TWI745727B - Laser processing apparatus - Google Patents

Laser processing apparatus Download PDF

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Publication number
TWI745727B
TWI745727B TW108127325A TW108127325A TWI745727B TW I745727 B TWI745727 B TW I745727B TW 108127325 A TW108127325 A TW 108127325A TW 108127325 A TW108127325 A TW 108127325A TW I745727 B TWI745727 B TW I745727B
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Taiwan
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laser
bolts
fixedly connected
water tank
processing machine
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TW108127325A
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Chinese (zh)
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TW202106423A (en
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肖雄
閆隴周
王飛
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健鼎科技股份有限公司
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Abstract

A laser processing apparatus is disclosed, which includes enclosure, water tank, processing machine, oscillator and feeder. Top of the enclosure is connected to the top of water tank by screw. Front wall of the enclosure is connected to the rear wall of processing machine by screw. Top of processing machine is connected to the bottom of oscillator. Right wall of oscillator is connected to the left wall of feeder by screw. Front wall of enclosure is connected to an unloading machine. Top of processing machine has a top board which has groove on its top. Inside the groove has a touch panel and display screen. Rear wall of feeder is connected to a drying machine by screw. Top of drying machine is connected to a vacuum adsorption device by screw.

Description

雷射製程設備Laser process equipment

本發明涉及電子設備技術領域,具體為一種雷射製程設備。 The invention relates to the technical field of electronic equipment, in particular to a laser manufacturing process equipment.

印製電路板,又稱印刷電路板,是電子元器件電氣連接的提供者。 Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components.

由於電子技術的迅猛提升,印刷電路板中的高密度互連技術(HDI,High Density Interconnect)板件市場迅速發展,高階HDI板件用途包括第三代行動通訊技術(3rd-Generation,3G)板或積體電路(integrated circuit,IC)載板未來增長非常迅速,3G板需具備高速傳輸、多功能、高積體發展帶來的高密度佈線與高頻傳輸。 Due to the rapid improvement of electronic technology, the high-density interconnect technology (HDI, High Density Interconnect) board market in printed circuit boards has developed rapidly. The use of high-end HDI boards includes the third-generation mobile communication technology (3rd-Generation, 3G) boards. Or integrated circuit (IC) carrier boards will grow rapidly in the future, and 3G boards need to have high-speed transmission, multi-function, and high-integration high-density wiring and high-frequency transmission brought about by the development.

但是現有的高階HDI板件為三層式結構,孔密度更多、更密集,因此加大了生產加工的難度,習知技術為將第一層、第二層和第三層導通,必須藉由二次雷射實現,經過雷射、鑽孔、電鍍、外層、壓合和雷射,製程數量較多,生產週期較長。 However, the existing high-end HDI panels have a three-layer structure with more and denser holes, which increases the difficulty of production and processing. The conventional technology must be used to connect the first layer, the second layer and the third layer. Realized by the second laser, after laser, drilling, electroplating, outer layer, pressing and laser, the number of manufacturing processes is large, and the production cycle is longer.

本發明的目的在於提供一種雷射製程設備,以解決上述背景技術中提出的現有的高階HDI板件孔密度更多、更密集,加大了生產加工的難 度,習知技術為將一層和三層導通,只能藉由二次雷射實現,經過雷射、鑽孔、電鍍、外層、壓合和雷射,製程數量較多,生產週期較長的問題。 The purpose of the present invention is to provide a laser process equipment to solve the problem that the existing high-end HDI plates proposed in the background art have more and more dense holes, which increases the difficulty of production and processing. In order to connect the first and third layers, the conventional technology can only be realized by two lasers. After laser, drilling, electroplating, outer layer, pressing and laser, the number of processes is large and the production cycle is longer. problem.

