TWI733257B - Substrate treating apparatus - Google Patents

Abstract

The substrate processing apparatus 1 of the present invention includes a first frame 46, a movable member 51a1, a heat treatment portion 37a1, and a conveying mechanism 34a1. The movable member 51a1 is supported by the first frame 46. The movable member 51a1 is movable relative to the first frame 46. The heat treatment portion 37a1 is supported by the movable member 51a1. The transport mechanism 34a1 is supported by the movable member 51a1. As the movable member 51a1 moves relative to the first frame 46, the heat treatment portion 37a1 moves relative to the first frame 46. As the movable member 51a1 moves with respect to the first frame 46, the heat treatment portion 37a1 and the conveying mechanism 34a1 move integrally.

Description

Substrate processing device

The present invention relates to a substrate processing device for processing substrates. The substrates are, for example, semiconductor wafers, substrates for liquid crystal displays, substrates for organic EL (Electroluminescence), substrates for FPD (Flat Panel Display), substrates for optical displays, substrates for magnetic disks, substrates for optical disks, Substrates for magneto-optical discs, substrates for photomasks, and substrates for solar cells.

Patent Document 1 discloses a substrate processing apparatus. Hereinafter, the symbols described in Patent Document 1 are marked by brackets. The substrate processing apparatus (1) includes a heat treatment block (BA). The heat treatment block (BA) has a transfer space (AA), a main transfer mechanism (TAR), and a main transfer mechanism (TAL). The main transport mechanism (TAR) and the main transport mechanism (TAL) are installed in the transport space (AA). The main transport mechanism (TAR) and the main transport mechanism (TAL) transport substrates separately. The heat treatment block (BA) has 2 heat treatment units (HAR) and 2 heat treatment units (HAL). The heat treatment unit (HAR) is arranged on the right side of the conveying space (AA). The heat treatment unit (HAL) is arranged on the left of the conveying space (AA). Two heat treatment units (HAR) are arranged in an up-down direction. Two heat treatment units (HAL) are arranged in a vertical direction. The main transport mechanism (TAR) enters and exits the heat treatment unit (HAR). host The transport mechanism (TAL) enters and exits the heat treatment unit (HAL).

The heat treatment block (BA) further has a frame (FA). The frame (FA) supports the main transport mechanism (TAR), the main transport mechanism (TAL), the heat treatment unit (HAR) and the heat treatment unit (HAL).

[Prior Technical Literature] [Patent Literature]

[Patent Document 1]

Japanese Patent Laid-Open No. 2017-41588

It is required to be able to easily maintain the substrate processing equipment. Here, maintenance means, for example, including inspection, maintenance, adjustment, repair, and repair of the substrate processing apparatus.

On the other hand, in order to increase the throughput of the substrate processing apparatus, the number of elements (such as a heat treatment unit or a transport mechanism) provided in the substrate processing apparatus may be increased. The greater the number of elements provided in the substrate processing device, the more important the maintenance of the substrate processing device. Or, in order to increase the throughput of the substrate processing apparatus, the density of the elements provided in the substrate processing apparatus may be increased. The higher the density of the elements installed in the substrate processing device, the more important the maintenance of the substrate processing device.

The present invention was completed in view of this situation, and its purpose is to provide a method that can easily Substrate processing equipment for maintenance of substrate processing equipment.

In order to achieve such an object, the present invention adopts the following configuration. That is, the present invention is a substrate processing apparatus that includes: a first frame; a first movable member supported by the first frame and movable relative to the first frame; and a first heat treatment section that is supported by the first frame. Supported by a movable member to heat the substrate; and a first transport mechanism, which is supported by the first movable member and transports the substrate to the first heat treatment section; and by the first movable member moving relative to the first frame, the The first heat treatment unit moves relative to the first frame integrally with the first conveying mechanism.

The first movable member is supported by the first frame. The first heat treatment part is supported by the first movable member. The first movable member can move relative to the first frame. As the first movable member moves relative to the first frame, the first heat treatment portion moves relative to the first frame. Therefore, the maintenance of the first heat treatment section can be easily performed. Here, maintenance means, for example, including inspection, maintenance, adjustment, repair, and repair of the first heat treatment section.

The first transport mechanism is supported by the first movable member. As the first movable member moves with respect to the first frame, the first heat treatment unit and the first conveying mechanism move integrally. Therefore, when the first movable member moves with respect to the first frame, the relative position of the first heat treatment portion and the first conveying mechanism can be kept fixed. Therefore, the maintenance of the first heat treatment part can be performed while keeping the relative position of the first heat treatment part and the first conveying mechanism in a fixed state. Therefore, there is no need to adjust the relative position of the first heat treatment part and the first conveying mechanism every time the maintenance of the first heat treatment part is performed. That is, it can be more The maintenance of the first heat treatment department is carried out in a remote location.

As described above, according to this substrate processing apparatus, the maintenance of the substrate processing apparatus can be easily performed.

In the substrate processing apparatus, it is preferable that the first movable member moves relative to the first frame, and the first heat treatment section moves in a horizontal direction relative to the first frame. The first heat treatment part can move relative to the first frame without interfering with other members.

In the substrate processing apparatus, it is preferable that the first movable member moves relative to the first frame, and the first heat treatment section can be moved to the first heat treatment section where at least a part of the first heat treatment section is located outside the first frame. 1Maintenance position. By the movement of the first movable member with respect to the first frame, the first heat treatment part can be moved to the first maintenance position. When the first heat treatment part is in the first maintenance position, at least a part of the first heat treatment part is located outside the first frame. Therefore, the first heat treatment section can be easily moved to the first maintenance position. When the first heat treatment part is in the first maintenance position, at least a part of the first heat treatment part is located outside the first frame. Therefore, when the first heat treatment part is at the first maintenance position, the maintenance of the first heat treatment part can be easily performed.

In the substrate processing apparatus, it is preferable that the first movable member is supported by the first frame when the first heat treatment section is in the first maintenance position. When the first heat treatment part is in the first maintenance position, the first heat treatment part is supported by the first frame via the first movable member. Therefore, the maintenance of the first heat treatment part can be performed more easily.

In the substrate processing apparatus, it is preferable that the first movable member moves relative to the first frame, and the first heat treatment section can be moved to a first processing position for the first heat treatment section to heat the substrate. . According to this, the first heat treatment section can be easily moved to the first treatment position. Therefore, the first heat treatment section can be easily moved between the first maintenance position and the first treatment position. As described above, by the movement of the first movable member with respect to the first frame, the first heat treatment unit and the first conveying mechanism move integrally. Therefore, when the first movable member is moved to the first processing position, the relative position of the first heat treatment portion and the first conveying mechanism may be kept fixed. In short, in a state where the relative position of the first heat treatment part and the first conveying mechanism is kept fixed, the first heat treatment part can be easily moved between the first maintenance position and the first treatment position.

In the substrate processing apparatus, it is preferable that a portion of the first heat treatment part located outside the first frame when the first heat treatment part is at the first maintenance position is larger than the part of the first heat treatment part at the first treatment position The part of the first heat-treated part located outside the first frame. When the first heat treatment part is in the first maintenance position, the maintenance of the first heat treatment part can be easily performed. When the first heat treatment part is at the first treatment position, the first heat treatment part can appropriately heat-treat the substrate.

In the substrate processing apparatus, it is preferable that when the first heat treatment part is at the first treatment position, all the first heat treatment parts are located inside the first frame. When the first heat treatment part is at the first treatment position, the first heat treatment part can further appropriately heat-treat the substrate.

In the substrate processing apparatus, it is preferable that the first heat treatment section is in the first treatment In the position, the first movable member is supported by the first frame. When the first heat treatment part is at the first treatment position, the first heat treatment part is supported by the first frame via the first movable member. Therefore, the first heat treatment section can further appropriately heat the substrate.

In the substrate processing apparatus, it is preferable that the first transport mechanism includes: a first rail portion fixed to the first movable member and extending in a horizontal direction; and a first horizontal moving portion supported by the first rail Part supported and movable in a horizontal direction relative to the first rail part; a first arm part supported by the first horizontal moving part and rotatable about a first axis relative to the first horizontal moving part; and 1 holding portion, which is fixed to the first arm portion and holds the substrate; and the first axis is parallel to the vertical direction, and when viewed from above, the relative position of the first axis with respect to the first horizontal moving portion is fixed, and In a plan view, the distance between the first holding portion and the first axis is constant.

The first transport mechanism includes a first rail portion, a first horizontal movement portion, a first arm portion, and a first holding portion. The first rail part is fixed to the first movable member. The first horizontal moving part is supported by the first rail part. The first arm is supported by the first horizontal moving part. The first holding portion is fixed to the first arm portion. In this way, the first rail portion, the first horizontal moving portion, the first arm portion, and the first holding portion are directly or indirectly supported by the first movable member. Therefore, the first movable member can support the first transport mechanism well.

The first horizontal moving part can move in the horizontal direction with respect to the first rail part. Therefore, the first holding portion can move in the horizontal direction with respect to the first rail portion. The first arm portion is rotatable about the first axis with respect to the first horizontal moving portion. Therefore, the first holding portion can rotate about the first axis with respect to the first horizontal moving portion. Therefore, the first holding portion can enter and exit the first heat treatment portion well.

In a plan view, the relative position of the first axis with respect to the first horizontal moving part is fixed. Therefore, the structure in which the first arm portion is supported by the first horizontal moving portion is simple. The first holding portion is fixed to the first arm portion. Furthermore, in a plan view, the distance between the first holding portion and the first axis is constant. Therefore, the structure in which the first holding portion is supported by the first arm portion is simple. In this way, the structure of the first transport mechanism is simple. Therefore, the installation space of the first transport mechanism in a plan view can be effectively reduced.

In the substrate processing apparatus, it is preferable that the first conveying mechanism includes a first vertical moving part supported by the first horizontal moving part and capable of moving up and down relative to the first horizontal moving part. When moving, the first arm part is supported by the first horizontal moving part via the first vertical moving part. As the first vertical moving part moves in the vertical direction relative to the first horizontal moving part, the first arm part and the first holding part move in the vertical direction relative to the first horizontal moving part. Therefore, the first holding portion can enter and exit the first heat treatment portion more satisfactorily.

In the substrate processing apparatus, it is preferable that the substrate processing apparatus includes: a second frame connected to the first frame; and a second movable member supported by the second frame and movable relative to the second frame ; A second heat treatment section, which is supported by the second movable member, heat-treating the substrate; and a second transport mechanism, which is supported by the second movable member, and transports the substrate to the second heat treatment section; and by the second The movable member moves relative to the second frame, and the second heat treatment unit moves relative to the second frame integrally with the second conveying mechanism.

The second movable member is supported by the second frame. The second heat treatment part is supported by the second movable member. The second movable member can move relative to the second frame. By moving the second movable member relative to the second frame, The second heat treatment part moves with respect to the second frame. Therefore, the maintenance of the second heat treatment section can be easily performed.

The second transport mechanism is supported by the second movable member. As the second movable member moves with respect to the second frame, the second heat treatment unit and the second conveying mechanism move integrally. Therefore, when the second movable member moves with respect to the second frame, the relative position of the second heat treatment part and the second conveying mechanism can be kept fixed. Therefore, the maintenance of the second heat treatment part can be performed while keeping the relative position of the second heat treatment part and the second conveying mechanism in a fixed state. Therefore, it is not necessary to perform maintenance of the second heat treatment part every time, and adjust the relative position of the second heat treatment part and the second conveying mechanism. That is, the maintenance of the second heat treatment part can be performed more easily.

As described above, according to this substrate processing apparatus, the maintenance of the substrate processing apparatus can be further easily performed.

Furthermore, the substrate processing apparatus includes a second heat treatment unit in addition to the first heat treatment unit. Therefore, the throughput of the substrate processing apparatus can be improved well.

In the substrate processing apparatus, it is preferable that the second frame is arranged at the same height position as the first frame, the first conveying mechanism is arranged between the first heat treatment section and the second frame, and the second conveying The mechanism is arranged between the second heat treatment section and the first frame. In other words, the first frame and the second frame are arranged in a horizontal direction. The first heat treatment part, the first conveying mechanism, the second conveying mechanism, and the second heat treatment part are arranged in order. Thereby, the 1st, 2nd heat processing part and the 1st, 2nd conveyance mechanism can be installed efficiently.

In the substrate processing apparatus, it is preferable that the direction from the second frame to the first frame is set as the first direction, and the direction opposite to the first direction is set as the second direction, and the first movable The member moves relative to the first frame, the first heat-treated portion can move in the first direction relative to the first frame, and the second movable member moves relative to the second frame, and the second heat-treated portion can be moved relative to the second frame. Move in the second direction on the second frame. When the first heat treatment part moves in the first direction with respect to the first frame, the first heat treatment part is away from the second frame. Therefore, the first heat treatment portion can move without interfering with the second frame. When the second heat treatment part moves in the second direction with respect to the second frame, the second heat treatment part is away from the first frame. Therefore, the second heat treatment part can move without interfering with the first frame.

In the substrate processing apparatus, it is preferable that the first movable member moves relative to the first frame, and the first movable member can move at least a part of the first heat treatment portion from the first frame toward the first direction When the second movable member moves relative to the second frame, the second movable member can pull at least a part of the second heat treatment portion from the second frame in the second direction. By moving the first movable member with respect to the first frame, at least a part of the first heat treatment portion can be pulled out from the first frame in the first direction. Therefore, the maintenance of the first heat treatment section can be easily performed. Similarly, by moving the second movable member relative to the second frame, at least a part of the second heat treatment portion can be pulled out from the second frame in the second direction. Therefore, the maintenance of the second heat treatment section can be easily performed.

In the substrate processing apparatus, it is preferable that the second frame has the same shape as the first frame. The first frame and the second frame can be easily manufactured. Therefore, the base can be easily manufactured 板处理装置。 Plate processing device.

In the substrate processing apparatus, it is preferable that the second frame is separable from the first frame. According to this, the substrate processing apparatus can be easily manufactured.

For example, the manufacturing of the substrate processing apparatus can be divided into the following first, second, and third operations.

‧The first task of installing the first movable member, the first heat treatment part and the first conveying mechanism on the first frame

‧The second task of installing the second movable member, the second heat treatment part and the second conveying mechanism on the second frame

‧The third task of connecting the first frame and the second frame

Here, the first task, the second task, and the third task can be performed in different places and at different times. Therefore, the substrate processing apparatus can be easily manufactured.

In the substrate processing apparatus, it is preferable that the second conveying mechanism is arranged at a position symmetrical with the first conveying mechanism, and the second heat treatment section is arranged at a position symmetrical with the first heat treatment section. The arrangement of the first conveying mechanism and the first heat treatment part is symmetrical to the arrangement of the second conveying mechanism and the second heat treatment part. Therefore, the design and manufacture of the substrate processing apparatus can be performed more easily.

In the above-mentioned substrate processing apparatus, it is preferable that the above-mentioned substrate processing apparatus includes: a third movable member supported by the first frame and movable relative to the first frame; and a third heat treatment section that is supported by the third movable member. Component support, heat treatment of the substrate; and the third conveying mechanism, which Supported by the third movable member, the substrate is conveyed to the third heat treatment section; and the third movable member is movable relative to the first frame independently of the first movable member, and the third movable member is relative to the The first frame moves, and the third heat treatment unit moves relative to the first frame integrally with the third conveying mechanism.

The third movable member is supported by the first frame. The third heat treatment part is supported by the third movable member. The third movable member can move relative to the first frame. As the third movable member moves relative to the first frame, the third heat treatment portion moves relative to the first frame. Therefore, the maintenance of the third heat treatment section can be easily performed.

The third conveying mechanism is supported by the third movable member. As the third movable member moves with respect to the first frame, the third heat treatment unit and the third conveying mechanism move integrally. Therefore, when the third movable member moves with respect to the first frame, the relative position of the third heat treatment part and the third conveying mechanism can be kept fixed. Therefore, the maintenance of the third heat treatment part can be performed while keeping the relative position of the third heat treatment part and the third conveying mechanism in a fixed state. Therefore, it is not necessary to adjust the relative position of the third heat treatment part and the third conveying mechanism every time the maintenance of the third heat treatment part is performed. That is, the maintenance of the third heat treatment part can be performed more easily.

As described above, according to this substrate processing apparatus, the maintenance of the substrate processing apparatus can be easily performed.

Furthermore, the third movable member can move relative to the first frame independently of the first movable member. Therefore, the first heat treatment part and the third heat treatment part can be moved separately. So, for example, it can easily Perform maintenance of only one of the first heat treatment section and the third heat treatment section. Alternatively, it is possible to easily perform maintenance of both the first heat treatment part and the third heat treatment part.

Furthermore, the substrate processing apparatus includes a third heat treatment unit in addition to the first heat treatment unit. Therefore, the throughput of the substrate processing apparatus can be improved well.

In the substrate processing apparatus, it is preferable that the third heat treatment section is disposed above the first heat treatment section, and the third conveyance mechanism is disposed above the first conveyance mechanism. The installation space of the first heat treatment part and the third heat treatment part in the plan view can be reduced. It can reduce the installation space of the first conveying mechanism and the third conveying mechanism in the top view. Therefore, the area occupied by the substrate processing apparatus can be reduced.

In the substrate processing apparatus, it is preferable that the substrate processing apparatus includes a guide part fixed to the first frame; and a sliding part fixed to the first movable member and guided by the guide part. Since the substrate processing apparatus includes the guide portion and the sliding portion, the first movable member can move well with respect to the first frame.

According to the present invention, the maintenance of the substrate processing apparatus can be easily performed.

1: Substrate processing equipment

11: Storage Department

13: shelf board

15: Vehicle transport mechanism

16a: Rail part

16b: Horizontal moving part

16c: Vertical movement part

16d: 1st arm

16e: 2nd arm

16f: Holding part

16g: Vertical moving part

16h: 1st arm

16i: 2nd arm

16j: holding part

21: Transfer and transfer department

22a: Vehicle loading department

22a1: Vehicle loading section

22a2: Vehicle loading section

22b: Vehicle loading section

22b1: Vehicle loading section

22b2: Vehicle loading section

23: Transport space

24: Frame

25: Conveying mechanism for transfer and transfer

26a: Transport mechanism

26b: Transport mechanism

27a: Pillar

27b: Vertical movement part

27c: Rotating part

27d, 27e: holding part

31: Heat treatment block

32: Transport space

33: Conveying mechanism for heat treatment

34a1: Transport mechanism (1st transport mechanism)

34a2: Transport mechanism (3rd transport mechanism)

34a3: Transport mechanism

34a4: Transport mechanism

34b1: Transport mechanism (2nd transport mechanism)

34b2: Transport mechanism (4th transport mechanism)

34b3: Transport mechanism

34b4: Transport mechanism

35a: Rail part (1st rail part, 2nd rail part)

35b: Horizontal moving part (1st horizontal moving part, 2nd horizontal moving part)

35c: Vertical movement part (1st vertical movement part, 2nd vertical movement part)

35d: Arm (1st arm, 2nd arm)

35e: holding part (first holding part, second holding part)

35f: Arm (1st arm, 2nd arm)

35g: holding part (first holding part, second holding part)

37a1: Heat treatment section (1st heat treatment section)

37a2: Heat treatment section (3rd heat treatment section)

37a3: Heat treatment department

37a4: Heat treatment department

37b1: Heat treatment section (Second heat treatment section)

37b2: Heat treatment section (4th heat treatment section)

37b3: Heat treatment department

37b4: Heat treatment department

38a1: Heat treatment unit (1st heat treatment unit)

38a2: Heat treatment unit (3rd heat treatment unit)

38a3: heat treatment unit

38a4: heat treatment unit

38b1: Heat treatment unit (2nd heat treatment unit)

38b2: Heat treatment unit (4th heat treatment unit)

38b3: Heat treatment unit

38b4: Heat treatment unit

39a: the first plate

39b: 2nd plate

41a1: Inspection Department

41a2: Inspection Department

41a3: Inspection Department

41a4: Inspection Department

41b1: Inspection Department

41b2: Inspection Department

41b3: Inspection Department

41b4: Inspection Department

42a1: Inspection unit

42a2-42a4: Inspection unit

42b1-42b4: Inspection unit

43a: Tablet

43b: Camera Department

45: Frame

46: Frame 1

47: Frame 2

48a: Base

48b: Pillar

48c: Rod

48d: Space (the interior of the 1st frame/the 2nd frame)

51a1: movable member (the first movable member)

51a2: movable member (third movable member)

51a3: movable member

51a4: movable member

51b1: Movable member (2nd movable member)

51b2: movable member (4th movable member)

51b3: movable member

51b4: movable member

52a: bottom plate

52b: Pillar

52c: shelf

52d: Wall

52e: Slot

52f: top plate

55: Guidance

56: Sliding part

57a1: Electrical Equipment Department

57a2-57a4: Electrical Equipment Department

57b1-57b4: Electrical Equipment Department

61: Liquid processing block

62: Frame

63: Transport space

64a: Transport space

64b: Transport space

65: next wall

67: Conveying mechanism for liquid handling

68a: Transport mechanism

68b: Transport mechanism

69a: Pillar

69b: Pillar

69c: Vertical movement part

69d: Horizontal moving part

69e: Rotating part

69f: holding part

69g: holding part

71: Liquid Handling Department

72: Liquid Handling Department

72L: Liquid Handling Department

72R: Liquid Handling Department

73: Liquid Handling Department

73L: Liquid Handling Department

73R: Liquid Handling Department

74: Liquid handling unit

75a: Rotation holding part

75b: nozzle

75c: Cup

76: Chamber

81: Front loading department

82a1: Placement part (first front placement part)

82a2: Placement part (3rd front placement part)

82a3: Placement part

82a4: Placement part

82b1: Placement part (2nd front placement part)

82b2: Placement part (4th front placement part)

82b3: Placement part

82b4: Placement part

83: Rear loading part

84a1: Placement part (1st rear placement part)

84a2: Placement part (3rd rear placement part)

84a3: Placement part

84a4: Placement part

84b1: Placement part (second rear placement part)

84b2: Placement part (4th rear placement part)

84b3: Placement part

84b4: Placement part

85: tablet

85a: Tablet

85b: Tablet

91: Control Department

A16d: axis of rotation

A16e: axis of rotation

A27c: Rotation axis

A35: Rotation axis

A35d: Rotation axis (1st axis, 2nd axis)

A35f: Rotation axis (1st axis, 2nd axis)

A69e: axis of rotation

AHP: Hydrophobic treatment unit

Ba: The area where the transport mechanism 34a1 can transport the substrate W

Bb: The area where the transport mechanism 34b1 can transport the substrate W

C: Vehicle

CP: Cooling unit

Da: The distance between two adjacent first center points in the approximate front and rear direction

Db: The distance between two adjacent second center points in the roughly front-to-back direction

E: imaginary line

e1: point

e2: point

e3: point

e4: point

e5: point

e6: point

e7: point

F2: imaginary line

Ga1: The first center point of the heat treatment unit 38a1

Gb1: The second center point of the heat treatment unit 38b1

HP: heating unit

J: The center point of the transport space

K: imaginary face

L1: The length of the conveying space 32 in the width direction

L2: The length of the transport space 32 in the front and rear direction

La: The length of one heat treatment unit 38a1 in the front and rear direction

Lb: The length of one heat treatment unit 38b1 in the front and rear direction

Pa1: Processing position (1st processing position)

Pa2: Processing position (3rd processing position)

Pa3: Processing position

Pa4: Processing position

Pb1: Processing position (2nd processing position)

Pb2: Processing position (4th processing position)

Pb3: Processing location

Pb4: Processing location

Qa1: Maintenance position (1st maintenance position)

Qa2: Maintenance position (3rd maintenance position)

Qa3: Processing location

Qa4: Processing location

Qb1: Maintenance position (2nd maintenance position)

Qb2: Maintenance position (4th maintenance position)

Qb3: Processing location

Qb4: Processing location

r: the radius of the substrate

U1, U2, U3: heat treatment unit

V2: Flat center point

W: substrate

X: front and rear direction

Y: width direction

Z: Up and down direction

In order to illustrate the invention, several forms that are currently considered preferable are illustrated, but it should be understood that the invention is not limited to the illustrated constitution and scheme.

