TWI751694B - Automatic shrink film connecting apparatus and automatic shrink film connecting method using the same - Google Patents

Abstract

The present invention relates to an automatic shrink film connecting apparatus and an automatic shrink film connecting method using the same, wherein the automatic shrink film connecting apparatus comprises a first film connecting device, a second film connecting device, a transfer device, a first feeding device, and a second feeding device. The first film connecting device comprises a first film connecting platform, a first upper rotating plate, and a first lower rotating plate. The second film connecting device comprises a second film connecting platform, a second upper rotating plate, and a second lower rotating plate. The transfer device is disposed corresponding to the first film connecting device or the second film connecting device and comprises a transfer platform, a third upper rotating plate, a third lower rotating plate, and a cutting element. The first feeding device provides a first shrink film to the first film connecting device. The second feeding device provides a second shrink film to the second film connecting device.

Description

Automatic film bonding equipment and automatic film bonding method using the same

The present invention relates to an automatic film bonding equipment and an automatic film bonding method using the same.

The conventional film splicing device must assign manpower to keep an eye on the stock of the film material, and rely on experience to judge whether the film material needs to be replaced. In addition, before the film material is about to be used up, the production line must be manually stopped, and then the new film material must be manually replaced. The production line can be restarted for production after the old film material and the new film material are joined together. Furthermore, in the process of replacing the film material, it is necessary to rely on manpower to cut the film material and the appropriate length of tape, and then manually align the front end of the new film material with the tail end of the old film material, and then use the tape to join.

However, in the prior art, since it is necessary to keep an eye on the usage of the film material to prevent the production line from being shut down, labor costs are increased. Secondly, due to the slow speed of manual replacement of the membrane material, the production line must be stopped to replace the membrane material for a long time, which will cause great business losses. Furthermore, since it relies on manual alignment and lamination of the old and new film materials, each time the new and old film materials are joined together, there may be deviations, and it is difficult to quickly and stably attach the two rolls of film materials, and the manual lamination process is even more difficult. There may be a problem of fouling the membrane material. In addition, in the prior art, the film material to be bonded is a single-layer film material, and it is difficult to apply the bonding technology of the single-layer film material to the double-layer film material for bonding. Therefore, the bonding technology of the double-layer film material is difficult. Still to go One-step development or improvement. To sum up, the use of the conventional film bonding device may cause problems such as increased production cost, decreased yield, decreased yield, unreliable bonding of film materials, fouling of film materials, or difficulty in bonding double-layer film materials.

Therefore, it is urgent to propose a new automatic film splicing equipment to eliminate or alleviate the above problems.

In view of this, the present invention proposes an automatic film splicing equipment to reduce production cost, increase productivity, improve yield, make shrink film surely join or keep shrink film clean.

In order to achieve the above object, according to the first aspect of the present invention, the automatic film bonding equipment of the present invention includes a first film bonding device, a second film bonding device, a transfer device, a first feeding device, and a second feeding device. . The first film bonding device includes a first film bonding stage, a first upper turning plate and a first lower turning plate, wherein the first film bonding stage has a first film bonding end; the first upper turning plate is arranged on the first film bonding stage. The first film connecting end; the first lower turning plate is arranged on the first film connecting end of the first film connecting stage, and the first upper turning plate and the first lower turning plate are correspondingly arranged, so the first upper turning plate and the first lower turning The rotating plate can be rotated to open an angle (for example, 0 degrees to 180 degrees). The second film bonding device includes a second film bonding stage, a second upper turning plate and a second lower turning plate, wherein the second film bonding stage has a second film bonding end; the second upper turning plate is arranged on the second film bonding stage The second film-connecting end of the second film-connecting plate; the second lower turning plate is arranged at the second film-connecting end of the second film-connecting stage, wherein the second upper turning plate and the second lower turning plate are correspondingly arranged. Similarly, the second upper turning plate and The second lower turning plate can be rotated to open at an angle (eg, 0°˜180°).

Secondly, the transfer device is arranged corresponding to the first film bonding station or the second film bonding station, so the transfer device can receive the shrink film from the first film bonding device or the second film bonding device. Here, the form of the shrink film can be It is a double-layer film material, but the present invention is not limited to this, it can also be a single-layer film material or a multi-layer film material, and the transfer device includes a transfer table, a third upper transfer plate, a third lower transfer plate and a cutting element, wherein The transfer stage has a third film-contacting end; The third upper transfer plate is arranged on the third film-contacting end of the transfer table; the third lower transfer plate is arranged on the third film-connecting end of the transfer table, wherein the third upper transfer plate and the third lower transfer plate are correspondingly arranged, which are Therefore, the third upper turning plate and the third lower turning plate can be rotated to open an angle (for example, 0 degrees to 180 degrees); the cutting element is arranged adjacent to the third film-contacting end of the transfer table, and is arranged on the first film-contacting end The first shrink film or the second shrink film can be cut between the end and the third film-bonding end or between the second film-bonding end and the third film-bonding end, wherein the cutting element can be a scissors, a blade, a saw blade or any suitable An element for cutting the shrink film, but the present invention is not limited thereto.

