TWI728074B - Addition curable silicone resin composition - Google Patents

Addition curable silicone resin composition Download PDF

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TWI728074B
TWI728074B TW106109568A TW106109568A TWI728074B TW I728074 B TWI728074 B TW I728074B TW 106109568 A TW106109568 A TW 106109568A TW 106109568 A TW106109568 A TW 106109568A TW I728074 B TWI728074 B TW I728074B
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井口洋之
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日商信越化學工業股份有限公司
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本發明課題為提供一種硬化前為低黏度且點膠性良好,硬化後產生具有充足的強度,切割性良好,不會沾黏的硬化物之加成硬化性聚矽氧樹脂組成物,尤其是甲基聚矽氧樹脂組成物。 The subject of the present invention is to provide an addition curable polysiloxane resin composition that has low viscosity and good dispensing properties before curing, produces sufficient strength after curing, has good cutting properties, and does not stick to the cured product, especially Methyl polysiloxane resin composition.

課題解決手段為一種加成硬化性聚矽氧樹脂組成物,其係含有:(A)含有烯基的分支狀有機聚矽氧烷(B)含有烯基的直鏈狀有機聚矽氧烷(C)環狀乙烯基矽氧烷:相對於(A)及(B)成分的合計100質量份為3~7質量份(D)分子內具有至少2個氫矽烷基之有機氫聚矽氧烷、及(E)氫矽烷化觸媒。 The solution to the problem is an addition curable silicone resin composition containing: (A) a branched organopolysiloxane containing alkenyl groups (B) a linear organopolysiloxane containing alkenyl groups ( C) Cyclic vinylsiloxane: 3-7 parts by mass relative to 100 parts by mass of the total of components (A) and (B) (D) Organohydrogenpolysiloxane having at least two hydrosilyl groups in the molecule , And (E) Hydrosilylation catalyst.

Description

加成硬化性聚矽氧樹脂組成物 Addition curable silicone resin composition

本發明關於一種加成硬化性聚矽氧樹脂組成物。 The present invention relates to an addition-curing polysiloxane resin composition.

加成硬化型聚矽氧樹脂組成物,由於快速硬化性、硬化物的耐熱性、耐候性等優異,因此過去以來都被使用在用來將LED等的半導體元件密封的密封材。例如專利文獻1(日本特開2007-2234號公報)提出了對於由PPA等的熱塑性樹脂製作出的LED封裝表現出高接著力之加成硬化型聚矽氧樹脂組成物。另外,專利文獻2(日本特開2006-93354號公報)提出了藉由加成硬化型聚矽氧樹脂組成物的壓縮成型將光半導體元件密封的方法。 The addition-curing silicone resin composition has excellent rapid curing properties, heat resistance of the cured product, weather resistance, etc., so it has been used in the past as a sealing material for sealing semiconductor elements such as LEDs. For example, Patent Document 1 (Japanese Patent Application Laid-Open No. 2007-2234) proposes an addition-curing silicone resin composition that exhibits high adhesion to LED packages made of thermoplastic resins such as PPA. In addition, Patent Document 2 (Japanese Patent Application Laid-Open No. 2006-93354) proposes a method of sealing an optical semiconductor element by compression molding of an addition-curable silicone resin composition.

像這樣,加成硬化型聚矽氧樹脂一般被廣泛地使用作為半導體密封材料,然而其特性仍然無法令人滿意。一般而言,甲基聚矽氧樹脂,會有柔軟、切割性不良,而且大多數的情況下會發生沾黏這樣的缺點。若為了改進切割性而增加SiO4/2單元[Q單元]或RSiO3/2單元[T單元]成分,雖然可製作出硬且不會沾黏的硬化物,然而會變成強度低、質脆的樹脂。 As such, addition-curing silicone resins are generally widely used as semiconductor sealing materials, but their characteristics are still unsatisfactory. Generally speaking, methyl polysiloxane resin has softness and poor cutting properties, and in most cases, it has disadvantages such as sticking. If the SiO 4/2 unit [Q unit] or RSiO 3/2 unit [T unit] is added in order to improve the cutting performance, although a hard and non-sticky hardened product can be produced, it will become low in strength and brittle. Of resin.

[先前技術文獻] [Prior Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2007-2234號公報 [Patent Document 1] JP 2007-2234 A

[專利文獻2]日本特開2006-93354號公報 [Patent Document 2] JP 2006-93354 A

本發明鑑於上述問題而完成,目的為提供一種硬化前為低黏度且點膠性良好,硬化後產生具有充足的強度,切割性良好,不會沾黏的硬化物之加成硬化性聚矽氧樹脂組成物,尤其是甲基聚矽氧樹脂組成物。 The present invention has been completed in view of the above-mentioned problems, and its purpose is to provide an addition-curing polysilicone which has a low viscosity and good dispensing performance before hardening, and produces a hardened substance with sufficient strength after hardening, good cutting performance, and non-sticking. Resin composition, especially methyl polysiloxane resin composition.

本發明人為了解決上述課題鑽研檢討的結果,發現含有下述(A)~(E)成分之加成硬化性聚矽氧樹脂組成物,(A)下述式(1)所表示的分支狀有機聚矽氧烷(R1 3SiO1/2)r(R1 2SiO2/2)s(R1SiO3/2)t(SiO4/2)u (1)(式中,R1互相獨立地為選自碳數1~12之取代或非取代的一價飽和烴基及碳數2~6之烯基之基,但是R1的至少2個為烯基,r為0~100之整數、s為0~300之整數、t為0~200之整數、u為0~200之整數,但是1≦t+u≦400、3≦r+s+t+u≦800);(B)下述式(2)所表示的直鏈狀有機聚矽氧烷(R1 3SiO1/2)2(R1 2SiO2/2)x (2)(式(2)中,R1互相獨立地為選自碳數1~12之取代或非取代的一價飽和烴基及碳數2~6之烯基之基,但是R1的至少2個為烯基,且該烯基係位於分別的2個的(R1 3SiO1/2)單元,而不位於x個的(R1 2SiO2/2)單元,x為200~700(但是不包括x=200)之整數);(C)下述式(3)所表示的環狀乙烯基矽氧烷:相對於(A)及(B)成分的合計100質量份為2~7質量份

Figure 106109568-A0305-02-0005-2
(式(3)中,R1與上述式(1)中的R1相同,n為3~6之整數);(D)一分子中具有至少2個氫矽烷基之有機氫聚矽氧烷:相對於(A)~(C)成分中之烯基1莫耳,(D)成分中的氫矽烷基為0.4~4.0莫耳的量、及(E)氫矽烷化觸媒:進行氫矽烷化反應所足夠的量硬化前為低黏度且點膠性良好,硬化後產生具有充足的強度,切割性良好,不會沾黏的硬化物,而完成了本發明。 In order to solve the above-mentioned problems, the inventor of the present invention has studied and reviewed, and found that an addition curable silicone resin composition containing the following components (A) to (E), (A) branched as represented by the following formula (1) Organopolysiloxane (R 1 3 SiO 1/2 ) r (R 1 2 SiO 2/2 ) s (R 1 SiO 3/2 ) t (SiO 4/2 ) u (1) (where R 1 Independently of each other is a group selected from a substituted or unsubstituted monovalent saturated hydrocarbon group with 1 to 12 carbons and an alkenyl group with 2 to 6 carbons, but at least two of R 1 are alkenyl groups, and r is 0-100 Integer, s is an integer from 0 to 300, t is an integer from 0 to 200, u is an integer from 0 to 200, but 1≦t+u≦400, 3≦r+s+t+u≦800); (B ) The linear organopolysiloxane represented by the following formula (2) (R 1 3 SiO 1/2 ) 2 (R 1 2 SiO 2/2 ) x (2) (In formula (2), R 1 Independently of each other are groups selected from substituted or unsubstituted monovalent saturated hydrocarbon groups with 1 to 12 carbons and alkenyl groups with 2 to 6 carbons, but at least two of R 1 are alkenyl groups, and the alkenyl group is located Respectively 2 (R 1 3 SiO 1/2 ) units instead of x (R 1 2 SiO 2/2 ) units, x is 200~700 (but not including the integer of x=200); (C) Cyclic vinylsiloxane represented by the following formula (3): 2-7 parts by mass relative to 100 parts by mass of the total of components (A) and (B)
Figure 106109568-A0305-02-0005-2
(In the formula (3), the same as R 1 (1) R in the above Formula 1, n is an integer of 3 to 6); (D) having an alkyl group of one molecule at least two silicon organohydrogen silicon hydrogen siloxane : Relative to 1 mol of alkenyl group in components (A) to (C), the amount of hydrosilyl group in component (D) is 0.4 to 4.0 mol, and (E) hydrosilylation catalyst: hydrogen silane The sufficient amount of chemical reaction has low viscosity and good dispensing performance before hardening, and after hardening, it produces a hardened product with sufficient strength, good cutting performance, and no sticking, and the present invention is completed.

亦即,本發明提供下述加成硬化性聚矽氧樹 脂組成物。 That is, the present invention provides the following addition curable polysiloxane resin Lipid composition.

