TWI733952B - Fully aromatic polyester amide and its production method - Google Patents

Fully aromatic polyester amide and its production method Download PDF

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TWI733952B
TWI733952B TW106140521A TW106140521A TWI733952B TW I733952 B TWI733952 B TW I733952B TW 106140521 A TW106140521 A TW 106140521A TW 106140521 A TW106140521 A TW 106140521A TW I733952 B TWI733952 B TW I733952B
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川原俊紀
横田俊明
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日商寶理塑料股份有限公司
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Abstract

提供一種低熔點化與耐熱性的並存為充分之全芳香族聚酯醯胺及其製造方法。本發明之全芳香族聚酯醯胺,係由下述結構單元(I)~(V)作為必要的構成成分所構成;相對於總結構單元,含有61~75莫耳%的結構單元(I)、1~4.5莫耳%的結構單元(II)、10.25~19莫耳%的結構單元(III)、3.25~18莫耳%的結構單元(IV)、及1~7莫耳%的結構單元(V),將結構單元(I)~(V)合計為含有100莫耳%且在熔融時顯示光學異方性。 Provided is a fully aromatic polyester amide that has sufficient low melting point and heat resistance, and a method for producing the same. The wholly aromatic polyester amide of the present invention is composed of the following structural units (I) to (V) as essential constituents; relative to the total structural units, it contains 61 to 75 mol% of the structural units (I) ), 1-4.5 mol% structural unit (II), 10.25-19 mol% structural unit (III), 3.25-18 mol% structural unit (IV), and 1-7 mol% structural unit The unit (V) contains 100 mol% of the structural units (I) to (V) in total, and exhibits optical anisotropy when melted.

Figure 106140521-A0202-11-0001-24
Figure 106140521-A0202-11-0001-24

Figure 106140521-A0202-11-0001-25
Figure 106140521-A0202-11-0001-25

Figure 106140521-A0202-11-0001-26
Figure 106140521-A0202-11-0001-26

Figure 106140521-A0202-11-0001-27
Figure 106140521-A0202-11-0001-27

Figure 106140521-A0202-11-0001-28
Figure 106140521-A0202-11-0001-28

Description

全芳香族聚酯醯胺及其製造方法 Fully aromatic polyester amide and its production method

本發明係有關於一種全芳香族聚酯醯胺及其製造方法。 The present invention relates to a wholly aromatic polyester amide and its manufacturing method.

因為液晶體聚合物係平衡良好地具有優異的流動性、機械強度、耐熱性、耐藥品性、電性質等,所以能夠適合且廣泛地被利用在高功能工程塑膠。作為液晶體聚合物,係與全芳香族聚酯同時,能夠使用全芳香族聚酯醯胺。例如專利文獻1,係揭示一種使對胺基苯酚、4-羥基苯甲酸、4,4’-二羥基聯苯、對苯二甲酸、及間苯二甲酸反應而得到的芳香族聚酯醯胺。又,專利文獻2係揭示一種使對胺基苯酚、4-羥基苯甲酸、6-羥基-2-萘甲酸、4,4’-二羥基聯苯、及對苯二甲酸反應而得到的芳香族聚酯醯胺。 Since the liquid crystal polymer system has excellent fluidity, mechanical strength, heat resistance, chemical resistance, electrical properties, etc., in a well-balanced manner, it can be suitably and widely used in high-functional engineering plastics. As the liquid crystal polymer, a wholly aromatic polyester amide can be used together with a wholly aromatic polyester. For example, Patent Document 1 discloses an aromatic polyester amide obtained by reacting p-aminophenol, 4-hydroxybenzoic acid, 4,4'-dihydroxybiphenyl, terephthalic acid, and isophthalic acid . In addition, Patent Document 2 discloses an aromatic compound obtained by reacting p-aminophenol, 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, 4,4'-dihydroxybiphenyl, and terephthalic acid. Polyesteramide.

先前技術文獻 Prior art literature

專利文獻 Patent literature

[專利文獻1]日本特開平02-086623號公報 [Patent Document 1] Japanese Patent Application Laid-Open No. 02-086623

[專利文獻2]日本特開平05-170902號公報 [Patent Document 2] Japanese Patent Laid-Open No. 05-170902

但是,專利文獻1所記載的全芳香族聚酯醯胺,其耐熱性為不充分,專利文獻2所記載的全芳香族聚酯醯胺,其低熔點化與耐熱性的並存為不充分。 However, the wholly aromatic polyesteramide described in Patent Document 1 has insufficient heat resistance, and the wholly aromatic polyesteramide described in Patent Document 2 has insufficient coexistence of low melting point and heat resistance.

鑒於上述課題,本發明之目的係提供一種低熔點化與耐熱性的並存為充分之全芳香族聚酯醯胺及其製造方法。 In view of the above-mentioned problems, the object of the present invention is to provide a wholly aromatic polyesteramide that has a low melting point and a sufficient heat resistance, and a method for producing the same.

為了解決上述課題,本發明者等重複專心研究。其結果,發現一種全芳香族聚酯醯胺,其係由下列結構單元所構成:由4-羥基苯甲酸所衍生的結構單元、由6-羥基-2-萘甲酸所衍生的結構單元、由1,4-苯二羧酸所衍生的結構單元、由4,4’-二羥基聯苯所衍生的結構單元、及由N-乙醯基-對胺基苯酚所衍生的結構單元,而且各結構單元的含量在特定範圍,能夠解決上述課題,而完成了本發明。更具體地,本發明係提供以下列項目。 In order to solve the above-mentioned problems, the inventors of the present invention have repeatedly intensively studied. As a result, a wholly aromatic polyester amide was found, which is composed of the following structural units: structural units derived from 4-hydroxybenzoic acid, structural units derived from 6-hydroxy-2-naphthoic acid, Structural units derived from 1,4-benzenedicarboxylic acid, structural units derived from 4,4'-dihydroxybiphenyl, and structural units derived from N-acetyl-p-aminophenol, and each The content of the structural unit is within a specific range, the above-mentioned problems can be solved, and the present invention has been completed. More specifically, the present invention provides the following items.

(1)一種全芳香族聚酯醯胺,係由下述結構單元(I)~(V)作為必要的構成成分所構成:相對於總結構單元,結構單元(I)的含量為61~75莫耳%,相對於總結構單元,結構單元(II)的含量為1~4.5莫耳%,相對於總結構單元,結構單元(III)的含量為10.25~19莫耳%,相對於總結構單元,結構單元(IV)的含量為3.25~18莫耳%,及相對於總結構單元,結構單元(V)的含量為1~7莫耳%,相對於總結構單元,結構單元(I)~(V)的合計含量為100莫 耳%且在熔融時顯示光學異方性:

Figure 106140521-A0202-12-0003-7
(1) A wholly aromatic polyester amide, which is composed of the following structural units (I) to (V) as essential constituents: relative to the total structural units, the content of structural unit (I) is 61 to 75 Mole%, relative to the total structural unit, the content of structural unit (II) is 1 to 4.5 mol%, relative to the total structural unit, the content of structural unit (III) is 10.25 to 19 mol%, relative to the total structure Unit, the content of structural unit (IV) is 3.25-18 mol%, and relative to the total structural unit, the content of structural unit (V) is 1-7 mol%, relative to the total structural unit, structural unit (I) The total content of ~(V) is 100 mol% and shows optical anisotropy when melting:
Figure 106140521-A0202-12-0003-7

Figure 106140521-A0202-12-0003-8
Figure 106140521-A0202-12-0003-8

Figure 106140521-A0202-12-0003-9
Figure 106140521-A0202-12-0003-9

Figure 106140521-A0202-12-0003-10
Figure 106140521-A0202-12-0003-10

Figure 106140521-A0202-12-0003-11
Figure 106140521-A0202-12-0003-11

(2)如(1)所述之全芳香族聚酯醯胺,其熔點為350℃以下。 (2) The wholly aromatic polyester amide as described in (1), which has a melting point of 350°C or less.

(3)一種全芳香族聚酯醯胺,係荷重撓曲溫度為270℃以上之如(1)或(2)所述之全芳香族聚酯醯胺, 前述荷重撓曲溫度係將前述全芳香族聚酯醯胺60質量%、與平均纖維徑11μm且平均纖維長75μm的磨碎纖維40質量%在前述全芳香族聚酯醯胺的熔點+20℃進行熔融混煉而得到之聚酯醯胺樹脂組合物的狀態下測定。 (3) A wholly aromatic polyester amide, which is a wholly aromatic polyester amide as described in (1) or (2) with a deflection temperature under load of 270°C or higher, wherein the deflection temperature under load is the same as the aforementioned total deflection temperature. 60% by mass of aromatic polyesteramide, and 40% by mass of ground fibers with an average fiber diameter of 11μm and average fiber length of 75μm. Measured in the state of the amide resin composition.

