TWI732614B - Integration type integrated circuit chip and mobile device including the same - Google Patents

Integration type integrated circuit chip and mobile device including the same Download PDF

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TWI732614B
TWI732614B TW109122148A TW109122148A TWI732614B TW I732614 B TWI732614 B TW I732614B TW 109122148 A TW109122148 A TW 109122148A TW 109122148 A TW109122148 A TW 109122148A TW I732614 B TWI732614 B TW I732614B
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long side
integrated
circuit chip
integrated circuit
short side
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TW202202909A (en
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施博盛
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敦泰電子股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting

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Abstract

An integration type integrated circuit chip is used for an integration type panel. The integration type integrated circuit chip includes a first long side, a second long side, a first short side, a second short side, and a surface. At least one OLB pad row is arranged on the surface. The at least one OLB pad row has a plurality of OLB pads arranged at intervals. The plurality of OLB pads are arranged in a tapered manner respectively from the surface adjacent to where the second long side connects to the first short side and the surface adjacent to where the second long side connects to the second short side toward the first long side and then arranged along the first long side. At least a portion of the plurality of OLB pads are used to transmit display and fingerprint signals.

Description

整合積體電路晶片及包含該整合積體電路晶片的行動裝置Integrated integrated circuit chip and mobile device containing the integrated integrated circuit chip

本發明係關於一種積體電路晶片,尤指一種用於一整合面板的整合積體電路晶片。The present invention relates to an integrated circuit chip, in particular to an integrated integrated circuit chip for an integrated panel.

圖1示意地顯示一習知的整合面板,此面板10可以是將觸控整合至顯示面板中,觸控電極(未顯示)可形成在畫素單元11上,使得可實現顯示及觸控感應的功能。而顯示RGB子畫素的掃描線沿X軸方向延伸,連接到顯示掃描驅動電路13L, 13R,其中顯示掃描驅動電路13R, 13L可以是獨立的驅動晶片,或是整合在面板的電路,並接受由一整合積體電路晶片15傳送來的時序控制訊號。於圖1中,沿Y軸延伸的訊號線有顯示資料線121,顯示資料線121用來寫入顯示資料。三條顯示資料線121可連接到一多工器17,再連接到整合積體電路晶片15的外引腳(Outer Lead Bonding pad, OLB pad)151。Figure 1 schematically shows a conventional integrated panel. This panel 10 can integrate touch into a display panel. Touch electrodes (not shown) can be formed on the pixel unit 11, so that display and touch sensing can be realized. Function. The scan lines for displaying RGB sub-pixels extend along the X axis and are connected to display scan drive circuits 13L, 13R. The display scan drive circuits 13R, 13L can be independent drive chips or circuits integrated in the panel, and accept The timing control signal sent from an integrated integrated circuit chip 15. In FIG. 1, the signal line extending along the Y axis has a display data line 121, and the display data line 121 is used to write display data. The three display data lines 121 can be connected to a multiplexer 17 and then to the outer lead bonding pad (OLB pad) 151 of the integrated integrated circuit chip 15.

如圖1所示,整合積體電路晶片15的X軸方向的尺寸顯較整合面板10的顯示主動區(active area)101為小,因此顯示主動區101的顯示資料線121必須收線才可以接到整合積體電路晶片15的外引腳151,而收線所需區域的大小受限於顯示面板製程的最小線寬與線距。As shown in FIG. 1, the size of the integrated integrated circuit chip 15 in the X-axis direction is significantly smaller than that of the display active area 101 of the integrated panel 10. Therefore, the display data line 121 of the display active area 101 must be retracted. It is connected to the outer pins 151 of the integrated integrated circuit chip 15, and the size of the area required for the wire take-up is limited by the minimum line width and line spacing of the display panel manufacturing process.

於圖1的整合面板10上,由顯示主動區101的下側到整合面板10的下緣的非顯示區域定義為邊界區域(border)102,此邊界區域102的大小關係了顯示面板的屏佔比,尤其是手機產品要求較高的屏佔比以改善產品的外觀,因此,縮小邊界區域102便成為很重要的產品規格。然而,習知整合積體電路晶片15的腳位設計是將外引腳151全部設置於整合積體電路晶片15的接近顯示主動區101的一邊上,以此腳位設計,由於收線所需區域較大,導致無法縮小邊界區域102。On the integrated panel 10 of FIG. 1, the non-display area from the lower side of the display active area 101 to the lower edge of the integrated panel 10 is defined as a border area 102. The size of the border area 102 is related to the screen occupancy of the display panel. In particular, mobile phone products require a higher screen-to-body ratio to improve the appearance of the product. Therefore, reducing the border area 102 becomes a very important product specification. However, the conventional pin design of the integrated integrated circuit chip 15 is that all the outer pins 151 are arranged on the side of the integrated integrated circuit chip 15 close to the display active area 101. With this pin design, due to the need for wire take-up The area is so large that the boundary area 102 cannot be reduced.

因此,現行的整合積體電路晶片的設計並無法滿足顯示面板的高屏佔比的需求,而有予以改善之必要。Therefore, the current integrated integrated circuit chip design cannot meet the demand for a high screen-to-body ratio of the display panel, and it is necessary to improve it.

本發明之目的主要係在提供一種整合積體電路晶片,以解決前述習知技術之缺失。The purpose of the present invention is mainly to provide an integrated integrated circuit chip to solve the aforementioned shortcomings of the conventional technology.

為達前述之目的,本發明提出一種整合積體電路晶片,用於一整合面板,該整合積體電路晶片包含:一第一長邊;一第二長邊,對向於該第一長邊;一第一短邊;一第二短邊,對向於該第一短邊;以及一表面,由該第一長邊、第二長邊、第一短邊及第二短邊所圍繞,其中,該表面上設置有至少一外引腳排,該至少一外引腳排具有複數間隔排列的外引腳,且該複數外引腳是分別由鄰近該第二長邊與該第一短邊連接處的表面及鄰近該第二長邊與該第二短邊連接處的表面往該第一長邊漸縮至接近該第一長邊處的表面排列,再沿著該第一長邊排列,至少一部分該複數外引腳是用以傳遞顯示及指紋信號。To achieve the foregoing objective, the present invention provides an integrated integrated circuit chip for an integrated panel. The integrated integrated circuit chip includes: a first long side; a second long side opposite to the first long side ; A first short side; a second short side facing the first short side; and a surface surrounded by the first long side, the second long side, the first short side and the second short side, Wherein, the surface is provided with at least one outer pin row, the at least one outer pin row has a plurality of outer pins arranged at intervals, and the plurality of outer pins are formed from adjacent to the second long side and the first short The surface of the edge connection and the surface adjacent to the connection of the second long side and the second short side are tapered toward the first long side to be close to the surface of the first long side, and then arranged along the first long side Arranged, at least a part of the plurality of external pins are used to transmit display and fingerprint signals.

以上概述與接下來的詳細說明皆為示範性質,是為了進一步說明本發明的申請專利範圍,而有關本發明的其他目的與優點,將在後續的說明與圖式加以闡述。The above summary and the following detailed description are exemplary in nature, and are intended to further illustrate the scope of the patent application of the present invention. Other objectives and advantages of the present invention will be described in the following description and drawings.

