TWI747318B - Method for manufacturing heat conduction device, heat conduction device manufactured by method for manufacturing heat conduction device, method for manufacturing motor, motor manufactured by method for manufacturing motor - Google Patents
Method for manufacturing heat conduction device, heat conduction device manufactured by method for manufacturing heat conduction device, method for manufacturing motor, motor manufactured by method for manufacturing motor Download PDFInfo
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本發明涉及一種導熱裝置的製造方法及其導熱裝置、馬達的製造方法及其馬達,特別是一種適合作為馬達散熱的導熱裝置的製造方法及其導熱裝置,以及特別是一種具有導熱裝置的馬達的製造方法及其所製造的馬達。 The present invention relates to a method for manufacturing a heat conduction device, a heat conduction device, a method for manufacturing a motor, and a motor thereof, in particular to a method for manufacturing a heat conduction device suitable for motor heat dissipation, and a heat conduction device, and particularly to a motor with a heat conduction device Manufacturing method and motor manufactured by it.
現有常見的馬達的水冷裝置,其製造流程繁瑣,進而使得製造成本高。 The existing common water cooling device of the motor has a complicated manufacturing process, which in turn makes the manufacturing cost high.
本發明公開一種導熱裝置的製造方法及其製造出的導熱裝置、馬達的製造方法及其製造出的馬達,主要用以改善現有常見的馬達的水冷裝置,其製造流程繁瑣的問題。 The invention discloses a method for manufacturing a heat conduction device, a heat conduction device manufactured therefrom, a method for manufacturing a motor, and a motor manufactured therefrom, which are mainly used to improve the existing common water cooling device of the motor, and the manufacturing process is complicated.
本發明的其中一實施例公開一種導熱裝置的製造方法,其包含:一板件製作步驟:製造一板件,板件中具有多個流道,各個流道彼此不相互連通,且多個流道是分別沿彼此相互平行的一軸線貫穿板件設置,而各個流道於板件的兩端形成一第一開口及一第二開口;一定位步驟:除了鄰近於板件的其中一個長側邊的至少一個流道的第一開口及鄰近於板件的另一 個長側邊的至少一個流道的第二開口外,使其餘的各個流道的第一開口與相鄰的流道的第二開口相互抵靠,而使多個流道相互連通成為至少一螺旋流道;一連接步驟:使相互抵靠的板件的兩端相互固定,而使一散熱流體能由螺旋流道的一端進入並由螺旋流道的另一端流出。 One of the embodiments of the present invention discloses a method for manufacturing a heat conducting device, which includes: a plate manufacturing step: manufacturing a plate, the plate has a plurality of flow channels, each flow channel is not connected to each other, and the multiple flow The channels are respectively arranged through the plate along an axis parallel to each other, and each flow channel forms a first opening and a second opening at both ends of the plate; a positioning step: except for one of the long sides adjacent to the plate The first opening of at least one flow channel of the side and the other adjacent to the plate In addition to the second openings of at least one flow channel on each long side, the first openings of the remaining flow channels and the second openings of the adjacent flow channels are abutted against each other, so that the plurality of flow channels communicate with each other to form at least one Spiral flow channel; a connecting step: fix the two ends of the plates that abut each other, so that a heat dissipation fluid can enter from one end of the spiral flow channel and flow out from the other end of the spiral flow channel.
