TWI743575B - Work piece conveying device and work piece conveying method - Google Patents

Work piece conveying device and work piece conveying method Download PDF

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TWI743575B
TWI743575B TW108137578A TW108137578A TWI743575B TW I743575 B TWI743575 B TW I743575B TW 108137578 A TW108137578 A TW 108137578A TW 108137578 A TW108137578 A TW 108137578A TW I743575 B TWI743575 B TW I743575B
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workpiece
pocket
stage
nozzle
conveying device
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TW108137578A
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TW202112634A (en
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藤本博
小島智幸
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日商東京威爾斯股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/914—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems incorporating rotary and rectilinear movements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
    • B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Specific Conveyance Elements (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

[課題]使來自工件進料器之工件正確且快速移送至移載載台上。 [解決手段]工件搬送裝置(10)係具備：旋轉載台(1)；與旋轉載台(1)同步旋轉的吸附噴嘴裝置(20)。吸附噴嘴裝置(20)具有裝置本體(21)、及複數個吸附噴嘴(22)。吸附噴嘴(22)包含：噴嘴本體(22a)、及相對於噴嘴本體(22a)可於上下方向移動的噴嘴(25)。[Question] Make the workpiece from the workpiece feeder accurately and quickly transfer to the transfer stage. [Solution] The workpiece conveying device (10) is provided with: a rotating stage (1); and a suction nozzle device (20) that rotates synchronously with the rotating stage (1). The adsorption nozzle device (20) has a device body (21) and a plurality of adsorption nozzles (22). The suction nozzle (22) includes a nozzle body (22a) and a nozzle (25) that can move in the vertical direction with respect to the nozzle body (22a).

Description

工件搬送裝置及工件搬送方法Work piece conveying device and work piece conveying method

本揭示關於對裝置元件進行搬送的工件搬送裝置及工件搬送方法。The present disclosure relates to a workpiece conveying device and a workpiece conveying method for conveying device components.

已知有對裝置元件(以下亦稱為工件)進行搬送，於次一工程中對裝置元件進行檢測之工件搬送方法。Known is a method of transporting device components (hereinafter also referred to as workpieces) and inspecting the device components in the next project.

該情況下，首先，工件藉由工件進料器被搬送，藉由工件進料器被搬送的工件係藉由吸附噴嘴等依序移載於移載載台上。之後，於次一工程中對移載載台上之工件實施性能檢測或外觀檢測。 [先前技術文獻] [專利文獻]In this case, first, the workpieces are conveyed by the workpiece feeder, and the workpieces conveyed by the workpiece feeder are sequentially transferred on the transfer stage by the suction nozzle or the like. After that, perform performance inspection or appearance inspection on the workpiece on the transfer stage in the next project. [Prior Technical Literature] [Patent Literature]

[專利文獻1]特開2008-260594號公報[Patent Document 1] JP 2008-260594 A

[發明所欲解決之課題][The problem to be solved by the invention]

但是，習知技術上，針對經由工件進料器搬送的工件，一邊在移載載台上高精度地進行定位，一邊快速移載的工件搬送裝置及工件搬送方法乃未開發，此為實情。However, in the conventional technology, a workpiece conveying device and a workpiece conveying method that move quickly while positioning a workpiece on a transfer stage with high precision on a workpiece conveyed via a workpiece feeder is not yet developed. This is the truth.

本揭示係考慮到這樣的點而完成者，目的在於提供針對經由工件進料器搬送的工件一邊高精度地進行定位，一邊快速移載的工件搬送裝置及工件搬送方法。 [用以解決課題的手段]The present disclosure was completed in consideration of such points, and the object is to provide a workpiece conveying device and a workpiece conveying method for quickly transferring a workpiece conveyed via a workpiece feeder while positioning it with high accuracy. [Means to solve the problem]

本揭示之工件搬送裝置，係具備：旋轉自如之旋轉載台，在該旋轉載台之外周緣形成有用於收納工件的複數個口袋；及吸附噴嘴裝置，係設置於上述旋轉載台上，且與上述旋轉載台同步旋轉；上述吸附噴嘴裝置具有：旋轉自如之裝置本體；及複數個吸附噴嘴，其被保持於該裝置本體，而且設置於與各口袋對應的位置，用於吸附上述工件；各吸附噴嘴成為可以在上下方向移動，使上述口袋內之上述工件從上述口袋往下方下降。 本揭示之工件搬送裝置中，係於上述旋轉載台之下方設置有，具有收納上述口袋內之上述工件的複數個工件收納部之移載載台、具有黏著層的黏著板或裝配基板。The workpiece conveying device of the present disclosure is provided with: a freely rotatable rotary stage, a plurality of pockets for storing workpieces are formed on the outer periphery of the rotary stage; and an adsorption nozzle device, which is arranged on the rotary stage, and Rotate synchronously with the rotating stage; the adsorption nozzle device has: a device body that rotates freely; and a plurality of adsorption nozzles, which are held in the device body and are arranged at positions corresponding to the pockets for adsorbing the workpiece; Each suction nozzle can be moved up and down, so that the workpiece in the pocket is lowered from the pocket. In the workpiece conveying device of the present disclosure, a transfer table having a plurality of workpiece storage parts for storing the workpiece in the pocket, an adhesive plate with an adhesive layer, or an assembly substrate is provided below the rotating platform.