Fig. 1 is a plan view of the substrate processing apparatus of the embodiment.

Fig. 2 is a right side view showing the structure of the right part of the substrate processing apparatus.

Fig. 3 is a right side view showing the structure of the central part of the substrate processing apparatus in the width direction.

Fig. 4 is a left side view showing the structure of the left part of the substrate processing apparatus.

Figure 5 is a front view of the transfer and transfer section.

Fig. 6 is a front view showing the internal structure of the transfer conveying unit.

Figure 7 is a front view of the heat treatment block.

Figure 8 is an enlarged top view of the heat treatment block.

Fig. 9 is a plan view illustrating the maintenance position of the heat treatment unit.

Fig. 10 is a front view illustrating the maintenance position of the heat treatment part.

Fig. 11A is a top view of the first frame and the second frame, Fig. 11B is a front view of the first frame and the second frame, and Fig. 11C is a right side view of the first frame.

Fig. 12A is a plan view of the movable member, Fig. 12B is a front view of the movable member, and Fig. 12C is a right side view of the movable member.

FIG. 13 is a diagram schematically showing the elements of the substrate processing apparatus through which the substrate passes.

14A-14R is a plan view showing an example of the operation of the conveying mechanism.

Hereinafter, the substrate processing apparatus of the present invention will be described with reference to the drawings.

<Overview of substrate processing equipment>

Fig. 1 is a plan view of the substrate processing apparatus of the embodiment. The substrate processing apparatus 1 processes a substrate (for example, a semiconductor wafer) W.

The substrate W is, for example, a semiconductor wafer, a substrate for liquid crystal displays, a substrate for organic EL (Electroluminescence), a substrate for FPD (Flat Panel Display), a substrate for optical display, a substrate for magnetic disks, a substrate for optical disks, a substrate for magneto-optical disks, and optical disks. Cover substrate and solar cell substrate. The substrate W has a thin flat plate shape. The substrate W has a substantially circular shape in a plan view.

The substrate processing apparatus 1 includes a storage unit 11, a transfer conveying unit 21, a heat treatment block 31, and a liquid treatment block 61. The storage unit 11 stores a plurality of carriers C. The carrier C accommodates a plurality of substrates W. The carrier C is, for example, a FOUP (front opening unified pod). The transfer conveying unit 21 carries the substrate W out of the carrier C and carries the substrate W into the carrier C. The heat treatment block 31 heats the substrate W. The liquid processing block 61 performs liquid processing on the substrate W.

The storage unit 11 is connected to the transfer and transfer unit 21. The carrier C is conveyed between the storage unit 11 and the transfer conveying unit 21. The transfer and transfer part 21 is connected to the heat treatment block 31. The substrate W is transported between the transfer section 21 and the heat treatment block 31. The heat treatment block 31 is connected to the liquid treatment block 61. The substrate W is transported between the heat treatment block 31 and the liquid treatment block 61.

The storage unit 11, the transfer unit 21, the heat treatment block 31, and the liquid treatment block 61 are arranged in a row in sequence. The direction in which the storage section 11, the transfer conveying section 21, the heat treatment block 31, and the liquid treatment block 61 are arranged is referred to as the "front-rear direction X". The front and rear direction X is horizontal. In the front-rear direction X, the direction from the liquid processing block 61 toward the storage portion 11 is referred to as "front". The direction opposite to the front is called "rear". The horizontal direction orthogonal to the front-rear direction X is called the "width direction Y" or "side". One of the "width directions Y" is appropriately referred to as "right". The direction opposite to the right is called "left". The vertical direction is referred to as "up and down direction Z". The up-down direction Z is orthogonal to the front-rear direction X and orthogonal to the width direction Y. In each figure, the front, back, right, left, top, and bottom are appropriately shown for reference.

The substrate processing apparatus 1 further includes a front mounting portion 81 and a rear mounting portion 83. The front placement part 81 is disposed between the transfer and transfer part 21 and the heat treatment block 31. The front mounting portion 81 is for mounting the substrate W. The substrate W is conveyed between the transfer conveying part 21 and the heat treatment block 31 via the front mounting part 81. The rear mounting portion 83 is arranged between the heat treatment block 31 and the liquid treatment block 61. The rear mounting portion 83 is for mounting the substrate W. The substrate W is conveyed between the heat treatment block 31 and the liquid treatment part 61 via the post-mounting part 83.

The storage section 11, the transfer conveying section 21, the heat treatment block 31, the liquid treatment block 61, the front placement section 81, and the rear placement section 83 will be described below.

<Storage Section 11>

Refer to Figure 1-4. FIG. 2 is a right side view showing the structure of the right part of the substrate processing apparatus 1. FIG. 3 is a right side view showing the structure of the center portion of the substrate processing apparatus 1 in the width direction Y. FIG. 4 is a left side view showing the structure of the left part of the substrate processing apparatus 1.

The storage unit 11 includes a plurality of shelf plates 13. Each shelf 13 is for mounting a plurality of carriers C. The shelf 13 has a substantially horizontal plate shape. The plurality of shelf plates 13 are arranged so as to be arranged in the vertical direction Z.

According to the condition of the vehicle C, the vehicle C can be classified into several categories. For example, the carrier C is classified into the carrier C (referred to as the "previous type of carrier C") that is transferred between the storage part 11 and an external transport mechanism not shown in the figure, and the other carrier C (referred to as Is "the latter vehicle C"). Here, the external transport mechanism is an external device of the substrate processing apparatus 1. The external transport mechanism transports the carrier C. The external transport mechanism is provided above the storage section 11, for example. The external transport mechanism is, for example, OHT (Overhead Hoist Transfer). The former carrier C is further classified into the carrier C received by the storage unit 11 from the external transport mechanism, and the carrier C delivered by the storage unit 11 to the external transport mechanism. The latter type of carrier C is further classified into a carrier C that accommodates an unprocessed substrate W, a carrier C that does not accommodate the substrate W, and a carrier C that accommodates the processed substrate W.

It is also possible to change the position of the carrier C placed on the shelf 13 for each type of the above-mentioned carrier C.

The storage unit 11 includes a carrier transport mechanism 15 that transports the carrier C. The carrier conveying mechanism 15 is arranged between the shelf 13 and the transfer conveying part 21. The carrier conveying mechanism 15 can place the carrier C on the shelf 13 and can obtain the carrier C on the shelf 13. Furthermore, the carrier conveying mechanism 15 can convey the carrier C between the shelf 13 and the transfer conveying part 21.

The carrier transport mechanism 15 includes a rail portion 16a, a horizontal movement portion 16b, a vertical movement portion 16c, a first arm portion 16d, a second arm portion 16e, and a holding portion 16f. The rail portion 16a is set to be fixed. The rail portion 16a extends in the substantially width direction Y. The horizontal moving part 16b is supported by the rail part 16a. The horizontal moving part 16b can move in the substantially width direction Y with respect to the rail part 16a. The horizontal moving portion 16b extends in the substantially vertical direction Z. The vertical moving part 16c is supported by the horizontal moving part 16b. Move vertically The part 16c can move in substantially the up-down direction Z with respect to the horizontal movement part 16b. The first arm portion 16d is supported by the vertical moving portion 16c. The first arm portion 16d is rotatable about the rotation axis A16d with respect to the vertical moving portion 16c. The rotation axis A16d is an imaginary line parallel to the substantially vertical direction Z. The second arm portion 16e is supported by the first arm portion 16d. The second arm portion 16e is rotatable about the rotation axis A16e with respect to the first arm portion 16d. The rotation axis A16e is an imaginary line parallel to the substantially vertical direction Z. The holding portion 16f is supported by the second arm portion 16e. The holding portion 16f holds one carrier C. Specifically, the holding portion 16f holds the upper portion of the carrier C.

Refer to Figure 2-4. The carrier transport mechanism 15 further includes a vertical moving portion 16g, a first arm portion 16h, a second arm portion 16i, and a holding portion 16j. The vertical moving portion 16g, the first arm portion 16h, the second arm portion 16i, and the holding portion 16j have substantially the same shape and structure as the vertical moving portion 16c, the first arm portion 16d, the second arm portion 16e, and the holding portion 16f, respectively. The vertical moving part 16g is supported by the horizontal moving part 16b. The vertical moving part 16g can operate independently of the vertical moving part 16c. The first arm portion 16h is supported by the vertical moving portion 16g. The second arm portion 16i is supported by the first arm portion 16h. The holding portion 16j is supported by the second arm portion 16i.

<Transfer Conveyor 21>

Refer to Figure 1-5. FIG. 5 is a front view of the transfer and transfer part 21. The transfer conveying section 21 includes carrier placing sections 22a1, 22a2, 22b1, 22b2. One carrier C is respectively placed on the carrier placing portions 22a1, 22a2, 22b1, 22b2.

The carrier mounting parts 22a1, 22a2 are arranged so as to be arranged in the vertical direction Z. The carrier placing portion 22a2 is disposed above the carrier placing portion 22a1. The carrier placement parts 22b1, 22b2 are arranged on the It is arranged in the downward direction Z. The carrier placing portion 22b2 is arranged above the carrier placing portion 22b1. The carrier placing portion 22a1 is arranged at a height position that is substantially the same as that of the carrier placing portion 22b1. The carrier mounting parts 22a1, 22b1 are arranged so as to be arranged in the width direction Y. The carrier placing portion 22a1 is arranged on the right of the carrier placing portion 22b1. The carrier placing portion 22a2 is arranged at a height position that is substantially the same as that of the carrier placing portion 22b2. The carrier mounting parts 22a2, 22b2 are arranged so as to be arranged in the width direction Y. The carrier placing portion 22a2 is arranged on the right of the carrier placing portion 22b2.

When not distinguishing between the carrier placing parts 22a1 and 22a2, it is described as "carrier placing part 22a". When not distinguishing between the carrier placing parts 22b1 and 22b2, it is described as "carrier placing part 22b".

The carrier placing parts 22 a and 22 b are arranged behind the carrier conveying mechanism 15. The carrier conveying mechanism 15 can place the carrier C on the carrier placing portions 22a and 22b. The carrier conveying mechanism 15 can obtain the carrier C on the carrier placing portions 22a and 22b.

Refer to Figures 1-4 and 6. FIG. 6 is a front view showing the internal structure of the transfer conveying section 21. FIG. The transfer conveying unit 21 includes a conveying space 23. The conveyance space 23 is arrange|positioned behind the carrier mounting part 22a, 22b. The transport space 23 has a substantially box shape. The conveying space 23 has a substantially rectangular shape in a plan view, a side view, and a front view.

The transfer conveyor 21 includes a frame 24. The frame 24 is set as a skeleton of the transport space 23. The frame 24 defines the shape of the conveying space 23. The frame 24 is made of metal, for example.

The transfer conveyor 21 includes a transfer mechanism 25 for transfer and transfer. The transfer mechanism 25 for transfer and transfer is installed in the transfer space 23. The transfer mechanism 25 for transfer transfer transfers the substrate W between the carrier C placed on the carrier placing portions 22 a and 22 b and the heat treatment block 31.

The transfer mechanism 25 for transfer and transfer includes two transfer mechanisms 26a and 26b. The conveying mechanism 26b is arranged at a height position that is substantially the same as that of the conveying mechanism 26a. The conveyance mechanisms 26a and 26b are arranged so as to be aligned in the width direction Y. The conveying mechanism 26b is arranged on the left of the conveying mechanism 26a. The conveyance mechanism 26a is arrange|positioned behind the carrier mounting part 22a. The conveyance mechanism 26b is arrange|positioned behind the carrier mounting part 22b. The transport mechanism 26 a transports the substrate W between the carrier C placed on the carrier placing portion 22 a and the heat treatment block 31. The transport mechanism 26b transports the substrate W between the carrier C placed on the carrier placing portion 22b and the heat treatment block 31. The transport mechanism 26b can transport the substrate W independently of the transport mechanism 26a.

The conveying mechanism 26a includes a support column 27a, a vertical moving part 27b, a rotating part 27c, and holding parts 27d and 27e. The pillar 27a is supported by the frame 24. The pillar 27a is fixed to the frame 24. The pillar 27a cannot move relative to the frame 24. The pillar 27a extends in the substantially vertical direction Z. The vertical moving part 27b is supported by the pillar 27a. The vertical moving part 27b can move in the substantially up-down direction Z with respect to the support|pillar 27a. The vertical moving part 27b cannot move in a substantially horizontal direction with respect to the pillar 27a. The rotating part 27c is supported by the vertical moving part 27b. The rotating portion 27c is rotatable about the rotation axis A27c relative to the vertical moving portion 27b. The rotation axis A27c is an imaginary line parallel to the substantially vertical direction Z. The holding parts 27d and 27e are supported by the rotating part 27c. The holding parts 27d and 27e can move forward and backward with respect to the rotating part 27c. More specifically, the holding parts 27d and 27e can reciprocate in one of the horizontal directions determined by the direction of the rotating part 27c. One of the horizontal directions is, for example, the radial direction of the rotation axis A27c. The holding parts 27d and 27e can move forward and backward independently of each other. The holding parts 27d and 27e each have one substrate W with water Maintain a flat posture.

In this way, the holding parts 27d and 27e can move in parallel in the vertical direction Z. The holding parts 27d and 27e are rotatable about the rotation axis A27c. The holding parts 27d and 27e can move forward and backward with respect to the rotating part 27c.

The conveying mechanism 26b has substantially the same structure and shape as the conveying mechanism 26a, except that it is bilaterally symmetrical. That is, the conveyance mechanism 26b is equipped with the support|pillar 27a, the vertical movement part 27b, the rotation part 27c, and the holding|maintenance part 27d, 27e.

As such, in this specification, when different elements have the same structure, the detailed description is omitted by denoting the structure with a common symbol.

<Heat Treatment Block 31> <<Summary of Heat Treatment Block 31>>

Refer to Figures 1-4 and 7. FIG. 7 is a front view of the heat treatment block 31. The heat treatment block 31 has a substantially box shape. The heat treatment block 31 is substantially rectangular in plan view, side view, and front view.

The heat treatment block 31 includes a conveying space 32 and a conveying mechanism 33 for heat treatment. The heat treatment transport mechanism 33 is installed in the transport space 32. The heat treatment transport mechanism 33 transports the substrate W.

The conveyance mechanism 33 for heat treatment includes a plurality of (for example, eight) conveyance mechanisms 34a1, 34a2, 34a3, 34a4, 34b1, 34b2, 34b3, and 34b4. Regarding the indiscriminate transfer mechanism 34a1- In the case of 34a4 and 34b1-34b4, the conveying mechanisms 34a1-34a4 and 34b1-34b4 are collectively referred to as the conveying mechanism 34. The transport mechanism 34 transports the substrates W, respectively.

The heat treatment block 31 includes a plurality of (for example, 8) heat treatment portions 37a1, 37a2, 37a3, 37a4, 37b1, 37b2, 37b3, and 37b4. When the heat treatment parts 37a1-37a4 and 37b1-37b4 are not distinguished, the heat treatment parts 37a1-37a4 and 37b1-37b4 are collectively referred to as the heat treatment part 37. The heat treatment unit 37 heats the substrate W, respectively.

The heat treatment unit 37a1 includes a plurality of (for example, 7) heat treatment units 38a1. Similarly, the heat treatment units 37a2-37a4, 37b1-37b4 are provided with a plurality of (for example, 7) heat treatment units 38a2-38a4, 38b1-38b4, respectively. When the heat treatment units 38a1-38a4 and 38b1-38b4 are not distinguished, the heat treatment units 38a1-38a4 and 38b1-38b4 are collectively referred to as the heat treatment unit 38. The heat treatment unit 38 heats one substrate W, respectively.

The heat treatment block 31 includes a plurality of (for example, 8) inspection parts 41a1, 41a2, 41a3, 41a4, 41b1, 41b2, 41b3, 41b4. When the inspection parts 41a1-41a4 and 41b1-41b4 are not distinguished, the inspection parts 41a1-41a4 and 41b1-41b4 are collectively referred to as the inspection part 41. The inspection unit 41 inspects the substrate W.

The inspection unit 41a1 includes one inspection unit 42a1. Similarly, the inspection units 41a2-41a4, 41b1-41b4 each include one inspection unit 42a2-42a4, 42b1-42b4. When the inspection units 42a1-42a4 and 42b1-42b4 are not distinguished, the inspection units 42a1-42a4 and 42b1-42b4 are collectively referred to as the inspection unit 42. The inspection unit 42 inspects one substrate W.

The transport mechanism 34a1 transports the substrate W to the heat treatment unit 37a1. The conveyance mechanism 34a1 does not convey the substrate W to the heat treatment part 37 other than the heat treatment part 37a1. With respect to the heat treatment portion 37a1, the substrate W is mainly transported by the transport mechanism 34a1. Specifically, the transport mechanism 34a1 transports the substrate W to the heat treatment unit 38a. Similarly, the transport mechanisms 34a2-34a4, 34b1-34b4 transport the substrate W to the heat treatment sections 37a2-37a4, 37b1-34b4, respectively. Specifically, the conveyance mechanisms 34a2-34a4, 34b1-34b4 convey the substrate W to the heat treatment units 38a2-38a4, 38b1-38b4, respectively.

The transport mechanism 34a1 transports the substrate W to the inspection section 41a1. The transport mechanism 34a1 does not transport the substrate W to the inspection unit 41 other than the inspection unit 41a1. With regard to the inspection unit 41a1, the substrate W is mainly transported by the transport mechanism 34a1. Specifically, the transport mechanism 34a transports the substrate W to the inspection unit 42a1. Similarly, the transport mechanisms 34a2-34a4, 34b1-34b4 transport the substrate W to the inspection sections 41a2-41a4, 41b1-41b4, respectively. Specifically, the transport mechanisms 34a2-34a4, 34b1-34b4 transport the substrate W to the inspection units 42a2-42a4, 42b1-42b4, respectively.

<<The configuration of each element of heat treatment block 31>>

The arrangement of the transport space 32, the heat treatment transport mechanism 33, the heat treatment unit 37, and the inspection unit 41 will be described.

Refer to Figure 1. The conveying space 32 is arranged at the center of the heat treatment block 31 in the width direction Y in a plan view. The conveying space 32 has a substantially rectangular shape in a plan view. The conveyance space 32 extends substantially in the front-rear direction X. The conveying space 32 is in contact with the conveying space 23 of the transfer conveyor 21. The conveyance space 32 is arrange|positioned at the left and rear of the conveyance mechanism 26a. The conveying space 32 is arranged in the conveying mechanism 26b to the right and to the rear.

FIG. 8 is an enlarged top view of the heat treatment block 31. The length L1 of the transport space 32 in the width direction Y is, for example, 5 times or less of the radius r of the substrate W. The length L1 is more than 4 times the radius r of the substrate W. The length L1 is shorter than the length L2 of the transport space 32 in the front-rear direction X. As such, the length L1 is relatively small.

Refer to Figures 7 and 8. The transfer space 32 has an imaginary center point J located at the center of the transfer space 32. 7 and 8 show a virtual plane K passing through the center point J and orthogonal to the width direction Y. The transport mechanism 34a1-34a4 is arranged on the right of the virtual plane K. The transport mechanism 34b1-34b4 is arranged on the left of the virtual plane K.

The conveying mechanism 34b1 is arranged at a height position that is substantially the same as that of the conveying mechanism 34a1. The conveyance mechanisms 34a1, 34b1 are arranged so as to be aligned in the width direction Y. The conveying mechanism 34b1 is arranged on the left of the conveying mechanism 34a1. The conveying mechanism 34b1 is arranged at a position symmetrical to the conveying mechanism 34a1. Specifically, the conveying mechanism 34b1 is arranged at a position that is bilaterally symmetrical to the conveying mechanism 34a1 with respect to the virtual plane K.

The relative positional relationship of the conveying mechanisms 34a2, 34b2 is the same as the relative positional relationship of the conveying mechanisms 34a1, 34b1. The relative positional relationship of the conveying mechanisms 34a3, 34b3 is the same as the relative positional relationship of the conveying mechanisms 34a1, 34b1. The relative positional relationship of the conveying mechanisms 34a4 and 34b4 is the same as the relative positional relationship of the conveying mechanisms 34a1 and 34b1.

Refer to Figure 7. The conveying mechanisms 34a2, 34b2 are arranged above the conveying mechanisms 34a1, 34b1. The conveying mechanisms 34a3, 34b3 are arranged above the conveying mechanisms 34a2, 34b2. The conveying mechanisms 34a4 and 34b4 are arranged above the conveying mechanisms 34a3 and 34b3.

The conveyance mechanisms 34a1-34a4 are arranged so as to be arranged in the vertical direction Z. The conveying mechanism 34a2 overlaps with the conveying mechanism 34a1 in a plan view. The conveying mechanism 34a3 overlaps with the conveying mechanism 34a1 in a plan view. The conveying mechanism 34a4 overlaps with the conveying mechanism 34a1 in a plan view.

The conveying mechanisms 34b1-34b4 are arranged so as to be arranged in the vertical direction Z. The conveying mechanism 34b2 overlaps with the conveying mechanism 34b1 in a plan view. The conveying mechanism 34b3 overlaps with the conveying mechanism 34b1 in a plan view. The conveying mechanism 34b4 overlaps with the conveying mechanism 34b1 in a plan view.

Refer to Figures 1, 2, 4, 7, and 8. The heat treatment part 37a1, the conveyance space 32, and the heat treatment part 37b1 are arranged so as to be sequentially arranged in the substantially width direction Y. In other words, the conveyance space 32 is arranged between the heat treatment portion 37a1 and the heat treatment portion 37b1 in the substantially width direction Y. Similarly, the heat treatment part 37a2, the conveyance space 32, and the heat treatment part 37b2 are arranged so as to be sequentially arranged in the substantially width direction Y. The heat treatment part 37a3, the conveyance space 32, and the heat treatment part 37b3 are arranged so as to be sequentially arranged in the substantially width direction Y. The heat treatment part 37a4, the conveyance space 32, and the heat treatment part 37b4 are arranged so as to be sequentially arranged in the substantially width direction Y.

Specifically, the heat treatment portion 37a1-37a4 is arranged at a position on the right of the conveying space 32. The heat treatment parts 37b1-37b4 are arranged on the left side of the conveying space 32.

