TWI732821B - Light emitting device and backlight including the light emitting device - Google Patents

Light emitting device and backlight including the light emitting device Download PDF

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TWI732821B
TWI732821B TW106104060A TW106104060A TWI732821B TW I732821 B TWI732821 B TW I732821B TW 106104060 A TW106104060 A TW 106104060A TW 106104060 A TW106104060 A TW 106104060A TW I732821 B TWI732821 B TW I732821B
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light
emitting element
emitting
emitting device
elements
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TW106104060A
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TW201803160A (en
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赤川星太郎
森川武
西垣健太郎
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日商日亞化學工業股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19107Disposition of discrete passive components off-chip wires

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Abstract

A light emitting device includes at least three light emitting elements arranged side by side, and one or more light transmissive members each containing a phosphor and covering the light emitting elements. The at least three light emitting elements include two outer light emitting elements arranged on outer sides, and an inner light emitting element arranged between the two outer light emitting elements and having a different peak emission wavelength than a peak emission wavelength of the two outer light emitting elements. The phosphor has a longer peak emission wavelength than the peak emission wavelengths of the outer light emitting elements and the peak emission wavelength of the inner light emitting element. The two outer light emitting elements and the inner light emitting element are connected in series.

Description

發光裝置及具備發光裝置之背光Light-emitting device and backlight with light-emitting device

本發明係關於一種發光裝置及具備該發光裝置之背光。The present invention relates to a light-emitting device and a backlight provided with the light-emitting device.

一般而言,使用發光二極體等發光元件之發光裝置作為如液晶顯示器之背光、LED燈泡或LED螢光燈、吸頂燈之類的照明器具等各種光源而被廣泛地利用。 例如,專利文獻1中揭示之發光裝置包括紅色螢光體、發出藍色光之發光元件、及發出綠色光之發光元件。藉此,使得作為用於液晶顯示器之背光之發光裝置可獲得較高之色再現性。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2007-158296號公報Generally speaking, light-emitting devices using light-emitting elements such as light-emitting diodes are widely used as various light sources such as backlights of liquid crystal displays, LED bulbs, LED fluorescent lamps, and ceiling lamps. For example, the light-emitting device disclosed in Patent Document 1 includes a red phosphor, a light-emitting element that emits blue light, and a light-emitting element that emits green light. As a result, a light-emitting device used as a backlight of a liquid crystal display can obtain high color reproducibility. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2007-158296

[發明所欲解決之問題] 然而,於專利文獻1所揭示之發光裝置中,與具備綠色之螢光體之發光裝置相比,自發光元件出射之光之直進性較強,因此,有產生作為發光裝置之顏色不均之虞。 因此,本發明之目的在於提供一種抑制了顏色不均之發光裝置。 [解決問題之技術手段] 本發明之發光裝置係具有並排配置之至少3個發光元件、及包含螢光體之透光性構件者,且至少3個發光元件具有:2個外側發光元件,其等配置於外側;及內側發光元件,其配置於2個外側發光元件之內側且具有與2個外側發光元件之發光峰值波長不同之發光峰值波長;且螢光體具有較外側發光元件及內側發光元件之發光峰值波長長之發光峰值波長,且2個外側發光元件與內側發光元件串聯地連接。 [發明之效果] 根據本發明,可提供一種抑制了顏色不均之發光裝置。[Problem to be Solved by the Invention] However, in the light-emitting device disclosed in Patent Document 1, compared with a light-emitting device with a green phosphor, the light emitted from the light-emitting element is more straightforward. As a light-emitting device, there is a risk of uneven color. Therefore, the object of the present invention is to provide a light-emitting device that suppresses color unevenness. [Technical Means for Solving the Problem] The light-emitting device of the present invention has at least three light-emitting elements arranged side by side and a light-transmitting member including phosphors, and at least three light-emitting elements have: 2 outer light-emitting elements, which Etc. are arranged on the outside; and the inner light-emitting element, which is arranged inside the two outer light-emitting elements and has an emission peak wavelength different from the emission peak wavelength of the two outer light-emitting elements; and the phosphor has more outer light-emitting elements and inner light-emitting The emission peak wavelength of the element is a long emission peak wavelength, and the two outer light-emitting elements and the inner light-emitting element are connected in series. [Effects of the Invention] According to the present invention, it is possible to provide a light-emitting device with suppressed color unevenness.