本發明的其中一實施例公開一種馬達的製造方法:一導熱裝置成型步驟及一安裝步驟;導熱裝置成型步驟包含:一板件製作步驟:製造一板件,板件中具有多個流道,各個流道彼此不相互連通,且多個流道是分別沿彼此相互平行的一軸線貫穿板件設置,而各個流道於板件的兩端形成一第一開口及一第二開口;一定位步驟:除了鄰近於板件的其中一個長側邊的至少一個流道的第一開口及鄰近於板件的另一個長側邊的至少一個流道的第二開口外,使其餘的各個流道的第一開口與相鄰的流道的第二開口相互抵靠,而使多個流道相互連通成為至少一螺旋流道;一連接步驟:使相互抵靠的板件的兩端相互固定,而使一散熱流道能由螺旋流道的一端進入並由螺旋流道的另一端流出。所述安裝步驟:將所述導熱裝置成型步驟所製造出的所述導熱裝置,套設於一馬達的外殼,並使所述導熱裝置及所述外殼相互固定。 One of the embodiments of the present invention discloses a method for manufacturing a motor: a heat-conducting device forming step and an assembling step; the heat-conducting device forming step includes: a plate manufacturing step: manufacturing a plate with a plurality of flow channels, The flow channels are not connected to each other, and a plurality of flow channels are respectively arranged through the plate along an axis parallel to each other, and each flow channel forms a first opening and a second opening at both ends of the plate; a positioning Step: Except for the first opening of at least one flow channel adjacent to one of the long sides of the plate and the second opening of at least one flow channel adjacent to the other long side of the plate, make the remaining flow channels The first opening and the second opening of the adjacent flow channel abut against each other, so that the multiple flow channels communicate with each other to form at least one spiral flow channel; a connecting step: fix the two ends of the abutting plate to each other, A heat dissipation channel can enter from one end of the spiral channel and flow out from the other end of the spiral channel. The installation step: the heat conduction device manufactured by the heat conduction device forming step is sleeved on the outer shell of a motor, and the heat conduction device and the outer shell are fixed to each other.
綜上所述,本發明的導熱裝置的製造方法及馬達的製造方法,具有製造成本低、製造流程簡單等優點,且製造出的導熱裝置可以廣泛地安裝於各式馬達的外殼。 In summary, the manufacturing method of the heat conducting device and the manufacturing method of the motor of the present invention have the advantages of low manufacturing cost, simple manufacturing process, etc., and the manufactured heat conducting device can be widely installed in the housing of various motors.
為能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。 In order to further understand the features and technical content of the present invention, please refer to the following detailed descriptions and drawings about the present invention, but these descriptions and drawings are only used to illustrate the present invention, and do not make any claims about the protection scope of the present invention. limit.
100:導熱裝置 100: heat conduction device
1:板件 1: Plate
1A:長側邊 1A: Long side
101:流道 101: Runner
102:第一開口 102: The first opening
103:第二開口 103: second opening
102A:流入口 102A: Inlet
103A:流出口 103A: Outlet
104:第一穿孔 104: first piercing
105:第二穿孔 105: second piercing
106:螺旋流道 106: Spiral flow channel
107:容置通道 107: containment channel
11:側牆 11: side wall
12:凸出結構 12: Protruding structure
13:端面 13: end face
2:密封件 2: seal
3:管路接頭 3: Pipeline connector
200:馬達 200: Motor
201:外殼 201: Shell
C:軸線 C: axis
T:厚度 T: thickness
P:螺旋路徑 P: spiral path
L:冷卻流體 L: Cooling fluid
圖1為本發明的導熱裝置的製造方法的第一實施例的流程示意圖。 FIG. 1 is a schematic flow chart of the first embodiment of the manufacturing method of the heat conducting device of the present invention.
圖2為本發明的導熱裝置的製造方法的第一實施例的板件製 作步驟中所製造出的板件的示意圖。 Figure 2 is the plate manufacturing method of the first embodiment of the heat conducting device manufacturing method of the present invention Schematic diagram of the panel manufactured in the manufacturing step.
圖3為圖2的俯視圖。 Fig. 3 is a top view of Fig. 2.
圖4為本發明的導熱裝置的製造方法的第一實施例的定位步驟的過程中的板件的示意圖。 FIG. 4 is a schematic diagram of the plate during the positioning step of the first embodiment of the manufacturing method of the heat conducting device of the present invention.
圖5為本發明的導熱裝置的製造方法的第一實施例的定位步驟後所製造出的板件的示意圖。 Fig. 5 is a schematic diagram of the plate manufactured after the positioning step of the first embodiment of the manufacturing method of the heat conducting device of the present invention.