Refer to Figure 7. The heat treatment portion 37a1 is arranged at a height position that is substantially the same as that of the conveying mechanism 34a1. The heat treatment portion 37a1 is arranged to line up with the conveying mechanism 34a1 in the substantially width direction Y. The heat treatment part 37a1 is arranged at a position on the right of the conveying mechanism 34a1. Similarly, the heat treatment portions 37a2-37a4 are respectively arranged at substantially the same height positions as the conveying mechanism 34a2-34a4. The heat treatment parts 37a2-37a4 are respectively arranged to line up with the conveying mechanism 34a2-34a4 in the substantially width direction Y. The heat treatment parts 37a2-37a4 are respectively arranged at positions on the right of the conveying mechanism 34a2-34a4.

The heat treatment portion 37b1 is arranged at a height position that is substantially the same as that of the conveying mechanism 34b1. The heat treatment portion 37b1 is arranged to be parallel to the conveying mechanism 34b1 in the substantially width direction Y. The heat treatment part 37b1 is arranged on the left side of the conveying mechanism 34b1. Similarly, the heat treatment parts 37b2-37b4 are respectively arranged at substantially the same height positions as the conveying mechanism 34b2-34b4. The heat treatment portions 37b2-37b4 are respectively arranged to line up with the conveying mechanism 34b2-34b4 in the substantially width direction Y. The heat treatment parts 37b2-37b4 are respectively arranged at positions on the left of the conveying mechanism 34b2-34b4.

The heat treatment part 37a1, the conveyance mechanism 34a1, the conveyance mechanism 34b1, and the heat treatment part 37b1 are arranged so as to be sequentially arranged in the substantially width direction Y. Similarly, the heat treatment part 37a2, the conveyance mechanism 34a2, the conveyance mechanism 34b2, and the heat treatment part 37b2 are arranged so as to be sequentially arranged in the substantially width direction Y. The heat treatment part 37a3, the conveyance mechanism 34a3, the conveyance mechanism 34b3, and the heat treatment part 37b3 are arranged so as to be sequentially arranged in the substantially width direction Y. The heat treatment part 37a4, the conveyance mechanism 34a4, the conveyance mechanism 34b4, and the heat treatment part 37b4 are arranged so as to be sequentially arranged in the substantially width direction Y.

Refer to Figures 2 and 7. The heat treatment portions 37a1-37a4 are arranged so as to be aligned in the vertical direction Z. The heat treatment part 37a2 is arranged above the heat treatment part 37a1. The heat treatment part 37a3 is arranged in the heat treatment Above section 37a2. The heat treatment part 37a4 is arranged above the heat treatment part 37a3. The heat treatment part 37a2 overlaps with the heat treatment part 37a1 in a plan view. The heat treatment part 37a3 overlaps with the heat treatment part 37a1 in a plan view. The heat treatment portion 37a4 overlaps the heat treatment portion 37a1 in a plan view.

Refer to Figures 4 and 7. The heat treatment portions 37b1-37b4 are arranged so as to be aligned in the vertical direction Z. The heat treatment part 37b2 is arranged above the heat treatment part 37b1. The heat treatment part 37b3 is arranged above the heat treatment part 37b2. The heat treatment part 37b4 is arranged above the heat treatment part 37b3. The heat treatment part 37b2 overlaps with the heat treatment part 37b1 in a plan view. The heat treatment portion 37b3 overlaps the heat treatment portion 37b1 in a plan view. The heat treatment portion 37b4 overlaps the heat treatment portion 37b1 in a plan view.

Refer to Figure 7. The heat treatment part 37b1 is arranged at a height position substantially the same as that of the heat treatment part 37a1. The heat treatment part 37b1 faces the heat treatment part 37a1 with the conveyance space 32 interposed therebetween. The heat treatment part 37b1 is arranged at a position symmetrical to the heat treatment part 37a1. Specifically, the heat treatment portion 37b1 is arranged at a position that is bilaterally symmetrical to the heat treatment portion 37a1 with respect to the virtual plane K.

The relative positional relationship of the heat treatment portions 37a2, 37b2 is the same as the relative positional relationship of the heat treatment portions 37a1, 37b1. The relative positional relationship of the heat treatment portions 37a3, 37b3 is the same as the relative positional relationship of the heat treatment portions 37a1, 37b1. The relative positional relationship of the heat treatment portions 37a4, 37b4 is the same as the relative positional relationship of the heat treatment portions 37a1, 37b1.

Refer to Figures 1, 2, and 4. The inspection part 41a1-41a4 is arrange|positioned at the position of the right of the conveyance space 32. As shown in FIG. The inspection portion 41b1-41b4 is arranged at a position on the left of the conveying space 32.

Although illustration is omitted, the inspection parts 41a1-41a4, 41b1-41b4 are arranged at substantially the same height positions as the conveying mechanisms 34a1-34a4, 34b1-34b4, respectively. The inspection parts 41a1-41a4 are respectively arranged on the right of the conveying mechanism 34a1-34a4. The inspection parts 41b1-41b4 are respectively arranged on the left of the conveying mechanism 34b1-34b4.

The inspection parts 41a1-41a4 are arranged so as to be arranged in the vertical direction Z. The inspection parts 41b1-41b4 are arranged so as to be arranged in the vertical direction Z.

The inspection part 41b1 is arrange|positioned at substantially the same height position as the inspection part 41a1. The inspection part 41b1 faces the inspection part 41a1 across the transport space 32. The inspection portion 41b1 is arranged at a position symmetrical to the inspection portion 41a1. Specifically, the inspection portion 41b1 is arranged at a position that is bilaterally symmetrical to the inspection portion 41a1 with respect to the virtual plane K.

The relative positional relationship of the inspection parts 41a2, 41b2 is the same as the relative positional relationship of the inspection parts 41a1, 41b1. The relative positional relationship of the inspection parts 41a3 and 41b3 is the same as the relative positional relationship of the inspection parts 41a1 and 41b1. The relative positional relationship of the inspection parts 41a4 and 41b4 is the same as the relative positional relationship of the inspection parts 41a1 and 41b1.

Refer to Figure 8. A plurality of (for example, 2 or 3) heat treatment units 38a1 are arranged so as to be arranged in substantially the front-rear direction X. A plurality of (for example, two or three) heat treatment units 38b1 are arranged so as to be arranged substantially in the front-rear direction X.

The length La of one heat treatment unit 38a1 in the front-rear direction X is 3 times the radius r of the substrate W the following. The length La is greater than twice the radius r of the substrate W.

The heat treatment units 38a1 each have an imaginary first center point Ga1 located at the center of the heat treatment unit 38a1. The distance Da between two adjacent first center points Ga1 in the substantially front-rear direction X is less than 3 times the radius r of the substrate W. The distance Da is greater than twice the radius r of the substrate W.

The length Lb of one heat treatment unit 38b1 in the front-rear direction X is less than 3 times the radius r of the substrate W. The length Lb is greater than twice the radius r of the substrate W. The length Lb is approximately equal to the length La.

The heat treatment units 38b1 each have an imaginary second center point Gb1 located at the center of the heat treatment unit 38b1. The distance Db between two adjacent second center points Gb1 in the substantially front-rear direction X is less than 3 times the radius r of the substrate W. The distance Db is greater than twice the radius r of the substrate W. The distance Db is approximately equal to the distance Da.

Refer to Figure 2. A plurality of (for example, two or three) heat treatment units 38a1 are arranged so as to be arranged in a substantially vertical direction Z.

The plurality of heat treatment units 38a1 and one inspection unit 42a1 are arranged in a matrix in a side view. For example, a plurality of heat treatment units 38a1 and one inspection unit 42a1 are arranged in three rows in the front-rear direction X, and are arranged in three stages in the vertical direction Z. The inspection unit 42a1 overlaps with at least one heat treatment unit 38a1 in a plan view.

Refer to Figure 4. A plurality of (e.g. 2 or 3) heat treatment units 38b1 are arranged approximately up and down Configuration in the direction Z.

The plurality of heat treatment units 38b1 and one inspection unit 42b1 are arranged in a matrix in a side view. For example, a plurality of heat treatment units 38b1 and one inspection unit 42b1 are arranged in three rows in the front-rear direction X, and are arranged in three stages in the vertical direction Z. The inspection unit 42b1 overlaps with at least one heat treatment unit 38b1 in a plan view.

The heat treatment units 38a2, 38a3, and 38a4 are respectively arranged in the same manner as the heat treatment unit 38a1. The heat treatment units 38b2, 38b3, and 38b4 are respectively arranged in the same manner as the heat treatment unit 38b1. The inspection units 42a2, 42a3, and 42a4 are respectively arranged in the same manner as the inspection unit 42a1. The inspection units 42b2, 42b3, and 42b4 are respectively arranged in the same manner as the inspection unit 42b1.

<<Structure of the transport mechanism 34 of the heat treatment block 31>>

The structure of the transport mechanism 34a1 will be described with reference to FIGS. 3 and 8. The conveyance mechanism 34a1 includes a rail portion 35a, a horizontal movement portion 35b, a vertical movement portion 35c, an arm portion 35d, and a holding portion 35e. The rail part 35a is set to be fixed. The rail portion 35a extends in a substantially horizontal direction. Specifically, the rail portion 35a extends in the substantially front-rear direction X. The guide rail portion 35a extends from a position farther forward than any one of the first center points Ga1 to a position rearward than any one of the first center points Ga1. The horizontal moving part 35b is supported by the rail part 35a. The horizontal moving part 35b can move in a substantially horizontal direction with respect to the rail part 35a. Specifically, the horizontal moving part 35b can move in substantially the front-rear direction X with respect to the rail part 35a. The horizontal moving portion 35b extends in the substantially vertical direction Z. The length of the horizontal moving portion 35b in the vertical direction Z is shorter than the length of the rail portion 35a in the front-rear direction X. The vertical moving part 35c is supported by the horizontal moving part 35b. The vertical moving part 35c can be larger than the horizontal moving part 35b. Move up and down in the Z direction. The vertical moving part 35c protrudes to the right from the horizontal moving part 35b. The arm portion 35d is supported by the vertical moving portion 35c. The arm portion 35d is rotatable about the rotation axis A35d relative to the vertical moving portion 35c. The rotation axis A35d is an imaginary line parallel to the substantially vertical direction Z. The rotation axis A35d passes through the arm 35d, for example. The rotation axis A35d is located on the right of the horizontal moving part 35b, for example. The arm portion 35d extends in the horizontal direction from the vertical moving portion 35c. The holding portion 35e is supported by the arm portion 35d. The holding portion 35e is fixed to the arm portion 35d. The rotation axis A35d does not pass through the holding portion 35e. The holding portion 35e is arranged at a position deviated from the rotation axis A35d. The holding portion 35e holds one substrate W in a horizontal posture.

The transport mechanism 34a1 further includes an arm portion 35f and a holding portion 35g. The arm portion 35f and the holding portion 35g have substantially the same shape and structure as the arm portion 35d and the holding portion 35e, respectively. The arm 35f is arranged below the arm 35d. The arm portion 35f is supported by the vertical moving portion 35c. The arm portion 35f is rotatable about the rotation axis A35f with respect to the vertical moving portion 35c. The rotation axis A35f is an imaginary line parallel to the substantially vertical direction Z. The rotation axis A35f is located on the same axis as the rotation axis A35d. The arm 35f can rotate independently of the arm 35d. The holding portion 35g is fixed to the arm portion 35f.

In this way, the holding parts 35e and 35g can be moved in parallel in the front-rear direction X and the vertical direction Z, respectively. Furthermore, the holding parts 35e and 35g are each rotatable about the rotation axis A35d. However, neither of the holding portions 35e and 35g can move in parallel in the width direction Y.

FIG. 8 shows an imaginary line E passing through the rotation axis A35d and substantially parallel to the front-rear direction X in a plan view. The imaginary line E passes through the rotation axis A35f. In a plan view, the rotation axes A35d and A35f move on the imaginary line E. In the top view, the rotation axis A35d and A35f cannot move to deviate from the imaginary line E 的的位置。 The location.

In a plan view, the relative position of the rotation axis A35d with respect to the horizontal moving portion 35b is fixed, and in a plan view, the distance between the holding portion 35e and the rotation axis A35d is fixed. Therefore, the structure of the conveying mechanism 34a1 is simple. A specific description will be given below.

In a plan view, the relative position of the rotation axis A35d with respect to the horizontal moving portion 35b is fixed. For example, even if the arm portion 35d rotates about the rotation axis A35d with respect to the horizontal movement portion 35b, the rotation axis A35d is maintained at a position to the right of the horizontal movement portion 35b in a plan view. Therefore, the structure of the horizontal moving portion 35b supporting the arm portion 35d is relatively simple. In a plan view, the distance between the holding portion 35e and the rotation axis A35d is constant. For example, even if the arm portion 35d rotates about the rotation axis A35d with respect to the horizontal movement portion 35b and the vertical movement portion 35c, the distance between the holding portion 35e and the rotation axis A35d is kept constant. Therefore, the structure of the arm portion 35d supporting the holding portion 35e is relatively simple.

Similarly, in a plan view, the relative position of the rotation axis A35f with respect to the horizontal moving portion 35b is fixed, and in a plan view, the distance between the holding portion 35g and the rotation axis A35f is fixed. Therefore, even if focusing on the holding portion 35g, the structure of the conveying mechanism 34a1 is relatively simple. Specifically, the structure of the horizontal moving portion 35b to support the arm portion 35f is relatively simple, and the structure of the arm portion 35f to support the holding portion 35g is relatively simple.

The conveying mechanisms 34a2-34a4 have substantially the same structure as the conveying mechanism 34a1, respectively. The conveying mechanisms 34b1-34b4 each have substantially the same structure and shape as the conveying mechanism 34a1, except that they are bilaterally symmetrical.

The conveyance mechanism 34a1 is movable in substantially the front-rear direction X with respect to the heat treatment unit 38a1. More specifically, the horizontal moving portion 35b, the vertical moving portion 35c, the arm portion 35d, the holding portion 35e, the arm portion 35f, and the holding portion 35g of the conveying mechanism 34a1 are movable in the substantially front-rear direction X relative to the heat treatment unit 38a1. Similarly, the conveying mechanisms 34a2-34a4, 34b1-34b4 are respectively movable relative to the heat treatment units 38a2-38a4, 38b1-38b4 in the substantially front-rear direction X.

The transport mechanism 34a1 is movable in the substantially front-rear direction X with respect to the inspection unit 42a1. Similarly, the conveyance mechanisms 34a2-34a4, 34b1-34b4 are respectively movable in the substantially front-rear direction X with respect to the inspection units 42a2-42a4, 42b1-42b4.

Each conveyance mechanism 34 can move in substantially the front-rear direction X independently of each other. Specifically, the horizontal moving parts 35b of the conveying mechanisms 34a1-34a4 and 34b1-34b4 can move in the substantially front-rear direction X independently of each other. For example, the conveying mechanism 34a1 can move in the substantially front-rear direction X independently of the conveying mechanism 34 other than the conveying mechanism 34a1.

FIG. 8 schematically shows the area Ba where the transfer mechanism 34a1 can transfer the substrate W. FIG. 8 schematically shows the area Bb where the substrate W can be transported by the transport mechanism 34b1. The regions Ba and Bb each have an elliptical shape that is long in the front-rear direction X. For example, the length of the area Ba in the front-rear direction X is greater than the length of the area Ba in the width direction Y. The heat treatment part 37a1 is arranged inside the area Ba. The heat treatment portion 37b1 is arranged inside the area Bb. The heat treatment part 37b1 is arranged outside the area Ba. The heat treatment portion 37a1 is arranged outside the area Bb.

The area where the transport mechanisms 34a2, 34a3, and 34a4 can transport the substrate W is substantially the same as the area Ba in a plan view. The area where the transport mechanisms 34b2, 34b3, and 34b4 can transport the substrate W is substantially the same as the area Bb in a plan view.

The conveying mechanism 34a1 is an example of the first conveying mechanism in the present invention. The transport mechanism 34b1 is an example of the second transport mechanism in the present invention. The conveying mechanism 34a2 is an example of the third conveying mechanism in the present invention. The transport mechanism 34b2 is an example of the fourth transport mechanism in the present invention.

The rail part 35a of the transport mechanism 34a1 is an example of the first rail part in the present invention. The horizontal movement part 35b of the conveyance mechanism 34a1 is an example of the 1st horizontal movement part in this invention. The vertical moving part 35c of the transport mechanism 34a1 is an example of the first vertical moving part in the present invention. The arms 35d and 35f of the transport mechanism 34a1 are examples of the first arm in the present invention. The rotation axes A35d and A35f of the conveying mechanism 34a1 are examples of the first axis in the present invention. The holding parts 35e and 35g of the conveying mechanism 34a1 are examples of the first holding part in the present invention.

The rail part 35a of the transport mechanism 34b1 is an example of the second rail part in the present invention. The horizontal movement part 35b of the conveyance mechanism 34b1 is an example of the 2nd horizontal movement part in this invention. The vertical moving part 35c of the conveying mechanism 34b1 is an example of the second vertical moving part in the present invention. The arms 35d and 35f of the transport mechanism 34b1 are examples of the second arm in the present invention. The rotation axes A35d and A35f of the conveying mechanism 34b1 are examples of the second axis in the present invention. The holding parts 35e and 35g of the conveying mechanism 34b1 are examples of the second holding part in the present invention.

<<Structure of heat treatment unit 38 of heat treatment block 31>>

The structure of the heat treatment unit 38 will be described with reference to FIG. 1. Furthermore, the structures of the heat treatment units 38a1-38a4 and 38b1-38b4 are basically the same.

The heat treatment unit 38 includes a first flat plate 39a. The first flat plate 39a has a substantially disc shape. One substrate W is placed on the first flat plate 39a. For example, the transport mechanism 34a1 can place the substrate W on the first flat plate 39a of the heat treatment unit 38a1. The transport mechanism 34a1 can obtain the substrate W on the first flat plate 39a of the heat treatment unit 38a1.

The heat treatment unit 38 includes a second flat plate 39b. The second flat plate 39b is provided at a height position that is substantially the same as that of the first flat plate 39a. The first flat plate 39a and the second flat plate 39b are arranged so as to be aligned in the substantially width direction Y. The second flat plate 39b has a substantially disc shape. One substrate W is placed on the second flat plate 39b.

The heat treatment unit 38 is provided with a local conveying mechanism (not shown). The local transport mechanism transports the substrate W between the first flat plate 39a and the second flat plate 39b.

The heat treatment unit 38 includes a first temperature adjustment unit not shown. The first temperature control unit is attached to at least any one of the first flat plate 39a and the local transport mechanism. When the first temperature adjustment part is mounted on the first flat plate 39a, the first temperature adjustment part adjusts the temperature of the substrate W on the first flat plate 39a. When the first temperature adjustment unit is installed in the local transport mechanism, the first temperature adjustment unit adjusts the temperature of the substrate W held by the local transport mechanism. The first temperature control unit adjusts the substrate W to the first temperature. The first temperature control unit cools the substrate W, for example. The first temperature control unit is, for example, a heat exchanger. The heat exchanger has, for example, a flow path through which a heating medium (cooling water) flows.

The heat treatment unit 38 includes a second temperature adjustment unit not shown. The second temperature control unit is attached to the second flat plate 39b. The second temperature control unit adjusts the temperature of the substrate W on the second flat plate 39b. The second temperature control unit adjusts the substrate W to a second temperature higher than the first temperature. The second temperature control unit heats the substrate W, for example. The second temperature control unit is, for example, a heater.

As described above, the heat treatment section 37 heats the substrate W, respectively. In more detail, the heat treatment performed on the substrate W by the heat treatment unit 37a1 includes a hydrophobization treatment, a heating treatment, and a cooling treatment. The hydrophobization treatment is a treatment in which a processing gas containing hexamethyldisilazane (HMDS: Hexamethyldisilazane) is supplied to the substrate W and the substrate W is adjusted to a specific temperature. The hydrophobization treatment is performed in order to improve the adhesion between the substrate W and the coating film. The heating process heats the substrate W. The cooling process cools the substrate W.

The heat treatment performed by the heat treatment section 37b1 on the substrate W includes hydrophobization treatment, heating treatment, and cooling treatment. In this way, the heat treatment performed on the substrate W by the heat treatment portion 37b1 is the same as the heat treatment performed on the substrate W by the heat treatment portion 37a1.

The heat treatment of the substrate W by the heat treatment sections 37a2-37a4 and 37b2-37b4 includes hydrophobization treatment, heating treatment, and cooling treatment. In this way, the heat treatment of the substrate W by the heat treatment parts 37a2-37a4 and 37b2-37b4 is the same as the heat treatment of the substrate W by the heat treatment part 37a1.

Refer to Figure 2. As described above, the heat treatment section 37a1 includes a plurality of (for example, seven) heat treatment units 38a1. Here, more than one heat treatment unit 38a1 is equivalent to the hydrophobic Chemical processing unit AHP. The other one or more heat treatment units 38a1 are equivalent to the heating unit HP for heat treatment. The remaining one or more heat treatment units 38a1 are equivalent to the cooling unit CP for cooling treatment. For example, the heat treatment unit 37a1 includes two hydrophobization treatment units AHP, four heating units HP, and one cooling unit CP.

Refer to Figures 2 and 4. Similarly, the heat treatment parts 37a2-37a4, 37b1-37b4 are provided with two hydrophobization treatment units AHP, four heating units HP, one cooling unit CP, and heat treatment unit 38, respectively.

The structure of the heat treatment unit 38 may be different among the hydrophobization treatment unit AHP, the heating unit HP, and the cooling unit CP. For example, the hydrophobization treatment unit AHP may further include a gas supply unit for supplying processing gas to the substrate W on the second flat plate 39b. For example, the cooling unit CP may not include the second flat plate 39b, the local conveying mechanism, and the second temperature control unit.

Here, the heat treatment can be classified into pre-treatment and post-treatment. The pretreatment is a heat treatment performed on the substrate W before liquid treatment. The post-treatment is a heat treatment performed on the substrate W after the liquid treatment. The liquid treatment is the treatment performed on the substrate W in the liquid treatment block 61. The heat treatment performed by the heat treatment unit 37a1 on the substrate W may include pretreatment and posttreatment. The pretreatment may include the above-mentioned hydrophobization treatment. The post-treatment may include the above-mentioned heat treatment and cooling treatment. Similarly, the heat treatment of the substrate W by the heat treatment sections 37a2-37a4 and 37b1-37b4 may include pretreatment and posttreatment, respectively.

The heat treatment part 37a1 is an example of the first heat treatment part in the present invention. The heat treatment part 37b1 is the original hair An example of the second heat treatment section in Ming Dynasty. The heat treatment part 37a2 is an example of the third heat treatment part in the present invention. The heat treatment part 37b2 is an example of the fourth heat treatment part in the present invention.

The heat treatment unit 38a1 is an example of the first heat treatment unit in the present invention. The heat treatment unit 38b1 is an example of the second heat treatment unit in the present invention. The heat treatment unit 38a2 is an example of the third heat treatment unit in the present invention. The heat treatment unit 38b2 is an example of the fourth heat treatment unit in the present invention.

<<The structure of the inspection unit 42 of the heat treatment block 31>>

The structure of the inspection unit 42 will be described with reference to FIG. 1. Furthermore, the structures of the inspection units 42a1-42a4 and 42b1-42b4 are substantially the same.

The inspection unit 42 includes a flat plate 43a. The flat plate 43a has a substantially disc shape. One substrate W is placed on the flat plate 43a. For example, the transport mechanism 34a1 can place the substrate W on the flat plate 43a of the inspection unit 42a1. The transport mechanism 34a1 can obtain the substrate W on the flat plate 43a of the inspection unit 42a1.

