TW201803913A - Addition-curable silicone resin composition - Google Patents
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本發明關於一種加成硬化性聚矽氧樹脂組成物。 The present invention relates to an addition-curable polysiloxane resin composition.
加成硬化型聚矽氧樹脂組成物,由於快速硬化性、硬化物的耐熱性、耐候性等優異,因此過去以來都被使用在用來將LED等的半導體元件密封的密封材。例如專利文獻1(日本特開2007-2234號公報)提出了對於由PPA等的熱塑性樹脂製作出的LED封裝表現出高接著力之加成硬化型聚矽氧樹脂組成物。另外,專利文獻2(日本特開2006-93354號公報)提出了藉由加成硬化型聚矽氧樹脂組成物的壓縮成型將光半導體元件密封的方法。 The addition-curable polysiloxane resin composition has been used as a sealing material for sealing semiconductor elements such as LEDs because of its excellent rapid curing properties, heat resistance of the cured material, and weather resistance. For example, Patent Document 1 (Japanese Patent Application Laid-Open No. 2007-2234) proposes an addition-hardening type silicone resin composition that exhibits high adhesion to an LED package made of a thermoplastic resin such as PPA. In addition, Patent Document 2 (Japanese Patent Application Laid-Open No. 2006-93354) proposes a method of sealing an optical semiconductor element by compression molding of an addition-hardening type silicone resin composition.
像這樣,加成硬化型聚矽氧樹脂一般被廣泛地使用作為半導體密封材料,然而其特性仍然無法令人滿意。一般而言,甲基聚矽氧樹脂,會有柔軟、切割性不良,而且大多數的情況下會發生沾黏這樣的缺點。若為了改進切割性而增加SiO4/2單元[Q單元]或RSiO3/2單元[T單元]成分,雖然可製作出硬且不會沾黏的硬化物,然而會變成強度低、質脆的樹脂。 In this manner, addition-curing polysiloxane resins are generally widely used as semiconductor sealing materials, but their characteristics are still unsatisfactory. In general, methyl silicone resins have the disadvantages of softness, poor cutting properties, and sticking in most cases. If the SiO 4/2 unit [Q unit] or RSiO 3/2 unit [T unit] component is added to improve the cuttability, although a hardened and non-sticky hardened product can be produced, it will become low strength and brittle. Of resin.
[專利文獻1]日本特開2007-2234號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2007-2234
[專利文獻2]日本特開2006-93354號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2006-93354
本發明鑑於上述問題而完成,目的為提供一種硬化前為低黏度且點膠性良好,硬化後產生具有充足的強度,切割性良好,不會沾黏的硬化物之加成硬化性聚矽氧樹脂組成物,尤其是甲基聚矽氧樹脂組成物。 The present invention has been made in view of the above problems, and an object thereof is to provide an addition-hardenable polysiloxane which has low viscosity before hardening and good dispensing properties, has sufficient strength after hardening, has good cutting properties, and does not stick to hardened materials. Resin composition, especially methyl silicone resin composition.
本發明人為了解決上述課題鑽研檢討的結果,發現含有下述(A)~(E)成分之加成硬化性聚矽氧樹脂組成物,(A)下述式(1)所表示的分支狀有機聚矽氧烷(R1 3SiO1/2)r(R1 2SiO2/2)s(R1SiO3/2)t(SiO4/2)u (1)(式中,R1互相獨立地為選自碳數1~12之取代或非取代的一價飽和烴基及碳數2~6之烯基之基,但是R1的至少2個為烯基,r為0~100之整數、s為0~300之整
數、t為0~200之整數、u為0~200之整數,但是1≦t+u≦400、3≦r+s+t+u≦800);(B)下述式(2)所表示的直鏈狀有機聚矽氧烷(R1 3SiO1/2)2(R1 2SiO2/2)x (2)(式中,R1與上述相同,但是R1的至少2個為烯基,x為200~700之整數);(C)下述式(3)所表示的環狀乙烯基矽氧烷:相對於(A)及(B)成分的合計100質量份為2~7質量份
亦即,本發明提供下述加成硬化性聚矽氧樹 脂組成物。 That is, the present invention provides the following addition-hardening polysiloxane Fat composition.