Furthermore, the first feeding device supplies the first shrink film to the first film joining device. The second feeding device supplies the second shrink film to the second film joining device. When feeding from the first shrink film, the second shrink film is in the state of waiting for film connection. When the first shrink film only has a predetermined length remaining, the second shrink film will be joined to the first shrink film, and the second shrink film will be changed to the first shrink film. Two shrink film feeds, and vice versa, where the automatic splicing method will be described below.

In the automatic film splicing equipment of the present invention, the means for joining the first shrink film and the second shrink film is not particularly limited. Bonding of two shrink films.

In the automatic film bonding equipment of the present invention, the first film bonding device may further include a first upper adsorption element and a first lower adsorption element, the first upper adsorption element may be disposed on the first upper turn plate, and the first lower adsorption element It can be disposed on the first lower transfer plate, wherein the first upper adsorption element and the first lower adsorption element are disposed adjacent to the third film-contacting end of the transfer stage, but the invention is not limited thereto. In addition, the first upper adsorption element and the first lower adsorption element can respectively adsorb the adhesive tape, and the opposite side of the adhesive surface of the adhesive tape is adsorbed on the surfaces of the first upper turning plate and the first lower turning plate, but the invention is not limited thereto.

In the automatic film bonding equipment of the present invention, the first film bonding device may further comprise a first roller, which is arranged at the first film feeding end of the first film bonding stage, and the first film feeding end is opposite to the first film bonding end, But the present invention Not limited to this. Secondly, the first shrink film can pass between the first film joining station and the first roller, and the first roller can maintain a stable supply of the first shrink film, but the invention is not limited to this.

In the automatic film bonding equipment of the present invention, the second film bonding device may further include a second upper adsorption element and a second lower adsorption element, the second upper adsorption element may be disposed on the second upper turn plate, and the second lower adsorption element It can be disposed on the second lower transfer plate, wherein the second upper adsorption element and the second lower adsorption element are disposed adjacent to the third film-contacting end of the transfer stage, but the invention is not limited thereto. In addition, the second upper adsorption element and the second lower adsorption element can respectively adsorb the adhesive tape, and the opposite side of the adhesive surface of the adhesive tape is adsorbed on the surfaces of the second upper turning plate and the second lower turning plate, but the invention is not limited thereto.

In the automatic film bonding equipment of the present invention, the second film bonding device may further comprise a second roller, which is arranged at the second film feeding end of the second film bonding stage, and the second film feeding end is opposite to the second film bonding end, However, the present invention is not limited to this. Secondly, the second shrink film can pass between the second film joining station and the second roller, and the second roller can maintain a stable supply of the second shrink film, but the invention is not limited to this.

In the automatic film bonding apparatus of the present invention, the first film bonding device and the second film bonding device may be disposed adjacent to each other, but the present invention is not limited thereto. For example, the first film bonding device and the second film bonding device can be arranged in a stacked manner or side by side.

In the automatic film splicing equipment of the present invention, the transfer device may further include a guide wheel, so that the first shrink film or the second shrink film can move along the conveying direction, but the invention is not limited thereto.

In the automatic film splicing equipment of the present invention, the cutting element can be arranged on the third upper turning plate to cut the first shrink film or the second shrink film, but the invention is not limited thereto.

In the automatic film splicing equipment of the present invention, a moving element can be further included, which is pivotally connected with the transfer device, and enables the transfer device to move toward or away from the first film splicing device or the second film splicing device, so that the transfer device can be moved. The carrier device may correspond to the first film bonding device or the second film bonding device and receive the first shrink film from the first film bonding device or the second shrink film from the second film bonding device, but the invention is not limited thereto.

In the automatic film bonding equipment of the present invention, it may further include a motor, which is connected with the guide wheel to drive the guide wheel, wherein the motor can be a DC motor, an AC motor or any suitable type of motor, but the present invention is not limited thereto.

According to the second aspect of the present invention, the present invention further provides an automatic film bonding method, comprising the following steps:

Step S1: Provide the automatic film splicing equipment as described above.

Step S2: Setting the first shrink film on the first feeding device, supplying the first shrink film to the first film bonding device and the transfer device, and transferring the first shrink film on the first film bonding stage and the transfer stage .

Step S3: setting the second shrink film on the second feeding device, and supplying the second shrink film to the second film bonding stage of the second film bonding device, one end of the second shrink film is set corresponding to the second film bonding end, The second shrink film is cut to form a first film layer and a second film layer, the first film layer is arranged on the second upper turntable, the second film layer is arranged on the first lower turntable, and the second upper turntable is The surfaces of the turning plate and the second lower turning plate face the third film bonding end of the transfer table respectively, so the second film bonding device is in the standby film bonding state at this time, and the film bonding can be performed at any time.

Step S4: when the first shrink film remains on the first feeding device with a predetermined length, the surface of the third upper rotating plate is opposite to the surface of the third lower rotating plate, and the first shrink film is cut with a cutting element.

Step S5 : moving the transfer device, so that the transfer stage and the second film contact stage are set correspondingly.

Step S6: turning the second upper turning plate and the second lower turning plate so that the surfaces of the second upper turning plate and the second lower turning plate are opposite to each other, so that the first film layer and the second lower turning plate on the second upper turning plate are separated. The upper second film layer is bonded to the first shrink film.

In the automatic film joining method of the present invention, the first film layer and the second film layer of the second shrink film can be bonded to the first shrink film by any means; for example, through tape, glue, welding or other film materials The bonding mode is combined with the first shrink film.

