TWI746101B - Electronic device and thermal controlling method for solid state disk thereof - Google Patents

Abstract

An electronic device and a thermal controlling method for solid state disk thereof are provided. The thermal controlling method includes following steps: A plurality of first commands are sent at a first frequency by a CPU of the electronic device. The plurality of first commands are received by a controller of the solid state disk, and a plurality of current temperatures of the solid state disk are returned to the CPU according to the plurality of first commands. Cooling the solid state disk in a first stage, a second stage or a third stage is determined according to the plurality of current temperatures by the CPU, and a second command is sent to set a power state of the solid state disk according to the first stage, the second stage or the third stage.

Description

Electronic device and temperature control method of solid hard disk

The present invention relates to an electronic device and a temperature control method thereof, and more particularly to a temperature control method of an electronic device and a solid state hard disk.

NVMe solid-state hard drives have become the mainstream of the market. Solid-state hard drives have high performance but also have some overheating problems. At present, there is a Thermal Throttling mechanism in the solid state drive, which cools the solid state drive through two temperature parameters of the host controlled thermal management (HCTM). However, the two temperature parameters used by the host to control thermal management are the factory default values (Default), and the factory default values of each manufacturer (such as 82°C and 84°C) are usually lower than the safe temperature of the solid state drive (usually about 70°C). ) Is still high. That is to say, when the temperature of the solid state drive exceeds the safe temperature, the solid state drive will be cooled according to the two temperature parameters of the thermal management controlled by the host. In other words, the manufacturer's default values of each manufacturer are only applicable to certain usage scenarios, such as solid-state drive access in a short period of time. If the solid state drive is kept in operation for a long time, the temperature of the solid state drive will still be above the safe temperature.

In addition, although currently in the NVMe specification, the system can set the two temperature parameters of the host to control thermal management to be lower than the manufacturer's preset values through the Set Feature command. However, the method of cooling the solid-state drive only through the two temperature parameters of the system setting host to control thermal management cannot be applied to certain usage scenarios, such as long-term solid-state drive access or solid-state drive that is higher than room temperature. (For example, 40°C), etc., etc., these usage scenarios will still cause the temperature of the solid state drive to always be above the safe temperature. In this way, it will pose a serious threat to the life of the solid state drive and its stored data.

Therefore, how to improve the above shortcomings and provide a more efficient temperature control method has become the direction of the industry's efforts.

The present invention relates to an electronic device and a temperature control method for a solid state hard disk. It sets three stages of cooling, and can actively set the power state of the solid state disk according to different stages to effectively control the solid state disk. Cool down.

According to the first aspect of the present invention, a temperature control method of a solid state drive is provided. The temperature control method of the solid state hard disk includes the following steps: a central processing unit of the electronic device sends out a plurality of first commands at a first frequency. Receive these first commands through a controller of the solid state hard disk, and return a plurality of current temperatures of the solid state hard disk to the central processing unit according to the first commands. According to the current temperature, the central processing unit decides whether to use a first stage, a second stage or a third stage The temperature of the solid state hard disk is reduced, and a second command is issued according to the first stage, the second stage, or the third stage to set a power state of the solid state hard disk.

According to the second aspect of the present invention, an electronic device is provided. The electronic device includes a central processing unit and a solid state hard disk. The solid state drive includes a controller. The central processing unit is used for issuing a plurality of first commands at a first frequency. The controller is used for receiving the first commands, and returning a plurality of current temperatures of the solid state drive to the central processing unit according to the first commands. The central processing unit decides to cool the solid state drive in a first stage, a second stage, or a third stage according to the current temperatures, and sends out a The second command sets a power state of the solid state drive.

In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows:

100,300: electronic devices

110,310: central processing unit

200,400: solid state drive

210,410: Controller

CMD1: The first command

CMD2: Second instruction

S110~S130, S1310~S1380: steps

Figure 1 shows a schematic diagram of an electronic device.

Figure 2 shows a schematic diagram of an electronic device with a solid state drive according to an embodiment

FIG. 3 shows a flowchart of a temperature control method of a solid state drive according to an embodiment of the present invention.

FIG. 4 shows a flowchart of the sub-steps of step S130 according to an embodiment of the present invention.

