CN114077293A - Electronic device and temperature control method of solid state disk thereof - Google Patents
Electronic device and temperature control method of solid state disk thereof Download PDFInfo
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- CN114077293A CN114077293A CN202010848732.1A CN202010848732A CN114077293A CN 114077293 A CN114077293 A CN 114077293A CN 202010848732 A CN202010848732 A CN 202010848732A CN 114077293 A CN114077293 A CN 114077293A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3003—Monitoring arrangements specially adapted to the computing system or computing system component being monitored
- G06F11/3037—Monitoring arrangements specially adapted to the computing system or computing system component being monitored where the computing system component is a memory, e.g. virtual memory, cache
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
Abstract
An electronic device and a temperature control method of a solid state disk thereof are provided. The temperature control method of the solid state disk comprises the following steps: a central processing unit of the electronic device sends a plurality of first instructions at a first frequency. The first instructions are received by a controller of the solid state disk, and a plurality of current temperatures of the solid state disk are returned to the central processing unit according to the first instructions. The CPU determines to cool the solid state disk in a first stage, a second stage or a third stage according to the current temperatures, and sends a second instruction to set a power state of the solid state disk according to the first stage, the second stage or the third stage.
Description
[ technical field ] A method for producing a semiconductor device
The present invention relates to an electronic device and a temperature control method thereof, and more particularly, to an electronic device and a temperature control method of a solid state disk thereof.
[ background of the invention ]
NVMe solid state disks have become the mainstream of the market, and the solid state disks have high performance but also cause some overheating problems. At present, a temperature control frequency modulation (Thermal Throttling) mechanism is available in a solid state disk, and the solid state disk is cooled by controlling two temperature parameters of a Thermal management (HCTM) through a host. However, two temperature parameters for host-controlled thermal management are manufacturer preset values (defaults), and the manufacturer preset values (e.g., 82 ℃ and 84 ℃) of each manufacturer are generally higher than the safe temperature (typically about 70 ℃) of the solid state disk. That is to say, when the temperature of solid state hard drives exceeded the safe temperature, just can make solid state hard drives cool down according to two temperature parameters of host control thermal management. In other words, the manufacturer preset values of each manufacturer are only suitable for some usage situations, such as accessing the solid state disk for a short time. If the solid state disk is in an operating state for a long time, the temperature of the solid state disk is always at a safe temperature.
Additionally, while currently in the NVMe specification, the system may Set two temperature parameters of the host controlled thermal management below vendor preset values by a Set Feature command. However, the method of cooling the solid state disk by only setting two temperature parameters of the host for controlling thermal management by the system is not suitable for some usage situations, such as accessing the solid state disk for a long time or using the solid state disk in an environment higher than room temperature (e.g. 40 ℃) such as …, and the usage situations still cause the temperature of the solid state disk to be always at the safe temperature. Therefore, the life of the solid state disk and the data stored in the solid state disk will pose a serious threat.
Therefore, it is an effort in the industry to improve the above-mentioned shortcomings and provide a more efficient temperature control method.
[ summary of the invention ]
The invention relates to an electronic device and a temperature control method of a solid state disk thereof, which are provided with three stages of cooling, and can effectively cool the solid state disk by actively setting the power state of the solid state disk according to different stages.
According to a first aspect of the present invention, a method for controlling a temperature of a solid state disk is provided. The temperature control method of the solid state disk comprises the following steps: a central processing unit of the electronic device sends a plurality of first instructions at a first frequency. The first instructions are received by a controller of the solid state disk, and a plurality of current temperatures of the solid state disk are returned to the central processing unit according to the first instructions. The CPU determines to cool the solid state disk in a first stage, a second stage or a third stage according to the current temperatures, and sends a second instruction to set a power state of the solid state disk according to the first stage, the second stage or the third stage.