以下基於圖式對本發明之實施形態詳細地進行說明。再者,於以下說明中,視需要使用表示特定之方向或位置之用語(例如,「上」、「下」、及包括該等用語之其他用語),但,該等用語之使用係為了使參照圖式之發明之理解較容易,並非藉由該等用語之意思限制本發明之技術範圍。又,複數個圖式中示出之相同符號之部分表示同一或同等之部分或構件。 進而以下所示之實施形態係例示用以將本發明之技術思想具體化之發光裝置者,並非將本發明限定於以下。又,實施形態中記載之構成零件之尺寸、材質、形狀、其相對配置等只要無特定之記載,則並非係將本發明之範圍僅限於此之宗旨,而係意圖例示者。各圖式所示之構件之大小或位置關係等有時為了使理解較容易等而進行誇張。再者,顏色名稱與色度座標之關係、光之波長範圍與單色光之顏色名稱之關係等係依據JIS Z8110。 本發明之發光裝置具有並排配置之至少3個發光元件、及包含螢光體之透光性構件。至少3個發光元件具備配置於外側之2個外側發光元件、及配置於2個外側發光元件之內側之內側發光元件。而且,2個外側發光元件與內側發光元件串聯地連接。 具有此種構成之本發明之發光裝置可實現各發光元件之出射光與由發光元件之出射光激發之螢光體之出射光之優異之混色性,且可抑制發光裝置之顏色不均。 以下,對本發明之實施形態之發光裝置之詳情進行說明。 1.實施形態1 圖1A係表示發光裝置100之模式性俯視圖,圖1B係表示圖1A之Ib-Ib線剖面之模式性剖視圖。於圖1A中,省略螢光體4之記載以便可容易地辨識配置於透光性構件3內之外側發光元件P、內側發光元件Q。 於發光裝置100中,於配置於樹脂封裝2之凹部之底面之第1簧片36a之上表面並排配置有2個外側發光元件P、及1個內側發光元件Q。而且,內側發光元件Q配置於2個外側發光元件P之內側。各發光元件間之間隔較佳為相同,但亦可不同。 於本說明書中,所謂「並排配置」係指至少3個發光元件呈線狀配置,換言之,係指至少鄰接之發光元件之側面彼此之一部分對面配置。又,所謂「外側發光元件」係指並排配置之複數個發光元件中之配置於端部側之發光元件。外側發光元件P可為一個端部側具有1個,亦可為具有2個以上。於一個端部側具有2個以上外側發光元件P之情形時,2個以上之外側發光元件P發出相同之顏色之光,更具體而言,於外側發光元件P為藍色發光元件之情形時,使用各自之發光峰值波長為430 nm以上且未達490 nm之範圍之發光元件。於一個端部側配置2個以上之外側發光元件P之情形時,例如,2個以上之外側發光元件P可沿著並排配置之複數個發光元件之排列方向L配置,亦可相對於排列方向L垂直地配置。又,所謂「內側發光元件」係指被外側發光元件P夾持而配置之發光元件。內側發光元件Q只要由至少2個外側發光元件P夾持即可,不必為複數個發光元件之中心或配置於凹部之底面之中央。內側發光元件Q可為1個,亦可為2個以上。於內側發光元件Q為2個以上之情形時,2個以上之內側發光元件Q發出相同顏色之光,更具體而言,於內側發光元件Q為綠色發光元件之情形時,使用各自之發光峰值波長為490 nm以上且570 nm以下之範圍之發光元件。於具有2個以上內側發光元件Q之情形時,內側發光元件Q例如可沿著並排配置之複數個發光元件之排列方向L配置,亦可相對於排列方向L垂直地配置。 於圖1A及圖1B所示之發光裝置100中,作為外側發光元件P使用藍色發光元件(第1發光元件10b),作為內側發光元件Q使用綠色發光元件(第2發光元件20g)。 發光裝置100根據所欲獲得之光量等可具有3個以上之外側發光元件P(第1發光元件10b),又,可具有2個以上之內側發光元件Q(第2發光元件20g)。於圖1A所示之實施形態中,自左起依序並列配置有第1發光元件10b、第2發光元件20g、第1發光元件10b。又,於圖1A所示之實施形態中,使用藍色發光元件作為外側發光元件P,使用綠色發光元件作為內側發光元件Q,但並不限定於此,亦可使用綠色發光元件作為外側發光元件P,使用藍色發光元件作為內側發光元件Q。又,根據所欲獲得之發光特性,可為第1發光元件10b之個數較第2發光元件20g之個數多,可為第2發光元件20g之個數較第1發光元件10b之個數多,又,亦可為第1發光元件10b與第2發光元件20g之個數相同。於圖2之發光裝置100A中,具備2個第1發光元件10b及2個第2發光元件20g,於2個第1發光元件10b之內側配置有2個第2發光元件20g。藉由如此調整發光元件之個數,可設為具有任意之色調或光量之發光裝置。 第1發光元件10b之發光之峰值波長處於430 nm以上且未達490 nm之範圍(藍色區域之波長範圍),其中,較佳為處於440 nm以上且470 nm以下之範圍。又,第2發光元件20g之發光之峰值波長處於490 nm以上且570 nm以下之範圍(綠色區域之波長範圍),其中較佳為處於520 nm以上且550 nm以下之範圍。尤其是,第2發光元件20g較佳為使用半值寬為40 nm以下之發光元件,更佳為使用半值寬為30 nm以下之發光元件。藉此,與使用綠色螢光體獲得綠色光之情形相比,綠色光可容易地具有尖峰值。其結果,具備發光裝置100之液晶顯示裝置可達成較高之色再現性。 第1發光元件10b及第2發光元件20g分別例如與如安裝基板之配線層之外部之電路電性連接,且藉由經由該外部電路供給之電力發光。於圖1A所示之發光裝置100中,配置於一個端部側之第1發光元件10b之正電極及負電極之一者經由導線6而連接於第1簧片36a,配置於另一端部側之第1發光元件10b之正電極及負電極之一者經由導線6而與第2簧片36b連接。而且,配置於內側之第2發光元件20g經由導線6而與相鄰配置之第1發光元件10b電性連接。於圖1A所示之發光裝置100中,配置於一端部側之第1發光元件10b、配置於內側之第2發光元件20g、配置於另一端部側之第1發光元件10b依序串聯地連接。 再者,於發光裝置100中,作為支持體7使用樹脂封裝2。於本說明書中,所謂支持體係指用於配置第1發光元件10b及第2發光元件20g之構件,例如,包含用以對發光元件供給電力之導電構件之樹脂封裝或陶瓷基板等。該導電構件配置於支持體7之表面,例如,使用簧片或配線層等。 於圖1A及圖1B所示之發光裝置100中,於樹脂封裝2之凹部內配置有透光性構件3。透光性構件3例如亦可為樹脂或玻璃等。透光性構件3包含具有較外側發光元件及內側發光元件之發光峰值波長長之發光峰值波長之螢光體4。於圖1B所示之發光裝置100中,作為螢光體4使用發光峰值波長處於580 nm以上且680 nm以下之範圍之螢光體4。螢光體4吸收第1發光元件10b發出之藍色光之一部分而發出紅色光。即,螢光體4將藍色光波長轉換為具有不同之波長之紅色光。 較佳為幾乎不存在螢光體4吸收第2發光元件20g之綠色光而發出紅色光之情況。即,較佳為螢光體4實質上未將綠色光轉換為紅色光。而且,較佳為螢光體4相對於綠色光之反射率於綠色光之波長之範圍內平均為70%以上。藉由將螢光體4設為對綠色光之反射率較高之、即吸收綠色光較少之螢光體、即對綠色光進行波長轉換較少之螢光體,可使發光裝置之設計較容易。 若使用綠色光之吸收較大之紅色螢光體,則不僅第1發光元件10b,對於第2發光元件20g亦必須考慮螢光體4之波長轉換而研究發光裝置之輸出平衡。另一方面,若使用幾乎不對綠色光進行波長轉換之螢光體4,則僅考慮第1發光元件10b發出之藍色光之波長轉換即可設計發光裝置之輸出平衡。 作為此種較佳之螢光體4可列舉以下紅色螢光體。螢光體4為該等之至少1種以上。 第1種類為其組成由以下之通式(I)所表示之紅色螢光體。 A2 MF6 :Mn4+ (I) 其中,上述通式(I)中,A係選自由K、Li、Na、Rb、Cs及NH4+ 所組成之群中之至少1種元素,M係選自由第4族元素及第14族元素所組成之群中之至少1種元素。 第4族元素為鈦(Ti)、鋯(Zr)及鉿(Hf)。第14族元素為矽(Si)、鍺(Ge)、錫(Sn)及鉛(Pb)。 作為第1種類之紅色螢光體之具體例可列舉K2 SiF6 :Mn4+ 、K2 (Si,Ge)F6 :Mn4+ 、K2 TiF6 :Mn4+ 。 第2種類為其組成由3.5MgO・0.5MgF2 ・GeO2 :Mn4+ 所表示之紅色螢光體或其組成由以下通式(II)表示之紅色螢光體。 (x-a)MgO・a(Ma)O・b/2(Mb)2 O3 ・yMgF2 ・c(Mc)X2 ・(1-d-e)GeO2 ・d(Md)O2 ・e(Me)2 O3 :Mn4+ (II) 其中,上述通式(II)中,Ma為選自Ca、Sr、Ba、Zn之至少1種,Mb為選自Sc、La、Lu之至少一種,Mc為選自Ca、Sr、Ba、Zn之至少1種,X為選自F、Cl之至少1種,Md為選自Ti、Sn、Zr之至少一種,Me為選自B、Al、Ga、In之至少一種。又,對於x、y、a、b、c、d、e,為2≦x≦4、0<y≦2、0≦a≦1.5、0≦b<1、0≦c≦2、0≦d≦0.5、0≦e<1。 此種透光性構件3覆蓋第1發光元件10b之至少一部分及第2發光元件20g之至少一部分。又,透光性構件3以其至少一部分位於第1發光元件10b及第2發光元件20g之間之方式配置。較佳為透光性構件3跨於第1發光元件10b、第2發光元件20g之上而與其等接觸地配置。如圖1A及圖1B所示,第1發光元件10b之安裝於第1簧片36a或第2簧片36b之底面以外之面(即,上表面及側面)整體實質上可由透光性構件3覆蓋。同樣地,第2發光元件20g之與第1簧片36a或第2簧片36b接觸之底面以外之面(即,上表面及側面)整體實質上可由透光性構件3覆蓋。 藉由透光性構件3覆蓋第1發光元件10b,自第1發光元件10b發出之藍色光之一部分由透光性構件3中之螢光體4吸收,螢光體4發出紅色光。而且,未經螢光體4波長轉換之藍色光及螢光體4發出之紅色光通過透光性構件3且自透光性構件3之上表面(發光裝置100之光提取面)向外側出射。另一方面,自第2發光元件20g發出之綠色光之一部分由螢光體4波長轉換為紅色光,(較佳為未由螢光體4轉換為紅色光(或幾乎未轉換))而通過透光性構件3自透光性構件3之上表面向外側出射。而且,藍色光、紅色光、綠色光於透光性構件3之外側混色,例如,可獲得如白色光之所需顏色之光。 進而,自第2發光元件20g發出之綠色光之一部分較佳為波長未改變而由螢光體4散射。於此情形時,自發光裝置100出射之綠色光之強度分佈變得均一,從而可抑制顏色不均之產生。進而,例如,將透光性構件3設為密封樹脂,將覆蓋第1發光元件10b之樹脂及覆蓋第2發光元件20g之樹脂設為相同之透光性構件3就生產性之觀點而言亦較適當。 以下,對構成發光裝置100之要素之詳情進行說明。 ・發光元件 以下,例示第1發光元件10b與第2發光元件20g之較佳之配置。 如圖1A所示,可使並排配置之2個第1發光元件10b及第2發光元件20g之排列方向L與支持體7之長度方向(圖1A、圖1B之左右方向)平行。又,可使2個第1發光元件10b及第2發光元件20g之排列方向L與支持體7之發光元件載置面之長度方向平行。此處,所謂支持體7之發光元件載置面係於支持體7中載置有發光元件之面。於圖1A及圖1B中,發光元件載置面係指於凹部之底面露出之第1簧片36a之整個面。藉由設為該等配置而遍及發光裝置100整體更均一地使來自發光元件之發光分散。 於發光裝置100中,第2發光元件20g夾持於2個第1發光元件10b而配置。藉由設為此種配置,可使自第2發光元件20g出射之光與自配置於第2發光元件20g之外側之2個第1發光元件10b出射之光容易混色,因此,其結果,可進一步抑制顏色不均之產生。第1發光元件10b及第2發光元件20g之對向之側面彼此之距離較佳為10 μm~300 μm,更佳為50 μm~150 μm。藉此,可將第1發光元件10b與第2發光元件20g靠近配置,因此,可使發光裝置之混色性進一步提昇。 於發光裝置100中,配置於左側之第1發光元件10b與第2發光元件20g之發光元件間之距離和配置於右側之第1發光元件10b與第2發光元件20g之發光元件間之距離設定為大致相等。於第1發光元件10b及第2發光元件20g之各者設置複數個之情形時,較佳為各發光元件等間隔地配置。進而,較佳為複數個發光元件相對於對於排列方向L垂直之中心線C線對稱地配置。於圖1A中所示之發光裝置100中,2個第1發光元件10b及第2發光元件20g相對於中心線C線對稱地配置。藉由將包含第1發光元件10b及第2發光元件20g之複數個發光元件相對於中心線C線對稱地配置,各發光元件間之距離以變為相等之方式配置,且複數個發光元件之俯視下之發光面之面積左右相等。藉由設為該等配置,可抑制發光裝置之顏色不均之產生。 再者,於根據用途而具有發光裝置之理想之配光之情形時,各發光元件間之距離亦可不同。 又,包含2個第1發光元件10b及第2發光元件20g之至少3個發光元件並排配置於1行,可將此種行設置複數行。即,可為包含2個第1發光元件10b及第2發光元件20g之至少3個發光元件整齊排列於1條直線上,另一包含2個第1發光元件10b及第2發光元件20g之至少3個發光元件整齊排列於另一條直線上。 以上所述之較佳之配置可相互組合。 第1發光元件10b及第2發光元件20g可為藉由施加電壓而自發光之例如如發光二極體(LED)般之半導體元件。作為各發光元件中使用之半導體可使用氮化物系半導體(InX AlY Ga1-X-Y N、0≦X、0≦Y、X+Y≦1)等。即,第1發光元件10b及第2發光元件20g可為氮化物半導體元件。第1發光元件10b及第2發光元件20g之平面形狀可為正方形亦可為長方形,或者亦可將其等組合而配置複數個。可配合支持體7之形狀或大小適當選擇發光元件之個數或形狀。 作為發光元件之形狀之一例,如圖3A及圖3B所示,第1發光元件10b及第2發光元件20g之平面形狀亦可為三角形或六邊形。於圖3A所示之發光裝置100B中,第1發光元件10b之與第2發光元件20g對向之側面和第2發光元件20g之與第1發光元件10b對向之側面以成為平行之方式配置。換言之,第1發光元件10b及第2發光元件20g以由b1、b2、g1及g2形成之第1發光元件10b與第2發光元件20g之間之區域成為大致平行四邊形之方式配置。又,於圖3B所示之發光裝置100C中,亦為第1發光元件10b之與第2發光元件20g對向之側面和第2發光元件20g之與第1發光元件10b對向之側面以成為平行之方式配置。藉由使用此種發光元件,可增大發光元件占支持體7之發光元件載置面之比率,因此,可設為光提取良好之發光裝置。 第1發光元件10b之光輸出與第2發光元件20g之光輸出亦可相同。又,根據色再現性等所欲獲得之特性,第1發光元件10b之光輸出亦可與第2發光元件20g之光輸出不同。作為獲得優異之色再現性之1個實施形態,可將第2發光元件20g之光輸出相對於第1發光元件10b之光輸出之比設為0.3以上且0.7以下。又,可將所使用之所有第2發光元件20g之光輸出之總和相對於所使用之所有第1發光元件10b之光輸出之總和之比設為0.2以上且0.6以下。 本說明書中之所謂「光輸出」係JIS Z 8113之放射束。又,發光元件之光輸出之比可利用分光光度計測定發光光譜,並根據藍色發光元件與綠色光元件之發光光譜之積分值之比算出。發光元件之光輸出係根據發光元件之發光峰值波長、發光元件之平面面積、或發光元件所具有之半導體積層體之種類等決定。 又,於圖1B所示之發光裝置100中,第2發光元件20g之上表面以較第1發光元件10b之上表面成為上側之方式配置。即,第2發光元件20g之上表面較第1發光元件10b之上表面更配置於發光裝置100之光提取面(透光性構件3之上表面)之附近。第1發光元件10b之上表面與第2發光元件20g之高低差例如為50 μm~150 μm,較佳為100 μm~120 μm。藉由進行此種配置,例如,即便於第2發光元件20g之光輸出較第1發光元件10b之光輸出低某種程度之情形時,亦可獲得優異之色再現性。再者,並不限定於此,亦能以第2發光元件20g之上表面較第1發光元件10b之上表面成為下側之方式配置,第1發光元件10b之上表面與第2發光元件20g之上表面亦可處於相同高度之位置。 ・透光性構件 透光性構件3由樹脂或玻璃材料等任意之材料形成,且包含螢光體4。於利用樹脂形成透光性構件3之情形時,可使用任意之樹脂。又,可使透光性構件3含有TiO2 或SiO2 等擴散材。藉此,可使第1發光元件10b、第2發光元件20g及螢光體4發出之光充分地擴散。 作為此種較佳之樹脂,可例示矽酮系樹脂、環氧系樹脂等。將此種樹脂設為熔融狀態並使螢光體4混合及分散之後,將該螢光體4分散之樹脂填充於樹脂封裝2之凹部,使樹脂硬化,藉此可形成透光性構件3。 ・支持體 作為支持體7之一形態之樹脂封裝2可由任意之樹脂形成。作為樹脂可使用熱固性樹脂、熱塑性樹脂等,作為較佳之樹脂,可例示尼龍系樹脂、環氧系樹脂及矽酮系樹脂、不飽和聚酯等聚酯系樹脂。 亦可視需要於樹脂封裝2之凹部之表面例如配置如鍍銀(Ag)等金屬之反射材料或於凹部之表面形成反射率較高之構件。藉此,可提高凹部之表面之光之反射率,且可藉由將到達至凹部之表面之光更多地反射至出射方向而進一步提高發光裝置100之效率。 亦可代替具有凹部之樹脂封裝而設為於例如包含陶瓷、樹脂、介電體、玻璃或其等之複合材料之絕緣基板之表面配置有連接端子之支持體。亦可於該支持體配置第1發光元件10b及第2發光元件20g,例如藉由灌注以被覆第1發光元件10b及第2發光元件20g之方式形成包含螢光體4之透光性構件3。 又,作為不使用支持體之發光裝置100之變化例,可例示如圖4A及圖4B所示之發光裝置100D。於圖4A及圖4B所示之發光裝置100D中,具備2個第1發光元件10b及第2發光元件20g、設置於各發光元件之側面側之第1透光性構件12、及覆蓋第1透光性構件12之外表面之被覆構件13。而且,發光裝置100D可具備於作為發光面發揮功能之上表面側含有螢光體4之第2透光性構件15或第3透光性構件16。較佳為第1透光性構件12、第2透光性構件15、及第3透光性構件16使用光之透過率較高之構件,第1透光性構件12及第3透光性構件16為了使來自發光元件之光高效率地透過而不具備光擴散材等。 圖4B中所示之第1發光元件10b包含透光性基板27、半導體積層體28、及一對電極251、252,將透光性基板27配置於第1發光元件10b之上表面側,將半導體積層體28配置於第1發光元件10b之下表面側。而且,第1發光元件10b之一對電極251、252自被覆構件13露出且露出至發光裝置100D之下表面。第2發光元件20g亦同樣。 被覆構件13覆蓋設置於各發光元件之側面之第1透光性構件12之外表面、及各發光元件之側面之露出部分。被覆構件13係由熱膨脹率之大小關係中與第1透光性構件12及各發光元件滿足特定之關係之材料形成。具體而言,以於對第1透光性構件12與各發光元件之熱膨脹率差(將其稱為「第1熱膨脹率差ΔT30」)和被覆構件13與各發光元件之熱膨脹率差(將其稱為「第2熱膨脹率差ΔT40」)進行比較時成為ΔT40<ΔT30之方式選擇被覆構件13之材料。藉此,可抑制第1透光性構件12自各發光元件剝離。 作為可用於被覆構件13之樹脂材料特佳為矽酮樹脂、矽酮改性樹脂、環氧樹脂、酚樹脂等熱固性之透光性樹脂。又,被覆構件13可由光反射性樹脂形成。所謂光反射性樹脂係指相對於來自發光元件之光之反射率為70%以上之樹脂材料。到達至被覆構件13之光被反射而朝向發光裝置100D之上表面側(發光面側),藉此,可提高發光裝置100D之光取出效率。 第1透光性構件12覆蓋各發光元件之側面,將自其側面出射之光導光至發光裝置100D之上表面方向。亦即,第1透光性構件12係用於在到達至各發光元件之側面之光於該側面被反射而於發光元件內衰減之前將該光通過第1透光性構件12提取至發光元件之外側之構件。第1透光性構件12可使用於發光裝置100中例示之構件,尤其較佳為矽酮樹脂、矽酮改性樹脂、環氧樹脂、酚樹脂等熱固性之透光性樹脂。第2透光性構件15及第3透光性構件16亦可使用第1透光性構件12中例示之構件。第1透光性構件12由於與發光元件之側面接觸,故而容易受到於點亮時於發光元件中產生之熱之影響。熱固性樹脂由於耐熱性優異,故而適於第1透光性構件12。再者,較佳為第1透光性構件12之光之透過率較高。因此,通常較佳為第1透光性構件12中未添加將光反射、吸收或散射之添加物。然而,亦存在為了賦予較理想之特性較佳為於第1透光性構件12添加添加物之情況。例如,為了調整第1透光性構件12之折射率,或為了調整硬化前之第1透光性構件12之黏度,亦可添加各種填料。 於圖4A及圖4B所示之發光裝置100D中,於第1發光元件10b之作為發光面發揮功能之上表面側配置有含有螢光體4之第2透光性構件15,於第2發光元件20g之作為發光面發揮功能之上表面側配置有第3透光性構件16。較佳為配置於第2發光元件20g之上表面側之第3透光性構件16未添加將自第2發光元件20g發出之光反射、吸收或散射之添加物。藉由設為此種配置,自第1發光元件10b、第2發光元件20g、及螢光體4發出之光被混色,例如,可獲得如白色光之所需之顏色之光。又,如圖4B所示,第1發光元件10b與第2發光元件20g由利用濺鍍等形成之金屬膜14串聯地連接。藉由設置此種金屬膜14,可將來自發光元件之熱高效率地釋出至外部。 發光裝置100可藉由以下製造方法製造。 於模具內配置第1簧片36a及第2簧片36b之後,將樹脂填充於模具內,一體地形成樹脂部、第1簧片36a、及第2簧片36b,而獲得樹脂封裝2。於樹脂封裝2之凹部之底面露出之第1簧片36a配置2個第1發光元件10b及第2發光元件20g。其後,如圖1A所示,利用導線6,將第1簧片36a與配置於左側之第1發光元件10b、第1發光元件10b與第2發光元件20g、及第2發光元件20g與配置於右側之第1發光元件10b、及第1發光元件10b與第2簧片36b分別連接。 其次,將包含螢光體4之熔融狀態之樹脂以至少一部分與第1發光元件10b及第2發光元件20g接觸之方式向樹脂封裝2之凹部內填充,使螢光體4沈澱之後,使樹脂硬化,藉此形成透光性構件3。 再者,以上所說明之發光裝置100係將發光裝置之上表面設為光提取面將下表面設為安裝面之稱為頂視型之發光裝置。然而,並不限定於此,本發明之發光裝置亦包含將與光提取面鄰接之面設為安裝面且於與安裝面平行之方向發出光之被稱為所謂側視型之發光裝置。 2.實施形態2 圖5A及圖5B係表示實施形態2之背光200之模式性俯視圖。背光200如以下所說明般包含發光裝置100。然而,以下之說明中所使用之發光裝置100亦可置換為發光裝置100A至100D。 背光200具有殼體21、配置於殼體21內之導光板22、及配置於殼體21內並且朝向導光板22發出光之發光裝置100。背光200將來自發光裝置100之光經由導光板22而例如將光照射至液晶面板等所需之裝置。 殼體21能以其內表面反射光之方式形成。例如,可將內表面設為白色。 將導光板22之4個側面之至少1個用作入射面(入光部)。於圖5A所示之實施形態中,將位於下方之側面設為入射面。發光裝置100以其光提取面與入射面對向之方式配置。較佳為發光裝置100沿著入射面配置有複數個。自發光裝置100發出之光自入射面進入至導光板22之內部。於使用複數個發光裝置100之情形時,自不同之發光裝置100發出之光於導光板22之內部被混合。 導光板22之上表面成為出射面。藉由於出射面上例如配置液晶面板等所需之裝置,自導光板22發出之光朝向該等裝置前進。 可使發光裝置100之光提取面與導光板22之入光部(入射面)之長度方向一致而配置。可藉由將發光裝置100之光提取面之長度方向與導光板之入光面之長度方向設為平行而以更高之效率將發光裝置100之光導入至導光板22。 圖5B係表示實施形態2之背光200之變化例之模式性剖視圖。背光200亦可為如圖5B所示般於導光板22之正下方配置有複數個發光裝置100之所謂正下型之背光裝置。 [產業上之可利用性] 本發明之發光裝置例如可用作液晶顯示器之背光。Hereinafter, the embodiments of the present invention will be described in detail based on the drawings. Furthermore, in the following description, terms that indicate a specific direction or position (for example, "up", "down", and other terms including these terms) are used as necessary, but these terms are used to make It is easier to understand the invention with reference to the drawings, and the technical scope of the invention is not limited by the meaning of these terms. In addition, the parts with the same symbols shown in the plural drawings indicate the same or equivalent parts or components. Furthermore, the embodiment shown below is an example of a light-emitting device for embodying the technical idea of the present invention, and does not limit the present invention to the following. In addition, the dimensions, materials, shapes, and relative arrangements of the components described in the embodiments are not intended to limit the scope of the present invention to the purpose of these, but are intended to be illustrative, as long as there is no specific description. The size or positional relationship of the components shown in the drawings are sometimes exaggerated in order to make it easier to understand. Furthermore, the relationship between color names and chromaticity coordinates, the relationship between the wavelength range of light and the color names of monochromatic light, etc. are based on JIS Z8110. The light-emitting device of the present invention has at least three light-emitting elements arranged side by side, and a translucent member including a phosphor. At least three light-emitting elements include two outer light-emitting elements arranged on the outside and an inner light-emitting element arranged on the inner side of the two outer light-emitting elements. Furthermore, the two outer light-emitting elements and the inner light-emitting element are connected in series. The light-emitting device of the present invention having such a configuration can achieve excellent color mixing between the emitted light of each light-emitting element and the emitted light of the phosphor excited by the emitted light of the light-emitting element, and can suppress the color unevenness of the light-emitting device. Hereinafter, the details of the light-emitting device according to the embodiment of the present invention will be described. 