The inspection unit 42 includes an imaging unit 43b. The imaging unit 43b is arranged above the flat plate 43a, for example. The image capturing section 43b images the upper surface of the substrate W on the flat plate 43a.

The inspection unit 42 may also include a drive unit not shown. The driving unit moves at least one of the flat plate 43a and the imaging unit 43b, and changes the relative position of the flat plate 43a and the imaging unit 43b. By changing the relative position of the flat plate 43a and the imaging unit 43b by the driving unit, the range of the upper surface of the substrate W imaged by the imaging unit 43b can be changed.

The inspection unit 42 inspects the upper surface of the substrate W based on the image taken by the imaging unit 43b. The content of the inspection performed by the inspection unit 42 is illustrated below.

‧Measure the shape of the upper surface of the substrate W

‧Specify the state of the upper surface of the substrate W

‧Detect defects on the upper surface of substrate W

Here, the upper surface of the substrate W means at least any one of the upper surface of the substrate W itself, the coating film formed on the upper surface of the substrate W, and the pattern formed on the upper surface of the substrate W. The aforementioned "measurement of the shape of the upper surface of the substrate W" includes, for example, measuring and inspecting the film thickness of the coating film formed on the upper surface of the substrate W, or measuring and inspecting the width of the cut edge of the substrate W.

<<Support structure of each element of heat treatment block 31>>

Refer to Figures 1 and 7. Figures 1 and 7 show the heat treatment section 37 in the treatment position. The processing position is the position of the heat treatment portion 37 for heat-treating the substrate W.

The processing position of the heat treatment portion 37a1 is appropriately referred to as a processing position Pa1. Similarly, the processing positions of the heat treatment portions 37a2-37a4, 37b1-37b4 are appropriately referred to as processing positions Pa2-Pa4, Pb1-Pb4, respectively.

FIG. 9 is a plan view illustrating the maintenance position of the heat treatment unit 37. FIG. 10 is a front view illustrating the maintenance position of the heat treatment part 37. FIG. The maintenance position is the position of the heat treatment part 37 for performing maintenance of the heat treatment part 37. Maintenance means, for example, including inspection, maintenance, adjustment, repair, and repair of the heat treatment unit 37. Each heat treatment part 37 is installed so that it can move to a processing position and a maintenance position.

The maintenance position of the heat treatment portion 37a1 is appropriately referred to as a maintenance position Qa1. Similarly, the maintenance positions of the heat treatment parts 37a2-37a4, 37b1-37b4 are appropriately referred to as maintenance positions Qa2-Qa4, Qb1-Qb4, respectively.

The processing position Pa1 is an example of the first processing position in the present invention. The processing positions Pb1, Pa2, and Pb2 are respectively examples of the second, third, and fourth processing positions in the present invention. The maintenance position Qa1 is an example of the first maintenance position in the present invention. The maintenance positions Qb1, Qa2, and Qb2 are respectively examples of the second, third, and fourth maintenance positions in the present invention.

Hereinafter, the support structure of the heat treatment unit 37, the transport mechanism 34, and the inspection unit 41 will be described.

Refer to Figures 1-4, 7, and 8. The heat treatment block 31 includes a frame 45. The frame 45 is set as a skeleton of the heat treatment block 31. The frame 45 defines the shape of the heat treatment block 31. The frame 45 is made of metal, for example.

The frame 45 includes a first frame 46 and a second frame 47. The second frame 47 is arranged at approximately the same height position as the first frame 46. The first frame 46 and the second frame 47 are arranged in a horizontal direction. Specifically, the first frame 46 and the second frame 47 are arranged so as to be aligned in the width direction Y. The second frame 47 is arranged on the left of the first frame 46. The first frame 46 defines the shape of the right part of the heat treatment block 31. The second frame 47 defines the shape of the left part of the heat treatment block 31.

The first frame 46 supports the transport mechanism 34a1-34a4, the heat treatment section 37a1-37a4, and the inspection section 41a1-41a4. The second frame 47 supports the conveying mechanism 34b1-34b4, the heat treatment part 37b1-37b4, and Inspection part 41b1-41b4.

Fig. 11A is a top view of the first frame and the second frame. Fig. 11B is a front view of the first frame and the second frame. Figure 11C is a right side view of the first frame. The first frame 46 and the second frame 47 have a symmetrical shape in front view. The first frame 46 and the second frame 47 each have a substantially rectangular shape in a plan view.

The first frame 46 includes a base portion 48a. The base portion 48a has a substantially horizontal plate shape or a box shape. The base portion 48a has a substantially rectangular shape in a plan view.

The first frame 46 has a plurality of (for example, four) pillars 48b. The pillars 48b are connected to the base portion 48a, respectively. The pillars 48b respectively extend upward from the base portion 48a.

The first frame 46 includes a rod 48c. The rod 48c is arranged at a position higher than the base portion 48a. The rod 48c connects the pillars 48b to each other. The rod 48c extends in a substantially horizontal direction.

The first frame 46 has a space 48d. The space 48d is divided by the base part 48a, the support|pillar 48b, and the rod 48c. The space 48d has a substantially rectangular parallelepiped shape.

The second frame 47 has the same structure as the first frame 46. The second frame 47 has the same shape as the first frame 46. The second frame 47 corresponds to a structure obtained by rotating the first frame 46 about an axis parallel to the vertical direction Z by 180 degrees. The second frame 47 includes a base portion 48a, a pillar 48b, a rod 48c, and a space 48d.

The space 48d of the first frame 46 is an example of the "inside of the first frame 46" in the present invention. The exterior of the space 48d of the first frame 46 is an example of "the exterior of the first frame 46" in the present invention. The space 48d of the second frame 47 is an example of the "inside of the second frame 47" in the present invention. The exterior of the space 48d of the second frame 47 is an example of "the exterior of the second frame 47" in the present invention.

The second frame 47 is connected to the first frame 46. Specifically, the base portion 48a of the second frame 47 and the base portion 48a of the first frame 46 are connected.

More specifically, the base portion 48a of the first frame 46 has a left portion located on the left side of the pillar 48b of the first frame 46. The base portion 48a of the second frame 47 has a right portion located more to the right than the pillar 48b of the second frame 47. The right part of the base part 48a of the second frame 47 is connected to the left part of the base part 48a of the first frame 46. The pillar 48b of the second frame 47 is not in contact with the pillar 48b of the first frame 46. The pillar 48b of the second frame 47 is arranged to the left of the pillar 48b of the first frame 46.

The second frame 47 can be separated from the first frame 46.

The transport space 32 is formed between the first frame 46 and the second frame 47. Specifically, the conveyance space 32 is formed on the left of the first frame 46 and on the right of the second frame 47. In more detail, the conveyance space 32 is formed on the left side of the pillar 48b of the first frame 46 and on the right side of the pillar 48b of the second frame 47.

Refer to Figures 2-4, 7, 9, and 10. The heat treatment block 31 has a plurality of (e.g. 8) movable structures Pieces 51a1, 51a2, 51a3, 51a4, 51b1, 51b2, 51b3, 51b4. When the movable members 51a1-51a4 and 51b1-51b4 are not distinguished, the movable members 51a1-51a4 and 51b1-51b4 are collectively referred to as the movable member 51.

The movable members 51a1-51a4 are supported by the first frame 46. The movable members 51a1-51a4 are movable relative to the first frame 46. The movable members 51b1-51b4 are supported by the second frame 47. The movable members 51b1-51b4 are movable relative to the second frame 47.

The heat treatment block 31 includes a plurality of guide parts 55 and a plurality of sliding parts 56. The guide 55 is fixed to the first frame 46 and the second frame 47. The guide part 55 is fixed to the rod 48c of the 1st frame 46 and the 2nd frame 47, for example. The sliding parts 56 are individually fixed to the movable members 51a1-51a4 and 51b1-51b4. Each sliding portion 56 is fixed to only any one of the movable members 51a1-51a4 and 51b1-51b4. Each sliding part 56 is supported by the guide part 55. The sliding part 56 fixed to the movable member 51a1-51a4 is supported by the guide part 55 fixed to the first frame 46. The movable member 51a1-51a4 is supported by the first frame 46 via the guide portion 55 and the sliding portion 56. The sliding part 56 fixed to the movable member 51b1-51b4 is supported by the guide part 55 fixed to the second frame 47. The movable members 51b1-51b4 are supported by the second frame 47 via the guide portion 55 and the sliding portion 56.

Each sliding part 56 is movable relative to the guide part 55. Specifically, the sliding portion 56 can slide with respect to the guide portion 55. The sliding part 56 can move in the substantially width direction Y with respect to the guide part 55, for example. As the sliding part 56 moves relative to the guide part 55, each movable member 51 moves relative to the frame 45. For example, when the sliding portion 56 fixed to the movable member 51a1 moves relative to the guide portion 55, the movable member 51a1 moves relative to the first frame 46. For example, by fixing to the movable member 51b1 The sliding portion 56 moves with respect to the guide portion 55, and the movable member 51b1 moves with respect to the second frame 47.

The sliding parts 56 can move independently of each other with respect to the guide part 55. Therefore, each movable member 51 can move independently of at least one of the first frame 46 and the second frame 47.

Fig. 12A is a plan view of the movable member 51a1. Fig. 12B is a front view of the movable member 51a1. Fig. 12C is a right side view of the movable member 51a1. Hereinafter, the structure of the movable member 51a1 is demonstrated.

The movable member 51a1 includes a bottom plate 52a. The bottom plate 52a has a substantially horizontal plate shape. The bottom plate 52a has a substantially rectangular shape in a plan view. The sliding portion 56 is fixed to the bottom plate 52a, for example.

The movable member 51 includes a plurality of (for example, four) pillars 52b. The pillars 52b are connected to the bottom plate 52a, respectively. The pillars 52b respectively extend upward from the bottom plate 52a.

The movable member 51 includes a plurality of (for example, two) shelves 52c. Each shelf 52c is arranged above the bottom plate 52a. Each shelf 52c is supported by the pillar 52b. Each shelf 52c has a substantially horizontal plate shape. Each shelf 52c is smaller than the bottom plate 52a in a plan view.

The movable member 51 includes a plurality of wall portions 52d. The wall 52d is connected to the shelf 52c. The wall 52d has a substantially vertical plate shape. Specifically, the wall portion 52d has a plate shape substantially perpendicular to the front-rear direction X. The shelf 52c and the wall 52d divide the space above the bottom plate 52a into a plurality of (for example, 9) small spaces (slots) 52e. The plurality of grooves 52e are arranged in a matrix in a side view.

The movable member 51 includes one top plate 52f. The top plate 52f is arranged above the shelf 52c. The top plate 52f is arranged above the groove 52e. The top plate 52f is supported by the pillar 52b. The top plate 52f has a substantially horizontal plate shape. The top plate 52f is smaller than the bottom plate 52a in a plan view. The top plate 52f has substantially the same width as the shelf 52c in a plan view.

The movable members 51a2-51a4 and 51b1-51b4 have substantially the same structure as the movable member 51a1.

Refer to Figures 2, 7, 9, 10. The movable member 51a1 supports the heat treatment portion 37a1. Specifically, the heat treatment unit 38a1 is provided on the bottom plate 52a of the movable member 51a1 and the shelf 52c. Each heat treatment unit 38a1 is arranged in one tank 52e. Each heat treatment unit 38a1 overlaps the shelf 52c and the top plate 52f in a plan view.

Refer to Figures 3, 7, 9, and 10. The movable member 51a1 supports the conveying mechanism 34a1. Specifically, the conveyance mechanism 34a1 is provided on the bottom plate 52a of the movable member 51a1. The conveyance mechanism 34a1 does not overlap the shelf 52c and the top plate 52f in a plan view. In more detail, the guide rail 35a of the transport mechanism 34a1 is provided on the bottom plate 52a of the movable member 51a1. The rail part 35a of the conveyance mechanism 34a1 does not overlap with the shelf 52c and the top plate 52f in a plan view. The rail portion 35a of the transport mechanism 34a1 is fixed to the first movable member 51a1 (specifically, the bottom plate 52a).

Refer to Figure 2. The movable member 51a1 supports the inspection part 41a1. For example, one inspection unit 42a1 is placed on the shelf 52c of the movable member 51a1. The inspection unit 42a1 is arranged in one groove 52e. The inspection unit 42a1 overlaps the shelf 52c and the top plate 52f in a plan view.

The heat treatment block 31 includes an electric device part 57a1. The movable member 51a1 supports the electric device part 57a1. For example, the electric device part 57a1 is placed on the shelf 52c of the movable member 51a1. The electric device portion 57a1 is arranged in one groove 52e of the movable member 51a1. The electric device portion 57a1 overlaps the shelf 52c and the top plate 52f in a plan view.

Here, the electric device part 57a1 is an electric component associated with at least any one of the conveyance mechanism 34a1, the heat treatment part 37a1, and the inspection part 41a1. The electric device part 57a1 electrically controls at least any one of the conveyance mechanism 34a1, the heat treatment part 37a1, and the inspection part 41a1, for example. The electric device part 57a1 supplies electric power to at least any one of the conveyance mechanism 34a1, the heat processing part 37a1, and the inspection part 41a1, for example.

Refer to Figures 2, 4, 7, 9, 10. Similarly, the movable members 51a2-51a4, 51b1-51b4 respectively support the heat treatment parts 37a2-37a4, 37b1-37b4, the conveying mechanisms 34a2-34a4, 34b1-34b4, and the inspection parts 41a2-41a4, 41b1-41b4.

The heat treatment block 31 includes electric device parts 57a2-57a4 and 57b1-57b4. The movable members 51a2-51a4, 51b1-51b4 support the electric device parts 57a2-57a4, 57b1-57b4, respectively. When the electrical device portions 57a1-57a4 and 57b1-57b4 are not distinguished, the electrical device portions 57a1-57a4, 57b1-57b4 are collectively referred to as the electrical device portion 57.

As described above, the first frame 46 supports the transport mechanism 34a1, the heat treatment section 37a1, the inspection section 41a1, and the electric device section 57a1 via the movable member 51a1. Similarly, the first frame 46 passes through the movable structure The parts 51a2-51a4 support the transport mechanism 34a2-34a4, the heat treatment section 37a2-37a4, the inspection section 41a2-41a4, and the electrical device section 57a2-57a4. The second frame 47 supports the transport mechanism 34b1-34b4, the heat treatment section 37b1-37b4, the inspection section 41b1-41b4, and the electric device section 57b1-57b4 via the movable member 51b1-51b4.

The heat treatment part 37a1 is arranged at a position farther from the second frame 47 than the conveying mechanism 34a1. The transport mechanism 34a1 is arranged between the heat treatment portion 37a1 and the second frame 47. Specifically, the conveyance mechanism 34a1 is arranged between the heat treatment portion 37a1 and the second frame 47 in the width direction Y. Similarly, the heat treatment portion 37a2-37a4 is arranged at a position farther from the second frame 47 than the conveying mechanism 34a2-34a4. The transport mechanism 34a2-34a4 is arranged between the heat treatment portion 37a2-37a4 and the second frame 47.

The heat treatment portion 37b1 is arranged at a position farther from the first frame 46 than the conveying mechanism 34b1. The transport mechanism 34b1 is arranged between the heat treatment portion 37b1 and the first frame 46. Specifically, the conveyance mechanism 34b1 is arranged between the heat treatment portion 37b1 and the first frame 46 in the width direction Y. Similarly, the heat treatment portion 37b2-37b4 is arranged at a position farther from the first frame 46 than the conveying mechanism 34b2-34b4. The transport mechanism 34b2-34b4 is arranged between the heat treatment portion 37b2-37b4 and the first frame 46.

Refer to Figures 1, 7, 9, 10. As the movable member 51a1 moves relative to the first frame 46, the heat treatment portion 37a1 moves relative to the first frame 46. Specifically, as the movable member 51a1 moves with respect to the first frame 46, the heat treatment portion 37a1 moves with respect to the first frame 46 in a substantially horizontal direction. More specifically, as the movable member 51a1 moves relative to the first frame 46, the heat treatment portion 37a1 moves relative to the first frame 46 in the substantially width direction Y.

As the movable member 51a1 moves with respect to the first frame 46, the heat treatment part 37a1 moves integrally with the conveying mechanism 34a1, the inspection part 41a1, and the electric device part 57a1.

By moving the movable member 51a1 with respect to the first frame 46, the heat treatment portion 37a1 can be moved to the processing position Pa1 and the maintenance position Qa1. Furthermore, when the heat treatment portion 37a1 moves to the treatment position Pa1 and the maintenance position Qa1, the movable member 51a1 is not separated from the first frame 46, but is maintained in a state of being supported by the first frame 46. Therefore, the first frame 46 can support the heat treatment portion 37a1 at the treatment position Pa1 via the movable member 51a1. Furthermore, the first frame 46 can support the heat treatment portion 37a1 at the maintenance position Qa1 via the movable member 51a1.

The maintenance position Qa1 is substantially the same height position as the processing position Pa1. The maintenance position Qa1 is to the right of the processing position Pa1. By moving the heat treatment part 37a1 to the right, the heat treatment part 37a1 can move from the treatment position Pa1 to the maintenance position Qa1. By moving the heat treatment part 37a1 to the left, the heat treatment part 37a1 can be moved from the maintenance position Qa1 to the treatment position Pa1.

When the heat treatment part 37a1 is at the treatment position Pa1, all the heat treatment parts 37a1 are located in the space 48d of the first frame 46. That is, when the heat treatment part 37a1 is at the treatment position Pa1, all the heat treatment parts 37a1 are located inside the first frame 46.

When the heat treatment part 37a1 is in the maintenance position Qa1, at least a part of the heat treatment part 37a1 is located outside the space 48d of the first frame 46. That is, when the heat treatment part 37a1 is at the maintenance position Qa1, at least a part of the heat treatment part 37a1 is located outside the first frame 46. When the heat treatment part 37a1 is in the maintenance position Qa1, the part of the heat treatment part 37a1 located outside the first frame 46 is hotter than the heat treatment part 37a1. The part of the heat treatment part 37a1 located outside the first frame 46 when the treatment part 37a1 is at the treatment position Pa1 is large. When the heat treatment part 37a1 is in the maintenance position Qa1, at least a part of the heat treatment part 37a1 is located to the right of the first frame 46. Preferably, when the heat treatment part 37a1 is at the maintenance position Qa1, more than half of the heat treatment part 37a1 is located outside the first frame 46.

Furthermore, when the heat treatment part 37a1 is at the maintenance position Qa1, all the heat treatment parts 37a1 are located outside the second frame 47. Even when the heat treatment part 37a1 is at the treatment position Pa1, all the heat treatment parts 37a1 are located outside the second frame 47.

The movable member 51a1 and the heat treatment portion 37a1 will be described again. The direction from the second frame 47 to the first frame 46 is referred to as the first direction. In this embodiment, the first direction is the right. As the movable member 51a1 moves relative to the first frame 46, the heat treatment portion 37a1 can move relative to the first frame 46 in the first direction. By moving the movable member 51a1 with respect to the first frame 46, the movable member 51a1 can pull at least a part of the heat treatment portion 37a1 from the first frame 46 in the first direction.

When the heat treatment part 37a1 is at the treatment position Pa1, all the inspection parts 41a1 are located inside the first frame 46. When the heat treatment part 37a1 is at the treatment position Pa1, all the electric device parts 57a1 are located inside the first frame 46. When the heat treatment portion 37a1 is at the maintenance position Qa1, at least a part of the inspection portion 41a1 is located outside the first frame 46. When the heat treatment portion 37a1 is at the maintenance position Qa1, at least a part of the electric device portion 57a1 is located outside the first frame 46.

As the movable member 51b1 moves relative to the second frame 47, the heat treatment portion 37b1 moves relative to the second frame 47. Specifically, as the movable member 51b1 moves relative to the second frame 47, the heat is The management portion 37b1 moves in a substantially horizontal direction with respect to the second frame 47. More specifically, as the movable member 51b1 moves relative to the second frame 47, the heat treatment portion 37b1 moves relative to the second frame 47 in the substantially width direction Y.

As the movable member 51b1 moves with respect to the second frame 47, the heat treatment part 37b1 moves integrally with the conveying mechanism 34b1, the inspection part 41b1, and the electric device part 57b1.

By moving the movable member 51b1 with respect to the second frame 47, the heat treatment portion 37b1 can be moved to the processing position Pb1 and the maintenance position Qb1. In addition, when the heat treatment portion 37b1 moves to the treatment position Pb1 and the maintenance position Qb1, the movable member 51b1 is not separated from the second frame 47, but is maintained in a state of being supported by the second frame 47. Therefore, the second frame 47 can support the heat treatment portion 37b1 at the treatment position Pb1 via the movable member 51b1. Furthermore, the second frame 47 can support the heat treatment portion 37b1 at the maintenance position Qb1 via the movable member 51b1.

The maintenance position Qb1 is substantially the same height position as the processing position Pb1. The maintenance position Qb1 is to the left of the processing position Pb1. By moving the heat treatment part 37b1 to the left, the heat treatment part 37b1 can be moved from the treatment position Pb1 to the maintenance position Qb1. By moving the heat treatment part 37b1 to the right, the heat treatment part 37b1 can be moved from the maintenance position Qb1 to the treatment position Pb1.

When the heat treatment part 37b1 is at the treatment position Pb1, all the heat treatment parts 37b1 are located inside the second frame 47.

When the heat treatment part 37b1 is at the maintenance position Qb1, at least a part of the heat treatment part 37b1 Located outside the second frame 47. Thus, the part of the heat treatment part 37b1 located outside the second frame 47 when the heat treatment part 37b1 is at the maintenance position Qa1 is larger than the part of the heat treatment part 37b1 outside the second frame 47 when the heat treatment part 37b1 is at the treatment position Pb1. When the heat treatment part 37b1 is at the maintenance position Qb1, at least a part of the heat treatment part 37b1 is located to the left of the second frame 47. Preferably, when the heat treatment part 37b1 is at the maintenance position Qb1, more than half of the heat treatment part 37b1 is located outside the second frame 47.

Furthermore, when the heat treatment part 37b1 is at the maintenance position Qb1, all the heat treatment parts 37b1 are located outside the first frame 46. When the heat treatment part 37b1 is at the treatment position Pb1, all the heat treatment parts 37b1 are also located outside the first frame 46.

The movable member 51b1 and the heat treatment portion 37b1 will be described again. The direction opposite to the first direction is referred to as the second direction. In this embodiment, the second direction is the left. As the movable member 51b1 moves relative to the second frame 47, the heat treatment portion 37b1 can move relative to the second frame 47 in the second direction. By moving the movable member 51b1 with respect to the second frame 47, the movable member 51b1 can pull at least a part of the heat treatment portion 37b1 from the second frame 47 in the second direction.

When the heat treatment part 37b1 is at the treatment position Pb1, all the inspection parts 41b1 are located inside the second frame 47. When the heat treatment part 37b1 is at the treatment position Pb1, all the electric device parts 57b1 are located inside the second frame 47. When the heat treatment portion 37b1 is at the maintenance position Qb1, at least a part of the inspection portion 41b1 is located outside the second frame 47. When the heat treatment portion 37b1 is at the maintenance position Qb1, at least a part of the electric device portion 57b1 is located outside the second frame 47.

