TWI733524B - Temperature calibration method of infrared thermal image camera and calibration method of temperature sensing system of infrared thermal image camera - Google Patents
Temperature calibration method of infrared thermal image camera and calibration method of temperature sensing system of infrared thermal image camera Download PDFInfo
- Publication number
- TWI733524B TWI733524B TW109123988A TW109123988A TWI733524B TW I733524 B TWI733524 B TW I733524B TW 109123988 A TW109123988 A TW 109123988A TW 109123988 A TW109123988 A TW 109123988A TW I733524 B TWI733524 B TW I733524B
- Authority
- TW
- Taiwan
- Prior art keywords
- temperature
- correction
- measured
- coefficient
- objn
- Prior art date
Links
Images
Landscapes
- Radiation Pyrometers (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
Description
本發明涉及一種溫度校正方法及溫度感測系統的校正方法,特別是涉及一種紅外線熱像儀的溫度校正方法及紅外線熱像儀的溫度感測系統的校正方法。The invention relates to a temperature correction method and a temperature sensing system correction method, in particular to a temperature correction method of an infrared thermal imager and a temperature sensing system correction method of an infrared thermal imager.
首先,非接觸式紅外線溫度感測系統一般都具有一濾光片(filter),其主要作為阻擋可見光,避免可見光干擾紅外線溫度感測系統的量測數值。但是,濾光片的設置仍會影響紅外線溫度感測系統量測待檢測物體的溫度值,而使得所量測到的溫度不完全準確。First, non-contact infrared temperature sensing systems generally have a filter, which is mainly used to block visible light to prevent visible light from interfering with the measurement value of the infrared temperature sensing system. However, the setting of the filter still affects the infrared temperature sensing system to measure the temperature of the object to be detected, so that the measured temperature is not completely accurate.
藉此,如何提升溫度感測系統的準確性,來克服上述的缺陷,已成為該項技術所欲解決的重要課題之一。Therefore, how to improve the accuracy of the temperature sensing system to overcome the above-mentioned shortcomings has become one of the important issues to be solved by this technology.
本發明所要解決的技術問題在於,針對現有技術的不足提供一種紅外線熱像儀的溫度校正方法及紅外線熱像儀的溫度感測系統的校正方法。The technical problem to be solved by the present invention is to provide a temperature correction method of an infrared thermal imager and a correction method of the temperature sensing system of an infrared thermal imager in view of the deficiencies of the prior art.
為了解決上述的技術問題,本發明所採用的其中一技術方案是提供一種紅外線熱像儀的溫度校正方法,其包括:提供一溫度感測系統量測一待測物體,以得到一未校正溫度;以及依據所述未校正溫度以及一溫度校正函數,將所述未校正溫度校準至一已校正溫度。其中,所述溫度校正函數由一迴歸分析所獲得。In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a temperature correction method for an infrared thermal imager, which includes: providing a temperature sensing system to measure an object to be measured to obtain an uncorrected temperature And according to the uncorrected temperature and a temperature correction function, the uncorrected temperature is calibrated to a corrected temperature. Wherein, the temperature correction function is obtained by a regression analysis.
為了解決上述的技術問題,本發明所採用的另外一技術方案是提供一種紅外線熱像儀的溫度校正方法,其包括:提供一溫度感測系統量測一待測物體,以得到n個未校正溫度,其中,所述溫度感測系統包括n個紅外線溫度感測器,n個所述紅外線溫度感測器呈R×L的形式陣列排列,n個所述紅外線溫度感測器依序由一第一紅外線溫度感測器至一第n紅外線溫度感測器排列,R為大於等於2的正整數,L為大於等於2的正整數,n為R乘以L的數量,其中,n個所述紅外線溫度感測器分別量測所述待測物體以得到n個所述未校正溫度;以及依據n個所述未校正溫度以及n個溫度校正函數,以將n個所述未校正溫度分別校準至一已校正溫度,而得到n個所述已校正溫度,其中,每一所述未校正溫度分別對應於相對應的所述溫度校正函數,且所述第一紅外線溫度感測器至所述第n紅外線溫度感測器分別量測所述待測物體以得到相對應的一第一未校正溫度至一第n未校正溫度;其中,n個所述溫度校正函數分別由一迴歸分析所獲得。In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a temperature correction method for an infrared thermal imager, which includes: providing a temperature sensing system to measure an object to be measured to obtain n uncorrected Temperature, wherein the temperature sensing system includes n infrared temperature sensors, the n infrared temperature sensors are arranged in an array of R×L, and the n infrared temperature sensors are sequentially composed of one The first infrared temperature sensor to the nth infrared temperature sensor are arranged, R is a positive integer greater than or equal to 2, L is a positive integer greater than or equal to 2, n is the number of R multiplied by L, where n are The infrared temperature sensor measures the object to be measured to obtain the n uncorrected temperatures; and according to the n uncorrected temperatures and n temperature correction functions, the n uncorrected temperatures are respectively measured Calibrate to a corrected temperature to obtain n corrected temperatures, wherein each of the uncorrected temperatures corresponds to the corresponding temperature correction function, and the first infrared temperature sensor is The nth infrared temperature sensor measures the object to be measured to obtain a corresponding first uncorrected temperature to an nth uncorrected temperature; wherein the n temperature correction functions are respectively determined by a regression analysis get.
為了解決上述的技術問題,本發明所採用的另外再一技術方案是提供一種紅外線熱像儀的溫度感測系統的校正方法,其包括:提供具有一預設溫度的一黑體;取得所述溫度感測系統的一校正係數以及一系統溫度係數;提供多個輻射黑體,且多個所述輻射黑體所分別具有的一預定溫度彼此相異;利用所述溫度感測系統量測多個所述輻射黑體,以得到多個量測溫度;對多個所述量測溫度以及多個所述預定溫度進行一迴歸分析,以得到一初始溫度校正函數;以及利用所述初始溫度校正函數得到一溫度校正函數。其中,在取得所述校正係數以及所述系統溫度係數的步驟中,是利用一初始溫度量測公式取得所述校正係數以及所述系統溫度係數,所述初始溫度量測公式包括下列關係式:S=G1×(1+tCo1×(T amb-T de))×((T objNA) 4-(T amb) 4)。其中,S為所述溫度感測系統量測一黑體所得到的一初始數位訊號,G1為所述校正係數,tCo1為所述系統溫度係數,T amb為所述環境溫度,所述環境溫度的單位為凱氏,T de為溫度為298.15 K,T objNA為所述黑體的所述預設溫度,所述預設溫度的單位為凱氏。其中,所述黑體的所述預設溫度為已知。 In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a method for calibrating the temperature sensing system of an infrared thermal imager, which includes: providing a black body with a preset temperature; and obtaining the temperature A correction coefficient and a system temperature coefficient of the sensing system; a plurality of radiating black bodies are provided, and a predetermined temperature of the plurality of radiating black bodies is different from each other; the temperature sensing system is used to measure the plurality of Radiate a black body to obtain a plurality of measured temperatures; perform a regression analysis on a plurality of the measured temperatures and a plurality of the predetermined temperatures to obtain an initial temperature correction function; and use the initial temperature correction function to obtain a temperature Correction function. Wherein, in the step of obtaining the correction coefficient and the system temperature coefficient, an initial temperature measurement formula is used to obtain the correction coefficient and the system temperature coefficient, and the initial temperature measurement formula includes the following relationship: S=G1×(1+tCo1×(T amb -T de ))×((T objNA ) 4 -(T amb ) 4 ). Wherein, S is an initial digital signal obtained by the temperature sensing system measuring a black body, G1 is the correction coefficient, tCo1 is the system temperature coefficient, T amb is the ambient temperature, and the The unit is Kelvin, T de is a temperature of 298.15 K, T objNA is the preset temperature of the black body, and the unit of the preset temperature is Kelvin. Wherein, the preset temperature of the black body is known.
本發明的其中一有益效果在於,本發明所提供的紅外線熱像儀的溫度校正方法,其能通過“依據所述未校正溫度以及一溫度校正函數,將所述未校正溫度校準至一已校正溫度”的技術方案,以提升紅外線熱像儀的溫度感測系統的準確性。此外,本發明所提供的紅外線熱像儀的溫度感測系統的校正方法,其能通過“對多個所述量測溫度以及多個所述預定溫度進行一迴歸分析,以得到一初始溫度校正函數”以及“利用所述初始溫度校正函數得到一溫度校正函數”的技術方案,以使得紅外線熱像儀的溫度感測系統能通過溫度校正函數而提升紅外線熱像儀的溫度感測系統的準確性。One of the beneficial effects of the present invention is that the temperature correction method of the infrared thermal imager provided by the present invention can calibrate the uncorrected temperature to a corrected temperature based on the uncorrected temperature and a temperature correction function. "Temperature" technical solution to improve the accuracy of the temperature sensing system of the infrared thermal imager. In addition, the method for calibrating the temperature sensing system of an infrared thermal imager provided by the present invention can obtain an initial temperature calibration by performing a regression analysis on a plurality of the measured temperatures and a plurality of the predetermined temperatures. Function" and "using the initial temperature correction function to obtain a temperature correction function" technical solution, so that the temperature sensing system of the infrared thermal imager can improve the accuracy of the temperature sensing system of the infrared thermal imager through the temperature correction function sex.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings about the present invention. However, the provided drawings are only for reference and description, and are not used to limit the present invention.
