TWI744916B - Wafer transport device - Google Patents

Wafer transport device Download PDF

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TWI744916B
TWI744916B TW109117638A TW109117638A TWI744916B TW I744916 B TWI744916 B TW I744916B TW 109117638 A TW109117638 A TW 109117638A TW 109117638 A TW109117638 A TW 109117638A TW I744916 B TWI744916 B TW I744916B
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Taiwan
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silicon wafer
vacuum
manipulators
transfer
silicon
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TW109117638A
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Chinese (zh)
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TW202135213A (en
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夏世偉
炯 陳
俊華 洪
傑夫 貝克
張長勇
王占柱
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大陸商上海臨港凱世通半導體有限公司
大陸商上海凱世通半導體股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
    • B25J9/0087—Dual arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • H—ELECTRICITY
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    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

一種矽片輸運裝置，包括兩個預抽真空裝置和真空輸運裝置。真空輸運裝置在真空狀態下在預抽真空裝置和工藝處理裝置間傳輸矽片。真空輸運裝置包括：真空輸運腔室、兩個搬運機器人和中轉台。搬運機器人具有兩個可獨立動作的機械手，藉由兩個機械手的有序配合，可對同一工位執行矽片交換。當一個搬運機器人在預抽真空裝置和過渡中轉台之間傳輸矽片時，另一個搬運機器人在中轉台和工藝處理裝置之間傳輸矽片。由於使用可獨立動作的機械手的機器人對同一工位進行矽片交換的技術，結合多自由度的機械手，使得矽片傳輸可高速進行，提高整體的產能。A silicon wafer transport device includes two pre-vacuum devices and a vacuum transport device. The vacuum transport device transports silicon wafers between the pre-vacuum device and the process processing device in a vacuum state. The vacuum transport device includes: a vacuum transport chamber, two handling robots and a transfer platform. The handling robot has two manipulators that can move independently, and through the orderly cooperation of the two manipulators, silicon wafer exchange can be performed on the same station. When one transfer robot transfers silicon wafers between the pre-vacuum device and the transition transfer table, another transfer robot transfers the silicon wafers between the transfer platform and the process processing device. Due to the technology of using robots that can move independently to exchange silicon wafers at the same station, combined with multi-degree-of-freedom robots, silicon wafer transmission can be carried out at high speed and overall productivity can be improved.

Description

矽片輸運裝置Wafer transport device

本發明關於一種輸運裝置，特別關於一種用於需要在大氣側和真空側之間對矽片進行輸運的真空設備的矽片輸運裝置。The present invention relates to a transport device, in particular to a silicon wafer transport device used in vacuum equipment that needs to transport silicon wafers between the atmosphere side and the vacuum side.

在半導體產業中，需要使用各種類型的工藝設備，幾乎所有工藝設備都需要配置矽片傳輸裝置。隨著半導體產業的發展及其規模的不斷擴大，對工藝設備的產能要求不斷提高。鑒於工藝設備技術的進步，工藝處理能力得到了很大提升，從而使矽片輸運過程日漸成為產能提升的瓶頸。為了滿足半導體設備對產能提升的需求，開發高效率的矽片傳輸系統已迫在眉睫。由於在很多半導體加工設備中，被加工的矽片在加工過程（例如離子注入）中處於真空狀態，而在一些其他過程（例如不同加工設備之間的搬運過程）中處於大氣狀態，因而抽真空和破真空的工序對整個製程的加工效率有著一定的影響。In the semiconductor industry, various types of process equipment need to be used, and almost all process equipment needs to be equipped with silicon wafer transfer devices. With the development of the semiconductor industry and the continuous expansion of its scale, the requirements for the production capacity of process equipment continue to increase. In view of the advancement of process equipment technology, the process capacity has been greatly improved, so that the wafer transportation process has gradually become the bottleneck of the increase in production capacity. In order to meet the demand for increased production capacity of semiconductor equipment, the development of high-efficiency silicon wafer transmission systems is urgently needed. Because in many semiconductor processing equipment, the processed silicon wafer is in a vacuum state during the processing (such as ion implantation), and in some other processes (such as the handling process between different processing equipment) in an atmospheric state, so vacuum The process of breaking the vacuum has a certain influence on the processing efficiency of the whole process.