為實現上述目的,本發明提供如下技術方案:一種雷射製程設備,包含外殼、水箱、加工機、發振器和上料機,外殼的頂部藉由螺栓與該水箱的頂部固定連接,該外殼的前側壁藉由螺栓與該加工機的後側壁固定連接,該加工機的頂部藉由螺栓與該發振器的底部固定連接,該發振器的右側壁藉由螺栓與該上料機的左側壁固定連接,該外殼的前側壁藉由螺栓固定連接有下料機,該加工機的頂部焊接有頂板,該頂板的頂部開設有凹槽,該凹槽的內腔鑲嵌有觸控板和顯示螢幕,該上料機的後側壁藉由螺栓固定連接有乾燥機,該乾燥機的頂部藉由螺栓固定連接有真空吸附裝置。 In order to achieve the above objective, the present invention provides the following technical solutions: a laser process equipment, comprising a casing, a water tank, a processing machine, a vibrator and a feeder, the top of the casing is fixedly connected to the top of the water tank by bolts, the casing The front side wall is fixedly connected with the rear side wall of the processing machine by bolts, the top of the processing machine is fixedly connected with the bottom of the vibrator by bolts, and the right side wall of the vibrator is connected with the feeder by bolts. The left side wall is fixedly connected, the front side wall of the housing is fixedly connected with a cutting machine by bolts, the top of the processing machine is welded with a top plate, the top of the top plate is provided with a groove, and the inner cavity of the groove is inlaid with a touch panel and On the display screen, the back wall of the feeder is fixedly connected with a dryer by bolts, and the top of the dryer is fixedly connected with a vacuum suction device by bolts.

優選的,所述水箱的後側壁預留有出水管口。 Preferably, a water outlet pipe port is reserved on the rear side wall of the water tank.

優選的,所述該發振器的內腔底部藉由螺栓固定連接有全反射鏡、空氣雷射介質板和部分反射鏡,該全反射鏡的安裝高度與該空氣雷射介質板和該部分反射鏡的安裝高度相同,該空氣雷射介質板的頂板和底板厚度相同,該空氣雷射介質板的中心點與該部分反射鏡的中心點在同一水平線上。 Preferably, the bottom of the cavity of the vibrator is fixedly connected with a total reflection mirror, an air laser dielectric plate and a partial reflection mirror by bolts, and the installation height of the total reflection mirror is the same as that of the air laser dielectric plate and the part. The installation height of the reflector is the same, the top plate and the bottom plate of the air laser dielectric plate have the same thickness, and the center point of the air laser medium plate is on the same horizontal line as the center point of the partial reflector.

與現有技術相比,本發明的有益效果是:該種雷射製程設備,藉由配件的組合運用,在週期高電壓輸入後,利用增設的氣體雷射介質板,來配合全反射鏡和部分反射鏡來進行雷射分散,使雷射射出過程一次實現,不必藉由二次雷射,就可使雷射、鑽孔、電鍍、外層、壓合和雷射的常規過程得到壓縮,降低製程數,提升生產效率。 Compared with the prior art, the beneficial effect of the present invention is: this kind of laser process equipment, through the combined use of accessories, uses the additional gas laser dielectric plate to cooperate with the total reflection mirror and part after periodic high voltage input. The reflector is used to disperse the laser, so that the laser injection process can be realized at one time. Without the need for a second laser, the conventional processes of laser, drilling, plating, outer layer, pressing and laser can be compressed, and the manufacturing process can be reduced. Number, improve production efficiency.

100:外殼 100: shell

110:下料機 110: Cutting machine

200:水箱 200: water tank

300:加工機 300: processing machine

310:頂板 310: top plate

311:觸控板 311: Touchpad

312:顯示螢幕 312: display screen

400:發振器 400: Vibrator

410:全反射鏡 410: Total reflection mirror

420:氣體雷射介質板 420: Gas laser media plate

430:部分反射鏡 430: Partial mirror

500:上料機 500: feeding machine

510:乾燥機 510: Dryer

520:真空吸附裝置 520: Vacuum adsorption device

圖1為本發明之結構示意圖;圖2為本發明之發振器之內部架構示意圖。 Fig. 1 is a schematic diagram of the structure of the present invention; Fig. 2 is a schematic diagram of the internal structure of the vibrator of the present invention.