為了使本發明的目的、技術方案及優點更加清楚明白,以下結合附圖及實施例,對本發明進行進一步詳細說明。應當理解,此處所描述的具體實施例僅僅用以解釋本發明的實施方式,並不用於限定本發明。In order to make the objectives, technical solutions, and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the implementation of the present invention, and are not used to limit the present invention.

圖2(A)示意地顯示本發明一實施例的整合面板20,此整合面板20上具有一顯示主動區域201及一非顯示用的邊界區域202。邊界區域202中設置有一整合積體電路晶片70,整合積體電路晶片70具有一第一長邊71、一對向於該第一長邊71的第二長邊74、一第一短邊72、一對向於該第一短邊72的第二短邊73、以及一表面75,其中,表面75是指整合積體電路晶片70面向該整合面板20的一面,表面75是由該第一長邊71、第二長邊74、第一短邊72及第二短邊73所圍繞,且表面上設有複數外引腳61。顯示主動區域201左右兩側分別設置有顯示掃描與指紋驅動電路23L,23R,用以驅動掃描線203與指紋感應所需要的控制訊號(參見圖2(B)重置訊號FP-reset與選取訊號FP-select),並接受由整合積體電路晶片70傳送來的時序控制訊號。FIG. 2(A) schematically shows an integrated panel 20 according to an embodiment of the present invention. The integrated panel 20 has a display active area 201 and a non-display boundary area 202 thereon. An integrated integrated circuit chip 70 is disposed in the boundary region 202. The integrated integrated circuit chip 70 has a first long side 71, a second long side 74 facing the first long side 71, and a first short side 72. , A second short side 73 facing the first short side 72, and a surface 75, wherein the surface 75 refers to the side of the integrated integrated circuit chip 70 facing the integrated panel 20, and the surface 75 is formed by the first The long side 71, the second long side 74, the first short side 72 and the second short side 73 are surrounded, and a plurality of outer pins 61 are provided on the surface. The left and right sides of the display active area 201 are respectively provided with display scanning and fingerprint driving circuits 23L, 23R to drive the scan line 203 and the control signals required for fingerprint sensing (see Figure 2(B) for reset signal FP-reset and selection signal) FP-select), and receive the timing control signal sent from the integrated integrated circuit chip 70.

請一併參照圖2(A)及2(B)為整合面板20的電路示意圖,此整合面板20將指紋感應器26內建在顯示面板中,使得RGB子畫素與指紋感應器26組成一畫素單元21。於本實施例中,顯示主動區域201沿Y軸延伸的複數電路走線22包括顯示資料線221、及顯示資料與指紋資料複用線223,顯示資料線221用來寫入顯示資料,顯示資料與指紋資料複用線223利用分時方式來寫入顯示資料與讀取指紋資料,該複數電路走線22朝該整合積體電路晶片70的第一長邊71而延伸出顯示主動區域201,經由複數多工器27而佈設於該邊界區域202並朝向該整合積體電路晶片70的第一長邊71、第一短邊72及第二短邊73而連接至該複數外引腳61,於本實施例,每兩條顯示資料線221與一條顯示資料與指紋資料複用線223連接到一多工器27,再連接到整合積體電路晶片70的外引腳61。Please also refer to Figures 2(A) and 2(B) for a schematic circuit diagram of the integrated panel 20. The integrated panel 20 has a fingerprint sensor 26 built into the display panel, so that the RGB sub-pixels and the fingerprint sensor 26 form one Pixel unit 21. In this embodiment, the multiple circuit traces 22 extending along the Y axis of the display active area 201 include a display data line 221 and a display data and fingerprint data multiplexing line 223. The display data line 221 is used to write display data, and display data The multiplexing line 223 with fingerprint data uses a time-sharing method to write display data and read fingerprint data. The multiple circuit traces 22 extend toward the first long side 71 of the integrated integrated circuit chip 70 to extend the display active area 201. It is arranged in the boundary area 202 through a plurality of multiplexers 27 and is connected to the plurality of outer pins 61 toward the first long side 71, the first short side 72 and the second short side 73 of the integrated integrated circuit chip 70, In this embodiment, every two display data lines 221 and one display data and fingerprint data multiplexing line 223 are connected to a multiplexer 27 and then connected to the external pins 61 of the integrated integrated circuit chip 70.

如圖2(B)所示,由於本實施例採用顯示資料與指紋資料複用線223來在同一電路走線22上複用顯示資料與指紋資料,因此整合積體電路晶片70內含對應之切換器51,以將顯示資料與指紋資料複用線223分時接到整合積體電路晶片70內的顯示驅動電路52與指紋感應電路53。此外,可選擇地,本實施例進一步包含一公共電極與觸控感應電路54,複數電路走線22更包含觸控感應線541,公共電極與觸控感應電路54經由觸控感應線541連接到整合面板20的公共電極,以提供觸控感應功能,其中,切割公共電極作為觸控感應器為本領域技術人士所知,故在此不在贅述,且前述觸控感應、顯示驅動與指紋讀取採分時進行。本發明實施例中,可以是將顯示、指紋感應器整合至面板內,也可以是將顯示、指紋感應器及觸控感測整合至面板內。本發明實施例中的整合面板,也可以稱為內嵌式指紋辨識顯示面板,或屏下式指紋辨識顯示面板。As shown in Figure 2(B), since the display data and fingerprint data multiplexing line 223 is used in this embodiment to multiplex the display data and fingerprint data on the same circuit trace 22, the integrated integrated circuit chip 70 contains the corresponding The switch 51 connects the display data and fingerprint data multiplexing line 223 to the display driving circuit 52 and the fingerprint sensing circuit 53 in the integrated integrated circuit chip 70 in a time-division manner. In addition, optionally, this embodiment further includes a common electrode and touch sensing circuit 54, and the plurality of circuit traces 22 further includes touch sensing lines 541, and the common electrode and touch sensing circuit 54 are connected to each other through the touch sensing lines 541. The common electrode of the panel 20 is integrated to provide a touch sensing function. Among them, cutting the common electrode as a touch sensor is known to those skilled in the art, so it will not be repeated here, and the aforementioned touch sensing, display driving and fingerprint reading Take time-sharing. In the embodiment of the present invention, the display and fingerprint sensor may be integrated into the panel, or the display, fingerprint sensor, and touch sensing may be integrated into the panel. The integrated panel in the embodiment of the present invention may also be referred to as an embedded fingerprint recognition display panel or an under-screen fingerprint recognition display panel.