According to a second aspect of the present invention, an electronic device is provided. The electronic device comprises a central processing unit and a solid state disk. The solid state disk comprises a controller. The CPU is used for sending a plurality of first instructions at a first frequency. The controller is used for receiving the first instructions and returning the current temperatures of the solid state disk to the central processing unit according to the first instructions. The central processing unit determines to cool the solid state disk in a first stage, a second stage or a third stage according to the current temperatures, and sends a second instruction to set a power state of the solid state disk according to the first stage, the second stage or the third stage.
In order to better understand the above and other aspects of the present invention, the following detailed description of the embodiments is made with reference to the accompanying drawings, in which:
[ description of the drawings ]
Fig. 1 is a schematic diagram of an electronic device according to an embodiment of the invention.
FIG. 2 is a schematic diagram of an electronic device with a solid state drive according to an embodiment of the invention.
Fig. 3 is a flowchart illustrating a method for controlling temperature of a solid state disk according to an embodiment of the invention.
Fig. 4 is a flowchart illustrating the sub-steps of step S130 according to an embodiment of the invention.
[ detailed description ] embodiments
Referring to fig. 1, a schematic diagram of an electronic device 100 is shown. The electronic device 100 includes a central processing unit 110 and a solid state drive 200. The cpu 110 is coupled to the solid state drive 200 and can access data of the solid state drive 200. The electronic device 100 is, for example, a notebook computer, a desktop computer, a tablet computer, a smart phone or a multimedia device. The CPU 110 is, for example, a single or multi-core processor, a special purpose microprocessor, or an ASIC.
The solid state drive 200 includes a controller 210. The solid state disk 200 supports NVMe. The controller 210 is, for example, a control chip, an embedded controller, or an application specific integrated circuit. The controller 210 may respond to the command sent by the cpu 110 and set the power state (power state) of the solid state disk 200.
Table one is a corresponding relationship between the power state and the performance of the solid state drive 200. The power states include five power states PS0 through PS 4. Each power state PS 0-PS 4 corresponds to a different performance. The power states PS0 to PS2 are working states, and PS3 to PS4 are sleeping states. The correspondence between power states and performance shown in table one is an example, and may have different settings according to different manufacturers of the solid state disk. However, generally, it can be determined that the performance of the power states PS0 through PS4 is sequentially lower.
| Power state | Efficiency of |
| PS0 | 100％ |
| PS1 | 50％ |
| PS2 | 10％ |
| PS3 | Minimum size |
| PS4 | Minimum size |
Watch 1
In the NVMe specification, the power state of the solid state disk 200 under normal use conditions is PS 0. When the current temperature of the solid state disk 200 exceeds a first temperature parameter (TMT1) of a Host Control Thermal Management (HCTM), a first cooling is performed, and at this time, the controller 210 sets the power state of the solid state disk 200 to PS1, so as to reduce the performance of the solid state disk 200 and perform cooling. When the current temperature of the solid state disk 200 exceeds the second temperature parameter (TMT2) of the host control thermal management, the temperature is lowered for the second time, and at this time, the controller 210 sets the power state of the solid state disk 200 to be PS2, so as to reduce the performance of the solid state disk 200 again for cooling. When the current temperature of the solid state disk 200 returns to the first temperature parameter, the controller 210 sets the power state of the solid state disk 200 back to PS 0. In other words, the power state setting for solid state disk 200 is passive. However, this cannot cope with various usage scenarios of the solid state disk 200.
In view of the above, the present invention provides a method for controlling temperature of a solid state disk, which can improve the aforementioned drawbacks.
Please refer to fig. 2 and fig. 3. FIG. 2 is a schematic diagram of an electronic device 300 with a solid state drive 400 according to an embodiment. Fig. 3 is a flowchart illustrating a method for controlling the temperature of the solid state disk 400 according to an embodiment of the invention. The elements of fig. 2 are similar to those of fig. 1 and will not be described herein. Fig. 2 is different from fig. 1 in that the cpu 310 may send a first command CMD1 and a second command CMD2 to the solid state disk 400 to periodically monitor the current temperature of the solid state disk 400 and enable the controller 410 to set the power state of the solid state disk 400.