以下是通過特定的具體實施例來說明本發明所公開有關“紅外線熱像儀的溫度校正方法及紅外線熱像儀的溫度感測系統的校正方法”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不背離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。另外,應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件,但這些元件不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。The following is a specific embodiment to illustrate the implementation of the “temperature correction method of an infrared thermal imager and a correction method of the temperature sensing system of an infrared thermal imager" disclosed in the present invention. Those skilled in the art can use this specification. The disclosed content understands the advantages and effects of the present invention. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, it should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.
[第一實施例][First Embodiment]
請參閱圖1及圖2所示,圖1為本發明的紅外線熱像儀的溫度感測系統的功能方塊圖,圖2為本發明的紅外線熱像儀(Infrared Thermal Image Camera)的溫度感測系統的紅外線溫度感測裝置的俯視示意圖。本發明提供一種紅外線熱像儀的溫度校正方法及紅外線熱像儀的溫度感測系統S的校正方法,紅外線熱像儀的溫度校正方法及紅外線熱像儀的溫度感測系統S的校正方法可應用於紅外線熱像儀(Infrared Thermal Image Camera)上,然本發明不以此為限。此外,須說明的是,第一實施例將先針對紅外線熱像儀的溫度校正方法進行說明,第二實施例再針對紅外線熱像儀的溫度感測系統的校正方法進行說明。進一步來說,當紅外線熱像儀的溫度感測系統S通過本發明第二實施例所提供的紅外線熱像儀的溫度感測系統S的校正方法的步驟之後,紅外線熱像儀的溫度感測系統S可利用第一實施例所提供的紅外線熱像儀的溫度校正方法,而使得紅外線熱像儀的溫度感測系統S能準確的得到一待測物體(圖中未示出)的溫度。Please refer to Figures 1 and 2. Figure 1 is a functional block diagram of the temperature sensing system of the infrared thermal imager of the present invention, and Figure 2 is the temperature sensing of the infrared thermal image camera of the present invention A schematic top view of the infrared temperature sensing device of the system. The present invention provides a temperature correction method of an infrared thermal imager and a correction method of the temperature sensing system S of an infrared thermal imager, a temperature correction method of an infrared thermal imager and a correction method of the temperature sensing system S of an infrared thermal imager. It is applied to an Infrared Thermal Image Camera, but the present invention is not limited to this. In addition, it should be noted that the first embodiment will first describe the temperature correction method of the infrared thermal imager, and the second embodiment will describe the correction method of the temperature sensing system of the infrared thermal imager. Furthermore, after the temperature sensing system S of the infrared thermal imager passes the steps of the method for calibrating the temperature sensing system S of the infrared thermal imager provided by the second embodiment of the present invention, the temperature sensing of the infrared thermal imager The system S can use the temperature correction method of the infrared thermal imager provided in the first embodiment, so that the temperature sensing system S of the infrared thermal imager can accurately obtain the temperature of an object to be measured (not shown in the figure).
承上述,紅外線熱像儀的溫度感測系統S包括一紅外線溫度感測裝置1、一溫度量測裝置2以及一控制裝置3。紅外線溫度感測裝置1及溫度量測裝置2可電性連接於控制裝置3,以利用控制裝置3計算出紅外線溫度感測裝置1及溫度量測裝置2所量測到的溫度。此外,紅外線溫度感測裝置1可包括多個紅外線溫度感測器10,多個紅外線溫度感測器10設置在一基板100上。此外,須注意的是,為利於說明,本發明所提供的紅外線溫度感測裝置1是以一4×4陣列排列的紅外線溫度感測器10作為舉例說明,但是,在其他實施方式中,紅外線溫度感測裝置1是以一32×32或是320×240等陣列排列的紅外線溫度感測器10,即,紅外線溫度感測裝置1可以R×L的陣列排列,其中,R及L為大於等於2的整數。然而,須說明的是,本發明不以紅外線溫度感測器10的數量或排列方式為限制。此外,舉例來說,紅外線溫度感測器10可為一微測輻射熱計(Microbolometer)或是一紅外線溫度計(Infrared Thermometer),溫度量測裝置2可為一熱電偶(Thermocouple)感測器或一熱敏電阻(thermistor)溫度感測器,然本發明不以此為限。以本發明而言,可利用溫度量測裝置2量測環境溫度,且可利用紅外線溫度感測裝置1量測一待測物體的溫度。此外,舉例來說,控制裝置3可以是一微控制器(Microcontroller Unit,MCU),以處理紅外線溫度感測器10及溫度量測裝置2所量測到的資訊,然本發明不以此為限。In view of the above, the temperature sensing system S of the infrared thermal imager includes an infrared temperature sensing device 1, a
接著,請參閱圖3所示,圖3為本發明第一實施例的紅外線熱像儀的溫度校正方法的流程圖。詳細來說,紅外線熱像儀的溫度校正方法,其包括下列步驟:如步驟S102所示:提供一溫度感測系統S量測一待測物體,以得到一未校正溫度。舉例來說,可利用紅外線熱像儀的溫度感測系統S的紅外線溫度感測裝置1中的其中一個紅外線溫度感測器10量測一待測物體,以得到一未校正溫度。另外,須說明的是,本發明得到一未校正溫度的方式是以其中一個紅外線溫度感測器10量測一待測物體作為舉例說明,其他多個紅外線溫度感測器10得到一未校正溫度的方式也與此相彷,在此不再贅述。Next, please refer to FIG. 3, which is a flowchart of the temperature correction method of the infrared thermal imager according to the first embodiment of the present invention. In detail, the temperature correction method of an infrared thermal imager includes the following steps: as shown in step S102: a temperature sensing system S is provided to measure an object to be measured to obtain an uncorrected temperature. For example, one of the
接著,如步驟S104所示:將未校正溫度校準至一已校正溫度。舉例來說,可依據未校正溫度以及一溫度校正函數,將未校正溫度校準至一已校正溫度,且溫度校正函數可由一迴歸分析(Regression Analysis)所獲得。舉例來說,溫度校正函數可由一非線性迴歸分析所獲得,例如由一多項式迴歸分析所獲得,然本發明不以此為限。進一步來說,以本發明而言,溫度校正函數可包括下列關係式:T1
obj=(C1
0+C1
1×T1
objN+C1
2×(T1
objN)
2+C1
3×(T1
objN)
3+C1
4×(T1
objN)
4+C1
5×(T1
objN)
5)。T1
obj為其中一個紅外線溫度感測器10(或可稱第一紅外線溫度感測器10a)量測待測物體後所得到的待測物體的已校正溫度,已校正溫度T1
obj的單位為攝氏(°C),T1
objN為其中一個紅外線溫度感測器10(或可稱第一紅外線溫度感測器10a)量測待測物體後所得到的待測物體的未校正溫度,溫度校正函數中的未校正溫度T1
objN的單位為攝氏,C1
0為一第一溫度校正迴歸係數,C1
1為一第二溫度校正迴歸係數,C1
2為一第三溫度校正迴歸係數,C1
3為一第四溫度校正迴歸係數,C1
4為一第五溫度校正迴歸係數,C1
5為一第六溫度校正迴歸係數。也就是說,可將前述步驟S102所得到的待測物體的未校正溫度帶入上述溫度校正函數,而得到待測物體的已校正溫度。即,可利用上述溫度校正函數校正每一個紅外線溫度感測器10所量測到的數值。
Then, as shown in step S104: calibrate the uncorrected temperature to a corrected temperature. For example, the uncorrected temperature can be calibrated to a corrected temperature based on the uncorrected temperature and a temperature correction function, and the temperature correction function can be obtained by a regression analysis. For example, the temperature correction function can be obtained by a nonlinear regression analysis, such as a polynomial regression analysis, but the invention is not limited thereto. Furthermore, in the context of the present invention, the temperature correction function may include the following relationship: T1 obj = (C1 0 + C1 1 × T1 objN + C1 2 × (T1 objN ) 2 + C1 3 × (T1 objN ) 3 + C1 4 ×(T1 objN ) 4 +C1 5 ×(T1 objN ) 5 ). T1 obj is the corrected temperature of the object to be measured after one of the infrared temperature sensors 10 (or the first