[1]一種加成硬化性聚矽氧樹脂組成物,其特徵為:含有下述(A)~(E)成分(A)下述式(1)所表示的分支狀有機聚矽氧烷(R1 3SiO1/2)r(R1 2SiO2/2)s(R1SiO3/2)t(SiO4/2)u (1)(式中,R1互相獨立地為選自碳數1~12之取代或非取代的一價飽和烴基及碳數2~6之烯基之基,但是R1的至少2個為烯基,r為0~100之整數、s為0~300之整數、t為0~200之整數、u為0~200之整數,但是1≦t+u≦400、3≦r+s+t+u≦800);(B)下述式(2)所表示的直鏈狀有機聚矽氧烷(R1 3SiO1/2)2(R1 2SiO2/2)x (2)(式中,R1與上述相同,但是R1的至少2個為烯基,x為200~700之整數);(C)下述式(3)所表示的環狀乙烯基矽氧烷:相對於(A)及(B)成分的合計100質量份為2~7質量份
[2]如[1]之加成硬化性聚矽氧樹脂組成物,其中前述(A)成分與(B)成分的摻合比以質量比而計為(A):(B)=1:1~2:1。 [2] The addition-curable polysiloxane resin composition according to [1], wherein the blending ratio of the component (A) and the component (B) is (A): (B) = 1: 1 ~ 2: 1.
[3]如[1]或[2]之加成硬化性聚矽氧樹脂組成物,其中前述(D)成分為下述式(4)所表示的有機氫聚矽氧烷(R2 3SiO1/2)r’(R2 2SiO2/2)s’(R2SiO3/2)t’(SiO4/2)u’ (4)(式中,R2互相獨立地為氫原子或碳數1~12之取代或非取代的一價飽和烴基,R2的至少2個為氫原子,r’為0~100之整數、s’為0~300之整數、t’為0~200之整數、u’為0~200之整數,但是,2≦r’+s’+t’+u’≦800)。 [3] The addition-curable polysiloxane resin composition according to [1] or [2], wherein the component (D) is an organohydrogenpolysiloxane (R 2 3 SiO) represented by the following formula (4) 1/2 ) r ' (R 2 2 SiO 2/2 ) s' (R 2 SiO 3/2 ) t ' (SiO 4/2 ) u' (4) (wherein R 2 is a hydrogen atom independently of each other Or a substituted or unsubstituted monovalent saturated hydrocarbon group having 1 to 12 carbon atoms, at least two of R 2 are hydrogen atoms, r 'is an integer of 0 to 100, s' is an integer of 0 to 300, and t' is 0 to An integer of 200 and u 'are integers of 0 to 200, but 2 ≦ r' + s' + t '+ u' ≦ 800).
[4]如[1]~[3]中任一項之加成硬化性聚矽氧樹脂組成物,其中前述(E)成分的摻合量,相對於(A)~(D)成分的合計質量為5~20ppm的量。 [4] The addition-curable silicone resin composition according to any one of [1] to [3], wherein the blending amount of the component (E) is relative to the total of the components (A) to (D) The mass is 5 to 20 ppm.
依據本發明,藉由添加足量的環狀乙烯基矽氧烷,可得到硬化前為低黏度且點膠性良好,硬化後產生 具有充足的強度,切割性良好,不會沾黏的硬化物之加成硬化性聚矽氧樹脂組成物。 According to the present invention, by adding a sufficient amount of cyclic vinyl siloxane, a low viscosity before hardening and good dispensability can be obtained, which is generated after hardening. Addition hardening silicone composition with sufficient strength, good cutting properties, and non-sticky hardened material.
以下針對本發明之各成分作說明。 Each component of the present invention will be described below.
本發明之(A)成分是本發明之加成硬化性聚矽氧樹脂組成物的主成分,且為下述式(1)所表示的有機聚矽氧烷。 The component (A) of the present invention is a main component of the addition-curable polysiloxane resin composition of the present invention, and is an organopolysiloxane represented by the following formula (1).
(R1 3SiO1/2)r(R1 2SiO2/2)s(R1SiO3/2)t(SiO4/2)u (1)(式中,R1互相獨立地為選自碳數1~12之取代或非取代的一價飽和烴基及碳數2~6之烯基之基,但是R1的至少2個為烯基,r為0~100之整數、s為0~300之整數、t為0~200之整數、u為0~200之整數,但是1≦t+u≦400、3≦r+s+t+u≦800)。 (R 1 3 SiO 1/2 ) r (R 1 2 SiO 2/2 ) s (R 1 SiO 3/2 ) t (SiO 4/2 ) u (1) (where R 1 is selected independently of each other From substituted or unsubstituted monovalent saturated hydrocarbon groups having 1 to 12 carbon atoms and alkenyl groups having 2 to 6 carbon atoms, but at least two of R 1 are alkenyl groups, r is an integer of 0 to 100, and s is 0 An integer of ~ 300, t is an integer of 0 to 200, and u is an integer of 0 to 200, but 1 ≦ t + u ≦ 400, 3 ≦ r + s + t + u ≦ 800).