(4)如(1)至(3)項中任一項所述之全芳香族聚酯醯胺,其中在比前述全芳香族聚酯醯胺的熔點更高10~30℃的溫度且剪切速度1000/秒之熔融黏度為500Pa‧s以下。 (4) The wholly aromatic polyester amide according to any one of (1) to (3), wherein it is cut at a temperature 10 to 30°C higher than the melting point of the aforementioned wholly aromatic polyester amide The melt viscosity at a cutting speed of 1000/sec is below 500Pa‧s.

(5)如(1)至(4)項中任一項所述之全芳香族聚酯醯 胺,其中結構單元(III)的莫耳數為結構單元(IV)與結構單元(V)的合計莫耳數之1~1.2倍,或是結構單元(IV)與結構單元(V)的合計莫耳數為結構單元(III)的莫耳數之1~1.2倍。 (5) The wholly aromatic polyester amide according to any one of items (1) to (4), wherein the molar number of the structural unit (III) is the ratio of the structural unit (IV) and the structural unit (V) The total number of moles is 1 to 1.2 times, or the total number of moles of structural unit (IV) and structural unit (V) is 1 to 1.2 times of the number of moles of structural unit (III).

(6)一種方法,係在熔融時顯示光學異方性之全芳香族聚酯醯胺的製造方法,前述方法係包含在脂肪酸金屬鹽的存在下,使用脂肪酸酐將4-羥基苯甲酸、6-羥基-2-萘甲酸、4,4’-二羥基聯苯、及N-乙醯基-對胺基苯酚進行醯基化且與1,4-苯二羧酸進行酯交換之步驟;而且相對於由4-羥基苯甲酸、6-羥基-2-萘甲酸、1,4-苯二羧酸、4,4’-二羥基聯苯、及N-乙醯基-對胺基苯酚所構成且使用在前述方法之總單體,4-羥基苯甲酸的使用量為61~75莫耳%,6-羥基-2-萘甲酸的使用量為1~4.5莫耳%,1,4-苯二羧酸的使用量為10.25~19莫耳%,4,4’-二羥基聯苯的使用量為3.25~18莫耳%,N-乙醯基-對胺基苯酚的使用量為1~7莫耳%,4-羥基苯甲酸、6-羥基-2-萘甲酸、1,4-苯二羧酸、4,4’-二羥基聯苯、及N-乙醯基-對胺基苯酚的合計使用量為100莫耳%,前述脂肪酸酐的使用量為4-羥基苯甲酸、6-羥基-2-萘甲酸、4,4’-二羥基聯苯、及N-乙醯基-對胺基苯酚的合計羥基當量之1.02~1.05倍。 (6) A method for producing a wholly aromatic polyester amide that exhibits optical anisotropy when melted. The aforementioned method involves the use of fatty acid anhydride in the presence of a fatty acid metal salt to convert 4-hydroxybenzoic acid, 6 -Hydroxy-2-naphthoic acid, 4,4'-dihydroxybiphenyl, and N-acetyl-p-aminophenol are acylated and transesterified with 1,4-benzenedicarboxylic acid; and Compared with 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, 1,4-benzenedicarboxylic acid, 4,4'-dihydroxybiphenyl, and N-acetyl-p-aminophenol And the total monomer used in the aforementioned method, the usage amount of 4-hydroxybenzoic acid is 61~75 mol%, the usage amount of 6-hydroxy-2-naphthoic acid is 1~4.5 mol%, 1,4-benzene The usage amount of dicarboxylic acid is 10.25~19 mol%, the usage amount of 4,4'-dihydroxybiphenyl is 3.25~18 mol%, and the usage amount of N-acetyl-p-aminophenol is 1~ 7 mol%, 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, 1,4-benzenedicarboxylic acid, 4,4'-dihydroxybiphenyl, and N-acetyl-p-aminophenol The total usage amount of the above-mentioned fatty acid anhydride is 100 mol%, and the usage amount of the aforementioned fatty acid anhydride is 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, 4,4'-dihydroxybiphenyl, and N-acetyl-p- The total hydroxyl equivalent of aminophenol is 1.02~1.05 times.

(7)如(6)所述之方法,其中前述脂肪酸金屬鹽為乙酸金屬鹽,前述脂肪酸酐為乙酸酐。 (7) The method according to (6), wherein the fatty acid metal salt is a metal acetate, and the fatty acid anhydride is acetic anhydride.

(8)如(6)或(7)所述之方法,其中1,4-苯二羧酸的莫耳數為4,4’-二羥基聯苯與N-乙醯基-對胺基苯酚的合計莫耳數 之1~1.2倍,或是4,4’-二羥基聯苯與N-乙醯基-對胺基苯酚的合計莫耳數為1,4-苯二羧酸的莫耳數之1~1.2倍。 (8) The method according to (6) or (7), wherein the molar number of 1,4-benzenedicarboxylic acid is 4,4'-dihydroxybiphenyl and N-acetyl-p-aminophenol 1 to 1.2 times the total number of moles, or the total number of moles of 4,4'-dihydroxybiphenyl and N-acetyl-p-aminophenol is the number of moles of 1,4-benzenedicarboxylic acid 1 to 1.2 times the number.

依照本發明,由特定結構單元所構成且在熔融時顯示光學異方性之本發明的全芳香族聚酯醯胺,係低熔點化與耐熱性的並存為充分的。 According to the present invention, the wholly aromatic polyesteramide of the present invention, which is composed of a specific structural unit and exhibits optical anisotropy when melted, is sufficiently compatible with low melting point and heat resistance.

又,因為本發明的全芳香族聚酯醯胺之成形加工溫度不太高,所以即便不使用具有特殊結構之成形機,亦能夠進行射出成形、擠製成形、壓縮成形等。 In addition, since the molding processing temperature of the wholly aromatic polyester amide of the present invention is not too high, injection molding, extrusion molding, compression molding, etc. can be performed even without using a molding machine with a special structure.

本發明的全芳香族聚酯醯胺係如上述具有優異的成形性,而且能夠使用各式各樣的成形機而成形,其結果能夠容易地加工成為各種的立體成形品、纖維、薄膜等。因此,亦能夠容易地得到適合本發明的全芳香族聚酯醯胺的用途之連接器、CPU插座、繼電器開關零件、繞線管、引動器、雜訊減低濾波盒或是OA機器的加熱固定輥等的成形品。 The wholly aromatic polyester amide system of the present invention has excellent moldability as described above and can be molded using various molding machines. As a result, it can be easily processed into various three-dimensional molded products, fibers, films, and the like. Therefore, connectors, CPU sockets, relay switch parts, bobbins, actuators, noise reduction filter boxes, or heating fixation of OA equipment suitable for the use of the wholly aromatic polyesteramide of the present invention can also be easily obtained Molded products such as rolls.

以下,說明本發明的實施形態。又,本發明係不被以下的實施形態限定。 Hereinafter, embodiments of the present invention will be described. In addition, the present invention is not limited by the following embodiments.

<全芳香族聚酯醯胺> <Wholly aromatic polyester amide>

本發明的全芳香族聚酯醯胺,係由下述結構單元(I)、下述結構單元(II)、下述結構單元(III)、下述結構單元(IV)、及下述結構單元(V)所構成。 The wholly aromatic polyester amide of the present invention is composed of the following structural unit (I), the following structural unit (II), the following structural unit (III), the following structural unit (IV), and the following structural unit (V) constituted.

Figure 106140521-A0202-12-0006-12
Figure 106140521-A0202-12-0006-12

Figure 106140521-A0202-12-0006-13
Figure 106140521-A0202-12-0006-13

Figure 106140521-A0202-12-0006-14
Figure 106140521-A0202-12-0006-14

Figure 106140521-A0202-12-0006-15
Figure 106140521-A0202-12-0006-15

Figure 106140521-A0202-12-0006-16
Figure 106140521-A0202-12-0006-16

結構單元(I)係由4-羥基苯甲酸(以下,亦稱為「HBA」)所衍生。相對於總結構單元,本發明的全芳香族聚酯醯胺係含有61~75莫耳%的結構單元(I)。結構單元(I)的含量小於61莫耳%時、或大於75莫耳%時,低熔點化及耐熱性的至少一方容易變為不充分。從低熔點化與耐熱性的並存之觀點而言,結構單元(I)的含量係以61.5~73.5莫耳%為佳,較佳為62~72莫耳%。 The structural unit (I) is derived from 4-hydroxybenzoic acid (hereinafter, also referred to as "HBA"). The wholly aromatic polyesteramide of the present invention contains 61 to 75 mol% of the structural unit (I) relative to the total structural unit. When the content of the structural unit (I) is less than 61 mol%, or when it is more than 75 mol%, at least one of lower melting point and heat resistance tends to become insufficient. From the viewpoint of coexistence of low melting point and heat resistance, the content of the structural unit (I) is preferably 61.5-73.5 mol%, preferably 62-72 mol%.