承上述,須說明的是,由於每一個紅外線溫度感測器10在製程或其他參數上仍會有所差異,因此,其他多個紅外線溫度感測器10也可以分別具有相對應的溫度校正函數,且其他多個紅外線溫度感測器10(或可稱第二紅外線溫度感測器10b、第三紅外線溫度感測器或是第n紅外線溫度感測器,n為大於1的正整數)的溫度校正函數中的第一溫度校正迴歸係數Cn
1、第二溫度校正迴歸係數Cn
2、第三溫度校正迴歸係數Cn
3、第四溫度校正迴歸係數Cn
4、第五溫度校正迴歸係數Cn
5及第六溫度校正迴歸係數Cn
6,仍有可能與前述其中一個紅外線溫度感測器10的第一溫度校正迴歸係數C1
1、第二溫度校正迴歸係數C1
2、第三溫度校正迴歸係數C1
3、第四溫度校正迴歸係數C1
4、第五溫度校正迴歸係數C1
5及第六溫度校正迴歸係數C1
6不同。另外,上述第一溫度校正迴歸係數(C1
1至Cn
1)、第二溫度校正迴歸係數(C1
2至Cn
2)、第三溫度校正迴歸係數(C1
3至Cn
3)、第四溫度校正迴歸係數(C1
4至Cn
4)、第五溫度校正迴歸係數(C1
5至Cn
5)及第六溫度校正迴歸係數(C1
6至Cn
6)的數值可儲存在溫度感測系統S中,例如可儲存於一校正係數表中,且校正係數表可為一查找表(lookup table)。控制裝置3可利用校正係數表,而得到相對應的數值。此外,產生上述校正迴歸係數的方法將於後續實施例進行說明。另外,須說明的是,雖然上述實施方式是以五次方程式進行分析,但是,在其他實施方式中,也可以是四次方程式、六次方程式或七次方程式。換句話說,在其他實施方式中,第n紅外線溫度感測器10的溫度校正函數也可以是一K次方程式,其包括下列關係式,例如:Tn
obj=(Cn
0+Cn
1×Tn
objN+Cn
2×(Tn
objN)
2+Cn
3×(Tn
objN)
3+Cn
4×(Tn
objN)
4+…+Cn
K×(Tn
objN)
K)。
In view of the above, it should be noted that since each
接著,請參閱圖4所示,圖4為本發明第一實施例的溫度校正方法的步驟S102的流程圖。在步驟S102量測待測物體以得到未校正溫度的步驟中,其包括下列步驟:如步驟S1022所示:利用溫度感測系統S量測待測物體的一輻射能量,以產生一數位訊號。舉例來說,數位訊號可以由紅外線溫度感測裝置1的其中一個紅外線溫度感測器10量測待測物體的輻射能量之後所產生的數位訊號。此外,數位訊號的產生方式可由其中一個紅外線溫度感測器10量測待測物體的輻射能量,並將其轉換成電壓訊號後,通過運算放大器(Operation Amplifier)將電壓訊號放大,再通過類比數位轉換器(Analog-to-Digital Converter)將其轉換成數位訊號。Next, please refer to FIG. 4, which is a flowchart of step S102 of the temperature correction method according to the first embodiment of the present invention. In step S102, the step of measuring the object to be measured to obtain the uncorrected temperature includes the following steps: as shown in step S1022: the temperature sensing system S is used to measure a radiation energy of the object to be measured to generate a digital signal. For example, the digital signal can be a digital signal generated after one of the
接著,如步驟S1024所示:根據數位訊號S1以及一溫度量測公式計算出待測物體的未校正溫度。舉例來說,控制裝置3可接收紅外線溫度感測器10所量測到的數位訊號,並利用溫度量測公式計算出待測物體的未校正溫度。進一步來說,以本發明而言,溫度量測公式包括下列關係式:S1=G1×(1+tCo1×(T
amb-T
de))×((T1
objN)
4-(T
amb)
4)。S1為數位訊號,G1為一校正係數,tCo1為一系統溫度係數,T
amb為一環境溫度,環境溫度的單位為凱氏(克耳文,K),T1
objN為待測物體的未校正溫度,溫度量測公式中的未校正溫度T1
objN的單位為凱氏,T
de為溫度為298.15K。另外,須說明的是,環境溫度T
amb可利用溫度量測裝置2量測,數位訊號S1可利用紅外線溫度感測裝置1的其中一個紅外線溫度感測器10量測。此外,T
de為溫度為298.15K所代表的是T
de為溫度為25°C。藉此,在步驟S1024中,可以利用數位訊號S1以及一溫度量測公式計算出待測物體的未校正溫度,接著,再利用步驟S104中的溫度校正函數,將待測物體的未校正溫度帶入上述溫度校正函數,而得到待測物體的已校正溫度。值得說明的是,上述溫度量測公式可由斯特凡波茲曼定律(Stefan-Boltzmann law)取得。
Then, as shown in step S1024: the uncorrected temperature of the object to be measured is calculated according to the digital signal S1 and a temperature measurement formula. For example, the control device 3 can receive the digital signal measured by the
承上述,須說明的是,由於每一個紅外線溫度感測器10在製程或其他參數上仍會有所差異,因此,其他多個紅外線溫度感測器10也可以分別具有相對應的溫度量測公式,且其他多個紅外線溫度感測器10(或可稱第二紅外線溫度感測器10b、第三紅外線溫度感測器或是第n紅外線溫度感測器,n為大於1的正整數)的溫度量測公式中的校正係數Gn及系統溫度係數tCon仍有可能與前述其中一個紅外線溫度感測器10的校正係數G1及系統溫度係數tCo1不同。另外,上述校正係數(G1至Gn)及系統溫度係數(tCo1至tCon)的數值可儲存在紅外線熱像儀的溫度感測系統S中,例如可儲存於一校正係數表中,且校正係數表可為一查找表(lookup table)。控制裝置3可利用校正係數表,而得到相對應的數值。此外,產生校正係數及系統溫度係數的方法將於後續實施例進行說明。In view of the above, it should be noted that since each
接著,請復參閱圖1及圖2所示,並請一併參閱圖5所示,圖5為本發明第一實施例的紅外線熱像儀的溫度校正方法的另外一流程圖。須說明的是,由於本發明所提供的溫度感測系統S是應用在一紅外線熱像儀上,因此,溫度感測系統S的紅外線溫度感測裝置1中會具有多個呈陣列排列的紅外線溫度感測器10。但是,每一個紅外線溫度感測器10在製程或其他參數上仍會有所差異,因此,其他多個紅外線溫度感測器10也可以分別具有相對應的溫度校正函數。以下將進一步舉例說明多個紅外線溫度感測器10的溫度校正方法。Next, please refer to FIG. 1 and FIG. 2 again, and also to FIG. 5. FIG. 5 is another flowchart of the temperature correction method of the infrared thermal imager according to the first embodiment of the present invention. It should be noted that since the temperature sensing system S provided by the present invention is applied to an infrared thermal imager, the infrared temperature sensing device 1 of the temperature sensing system S will have a plurality of infrared rays arranged in an array.
承上述,溫度校正方法包括下列步驟:如步驟S202所示:提供一溫度感測系統S量測一待測物體,以得到n個未校正溫度。舉例來說,可利用至少一個第一群組10A中的第一紅外線溫度感測器10a及/或至少一個第二群組10B中的第一紅外線溫度感測器10b量測待測物體,以得到n個(或可稱多個)未校正溫度。此外,溫度感測系統S包括n個紅外線溫度感測器10,n個紅外線溫度感測器10呈R×L的形式陣列排列,n個紅外線溫度感測器10依序由一第一紅外線溫度感測器10至一第n紅外線溫度感測器10排列,R為大於等於2的正整數,L為大於等於2的正整數,n為R乘以L的數量,其中,n個紅外線溫度感測器10分別量測待測物體以得到n個未校正溫度。In view of the above, the temperature correction method includes the following steps: as shown in step S202: a temperature sensing system S is provided to measure an object to be measured to obtain n uncorrected temperatures. For example, at least one first
接著,如步驟S204所示:依據n個未校正溫度以及n個溫度校正函數,以將n個未校正溫度分別校準至一已校正溫度,而得到n個已校正溫度,且n個溫度校正函數分別由一迴歸分析所獲得。進一步來說,每一未校正溫度分別對應於相對應的溫度校正函數,且第一紅外線溫度感測器至第n紅外線溫度感測器10分別量測待測物體以得到相對應的一第一未校正溫度至一第n未校正溫度。Then, as shown in step S204: according to n uncorrected temperatures and n temperature correction functions, the n uncorrected temperatures are calibrated to a corrected temperature, respectively, to obtain n corrected temperatures and n temperature correction functions Respectively obtained by a regression analysis. Furthermore, each uncorrected temperature corresponds to a corresponding temperature correction function, and the first infrared temperature sensor to the nth
承上述,以本發明而言,n個溫度校正函數中的一第一溫度校正函數包括下列關係式:T1
obj=(C1
0+C1
1×T1
objN+C1
2×(T1
objN)
2+C1
3×(T1
objN)
3+C1
4×(T1
objN)
4+C1
5×(T1
objN)
5)。T1
obj為第一紅外線溫度感測器10量測待測物體後得到的一第一已校正溫度,第一已校正溫度的單位為攝氏,T1
objN為第一紅外線溫度感測器10量測待測物體後得到的第一未校正溫度,第一溫度校正函數的第一未校正溫度的單位為攝氏,C1
0為第一溫度校正函數的一第一溫度校正迴歸係數,C1
1為第一溫度校正函數的一第二溫度校正迴歸係數,C1
2為第一溫度校正函數的一第三溫度校正迴歸係數,C1
3為第一溫度校正函數的一第四溫度校正迴歸係數,C1
4為第一溫度校正函數的一第五溫度校正迴歸係數,C1
5為第一溫度校正函數的一第六溫度校正迴歸係數。也就是說,可將前述步驟S202所得到的待測物體的第一未校正溫度帶入上述第一溫度校正函數,而得到待測物體的第一已校正溫度。即,可利用上述第一溫度校正函數校正第一紅外線溫度感測器10所量測到的第一未校正溫度的數值。
In view of the above, in terms of the present invention, a first temperature correction function of the n temperature correction functions includes the following relationship: T1 obj = (C1 0 + C1 1 × T1 objN + C1 2 × (T1 objN ) 2 + C1 3 ×(T1 objN ) 3 +C1 4 ×(T1 objN ) 4 +C1 5 ×(T1 objN ) 5 ). T1 obj is a first corrected temperature obtained after the first