本揭示之工件搬送裝置中，於上述旋轉載台連接有使上述工件移載至上述口袋內的工件進料器。In the work conveying device of the present disclosure, a work feeder for transferring the work to the pocket is connected to the rotating stage.

本揭示之工件搬送裝置中，上述口袋係在上述旋轉載台之外周緣貫穿上下方向而設置。In the workpiece conveying device of the present disclosure, the pocket is provided on the outer peripheral edge of the rotating stage through the vertical direction.

本揭示之工件搬送裝置中，上述移載載台、上述黏著板或上述裝配基板係在水平面上可於X-Y方向移動。In the workpiece conveying device of the present disclosure, the transfer stage, the adhesive plate or the assembly substrate can be moved in the X-Y direction on a horizontal plane.

本揭示之工件搬送裝置中，於上述旋轉載台之上述口袋之上緣端部設置有，朝上述口袋內方突出，且將上述吸附噴嘴與上述口袋內密閉的突出板。In the work conveying device of the present disclosure, a protruding plate is provided at the upper edge of the pocket of the rotary stage, which protrudes toward the inside of the pocket and seals the suction nozzle and the inside of the pocket.

本揭示之工件搬送方法，係使用上述工件搬送裝置的工件搬送方法，其具備：使上述旋轉載台停止，使上述工件收納於上述口袋內的工程；藉由與上述口袋對應的上述吸附噴嘴對上述口袋內之上述工件進行吸附的工程；在藉由上述吸附噴嘴吸附有上述口袋內之上述工件之狀態下使上述旋轉載台與上述吸附噴嘴裝置旋轉的工程；及使上述旋轉載台與上述吸附噴嘴之旋轉停止之後，下降上述吸附噴嘴而使吸附於上述吸附噴嘴的上述工件從上述口袋往下方下降的工程。 [發明效果]The workpiece conveying method of the present disclosure is a workpiece conveying method using the above-mentioned workpiece conveying device, and includes: stopping the rotating stage and storing the workpiece in the pocket; and pairing the suction nozzles corresponding to the pocket The process of adsorbing the workpiece in the pocket; the process of rotating the rotary stage and the adsorption nozzle device while the workpiece in the pocket is adsorbed by the adsorption nozzle; and the process of making the rotary stage and the above After the rotation of the suction nozzle is stopped, the suction nozzle is lowered to lower the workpiece adsorbed to the suction nozzle from the pocket downward. [Effects of the invention]

依據以上之本揭示，可以對工件進行高精度定位之同時快速移載。According to the above disclosure, the workpiece can be quickly moved while positioning the workpiece with high precision.

＜實施形態＞<Implementation form>

以下，參照圖面說明本揭示之實施形態。圖1至圖8係表示本揭示之實施形態之圖。Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Figures 1 to 8 are diagrams showing embodiments of the present disclosure.

於此，圖1係表示本揭示的工件搬送裝置之概略斜視圖，圖2係表示旋轉載台之平面圖，圖3係表示為了方便而將樹脂製板去除了的旋轉載台之平面圖，圖4係表示旋轉載台之側剖面圖，圖5係表示從工件進料器搬送至旋轉載台的工件之圖，圖6A至圖6C係表示旋轉載台之口袋內之工件之動作之圖，圖7係表示將旋轉載台之口袋內之工件移載至移載載台的狀態之圖，圖8係表示移載載台之平面圖。Here, FIG. 1 is a schematic perspective view of the workpiece conveying device of the present disclosure, FIG. 2 is a plan view of the rotating stage, and FIG. 3 is a plan view of the rotating stage with the resin plate removed for convenience, and FIG. 4 Fig. 5 is a diagram showing the workpiece conveyed from the workpiece feeder to the rotary carrier, and Figs. 6A to 6C are diagrams showing the movement of the workpiece in the pocket of the rotary carrier. 7 is a diagram showing a state in which the workpiece in the pocket of the rotary stage is transferred to the transfer stage, and FIG. 8 is a plan view of the transfer stage.

如圖1至圖8所示，工件搬送裝置10係對裝置元件等之工件W進行搬送之同時，高精度地進行定位並移載者。As shown in FIGS. 1 to 8, the workpiece conveying device 10 is a device that performs positioning and transfer with high precision while conveying workpieces W such as device components.

這樣的工件搬送裝置10，係具備：旋轉自如之圓形狀旋轉載台1，在旋轉載台1之外周緣設置有用於收納工件W的複數個口袋2；及設置於旋轉載台1上，且與旋轉載台1同步旋轉的吸附噴嘴裝置20。Such a workpiece conveying device 10 is provided with: a freely rotatable circular-shaped rotating stage 1 provided with a plurality of pockets 2 for storing workpieces W on the outer periphery of the rotating stage 1; and installed on the rotating stage 1, and The suction nozzle device 20 rotates synchronously with the rotating stage 1.