Please refer to FIG. 1, which shows a schematic diagram of the electronic device 100. The electronic device 100 includes a central processing unit 110 and a solid state hard disk 200. The central processing unit 110 is coupled to the solid state drive 200 and can access data on the solid state drive 200. The electronic device 100 is, for example, a notebook computer, a desktop computer, a tablet computer, a smart phone or a multimedia device. The central processing unit 110 is, for example, a single-core or multi-core processor, a special-purpose microprocessor, or a special-application integrated circuit.

The solid state drive 200 includes a controller 210. The SSD 200 supports NVMe. The controller 210 is, for example, a control chip, an embedded controller, or a special application integrated circuit. The controller 210 can respond to commands sent by the central processing unit 110 and set the power state of the solid state drive 200.

Table 1 shows the corresponding relationship between the power state and performance of the solid state drive 200. The power state includes five power states PS0 to PS4. Each power state PS0 to PS4 corresponds to a different performance. The power states PS0 to PS2 are working states, and PS3 to PS4 are sleeping states. The corresponding relationship between power status and performance shown in Table 1 is an example, and different settings can be set according to different solid state drive manufacturers. But generally speaking, it can be determined that the performance of the power states PS0 to PS4 is successively lower and lower.

In the NVMe specification, under normal use conditions, the power state of the solid state drive 200 is PS0. When the current temperature of the solid state drive 200 exceeds the first temperature parameter (TMT1) of the host controlled thermal management (HCTM), the temperature will be cooled for the first time. At this time, the controller 210 sets the power state of the solid state drive 200 to PS1. In order to reduce the performance of the solid state drive 200, to cool down. When the current temperature of the solid state drive 200 exceeds the second temperature parameter (TMT2) of the host's thermal management control, the temperature will be lowered a second time. At this time, the controller 210 sets the power state of the solid state drive 200 to PS2 to reduce again The performance of the solid state drive 200 can be used to cool down. When the current temperature of the solid state drive 200 returns to below the first temperature parameter, the controller 210 at this time sets the power state of the solid state drive 200 back to PS0. In other words, the power state setting of the solid state drive 200 is passive. However, this cannot cope with various usage scenarios of the solid state drive 200.

In view of this, the present invention provides a temperature control method for a solid state hard disk, which can improve the aforementioned shortcomings.

Please refer to Figures 2 and 3. FIG. 2 is a schematic diagram of an electronic device 300 with a solid state drive 400 according to an embodiment. FIG. 3 shows a flowchart of a temperature control method of a solid state drive 400 according to an embodiment of the invention. The elements in Fig. 2 are similar to those in Fig. 1, so I won’t repeat them here. The difference between Figure 2 and Figure 1 is that the central processing unit 310 can send the first command CMD1 and the second command CMD2 to the solid state drive 400 to periodically monitor the current temperature of the solid state drive 400 and make the controller 410 set the power state of the solid state drive 400.

In step S110, the central processing unit 310 sends a plurality of first commands CMD1 to the solid state hard disk 400 at a first frequency to query the current temperature of the solid state disk 400. In one embodiment, the first frequency is, for example, issuing the first command CMD1 every 5 minutes to query the current temperature of the solid state drive 400. It is worth noting that the frequency of issuing the first command CMD1 is not limited to this, and can be designed differently according to different usage scenarios. For example, the central processing unit 310 can issue the first command CMD1 every 3 minutes or issue the first command CMD1 every 6 minutes. One command CMD1.

In step S120, the controller 410 of the solid state drive 400 receives the first command CMD1, and returns a plurality of current temperatures of the solid state drive 400 to the central processing unit 310 according to the first command CMD1. Furthermore, since the central processing unit 310 sequentially issues a plurality of first commands CMD1 at the first frequency, the controller 410 also returns the plurality of solid state disks 400 in sequence according to the first command CMD1 at the first frequency. The current temperature to the central processing unit 310.

In step S130, the central processing unit 310 decides to cool the solid state drive 400 in a first stage, a second stage or a third stage according to the current temperatures, and according to the first stage, the second stage or the third stage A second command CMD2 is issued to set a power state of the solid state drive 400. Please refer to Figure 4. FIG. 4 shows a flowchart of the sub-steps of step S130 according to an embodiment of the present invention. Step S130 includes steps S1310 to S1380.

In step S1310, the central processing unit 310 calculates these current temperature A number of current temperatures that continuously exceed a safe temperature in degrees. In one embodiment, since the solid state drive 400 can operate normally below 70°C, and the solid state drive 400 may be damaged if the temperature exceeds 70°C, the safe temperature in this embodiment may be 70°C, but not As a limit, it can be adjusted according to the actual situation. For example, if the controller 410 sequentially returns a plurality of current temperatures of the solid state drive 400 as 65°C, 68°C, 72°C, 75°C, and 74°C according to the first command CMD1 every 5 minutes, then the central processing unit 310 calculates that the number of current temperatures continuously exceeding 70° C. among these current temperatures is 3.