前述整合積體電路晶片70的表面75上設置有至少一外引腳排60,至少一外引腳排60可為單一外引腳排或複數外引腳排,為方便說明,圖2(A)的實施例顯示整合積體電路晶片70的表面75上的外引腳61是排列為兩排外引腳排60,每一外引腳排60具有複數間隔排列的外引腳61,任兩相鄰外引腳排60之間維持一距離而延伸,且每一外引腳排60的複數外引腳61是分別由鄰近該第二長邊74與該第一短邊72連接處的表面75及鄰近該第二長邊74與該第二短邊73連接處的表面75往該第一長邊71漸縮至接近該第一長邊71處的表面75排列,再沿著該第一長邊71排列,至少一部份的該複數外引腳61是用以傳遞顯示及指紋信號,或是用以傳遞顯示、指紋及觸控信號。At least one outer pin row 60 is provided on the surface 75 of the aforementioned integrated integrated circuit chip 70. The at least one outer pin row 60 can be a single outer pin row or a plurality of outer pin rows. For the convenience of description, FIG. 2(A The embodiment of) shows that the outer pins 61 on the surface 75 of the integrated integrated circuit chip 70 are arranged in two rows of outer pin rows 60, and each outer pin row 60 has a plurality of outer pins 61 arranged at intervals, any two phases The adjacent outer pin rows 60 maintain a distance and extend, and the plurality of outer pins 61 of each outer pin row 60 are respectively formed from the surface 75 adjacent to the junction of the second long side 74 and the first short side 72 And the surface 75 adjacent to the junction of the second long side 74 and the second short side 73 is tapered toward the first long side 71 to be close to the surface 75 at the first long side 71, and then arranged along the first long side. The sides 71 are arranged, and at least a part of the plurality of external pins 61 are used to transmit display and fingerprint signals, or to transmit display, fingerprint and touch signals.

以此外引腳61的腳位配置,能有效使用整合積體電路晶片70的兩短邊72,73附近的區域,而可達成電路走線22的收線所需區域與整合積體電路晶片70的最大化重疊,因此可有效縮小邊界區域202而滿足顯示面板的高屏佔比的需求。With the pin configuration of the other pins 61, the areas near the two short sides 72, 73 of the integrated integrated circuit chip 70 can be effectively used, and the area required for the take-up of the circuit traces 22 and the integrated integrated circuit chip 70 can be achieved. Therefore, the boundary area 202 can be effectively reduced to meet the requirement of high screen-to-body ratio of the display panel.

另外,在本發明實施例中雖然是以兩外引腳排作為說明,可以理解的是,在一些實施例中,也可以是單一排外引腳排或是三排或三排以上的外引腳排,只要外引腳排的複數外引腳依本發明排列成從晶片一側漸縮、漸進方式延伸至另一側,可有效利用非顯示區域達成縮小、窄化邊框等功效即可,並不以實施例揭露內容為限。In addition, although two external pin rows are used as an illustration in the embodiments of the present invention, it can be understood that in some embodiments, it may also be a single row of external pins or three or more rows of external pins. As long as the plurality of outer pins of the outer pin row are arranged to gradually shrink from one side of the chip and gradually extend to the other side according to the present invention, the non-display area can be effectively used to achieve the effects of shrinking and narrowing the frame. It is not limited to the content disclosed in the embodiments.

圖3(A)示意地顯示本發明另一實施例的整合面板30,此整合面板30上具有一顯示主動區域301及一非顯示用的邊界區域302。邊界區域302中設置有一整合積體電路晶片70,整合積體電路晶片70具有一第一長邊71、一對向於該第一長邊71的第二長邊74、一第一短邊72、一對向於該第一短邊72的第二短邊73、以及一表面75,其中,表面75是指整合積體電路晶片70面向該整合面板30的一面,表面75是由該第一長邊71、第二長邊74、第一短邊72及第二短邊73所圍繞,且表面上設有複數外引腳61。顯示主動區域301左右兩側分別設置有顯示掃描與指紋驅動電路33L, 33R,用以驅動掃描線303與指紋感應所需要的控制訊號(參見圖3(B)重置訊號FP-reset與選取訊號FP-select),並接受由整合積體電路晶片70傳送來的時序控制訊號。FIG. 3(A) schematically shows an integrated panel 30 according to another embodiment of the present invention. The integrated panel 30 has a display active area 301 and a non-display boundary area 302 thereon. An integrated integrated circuit chip 70 is provided in the boundary area 302. The integrated integrated circuit chip 70 has a first long side 71, a second long side 74 facing the first long side 71, and a first short side 72. , A second short side 73 facing the first short side 72, and a surface 75, wherein the surface 75 refers to the side of the integrated integrated circuit chip 70 facing the integrated panel 30, and the surface 75 is formed by the first The long side 71, the second long side 74, the first short side 72 and the second short side 73 are surrounded, and a plurality of outer pins 61 are provided on the surface. The left and right sides of the display active area 301 are respectively provided with display scanning and fingerprint driving circuits 33L, 33R to drive the scan line 303 and the control signals required for fingerprint sensing (see Figure 3(B) for reset signal FP-reset and selection signal) FP-select), and receive the timing control signal sent from the integrated integrated circuit chip 70.

請一併參照圖3(A)及3(B)為整合面板30的電路示意圖,此整合面板30將指紋感應器36內建在顯示面板中,使得RGB子畫素與指紋感應器36組成一畫素單元31。於本實施例中,顯示主動區域301沿Y軸延伸的複數電路走線32包括顯示資料線321、及顯示資料與指紋資料複用線323,顯示資料線321用來寫入顯示資料,顯示資料與指紋資料複用線323利用分時方式來寫入顯示資料與讀取指紋資料,該複數電路走線32朝該整合積體電路晶片70的第一長邊71而延伸出顯示主動區域301,佈設於該邊界區域302並朝向該整合積體電路晶片70的第一長邊71、第一短邊72及第二短邊73而連接至該複數外引腳61。Please also refer to FIGS. 3(A) and 3(B) for the circuit diagrams of the integrated panel 30. The integrated panel 30 has a fingerprint sensor 36 built into the display panel, so that the RGB sub-pixels and the fingerprint sensor 36 form one Pixel unit 31. In this embodiment, the multiple circuit traces 32 extending along the Y axis of the display active area 301 include a display data line 321 and a display data and fingerprint data multiplexing line 323. The display data line 321 is used to write display data, and display data The multiplexing line 323 with fingerprint data uses a time-sharing method to write display data and read fingerprint data. The multiple circuit traces 32 extend toward the first long side 71 of the integrated integrated circuit chip 70 to extend the display active area 301. It is arranged in the boundary area 302 and faces the first long side 71, the first short side 72 and the second short side 73 of the integrated integrated circuit chip 70 and is connected to the plurality of outer pins 61.

如圖3(B)所示,由於本實施例採用顯示資料與指紋資料複用線323來在同一電路走線32上複用顯示資料與指紋資料,因此整合積體電路晶片70內含對應之切換器51,其中,只做顯示驅動的顯示資料線321直接經由外引腳61連接到顯示驅動電路52,而顯示資料與指紋資料複用線323則連接到切換器51,以在顯示階段將顯示資料與指紋資料複用線323連接到顯示驅動電路52,在指紋讀取階段將顯示資料與指紋資料複用線323連接到指紋感應電路53。此外,可選擇地,本實施例進一步包含一公共電極與觸控感應電路54,複數電路走線32更包含觸控感應線541,公共電極與觸控感應電路54經由觸控感應線541連接到整合面板30的公共電極,以提供觸控感應功能,其中,切割公共電極作為觸控感應器為本領域技術人士所知,故在此不在贅述,且前述觸控感應、顯示驅動與指紋讀取採分時進行。As shown in FIG. 3(B), since the display data and fingerprint data multiplexing line 323 is used in this embodiment to multiplex the display data and fingerprint data on the same circuit trace 32, the integrated integrated circuit chip 70 contains the corresponding The switch 51, wherein the display data line 321, which is only used for display driving, is directly connected to the display drive circuit 52 through the external pin 61, and the display data and fingerprint data multiplexing line 323 is connected to the switch 51 to connect The display data and fingerprint data multiplexing line 323 is connected to the display driving circuit 52, and the display data and fingerprint data multiplexing line 323 is connected to the fingerprint sensing circuit 53 in the fingerprint reading phase. In addition, optionally, this embodiment further includes a common electrode and touch sensing circuit 54, and the plurality of circuit traces 32 further includes touch sensing lines 541, and the common electrode and touch sensing circuit 54 are connected to the touch sensing lines 541 via the touch sensing lines 541. The common electrode of the panel 30 is integrated to provide a touch sensing function. Among them, cutting the common electrode as a touch sensor is known to those skilled in the art, so it will not be repeated here, and the aforementioned touch sensing, display driving and fingerprint reading Take time-sharing.

