JP2006125819A - Plate type heat exchanger - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To increase the area of contact between fluid and a heat transfer plate when the fluid passes through a passage in communication, thereby increasing the efficiency of heat exchange, and reducing the heat capacity of the heat transfer plate for better heat responsiveness. <P>SOLUTION: The plate type heat exchanger comprises a copper plate A1 having formed therein a number of holes A5 and plated on its surface; a copper plate B2 plated on its surface and having holes B6 that are different in position or in both position and shape from the holes A5 in the copper plate A1, the holes B6 forming a passage 12 that is in communication when the copper plates A1, B2 are stacked together; a copper plate C3 located outside of the copper plate B2 to form a wall of the passage 12; and a copper plate D4 stacked on the outside of the copper plate A1 and having an inlet 9 and an outlet 10 for the fluid 8 while forming a wall of the passage 12. The copper plates A1, B2, C3 are held by the copper plate D4 and the copper plates A1, B2, C3, D4 are stacked and integrated together. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a plate heat exchanger in which a predetermined number of copper plates serving as heat transfer plates are stacked and a passage communicating by the stacking is formed.

  In recent years, plate-type heat exchangers have been used for heating, cooling, and heat recovery processes in various chemical facilities and heat appliances.

As this plate-type heat exchanger, for example, as shown in FIG. 6, a stainless steel plate is plated on the surface of a heat transfer plate 31 formed with continuous irregularities 32 by pressing, and the surface of the heat transfer plate 31 is plated. Then, a predetermined number of the heat transfer plates 31 are stacked and joined by brazing 34 in a continuous deoxidation electric furnace, and a narrow gap is formed between the heat transfer plate 31 and the heat transfer plate 31. The fluid channel 35 is formed, and two types of fluids such as liquid-liquid and liquid-gas are alternately circulated through the channel 35 to flow out from the opening 33 to exchange heat. (Patent Document 1)
JP 2000-356490 A

In the prior art disclosed in Patent Document 1, in order to improve various properties such as durability, pressure resistance, chemical resistance, and corrosion resistance, a heat transfer plate 31 is formed using a stainless steel plate. Joined by brazing 34 in a continuous deoxidation electric furnace. Further, the heat transfer plate 31 is provided with irregularities 32 by press working, a plurality of heat transfer plates 31 are stacked, and a space generated between each heat transfer plate 31 is used as a channel 35 passage, and two types such as liquid-liquid and liquid-gas The fluid is circulated alternately.
However, the problem in this Patent Document 1 is that the material of the heat transfer plate 31 is a stainless steel plate, the heat capacity is large, and the fluid flows in parallel to the heat transfer plate 31, so that the contact area between the fluid and the heat transfer plate 31 is Therefore, the heat responsiveness is low and heat exchange takes a long time.

  The present invention has been made to solve the above-mentioned problems. Specifically, as shown in claim 1, a copper plate A1 having a large number of holes A5 and plated on the surface, and a copper plate A1. The position of the hole A5 is different from the position of the hole A5, or the position and shape of the hole A5 is different from that of the hole A5. The copper plate B2 has a hole B6 formed with a passage 12 communicating with the copper plate A1 and is plated. The copper plate C3 that forms the wall of the passage 12 and the copper plate A1 are laminated on the outside of the copper plate A1, have an inlet 9 and an outlet 10 for the fluid 8, sandwiched by the copper plate D4 that forms the wall of the passage 12, and the copper plate A1 The copper plate B2, the copper plate C3, and the copper plate D4 are laminated and integrated.

  Since the present invention is configured as described above, the contact area between the fluid and the heat transfer plate when passing through the passage through which the fluid communicates is increased, and the heat exchange efficiency is improved.

  In addition, since a copper plate is used, it can be made into a thin plate, and a large number of holes can be formed by etching, so that the heat capacity is significantly reduced compared to a heat transfer plate provided with irregularities by pressing a stainless steel plate. , Better thermal response.

  Also, the heat transfer plate forming the communicating passage, the wall of the communicating passage, the fluid inlet / outlet, and the heat transfer plate serving as the communicating passage wall braze the surface of the heat transfer plate forming the communicating passage. By performing a plating process suitable for the above and forming a metal film, it is possible to braze and join the heat transfer plates with a normal continuous deoxidation electric furnace, particularly a general-purpose hydrogen furnace.

  Furthermore, since the copper plate having different hole shapes and positions, that is, a plurality of heat transfer plates can be plated simultaneously, the processing time can be reduced.