又，在旋轉載台1之一側連接有，對工件W進行搬送之同時，將該工件W移載至旋轉載台1之口袋2內的由直線狀之線性進料器形成的工件進料器11。該工件進料器11係藉由工件進料器支撐機構11a進行支撐。再者，於旋轉載台1下方設置有具有複數個工件收納部31的移載載台30，旋轉載台1之口袋2內所收納的工件W係被移載至該複數個工件收納部31。In addition, a workpiece feed formed by a linear linear feeder is connected to one side of the rotary stage 1 to transfer the workpiece W to the pocket 2 of the rotary stage 1 while conveying the workpiece W器11. The workpiece feeder 11 is supported by a workpiece feeder supporting mechanism 11a. Furthermore, a transfer stage 30 having a plurality of workpiece storage portions 31 is provided under the rotary stage 1, and the workpieces W stored in the pocket 2 of the rotary stage 1 are transferred to the plurality of workpiece storage portions 31 .

其中，旋轉載台1係透過驅動軸38藉由旋轉載台上方之驅動部7支撐成為旋轉自如，該驅動軸38被收納於固定側之驅動盒7A內。又，於旋轉載台1上，在旋轉載台1之外周緣分開各90°而設置有收納工件W的4個口袋2。又，各口袋2係在旋轉載台1之外周緣在上下方向貫穿旋轉載台1而設置。Among them, the rotating stage 1 is rotatably supported by the drive part 7 above the rotating stage through a drive shaft 38, and the drive shaft 38 is housed in a drive box 7A on the fixed side. In addition, on the rotating stage 1, four pockets 2 for storing workpieces W are provided on the outer peripheral edge of the rotating stage 1 by 90°. In addition, the pockets 2 are provided on the outer periphery of the rotary stage 1 to penetrate the rotary stage 1 in the vertical direction.

又，吸附噴嘴裝置20具備：連結於從驅動部7朝下方延伸的驅動軸38，且與旋轉載台1同步旋轉的裝置本體21；及保持於該裝置本體21的4個吸附噴嘴22。其中，裝置本體21係如上述般連結於安裝於旋轉載台1之中央部的驅動軸38，該驅動軸38係朝上方延伸而到達驅動部7。In addition, the suction nozzle device 20 includes a device main body 21 connected to a drive shaft 38 extending downward from the drive unit 7 and rotating in synchronization with the rotating stage 1, and four suction nozzles 22 held by the device main body 21. Among them, the device main body 21 is connected to the drive shaft 38 attached to the central portion of the rotating stage 1 as described above, and the drive shaft 38 extends upward to reach the drive portion 7.

又，裝置本體21，係連結於驅動軸38，而且具有從上方觀察時構成“十”字之形狀的4根手柄21a，在各手柄21a之前端設置有吸附噴嘴22。In addition, the device body 21 is connected to the drive shaft 38 and has four handles 21a in the shape of a cross when viewed from above, and a suction nozzle 22 is provided at the front end of each handle 21a.

各吸附噴嘴22具有噴嘴本體22a、及設置於該噴嘴本體22a之下端的噴嘴25，各噴嘴25相對於噴嘴本體22a可於上下方向移動。又，各吸附噴嘴22之噴嘴25，在吸附動作中在其下端可以吸附工件W，在吸附動作停止之情況下，噴嘴25無法吸附工件W。Each suction nozzle 22 has a nozzle main body 22a and a nozzle 25 provided at the lower end of the nozzle main body 22a, and each nozzle 25 is movable in the vertical direction with respect to the nozzle main body 22a. In addition, the nozzle 25 of each suction nozzle 22 can suction the workpiece W at its lower end during the suction operation, and the nozzle 25 cannot suction the workpiece W when the suction operation is stopped.

但是各吸附噴嘴22係如上述般設置於裝置本體21之4根手柄21a之前端，因此合計4個吸附噴嘴22被設置於裝置本體21。各吸附噴嘴22，係在旋轉載台1之上方，以各吸附噴嘴22之噴嘴25來到與旋轉載台1之口袋2對應的位置的方式被配置。However, since each suction nozzle 22 is installed at the front end of the four handles 21a of the device body 21 as described above, a total of four suction nozzles 22 are installed on the device body 21. Each suction nozzle 22 is located above the rotary stage 1, and is arranged so that the nozzle 25 of each suction nozzle 22 reaches a position corresponding to the pocket 2 of the rotary stage 1.

又，旋轉載台1係按照每一口袋2之配置間距(90°間距)斷續地旋轉。又，於旋轉載台1之上面設置有樹脂製板5，於該樹脂製板5設置有與口袋2對應的開口5a。樹脂製板5之開口5a，從平面觀察時呈矩形狀，旋轉載台1之口袋2從平面觀察時亦呈矩形狀。樹脂製板5之開口5a之平面形狀小於口袋2之平面矩形狀。因此樹脂製板5係從口袋2之上端緣朝向口袋2之內方從3邊突出(參照圖2及圖3)。該情況下，如圖2所示，樹脂製板5之開口5a及口袋2，從平面觀察時係在旋轉載台1之外周緣側呈開口。In addition, the rotating stage 1 rotates intermittently according to the arrangement pitch (90° pitch) of each pocket 2. In addition, a resin plate 5 is provided on the upper surface of the rotating stage 1, and an opening 5 a corresponding to the pocket 2 is provided on the resin plate 5. The opening 5a of the resin plate 5 is rectangular when viewed from a plane, and the pocket 2 of the rotating stage 1 is also rectangular when viewed from a plan. The planar shape of the opening 5a of the resin plate 5 is smaller than the planar rectangular shape of the pocket 2. Therefore, the resin board 5 protrudes from three sides from the upper edge of the pocket 2 toward the inside of the pocket 2 (refer to FIGS. 2 and 3). In this case, as shown in FIG. 2, the opening 5a and the pocket 2 of the resin plate 5 are open on the outer peripheral edge side of the rotating stage 1 when viewed from a plane.