In the automatic film joining method of the present invention, the first film layer on the second upper transfer plate and the second film layer on the second lower transfer plate can be respectively bonded to the first shrink film through adhesive tapes. Similarly, the first film layer on the first upper turning plate and the second film layer on the first lower turning plate can also be bonded to the second shrink film through adhesive tapes, respectively.

The accompanying drawings and detailed description will hereinafter make other objects, advantages and novel features of the present invention more apparent.

1: The first film bonding device

2: The second film bonding device

3: Transfer device

4: Moving Components

5: The first feeding device

6: The second feeding device

7: The first shrink film

7a: The first film layer

7b: Second film layer

8: Second shrink film

8a: The first film layer

8b: Second film layer

9: Bracket

10: Motor

11: The first film joining station

11a: The first film connection end

11b: The first membrane entry end

12: Side panels

13: The first turn board

14: The first turn board

15: The first roller

21: The second film joining station

21a: The second film connection end

21b: The second membrane entry end

22: Side panels

23: Second upper turn board

24: The second turn board

25: Second roller

31: Transfer stage

31a: The third film terminal

31b: The third exit end

32: Guide wheel

33: The third upper turn board

34: The third turn board

35: Cutting Elements

36: Front side panel

37: Rear side panel

38: Roller

91: Orbit

100: Automatic film bonding equipment

111: First side

112: Second side

131: The first upper adsorption element

132: Tape

141: The first lower adsorption element

142: Tape

211: First side

212: Second Side

231: Second upper adsorption element

232: Tape

241: The second lower adsorption element

242: Tape

311: First side

312: Second side

C: cutting direction

D: conveying direction

F: long axis direction

FIG. 1 shows a three-dimensional schematic diagram of an automatic film bonding apparatus according to an embodiment of the present invention.

2(A) to 2(C) are schematic perspective views of a transfer device according to an embodiment of the present invention.

3(A) to FIG. 3(B) are schematic perspective views of a film bonding device according to an embodiment of the present invention.

4(A) to 4(C) are schematic perspective views of a film bonding device according to an embodiment of the present invention.

5 to 10 show the action side views of the automatic film bonding apparatus according to an embodiment of the present invention.

Various embodiments of the present invention are provided below. These embodiments are used to illustrate the technical content of the present invention, but not to limit the scope of the right of the present invention. A feature of one embodiment can be applied to other embodiments by suitable modification, substitution, combination, isolation.

It should be noted that in this text, unless otherwise specified, ordinal numbers such as "first" and "second" are only used to distinguish multiple elements with the same name, and do not mean that there is a rank or hierarchy between them. , execution sequence or process sequence. A "first" element and a "second" element may appear together in the same component or separately in different components. The presence of an element with a higher ordinal number does not necessarily imply the presence of another element with a lower ordinal number.

In addition, in this article, the so-called "upper", "lower" or "between" and other terms are only used to describe the relative positions between multiple elements, and can be extended to include translation, rotation or mirroring in interpretation situation.

Furthermore, herein, unless specifically stated otherwise, "an element is on another element" or the like does not necessarily mean that the element is in contact with the other element.

Furthermore, herein, "preferred" or "better" is used to describe optional or additional elements or features, ie, those elements or features are not required and may be omitted.

Automatic film bonding equipment

FIG. 1 shows a three-dimensional schematic diagram of an automatic film bonding apparatus according to an embodiment of the present invention.

As shown in FIG. 1 , the automatic film bonding equipment 100 of this embodiment includes a first film bonding device 1 , a second film bonding device 2 , a transfer device 3 , a moving element 4 , a first feeding device 5 , and a second feeding device 5 . Feeding device 6 , first shrink film 7 , second shrink film 8 , bracket 9 and motor 10 . Wherein, the first film bonding device 1 and the second film bonding device 2 are stacked; in another embodiment, the first film bonding device 1 and the second film bonding device 2 can be arranged side by side.

In addition, the moving element 4 is arranged on the track 91 of the bracket 9, and the moving element 4 is pivotally connected with the transfer device 3, so the moving element 4 moves along the long axis direction F of the track 91 of the bracket 9, and simultaneously moves the transfer device. 3. The transfer device 3 can move toward or away from the first film bonding device 1 or the second film bonding device 2, so that the transfer device 3 can be set corresponding to the first film bonding device 1 or the second film bonding device 2, to receive the first shrink film 7 from the first film bonding device 1 or the second shrink film 8 from the second film bonding device 2, wherein, in one embodiment, the first shrink film 7 and the second shrink film 8 are respectively It is a double-layer film material, but not limited to this.

Secondly, the transfer device 3 further has a guide wheel 32, and the guide wheel 32 is connected with the motor 10, so the motor 10 can drive the guide wheel 32 to rotate, so that the first shrink film 7 or the second shrink film 8 moves along the conveying direction D . Here, the rotation direction of the guide pulley 32 can be determined by the conveying direction D. As shown in FIG.

Furthermore, the first feeding device 5 supplies the first shrink film 7 to the first film bonding device 1 , and the second feeding device 6 supplies the second shrink film 8 to the second film bonding device 2 , wherein the first feeding device 5 and the second feeding device 6 are arranged side by side; in another embodiment, the first feeding device 5 and the second feeding device 6 can be stacked.