承上述,進一步來說,n個溫度校正函數中的一第j溫度校正函數包括下列關係式,其中,j為大於1且小於等於n的正整數,第j溫度校正函數包括下列關係式:Tj
obj=(Cj
0+Cj
1×Tj
objN+Cj
2×(Tj
objN)
2+Cj
3×(Tj
objN)
3+Cj
4×(Tj
objN)
4+Cj
5×(Tj
objN)
5)。Tj
obj為第j紅外線溫度感測器10量測待測物體後得到的一第j已校正溫度,第j已校正溫度的單位為攝氏,Tj
objN為第j紅外線溫度感測器10量測待測物體後得到的一第j未校正溫度,第j溫度校正函數的第j未校正溫度的單位為攝氏,Cj
0為第j溫度校正函數的一第一溫度校正迴歸係數,Cj
1為第j溫度校正函數的一第二溫度校正迴歸係數,Cj
2為第j溫度校正函數的一第三溫度校正迴歸係數,Cj
3為第j溫度校正函數的一第四溫度校正迴歸係數,Cj
4為第j溫度校正函數的一第五溫度校正迴歸係數,Cj
5為第j溫度校正函數的一第六溫度校正迴歸係數。也就是說,可將前述步驟S202所得到的待測物體的第j未校正溫度帶入上述第j溫度校正函數,而得到待測物體的第j已校正溫度。即,可利用上述第j溫度校正函數校正第j紅外線溫度感測器10所量測到的第j未校正溫度的數值。
In view of the above, further speaking, a j-th temperature correction function in the n temperature correction functions includes the following relational expression, where j is a positive integer greater than 1 and less than or equal to n, and the j-th temperature correction function includes the following relational expression: Tj obj =(Cj 0 +Cj 1 ×Tj objN +Cj 2 ×(Tj objN ) 2 +Cj 3 ×(Tj objN ) 3 +Cj 4 ×(Tj objN ) 4 +Cj 5 ×(Tj objN ) 5 ). Tj obj is a j-th corrected temperature obtained after the j-th
承上述,進一步來說,第n溫度校正函數包括下列關係式:Tn
obj=(Cn
0+Cn
1×Tn
objN+Cn
2×(Tn
objN)
2+Cn
3×(Tn
objN)
3+Cn
4×(Tn
objN)
4+Cn
5×(Tn
objN)
5)。Tn
obj為第n紅外線溫度感測器10量測待測物體後得到的一第n已校正溫度,第n已校正溫度的單位為攝氏,Tn
objN為第n紅外線溫度感測器10量測待測物體後得到的第n未校正溫度,第n溫度校正函數的第n未校正溫度的單位為攝氏,Cn
0為第n溫度校正函數的一第一溫度校正迴歸係數,Cn
1為第n溫度校正函數的一第二溫度校正迴歸係數,Cn
2為第n溫度校正函數的一第三溫度校正迴歸係數,Cn
3為第n溫度校正函數的一第四溫度校正迴歸係數,Cn
4為第n溫度校正函數的一第五溫度校正迴歸係數,Cn
5為第n溫度校正函數的一第六溫度校正迴歸係數也就是說,可將前述步驟S202所得到的待測物體的第n未校正溫度帶入上述第n溫度校正函數,而得到待測物體的第n已校正溫度。即,可利用上述第n溫度校正函數校正第n紅外線溫度感測器10所量測到的第n未校正溫度的數值。
In view of the above, further speaking, the nth temperature correction function includes the following relationship: Tn obj =(Cn 0 +Cn 1 ×Tn objN +Cn 2 ×(Tn objN ) 2 +Cn 3 ×(Tn objN ) 3 +Cn 4 ×(Tn objN ) 4 +Cn 5 ×(Tn objN ) 5 ). Tn obj is an n-th corrected temperature obtained after the n-th
接著,請參閱圖6所示,圖6為本發明第一實施例的紅外線熱像儀的溫度校正方法的步驟S202的流程圖。在步驟S202量測待測物體,以得到n個未校正溫度的步驟中,其包括下列步驟:如步驟S2022所示:利用第一紅外線溫度感測器10量測待測物體的一第一預定位置的一輻射能量,以產生一第一數位訊號,利用第j紅外線溫度感測器10量測待測物體的一第j預定位置的一輻射能量,以產生一第j數位訊號,且利用第n紅外線溫度感測器10量測待測物體的一第n預定位置的一輻射能量,以產生一第n數位訊號。Next, please refer to FIG. 6, which is a flowchart of step S202 of the temperature correction method of the infrared thermal imager according to the first embodiment of the present invention. In step S202, the step of measuring the object to be measured to obtain n uncorrected temperatures includes the following steps: as shown in step S2022: using the first
接著,如步驟S2024所示:根據第一數位訊號以及一第一溫度量測公式計算出待測物體的第一未校正溫度,根據第j數位訊號以及一第j溫度量測公式計算出待測物體的第j未校正溫度,且根據第n數位訊號以及一第n溫度量測公式計算出待測物體的第n未校正溫度。舉例來說,控制裝置3可接收第一紅外線溫度感測器10所量測到的第一數位訊號、第j紅外線溫度感測器10所量測到的第j數位訊號及第n紅外線溫度感測器10所量測到的第n數位訊號,並利用第一溫度量測公式、第j溫度量測公式及第n溫度量測公式計算出待測物體的第一未校正溫度、第j未校正溫度及第n位校正溫度。進一步來說,以本發明而言,第一溫度量測公式包括下列關係式:S1=G1×(1+tCo1×(T
amb-T
de))×((T1
objN)
4-(T
amb)
4)。此外,第j溫度量測公式包括下列關係式:Sj=Gj×(1+tCoj×(T
amb-T
de))×((Tj
objN)
4-(T
amb)
4)。此外,第n溫度量測公式包括下列關係式:Sn=Gn×(1+tCon×(T
amb-T
de))×((Tn
objN)
4-(T
amb)
4)。S1為第一數位訊號,Sj為第j數位訊號,Sn為第n數位訊號,G1為第一溫度量測公式的一校正係數,Gj為第j溫度量測公式的一校正係數,Gn為第n溫度量測公式的一校正係數,tCo1為第一溫度量測公式的一系統溫度係數,tCoj為第j溫度量測公式的一系統溫度係數,tCon為第n溫度量測公式的一系統溫度係數,T
amb為一環境溫度,環境溫度的單位為凱氏,T
de為溫度為298.15K,T1
objN為待測物體的第一未校正溫度,第一溫度量測公式中的第一未校正溫度的單位為凱氏,Tj
objN為待測物體的第j未校正溫度,第j溫度量測公式中的第j未校正溫度的單位為凱氏,第n溫度量測公式中的第n未校正溫度的單位為凱氏。
Then, as shown in step S2024: the first uncorrected temperature of the object to be measured is calculated according to the first digital signal and a first temperature measurement formula, and the to-be-measured temperature is calculated according to the j-th digital signal and a j-th temperature measurement formula The j-th uncorrected temperature of the object is calculated, and the n-th uncorrected temperature of the object to be measured is calculated according to the n-th digital signal and an n-th temperature measurement formula. For example, the control device 3 can receive the first digital signal measured by the first
承上述,須說明的是,環境溫度T
amb可利用溫度量測裝置2量測,第一數位訊號S1可利用第一紅外線溫度感測器10量測,第j數位訊號Sj可利用第j紅外線溫度感測器10量測,第n數位訊號Sn可利用第n紅外線溫度感測器10量測。此外,T
de為溫度為298.15K所代表的是T
de為溫度為25°C。藉此,在步驟S2024中,可以利用第一數位訊號、第j數位訊號、第n數位訊號、第一溫度量測公式、第j溫度量測公式及第n溫度量測公式計算出待測物體的第一未校正溫度、第j位校正溫度及第n位校正溫度,接著,再利用步驟S204中的第一溫度校正函數、第j溫度校正函數及第n溫度校正函數,將待測物體的第一未校正溫度、第j未校正溫度及第n位校正溫度帶入上述第一溫度校正函數、第j溫度校正函數及第n溫度校正函數,而得到待測物體的第一已校正溫度、第j已校正溫度及第n以校正溫度。此外,值得說明的是,上述第一溫度量測公式、第j溫度量測公式及第n溫度量測公式可由斯特凡波茲曼定律(Stefan-Boltzmann law)取得。
In view of the above, it should be noted that the ambient temperature T amb can be measured by the
接著,請參閱圖7所示,圖7為本發明第一實施例的紅外線熱像儀的溫度校正方法的再一流程圖,以下將進一步舉例說明多個紅外線溫度感測器10中的其中兩個紅外線溫度感測器10(第一紅外線溫度感測器10a及第二紅外線溫度感測器10b)的溫度校正方法。另外,雖然本發明是以第一紅外線溫度感測器10a及第二紅外線溫度感測器10b分別利用一第一溫度校正函數及第二溫度校正函數進行溫度量測校正,但是,在其他實施方式中,也可以是多個第一紅外線溫度感測器10a所組成的群組(例如第一群組10A)利用第一溫度校正函數進行溫度量測校正,且多個第二紅外線溫度感測器10b所組成的群組(例如第二群組10B)利用第二溫度校正函數進行溫度量測校正。Next, please refer to FIG. 7. FIG. 7 is another flowchart of the temperature correction method of the infrared thermal imager according to the first embodiment of the present invention. The following will further illustrate two of the
承上述,溫度校正方法包括下列步驟:如步驟S302所示:提供一溫度感測系統S量測一待測物體,以得到一第一未校正溫度以及一第二未校正溫度。舉例來說,可利用第一群組10A中的第一紅外線溫度感測器10a量測待測物體,以得到一第一未校正溫度,同時,利用第二群組10B中的第二紅外線溫度感測器10b量測待測物體,以得到一第二未校正溫度。In view of the above, the temperature correction method includes the following steps: As shown in step S302, a temperature sensing system S is provided to measure an object to be measured to obtain a first uncorrected temperature and a second uncorrected temperature. For example, the first
承上述,如步驟S304所示,將第一未校正溫度校準至一第一已校正溫度,且將第二未校正溫度校準至一第二已校正溫度。舉例來說,可依據第一未校正溫度、第二未校正溫度、一第一溫度校正函數及一第二溫度校正函數,將第一未校正溫度校準至一第一已校正溫度,且將第二未校正溫度校準至一第二已校正溫度,且第一溫度校正函數及第二溫度校正函數可分別由一迴歸分析所獲得。進一步來說,以本發明而言,第一溫度校正函數可包括下列關係式:T1
obj=(C1
0+C1
1×T1
objN+C1
2×(T1
objN)
2+C1
3×(T1
objN)
3+C1
4×(T1
objN)
4+C1
5×(T1
objN)
5)。T1
obj為第一紅外線溫度感測器10a量測待測物體後所得到的待測物體的第一已校正溫度,第一已校正溫度T1