以下將詳述本發明內容的各實施例,並配合圖式作為例示。除了這些詳細描述之外,本案還可以廣泛地施行在其他的實施例中,任何所述實施例的輕易替代、修改、等效變化都包含在本案的範圍內,並以之後的專利範圍為準。在說明書的描述中,為了使讀者對本案有較完整的瞭解,提供了許多特定細節;然而,本案可能在省略部分或全部這些特定細節的前提下,仍可實施。此外,眾所周知的步驟或元件並未描述於細節中,以避免造成本案不必要之限制。圖式中相同或類似之元件將以相同或類似符號來表示。特別注意的是,圖式僅為示意之用,並非代表元件實際的尺寸或數量,除非有特別說明。 Hereinafter, each embodiment of the content of the present invention will be described in detail, and the drawings will be used as examples. In addition to these detailed descriptions, this case can also be widely implemented in other embodiments. Any easy substitutions, modifications, and equivalent changes of the embodiments are included in the scope of this case, and the subsequent patent scope shall prevail. . In the description of the specification, in order to enable the reader to have a more complete understanding of the case, many specific details are provided; however, the case may still be implemented under the premise of omitting some or all of these specific details. In addition, well-known steps or elements are not described in the details to avoid unnecessary limitation of the case. The same or similar elements in the drawings will be represented by the same or similar symbols. It should be noted that the drawings are for illustration only, and do not represent the actual size or quantity of the components, unless otherwise specified.

請參閱圖1及圖2所示,本發明提供一種雷射製程設備,藉由配件的組合運用,可降低製程數,提升生產效率,其包括外殼100、水箱200、加工機300、發振器400和上料機500。 Please refer to Figures 1 and 2, the present invention provides a laser process equipment, through the combined use of accessories, can reduce the number of processes, improve production efficiency, which includes a housing 100, a water tank 200, a processing machine 300, a vibrator 400 and 500 on the feeder.

請再次參閱圖1所示,外殼100的前側壁具有下料機110,具體的,外殼100的前側壁藉由螺栓固定連接有下料機110,下料機110便於進行下料。 Please refer to FIG. 1 again. The front side wall of the casing 100 has a blanking machine 110. Specifically, the front wall of the casing 100 is fixedly connected with the blanking machine 110 by bolts, and the blanking machine 110 is convenient for blanking.

請再次參閱圖1所示,水箱200的底部與外殼100固定安裝,具體的,外殼100的頂部藉由螺栓與水箱200的頂部固定連接,水箱200便於冷卻水迴圈。水箱200位於加工機300與發振器400的左側,且水箱200位於下料 機110的頂部。 Please refer to FIG. 1 again. The bottom of the water tank 200 is fixedly installed with the housing 100. Specifically, the top of the housing 100 is fixedly connected with the top of the water tank 200 by bolts, and the water tank 200 is convenient for cooling water to circulate. The water tank 200 is located on the left side of the processing machine 300 and the vibrator 400, and the water tank 200 is located on the blanking The top of the machine 110.

請再次參閱圖1所示,加工機300的左側壁與外殼100固定安裝,具體的,外殼100的前側壁藉由螺栓與加工機300的後側壁固定連接,加工機300的頂部焊接有頂板310,頂板310的頂部開設有凹槽,凹槽便於產生空腔,凹槽的內腔鑲嵌有觸控板311和顯示螢幕312。 Please refer to FIG. 1 again. The left side wall of the processing machine 300 is fixedly installed with the housing 100. Specifically, the front side wall of the housing 100 is fixedly connected with the rear side wall of the processing machine 300 by bolts, and the top plate 310 is welded on the top of the processing machine 300. , The top of the top plate 310 is provided with a groove, which is convenient for generating a cavity, and the inner cavity of the groove is inlaid with the touch pad 311 and the display screen 312.

請參閱圖1及圖2所示,發振器400的底部與加工機300頂部固定安裝,具體的,加工機300的頂部藉由螺栓與發振器400的底部固定連接,發振器400的內腔底部藉由螺栓固定連接有全反射鏡410、氣體雷射介質板420和部分反射鏡430。 1 and 2, the bottom of the vibrator 400 and the top of the processing machine 300 are fixedly installed. Specifically, the top of the processing machine 300 is fixedly connected to the bottom of the vibrator 400 by bolts. A total reflection mirror 410, a gas laser dielectric plate 420 and a partial reflection mirror 430 are fixedly connected to the bottom of the inner cavity by bolts.