如此般，樹脂製板5係從口袋2之上端緣朝向口袋2之內方突出，因此樹脂製板5作為從口袋2之上端緣朝向口袋2之內方突出的突出板而發揮功能。In this way, the resin plate 5 protrudes from the upper edge of the pocket 2 toward the inside of the pocket 2, so the resin plate 5 functions as a protrusion plate that protrudes from the upper edge of the pocket 2 toward the inside of the pocket 2.

該情況下，從口袋2之上端緣朝向口袋2之內方突出的樹脂製板5，可以將口袋2之上端緣以及吸附噴嘴22之噴嘴密閉，藉此，可以提升口袋2內之密閉度。In this case, the resin plate 5 protruding from the upper edge of the pocket 2 toward the inside of the pocket 2 can seal the upper edge of the pocket 2 and the nozzle of the suction nozzle 22, thereby increasing the degree of airtightness in the pocket 2.

又，上述本實施形態中示出在旋轉載台1上設置有樹脂製板5之例，但口袋2內之密閉度可以確保之情況下，該樹脂製板5未必一定要設置。In addition, in the above-mentioned present embodiment, the example in which the resin plate 5 is provided on the rotating stage 1 is shown, but when the degree of airtightness in the pocket 2 can be ensured, the resin plate 5 is not necessarily provided.

接著，參照圖5至圖7說明旋轉載台1與工件進料器11間之連接部之構造。如圖5至圖7所示，在旋轉載台1之口袋2內，在其半徑方向內方設置有藉由吸附作用將工件W吸入口袋2內的吸附部8。Next, the structure of the connection part between the rotary stage 1 and the workpiece feeder 11 will be described with reference to FIGS. 5 to 7. As shown in FIGS. 5 to 7, in the pocket 2 of the rotary stage 1, a suction part 8 for sucking the workpiece W into the pocket 2 by suction is provided in the radial direction of the pocket 2.

該情況下，口袋2內之吸附部8係設置於口袋2之內側緣之隅部(參照圖2及圖3)。又，吸附部8連接於組裝在後述之裝載器底座13內的吸附機構(未圖示)，藉由該吸附機構進行吸附作用。In this case, the suction part 8 in the pocket 2 is provided at the corner of the inner edge of the pocket 2 (refer to FIGS. 2 and 3). In addition, the suction unit 8 is connected to a suction mechanism (not shown) assembled in the loader base 13 described later, and the suction mechanism performs a suction action by the suction mechanism.

又，在旋轉載台1之口袋2內設置有，對工件W是否收納於口袋2內之正確的位置進行光學檢測的工件檢測部9。In addition, the pocket 2 of the rotary stage 1 is provided with a workpiece detection unit 9 that optically detects whether the workpiece W is stored in the correct position in the pocket 2.

但是，在旋轉載台1與工件進料器11間之連接部，為了使工件W從工件進料器11順利地移行至旋轉載台1之口袋2側而安裝有從上方覆蓋工件W的頂蓋12。However, in the connection part between the rotary stage 1 and the workpiece feeder 11, in order to smoothly move the workpiece W from the workpiece feeder 11 to the pocket 2 side of the rotary stage 1, a top covering the workpiece W from above is installed. Cover 12.

又，在旋轉載台1與工件進料器11間之連接部設置有，將從工件進料器11移行至旋轉載台1之口袋2側之工件W從下方進行支撐的裝載器底座13。In addition, a loader base 13 is provided at the connection portion between the rotary stage 1 and the workpiece feeder 11 to support the workpiece W moved from the workpiece feeder 11 to the pocket 2 side of the rotary stage 1 from below.

接著，參照圖7及圖8說明配置於旋轉載台1之下方的移載載台30。移載載台30具有藉由區劃壁32被區劃為格子狀的多個工件收納部31。Next, the transfer stage 30 arranged below the rotary stage 1 will be described with reference to FIGS. 7 and 8. The transfer stage 30 has a plurality of work storage portions 31 partitioned into a lattice shape by the partition wall 32.

又，移載載台30係在旋轉載台1之下方可以在水平面上沿著X-Y方向移動。如此般，藉由移載載台30在水平面上沿著X-Y方向移動，而使收納於旋轉載台1之口袋2內且經由旋轉載台1被搬送的工件W，透過吸附噴嘴22下降，而可以收納於移載載台30之期待之工件收納部31內。In addition, the transfer stage 30 is located below the rotating stage 1 and can move in the X-Y direction on a horizontal surface. In this way, by moving the transfer stage 30 in the XY direction on the horizontal plane, the workpiece W contained in the pocket 2 of the rotating stage 1 and transported via the rotating stage 1 is lowered through the suction nozzle 22, and It can be stored in the desired workpiece storage portion 31 of the transfer stage 30.