obj的單位為攝氏,T1
objN為第一紅外線溫度感測器10a量測待測物體後所得到的待測物體的第一未校正溫度,第一溫度校正函數的第一未校正溫度的單位為攝氏,C1
0為第一溫度校正函數的一第一溫度校正迴歸係數,C1
1為第一溫度校正函數的一第二溫度校正迴歸係數,C1
2為第一溫度校正函數的一第三溫度校正迴歸係數,C1
3為第一溫度校正函數的一第四溫度校正迴歸係數,C1
4為第一溫度校正函數的一第五溫度校正迴歸係數,C1
5為第一溫度校正函數的一第六溫度校正迴歸係數。也就是說,可將前述步驟S302所得到的待測物體的第一未校正溫度帶入上述第一溫度校正函數,而得到待測物體的第一已校正溫度。即,可利用上述第一溫度校正函數校正第一紅外線溫度感測器10a所量測到的第一未校正溫度的數值。
In view of the above, as shown in step S304, the first uncorrected temperature is calibrated to a first corrected temperature, and the second uncorrected temperature is calibrated to a second corrected temperature. For example, the first uncorrected temperature can be calibrated to a first corrected temperature based on the first uncorrected temperature, the second uncorrected temperature, a first temperature correction function, and a second temperature correction function, and the first uncorrected temperature can be calibrated to a first corrected temperature. The two uncorrected temperatures are calibrated to a second corrected temperature, and the first temperature correction function and the second temperature correction function can be respectively obtained by a regression analysis. Furthermore, in terms of the present invention, the first temperature correction function may include the following relationship: T1 obj = (C1 0 + C1 1 × T1 objN + C1 2 × (T1 objN ) 2 + C1 3 × (T1 objN ) 3 +C1 4 ×(T1 objN ) 4 +C1 5 ×(T1 objN ) 5 ). T1 obj is the first corrected temperature of the object to be measured obtained after the first
承上述,進一步來說,以本發明而言,第二溫度校正函數可包括下列關係式:T2
obj=(C2
0+C2
1×T2
objN+C2
2×(T2
objN)
2+C2
3×(T2
objN)
3+C2
4×(T2
objN)
4+C2
5×(T2
objN)
5)。T2
obj為第二紅外線溫度感測器10b量測待測物體後所得到的待測物體的第二已校正溫度,第二已校正溫度T2
obj的單位為攝氏,T2
objN為第二紅外線溫度感測器10b量測待測物體後所得到的待測物體的第二未校正溫度,第二溫度校正函數的第二未校正溫度T2
objN的單位為攝氏,C2
0為第二溫度校正函數的一第一溫度校正迴歸係數,C2
1為第二溫度校正函數的一第二溫度校正迴歸係數,C2
2為第二溫度校正函數的一第三溫度校正迴歸係數,C2
3為第二溫度校正函數的一第四溫度校正迴歸係數,C2
4為第二溫度校正函數的一第五溫度校正迴歸係數,C2
5為第二溫度校正函數的一第六溫度校正迴歸係數。也就是說,可將前述步驟S302所得到的待測物體的第二未校正溫度帶入上述第二溫度校正函數,而得到待測物體的第二已校正溫度。即,可利用上述第二溫度校正函數校正第二紅外線溫度感測器10b所量測到的第二未校正溫度的數值。
In view of the above, and further, in terms of the present invention, the second temperature correction function may include the following relationship: T2 obj = (C2 0 + C2 1 × T2 objN + C2 2 × (T2 objN ) 2 + C2 3 ×( T2 objN ) 3 +C2 4 ×(T2 objN ) 4 +C2 5 ×(T2 objN ) 5 ). T2 obj is the second corrected temperature of the object to be measured obtained after the second
接著,請參閱圖8所示,圖8為本發明第一實施例的溫度校正方法的步驟S302的流程圖。在步驟S302量測待測物體,以得到一第一未校正溫度以及一第二未校正溫度的步驟中,其包括下列步驟:如步驟S3022所示:利用第一紅外線溫度感測器10a量測待測物體的一第一預定位置的一紅外線能量,以產生一第一數位訊號,且利用第二紅外線溫度感測器量測待測物體的一第二預定位置的一紅外線能量,以產生一第二數位訊號。舉例來說,第一數位訊號及第二數位訊號可以分別由紅外線溫度感測裝置1的第一紅外線溫度感測器10a及第二紅外線溫度感測器10b量測待測物體的輻射能量之後所產生的訊號。Next, please refer to FIG. 8, which is a flowchart of step S302 of the temperature correction method according to the first embodiment of the present invention. In step S302, the step of measuring the object to be measured to obtain a first uncorrected temperature and a second uncorrected temperature includes the following steps: as shown in step S3022: measuring with the first
接著,如步驟S3024所示:根據第一數位訊號及一第一溫度量測公式計算出待測物體的第一未校正溫度,且根據第二數位訊號及一第二溫度量測公式計算出所述待測物體的第二未校正溫度。舉例來說,控制裝置3可接收第一紅外線溫度感測器10a所量測到的第一數位訊號及第二紅外線溫度感測器10b所量測到的第二數位訊號,並利用第一溫度量測公式及第二溫度量測公式計算出待測物體的第一未校正溫度及第二位校正溫度。進一步來說,以本發明而言,第一溫度量測公式包括下列關係式:S1=G1×(1+tCo1×(T
amb-T
de))×((T1
objN)
4-(T
amb)
4)。此外,第二溫度量測公式包括下列關係式:S2=G2×(1+tCo2×(T
amb-T
de))×((T2
objN)
4-(T
amb)
4)。S1為第一數位訊號,S2為第二數位訊號,G1為第一溫度量測公式的一校正係數,G2為第二溫度量測公式的一校正係數,tCo1為第一溫度量測公式的一系統溫度係數,tCo2為第二溫度量測公式的一系統溫度係數,T
amb為一環境溫度,環境溫度T
amb的單位為凱氏,T
de為溫度為298.15K,T1
objN為待測物體的第一未校正溫度,T2
objN為待測物體的第二未校正溫度,第一溫度量測公式中的第一未校正溫度T1
objN的單位為凱氏,第二溫度量測公式中的第二未校正溫度T2
objN的單位為凱氏。藉此,在步驟S3024中,可以利用第一數位訊號、第二數位訊號、第一溫度量測公式及第二溫度量測公式計算出待測物體的第一未校正溫度及第二位校正溫度,接著,再利用步驟S304中的第一溫度校正函數及第二溫度校正函數,將待測物體的第一未校正溫度及第二位校正溫度帶入上述第一溫度校正函數及第二溫度校正函數,而得到待測物體的第一已校正溫度及第二以校正溫度。另外,須說明的是,雖然上述是以第一紅外線溫度感測器10a及第二紅外線溫度感測器10b作為舉例說明,但是,其他多個紅外線溫度感測器10的得到已校正溫度的方式也與前述說明相仿,在此不再贅述。此外,值得說明的是,上述第一溫度量測公式及第二溫度量測公式可由斯特凡波茲曼定律(Stefan-Boltzmann law)取得。
Then, as shown in step S3024: calculate the first uncorrected temperature of the object to be measured according to the first digital signal and a first temperature measurement formula, and calculate the all according to the second digital signal and a second temperature measurement formula The second uncorrected temperature of the object to be measured. For example, the control device 3 can receive the first digital signal measured by the first
[第二實施例][Second Embodiment]
請參閱圖9及圖10所示,圖9為本發明第二實施例的溫度感測系統的校正方法的流程圖,圖10為本發明第二實施例的溫度感測系統的校正方法的步驟S12的流程圖。以下將進一步說明溫度感測系統的校正方法,同時,進一步說明產生前述校正迴歸係數、校正係數及系統溫度係數的方法。以本發明而言,第一溫度校正迴歸係數、第二溫度校正迴歸係數、第三溫度校正迴歸係數、第四溫度校正迴歸係數、第五溫度校正迴歸係數、第六溫度校正迴歸係數、校正係數以及系統溫度係數的數值是在溫度感測系統的校正過程中所產生。Please refer to FIG. 9 and FIG. 10. FIG. 9 is a flowchart of a method for calibrating a temperature sensing system according to a second embodiment of the present invention, and FIG. 10 is a step of the method for calibrating a temperature sensing system according to a second embodiment of the present invention The flow chart of S12. The following will further explain the calibration method of the temperature sensing system, and at the same time, further explain the method of generating the aforementioned calibration regression coefficient, calibration coefficient, and system temperature coefficient. According to the present invention, the first temperature correction regression coefficient, the second temperature correction regression coefficient, the third temperature correction regression coefficient, the fourth temperature correction regression coefficient, the fifth temperature correction regression coefficient, the sixth temperature correction regression coefficient, the correction coefficient And the value of the system temperature coefficient is generated during the calibration process of the temperature sensing system.
