TWI732614B - Integration type integrated circuit chip and mobile device including the same - Google Patents
Integration type integrated circuit chip and mobile device including the same Download PDFInfo
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
- H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
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Abstract
Description
本發明係關於一種積體電路晶片,尤指一種用於一整合面板的整合積體電路晶片。The present invention relates to an integrated circuit chip, in particular to an integrated integrated circuit chip for an integrated panel.
圖1示意地顯示一習知的整合面板,此面板10可以是將觸控整合至顯示面板中,觸控電極(未顯示)可形成在畫素單元11上,使得可實現顯示及觸控感應的功能。而顯示RGB子畫素的掃描線沿X軸方向延伸,連接到顯示掃描驅動電路13L, 13R,其中顯示掃描驅動電路13R, 13L可以是獨立的驅動晶片,或是整合在面板的電路,並接受由一整合積體電路晶片15傳送來的時序控制訊號。於圖1中,沿Y軸延伸的訊號線有顯示資料線121,顯示資料線121用來寫入顯示資料。三條顯示資料線121可連接到一多工器17,再連接到整合積體電路晶片15的外引腳(Outer Lead Bonding pad, OLB pad)151。Figure 1 schematically shows a conventional integrated panel. This
如圖1所示,整合積體電路晶片15的X軸方向的尺寸顯較整合面板10的顯示主動區(active area)101為小,因此顯示主動區101的顯示資料線121必須收線才可以接到整合積體電路晶片15的外引腳151,而收線所需區域的大小受限於顯示面板製程的最小線寬與線距。As shown in FIG. 1, the size of the integrated
於圖1的整合面板10上,由顯示主動區101的下側到整合面板10的下緣的非顯示區域定義為邊界區域(border)102,此邊界區域102的大小關係了顯示面板的屏佔比,尤其是手機產品要求較高的屏佔比以改善產品的外觀,因此,縮小邊界區域102便成為很重要的產品規格。然而,習知整合積體電路晶片15的腳位設計是將外引腳151全部設置於整合積體電路晶片15的接近顯示主動區101的一邊上,以此腳位設計,由於收線所需區域較大,導致無法縮小邊界區域102。On the integrated
因此,現行的整合積體電路晶片的設計並無法滿足顯示面板的高屏佔比的需求,而有予以改善之必要。Therefore, the current integrated integrated circuit chip design cannot meet the demand for a high screen-to-body ratio of the display panel, and it is necessary to improve it.
本發明之目的主要係在提供一種整合積體電路晶片,以解決前述習知技術之缺失。The purpose of the present invention is mainly to provide an integrated integrated circuit chip to solve the aforementioned shortcomings of the conventional technology.
為達前述之目的,本發明提出一種整合積體電路晶片,用於一整合面板,該整合積體電路晶片包含:一第一長邊;一第二長邊,對向於該第一長邊;一第一短邊;一第二短邊,對向於該第一短邊;以及一表面,由該第一長邊、第二長邊、第一短邊及第二短邊所圍繞,其中,該表面上設置有至少一外引腳排,該至少一外引腳排具有複數間隔排列的外引腳,且該複數外引腳是分別由鄰近該第二長邊與該第一短邊連接處的表面及鄰近該第二長邊與該第二短邊連接處的表面往該第一長邊漸縮至接近該第一長邊處的表面排列,再沿著該第一長邊排列,至少一部分該複數外引腳是用以傳遞顯示及指紋信號。To achieve the foregoing objective, the present invention provides an integrated integrated circuit chip for an integrated panel. The integrated integrated circuit chip includes: a first long side; a second long side opposite to the first long side ; A first short side; a second short side facing the first short side; and a surface surrounded by the first long side, the second long side, the first short side and the second short side, Wherein, the surface is provided with at least one outer pin row, the at least one outer pin row has a plurality of outer pins arranged at intervals, and the plurality of outer pins are formed from adjacent to the second long side and the first short The surface of the edge connection and the surface adjacent to the connection of the second long side and the second short side are tapered toward the first long side to be close to the surface of the first long side, and then arranged along the first long side Arranged, at least a part of the plurality of external pins are used to transmit display and fingerprint signals.