請參閱圖1所示,上料機500的左側壁與發振器400固定安裝,具體的,發振器400的右側壁藉由螺栓與上料機500的左側壁固定連接,上料機500的後側壁藉由螺栓固定連接有乾燥機510,乾燥機510便於乾燥,乾燥機510的頂部藉由螺栓固定連接有真空吸附裝置520。 Please refer to FIG. 1, the left side wall of the feeder 500 is fixedly installed with the vibrator 400. Specifically, the right side wall of the vibrator 400 is fixedly connected with the left side wall of the feeder 500 by bolts, and the feeder 500 A dryer 510 is fixedly connected to the rear side wall by bolts, the dryer 510 is convenient for drying, and the top of the dryer 510 is fixedly connected with a vacuum adsorption device 520 by bolts.

在具體的使用時,本技術領域人員首先從內層開料開始,做好實驗追蹤單與普通量產板一起後製作後段工序,其中每一工序都有品保專業人員對品質進行把關,而且最終出貨也必須經過品保抽檢合格後才能出貨,在生產過程中對產品進行管控,例如盲孔孔徑的管控、自動光學檢測(Automated Optical Inspection,AOI)掃描的品質確認,保證不良品杜絕流入下製程,進行測試及追蹤,例如溫度循環(Temperature cycle,TCT)測試、互連強度測試(IST)測試、離子污染程度的測試、剝離強度的測試、剝離(PEELING)測試、對準度測試、高溫高濕實驗的測試、紅外線回流(IRREFLOW)實驗的測試等。 In specific use, those skilled in the art first start from the inner layer cutting, prepare the experimental tracking sheet together with the ordinary mass-produced board, and then make the subsequent processes, in which each process has quality assurance professionals to check the quality, and The final shipment must pass the quality assurance random inspection before it can be shipped. The product is controlled during the production process, such as the control of the blind hole diameter, the quality confirmation of the automatic optical inspection (Automated Optical Inspection, AOI) scanning, and the elimination of defective products. Flow into the next process for testing and tracking, such as temperature cycle (TCT) testing, interconnect strength testing (IST) testing, ion contamination level testing, peeling strength testing, peeling (PEELING) testing, alignment testing , Test of high temperature and high humidity experiment, test of infrared reflux (IRREFLOW) experiment, etc.

請參閱圖1及圖2所示,操作時,將印刷電路板放在上料機500上,加工時藉由真空吸附裝置520自動將印刷電路板放於加工機300之加工平台上,利用加工機300進行雷射加工。其中,發振器400是為了完成雷射的產生及發射,再次過程中,利用增設的氣體雷射介質板420,來配合全反射鏡410和部分反射鏡430來進行雷射分散,使雷射射出過程一次實現。於加工機300中完成雷射製程的印刷電路板,經由水箱200冷卻,再由下料機110送出。 Please refer to FIG. 1 and FIG. 2. During operation, the printed circuit board is placed on the loader 500. During processing, the printed circuit board is automatically placed on the processing platform of the processing machine 300 by the vacuum suction device 520. The machine 300 performs laser processing. Among them, the vibrator 400 is to complete the generation and emission of the laser. In the process again, the additional gas laser dielectric plate 420 is used to cooperate with the total reflection mirror 410 and the partial reflection mirror 430 for laser dispersion, so that the laser The injection process is realized at one time. The printed circuit board that has completed the laser process in the processing machine 300 is cooled by the water tank 200 and then sent out by the blanking machine 110.

然後,乾燥機510可乾燥加工環境,並將散發出的熱量排出,由水箱200來進行冷卻水的迴路。生產線為全自動連續生產,操作人員只需進行資料控制、品質檢驗、參數調節控制,主要生產過程可自動完成;配料工序密封較好,加料等採用電腦控制。 Then, the dryer 510 can dry the processing environment and discharge the emitted heat, and the water tank 200 performs a cooling water circuit. The production line is fully automatic and continuous production. Operators only need to perform data control, quality inspection, and parameter adjustment control. The main production process can be completed automatically; the batching process is well sealed, and the feeding is controlled by computer.