再請參照圖3(A)所示,整合積體電路晶片70的表面75上的外引腳61是排列為複數外引腳排60,於本實施例是顯示有兩外引腳排60,每一外引腳排60具有複數間隔排列的外引腳61,任兩相鄰外引腳排60之間維持一距離而延伸,且每一外引腳排60的複數外引腳61是分別由鄰近該第二長邊74與該第一短邊72連接處的表面75及鄰近該第二長邊74與該第二短邊73連接處的表面75往該第一長邊71漸縮至接近該第一長邊71處的表面75排列,再沿著該第一長邊71排列,該複數外引腳61是用以傳遞顯示及指紋信號,或是用以傳遞顯示、指紋及觸控信號。Please refer to FIG. 3(A) again, the outer pins 61 on the surface 75 of the integrated integrated circuit chip 70 are arranged as a plurality of outer pin rows 60. In this embodiment, two outer pin rows 60 are shown. Each outer pin row 60 has a plurality of outer pins 61 arranged at intervals, and any two adjacent outer pin rows 60 are extended while maintaining a distance, and the plurality of outer pins 61 of each outer pin row 60 are separate From the surface 75 adjacent to the connection of the second long side 74 and the first short side 72 and the surface 75 adjacent to the connection of the second long side 74 and the second short side 73 to the first long side 71 The surface 75 close to the first long side 71 is arranged, and then arranged along the first long side 71. The plurality of outer pins 61 are used to transmit display and fingerprint signals, or to transmit display, fingerprint and touch signal.

以此外引腳61的腳位配置,能有效使用整合積體電路晶片70的兩短邊72,73附近的區域,而可達成電路走線32的收線所需區域與整合積體電路晶片70的最大化重疊,因此可有效縮小邊界區域302而滿足顯示面板的高屏佔比的需求。With the pin configuration of the other pins 61, the areas near the two short sides 72, 73 of the integrated integrated circuit chip 70 can be effectively used, and the area required for the take-up of the circuit traces 32 and the integrated integrated circuit chip 70 can be achieved. Therefore, the boundary area 302 can be effectively reduced to meet the requirement of a high screen-to-body ratio of the display panel.

圖4(A)示意地顯示本發明又一實施例的整合面板40,此整合面板40上具有一顯示主動區域401及一非顯示用的邊界區域402。邊界區域402中設置有一整合積體電路晶片70,整合積體電路晶片70具有一第一長邊71、一對向於該第一長邊71的第二長邊74、一第一短邊72、一對向於該第一短邊72的第二短邊73、以及一表面75,其中,表面75是指整合積體電路晶片70面向該整合面板40的一面,表面75是由該第一長邊71、第二長邊74、第一短邊72及第二短邊73所圍繞,且表面上設有複數外引腳61。顯示主動區域401左右兩側分別設置有顯示掃描與指紋驅動電路43L, 43R,用以驅動掃描線403與指紋感應所需要的控制訊號(參見圖4(B)重置訊號FP-reset與選取訊號FP-select),並接受由整合積體電路晶片70傳送來的時序控制訊號。FIG. 4(A) schematically shows an integrated panel 40 according to another embodiment of the present invention. The integrated panel 40 has a display active area 401 and a non-display boundary area 402 thereon. An integrated integrated circuit chip 70 is disposed in the boundary area 402. The integrated integrated circuit chip 70 has a first long side 71, a second long side 74 facing the first long side 71, and a first short side 72. , A second short side 73 facing the first short side 72, and a surface 75, wherein the surface 75 refers to the side of the integrated integrated circuit chip 70 facing the integrated panel 40, and the surface 75 is formed by the first The long side 71, the second long side 74, the first short side 72 and the second short side 73 are surrounded, and a plurality of outer pins 61 are provided on the surface. The left and right sides of the display active area 401 are respectively provided with display scanning and fingerprint driving circuits 43L, 43R to drive the scan line 403 and the control signals required for fingerprint sensing (see Figure 4(B) for reset signal FP-reset and selection signal) FP-select), and receive the timing control signal sent from the integrated integrated circuit chip 70.

請一併參照圖4(A)及4(B)為整合面板40的電路示意圖,此整合面板40將指紋感應器46內建在顯示面板中,使得RGB子畫素與指紋感應器46組成一畫素單元41。於本實施例中,指紋資料與顯示資料不共用線,顯示主動區域401沿Y軸延伸的複數電路走線42包括顯示資料線421與指紋資料線423,顯示資料線421用來寫入顯示資料,指紋資料線423用來讀取指紋資料,該複數電路走線42朝該整合積體電路晶片70的第一長邊71而延伸出顯示主動區域401,經由複數多工器47而佈設於該邊界區域402並朝向該整合積體電路晶片70的第一長邊71、第一短邊72及第二短邊73而連接至該複數外引腳61,於本實施例中,每三條顯示資料線421與一條指紋資料線423連接到一多工器47,再連接到整合積體電路晶片70的外引腳61。Please also refer to FIGS. 4(A) and 4(B) for schematic circuit diagrams of the integrated panel 40. The integrated panel 40 has a fingerprint sensor 46 built into the display panel, so that the RGB sub-pixels and the fingerprint sensor 46 form one Pixel unit 41. In this embodiment, the fingerprint data and the display data do not share lines. The complex circuit trace 42 extending along the Y axis of the display active area 401 includes a display data line 421 and a fingerprint data line 423. The display data line 421 is used to write the display data The fingerprint data line 423 is used to read fingerprint data. The plurality of circuit traces 42 extend toward the first long side 71 of the integrated integrated circuit chip 70 to extend out of the display active area 401, and are arranged on the display active area 401 through a plurality of multiplexers 47 The boundary area 402 faces the first long side 71, the first short side 72 and the second short side 73 of the integrated integrated circuit chip 70 and is connected to the plurality of external pins 61. In this embodiment, every three pieces of data are displayed The line 421 and a fingerprint data line 423 are connected to a multiplexer 47 and then connected to the outer pin 61 of the integrated integrated circuit chip 70.