  Thus, a plate heat exchanger having a high heat exchange efficiency with a large contact area between the fluid and the heat transfer plate can be provided.

Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS.
In the figure, a predetermined number of holes A5 are processed by etching in a copper plate A1 serving as a heat transfer plate. Similarly, by laminating a copper plate B2 serving as a heat transfer plate on the copper plate A1, a hole B6 constituting the passage 12 communicating with the hole A5 is formed by etching.

  Further, the copper plate C3 serving as a heat transfer plate is a flat plate and is thermally coupled to the heat exchange object 20 on a surface that easily contacts the heat exchange object 20 that needs to be heated, cooled, and recovered.

  The copper plate C3 is laminated on the lower surface of the copper plate A1, becomes a wall surface facing the hole A5 of the copper plate A1, and forms a communicating passage 12. Further, the copper plate D4 is laminated above the copper plate B2, and forms an inlet 9 and an outlet 10 for the fluid 8 at a position corresponding to the hole B6, and forms a passage 12 that becomes a wall surface and communicates with the other hole B6. To do.

  Next, the surface of each of the copper plate A1 and the copper plate B2 is subjected to a plating process using a metal material (for example, silver, nickel, etc.) having excellent bonding properties by brazing, and a metal film suitable for brazing is applied to the surface. Form.

  The copper plate A1 and the copper plate B2 are formed in a substantially rectangular shape with a side of 10 mm to 300 mm on one side, and the thickness is 0.1 mm to 1 mm in order to prevent the metal film from protruding during brazing and damage to the holes. desirable. The copper plate C3 and the copper plate D4 preferably have the same or larger dimensions as the copper plate A1 and the copper plate B2.

  The heat exchanger is assembled as shown in FIG. Here, the copper plate A1 is laminated on the copper plate C3, the copper plate B2 is further laminated thereon, and the copper plate D4 is laminated thereon, and is fixed with the jig 13 and is suitably fixed at about 1000 ° C. for about 15 minutes in a continuous hydrogen furnace. The copper plate A1, the copper plate B2, the copper plate C3, and the copper plate D4 are heated by spending temperature and time. At this time, the metal film formed by plating the copper plate A1 and the copper plate B2 melts, and the four copper plates A1, copper plate B2, copper plate C3, and copper plate D4 are joined.

  As described above, the plate heat exchanger is completed in a general-purpose continuous hydrogen furnace.

  When using the heat exchanger, as shown in FIG. 1, first, the plate heat exchanger of the present invention is fixed to the heat exchange object 20 with the mounting screw 21.

  At this time, since the copper plate D4, the copper plate B2, the copper plate A1, and the copper plate C3 are thermally coupled, the copper plate C3 receives the heat of the heat exchange object 20, and sequentially transfers the heat to the copper plate A, the copper plate B, and the copper plate D. Is done.

  Next, the tank 24 and the pipe 22 for storing the fluid 8 are connected to the pump 23 and the like, and the ends are connected to the inlet by the fluid 8 of the copper plate D4. When the pump 23 is driven to inject the fluid 8 into the plate heat exchanger of the present invention, the fluid 8 such as water is poured into the inlet 9 provided in the copper plate D4.

  The fluid 8 passes through the hole B6 provided in the copper plate B, then passes through the hole A5 provided in the copper plate A sandwiched between the copper plate B and the copper plate C, and then the hole sandwiched between the copper plate A and the copper plate D. Proceed to B6.

Thus, it passes along the communication path 12 formed by the wall of the copper plate C3 and the wall of the copper plate D4, and is led out from the outlet 10 of the copper plate D4.

  At this time, the fluid 8 transfers heat one after another from the copper plate A, copper plate B, copper plate C, and copper plate D, and transfers heat.

  In the above embodiment, the copper plate A1 and the copper plate B2 are integrated by being sandwiched between the copper plate C3 and the copper plate D4, but the copper plate A1 and the copper plate B2 may be further inserted between the copper plate C3 and the copper plate D4 to increase the number of channels. .

  The flow of the fluid in the plate heat exchanger will be described in detail. The fluid 8 flowing into the copper plate A1 from the inlet 9 opened in the copper plate D4 as shown in FIG. 3 enters the hole A5 of the copper plate A1, and then continues to the copper plate. It flows to the hole B6 of B2, and then is led to the outlet 10 opened in the copper plate D4 through the passage 12 communicating with the hole A5 of the copper plate A1.