結構單元(II)係由6-羥基-2-萘甲酸(以下,亦稱為「HNA」)所衍生。相對於總結構單元,本發明的全芳香族聚酯醯胺係含有1~4.5莫耳%的結構單元(II)。結構單元(II)的含量小於1莫耳%時、或大於4.5莫耳%時,低熔點化及耐熱性的至少一方容易變為不充分。從低熔點化與耐熱性的並存之觀點而言, 結構單元(II)的含量係以2~4莫耳%為佳,較佳為3~3.6莫耳%。 The structural unit (II) is derived from 6-hydroxy-2-naphthoic acid (hereinafter also referred to as "HNA"). The wholly aromatic polyesteramide of the present invention contains 1 to 4.5 mol% of the structural unit (II) relative to the total structural unit. When the content of the structural unit (II) is less than 1 mol%, or when it is more than 4.5 mol%, at least one of low melting point and heat resistance tends to become insufficient. From the viewpoint of coexistence of low melting point and heat resistance, the content of the structural unit (II) is preferably 2 to 4 mol%, preferably 3 to 3.6 mol%.

結構單元(III)係由1,4-苯二羧酸(以下,亦稱為「TA」)所衍生。相對於總結構單元,本發明的全芳香族聚酯醯胺係含有10.25~19莫耳%的結構單元(III)。結構單元(III)的含量小於10.25莫耳%時、或大於19莫耳%時,低熔點化及耐熱性的至少一方容易變為不充分。從低熔點化與耐熱性的並存之觀點而言,結構單元(III)的含量係以11.5~18.25莫耳%為佳,較佳為12.5~17.45莫耳%。 The structural unit (III) is derived from 1,4-benzenedicarboxylic acid (hereinafter, also referred to as "TA"). The wholly aromatic polyesteramide of the present invention contains 10.25 to 19 mol% of the structural unit (III) relative to the total structural unit. When the content of the structural unit (III) is less than 10.25 mol%, or when it is more than 19 mol%, at least one of low melting point and heat resistance tends to become insufficient. From the viewpoint of coexistence of low melting point and heat resistance, the content of structural unit (III) is preferably 11.5-18.25 mol%, preferably 12.5-17.45 mol%.

結構單元(IV)係由4,4’-二羥基聯苯(以下,亦稱為「BP」)所衍生。相對於總結構單元,本發明的全芳香族聚酯醯胺係含有3.25~18莫耳%的結構單元(IV)。結構單元(IV)的含量小於3.25莫耳%時、或大於18莫耳%時,低熔點化及耐熱性的至少一方容易變為不充分。從低熔點化與耐熱性的並存之觀點而言,結構單元(IV)的含量係以6.5~16莫耳%為佳,較佳為10~14.25莫耳%。 The structural unit (IV) is derived from 4,4'-dihydroxybiphenyl (hereinafter, also referred to as "BP"). With respect to the total structural units, the wholly aromatic polyesteramide of the present invention contains 3.25 to 18 mol% of structural units (IV). When the content of the structural unit (IV) is less than 3.25 mol% or more than 18 mol%, at least one of lower melting point and heat resistance tends to become insufficient. From the viewpoint of coexistence of low melting point and heat resistance, the content of the structural unit (IV) is preferably 6.5-16 mol%, preferably 10-14.25 mol%.

結構單元(V)係由N-乙醯基-對胺基苯酚(以下,亦稱為「APAP」)所衍生。相對於總結構單元,本發明的全芳香族聚酯醯胺係含有1~7莫耳%的結構單元(V)。結構單元(V)的含量小於1莫耳%時、或大於7莫耳%時,低熔點化及耐熱性的至少一方容易變為不充分。從低熔點化與耐熱性的並存之觀點而言,結構單元(V)的含量係以1.5~6莫耳%為佳,較佳為2~5莫耳%。 The structural unit (V) is derived from N-acetyl-p-aminophenol (hereinafter, also referred to as "APAP"). The wholly aromatic polyester amide system of the present invention contains 1 to 7 mol% of the structural unit (V) relative to the total structural unit. When the content of the structural unit (V) is less than 1 mol% or more than 7 mol%, at least one of lower melting point and heat resistance tends to become insufficient. From the viewpoint of coexistence of low melting point and heat resistance, the content of the structural unit (V) is preferably 1.5-6 mol%, preferably 2-5 mol%.

從低熔點化與耐熱性的並存之觀點而言,結構單元(III)的莫耳數(以下,亦稱為「莫耳數1A」)係結構單元(IV)與結構單元(V)的合計莫耳數(以下,亦稱為「莫耳數2A」)之 1~1.2倍,或是結構單元(IV)與結構單元(V)的合計莫耳數係結構單元(III)的莫耳數之1~1.2倍為佳。莫耳數1A係莫耳數2A的1.01~1.06倍,或是莫耳數2A係莫耳數1A的1.01~1.06倍為較佳。莫耳數1A係莫耳數2A的1.02~1.03倍,或是莫耳數2A係莫耳數1A的1.02~1.03倍為更佳。莫耳數1A係莫耳數2A的1.024~1.030倍,或是莫耳數2A係莫耳數1A的1.024~1.030倍為特佳。 From the viewpoint of coexistence of low melting point and heat resistance, the molar number of structural unit (III) (hereinafter also referred to as "molar number 1A") is the sum of structural unit (IV) and structural unit (V) The number of moles (hereinafter, also referred to as "number of moles 2A") is 1 to 1.2 times, or the total number of moles of structural unit (IV) and structural unit (V), the number of moles of structural unit (III) 1~1.2 times is better. Preferably, the molar number 1A is 1.01 to 1.06 times the molar number 2A, or the molar number 2A is 1.01 to 1.06 times the molar number 1A. The molar number 1A is 1.02~1.03 times the molar number 2A, or the molar number 2A is 1.02~1.03 times the molar number 1A. The molar number 1A is 1.024~1.030 times the molar number 2A, or the molar number 2A is 1.024~1.030 times the molar number 1A.

如以上,因為本發明的全芳香族聚酯醯胺係相對於總結構單元,含有特定量之特定結構單元(I)~(V),所以低熔點化與耐熱性的並存為充分的。又,本發明的全芳香族聚酯醯胺係相對於總結構單元,合計為含有100莫耳%的結構單元(I)~(V)。 As described above, since the wholly aromatic polyesteramide of the present invention contains specific structural units (I) to (V) in a specific amount relative to the total structural units, the coexistence of low melting point and heat resistance is sufficient. In addition, the wholly aromatic polyester amide system of the present invention contains 100 mol% of the structural units (I) to (V) in total with respect to the total structural units.

作為上述耐熱性之指標,可舉出荷重撓曲溫度(以下,亦稱為「DTUL」)。DTUL為270C以上時,耐熱性有變高之傾向,乃是較佳。DTUL係將前述全芳香族聚酯醯胺60質量%、及平均纖維徑11μm、平均纖維長75μm的磨碎纖維40質量%,在前述全芳香族聚酯醯胺的熔點+20℃進行熔融混煉得到的聚酯醯胺樹脂組合物之狀態下所測定之值,而且能夠依據ISO75-1,2而測定。從低熔點化與耐熱性的並存之觀點而言,DTUL係以271℃以上且小於320℃為佳,較佳為272~288℃。 As an index of the above-mentioned heat resistance, a deflection temperature under load (hereinafter, also referred to as "DTUL") can be cited. When the DTUL is 270C or higher, the heat resistance tends to increase, which is preferable. DTUL is based on 60% by mass of the aforementioned wholly aromatic polyesteramide, and 40% by mass of ground fibers with an average fiber diameter of 11μm and an average fiber length of 75μm. The value measured in the state of the polyester amide resin composition obtained by refining, and can be measured in accordance with ISO75-1,2. From the viewpoint of coexistence of low melting point and heat resistance, DTUL is preferably 271°C or more and less than 320°C, preferably 272 to 288°C.