傳統的矽片傳輸系統，矽片輸運循環時間較長，設備產能受到矽片輸運效率的限制。US5486080中公開了幾種真空處理中工件的高速移動方式（參見其圖2和圖3），一種方式為：採用一種矽片輸運裝置，該裝置主要由兩個預抽真空裝置（Loadlock）和兩個機械手構成。該裝置的兩個預抽真空裝置同時作業：在兩個預抽真空裝置都被充氣至大氣壓後，將待處理的矽片放入其中，然後對兩個預抽真空裝置同時抽真空，達到設定的真空度後，由兩個機械手輪流將兩個預抽真空裝置中的矽片逐個取出傳送至工藝平台進行工藝處理，完成工藝處理後的矽片再傳回預抽真空裝置。兩個機械手分別對應於兩個預抽真空裝置。在矽片進行工藝處理的週期內，一個機械手將上次處理完成的矽片傳回至對應的預抽真空裝置，再從該預抽真空裝置中取出下一片向工藝裝置運動；同時，另一個機械手在工藝裝置附近等待，準備接受當前正在進行工藝處理的矽片。兩個機械手按照這樣的運行時序，輪流作業，直至兩個預抽真空裝置中的所有矽片全部處理完成。這樣一種矽片輸運裝置，在兩個預抽真空裝置進行充氣（破真空）和抽真空的時候，工藝處理裝置完全處於等候狀態，浪費了寶貴的工藝處理時間。由於預抽真空裝置進行充氣/抽真空的過程需要很長時間，導致無法提高矽片輸送效率，因而這種矽片輸運裝置產能很低。The traditional silicon wafer transport system has a long wafer transport cycle time, and the equipment capacity is limited by the wafer transport efficiency. US5486080 discloses several methods of high-speed movement of workpieces in vacuum processing (see Figure 2 and Figure 3). One method is: a silicon wafer transport device is used, which is mainly composed of two pre-vacuum devices (Loadlock) and Two manipulators constitute. The two pre-evacuating devices of the device work at the same time: After the two pre-evacuating devices are inflated to atmospheric pressure, put the silicon wafer to be processed into it, and then simultaneously evacuate the two pre-evacuating devices to reach the setting After the degree of vacuum is reached, two robots take turns to take out the silicon wafers in the two pre-vacuum devices one by one and transfer them to the process platform for process processing. After the process is completed, the silicon wafers are returned to the pre-vacuum device. The two manipulators correspond to two pre-vacuum devices respectively. During the wafer processing cycle, a manipulator transfers the wafer processed last time to the corresponding pre-evacuation device, and then removes the next wafer from the pre-evacuation device to move to the processing device; at the same time, another A manipulator waits near the process unit, ready to accept the silicon wafer currently being processed. The two manipulators work in turn according to this operating sequence until all the silicon wafers in the two pre-vacuum devices are completely processed. In such a silicon wafer transport device, when the two pre-evacuating devices are inflating (vacuum breaking) and evacuating, the process processing device is completely in a waiting state, which wastes valuable process processing time. Since the pre-evacuation device requires a long time to perform the charging/vacuuming process, the wafer conveying efficiency cannot be improved, so the production capacity of the silicon wafer conveying device is very low.

藉由改進，US5486080提出一種設有過渡承片機構的矽片輸運裝置，主要由兩個預抽真空裝置，兩個搬運機器人，一個中轉台構成。不同於上述裝置之處在於：兩個預抽真空裝置並非同時工作而是輪流工作，當對其中一個預抽真空裝置中的矽片進行工藝處理的過程中，另一個預抽真空裝置進行充氣-矽片卸載和重新裝載-抽真空的操作。這樣，對預抽真空裝置進行充氣-矽片卸載和重新裝載-抽真空的操作時間與工藝處理時間重疊，在很大程度上提高了矽片傳輸效率。在真空側，兩個搬運機器人聯合作業，執行將矽片從預抽真空裝置取出-放到中轉台進行對準操作-傳送到工藝處理腔室（process chamber）中的承片台-工藝處理完成後取回到預抽真空裝置中。該系統中，每個搬運機器人配置一個終端執行器，每次操作只能完成一個取片或放片的功能，每次取片或放片的過程都要執行終端執行器伸出-抬起或放下-縮回-回旋等一系列操作到下一個目標位置的步驟。終端執行器上一般不配置機械卡扣或靜電吸盤固定矽片，僅僅依靠摩擦力保持矽片。為了防止矽片滑移，機械手的運動加速度不能過大，每次取片或放片的過程都需要耗費較長時間。因此，這種傳送機構的產能在一定程度上也受到了限制。By improvement, US5486080 proposes a silicon wafer transport device with a transition carrier mechanism, which is mainly composed of two pre-vacuum devices, two handling robots, and a turntable. The difference from the above device is that the two pre-evacuation devices do not work at the same time but work in turn. When the silicon wafer in one of the pre-evacuation devices is processed, the other pre-evacuation device is inflated- Wafer unloading and reloading-vacuum operation. In this way, the operation time of charging the pre-vacuum device-unloading the silicon wafer and reloading-vacuuming overlaps with the processing time, which greatly improves the transmission efficiency of the silicon wafer. On the vacuum side, two handling robots work together to take out the silicon wafer from the pre-vacuum device-put it on the transfer table for alignment operation-transfer to the wafer table in the process chamber-the process is completed Then take it back to the pre-vacuum device. In this system, each handling robot is equipped with a terminal actuator, and each operation can only complete one function of fetching or placing a film. Each time the process of fetching or placing a film, the terminal actuator must be extended-lifted or A series of operations such as lowering-retracting-turning to the next target position. The end effector is generally not equipped with mechanical buckles or electrostatic chuck to fix the silicon wafer, only relying on friction to maintain the silicon wafer. In order to prevent the silicon wafer from slipping, the movement acceleration of the manipulator should not be too large, and each process of picking up or placing the wafer takes a long time. Therefore, the production capacity of this conveying mechanism is also limited to a certain extent.