如圖4(B)所示整合積體電路晶片70內含切換器51,以將顯示資料線421切換連接到顯示驅動電路52,而將指紋資料線423切換連接到指紋感應電路53。此外,可選擇地,本實施例進一步包含一公共電極與觸控感應電路54,複數電路走線42更包含觸控感應線541,公共電極與觸控感應電路54經由觸控感應線541連接到整合面板40的公共電極,以提供觸控感應功能,其中,切割公共電極作為觸控感應器為本領域技術人士所知,故在此不在贅述,且前述觸控感應、顯示驅動與指紋讀取採分時進行。As shown in FIG. 4(B), the integrated integrated circuit chip 70 includes a switch 51 to switch the display data line 421 to the display driving circuit 52, and switch the fingerprint data line 423 to the fingerprint sensor circuit 53. In addition, optionally, this embodiment further includes a common electrode and touch sensing circuit 54, and the plurality of circuit traces 42 further include touch sensing lines 541, and the common electrode and touch sensing circuit 54 are connected to the touch sensing lines 541. The common electrode of the panel 40 is integrated to provide a touch sensing function. Among them, cutting the common electrode as a touch sensor is known to those skilled in the art, so it will not be repeated here, and the aforementioned touch sensing, display driving and fingerprint reading Take time-sharing.

再請參照圖4(A)所示,整合積體電路晶片70的表面75上的外引腳61是排列為複數外引腳排60,於本實施例是顯示有兩外引腳排60,每一外引腳排60具有複數間隔排列的外引腳61,任兩相鄰外引腳排60之間維持一距離而延伸,且每一外引腳排60的複數外引腳61是分別由鄰近該第二長邊74與該第一短邊72連接處的表面75及鄰近該第二長邊74與該第二短邊73連接處的表面75往該第一長邊71漸縮至接近該第一長邊71處的表面75排列,再沿著該第一長邊71排列,該複數外引腳61是用以傳遞顯示及指紋信號,或是用以傳遞顯示、指紋及觸控信號。Please refer to FIG. 4(A) again, the outer pins 61 on the surface 75 of the integrated integrated circuit chip 70 are arranged as a plurality of outer pin rows 60. In this embodiment, two outer pin rows 60 are shown. Each outer pin row 60 has a plurality of outer pins 61 arranged at intervals, and any two adjacent outer pin rows 60 are extended while maintaining a distance, and the plurality of outer pins 61 of each outer pin row 60 are separate From the surface 75 adjacent to the connection of the second long side 74 and the first short side 72 and the surface 75 adjacent to the connection of the second long side 74 and the second short side 73 to the first long side 71 The surface 75 close to the first long side 71 is arranged, and then arranged along the first long side 71. The plurality of outer pins 61 are used to transmit display and fingerprint signals, or to transmit display, fingerprint and touch signal.

以本發明上述實施例中的外引腳61的腳位配置,能有效使用整合積體電路晶片70的兩短邊72,73附近的區域,而可達成電路走線42的收線所需區域與整合積體電路晶片70的最大化重疊,因此可有效縮小邊界區域402而滿足顯示面板的高屏佔比的需求。With the pin configuration of the outer pins 61 in the above-mentioned embodiment of the present invention, the area near the two short sides 72, 73 of the integrated integrated circuit chip 70 can be effectively used, and the required area for the circuit trace 42 can be achieved. The maximum overlap with the integrated integrated circuit chip 70 can effectively reduce the boundary area 402 to meet the requirement of high screen-to-body ratio of the display panel.

圖5(A)示意地顯示本發明一實施例的整合積體電路晶片的外引腳排列,於本實施例中,整合積體電路晶片70的表面75上設置有兩外引腳排60,如圖所示,每一外引腳排60的複數外引腳61由鄰近第二長邊74與第一短邊72連接處的表面75往第一長邊71漸縮至接近第一長邊71處的表面75排列,使得該複數外引腳61的排列方向與該第一短邊72之間具有一第一夾角A1;每一外引腳排60的複數外引腳61由鄰近第二長邊74與第二短邊73連接處的表面75往第一長邊71漸縮至接近第一長邊71處的表面75排列,使得該複數外引腳61的排列方向與該第二短邊73之間具有一第二夾角A2。於本實施例中,該第一夾角A1等於該第二夾角A2,於其他實施例中,該第一夾角A1可不等於該第二夾角A2。由此可以看出,每一外引腳排60的複數外引腳61是排列為一等腰梯形的上底及兩腰邊。FIG. 5(A) schematically shows the external pin arrangement of an integrated integrated circuit chip according to an embodiment of the present invention. In this embodiment, two external pin rows 60 are provided on the surface 75 of the integrated integrated circuit chip 70. As shown in the figure, the plurality of outer pins 61 of each outer pin row 60 taper from the surface 75 adjacent to the junction of the second long side 74 and the first short side 72 to the first long side 71 to be close to the first long side. The surface 75 at 71 is arranged so that there is a first included angle A1 between the arrangement direction of the plurality of outer pins 61 and the first short side 72; the plurality of outer pins 61 of each outer pin row 60 are separated from the adjacent second The surface 75 at the junction of the long side 74 and the second short side 73 tapers toward the first long side 71 to be close to the surface 75 at the first long side 71, so that the arrangement direction of the plurality of outer pins 61 is aligned with the second short side. There is a second included angle A2 between the edges 73. In this embodiment, the first included angle A1 is equal to the second included angle A2. In other embodiments, the first included angle A1 may not be equal to the second included angle A2. It can be seen that the plurality of outer pins 61 of each outer pin row 60 are arranged as an isosceles trapezoid upper bottom and two waist edges.

此外,每一外引腳61為一長方形,該長方形的長是垂直於該第二長邊74。一外引腳排601的複數外引腳61(如圖中的外引腳611)是排列為錯位於相鄰的外引腳排602的對應複數外引腳61(如圖中的外引腳612),亦即,外引腳611及外引腳612在Y軸方向存在一偏移而非完全重疊,以方便電路走線22,32,42的佈設及連接。In addition, each outer pin 61 is a rectangle, and the length of the rectangle is perpendicular to the second long side 74. The plural outer pins 61 of an outer pin row 601 (the outer pins 611 in the figure) are arranged so that the corresponding plural outer pins 61 of the adjacent outer pin row 602 (the outer pins in the figure 612), that is, the outer pin 611 and the outer pin 612 have an offset in the Y-axis direction instead of completely overlapping, so as to facilitate the layout and connection of the circuit traces 22, 32, and 42.