[1]一種加成硬化性聚矽氧樹脂組成物,其特徵為:含有下述(A)~(E)成分(A)下述式(1)所表示的分支狀有機聚矽氧烷(R1 3SiO1/2)r(R1 2SiO2/2)s(R1SiO3/2)t(SiO4/2)u (1)(式中,R1互相獨立地為選自碳數1~12之取代或非取代的一價飽和烴基及碳數2~6之烯基之基,但是R1的至少2個為烯基,r為0~100之整數、s為0~300之整數、t為0~200之整數、u為0~200之整數,但是1≦t+u≦400、3≦r+s+t+u≦800);(B)下述式(2)所表示的直鏈狀有機聚矽氧烷(R1 3SiO1/2)2(R1 2SiO2/2)x (2)(式(2)中,R1互相獨立地為選自碳數1~12之取代或非取代的一價飽和烴基及碳數2~6之烯基之基,但是R1的至少2個為烯基,且該烯基係位於分別的2個的(R1 3SiO1/2)單元,而不位於x個的(R1 2SiO2/2)單元,x為200~700(但是不包括x=200)之整數);(C)下述式(3)所表示的環狀乙烯基矽氧烷:相對於(A)及(B)成分的合計100質量份為2~7質量份

Figure 106109568-A0305-02-0006-5
(式(3)中,R1與上述式(1)中的R1相同,n為3~6之整數);(D)一分子中具有至少2個氫矽烷基之有機氫聚矽氧烷:相對於(A)~(C)成分中之烯基1莫耳,(D)成分中的氫矽烷基為0.4~4.0莫耳的量、及(E)氫矽烷化觸媒:進行氫矽烷化反應所足夠的量。 [1] An addition curable polysiloxane resin composition characterized by containing the following (A) to (E) components (A) and a branched organopolysiloxane represented by the following formula (1) ( R 1 3 SiO 1/2 ) r (R 1 2 SiO 2/2 ) s (R 1 SiO 3/2 ) t (SiO 4/2 ) u (1) (where R 1 is independently selected from A substituted or unsubstituted monovalent saturated hydrocarbon group with 1 to 12 carbons and an alkenyl group with 2 to 6 carbons, but at least two of R 1 are alkenyl groups, r is an integer from 0 to 100, and s is 0 to 300 is an integer, t is an integer from 0 to 200, u is an integer from 0 to 200, but 1≦t+u≦400, 3≦r+s+t+u≦800); (B) the following formula (2) ) Represented by linear organopolysiloxane (R 1 3 SiO 1/2 ) 2 (R 1 2 SiO 2/2 ) x (2) (In formula (2), R 1 is independently selected from A substituted or unsubstituted monovalent saturated hydrocarbon group with 1 to 12 carbons and an alkenyl group with 2 to 6 carbons, but at least two of R 1 are alkenyl groups, and the alkenyl groups are located in two ( R 1 3 SiO 1/2 ) unit instead of x (R 1 2 SiO 2/2 ) unit, x is 200~700 (but not including the integer of x=200); (C) the following formula (3) Cyclic vinylsiloxane represented by: 2-7 parts by mass relative to 100 parts by mass of the total of components (A) and (B)
Figure 106109568-A0305-02-0006-5
(In the formula (3), the same as R 1 (1) R in the above Formula 1, n is an integer of 3 to 6); (D) having an alkyl group of one molecule at least two silicon organohydrogen silicon hydrogen siloxane : Relative to 1 mol of alkenyl group in components (A) to (C), the amount of hydrosilyl group in component (D) is 0.4 to 4.0 mol, and (E) hydrosilylation catalyst: hydrogen silane The amount sufficient for the chemical reaction.

[2]如[1]之加成硬化性聚矽氧樹脂組成物,其中前述(A)成分與(B)成分的摻合比以質量比而計為(A):(B)=1:1~2:1。 [2] The addition curable silicone resin composition as in [1], wherein the blending ratio of the aforementioned (A) component and (B) component is calculated by mass ratio as (A): (B)=1: 1~2:1.

[3]如[1]或[2]之加成硬化性聚矽氧樹脂組成物,其中前述(D)成分為下述式(4)所表示的有機氫聚矽氧烷(R2 3SiO1/2)r’(R2 2SiO2/2)s’(R2SiO3/2)t’(SiO4/2)u’ (4)(式中,R2互相獨立地為氫原子或碳數1~12之取代或非取代的一價飽和烴基,R2的至少2個為氫原子,r’為0~100之整數、s’為0~300之整數、t’為0~200之整數、u’為0~200之整數,但是,2≦r’+s’+t’+u’≦800)。 [3] The addition curable silicone resin composition according to [1] or [2], wherein the aforementioned component (D) is an organohydrogen polysiloxane represented by the following formula (4) (R 2 3 SiO 1/2 ) r' (R 2 2 SiO 2/2 ) s' (R 2 SiO 3/2 ) t' (SiO 4/2 ) u' (4) (where R 2 is independently a hydrogen atom Or a substituted or unsubstituted monovalent saturated hydrocarbon group with 1 to 12 carbon atoms, at least two of R 2 are hydrogen atoms, r'is an integer from 0 to 100, s'is an integer from 0 to 300, and t'is 0 to An integer of 200, u'is an integer of 0~200, but 2≦r'+s'+t'+u'≦800).

[4]如[1]~[3]中任一項之加成硬化性聚矽氧樹脂組成物,其中前述(E)成分的摻合量,相對於(A)~(D)成分的合計質量為5~20ppm的量。 [4] The addition curable silicone resin composition of any one of [1] to [3], wherein the blending amount of the aforementioned (E) component is relative to the total of the (A) to (D) components The mass is 5-20ppm.

依據本發明,藉由添加足量的環狀乙烯基矽氧烷,可得到硬化前為低黏度且點膠性良好,硬化後產生 具有充足的強度,切割性良好,不會沾黏的硬化物之加成硬化性聚矽氧樹脂組成物。 According to the present invention, by adding a sufficient amount of cyclic vinyl silicone, it is possible to obtain low viscosity and good dispensing performance before curing, and produce It has sufficient strength, good cutting ability, and is an additive curable silicone resin composition that does not stick to the hardened material.

以下針對本發明之各成分作說明。 Hereinafter, each component of the present invention will be explained.

[(A)分支狀(樹脂狀)有機聚矽氧烷] [(A) Branched (resin-like) organopolysiloxane]

本發明之(A)成分是本發明之加成硬化性聚矽氧樹脂組成物的主成分,且為下述式(1)所表示的有機聚矽氧烷。 The component (A) of the present invention is the main component of the addition curable polysiloxane resin composition of the present invention, and is an organopolysiloxane represented by the following formula (1).

(R1 3SiO1/2)r(R1 2SiO2/2)s(R1SiO3/2)t(SiO4/2)u (1)(式中,R1互相獨立地為選自碳數1~12之取代或非取代的一價飽和烴基及碳數2~6之烯基之基,但是R1的至少2個為烯基,r為0~100之整數、s為0~300之整數、t為0~200之整數、u為0~200之整數,但是1≦t+u≦400、3≦r+s+t+u≦800)。 (R 1 3 SiO 1/2 ) r (R 1 2 SiO 2/2 ) s (R 1 SiO 3/2 ) t (SiO 4/2 ) u (1) (where R 1 is independent of each other A group consisting of a substituted or unsubstituted monovalent saturated hydrocarbon group with 1 to 12 carbons and an alkenyl group with 2 to 6 carbons, but at least two of R 1 are alkenyl groups, r is an integer from 0 to 100, and s is 0 ~300 is an integer, t is an integer of 0~200, u is an integer of 0~200, but 1≦t+u≦400, 3≦r+s+t+u≦800).

此處,R1為選自碳數1~12,宜為1~6,較佳為1~4之取代或非取代的一價飽和烴基及碳數2~6之烯基之基。一價飽和烴基的例子,具體而言,可例示甲基、乙基、丙基、丁基等的烷基;環戊基、環己基等的環烷基、及鍵結於這些基團中的碳原子之氫原子一部分或全部被氟,溴、氯等的鹵素原子、氰基、(甲基)丙烯醯氧基、縮水甘油氧基、巰基、胺基等取代而成的基團,例如三氟丙基、氯丙基等的鹵化一價飽和烴基;β-氰乙基、γ-氰丙基等的氰烷基;3-甲基丙烯醯氧基丙基、3-縮水甘油氧基丙基、3-巰丙基、3-胺丙基等。烯基的例子,可列舉乙烯基、烯丙基、丙烯基、己烯基、苯乙烯基等。該等之中,以甲基、環己基等為佳,甲基為特佳。但是,R1的至少2個為烯基,烯基宜為乙烯基。 Here, R 1 is a group selected from a substituted or unsubstituted monovalent saturated hydrocarbon group having 1 to 12 carbons, preferably 1 to 6, preferably 1 to 4, and an alkenyl group having 2 to 6 carbons. Examples of monovalent saturated hydrocarbon groups include, specifically, alkyl groups such as methyl, ethyl, propyl, and butyl; cycloalkyl groups such as cyclopentyl and cyclohexyl, and those bonded to these groups A group in which part or all of the hydrogen atoms of the carbon atoms are replaced by halogen atoms such as fluorine, bromine, chlorine, cyano, (meth)acryloxy, glycidoxy, mercapto, and amino groups, such as three Halogenated monovalent saturated hydrocarbon groups such as fluoropropyl and chloropropyl; cyanoalkyl groups such as β-cyanoethyl and γ-cyanopropyl; 3-methacryloxypropyl, 3-glycidoxypropyl Group, 3-mercaptopropyl, 3-aminopropyl, etc. Examples of alkenyl groups include vinyl groups, allyl groups, propenyl groups, hexenyl groups, and styryl groups. Among them, methyl, cyclohexyl, etc. are preferred, and methyl is particularly preferred. However, at least two of R 1 are alkenyl groups, and the alkenyl group is preferably a vinyl group.

此外,烯基在一分子中具有至少2個,在(A)成分之有機聚矽氧烷中,宜含有0.005~0.5莫耳/100g,尤其0.01~0.2莫耳/100g。 In addition, the alkenyl group has at least two in one molecule, and the organopolysiloxane of component (A) preferably contains 0.005 to 0.5 mol/100g, especially 0.01 to 0.2 mol/100g.