本發明要解決的技術問題是為了克服先前技術中半導體加工設備中的矽片輸運過程由於搬運機器人執行取片或放片的時間過長、使得產能難以提高的缺陷，提供一種矽片傳輸效率較高的矽片輸運裝置。The technical problem to be solved by the present invention is to overcome the defect that the transfer robot in the semiconductor processing equipment in the prior art takes too long time to take or release the wafers, which makes it difficult to increase the productivity, and provides a silicon wafer transmission efficiency Higher wafer transport device.

本發明是藉由下述技術方案來解決上述技術問題的： 一種矽片輸運裝置，其特點在於，其包括兩個預抽真空裝置和真空輸運裝置，其中， 每個預抽真空裝置用於在大氣狀態和真空狀態下切換，每個預抽真空裝置用於承載至少一片矽片； 所述真空輸運裝置用於在真空狀態下在每個預抽真空裝置和用於處理矽片的工藝處理裝置之間傳輸矽片，所述真空輸運裝置包括：真空輸運腔室、位於所述真空輸運腔室中的兩個搬運機器人和用於承載矽片的中轉台。所述兩個搬運機器人中，每個搬運機器人有兩個可以獨立動作的機械手，藉由一個搬運機器人中的所述兩個機械手的有序配合，使用一個所述機器人可以對同一個工位執行矽片交換的操作。其中，兩個搬運機器人中的一個搬運機器人用於在每個預抽真空裝置和所述中轉台之間傳輸矽片，兩個搬運機器人中的另一個搬運機器人用於在所述中轉台和所述工藝處理裝置之間傳輸矽片。 The present invention solves the above technical problems through the following technical solutions: A silicon wafer transport device, which is characterized in that it includes two pre-vacuum devices and a vacuum transport device, among which, Each pre-evacuating device is used to switch between the atmospheric state and the vacuum state, and each pre-evacuating device is used to carry at least one silicon wafer; The vacuum transport device is used to transport silicon wafers between each pre-vacuum device and the process processing device for processing the silicon wafers in a vacuum state, and the vacuum transport device includes: a vacuum transport chamber, Two handling robots in the vacuum transport chamber and a transfer platform for carrying silicon wafers. Among the two handling robots, each handling robot has two manipulators that can act independently. By the orderly cooperation of the two manipulators in one handling robot, the same robot can be used for the same work. Bits perform silicon swap operations. Among them, one of the two handling robots is used to transfer silicon wafers between each pre-vacuum device and the transfer table, and the other of the two handling robots is used to transfer the silicon wafer between the transfer table and the transfer table. The silicon wafers are transferred between the process processing devices.

較佳地，每個搬運機器人包括兩個用於持有矽片的機械手，所述兩個機械手在垂直於矽片傳輸平面的方向上間隔佈置，每個機械手在矽片傳輸平面中是可旋轉的。同一搬運機器人的兩個機械手，可以同時旋轉，也可以在不同時刻旋轉。Preferably, each handling robot includes two manipulators for holding silicon wafers, the two manipulators are arranged at intervals in a direction perpendicular to the silicon wafer transfer plane, and each manipulator is in the silicon wafer transfer plane. It is rotatable. The two manipulators of the same handling robot can rotate at the same time or at different times.

較佳地，每個機械手在垂直於矽片傳輸平面的方向上是可升降的。同一搬運機器人的兩個機械手，可以同時升降，也可以在不同時刻分別升降。Preferably, each manipulator is liftable in a direction perpendicular to the wafer transfer plane. The two manipulators of the same handling robot can be raised and lowered at the same time or separately at different times.

較佳地，每個機械手在矽片傳輸平面中可線性伸縮。同一搬運機器人的兩個機械手，可以同時伸出/縮回，或者其中一個伸出同時另一個縮回。Preferably, each manipulator is linearly stretchable in the silicon wafer transmission plane. The two manipulators of the same handling robot can be extended/retracted at the same time, or one of them can be extended and the other can be retracted.

並且，同一搬運機器人的兩個機械手可以同時持有矽片，也可以均不持有矽片，或者一個持有矽片另一個不持有矽片。In addition, the two manipulators of the same handling robot can hold silicon wafers at the same time, or both can hold silicon wafers, or one holds silicon wafers and the other does not hold silicon wafers.

也就是說，每個機器人中配置兩個機械手，所述兩個機械手上下佈置。所述搬運機器人配置4個運動軸，其中第一軸和第二軸分別用於所述兩個機械手的伸縮，第三軸用於帶動所述兩個機械手做上下運動，第四軸用於帶動所述兩個機械手做旋轉運動。所述兩個機械手可以獨立操作。所述兩個機械手可以同時伸出，或同時縮回，或一個伸出另一個縮回。所述兩個機械手，每個可以攜帶一個矽片。當所述兩個機械手都縮回時，所述機器人的第四軸可以進行旋轉運動。所述同一個搬運機器人的兩個機械手可以對一個工位執行矽片交換操作。That is, each robot is equipped with two manipulators, and the two manipulators are arranged up and down. The handling robot is equipped with 4 motion axes, of which the first axis and the second axis are respectively used for the expansion and contraction of the two manipulators, the third axis is used for driving the two manipulators to move up and down, and the fourth axis is used for To drive the two manipulators to make a rotary motion. The two manipulators can be operated independently. The two manipulators can be extended at the same time, or retracted at the same time, or one extended and the other retracted. Each of the two manipulators can carry a silicon wafer. When the two manipulators are retracted, the fourth axis of the robot can perform a rotational movement. The two manipulators of the same handling robot can perform silicon wafer exchange operations on one station.