接著說明由這樣的構成形成的本實施之形態之作用。Next, the function of the embodiment formed by such a configuration will be explained.

首先，如圖1及圖6A所示，裝置元件等之工件W從工件進料器11被收納於旋轉載台1之中之工件進料器11側之口袋2內。該情況下，旋轉載台1停止旋轉。又，從工件進料器11內輸出之工件W，係在工件進料器11與旋轉載台1之間之連接部中，藉由裝載器底座13進行支撐，而且藉由頂蓋12從上方覆蓋。First, as shown in FIGS. 1 and 6A, the workpiece W of the device components and the like is stored in the pocket 2 on the workpiece feeder 11 side of the rotary stage 1 from the workpiece feeder 11. In this case, the rotation stage 1 stops rotating. In addition, the workpiece W output from the workpiece feeder 11 is in the connection part between the workpiece feeder 11 and the rotary stage 1, and is supported by the loader base 13, and is supported by the top cover 12 from above. cover.

接著，藉由控制部35使設置於旋轉載台1之上方的吸附噴嘴裝置20之中之與收納有工件W的口袋2對應的吸附噴嘴22之噴嘴25下降而進入口袋2內，在稍微進入了口袋2內之狀態下使噴嘴25停止。Next, the nozzle 25 of the suction nozzle 22 corresponding to the pocket 2 accommodating the workpiece W among the suction nozzle device 20 installed above the rotary stage 1 is lowered by the control unit 35 to enter the pocket 2 and enter the pocket 2 slightly. Stop the nozzle 25 in the state in the pocket 2.

該情況下，口袋2之上端緣之中，在旋轉載台1之除了其外周緣側之邊以外的3邊中，樹脂製板5朝向口袋2之內方突出。因此藉由噴嘴25與樹脂製板5密閉口袋2之上端緣。In this case, among the upper edge of the pocket 2, the resin plate 5 protrudes toward the inside of the pocket 2 among the three sides of the rotating stage 1 except for the side on the outer peripheral edge side. Therefore, the upper edge of the pocket 2 is sealed by the nozzle 25 and the resin plate 5.

接著，藉由裝載器底座13之吸附機構作動口袋2內之吸附部8，以將工件W吸附至口袋2內的方式產生氣流。該情況下，如上述般口袋2之上端緣被噴嘴25與樹脂製板5密閉，因此口袋2內可以有效地設為吸引狀態，可以提高該口袋2內之吸引狀態。Then, the suction mechanism of the loader base 13 actuates the suction part 8 in the pocket 2 to generate airflow in a manner of sucking the workpiece W into the pocket 2. In this case, the upper edge of the pocket 2 is sealed by the nozzle 25 and the resin plate 5 as described above, so the inside of the pocket 2 can be effectively put in a suction state, and the suction state in the pocket 2 can be improved.

如上述般，口袋2內成為吸引狀態之後，如圖6B所示，藉由頂蓋12與裝載器底座13使從工件進料器11輸出之工件W從上下方向被導引，被吸入吸引狀態之口袋2內。As described above, after the pocket 2 is in the suction state, as shown in FIG. 6B, the workpiece W output from the workpiece feeder 11 is guided from the vertical direction by the top cover 12 and the loader base 13, and sucked into the suction state Inside the pocket 2.

接著，工件W進入口袋2內之後，工件檢測部9檢測出工件W已進入口袋2內。來自工件檢測部9之信號被傳送至控制部35，控制部35依據來自工件檢測部9之信號而使吸附噴嘴22之噴嘴25動作，將工件W吸附於噴嘴25之下端(參照圖6C)。Next, after the workpiece W enters the pocket 2, the workpiece detection unit 9 detects that the workpiece W has entered the pocket 2. The signal from the workpiece detection unit 9 is sent to the control unit 35, and the control unit 35 operates the nozzle 25 of the suction nozzle 22 according to the signal from the workpiece detection unit 9 to suck the workpiece W to the lower end of the nozzle 25 (see FIG. 6C).

之後，如圖1所示，控制部35使驅動部7動作，使旋轉載台1與吸附噴嘴裝置20旋轉90°。After that, as shown in FIG. 1, the control unit 35 operates the drive unit 7 to rotate the rotary stage 1 and the suction nozzle device 20 by 90°.

在該期間，被收納於旋轉載台1之口袋2內且藉由吸附噴嘴22之噴嘴25吸附保持的工件W，亦與旋轉載台1同時旋轉90°。During this period, the workpiece W stored in the pocket 2 of the rotary stage 1 and sucked and held by the nozzle 25 of the suction nozzle 22 is also rotated by 90° simultaneously with the rotary stage 1.

之後，旋轉載台1及吸附噴嘴裝置20停止旋轉，同樣地使工件W從工件進料器11被收納於旋轉載台1之中之工件進料器11側之口袋2內。After that, the rotation of the rotary stage 1 and the suction nozzle device 20 is stopped, and the workpiece W is similarly stored from the workpiece feeder 11 in the pocket 2 on the side of the workpiece feeder 11 in the rotary stage 1.