此處,R1為選自碳數1~12,宜為1~6,較佳為1~4之取代或非取代的一價飽和烴基及碳數2~6之烯基之基。一價飽和烴基的例子,具體而言,可例示甲基、乙基、丙基、丁基等的烷基;環戊基、環己基等的環烷基、及鍵結於這些基團中的碳原子之氫原子一部分或全部被氟,溴、氯等的鹵素原子、氰基、(甲基)丙烯醯氧 基、縮水甘油氧基、巰基、胺基等取代而成的基團,例如三氟丙基、氯丙基等的鹵化一價飽和烴基;β-氰乙基、γ-氰丙基等的氰烷基;3-甲基丙烯醯氧基丙基、3-縮水甘油氧基丙基、3-巰丙基、3-胺丙基等。烯基的例子,可列舉乙烯基、烯丙基、丙烯基、己烯基、苯乙烯基等。該等之中,以甲基、環己基等為佳,甲基為特佳。但是,R1的至少2個為烯基,烯基宜為乙烯基。 Here, R 1 is a group selected from a substituted or unsubstituted monovalent saturated hydrocarbon group having 1 to 12 carbon atoms, preferably 1 to 6, preferably 1 to 4, and an alkenyl group having 2 to 6 carbon atoms. Examples of the monovalent saturated hydrocarbon group include, specifically, alkyl groups such as methyl, ethyl, propyl, and butyl; cycloalkyl groups such as cyclopentyl, cyclohexyl, and the like bonded to these groups; A group in which a hydrogen atom of a carbon atom is partially or completely substituted with a halogen atom such as fluorine, bromine, chlorine, cyano, (meth) acryloxy, glycidyloxy, mercapto, amine, etc. Halogenated monovalent saturated hydrocarbon groups such as fluoropropyl and chloropropyl; cyanoalkyl groups such as β-cyanoethyl and γ-cyanopropyl; 3-methacryloxypropyl, 3-glycidyloxypropyl Group, 3-mercaptopropyl, 3-aminopropyl and the like. Examples of the alkenyl group include a vinyl group, an allyl group, a propenyl group, a hexenyl group, and a styryl group. Among these, methyl and cyclohexyl are preferred, and methyl is particularly preferred. However, at least two of R 1 are alkenyl, and the alkenyl is preferably vinyl.
此外,烯基在一分子中具有至少2個,在(A)成分之有機聚矽氧烷中,宜含有0.005~0.5莫耳/100g,尤其0.01~0.2莫耳/100g。 In addition, the alkenyl group has at least two in one molecule, and in the organopolysiloxane of the component (A), it is preferable to contain 0.005 to 0.5 mole / 100g, especially 0.01 to 0.2 mole / 100g.
另外,烯基可位於R1 3SiO1/2單元、R1 2SiO2/2單元、R1SiO3/2單元、或這些單元中的複數種,以在R1 3SiO1/2單元具有烯基為佳。 In addition, the alkenyl group may be located in the R 1 3 SiO 1/2 unit, the R 1 2 SiO 2/2 unit, the R 1 SiO 3/2 unit, or a plurality of these units, so that the R 1 3 SiO 1/2 unit It is preferred to have an alkenyl group.