較佳地，在從所述中轉台和/或所述工藝處理裝置中取走和/或放入的一個操作循環中，同一個搬運機器人的兩個機械手中的一個機械手持有矽片，同一個搬運機器人的兩個機械手中的另一個機械手不持有矽片。進一步地，同一個搬運機器人中的兩個所述機械手，用最短的時間對目標承片裝置（可以是真空輸運腔室中的中轉台，也可以是工藝處理裝置中的承片台）完成矽片的交換。所述的矽片交換過程按下述步驟執行。交換之前，其中一個機械手攜帶矽片，另一個機械手不攜帶矽片。所述不攜帶矽片的機械手先伸出拾起所述承片裝置上的矽片後縮回，在該機械手縮回的同時所述攜帶矽片的機械手伸出將其攜帶的矽片放到所述承片裝置上。對一個承片裝置完成矽片交換後，所述機械手旋轉到下一個目標承片裝置，執行相同的矽片交換任務。Preferably, in one operation cycle of removing and/or putting in the transfer table and/or the process processing device, one of the two manipulators of the same handling robot holds the silicon wafer in its hand. The other manipulator of the two manipulators of a handling robot does not hold silicon wafers. Further, the two manipulators in the same handling robot use the shortest time to target the target sheet device (which can be the transfer table in the vacuum transport chamber or the sheet table in the process processing device) Complete the exchange of silicon wafers. The described silicon wafer exchange process is executed according to the following steps. Before the exchange, one of the manipulators carried silicon wafers, and the other manipulator did not carry silicon wafers. The manipulator that does not carry the silicon wafer first stretches out to pick up the silicon wafer on the wafer carrier device and then retracts, while the manipulator retracts, the manipulator that carries the silicon wafer stretches out the silicon wafer that it carries Put it on the carrier device. After completing the wafer exchange for one wafer device, the manipulator rotates to the next target wafer device to perform the same wafer exchange task.

具體來說，在矽片交換操作中，在矽片交換之前，其中第一個機械手不攜帶矽片，第二個機械手攜帶矽片，所述矽片交換操作將按照下述步驟執行：所述第一個機械手先伸出，然後，所述第三軸上升使所述工位上的矽片轉移到該所述第一個機械手上，然後，該所述第一個機械手攜帶矽片縮回，同時，所述第二個機械手伸出，然後，所述第三軸下降使該所述第二個機械手上的矽片轉移到所述工位上，然後，該所述第二個機械手不攜帶矽片縮回，最後，完成所述交換作業後，所述第一個機械手攜帶矽片，所述第二個機械手不攜帶矽片。再然後，當所述兩個機械手都縮回後，所述第四軸旋轉，和/或所述第三軸升降，使所述機器人指向另一個目標工位元對其進行矽片交換。Specifically, in the wafer exchange operation, before the wafer exchange, the first manipulator does not carry the silicon wafer, and the second manipulator carries the silicon wafer. The silicon wafer exchange operation will be performed according to the following steps: The first manipulator extends first, and then the third axis rises to transfer the silicon wafer on the station to the first manipulator, and then the first manipulator carries The silicon wafer is retracted, and at the same time, the second manipulator is extended. Then, the third shaft is lowered so that the silicon wafer on the second manipulator is transferred to the station. The second manipulator retracts without carrying the silicon wafer. Finally, after the exchange operation is completed, the first manipulator carries the silicon wafer, and the second manipulator does not carry the silicon wafer. Then, when the two manipulators are retracted, the fourth axis rotates, and/or the third axis rises and falls, so that the robot points to another target station for silicon wafer exchange.

較佳地，兩個預抽真空裝置中的一個預抽真空裝置中的矽片被逐一傳輸至所述工藝處理裝置中處理時，兩個預抽真空裝置中的另一個預抽真空裝置處於抽真空或者破真空或者在大氣環境下移除或裝入矽片。Preferably, when the silicon wafers in one of the two pre-evacuating devices are transferred to the process processing device one by one for processing, the other of the two pre-evacuating devices is in the process of evacuation. Vacuum or break the vacuum or remove or load the silicon wafer in an atmospheric environment.

較佳地，所述中轉台除了用於在矽片輸運路徑的中途存放矽片，還用於矽片中心的定位和/或矽片方向的對準，或其他輔助操作。Preferably, the transfer table is used for not only storing silicon wafers in the middle of the wafer transport path, but also for positioning the center of the silicon wafer and/or aligning the direction of the silicon wafer, or other auxiliary operations.

較佳地，每個預抽真空裝置中設置有用於承載至少一片矽片的晶片盒。Preferably, each pre-evacuating device is provided with a wafer cassette for carrying at least one silicon wafer.