請參閱圖2所示,為了使雷射傳遞過程持續有效,具體的,全反射鏡410的安裝高度與氣體雷射介質板420和部分反射鏡430的安裝高度相同。 Please refer to FIG. 2, in order to make the laser transmission process continue to be effective, specifically, the installation height of the total reflection mirror 410 is the same as the installation height of the gas laser dielectric plate 420 and the partial reflection mirror 430.

請參閱圖2所示,為了使過程均勻分散,具體的,氣體雷射介質板420的頂板和底板厚度相同,氣體雷射介質板420的中心點與部分反射鏡430的中心點在同一水平線上。 Please refer to FIG. 2, in order to make the process evenly distributed, specifically, the top and bottom plates of the gas laser dielectric plate 420 have the same thickness, and the center point of the gas laser dielectric plate 420 and the center point of the partial reflector 430 are on the same horizontal line. .

請再次參閱圖1所示,為了使水箱200的內部水源可以迴圈,具體的,水箱200的後側壁預留有出水管口。 Please refer to FIG. 1 again. In order to make the internal water source of the water tank 200 circulate, specifically, a water outlet is reserved on the rear side wall of the water tank 200.

綜上所述,本發明所提供之雷射製程設備,藉由配件的組合運用,在週期高電壓輸入後,利用增設的氣體雷射介質板,來配合全反射鏡和部分反射鏡來進行雷射分散,使雷射射出過程一次即可打通多層結構,不必藉由二次雷射,就可使雷射、鑽孔、電鍍、外層、壓合和雷射的常規過程 得到壓縮,降低製程數,提升生產效率。因此適用於孔密度更多、更密集的板件,例如三層式結構的高階HDI板件。 To sum up, the laser process equipment provided by the present invention uses a combination of accessories and uses an additional gas laser dielectric plate to cooperate with the total reflector and the partial reflector to perform the laser after the periodic high voltage is input. The laser is scattered, so that the multi-layer structure can be opened up in one shot of the laser, and the conventional processes of laser, drilling, electroplating, outer layer, pressing and laser can be made without the need of a second laser. Get compressed, reduce the number of processes, and improve production efficiency. Therefore, it is suitable for boards with more and denser holes, such as high-end HDI boards with a three-layer structure.

雖然在上文中已經參考實施例對本發明進行了描述,然而在不脫離本發明的範圍的情況下,可以對其進行各種改進並且可以用等效物替換其中的部件。尤其是,只要不存在結構衝突,本發明所披露的實施例中的各項特徵均可藉由任意方式相互結合起來使用,在本說明書中未對這些組合的情況進行窮舉性的描述僅僅是出於省略篇幅和節約資源的考慮。因此,本發明並不侷限於文中公開的特定實施例,而是包括落入權利要求的範圍內的所有技術方案。 Although the present invention has been described above with reference to the embodiments, without departing from the scope of the present invention, various modifications can be made thereto and the components therein can be replaced with equivalents. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention can be combined with each other in any manner. The description of these combinations is not exhaustive in this specification. Out of consideration of omission of space and saving resources. Therefore, the present invention is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

100:外殼 100: shell

110:下料機 110: Cutting machine

200:水箱 200: water tank

300:加工機 300: processing machine

310:頂板 310: top plate

311:觸控板 311: Touchpad

312:顯示螢幕 312: display screen

400:發振器 400: Vibrator

500:上料機 500: feeding machine

510:乾燥機 510: Dryer

520:真空吸附裝置 520: Vacuum adsorption device

Claims (2)