  At this time, the fluid 8 introduces into the fluid 8 the amount of heat of the copper plate C3 that has changed due to the transfer of heat with the heat exchange object 20 performed through the wall surface of the copper plate C3, and also includes the copper plate A1, the copper plate B2, and the copper plate D4. Both of them exchange heat and circulate to dissipate heat from the external heat dissipation part. Of course, heat is radiated not only from the fluid 8 but also from the surface of the heat transfer plate in contact with the outside.

  In addition, in this plate heat exchanger, the heat capacity decreases as the thickness of the copper plate A1 and the copper plate B2 is smaller. Therefore, assuming that the amount of the fluid 8 passing is constant, the heat exchange efficiency increases. It is also possible to increase the heat exchange efficiency by increasing the passage amount of.

When the plate type exchanger of the present invention is assembled, that is, when the copper plate A1, the copper plate B2, the copper plate C3, and the copper plate D4 are joined, the plated layer 7 of the copper plate A1 and the copper plate B2 is melted by heat, and a strong joint is made. If significant deformation occurs in the holes A5 and B6 due to the protrusion of the metal film, it becomes an obstacle in the passage 12 of the fluid 8.
For this reason, from the thickness of the plating layer 7, the thicknesses of the copper plate A1 and the copper plate B2 prevent the occurrence of the above problems, so that the thicknesses of the copper plate A1 and the copper plate B2 are preferably 0.1 mm to 1 mm as described above.

  The welding means performed at the time of assembly will be described in detail. The copper plate A1, the copper plate B2, the copper plate C3, and the copper plate D4 are laminated in order with a predetermined jig 13 and temporarily fixed, and in a continuous deoxygenation electric furnace such as a hydrogen furnace. The plating layer 7 is melted and joined.

  In this assembling process, since the metal coating is formed into a thin film by plating, the metal coating does not protrude and the preferred finish is obtained.

  Since the present invention is configured as described above, the contact area between the fluid 8 and the heat transfer plate when passing through the passage 12 through which the fluid 8 communicates is increased, and the heat exchange efficiency is improved.

  In addition, since a copper plate is used, it can be made into a thin plate and a large number of holes can be formed by etching, so that the heat capacity is significantly higher than that of a heat transfer plate provided with unevenness by pressing a stainless steel plate. Smaller and better thermal response.

  In addition, the heat transfer plate forming the communicating passage 12, the wall of the communicating passage 12, the entrance and exit of the fluid 8, and the heat transfer plate serving as the wall of the communicating passage 12 are each plated with a surface suitable for bonding. By applying and forming a metal film, it is possible to join the heat transfer plates with a normal continuous deoxidation electric furnace, particularly a general-purpose hydrogen furnace.

  Furthermore, since copper plates having different hole shapes and positions, that is, a plurality of heat transfer plates can be simultaneously plated, the processing time can be reduced.

  Thus, a plate heat exchanger with high heat exchange efficiency in which the contact area between the fluid 8 and the heat transfer plate is increased can be provided.

It is sectional drawing of the plate-type heat exchanger which is an Example of this invention. It is explanatory drawing at the time of the assembly of this invention. It is explanatory drawing of the flow of the fluid by one Example cross section of this invention. It is explanatory drawing of the copper plate A in one Example of this invention. It is explanatory drawing of the copper plate B in one Example of this invention. It is explanatory drawing of a prior art example.

Explanation of symbols

1 Copper plate A
2 Copper plate B
3 Copper plate C
4 Copper plate D
5 hole A
6 hole B
7 Plating layer 8 Fluid 9 Fluid inlet 10 Fluid outlet 12 Passage 20 Heat exchange object

Claims (1)

  The position of the copper plate A (1) formed with a large number of holes A (5) and plated on the surface is different from the position of the hole A (5) of the copper plate A (1), or the position and shape are different. It has a hole B (6) in which a passage (12) communicating with the copper plate A (1) by laminating is formed, and a copper plate B (2) plated on the surface and on the outside of the copper plate B (2) A copper plate C (3) located on the wall of the passage (12) and laminated on the outside of the copper plate A (1), having an inlet (9) and an outlet (10) for the fluid (8), and the passage (12 ) Is sandwiched between the copper plate D (4) and the copper plate A (1), the copper plate B (2), the copper plate C (3), and the copper plate D (4), and the plate type characterized by being integrated Heat exchanger.

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