其次,說明本發明的全芳香族聚酯醯胺之製造方法。本發明的全芳香族聚酯醯胺係能夠使用直接聚合法、酯交換法等而聚合。聚合時係能夠使用熔融聚合法、溶液聚合法、漿料聚合法、固相聚合法等、或該等2種以上之組合,而且能 夠適合使用熔融聚合法、或熔融聚合法與固相聚合法之組合。 Next, the method for producing the wholly aromatic polyester amide of the present invention will be explained. The wholly aromatic polyester amide system of the present invention can be polymerized using a direct polymerization method, a transesterification method, or the like. For polymerization, melt polymerization method, solution polymerization method, slurry polymerization method, solid phase polymerization method, etc., or a combination of two or more of these can be used, and melt polymerization method, or melt polymerization method and solid phase polymerization method can be suitably used.的组合。 The combination.

在本發明,聚合時係能夠使用對聚合單體之醯基化劑、作為醯基氯衍生物之將末端活性化之單體。作為醯基化劑,可舉出乙酸酐等的脂肪酸酐。 In the present invention, it is possible to use an acylating agent for polymerized monomers and a monomer that activates the terminal as an acetyl chloride derivative during polymerization. Examples of the acylating agent include fatty acid anhydrides such as acetic anhydride.

該等聚合時能夠使用各種觸媒,作為代表性之物,可舉出二烷基錫氧化物、二芳基錫氧化物、二氧化鈦、矽酸烷氧基鈦類、鈦醇化物類、脂肪酸金屬鹽、如BF3的路易斯酸鹽等,以脂肪酸金屬鹽為佳。觸媒的使用量係通常基於單體的總質量為約0.001~1質量%,以約0.003~0.2質量%為特佳。 Various catalysts can be used in these polymerizations. Representative examples include dialkyl tin oxides, diaryl tin oxides, titanium dioxide, alkoxide titanium silicates, titanium alcoholates, and fatty acid metals. The salt, such as the Lewis acid salt of BF3, is preferably a fatty acid metal salt. The amount of the catalyst used is usually about 0.001 to 1% by mass based on the total mass of the monomers, preferably about 0.003 to 0.2% by mass.

又,進行溶液聚合或是漿料聚合時,作為溶劑,能夠使用流動石蠟、高耐熱性合成油、惰性礦物油等。 In addition, when performing solution polymerization or slurry polymerization, fluidized paraffin, highly heat-resistant synthetic oil, inert mineral oil, etc. can be used as the solvent.

作為反應條件,例如反應溫度200~380℃、最後到達壓力0.1~760Torr(亦即13~101,080Pa)。特別是熔融反應,係例如反應溫度260~380C,較佳為300~360℃,最後到達壓力1~100Torr(亦即133~13,300Pa),較佳為1~50Torr(亦即133~6,670Pa)。 As the reaction conditions, for example, the reaction temperature is 200 to 380°C, and the final pressure is 0.1 to 760 Torr (that is, 13 to 101,080 Pa). Especially for melting reaction, for example, the reaction temperature is 260~380C, preferably 300~360℃, and the final pressure is 1~100 Torr (that is, 133~13,300Pa), preferably 1~50 Torr (that is, 133~6,670Pa) .

反應係能夠將全部原料單體(HBA、HNA、TA、BP、及APAP)、醯基化劑、及觸媒添加至相同的反應容器而使反應開始(一段方式),亦可使用醯基化劑將原料單體HBA、HNA、BP、及APAP的羥基使其醯基化後,使其與TA的羧基反應(二段方式)。 The reaction system can add all the raw material monomers (HBA, HNA, TA, BP, and APAP), acylating agent, and catalyst to the same reaction vessel to start the reaction (one-stage method), or acylation The agent acylated the hydroxyl groups of the raw material monomers HBA, HNA, BP, and APAP, and then reacted with the carboxyl group of TA (two-stage method).

熔融聚合係反應系統內到達預定溫度後,開始減壓使其成為預定減壓度而進行。攪拌機的轉矩到達預定值之後,導入惰性氣體且從減壓狀態起經過常壓而成為預定加壓狀態,而且將全芳香族聚酯醯胺從反應系統排出。 After the temperature in the melt polymerization system reaches a predetermined temperature, the pressure is reduced to a predetermined degree of pressure reduction. After the torque of the stirrer reaches a predetermined value, an inert gas is introduced and the pressure is passed from the reduced pressure state to a predetermined pressurized state, and the wholly aromatic polyesteramide is discharged from the reaction system.

依照上述聚合方法而製造的全芳香族聚酯醯胺,係藉由進一步在常壓或減壓、惰性氣體中加熱之固相聚合,而能夠謀求分子量增加。固相聚合反應的較佳條件,係反應溫度230~350℃,較佳為260~330℃,最後到達壓力10~760Torr(亦即1,330~101,080Pa)。 The wholly aromatic polyester amide produced according to the above-mentioned polymerization method can achieve an increase in molecular weight by further solid-phase polymerization by heating under normal pressure or reduced pressure under an inert gas. The preferred conditions for the solid-phase polymerization reaction are the reaction temperature of 230-350°C, preferably 260-330°C, and the final pressure is 10 to 760 Torr (that is, 1,330 to 101,080 Pa).

本發明的全芳香族聚酯醯胺之製造方法,係以包含在脂肪酸金屬鹽的存在下,使用脂肪酸酐將4-羥基苯甲酸、6-羥基-2-萘甲酸、4,4’-二羥基聯苯、及N-乙醯基-對胺基苯酚醯基化且與1,4-苯二羧酸進行酯交換之步驟為佳,而且相對於由4-羥基苯甲酸、6-羥基-2-萘甲酸、1,4-苯二羧酸、4,4’-二羥基聯苯、及N-乙醯基-對胺基苯酚所構成且使用在前述方法之總單體,4-羥基苯甲酸的使用量為61~75莫耳%,從低熔點化與耐熱性的並存之觀點而言,以61.5~73.5莫耳%為佳,較佳為62~72莫耳%,6-羥基-2-萘甲酸的使用量為1~4.5莫耳%,從低熔點化與耐熱性的並存之觀點而言,以2~4莫耳%為佳,較佳為3~3.6莫耳%,1,4-苯二羧酸的使用量為10.25~19莫耳%,從低熔點化與耐熱性的並存之觀點而言,以11.5~18.25莫耳%為佳,較佳為12.5~17.45莫耳%,4,4’-二羥基聯苯的使用量為3.25~18莫耳%,從低熔點化與耐熱性的並存之觀點而言,以6.5~16莫耳%為佳,較佳為10~14.25莫耳%, N-乙醯基-對胺基苯酚的使用量為1~7莫耳%,從低熔點化與耐熱性的並存之觀點而言,以1.5~6莫耳%為佳,較佳為2~5莫耳%,4-羥基苯甲酸、6-羥基-2-萘甲酸、1,4-苯二羧酸、4,4’-二羥基聯苯、及N-乙醯基-對胺基苯酚的合計使用量,係以100莫耳%為佳,前述脂肪酸酐的使用量,係以4-羥基苯甲酸、6-羥基-2-萘甲酸、4,4’-二羥基聯苯、及N-乙醯基-對胺基苯酚的合計羥基當量之1.02~1.05倍為佳。上述脂肪酸金屬鹽為乙酸金屬鹽,上述脂肪酸酐係以乙酸酐為較佳。又,1,4-苯二羧酸的莫耳數(以下,亦稱為「莫耳數1B」)係4,4’-二羥基聯苯與N-乙醯基-對胺基苯酚的合計莫耳數(以下,亦稱為「莫耳數2B」)的1~1.2倍,或是4,4’-二羥基聯苯與N-乙醯基-對胺基苯酚的合計莫耳數係以1,4-苯二羧酸的莫耳數之1~1.2倍為較佳。莫耳數1B係莫耳數2B的1.01~1.06倍,或是莫耳數2B係以莫耳數1B之1.01~1.06倍為更佳。莫耳數1B為莫耳數2B的1.02~1.03倍,或是莫耳數2B係以莫耳數1B的1.02~1.03倍為又更佳。莫耳數1B係莫耳數2B的1.024~1.030倍,或是莫耳數2B係以莫耳數1B的1.024~1.030倍為特佳。 The manufacturing method of the wholly aromatic polyester amide of the present invention is to include 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, 4,4'-di The step of hydroxybiphenyl and N-acetyl-p-aminophenol acylation and transesterification with 1,4-benzenedicarboxylic acid is better, and is better than 4-hydroxybenzoic acid, 6-hydroxy- The total monomer composed of 2-naphthoic acid, 1,4-benzenedicarboxylic acid, 4,4'-dihydroxybiphenyl, and N-acetyl-p-aminophenol and used in the aforementioned method, 4-hydroxyl The amount of benzoic acid used is 61~75 mol%. From the viewpoint of coexistence of low melting point and heat resistance, 61.5-73.5 mol% is preferred, and 62-72 mol% is more preferred. 6-hydroxyl The usage amount of -2-naphthoic acid is 1 to 4.5 mol%. From the viewpoint of coexistence of low melting point and heat resistance, it is preferably 2 to 4 mol%, preferably 3 to 3.6 mol%, The amount of 1,4-benzenedicarboxylic acid used is 10.25-19 mol%. From the viewpoint of coexistence of low melting point and heat resistance, 11.5-18.25 mol% is preferred, and 12.5-17.45 mol% is more preferred. Ear%, the usage amount of 4,4'-dihydroxybiphenyl is 3.25-18 mol%. From the viewpoint of coexistence of low melting point and heat resistance, 6.5-16 mol% is preferred, and more preferably 10~14.25 mol%, the use amount of N-acetyl-p-aminophenol is 1-7 mol%, from the viewpoint of coexistence of low melting point and heat resistance, 1.5-6 mol% Better, preferably 2~5 mol%, 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, 1,4-benzenedicarboxylic acid, 4,4'-dihydroxybiphenyl, and N-ethyl The total usage amount of acyl-p-aminophenol is preferably 100 mol%. The usage amount of the aforementioned fatty acid anhydride is 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, 4,4'- The total hydroxyl equivalent of dihydroxybiphenyl and N-acetyl-p-aminophenol is preferably 1.02~1.05 times. The fatty acid metal salt is an acetic acid metal salt, and the fatty acid anhydride is preferably acetic anhydride. In addition, the molar number of 1,4-benzenedicarboxylic acid (hereinafter also referred to as "molar number 1B") is the total of 4,4'-dihydroxybiphenyl and N-acetyl-p-aminophenol The molar number (hereinafter, also referred to as "molar number 2B") is 1 to 1.2 times, or the total molar number system of 4,4'-dihydroxybiphenyl and N-acetyl-p-aminophenol The molar number of 1,4-benzenedicarboxylic acid is preferably 1 to 1.2 times. The molar number 1B is 1.01~1.06 times the molar number 2B, or the molar number 2B is 1.01~1.06 times the molar number 1B. The molar number 1B is 1.02 to 1.03 times the molar number 2B, or the molar number 2B is 1.02 to 1.03 times the molar number 1B. The molar number 1B is 1.024~1.030 times the molar number 2B, or the molar number 2B is 1.024~1.030 times the molar number 1B.