另外,r為0~100之整數,宜為0~75之整數,較佳為0~50之整數,然而更佳的情況是r為2以上,尤其2~50,特別是3~40,最佳為3~35,此情況下,在R1 3SiO1/2單元具有烯基時,具有該烯基的R1 3SiO1/2單元之r宜為2~50。s為0~300之整數,宜為0~200之整數,更佳為0~100之整數,t為0~200之整數,宜為0~100之整數,更佳為0~50之整數,u為0~200之整數,宜為0~100之整數,更佳為0~50之整數。但是,1≦t+u≦400,宜為1≦t+u≦200,較佳為1≦t+u≦100。另外,3≦r+s+t+u≦800,宜為4≦r+s+t+u≦600。該有機聚矽氧烷必須有R1SiO3/2單元(T 單元)、及/或SiO4/2單元(Q單元),因此具有分支狀(樹脂狀)構造。 In addition, r is an integer from 0 to 100, preferably an integer from 0 to 75, and preferably an integer from 0 to 50. However, it is more preferable that r is 2 or more, especially 2 to 50, especially 3 to 40. best of 3 to 35, in this case, when the r 1 3 SiO 1/2 unit having an alkenyl group, the alkenyl group having r r 1 3 SiO 1/2 units of from 2 to 50 is desirable. s is an integer from 0 to 300, preferably an integer from 0 to 200, more preferably an integer from 0 to 100, t is an integer from 0 to 200, preferably an integer from 0 to 100, and more preferably an integer from 0 to 50. u is an integer from 0 to 200, preferably from 0 to 100, and more preferably from 0 to 50. However, 1 ≦ t + u ≦ 400, preferably 1 ≦ t + u ≦ 200, and more preferably 1 ≦ t + u ≦ 100. In addition, 3 ≦ r + s + t + u ≦ 800, preferably 4 ≦ r + s + t + u ≦ 600. This organic polysiloxane must have R 1 SiO 3/2 units (T units) and / or SiO 4/2 units (Q units), and therefore has a branched (resin-like) structure.
本發明之(B)成分,也是本發明之加成硬化性聚矽氧樹脂組成物的主成分,藉由與(A)成分之分支狀有機聚矽氧烷併用,可發揮出降低黏度,甚至提升硬化物的強度等的作用。該有機聚矽氧烷為下述式(2)所表示的有機聚矽氧烷。 The component (B) of the present invention is also the main component of the addition-curing polysiloxane resin composition of the present invention. By using it in combination with the branched organopolysiloxane of the component (A), it can exhibit reduced viscosity, and even The effect of improving the strength of hardened materials. The organic polysiloxane is an organic polysiloxane represented by the following formula (2).
(R1 3SiO1/2)2(R1 2SiO2/2)x (2)(式中,R1的定義與上述相同,R1的至少2個為烯基,x為200~700之整數)。 (R 1 3 SiO 1/2 ) 2 (R 1 2 SiO 2/2 ) x (2) (wherein R 1 has the same definition as above, at least two of R 1 are alkenyl groups, and x is 200 to 700 Integer).
R1可例示與上述(A)成分的具體例所列舉的基團相同的基團,x為200~700之整數,宜為300~600。若x小於200,則硬化物無法得到充足的強度,若x大於700,則硬化物會白濁。 R 1 may be the same as the groups listed in the specific examples of the component (A), and x is an integer of 200 to 700, and preferably 300 to 600. When x is less than 200, the cured product cannot obtain sufficient strength, and when x is more than 700, the cured product becomes cloudy.
此外,烯基在一分子中具有至少2個,在(B)成分中,宜含有10×10-3~10×10-1莫耳/100g,尤其以10×10-3~10×10-2莫耳/100g。 Further, alkenyl groups having in one molecule at least two, the component (B), the preferably contain 10 × 10 -3 ~ 10 × 10 -1 mole / 100g, especially 10 × 10 -3 ~ 10 × 10 - 2 moles / 100g.
另外,烯基可位於R1 3SiO1/2單元、R1 2SiO2/2單元、或這些單元中的複數種,以在R1 3SiO1/2單元具有烯基為佳。 In addition, the alkenyl group may be located in an R 1 3 SiO 1/2 unit, an R 1 2 SiO 2/2 unit, or a plurality of these units, and it is preferable to have an alkenyl group in the R 1 3 SiO 1/2 unit.
(B)成分的摻合量為與(A)成分合計成為100質量份的量,前述(A)成分與(B)成分的摻合比率,以質量比而計,係以(A):(B)=1:1~2:1為佳,1.2:1~2:1為較佳,1.4:1~2:1為更佳。只要在此範圍內,則硬化物不會沾黏,切割性良好,故為適合。 The blending amount of the component (B) is a total of 100 parts by mass with the component (A). The blending ratio of the component (A) and the component (B) is based on the mass ratio and is (A): ( B) = 1: 1 ~ 2: 1 is better, 1.2: 1 ~ 2: 1 is better, 1.4: 1 ~ 2: 1 is better. As long as it is within this range, the cured product is not sticky and has good cutting properties, so it is suitable.