在符合本領域常識的基礎上，上述各較佳條件，可任意組合，即得本發明各較佳實例。On the basis of conforming to common knowledge in the field, the above-mentioned preferred conditions can be combined arbitrarily to obtain preferred embodiments of the present invention.

本發明的積極進步效果在於：藉由對兩個搬運機器人功能的劃分，結合以具有多自由度的兩個機械手，使得矽片在預抽真空裝置和中轉台之間以及中轉台和工藝處理裝置之間的傳輸可以有序交替進行，從而減少無效等待時間，提高整體的產能。The positive progress effect of the present invention is that by dividing the functions of the two handling robots and combining the two manipulators with multiple degrees of freedom, the silicon wafers can be processed between the pre-vacuum device and the transfer table, as well as the transfer table and the process. The transmission between the devices can be performed alternately in an orderly manner, thereby reducing invalid waiting time and improving overall production capacity.

下面藉由實施例的方式進一步說明本發明，但並不因此將本發明限制在所述的實施例範圍之中。Hereinafter, the present invention will be further described by way of examples, but the present invention is not limited to the scope of the described examples.

下面參考圖1至圖5，以一具體實施例，進一步闡述本發明的技術方案。該矽片輸運裝置，包括兩個預抽真空裝置11和12以及真空輸運裝置，其中， 每個預抽真空裝置11、12用於在大氣狀態和真空狀態下切換，每個預抽真空裝置用於承載至少一片矽片100； 所述真空輸運裝置用於在真空狀態下在每個預抽真空裝置和用於處理矽片的工藝處理裝置（未示出）之間傳輸矽片100，所述真空輸運裝置包括：真空輸運腔室2、位於所述真空輸運腔室2中的兩個搬運機器人（分別以3和4標記）和用於承載矽片的中轉台5，其中，兩個搬運機器人中的一個搬運機器人3用於在每個預抽真空裝置和所述中轉台5之間傳輸矽片，兩個搬運機器人中的另一個搬運機器人4用於在所述中轉台5和所述工藝處理裝置之間傳輸矽片。所述兩個搬運機器人中，每個搬運機器人有兩個可以獨立動作的機械手，藉由一個搬運機器人中的所述兩個機械手的有序配合，使用一個所述機器人可以對同一個工位執行矽片交換的操作。 The technical solution of the present invention will be further described with a specific embodiment with reference to FIGS. 1 to 5 below. The wafer transport device includes two pre-evacuation devices 11 and 12 and a vacuum transport device, among which, Each pre-evacuating device 11, 12 is used to switch between the atmospheric state and the vacuum state, and each pre-evacuating device is used to carry at least one silicon wafer 100; The vacuum transport device is used to transport the silicon wafer 100 between each pre-vacuum device and a process device (not shown) for processing the silicon wafer in a vacuum state, and the vacuum transport device includes: a vacuum The transport chamber 2, the two handling robots (labeled 3 and 4, respectively) located in the vacuum transport chamber 2 and the turntable 5 for carrying silicon wafers, wherein one of the two handling robots transports The robot 3 is used to transfer silicon wafers between each pre-vacuum device and the transfer table 5, and the other transfer robot 4 of the two transfer robots is used to transfer the silicon wafer between the transfer table 5 and the process processing device. Transmission silicon. Among the two handling robots, each handling robot has two manipulators that can act independently. By the orderly cooperation of the two manipulators in one handling robot, the same robot can be used for the same work. Bits perform silicon swap operations.

結合圖3至圖5，每個搬運機器人3和4包括兩個用於持有矽片的機械手（分別以31、32和41、42標記），所述兩個機械手在垂直於矽片傳輸平面（矽片傳輸平面為圖1的紙面）的方向上間隔佈置，每個機械手在矽片傳輸平面中是可旋轉的。同一搬運機器人的兩個機械手，可以同時旋轉，也可以在不同時刻旋轉。With reference to Figures 3 to 5, each handling robot 3 and 4 includes two manipulators for holding silicon wafers (labeled 31, 32 and 41, 42 respectively), and the two manipulators are perpendicular to the silicon wafer. The transfer plane (the silicon wafer transfer plane is the paper surface of Figure 1) is arranged at intervals, and each manipulator is rotatable in the silicon wafer transfer plane. The two manipulators of the same handling robot can rotate at the same time or at different times.

其中，每個機械手在垂直於矽片傳輸平面的方向上是可升降的。同一搬運機器人的兩個機械手，可以同時升降，也可以在不同時刻分別升降。而且，每個機械手在矽片傳輸平面中可線性伸縮。同一搬運機器人的兩個機械手，可以同時伸出/縮回，或者其中一個伸出同時另一個縮回。Among them, each manipulator can be raised and lowered in the direction perpendicular to the wafer transmission plane. The two manipulators of the same handling robot can be raised and lowered at the same time or separately at different times. Moreover, each manipulator can linearly expand and contract in the wafer transmission plane. The two manipulators of the same handling robot can be extended/retracted at the same time, or one of them can be extended and the other can be retracted.