圖6為本發明的導熱裝置的製造方法的第一實施例所製造出的導熱裝置的示意圖。 FIG. 6 is a schematic diagram of a heat conduction device manufactured by the first embodiment of the method for manufacturing a heat conduction device of the present invention.
圖7為本發明的導熱裝置的製造方法的第二實施例的流程示意圖。 FIG. 7 is a schematic flow chart of the second embodiment of the manufacturing method of the heat conducting device of the present invention.
圖8為本發明的導熱裝置的製造方法的第二實施例所製造出的導熱裝置的示意圖。 FIG. 8 is a schematic diagram of a heat conduction device manufactured by the second embodiment of the method for manufacturing a heat conduction device of the present invention.
圖9為本發明的導熱裝置的製造方法的第三實施例的流程示意圖。 FIG. 9 is a schematic flowchart of the third embodiment of the manufacturing method of the heat conducting device of the present invention.
圖10為本發明的導熱裝置的製造方法的第三實施例的板件製作步驟中所製造出的板件的示意圖。 Fig. 10 is a schematic diagram of the plate manufactured in the plate manufacturing step of the third embodiment of the manufacturing method of the heat conducting device of the present invention.
圖11為圖10的俯視圖。 Fig. 11 is a top view of Fig. 10.
圖12為本發明的導熱裝置的製造方法的第三實施例的定位步驟的過程中的板件的示意圖。 FIG. 12 is a schematic diagram of the plate during the positioning step of the third embodiment of the manufacturing method of the heat conducting device of the present invention.
圖13為本發明的導熱裝置的製造方法的第三實施例的定位步驟後所製造出的板件的示意圖。 FIG. 13 is a schematic diagram of the plate manufactured after the positioning step of the third embodiment of the manufacturing method of the heat conducting device of the present invention.
圖14為本發明的馬達的製造方法的製造過程中的其中一示意圖。 FIG. 14 is a schematic diagram of the manufacturing process of the manufacturing method of the motor of the present invention.
圖15為本發明的馬達的製造方法所製造出的馬達的示意圖。 Fig. 15 is a schematic diagram of a motor manufactured by the method of manufacturing a motor of the present invention.
於以下說明中,如有指出請參閱特定圖式或是如特定圖式所示,其僅是用以強調於後續說明中,所述及的相關內容大部份出現於該特定圖式中,但不限制該後續說明中僅可參考所述特定圖式。 In the following description, if it is pointed out, please refer to the specific drawing or as shown in the specific drawing, it is only used to emphasize in the subsequent description, and most of the related content appears in the specific drawing. However, it is not limited that only the specific drawings can be referred to in this subsequent description.
請一併參閱圖1至圖6,圖1為本發明的導熱裝置的製造方法的第一實施例的流程示意圖,圖2為本發明的導熱裝置的製造方法的第一實施例的板件製作步驟中所製造出的板件的示意圖,圖3為圖2的俯視圖,圖4為本發明的導熱裝置的製造方法的第一實施例的定位步驟的過程中的板件的示意圖,圖5為本發明的導熱裝置的製造方法的第一實施例的定位步驟後所製造出的板件的示意圖,圖6為本發明的導熱裝置的製造方法的第一實施例所製造出的導熱裝置的示意圖。 Please refer to FIGS. 1 to 6 together. FIG. 1 is a schematic flowchart of the first embodiment of the method for manufacturing a heat conduction device of the present invention, and FIG. 2 is the production of a plate in the first embodiment of the method for manufacturing a heat conduction device of the present invention. 3 is a top view of FIG. 2, and FIG. 4 is a schematic diagram of the plate during the positioning step of the first embodiment of the method for manufacturing a heat conducting device of the present invention, and FIG. 5 is The schematic diagram of the board manufactured after the positioning step of the first embodiment of the method of manufacturing a heat conducting device of the present invention. FIG. 6 is a schematic diagram of the thermal device manufactured by the first embodiment of the method of manufacturing a heat conducting device of the present invention .