1. Embodiment 1 FIG. 1A is a schematic plan view of the light-emitting device 100, and FIG. 1B is a schematic cross-sectional view taken along the line Ib-Ib of FIG. 1A. In FIG. 1A, the description of the phosphor 4 is omitted so that the outer light emitting element P and the inner light emitting element Q arranged in the translucent member 3 can be easily recognized. In the light-emitting device 100, two outer light-emitting elements P and one inner light-emitting element Q are arranged side by side on the upper surface of the first spring 36a arranged on the bottom surface of the recess of the resin package 2. In addition, the inner light-emitting element Q is arranged inside the two outer light-emitting elements P. The interval between the light-emitting elements is preferably the same, but may be different. In this specification, the term “side-by-side arrangement” means that at least three light-emitting elements are arranged in a line shape. In other words, it means that at least a part of the side surfaces of adjacent light-emitting elements are arranged opposite to each other. In addition, the term "outside light-emitting element" refers to a light-emitting element arranged on the end side among a plurality of light-emitting elements arranged side by side. The outer light-emitting element P may have one on one end side, or may have two or more. When there are two or more outer light-emitting elements P on one end side, the two or more outer light-emitting elements P emit light of the same color, more specifically, when the outer light-emitting element P is a blue light-emitting element , Use light-emitting elements whose peak wavelength is above 430 nm and less than 490 nm. When two or more outer light-emitting elements P are arranged on one end side, for example, the two or more outer light-emitting elements P may be arranged along the arrangement direction L of a plurality of light-emitting elements arranged side by side, or may be opposite to the arrangement direction L is arranged vertically. In addition, the "inner light-emitting element" refers to a light-emitting element that is sandwiched by the outer light-emitting element P and arranged. The inner light-emitting element Q only needs to be sandwiched by at least two outer light-emitting elements P, and it does not need to be the center of a plurality of light-emitting elements or be arranged in the center of the bottom surface of the recess. There may be one inner light-emitting element Q, or two or more. When there are two or more inner light-emitting elements Q, the two or more inner light-emitting elements Q emit light of the same color. More specifically, when the inner light-emitting element Q is a green light-emitting element, the respective emission peaks are used A light-emitting element with a wavelength in the range of 490 nm or more and 570 nm or less. When there are two or more inner light-emitting elements Q, the inner light-emitting element Q may be arranged along the arrangement direction L of a plurality of light-emitting elements arranged side by side, or may be arranged perpendicular to the arrangement direction L, for example. In the light-emitting device 100 shown in FIGS. 1A and 1B, a blue light-emitting element (first light-emitting element 10b) is used as the outer light-emitting element P, and a green light-emitting element (second light-emitting element 20g) is used as the inner light-emitting element Q. The light-emitting device 100 may have three or more outer light-emitting elements P (first light-emitting element 10b) according to the amount of light to be obtained, and may have two or more inner light-emitting elements Q (second light-emitting element 20g). In the embodiment shown in FIG. 1A, the first light-emitting element 10b, the second light-emitting element 20g, and the first light-emitting element 10b are arranged side by side in this order from the left. Furthermore, in the embodiment shown in FIG. 1A, a blue light-emitting element is used as the outer light-emitting element P, and a green light-emitting element is used as the inner light-emitting element Q. However, it is not limited to this, and a green light-emitting element may be used as the outer light-emitting element. P, a blue light-emitting element is used as the inner light-emitting element Q. Also, according to the desired light-emitting characteristics, the number of first light-emitting elements 10b may be greater than the number of second light-emitting elements 20g, and the number of second light-emitting elements 20g may be greater than the number of first light-emitting elements 10b. There are many, and the number of the first light-emitting elements 10b and the second light-emitting elements 20g may be the same. In the light-emitting device 100A of FIG. 2, two first light-emitting elements 10b and two second light-emitting elements 20g are provided, and two second light-emitting elements 20g are arranged inside the two first light-emitting elements 10b. By adjusting the number of light-emitting elements in this way, a light-emitting device with any color tone or light quantity can be set. The peak wavelength of light emitted by the first light-emitting element 10b is in the range of 430 nm or more and less than 490 nm (the wavelength range of the blue region), and among them, it is preferably in the range of 440 nm or more and 470 nm or less. In addition, the peak wavelength of the light emitted by the second light-emitting element 20g is in the range of 490 nm or more and 570 nm or less (wavelength range of the green region), and it is preferably in the range of 520 nm or more and 550 nm or less. In particular, the second light-emitting element 20g is preferably a light-emitting element having a half-value width of 40 nm or less, and more preferably a light-emitting element having a half-value width of 30 nm or less. Thereby, compared with the case where green light is obtained by using a green phosphor, the green light can easily have a sharp peak. As a result, the liquid crystal display device provided with the light-emitting device 100 can achieve high color reproducibility. The first light-emitting element 10b and the second light-emitting element 20g are respectively electrically connected to an external circuit such as a wiring layer of the mounting substrate, and emit light by power supplied through the external circuit. In the light-emitting device 100 shown in FIG. 1A, one of the positive electrode and the negative electrode of the first light-emitting element 10b arranged on one end side is connected to the first spring 36a via a wire 6, and is arranged on the other end side One of the positive electrode and the negative electrode of the first light-emitting element 10b is connected to the second spring 36b via the wire 6. Furthermore, the second light-emitting element 20g arranged on the inner side is electrically connected to the first light-emitting element 10b arranged adjacently via the wire 6. In the light-emitting device 100 shown in FIG. 1A, the first light-emitting element 10b arranged on one end side, the second light-emitting element 20g arranged on the inner side, and the first light-emitting element 10b arranged on the other end side are sequentially connected in series. . Furthermore, in the light-emitting device 100, the resin package 2 is used as the support body 7. In this specification, the so-called support system refers to a member for arranging the first light-emitting element 10b and the second light-emitting element 20g, for example, a resin package or ceramic substrate including a conductive member for supplying power to the light-emitting element. The conductive member is arranged on the surface of the support body 7, and for example, a reed or a wiring layer is used. In the light-emitting device 100 shown in FIGS. 1A and 1B, a translucent member 3 is arranged in the recess of the resin package 2. The translucent member 3 may be resin, glass, or the like, for example. The light-transmitting member 3 includes a phosphor 4 having an emission peak wavelength longer than the emission peak wavelength of the outer light-emitting element and the inner light-emitting element. In the light-emitting device 100 shown in FIG. 1B, as the phosphor 4, a phosphor 4 having an emission peak wavelength in the range of 580 nm or more and 680 nm or less is used. The phosphor 4 absorbs a part of the blue light emitted by the first light-emitting element 10b and emits red light. That is, the phosphor 4 converts the wavelength of blue light into red light having a different wavelength. It is preferable that the phosphor 4 absorbs the green light of the second light-emitting element 20g and emits red light. That is, it is preferable that the phosphor 4 does not substantially convert green light into red light. Moreover, it is preferable that the reflectance of the phosphor 4 with respect to the green light is 70% or more on average in the range of the wavelength of the green light. By setting the phosphor 4 to have a higher reflectivity to green light, that is, a phosphor that absorbs less green light, that is, a phosphor that performs less wavelength conversion on green light, so that the design of the light-emitting device can be achieved. Easier. If a red phosphor with a large absorption of green light is used, not only the first light-emitting element 10b, but also the second light-emitting element 20g must consider the wavelength conversion of the phosphor 4 to study the output balance of the light-emitting device. On the other hand, if the phosphor 4 that hardly converts the wavelength of green light is used, the output balance of the light-emitting device can be designed by considering only the wavelength conversion of the blue light emitted by the first light-emitting element 10b. As such a preferable phosphor 4, the following red phosphors can be cited. The phosphor 4 is at least one of these. The first type is a red phosphor whose composition is represented by the following general formula (I). A 2 MF 6 : Mn 4+ (I) where, in the above general formula (I), A is selected from at least one element selected from the group consisting of K, Li, Na, Rb, Cs and NH 4+, M At least one element selected from the group consisting of group 4 elements and group 14 elements. Group 4 elements are titanium (Ti), zirconium (Zr) and hafnium (Hf). Group 14 elements are silicon (Si), germanium (Ge), tin (Sn) and lead (Pb). Specific examples of the first type of red phosphor include K 2 SiF 6 : Mn 4+ , K 2 (Si,Ge)F 6 : Mn 4+ , and K 2 TiF 6 : Mn 4+ . The second type is a red phosphor whose composition is represented by 3.5MgO·0.5MgF 2 ·GeO 2 : Mn 4+ or a red phosphor whose composition is represented by the following general formula (II). (x-a)MgO・a(Ma)O・b/2(Mb) 2 O 3・yMgF 2・c(Mc)X 2・(1-d-e)GeO 2・d(Md)O 2・e(Me) 2 O 3 : Mn 4+ (II) where, in the above general formula (II), Ma is at least one selected from Ca, Sr, Ba, and Zn, and Mb is selected from Sc, La, Lu At least one, Mc is at least one selected from Ca, Sr, Ba, Zn, X is at least one selected from F, Cl, Md is at least one selected from Ti, Sn, Zr, Me is selected from B, At least one of Al, Ga, and In. Also, for x, y, a, b, c, d, e, 2≦x≦4, 0<y≦2, 0≦a≦1.5, 0≦b<1, 0≦c≦2, 0≦ d≦0.5, 0≦e<1. Such a light-transmitting member 3 covers at least a part of the first light-emitting element 10b and at least a part of the second light-emitting element 20g. In addition, the light-transmitting member 3 is arranged such that at least a part thereof is located between the first light-emitting element 10b and the second light-emitting element 20g. It is preferable that the light-transmitting member 3 straddles the first light-emitting element 10b, the second light-emitting element 20g and is arranged in contact with the first light-emitting element 10b and the second light-emitting element 20g. 1A and 1B, the first light emitting element 10b is mounted on the surface other than the bottom surface of the first reed 36a or the second reed 36b (that is, the upper surface and the side surface) as a whole can be substantially formed by the light-transmitting member 