另外,烯基可位於R1 3SiO1/2單元、R1 2SiO2/2單元、R1SiO3/2單元、或這些單元中的複數種,以在R1 3SiO1/2單元具有烯基為佳。 In addition, the alkenyl group may be located in the R 1 3 SiO 1/2 unit, R 1 2 SiO 2/2 unit, R 1 SiO 3/2 unit, or a plurality of these units, so that the R 1 3 SiO 1/2 unit It is preferable to have an alkenyl group.

另外,r為0~100之整數,宜為0~75之整數,較佳為0~50之整數,然而更佳的情況是r為2以上,尤其2~50,特別是3~40,最佳為3~35,此情況下,在R1 3SiO1/2單元具有烯基時,具有該烯基的R1 3SiO1/2單元之r宜為2~50。s為0~300之整數,宜為0~200之整數,更佳為0~100之整數,t為0~200之整數,宜為0~100之整數,更佳為0~50之整數,u為0~200之整數,宜為0~100之整數,更佳為0~50之整數。但是,1≦t+u≦400,宜為1≦t+u≦200,較佳為1≦t+u≦100。另外,3≦r+s+t+u≦800,宜為4≦r+s+t+u≦600。該有機聚矽氧烷必須有R1SiO3/2單元(T 單元)、及/或SiO4/2單元(Q單元),因此具有分支狀(樹脂狀)構造。 In addition, r is an integer of 0 to 100, preferably an integer of 0 to 75, preferably an integer of 0 to 50, but it is more preferable that r is 2 or more, especially 2 to 50, especially 3 to 40. It is preferably 3 to 35. In this case, when the R 1 3 SiO 1/2 unit has an alkenyl group, the r of the R 1 3 SiO 1/2 unit having the alkenyl group is preferably 2 to 50. s is an integer from 0 to 300, preferably an integer from 0 to 200, more preferably an integer from 0 to 100, t is an integer from 0 to 200, preferably an integer from 0 to 100, and more preferably an integer from 0 to 50, u is an integer from 0 to 200, preferably an integer from 0 to 100, more preferably an integer from 0 to 50. However, 1≦t+u≦400, preferably 1≦t+u≦200, and more preferably 1≦t+u≦100. In addition, 3≦r+s+t+u≦800, preferably 4≦r+s+t+u≦600. The organopolysiloxane must have R 1 SiO 3/2 units (T units) and/or SiO 4/2 units (Q units), so it has a branched (resin-like) structure.

[(B)直鏈狀有機聚矽氧烷] [(B) Linear organopolysiloxane]

本發明之(B)成分,也是本發明之加成硬化性聚矽氧樹脂組成物的主成分,藉由與(A)成分之分支狀有機聚矽氧烷併用,可發揮出降低黏度,甚至提升硬化物的強度等的作用。該有機聚矽氧烷為下述式(2)所表示的有機聚矽氧烷。 The component (B) of the present invention is also the main component of the addition curable polysiloxane resin composition of the present invention. By using it in combination with the branched organopolysiloxane of component (A), it can reduce the viscosity, even Improve the strength of the hardened product. This organopolysiloxane is an organopolysiloxane represented by the following formula (2).

(R1 3SiO1/2)2(R1 2SiO2/2)x (2)(式中,R1的定義與上述相同,R1的至少2個為烯基,x為200~700之整數)。 (R 1 3 SiO 1/2 ) 2 (R 1 2 SiO 2/2 ) x (2) (In the formula, the definition of R 1 is the same as above, at least 2 of R 1 are alkenyl groups, and x is 200~700 Integer).

R1可例示與上述(A)成分的具體例所列舉的基團相同的基團,x為200~700之整數,宜為300~600。若x小於200,則硬化物無法得到充足的強度,若x大於700,則硬化物會白濁。 R 1 can exemplify the same groups as those exemplified in the specific examples of the component (A), and x is an integer of 200 to 700, preferably 300 to 600. If x is less than 200, the hardened product cannot obtain sufficient strength, and if x is greater than 700, the hardened product will become cloudy.

此外,烯基在一分子中具有至少2個,在(B)成分中,宜含有10×10-3~10×10-1莫耳/100g,尤其以10×10-3~10×10-2莫耳/100g。 Further, alkenyl groups having in one molecule at least two, the component (B), the preferably contain 10 × 10 -3 ~ 10 × 10 -1 mole / 100g, especially 10 × 10 -3 ~ 10 × 10 - 2 moles/100g.

另外,烯基可位於R1 3SiO1/2單元、R1 2SiO2/2單元、或這些單元中的複數種,以在R1 3SiO1/2單元具有烯基為佳。 In addition, the alkenyl group may be located in the R 1 3 SiO 1/2 unit, the R 1 2 SiO 2/2 unit, or a plurality of these units, and the R 1 3 SiO 1/2 unit preferably has an alkenyl group.

(B)成分的摻合量為與(A)成分合計成為100質量份的量,前述(A)成分與(B)成分的摻合比率,以質量比而計,係以(A):(B)=1:1~2:1為佳,1.2:1~2:1為較佳,1.4:1~2:1為更佳。只要在此範圍內,則硬化物不會沾黏,切割性良好,故為適合。 The blending amount of the (B) component is an amount that totals 100 parts by mass with the (A) component, and the blending ratio of the aforementioned (A) component and (B) component is calculated by mass ratio, which is based on (A): ( B)=1:1~2:1 is better, 1.2:1~2:1 is better, 1.4:1~2:1 is better. As long as it is within this range, the hardened material will not stick and the cutting performance is good, so it is suitable.

[(C)環狀乙烯基矽氧烷] [(C) Cyclic Vinylsiloxane]

本發明之(C)成分,藉由與前述(A)及(B)成分一起使用,可調整交聯密度,其結果,可改善組成物的黏度或硬化物的硬度、強度。該環狀矽氧烷為下述式(3)所表示的環狀矽氧烷。 The (C) component of the present invention can be used together with the aforementioned (A) and (B) components to adjust the cross-linking density. As a result, the viscosity of the composition or the hardness and strength of the cured product can be improved. This cyclic siloxane is a cyclic siloxane represented by the following formula (3).

Figure 106109568-A0202-12-0009-4
(式中,R1與上述相同,n為3~6之整數)
Figure 106109568-A0202-12-0009-4
(In the formula, R 1 is the same as above, n is an integer from 3 to 6)

R1可例示與上述(A)成分的具體例所列舉的基團相同的基團,宜為甲基、乙基、丙基、丁基等的烷基,較佳為甲基。n為3~6之整數,宜為3或4。 R 1 may be exemplified the same groups as specific examples of the component (A) of the recited groups, an alkyl group is suitably a methyl, ethyl, propyl, butyl, etc., preferably methyl. n is an integer from 3 to 6, preferably 3 or 4.

具體而言,可例示1,3,5-三甲基-1,3,5-三乙烯基環三矽氧烷、1,3,5,7-四甲基-1,3,5,7-四乙烯基環四矽氧烷、1,3,5,7,9-五甲基-1,3,5,7,9-五乙烯基環五矽氧烷等。 Specifically, 1,3,5-trimethyl-1,3,5-trivinylcyclotrisiloxane, 1,3,5,7-tetramethyl-1,3,5,7 can be exemplified -Tetravinylcyclotetrasiloxane, 1,3,5,7,9-pentamethyl-1,3,5,7,9-pentavinylcyclopentasiloxane, etc.

(C)成分的添加量,相對於(A)及(B)成分的合計100質量份,為2~7質量份的量,宜為2~6質量份,較佳為3~6質量份。在未達2質量份的情況,無法充分降低黏度,甚至,所得到的的硬化物不會具有充足的強度。另外還已知環狀乙烯基矽氧烷具有氫矽烷化的抑制作用,因此若添加高於7質量份,則硬化時間會變長,甚至交聯密度變得過大,因此變脆。 The amount of (C) component added is 2 to 7 parts by mass relative to 100 parts by mass of the total of (A) and (B) components, preferably 2 to 6 parts by mass, and more preferably 3 to 6 parts by mass. In the case of less than 2 parts by mass, the viscosity cannot be sufficiently reduced, and the resulting hardened product may not have sufficient strength. In addition, it is also known that cyclic vinylsiloxane has an inhibitory effect on hydrosilylation. Therefore, if it is added more than 7 parts by mass, the curing time will become longer, and the crosslinking density will even become too large, which will result in brittleness.

[(D)有機氫聚矽氧烷] [(D) Organohydrogen polysiloxane]

本發明之(D)成分可發揮交聯劑的作用,藉由氫矽烷化反應,與前述(A)~(C)成分形成交聯構造,而使該聚矽氧樹脂組成物硬化。 The component (D) of the present invention can function as a cross-linking agent and forms a cross-linked structure with the aforementioned components (A) to (C) by a hydrosilylation reaction, thereby hardening the silicone resin composition.

(D)一分子中具有至少2個氫矽烷基之有機氫聚矽氧烷並未受到特別限定,適合使用下述式(4)所表示的有機氫聚矽氧烷。 (D) The organohydrogenpolysiloxane having at least two hydrosilyl groups in one molecule is not particularly limited, and the organohydrogenpolysiloxane represented by the following formula (4) can be suitably used.

(R2 3SiO1/2)r’(R2 2SiO2/2)s’(R2SiO3/2)t’(SiO4/2)u’ (4)(式中,R2互相獨立地為氫原子或碳數1~12之取代或非取代的一價飽和烴基,R2的至少2個為氫原子,r’為0~100之整數、s’為0~300之整數、t’為0~200之整數、u’為0~200之整數,但是,2≦r’+s’+t’+u’≦800)。 (R 2 3 SiO 1/2 ) r' (R 2 2 SiO 2/2 ) s' (R 2 SiO 3/2 ) t' (SiO 4/2 ) u' (4) (where R 2 is mutually Independently is a hydrogen atom or a substituted or unsubstituted monovalent saturated hydrocarbon group with 1 to 12 carbons , at least two of R 2 are hydrogen atoms, r'is an integer from 0 to 100, s'is an integer from 0 to 300, t'is an integer from 0 to 200, u'is an integer from 0 to 200, but 2≦r'+s'+t'+u'≦800).