所述導熱裝置的製造方法包含:一板件製作步驟S11:製造一板件1,板件1中具有多個流道101,各個流道101彼此不相互連通,且多個流道101是分別沿彼此相互平行的一軸線C貫穿板件設置,而各個流道101於板件1的兩端形成一第一開口102及一第二開口103;一定位步驟S12:除了鄰近於板件1彼此相反的兩個長側邊的第一開口102及第二開口103外,使各個流道101的第一開口102與相鄰的流道101的第二開口103相互抵靠,而使多個流道101相互連通;一連接步驟S13:使相互抵靠的板件1的兩端相互固定,而使多個流道101相互連接成為一螺旋流道106;其中,鄰近於板件1彼此相反的兩個所述長側邊1A的第一開口102及第二開口103,分別定義為一流入口102A及一流出口103A,所述流入口102A用以提供一導熱流體流入螺旋流道106,所述流出口103A用以提供導熱流體由螺旋流道106流出。
The manufacturing method of the heat conducting device includes: a plate manufacturing step S11: manufacturing a
如圖1及圖2所示,於本實施例所指的板件製作步驟S1中,各個流道101是沿平行於板件1的其中一長側邊1A的所述軸線C貫穿板件,且多個流道101是彼此並排地形成於板件1中。關於板件1中形成多個流道101的方式,於此不加以限制。
As shown in Figures 1 and 2, in the plate manufacturing step S1 referred to in this embodiment, each
於本實施例中,是以各個流道101大致呈矩形條狀,且第一開口102及第二開口103皆為矩形狀為例,但各個流道101的外型不以此為限,在特殊的應用中,流道101也可以是圓柱條狀,而各個第一開口102及第二開口103則可以是對應為圓形狀。
In this embodiment, each
值得一提的是,於所述板件製作步驟S1中,所形成的多個流道101的尺寸是完全相同,亦即,各個流道101的長度、寬度、高度都是完全相同,且各個第一開口102及各個第二開口103的外型也是完全相同。
It is worth mentioning that in the plate manufacturing step S1, the dimensions of the plurality of
如圖2至圖4所示,在所述定位步驟S2中,可以是利用傾角滾壓法來彎曲所述板件製作步驟S11所製造出的板件1,且傾角滾壓法中的傾角可以是依據各個流道101的寬度及彼此相鄰的兩個流道101的間隔距離等決定,較佳地,傾角是可以是10度。也就是說,在所述定位步驟S12中,可以是利用相關機械設備將板件1的兩端向彼此相互靠近的方向彎曲,且使板件1的其中一端相對於另一端稍微扭轉,據以使板件1的其中一端與另一端彼此相互錯位地抵靠。
As shown in Figures 2 to 4, in the positioning step S2, the
在實際應用中,於板件製作步驟S11中,可以是使各個流道101彼此間的側牆11的厚度T不大於15公釐,如此,於所述定位步驟S2中,將可以相對容易地使多個所述第一開口102與多個所述第二開口103相互抵靠。
In practical applications, in the plate making step S11, the thickness T of the
如圖5及圖6所示,在實際應用中,於連接步驟S14中,可以是利用焊接等方式,使板件1的兩端相互連接、固定,但不以此為限,在實際應用中,可以是依據板件1實際材質的不同,而選擇相對應的方式,將板件1的兩端相互連接。值得一提的是,如圖2至圖5所示,於所述定位步驟S12在
具體的實施中,可以是利用相關工具、設備等,來將圖2所示的板件1彎曲成圖4所示的狀態,且還可以是搭配相關的夾具等固定機構,來使板件1的兩端穩定地相互抵靠,以方便相關人員或是機械設備,對板件1彼此相互抵靠的兩端進行焊接作業(即連接步驟S14)。
As shown in Figures 5 and 6, in practical applications, in the connecting step S14, welding and other methods may be used to connect and fix the two ends of the
如圖4至圖6所示,通過本發明的導熱裝置的製造方法所製造出的導熱裝置100,其中間將具有一容置通道107,所述容置通道107能用以套設於需要散熱或是加熱的裝置外,舉例來說,導熱裝置100可以用來套設於馬達外,於馬達運轉時,則可以是於使冷卻流體L由導熱裝置100的流入口102A流入螺旋流道106中,如此,冷卻流體將沿著螺旋流道106,螺旋地由導熱裝置100的一端向導熱裝置100的另一端流動,最後從所述流出口103A離開所述導熱裝置100,並據以帶走馬達運轉時所產生的熱能。如圖6所示,也就是說,冷卻流體L由流入口102A進入導熱裝置100後,將沿著圖中所示的一螺旋路徑P,由導熱裝置100的一端移動至另一端,並由導熱裝置100的流出口103A向外流出。
As shown in FIGS. 4 to 6, the
需說明的是,在具體的實施中,還可以是於流入口102A及流出口103A分別固定設置一管路接頭,而使用以運送導熱流體的管路可以通過管路接頭而方便地與螺旋流道106相連通。
It should be noted that, in specific implementation, a pipe joint may be fixedly arranged at the