3. cover. Similarly, the entire surface of the second light emitting element 20g other than the bottom surface (that is, the upper surface and the side surface) contacting the first reed 36a or the second reed 36b can be substantially covered by the light-transmitting member 3. By covering the first light-emitting element 10b with the light-transmitting member 3, a part of the blue light emitted from the first light-emitting element 10b is absorbed by the phosphor 4 in the light-transmitting member 3, and the phosphor 4 emits red light. Furthermore, the blue light that has not been wavelength-converted by the phosphor 4 and the red light emitted by the phosphor 4 pass through the translucent member 3 and exit from the upper surface of the translucent member 3 (the light extraction surface of the light-emitting device 100) to the outside. . On the other hand, a part of the green light emitted from the second light-emitting element 20g is wavelength-converted by the phosphor 4 into red light, (preferably, it is not converted into red light (or hardly converted) by the phosphor 4) and passes through The light-transmitting member 3 emits outward from the upper surface of the light-transmitting member 3. In addition, blue light, red light, and green light are mixed on the outer side of the translucent member 3, for example, light of a desired color such as white light can be obtained. Furthermore, a part of the green light emitted from the second light-emitting element 20g is preferably scattered by the phosphor 4 without changing the wavelength. In this case, the intensity distribution of the green light emitted from the light-emitting device 100 becomes uniform, so that the occurrence of color unevenness can be suppressed. Furthermore, for example, the translucent member 3 is made of a sealing resin, and the resin covering the first light-emitting element 10b and the resin covering the second light-emitting element 20g are the same translucent member 3 from the viewpoint of productivity. More appropriate. Hereinafter, the details of the elements constituting the light-emitting device 100 will be described.・Light-emitting element Hereinafter, a preferable arrangement of the first light-emitting element 10b and the second light-emitting element 20g is illustrated. As shown in FIG. 1A, the arrangement direction L of the two first light-emitting elements 10b and second light-emitting elements 20g arranged side by side can be parallel to the longitudinal direction of the support 7 (the left-right direction in FIGS. 1A and 1B). In addition, the arrangement direction L of the two first light-emitting elements 10b and the second light-emitting element 20g can be made parallel to the longitudinal direction of the light-emitting element placement surface of the support 7. Here, the so-called light-emitting element mounting surface of the support 7 is the surface on which the light-emitting element is mounted in the support 7. In FIGS. 1A and 1B, the light-emitting element mounting surface refers to the entire surface of the first spring 36a exposed on the bottom surface of the recess. By providing these configurations, the light emitted from the light-emitting element can be more uniformly dispersed throughout the entire light-emitting device 100. In the light-emitting device 100, the second light-emitting element 20g is sandwiched between the two first light-emitting elements 10b and arranged. With this arrangement, the light emitted from the second light-emitting element 20g can be easily mixed with the light emitted from the two first light-emitting elements 10b arranged outside the second light-emitting element 20g. Therefore, as a result, the color can be easily mixed. Further suppress the occurrence of uneven color. The distance between the opposing side surfaces of the first light-emitting element 10b and the second light-emitting element 20g is preferably 10 μm to 300 μm, and more preferably 50 μm to 150 μm. Thereby, the first light-emitting element 10b and the second light-emitting element 20g can be arranged close to each other, and therefore, the color mixing property of the light-emitting device can be further improved. In the light-emitting device 100, the distance between the light-emitting elements of the first light-emitting element 10b and the second light-emitting element 20g arranged on the left and the distance between the light-emitting elements of the first light-emitting element 10b and the second light-emitting element 20g arranged on the right are set Are roughly equal. When a plurality of each of the first light-emitting element 10b and the second light-emitting element 20g is provided, it is preferable that the light-emitting elements are arranged at equal intervals. Furthermore, it is preferable that the plurality of light-emitting elements are arranged symmetrically with respect to the center line C perpendicular to the arrangement direction L. In the light-emitting device 100 shown in FIG. 1A, the two first light-emitting elements 10b and the second light-emitting elements 20g are arranged symmetrically with respect to the center line C. By arranging a plurality of light-emitting elements including the first light-emitting element 10b and the second light-emitting element 20g symmetrically with respect to the center line C, the distance between the light-emitting elements becomes equal, and the number of light-emitting elements The area of the light-emitting surface in the top view is equal to the left and right. With these configurations, the color unevenness of the light-emitting device can be suppressed. Furthermore, when the light-emitting device has an ideal light distribution according to the application, the distance between the light-emitting elements can also be different. In addition, at least three light-emitting elements including two first light-emitting elements 10b and second light-emitting elements 20g are arranged side by side in one row, and such rows can be arranged in plural rows. That is, at least three light-emitting elements including two first light-emitting elements 10b and second light-emitting elements 20g may be neatly arranged on a straight line, and at least three light-emitting elements including two first light-emitting elements 10b and second light-emitting elements 20g The three light-emitting elements are neatly arranged on another straight line. The above-mentioned preferred configurations can be combined with each other. The first light-emitting element 10b and the second light-emitting element 20g may be semiconductor elements such as light-emitting diodes (LEDs) that emit light by applying a voltage. As the semiconductor used in each light-emitting element, a nitride-based semiconductor (In X Al Y Ga 1-XY N, 0≦X, 0≦Y, X+Y≦1) or the like can be used. That is, the first light-emitting element 10b and the second light-emitting element 20g may be nitride semiconductor elements. The planar shape of the first light-emitting element 10b and the second light-emitting element 20g may be a square or a rectangle, or they may be combined to arrange a plurality of them. The number or shape of the light-emitting elements can be appropriately selected according to the shape or size of the support 7. As an example of the shape of the light-emitting element, as shown in FIGS. 3A and 3B, the planar shape of the first light-emitting element 10b and the second light-emitting element 20g may be a triangle or a hexagon. In the light-emitting device 100B shown in FIG. 3A, the side surface of the first light-emitting element 10b opposite to the second light-emitting element 20g and the side surface of the second light-emitting element 20g opposite to the first light-emitting element 10b are arranged in parallel. . In other words, the first light-emitting element 10b and the second light-emitting element 20g are arranged such that the area between the first light-emitting element 10b and the second light-emitting element 20g formed by b1, b2, g1, and g2 becomes a substantially parallelogram. In addition, in the light-emitting device 100C shown in FIG. 3B, the side surface of the first light-emitting element 10b opposite to the second light-emitting element 20g and the side surface of the second light-emitting element 20g opposite to the first light-emitting element 10b become Parallel configuration. By using such a light-emitting element, the ratio of the light-emitting element to the light-emitting element mounting surface of the support 7 can be increased, and therefore, a light-emitting device with good light extraction can be set. The light output of the first light-emitting element 10b and the light output of the second light-emitting element 20g may be the same. In addition, the light output of the first light-emitting element 10b may be different from the light output of the second light-emitting element 20g according to desired characteristics such as color reproducibility. As one embodiment for obtaining excellent color reproducibility, the ratio of the light output of the second light-emitting element 20g to the light output of the first light-emitting element 10b can be set to 0.3 or more and 0.7 or less. In addition, the ratio of the total light output of all the second light-emitting elements 20g to the total light output of all the first light-emitting elements 10b used can be set to 0.2 or more and 0.6 or less. The so-called "light output" in this manual refers to the radiation beam of JIS Z 8113. In addition, the ratio of the light output of the light-emitting element can be calculated from the ratio of the integrated value of the light-emitting spectra of the blue light-emitting element and the green light-emitting element by measuring the emission spectrum with a spectrophotometer. The light output of the light-emitting element is determined according to the peak wavelength of the light-emitting element, the planar area of the light-emitting element, or the type of semiconductor laminate that the light-emitting element has. In addition, in the light-emitting device 100 shown in FIG. 1B, the upper surface of the second light-emitting element 20g is arranged so as to be higher than the upper surface of the first light-emitting element 10b. That is, the upper surface of the second light-emitting element 20g is arranged in the vicinity of the light extraction surface (the upper surface of the translucent member 3) of the light-emitting device 100 than the upper surface of the first light-emitting element 10b. The height difference between the upper surface of the first light-emitting element 10b and the second light-emitting element 20g is, for example, 50 μm to 150 μm, preferably 100 μm to 120 μm. With this arrangement, for example, even when the light output of the second light emitting element 20g is lower than the light output of the first light emitting element 10b to a certain extent, excellent color reproducibility can be obtained. Furthermore, it is not limited to this, and the upper surface of the second light-emitting element 20g may be arranged on the lower side than the upper surface of the first light-emitting element 10b. The upper surface of the first light-emitting element 10b and the second light-emitting element 20g The upper surface can also be at the same height.・Light-transmitting member The light-transmitting member 3 is formed of any material such as resin or glass material, and includes the phosphor 4. When the translucent member 3 is formed of resin, any resin can be used. In addition, the light-transmitting member 3 may contain a diffusion material such as TiO 2 or SiO 2. Thereby, the light emitted by the first light-emitting element 10b, the second light-emitting element 20g, and the phosphor 4 can be sufficiently diffused. As such preferable resins, silicone resins, epoxy resins, etc. can be exemplified. After the resin is brought into a molten state and the phosphor 4 is mixed and dispersed, the resin in which the phosphor 4 is dispersed is filled in the recess of the resin package 2 to harden the resin, thereby forming the translucent member 3.