本發明之(C)成分,藉由與前述(A)及(B)成分一起使用,可調整交聯密度,其結果,可改善組成物的黏度或硬化物的硬度、強度。該環狀矽氧烷為下述式(3)所表示的環狀矽氧烷。 The component (C) of the present invention can be used together with the components (A) and (B) to adjust the crosslinking density. As a result, the viscosity of the composition, the hardness and the strength of the cured product can be improved. This cyclic siloxane is a cyclic siloxane represented by the following formula (3).
R1可例示與上述(A)成分的具體例所列舉的基團相同的基團,宜為甲基、乙基、丙基、丁基等的烷基,較佳為甲基。n為3~6之整數,宜為3或4。 R 1 may be the same as those exemplified in the specific examples of the component (A), and is preferably an alkyl group such as methyl, ethyl, propyl, or butyl, and more preferably methyl. n is an integer from 3 to 6, preferably 3 or 4.
具體而言,可例示1,3,5-三甲基-1,3,5-三乙烯基環三矽氧烷、1,3,5,7-四甲基-1,3,5,7-四乙烯基環四矽氧烷、1,3,5,7,9-五甲基-1,3,5,7,9-五乙烯基環五矽氧烷等。 Specific examples include 1,3,5-trimethyl-1,3,5-trivinylcyclotrisiloxane, 1,3,5,7-tetramethyl-1,3,5,7 -Tetravinylcyclotetrasiloxane, 1,3,5,7,9-pentamethyl-1,3,5,7,9-pentavinylcyclopentasiloxane, etc.
(C)成分的添加量,相對於(A)及(B)成分的合計100質量份,為2~7質量份的量,宜為2~6質量份,較佳為3~6質量份。在未達2質量份的情況,無法充分降低黏度,甚至,所得到的的硬化物不會具有充足的強度。另外還已知環狀乙烯基矽氧烷具有氫矽烷化的抑制作用,因此若添加高於7質量份,則硬化時間會變長,甚至交聯密度變得過大,因此變脆。 The amount of the component (C) added is 2 to 7 parts by mass, preferably 2 to 6 parts by mass, and more preferably 3 to 6 parts by mass relative to 100 parts by mass of the total of the components (A) and (B). When it is less than 2 parts by mass, the viscosity cannot be sufficiently reduced, and even the obtained hardened product does not have sufficient strength. In addition, it is also known that cyclic vinyl siloxane has an inhibitory effect on hydrosilylation. Therefore, if it is added more than 7 parts by mass, the hardening time becomes long, and even the crosslinking density becomes too large, so it becomes brittle.
本發明之(D)成分可發揮交聯劑的作用,藉由氫矽烷化反應,與前述(A)~(C)成分形成交聯構造,而使該聚矽氧樹脂組成物硬化。 The component (D) of the present invention can function as a cross-linking agent and form a cross-linked structure with the aforementioned components (A) to (C) by a hydrosilylation reaction to harden the polysiloxane resin composition.
(D)一分子中具有至少2個氫矽烷基之有機氫聚矽氧烷並未受到特別限定,適合使用下述式(4)所表示的有機氫聚矽氧烷。 (D) The organohydrogenpolysiloxane having at least two hydrosilyl groups in one molecule is not particularly limited, and an organohydrogenpolysiloxane represented by the following formula (4) is suitably used.
(R2 3SiO1/2)r’(R2 2SiO2/2)s’(R2SiO3/2)t’(SiO4/2)u’ (4)(式中,R2互相獨立地為氫原子或碳數1~12之取代或非取代的一價飽和烴基,R2的至少2個為氫原子,r’為0~100之整數、s’為0~300之整數、t’為0~200之整數、u’為0~200之整數,但是,2≦r’+s’+t’+u’≦800)。 (R 2 3 SiO 1/2 ) r ' (R 2 2 SiO 2/2 ) s' (R 2 SiO 3/2 ) t ' (SiO 4/2 ) u' (4) (where R 2 are mutually Independently a hydrogen atom or a substituted or unsubstituted monovalent saturated hydrocarbon group having 1 to 12 carbon atoms; at least two of R 2 are hydrogen atoms; r 'is an integer of 0 to 100; s' is an integer of 0 to 300; t 'is an integer from 0 to 200 and u' is an integer from 0 to 200, but 2 ≦ r '+ s' + t '+ u' ≦ 800).