此處,R2為氫原子、或碳數1~12,尤其1~6之取 代或非取代的一價飽和烴基,一價飽和烴基的例子,具體而言,可例示甲基、乙基、丙基、丁基等的烷基;環戊基、環己基等的環烷基、及鍵結於這些基團中的碳原子之氫原子一部分或全部被氟、溴、氯等的鹵素原子、氰基等取代而成的基團等,而R2之中至少2個為氫原子,其他取代基宜為甲基。 Here, R 2 is a hydrogen atom, or a substituted or unsubstituted monovalent saturated hydrocarbon group having 1 to 12 carbon atoms, especially 1 to 6, examples of the monovalent saturated hydrocarbon group, specifically, methyl, ethyl, Alkyl groups such as propyl group and butyl group; cycloalkyl groups such as cyclopentyl group and cyclohexyl group, and hydrogen atoms of carbon atoms bonded to these groups are partially or completely replaced by halogen atoms such as fluorine, bromine, and chlorine, Groups substituted by cyano groups, etc., and at least two of R 2 are hydrogen atoms, and other substituents are preferably methyl groups.

r’為0~100之整數,宜為0~75之整數,更佳為0~50之整數,尤其是2以上為佳,s’為0~300之整數,宜為0~200之整數,更佳為0~100之整數,尤其是1以上,特別是2以上為佳。t’為0~200之整數,宜為0~100之整數,更佳為0~50之整數,u’為0~200之整數,宜為0~100之整數,更佳為0~50之整數,在2≦r’+s’+t’+u’≦800的範圍為佳,3≦r’+s’+t’+u’≦400的範圍為較佳,4≦r’+s’+t’+u’≦200的範圍為更佳。 r'is an integer from 0 to 100, preferably an integer from 0 to 75, more preferably an integer from 0 to 50, especially preferably 2 or more, s'is an integer from 0 to 300, preferably an integer from 0 to 200, More preferably, it is an integer of 0-100, especially 1 or more, especially 2 or more. t'is an integer of 0~200, preferably an integer of 0~100, more preferably an integer of 0~50, u'is an integer of 0~200, preferably an integer of 0~100, more preferably an integer of 0~50 Integer, preferably in the range of 2≦r'+s'+t'+u'≦800, preferably in the range of 3≦r'+s'+t'+u'≦400, 4≦r'+s The range of'+t'+u'≦200 is more preferable.

此外,氫原子在一分子中具有至少2個,在(D)成分中,宜含有0.1~10莫耳/100g,尤其0.5~5莫耳/100g。 In addition, there are at least two hydrogen atoms in one molecule, and the component (D) preferably contains 0.1-10 mol/100g, especially 0.5-5 mol/100g.

另外,氫原子可位於R2 3SiO1/2單元、R2 2SiO2/2單元、R2SiO3/2單元、或這些單元中的複數種,以在R2 3SiO2/2單元具有氫原子為佳。 In addition, the hydrogen atom can be located in the R 2 3 SiO 1/2 unit, R 2 2 SiO 2/2 unit, R 2 SiO 3/2 unit, or a plurality of these units, so as to be in the R 2 3 SiO 2/2 unit It is better to have a hydrogen atom.

(D)成分之一分子中具有至少2個氫矽烷基的有機氫聚矽氧烷,其添加量為相對於(A)~(C)成分中所含有的烯基1莫耳,(D)成分中的氫矽烷基為0.4~4.0莫耳的量,宜為0.6~2.0莫耳的量,更佳為0.8~1.6莫耳的 量。在未達0.4莫耳的情況,SiH基不足,因此硬化不良,若超過4.0莫耳,則殘存的SiH基容易導致脫氫等的副反應發生。 (D) An organohydrogen polysiloxane having at least two hydrosilyl groups in one molecule of the component, and its addition amount is 1 mol relative to the alkenyl group contained in the components (A) to (C), (D) The amount of hydrosilyl group in the composition is 0.4 to 4.0 mol, preferably 0.6 to 2.0 mol, more preferably 0.8 to 1.6 mol the amount. If it is less than 0.4 mol, the SiH group is insufficient and hardening is poor. If it exceeds 4.0 mol, the remaining SiH group is likely to cause side reactions such as dehydrogenation.

[(E)氫矽烷化觸媒] [(E) Hydrosilylation catalyst]

(E)成分為氫矽烷化觸媒。該觸媒只要具有使氫矽烷化反應進行的能力即可,並未受到特別限定。尤其宜為選自鉑族金屬單體及鉑族金屬化合物的觸媒。可列舉例如鉑(包括鉑黑)、氯化鉑、氯鉑酸、鉑-二乙烯基矽氧烷錯合物等的鉑-烯烴錯合物、鉑-羰基錯合物等的鉑觸媒、鈀觸媒、銠觸媒等。這些觸媒可單獨使用一種或組合兩種以上來使用。該等之中,特佳為氯鉑酸、及鉑-二乙烯基矽氧烷錯合物等的鉑-烯烴錯合物。 (E) The component is a hydrosilylation catalyst. The catalyst is not particularly limited as long as it has the ability to advance the hydrosilylation reaction. In particular, it is preferably a catalyst selected from platinum group metal monomers and platinum group metal compounds. Examples include platinum (including platinum black), platinum chloride, chloroplatinic acid, platinum-divinylsiloxane complexes and other platinum-olefin complexes, platinum-carbonyl complexes and other platinum catalysts, Palladium catalyst, rhodium catalyst, etc. These catalysts can be used alone or in combination of two or more. Among them, particularly preferred are platinum-olefin complexes such as chloroplatinic acid and platinum-divinylsiloxane complexes.

(E)成分的摻合量為觸媒量即可。觸媒量只要是可使氫矽烷化反應進行的量即可,並且因應所希望的硬化速度適當地調整即可。例如在鉑族金屬觸媒的情況,從反應速率的觀點看來,以換算為鉑族金屬原子的質量基準而計,上述相對於(A)~(D)成分的合計質量,以5~20ppm的量為佳,甚至5~10ppm的量為較佳。 (E) The blending amount of the component may be the amount of the catalyst. The amount of the catalyst may be any amount that allows the hydrosilylation reaction to proceed, and may be appropriately adjusted in accordance with the desired curing rate. For example, in the case of platinum group metal catalysts, from the viewpoint of the reaction rate, based on the mass basis of platinum group metal atoms, the above-mentioned total mass of the components (A) to (D) is 5-20 ppm The amount of is better, and even the amount of 5-10 ppm is better.

本發明之硬化性組成物中,除了上述(A)~(E)成分以外,還可因應必要含有螢光體、無機填充材、接著助劑、硬化抑制劑等。以下針對各成分作說明。 In addition to the above-mentioned (A) to (E) components, the curable composition of the present invention may contain phosphors, inorganic fillers, adhesives, curing inhibitors, etc. as necessary. The following is an explanation of each ingredient.

[螢光體] [Fluorescent body]

螢光體並不受特別限制,只要使用以往周知的螢光體即可。例如以吸收來自半導體元件,尤其是以氮化物系半導體作為發光層的半導體發光二極體的光線,轉換成不同波長的光線的物質為佳。這種螢光體,宜為例如選自主要藉由Eu、Ce等的鑭系元素活化的氮化物系螢光體、氮氧化物系螢光體、主要藉由Eu等的鑭系、Mn等的過渡金屬系元素活化的鹼土類金屬鹵素磷灰石螢光體、鹼土類金屬硼酸鹵素螢光體、鹼土類金屬鋁酸鹽螢光體、鹼土類金屬矽酸鹽螢光體、鹼土類金屬硫化物螢光體、鹼土類金屬硫代鎵酸鹽螢光體、鹼土類金屬氮化矽螢光體、鍺酸鹽螢光體,或主要藉由Ce等的鑭系元素活化的稀土類鋁酸鹽螢光體、稀土類矽酸鹽螢光體,或主要藉由Eu等的鑭系元素活化的有機錯合物螢光體、Ca-Al-Si-O-N系氧氮化物玻璃螢光體等的一種以上。 The phosphor is not particularly limited, as long as a conventionally known phosphor is used. For example, a substance that absorbs light from a semiconductor element, especially a semiconductor light-emitting diode with a nitride-based semiconductor as the light-emitting layer, and converts it into light of different wavelengths is preferable. Such a phosphor is preferably selected from, for example, nitride-based phosphors, oxynitride-based phosphors that are mainly activated by lanthanide elements such as Eu, Ce, and lanthanides, Mn, etc. Alkaline earth metal halide phosphors activated by transition metal elements, alkaline earth metal borate halogen phosphors, alkaline earth metal aluminate phosphors, alkaline earth metal silicate phosphors, alkaline earth metal sulfides Phosphors, alkaline earth metal thiogallate phosphors, alkaline earth metal silicon nitride phosphors, germanate phosphors, or rare earth aluminates mainly activated by lanthanides such as Ce Phosphors, rare earth silicate phosphors, or organic complex phosphors mainly activated by lanthanides such as Eu, Ca-Al-Si-ON oxynitride glass phosphors, etc. More than one kind.