・Resin package 2 in which the support is one form of the support 7 can be formed of any resin. As the resin, thermosetting resins, thermoplastic resins, etc. can be used, and preferred resins include polyester resins such as nylon resins, epoxy resins, silicone resins, and unsaturated polyesters. It is also possible to arrange a reflective material such as silver (Ag) plating on the surface of the recessed portion of the resin package 2 or form a member with higher reflectivity on the surface of the recessed portion. Thereby, the reflectivity of the light on the surface of the recess can be improved, and the efficiency of the light emitting device 100 can be further improved by reflecting the light reaching the surface of the recess to the exit direction more. Instead of the resin package with the recessed portion, it may be provided as a support with connection terminals arranged on the surface of an insulating substrate containing ceramics, resins, dielectrics, glass, or composite materials such as ceramics, resins, dielectrics, and glass. It is also possible to arrange the first light-emitting element 10b and the second light-emitting element 20g on the support, for example, by pouring to cover the first light-emitting element 10b and the second light-emitting element 20g to form the translucent member 3 including the phosphor 4 . In addition, as a modified example of the light-emitting device 100 that does not use a support, the light-emitting device 100D shown in FIGS. 4A and 4B can be exemplified. In the light-emitting device 100D shown in FIGS. 4A and 4B, two first light-emitting elements 10b and second light-emitting elements 20g, a first light-transmitting member 12 provided on the side surface of each light-emitting element, and a cover The covering member 13 on the outer surface of the translucent member 12. Furthermore, the light-emitting device 100D may be provided with the second light-transmitting member 15 or the third light-transmitting member 16 containing the phosphor 4 on the upper surface side which functions as a light-emitting surface. It is preferable that the first light-transmitting member 12, the second light-transmitting member 15, and the third light-transmitting member 16 use a member having a high light transmittance, and the first light-transmitting member 12 and the third light-transmitting member The member 16 does not include a light diffusing material or the like in order to efficiently transmit the light from the light emitting element. The first light-emitting element 10b shown in FIG. 4B includes a light-transmitting substrate 27, a semiconductor laminate 28, and a pair of electrodes 251, 252. The light-transmitting substrate 27 is arranged on the upper surface side of the first light-emitting element 10b, and The semiconductor laminate 28 is arranged on the lower surface side of the first light emitting element 10b. Furthermore, one of the pair of electrodes 251 and 252 of the first light-emitting element 10b is exposed from the covering member 13 and is exposed to the lower surface of the light-emitting device 100D. The same applies to the second light-emitting element 20g. The covering member 13 covers the outer surface of the first light-transmitting member 12 provided on the side surface of each light-emitting element and the exposed portion of the side surface of each light-emitting element. The covering member 13 is formed of a material that satisfies a specific relationship with the first light-transmitting member 12 and each light-emitting element in the magnitude relationship of the thermal expansion coefficient. Specifically, the difference in thermal expansion coefficient between the first translucent member 12 and each light-emitting element (referred to as the "first thermal expansion coefficient difference ΔT30") and the difference in thermal expansion coefficient between the covering member 13 and each light-emitting element (referring to This is referred to as "the second thermal expansion coefficient difference ΔT40") The material of the covering member 13 is selected so that ΔT40<ΔT30 for comparison. Thereby, it can suppress that the 1st translucent member 12 peels from each light-emitting element. The resin material that can be used for the covering member 13 is particularly preferably thermosetting and translucent resins such as silicone resin, silicone modified resin, epoxy resin, and phenol resin. In addition, the covering member 13 may be formed of a light reflective resin. The so-called light-reflective resin refers to a resin material with a reflectance of 70% or more with respect to the light from the light-emitting element. The light reaching the covering member 13 is reflected toward the upper surface side (light emitting surface side) of the light emitting device 100D, whereby the light extraction efficiency of the light emitting device 100D can be improved. The first light-transmitting member 12 covers the side surface of each light-emitting element, and guides the light emitted from the side surface to the upper surface direction of the light-emitting device 100D. That is, the first light-transmitting member 12 is used for extracting the light to the light-emitting element through the first light-transmitting member 12 before the light reaching the side surface of each light-emitting element is reflected on the side surface and attenuated in the light-emitting element. The outer member. The first light-transmitting member 12 can be used for the members exemplified in the light-emitting device 100, and is particularly preferably a thermosetting light-transmitting resin such as silicone resin, silicone modified resin, epoxy resin, and phenol resin. For the second light-transmitting member 15 and the third light-transmitting member 16, the members exemplified in the first light-transmitting member 12 may also be used. Since the first light-transmitting member 12 is in contact with the side surface of the light-emitting element, it is easily affected by the heat generated in the light-emitting element during lighting. Since the thermosetting resin is excellent in heat resistance, it is suitable for the first translucent member 12. Furthermore, it is preferable that the light transmittance of the first translucent member 12 is high. Therefore, it is generally preferable that no additives that reflect, absorb or scatter light are added to the first translucent member 12. However, there are also cases where it is preferable to add additives to the first translucent member 12 in order to impart more desirable characteristics. For example, in order to adjust the refractive index of the first light-transmitting member 12, or to adjust the viscosity of the first light-transmitting member 12 before curing, various fillers may be added. In the light-emitting device 100D shown in FIGS. 4A and 4B, the second light-transmitting member 15 containing the phosphor 4 is arranged on the upper surface side of the first light-emitting element 10b which functions as a light-emitting surface, and emits light in the second The third light-transmitting member 16 is arranged on the upper surface side of the element 20g that functions as a light-emitting surface. It is preferable that the third light-transmitting member 16 arranged on the upper surface side of the second light-emitting element 20g is not added with an additive that reflects, absorbs, or scatters the light emitted from the second light-emitting element 20g. With this configuration, the light emitted from the first light-emitting element 10b, the second light-emitting element 20g, and the phosphor 4 is mixed, and for example, light of a desired color such as white light can be obtained. Furthermore, as shown in FIG. 4B, the first light-emitting element 10b and the second light-emitting element 20g are connected in series by a metal film 14 formed by sputtering or the like. By providing such a metal film 14, the heat from the light-emitting element can be efficiently released to the outside. The light emitting device 100 can be manufactured by the following manufacturing method. After arranging the first reed 36a and the second reed 36b in the mold, resin is filled in the mold to integrally form the resin part, the first reed 36a, and the second reed 36b, and the resin package 2 is obtained. Two first light-emitting elements 10b and second light-emitting elements 20g are arranged on the first spring 36a exposed on the bottom surface of the recess of the resin package 2. Thereafter, as shown in FIG. 1A, the first reed 36a and the first light-emitting element 10b, the first light-emitting element 10b and the second light-emitting element 20g, and the second light-emitting element 20g arranged on the left side are arranged with the wire 6 The first light emitting element 10b and the first light emitting element 10b on the right side are respectively connected to the second reed 36b. Next, the molten resin containing the phosphor 4 is filled into the recesses of the resin package 2 so that at least a part of it is in contact with the first light-emitting element 10b and the second light-emitting element 20g. After the phosphor 4 is deposited, the resin Hardening, thereby forming the translucent member 3. Furthermore, the light-emitting device 100 described above is a top-view type light-emitting device in which the upper surface of the light-emitting device is used as the light extraction surface and the lower surface is used as the mounting surface. However, it is not limited to this. The light-emitting device of the present invention also includes a so-called side-view type light-emitting device in which the surface adjacent to the light extraction surface is used as the mounting surface and the light is emitted in a direction parallel to the mounting surface. 2. Embodiment 2 FIGS. 5A and 5B are schematic plan views showing a backlight 200 of Embodiment 2. FIG. The backlight 200 includes the light emitting device 100 as described below. However, the light-emitting device 100 used in the following description can also be replaced with light-emitting devices 100A to 100D. The backlight 200 has a casing 21, a light guide plate 22 disposed in the casing 21, and a light emitting device 100 disposed in the casing 21 and emitting light toward the light guide plate 22. The backlight 200 irradiates the light from the light-emitting device 100 through the light guide plate 22 to a required device such as a liquid crystal panel. The housing 21 can be formed in a way that its inner surface reflects light. For example, the inner surface can be made white. At least one of the four side surfaces of the light guide plate 22 is used as an incident surface (light incident part). In the embodiment shown in FIG. 5A, the side surface located below is set as the incident surface. The light emitting device 100 is arranged in such a way that the light extraction surface and the incident surface face each other. Preferably, the light emitting device 100 is arranged in plural along the incident surface. The light emitted from the light emitting device 100 enters the light guide plate 22 from the incident surface. In the case of using a plurality of light-emitting devices 100, the lights emitted from different light-emitting devices 100 are mixed inside the light guide plate 22. The upper surface of the light guide plate 22 becomes an exit surface. The light emitted from the light guide plate 22 advances toward these devices due to the necessary devices such as a liquid crystal panel disposed on the exit surface. The light extraction surface of the light emitting device 100 and the light incident portion (incident surface) of the light guide plate 22 can be arranged in the same length direction. The light of the light emitting device 100 can be guided to the light guide plate 22 with higher efficiency by setting the length direction of the light extraction surface of the light emitting device 100 and the length direction of the light incident surface of the light guide plate to be parallel. FIG. 5B is a schematic cross-sectional view showing a modification example of the backlight 200 of the second embodiment. The backlight 200 may also be a so-called direct type backlight device in which a plurality of light-emitting devices 100 are arranged directly under the light guide plate 22 as shown in FIG. 5B. [Industrial Applicability] The light-emitting device of the present invention can be used, for example, as a backlight of a liquid crystal display.