並且，同一搬運機器人的兩個機械手可以同時持有矽片，也可以均不持有矽片（如圖3所示），或者一個持有矽片另一個不持有矽片（如圖4和圖5所示）。In addition, the two manipulators of the same handling robot can hold silicon wafers at the same time, or both can hold silicon wafers (as shown in Figure 3), or one holds silicon wafers and the other does not hold silicon wafers (Figure 4). And shown in Figure 5).

除此之外，所述中轉台5除了用於在矽片輸運路徑的中途存放矽片，還用於矽片中心的定位和/或矽片方向的對準。In addition, the transfer table 5 is not only used for storing silicon wafers in the middle of the wafer transport path, but also used for positioning the center of the silicon wafer and/or aligning the direction of the silicon wafer.

在本實施例中，每個預抽真空裝置中設置有用於承載至少一片矽片的晶片盒（cassette），所述晶片盒可以在垂直矽片傳輸平面的方向上升降，從而實現待處理矽片的取出和處理完的矽片的放入。每個預抽真空裝置與所述真空輸運裝置之間設置有傳送閥門，藉由所述傳送閥門矽片可以被傳輸。此外，每個預抽真空裝置還配備有抽真空設備和破真空設備，使得每個預抽真空裝置可以在真空狀態和大氣狀態之間切換。In this embodiment, each pre-evacuating device is provided with a cassette for carrying at least one silicon wafer, and the wafer cassette can be raised and lowered in a direction perpendicular to the wafer transfer plane, thereby realizing the wafer to be processed Take out and put in the processed silicon wafer. A transfer valve is arranged between each pre-vacuum device and the vacuum conveying device, through which the silicon wafer can be transferred. In addition, each pre-evacuating device is also equipped with a vacuuming device and a vacuum breaking device, so that each pre-evacuating device can be switched between a vacuum state and an atmospheric state.

真空輸運腔室也設置有連接工藝處理裝置的連接部，供矽片傳輸已在工藝處理裝置中完成工藝操作（例如離子注入、沉積等）。The vacuum transport chamber is also provided with a connection part connected to the process processing device for the transfer of silicon wafers and the process operations (such as ion implantation, deposition, etc.) have been completed in the process processing device.

特別地，在從所述中轉台和/或所述工藝處理裝置中取走和/或放入的一個操作循環中，同一個搬運機器人的兩個機械手中的一個機械手持有矽片，同一個搬運機器人的兩個機械手中的另一個機械手不持有矽片。進一步地，同一個搬運機器人中的兩個所述機械手，用最短的時間對目標承片裝置（可以是真空輸運腔室中的中轉台，也可以是工藝處理裝置中的承片台）完成矽片的交換。所述的矽片交換過程按下述步驟執行。具體來說，以圖4和圖5為例，交換之前，其中一個機械手41攜帶未經處理的矽片（以100a表示），另一個機械手42不攜帶矽片。所述不攜帶矽片的機械手先伸出拾起例如放置在所述中轉台上的處理完成的矽片（以100b表示）後縮回，在該機械手縮回的同時所述攜帶矽片的機械手41伸出將其攜帶的矽片100a放到所述中轉台上。對一個承片裝置（可以是中轉台5，也可以是工藝處理裝置中的承片台）完成矽片交換後，所述機械手旋轉到下一個目標承片裝置，執行相同的矽片交換任務，如此往復，直至所有矽片被處理完成並送入相應的預抽真空裝置。上述所述的一個取走/放入操作循環，兩個所述機械手可以並行作業，消除了各分部動作之間的等待過程，從而縮短了整個操作循環的時間，因此達到高產能的目的。In particular, in one operation cycle of removing and/or putting in the transfer table and/or the process processing device, one of the two manipulators of the same handling robot holds the silicon wafer, and the same The other manipulator of the two manipulators carrying the robot does not hold the silicon wafer. Further, the two manipulators in the same handling robot use the shortest time to target the target sheet device (which can be the transfer table in the vacuum transport chamber or the sheet table in the process processing device) Complete the exchange of silicon wafers. The described silicon wafer exchange process is executed according to the following steps. Specifically, taking FIGS. 4 and 5 as an example, before the exchange, one of the manipulators 41 carries unprocessed silicon wafers (indicated by 100a), and the other manipulator 42 does not carry the silicon wafers. The manipulator that does not carry the silicon wafer first stretches out to pick up, for example, the processed silicon wafer (indicated by 100b) placed on the transfer platform and then retracts. When the manipulator is retracted, the manipulator that carries the silicon wafer is retracted. The manipulator 41 extends and places the silicon wafer 100a carried by it on the transfer platform. After completing the wafer exchange for a wafer device (which can be the turntable 5 or the wafer stage in the process device), the manipulator rotates to the next target wafer device to perform the same wafer exchange task , So reciprocating, until all silicon wafers are processed and sent to the corresponding pre-vacuum device. The above-mentioned one take-out/put-in operation cycle, the two manipulators can work in parallel, eliminating the waiting process between each sub-action, thus shortening the entire operation cycle time, so as to achieve the goal of high productivity .