主要藉由Eu、Ce等的鑭系元素活化的氮化物系螢光體,可列舉M2Si5N8:Eu(M為選自Sr、Ca、Ba、Mg、Zn的至少一種)。另外還可列舉MSi7N10:Eu、M1.8Si5O0.2N8:Eu、及M0.9Si7O0.1N10:Eu(M為選自Sr、Ca、Ba、Mg、Zn的至少一種)等。 Nitride-based phosphors mainly activated by lanthanide elements such as Eu and Ce include M 2 Si 5 N 8 : Eu (M is at least one selected from Sr, Ca, Ba, Mg, and Zn). In addition, MSi 7 N 10 : Eu, M 1.8 Si 5 O 0.2 N 8 : Eu, and M 0.9 Si 7 O 0.1 N 10 : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn )Wait.

主要藉由Eu、Ce等的鑭系元素活化的氮氧化物系螢光體,可列舉MSi2O2N2:Eu(M為選自Sr、Ca、Ba、Mg、Zn的至少一種)。 The oxynitride phosphors mainly activated by lanthanide elements such as Eu and Ce include MSi 2 O 2 N 2 : Eu (M is at least one selected from Sr, Ca, Ba, Mg, and Zn).

主要藉由Eu等的鑭系、Mn等的過渡金屬系元素活化的鹼土類金屬鹵素磷灰石螢光體,可列舉 M5(PO4)3X:R(M為選自Sr、Ca、Ba、Mg、Zn的至少一種,X為選自F、Cl、Br、I的至少一種,R為Eu、Mn、Eu及Mn的任一種以上)。 Alkaline earth metal halide apatite fluors mainly activated by transition metal elements such as Eu and other lanthanides, Mn, etc., include M 5 (PO 4 ) 3 X: R (M is selected from Sr, Ca, Ba, At least one of Mg and Zn, X is at least one selected from F, Cl, Br, and I, and R is any one or more of Eu, Mn, Eu, and Mn).

鹼土類金屬硼酸鹵素螢光體,可列舉M2B5O9X:R(M為選自Sr、Ca、Ba、Mg、Zn的至少一種,X為選自F、Cl、Br、I的至少一種,R為Eu、Mn、Eu及Mn的任一種以上)。 Alkaline earth metal borate halogen phosphors, including M 2 B 5 O 9 X: R (M is at least one selected from Sr, Ca, Ba, Mg, Zn, and X is selected from F, Cl, Br, I At least one, R is any one or more of Eu, Mn, Eu, and Mn).

鹼土類金屬鋁酸鹽螢光體,可列舉SrAl2O4:R、Sr4Al14O25:R、CaAl2O4:R、BaMg2Al16O27:R、BaMg2Al16O12:R、及BaMgAl10O17:R(R為Eu、Mn、Eu及Mn的任一種以上)。 Alkaline earth metal aluminate phosphors include SrAl 2 O 4 : R, Sr 4 Al 14 O 25 : R, CaAl 2 O 4 : R, BaMg 2 Al 16 O 27 : R, BaMg 2 Al 16 O 12 : R, and BaMgAl 10 O 17 : R (R is any one or more of Eu, Mn, Eu, and Mn).

鹼土類金屬硫化物螢光體,可列舉La2O2S:Eu、Y2O2S:Eu、及Gd2O2S:Eu等。 Examples of alkaline earth metal sulfide phosphors include La 2 O 2 S: Eu, Y 2 O 2 S: Eu, and Gd 2 O 2 S: Eu.

主要藉由Ce等的鑭系元素活化的稀土類鋁酸鹽螢光體,可列舉Y3Al5O12:Ce、(Y0.8Gd0.2)3Al5O12:Ce、Y3(Al0.8Ga0.2)5O12:Ce、及(Y,Gd)3(Al,Ga)5O12的組成式所表示的YAG系螢光體。另外還有Y的一部分或全部被Tb、Lu等取代的Tb3Al5O12:Ce、Lu3Al5O12:Ce等。 Rare earth aluminate phosphors activated mainly by lanthanide elements such as Ce include Y 3 Al 5 O 12 : Ce, (Y 0.8 Gd 0.2 ) 3 Al 5 O 12 : Ce, Y 3 (Al 0.8 Ga 0.2 ) 5 O 12 : A YAG-based phosphor represented by the composition formula of Ce and (Y, Gd) 3 (Al, Ga) 5 O 12. In addition, there are Tb 3 Al 5 O 12 : Ce, Lu 3 Al 5 O 12 : Ce, etc. in which part or all of Y is substituted by Tb, Lu, and the like.

其他螢光體,可列舉ZnS:Eu、Zn2GeO4:Mr1、MGa2S4:Eu(M為選自Sr、Ca、Ba、Mg、Zn的至少一種)等。 Other phosphors include ZnS: Eu, Zn 2 GeO 4 : Mr 1 , MGa 2 S 4 : Eu (M is at least one selected from Sr, Ca, Ba, Mg, and Zn).

上述螢光體中,可因應需要含有選自Tb、Cu、Ag、Au、Cr、Nd、Dy、Co、Ni、Ti的一種以上來代替Eu,或與Eu一起。 The above-mentioned phosphors may contain at least one selected from Tb, Cu, Ag, Au, Cr, Nd, Dy, Co, Ni, and Ti instead of or together with Eu as required.

Ca-Al-Si-O-N系氧氮化物玻璃螢光體,是指以氧氮化物玻璃作為母體材料的螢光體,該氧氮化物玻璃之中,以莫耳%來表示,CaCO3以CaO換算為20~50莫耳%、Al2O3為0~30莫耳%、SiO為25~60莫耳%、AlN為5~50莫耳%、稀土類氧化物或過渡金屬氧化物為0.1~20莫耳%,五種成分合計為100莫耳%。此外,在以氧氮化物玻璃作為母體材料的螢光體中,氮含量宜為15莫耳%以下,並且除了稀土類氧化物離子之外,宜含有當作增感劑的其他稀土類元素離子以作為共活化劑,其在螢光玻璃中的含量,以稀土類氧化物而計在0.1~10莫耳%的範圍。 Ca-Al-Si-ON-based oxynitride glass phosphor refers to a phosphor using oxynitride glass as a matrix material. In the oxynitride glass, it is expressed in mole %, and CaCO 3 is CaO Converted to 20-50 mol%, Al 2 O 3 is 0-30 mol%, SiO is 25-60 mol%, AlN is 5-50 mol%, rare earth oxides or transition metal oxides are 0.1 ~20 mol%, the total of the five components is 100 mol%. In addition, in the phosphor with oxynitride glass as the matrix material, the nitrogen content is preferably 15 mol% or less, and in addition to the rare earth oxide ions, it is advisable to contain other rare earth element ions as a sensitizer As a co-activator, its content in the fluorescent glass is in the range of 0.1-10 mol% in terms of rare earth oxides.

另外還可使用上述螢光體以外且具有同樣性能、效果的螢光體。 In addition, phosphors other than the above-mentioned phosphors that have the same performance and effects can also be used.

在摻合螢光體的情況,其摻合量,相對於(A)~(D)成分100質量份,宜為0.1~2,000質量份,較佳為0.1~100質量份。在將本發明之硬化物製成含螢光體的波長轉換薄膜的情況,螢光體的摻合量,宜定在10~2,000質量份。另外,螢光體的平均粒徑宜為10nm以上,較佳為10nm~10μm,更佳為10nm~1μm。上述平均粒徑,可藉由CILAS雷射測定裝置等,利用雷射光繞射法進行的粒度分布測定來作測定。 When the phosphor is blended, the blending amount is preferably 0.1 to 2,000 parts by mass, and more preferably 0.1 to 100 parts by mass relative to 100 parts by mass of the components (A) to (D). When the cured product of the present invention is made into a phosphor-containing wavelength conversion film, the blending amount of the phosphor is preferably set at 10 to 2,000 parts by mass. In addition, the average particle diameter of the phosphor is preferably 10 nm or more, preferably 10 nm to 10 μm, and more preferably 10 nm to 1 μm. The above-mentioned average particle size can be measured by a CILAS laser measuring device, etc., by a particle size distribution measurement by a laser light diffraction method.

[無機填充材] [Inorganic Filler]

無機填充材,可列舉例如二氧化矽、發煙二氧化矽、 發煙二氧化鈦、氧化鋁、碳酸鈣、矽酸鈣、二氧化鈦、氧化鐵(III)、氧化鋅等。該等可單獨使用一種或併用兩種以上。在摻合無機填充材的情況,其摻合量並不受特別限制,只要以每(A)~(D)成分合計的100質量份為20質量份以下,宜為0.1~10質量份的範圍適當地摻合即可。 Inorganic fillers, for example, silica, fuming silica, Fuming titanium dioxide, aluminum oxide, calcium carbonate, calcium silicate, titanium dioxide, iron (III) oxide, zinc oxide, etc. These can be used individually by 1 type or in combination of 2 or more types. In the case of blending inorganic fillers, the blending amount is not particularly limited, as long as it is 20 parts by mass or less per 100 parts by mass of the total of components (A) to (D), preferably in the range of 0.1-10 parts by mass It is sufficient to blend appropriately.

[接著助劑] [Adhesive agent]

本發明之硬化性組成物中,為了賦予接著性,可因應必要含有接著助劑。接著助劑,可列舉例如在一分子中具有由鍵結於矽原子的氫原子、烯基、烷氧基、環氧基所選出的官能性基至少兩種,宜為三種之有機矽氧烷寡聚物。該有機矽氧烷寡聚物中,矽原子數宜為4~50個,較佳為4~20個。另外,接著助劑,可使用下述一般式(5)所表示的有機氧甲矽烷基改質異氰尿酸酯化合物、及其水解縮合物(有機矽氧烷改質異氰尿酸酯化合物)。 In order to impart adhesiveness to the curable composition of the present invention, an adhesive auxiliary agent may be contained as necessary. The auxiliary agent may be, for example, an organosiloxane having at least two functional groups selected from a hydrogen atom, an alkenyl group, an alkoxy group, and an epoxy group bonded to a silicon atom in one molecule, preferably three types of organosiloxanes Oligomer. In the organosiloxane oligomer, the number of silicon atoms is preferably 4-50, preferably 4-20. In addition, as an adhesive agent, an organooxysilyl-modified isocyanurate compound represented by the following general formula (5), and its hydrolysis condensate (organosiloxane-modified isocyanurate compound) can be used. ).