此處,R2為氫原子、或碳數1~12,尤其1~6之取 代或非取代的一價飽和烴基,一價飽和烴基的例子,具體而言,可例示甲基、乙基、丙基、丁基等的烷基;環戊基、環己基等的環烷基、及鍵結於這些基團中的碳原子之氫原子一部分或全部被氟、溴、氯等的鹵素原子、氰基等取代而成的基團等,而R2之中至少2個為氫原子,其他取代基宜為甲基。 Here, R 2 is a hydrogen atom or a substituted or unsubstituted monovalent saturated hydrocarbon group having 1 to 12 carbon atoms, especially 1 to 6, and examples of the monovalent saturated hydrocarbon group. Specifically, methyl, ethyl, Alkyl groups such as propyl and butyl; cycloalkyl groups such as cyclopentyl and cyclohexyl; and hydrogen atoms of carbon atoms bonded to these groups are partially or totally replaced by halogen atoms such as fluorine, bromine, and chlorine; A group such as a cyano group and the like, and at least two of R 2 are hydrogen atoms, and other substituents are preferably methyl groups.
r’為0~100之整數,宜為0~75之整數,更佳為0~50之整數,尤其是2以上為佳,s’為0~300之整數,宜為0~200之整數,更佳為0~100之整數,尤其是1以上,特別是2以上為佳。t’為0~200之整數,宜為0~100之整數,更佳為0~50之整數,u’為0~200之整數,宜為0~100之整數,更佳為0~50之整數,在2≦r’+s’+t’+u’≦800的範圍為佳,3≦r’+s’+t’+u’≦400的範圍為較佳,4≦r’+s’+t’+u’≦200的範圍為更佳。 r 'is an integer from 0 to 100, preferably an integer from 0 to 75, more preferably an integer from 0 to 50, especially preferably 2 or more, s' is an integer from 0 to 300, and preferably an integer from 0 to 200. More preferably, it is an integer from 0 to 100, especially 1 or more, especially 2 or more. t 'is an integer from 0 to 200, preferably from 0 to 100, more preferably from 0 to 50, u' is an integer from 0 to 200, preferably from 0 to 100, and more preferably from 0 to 50 An integer is preferably in the range of 2 ≦ r '+ s' + t' + u '≦ 800, 3 ≦ r' + s' + t '+ u' ≦ 400 is better, and 4 ≦ r '+ s The range of '+ t' + u '≦ 200 is more preferable.
此外,氫原子在一分子中具有至少2個,在(D)成分中,宜含有0.1~10莫耳/100g,尤其0.5~5莫耳/100g。 In addition, the hydrogen atom has at least two in one molecule, and in the component (D), it is preferable to contain 0.1 to 10 moles / 100g, especially 0.5 to 5 moles / 100g.
另外,氫原子可位於R2 3SiO1/2單元、R2 2SiO2/2單元、R2SiO3/2單元、或這些單元中的複數種,以在R2 3SiO2/2單元具有氫原子為佳。 In addition, the hydrogen atom may be located in the R 2 3 SiO 1/2 unit, the R 2 2 SiO 2/2 unit, the R 2 SiO 3/2 unit, or a plurality of these units, so that the R 2 3 SiO 2/2 unit It is preferable to have a hydrogen atom.
(D)成分之一分子中具有至少2個氫矽烷基的有機氫聚矽氧烷,其添加量為相對於(A)~(C)成分中所含有的烯基1莫耳,(D)成分中的氫矽烷基為0.4~4.0莫耳的量,宜為0.6~2.0莫耳的量,更佳為0.8~1.6莫耳的 量。在未達0.4莫耳的情況,SiH基不足,因此硬化不良,若超過4.0莫耳,則殘存的SiH基容易導致脫氫等的副反應發生。 One component (D) is an organohydrogenpolysiloxane having at least two hydrosilyl groups in a molecule, and the addition amount is 1 mole relative to the alkenyl group contained in the components (A) to (C), (D) The amount of hydrosilyl in the composition is 0.4 to 4.0 moles, preferably 0.6 to 2.0 moles, and more preferably 0.8 to 1.6 moles. the amount. When it is less than 0.4 mol, the SiH group is insufficient, so the hardening is poor. If it exceeds 4.0 mol, the residual SiH group is liable to cause side reactions such as dehydrogenation.