接著，使旋轉載台1與吸附噴嘴裝置20進一步旋轉90°，使最初被收納於工件進料器11側之口袋2內的工件W到達相對於工件進料器11旋轉180°之位置。之後，旋轉載台1之及吸附噴嘴裝置20停止旋轉。Next, the rotary stage 1 and the suction nozzle device 20 are further rotated by 90°, and the workpiece W initially contained in the pocket 2 on the workpiece feeder 11 side reaches a position rotated by 180° with respect to the workpiece feeder 11. After that, the rotation of the rotating stage 1 and the suction nozzle device 20 is stopped.

此時，來到相對於工件進料器11旋轉180°之位置的吸附噴嘴22之噴嘴25，以其下端將工件W吸附保持於口袋2內。接著，藉由控制部35使吸附噴嘴22之噴嘴25進一步下降，噴嘴25進一步下降而貫穿口袋2內。在噴嘴25之下端所吸附的工件W到達移載載台30之工件收納部31內時，控制部35停止噴嘴25之下降之同時，停止噴嘴25之吸附作用。At this time, the nozzle 25 of the suction nozzle 22, which is at a position rotated by 180° with respect to the workpiece feeder 11, sucks and holds the workpiece W in the pocket 2 with its lower end. Then, the nozzle 25 of the suction nozzle 22 is further lowered by the control unit 35, and the nozzle 25 is further lowered and penetrates the inside of the pocket 2. When the workpiece W sucked by the lower end of the nozzle 25 reaches the workpiece storage section 31 of the transfer stage 30, the control section 35 stops the descending of the nozzle 25 and stops the suction action of the nozzle 25.

如上述般噴嘴25之下端吸附的工件W正確地被移載至移載載台30之工件收納部31內，之後，藉由控制部35使吸附噴嘴22之噴嘴25朝上方上升。As described above, the workpiece W sucked by the lower end of the nozzle 25 is accurately transferred into the workpiece storage section 31 of the transfer stage 30, and then the nozzle 25 of the suction nozzle 22 is raised upward by the control section 35.

如上述般藉由到達相對於工件進料器11旋轉180°之位置的吸附噴嘴22，將工件W依序移載至移載載台30之工件收納部31內。該情況下，控制部35可以使移載載台30沿著X-Y方向在水平面上移動，藉此，藉由吸附噴嘴22可以將工件W依序移載至移載載台30之期待之工件收納部31。As described above, by reaching the suction nozzle 22 at a position rotated by 180° with respect to the workpiece feeder 11, the workpiece W is sequentially transferred into the workpiece storage portion 31 of the transfer stage 30. In this case, the control unit 35 can move the transfer stage 30 on the horizontal plane along the XY direction, whereby the workpiece W can be sequentially transferred to the desired work storage of the transfer stage 30 by the suction nozzle 22部31.

又，位於旋轉載台1旋轉270°之位置的吸附噴嘴22，並未特別對工件W進行吸附而處於待機狀態。In addition, the suction nozzle 22 located at the position where the rotary stage 1 rotates by 270° does not particularly suction the workpiece W and is in a standby state.

藉由依序重複這樣的作用，可以將從工件進料器11送出的工件W，依序移載至移載載台30之期待之工件收納部31內。之後移載載台30被送至次一工程，於次一工程中，從移載載台30內取出工件W，對該工件W進行性能檢測或者外觀檢測。之後以判斷為良品的工件W作為裝置元件使用。By repeating such actions in sequence, the workpiece W fed from the workpiece feeder 11 can be sequentially transferred to the desired workpiece storage portion 31 of the transfer stage 30. After that, the transfer stage 30 is sent to the next process. In the next process, the workpiece W is taken out from the transfer stage 30, and the performance or appearance inspection of the workpiece W is performed. After that, the workpiece W judged to be a good product is used as a device element.

依據以上之本實施形態，可以將從工件進料器11送來的工件W正確定位於旋轉載台1之口袋2內之同時，藉由吸附噴嘴22之噴嘴25進行吸附，可以確實搬送至相對於工件進料器11旋轉180°之位置。又，針對到達相對於工件進料器11已旋轉180°之位置的工件W，僅藉由下降吸附噴嘴22之噴嘴25即可以容易且簡單地收納於載台30內之期待之工件收納部31內。According to the above embodiment, the workpiece W sent from the workpiece feeder 11 can be accurately positioned in the pocket 2 of the rotary stage 1, and the nozzle 25 of the suction nozzle 22 can be sucked, so that it can be reliably conveyed to the opposite side. At the position where the workpiece feeder 11 rotates 180°. In addition, for the workpiece W that has reached a position rotated by 180° with respect to the workpiece feeder 11, the desired workpiece storage portion 31 can be easily and simply stored in the stage 30 only by lowering the nozzle 25 of the suction nozzle 22 Inside.

因此可以將從工件進料器11送來的工件W迅速且高精度地搬送至移載載台30之期待之工件收納部31內。Therefore, the workpiece W sent from the workpiece feeder 11 can be quickly and accurately transported into the desired workpiece storage portion 31 of the transfer stage 30.