In this embodiment, the automatic film bonding apparatus 100 includes two film bonding devices (respectively the first film bonding device 1 and the second film bonding device 2) and two feeding devices (respectively the first feeding device 5 and the second film bonding device 2). The second feeding device 6). However, the present invention is not limited to this. In other embodiments of the present invention, the automatic film bonding apparatus 100 may include more than three film bonding devices and more than three feeding devices, as long as the number of film bonding devices corresponds to the number of feeding devices.

2(A) to 2(C) are schematic perspective views of a transfer device according to an embodiment of the present invention.

As shown in FIG. 2(A) (the third upper turning plate 33 and the third lower turning plate 34 are in an open state, and the included angle between them is 180 degrees), the transfer device 3 includes a transfer table 31 , a guide wheel 32 , a first Three upper turning plates 33 , a third lower turning plate 34 , a cutting element 35 , a front side plate 36 , a rear side plate 37 and a roller 38 . Wherein, the transfer stage 31 has a third film contact end 31a, a third film discharge end 31b, a first side 311 and a second side 312, and the transfer table 31 is disposed between the two front side plates 36 and the two rear side plates 37; In addition, the first shrink film 7 or the second shrink film 8 is on the first side 311 of the transfer stage 31 conveyed, while the second side 312 is the opposite of the first side 311 . Next, the guide wheel 32 is arranged on the third film outlet end 31b of the transfer table 31 and is driven by the motor 10 (as shown in FIG. 1 ) so that the first shrink film 7 or the second shrink film 8 can move along the conveying direction D . Furthermore, the roller 38 is arranged on the transfer table 31, and the first shrink film 7 or the second shrink film 8 can pass between the roller 38 and the transfer table 31 to maintain the first shrink film 7 or the second shrink film 8. stable supply. In addition, the third upper rotating plate 33 is disposed on the third film-contacting end 31a of the transfer table 31 and is pivotally connected to the two rear side plates 37 , and the third lower rotating plate 34 is disposed on the third film-contacting end 31a of the transfer table 31 . It is pivotally connected to the two rear side plates 37, wherein the third upper rotating plate 33 and the third lower rotating plate 34 are correspondingly disposed, so the third upper rotating plate 33 and the third lower rotating plate 34 can be rotated to open a predetermined angle. In FIG. 2(A), the third upper turning plate 33 and the third lower turning plate 34 are opened 180 degrees; but in other embodiments of the present invention, the third upper turning plate 33 and the third lower turning plate 34 The opening angle is not limited to this, as long as it does not affect the movement of the first shrink film 7 or the second shrink film 8 . In addition, the cutting element 35 is disposed on the third upper rotating plate 33 to cut the first shrink film 7 or the second shrink film 8 ; in another embodiment, the cutting element 35 can be disposed on the third lower rotating plate 34 .

As shown in FIG. 2(B) (the third upper turning plate 33 and the third lower turning plate 34 are closed, and the included angle between the two is 0 degrees), by rotating the third upper turning plate 33 and the third lower turning plate 34, the third upper turning plate 33 and the third lower turning plate 34 can be turned into a closed state to clamp and fix the first shrink film 7 or the second shrink film 8, thereby facilitating the cutting element 35 to cut the first shrink film 7 or second shrink film 8.

As shown in FIG. 2(C) (the third upper turning plate 33 and the third lower turning plate 34 are in a closed state, and the cutting element 35 is activated), the cutting element 35 can move along the cutting direction C perpendicular to the conveying direction D to The first shrink film 7 or the second shrink film 8 is cut.

3(A) to FIG. 3(B) are schematic perspective views of a film bonding device according to an embodiment of the present invention.

As shown in FIG. 3(A) (the first upper turning plate 13 and the first lower turning plate 14 or the second upper turning plate 23 and the second lower turning plate 24 are in the open state, and the included angle between them is 180 degrees), the first A film bonding device 1 includes a first film bonding stage 11 , a side plate 12 , a first upper turning plate 13 , a first lower turning plate 14 and a first roller 15 . The first film bonding stage 11 has a first film bonding end 11 a , a first film feeding end 11 b , a first side 111 and a second side 112 , and the first film bonding stage 11 is disposed between the two side plates 12 . The first upper turning plate 13 is disposed on the first film bonding end 11a of the first film bonding stage 11 and is pivotally connected to the two side plates 12, and a first upper suction element 131 is disposed on the first upper turning plate 13; The lower turning plate 14 is disposed on the first film connecting end 11a of the first film bonding stage 11 and is pivotally connected to the two side plates 12, and a first lower suction element 141 is disposed on the first lower turning plate 14; The rotating plate 13 and the first lower rotating plate 14 are arranged correspondingly, and the first upper suction element 131 and the first lower suction element 141 respectively disposed on the rotating plate 13 are also arranged correspondingly, so the first upper rotating plate 13 and the first lower rotating plate 13 The plate 14 can be rotated to open a predetermined angle. In FIG. 3(A), the first upper turning plate 13 and the first lower turning plate 14 are opened 180 degrees; but in other embodiments of the present invention, the first upper turning plate 13 and the first lower turning plate 14 The opening angle is not limited to this, as long as it does not affect the bonding of the subsequent shrink film. The first roller 15 is disposed at the first film feeding end 11b of the first film bonding stage 11 , wherein the first shrink film 7 can pass between the first film bonding stage 11 and the first roller 15 , and is placed on the first film bonding stage 11 . The first side 111 is conveyed on the second side 112, and the second side 112 is the opposite side of the first side 111, so as to maintain a stable supply of the first shrink film 7 by the first roller 15 (as shown in FIG. 4(B) ).