以上概述與接下來的詳細說明皆為示範性質,是為了進一步說明本發明的申請專利範圍,而有關本發明的其他目的與優點,將在後續的說明與圖式加以闡述。The above summary and the following detailed description are exemplary in nature, and are intended to further illustrate the scope of the patent application of the present invention. Other objectives and advantages of the present invention will be described in the following description and drawings.
為了使本發明的目的、技術方案及優點更加清楚明白,以下結合附圖及實施例,對本發明進行進一步詳細說明。應當理解,此處所描述的具體實施例僅僅用以解釋本發明的實施方式,並不用於限定本發明。In order to make the objectives, technical solutions, and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the implementation of the present invention, and are not used to limit the present invention.
圖2(A)示意地顯示本發明一實施例的整合面板20,此整合面板20上具有一顯示主動區域201及一非顯示用的邊界區域202。邊界區域202中設置有一整合積體電路晶片70,整合積體電路晶片70具有一第一長邊71、一對向於該第一長邊71的第二長邊74、一第一短邊72、一對向於該第一短邊72的第二短邊73、以及一表面75,其中,表面75是指整合積體電路晶片70面向該整合面板20的一面,表面75是由該第一長邊71、第二長邊74、第一短邊72及第二短邊73所圍繞,且表面上設有複數外引腳61。顯示主動區域201左右兩側分別設置有顯示掃描與指紋驅動電路23L,23R,用以驅動掃描線203與指紋感應所需要的控制訊號(參見圖2(B)重置訊號FP-reset與選取訊號FP-select),並接受由整合積體電路晶片70傳送來的時序控制訊號。FIG. 2(A) schematically shows an integrated
請一併參照圖2(A)及2(B)為整合面板20的電路示意圖,此整合面板20將指紋感應器26內建在顯示面板中,使得RGB子畫素與指紋感應器26組成一畫素單元21。於本實施例中,顯示主動區域201沿Y軸延伸的複數電路走線22包括顯示資料線221、及顯示資料與指紋資料複用線223,顯示資料線221用來寫入顯示資料,顯示資料與指紋資料複用線223利用分時方式來寫入顯示資料與讀取指紋資料,該複數電路走線22朝該整合積體電路晶片70的第一長邊71而延伸出顯示主動區域201,經由複數多工器27而佈設於該邊界區域202並朝向該整合積體電路晶片70的第一長邊71、第一短邊72及第二短邊73而連接至該複數外引腳61,於本實施例,每兩條顯示資料線221與一條顯示資料與指紋資料複用線223連接到一多工器27,再連接到整合積體電路晶片70的外引腳61。Please also refer to Figures 2(A) and 2(B) for a schematic circuit diagram of the integrated
如圖2(B)所示,由於本實施例採用顯示資料與指紋資料複用線223來在同一電路走線22上複用顯示資料與指紋資料,因此整合積體電路晶片70內含對應之切換器51,以將顯示資料與指紋資料複用線223分時接到整合積體電路晶片70內的顯示驅動電路52與指紋感應電路53。此外,可選擇地,本實施例進一步包含一公共電極與觸控感應電路54,複數電路走線22更包含觸控感應線541,公共電極與觸控感應電路54經由觸控感應線541連接到整合面板20的公共電極,以提供觸控感應功能,其中,切割公共電極作為觸控感應器為本領域技術人士所知,故在此不在贅述,且前述觸控感應、顯示驅動與指紋讀取採分時進行。本發明實施例中,可以是將顯示、指紋感應器整合至面板內,也可以是將顯示、指紋感應器及觸控感測整合至面板內。本發明實施例中的整合面板,也可以稱為內嵌式指紋辨識顯示面板,或屏下式指紋辨識顯示面板。As shown in Figure 2(B), since the display data and fingerprint