圖5(B)示意地顯示本發明另一實施例的整合積體電路晶片的外引腳排列,本實施例是相似於圖5(A)之實施例,不同之處在於:沿著第一長邊71排列的外引腳排60的每一外引腳61的長方形的長是垂直於該第二長邊74;由鄰近第二長邊74與第一短邊72連接處的表面75往第一長邊71漸縮至接近第一長邊71處的表面75排列的外引腳排60的每一外引腳61(如圖中的外引腳613)的長方形的長是朝第一短邊72傾斜而與第二長邊74呈一小於等於90度的第三夾角B1;由鄰近第二長邊74與第二短邊73連接處的表面75往第一長邊71漸縮至接近第一長邊71處的表面75排列的外引腳排60的每一外引腳61(如圖中的外引腳614)的長方形的長是朝第二短邊73傾斜而與第二長邊74呈一小於等於90度的第四夾角B2。FIG. 5(B) schematically shows the outer pin arrangement of an integrated integrated circuit chip according to another embodiment of the present invention. This embodiment is similar to the embodiment of FIG. 5(A), except that it runs along the first The length of the rectangle of each outer pin 61 of the outer pin row 60 arranged on the long side 71 is perpendicular to the second long side 74; from the surface 75 adjacent to the connection between the second long side 74 and the first short side 72 The first long side 71 is tapered to be close to the surface 75 at the first long side 71. The rectangular length of each outer pin 61 (the outer pin 613 in the figure) of the outer pin row 60 arranged on the surface 75 is toward the first. The short side 72 is inclined to form a third angle B1 less than or equal to 90 degrees with the second long side 74; the surface 75 adjacent to the connection between the second long side 74 and the second short side 73 is tapered to the first long side 71 The rectangular length of each outer pin 61 (the outer pin 614 in the figure) of the outer pin row 60 arranged close to the surface 75 at the first long side 71 is inclined toward the second short side 73 and is different from the second short side 73. The long side 74 has a fourth angle B2 that is less than or equal to 90 degrees.

進一步,由鄰近第二長邊74與第一短邊72連接處的表面75往第一長邊71漸縮至接近第一長邊71處的表面75排列的外引腳排60的該複數外引腳61與第二長邊74所構成之複數個第三夾角B1是逐漸變大直至等於90度(亦即,成為長方形的長垂直於該第二長邊74的沿著第一長邊71排列的外引腳61);同樣地,由鄰近第二長邊74與第二短邊73連接處的表面75往第一長邊71漸縮至接近第一長邊71處的表面75排列的外引腳排60的該複數外引腳61與第二長邊74所構成之複數個第四夾角B2是逐漸變大直至等於90度(亦即,成為長方形的長垂直於該第二長邊74的沿著第一長邊71排列的外引腳61)。藉此,整合積體電路晶片70左右兩側的外引腳61進一步往X軸方向做向外的角度旋轉,由於電路走線22,32,42的收線也是由外引腳61往外連接到顯示主動區域201,301,401,因此外引腳61的角度旋轉可進一步縮小收線所需要的區域。在一實施例中,第三夾角B1的逐漸變大可以是對應於第四夾角B2的逐漸變大。Further, from the surface 75 adjacent to the junction of the second long side 74 and the first short side 72 to the first long side 71, the plurality of outer pin rows 60 arranged close to the surface 75 at the first long side 71 are tapered. The plurality of third included angles B1 formed by the pin 61 and the second long side 74 gradually increase to 90 degrees (that is, the length of the rectangle is perpendicular to the second long side 74 along the first long side 71 Aligned outer pins 61); similarly, the surface 75 near the junction of the second long side 74 and the second short side 73 is tapered to the first long side 71 to approach the surface 75 at the first long side 71 The plurality of fourth included angles B2 formed by the plurality of outer pins 61 of the outer pin row 60 and the second long side 74 gradually increase until it is equal to 90 degrees (that is, the length of the rectangle is perpendicular to the second long side 74, the outer pins 61 arranged along the first long side 71). As a result, the outer pins 61 on the left and right sides of the integrated integrated circuit chip 70 are further rotated toward the X-axis direction. Because the take-up of the circuit traces 22, 32, 42 is also connected to the outer pin 61 The active areas 201, 301, and 401 are displayed, so the angular rotation of the outer pin 61 can further reduce the area required for the winding. In an embodiment, the gradual increase of the third included angle B1 may correspond to the gradual increase of the fourth included angle B2.

圖5(C)示意地顯示本發明又一實施例的整合積體電路晶片的外引腳排列,本實施例是相似於圖5(A)之實施例,不同之處在於整合積體電路晶片70的表面75上設置有三外引腳排60,因此,可以設置較多的外引腳61於整合積體電路晶片70的表面75上,以適用於電路走線22,32,42的數量較多的應用,例如較高解析度、或是同時整合顯示、指紋與觸控的應用、或是不使用多工器的圖3(A)的實施例等,但不以此為限。在上述實施例中,外引腳排的兩端是分別設置在鄰近第一短邊和第一長邊連接處的表面及鄰近第二短邊和第一長邊連接處的表面,然而,在其它實施例中,外引腳排的兩端也可以是略遠離第一長邊而朝向第二長邊的方向延伸設置,使得能有效使用兩短邊附近的區域,達成電路走線的收線所需區域與整合積體電路晶片的最大化重疊,因此可有效縮小、窄化邊界區域,進而滿足顯示面板的高屏佔比的需求。FIG. 5(C) schematically shows the outer pin arrangement of an integrated integrated circuit chip according to another embodiment of the present invention. This embodiment is similar to the embodiment of FIG. 5(A), except that the integrated integrated circuit chip is different There are three outer pin rows 60 on the surface 75 of the 70. Therefore, more outer pins 61 can be arranged on the surface 75 of the integrated integrated circuit chip 70, which is suitable for the larger number of circuit traces 22, 32, and 42. Many applications, such as higher resolution, or applications that integrate display, fingerprint and touch at the same time, or the embodiment of FIG. 3(A) that does not use a multiplexer, but not limited to this. In the above embodiment, the two ends of the outer pin row are respectively arranged on the surface adjacent to the connection of the first short side and the first long side and the surface adjacent to the connection of the second short side and the first long side. However, in In other embodiments, the two ends of the outer pin row can also extend slightly away from the first long side and toward the second long side, so that the area near the two short sides can be effectively used to achieve circuit routing. The required area and the integrated integrated circuit chip overlap to the maximum, so the boundary area can be effectively reduced and narrowed, thereby meeting the demand for high screen-to-body ratio of the display panel.

圖6示意地顯示本發明的包含整合積體電路晶片的行動裝置,其中,該行動裝置是例如為一手機61,由於使用前述整合積體電路晶片70,因此可有效縮小邊界區域202, 302, 402而滿足行動裝置的顯示面板的高屏佔比的需求。FIG. 6 schematically shows the mobile device including an integrated integrated circuit chip of the present invention, where the mobile device is, for example, a mobile phone 61. Since the aforementioned integrated integrated circuit chip 70 is used, the boundary area 202, 302 can be effectively reduced. 402 to meet the requirement of high screen-to-body ratio of the display panel of the mobile device.

上述實施例僅係為了方便說明而舉例而已,本發明所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。The above-mentioned embodiments are merely examples for the convenience of description, and the scope of rights claimed in the present invention should be subject to the scope of the patent application, rather than being limited to the above-mentioned embodiments.