In addition, the second film bonding device 2 includes a second film bonding stage 21 , a side plate 22 , a second upper turning plate 23 , a second lower turning plate 24 and a second roller 25 . The second film bonding stage 21 has a second film bonding end 21 a , a second film feeding end 21 b , a first side 211 and a second side 212 , and the second film bonding stage 21 is disposed between the two side plates 22 . The second upper turning plate 23 is disposed on the second film bonding end 21a of the second film bonding stage 21 and is pivotally connected to the two side plates 22, and a second upper suction element 231 is disposed on the second upper turning plate 23; The lower turning plate 24 is disposed on the second film bonding end 21a of the second film bonding stage 21 and is pivotally connected to the two side plates 22 , and a second lower suction element is arranged on the second lower turning plate 24 241; In addition, the second upper turning plate 23 and the second lower turning plate 24 are arranged correspondingly, and the second upper suction element 231 and the second lower suction element 241 respectively arranged on them are also correspondingly arranged, so the same is true for the second upper turning plate 241. The upper turning plate 23 and the second lower turning plate 24 can also be rotated to open a predetermined angle. In FIG. 3(A), the second upper turning plate 23 and the second lower turning plate 24 are opened by 180 degrees; but in other embodiments of the present invention, the second upper turning plate 23 and the second lower turning plate 24 The opening angle is not limited to this, as long as it does not affect the bonding of the subsequent shrink film. The second roller 25 is disposed at the second film feeding end 21b of the second film bonding stage 21 , wherein the second shrink film 8 can pass between the second film bonding stage 21 and the second roller 25 , and the second film bonding stage 21 The second side 212 is the opposite side of the first side, so as to maintain a stable supply of the second shrink film 8 by the second roller 25 (as shown in FIG. 4(B) ).

As shown in FIG. 3(B) (the first upper turning plate 13 and the first lower turning plate 14 or the second upper turning plate 23 and the second lower turning plate 24 are closed, and the included angle between them is 0 degrees), by By rotating the first upper rotating plate 13 and the first lower rotating plate 14 or the second upper rotating plate 23 and the second lower rotating plate 24, the first upper rotating plate 13 and the first lower rotating plate 14 or the second rotating plate 24 can be rotated. The upper turning plate 23 and the second lower turning plate 24 are in a closed state, which facilitates the bonding of the first shrink film 7 or the second shrink film 8. The automatic film bonding method will be described in detail below.

4(A) to 4(C) are schematic perspective views of a film bonding device according to an embodiment of the present invention.

As shown in FIG. 4(A) , the first upper adsorption element 131 and the first lower adsorption element 141 can adsorb the adhesive tapes 132 and 142 respectively, and the opposite sides of the adhesive surfaces of the adhesive tapes 132 and 142 are adsorbed on the first upper turning plate 13 and the On the surface of the first lower turning plate 14 , that is, the adhesive tapes 132 and 142 are respectively adsorbed on the first upper adsorption element 131 and the first lower adsorption element 141 . Similarly, the second upper adsorption element 231 and the second lower adsorption element 241 can adsorb the tapes 232 and 242 respectively, and the opposite sides of the adhesive surfaces of the tapes 232 and 242 are adsorbed on the second upper turning plate 23 and the second lower turning plate 24 On the surface of , that is, the adhesive tapes 232 and 242 are respectively adsorbed on the second upper adsorption element 231 and the second lower adsorption element 241 .

As shown in FIG. 4(B), the first shrink film 7 passes between the first upper turning plate 13 and the first lower turning plate 14 and is disposed on the first side 111 of the first film bonding stage 11, and the first shrinking film 7 The membrane 7 passes through and protrudes from the first upper turning plate 13 and the first lower turning plate 14 . Similarly, the second shrink film 8 passes between the second upper turning plate 23 and the second lower turning plate 24 and is disposed on the first side 211 of the second film bonding stage 21 , and the second shrink film 8 passes through and protrudes on the second upper turning plate 23 and the second lower turning plate 24 .

As shown in FIG. 4(C), since the shrink film is a flattened cylindrical plastic film, the first shrink film 7 after shearing has a first film layer 7a and a second film layer 7b (ie, the first shrink film 7 is a double-layer film material), wherein the first film layer 7a of the first shrink film 7 is adsorbed on the first upper adsorption element 131 (as shown in FIG. 4(A) ), and the second film of the first shrink film 7 The layer 7b is adsorbed on the first lower adsorption element 141 (as shown in FIG. 4(A) ), and the adhesive tapes 132 and 142 are not completely covered by the first film layer 7a or the second film layer 7b of the first shrink film 7 . Similarly, the sheared second shrink film 8 has a first film layer 8a and a second film layer 8b (that is, the second shrink film 8 is a double-layer film material), wherein the first film layer 8a of the second shrink film 8 Adsorbed on the second upper adsorption element 231 (as shown in FIG. 4(A) ), and the second film layer 8b of the second shrink film 8 is adsorbed on the second lower adsorption element 241 (as shown in FIG. 4(A) ) and the adhesive tapes 232 and 242 are not completely covered by the first film layer 8 a and the second film layer 8 b of the second shrink film 8 . Therefore, the first shrink film 7 and the second shrink film 8 can be connected to each other by bonding the uncovered parts of the adhesive tapes 132 , 142 , 232 , 242 to the first shrink film 7 or the second shrink film 8 .