前述整合積體電路晶片70的表面75上設置有至少一外引腳排60,至少一外引腳排60可為單一外引腳排或複數外引腳排,為方便說明,圖2(A)的實施例顯示整合積體電路晶片70的表面75上的外引腳61是排列為兩排外引腳排60,每一外引腳排60具有複數間隔排列的外引腳61,任兩相鄰外引腳排60之間維持一距離而延伸,且每一外引腳排60的複數外引腳61是分別由鄰近該第二長邊74與該第一短邊72連接處的表面75及鄰近該第二長邊74與該第二短邊73連接處的表面75往該第一長邊71漸縮至接近該第一長邊71處的表面75排列,再沿著該第一長邊71排列,至少一部份的該複數外引腳61是用以傳遞顯示及指紋信號,或是用以傳遞顯示、指紋及觸控信號。At least one
以此外引腳61的腳位配置,能有效使用整合積體電路晶片70的兩短邊72,73附近的區域,而可達成電路走線22的收線所需區域與整合積體電路晶片70的最大化重疊,因此可有效縮小邊界區域202而滿足顯示面板的高屏佔比的需求。With the pin configuration of the
另外,在本發明實施例中雖然是以兩外引腳排作為說明,可以理解的是,在一些實施例中,也可以是單一排外引腳排或是三排或三排以上的外引腳排,只要外引腳排的複數外引腳依本發明排列成從晶片一側漸縮、漸進方式延伸至另一側,可有效利用非顯示區域達成縮小、窄化邊框等功效即可,並不以實施例揭露內容為限。In addition, although two external pin rows are used as an illustration in the embodiments of the present invention, it can be understood that in some embodiments, it may also be a single row of external pins or three or more rows of external pins. As long as the plurality of outer pins of the outer pin row are arranged to gradually shrink from one side of the chip and gradually extend to the other side according to the present invention, the non-display area can be effectively used to achieve the effects of shrinking and narrowing the frame. It is not limited to the content disclosed in the embodiments.
圖3(A)示意地顯示本發明另一實施例的整合面板30,此整合面板30上具有一顯示主動區域301及一非顯示用的邊界區域302。邊界區域302中設置有一整合積體電路晶片70,整合積體電路晶片70具有一第一長邊71、一對向於該第一長邊71的第二長邊74、一第一短邊72、一對向於該第一短邊72的第二短邊73、以及一表面75,其中,表面75是指整合積體電路晶片70面向該整合面板30的一面,表面75是由該第一長邊71、第二長邊74、第一短邊72及第二短邊73所圍繞,且表面上設有複數外引腳61。顯示主動區域301左右兩側分別設置有顯示掃描與指紋驅動電路33L, 33R,用以驅動掃描線303與指紋感應所需要的控制訊號(參見圖3(B)重置訊號FP-reset與選取訊號FP-select),並接受由整合積體電路晶片70傳送來的時序控制訊號。FIG. 3(A) schematically shows an integrated
請一併參照圖3(A)及3(B)為整合面板30的電路示意圖,此整合面板30將指紋感應器36內建在顯示面板中,使得RGB子畫素與指紋感應器36組成一畫素單元31。於本實施例中,顯示主動區域301沿Y軸延伸的複數電路走線32包括顯示資料線321、及顯示資料與指紋資料複用線323,顯示資料線321用來寫入顯示資料,顯示資料與指紋資料複用線323利用分時方式來寫入顯示資料與讀取指紋資料,該複數電路走線32朝該整合積體電路晶片70的第一長邊71而延伸出顯示主動區域301,佈設於該邊界區域302並朝向該整合積體電路晶片70的第一長邊71、第一短邊72及第二短邊73而連接至該複數外引腳61。Please also refer to FIGS. 3(A) and 3(B) for the circuit diagrams of the integrated