In step S110, the cpu 310 issues a plurality of first commands CMD1 to the solid state disk 400 at a first frequency to query the current temperature of the solid state disk 400. In one embodiment, the first frequency is, for example, issuing a first command CMD1 every 5 minutes to query the current temperature of solid state disk 400. It should be noted that the frequency of issuing the first command CMD1 is not limited, and may be designed differently according to different usage scenarios, for example, the cpu 310 may issue the first command CMD1 every 3 minutes or issue the first command CMD1 every 6 minutes.
In step S120, the controller 410 of the solid state drive 400 receives the first command CMD1, and returns a plurality of current temperatures of the solid state drive 400 to the cpu 310 according to the first command CMD 1. Furthermore, since the cpu 310 sequentially issues the first commands CMD1 at the first frequency, the controller 410 substantially returns the current temperatures of the solid state drive 400 to the cpu 310 sequentially according to the first commands CMD1 at the first frequency.
In step S130, the cpu 310 determines to cool the solid state disk 400 in a first stage, a second stage, or a third stage according to the current temperatures, and issues a second command CMD2 to set a power state of the solid state disk 400 according to the first stage, the second stage, or the third stage. Please refer to fig. 4. Fig. 4 is a flowchart illustrating the sub-steps of step S130 according to an embodiment of the invention. Step S130 includes steps S1310 to S1380.
In step S1310, the cpu 310 calculates a number of current temperatures that continuously exceed a safe temperature. In an embodiment, since the solid state disk 400 may operate normally below 70 ℃, and damage may be caused to the solid state disk 400 when the temperature exceeds 70 ℃, the safe temperature in this embodiment may be 70 ℃, but not limited thereto, and may be adjusted according to actual situations. For example, if the controller 410 sequentially returns a plurality of current temperatures of 65 ℃, 68 ℃, 72 ℃, 75 ℃ and 74 ℃ of the solid state disk 400 every 5 minutes according to the first command CMD1, the cpu 310 calculates the number of current temperatures continuously exceeding 70 ℃ among the current temperatures to be 3.
Next, in step S1320, the cpu 310 compares the number with a threshold value to determine to cool the solid state disk 400 in the first stage, the second stage or the third stage. In one embodiment, the threshold value is 3, but not limited thereto, and may be adjusted according to the actual situation. When the number does not reach the threshold value, step S1330 is entered to determine to cool the solid state disk 400 in the first stage; when the number is equal to the threshold value, step S1340 is entered to determine to cool the solid state disk 400 in the second stage; when the number exceeds the threshold value, the process proceeds to step S1350, and the solid state disk 400 is cooled in the third stage.
In the above example, the cpu 310 calculates that the number of the current temperatures continuously exceeding 70 ℃ among the current temperatures is 3, and the threshold value is 3, so the process proceeds to step S1340, and the cpu 310 determines to cool the solid state disk 400 in the second stage.
After step S1340, step S1370 is entered, and during the second stage of cooling, the cpu 310 issues a second command CMD2 to set the power state of the solid state disk 400 to a power state PS1, and sets a first temperature parameter and a second temperature parameter for controlling thermal management by a host. In one embodiment, the first temperature parameter and the second temperature parameter are set to be lower than the manufacturer preset values, for example, the first temperature parameter is set to 67 ℃ and the second temperature parameter is set to 69 ℃, which are both lower than the manufacturer preset values of 82 ℃ and 84 ℃. In the above example, in this step, since the number of the current temperatures that continuously exceed the safe temperature in the current temperatures is equal to the threshold value, the cpu 310 determines that the solid state disk 400 is at risk of damage due to high temperature, and thus the solid state disk 400 is effectively cooled by setting the power state of the solid state disk 400 to be the power state PS1 and setting a first temperature parameter and a second temperature parameter for controlling thermal management by a host.