In this embodiment, the first film layer 7a and the second film layer 7b of the first shrink film 7 and the first film layer 8a and the second film layer 8b of the second shrink film 8 are through the adhesive tapes 132, 142, 232, 242 to join with the first shrink film 7 or the second shrink film 8; however, the present invention is not limited thereto. In other embodiments of the present invention, the first film layer 7a and the second film layer 7b of the first shrink film 7 or the first film layer 8a and the second film layer 8b of the second shrink film 8 can be joined by other means. . For example, it can be joined by glue, welding or other film joining methods.

In addition, in this embodiment, as shown in FIG. 4(A) to FIG. 4(C) , the first upper adsorption element 131 , the first lower adsorption element 141 , the second upper adsorption element 231 and the second lower adsorption element 241 The first film layer 7a and the second film layer 7b of the first shrink film 7 and the first film layer 8a and the second film layer 8b of the second shrink film 8 can be respectively adsorbed to each other through suction flow, static electricity or other methods. on it. In addition, the first upper adsorption element 131 , the first lower adsorption element 141 , the second upper adsorption element 231 and the second lower adsorption element 241 can also separate the adhesive tapes 132 , 142 , 232 , 242 by suction flow, static electricity or other methods, respectively. respectively adsorbed on it.

Automatic film bonding method

5 to 10 show the action side views of the automatic film bonding apparatus according to an embodiment of the present invention.

As shown in FIG. 5 (the state of being fed by the first shrink film 7 ), set the first shrink film 7 on the first feeding device 5 (as shown in FIG. 1 ), and supply the first shrink film 7 to the first shrink film 7 . A film bonding device 1 and a transfer device 3 , and the first shrink film 7 is transported on the first film bonding stage 11 and the transfer stage 31 . In this embodiment, the first shrink film 7 is used for feeding; however, the present invention is not limited to this. In other embodiments of the present invention, the second shrink film 8 can be used for feeding first.

In addition, the guide wheel 32 is driven to rotate by the motor 10 (as shown in FIG. 1 ), so that the first shrink film 7 is rapidly rolled for feeding. Therefore, the third upper turning plate 33 and the third lower turning plate 34 on the transfer device 3 are in the open state, and the first upper turning plate 13 and the first lower turning plate 14 of the first film splicing device 1 are also in the opening state. , so as to allow the slight vibration of the first shrink film 7 when it is rapidly rolled, keep the feeding of the first shrink film 7 smooth, or prevent the first shrink film 7 from being damaged. In this embodiment, the third upper turning plate 33 and the third lower turning plate 34 or the first upper turning plate 13 and the first lower turning plate 14 are opened by 180 degrees; but in other embodiments of the present invention, the The opening angles of the three upper turning plates 33 and the third lower turning plates 34 or the first upper turning plates 13 and the first lower turning plates 14 are not limited to this, as long as they do not affect the movement of the shrink film.

At the same time, as shown in FIG. 4(C) and FIG. 5 , the second film bonding device 2 is in a preparatory film bonding state, which is on standby at any time to prepare for film bonding. Therefore, a second shrink film 8 is set in the second supply. The second shrink film 8 is supplied to the second film bonding stage 21 of the second film bonding device 2, and one end of the second shrink film 8 is set corresponding to the second film bonding end 21a. (As shown in FIG. 4(B) ), and the second shrink film 8 passes through and protrudes between the second upper turning plate 23 and the second lower turning plate 24 (as shown in FIG. 4(B) ). In addition, since the shrink film is a flattened cylindrical plastic film, the first film layer 8a and the second film layer 8b can be formed by cutting both sides of the second shrink film 8, wherein the second shrink film 8 The first film layer 8a is adsorbed on the second upper adsorption element 231 (as shown in FIG. 4(A) ), and the second film layer 8b of the second shrink film 8 is adsorbed on the second lower adsorption element 241 (as shown in FIG. 4 ). (A)), the surfaces of the second upper turning plate 23 and the second lower turning plate 24 face the third film-contacting end 31a of the transfer stage 31 respectively (as shown in FIG. 1 ). Secondly, since the first film layer 8a and the second film layer 8b of the second shrink film 8 are only partially adhered to the tapes 232 and 242, the tapes 232 and 242 are not covered by the first film 8a and the second film layer of the second shrink film 8. The part covered by the two-layer film 8b can be used for bonding with the first shrink film 7 . In this embodiment, the first shrink film 7 and the second shrink film 8 are bonded through the adhesive tapes 132 , 142 , 232 , 242 ; however, the present invention is not limited to this. In other embodiments of the present invention, the first shrink film 7 and the second shrink film 8 can be joined by other means. For example, it can be joined by glue, welding or other film joining methods.