如圖3(B)所示,由於本實施例採用顯示資料與指紋資料複用線323來在同一電路走線32上複用顯示資料與指紋資料,因此整合積體電路晶片70內含對應之切換器51,其中,只做顯示驅動的顯示資料線321直接經由外引腳61連接到顯示驅動電路52,而顯示資料與指紋資料複用線323則連接到切換器51,以在顯示階段將顯示資料與指紋資料複用線323連接到顯示驅動電路52,在指紋讀取階段將顯示資料與指紋資料複用線323連接到指紋感應電路53。此外,可選擇地,本實施例進一步包含一公共電極與觸控感應電路54,複數電路走線32更包含觸控感應線541,公共電極與觸控感應電路54經由觸控感應線541連接到整合面板30的公共電極,以提供觸控感應功能,其中,切割公共電極作為觸控感應器為本領域技術人士所知,故在此不在贅述,且前述觸控感應、顯示驅動與指紋讀取採分時進行。As shown in FIG. 3(B), since the display data and fingerprint
再請參照圖3(A)所示,整合積體電路晶片70的表面75上的外引腳61是排列為複數外引腳排60,於本實施例是顯示有兩外引腳排60,每一外引腳排60具有複數間隔排列的外引腳61,任兩相鄰外引腳排60之間維持一距離而延伸,且每一外引腳排60的複數外引腳61是分別由鄰近該第二長邊74與該第一短邊72連接處的表面75及鄰近該第二長邊74與該第二短邊73連接處的表面75往該第一長邊71漸縮至接近該第一長邊71處的表面75排列,再沿著該第一長邊71排列,該複數外引腳61是用以傳遞顯示及指紋信號,或是用以傳遞顯示、指紋及觸控信號。Please refer to FIG. 3(A) again, the
以此外引腳61的腳位配置,能有效使用整合積體電路晶片70的兩短邊72,73附近的區域,而可達成電路走線32的收線所需區域與整合積體電路晶片70的最大化重疊,因此可有效縮小邊界區域302而滿足顯示面板的高屏佔比的需求。With the pin configuration of the
圖4(A)示意地顯示本發明又一實施例的整合面板40,此整合面板40上具有一顯示主動區域401及一非顯示用的邊界區域402。邊界區域402中設置有一整合積體電路晶片70,整合積體電路晶片70具有一第一長邊71、一對向於該第一長邊71的第二長邊74、一第一短邊72、一對向於該第一短邊72的第二短邊73、以及一表面75,其中,表面75是指整合積體電路晶片70面向該整合面板40的一面,表面75是由該第一長邊71、第二長邊74、第一短邊72及第二短邊73所圍繞,且表面上設有複數外引腳61。顯示主動區域401左右兩側分別設置有顯示掃描與指紋驅動電路43L, 43R,用以驅動掃描線403與指紋感應所需要的控制訊號(參見圖4(B)重置訊號FP-reset與選取訊號FP-select),並接受由整合積體電路晶片70傳送來的時序控制訊號。FIG. 4(A) schematically shows an
請一併參照圖4(A)及4(B)為整合面板40的電路示意圖,此整合面板40將指紋感應器46內建在顯示面板中,使得RGB子畫素與指紋感應器46組成一畫素單元41。於本實施例中,指紋資料與顯示資料不共用線,顯示主動區域401沿Y軸延伸的複數電路走線42包括顯示資料線421與指紋資料線423,顯示資料線421用來寫入顯示資料,指紋資料線423用來讀取指紋資料,該複數電路走線42朝該整合積體電路晶片70的第一長邊71而延伸出顯示主動區域401,經由複數多工器47而佈設於該邊界區域402並朝向該整合積體電路晶片70的第一長邊71、第一短邊72及第二短邊73而連接至該複數外引腳61,於本實施例中,每三條顯示資料線421與一條指紋資料線423連接到一多工器47,再連接到整合積體電路晶片70的外引腳61。Please also refer to FIGS. 4(A) and 4(B) for schematic circuit diagrams of the integrated