Figure 106109568-A0202-12-0016-5
Figure 106109568-A0202-12-0016-5

上述式(5)中,R3互相獨立地為下述式(6)所表示的有機基、或可具有氧原子的脂肪族不飽和一價烴基。但是,R3的至少1個為下述式(6)所表示之基。 In the above formula (5), R 3 is independently an organic group represented by the following formula (6) or an aliphatic unsaturated monovalent hydrocarbon group which may have an oxygen atom. However, at least one of R 3 is a group represented by the following formula (6).

Figure 106109568-A0202-12-0017-6
(R4為氫原子或碳數1~6之甲基、乙基等的一價烴基,k為1~6之整數,宜為1~4之整數)。
Figure 106109568-A0202-12-0017-6
(R 4 is a hydrogen atom or a monovalent hydrocarbon group such as a methyl or ethyl group with a carbon number of 1 to 6, and k is an integer of 1 to 6, preferably an integer of 1 to 4).

上述式(5)之中,R3之可具有氧原子的一價脂肪族不飽和烴基,宜為碳數2~8、更佳為碳數2~6之直鏈狀或分支之烯基,可列舉例如乙烯基、烯丙基、1-丁烯基、1-己烯基、2-甲基丙烯基、或(甲基)丙烯酸基等。 In the above formula (5), the monovalent aliphatic unsaturated hydrocarbon group which may have an oxygen atom for R 3 is preferably a linear or branched alkenyl group having 2 to 8 carbon atoms, more preferably 2 to 6 carbon atoms, For example, a vinyl group, an allyl group, a 1-butenyl group, a 1-hexenyl group, a 2-methpropenyl group, or a (meth)acrylic group can be mentioned.

在摻合接著助劑的情況,其摻合量,相對於(A)~(D)成分的合計100質量份,宜為10質量份以下,較佳為0.1~8質量份,特佳為0.2~5質量份。摻合量只要在上述上限值以下,則硬化物硬度高,亦可抑制表面沾黏性。 In the case of blending an adhesive agent, the blending amount is preferably 10 parts by mass or less, preferably 0.1 to 8 parts by mass, and particularly preferably 0.2, relative to 100 parts by mass of the total of components (A) to (D). ~5 parts by mass. As long as the blending amount is below the above upper limit, the hardness of the hardened product will be high and the surface stickiness can also be suppressed.

另外,在摻合接著助劑的情況,其摻合量,係以使含有本接著助劑的全組成物中的氫矽烷基合計個數相對於全組成物中的烯基合計個數之比成為0.4~4的量為佳,0.6~3的量為較佳,0.8~2的量為更佳。 In addition, when an adhesive agent is blended, the blending amount is such that the ratio of the total number of hydrosilyl groups in the entire composition containing the adhesive agent to the total number of alkenyl groups in the entire composition The amount of 0.4 to 4 is preferable, the amount of 0.6 to 3 is more preferable, and the amount of 0.8 to 2 is more preferable.

[硬化抑制劑] [Sclerosis inhibitor]

本發明之硬化性組成物中,為了控制反應性,提高貯藏安定性,可含有硬化抑制劑。硬化抑制劑,可列舉選自 異氰尿酸三烯丙酯、馬來酸烷基酯、乙炔醇類、及其矽烷改質物及矽氧烷改質物、過氧化氫、四甲基乙二胺、苯并三唑、及該等的混合物所構成的群組之化合物。在摻合硬化抑制劑的情況,其摻合量,相對於(E)成分之氫矽烷化觸媒中的觸媒有效量,以莫耳比而計,宜為5~100倍的量,較佳為5~50倍的量。 The curable composition of the present invention may contain a curing inhibitor in order to control reactivity and improve storage stability. Hardening inhibitors can be selected from Triallyl isocyanurate, alkyl maleate, acetylene alcohols, and silane-modified products and siloxane-modified products, hydrogen peroxide, tetramethylethylenediamine, benzotriazole, and the like The compound of the group formed by the mixture. In the case of blending a hardening inhibitor, the blending amount is 5 to 100 times the effective amount of the catalyst in the hydrosilylation catalyst of component (E) in terms of molar ratio. Preferably, the amount is 5 to 50 times.

[其他添加劑] [Other additives]

在本發明之硬化性組成物中,除了上述成分之外,還可摻合其他添加劑。其他添加劑,可列舉例如抗老化劑、自由基禁止劑、阻燃劑、界面活性劑、臭氧劣化防止劑、光安定劑、增黏劑、可塑劑、抗氧化劑、熱安定劑、導電性賦予劑、抗靜電劑、放射線遮蔽劑、核劑、磷系過氧化物分解劑、潤滑劑、顏料、金屬失活劑、物性調整劑、有機溶劑等。這些任意成分可單獨使用一種或併用兩種以上。 In the curable composition of the present invention, in addition to the above-mentioned components, other additives may be blended. Other additives include, for example, anti-aging agents, free radical inhibitors, flame retardants, surfactants, ozone degradation inhibitors, light stabilizers, tackifiers, plasticizers, antioxidants, heat stabilizers, conductivity imparting agents , Antistatic agents, radiation shielding agents, nucleating agents, phosphorus peroxide decomposers, lubricants, pigments, metal deactivators, physical property regulators, organic solvents, etc. These arbitrary components can be used individually by 1 type or in combination of 2 or more types.

本發明之硬化性組成物最單純的實施形態,是由(A)成分、(B)成分、(C)成分、(D)成分及(E)成分所構成的組成物。宜為由(A)成分、(B)成分、(C)成分、(D)成分、(E)成分及螢光體所構成的組成物。尤其為了得到具有高透明性的硬化物,宜不含二氧化矽等的無機填充材。該無機填充材的例子如上述。 The simplest embodiment of the curable composition of the present invention is a composition composed of (A) component, (B) component, (C) component, (D) component, and (E) component. It is preferably a composition composed of (A) component, (B) component, (C) component, (D) component, (E) component, and phosphor. In particular, in order to obtain a cured product with high transparency, it is preferable not to contain inorganic fillers such as silicon dioxide. Examples of this inorganic filler are as described above.

本發明之硬化性組成物的調製方法並不受特別限制,只要依據以往周知的方法即可。例如可將(A)、 (B)、(C)、(D)及(E)成分藉由任意方法混合而調製。或者只要將(A)、(B)、(C)、(D)、(E)成分與螢光體、或(A)、(B)、(C)、(D)、(E)成分、及任意成分藉由任意方法混合而調製即可。例如可藉由裝入市售的攪拌機(THINKY CONDITIONING MIXER(Thinky股份有限公司製)等),均勻混合1~5分鐘左右而調製。 The preparation method of the curable composition of the present invention is not particularly limited, as long as it is based on a conventionally known method. For example, (A), The components (B), (C), (D), and (E) are mixed and prepared by any method. Or as long as the (A), (B), (C), (D), (E) components and the phosphor, or (A), (B), (C), (D), (E) components, And any components may be mixed and prepared by any method. For example, it can be prepared by putting it in a commercially available mixer (THINKY CONDITIONING MIXER (manufactured by Thinky Co., Ltd.), etc.) and mixing uniformly for about 1 to 5 minutes.

使本發明之硬化性組成物硬化的方法不受特別限制,只要依照以往周知的方法即可。例如可在60~180℃硬化1~12小時左右。尤其以在60~180℃,宜為60~150℃下藉由分段硬化來使其硬化為佳。在分段硬化時,以經過以下的兩階段為較佳。首先,將硬化性組成物在60~100℃的溫度下加熱0.5~2小時,使其充分脫泡。接下來使硬化性組成物在120~180℃的溫度下加熱硬化1~10小時。藉由經過這些階段,即使在硬化物厚的情況,也能夠充分硬化,氣泡不會發生,而呈無色透明。此外,在本發明中無色透明的硬化物,意指厚度為1mm時,在450nm的透光率為80%以上,宜為85%以上,特佳為90%以上的硬化物。透光率的測定如後述。 The method of hardening the curable composition of the present invention is not particularly limited, as long as it is in accordance with a conventionally known method. For example, it can be cured at 60~180℃ for about 1~12 hours. Particularly, it is better to harden it by stepwise hardening at 60~180℃, preferably 60~150℃. In the stage hardening, it is better to go through the following two stages. First, the curable composition is heated at a temperature of 60 to 100°C for 0.5 to 2 hours to fully defoam. Next, the curable composition is heat-cured at a temperature of 120 to 180°C for 1 to 10 hours. By going through these stages, even when the hardened material is thick, it can be cured sufficiently, bubbles will not occur, and it is colorless and transparent. In addition, the colorless and transparent cured product in the present invention means a cured product having a light transmittance at 450 nm of 80% or more at a thickness of 1 mm, preferably 85% or more, and particularly preferably 90% or more. The measurement of the light transmittance will be described later.

本發明之硬化性組成物可產生具有高光學透過率的硬化物。所以,本發明之硬化性組成物,在LED元件密封用途方面,尤其是藍色LED或紫外LED的元件密封用途方面,是有用的物品。以本發明之硬化性組成物來密封LED元件等的方法,只要依照以往周知的方法即可。例如可藉由點膠法、壓縮模製法等來進行。 The curable composition of the present invention can produce a cured product with high optical transmittance. Therefore, the curable composition of the present invention is useful in LED device sealing applications, especially in blue LED or ultraviolet LED device sealing applications. The method of sealing LED elements and the like with the curable composition of the present invention may be in accordance with a conventionally known method. For example, it can be performed by a dispensing method, a compression molding method, or the like.