承上述,溫度感測系統S的校正方法,其包括下列步驟:如步驟S11所示:提供具有一預設溫度的一黑體(Black Body)。舉例來說,黑體的預設溫度為已知,以用於計算校正係數及系統溫度係數。接著,如步驟S12所示:取得溫度感測系統S的一校正係數G1以及一系統溫度係數tCo1。舉例來說,在取得校正係數以及所述系統溫度係數的步驟中,是利用一初始溫度量測公式取得校正係數以及系統溫度係數,初始溫度量測公式包括下列關係式:S=G1×(1+tCo1×(T
amb-T
de))×((T
objNA)
4-(T
amb)
4)。S為溫度感測系統S的紅外線溫度感測器10量測一黑體所得到的一初始數位訊號,G1為校正係數,tCo1為系統溫度係數,T
amb為環境溫度,環境溫度可利用溫度感測系統S的溫度量測裝置2量測環境的溫度而取得,環境溫度T
amb的單位為凱氏,T
de為溫度為298.15 K,T
objNA為黑體的預設溫度,預設溫度的單位為凱氏。舉例來說,黑體的預設溫度可為100°C,即,373.15K。此外,值得說明的是,上述初始溫度量測公式可由斯特凡波茲曼定律(Stefan-Boltzmann law)取得。
In view of the above, the calibration method of the temperature sensing system S includes the following steps: as shown in step S11: providing a black body with a preset temperature. For example, the preset temperature of the black body is known and used to calculate the correction coefficient and the system temperature coefficient. Then, as shown in step S12: obtain a correction coefficient G1 and a system temperature coefficient tCo1 of the temperature sensing system S. For example, in the step of obtaining the correction coefficient and the system temperature coefficient, an initial temperature measurement formula is used to obtain the correction coefficient and the system temperature coefficient. The initial temperature measurement formula includes the following relationship: S=G1×(1 +tCo1×(T amb -T de ))×((T objNA ) 4 -(T amb ) 4 ). S is an initial digital signal obtained by measuring a black body by the
承上述,在取得校正係數以及系統溫度係數的步驟中,其包括下列步驟:如步驟S122所示,在環境溫度是298.15 K的環境下取得校正係數。換句話說,當環境溫度T amb為298.15 K時,可以利用初始溫度量測公式計算出校正係數G1。接著,如步驟S124所示:依據取得的校正係數G1,在環境溫度T amb不是298.15 K的環境下取得系統溫度係數tCo1。換句話說,由於校正係數G1可以在步驟S122中取得,因此,通過初始溫度量測公式可以再計算出系統溫度係數tCo1。另外,須說明的是,在步驟S11及步驟S12中,並未考慮到維恩位移(Wien's displacement)補償。因此,仍須要進行後續步驟S13、步驟S14、步驟S15及步驟S16。 In view of the above, the step of obtaining the correction coefficient and the system temperature coefficient includes the following steps: as shown in step S122, the correction coefficient is obtained in an environment where the ambient temperature is 298.15 K. In other words, when the ambient temperature T amb is 298.15 K, the correction coefficient G1 can be calculated using the initial temperature measurement formula. Next, as shown in step S124: according to the obtained correction coefficient G1, the system temperature coefficient tCo1 is obtained in an environment where the ambient temperature T amb is not 298.15 K. In other words, since the correction coefficient G1 can be obtained in step S122, the system temperature coefficient tCo1 can be calculated by the initial temperature measurement formula. In addition, it should be noted that in step S11 and step S12, Wien's displacement compensation is not considered. Therefore, the subsequent steps S13, S14, S15, and S16 still need to be performed.
接著,如步驟S13所示,提供多個輻射黑體,且多個輻射黑體(Black Body)所分別具有的一預定溫度彼此相異。舉例來說,多個輻射黑體的一預定溫度為已知,以用於計算校正迴歸係數。此外,多個輻射黑體的預定溫度的單位為攝氏。接著,如步驟S14所示,利用溫度感測系統S量測多個輻射黑體,以得到多個量測溫度。舉例來說,可以利用溫度感測系統S的紅外線溫度感測器10直接量測多個輻射黑體。此外,多個量測溫度的單位為攝氏。進一步來說,上述所說明的多個輻射黑體的預定溫度為多個輻射黑體的實際溫度值,而多個量測溫度則是利用溫度感測系統所量測出來的溫度值,因此,兩者之間仍有可能有所誤差。因此,需要針對兩者之間的誤差進行校正。Then, as shown in step S13, a plurality of radiating black bodies are provided, and the plurality of radiating black bodies (black bodies) respectively have a predetermined temperature different from each other. For example, a predetermined temperature of a plurality of radiating black bodies is known and used to calculate the correction regression coefficient. In addition, the unit of the predetermined temperature of the plurality of radiant black bodies is Celsius. Next, as shown in step S14, the temperature sensing system S is used to measure a plurality of radiating black bodies to obtain a plurality of measured temperatures. For example, the
承上述,舉例來說,在步驟S13中,可提供具有一第一預定溫度的一第一輻射黑體、具有一第二預定溫度的一第二輻射黑體、具有一第三預定溫度的一第三輻射黑體、具有一第四預定溫度的一第四輻射黑體、具有一第五預定溫度的一第五輻射黑體以及具有一第六預定溫度的一第六輻射黑體。此外,第一預定溫度、第二預定溫度、第三預定溫度、第四預定溫度、第五預定溫度及第六預定溫度彼此相異。此外,第一預定溫度、第二預定溫度、第三預定溫度、第四預定溫度、第五預定溫度及第六預定溫度的單位為攝氏。然而,須說明的是,本發明不以上述多個輻射黑體的數量為限制。Following the above, for example, in step S13, a first radiant black body with a first predetermined temperature, a second radiant black body with a second predetermined temperature, and a third radiant black body with a third predetermined temperature can be provided. A radiant black body, a fourth radiant black body with a fourth predetermined temperature, a fifth radiant black body with a fifth predetermined temperature, and a sixth radiant black body with a sixth predetermined temperature. In addition, the first predetermined temperature, the second predetermined temperature, the third predetermined temperature, the fourth predetermined temperature, the fifth predetermined temperature, and the sixth predetermined temperature are different from each other. In addition, the units of the first predetermined temperature, the second predetermined temperature, the third predetermined temperature, the fourth predetermined temperature, the fifth predetermined temperature, and the sixth predetermined temperature are Celsius. However, it should be noted that the present invention is not limited by the number of the above-mentioned multiple radiating black bodies.
承上述,舉例來說,在步驟S14中,可利用溫度感測系統的紅外線溫度感測器10量測第一輻射黑體、第二輻射黑體、第三輻射黑體、第四輻射黑體、第五輻射黑體以及第六輻射黑體以得到一第一量測溫度、一第二量測溫度、一第三量測溫度、一第四量測溫度、一第五量測溫度以及一第六量測溫度。此外,第一量測溫度、第二量測溫度、第三量測溫度、第四量測溫度、第五量測溫度以及第六量測溫度的單位為攝氏。在其中一實施方式中,由於前述步驟S11及步驟S12中,已取得校正係數G1以及系統溫度係數tCo1。因此,可以利用直接利用溫度量測公式:S=G1×(1+tCo1×(T
amb-T
de))×((T
objNR)
4-(T
amb)
4)取得量測溫度。此外,T
objNR為量測溫度(例如第一量測溫度、第二量測溫度、第三量測溫度、第四量測溫度、第五量測溫度以及第六量測溫度)。此外,須說明的是,此時利用溫度量測公式所求得的多個量測溫度的單位為凱氏溫標,因此,需要將其轉換成攝氏溫標,以進一步利用步驟S15取得校正迴歸係數。
Following the above, for example, in step S14, the
承上述,請一併參閱下表一所示,進一步來說,第一量測溫度對應於第一預定溫度,第二量測溫度對應於第二預定溫度,第三量測溫度對應於第三預定溫度,第四量測溫度對應於第四預定溫度,第五量測溫度對應於第五預定溫度,第六量測溫度對應於第六預定溫度。In view of the above, please refer to the table below. Further, the first measured temperature corresponds to the first predetermined temperature, the second measured temperature corresponds to the second predetermined temperature, and the third measured temperature corresponds to the third The fourth measured temperature corresponds to the fourth predetermined temperature, the fifth measured temperature corresponds to the fifth predetermined temperature, and the sixth measured temperature corresponds to the sixth predetermined temperature.