The movable members 51a2-51a4 move in the same manner as the movable member 51a1. The movable members 51b2-51b4 move in the same manner as the movable member 51b1.

The heat treatment part 37a2-37a4 moves in the same manner as the heat treatment part 37a1. The maintenance position Qa2 is located above the maintenance position Qa1. The maintenance position Qa3 is located above the maintenance position Qa2. The maintenance position Qa4 is located above the maintenance position Qa3.

The heat treatment part 37b2-37b4 moves in the same manner as the heat treatment part 37b1. The maintenance position Qb2 is located above the maintenance position Qb1. The maintenance position Qb3 is located above the maintenance position Qb2. The maintenance position Qb4 is located above the maintenance position Qb3.

The heat treatment parts 37a1-37a4, 37b1-37b4 can move independently of each other. The heat treatment parts 37a1-37a4, 37b1-37b4 can move to the maintenance positions Qa1-Qa4, Qb1-Qb4 without interfering with each other.

The movable member 51a1 is an example of the first movable member in the present invention. The movable member 51b1 is an example of the second movable member in the present invention. The movable member 51a2 is an example of the third movable member in the present invention. The movable member 51b2 is an example of the fourth movable member in the present invention.

<Liquid processing block 61>

Refer to Figure 1-4. The liquid treatment block 61 has a substantially box shape. The liquid treatment block 61 has a substantially rectangular shape in a top view and a side view. Although the illustration is omitted, the liquid treatment block 61 is also substantially rectangular in front view.

The liquid treatment block 61 has a frame 62. The frame 62 is set as a skeleton of the liquid treatment block 61. The frame 62 defines the shape of the liquid treatment block 61. The frame 62 is made of metal, for example.

The liquid processing block 61 includes a conveyance space 63. The conveying space 63 is arranged at the center of the liquid processing block 61 in the width direction Y in a plan view. The conveyance space 63 extends substantially in the front-rear direction X. The conveying space 63 is connected to the conveying space 32 of the heat treatment block 31.

The liquid processing block 61 includes a liquid processing transport mechanism 67. The liquid processing transport mechanism 67 is installed in the transport space 63. That is, the transport mechanism 67 for liquid treatment is arranged behind the transport mechanism 33 for heat treatment. The liquid processing transport mechanism 67 transports the substrate W.

Refer to Figure 3. The transport space 63 includes two transport spaces 64a and 64b. The transport space 64b is arranged above the transport space 64a.

The liquid treatment block 61 includes a partition wall 65. The partition wall 65 has a horizontal plate shape. The partition wall 65 is arranged at the boundary between the transport space 64a and the transport space 64b. The partition wall 65 partitions the conveyance space 64a from the conveyance space 64b.

The liquid processing conveyance mechanism 67 includes two conveyance mechanisms 68a and 68b. The conveyance mechanisms 68a and 68b are arranged so as to be arranged in the vertical direction Z. The conveying mechanism 68b is arranged above the conveying mechanism 68a. The conveyance mechanism 68a is installed in the conveyance space 64a. The conveyance mechanism 68a is arranged below the partition wall 65. The conveyance mechanism 68b is installed in the conveyance space 64b. The conveying mechanism 68b is arranged on the partition wall 65 above. The transport mechanisms 68a and 68b transport the substrate W, respectively. The transport mechanism 68a can transport the substrate W independently of the transport mechanism 68b.

Refer to Figures 1 and 3. The conveyance mechanism 68a is equipped with support|pillars 69a, 69b, the vertical movement part 69c, the horizontal movement part 69d, the rotating part 69e, and the holding|maintenance part 69f, 69g. The pillars 69a and 69b are supported by the frame 62. The pillars 69a and 69b are fixed to the frame 62. The pillars 69a and 69b cannot move relative to the frame 62. The pillar 69b is arranged at a height position substantially the same as that of the pillar 69a. The pillars 69a and 69b are arranged so as to be aligned in the substantially front-rear direction X. The pillar 69a is arranged at the left front part of the conveyance space 64a. The pillar 69b is arranged at the left rear part of the conveying space 64a. The pillars 69a and 69b extend in the vertical direction Z. The vertical moving part 69c is supported by the pillars 69a and 69b. The vertical moving part 69c can move in the substantially up-down direction Z with respect to the support|pillar 69a, 69b. The vertical moving portion 69c extends in the substantially front-rear direction X. The horizontal moving part 69d is supported by the vertical moving part 69c. The horizontal moving part 69d can move in substantially the front-rear direction X with respect to the vertical moving part 69c. The rotating part 69e is supported by the horizontal moving part 69d. The rotating part 69e is rotatable about the rotation axis A69e with respect to the horizontal moving part 69d. The rotation axis A69e is an imaginary line parallel to the substantially vertical direction Z. The rotation axis A69e is located to the right of the horizontal moving part 69d, for example. The holding parts 69f and 69g are supported by the rotating part 69e. The holding parts 69f and 69g can move forward and backward with respect to the rotating part 69e. More specifically, the holding parts 69f and 69g can reciprocate in one of the horizontal directions determined by the direction of the rotating part 69e. One of the horizontal directions is, for example, the radial direction of the rotation axis A69e. The holding parts 69f and 69g can move forward and backward independently of each other. The holding portions 69f and 69g each hold one substrate W in a horizontal posture.

In this way, the holding parts 69f and 69g can move in parallel in the front-rear direction X and the up-down direction Z. The holding parts 69f and 69g are rotatable about the rotation axis A69e. The holding part 69f, 69g can be relative to the rotating part 69e moves forward and backward.

The conveying mechanism 68b has substantially the same structure as the conveying mechanism 68a. That is, the conveyance mechanism 68b is equipped with support|pillars 69a, 69b, the vertical movement part 69c, the horizontal movement part 69d, the rotating part 69e, and the holding|maintenance part 69f, 69g.

Refer to Figure 1. The liquid processing block 61 includes a liquid processing unit 71. The liquid processing unit 71 is arranged on the side of the conveying space 63. The liquid processing unit 71 is arranged at a position adjacent to the liquid processing transport mechanism 67. The liquid processing unit 71 is arranged at a height position that is substantially the same as that of the liquid processing transport mechanism 67. The liquid processing part 71 is arrange|positioned at the position side-by-side in the substantially width direction Y with the conveying mechanism 67 for liquid processing. Specifically, the liquid processing unit 71 is arranged at a position on the right of the liquid processing conveying mechanism 67 and a position on the left of the liquid processing conveying mechanism 67.

Refer to Figure 8. The liquid processing unit 71 is arranged outside the area where the heat treatment transport mechanism 33 can transport the substrate W. The liquid treatment part 71 is arranged outside the area Ba. Specifically, the following rotation holding portion 75a is arranged outside the area Ba. The liquid treatment part 71 is arranged outside the area Bb. Specifically, the following rotation holding portion 75a is arranged outside the area Bb. Similarly, the liquid processing unit 71 is arranged outside the area where the substrate W can be transported by the transport mechanisms 34a2-34a4, 34b2-34b4.

The liquid processing unit 71 performs liquid processing on the substrate W. The liquid treatment is a treatment of supplying a treatment liquid to the substrate W. The liquid treatment is, for example, coating treatment. The treatment liquid is, for example, a coating material. The coating process is a process of applying a coating film material to the substrate W and forming a coating film on the substrate W. The coating film material is, for example, a resist film material. The coating film is, for example, a resist film.

Refer to Figure 1-4. The liquid processing unit 71 includes a plurality of (for example, two) liquid processing units 72 and 73. The liquid processing part 72 is arrange|positioned at substantially the same height position as the conveyance mechanism 68a. The liquid treatment part 72 is arranged below the partition wall 65. The liquid processing part 73 is arrange|positioned at substantially the same height position as the conveyance mechanism 68b. The liquid treatment part 73 is arranged above the partition wall 65. The transport mechanism 68 a transports the substrate W to the liquid processing unit 72. The transport mechanism 68b transports the substrate W to the liquid processing unit 73.

The liquid processing part 72 is arrange|positioned at the position adjacent to the conveyance mechanism 68a. The liquid processing section 72 includes a liquid processing section 72R arranged on the right side of the conveying mechanism 68a, and a liquid processing section 72L arranged on the left side of the conveying mechanism 68a. The liquid processing part 73 is arrange|positioned at the position adjacent to the conveyance mechanism 68b. The liquid processing section 73 includes a liquid processing section 73R arranged on the right side of the conveying mechanism 68b, and a liquid processing section 73L arranged on the left side of the conveying mechanism 68b.

The liquid processing parts 72R and 73R are arranged so as to be aligned in the vertical direction Z. The liquid processing part 73R is arranged above the liquid processing part 72R. The liquid treatment parts 72L and 73L are arranged so as to be aligned in the vertical direction Z. The liquid treatment part 73L is arranged above the liquid treatment part 72L.

The liquid processing unit 72R includes a plurality of (for example, four) liquid processing units 74. The liquid processing units 74 of the liquid processing section 72R are arranged in a matrix in the front-rear direction X and the up-down direction Z. For example, two liquid processing units 74 are arranged in the lower stage of the liquid processing part 72R. The remaining two liquid processing units 74 are arranged on the upper stage of the liquid processing part 72R. The two liquid processing units 74 arranged in the lower stage of the liquid processing portion 72R are arranged in a manner to be aligned in the front-rear direction X. The two liquid processing units 74 arranged on the upper stage of the liquid processing portion 72R are arranged so as to be aligned in the front-rear direction X. Configured on The two liquid processing units 74 on the upper stage of the liquid processing portion 72R overlap with the two liquid processing units 74 arranged on the lower stage of the liquid processing portion 72R in a plan view. The two liquid processing units 74 arranged in the lower section of the liquid processing part 72R are housed in one chamber 76. The two liquid processing units 74 arranged on the upper stage of the liquid processing portion 72R are housed in the other chamber 76.

The liquid processing unit 72L includes a plurality of (for example, four) liquid processing units 74. The liquid processing unit 74 of the liquid processing unit 72L is configured to be the same as the liquid processing unit 74 of the liquid processing unit 72R except that it is bilaterally symmetrical.

The liquid processing unit 73R includes a plurality of (for example, four) liquid processing units 74. The liquid processing unit 74 of the liquid processing unit 73R is configured to be the same as the liquid processing unit 74 of the liquid processing unit 72R.

The liquid processing unit 73L includes a plurality of (for example, four) liquid processing units 74. The liquid processing unit 74 of the liquid processing unit 73L is arranged in the same manner as the liquid processing unit 74 of the liquid processing unit 72R, except that it is bilaterally symmetrical.

The liquid processing unit 74 includes a rotation holding portion 75a, a nozzle 75b, and a cup 75c. The rotation holding portion 75a holds one substrate W in a horizontal posture. For example, the transport mechanism 68a may place the substrate W on the rotation holding portion 75a of the liquid processing unit 74 of the liquid processing portion 72. For example, the transport mechanism 68a can obtain the substrate W on the rotation holding portion 75a of the liquid processing unit 74 of the liquid processing portion 72. The rotation holding portion 75a can rotate the held substrate W around an axis parallel to the vertical direction Z. The nozzle 75b ejects the processing liquid to the substrate W. The treatment liquid is, for example, a coating liquid. The nozzle 75b is provided so as to be movable to the processing position and the retracted position. The processing position is the substrate W held in the rotation holding portion 75a The position above. When the nozzle 75b is at the processing position, the nozzle 75b overlaps the substrate W held by the rotation holding portion 75a in a plan view. When the nozzle 75b is in the retracted position, the nozzle 75b does not overlap the substrate W held by the rotation holding portion 75a in a plan view. The cup 75c is arranged around the rotation holding portion 75a. The receiving cup 75c recovers the treatment liquid.

<Front Mount 81>

Refer to Figures 1, 3, 6, and 8. The front placement part 81 is arranged across the transfer and transfer part 21 and the heat treatment block 31. The front mounting portion 81 is arranged to straddle the transfer space 23 of the transfer conveying portion 21 and the transfer space 32 of the heat treatment block 31.

The front mounting portion 81 is arranged behind the transfer mechanism 25 for transfer and transfer. The front mounting part 81 is arrange|positioned at the left and rear of the conveyance mechanism 26a. The front mounting part 81 is arrange|positioned at the right and rear of the conveyance mechanism 26b. The transfer mechanism 25 for transfer transfer transfers the substrate W between the carrier C and the front mounting portion 81.

The front mounting portion 81 is arranged in front of the conveying mechanism 33 for heat treatment.

The front mounting portion 81 includes a plurality of (for example, 8) mounting portions 82a1, 82a2, 82a3, 82a4, 82b1, 82b2, 82b3, and 82b4. When the placement portions 82a1-82a4 and 82b1-82b4 are not distinguished, the placement portions 82a1-82a4, 82b1-82b4 are collectively referred to as the placement portion 82. Each mounting portion 82 is for mounting a substrate W. The transfer mechanism 25 for transfer and transfer can mount the substrate W on each mounting portion 82. Specifically, the conveyance mechanisms 26a and 26b can respectively place the substrate W on the respective mounting portions 82. The transfer mechanism 25 for transfer and transfer can take in the substrate W on each mounting portion 82. Specifically, the conveyance mechanisms 26a and 26b can respectively obtain the substrate W on each mounting portion 82.

The plurality of placing parts 82 are arranged so as to be arranged in a substantially vertical direction Z. The placement portion 82b1 overlaps the placement portion 82a1 in a plan view. Similarly, the placement portions 82a2-82a4 and 82b2-82b4 overlap the placement portion 82a1 in a plan view. Each placement part 82 is arrange|positioned at the position which cross|intersects the virtual plane K (refer FIG. 8).

The placement portions 82a2 and 82b2 are arranged above the placement portions 82a1 and 82b1. The placement portions 82a3 and 82b3 are arranged above the placement portions 82a2 and 82b2. The placement portions 82a4 and 82b4 are arranged above the placement portions 82a3 and 82b3.

The mounting portions 82a1, 82b1 are arranged at substantially the same height positions as the conveying mechanisms 34a1, 34b1. The mounting portions 82a1 and 82b1 are arranged in front of and on the left of the conveying mechanism 34a1. The placing portions 82a1 and 82b1 are arranged in front of and on the right of the conveying mechanism 34b1. The conveyance mechanisms 34a1 and 34b1 can place the substrate W on the mounting portions 82a1 and 82b1, respectively. The conveying mechanisms 34a1 and 34b1 can respectively obtain the substrate W on the placing portions 82a1 and 82b1.

The relative positional relationship between the placing portions 82a2, 82b2 and the conveying mechanisms 34a2, 34b2 is the same as the relative positional relationship between the placing portions 82a1, 82b1 and the conveying mechanisms 34a1, 34b1. The relative positional relationship between the placing portions 82a3 and 82b3 and the conveying mechanisms 34a3 and 34b3 is the same as the relative positional relationship between the placing portions 82a1 and 82b1 and the conveying mechanisms 34a1 and 34b1. The relative positional relationship between the placing portions 82a4 and 82b4 and the conveying mechanisms 34a4 and 34b4 is the same as the relative positional relationship between the placing portions 82a1 and 82b1 and the conveying mechanisms 34a1 and 34b1.

Each mounting portion 82 includes a plurality of (for example, two) flat plates 85. The plurality of flat plates 85 are arranged so as to be arranged in a substantially vertical direction Z. One substrate W is placed on one flat plate 85. Therefore, each mounting portion 82 can mount a plurality of substrates W.

The placement portion 82a1 is an example of the first front placement portion in the present invention. The placement portion 82b1 is an example of the second front placement portion in the present invention. The placement portion 82a2 is an example of the third front placement portion in the present invention. The placement portion 82b2 is an example of the fourth front placement portion in the present invention.

<Back Mount 83>

Refer to Figures 1, 3 and 8. The rear mounting portion 83 is arranged so as to span the heat treatment block 31 and the liquid treatment block 61. The rear mounting portion 83 is arranged across the transfer space 32 of the heat treatment block 31 and the transfer space 63 of the liquid treatment block 61.

The rear mounting portion 83 is arranged behind the heat treatment transport mechanism 33. The rear mounting portion 83 is arranged in front of the liquid processing transport mechanism 67.

The rear mounting portion 83 includes a plurality of (for example, 8) mounting portions 84a1, 84a2, 84a3, 84a4, 84b1, 84b2, 84b3, and 84b4. When the placement portions 84a1-84a4 and 84b1-84b4 are not distinguished, the placement portions 84a1-84a4, 84b1-84b4 are collectively referred to as the placement portion 84. Each mounting portion 84 is for mounting a substrate W. The liquid processing transport mechanism 67 can place the substrate W on each placing portion 84. The liquid processing conveyance mechanism 67 can take in the substrate W on each mounting portion 84.

The plurality of placing parts 84 are arranged so as to be arranged in the substantially vertical direction Z. The placement part 84b1 is It overlaps with the placing part 84a1 in a plan view. Similarly, the placement portions 84a2-84a4 and 84b2-84b4 overlap the placement portion 84a1 in a plan view. Each placement part 84 is arrange|positioned at the position which cross|intersects the virtual plane K (refer FIG. 8).

The placing portions 84a2, 84b2 are arranged above the placing portions 84a1, 84b1. The placement portions 84a3 and 84b3 are arranged above the placement portions 84a2 and 84b2. The placement portions 84a4 and 84b4 are arranged above the placement portions 84a3 and 84b3.

The mounting portions 84a1, 84b1 are arranged at substantially the same height positions as the conveying mechanisms 34a1, 34b1. The mounting portions 84a1 and 84b1 are arranged behind and on the left of the conveying mechanism 34a1. The mounting portions 84a1 and 84b1 are arranged behind and on the right side of the conveying mechanism 34b1. The transport mechanisms 34a1 and 34b1 can respectively place the substrate W on the mounting portions 84a1 and 84b1. The conveying mechanisms 34a1 and 34b1 can respectively obtain the substrate W on the placing portions 84a1 and 84b1.

The relative positional relationship between the placing portions 84a2, 84b2 and the conveying mechanisms 34a2, 34b2 is the same as the relative positional relationship between the placing portions 84a1, 84b1 and the conveying mechanisms 34a1, 34b1. The relative positional relationship between the placement portions 84a3 and 84b3 and the conveying mechanisms 34a3 and 34b3 is the same as the relative positional relationship between the placement portions 84a1 and 84b1 and the conveying mechanisms 34a1 and 34b1. The relative positional relationship between the placing portions 84a4 and 84b4 and the conveying mechanisms 34a4 and 34b4 is the same as the relative positional relationship between the placing portions 84a1 and 84b1 and the conveying mechanisms 34a1 and 34b1.

The mounting portions 84a1, 84a2, 84b1, and 84b2 are arranged at substantially the same height positions as the conveying mechanism 68a. The mounting portions 84a1, 84a2, 84b1, and 84b2 are arranged in front of the conveying mechanism 68a. The transport mechanism 68a can place the substrate W on the placement portions 84a1, 84a2, 84b1, and 84b2. The conveying mechanism 68a can take in the substrate W on the placing portions 84a1, 84a2, 84b1, and 84b2.

The mounting portions 84a3, 84a4, 84b3, and 84b4 are arranged at substantially the same height positions as the conveying mechanism 68b. The mounting portions 84a3, 84a4, 84b3, and 84b4 are arranged in front of the conveying mechanism 68b. The transport mechanism 68b can place the substrate W on the placement portions 84a3, 84a4, 84b3, and 84b4. The conveying mechanism 68b can take in the substrate W on the placement portions 84a3, 84a4, 84b3, and 84b4.

Each placement portion 84 has substantially the same structure as the placement portion 82. Specifically, each mounting portion 84 includes a plurality of (for example, two) flat plates 85. Each mounting part 84 can mount a plurality of substrates W.

The placement portion 84a1 is an example of the first rear placement portion in the present invention. The placement portion 84b1 is an example of the second rear placement portion in the present invention. The placement portion 84a2 is an example of the third rear placement portion in the present invention. The placement portion 84b2 is an example of the fourth rear placement portion in the present invention.

<Control Department>

Refer to Figure 1. The substrate processing apparatus 1 includes a control unit 91. The control unit 91 is provided in the transfer and transfer unit 21, for example. The control unit 91 controls the storage unit 11, the transfer and transfer unit 21, the heat treatment block 31, and the liquid treatment block 61. More specifically, the control unit 91 controls the carrier transport mechanism 15, the transfer transport mechanism 25, the heat treatment transport mechanism 33, the heat treatment unit 37, the inspection unit 41, the electrical device unit 57, the liquid treatment transport mechanism 67, and the liquid处理部71。 Processing section 71.

The control unit 91 is a central processing unit (CPU (Central Processing Unit, central processing unit)), RAM (Random-Access Memory) that becomes the operating area of arithmetic processing, and storage media such as fixed disks. The storage medium stores various information such as a processing plan (processing program) for processing the substrate W, or information for identifying each substrate W.

<Operation example of substrate processing apparatus 1>

Hereinafter, an example of the operation of the storage unit 11 and the transfer unit 21, and an example of the operation of the transfer unit 21, the heat treatment block 31, and the liquid treatment block 61 will be described.

<<Operation example of storage unit 11 and transfer unit 21>>

An external transport mechanism (not shown) places the carrier C containing the unprocessed substrate W on the shelf 13. The carrier conveying mechanism 15 places the carrier C containing the unprocessed substrate W from the shelf 13 on the carrier placing portion 22a. The transport mechanism 26a transports the substrate W from the carrier C on the carrier placing portion 22a. After the conveying mechanism 26a unloads all the substrates W from the carrier C on the carrier placing portion 22a, the carrier conveying mechanism 15 conveys the carrier C that has not accommodated the substrate W from the carrier placing portion 22a to the carrier placing portion 22b. At this time, the carrier conveying mechanism 15 may also temporarily place the carrier C that does not contain the substrate W on the shelf 13. The transport mechanism 26b transports the processed substrate W to the carrier C on the carrier placing portion 22b. After that, the carrier conveying mechanism 15 conveys the carrier C containing the processed substrate W from the carrier placing portion 22b to the shelf 13. The external transport mechanism obtains the carrier C containing the processed substrate W from the shelf 13.

<<Operation example of transfer section 21, heat treatment block 31, and liquid treatment block 61>>

FIG. 13 is a diagram schematically showing elements (for example, a conveying mechanism or a processing section) of the substrate processing apparatus 1 through which the substrate W passes.

The transport mechanism 26a transports the substrate W from the carrier C on the carrier placing section 22a to the placing sections 82a1-82a4, 82b1-82b4. For example, the transport mechanism 26a can place the substrates W one sheet at a time on each placing portion 82. For example, the conveying mechanism 26a may place two substrates W on each mounting portion 82 at a time. For example, the conveyance mechanism 26a may place two substrates W on each mounting portion 82 at the same time.

The transport mechanism 34a1 transports the substrate W from the mounting portion 82a1 to the heat treatment unit 38a1 (specifically, the hydrophobization treatment unit AHP). The hydrophobization treatment unit AHP of the heat treatment section 37a1 performs hydrophobization treatment on the substrate W. The transport mechanism 34a1 transports the substrate W from the hydrophobization treatment unit AHP of the heat treatment section 37a1 to the placement section 84a1.