(E)成分為氫矽烷化觸媒。該觸媒只要具有使氫矽烷化反應進行的能力即可,並未受到特別限定。尤其宜為選自鉑族金屬單體及鉑族金屬化合物的觸媒。可列舉例如鉑(包括鉑黑)、氯化鉑、氯鉑酸、鉑-二乙烯基矽氧烷錯合物等的鉑-烯烴錯合物、鉑-羰基錯合物等的鉑觸媒、鈀觸媒、銠觸媒等。這些觸媒可單獨使用一種或組合兩種以上來使用。該等之中,特佳為氯鉑酸、及鉑-二乙烯基矽氧烷錯合物等的鉑-烯烴錯合物。 (E) The component is a hydrosilylation catalyst. The catalyst is not particularly limited as long as it has the ability to advance a hydrosilylation reaction. In particular, it is a catalyst selected from a platinum group metal monomer and a platinum group metal compound. Examples include platinum (including platinum black), platinum chloride, chloroplatinic acid, platinum-olefin complexes such as platinum-divinylsiloxane complexes, platinum catalysts such as platinum-carbonyl complexes, Palladium catalyst, rhodium catalyst, etc. These catalysts can be used alone or in combination of two or more. Among these, particularly preferred are platinum-olefin complexes such as chloroplatinic acid and platinum-divinylsiloxane complexes.
(E)成分的摻合量為觸媒量即可。觸媒量只要是可使氫矽烷化反應進行的量即可,並且因應所希望的硬化速度適當地調整即可。例如在鉑族金屬觸媒的情況,從反應速率的觀點看來,以換算為鉑族金屬原子的質量基準而計,上述相對於(A)~(D)成分的合計質量,以5~20ppm的量為佳,甚至5~10ppm的量為較佳。 The amount of the component (E) may be a catalyst amount. The amount of the catalyst may be an amount that allows the hydrosilylation reaction to proceed, and may be appropriately adjusted in accordance with a desired curing rate. For example, in the case of a platinum group metal catalyst, from the viewpoint of the reaction rate, based on the mass standard converted to a platinum group metal atom, the above-mentioned mass relative to the total mass of the components (A) to (D) is 5 to 20 ppm. The amount is preferably, and even an amount of 5 to 10 ppm is preferable.
本發明之硬化性組成物中,除了上述(A)~(E)成分以外,還可因應必要含有螢光體、無機填充材、接著助劑、硬化抑制劑等。以下針對各成分作說明。 In addition to the components (A) to (E) described above, the curable composition of the present invention may contain a phosphor, an inorganic filler, an adjuvant, a hardening inhibitor, and the like as necessary. Each component is explained below.
螢光體並不受特別限制,只要使用以往周知的螢光體即可。例如以吸收來自半導體元件,尤其是以氮化物系半導體作為發光層的半導體發光二極體的光線,轉換成不同波長的光線的物質為佳。這種螢光體,宜為例如選自主要藉由Eu、Ce等的鑭系元素活化的氮化物系螢光體、氮氧化物系螢光體、主要藉由Eu等的鑭系、Mn等的過渡金屬系元素活化的鹼土類金屬鹵素磷灰石螢光體、鹼土類金屬硼酸鹵素螢光體、鹼土類金屬鋁酸鹽螢光體、鹼土類金屬矽酸鹽螢光體、鹼土類金屬硫化物螢光體、鹼土類金屬硫代鎵酸鹽螢光體、鹼土類金屬氮化矽螢光體、鍺酸鹽螢光體,或主要藉由Ce等的鑭系元素活化的稀土類鋁酸鹽螢光體、稀土類矽酸鹽螢光體,或主要藉由Eu等的鑭系元素活化的有機錯合物螢光體、Ca-Al-Si-O-N系氧氮化物玻璃螢光體等的一種以上。 The phosphor is not particularly limited, as long as a conventionally known phosphor is used. For example, a substance that absorbs light from a semiconductor element, especially a semiconductor light-emitting diode with a nitride-based semiconductor as a light-emitting layer, and converts it into light of a different wavelength is preferred. Such a phosphor is preferably selected from, for example, nitride-based phosphors, oxynitride-based phosphors activated mainly by lanthanoids such as Eu, Ce, lanthanides, Mn, etc. Alkaline earth metal halogen apatite phosphor activated by transition metal elements, alkaline earth metal borate halogen phosphor, alkaline earth metal aluminate phosphor, alkaline earth metal silicate phosphor, alkaline earth metal sulfide Phosphors, alkaline earth metal thiogallate phosphors, alkaline earth metal silicon nitride phosphors, germanate phosphors, or rare earth aluminates activated primarily by lanthanides such as Ce Phosphors, rare earth silicate phosphors, or organic complex phosphors activated mainly by lanthanides such as Eu, Ca-Al-Si-ON oxynitride glass phosphors, etc. More than one.