其次,說明全芳香族聚酯醯胺的性質。本發明的全芳香族聚酯醯胺係在熔融時顯示光學異方性。所謂熔融時顯示光學異方性,係意味著本發明的全芳香族聚酯醯胺為液晶體聚合物。 Next, the properties of the wholly aromatic polyester amide will be explained. The wholly aromatic polyesteramide of the present invention exhibits optical anisotropy when melted. The expression of optical anisotropy during melting means that the wholly aromatic polyesteramide of the present invention is a liquid crystal polymer.

在本發明,全芳香族聚酯醯胺為液晶體聚合物, 係全芳香族聚酯醯胺在兼具熱安定性與易加工性方面不可缺少的要素。雖然由上述結構單元(I)~(V)所構成之全芳香族聚酯醯胺,依照構成成分及聚合物中的順序分布,亦存在未形成異方性熔融相之物,但是本發明的聚合物係限定為熔融時顯示光學異方性之全芳香族聚酯醯胺。 In the present invention, the wholly aromatic polyesteramide is a liquid crystal polymer, which is an indispensable element for the wholly aromatic polyesteramide to have both thermal stability and ease of processing. Although the wholly aromatic polyester amides composed of the above structural units (I) to (V) are distributed according to the order of the constituent components and the polymer, there are also substances that do not form an anisotropic melt phase, but the present invention The polymer is limited to a wholly aromatic polyesteramide that exhibits optical anisotropy when melted.

熔融異方性的性質,係能夠藉由利用正交偏光鏡之慣用的偏光檢查方法來確認。更具體地,熔融異方性的確認,係能夠藉由使用Olympus公司製偏光顯微鏡且將載置在Linkam公司製熱載台(hot stage)之試料熔融,而且在氮氣環境下以150倍的倍率觀察來實施。液晶性聚合物為光學異方性,插入至正交偏光鏡之間時係使光線透射。試料為光學異方性時,例如即便為熔融靜止液狀態,偏光亦透射。 The nature of melting anisotropy can be confirmed by the usual polarization inspection method using crossed polarizers. More specifically, the melting anisotropy can be confirmed by using a polarizing microscope manufactured by Olympus Corporation and melting a sample placed on a hot stage manufactured by Linkam Corporation, and at a magnification of 150 times in a nitrogen environment. Observe to implement. Liquid crystalline polymers are optically anisotropic and transmit light when inserted between crossed polarizers. When the sample is optically anisotropic, for example, even if it is in a molten static liquid state, polarized light is transmitted.

因為向列的液晶體聚合物在熔點以上係顯著地產生黏性降低,所以通常在熔點或其以上的溫度顯示液晶性係成為加工性的指標。從耐熱性的觀點而言,熔點係以盡可能較高為佳,但是考慮聚合物的熔融加工時的熱劣化、成形機的加熱能力等,350℃以下係成為合適的目標。又,較佳為320~350℃,更佳為344~349℃。 Since nematic liquid crystal polymers have a significant decrease in viscosity above the melting point, the liquid crystallinity is usually shown at a temperature above the melting point and becomes an index of processability. From the viewpoint of heat resistance, the melting point is preferably as high as possible. However, considering the thermal degradation during the melt processing of the polymer, the heating capacity of the molding machine, etc., 350° C. or less is a suitable target. Furthermore, it is preferably 320 to 350°C, more preferably 344 to 349°C.

在比本發明的全芳香族聚酯醯胺的熔點更高10~30℃的溫度且切剪速度1000/秒之前述全芳香族聚酯醯胺的熔融黏度,係以500Pa‧s以下為佳,較佳為0.5~300Pa‧s,更佳為1~100Pa‧s。上述熔融黏度為上述範圍內時,前述全芳香族聚酯醯胺本身、或含有前述全芳香族聚酯醯胺之組合物,在其成形時係容易確保流動性且填充壓力不容易太高。又,在 本說明書,所謂熔融黏度,係指依據ISO11443而測定的熔融黏度。 The melt viscosity of the aforementioned wholly aromatic polyester amide at a temperature 10~30°C higher than the melting point of the wholly aromatic polyester amide of the present invention and a cutting speed of 1000/sec is preferably 500Pa‧s or less , Preferably 0.5~300Pa‧s, more preferably 1~100Pa‧s. When the melt viscosity is within the above range, the wholly aromatic polyesteramide itself or the composition containing the wholly aromatic polyesteramide can easily ensure fluidity during molding and the filling pressure is not likely to be too high. In this specification, the melt viscosity refers to the melt viscosity measured in accordance with ISO11443.

作為表示上述耐熱性之指標,亦可舉出熔點與DTUL之差。該差為85℃以下時,耐熱性有變高之傾向,乃是較佳。從低熔點化與耐熱性的並存之觀點而言,上述差係以大於0℃且79℃以下(例如50℃以上且79℃以下)為佳,較佳為61~75℃。 As an index showing the above-mentioned heat resistance, the difference between the melting point and DTUL can also be cited. When the difference is 85°C or less, the heat resistance tends to increase, which is preferable. From the viewpoint of coexistence of low melting point and heat resistance, the above difference is preferably greater than 0°C and 79°C or less (for example, 50°C or more and 79°C or less), and preferably 61 to 75°C.

<聚酯醯胺樹脂組合物> <Polyesteramide resin composition>

上述本發明的全芳香族聚酯醯胺,係能夠按照使用目的而調配各種纖維狀、粉粒狀、板狀無機及有機填充劑。 The above-mentioned wholly aromatic polyesteramide of the present invention can be formulated with various fibrous, powdery, and plate-shaped inorganic and organic fillers according to the purpose of use.

作為在本發明的聚酯醯胺樹脂組合物所調配之無機填充劑,有纖維狀、粒狀、板狀之物。 As the inorganic filler blended in the polyester amide resin composition of the present invention, there are fibrous, granular, and plate-like materials.

作為纖維狀無機填充劑,可舉出玻璃纖維、石棉纖維、氧化矽纖維、氧化矽‧氧化鋁纖維、氧化鋁纖維、氧化鋯纖維、氮化硼纖維、氮化矽纖維、硼纖維、鈦酸鉀纖維、如矽灰石(wollastonite)之矽酸鹽的纖維、硫酸鎂纖維、硼酸鋁纖維、進而不鏽鋼、鋁、鈦、銅、黃銅等金屬的纖維狀物等的無機質纖維狀物質。特別具有代表性的纖維狀填充劑為玻璃纖維。 Examples of fibrous inorganic fillers include glass fiber, asbestos fiber, silica fiber, silica and alumina fiber, alumina fiber, zirconia fiber, boron nitride fiber, silicon nitride fiber, boron fiber, titanic acid Potassium fibers, silicate fibers such as wollastonite, magnesium sulfate fibers, aluminum borate fibers, and inorganic fibrous substances such as fibrous materials of metals such as stainless steel, aluminum, titanium, copper, and brass. A particularly representative fibrous filler is glass fiber.