After step S1330, the process proceeds to step S1360, in the first stage of cooling, the cpu 310 determines whether the solid state disk 400 is idle for more than a time, and when the solid state disk 400 is idle for more than the time, the cpu 310 issues the second command CMD2 to set the power state of the solid state disk 400 to be the power state PS 1. In one embodiment, the time period may be 4 minutes, but not limited thereto, and may be adjusted according to the actual situation. In this step, since the number of the current temperatures continuously exceeding the safety temperature does not reach the threshold value, the cpu 310 determines that the solid state disk 400 is not in danger of being damaged due to high temperature, and thus, the solid state disk 400 can be in the power state PS0 without reducing the performance. Only when the solid state disk 400 is idle for more than a time, which means that the solid state disk 400 is not in use, the cpu 310 sends the second command CMD2 to set the power state of the solid state disk 400 to be the power state PS1, so that the performance is reduced during the idle period, and the current temperature of the solid state disk 400 is effectively reduced.
After step S1350, step S1380 is performed, in the third cooling stage, the cpu 310 issues the second command CMD2 to set the power state of the solid state drive 400 to be the power state PS2, and issues the first command CMD1 at the second frequency, so that the controller 410 receives the first command CMD1, and returns the current temperature of the solid state drive 400 to the cpu 310 according to the first command CMD 1. In one embodiment, the second frequency is higher than the first frequency. In this step, since the number of the current temperatures that continuously exceed the safe temperature exceeds the threshold value, the cpu 310 determines that the solid state disk 400 is at risk of being damaged due to high temperature, and therefore, the cpu 310 issues the second command CMD2 to set the power state of the solid state disk 400 to be the power state PS2, and increases the frequency of issuing the first command CMD 1. Since the power state PS2 is low performance and may significantly affect the user experience, the performance can be recovered when the temperature returns to the normal value by obtaining the current temperature of the solid state disk 400 more frequently.
In this way, the electronic device 300 can determine different usage situations according to a plurality of current temperatures of the solid state disk 400 to perform three-stage cooling, and actively set the power state of the solid state disk 400 according to different stages to reduce efficiency, so as to effectively achieve the purpose of cooling. Therefore, compared to the prior art in which the solid state disk is cooled only by two temperature parameters of the host controlled thermal management, the method provided by the present disclosure is more suitable for various usage scenarios, and can more efficiently reduce the temperature of the solid state disk 400.
In summary, although the present invention has been described with reference to the above embodiments, the present invention is not limited thereto. Various modifications and alterations may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the protection scope of the present invention should be determined by the appended claims.
Claims (10)
1. A temperature control method of a solid state disk is suitable for an electronic device with the solid state disk, and is characterized by comprising the following steps:
sending a plurality of first instructions at a first frequency by a central processing unit of the electronic device;
receiving the first instructions through a controller of the solid state disk, and returning the current temperatures of the solid state disk to the central processing unit according to the first instructions; and
the CPU determines to cool the solid state disk in a first stage, a second stage or a third stage according to the current temperatures, and sends a second instruction to set a power state of the solid state disk according to the first stage, the second stage or the third stage.
2. The method of claim 1, wherein the step of determining, by the cpu, the first stage, the second stage, or the third stage to cool the solid state disk according to the current temperatures comprises:
calculating the number of the current temperatures which continuously exceed a safe temperature in the current temperatures;
comparing the quantity to a threshold value;
when the quantity does not reach the threshold value, determining to cool the solid state disk by the first stage;
when the number is equal to the threshold value, determining to cool the solid state disk in the second stage; and
and when the number exceeds the threshold value, determining to cool the solid state disk by the third stage.
3. The method as claimed in claim 2, wherein the step of setting the power state of the solid state disk according to the second command issued by the first stage, the second stage or the third stage comprises:
when the solid state disk is determined to be cooled in the first stage, judging whether the solid state disk is idle for more than one time; and
when the solid state disk is idle for more than the time, the central processing unit sends the second instruction to set the power state of the solid state disk to be a power state PS 1.
4. The method as claimed in claim 2, wherein the step of setting the power state of the solid state disk according to the second command issued by the first stage, the second stage or the third stage comprises:
when the solid state disk is determined to be cooled in the second stage, the central processing unit sends the second instruction to set the power state of the solid state disk to be a power state PS1, and sets a first temperature parameter and a second temperature parameter of a host for controlling thermal management.