The conveyance mechanism 34b1 conveys the substrate W from the mounting portion 82b1 to the heat treatment unit 38b1 (specifically, the hydrophobization treatment unit AHP). The hydrophobization treatment unit AHP of the heat treatment section 37b1 performs hydrophobization treatment on the substrate W. The conveyance mechanism 34b1 conveys the substrate W from the hydrophobization treatment unit AHP of the heat treatment section 37b1 to the placement section 84b1.

The conveying mechanisms 34a2-34a4 and 34b2-34b4 convey the substrate W in the same manner as the conveying mechanisms 34a1 and 34b1, respectively. The conveying mechanisms 34a1-34a4 and 34b1-34b4 operate in parallel. The heat treatment parts 37a2-37a4 and 37b2-37b4 heat the substrate W in the same manner as the heat treatment parts 37a1 and 37b1, respectively. The heat treatment parts 37a1-37a4 and 37b1-37b4 operate in parallel.

The conveying mechanism 68 a conveys the substrate W from the placing sections 84 a 1, 84 a 2, 84 b 1, and 84 b 2 to the liquid processing section 72. The liquid processing unit 72 performs liquid processing on the substrate W. The transfer mechanism 68a transfers the substrate W is conveyed from the liquid processing part 72 to the placing parts 84a1, 84a2, 84b1, and 84b2.

The transport mechanism 68 b transports the substrate W from the placement sections 84 a 3, 84 a 4, 84 b 3, and 84 b 4 to the liquid processing section 73. The liquid processing unit 73 performs liquid processing on the substrate W. The transport mechanism 68b transports the substrate W from the liquid processing section 73 to the placement sections 84a3, 84a4, 84b3, and 84b4.

The conveyance mechanism 34a1 conveys the substrate W from the mounting portion 84a1 to the heat treatment unit 38a1 (specifically, the heating unit HP). The heating unit HP of the heat treatment portion 37a1 heats the substrate W. The transport mechanism 34a1 transports the substrate W from the heating unit HP of the heat treatment section 37a1 to the other heat treatment unit 38a1 (specifically, the cooling unit CP). The cooling unit CP of the heat treatment portion 37a1 performs cooling processing on the substrate W. The transport mechanism 34a1 transports the substrate W from the cooling unit CP of the heat treatment unit 37a1 to the inspection unit 41a1. The inspection unit 41a1 inspects the substrate W. The transport mechanism 34a1 transports the substrate W from the inspection section 41a1 to the placement section 82a1.

The conveying mechanism 34b1 conveys the substrate W from the mounting portion 84b1 to the heat treatment unit 38b1 (specifically, the heating unit HP). The heating unit HP of the heat treatment portion 37b1 heats the substrate W. The transport mechanism 34b1 transports the substrate W from the heating unit HP of the heat treatment part 37b1 to the other heat treatment unit 38b1 (specifically, the cooling unit CP). The cooling unit CP of the heat treatment portion 37b1 cools the substrate W. The transport mechanism 34b1 transports the substrate W from the cooling unit CP of the heat treatment section 37b1 to the inspection section 41b1. The inspection unit 41b1 inspects the substrate W. The transport mechanism 34b1 transports the substrate W from the inspection section 41b1 to the placement section 82b1.

The conveying mechanisms 34a2-34a4, 34b2-34b4 are the same as the conveying mechanisms 34a1, 34b1, respectively The substrate W is transported. The conveying mechanisms 34a1-34a4 and 34b1-34b4 operate in parallel. The heat treatment parts 37a2-37a4 and 37b2-37b4 heat the substrate W in the same manner as the heat treatment parts 37a1 and 37b1, respectively. The heat treatment parts 37a1-37a4 and 37b1-37b4 operate in parallel. The inspection parts 41a2-41a4 and 41b2-41b4 inspect the substrate W in the same manner as the inspection parts 41a1 and 41b1, respectively. The inspection units 41a1-41a4 and 41b1-41b4 operate in parallel.

The transport mechanism 26b transports the substrate W from the placement sections 82a1-82a4 and 82b1-82b4 to the carrier C on the carrier placement section 22b.

<<Detailed operation example of conveying mechanism 34>>

14A-14R are plan views showing an example of the operation of the conveying mechanism 34a1. The operation of the conveyance mechanism 34a1 in and out of the placing portion 82a1 and the heat treatment unit 38a1 is shown as an example. 14A-14R schematically illustrate the conveying mechanism 34a1.

In the following description, in order to distinguish the three heat treatment units 38a1 arranged in the substantially front-rear direction X, these heat treatment units 38a1 are described as heat treatment units U1, U2, U3. The heat treatment unit U2 is arranged behind the heat treatment unit U1. The heat treatment unit U3 is arranged behind the heat treatment unit U2.

In the following description, the rotation axes A35d and A35f are abbreviated as the rotation axis A35. The rotation axis A35 moves on the imaginary line E in a plan view. In Figures 14A-14R, the counterclockwise rotation is abbreviated as "rotation". In Figures 14A-14R, the clockwise rotation is abbreviated as "rotation" or "rotation in the opposite direction".

14A-14R show points e1, e2, e3, e4, e5, e6, and e7 on the imaginary line E. Point e1 is the most movable position of the rotation axis A35. Point e7 is the rearmost position where the rotation axis A35 can move. The point e4 is at a position facing the heat treatment unit U2 in the substantially width direction Y in a plan view. More specifically, the heat treatment unit U2 has an imaginary flat plate center point V2. The flat plate center point V2 is located at the center of the first flat plate 39a of the heat treatment unit U2 in a plan view. An imaginary line passing through the center point V2 of the flat plate and parallel to the substantially width direction Y in a plan view is referred to as an imaginary line F2. Point e4 is at the position where the imaginary line E crosses the imaginary line F2 when viewed from above.

The points e2 and e3 are located farther back than the point e1 and farther forward than the point e4. Point e3 is located further behind point e2. The points e5 and e6 are located farther back than the point e4 and farther forward than the point e7. Point e6 is located farther behind than point e5. The points e2 and e6 are determined in advance based on the positional relationship between the rotation axis A35, the holding portions 35e and 35g, and the heat treatment unit U2. The point e3 is determined in advance based on the positional relationship between the rotation axis A35, the holding portions 35e and 35g, and the placing portion 82a1. The point e5 is determined in advance based on the positional relationship between the rotation axis A35, the holding portions 35e and 35g, and the placing portion 84a1.

In the following description, the two flat plates 85 provided in the placing portion 82a1 are referred to as flat plates 85a and 85b. The substrate W is delivered to the conveying mechanism 34a1 via the conveying mechanism 25 for self-transferring and conveying via the flat plate 85a. The substrate W is delivered to the transfer mechanism 25 for transfer and transfer from the transfer mechanism 34a1 via the flat plate 85b.

Refer to Figure 14A. The rotation axis A35 is located further behind the point e3. The arm 35d faces forward. The holding portion 35e is located forward of the rotation axis A35. The arm 35f faces the opposite of the arm 35d direction. That is, the arm 35f faces backward. The holding portion 35g is located behind the rotation axis A35. The holding portion 35e holds one substrate W. The substrate W held by the holding portion 35e is, for example, a processed substrate W. The board|substrate W held by the holding part 35e is, for example, the board|substrate W carried out from the inspection part 41a1. The holding portion 35g does not hold the substrate W. On the flat plate 85b of the placing portion 82a1, the substrate W is not placed.

Refer to Figures 14A-14D. The horizontal moving part 35b moves forward with respect to the rail part 35a. The axis of rotation A35 passes through points e3 and e2 and advances to point e1. When the rotation axis A35 reaches the point e1, the horizontal moving part 35b stops moving.

When the rotation axis A35 advances to the point e3, the arm 35d does not rotate. Thereby, the relative positional relationship between the rotation axis A35 and the holding portion 35e does not change. The holding portion 35e and the substrate W held by the holding portion 35e move in parallel forward.

When the rotation axis A35 advances from the point e3 to the point e1, the arm 35d rotates. Thereby, when the rotation axis A35 advances from the point e3 to the point e1, the holding part 35e and the board|substrate W held by the holding part 35e move forward and left.

When the rotation axis A35 reaches the point e1, the arm 35d stops rotating. When the rotation axis A35 is located at the point e1, the holding portion 35e is located forward and to the left of the rotation axis A35. When the rotation axis A35 is located at the point e1, the holding portion 35e and the substrate W held by the holding portion 35e overlap with the flat plate 85b of the placing portion 82a1 in a plan view. When the rotation axis A35 is located at the point e1, the holding portion 35e places the substrate W on the flat plate 85b of the placing portion 82a1.

When the rotation axis A35 passes through the points e3 and e2 and advances to the point e1, the arm 35f does not rotate. Thereby, the relative positional relationship between the rotation axis A35 and the holding portion 35g remains unchanged. The holding portion 35g moves in parallel to the front.

Refer to Figures 14D-14E. The horizontal moving part 35b moves rearward with respect to the rail part 35a. The axis of rotation A35 retreats from the point e1.

When the rotation axis A35 retreats from the point e1, the arm 35d rotates in the opposite direction. Thereby, the holding part 35e moves back and right. When the holding portion 35e moves backward and to the right, the holding portion 35e does not hold the substrate W. The holding portion 35e moves to a position that does not overlap with the placing portion 82a1. When the rotation axis A35 retreats from the point e1, the arm 35f does not rotate. As a result, the holding portion 35g moves in parallel to the rear.

Refer to Figures 14E-14F. The vertical moving part 35c moves in the substantially vertical direction Z with respect to the horizontal moving part 35b. Thereby, the holding parts 35e, 35g move in parallel in the substantially vertical direction Z. The holding portion 35e moves to a height position approximately the same as that of the flat plate 85a. One substrate W is placed on the flat plate 85a. The substrate W on the flat plate 85a is, for example, an unprocessed substrate W.

Refer to Figures 14F-14G. The horizontal moving part 35b moves forward again. The rotation axis A35 advances again to the point e1. When the rotation axis A35 reaches the point e1, the horizontal moving part 35b stops moving.

When the rotation axis A35 advances to the point e1, the arm 35d rotates. With this, when the rotation axis A35 advances to the point e1, the holding portion 35e moves forward and leftward.

When the rotation axis A35 reaches the point e1, the arm 35d stops rotating. When the rotation axis A35 is located at the point e1, the holding portion 35e is located forward and to the left of the rotation axis A35. When the rotation axis A35 is located at the point e1, the holding portion 35e overlaps the flat plate 85a of the placing portion 82a1 in a plan view. When the rotation axis A35 is located at the point e1, the holding portion 35e acquires the substrate W on the flat plate 85a.

When the rotation axis A35 advances to the point e1, the arm 35f does not rotate. Thereby, the holding part 35g moves in parallel to the front.

Refer to Figure 14G-14K. The horizontal moving part 35b moves backward again. The axis of rotation A35 retreats from the point e1 to the point e4. When the rotation axis A35 reaches the point e4, the horizontal moving part 35b stops moving.

When the rotation axis A35 retreats from the point e1 to the point e3, the arm 35d rotates in the opposite direction. Thereby, the holding part 35e and the board|substrate W held by the holding part 35e move back and right.

When the rotation axis A35 reaches the point e3, the arm 35d stops rotating. When the rotation axis A35 is located at the point e3, the arm 35d faces forward. The holding portion 35e is located forward of the rotation axis A35.

When the rotation axis A35 retreats from the point e3 to the point e4, the arm 35d does not rotate. Thereby, the holding part 35e and the board|substrate W held by the holding part 35e move back in parallel.

When the rotation axis A35 retreats from the point e1 to the point e2, the arm 35f does not rotate. By this, keep The part 35g moves in parallel to the rear.

When the rotation axis A35 retreats from the point e2 to the point e4, the arm 35f rotates. Thereby, the holding part 35g moves to the right. In more detail, the holding portion 35g moves along the imaginary line F2. While the holding portion 35g rotates around the rotation axis A35, it moves from the point e4 to the right along the imaginary line F2. The holding portion 35g approaches the heat treatment unit U2 from the point e4 along the imaginary line F2.

In this manner, the horizontal moving portion 35b moves in the substantially front-rear direction X, and the arm portion 35f rotates about the rotation axis A35, whereby the holding portion 35g linearly moves in the substantially width direction Y toward the heat treatment unit U2.

When the rotation axis A35 reaches the point e4, the arm 35f stops rotating. When the rotation axis A35 is located at the point e4, the arm 35f faces the right. When the rotation axis A35 is located at the point e4, the holding portion 35g is located to the right of the rotation axis A35. When the rotation axis A35 is located at the point e4, the holding portion 35g overlaps the first flat plate 39a of the heat treatment unit U2 in a plan view. When the rotation axis A35 is located at the point e4, the holding portion 35g acquires the substrate W on the first flat plate 39a of the heat treatment unit U2. Here, the substrate W on the first flat plate 39a of the heat treatment unit U2 is, for example, the substrate W that has been processed by the heat treatment unit U2.

Refer to Figures 14K-14M. The horizontal moving part 35b moves forward. The axis of rotation A35 advances from point e4 to point e2. When the rotation axis A35 reaches the point e2, the horizontal moving part 35b stops moving forward.

When the rotation axis A35 advances from the point e4 to the point e2, the arm 35d does not rotate. By this, keep The portion 35e and the substrate W held by the holding portion 35e move in parallel forward.

When the rotation axis A35 advances from the point e4 to the point e2, the arm 35f rotates in the opposite direction. Thereby, the holding part 35g and the board|substrate W held by the holding part 35g move to the left. In more detail, the holding portion 35g and the substrate W held by the holding portion 35g move along the imaginary line F2. The holding portion 35g and the substrate W held by the holding portion 35g move to the left along the imaginary line F2 toward the point e4. The holding portion 35g and the substrate W held by the holding portion 35g are away from the heat treatment unit U2 along the imaginary line F2. The substrate W is not placed on the first flat plate 39a of the heat treatment unit U2.

In this way, the horizontal moving portion 35b moves in the substantially front-rear direction X, and the arm portion 35f rotates about the rotation axis A35, whereby the holding portion 35g moves linearly in the substantially width direction Y so as to be away from the heat treatment unit U2. Thereby, the substrate W held by the holding portion 35g also moves linearly in the substantially width direction Y so as to be away from the heat treatment unit U2.

When the rotation axis A35 reaches the point e2, the reverse rotation of the arm 35f ends. When the rotation axis A35 is located at the point e2, the arm 35f faces backward. When the rotation axis A35 is located at the point e2, the holding portion 35g and the substrate W held by the holding portion 35g are located behind the rotation axis A35.

Refer to Figures 14M-14N. The horizontal moving part 35b moves backward. The axis of rotation A35 retreats from the point e2 to the point e6.

When the rotation axis A35 retreats from the point e2 to the point e6, the arm 35d does not rotate. Thereby, the holding part 35e and the board|substrate W held by the holding part 35e move back in parallel. When the rotation axis A35 retreats from the point e2 to the point e6, the arm 35f does not rotate. Thereby, the holding part 35g and the board|substrate W held by the holding part 35g move back in parallel.

Refer to Figure 14N-14P. The horizontal moving part 35b moves forward. The axis of rotation A35 advances from point e6 to point e4. When the rotation axis A35 reaches the point e4, the horizontal moving part 35b stops moving.

When the rotation axis A35 advances from the point e6 to the point e4, the arm 35d rotates in the opposite direction. Thereby, the holding part 35e and the board|substrate W held by the holding part 35e move to the right. In more detail, the holding portion 35e and the substrate W held by the holding portion 35e move along the imaginary line F2. The holding portion 35e and the substrate W held by the holding portion 35e move to the right along the virtual line F2 from the point e4. The holding portion 35e and the substrate W held by the holding portion 35e approach the heat treatment unit U2 from the point e4 along the virtual line F2.

In this manner, the horizontal moving portion 35b moves in the substantially front-rear direction X, and the arm portion 35d rotates about the rotation axis A35, whereby the holding portion 35e linearly moves in the substantially width direction Y toward the heat treatment unit U2. Thereby, the substrate W held by the holding portion 35e is moved linearly in the substantially width direction Y toward the heat treatment unit U2.

When the rotation axis A35 reaches the point e4, the arm 35d stops rotating. When the rotation axis A35 is located at the point e4, the arm 35d faces the right. When the rotation axis A35 is located at the point e4, the holding portion 35e and the substrate W held by the holding portion 35e are located to the right of the rotation axis A35. When the rotation axis A35 is located at the point e4, the holding portion 35e and the substrate W held by the holding portion 35e overlap the first flat plate 39a of the heat treatment unit U2 in a plan view. The holding portion 35e places the substrate W on the first flat plate 39a of the heat treatment unit U2.

When the rotation axis A35 advances from the point e6 to the point e4, the arm 35f does not rotate. Thereby, the holding part 35g and the board|substrate W held by the holding part 35g move in parallel to the front.

Refer to Figure 14P-14R. The horizontal moving part 35b moves backward. The axis of rotation A35 retreats from the point e4 to the point e6.

When the rotation axis A35 retreats from the point e4 to the point e6, the arm 35d rotates. Thereby, the holding part 35e moves to the left. In more detail, the holding portion 35e moves along the virtual line F2. The holding portion 35e moves to the left along the imaginary line F2 toward the point e4. The holding portion 35e is away from the heat treatment unit U2 along the imaginary line F2. The holding portion 35e does not hold the substrate W.

In this way, the horizontal moving portion 35b moves in the substantially front-rear direction X, and the arm portion 35d rotates around the rotation axis A35, whereby the holding portion 35e moves linearly in the substantially width direction Y so as to be away from the heat treatment unit U2.

When the rotation axis A35 reaches the point e6, the rotation of the arm 35d ends. When the rotation axis A35 is located at the point e6, the arm 35d faces forward. When the rotation axis A35 is located at the point e6, the holding portion 35e is located in front of the rotation axis A35.

When the rotation axis A35 retreats from the point e4 to the point e5, the arm 35f does not rotate. Thereby, the holding part 35g and the board|substrate W held by the holding part 35g move back in parallel.

When the rotation axis A35 retreats from the point e5 to the point e6, the arm 35f rotates in the opposite direction. Thereby, the holding part 35g and the board|substrate W held by the holding part 35g move to the left and back.

After that, although illustration is omitted, the conveying mechanism 34a1 moves in and out of the placing portion 84a1. For example, as the horizontal moving portion 35b further moves backward, the rotation axis A35 retreats to the point e7. When the rotation axis A35 retreats from the point e5 to the point e7, the holding portion 35g rotates in the opposite direction. Then, when the rotation axis A35 is located at the point e7, the holding portion 35g places the substrate W on the placing portion 84a1.

The conveying mechanisms 34a2-34a4 and 34b1-34b4 also operate in the same manner as the conveying mechanism 34a1.

In the above-mentioned operation example, the conveyance mechanism 34a1 conveys the substrate W from the placement portion 82a1 (flat plate 85a) to the heat treatment unit 38a1 (U2) (see FIGS. 14F-14P). But it is not limited to this. For example, the conveyance mechanism 34a1 may not place the substrate W on the heat treatment unit 38a1, but may convey the substrate W between the placement portion 82a1 and the placement portion 84a1.

For the sake of convenience, referring to FIGS. 14A-14R, an operation example of the transfer mechanism 34a1 that does not mount the substrate W on the heat treatment unit 38a1 but transfers the substrate W from the mounting portion 82a1 to the mounting portion 84a1 will be described.

First, the holding portion 35e obtains the substrate W on the placing portion 82a1 (FIG. 14F-14G). After that, the holding portion 35e moves to the position shown in FIG. 14N. The holding portion 35e and the substrate W held by the holding portion 35e are located in front of the rotation axis A35.

Next, the horizontal moving part 35b moves forward, and the arm part 35d rotates. Thereby, the substrate W held by the holding portion 35e approaches the heat treatment unit U2 along the imaginary line F2 (FIG. 14N-14P). When the holding portion 35e reaches the position shown in FIG. 14P, the holding portion 35e does not place the substrate W In the heat treatment unit U2. The holding portion 35e holds the substrate W in the space above the first flat plate 39a. The holding portion 35e and the substrate W held by the holding portion 35e move to the right of the rotation axis A35.

Next, the horizontal moving portion 35b further advances, and the arm portion 35d further rotates. Thereby, the arm portion 35d and the holding portion 35e perform substantially the same actions as the arm portion 35f and the holding portion 35g shown in FIGS. 14K-14M. The substrate W held by the holding portion 35e is away from the heat treatment unit U2 along the imaginary line F2. The holding portion 35e and the substrate W held by the holding portion 35e move to the rear of the rotation axis A35.

After that, the horizontal moving part 35b retreats. Thereby, the holding part 35e moves in and out of the mounting part 84a1, and the board|substrate W is mounted on the mounting part 84a1.

In this way, the holding portion 35e can use the space of the heat treatment unit 38a1 to rotate around the rotation axis A35. The holding portion 35e may not place the substrate W on the heat treatment unit 38a1, but may move from a position before the rotation axis A35 to a position behind the rotation axis A35. Therefore, after the holding portion 35e enters and exits the placing portion 82a1, the holding portion 35e can enter and exit the placing portion 84a1. Therefore, the transport mechanism 34a1 can transport the substrate W from the placement portion 82a1 to the placement portion 84a1 without placing the substrate W on the heat treatment unit 38a1.

By carrying out the procedure reverse to the above-mentioned operation example by the conveying mechanism 34a1, the holding portion 35e can use the space of the heat treatment unit 38a1 to move from a position behind the rotation axis A35 to a position before the rotation axis A35. Therefore, the transport mechanism 34a1 can transport the substrate W from the placement portion 84a1 to the placement portion 82a1 without placing the substrate W on the heat treatment unit 38a1.

Furthermore, the arm portions 35d and 35f can rotate about 250 degrees around the rotation axis A35, respectively.

<Effects of Implementation Mode>

The movable member 51a1 is supported by the first frame 46. The heat treatment portion 37a1 is supported by the movable member 51a1. The movable member 51a1 is movable relative to the first frame 46. As the movable member 51a1 moves relative to the first frame 46, the heat treatment portion 37a1 moves relative to the first frame 46. Therefore, the maintenance of the heat treatment portion 37a1 can be easily performed.

The conveyance mechanism 34a1 is supported by the movable member 51a1. As the movable member 51a1 moves with respect to the first frame 46, the heat treatment portion 37a1 and the conveying mechanism 34a1 move integrally. Therefore, when the movable member 51a1 moves with respect to the 1st frame 46, the relative position of the heat processing part 37a1 and the conveyance mechanism 34a1 can be kept fixed. Therefore, the maintenance of the heat treatment part 37a1 can be performed while keeping the relative position of the heat treatment part 37a1 and the conveying mechanism 34a1 fixed. Therefore, it is not necessary to adjust the relative position of the heat treatment part 37a1 and the conveying mechanism 34a1 every time maintenance of the heat treatment part 37a1 is performed. That is, the maintenance of the heat treatment portion 37a1 can be performed more easily.

As described above, according to the substrate processing apparatus 1, the maintenance of the substrate processing apparatus 1 can be easily performed.

As the movable member 51a1 moves with respect to the first frame 46, the heat treatment portion 37a1 moves with respect to the first frame 46 in a substantially horizontal direction. Therefore, the heat treatment portion 37a1 can move relative to the first frame 46 without interfering with other members. For example, even if it is arranged in the heat treatment part 37a1 in other members In the case of at least one of the upper and lower sides, the heat treatment portion 37a1 may move relative to the first frame 46 without interfering with other members.