Next, in step S1320, the central processing unit 310 compares this number with a threshold value to determine the cooling of the solid state drive 400 in the first stage, the second stage, or the third stage. In one embodiment, the threshold value is 3, but it is not limited to this, and can be adjusted according to actual conditions. When the number does not reach the threshold, go to step S1330 to decide to cool down the solid state drive 400 in the first stage; when the number is equal to the threshold, go to step S1340 to decide to cool down the solid state drive 400 in the second stage ; When the number exceeds the threshold, step S1350 is entered, and it is determined to cool down the solid state drive 400 in the third stage.

Taking the above example, the CPU 310 calculates that the number of current temperatures continuously exceeding 70°C among these current temperatures is 3, and the threshold value is 3. Therefore, in step S1340, the CPU 310 decides to perform the second stage The solid state drive 400 cools down.

After step S1340, proceed to step S1370. During the second stage of cooling, the central processing unit 310 issues a second command CMD2 to set the solid state drive 400 The power state is a power state PS1, and a first temperature parameter and a second temperature parameter for controlling thermal management of a host are set. In one embodiment, the set first temperature parameter and the second temperature parameter are lower than the factory preset values, for example, the first temperature parameter is set to 67°C and the second temperature parameter is set to 69°C, which are both lower than the factory preset values 82°C and 84°C. Taking the above example, in this step, since the number of current temperatures that continuously exceed the safe temperature is equal to the threshold value, the CPU 310 determines that the solid state drive 400 is in danger of being damaged due to high temperature, so by setting the solid state The power state of the hard disk 400 is the power state PS1, and a first temperature parameter and a second temperature parameter for controlling thermal management of a host are set to effectively cool the solid state hard disk 400.

After step S1330, proceed to step S1360. In the first stage of cooling, the CPU 310 determines whether the solid state drive 400 has been idle for more than a period of time. When the solid state drive 400 has been idle for more than this period of time, the CPU 310 issues a second command CMD2 sets the power state of the solid state drive 400 to a power state PS1. In one embodiment, the time can be 4 minutes, but it is not limited to this, and can be adjusted according to actual conditions. In this step, since the number of current temperatures continuously exceeding the safe temperature among the current temperatures has not reached the threshold value, the central processing unit 310 determines that the solid state drive 400 is not in danger of being damaged due to the high temperature, and therefore, the solid state drive can be made 400 is in the power state PS0 without reducing performance. Only when the solid state drive 400 is idle for more than a period of time, it means that the solid state drive 400 is not in use. At this time, the central processing unit 310 sends the second command CMD2 to set the power state of the solid state drive 400 to the power state PS1. During the period, the performance is reduced, effectively reducing the current temperature of the solid state drive 400 Spend.

After step S1350, proceed to step S1380. In the third stage of cooling, the central processing unit 310 issues a second command CMD2 to set the power state of the solid state drive 400 to a power state PS2, and issues a first command CMD1 at a second frequency , So that the controller 410 receives the first command CMD1, and returns the current temperature of the solid state drive 400 to the central processing unit 310 according to the first command CMD1. In an embodiment, the second frequency is higher than the first frequency. In this step, because the number of current temperatures that continuously exceed the safe temperature exceeds the threshold, the CPU 310 determines that the solid state drive 400 is in danger of being damaged due to the high temperature. Therefore, the CPU 310 issues the first The second command CMD2 sets the power state of the solid state drive 400 to the power state PS2, and increases the frequency of issuing the first command CMD1. Because the power state PS2 is of low performance, which will seriously affect the user experience, by obtaining the current temperature of the solid state drive 400 more frequently, the performance can be restored when the temperature returns to a normal value.

In this way, the electronic device 300 can determine different usage scenarios based on the multiple current temperatures of the solid state drive 400 to cool down in three stages, and automatically set the power state of the solid state drive 400 according to different stages to reduce performance. To effectively achieve the purpose of cooling down. Therefore, compared with the prior art that only uses the two temperature parameters of the host to control thermal management to cool the solid state drive, the method proposed in this case is more suitable for a variety of usage scenarios, and can reduce the solid state drive 400 more efficiently. temperature.