本發明之硬化性組成物及硬化物,其他方面,由於其具有優異的耐龜裂性、耐熱性、耐光性、透明性等的特性,因此在顯示材料、光記錄媒體材料、光學機器材料、光學零件材料、光纖維材料、光電機能性有機材料、半導體積體電路周邊材料等的用途也很有用。 In other respects, the curable composition and cured product of the present invention have excellent characteristics such as crack resistance, heat resistance, light resistance, transparency, etc., and are therefore used in display materials, optical recording media materials, optical device materials, Optical component materials, optical fiber materials, photoelectric energy organic materials, semiconductor integrated circuit peripheral materials, etc. are also very useful.

[實施例] [Example]

以下揭示實施例及比較例對本發明作更詳細的說明,然而本發明不受下述實施例限制。 The following examples and comparative examples are disclosed to illustrate the present invention in more detail, but the present invention is not limited by the following examples.

下述實施例中所揭示的重量平均分子量(Mw),是藉由以聚苯乙烯為標準物質的凝膠滲透層析(GPC)所測得之值。以下揭示測定條件。 The weight average molecular weight (Mw) disclosed in the following examples is a value measured by gel permeation chromatography (GPC) using polystyrene as a standard substance. The measurement conditions are disclosed below.

[GPC測定條件] [GPC measurement conditions]

展開溶劑:四氫呋喃 Developing solvent: tetrahydrofuran

流速:0.6mL/min Flow rate: 0.6mL/min

管柱:TSK Guardcolumn SuperH-L Column: TSK Guardcolumn SuperH-L

TSKgel SuperH4000(6.0mm I.D.×15cm×1) TSKgel SuperH4000(6.0mm I.D.×15cm×1)

TSKgel SuperH3000(6.0mm I.D.×15cm×1) TSKgel SuperH3000(6.0mm I.D.×15cm×1)

TSKgel SuperH2000(6.0mm I.D.×15cm×2) TSKgel SuperH2000(6.0mm I.D.×15cm×2)

(任一者皆為東曹公司製) (Any one is manufactured by Tosoh Corporation)

管柱溫度:40℃ Column temperature: 40℃

試樣注入量:20μL(試樣濃度:0.5質量%-四氫呋喃溶液)偵測器;示差折射率計(RI) Sample injection volume: 20μL (sample concentration: 0.5% by mass-tetrahydrofuran solution) detector; differential refractometer (RI)

下述實施例所示的Vi(乙烯基)價(莫耳/100g)及SiH價(莫耳/100g),是測定化合物在400MHz的1H-NMR光譜,並以二甲亞碸作為內標準品,由所得到的乙烯基或氫矽烷基的氫原子積分值來作計算。 The Vi (vinyl) valence (mole/100g) and SiH valence (mole/100g) shown in the following examples are measured by 1 H-NMR spectrum of the compound at 400 MHz, and dimethyl sulfide is used as the internal standard The product is calculated from the integral value of the hydrogen atom of the obtained vinyl or hydrosilyl group.

將實施例及比較例之中所使用的(C)成分揭示如下。此外,下述式中Me表示甲基。 The component (C) used in Examples and Comparative Examples is disclosed as follows. In addition, in the following formula, Me represents a methyl group.

(C-1)1,3,5,7-四甲基-1,3,5,7-四乙烯基環四矽氧烷(Vi價=1.16莫耳/100g) (C-1) 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane (Vi value=1.16mol/100g)

(C-2)1,3,5-三甲基-1,3,5-三乙烯基環三矽氧烷(Vi價=1.16莫耳/100g) (C-2) 1,3,5-trimethyl-1,3,5-trivinyl cyclotrisiloxane (Vi value=1.16 mol/100g)

(C-1’)下述式所表示的兩末端乙烯基二甲基聚矽氧油(信越化學工業股份有限公司製,Vi價=0.217莫耳/100g) (C-1') Vinyl dimethyl polysiloxane oil at both ends represented by the following formula (manufactured by Shin-Etsu Chemical Co., Ltd., Vi value = 0.217 mol/100g)

Figure 106109568-A0202-12-0021-7
Figure 106109568-A0202-12-0021-7

(C-2’)下述式所表示之兩末端乙烯基(二甲基)(甲基乙烯基)聚矽氧油(信越化學工業股份有限公司製,Vi價=1.14莫耳/100g) (C-2') Two-terminal vinyl (dimethyl) (methyl vinyl) polysiloxane oil represented by the following formula (manufactured by Shin-Etsu Chemical Co., Ltd., Vi price = 1.14 mol/100g)

Figure 106109568-A0202-12-0022-8
Figure 106109568-A0202-12-0022-8

(C-3’)1,3,5,7-四甲基環四矽氧烷(SiH價=1.18莫耳/100g) (C-3’)1,3,5,7-Tetramethylcyclotetrasiloxane (SiH value=1.18mol/100g)

以下揭示實施例及比較例之中所使用的(A)成分、(B)成分、(D)成分及(E)成分。此外,下述式中Me表示甲基。 The (A) component, (B) component, (D) component, and (E) component used in the Example and the comparative example are shown below. In addition, in the following formula, Me represents a methyl group.

(A)下述式所表示之甲基系聚矽氧樹脂(信越化學工業股份有限公司製,Vi價=9.12×10-2莫耳/100g) (A) Methyl silicone resin represented by the following formula (manufactured by Shin-Etsu Chemical Co., Ltd., Vi price = 9.12×10 -2 mol/100g)

Figure 106109568-A0202-12-0022-9
Figure 106109568-A0202-12-0022-9

(B)下述式所表示之兩末端乙烯基二甲基聚矽氧油(信越化學工業股份有限公司製,Vi價=5.12×10-3莫耳/100g) (B) Two-terminal vinyl dimethyl polysiloxane oil represented by the following formula (manufactured by Shin-Etsu Chemical Co., Ltd., Vi value = 5.12×10 -3 mol/100g)

Figure 106109568-A0202-12-0023-10
Figure 106109568-A0202-12-0023-10

(D)下述式所表示之含SiH基的直鏈狀聚矽氧油(信越化學工業股份有限公司製,SiH價=1.63莫耳/100g) (D) The SiH group-containing linear polysiloxane oil represented by the following formula (manufactured by Shin-Etsu Chemical Co., Ltd., SiH value=1.63 mol/100g)

Figure 106109568-A0202-12-0023-11
Figure 106109568-A0202-12-0023-11

(E)氯鉑酸的二乙烯基矽氧烷錯合物 (E) Divinylsiloxane complex of chloroplatinic acid

[實施例1] [Example 1]

將53質量份的(A)、36質量份的(B)、4質量份的(C)、7質量份的(D)混合,並加入以鉑量而計5ppm的(E)氯鉑酸的二乙烯基矽氧烷錯合物,加以混合,調製出硬化性組成物。 Mix 53 parts by mass of (A), 36 parts by mass (B), 4 parts by mass (C), and 7 parts by mass (D), and add 5 ppm of (E) chloroplatinic acid based on the amount of platinum The divinylsiloxane complex compound is mixed to prepare a curable composition.

[實施例2~4及比較例1~5] [Examples 2 to 4 and Comparative Examples 1 to 5]

將各成分的摻合量如表1所記載般變更,除此之外重覆與實施例1同樣的操作,調製出硬化性組成物。 The blending amount of each component was changed as described in Table 1, except that the same operation as in Example 1 was repeated to prepare a curable composition.

對於上述實施例1~4及比較例1~5所調製 出的硬化性組成物,進行以下所示的測試。 Prepared for the above examples 1 to 4 and comparative examples 1 to 5 The curable composition obtained was subjected to the test shown below.

[硬化性組成物的黏度] [Viscosity of curable composition]

依據JIS Z 8803:2011,使用B型黏度計,測定在23℃下的硬化性組成物的黏度。將結果記載於表1。 According to JIS Z 8803:2011, the viscosity of the curable composition at 23°C was measured using a type B viscometer. The results are shown in Table 1.

[硬化物的硬度] [Hardness of hardened material]

在50mm徑×10mm厚的鋁製淺皿中灌入調製好的硬化性組成物,依照60℃×1小時、100℃×1小時、150℃×4小時的順序進行分段硬化,製作出樣品。依據JIS K 6253-3:2012所記載的方法測定所得到的硬化物的硬度(硬度計Shore A或Shore D)。將結果記載於表1。 Pour the prepared curable composition in a 50mm diameter×10mm thick aluminum pan, and perform segmental curing in the order of 60°C×1 hour, 100°C×1 hour, and 150°C×4 hours to produce samples . The hardness (Shore A or Shore D) of the obtained hardened product was measured in accordance with the method described in JIS K 6253-3: 2012. The results are shown in Table 1.

[硬化物的透光率] [Light transmittance of hardened material]

在兩枚50mm×20mm×1mm厚的載玻片之間夾著凹字型的1mm厚的鐵氟龍(註冊商標)間隔件,將該等固定之後,灌入硬化性組成物,依照60℃×1小時、100℃×1小時、150℃×4小時的順序進行分段硬化,製作出透過率測定樣品。以分光光度計U-4100(股份有限公司日立HighTechnologies製)測定所得到的樣品在450nm的透光率。將結果記載於表1。 A recessed 1mm thick Teflon (registered trademark) spacer is sandwiched between two glass slides of 50mm×20mm×1mm thickness. After fixing these, the hardenable composition is poured in, and the temperature is 60°C. The stepwise curing was performed in the order of ×1 hour, 100°C ×1 hour, and 150°C ×4 hours to prepare transmittance measurement samples. The light transmittance of the obtained sample at 450 nm was measured with a spectrophotometer U-4100 (manufactured by Hitachi High Technologies Co., Ltd.). The results are shown in Table 1.