請一併參閱圖7及圖8,圖7為本發明的導熱裝置的製造方法的第二實施例的流程示意圖,圖8為本發明的導熱裝置的製造方法的第二實施例所製造出的導熱裝置的示意圖。 Please refer to FIGS. 7 and 8 together. FIG. 7 is a schematic flow diagram of the second embodiment of the method of manufacturing a heat conduction device of the present invention, and FIG. 8 is a flow chart of the second embodiment of the method of manufacturing a heat conduction device of the present invention. Schematic diagram of the heat-conducting device.
如圖7所示,本實施例與前述實施例最大不同之處在於:於所述連接步驟S13後還可以包含:一密封步驟S14:密封鄰近於板件1彼此相反的兩個長側邊1A的第一開口(即前述流入口102A)及第二開口(即前述流出口103A),而使螺旋流道呈密封狀;
一穿孔步驟S15:於形成螺旋流道的側壁形成一第一穿孔104及一第二穿孔105,第一穿孔104用以提供一導熱流體流入螺旋流道,且第二穿孔105則是用以提供鄰近於螺旋流道中的導熱流體向外流出。
As shown in FIG. 7, the biggest difference between this embodiment and the previous embodiment is that after the connecting step S13, it may further include: a sealing step S14: sealing two opposite
如圖8所示,在實際應用中,於所述密封步驟S4中,可以是將一密封件2固定於鄰近於板件1彼此相反的兩個長側邊1A的第一開口(即前述流入口102A)及第二開口(即前述流出口103A)。所述密封件2可以是與板件1為相同材質,且密封件2例如可以是利用焊接的方式與板件1相互固定。在不同的實施例中,也可以不利用密封件2來密封第一開口及第二開口,舉例來說,可以是使鄰近於板件1彼此相反的兩個長側邊1A的第一開口的周圍及第二開口的周圍分別呈熔融狀,而後通過相關工具,以密封所述第一開口及所述第二開口。
As shown in FIG. 8, in practical applications, in the sealing step S4, a sealing
如圖8所示,於所述穿孔步驟S15中,可以是使所述第一穿孔104鄰近於第一開口(即前述流入口102A),且使所述第二穿孔105鄰近於第二開口(即前述流出口103A),但第一穿孔104及第二穿孔105的設置位置及其設置數量不以圖中所示為限,其皆可依據需求變化。
As shown in FIG. 8, in the perforation step S15, the
值得一提的是,在實際應用中,還可以是於所述第一穿孔104及所述第二穿孔105分別安裝一管路接頭3,所述管路接頭3用以與外部管路相連接,而用以運送導熱流體的管路則可通過管路接頭3與導熱裝置100內的螺旋流道相互連通。
It is worth mentioning that, in practical applications, it is also possible to install a pipe joint 3 in the
請一併參閱圖9至圖13,圖9為本發明的導熱裝置的製造方法的第三實施例的流程示意圖,圖10為本發明的導熱裝置的製造方法的第三實施例的板件製作步驟中所製造出的板件的示意圖,圖11為圖10的俯視圖,圖12為本發明的導熱裝置的製造方法的第三實施例的定位步驟的過程中的板件的示意圖,圖13為本發明的導熱裝置的製造方法的第三實施例的定位步驟後所製造出的板件的示意圖。 Please refer to FIGS. 9 to 13 together. FIG. 9 is a schematic flow diagram of a third embodiment of the method of manufacturing a heat conduction device of the present invention, and FIG. 10 is a panel fabrication of the third embodiment of the method of manufacturing a heat conduction device of the present invention. Fig. 11 is a top view of Fig. 10, and Fig. 12 is a schematic diagram of the plate during the positioning step of the third embodiment of the method of manufacturing a heat conducting device of the present invention. Fig. 13 is The schematic diagram of the plate manufactured after the positioning step of the third embodiment of the manufacturing method of the heat conducting device of the present invention.