如圖4(B)所示整合積體電路晶片70內含切換器51,以將顯示資料線421切換連接到顯示驅動電路52,而將指紋資料線423切換連接到指紋感應電路53。此外,可選擇地,本實施例進一步包含一公共電極與觸控感應電路54,複數電路走線42更包含觸控感應線541,公共電極與觸控感應電路54經由觸控感應線541連接到整合面板40的公共電極,以提供觸控感應功能,其中,切割公共電極作為觸控感應器為本領域技術人士所知,故在此不在贅述,且前述觸控感應、顯示驅動與指紋讀取採分時進行。As shown in FIG. 4(B), the integrated
再請參照圖4(A)所示,整合積體電路晶片70的表面75上的外引腳61是排列為複數外引腳排60,於本實施例是顯示有兩外引腳排60,每一外引腳排60具有複數間隔排列的外引腳61,任兩相鄰外引腳排60之間維持一距離而延伸,且每一外引腳排60的複數外引腳61是分別由鄰近該第二長邊74與該第一短邊72連接處的表面75及鄰近該第二長邊74與該第二短邊73連接處的表面75往該第一長邊71漸縮至接近該第一長邊71處的表面75排列,再沿著該第一長邊71排列,該複數外引腳61是用以傳遞顯示及指紋信號,或是用以傳遞顯示、指紋及觸控信號。Please refer to FIG. 4(A) again, the
以本發明上述實施例中的外引腳61的腳位配置,能有效使用整合積體電路晶片70的兩短邊72,73附近的區域,而可達成電路走線42的收線所需區域與整合積體電路晶片70的最大化重疊,因此可有效縮小邊界區域402而滿足顯示面板的高屏佔比的需求。With the pin configuration of the
圖5(A)示意地顯示本發明一實施例的整合積體電路晶片的外引腳排列,於本實施例中,整合積體電路晶片70的表面75上設置有兩外引腳排60,如圖所示,每一外引腳排60的複數外引腳61由鄰近第二長邊74與第一短邊72連接處的表面75往第一長邊71漸縮至接近第一長邊71處的表面75排列,使得該複數外引腳61的排列方向與該第一短邊72之間具有一第一夾角A1;每一外引腳排60的複數外引腳61由鄰近第二長邊74與第二短邊73連接處的表面75往第一長邊71漸縮至接近第一長邊71處的表面75排列,使得該複數外引腳61的排列方向與該第二短邊73之間具有一第二夾角A2。於本實施例中,該第一夾角A1等於該第二夾角A2,於其他實施例中,該第一夾角A1可不等於該第二夾角A2。由此可以看出,每一外引腳排60的複數外引腳61是排列為一等腰梯形的上底及兩腰邊。FIG. 5(A) schematically shows the external pin arrangement of an integrated integrated circuit chip according to an embodiment of the present invention. In this embodiment, two
此外,每一外引腳61為一長方形,該長方形的長是垂直於該第二長邊74。一外引腳排601的複數外引腳61(如圖中的外引腳611)是排列為錯位於相鄰的外引腳排602的對應複數外引腳61(如圖中的外引腳612),亦即,外引腳611及外引腳612在Y軸方向存在一偏移而非完全重疊,以方便電路走線22,32,42的佈設及連接。In addition, each
圖5(B)示意地顯示本發明另一實施例的整合積體電路晶片的外引腳排列,本實施例是相似於圖5(A)之實施例,不同之處在於:沿著第一長邊71排列的外引腳排60的每一外引腳61的長方形的長是垂直於該第二長邊74;由鄰近第二長邊74與第一短邊72連接處的表面75往第一長邊71漸縮至接近第一長邊71處的表面75排列的外引腳排60的每一外引腳61(如圖中的外引腳613)的長方形的長是朝第一短邊72傾斜而與第二長邊74呈一小於等於90度的第三夾角B1;由鄰近第二長邊74與第二短邊73連接處的表面75往第一長邊71漸縮至接近第一長邊71處的表面75排列的外引腳排60的每一外引腳61(如圖中的外引腳614)的長方形的長是朝第二短邊73傾斜而與第二長邊74呈一小於等於90度的第四夾角B2。FIG. 5(B) schematically shows the outer pin arrangement of an integrated integrated circuit chip according to another embodiment of the present invention. This embodiment is similar to the embodiment of FIG. 5(A), except that it runs along the first The length of the rectangle of each