As shown in FIG. 6 (the state in which the first shrink film 7 is cut by the cutting element 35 ), when the first shrink film 7 remains on the first feeding device 5 for a predetermined length (that is, it means that the first shrink film 7 is about to be used up) , at this time, the motor 10 (as shown in FIG. 1 ) is in a stopped state, and is ready for film bonding. Here, the automatic film splicing equipment may further include a detection unit (not shown) for detecting the remaining first shrink film 7 or second shrink film on the first feeding device 5 or the second feeding device 6 8 amount. The type of the detection unit is not particularly limited, for example, it can be an optical detection unit or other detection units. When preparing for film bonding, the surfaces of the third upper turning plate 33 and the third lower turning plate 34 on the transfer device 3 are opposite to each other (that is, in a closed state), and the first film bonding device The first upper turning plate 13 and the first lower turning plate 14 of Between the first upper turning plate 13 and the first lower turning plate 14, the first shrink film 7 can be effectively fixed, and then the first shrink film 7 is cut by the cutting element 35 (as shown in FIG. 2(C) ) to Forms an even and neat cut surface. In this embodiment, the cutting element 35 is a blade; however, the present invention is not limited thereto. In other embodiments of the present invention, the cutting element 35 may be scissors, a saw blade, or any element suitable for cutting shrink film.

As shown in FIG. 7 (move the transfer device 3 so that the transfer table 31 is set corresponding to the second film bonding table 21 of the second film bonding device 2 ), after the first shrink film 7 has been cut by the cutting element 35, The third upper turning plate 33 is turned over first, while the third lower turning plate 34 remains in place, so that the third lower turning plate 34 can support the first shrink film 7 to prevent the first shrink film 7 from hanging down. Next, the transfer device 3 is moved, and the transfer stage 31 is installed corresponding to the second film bonding stage 21 of the second film bonding device 2 . In this embodiment, the third upper turning plate 33 and the third lower turning plate 34 are opened by 90 degrees; however, the present invention is not limited to this. In other embodiments of the present invention, as long as the positions of the third upper turning plate 33 and the third lower turning plate 34 do not affect the bonding of the shrink film, or can support the shrink film.

As shown in FIG. 4(C) and FIG. 8 (the first film layer 8a of the second shrink film 8 is bonded to the first shrink film 7), the second upper turning plate 23 is turned over to be fixed on the second upper turning plate 23 The adhesive tape 232 is attached to the first shrink film 7 , so the first film layer 8 a of the second shrink film 8 attached to the adhesive tape 232 is joined to the first shrink film 7 at the same time. In addition, the arrangement of the third lower turning plate 34 can more effectively support the first shrink film 7 , improve the bonding quality, and prevent the occurrence of incomplete bonding.

As shown in FIG. 4(C) and FIG. 9 (the second film layer 8b of the second shrink film 8 is bonded to the first shrink film 7), the third lower turning plate 34 is turned over, so that the third upper turning plate 33 and the third The lower turning plate 34 is in an open state, so that the second film layer 8 b of the second shrink film 8 and the first shrink film 7 are joined together. In this embodiment, the third upper turning plate 33 and the third lower turning plate 34 are opened by 180 degrees; however, the present invention is not limited to this. Other implementations of the invention For example, as long as the positions of the third upper turning plate 33 and the third lower turning plate 34 do not affect the bonding of the shrink film. Next, the second upper turning plate 23 remains in place, thereby providing the supporting force required by the second film layer 8b of the second shrink film 8 during bonding, which is helpful for improving the bonding quality. Subsequently, the second lower turning plate 24 is turned over, so that the second upper turning plate 23 and the second lower turning plate 24 face the surfaces, and the adhesive tape 242 fixed on the second lower turning plate 24 is joined to the first shrink film 7, so at the same time The second film layer 8 a of the second shrink film 8 attached to the adhesive tape 242 is joined to the first shrink film 7 . Since the first film layer 8 a and the second film layer 8 b of the second shrink film 8 have been bonded to the first shrink film 7 , respectively, the second shrink film 8 is successfully bonded to the first shrink film 7 .

As shown in FIG. 10 (the state where the material is supplied by the second shrink film 8 ), turn the second upper turning plate 23 and the second lower turning plate 24 so that the second upper turning plate 23 and the second lower turning plate 24 are open state, and the rotation speed of the guide wheel 32 is restored by the motor 10 (as shown in FIG. 1 ), and the second shrink film 8 is used for feeding. In this embodiment, the included angle between the second upper turning plate 23 and the second lower turning plate 24 is 180 degrees, but the invention is not limited to this, as long as the positions of the second upper turning plate 23 and the second lower turning plate 24 do not affect The shrink film can be moved. Furthermore, when the second shrink film 8 is about to be used up, the second shrink film 8 can be joined to the first shrink film 7 in the same way by simply replacing it according to the aforementioned steps, so as to achieve the effect of automatic film bonding. , and has the advantages of reducing production cost, increasing productivity, increasing yield, making shrink film really bonded or keeping shrink film clean.

Although the present invention has been illustrated by way of examples, it should be understood that many other possible modifications and changes can be made without departing from the spirit of the invention and the claimed scope of the invention.