又,作為粉粒狀無機填充劑,可舉出碳黑、石墨、氧化矽、石英粉末、玻璃珠、碾磨玻璃纖維、玻璃球、玻璃粉、如矽酸鈣、矽酸鋁、高嶺土、黏土、矽藻土、矽灰石之矽酸鹽、如氧化鐵、氧化鈦、氧化鋅、三氧化銻、氧化鋁之金屬氧化物、如碳酸鈣、碳酸鎂之金屬碳酸鹽、如硫酸鈣、硫酸鋇之金屬的 硫酸鹽、以及肥粒鐵、碳化矽、氮化矽、氮化硼、各種金屬粉末等。 In addition, as the powdery inorganic filler, carbon black, graphite, silica, quartz powder, glass beads, milled glass fibers, glass balls, glass powder, such as calcium silicate, aluminum silicate, kaolin, and clay can be mentioned. , Diatomaceous earth, silicates of wollastonite, metal oxides such as iron oxide, titanium oxide, zinc oxide, antimony trioxide, aluminum oxide, metal carbonates such as calcium carbonate, magnesium carbonate, such as calcium sulfate, sulfuric acid Metal sulfate of barium, as well as ferrous iron, silicon carbide, silicon nitride, boron nitride, various metal powders, etc.

又,作為板狀無機填充劑,可舉出雲母、玻璃碎片、滑石、各種金屬箔等。 Moreover, as a plate-shaped inorganic filler, mica, glass fragments, talc, various metal foils, etc. are mentioned.

揭示有機填充劑的例子時,有芳香族聚酯纖維、液晶性聚合物纖維、芳香族聚醯胺、聚醯亞胺纖維等的耐熱性高強度合成纖維等。 When revealing examples of organic fillers, there are heat-resistant high-strength synthetic fibers such as aromatic polyester fibers, liquid crystalline polymer fibers, aromatic polyamides, and polyimide fibers.

該等無機及有機填充劑係能夠使用一種或併用二種以上。纖維狀無機填充劑與粒狀或板狀無機填充劑之併用,就兼備機械強度與尺寸精確度、電性質等而言,乃是較佳組合。特佳是作為纖維狀填充劑之玻璃纖維、作為板狀填充劑之雲母及滑石,其調配量係相對於全芳香族聚酯醯胺100質量份為120質量份以下,較佳為20~80質量份。藉由將玻璃纖維與雲母或滑石組合,聚酯醯胺樹脂組合物之熱變形溫度、機械的物性等的提升為特別顯著。 These inorganic and organic fillers can be used singly or in combination of two or more. The combined use of fibrous inorganic fillers and granular or plate-shaped inorganic fillers is a preferred combination in terms of having both mechanical strength, dimensional accuracy, and electrical properties. Particularly preferred are glass fiber as a fibrous filler, mica and talc as a plate-like filler, and the blending amount is 120 parts by mass or less relative to 100 parts by mass of the wholly aromatic polyester amide, preferably 20 to 80 Mass parts. By combining glass fiber with mica or talc, the heat distortion temperature and mechanical properties of the polyester amide resin composition are particularly improved.

在使用該等填充劑時,必要時亦能夠使用收斂劑(astringent)或是表面處理劑。 When using these fillers, astringents or surface treatment agents can also be used when necessary.

本發明的聚酯醯胺樹脂組合物,係如上述,含有本發明的全芳香族聚酯醯胺、無機或是有機填充劑作為必要成分,但是只要在不妨害本發明的效果之範圍,亦可含有其它成分。在此,所謂其它成分,可為任何成分,例如能夠舉出其它的樹脂、抗氧化劑、安定劑、顏料、結晶核劑等的添加劑。 The polyester amide resin composition of the present invention, as described above, contains the wholly aromatic polyester amide of the present invention, inorganic or organic fillers as essential components, but as long as it is within a range that does not impair the effects of the present invention, May contain other ingredients. Here, the other components may be any components, and for example, additives such as other resins, antioxidants, stabilizers, pigments, and crystal nucleating agents can be cited.

又,本發明的聚酯醯胺樹脂組合物之製造方法係沒有特別限定,能夠使用先前習知的方法,來調製聚酯醯胺樹 脂組合物。 In addition, the production method of the polyester amide resin composition of the present invention is not particularly limited, and a conventionally known method can be used to prepare the polyester amide resin composition.

<聚酯醯胺成形品> <Polyester Amide Molded Products>

本發明的聚酯醯胺成形品,係將本發明的全芳香族聚酯醯胺或是聚酯醯胺樹脂組合物進行成形而成。成形方法係沒有特別限定,能夠採用通常的成形方法。作為通常的成形方法,能夠例示射出成形、擠製成形、壓縮成形、吹氣成形、真空成形、發泡成形、旋轉成形、氣體注射成形等的方法。 The polyester amide molded product of the present invention is formed by molding the wholly aromatic polyester amide or the polyester amide resin composition of the present invention. The forming method is not particularly limited, and ordinary forming methods can be adopted. As a general molding method, methods such as injection molding, extrusion molding, compression molding, blow molding, vacuum molding, foam molding, rotary molding, and gas injection molding can be exemplified.

將本發明的全芳香族聚酯醯胺等成形而成之聚酯醯胺成形品,係具有優異的耐熱性、韌性。又,將本發明的聚酯醯胺樹脂組合物成形而成之聚酯醯胺成形品,因為具有優異的耐熱性、韌性之同時,亦含有無機或有機填充劑,所以能夠進一步改善機械強度等。 The polyester amide molded product formed by molding the wholly aromatic polyester amide etc. of the present invention has excellent heat resistance and toughness. In addition, the polyester amide molded article formed by molding the polyester amide resin composition of the present invention has excellent heat resistance and toughness, and also contains inorganic or organic fillers, so it can further improve the mechanical strength, etc. .

又,本發明的全芳香族聚酯醯胺、聚酯醯胺樹脂組合物,因為具有優異的成形性,所以能夠容易地得到所需要形狀的聚酯醯胺成形品。 In addition, the wholly aromatic polyester amide and polyester amide resin composition of the present invention has excellent moldability, and therefore, a polyester amide molded product of a desired shape can be easily obtained.

作為具有具有如以上的性質之本發明的聚酯醯胺成形品的適合用途,可舉出連接器、CPU插座、繼電器開關零件、繞線管、引動器、雜訊減低濾波盒或OA機器的加熱固定輥等。 Suitable applications of the polyester amide molded product of the present invention having the above-mentioned properties include connectors, CPU sockets, relay switch parts, bobbins, actuators, noise reduction filter boxes, or OA equipment. Heating fixed rollers, etc.

[實施例] [Example]

以下,實施例而更詳細地說明本發明,但是本發明係不被以下的實施例限定。 The following examples illustrate the present invention in more detail, but the present invention is not limited by the following examples.

<實施例1> <Example 1>

在具備攪拌機、回流管柱、單體投入口、氮氣導入口、減 壓/流出管線之聚合容器,添加以下的原料單體、脂肪酸金屬鹽觸媒、醯基化劑且開始氮氣取代。 In a polymerization vessel equipped with a stirrer, a reflux column, a monomer input port, a nitrogen inlet, and a pressure reduction/outflow line, the following raw material monomers, fatty acid metal salt catalysts, and acylating agents are added, and nitrogen substitution is started.