進一步,由鄰近第二長邊74與第一短邊72連接處的表面75往第一長邊71漸縮至接近第一長邊71處的表面75排列的外引腳排60的該複數外引腳61與第二長邊74所構成之複數個第三夾角B1是逐漸變大直至等於90度(亦即,成為長方形的長垂直於該第二長邊74的沿著第一長邊71排列的外引腳61);同樣地,由鄰近第二長邊74與第二短邊73連接處的表面75往第一長邊71漸縮至接近第一長邊71處的表面75排列的外引腳排60的該複數外引腳61與第二長邊74所構成之複數個第四夾角B2是逐漸變大直至等於90度(亦即,成為長方形的長垂直於該第二長邊74的沿著第一長邊71排列的外引腳61)。藉此,整合積體電路晶片70左右兩側的外引腳61進一步往X軸方向做向外的角度旋轉,由於電路走線22,32,42的收線也是由外引腳61往外連接到顯示主動區域201,301,401,因此外引腳61的角度旋轉可進一步縮小收線所需要的區域。在一實施例中,第三夾角B1的逐漸變大可以是對應於第四夾角B2的逐漸變大。Further, from the
圖5(C)示意地顯示本發明又一實施例的整合積體電路晶片的外引腳排列,本實施例是相似於圖5(A)之實施例,不同之處在於整合積體電路晶片70的表面75上設置有三外引腳排60,因此,可以設置較多的外引腳61於整合積體電路晶片70的表面75上,以適用於電路走線22,32,42的數量較多的應用,例如較高解析度、或是同時整合顯示、指紋與觸控的應用、或是不使用多工器的圖3(A)的實施例等,但不以此為限。在上述實施例中,外引腳排的兩端是分別設置在鄰近第一短邊和第一長邊連接處的表面及鄰近第二短邊和第一長邊連接處的表面,然而,在其它實施例中,外引腳排的兩端也可以是略遠離第一長邊而朝向第二長邊的方向延伸設置,使得能有效使用兩短邊附近的區域,達成電路走線的收線所需區域與整合積體電路晶片的最大化重疊,因此可有效縮小、窄化邊界區域,進而滿足顯示面板的高屏佔比的需求。FIG. 5(C) schematically shows the outer pin arrangement of an integrated integrated circuit chip according to another embodiment of the present invention. This embodiment is similar to the embodiment of FIG. 5(A), except that the integrated integrated circuit chip is different There are three
圖6示意地顯示本發明的包含整合積體電路晶片的行動裝置,其中,該行動裝置是例如為一手機61,由於使用前述整合積體電路晶片70,因此可有效縮小邊界區域202, 302, 402而滿足行動裝置的顯示面板的高屏佔比的需求。FIG. 6 schematically shows the mobile device including an integrated integrated circuit chip of the present invention, where the mobile device is, for example, a
上述實施例僅係為了方便說明而舉例而已,本發明所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。The above-mentioned embodiments are merely examples for the convenience of description, and the scope of rights claimed in the present invention should be subject to the scope of the patent application, rather than being limited to the above-mentioned embodiments.