As the movable member 51a1 moves with respect to the first frame 46, the heat treatment portion 37a1 can be moved to the maintenance position Qa1. Therefore, the heat treatment part 37a1 can be easily moved to the maintenance position Qa1.

When the heat treatment part 37a1 is in the maintenance position Qa1, at least a part of the heat treatment part 37a1 is located outside the first frame 46. Therefore, when the heat treatment part 37a1 is in the maintenance position Qa1, the maintenance of the heat treatment part 37a1 can be easily performed.

When the heat treatment portion 37a1 is at the maintenance position Qa1, the movable member 51a1 is supported by the first frame 46. Therefore, when the heat treatment part 37a1 is at the maintenance position Qa1, the heat treatment part 37a1 is supported by the first frame 46 via the movable member 51a1. Therefore, the maintenance of the heat treatment portion 37a1 can be performed more easily.

As the movable member 51a1 moves relative to the first frame 46, the heat treatment portion 37a1 can be moved to the treatment position Pa1. Therefore, the heat treatment portion 37a1 can be easily moved to the treatment position Pa1. Therefore, the heat treatment part 37a1 can be easily moved between the maintenance position Qa1 and the processing position Pa1.

As described above, as the movable member 51a1 moves with respect to the first frame 46, the heat treatment portion 37a1 and the conveying mechanism 34a1 move integrally. Therefore, even when the movable member 51a1 moves to the processing position Pa1, the relative position of the heat treatment portion 37a1 and the conveying mechanism 34a1 can be kept fixed. In short, to keep the relative position of the heat treatment part 37a1 and the conveying mechanism 34a1 in a fixed state Next, the heat treatment part 37a1 can be easily moved between the maintenance position Qa1 and the treatment position Pa1.

The part of the heat treatment part 37a1 located outside the first frame 46 when the heat treatment part 37a1 is at the maintenance position Qa1 is larger than the part of the heat treatment part 37a1 outside the first frame 46 when the heat treatment part 37a1 is at the treatment position Pa1. Therefore, when the heat treatment part 37a1 is in the maintenance position Qa1, the maintenance of the heat treatment part 37a1 can be easily performed. When the heat treatment part 37a1 is at the treatment position Pa1, the heat treatment part 37a1 can heat the substrate W appropriately.

When the heat treatment part 37a1 is at the treatment position Pa1, all the heat treatment parts 37a1 are located inside the first frame 46. Therefore, when the heat treatment part 37a1 is at the treatment position Pa1, the heat treatment part 37a1 can heat the substrate W more appropriately.

When the heat treatment portion 37a1 is at the treatment position Pa1, the movable member 51a1 is supported by the first frame 46. Therefore, when the heat treatment part 37a1 is at the treatment position Pa1, the heat treatment part 37a1 is supported by the first frame 46 via the movable member 51a1. Therefore, the heat treatment portion 37a1 can heat the substrate W more appropriately.

Regarding the conveyance mechanism 34a1, the rail portion 35a is fixed to the movable member 51a1. The horizontal moving part 35b is supported by the rail part 35a. The arm portions 35d and 35f are supported by the horizontal moving portion 35b. The holding portion 35e is fixed to the arm portion 35d. The holding portion 35g is fixed to the arm portion 35f. In this way, the rail part 35a, the horizontal moving part 35b, the arm parts 35d, 35f, and the holding parts 35e, 35g are directly or indirectly supported by the movable member 51a1. Therefore, the movable member 51a1 can support the conveying mechanism 34a1 well.

The horizontal moving part 35b can move in a substantially horizontal direction with respect to the rail part 35a. Therefore, the holding parts 35e and 35g can move in a substantially horizontal direction with respect to the rail part 35a. The arm portion 35d is rotatable about the rotation axis A35d relative to the horizontal moving portion 35b. Therefore, the holding portion 35e is rotatable about the rotation axis A35d with respect to the horizontal moving portion 35b. The arm portion 35f is rotatable about the rotation axis A35f relative to the horizontal moving portion 35b. Therefore, the holding portion 35g can rotate about the rotation axis A35f with respect to the horizontal moving portion 35b. Therefore, the holding parts 35e and 35g can enter and exit the heat treatment part 37a1 well.

In a plan view, the relative positions of the rotation axes A35d and A35f with respect to the horizontal moving portion 35b are fixed. Therefore, the structure in which the arm portions 35d and 35f are supported by the horizontal moving portion 35b is simple. The holding parts 35e and 35g are fixed to the arm parts 35d and 35f. Furthermore, in a plan view, the distance between the holding portion 35e and the rotation axis A35d is constant. In a plan view, the distance between the holding portion 35g and the rotation axis A35f is constant. Therefore, the structure in which the holding parts 35e and 35g are supported by the arm parts 35d and 35f is simple. In this way, the structure of the conveying mechanism 34a1 is simple. As a result, the size of the transport mechanism 34a1 is relatively small. For example, the size of the arm portions 35d and 35f is relatively small. Therefore, the installation space of the conveying mechanism 34a1 in a plan view can be effectively reduced. Therefore, the area of the conveying space 32 in a plan view can be effectively reduced.

Incidentally, when the conveying mechanism 68a is viewed in a plan view, the relative position of the rotation axis A69e with respect to the horizontal moving portion 69d is fixed, but when viewed in a plan view, the distance between the holding portion 69f and the rotation axis A69e is not fixed. Furthermore, in a plan view, the distance between the holding portion 69g and the rotation axis A69e is not constant. Therefore, the structure of the conveying mechanism 68a is relatively complicated. A specific description will be given below.

In a plan view, the relative position of the rotation axis A69e with respect to the horizontal moving portion 69d is fixed. For example, even if the rotating portion 69e rotates about the rotation axis A69e with respect to the horizontal movement portion 69d, the rotation axis A69e is maintained at a position to the right of the horizontal movement portion 69d in a plan view. Therefore, the structure of the horizontal moving portion 69d supporting the rotating portion 69e is relatively simple. However, in a plan view, the distance between the holding portion 69f and the rotation axis A69e is not constant. For example, when the holding portion 69f advances and retreats with respect to the rotation portion 69e, the holding portion 69f approaches or moves away from the rotation axis A69e toward the rotation axis A69e in a plan view. Therefore, the structure of the rotating portion 69e supporting the holding portion 69f is relatively complicated. Therefore, the size of the rotating portion 69e is relatively large. Similarly, in a plan view, the distance between the holding portion 69g and the rotation axis A69e is not constant. Therefore, the structure of the rotating portion 69e to support the holding portion 69g is also relatively complicated. Therefore, the size of the rotating portion 69e is larger.

The conveying mechanism 34b1 has substantially the same structure as the conveying mechanism 34a1. Therefore, the structure of the transport mechanism 34b1 is simple. Therefore, the installation space of the conveying mechanism 34b1 in a plan view can be effectively reduced. Therefore, it is possible to further effectively reduce the area of the conveying space 32 in a plan view.

The vertical moving part 35c is supported by the horizontal moving part 35b. The vertical moving part 35c can move in substantially the up-down direction Z with respect to the horizontal moving part 35b. The arm parts 35d and 35f are supported by the horizontal moving part 35b via the vertical moving part 35c. Therefore, by the vertical movement portion 35c moving in the substantially vertical direction Z relative to the horizontal movement portion 35b, the arm portions 35d and 35f and the holding portions 35e and 35g move in the substantially vertical direction Z relative to the horizontal movement portion 35b. Therefore, the holding parts 35e and 35g can enter and exit the heat treatment part 37a1 more satisfactorily.

The movable member 51b1 is supported by the second frame 47. The heat treatment portion 37b1 is supported by the movable member 51b1. The movable member 51b1 can move relative to the second frame 47. With the movable member 51b1 relative to The second frame 47 moves, and the heat treatment portion 37b1 moves relative to the second frame 47. Therefore, the maintenance of the heat treatment portion 37b1 can be easily performed.

The transport mechanism 34b1 is supported by the movable member 51b1. As the movable member 51b1 moves relative to the second frame 47, the heat treatment portion 37b1 and the conveying mechanism 34b1 move integrally. Therefore, when the movable member 51b1 moves with respect to the 2nd frame 47, the relative position of the heat processing part 37b1 and the conveyance mechanism 34b1 can be kept fixed. Therefore, maintenance of the heat treatment part 37b1 can be performed while maintaining the relative position of the heat treatment part 37b1 and the conveying mechanism 34b1 in a fixed state. Therefore, it is not necessary to adjust the relative position of the heat treatment part 37b1 and the conveying mechanism 34b1 every time maintenance of the heat treatment part 37b1 is performed. That is, the maintenance of the heat treatment portion 37b1 can be performed more easily.

As described above, according to the substrate processing apparatus 1, the maintenance of the substrate processing apparatus 1 can be performed more easily.

The substrate processing apparatus 1 includes a heat treatment part 37b1 in addition to the heat treatment part 37a1. Therefore, the throughput of the substrate processing apparatus 1 can be improved satisfactorily.

The second frame 47 is arranged at approximately the same height position as the first frame 46. In other words, the first frame 46 and the second frame 47 are arranged so as to be aligned in a substantially horizontal direction. The transport mechanism 34a1 is arranged between the heat treatment portion 37a1 and the second frame 47. The transport mechanism 34b1 is arranged between the heat treatment portion 37b1 and the first frame 46. In other words, the heat treatment portion 37a1, the conveyance mechanism 34a1, the conveyance mechanism 34b1, and the heat treatment portion 37b1 are arranged in a substantially horizontal direction in sequence. Therefore, the heat treatment parts 37a1, 37b1 and the conveying mechanisms 34a1, 34b1 can be installed efficiently.

The second frame 47 is arranged on the left of the first frame 46. The transport mechanism 34a1 is arranged on the left of the heat treatment part 37a1. The conveying mechanism 34b1 is arranged on the left of the conveying mechanism 34a1. The heat treatment part 37b1 is arranged on the left of the conveying mechanism 34b1. Therefore, the heat treatment parts 37a1, 37b1 and the conveying mechanisms 34a1, 34b1 can be installed efficiently.

As the movable member 51a1 moves relative to the first frame 46, the heat treatment portion 37a1 can move relative to the first frame 46 in the first direction. When the heat treatment part 37a1 moves in the first direction with respect to the first frame 46, the heat treatment part 37a1 moves away from the second frame 47. Therefore, the heat treatment portion 37a1 can move without interfering with the second frame 47.

The heat treatment part 37a1 is arranged to the right of the heat treatment part 37b1. As the movable member 51a1 moves relative to the first frame 46, the heat treatment portion 37a1 can move to the right relative to the first frame 46. As the heat treatment part 37a1 moves to the right with respect to the first frame 46, the heat treatment part 37a1 moves away from the heat treatment part 37b1. Therefore, the heat treatment part 37a1 can move without interference with the heat treatment part 37b1.

As the movable member 51b1 moves relative to the second frame 47, the heat treatment portion 37b1 can move relative to the second frame 47 in the second direction. When the heat treatment part 37b1 moves in the second direction with respect to the second frame 47, the heat treatment part 37b1 moves away from the first frame 46. Therefore, the heat treatment portion 37b1 can move without interfering with the first frame 46.

The heat treatment part 37b1 is arranged on the left of the heat treatment part 37a1. As the movable member 51b1 moves relative to the second frame 47, the heat treatment portion 37b1 can move to the left relative to the second frame 47. By The heat treatment part 37b1 moves to the left with respect to the second frame 47, and the heat treatment part 37b1 is away from the heat treatment part 37a1. Therefore, the heat treatment part 37b1 can move without interference with the heat treatment part 37a1.

By moving the movable member 51a1 with respect to the first frame 46, the movable member 51a1 can pull at least a part of the heat treatment portion 37a1 from the first frame 46 in the first direction. Therefore, the maintenance of the heat treatment portion 37a1 can be easily performed.

By moving the movable member 51b1 with respect to the second frame 47, the movable member 51b1 can pull at least a part of the heat treatment portion 37b1 from the second frame 47 in the second direction. Therefore, the maintenance of the heat treatment portion 37b1 can be easily performed.

As the movable member 51b1 moves with respect to the second frame 47, the heat treatment portion 37b1 can be moved to the maintenance position Qb1. Therefore, the heat treatment part 37b1 can be easily moved to the maintenance position Qb1.

The second frame 47 is arranged on the left of the first frame 46. When the heat treatment part 37a1 is in the maintenance position Qa1, at least a part of the heat treatment part 37a1 is located to the right of the first frame 46. Therefore, when the heat treatment part 37a1 is in the first maintenance position Qa1, at least a part of the heat treatment part 37a1 is located outside the first frame 46 and outside the second frame 47. Therefore, when the heat treatment part 37a1 is in the maintenance position Qa1, the maintenance of the heat treatment part 37a1 can be easily performed.

The first frame 46 is arranged on the right of the second frame 47. When the heat treatment part 37b1 is at the maintenance position Qb1, at least a part of the heat treatment part 37b1 is located to the left of the second frame 47. Therefore, when the heat treatment part 37b1 is in the maintenance position Qb1, at least a part of the heat treatment part 37b1 is located in the first frame. The outside of the frame 46 and the outside of the second frame 47. Therefore, when the heat treatment part 37b1 is in the maintenance position Qb1, the maintenance of the heat treatment part 37b1 can be easily performed.

The second frame 47 has substantially the same shape as the first frame 46. Therefore, the first frame 46 and the second frame 47 can be easily manufactured. Therefore, the substrate processing apparatus 1 can be easily manufactured.

The second frame 47 can be separated from the first frame 46. Therefore, the substrate processing apparatus 1 can be easily manufactured.

For example, the manufacturing of the substrate processing apparatus 1 can be divided into the following first operation, second operation, and third operation.

‧The first task of installing the movable member 51a1, the heat treatment portion 37a1, and the conveying mechanism 34a1 on the first frame 46

‧The second task of installing the movable member 51b1, the heat treatment portion 37b1, and the conveying mechanism 34b1 on the second frame 47

‧The third task of connecting the first frame 46 and the second frame 47

Here, the first task, the second task, and the third task can be performed in different places and at different times.

Therefore, the substrate processing apparatus 1 can be easily manufactured.

The conveying mechanism 34b1 is arranged at a position symmetrical to the conveying mechanism 34a1. The heat treatment part 37b1 is arranged at a position symmetrical to the heat treatment part 37a1. Therefore, the design and manufacture of the substrate processing apparatus 1 can be performed more easily.

The movable member 51a2 is supported by the first frame 46. The heat treatment portion 37a2 is supported by the movable member 51a2. The movable member 51a2 is movable relative to the first frame 46. As the movable member 51 a 2 moves relative to the first frame 46, the heat treatment portion 37 a 2 moves relative to the first frame 46. Therefore, the maintenance of the heat treatment portion 37a2 can be easily performed.

The conveyance mechanism 34a2 is supported by the movable member 51a2. As the movable member 51a2 moves with respect to the first frame 46, the heat treatment portion 37a2 and the conveying mechanism 34a2 move integrally. Therefore, when the movable member 51a2 moves relative to the first frame 46, the relative position of the heat treatment portion 37a2 and the conveying mechanism 34a2 can be kept fixed. Therefore, maintenance of the heat treatment part 37a2 can be performed while maintaining the relative position of the heat treatment part 37a2 and the conveying mechanism 34a2 in a fixed state. Therefore, it is not necessary to adjust the relative position of the heat treatment part 37a2 and the conveying mechanism 34a2 every time maintenance of the heat treatment part 37a2 is performed. That is, the maintenance of the heat treatment portion 37a2 can be performed more easily.

As described above, according to the substrate processing apparatus 1, the maintenance of the substrate processing apparatus 1 can be easily performed.

The movable member 51a2 is movable relative to the first frame 46 independently of the movable member 51a1. Therefore, the heat treatment portions 37a1 and 37a2 can be moved individually. Therefore, for example, maintenance of only one of the heat treatment portions 37a1 and 37a2 can be easily performed. Or, maintenance of both of the heat treatment parts 37a1 and 37a2 can be easily performed.

The substrate processing apparatus 1 includes a heat treatment part 37a2 in addition to the heat treatment part 37a1. because Therefore, the throughput of the substrate processing apparatus 1 can be improved satisfactorily.

The heat treatment part 37a2 is arranged above the heat treatment part 37a1. Therefore, the installation space of the heat treatment portions 37a1 and 37a2 in a plan view can be reduced. The conveying mechanism 34a2 is arranged above the conveying mechanism 34a1. Therefore, the installation space of the conveying mechanisms 34a1 and 34a2 in a plan view can be reduced. Therefore, the area occupied by the substrate processing apparatus 1 can be reduced.

The guide 55 is fixed to the first frame 46. The sliding portion 56 is fixed to the movable member 51a1. The sliding part 56 is guided by the guide part 55. Therefore, the movable member 51a1 can move with respect to the first frame 46 well.

When the heat treatment portion 37a1 is at the maintenance position Qa1, at least a part of the inspection portion 41a1 is located outside the first frame 46. Therefore, when the heat treatment part 37a1 is in the maintenance position Qa1, the maintenance of the inspection part 41a can be easily performed.

When the heat treatment portion 37a1 is at the maintenance position Qa1, at least a part of the electric device portion 57a1 is located outside the first frame 46. Therefore, when the heat treatment part 37a1 is in the maintenance position Qa1, the maintenance of the electric device part 57a1 can be easily performed.

The heat treatment portion 37a1 and the conveyance space 32 are arranged so as to be aligned in the substantially width direction Y. The heat treatment unit 37a1 includes a plurality of heat treatment units 38a1. The heat treatment unit 38a1 heat-treats one substrate W, respectively. The transport mechanism 34a1 transports the substrate to the heat treatment unit 38a1. Here, the heat treatment unit 38a1 is arranged so as to be arranged in the substantially front-rear direction X. Therefore, it can be increased relatively easily The number of heat treatment units 38a1 included in the heat treatment portion 37a1. Therefore, the heat treatment portion 37a1 can heat a relatively large number of substrates W in parallel. Therefore, the throughput of the substrate processing apparatus 1 can be improved satisfactorily.

Similarly, the heat treatment portion 37b1 and the conveyance space 32 are arranged so as to be aligned in the substantially width direction Y. More specifically, the conveyance space 32 is arranged between the heat treatment portion 37a1 and the heat treatment portion 37b1 in the substantially width direction Y. The heat treatment unit 37b1 includes a plurality of heat treatment units 38b1. The heat treatment unit 38b1 heat-treats one substrate W, respectively. The transport mechanism 34b1 transports the substrate W to the heat treatment unit 38b1. Here, the heat treatment unit 38b1 is arranged so as to be arranged substantially in the front-rear direction X. Therefore, the number of heat treatment units 38b1 included in the heat treatment portion 37b1 can be relatively easily increased. Therefore, the heat treatment portion 37b1 can heat a relatively large number of substrates W in parallel. Therefore, the throughput of the substrate processing apparatus 1 can be improved satisfactorily.

Here, the number of heat treatment units 38a1 included in the heat treatment part 37a1 is 12 or less. Therefore, it is possible to well prevent the transfer amount of the substrate W borne by the transfer mechanism 34a1 from becoming excessive. Similarly, the number of heat treatment units 38a1 included in the heat treatment portion 37b1 is 12 or less. Therefore, it is possible to well prevent the transfer amount of the substrate W borne by the transfer mechanism 34b1 from becoming excessive.

The conveyance mechanism 34a1 is movable in substantially the front-rear direction X with respect to the heat treatment unit 38a1. Therefore, the transport mechanism 34a1 can enter and exit the heat treatment unit 38a1 well. The conveyance mechanism 34b1 is movable in substantially the front-rear direction X with respect to the heat treatment unit 38b1. Therefore, the transport mechanism 34b1 can enter and exit the heat treatment unit 38b1 well.

The conveying mechanism 34b1 can move independently of the conveying mechanism 34a1. Therefore, the conveying mechanisms 34a1, 34b1 can enter and exit the heat treatment units 38a1, 38b1 with high efficiency, respectively.

The conveyance mechanism 34a1 includes a horizontal moving part 35b, arm parts 35d and 35f, and holding parts 35e and 35g. The arm portions 35d and 35f are supported by the horizontal moving portion 35b. The holding parts 35e and 35g are fixed to the arm parts 35d and 35f. In this way, the holding parts 35e and 35g are indirectly supported by the horizontal moving part 35b. The horizontal moving part 35b is movable in the substantially front-rear direction X with respect to the heat treatment unit 38a1. Therefore, the holding parts 35e and 35g are movable in the substantially front-rear direction X with respect to the heat treatment unit 38a1. The arm portions 35d and 35f are rotatable about the rotation axis A35d and A35f with respect to the horizontal moving portion 35b. Therefore, the holding parts 35e and 35g are rotatable about the rotation axis A35d and A35f with respect to the horizontal moving part 35b. Therefore, the holding parts 35e and 35g can enter and exit the heat treatment unit 38a1 well.

The conveying mechanism 34b1 has substantially the same structure as the conveying mechanism 34a1. Therefore, the holding parts 35e and 35g of the conveying mechanism 34b1 can enter and exit the heat treatment unit 38b1 well.

Regarding the conveyance mechanism 34a1, the holding parts 35e and 35g move in parallel in the substantially front-rear direction X by the horizontal movement portion 35b moving in the substantially front-back direction X. As the arm portion 35d rotates about the rotation axis A35d, the holding portion 35e rotates about the rotation axis A35d. As the arm portion 35f rotates about the rotation axis A35f, the holding portion 35g rotates about the rotation axis A35f. Here, the horizontal moving portion 35b moves in the substantially front-rear direction X, and the arm portion 35d rotates about the rotation axis A35d, thereby linearly moving the substrate W held by the holding portion 35e in the substantially width direction Y toward the heat treatment unit 38a1. Similarly, the horizontal moving portion 35b moves in the substantially front-to-rear direction X, and the arm portion 35f moves around the rotation axis The rotation of A35f causes the substrate W held by the holding portion 35g to move linearly in the substantially width direction Y toward the heat treatment unit 38a1. Therefore, even when the length La of one heat treatment unit 38a1 in the front-rear direction X is short, the transport mechanism 34a1 can transport the substrate W to the heat treatment unit 38a1 well.

Regarding the conveying mechanism 34b1, the horizontal moving portion 35b moves in the substantially front-rear direction X, and the arm portions 35d, 35f rotate around the rotation axes A35d, A35f, whereby the substrate W held by the holding portions 35e, 35g is also directed toward the heat treatment unit 38b1. It moves linearly in the substantially width direction Y. Therefore, even when the length Lb of one heat treatment unit 38b1 in the front-rear direction X is short, the transport mechanism 34b1 can well transport the substrate W to the heat treatment unit 38b1.

The length La of one heat treatment unit 38a1 in the front-rear direction X is 3 times the radius r of the substrate W or less. As such, the size of the heat treatment unit 38a1 is relatively small. Therefore, the installation space of the heat treatment unit 38a1 can be reduced well. The length Lb of one heat treatment unit 38b1 in the front-rear direction X is less than 3 times the radius r of the substrate W. As such, the size of the heat treatment unit 38b1 is relatively small. Therefore, the installation space of the heat treatment unit 38b1 can be reduced satisfactorily.