在本發明的技術方案中，兩個預抽真空裝置中的一個預抽真空裝置中的矽片被逐一傳輸至所述工藝處理裝置中處理時，兩個預抽真空裝置中的另一個預抽真空裝置處於抽真空或者破真空。即所述兩個預抽真空裝置輪流作業，當一個預抽真空裝置的矽片在逐一進行矽片的工藝處理期間，另一個預抽真空裝置執行充氣-卸載矽片-裝載新的矽片-抽真空的作業。In the technical solution of the present invention, when the silicon wafers in one of the two pre-evacuating devices are transferred to the process processing device one by one, the other of the two pre-evacuating devices is pre-evacuated. The vacuum device is in the process of vacuuming or breaking the vacuum. That is to say, the two pre-evacuating devices operate in turn. When the silicon wafers of one pre-evacuating device are processing the wafers one by one, the other pre-evacuating device performs charging-unloading the silicon wafer-loading a new silicon wafer- Vacuum operation.

在本發明中，所述兩個預抽真空裝置輪流作業。當一個預抽真空裝置中的矽片逐一被所述搬運機器人運送至所述工藝處理裝置中進行工藝處理時，另一個預抽真空裝置執行充氣至大氣壓-卸載矽片-裝載新矽片-抽氣至設定真空度。在這種工作機制下，預抽真空裝置的處理時間與工藝處理時間重疊，從而不在成為限制產能的因素。並且其中第一個所述機器人專門用於將矽片在所述兩個預抽真空裝置與所述中轉台之間進行矽片搬運，第二個所述機器人專門用於在所述中轉台與所述工藝處理裝置之間進行矽片搬運。這樣一種工作機制，使得所述兩個搬運機器人具有幾乎相等的操作時間，因而不會存在相互等待的時間，從而使所述兩個搬運機器人均能發揮各自最大的作業能力。In the present invention, the two pre-vacuum devices operate in turn. When the silicon wafers in one pre-evacuating device are transported by the handling robot to the process processing device one by one for processing, another pre-evacuating device performs inflation to atmospheric pressure-unloading silicon wafers-loading new silicon wafers-pumping Air to the set vacuum. Under this working mechanism, the processing time of the pre-vacuum device overlaps with the process processing time, so that it is no longer a factor that limits productivity. And the first one of the robots is specifically used to transport silicon wafers between the two pre-vacuum devices and the transfer table, and the second robot is specifically used to transport the silicon wafers between the two pre-vacuum devices and the transfer table. The silicon wafers are transported between the process processing devices. Such a working mechanism enables the two handling robots to have almost the same operating time, so there is no waiting time for each other, so that the two handling robots can both exert their respective maximum operating capabilities.

雖然以上描述了本發明的具體實施方式，但是本領域的技術人員應當理解，這些僅是舉例說明，本發明的保護範圍是由所附申請專利範圍限定的。本領域的技術人員在不背離本發明的原理和實質的前提下，可以對這些實施方式做出多種變更或修改，但這些變更和修改均落入本發明的保護範圍。Although the specific embodiments of the present invention are described above, those skilled in the art should understand that these are only examples, and the scope of protection of the present invention is defined by the scope of the attached patent application. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principle and essence of the present invention, but these changes and modifications all fall within the protection scope of the present invention.

2                                  真空輸運腔室 3、4                             搬運機器人 5                                  中轉台 11、12                          預抽真空裝置 31、32、41、42          機械手 100、100a、100b        矽片 2 Vacuum transport chamber 3. 4 Handling robot 5 Transit station 11.12 Pre-vacuum device 31, 32, 41, 42 Robot 100, 100a, 100b Silicon wafer

圖1為本發明一實施例的矽片輸運裝置的俯視圖。FIG. 1 is a top view of a silicon wafer transport device according to an embodiment of the invention.

圖2為本發明一實施例的矽片輸運裝置的立體圖。2 is a perspective view of a silicon wafer transport device according to an embodiment of the invention.

圖3為本發明一實施例的不持有矽片的搬運機器人的示意圖。FIG. 3 is a schematic diagram of a handling robot without silicon wafers according to an embodiment of the present invention.

圖4為本發明一實施例的搬運機器人在進行矽片交換器的示意圖。FIG. 4 is a schematic diagram of the handling robot in an embodiment of the present invention performing a wafer changer.

圖5為本發明一實施例的搬運機器人完成矽片交換後的示意圖。FIG. 5 is a schematic diagram of the handling robot after completing the silicon wafer exchange according to an embodiment of the present invention.