10:整合面板
11:畫素單元
13L,13R:顯示掃描驅動電路
15:整合積體電路晶片
121:顯示資料線
17:多工器
151:外引腳
101:顯示主動區
102:邊界區域
20、30、40:整合面板
201、301、401:顯示主動區域
202、302、402:邊界區域
70:整合積體電路晶片
71:第一長邊
74:第二長邊
72:第一短邊
73:第二短邊
75:表面
60:外引腳排
61:外引腳
23L,23R、33L,33R、43L,43R:顯示掃描與指紋驅動電路
FP-reset:重置訊號
FP-select:選取訊號
26、36、46:指紋感應器
21、31、41:畫素單元
22、32、42:電路走線
221、321、421:顯示資料線
223、323:顯示資料與指紋資料複用線
423:指紋資料線
27、47:多工器
51:切換器
52:顯示驅動電路
53:指紋感應電路
54:公共電極與觸控感應電路
541:觸控感應線
A1:第一夾角
A2:第二夾角
B1:第三夾角
B2:第四夾角
61:手機10: Integrated panel
11:
圖1示意地顯示一習知的整合面板。 圖2(A)示意地顯示本發明一實施例的整合面板。 圖2(B)為圖2(A)的整合面板的電路示意圖。 圖3(A)示意地顯示本發明另一實施例的整合面板。 圖3(B) 為圖3(A)的整合面板的電路示意圖。 圖4(A)示意地顯示本發明又一實施例的整合面板。 圖4(B) 為圖4(A)的整合面板的電路示意圖。 圖5(A)示意地顯示本發明一實施例的整合積體電路晶片的外引腳排列。 圖5(B)示意地顯示本發明另一實施例的整合積體電路晶片的外引腳排列。 圖5(C)示意地顯示本發明又一實施例的整合積體電路晶片的外引腳排列。 圖6示意地顯示本發明的包含整合積體電路晶片的行動裝置。 Figure 1 schematically shows a conventional integrated panel. Fig. 2(A) schematically shows an integrated panel according to an embodiment of the present invention. Fig. 2(B) is a schematic circuit diagram of the integrated panel of Fig. 2(A). Fig. 3(A) schematically shows an integrated panel according to another embodiment of the present invention. Fig. 3(B) is a schematic circuit diagram of the integrated panel of Fig. 3(A). Fig. 4(A) schematically shows an integrated panel according to another embodiment of the present invention. Fig. 4(B) is a schematic circuit diagram of the integrated panel of Fig. 4(A). FIG. 5(A) schematically shows the outer pin arrangement of an integrated integrated circuit chip according to an embodiment of the present invention. FIG. 5(B) schematically shows the outer pin arrangement of an integrated integrated circuit chip according to another embodiment of the present invention. FIG. 5(C) schematically shows the outer pin arrangement of an integrated integrated circuit chip according to another embodiment of the present invention. Fig. 6 schematically shows a mobile device including an integrated integrated circuit chip of the present invention.
20:整合面板 20: Integrated panel
201:顯示主動區域 201: Display active area
202:邊界區域 202: Border Area
70:整合積體電路晶片 70: Integrated integrated circuit chip
71:第一長邊 71: The first long side
74:第二長邊 74: second long side
72:第一短邊 72: first short side
73:第二短邊 73: second short side
75:表面 75: Surface
60:外引腳排 60: Outer pin row
61:外引腳 61: External pin
23L,23R:顯示掃描與指紋驅動電路 23L, 23R: Display scanning and fingerprint drive circuit
21:畫素單元 21: Pixel unit
22:電路走線 22: circuit routing
221:顯示資料線 221: Display data line
223:顯示資料與指紋資料複用線 223: Display data and fingerprint data multiplexing line
27:多工器 27: Multiplexer
Claims (20)
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TW201015178A (en) * | 2008-10-01 | 2010-04-16 | Chunghwa Picture Tubes Ltd | Active device array substrate and liquid crystal display panel |
CN107436705A (en) * | 2017-06-20 | 2017-12-05 | 深圳欧菲光科技股份有限公司 | Contact panel and display device |
CN107924260A (en) * | 2015-09-09 | 2018-04-17 | 赛普拉斯半导体公司 | Multiphase fingerprint sensor is laid out and structure |
TW201841109A (en) * | 2017-02-22 | 2018-11-16 | 開曼群島商敦泰電子有限公司 | Touch and display sensing integrated circuit and touch-screen device using the same |
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TW201015178A (en) * | 2008-10-01 | 2010-04-16 | Chunghwa Picture Tubes Ltd | Active device array substrate and liquid crystal display panel |
CN107924260A (en) * | 2015-09-09 | 2018-04-17 | 赛普拉斯半导体公司 | Multiphase fingerprint sensor is laid out and structure |
TW201841109A (en) * | 2017-02-22 | 2018-11-16 | 開曼群島商敦泰電子有限公司 | Touch and display sensing integrated circuit and touch-screen device using the same |
CN107436705A (en) * | 2017-06-20 | 2017-12-05 | 深圳欧菲光科技股份有限公司 | Contact panel and display device |
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