如圖9所示,本實施例的導熱裝置的製造方法包含:一板件製作步驟S21:製造一板件1,板件1中具有多個流道101,各個流道101彼此不相互連通,且多個流道101是分別沿彼此相互平行的一軸線C貫穿板件設置,而各個流道101於板件1的兩端形成一第一開口102及一第二開口103;一定位步驟S22:除了鄰近於板件1彼此相反的兩個長側邊的第一開口102及第二開口103外,使各個流道101的第一開口102與相鄰的流道101的第二開口103相互抵靠,而使多個流道101相互連通,且使鄰近於板件1的兩個長側邊1A的第一開口102與第二開口103,分別與板件1未形成有第二開口103的端面13及未形成有第一開口102的端面13相互抵靠;一連接步驟S23:使相互抵靠的板件1的兩端相互固定,而使多個流道101相互連接成為一螺旋流道106,且所述螺旋流道106是呈封閉狀;一穿孔步驟S24:於形成螺旋流道106的側壁形成一第一穿孔104及一第二穿孔105,第一穿孔104用以提供一導熱流體流入螺旋流道,且第二穿孔105能提供鄰近於螺旋流道中的導熱流體向外流出。
As shown in FIG. 9, the manufacturing method of the heat conducting device of this embodiment includes: a plate manufacturing step S21: manufacturing a
如圖9至圖11所示,本實施例與前述實施例最大不同之處在於:本實施例的導熱裝置的製造方法的所述板件製作步驟S21所製造出的板件1,其所包含的各個流道101的中心軸線C是不平行於板件1的其中一長側邊1A,而多個流道101是斜向地排列設置。也就是說,各個所述流道101的中心流道101與板件1的長側邊1A的延伸線兩者之間形成有夾角θ,而其兩
者是不是相互平行。在較佳的實際應用中,所述夾角θ的範圍可以是介於3度至30度。
As shown in Figures 9 to 11, the biggest difference between this embodiment and the previous embodiment is that the
如圖10至圖12所示,本實施例與前述實施例另一不同之處在於:於所述定位步驟S22中,在彎曲所述板件1的過程中,無需使板件1的一端扭轉。請一併參閱圖6及圖13,如圖6所示,通過前述導熱裝置的製造方法的第一實施例所製造出的導熱裝置100,導熱裝置100的兩端將會有凸出結構12;相對地,如圖13所示,通過本實施例的導熱裝置的製造方法所製造出的導熱裝置100,所述板件1彼此相反的兩端,則分別是呈現為平坦狀而不會出現圖5所示的凸出結構12。
As shown in FIGS. 10 to 12, another difference between this embodiment and the foregoing embodiment is that in the positioning step S22, in the process of bending the
請一併參閱圖14至圖15,圖14為本發明的馬達的製造方法的製造過程中的其中一示意圖,圖15為本發明的馬達的製造方法所製造出的馬達的示意圖。本發明的馬達製造方法包含:一導熱裝置成型步驟及一安裝步驟。所述導熱裝置成型步驟與前述導熱裝置的製造方法的各實施例所包含的步驟相同,於此不再贅述。所述安裝步驟為:將導熱裝置成型步驟所製造出的導熱裝置100,套設於一馬達200的外殼201,並使導熱裝置100及外殼201相互固定。
Please refer to FIGS. 14 to 15 together. FIG. 14 is a schematic diagram of the manufacturing method of the motor manufacturing method of the present invention, and FIG. 15 is a schematic diagram of the motor manufactured by the motor manufacturing method of the present invention. The motor manufacturing method of the present invention includes: a heat-conducting device forming step and an assembling step. The forming steps of the heat conducting device are the same as the steps included in the foregoing embodiments of the method for manufacturing the heat conducting device, and will not be repeated here. The installation step is: the
在實際應用中,可以是使所述導熱裝置的成型步驟所製造出的導熱裝置100所包含的容置通道107的口徑略小於所述馬達200的外殼201的外徑,而於所述安裝步驟可以是利用相關設備,而使馬達200壓入於所述容置通道107中,據以使馬達200與導熱裝置100兩者以緊配合的方式相互固定。
In practical applications, the diameter of the
特別說明的是,於所述安裝步驟中,可以是先使馬達200的外殼201與導熱裝置100相互固定後,再將馬達200內的相關電機組件安裝於馬達200的外殼201中;或者,於所述安裝步驟中也可以是將通電後即可運作的馬達200直接安裝於導熱裝置100的容置通道107中。