To sum up, although the present invention has been disclosed as above in embodiments, its It is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to those defined by the attached patent application scope.

S110, S120, S130: steps

Claims (12)

A temperature control method for a solid-state hard disk is suitable for an electronic device with a solid-state hard disk. The temperature control method includes: issuing a plurality of first commands at a first frequency through a central processing unit of the electronic device; A controller of the hard disk receives the first commands, and returns a plurality of current temperatures of the solid state disk to the CPU according to the first commands; A first stage, a second stage, or a third stage to cool the solid state drive, and a second command is issued according to the first stage, the second stage, or the third stage to set a power source of the solid state drive State (power state). The temperature control method according to claim 1, wherein the step of determining, by the CPU according to the current temperatures, to cool the solid state drive in the first stage, the second stage or the third stage includes: calculating A number of the current temperatures that continuously exceed a safe temperature among the current temperatures; compare the number with a threshold value; when the number does not reach the threshold value, it is determined to use the first stage for the solid state drive Cool down; when the number is equal to the threshold value, decide to cool down the solid state drive in the second stage; and When the number exceeds the threshold value, it is decided to cool the solid state drive in the third stage. The temperature control method according to claim 2, wherein the step of issuing the second command according to the first stage, the second stage or the third stage to set the power state of the solid state drive includes: when it is determined to use the In the first stage, when the solid state drive is cooled down, it is determined whether the solid state drive is idle for more than a period of time; and when the solid state drive is idle for more than the period of time, the CPU sends the second command to set the solid state drive The power state is a power state PS1. The temperature control method according to claim 2, wherein the step of issuing the second command according to the first stage, the second stage or the third stage to set the power state of the solid state drive includes: when it is determined to use the When the solid state drive is cooled in the second stage, the central processing unit issues the second command to set the power state of the solid state drive to a power state PS1, and sets a first temperature parameter and a host controlled thermal management The second temperature parameter. The temperature control method according to claim 4, wherein the first temperature parameter and the second temperature parameter are lower than a factory preset value. The temperature control method according to claim 2, wherein the step of issuing the second command according to the first stage, the second stage or the third stage to set the power state of the solid state drive includes: when it is determined to use the When the solid state drive is cooled in the third stage, the central processing unit issues the second command to set the power state of the solid state drive to a power state PS2, and Send the first commands at a second frequency so that the controller receives the first commands; and return the current temperatures of the solid state drive to the central processing unit according to the first commands, wherein the The second frequency is higher than the first frequency. An electronic device for temperature control of a solid state hard disk, comprising: a central processing unit for issuing a plurality of first commands at a first frequency; and a solid state hard disk comprising: a controller for receiving these A first command, and return a plurality of current temperatures of the solid state drive to the CPU according to the first commands; wherein the CPU decides to perform a first stage and a second stage according to the current temperatures Or a third phase cools down the solid state drive, and a second command is issued according to the first phase, the second phase, or the third phase to set a power state of the solid state drive. The electronic device according to claim 7, wherein the central processing unit calculates a quantity of the current temperatures continuously exceeding a safe temperature among the current temperatures, and compares the quantity with a threshold value, when the quantity does not reach When the threshold value is reached, the CPU decides to cool down the solid state drive in the first stage. When the number is equal to the threshold value, the CPU decides to cool down the solid state drive in the second stage. When the number exceeds the threshold, the central processing unit decides to cool down the solid state drive in the third stage. The electronic device according to claim 8, wherein when the central processing unit decides to cool down the solid state drive in the first stage, the central processing unit further determines whether the solid state drive has been idle for more than a period of time, and when the solid state drive After being idle for more than the time, the central processing unit issues the second command to set the power state of the solid state drive to a power state PS1. The electronic device according to claim 8, wherein when the central processing unit decides to cool down the solid-state drive in the second stage, the central processing unit issues the second command to set the power state of the solid-state drive to a The power state PS1, and set a first temperature parameter and a second temperature parameter for a host to control thermal management. The electronic device according to claim 10, wherein the first temperature parameter and the second temperature parameter are lower than a factory preset value. The electronic device according to claim 8, wherein when the central processing unit decides to cool down the solid-state drive in the third stage, the central processing unit issues the second command to set the power state of the solid-state drive to a Power state PS2, and issue the first commands at a second frequency, so that the controller receives the first commands, and returns the current temperatures of the solid state drive to the center according to the first commands Processor, the second frequency is higher than the first frequency.

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