舉例來說,第一量測溫度可為346.42°C,第二量測溫度可為300.59°C,第三量測溫度可為181.57°C,第四量測溫度可為100°C,第五量測溫度可為-3.5°C,第六量測溫度可為-41.28°C。此外,第一預定溫度可為500°C,第二預定溫度可為400°C,第三預定溫度可為200°C,第四預定溫度可為100°C,第五預定溫度可為0°C,第六預定溫度可為-30°C。然而,須說明的是,上述量測溫度及預定溫度僅為舉例說明,本發明不以此為限。For example, the first measurement temperature may be 346.42°C, the second measurement temperature may be 300.59°C, the third measurement temperature may be 181.57°C, the fourth measurement temperature may be 100°C, and the fifth measurement temperature may be 181.57°C. The measurement temperature can be -3.5°C, and the sixth measurement temperature can be -41.28°C. In addition, the first predetermined temperature may be 500°C, the second predetermined temperature may be 400°C, the third predetermined temperature may be 200°C, the fourth predetermined temperature may be 100°C, and the fifth predetermined temperature may be 0° C, the sixth predetermined temperature may be -30°C. However, it should be noted that the above-mentioned measured temperature and predetermined temperature are only examples, and the present invention is not limited thereto.
接著,如步驟S15所示,對多個量測溫度及多個預設溫度進行一迴歸分析,以得到一初始溫度校正函數。以本發明而言,初始溫度校正函數包括下列關係式:T obj=(C1 0+C1 1×T1 objNB+C1 2×(T objNB) 2+C1 3×(T objNB) 3+C1 4×(T objNB) 4+C1 5×(T objNB) 5)。C1 0、C1 1、C1 2、C1 3、C1 4及C1 5分別為一溫度校正迴歸係數。此外,在得到初始溫度校正函數的步驟中,依序將多個預定溫度的數值帶入T obj中,且依序將多個量測溫度的數值帶入T objNB中,並進行迴歸分析,而取得多個溫度校正迴歸係數。此外,須說明的是,多個預定溫度的單位為攝氏,多個量測溫度的單位為攝氏。 Then, as shown in step S15, a regression analysis is performed on the plurality of measured temperatures and the plurality of preset temperatures to obtain an initial temperature correction function. According to the present invention, the initial temperature correction function includes the following relationship: T obj =(C1 0 +C1 1 ×T1 objNB +C1 2 ×(T objNB ) 2 +C1 3 ×(T objNB ) 3 +C1 4 ×( T objNB ) 4 +C1 5 ×(T objNB ) 5 ). C1 0, C1 1, C1 2 , C1 3, C1 4 C1 5 respectively, and a temperature correction coefficient regression. In addition, in the step of obtaining the initial temperature correction function, a plurality of predetermined temperature values are sequentially brought into T obj , and a plurality of measured temperature values are sequentially brought into T objNB , and regression analysis is performed, and Obtain multiple temperature correction regression coefficients. In addition, it should be noted that the unit of multiple predetermined temperatures is Celsius, and the unit of multiple measured temperatures is Celsius.
承上述,舉例來說,可依序將第一預定溫度、第二預定溫度、第三預定溫度、第四預定溫度、第五預定溫度以及第六預定溫度的數值帶入T obj中,且依序將第一量測溫度、第二量測溫度、第三量測溫度、第四量測溫度、第五量測溫度以及第六量測溫度的數值帶入T objNB中,並進行迴歸分析,而取得第一溫度校正迴歸係數C1 0、第二溫度校正迴歸係數C1 1、第三溫度校正迴歸係數C1 2、第四溫度校正迴歸係數C1 3、第五溫度校正迴歸係數C1 4及第六溫度校正迴歸係數C1 5。舉例來說,在其中一實施方式中可以利用表格計算軟體(例如Excel)進行迴歸分析,以取得第一溫度校正迴歸係數C1 0、第二溫度校正迴歸係數C1 1、第三溫度校正迴歸係數C1 2、第四溫度校正迴歸係數C1 3、第五溫度校正迴歸係數C1 4及第六溫度校正迴歸係數C1 5。 Based on the above, for example, the values of the first predetermined temperature, the second predetermined temperature, the third predetermined temperature, the fourth predetermined temperature, the fifth predetermined temperature, and the sixth predetermined temperature can be brought into T obj in sequence, and according to In order to bring the values of the first measurement temperature, the second measurement temperature, the third measurement temperature, the fourth measurement temperature, the fifth measurement temperature, and the sixth measurement temperature into T objNB , and perform regression analysis, acquires a first temperature correction regression coefficient C1 0, the second temperature correction regression coefficient C1 1, the third temperature correction regression coefficient C1 2, fourth temperature correction regression coefficient C1 3, the temperature correction fifth and sixth regression coefficient C1 4 temperature correction regression coefficient C1 5. For example, in one of the embodiments, a table calculation software (such as Excel) can be used to perform regression analysis to obtain the first temperature correction regression coefficient C1 0 , the second temperature correction regression coefficient C1 1 , and the third temperature correction regression coefficient C1 2, fourth temperature correction regression coefficient C1 3, a fifth regression coefficient C1 4 temperature correction and temperature correction sixth regression coefficient C1 5.
接著,如步驟S16所示,利用初始溫度校正函數得到一溫度校正函數。舉例來說,溫度校正函數包括下列關係式:T1 obj=(C1 0+C1 1×T1 objN+C1 2×(T1 objN) 2+C1 3×(T1 objN) 3+C1 4×(T1 objN) 4+C1 5×(T1 objN) 5)。T1 obj為一待測物體的一已校正溫度,已校正溫度的單位為攝氏,T1 objN為待測物體的一未校正溫度,溫度校正函數中的未校正溫度的單位為攝氏,C1 0、C1 1、C1 2、C1 3、C1 4、C1 5為溫度校正迴歸係數。換句話說,可利用上述初始溫度校正函數所得到的多個溫度校正迴歸係數,而得到用於第一實施例中所提供的溫度校正方法中的溫度校正函數。 Next, as shown in step S16, the initial temperature correction function is used to obtain a temperature correction function. For example, the temperature correction function includes the following relationship: T1 obj =(C1 0 +C1 1 ×T1 objN +C1 2 ×(T1 objN ) 2 +C1 3 ×(T1 objN ) 3 +C1 4 ×(T1 objN ) 4 +C1 5 ×(T1 objN ) 5 ). T1 obj is a corrected temperature of an object to be measured, the unit of corrected temperature is Celsius, T1 objN is an uncorrected temperature of the object to be measured, the unit of uncorrected temperature in the temperature correction function is Celsius, C1 0 , C1 1 , C1 2 , C1 3 , C1 4 , C1 5 are temperature correction regression coefficients. In other words, a plurality of temperature correction regression coefficients obtained by the above-mentioned initial temperature correction function can be used to obtain the temperature correction function used in the temperature correction method provided in the first embodiment.
另外,須說明的是,上述溫度校正迴歸係數僅為其中一個紅外線溫度感測器10的溫度校正迴歸係數,其他紅外線溫度感測器10(例如第一紅外線溫度感測器10至第n紅外線溫度感測器10)的溫度校正迴歸係數也可以利用上述方式進行計算,其計算方式彼此相彷,在此不再贅述。另外,須說明的是,雖然上述實施方式是以五次方程式進行分析,但是,在其他實施方式中,也可以是三次方程式、四次方程式、六次方程式或七次方程式。換句話說,在其他實施方式中,溫度校正函數也可以包括下列關係式,例如:T1
obj=(C1
0+C1
1×T1
objN+C1
2×(T1
objN)
2+C1
3×(T1
objN)
3)、T1
obj=(C1
0+C1
1×T1
objN+C1
2×(T1
objN)
2+C1
3×(T1
objN)
3+C1
4×(T1
objN)
4)、T1
obj=(C1
0+C1
1×T1
objN+C1
2×(T1
objN)
2+C1
3×(T1
objN)
3+C1
4×(T1
objN)
4+C1
5×(T1
objN)
5+C1
6×(T1
objN)
6)或是T1
obj=(C1
0+C1
1×T1
objN+C1
2×(T1
objN)
2+C1
3×(T1
objN)
3+C1
4×(T1
objN)
4+C1
5×(T1
objN)
5+C1
6×(T1
objN)
6+C1
7×(T1
objN)
7),本發明不以溫度校正函數的次方數為限制。
藉此,在其中一實施方式中,製造商可利用上述溫度感測系統S的校正方法,而得到一溫度校正函數,並將溫度校正函數儲存於溫度感測系統S的控制裝置3中。當使用者使用溫度感測系統S時,可利用溫度感測系統S量測待測物體,並利用溫度校正函數得到待測物體的準確溫度。Therefore, in one of the embodiments, the manufacturer can use the above-mentioned correction method of the temperature sensing system S to obtain a temperature correction function, and store the temperature correction function in the control device 3 of the temperature sensing system S. When the user uses the temperature sensing system S, the temperature sensing system S can be used to measure the object to be measured, and the temperature correction function can be used to obtain the accurate temperature of the object to be measured.