(I)4-羥基苯甲酸10.41莫耳%(62莫耳%)(HBA) (I) 4-Hydroxybenzoic acid 10.41 mol% (62 mol%) (HBA)

(II)6-羥基-2-萘甲酸0.61莫耳%(3.6莫耳%)(HNA) (II) 6-hydroxy-2-naphthoic acid 0.61 mol% (3.6 mol%) (HNA)

(III)對苯二甲酸2.93莫耳%(17.45莫耳%)(TA) (III) Terephthalic acid 2.93 mol% (17.45 mol%) (TA)

(IV)4,4’-二羥基聯苯2.01莫耳%(11.95莫耳%)(BP) (IV) 4,4’-Dihydroxybiphenyl 2.01 mol% (11.95 mol%) (BP)

(V)N-乙醯基-對胺基苯酚0.84莫耳%(5莫耳%)(APAP) (V) N-acetyl-p-aminophenol 0.84 mol% (5 mol%) (APAP)

乙酸鉀觸媒50ppm Potassium acetate catalyst 50ppm

乙酸酐1669g(HBA、HNA、BP及APAP的合計羥基當量的1.03倍) Acetic anhydride 1669g (1.03 times the total hydroxyl equivalent of HBA, HNA, BP and APAP)

添加原料後,將反應系統的溫度上升至140℃且在140℃使其反應1小時。隨後,進一步以5.5小時升溫至360℃為止,隨後以20分鐘減壓至10Torr(亦即1330Pa)為止,而使乙酸、過剩的乙酸酐、其它低沸點成分邊餾出邊進一步熔融聚合。攪拌轉矩到達預定值之後,導入氮氣而從減壓狀態經過常壓而成為加壓狀態,將聚合物從聚合容器的下部排出。 After adding the raw materials, the temperature of the reaction system was increased to 140°C and reacted at 140°C for 1 hour. Subsequently, the temperature was further increased to 360° C. in 5.5 hours, and then the pressure was reduced to 10 Torr (that is, 1330 Pa) in 20 minutes, and acetic acid, excess acetic anhydride, and other low-boiling components were further melt-polymerized while distilling out. After the stirring torque reaches a predetermined value, nitrogen is introduced to pass through normal pressure from a reduced pressure state to become a pressurized state, and the polymer is discharged from the lower part of the polymerization vessel.

<評價> <evaluation>

針對實施例1的全芳香族聚酯醯胺,使用以下的方法進行評價熔點、DTUL、熔融黏度、及製造性。將評價結果顯示在表1。 With respect to the wholly aromatic polyesteramide of Example 1, the following methods were used to evaluate the melting point, DTUL, melt viscosity, and manufacturability. The evaluation results are shown in Table 1.

[熔點] [Melting point]

藉由DSC(TA Instruments公司製)在從室溫起20℃/分鐘的升溫條件下測定聚合物時觀測能夠觀測到的吸熱尖峰溫度(Tm1)之後,在(Tm1+40)℃的溫度保持2分鐘之後,在20℃/分鐘的降溫條件下,一次冷卻至室溫之後,再次測定在20℃/ 分鐘的升溫條件下測定時能夠觀測到的吸熱尖峰溫度。 After observing the endothermic peak temperature (Tm1) that can be observed when measuring the polymer under a temperature rising condition of 20°C/min from room temperature by DSC (manufactured by TA Instruments), the temperature is maintained at (Tm1+40)°C for 2 Minutes later, after cooling to room temperature once at a temperature decrease of 20°C/min, the endothermic peak temperature that can be observed during the measurement under a temperature increase condition of 20°C/min is measured again.

[DTUL] [DTUL]

將聚合物60質量%與玻璃纖維(Central硝子(股)製EFH75-01、磨碎纖維、平體纖維徑11μm、平均纖維長75μm)40質量%使用雙軸擠製機((股)日本製鋼所製TEX30α型)且在聚合物的熔點+20℃之缸筒溫度進行熔融混煉來得到聚酯醯胺樹脂組合物丸粒。 60% by mass of polymer and 40% by mass of glass fiber (EFH75-01 manufactured by Central Glass Co., Ltd., ground fiber, flat fiber diameter 11μm, average fiber length 75μm) using a biaxial extruder ((stock) Nippon Steel The prepared TEX30α type) and melt-kneaded at the melting point of the polymer + the cylinder temperature of 20°C to obtain the polyester amide resin composition pellets.

將上述聚酯醯胺樹脂組合物丸粒,使用成形機(住友重機械工業(股)製「SE100DU」)且在以下的成形條件下成形而得到測定用試片(4mm×10mm×80mm)。使用該試片且藉由依據ISO75-1,2之方法測定荷重撓曲溫度。又,作為彎曲應力,係採用1.8MPa。將結果顯示在表1。 The above-mentioned polyester amide resin composition pellets were molded under the following molding conditions using a molding machine ("SE100DU" manufactured by Sumitomo Heavy Industries Co., Ltd.) to obtain test pieces for measurement (4 mm × 10 mm × 80 mm). Use this test piece and measure the deflection temperature under load by the method according to ISO75-1,2. In addition, 1.8 MPa was adopted as the bending stress. The results are shown in Table 1.

[成形條件] [Forming conditions]

缸筒溫度:聚合物的熔點+15℃ Cylinder temperature: melting point of polymer +15℃

模具溫度:80℃ Mold temperature: 80℃

背壓:2MPa Back pressure: 2MPa

射出速度:33mm/sec Injection speed: 33mm/sec

[熔融黏度] [Melting viscosity]

使用(股)東洋精機製作所製流動特性儀(CAPIROGRAPH)1B型,且在比液晶性聚合物的熔點更高10~30℃的溫度,使用內徑1mm、長度20mm的孔口,以切剪速度1000/秒依據ISO11443而測定液晶性聚合物的熔融黏度。又,測定溫度係針對實施例1~6、以及比較例1、2及4為360℃,針對比較例3為370℃,針對比較例5及6為380℃。 Use CAPIROGRAPH 1B model manufactured by Toyo Seiki Seisakusho Co., Ltd., and use an orifice with an inner diameter of 1 mm and a length of 20 mm at a temperature 10 to 30°C higher than the melting point of the liquid crystalline polymer, at a cutting speed 1000/sec. The melt viscosity of the liquid crystalline polymer was measured in accordance with ISO11443. In addition, the measurement temperature was 360°C for Examples 1 to 6, and Comparative Examples 1, 2, and 4, 370°C for Comparative Example 3, and 380°C for Comparative Examples 5 and 6.

[製造性] [Manufacturability]

觀察將聚合物從上述的聚合容器下部排出時的舉動,依照以下的基準而進行評價製造性。將結果顯示在表1。 The behavior when the polymer was discharged from the lower part of the polymerization vessel was observed, and the manufacturability was evaluated in accordance with the following criteria. The results are shown in Table 1.

○:沒有問題地能夠將聚合物製成股線且排出,而且能夠將該股線切割成為丸粒狀時,係評定為製造性良好。 ○: When the polymer can be formed into strands and discharged without problems, and the strands can be cut into pellets, the manufacturability is evaluated as good.

×:在聚合途中於容器內產生固化等而無法將聚合物排出時、或即便能夠將聚合物以股線的方式排出但無法將該股線切割時,係評定為製造性不良。 ×: When solidification or the like occurs in the container during polymerization and the polymer cannot be discharged, or even if the polymer can be discharged as a strand, the strand cannot be cut, it is evaluated as poor manufacturability.

<實施例2~6、比較例1~10> <Examples 2-6, Comparative Examples 1-10>

除了使原料單體的種類、添加比率(莫耳%)如表1及2以外,係與實施例1同樣地進行而得到聚合物。又,與實施例1進行同樣的評價。將評價結果顯示在表1及2。 Except having made the kind of raw material monomer and the addition ratio (mol %) as Tables 1 and 2, it carried out similarly to Example 1, and obtained the polymer. In addition, the same evaluation as in Example 1 was performed. The evaluation results are shown in Tables 1 and 2.

Figure 106140521-A0202-12-0018-17
Figure 106140521-A0202-12-0018-17

Figure 106140521-A0202-12-0019-18
Figure 106140521-A0202-12-0019-18

Figure 106140521-A0202-11-0002-6
Figure 106140521-A0202-11-0002-6

Claims (10)