In particular, in the installation step, the
特別說明的是,於上述各實施例所包含的各個圖式中,皆是以所述板件1彎曲成圓筒狀為例,但本發明的導熱裝置的製造方法並不侷限必須將板件1彎曲成圓筒狀,只要使非流入口102A及流出口103A的其餘第一開口102及第二開口103能相互連通,並據以形成螺旋流道106,板件1可以依據需求被彎曲、彎折為任何形狀。
In particular, in each of the drawings included in the above embodiments, the
需說明的是,利用上述本發明的導熱裝置的任一個實施例所製造出的導熱裝置,應為本發明的申請專利範圍可主張的權利範圍中,且利用上述本發明的馬達的製造方法所製造出的導熱裝置,同樣應為本發明的申請專利範圍可主張的權利範圍中。 It should be noted that the heat conduction device manufactured by any one of the embodiments of the heat conduction device of the present invention should be within the claimable scope of the patent application of the present invention, and the method for manufacturing the motor of the present invention described above should be used. The manufactured heat conduction device should also fall within the claimable scope of the patent application of the present invention.
綜上所述,本發明的導熱裝置的製造方法及馬達的製造方法,具有製造成本低、製造流程簡單等優點,且製造出的導熱裝置可以廣泛地安裝於各式馬達的外殼。 In summary, the manufacturing method of the heat conducting device and the manufacturing method of the motor of the present invention have the advantages of low manufacturing cost, simple manufacturing process, etc., and the manufactured heat conducting device can be widely installed in the housing of various motors.
以上所述僅為本發明的較佳可行實施例,非因此侷限本發明的專利範圍,故舉凡運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的保護範圍內。 The above are only the preferred and feasible embodiments of the present invention, which do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the protection scope of the present invention. .
S11~S13:流程步驟 S11~S13: Process steps
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CN104009562A (en) * | 2013-02-26 | 2014-08-27 | 发那科株式会社 | Cooling jacket, stator including a cooling jacket, and rotary electric machine including a cooling jacket |
WO2017071970A1 (en) * | 2015-10-28 | 2017-05-04 | Volkswagen Aktiengesellschaft | Cooling housing for an electric machine and production method therefor |
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CN104009562A (en) * | 2013-02-26 | 2014-08-27 | 发那科株式会社 | Cooling jacket, stator including a cooling jacket, and rotary electric machine including a cooling jacket |
CN103715831A (en) * | 2014-01-13 | 2014-04-09 | 苏州和鑫电气股份有限公司 | Cooling sleeve and manufacturing method thereof |
WO2017071970A1 (en) * | 2015-10-28 | 2017-05-04 | Volkswagen Aktiengesellschaft | Cooling housing for an electric machine and production method therefor |
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