2‧‧‧樹脂封裝3‧‧‧透光性構件4‧‧‧螢光體6‧‧‧導線7‧‧‧支持體10b‧‧‧第1發光元件20g‧‧‧第2發光元件12‧‧‧第1透光性構件13‧‧‧被覆構件14‧‧‧金屬膜15‧‧‧第2透光性構件16‧‧‧第3透光性構件21‧‧‧殼體22‧‧‧導光板27‧‧‧透光性基板28‧‧‧半導體積層體36a‧‧‧第1簧片36b‧‧‧第2簧片100‧‧‧發光裝置100A‧‧‧發光裝置100B‧‧‧發光裝置100C‧‧‧發光裝置100D‧‧‧發光裝置200‧‧‧背光251、252‧‧‧電極C‧‧‧中心線L‧‧‧排列方向P‧‧‧外側發光元件Q‧‧‧內側發光元件2‧‧‧Resin package 3‧‧‧Translucent member 4‧‧‧Fluorescent body 6‧‧Wire 7‧‧‧Support 10b‧‧‧First light-emitting element 20g‧‧‧Second light-emitting element 12‧ ‧‧The first light-transmitting member 13‧‧‧The covering member 14‧‧‧Metal film 15‧‧‧The second light-transmitting member 16‧‧‧The third light-transmitting member 21‧‧‧Shell 22‧‧‧ Light guide plate 27‧‧‧Transmissive substrate 28‧‧‧Semiconductor laminate 36a‧‧‧First reed 36b‧‧‧Second reed 100‧‧‧Light emitting device 100A‧‧‧Light emitting device 100B‧‧‧Light emitting Device 100C‧‧‧Light-emitting device 100D‧‧‧Light-emitting device 200‧‧‧Backlight 251,252‧‧‧Electrode C‧‧‧Center line L‧‧‧Arrangement direction P‧‧‧Outside light-emitting element Q‧‧‧Inside light-emitting element