5. The method of claim 4, wherein the first temperature parameter and the second temperature parameter are lower than a manufacturer preset value.
6. The method as claimed in claim 2, wherein the step of setting the power state of the solid state disk according to the second command issued by the first stage, the second stage or the third stage comprises:
when the solid state disk is determined to be cooled in the third stage, the central processing unit sends the second instruction to set the power state of the solid state disk to be a power state PS2, and sends the first instructions at a second frequency, so that the controller receives the first instructions; and
and returning the current temperatures of the solid state disk to the central processing unit according to the first instructions, wherein the second frequency is higher than the first frequency.
7. An electronic device, comprising:
a central processing unit for sending a plurality of first commands at a first frequency;
a solid state disk, comprising:
the controller is used for receiving the first instructions and returning the current temperatures of the solid state disk to the central processing unit according to the first instructions;
the central processing unit determines to cool the solid state disk in a first stage, a second stage or a third stage according to the current temperatures, and sends a second instruction to set a power state of the solid state disk according to the first stage, the second stage or the third stage.
8. The electronic device of claim 7, wherein said CPU calculates a number of said plurality of current temperatures that continuously exceed a safe temperature among said plurality of current temperatures and compares said number with a threshold value,
when the quantity does not reach the threshold value, the central processing unit determines to cool the solid state disk in the first stage,
when the number is equal to the threshold value, the central processing unit determines to cool the solid state disk in the second stage,
when the number exceeds the threshold value, the central processing unit determines to cool the solid state disk in the third stage.
9. The electronic device of claim 8, wherein when the cpu determines to cool the solid state disk in the first stage, the cpu further determines whether the solid state disk is idle for more than a time, and when the solid state disk is idle for more than the time, the cpu issues the second command to set the power state of the solid state disk to be a power state PS 1.
10. The electronic device of claim 8, wherein when the cpu determines to cool the solid state disk in the second stage, the cpu issues the second instruction to set the power state of the solid state disk to a power state PS1, and sets a first temperature parameter and a second temperature parameter for host-controlled thermal management.
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| CN202010848732.1A CN114077293A (en) | 2020-08-21 | 2020-08-21 | Electronic device and temperature control method of solid state disk thereof |
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| CN202010848732.1A CN114077293A (en) | 2020-08-21 | 2020-08-21 | Electronic device and temperature control method of solid state disk thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130031297A1 (en) * | 2011-07-26 | 2013-01-31 | International Business Machines Corporation | Adaptive record caching for solid state disks |
| CN105242876A (en) * | 2015-09-28 | 2016-01-13 | 联想(北京)有限公司 | Control method and electronic device |
| CN110275676A (en) * | 2019-05-08 | 2019-09-24 | 青岛镕铭半导体有限公司 | A kind of control method of solid state hard disk, device and solid state hard disk system |
| CN110471816A (en) * | 2019-07-02 | 2019-11-19 | 深圳市金泰克半导体有限公司 | The data managing method and device of solid state hard disk |
| CN110704274A (en) * | 2019-09-06 | 2020-01-17 | 苏州浪潮智能科技有限公司 | Temperature control method, device and equipment for solid state disk |
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2020
- 2020-08-21 CN CN202010848732.1A patent/CN114077293A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130031297A1 (en) * | 2011-07-26 | 2013-01-31 | International Business Machines Corporation | Adaptive record caching for solid state disks |
| CN105242876A (en) * | 2015-09-28 | 2016-01-13 | 联想(北京)有限公司 | Control method and electronic device |
| CN110275676A (en) * | 2019-05-08 | 2019-09-24 | 青岛镕铭半导体有限公司 | A kind of control method of solid state hard disk, device and solid state hard disk system |
| CN110471816A (en) * | 2019-07-02 | 2019-11-19 | 深圳市金泰克半导体有限公司 | The data managing method and device of solid state hard disk |
| CN110704274A (en) * | 2019-09-06 | 2020-01-17 | 苏州浪潮智能科技有限公司 | Temperature control method, device and equipment for solid state disk |
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