[實施例的有益效果][Beneficial effects of the embodiment]
本發明的其中一有益效果在於,本發明所提供的紅外線熱像儀的溫度校正方法,其能通過“依據未校正溫度以及一溫度校正函數,將未校正溫度校準至一已校正溫度”的技術方案,以提升溫度感測系統S的準確性。此外,本發明所提供的紅外線熱像儀的溫度感測系統S的校正方法,其能通過“對多個量測溫度以及多個預定溫度進行一迴歸分析,以得到一初始溫度校正函數”以及“利用初始溫度校正函數得到一溫度校正函數”的技術方案,以使得溫度感測系統S能通過溫度校正函數而提升準確性。One of the beneficial effects of the present invention is that the temperature correction method of the infrared thermal imager provided by the present invention can pass the technology of "calibrating the uncorrected temperature to a corrected temperature based on the uncorrected temperature and a temperature correction function" Solution to improve the accuracy of the temperature sensing system S. In addition, the method for calibrating the temperature sensing system S of the infrared thermal imager provided by the present invention can perform a regression analysis on a plurality of measured temperatures and a plurality of predetermined temperatures to obtain an initial temperature correction function" and The technical solution of "using the initial temperature correction function to obtain a temperature correction function" enables the temperature sensing system S to improve the accuracy through the temperature correction function.
更進一步來說,由於紅外線熱像儀會具有多個紅外線溫度感測器10,多個紅外線溫度感測器10大多會具有不同的參數,此外,待測物體所產生的輻射能量進入到紅外線熱像儀中會有多個不同的入射角。因此,上述因數都會影響紅外線熱像儀的準確性。本發明能通過第一實施例所提供的溫度校正方法,將每一個紅外線溫度感測器10所量測到的未校正溫度校正為已校正溫度,而提高溫度感測系統S的準確性。Furthermore, since the infrared thermal imager will have multiple
更進一步來說,由於本案的溫度校正方法是利用溫度校正函數來進行計算,且溫度校正函數的溫度校正係數已經經由製造商在出廠前針對每一個紅外線溫度感測器10進行校正後而得知,並儲存於溫度感測系統中。所以,本發明所提供的溫度校正方法,只要將溫度感測系統S所量測到的未校正溫度帶入溫度校正函數中進行計算即可得到已校正溫度,其運算速度可以大幅提升。Furthermore, because the temperature correction method in this case uses a temperature correction function for calculation, and the temperature correction coefficient of the temperature correction function has been obtained by the manufacturer after calibration for each
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the description and schematic content of the present invention are included in the application of the present invention. Within the scope of the patent.
S:溫度感測系統
1:紅外線溫度感測裝置
100:基板
10:紅外線溫度感測器
10a:第一紅外線溫度感測器
10b:第二紅外線溫度感測器
10A:第一群組
10B:第二群組
2:溫度量測裝置
3:控制裝置
S102, S1022, S1024, S104, S202, S2022, S2024, S204, S302, S3022, S3024, S304, S11, S12, S122, S124, S13, S14, S15, S16:步驟
S: temperature sensing system
1: Infrared temperature sensing device
100: substrate
10:
圖1為本發明的紅外線熱像儀的溫度感測系統的功能方塊圖。FIG. 1 is a functional block diagram of the temperature sensing system of the infrared thermal imager of the present invention.
圖2為本發明的紅外線熱像儀的溫度感測系統的紅外線溫度感測裝置的俯視示意圖。2 is a schematic top view of the infrared temperature sensing device of the temperature sensing system of the infrared thermal imager of the present invention.
圖3為本發明第一實施例的紅外線熱像儀的溫度校正方法的其中一流程圖。FIG. 3 is a flowchart of the temperature correction method of the infrared thermal imager according to the first embodiment of the present invention.
圖4為本發明第一實施例的紅外線熱像儀的溫度校正方法的步驟S102的流程圖。4 is a flowchart of step S102 of the temperature correction method of the infrared thermal imager according to the first embodiment of the present invention.
圖5為本發明第一實施例的紅外線熱像儀的溫度校正方法的另外一流程圖。FIG. 5 is another flowchart of the temperature correction method of the infrared thermal imager according to the first embodiment of the present invention.
圖6為本發明第一實施例的紅外線熱像儀的溫度校正方法的步驟S202的流程圖。FIG. 6 is a flowchart of step S202 of the temperature correction method of the infrared thermal imager according to the first embodiment of the present invention.
圖7為本發明第一實施例的紅外線熱像儀的溫度校正方法的再一流程圖。FIG. 7 is another flowchart of the temperature correction method of the infrared thermal imager according to the first embodiment of the present invention.
圖8為本發明第一實施例的紅外線熱像儀的溫度校正方法的步驟S302的流程圖。FIG. 8 is a flowchart of step S302 of the temperature correction method of the infrared thermal imager according to the first embodiment of the present invention.
圖9為本發明第二實施例的紅外線熱像儀的溫度感測系統的校正方法的流程圖。9 is a flowchart of a method for calibrating the temperature sensing system of an infrared thermal imager according to the second embodiment of the present invention.
圖10為本發明第二實施例的紅外線熱像儀的溫度感測系統的校正方法的步驟S12的流程圖。10 is a flowchart of step S12 of the method for calibrating the temperature sensing system of the infrared thermal imager according to the second embodiment of the present invention.
S102,S104:步驟 S102, S104: steps
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109123988A TWI733524B (en) | 2020-07-16 | 2020-07-16 | Temperature calibration method of infrared thermal image camera and calibration method of temperature sensing system of infrared thermal image camera |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109123988A TWI733524B (en) | 2020-07-16 | 2020-07-16 | Temperature calibration method of infrared thermal image camera and calibration method of temperature sensing system of infrared thermal image camera |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI733524B true TWI733524B (en) | 2021-07-11 |
TW202204861A TW202204861A (en) | 2022-02-01 |
Family
ID=77911408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109123988A TWI733524B (en) | 2020-07-16 | 2020-07-16 | Temperature calibration method of infrared thermal image camera and calibration method of temperature sensing system of infrared thermal image camera |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI733524B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5150969A (en) * | 1990-03-12 | 1992-09-29 | Ivac Corporation | System and method for temperature determination and calibration in a biomedical probe |
TWI504872B (en) * | 2014-09-26 | 2015-10-21 | China Steel Corp | Calibrating method for infrared thermometers and manufacturing controlling system using the same |
WO2020130940A1 (en) * | 2018-12-21 | 2020-06-25 | Ams Sensors Singapore Pte. Ltd. | Linear temperature calibration compensation for spectrometer systems |
-
2020
- 2020-07-16 TW TW109123988A patent/TWI733524B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5150969A (en) * | 1990-03-12 | 1992-09-29 | Ivac Corporation | System and method for temperature determination and calibration in a biomedical probe |
TWI504872B (en) * | 2014-09-26 | 2015-10-21 | China Steel Corp | Calibrating method for infrared thermometers and manufacturing controlling system using the same |
WO2020130940A1 (en) * | 2018-12-21 | 2020-06-25 | Ams Sensors Singapore Pte. Ltd. | Linear temperature calibration compensation for spectrometer systems |
Also Published As
Publication number | Publication date |
---|---|
TW202204861A (en) | 2022-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5845301B2 (en) | Infrared radiation detection device with resistive imaging bolometer and system with an array of such bolometers | |
CN103528694B (en) | A kind of method of temperature of infrared heat image instrument measuring target object | |
RU2523775C2 (en) | Method and system for correction on basis of quantum theory to increase accuracy of radiation thermometer | |
US8748808B2 (en) | Detection and correction of a loss of calibration of microbolometer thermal imaging radiometers | |
TWI651519B (en) | Temperature measurement correction method, electronic system and method for generating corrected regression coefficient table | |
CN111693154B (en) | Temperature compensation method and device for infrared temperature measurement sensor | |
JPH11507136A (en) | Calibration method of radiation thermometer | |
KR101229605B1 (en) | Method and system for measuring and compensating for the case temperature variations in a bolometer based system | |
CN112393808B (en) | Temperature compensation method and system for thermal camera | |
TWI716229B (en) | High-precision non-contact temperature measuring device | |
US20120166124A1 (en) | Sensor response calibration for linearization | |
CN109540297B (en) | Infrared thermal imager calibration method based on FPA temperature | |
CN111272290A (en) | Temperature measurement thermal infrared imager calibration method and device based on deep neural network | |
CN110455417B (en) | Quantitative measurement error correction method for stray radiation of infrared optical system | |
US20080170599A1 (en) | Calibration Method for Infrared Temperature Measuring Instruments | |
TWI733524B (en) | Temperature calibration method of infrared thermal image camera and calibration method of temperature sensing system of infrared thermal image camera | |
WO2023272908A1 (en) | High-precision temperature measurement method and system | |
US20040057494A1 (en) | Ear thermometer with improved temperature coefficient and method of calibration thereof | |
CN110146173B (en) | Temperature measurement consistency checking method based on infrared temperature measurement technology | |
US20220146319A1 (en) | Temperature calibration method of infrared thermal image camera and calibration method of temperature sensing system of infrared thermal image camera | |
CN111024237A (en) | Non-contact wide-temperature-difference infrared temperature measuring method | |
CN111289148A (en) | Transient fireball parameter acquisition method based on field calibration | |
KR101827284B1 (en) | Read-in integrated circuit for infrared scene projectors with improved uniformity of emitter current | |
CN112611482A (en) | Method for calibrating temperature sensor of intelligent equipment | |
Zhao et al. | The influence of thermal imager parameters on the accuracy of infrared thermal imager |