1: The first film bonding device

2: The second film bonding device

3: Transfer device

4: Moving Components

5: The first feeding device

6: The second feeding device

7: The first shrink film

8: Second shrink film

9: Bracket

10: Motor

11a: The first film connection end

12: Side panels

13: The first turn board

14: The first turn board

21: The second film joining station

21a: The second film connection end

21b: The second membrane entry end

22: Side panels

23: Second upper turn board

24: The second turn board

25: Second roller

31: Transfer stage

31a: The third film terminal

31b: The third exit end

32: Guide wheel

33: The third upper turn board

34: The third turn board

35: Cutting Elements

36: Front side panel

37: Rear side panel

91: Orbit

100: Automatic film bonding equipment

311: First side

312: Second side

D: conveying direction

F: long axis direction

Claims (13)

An automatic film bonding device, comprising: a first film bonding device, comprising: a first film bonding stage with a first film bonding end; and a first upper turning plate arranged on the first film bonding stage of the first film bonding stage a film connecting end; and a first lower turning plate, which is arranged on the first film connecting end of the first film connecting stage, wherein the first lower turning plate and the first upper turning plate are correspondingly arranged; a second connecting plate The film device includes: a second film bonding stage with a second film bonding end; a second upper turning plate arranged on the second film bonding end of the second film bonding stage; and a second lower turning board , set on the second film-contacting end of the second film-contacting stage, wherein the second upper turning plate and the second lower turning plate are correspondingly arranged; a transfer device is connected to the first film-connecting stage or the second The film receiving stage is correspondingly arranged, and includes: a transfer stage, which has a third film connecting end; a third upper turning plate, which is arranged on the third film connecting end of the transferring stage; and a third lower turning plate, The third film-contacting end is arranged on the transfer platform, wherein the third upper turning plate is correspondingly arranged with the third lower turning plate; and a cutting element is arranged adjacent to the third film-connecting end of the transferring platform, and is arranged between the first film-connecting end and the third film-connecting end or between the second film-connecting end and the third film-connecting end; a first feeding device for supplying a first shrink film to the first a film bonding device; a second feeding device for supplying a second shrink film to the second film bonding device; A moving element is pivotally connected with the transfer device and moves the transfer device toward or away from the first film bonding device or the second film bonding device. The automatic film bonding equipment as claimed in claim 1, wherein the first film bonding device further comprises: a first upper adsorption element disposed on the first upper turn plate; and a first lower adsorption element disposed on the first upper transfer plate First turn down the board. The automatic film splicing device as claimed in claim 2, wherein the first upper adsorption element and the first lower adsorption element respectively adsorb an adhesive tape, and the opposite side of an adhesive surface of the adhesive tape is adsorbed on the first upper turning plate and the on the surface of the first lower turn plate. The automatic film bonding equipment as claimed in claim 1, wherein the second film bonding device further comprises: a second upper suction element disposed on the second upper turn plate; and a second lower suction element disposed on the second upper rotating plate The second turn down the board. The automatic film splicing device as claimed in claim 4, wherein the second upper adsorption element and the second lower adsorption element respectively adsorb an adhesive tape, and the opposite side of an adhesive surface of the adhesive tape is adsorbed on the second upper turning plate and the on the surface of the second lower turn plate. The automatic film bonding equipment according to claim 1, wherein the first film bonding device further comprises a first roller disposed on a first film feeding end of the first film bonding stage, and the first film feeding end is connected to the first film feeding end. The first film-connecting ends are opposite to each other. The automatic film bonding equipment according to claim 6, wherein the first shrink film passes between the first film bonding station and the first roller. The automatic film bonding equipment according to claim 1, wherein the second film bonding device further comprises a second roller disposed on a second film feeding end of the second film bonding stage, and the second film feeding end is connected to the second film feeding end. The second film-connecting ends are opposite to each other. The automatic film bonding equipment according to claim 8, wherein the second shrink film passes between the second film bonding station and the second roller. The automatic film splicing equipment according to claim 1, wherein the cutting element is arranged on the third upper turning plate. The automatic film bonding equipment according to claim 1, wherein the first film bonding device and the second film bonding device are arranged adjacent to each other. An automatic film bonding method, comprising the following steps: providing the automatic film bonding equipment as claimed in claim 1; setting the first shrink film on the first feeding device, and supplying the first shrink film to the first bonding A film device and the transfer device, and the first shrink film is transported on the first film bonding stage and the transfer stage; the second shrink film is arranged on the second feeding device, and the second shrink film is supplied film to the second film bonding station of the second film bonding device, one end of the second shrink film is set corresponding to the second film bonding end, the second shrink film is cut to form a first film layer and a The second film layer, the first film layer is arranged on the second upper turning plate, and the second film layer is arranged on the second lower turning plate, and the second upper turning plate and the second lower turning plate are The surfaces of the third upper turning plate and the third lower turning plate face respectively when the first shrink film remains on the first feeding device for a predetermined length. cutting the first shrink film relative to and using the cutting element; moving the transfer device, so that the transfer stage and the second film bonding stage are correspondingly arranged; The second upper turning plate and the second lower turning plate are turned over so that the surfaces of the second upper turning plate and the second lower turning plate are opposite, so that the first film layer and the first film layer on the second upper turning plate and the second turning plate are opposite The second film layer on the two lower turning plates is joined with the first shrink film. The automatic film splicing method as claimed in claim 12, wherein the first film layer on the second upper transfer plate and the second film layer on the second lower transfer plate pass through a tape and the first shrink film respectively engage.

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