2              真空輸運腔室 3、      4         搬運機器人 5              中轉台 11、12          預抽真空裝置 2 Vacuum transport chamber 3. 4 Handling robots 5 Transfer station 11.12 Pre-vacuum device

Claims (8)

一種矽片輸運裝置，其包括兩個預抽真空裝置和真空輸運裝置，其中，每個所述預抽真空裝置用於在大氣狀態和真空狀態下切換，每個所述預抽真空裝置用於承載至少一片矽片；所述真空輸運裝置用於在真空狀態下在每個所述預抽真空裝置和用於處理矽片的工藝處理裝置之間傳輸矽片，所述真空輸運裝置包括：真空輸運腔室、位於所述真空輸運腔室中的兩個搬運機器人和位於所述真空輸運腔室中用於承載矽片的中轉台；兩個所述搬運機器人中，每個所述搬運機器人有兩個可以獨立動作的機械手，每個所述搬運機器人用於對同一個工位執行矽片交換的操作；當兩個所述搬運機器人中的一個搬運機器人用於在所述預抽真空裝置和所述中轉台之間傳輸矽片的時候，兩個所述搬運機器人中的另一個搬運機器人用於在所述中轉台和所述工藝處理裝置之間傳輸矽片；每個所述搬運機器人包括兩個用於持有矽片的機械手，兩個所述機械手在垂直於矽片傳輸平面的方向上間隔佈置，每個所述機械手在矽片傳輸平面中是可旋轉的；每個所述搬運機器人的兩個所述機械手在垂直於矽片傳輸平面的方向上各自分別升降。 A silicon wafer transport device, which includes two pre-evacuation devices and a vacuum transport device, wherein each of the pre-evacuation devices is used to switch between an atmospheric state and a vacuum state, and each of the pre-evacuation devices Used to carry at least one silicon wafer; the vacuum transport device is used to transport the silicon wafer between each of the pre-vacuum devices and the processing device for processing the silicon wafers in a vacuum state, and the vacuum transport The device includes: a vacuum transport chamber, two transport robots located in the vacuum transport chamber, and a turntable for carrying silicon wafers in the vacuum transport chamber; among the two transport robots, Each of the handling robots has two manipulators that can act independently, and each of the handling robots is used to perform wafer exchange operations on the same station; when one of the two handling robots is used for When transferring silicon wafers between the pre-vacuum device and the transfer platform, the other transfer robot of the two transfer robots is used to transfer the silicon wafers between the transfer platform and the process processing device ; Each of the handling robots includes two manipulators for holding silicon wafers, the two manipulators are arranged at intervals in a direction perpendicular to the silicon wafer transmission plane, and each of the manipulators is in the silicon wafer transmission plane The middle is rotatable; the two manipulators of each handling robot are lifted and lowered respectively in a direction perpendicular to the silicon wafer transmission plane. 如請求項1所述之矽片輸運裝置，其中，每個所述搬運機器人的兩個所述機械手在矽片傳輸平面中可以一起旋轉，或者每個所述搬運機器人的兩個所述機械手在矽片傳輸平面中可單獨旋轉。 The silicon wafer transport device according to claim 1, wherein the two manipulators of each transfer robot can rotate together in the silicon wafer transfer plane, or the two manipulators of each transfer robot The manipulator can rotate independently in the wafer transfer plane. 如請求項1所述之矽片輸運裝置，其中，每個所述搬運機器人的兩個所述機械手在垂直於矽片傳輸平面的方向上是可一起升降的。 The silicon wafer transport device according to claim 1, wherein the two manipulators of each of the handling robots can be raised and lowered together in a direction perpendicular to the wafer transport plane. 如請求項1所述之矽片輸運裝置，其中，每個所述機械手在 矽片傳輸平面中可線性伸縮。 The silicon wafer transport device according to claim 1, wherein each of the robots is The silicon wafer transmission plane can be linearly expanded and contracted. 如請求項4所述之矽片輸運裝置，其中，在從所述中轉台和/或所述工藝處理裝置中取走和/或放入的一個操作循環中，同一個所述搬運機器人的兩個所述機械手中的一個機械手持有矽片，同一個所述搬運機器人的兩個所述機械手中的另一個機械手不持有矽片。 The silicon wafer transport device according to claim 4, wherein in one operation cycle of taking and/or putting in the transfer table and/or the process processing device, the same transfer robot One of the two manipulators holds the silicon wafer in the hand, and the other manipulator of the two manipulators of the same handling robot does not hold the silicon wafer. 如請求項1至5中任一項所述之矽片輸運裝置，其中，兩個所述預抽真空裝置中的一個預抽真空裝置中的矽片被逐一傳輸至所述工藝處理裝置中處理時，兩個所述預抽真空裝置中的另一個預抽真空裝置處於抽真空或者破真空或者在大氣環境下移除或裝入矽片。 The silicon wafer transport device according to any one of claims 1 to 5, wherein the silicon wafers in one of the two pre-evacuation devices are transferred to the process processing device one by one During processing, the other one of the two pre-evacuating devices is evacuated or broken, or the silicon wafer is removed or loaded in an atmospheric environment. 如請求項1至5中任一項所述之矽片輸運裝置，其中，所述中轉台還用於矽片中心的定位和/或矽片方向的對準。 The silicon wafer transport device according to any one of claims 1 to 5, wherein the transfer table is also used for positioning the center of the silicon wafer and/or aligning the direction of the silicon wafer. 如請求項1至5中任一項所述之矽片輸運裝置，其中，每個所述預抽真空裝置中設置有用於承載至少一片矽片的晶片盒。 The silicon wafer transport device according to any one of claims 1 to 5, wherein each of the pre-evacuating devices is provided with a wafer cassette for carrying at least one silicon wafer.
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