＜本揭示之變形例＞ 接著，參照圖9說明本揭示之變形例。於圖1至圖8所示實施形態中示出藉由吸附噴嘴裝置20使工件W收納於移載載台30之工件收納部31內，但不限定於此，如圖9所示，藉由吸附噴嘴裝置20將工件W移載至黏著板40上亦可。圖9所示變形例中，針對和圖1至圖8所示實施形態同一之部分附加同一符號並省略詳細說明。圖9中，藉由吸附噴嘴裝置20被移載有工件W的黏著板40，係具有設置於其表面的黏著層40a。<Modifications of this disclosure> Next, a modification of the present disclosure will be described with reference to FIG. 9. The embodiment shown in FIGS. 1 to 8 shows that the workpiece W is stored in the workpiece storage portion 31 of the transfer stage 30 by the suction nozzle device 20, but it is not limited to this, as shown in FIG. 9, by The suction nozzle device 20 may transfer the workpiece W onto the adhesive plate 40. In the modified example shown in FIG. 9, the same reference numerals are attached to the same parts as those in the embodiment shown in FIGS. 1 to 8, and detailed descriptions are omitted. In FIG. 9, the adhesive plate 40 to which the workpiece W is transferred by the suction nozzle device 20 has an adhesive layer 40 a provided on the surface thereof.

或者，作為設置該黏著板40之取代，而直接藉由吸附噴嘴裝置20將工件W裝配於裝配基板(未圖示)上亦可。Alternatively, instead of providing the adhesive plate 40, the workpiece W may be directly mounted on the mounting substrate (not shown) by the suction nozzle device 20.

或者，在圖1至圖8所示實施形態或者圖9所示變形例中示出，藉由吸附噴嘴裝置20將到達相對於工件進料器11已旋轉180°之位置的工件W移載至移載載台30(參照圖1至圖8)，或者移載至黏著板40(參照圖9)之例，但不限定於此，將到達相對於工件進料器11已旋轉90°之位置的工件W移載至移載載台30之工件收納部31內，或者移載至黏著板40上亦可。Alternatively, in the embodiment shown in FIGS. 1 to 8 or the modified example shown in FIG. 9, the suction nozzle device 20 transfers the workpiece W that has reached a position rotated by 180° with respect to the workpiece feeder 11 to The transfer stage 30 (refer to FIGS. 1 to 8), or the example of transfer to the adhesive plate 40 (refer to FIG. 9), but not limited to this, it will reach a position that has been rotated 90° with respect to the workpiece feeder 11 The workpiece W of is transferred to the workpiece storage portion 31 of the transfer stage 30, or transferred to the adhesive plate 40.

1:旋轉載台 2:口袋 5:樹脂製板(突出板) 5a:開口 8:吸附部 9:工件檢測部 10:工件搬送裝置 11:工件進料器 20:吸附噴嘴裝置 21:裝置本體 22:吸附噴嘴 25:噴嘴 30:移載載台 31:工件收納部 35:控制部 40:黏著板1: Rotating stage 2: pocket 5: Resin board (protruding board) 5a: opening 8: Adsorption part 9: Workpiece Inspection Department 10: Workpiece conveying device 11: Workpiece feeder 20: Adsorption nozzle device 21: Device body 22: Adsorption nozzle 25: Nozzle 30: Transfer platform 31: Work storage department 35: Control Department 40: Adhesive board

[圖1]圖1係表示本揭示的工件搬送裝置之概略斜視圖。 [圖2]圖2係表示旋轉載台之平面圖。 [圖3]圖3係為了方便而去除了樹脂製板的旋轉載台之平面圖。 [圖4]圖4係表示旋轉載台之側剖面圖。 [圖5]圖5係表示從工件進料器搬送至旋轉載台的工件之圖。 [圖6A]圖6A係表示旋轉載台之口袋內之工件之動作之圖。 [圖6B]圖6B係表示旋轉載台之口袋內之工件之動作之圖。 [圖6C]圖6C係表示旋轉載台之口袋內之工件之動作之圖。 [圖7]圖7係表示將旋轉載台之口袋內之工件移載至移載載台的狀態之圖。 [圖8]圖8係表示移載載台之平面圖。 [圖9]圖9係表示本揭示之變形例之圖。[Fig. 1] Fig. 1 is a schematic perspective view showing the workpiece conveying device of the present disclosure. [Fig. 2] Fig. 2 is a plan view showing the rotating stage. [Fig. 3] Fig. 3 is a plan view of the rotating stage with the resin plate removed for convenience. [Fig. 4] Fig. 4 is a side sectional view showing the rotating stage. [Fig. 5] Fig. 5 is a diagram showing a workpiece transferred from the workpiece feeder to the rotary stage. [Fig. 6A] Fig. 6A is a diagram showing the movement of the workpiece in the pocket of the rotary stage. [Figure 6B] Figure 6B is a diagram showing the movement of the workpiece in the pocket of the rotary stage. [Figure 6C] Figure 6C is a diagram showing the movement of the workpiece in the pocket of the rotary stage. [Fig. 7] Fig. 7 is a diagram showing a state where the workpiece in the pocket of the rotary stage is transferred to the transfer stage. [Figure 8] Figure 8 is a plan view showing the transfer stage. [Fig. 9] Fig. 9 is a diagram showing a modification of the present disclosure.