As described above, the transport mechanism 34a1 linearly transports the substrate W in the substantially width direction Y toward the heat treatment unit 38a1. Therefore, even if the length La is three times or less the radius r of the substrate W, the transport mechanism 34a1 can transport the substrate W to the heat treatment unit 38a1 well. Similarly, the transport mechanism 34b1 linearly transports the substrate W in the substantially width direction Y toward the heat treatment unit 38b1. Therefore, even if the length Lb is three times or less the radius r of the substrate W, the transport mechanism 34b1 can transport the substrate W to the heat treatment unit 38b1 well.

The distance Da between two adjacent first center points Ga1 in the substantially front-rear direction X is less than 3 times the radius r of the substrate W. As such, the distance Da is relatively small. Therefore, the size of the heat treatment unit 38a1 is relatively small, and the two heat treatment units 38a1 arranged in the substantially front-rear direction X are close to each other. Therefore, the installation space of the heat treatment unit 38a1 can be reduced well. That is, the installation space of the heat treatment portion 37a1 can be reduced favorably. Similarly, the distance Db between two adjacent second center points Gb1 in the substantially front-rear direction X is less than 3 times the radius r of the substrate W. In this way, the size of the heat treatment unit 38b1 is relatively small, and the two heat treatment units 38b1 arranged in the substantially front-rear direction X are close to each other. Therefore, the installation space of the heat treatment unit 38b1 can be reduced satisfactorily. That is, the installation space of the heat treatment part 37b1 can be reduced favorably. Therefore, the area occupied by the substrate processing apparatus 1 can be reduced.

The length of the transport space 32 in the width direction Y is less than 5 times the radius r of the substrate W. Therefore, the area of the conveying space 32 in a plan view can be reduced. Therefore, the area occupied by the substrate processing apparatus 1 can be reduced.

The heat treatment of the substrate W by the heat treatment section 37a1 includes pretreatment. The heat treatment of the substrate W by the heat treatment section 37b1 also includes pretreatment. Here, the pretreatment refers to the heat treatment performed on the substrate W before the liquid treatment. Therefore, the substrate processing apparatus 1 can efficiently preprocess the substrate W.

The heat treatment performed on the substrate W by the heat treatment section 37a1 includes post-processing. The heat treatment of the substrate W by the heat treatment portion 37b1 also includes post-treatment. Here, the post-treatment is the liquid treatment The substrate W is heat treated. Therefore, the substrate processing apparatus 1 can perform post-processing on the substrate W efficiently.

The heat treatment of the substrate W by the heat treatment section 37a1 includes a hydrophobization treatment. The heat treatment performed on the substrate W by the heat treatment portion 37b1 also includes a hydrophobization treatment. Therefore, the substrate processing apparatus 1 can efficiently perform the hydrophobic treatment on the substrate W.

The heat treatment of the substrate W by the heat treatment section 37a1 includes heat treatment. The heat treatment of the substrate W by the heat treatment section 37b1 also includes heat treatment. Therefore, the substrate processing apparatus 1 can efficiently heat-process the substrate W.

The heat treatment of the substrate W by the heat treatment section 37a1 includes cooling treatment. The heat treatment of the substrate W by the heat treatment section 37b1 also includes cooling treatment. Therefore, the substrate processing apparatus 1 can efficiently cool the substrate W.

The heat treatment performed on the substrate W by the heat treatment section 37b1 is the same as the heat treatment performed on the substrate W by the heat treatment section 37a1. Therefore, the substrate processing apparatus 1 can heat the substrate W efficiently.

The placing portion 82a1 and the placing portion 82b1 are arranged so as to be aligned in the vertical direction Z. The placement portion 82b1 overlaps the placement portion 82a1 in a plan view. Therefore, the installation space of the placing portions 82a1 and 82b1 in a plan view can be reduced. Therefore, the area occupied by the substrate processing apparatus 1 can be reduced.

The liquid processing section 71 is arranged outside the area Ba where the substrate W can be transported by the transport mechanism 34a1. In this way, the liquid processing unit 71 is arranged at a position where the conveying mechanism 34a1 cannot enter and exit. Therefore, the transport mechanism 34a1 does not transport the substrate W to the liquid processing unit 71. Therefore, it is possible to well prevent the transfer amount of the substrate W borne by the transfer mechanism 34a1 from becoming excessive. The liquid processing unit 71 is arranged outside the area Bb where the substrate W can be transported by the transport mechanism 34b1. Therefore, the transport mechanism 34b1 does not transport the substrate W to the liquid processing section 71. Therefore, it is possible to well prevent the transfer amount of the substrate W borne by the transfer mechanism 34b1 from becoming excessive.

The substrate processing apparatus 1 includes a liquid processing transport mechanism 67. Therefore, the substrate W can be transported to the liquid processing section 71 satisfactorily.

The liquid processing transport mechanism 67 is arranged behind the transport mechanism 34a1. Therefore, it is possible to prevent the transport mechanism 34a1 from interfering with the liquid processing transport mechanism 67 satisfactorily. The liquid processing transport mechanism 67 is arranged behind the transport mechanism 34b1. Therefore, it is possible to prevent the transport mechanism 34b1 from interfering with the liquid processing transport mechanism 67 satisfactorily.

The liquid processing unit 71 is arranged at a position adjacent to the liquid processing transport mechanism 67. Therefore, the liquid processing transport mechanism 67 can easily move in and out of the liquid processing unit 71.

The conveying mechanisms 34a2, 34b2 are arranged above the conveying mechanisms 34a1, 34a2. Therefore, the installation space of the conveying mechanisms 34a1, 34a2, 34b1, and 34b2 in a plan view can be reduced. In other words, the installation area of the conveying space 32 in a plan view can be reduced.

The heat treatment part 37a2 overlaps with the heat treatment part 37a1 in a plan view. Therefore, the installation space of the heat treatment portions 37a1 and 37a2 in a plan view can be reduced. The heat treatment part 37b2 overlaps with the heat treatment part 37b1 in a plan view. Therefore, the installation space of the heat treatment portions 37b1 and 37b2 in a plan view can be reduced.

The heat treatment portion 37a2 and the conveyance space 32 are arranged so as to be aligned in the substantially width direction Y. The heat treatment unit 37a2 includes a plurality of heat treatment units 38a2. The heat treatment unit 38a2 heat-treats one substrate W, respectively. The transport mechanism 34a2 transports the substrate W to the heat treatment unit 38a2. Here, the heat treatment unit 38a2 is arranged so as to be lined up in the substantially front-rear direction X. Therefore, the number of heat treatment units 38a2 included in the heat treatment portion 37a2 can be relatively easily increased. Therefore, the heat treatment portion 37a2 can heat a relatively large number of substrates W in parallel. Therefore, the throughput of the substrate processing apparatus 1 can be improved satisfactorily.

The heat treatment part 37b2 and the conveyance space 32 are arrange|positioned so that it may line up in the substantially width direction Y. More specifically, the conveyance space 32 is arranged between the heat treatment portion 37a2 and the heat treatment portion 37b2 in the substantially width direction Y. The heat treatment unit 37b2 includes a plurality of heat treatment units 38b2. The heat treatment unit 38b2 heats one substrate W, respectively. The transport mechanism 34b2 transports the substrate W to the heat treatment unit 38b2. The heat treatment unit 38b2 is arranged so as to be arranged in the substantially front-rear direction X. Therefore, the number of heat treatment units 38b2 included in the heat treatment portion 37b2 can be increased relatively easily. Therefore, the heat treatment portion 37b2 can heat treat a relatively large number of substrates W in parallel. Therefore, the throughput of the substrate processing apparatus 1 can be improved satisfactorily.

The heat treatment of the substrate W by the heat treatment sections 37a2, 37b1, and 37b2 is the same as the heat treatment of the substrate W by the heat treatment section 37a1, respectively. Therefore, the substrate processing apparatus 1 can efficiently The substrate W is heat-treated.

The mounting portions 82a1, 82a2, 82b1, and 82b2 are arranged so as to be aligned in the substantially vertical direction Z. The placement portions 82a2, 82b1, and 82b2 respectively overlap the placement portion 82a1 in a plan view. Therefore, the installation space of the placement portions 82a1, 82a2, 82b1, and 82b2 in a plan view can be reduced. Therefore, the area occupied by the substrate processing apparatus 1 can be reduced.

The conveyance mechanism 25 for transfer conveyance conveys the board|substrate W between the carrier C and the mounting part 82a1. Therefore, the substrate W can be transported between the transfer mechanism 25 for transfer and the transport mechanism 34a1 via the placement portion 82a1. For example, the transfer mechanism 25 for transfer and transfer may deliver the substrate W carried out from the carrier C to the transfer mechanism 34a1. For example, the transport mechanism 25 for transfer and transfer can transport the substrate W received from the transport mechanism 34a1 into the carrier C.

Similarly, the transfer mechanism 25 for transfer transfer transfers the substrate W between the carrier C and the placing portion 82b1. Therefore, the board|substrate W can be conveyed between the conveyance mechanism 25 for transfer and conveyance and the conveyance mechanism 34b1 via the mounting part 82b1. The conveyance mechanism 25 for transfer conveyance conveys the board|substrate W between the carrier C and the mounting part 82a2. Therefore, the board|substrate W can be conveyed between the conveyance mechanism 25 for transfer conveyance, and the conveyance mechanism 34a2 via the mounting part 82a2. The conveyance mechanism 25 for transfer conveyance conveys the board|substrate W between the carrier C and the mounting part 82b2. Therefore, the substrate W can be transported between the transfer mechanism 25 for transfer and the transport mechanism 34b2 via the placement portion 82b2.

The liquid processing unit 71 is arranged outside the area where the substrate W can be transported by the transport mechanism 34a2. Therefore, the transport mechanism 34a2 does not transport the substrate W to the liquid processing unit 71. Therefore, it is possible to prevent The transfer amount of the substrate W borne by the transfer mechanism 34a2 becomes too large.

The liquid processing section 71 is arranged outside the area where the substrate W can be transported by the transport mechanism 34b2. Therefore, the transport mechanism 34b2 does not transport the substrate W to the liquid processing unit 71. Therefore, it is possible to prevent the transfer amount of the substrate W borne by the transfer mechanism 34b2 from becoming excessively large.

The liquid processing transport mechanism 67 is arranged behind the transport mechanisms 34a2, 34b2. Therefore, it is possible to prevent the transport mechanism 34a2, 34b2 from interfering with the liquid processing transport mechanism 67 well.

The liquid processing part 71 is arrange|positioned at the position side-by-side in the substantially width direction Y with the conveying mechanism 67 for liquid processing. Therefore, the liquid processing transport mechanism 67 can easily move in and out of the liquid processing unit 71.

The mounting portions 84a1, 84a2, 84b1, and 84b2 are arranged so as to be aligned in the substantially vertical direction Z. The placement portions 84a2, 84b1, and 84b2 respectively overlap the placement portion 84a1 in a plan view. Therefore, the installation space of the placement portions 84a1, 84a2, 84b1, and 84b2 in a plan view can be reduced. Therefore, the area occupied by the substrate processing apparatus 1 can be reduced.

The transport mechanism 34a1 and the liquid processing transport mechanism 67 can place the substrate W on the placement portion 84a1. Therefore, the substrate W can be transported between the transport mechanism 34a1 and the liquid processing transport mechanism 67 via the placement portion 84a1. For example, the liquid processing transport mechanism 67 can receive the substrate W from the transport mechanism 34a1. For example, the liquid processing transport mechanism 67 can deliver the substrate W to the transport mechanism 34a1.

Similarly, the transport mechanism 34b1 and the liquid processing transport mechanism 67 can place the substrate W on the placement portion 84b1. Therefore, the substrate W can be transported between the transport mechanism 34b1 and the liquid processing transport mechanism 67 via the placement portion 84b1. The transport mechanism 34a2 and the liquid processing transport mechanism 67 can place the substrate W on the placement portion 84a2. Therefore, the substrate W can be transported between the transport mechanism 34a2 and the liquid processing transport mechanism 67 via the placement portion 84a2. The transport mechanism 34b2 and the liquid processing transport mechanism 67 can place the substrate W on the placement portion 84b2. Therefore, the substrate W can be transported between the transport mechanism 34b2 and the liquid processing transport mechanism 67 via the placement portion 84b2.

The substrate processing apparatus 1 includes inspection units 41a1-41a4 and 41b1-41b4. Therefore, the substrate processing apparatus 1 can efficiently inspect the substrate W.

The present invention is not limited to the embodiment, and can be modified and implemented as follows.

In the above-described embodiment, the heat treatment transport mechanism 33 includes eight transport mechanisms 34a1-34a4 and 34b1-34b4. But it is not limited to this. The number of conveying mechanisms 34 included in the conveying mechanism 33 for heat treatment can be appropriately changed.

In the above embodiment, the rotation axis A35f is arranged at the same position as the rotation axis A35d. But it is not limited to this. For example, the rotation axis A35f may be arranged at a position different from the rotation axis A35d.

In the above embodiment, the substrate processing apparatus 1 includes eight heat treatment units 37a1-37a4, 37b1-37b4. But it is not limited to this. The number of heat treatment units 37 included in the substrate processing apparatus 1 can be appropriately changed.

In the above-mentioned embodiment, the heat treatment section 37a1 includes seven heat treatment units 38a1. But it is not limited to this. The number of heat treatment units 38a1 included in the heat treatment section 37a1 can be appropriately changed.

In the above-mentioned embodiment, as the heat treatment performed by the heat treatment portion 37a1 on the substrate W, hydrophobization treatment, heating treatment, and cooling treatment are exemplified. But it is not limited to this. The content of the heat treatment performed on the substrate W by the heat treatment section 37a1 can be appropriately changed. For example, the heat treatment of the substrate W by the heat treatment section 37a1 may not include one or two of the hydrophobization treatment, heating treatment, and cooling treatment.

In the above-mentioned embodiment, the heat treatment performed on the substrate W by the heat treatment portion 37b1 is the same as the heat treatment performed on the substrate W by the heat treatment portion 37a1. But it is not limited to this. The heat treatment performed on the substrate W by the heat treatment portion 37b1 may be different from the heat treatment performed on the substrate W by the heat treatment portion 37a1.

In the above-mentioned embodiment, the sliding part 56 is fixed to the lower part of the movable member 51a1. But it is not limited to this. The sliding part 56 can be fixed to any part of the movable member 51a1. For example, the sliding part 56 may be fixed to the side part or upper part of the movable member 51a1.

In the above-mentioned embodiment, the liquid processing part 71 is arrange|positioned at the position parallel to the conveyance mechanism 67 for liquid processing in substantially the width direction Y. As shown in FIG. But it is not limited to this. For example, liquid can also be treated The portion 71 is arranged at a position behind the liquid processing conveyance mechanism 67. For example, the liquid processing part 71 may be arrange|positioned at least any position of the position parallel to the conveyance mechanism 67 for liquid processing in the substantially width direction Y, and the position behind the conveyance mechanism 67 for liquid processing.

In the above-mentioned embodiment, the coating process performed on the substrate W by the liquid processing unit 71 is a process of forming a resist film on the substrate W. But it is not limited to this. The coating process may also be a process of forming an anti-reflection film on the substrate W.

In the above-mentioned embodiment, the liquid treatment performed on the substrate W by the liquid treatment section 71 is the coating treatment. But it is not limited to this. The liquid treatment may also be a development process in which the substrate W is developed. The developing solution is supplied to the pair of substrates W in the development processing system. The liquid treatment may also be a cleaning treatment for cleaning the substrate W. The cleaning process is to supply a cleaning liquid to the substrate W.

In the above-described embodiment, the substrate processing apparatus 1 includes the inspection unit 41. But it is not limited to this. For example, the inspection unit 41 may be omitted.

In the above-mentioned embodiment, the movable member 51a1 supports the inspection part 41a. But it is not limited to this. The movable member 51a1 may not support the inspection part 41a.

In the above-described embodiment, the inspection unit 41a includes one inspection unit 42a1. But it is not limited to this. The inspection unit 41a may include a plurality of inspection units 42a1.

Regarding the above-mentioned embodiment and each modified embodiment, each configuration can be further combined with other The configuration of the embodiment is changed, replaced or combined, etc., to change as appropriate.

The present invention can be implemented in other specific forms without departing from its idea or essence. Therefore, as content indicating the scope of the invention, the appended patent scope should be referred to instead of the above description.

31: Heat treatment block

32: Transport space

33: Conveying mechanism for heat treatment

34a1: Transport mechanism (1st transport mechanism)

34a2: Transport mechanism (3rd transport mechanism)

34a3: Transport mechanism

34a4: Transport mechanism

34b1: Transport mechanism (2nd transport mechanism)

34b2: Transport mechanism (4th transport mechanism)

34b3: Transport mechanism

34b4: Transport mechanism

37a1: Heat treatment section (1st heat treatment section)

37a2: Heat treatment section (3rd heat treatment section)

37a3: Heat treatment department

37a4: Heat treatment department

37b1: Heat treatment section (Second heat treatment section)

37b2: Heat treatment section (4th heat treatment section)

37b3: Heat treatment department

37b4: Heat treatment department

38a1: Heat treatment unit (1st heat treatment unit)

38a2: Heat treatment unit (3rd heat treatment unit)

38a3: heat treatment unit

38a4: heat treatment unit

38b1: Heat treatment unit (2nd heat treatment unit)

38b2: Heat treatment unit (4th heat treatment unit)

38b3: Heat treatment unit

38b4: Heat treatment unit

45: Frame

46: Frame 1

47: Frame 2

48a: Base

48b: Pillar

48c: Rod

48d: Space (the interior of the 1st frame/the 2nd frame)

51a1: movable member (the first movable member)

51a2: movable member (third movable member)

51a3: movable member

51a4: movable member

51b1: Movable member (2nd movable member)

51b2: movable member (4th movable member)

51b3: movable member

51b4: movable member

55: Guidance

56: Sliding part

Qa1: Maintenance position (1st maintenance position)

Qa2: Maintenance position (3rd maintenance position)

Qa3: Processing location

Qa4: Processing location

Qb1: Maintenance position (2nd maintenance position)

Qb2: Maintenance position (4th maintenance position)

Qb3: Processing location

Qb4: Processing location

X: front and rear direction

Y: width direction

Z: Up and down direction

Claims (20)

A substrate processing device, which includes: The first frame; A first movable member supported by the first frame and movable relative to the first frame; A first heat treatment part, which is supported by the first movable member and heat-treats the substrate; and A first transport mechanism, which is supported by the first movable member and transports the substrate to the first heat treatment section; and As the first movable member moves relative to the first frame, the first heat treatment unit and the first conveying mechanism move integrally with respect to the first frame. Such as the substrate processing apparatus of claim 1, wherein As the first movable member moves relative to the first frame, the first heat treatment portion moves in a horizontal direction relative to the first frame. Such as the substrate processing apparatus of claim 1, wherein By the movement of the first movable member with respect to the first frame, the first heat treatment part can be moved to a first maintenance position where at least a part of the first heat treatment part is located outside the first frame. Such as the substrate processing apparatus of claim 3, wherein When the first heat treatment portion is in the first maintenance position, the first movable member is supported by the first frame. Such as the substrate processing apparatus of claim 3, wherein By the movement of the first movable member with respect to the first frame, the first heat treatment part can be moved to a first treatment position for the first heat treatment part to heat the substrate. Such as the substrate processing apparatus of claim 5, wherein The part of the first heat treatment part located outside the first frame when the first heat treatment part is at the first maintenance position is larger than the part of the first heat treatment part outside the first frame when the first heat treatment part is at the first treatment position Part of the first heat treatment section. Such as the substrate processing apparatus of claim 5, wherein When the first heat treatment part is at the first treatment position, the first heat treatment part is all located inside the first frame. Such as the substrate processing apparatus of claim 5, wherein When the first heat treatment portion is at the first treatment position, the first movable member is supported by the first frame. Such as the substrate processing apparatus of claim 1, wherein The above-mentioned first transport mechanism has: A first rail part, which is fixed to the first movable member and extends in a horizontal direction; A first horizontal moving portion, which is supported by the first rail portion and can move in a horizontal direction relative to the first rail portion; A first arm, which is supported by the first horizontal moving part and is rotatable about a first axis relative to the first horizontal moving part; and A first holding portion, which is fixed to the first arm portion and holds the substrate; and The above-mentioned first axis is parallel to the vertical direction, In a plan view, the relative position of the first axis with respect to the first horizontal moving portion is fixed, In a plan view, the distance between the first holding portion and the first axis is constant. Such as the substrate processing apparatus of claim 9, wherein The above-mentioned first conveying mechanism includes a first vertical moving part, The first vertical moving part is supported by the first horizontal moving part, and is movable in the vertical direction relative to the first horizontal moving part, The first arm part is supported by the first horizontal moving part via the first vertical moving part. Such as the substrate processing apparatus of claim 1, wherein The above-mentioned substrate processing apparatus includes: The second frame, which is connected to the above-mentioned first frame; A second movable member supported by the second frame and movable relative to the second frame; A second heat treatment part, which is supported by the second movable member and heat-treats the substrate; and A second transport mechanism, which is supported by the second movable member and transports the substrate to the second heat treatment section; and As the second movable member moves relative to the second frame, the second heat treatment unit and the second conveying mechanism move integrally with respect to the second frame. Such as the substrate processing apparatus of claim 11, wherein The second frame is arranged at the same height position as the first frame, The first transport mechanism is arranged between the first heat treatment section and the second frame, The second transport mechanism is arranged between the second heat treatment section and the first frame. Such as the substrate processing apparatus of claim 12, wherein Let the direction from the second frame to the first frame be the first direction, Set the direction opposite to the above-mentioned first direction as the second direction, By the movement of the first movable member with respect to the first frame, the first heat treatment portion can move in the first direction with respect to the first frame, By the movement of the second movable member with respect to the second frame, the second heat treatment portion can move in the second direction with respect to the second frame. Such as the substrate processing apparatus of claim 13, wherein By the movement of the first movable member with respect to the first frame, the first movable member can pull at least a part of the first heat treatment portion from the first frame in the first direction, By the movement of the second movable member with respect to the second frame, the second movable member can pull at least a part of the second heat treatment portion from the second frame in the second direction. Such as the substrate processing apparatus of claim 11, wherein The second frame has the same shape as the first frame. Such as the substrate processing apparatus of claim 11, wherein The second frame may be separated from the first frame. Such as the substrate processing apparatus of claim 11, wherein The second conveying mechanism is arranged at a position symmetrical to the first conveying mechanism, The second heat treatment portion is arranged at a position that is bilaterally symmetrical to the first heat treatment portion. Such as the substrate processing apparatus of claim 1, wherein The above-mentioned substrate processing apparatus includes: The third movable member is supported by the first frame and can move relative to the first frame; A third heat treatment part, which is supported by the third movable member and heat-treats the substrate; and A third transport mechanism, which is supported by the third movable member and transports the substrate to the third heat treatment section; and The third movable member is movable relative to the first frame independently of the first movable member, As the third movable member moves relative to the first frame, the third heat treatment unit and the third conveying mechanism move integrally with respect to the first frame. Such as the substrate processing apparatus of claim 18, wherein The third heat treatment part is arranged above the first heat treatment part, The third conveying mechanism is arranged above the first conveying mechanism. Such as the substrate processing apparatus of claim 1, wherein The above-mentioned substrate processing apparatus includes: The guide part is fixed to the above-mentioned first frame; and The sliding part is fixed to the first movable member and guided by the guide part.

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