[硬化物的拉伸強度及切斷時的延伸率] [Tensile strength of hardened product and elongation when cut]

在150mm×200mm×2mm厚的凹型鐵氟龍(註冊商標)金 屬模具中灌入調製好的硬化性組成物,依照60℃×1小時、100℃×1小時、150℃×4小時的順序進行分段硬化,製作出測試樣品。依據JIS K 6251:2010,使用EZ TEST(EZ-L、島津製作所股份有限公司製),在測試速度500mm/min、夾具間距離80mm、標點問距離40mm的條件下,測定樣品的拉伸強度與切斷時的延伸率。將結果記載於表1。 In a concave Teflon (registered trademark) gold with a thickness of 150mm×200mm×2mm The prepared curable composition is poured into the mold, and the test samples are made by stepwise curing in the order of 60°C×1 hour, 100°C×1 hour, and 150°C×4 hours. According to JIS K 6251:2010, using EZ TEST (EZ-L, manufactured by Shimadzu Corporation), the tensile strength of the sample is measured under the conditions of a test speed of 500 mm/min, a distance between clamps of 80 mm, and a distance between marks of 40 mm. Elongation at cutting. The results are shown in Table 1.

[硬化物的沾黏性] [Adhesiveness of hardened material]

以姆指按壓在硬化物的表面1秒鐘,對於拉開時的抵抗進行官能評估。將感到抵抗的情況評為「有」、沒有感到抵抗的情況評為「無」。將結果揭示於表1。 Press the thumb on the surface of the hardened object for 1 second, and perform a sensory evaluation of the resistance when pulling it apart. The situation that felt resistance was rated as "Yes", and the situation that did not feel resistance was rated as "None". The results are shown in Table 1.

[硬化物的切割性] [Cutability of hardened material]

在凹型鐵氟龍(註冊商標)金屬模具中灌入調製好的硬化性組成物,依照60℃×1小時、100℃×1小時、150℃×4小時的順序進行分段硬化,製作出100mm×100mm×2mm厚的硬化物薄片。對於所得到的薄片,藉由ZP07-SD2000-F1B333NBC-ZB1050(DISCO股份有限公司)的刀片進行刀片切割來作評估。評估是將切割後的部分沒有凹陷的情況評為「良」、切割後的部分凹陷的情況評為「不良」。將結果揭示於表1。 Pour the prepared curable composition into a concave Teflon (registered trademark) metal mold, and perform segmental hardening in the order of 60°C×1 hour, 100°C×1 hour, and 150°C×4 hours to produce 100mm ×100mm×2mm thick hardened material sheet. For the obtained flakes, blade cutting was performed with a blade of ZP07-SD2000-F1B333NBC-ZB1050 (DISCO Co., Ltd.) for evaluation. In the evaluation, the case where there is no dent in the cut part is rated as "good", and the case where the part is dented after cutting is rated as "bad". The results are shown in Table 1.

Figure 106109568-A0202-12-0026-12
Figure 106109568-A0202-12-0026-12

如表1所示般,適量使用本發明之環狀乙烯基矽氧烷的硬化性聚矽氧樹脂組成物,可產生具有充足的強度,切割性良好,不會沾黏的硬化物。另外還可降低樹脂組成物的黏度,並且可期待作業效率的提升。 As shown in Table 1, an appropriate amount of the curable silicone resin composition of the cyclic vinylsiloxane of the present invention can produce a cured product with sufficient strength, good cutting properties, and non-sticking. In addition, the viscosity of the resin composition can be reduced, and an improvement in work efficiency can be expected.

此外,本發明不受限於上述實施形態。上述實施形態為例示,任何與本發明之申請專利範圍所記載的技術思想實質上具有相同的構成、發揮同樣的作用效果的物品,皆被包含在本發明之技術範圍。 In addition, the present invention is not limited to the above-mentioned embodiment. The above-mentioned embodiment is an example, and any article that has substantially the same structure and exerts the same effect as the technical idea described in the scope of the patent application of the present invention is included in the technical scope of the present invention.

Claims (4)

一種加成硬化性聚矽氧樹脂組成物,其特徵為:含有下述(A)~(E)成分,(A)下述式(1)所表示的分支狀有機聚矽氧烷(R1 3SiO1/2)r(R1 2SiO2/2)s(R1SiO3/2)t(SiO4/2)u (1)(式中,R1互相獨立地為選自碳數1~12之取代或非取代的一價飽和烴基及碳數2~6之烯基之基,但是R1的至少2個為烯基,r為0~100之整數、s為0~300之整數、t為0~200之整數、u為0~200之整數,但是1≦t+u≦400、3≦r+s+t+u≦800);(B)下述式(2)所表示的直鏈狀有機聚矽氧烷(R1 3SiO1/2)2(R1 2SiO2/2)x (2)(式(2)中,R1互相獨立地為選自碳數1~12之取代或非取代的一價飽和烴基及碳數2~6之烯基之基,但是R1的至少2個為烯基,且該烯基係位於分別的2個的(R1 3SiO1/2)單元,而不位於x個的(R1 2SiO2/2)單元,x為200~700(但是不包括x=200)之整數);(C)下述式(3)所表示的環狀乙烯基矽氧烷:相對於(A)及 (B)成分的合計100質量份為2~7質量份
Figure 106109568-A0305-02-0030-6
(式(3)中,R1與上述式(1)中的R1相同,n為3~6之整數);(D)一分子中具有至少2個氫矽烷基之有機氫聚矽氧烷:相對於(A)~(C)成分中之烯基1莫耳,(D)成分中的氫矽烷基為0.4~4.0莫耳的量、及(E)氫矽烷化觸媒:進行氫矽烷化反應所足夠的量。
An addition-curing polysiloxane resin composition characterized by containing the following components (A) to (E), (A) a branched organopolysiloxane represented by the following formula (1) (R 1 3 SiO 1/2 ) r (R 1 2 SiO 2/2 ) s (R 1 SiO 3/2 ) t (SiO 4/2 ) u (1) (where R 1 is independently selected from the carbon number 1-12 substituted or unsubstituted monovalent saturated hydrocarbon groups and carbon 2-6 alkenyl groups, but at least two of R 1 are alkenyl groups, r is an integer from 0 to 100, and s is from 0 to 300 Integer, t is an integer from 0 to 200, u is an integer from 0 to 200, but 1≦t+u≦400, 3≦r+s+t+u≦800); (B) the following formula (2) The linear organopolysiloxane represented by (R 1 3 SiO 1/2 ) 2 (R 1 2 SiO 2/2 ) x (2) (In formula (2), R 1 is independently selected from the carbon number 1-12 substituted or unsubstituted monovalent saturated hydrocarbon groups and carbon 2-6 alkenyl groups, but at least two of R 1 are alkenyl groups, and the alkenyl groups are located in the two (R 1 3 SiO 1/2 ) unit, instead of x (R 1 2 SiO 2/2 ) units, x is 200~700 (but not including the integer of x=200); (C) the following formula (3 Cyclic vinylsiloxane represented by ): 2-7 parts by mass relative to 100 parts by mass of the total of components (A) and (B)
Figure 106109568-A0305-02-0030-6
(In the formula (3), the same as R 1 (1) R in the above Formula 1, n is an integer of 3 to 6); (D) having an alkyl group of one molecule at least two silicon organohydrogen silicon hydrogen siloxane : Relative to 1 mol of alkenyl group in components (A) to (C), the amount of hydrosilyl group in component (D) is 0.4 to 4.0 mol, and (E) hydrosilylation catalyst: hydrogen silane The amount sufficient for the chemical reaction.
如申請專利範圍第1項之加成硬化性聚矽氧樹脂組成物,其中前述(A)成分與(B)成分的摻合比以質量比而計為(A):(B)=1:1~2:1。 For example, the addition curable silicone resin composition of item 1 in the scope of patent application, wherein the blending ratio of the aforementioned (A) component and (B) component is calculated by mass ratio as (A): (B)=1: 1~2:1. 如申請專利範圍第1或2項之加成硬化性聚矽氧樹脂組成物,其中前述(D)成分為下述式(4)所表示的有機氫聚矽氧烷(R2 3SiO1/2)r’(R2 2SiO2/2)s’(R2SiO3/2)t’(SiO4/2)u’ (4)(式中,R2互相獨立地為氫原子或碳數1~12之取代或非 取代的一價飽和烴基,R2的至少2個為氫原子,r’為0~100之整數、s’為0~300之整數、t’為0~200之整數、u’為0~200之整數,但是,2≦r’+s’+t’+u’≦800)。 For example, the addition curable silicone resin composition of item 1 or 2 of the scope of patent application, wherein the aforementioned (D) component is an organohydrogen polysiloxane represented by the following formula (4) (R 2 3 SiO 1/ 2 ) r' (R 2 2 SiO 2/2 ) s' (R 2 SiO 3/2 ) t' (SiO 4/2 ) u' (4) (where R 2 is independently a hydrogen atom or carbon A substituted or unsubstituted monovalent saturated hydrocarbon group with a number of 1-12, at least two of R 2 are hydrogen atoms, r'is an integer from 0 to 100, s'is an integer from 0 to 300, and t'is from 0 to 200 Integer, u'is an integer from 0 to 200, but 2≦r'+s'+t'+u'≦800). 如申請專利範圍第1或2項之加成硬化性聚矽氧樹脂組成物,其中前述(E)成分的摻合量相對於(A)~(D)成分的合計質量為5~20ppm的量。 For example, the addition curable silicone resin composition of item 1 or 2 of the scope of patent application, wherein the blending amount of the aforementioned (E) component is 5-20 ppm relative to the total mass of the (A) ~ (D) components .
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