10:整合面板 11:畫素單元 13L,13R:顯示掃描驅動電路 15:整合積體電路晶片 121:顯示資料線 17:多工器 151:外引腳 101:顯示主動區 102:邊界區域 20、30、40:整合面板 201、301、401:顯示主動區域 202、302、402:邊界區域 70:整合積體電路晶片 71:第一長邊 74:第二長邊 72:第一短邊 73:第二短邊 75:表面 60:外引腳排 61:外引腳 23L,23R、33L,33R、43L,43R:顯示掃描與指紋驅動電路 FP-reset:重置訊號 FP-select:選取訊號 26、36、46:指紋感應器 21、31、41:畫素單元 22、32、42:電路走線 221、321、421:顯示資料線 223、323:顯示資料與指紋資料複用線 423:指紋資料線 27、47:多工器 51:切換器 52:顯示驅動電路 53:指紋感應電路 54:公共電極與觸控感應電路 541:觸控感應線 A1:第一夾角 A2:第二夾角 B1:第三夾角 B2:第四夾角 61:手機10: Integrated panel 11: Pixel unit 13L, 13R: Display scan drive circuit 15: Integrated integrated circuit chip 121: Display data line 17: Multiplexer 151: External pin 101: Display active area 102: Boundary area 20, 30, 40: integrated panel 201, 301, 401: display active area 202, 302, 402: boundary area 70: Integrated integrated circuit chip 71: The first long side 74: second long side 72: first short side 73: second short side 75: Surface 60: Outer pin row 61: External pin 23L, 23R, 33L, 33R, 43L, 43R: display scanning and fingerprint drive circuit FP-reset: reset signal FP-select: select signal 26, 36, 46: fingerprint sensor 21, 31, 41: pixel unit 22, 32, 42: circuit routing 221, 321, 421: display data line 223, 323: Display data and fingerprint data multiplexing line 423: Fingerprint Data Line 27, 47: multiplexer 51: Switcher 52: display drive circuit 53: Fingerprint sensing circuit 54: Common electrode and touch sensing circuit 541: Touch sensor line A1: The first angle A2: The second included angle B1: third angle B2: The fourth included angle 61: mobile phone

圖1示意地顯示一習知的整合面板。 圖2(A)示意地顯示本發明一實施例的整合面板。 圖2(B)為圖2(A)的整合面板的電路示意圖。 圖3(A)示意地顯示本發明另一實施例的整合面板。 圖3(B) 為圖3(A)的整合面板的電路示意圖。 圖4(A)示意地顯示本發明又一實施例的整合面板。 圖4(B) 為圖4(A)的整合面板的電路示意圖。 圖5(A)示意地顯示本發明一實施例的整合積體電路晶片的外引腳排列。 圖5(B)示意地顯示本發明另一實施例的整合積體電路晶片的外引腳排列。 圖5(C)示意地顯示本發明又一實施例的整合積體電路晶片的外引腳排列。 圖6示意地顯示本發明的包含整合積體電路晶片的行動裝置。 Figure 1 schematically shows a conventional integrated panel. Fig. 2(A) schematically shows an integrated panel according to an embodiment of the present invention. Fig. 2(B) is a schematic circuit diagram of the integrated panel of Fig. 2(A). Fig. 3(A) schematically shows an integrated panel according to another embodiment of the present invention. Fig. 3(B) is a schematic circuit diagram of the integrated panel of Fig. 3(A). Fig. 4(A) schematically shows an integrated panel according to another embodiment of the present invention. Fig. 4(B) is a schematic circuit diagram of the integrated panel of Fig. 4(A). FIG. 5(A) schematically shows the outer pin arrangement of an integrated integrated circuit chip according to an embodiment of the present invention. FIG. 5(B) schematically shows the outer pin arrangement of an integrated integrated circuit chip according to another embodiment of the present invention. FIG. 5(C) schematically shows the outer pin arrangement of an integrated integrated circuit chip according to another embodiment of the present invention. Fig. 6 schematically shows a mobile device including an integrated integrated circuit chip of the present invention.

20:整合面板 20: Integrated panel

201:顯示主動區域 201: Display active area

202:邊界區域 202: Border Area

70:整合積體電路晶片 70: Integrated integrated circuit chip

71:第一長邊 71: The first long side

74:第二長邊 74: second long side

72:第一短邊 72: first short side

73:第二短邊 73: second short side

75:表面 75: Surface

60:外引腳排 60: Outer pin row

61:外引腳 61: External pin

23L,23R:顯示掃描與指紋驅動電路 23L, 23R: Display scanning and fingerprint drive circuit

21:畫素單元 21: Pixel unit

22:電路走線 22: circuit routing

221:顯示資料線 221: Display data line

223:顯示資料與指紋資料複用線 223: Display data and fingerprint data multiplexing line

27:多工器 27: Multiplexer

Claims (20)