圖1A係實施形態1之發光裝置100之模式性俯視圖。 圖1B係表示圖1A之Ib-Ib線剖面之模式性剖視圖。 圖2係表示發光裝置100之變化例之發光裝置100A之模式性俯視圖。 圖3A係表示發光裝置100之變化例之發光裝置100B之模式性俯視圖。 圖3B係表示發光裝置100之變化例之發光裝置100C之模式性俯視圖。 圖4A係表示發光裝置100之變化例之發光裝置100D之模式性俯視圖。 圖4B係表示圖4A之IIb-IIb線剖面之模式性剖視圖。 圖5A係表示實施形態2之背光200之模式性俯視圖。 圖5B係表示實施形態2之背光200之變化例之模式性剖視圖。FIG. 1A is a schematic plan view of the light-emitting device 100 of Embodiment 1. FIG. Fig. 1B is a schematic cross-sectional view of the section taken along the line Ib-Ib in Fig. 1A. FIG. 2 is a schematic plan view of a light-emitting device 100A showing a modification of the light-emitting device 100. FIG. 3A is a schematic plan view of a light-emitting device 100B showing a modification of the light-emitting device 100. FIG. 3B is a schematic plan view of a light-emitting device 100C showing a modification of the light-emitting device 100. FIG. 4A is a schematic plan view of a light-emitting device 100D showing a modification of the light-emitting device 100. Fig. 4B is a schematic cross-sectional view showing the section along the line IIb-IIb of Fig. 4A. FIG. 5A is a schematic plan view showing the backlight 200 of the second embodiment. FIG. 5B is a schematic cross-sectional view showing a modification example of the backlight 200 of the second embodiment.