1:旋轉載台1: Rotating stage

7:驅動部7: Drive

7A:驅動盒7A: Drive box

10:工件搬送裝置10: Workpiece conveying device

11:工件進料器11: Workpiece feeder

11a:工件進料器支撐機構11a: Workpiece feeder support mechanism

20:吸附噴嘴裝置20: Adsorption nozzle device

21:裝置本體21: Device body

21a:手柄21a: handle

22:吸附噴嘴22: Adsorption nozzle

22a:噴嘴本體22a: Nozzle body

25:噴嘴25: Nozzle

30:移載載台30: Transfer platform

35:控制部35: Control Department

38:驅動軸38: drive shaft

Claims (7)

一種工件搬送裝置，係具備：旋轉自如之旋轉載台，在該旋轉載台之外周緣形成有用於收納工件的複數個口袋；及吸附噴嘴裝置，係設置於上述旋轉載台上，且與上述旋轉載台同步旋轉；上述吸附噴嘴裝置具有：旋轉自如之裝置本體；及複數個吸附噴嘴，其被保持於該裝置本體，而且設置於與各口袋對應的位置，用於吸附上述工件；各吸附噴嘴成為可以在上下方向移動，使上述口袋內之上述工件從上述口袋往下方下降。 A workpiece conveying device is provided with: a freely rotatable rotary stage, a plurality of pockets for storing workpieces are formed on the outer periphery of the rotary stage; The rotating stage rotates synchronously; the adsorption nozzle device has: a device body that rotates freely; and a plurality of adsorption nozzles, which are held in the device body, and are arranged in positions corresponding to the pockets for adsorbing the workpiece; each adsorption The nozzle can be moved up and down, so that the workpiece in the pocket is lowered from the pocket. 如申請專利範圍第1項之工件搬送裝置，其中於上述旋轉載台之下方設置有：具有收納上述口袋內之上述工件的複數個工件收納部之移載載台、具有黏著層的黏著板、或裝配基板。 For example, the workpiece conveying device of the first item of the scope of patent application is provided below the rotating stage: a transfer stage having a plurality of workpiece storage parts for storing the workpiece in the pocket, an adhesive plate with an adhesive layer, Or assemble the substrate. 如申請專利範圍第1或2項之工件搬送裝置，其中於上述旋轉載台連接有使上述工件移載至上述口袋內的工件進料器。 For example, the workpiece conveying device of item 1 or 2 of the scope of patent application, wherein a workpiece feeder for transferring the workpiece to the pocket is connected to the rotating stage. 如申請專利範圍第1或2項之工件搬送裝置，其中上述口袋係在上述旋轉載台之外周緣貫穿上下方向而 設置。 For example, the workpiece conveying device of item 1 or 2 of the scope of patent application, in which the above-mentioned pocket is inserted in the vertical direction on the outer periphery of the above-mentioned rotating stage. set up. 如申請專利範圍第2項之工件搬送裝置，其中上述移載載台、上述黏著板或上述裝配基板係在水平面上可於X-Y方向移動。 For example, the workpiece conveying device of the second item of the scope of patent application, wherein the transfer stage, the adhesive plate or the assembly substrate are movable in the X-Y direction on a horizontal plane. 如申請專利範圍第1或2項之工件搬送裝置，其中於上述旋轉載台之上述口袋之上緣端部設置有：朝上述口袋內方突出，且將上述吸附噴嘴與上述口袋內密閉的突出板。 For example, the workpiece conveying device of item 1 or 2 of the scope of patent application, wherein the upper edge of the pocket of the rotary stage is provided with a protrusion that protrudes toward the inside of the pocket and seals the suction nozzle and the inside of the pocket plate. 一種工件搬送方法，係使用如申請專利範圍第1項之工件搬送裝置的工件搬送方法，該工件搬送方法具備：使上述旋轉載台停止，使上述工件收納於上述口袋內的工程；藉由與上述口袋對應的上述吸附噴嘴對上述口袋內之上述工件進行吸附的工程；在藉由上述吸附噴嘴吸附有上述口袋內之上述工件之狀態下使上述旋轉載台與上述吸附噴嘴裝置旋轉的工程；及使上述旋轉載台與上述吸附噴嘴之旋轉停止之後，下降上述吸附噴嘴而使吸附於上述吸附噴嘴的上述工件從上述口袋往下方下降的工程。 A workpiece conveying method is a workpiece conveying method using a workpiece conveying device as claimed in the scope of the patent application. The workpiece conveying method includes: stopping the rotating stage and storing the workpiece in the pocket; The process of adsorbing the workpiece in the pocket by the adsorption nozzle corresponding to the pocket; the process of rotating the rotary stage and the adsorption nozzle device while the workpiece in the pocket is adsorbed by the adsorption nozzle; And after stopping the rotation of the rotary stage and the suction nozzle, the suction nozzle is lowered to lower the workpiece adsorbed to the suction nozzle from the pocket downward.
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