一種雷射製程設備,其係針對多層印刷電路板的雷射製程,包含外殼、水箱、加工機、發振器和上料機,其中該外殼的頂部藉由螺栓與該水箱的頂部固定連接,該外殼的前側壁藉由螺栓與該加工機的後側壁固定連接,該加工機的頂部藉由螺栓與該發振器的底部固定連接,該發振器的右側壁藉由螺栓與該上料機的左側壁固定連接,該外殼的前側壁藉由螺栓固定連接有下料機,該水箱位於該加工機與該發振器的左側,且該水箱位於該下料機的頂部,該加工機的頂部焊接有頂板,該頂板的頂部開設有凹槽,該凹槽的內腔鑲嵌有觸控板和顯示螢幕,該上料機的後側壁藉由螺栓固定連接有乾燥機,該乾燥機的頂部藉由螺栓固定連接有真空吸附裝置,其中,該發振器的內腔底部藉由螺栓固定連接有全反射鏡、空氣雷射介質板和部分反射鏡,該全反射鏡的安裝高度與該空氣雷射介質板和該部分反射鏡的安裝高度相同,該空氣雷射介質板的頂板和底板厚度相同,該空氣雷射介質板的中心點與該部分反射鏡的中心點在同一水平線上;印刷電路板放在該上料機上,加工時藉由該真空吸附裝置將該印刷電路板放於該加工機之加工平台上,利用該加工機進行雷射加工,在此過程中,利用該氣體雷射介質板配合該全反射鏡和該部分反射鏡進行雷射分散,於該加工機中完成雷射製程的該印刷電路板,經由該水箱冷卻,再由該下料機送出。 A laser process equipment, which is a laser process for a multilayer printed circuit board, includes a casing, a water tank, a processing machine, a vibrator and a feeder, wherein the top of the casing is fixedly connected with the top of the water tank by bolts, The front side wall of the housing is fixedly connected with the rear side wall of the processing machine by bolts, the top of the processing machine is fixedly connected with the bottom of the vibrator by bolts, and the right side wall of the vibrator is connected with the loading material by bolts. The left side wall of the machine is fixedly connected, and the front side wall of the housing is fixedly connected with a cutting machine by bolts. The water tank is located on the left side of the processing machine and the vibrator, and the water tank is located on the top of the cutting machine. The top of the loader is welded with a top plate, the top of the top plate is provided with a groove, and the cavity of the groove is inlaid with a touch panel and a display screen. The rear wall of the feeder is fixed with a dryer by bolts. The top is fixedly connected with a vacuum suction device by bolts, and the bottom of the cavity of the vibrator is fixedly connected with a total reflection mirror, an air laser dielectric plate and a partial reflection mirror by a bolt. The installation height of the total reflection mirror is equal to the The installation height of the air laser dielectric plate and the partial reflector is the same, the top plate and the bottom plate of the air laser medium plate have the same thickness, and the center point of the air laser medium plate is on the same horizontal line as the center point of the partial reflector; The printed circuit board is placed on the loading machine. During processing, the printed circuit board is placed on the processing platform of the processing machine by the vacuum suction device, and the processing machine is used for laser processing. In this process, the The gas laser medium plate cooperates with the total reflection mirror and the partial reflection mirror to perform laser dispersion. The printed circuit board that has completed the laser process in the processing machine is cooled by the water tank and then sent out by the cutting machine. 如申請專利範圍第1項所述之雷射製程設備,其中該水箱的後側壁預留有出水管口。 For the laser process equipment described in item 1 of the scope of patent application, a water outlet is reserved on the rear side wall of the water tank.
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JPH10328863A (en) * 1997-06-03 1998-12-15 Hitachi Seiko Ltd Laser beam machining device
JP2015032682A (en) * 2013-08-02 2015-02-16 住友重機械工業株式会社 Gas laser device, method for outputting pulse laser beam, and laser processing device
JP2015135929A (en) * 2014-01-20 2015-07-27 ウシオ電機株式会社 Desmear treatment method and desmear treatment device
TWI504470B (en) * 2008-10-07 2015-10-21 Disco Corp Laser processing method and laser processing device
JP2017191833A (en) * 2016-04-12 2017-10-19 ファナック株式会社 Laser device capable of using small-sized chiller

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10328863A (en) * 1997-06-03 1998-12-15 Hitachi Seiko Ltd Laser beam machining device
TWI504470B (en) * 2008-10-07 2015-10-21 Disco Corp Laser processing method and laser processing device
JP2015032682A (en) * 2013-08-02 2015-02-16 住友重機械工業株式会社 Gas laser device, method for outputting pulse laser beam, and laser processing device
JP2015135929A (en) * 2014-01-20 2015-07-27 ウシオ電機株式会社 Desmear treatment method and desmear treatment device
JP2017191833A (en) * 2016-04-12 2017-10-19 ファナック株式会社 Laser device capable of using small-sized chiller

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