2‧‧‧樹脂封裝 2‧‧‧Resin package

3‧‧‧透光性構件 3‧‧‧Translucent component

6‧‧‧導線 6‧‧‧Wire

7‧‧‧支持體 7‧‧‧Support

10b‧‧‧第1發光元件 10b‧‧‧The first light-emitting element

20g‧‧‧第2發光元件 20g‧‧‧The second light-emitting element

36a‧‧‧第1簧片 36a‧‧‧First reed

36b‧‧‧第2簧片 36b‧‧‧Second reed

100‧‧‧發光裝置 100‧‧‧Light-emitting device

C‧‧‧中心線 C‧‧‧Centerline

L‧‧‧排列方向 L‧‧‧Arrangement direction

P‧‧‧外側發光元件 P‧‧‧Outside light-emitting element

Q‧‧‧內側發光元件 Q‧‧‧Inside light-emitting element

Claims (13)

一種發光裝置,其係具有並排配置之至少3個發光元件、及包含螢光體之透光性構件者,且上述至少3個發光元件具有配置於外側之2個外側發光元件、及配置於上述2個外側發光元件之內側且具有與上述2個外側發光元件之發光峰值波長不同之發光峰值波長之內側發光元件,上述螢光體具有較上述外側發光元件及上述內側發光元件之發光峰值波長長之發光峰值波長,上述2個外側發光元件與上述內側發光元件串聯地連接,上述2個外側發光元件各自之發光峰值波長為430nm以上且未達490nm之範圍,上述內側發光元件之發光峰值波長為490nm以上且570nm以下之範圍,且上述螢光體相對於上述內側發光元件之光之反射率於上述內側發光元件之光之波長之範圍內平均為70%以上。 A light-emitting device having at least three light-emitting elements arranged side by side and a translucent member including phosphors, and the at least three light-emitting elements have two outer light-emitting elements arranged on the outside, and are arranged on the An inner light-emitting element inside the two outer light-emitting elements and having an emission peak wavelength different from the emission peak wavelengths of the two outer light-emitting elements, and the phosphor has a longer emission peak wavelength than the outer light-emitting element and the inner light-emitting element The emission peak wavelength of the two outer light-emitting elements is connected in series with the inner light-emitting element, the emission peak wavelength of each of the two outer light-emitting elements is 430 nm or more and less than 490 nm, and the emission peak wavelength of the inner light-emitting element is The range of 490nm or more and 570nm or less, and the reflectance of the phosphor with respect to the light of the inner light-emitting element is 70% or more on average within the range of the wavelength of the light of the inner light-emitting element. 如請求項1之發光裝置,其中上述螢光體之發光峰值波長處於580nm以上且680nm以下之範圍。 The light-emitting device of claim 1, wherein the peak wavelength of the light emission of the phosphor is in the range of 580 nm or more and 680 nm or less. 如請求項1或2之發光裝置,其中上述螢光體為組成係由下述通式(I)表示之螢光體或組成係由3.5MgO‧0.5MgF2‧GeO2:Mn4+表示之螢光體之至少一者: A2MF6:Mn4+ (I)(其中,上述通式(I)中,A為選自由K、Li、Na、Rb、Cs及NH4+所組成之群中之至少1種元素,M為選自由第4族元素及第14族元素所組成之群中之至少1種元素)。 Such as the light-emitting device of claim 1 or 2, wherein the above-mentioned phosphor is a phosphor whose composition is represented by the following general formula (I) or whose composition is represented by 3.5MgO‧0.5MgF 2 ‧GeO 2 : Mn 4+ At least one of the phosphors: A 2 MF 6 : Mn 4+ (I) (wherein, in the above general formula (I), A is selected from the group consisting of K, Li, Na, Rb, Cs and NH 4+ At least one element in the group, and M is at least one element selected from the group consisting of group 4 elements and group 14 elements). 如請求項1或2之發光裝置,其中上述內側發光元件相對於上述外側發光元件之光輸出之比處於0.3以上且0.7以下之範圍。 The light-emitting device of claim 1 or 2, wherein the ratio of the light output of the inner light-emitting element to the outer light-emitting element is in the range of 0.3 or more and 0.7 or less. 如請求項1或2之發光裝置,其中上述外側發光元件與上述內側發光元件之間之上述透光性構件中之上述螢光體之含有密度為,相較於自上述內側發光元件之上表面之高度以上者,自上述上表面之高度以下者較高。 The light-emitting device of claim 1 or 2, wherein the phosphor contained in the light-transmitting member between the outer light-emitting element and the inner light-emitting element has a content density of that from the upper surface of the inner light-emitting element The height above the upper surface is higher than the height below the upper surface. 如請求項1或2之發光裝置,其中上述發光裝置具備支持體,且上述2個外側發光元件及上述內側發光元件係載置於上述支持體。 The light-emitting device of claim 1 or 2, wherein the light-emitting device includes a support, and the two outer light-emitting elements and the inner light-emitting element are placed on the support. 如請求項1或2之發光裝置,其中上述外側發光元件及上述內側發光元件之對向之側面彼此之距離為50~150μm The light-emitting device of claim 1 or 2, wherein the distance between the opposing side surfaces of the outer light-emitting element and the inner light-emitting element is 50~150μm 如請求項1或2之發光裝置,其中上述外側發光元件之與上述內側發光元件對向之側面和上述內側發光元件之與上述外側發光元件對向之側面以成為平行之方式配置 The light-emitting device of claim 1 or 2, wherein the side surface of the outer light-emitting element facing the inner light-emitting element and the side surface of the inner light-emitting element facing the outer light-emitting element are arranged so as to be parallel 如請求項1或2之發光裝置,其中上述內側發光元件之上表面以較上述外側發光元件之上表面成為上側之方式配置。 The light-emitting device according to claim 1 or 2, wherein the upper surface of the inner light-emitting element is arranged so that the upper surface of the outer light-emitting element becomes an upper side. 如請求項1或2之發光裝置,其中上述透光性構件覆蓋上述外側發光元件之至少一部分及上述內側發光元件之至少一部分。 The light-emitting device according to claim 1 or 2, wherein the light-transmitting member covers at least a part of the outer light-emitting element and at least a part of the inner light-emitting element. 如請求項10之發光裝置,其中上述透光性構件與上述外側發光元件及上述內側發光元件相接。 The light-emitting device according to claim 10, wherein the light-transmitting member is in contact with the outer light-emitting element and the inner light-emitting element. 如請求項1或2之發光裝置,其中於俯視時,上述內側發光元件及上述外側發光元件為長方形,且上述外側發光元件之長邊與上述內側發光元件之短邊對向。 The light-emitting device of claim 1 or 2, wherein the inner light-emitting element and the outer light-emitting element are rectangular in plan view, and the long sides of the outer light-emitting element are opposed to the short sides of the inner light-emitting element. 一種背光,其具備請求項1至12中任一項之發光裝置、及側面具有入光部之導光板,且上述發光裝置之光提取面與上述入光部相向配置。 A backlight is provided with the light-emitting device according to any one of claims 1 to 12, and a light guide plate with a light-incident part on the side surface, and the light extraction surface of the light-emitting device is arranged opposite to the light-incident part.
TW106104060A 2016-02-09 2017-02-08 Light emitting device and backlight including the light emitting device TWI732821B (en)

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