣體過少。As shown in FIG. 1 and FIG. 2, in some embodiments, when the
藉由前述結構配置,伺服器的冷卻系統100即可經由吸濕材料124的吸濕以達到保持整個系統為乾燥狀態之功效,並有效避免液態水接觸到電子元件。另外,由於槽體110內的介電液110a所產生之蒸氣可經由上述路徑冷凝於冷凝器121再流回槽體110,因此可有效地減少介電液110a之逸散以提高介電液110a的回收率。With the aforementioned structure and configuration, the
在一些實施方式中,冷凝器121可透過管材連接槽體110。在另一些實施方式中,冷凝器121可直接連接槽體110。In some embodiments, the
在一些實施方式中,介電液110a可以是油類或氟化液等介電物質,但本揭露不以此為限。In some embodiments, the
在一些實施方式中,吸濕材料124可以是分子篩,但本揭露不以此為限。在一些實施方式中,吸濕材料124可搭配濕度指示劑使用,以方便使用者根據濕度指示劑所指示的濕度狀態來即時更換吸濕材料124。In some embodiments, the
在一些實施方式中,儲氣腔125可以是一或多個可擴張且可縮聚的伸縮囊,但本揭露不以此為限。In some embodiments, the
在一些實施方式中,閥126可以是電磁閥,但本揭露不以此為限。In some embodiments, the
由以上對於本揭露之具體實施方式之詳述,可以明顯地看出,在本發明之伺服器的冷卻系統中,因為浸沒在介電液中產生廢熱的電子元件所導致的槽內熱蒸氣以及從外界進入伺服器的冷卻系統的濕空氣皆經由吸濕材料吸收水蒸氣和/或液態水,以達到避免在伺服器的冷卻系統內產生液態水與電子元件接觸的目的。由於進出伺服器的冷卻系統的空氣皆經過吸濕材料的處理,因此可有效地維持伺服器的冷卻系統內為低濕度狀態。在本發明之伺服器的冷卻系統中,使用者可以透過控制閥以達到使氣壓維持於設定的上限與下限之間以及防止介電液的逸散的目的,因此可有效地使氣壓恆定以及提升介電液的回收率。除此之外,在本發明之伺服器的冷卻系統中,省去放置於槽體內的除濕裝置可縮小槽體所需的空間,增加系統密度,亦可減少介電液的使用量,降低系統建置成本。From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that, in the cooling system of the server of the present invention, the hot vapor in the tank caused by the electronic components immersed in the dielectric liquid that generates waste heat and the The humid air entering the cooling system of the server from the outside absorbs water vapor and/or liquid water through the hygroscopic material, so as to avoid contact between the liquid water and the electronic components in the cooling system of the server. Since the air entering and exiting the cooling system of the server is treated with hygroscopic materials, it can effectively maintain the low humidity in the cooling system of the server. In the cooling system of the server of the present invention, the user can control the valve to maintain the air pressure between the set upper limit and the lower limit and prevent the escape of the dielectric fluid, thus effectively keeping the air pressure constant and increasing Dielectric fluid recovery. In addition, in the cooling system of the server of the present invention, omitting the dehumidification device placed in the tank can reduce the space required for the tank, increase the system density, and also reduce the amount of dielectric fluid used, reducing the system cost. construction cost.
在本發明的一實施方式中,本發明之冷卻系統係可應用於伺服器,該伺服器係可用於人工智慧(Artificial Intelligence,簡稱AI)運算、邊緣運算(edge computing),亦可當作5 G 伺服器、雲端伺服器或車聯網伺服器使用。In an embodiment of the present invention, the cooling system of the present invention can be applied to a server, and the server can be used for artificial intelligence (AI) computing, edge computing (edge computing), and can also be used as 5 G server, cloud server or car network server use.
雖然本揭露已以實施方式揭露如上,然其並不用以限定本揭露,任何熟習此技藝者,在不脫離本揭露的精神和範圍內,當可作各種的更動與潤飾,因此本揭露的保護範圍當視後附的申請專利範圍所界定者為準。Although the present disclosure has been disclosed as above in embodiments, it is not intended to limit the present disclosure. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection of the present disclosure The scope shall be determined by the scope of the appended patent application.
100:伺服器的冷卻系統
110:槽體
110a:介電液
110b:氣體側
112:氣壓計
120:壓力控制裝置
121:冷凝器
122:除濕裝置
123:筒狀結構
123a,123b:接口
124:吸濕材料
125:儲氣腔
126:閥
127:管線
128:箱體
129:風扇組
C:控制器
100: Cooling system for the server
110:
為讓本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖為繪示根據本揭露一實施方式之伺服器的冷卻系統的示意圖。 第2圖為繪示第1圖中之伺服器的冷卻系統之部分元件的功能方塊圖。 In order to make the above and other objects, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows: FIG. 1 is a schematic diagram illustrating a cooling system of a server according to an embodiment of the present disclosure. FIG. 2 is a functional block diagram showing some components of the cooling system of the server in FIG. 1 .
100:冷卻系統 100: Cooling system
110:槽體 110: tank body
110a:介電液 110a: Dielectric Fluid
110b:氣體側 110b: Gas side
112:氣壓計 112: Barometer
120:壓力控制裝置 120: Pressure control device
121:冷凝器 121: Condenser
122:除濕裝置 122: Dehumidification device
123:筒狀結構 123: Tubular structure
123a,123b:接口 123a, 123b: Interface
124:吸濕材料 124: Hygroscopic material
125:儲氣腔 125: Air storage chamber
126:閥 126: Valve
127:管線 127: Pipeline
128:箱體 128: Box
129:風扇組 129: Fan group
Claims (5)
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TW109140987A TWI751804B (en) | 2020-11-23 | 2020-11-23 | Cooling system of server |
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TW109140987A TWI751804B (en) | 2020-11-23 | 2020-11-23 | Cooling system of server |
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TW202221455A TW202221455A (en) | 2022-06-01 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105607715A (en) * | 2015-12-15 | 2016-05-25 | 曙光信息产业(北京)有限公司 | Liquid-cooling system of server |
US9699939B2 (en) * | 2014-06-24 | 2017-07-04 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
TW201816542A (en) * | 2016-10-19 | 2018-05-01 | 英業達股份有限公司 | Server cooling system |
CN107979955A (en) * | 2017-11-24 | 2018-05-01 | 北京百度网讯科技有限公司 | A kind of modularization liquid-cooled suit business device cabinet |
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2020
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US9699939B2 (en) * | 2014-06-24 | 2017-07-04 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
CN105607715A (en) * | 2015-12-15 | 2016-05-25 | 曙光信息产业(北京)有限公司 | Liquid-cooling system of server |
TW201816542A (en) * | 2016-10-19 | 2018-05-01 | 英業達股份有限公司 | Server cooling system |
CN107979955A (en) * | 2017-11-24 | 2018-05-01 | 北京百度网讯科技有限公司 | A kind of modularization liquid-cooled suit business device cabinet |
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