一種整合積體電路晶片,用於一整合面板,該整合積體電路晶片包含: 一第一長邊; 一第二長邊,對向於該第一長邊; 一第一短邊; 一第二短邊,對向於該第一短邊;以及 一表面,由該第一長邊、該第二長邊、該第一短邊及該第二短邊所圍繞,其中,該表面上設置有至少一外引腳排,該至少一外引腳排具有複數間隔排列的外引腳,且該複數外引腳是分別由鄰近該第二長邊與該第一短邊連接處的表面及鄰近該第二長邊與該第二短邊連接處的表面往該第一長邊漸縮至接近該第一長邊處的表面排列,再沿著該第一長邊排列,至少一部份的該複數外引腳是用以傳遞顯示及指紋信號。 An integrated integrated circuit chip for an integrated panel, the integrated integrated circuit chip comprising: A first long side; A second long side, opposite to the first long side; A first short side; A second short side opposite to the first short side; and A surface surrounded by the first long side, the second long side, the first short side, and the second short side, wherein at least one outer pin row is provided on the surface, and the at least one outer pin The row has a plurality of outer pins arranged at intervals, and the plurality of outer pins are respectively formed from the surface adjacent to the junction of the second long side and the first short side and adjacent to the junction of the second long side and the second short side The surface is tapered toward the first long side to be close to the surface of the first long side, and then arranged along the first long side. At least a part of the plurality of external pins is used to transmit display and fingerprint signals . 如請求項1所述之整合積體電路晶片,其中,該至少一外引腳排包含複數外引腳排,且任兩相鄰的複數外引腳排之間維持一距離而延伸排列。The integrated integrated circuit chip according to claim 1, wherein the at least one outer pin row includes a plurality of outer pin rows, and any two adjacent outer pin rows are arranged in an extended manner while maintaining a distance between them. 如請求項2所述之整合積體電路晶片,其中,每一外引腳排的複數外引腳由鄰近該第二長邊與該第一短邊連接處的表面往該第一長邊漸縮至接近該第一長邊處的表面排列,使得該複數外引腳的排列方向與該第一短邊之間具有一第一夾角;每一外引腳排的複數外引腳由鄰近該第二長邊與該第二短邊連接處的表面往該第一長邊漸縮至接近該第一長邊處的表面排列,使得該複數外引腳的排列方向與該第二短邊之間具有一第二夾角。The integrated integrated circuit chip according to claim 2, wherein the plurality of external pins of each external pin row gradually move from the surface adjacent to the junction of the second long side and the first short side to the first long side The surface arranged close to the first long side, so that the arrangement direction of the plurality of outer pins and the first short side have a first angle; the plurality of outer pins of each outer pin row are adjacent to the The surface at the junction of the second long side and the second short side is tapered toward the first long side to be close to the surface at the first long side, so that the arrangement direction of the plurality of outer pins is different from the second short side. There is a second included angle between. 如請求項3所述之整合積體電路晶片,其中,該第一夾角等於該第二夾角。The integrated integrated circuit chip according to claim 3, wherein the first included angle is equal to the second included angle. 如請求項2所述之整合積體電路晶片,其中,每一外引腳排的複數外引腳是排列為一等腰梯形的上底及兩腰邊。The integrated integrated circuit chip according to claim 2, wherein the plurality of outer pins of each outer pin row are arranged as an isosceles trapezoid upper bottom and two waist edges. 如請求項2所述之整合積體電路晶片,其中,該複數外引腳排的每一外引腳排的複數外引腳是排列為錯位於相鄰的外引腳排的對應複數外引腳。The integrated integrated circuit chip according to claim 2, wherein the plurality of external pins of each external pin row of the plurality of external pin rows are arranged so that the corresponding plural external pins of the adjacent external pin rows are misplaced foot. 如請求項6所述之整合積體電路晶片,其中,每一外引腳為長方形,該長方形的長是垂直於該第二長邊。The integrated integrated circuit chip according to claim 6, wherein each of the outer pins is a rectangle, and the length of the rectangle is perpendicular to the second long side. 如請求項6所述之整合積體電路晶片,其中,每一外引腳為長方形,沿著該第一長邊排列的外引腳排的每一外引腳的長方形的長是垂直於該第二長邊;由鄰近該第二長邊與該第一短邊連接處的表面往該第一長邊漸縮至接近該第一長邊處的表面排列的外引腳排的每一外引腳的長方形的長是朝該第一短邊傾斜而與該第二長邊呈一小於等於90度的第三夾角;由鄰近該第二長邊與該第二短邊連接處的表面往該第一長邊漸縮至接近該第一長邊處的表面排列的外引腳排的每一外引腳的長方形的長是朝該第二短邊傾斜而與該第二長邊呈一小於等於90度的第四夾角。The integrated integrated circuit chip according to claim 6, wherein each of the outer pins is rectangular, and the length of the rectangle of each outer pin of the row of outer pins arranged along the first long side is perpendicular to the The second long side; from the surface adjacent to the connection of the second long side and the first short side to the first long side tapering to each outer pin row arranged close to the surface at the first long side The length of the rectangle of the pin is inclined toward the first short side and forms a third included angle with the second long side that is less than or equal to 90 degrees; from the surface adjacent to the junction of the second long side and the second short side The first long side is tapered to be close to the surface of the first long side. The length of the rectangle of each outer pin row of the outer pin row is inclined toward the second short side and is aligned with the second long side. The fourth included angle is less than or equal to 90 degrees. 如請求項8所述之整合積體電路晶片,其中,由鄰近該第二長邊與該第一短邊連接處的表面往該第一長邊漸縮至接近該第一長邊處的表面排列的外引腳排的複數外引腳與該第二長邊的第三夾角是逐漸變大直至等於90度;由鄰近該第二長邊與該第二短邊連接處的表面往該第一長邊漸縮至接近該第一長邊處的表面排列的外引腳排的複數外引腳與該第二長邊的第四夾角是逐漸變大直至等於90度。The integrated integrated circuit chip according to claim 8, wherein the surface near the junction of the second long side and the first short side tapers toward the first long side to a surface close to the first long side The third included angle between the plurality of outer pins of the arranged outer pin row and the second long side gradually increases to equal to 90 degrees; from the surface adjacent to the junction of the second long side and the second short side toward the first The fourth included angle between the plurality of outer pins of the outer pin row arranged on the surface of the first long side and the second long side gradually increases until it is equal to 90 degrees. 如請求項9所述之整合積體電路晶片,其中,該第三夾角的逐漸變大是對應於該第四夾角的逐漸變大。The integrated integrated circuit chip according to claim 9, wherein the gradual increase of the third included angle corresponds to the gradual increase of the fourth included angle. 如請求項2所述之整合積體電路晶片,其中,該複數外引腳更用以傳遞觸控信號。The integrated integrated circuit chip according to claim 2, wherein the plurality of external pins are further used to transmit touch signals. 如請求項2所述之整合積體電路晶片,其中,該整合面板具有一顯示主動區域及一邊界區域,該整合積體電路晶片設置於該邊界區域,且使該整合積體電路晶片的一第一長邊接近於該顯示主動區域。The integrated integrated circuit chip according to claim 2, wherein the integrated panel has a display active area and a border area, the integrated integrated circuit chip is disposed in the border area, and a part of the integrated integrated circuit chip The first long side is close to the display active area. 如請求項12所述之整合積體電路晶片,其中,該顯示主動區域具有複數電路走線,該複數電路走線朝該整合積體電路晶片的第一長邊而延伸出該顯示主動區域,經由複數多工器而佈設於該邊界區域並朝向該整合積體電路晶片的第一長邊、第一短邊及第二短邊而連接至該複數外引腳。The integrated integrated circuit chip according to claim 12, wherein the display active area has a plurality of circuit traces, and the plurality of circuit traces extend out of the display active area toward the first long side of the integrated integrated circuit chip, It is arranged in the boundary area through a plurality of multiplexers and is connected to the plurality of external pins toward the first long side, the first short side and the second short side of the integrated integrated circuit chip. 如請求項13所述之整合積體電路晶片,其中,該複數電路走線包括顯示資料線與指紋資料線。The integrated integrated circuit chip according to claim 13, wherein the plurality of circuit traces include display data lines and fingerprint data lines. 如請求項14所述之整合積體電路晶片,其中,該複數電路走線更包括觸控感應線連接到該整合面板的公共電極。The integrated integrated circuit chip according to claim 14, wherein the plurality of circuit traces further include touch sensing lines connected to the common electrode of the integrated panel. 如請求項13所述之整合積體電路晶片,其中,該複數電路走線包括顯示資料線、及顯示資料與指紋資料複用線。The integrated integrated circuit chip according to claim 13, wherein the plurality of circuit traces include display data lines, and display data and fingerprint data multiplexing lines. 如請求項16所述之整合積體電路晶片,其中,該複數電路走線更包括觸控感應線連接到該整合面板的公共電極。The integrated integrated circuit chip according to claim 16, wherein the plurality of circuit traces further include touch sensing lines connected to the common electrode of the integrated panel. 如請求項12所述之整合積體電路晶片,其中,該顯示主動區域具有複數電路走線,該複數電路走線朝該整合積體電路晶片的第一長邊而延伸出該顯示主動區域,佈設於該邊界區域並朝向該整合積體電路晶片的第一長邊、第一短邊及第二短邊而連接至該複數外引腳。The integrated integrated circuit chip according to claim 12, wherein the display active area has a plurality of circuit traces, and the plurality of circuit traces extend out of the display active area toward the first long side of the integrated integrated circuit chip, It is arranged in the boundary area and faces the first long side, the first short side and the second short side of the integrated integrated circuit chip and is connected to the plurality of external pins. 如請求項18所述之整合積體電路晶片,其中,該複數電路走線包括顯示資料線、及顯示資料與指紋資料複用線。The integrated integrated circuit chip according to claim 18, wherein the plurality of circuit traces include display data lines, and display data and fingerprint data multiplexing lines. 一種行動裝置,包括如請求項1至19項中任一之整合積體電路晶片。A mobile device comprising an integrated integrated circuit chip as claimed in any one of claim items 1 to 19.
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