一種全芳香族聚酯醯胺,係由下述結構單元(I)~(V)作為必要的構成成分所構成:相對於總結構單元,結構單元(I)的含量為62~75莫耳%,相對於總結構單元,結構單元(II)的含量為1~4.5莫耳%,相對於總結構單元,結構單元(III)的含量為10.25~19莫耳%,相對於總結構單元,結構單元(IV)的含量為3.25~18莫耳%,及相對於總結構單元,結構單元(V)的含量為1~7莫耳%,相對於總結構單元,結構單元(I)~(V)的合計含量為100莫耳%,結構單元(III)的莫耳數為結構單元(IV)與結構單元(V)的合計莫耳數之1.01~1.06倍,或是結構單元(IV)與結構單元(V)的合計莫耳數為結構單元(III)的莫耳數之1.01~1.06倍且在熔融時顯示光學異方性:
Figure 106140521-A0305-02-0023-1
Figure 106140521-A0305-02-0023-2
Figure 106140521-A0305-02-0023-3
Figure 106140521-A0305-02-0023-4
Figure 106140521-A0305-02-0023-5
A wholly aromatic polyester amide, which is composed of the following structural units (I) ~ (V) as essential constituents: relative to the total structural units, the content of structural unit (I) is 62~75 mol% , Relative to the total structural unit, the content of structural unit (II) is 1~4.5 mol%, relative to the total structural unit, the content of structural unit (III) is 10.25-19 mol%, relative to the total structural unit, the structure The content of the unit (IV) is 3.25-18 mol%, and relative to the total structural unit, the content of the structural unit (V) is 1-7 mol%, relative to the total structural unit, the structural unit (I)~(V The total content of) is 100 mol%, and the mol number of structural unit (III) is 1.01~1.06 times the total mol number of structural unit (IV) and structural unit (V), or structural unit (IV) and The total molar number of structural unit (V) is 1.01~1.06 times the molar number of structural unit (III) and shows optical anisotropy when melting:
Figure 106140521-A0305-02-0023-1
Figure 106140521-A0305-02-0023-2
Figure 106140521-A0305-02-0023-3
Figure 106140521-A0305-02-0023-4
Figure 106140521-A0305-02-0023-5
如申請專利範圍第1項所述之全芳香族聚酯醯胺,其中相對於總結構單元,結構單元(III)的含量為10.25~17.45莫耳%。 For the wholly aromatic polyester amide described in the first item of the scope of patent application, the content of structural unit (III) relative to the total structural unit is 10.25-17.45 mol%. 如申請專利範圍第1或2項所述之全芳香族聚酯醯胺,其熔點為350℃以下。 The wholly aromatic polyester amide described in item 1 or 2 of the scope of patent application has a melting point of 350°C or less. 一種全芳香族聚酯醯胺,係荷重撓曲溫度為270℃以上之如申請專利範圍第1或2項所述之全芳香族聚酯醯胺,前述荷重撓曲溫度係將前述全芳香族聚酯醯胺60質量%、與平均纖維徑11μm且平均纖維長75μm的磨碎纖維40質量%在前述全芳香族聚酯醯胺的熔點+20℃進行熔融混煉而得到之聚酯醯胺樹脂組合物的狀態下測定。 A wholly aromatic polyester amide, which is a wholly aromatic polyester amide with a deflection temperature under load of 270°C or higher as described in item 1 or 2 of the scope of the patent application. Polyesteramide 60% by mass, and 40% by mass of ground fibers with an average fiber diameter of 11μm and average fiber length of 75μm are melt-kneaded at the melting point of the aforementioned wholly aromatic polyesteramide +20°C. Measured in the state of the resin composition. 如申請專利範圍第1或2項所述之全芳香族聚酯醯胺,其中在比前述全芳香族聚酯醯胺的熔點更高10~30℃的溫度且剪切速度1000/秒之熔融黏度為500Pa‧s以下。 The wholly aromatic polyester amide as described in item 1 or 2 of the scope of patent application, which melts at a temperature 10~30℃ higher than the melting point of the aforementioned wholly aromatic polyester amide and a shear rate of 1000/sec. The viscosity is below 500Pa‧s. 如申請專利範圍第1或2所述之全芳香族聚酯醯胺,其中 結構單元(III)的莫耳數為結構單元(IV)與結構單元(V)的合計莫耳數之1.02~1.06倍,或是結構單元(IV)與結構單元(V)的合計莫耳數為結構單元(III)的莫耳數之1.02~1.06倍。 The wholly aromatic polyester amide as described in the first or second scope of the patent application, wherein The molar number of structural unit (III) is 1.02~1.06 times the total molar number of structural unit (IV) and structural unit (V), or the total molar number of structural unit (IV) and structural unit (V) It is 1.02~1.06 times the molar number of structural unit (III). 一種在熔融時顯示光學異方性之全芳香族聚酯醯胺的製造方法,前述方法係包含在脂肪酸金屬鹽的存在下,使用脂肪酸酐將4-羥基苯甲酸、6-羥基-2-萘甲酸、4,4’-二羥基聯苯、及N-乙醯基-對胺基苯酚進行醯基化且與1,4-苯二羧酸進行酯交換之步驟;而且相對於由4-羥基苯甲酸、6-羥基-2-萘甲酸、1,4-苯二羧酸、4,4’-二羥基聯苯、及N-乙醯基-對胺基苯酚所構成且使用在前述方法之總單體,4-羥基苯甲酸的使用量為62~75莫耳%,6-羥基-2-萘甲酸的使用量為1~4.5莫耳%,1,4-苯二羧酸的使用量為10.25~19莫耳%,4,4’-二羥基聯苯的使用量為3.25~18莫耳%,N-乙醯基-對胺基苯酚的使用量為1~7莫耳%,4-羥基苯甲酸、6-羥基-2-萘甲酸、1,4-苯二羧酸、4,4’-二羥基聯苯、及N-乙醯基-對胺基苯酚的合計使用量為100莫耳%,1,4-苯二羧酸的莫耳數為4,4’-二羥基聯苯與N-乙醯基-對胺基苯酚的合計莫耳數之1.01~1.06倍,或是4,4’-二羥基聯苯與N-乙醯基-對胺基苯酚的合計莫耳數為1,4-苯二羧酸的莫耳數之1.01~1.06倍,前述脂肪酸酐的使用量為4-羥基苯甲酸、6-羥基-2-萘甲 酸、4,4’-二羥基聯苯、及N-乙醯基-對胺基苯酚的合計羥基當量之1.02~1.05倍。 A method for producing a wholly aromatic polyester amide that exhibits optical anisotropy when melted. The aforementioned method involves the use of fatty acid anhydride in the presence of a fatty acid metal salt to combine 4-hydroxybenzoic acid and 6-hydroxy-2-naphthalene Formic acid, 4,4'-dihydroxybiphenyl, and N-acetyl-p-aminophenol are acylated and transesterified with 1,4-benzenedicarboxylic acid; It is composed of benzoic acid, 6-hydroxy-2-naphthoic acid, 1,4-benzenedicarboxylic acid, 4,4'-dihydroxybiphenyl, and N-acetyl-p-aminophenol and used in the aforementioned methods The total monomer, the usage amount of 4-hydroxybenzoic acid is 62~75 mol%, the usage amount of 6-hydroxy-2-naphthoic acid is 1~4.5 mol%, and the usage amount of 1,4-benzenedicarboxylic acid 10.25~19mol%, the usage amount of 4,4'-dihydroxybiphenyl is 3.25~18mol%, the usage amount of N-acetyl-p-aminophenol is 1~7mol%, 4 -Hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, 1,4-benzenedicarboxylic acid, 4,4'-dihydroxybiphenyl, and N-acetyl-p-aminophenol in total usage amount is 100 Mole%, the mole number of 1,4-benzenedicarboxylic acid is 1.01~1.06 times the total mole number of 4,4'-dihydroxybiphenyl and N-acetyl-p-aminophenol, or The total number of moles of 4,4'-dihydroxybiphenyl and N-acetyl-p-aminophenol is 1.01~1.06 times the number of moles of 1,4-benzenedicarboxylic acid, and the usage amount of the aforementioned fatty acid anhydride It is 4-hydroxybenzoic acid, 6-hydroxy-2-naphthyl The total hydroxyl equivalent of acid, 4,4'-dihydroxybiphenyl, and N-acetyl-p-aminophenol is 1.02~1.05 times. 如申請專利範圍第7項所述之製造方法,其中相對於總單體,1,4-苯二羧酸的使用量為10.25~17.45莫耳%。 According to the manufacturing method described in item 7 of the scope of patent application, the amount of 1,4-benzenedicarboxylic acid used is 10.25~17.45 mol% relative to the total monomer. 如申請專利範圍第7或8項所述之製造方法,其中前述脂肪酸金屬鹽為乙酸金屬鹽,前述脂肪酸酐為乙酸酐。 The manufacturing method according to item 7 or 8 of the scope of patent application, wherein the aforementioned fatty acid metal salt is an acetic acid metal salt, and the aforementioned fatty acid anhydride is acetic anhydride. 如申請專利範圍第7或8項所述之製造方法,其中1,4-苯二羧酸的莫耳數為4,4’-二羥基聯苯與N-乙醯基-對胺基苯酚的合計莫耳數之1.02~1.06倍,或是4,4’-二羥基聯苯與N-乙醯基-對胺基苯酚的合計莫耳數為1,4-苯二羧酸的莫耳數之1.02~1.06倍。 The manufacturing method described in item 7 or 8 of the scope of patent application, wherein the molar number of 1,4-benzenedicarboxylic acid is 4,4'-dihydroxybiphenyl and N-acetyl-p-aminophenol 1.02~1.06 times the total number of moles, or the total number of moles of 4,4'-dihydroxybiphenyl and N-acetyl-p-aminophenol is the number of moles of 1,4-benzenedicarboxylic acid 1.02~1.06 times.
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