主要藉由Eu、Ce等的鑭系元素活化的氮化物系螢光體,可列舉M2Si5N8:Eu(M為選自Sr、Ca、Ba、Mg、Zn的至少一種)。另外還可列舉MSi7N10:Eu、M1.8Si5O0.2N8:Eu、及M0.9Si7O0.1N10:Eu(M為選自Sr、Ca、Ba、Mg、Zn的至少一種)等。 Examples of the nitride-based phosphor activated by lanthanides such as Eu and Ce include M 2 Si 5 N 8 : Eu (M is at least one selected from the group consisting of Sr, Ca, Ba, Mg, and Zn). In addition, MSi 7 N 10 : Eu, M 1.8 Si 5 O 0.2 N 8 : Eu, and M 0.9 Si 7 O 0.1 N 10 : Eu (M is at least one selected from the group consisting of Sr, Ca, Ba, Mg, and Zn )Wait.
主要藉由Eu、Ce等的鑭系元素活化的氮氧化物系螢光體,可列舉MSi2O2N2:Eu(M為選自Sr、Ca、Ba、Mg、Zn的至少一種)。 Examples of the oxynitride phosphor mainly activated by lanthanides such as Eu and Ce include MSi 2 O 2 N 2 : Eu (M is at least one selected from the group consisting of Sr, Ca, Ba, Mg, and Zn).
主要藉由Eu等的鑭系、Mn等的過渡金屬系元素活化的鹼土類金屬鹵素磷灰石螢光體,可列舉 M5(PO4)3X:R(M為選自Sr、Ca、Ba、Mg、Zn的至少一種,X為選自F、Cl、Br、I的至少一種,R為Eu、Mn、Eu及Mn的任一種以上)。 Alkaline earth metal halogen apatite phosphors mainly activated by transition metal elements such as lanthanide and Mn such as Eu, M 5 (PO 4 ) 3 X: R (M is selected from Sr, Ca, Ba, At least one of Mg and Zn, X is at least one selected from F, Cl, Br, and I, and R is any one or more of Eu, Mn, Eu, and Mn).
鹼土類金屬硼酸鹵素螢光體,可列舉M2B5O9X:R(M為選自Sr、Ca、Ba、Mg、Zn的至少一種,X為選自F、Cl、Br、I的至少一種,R為Eu、Mn、Eu及Mn的任一種以上)。 Alkaline earth metal borate halogen phosphors include M 2 B 5 O 9 X: R (M is at least one selected from the group consisting of Sr, Ca, Ba, Mg, and Zn, and X is selected from the group consisting of F, Cl, Br, and I (At least one type, and R is any one or more of Eu, Mn, Eu, and Mn).
鹼土類金屬鋁酸鹽螢光體,可列舉SrAl2O4:R、Sr4Al14O25:R、CaAl2O4:R、BaMg2Al16O27:R、BaMg2Al16O12:R、及BaMgAl10O17:R(R為Eu、Mn、Eu及Mn的任一種以上)。 Examples of the alkaline earth metal aluminate phosphor include SrAl 2 O 4 : R, Sr 4 Al 14 O 25 : R, CaAl 2 O 4 : R, BaMg 2 Al 16 O 27 : R, BaMg 2 Al 16 O 12 : R, and BaMgAl 10 O 17 : R (R is any one or more of Eu, Mn, Eu, and Mn).
鹼土類金屬硫化物螢光體,可列舉La2O2S:Eu、Y2O2S:Eu、及Gd2O2S:Eu等。 Examples of the alkaline earth metal sulfide phosphor include La 2 O 2 S: Eu, Y 2 O 2 S: Eu, and Gd 2 O 2 S: Eu.
主要藉由Ce等的鑭系元素活化的稀土類鋁酸鹽螢光體,可列舉Y3Al5O12:Ce、(Y0.8Gd0.2)3Al5O12:Ce、Y3(Al0.8Ga0.2)5O12:Ce、及(Y,Gd)3(Al,Ga)5O12的組成式所表示的YAG系螢光體。另外還有Y的一部分或全部被Tb、Lu等取代的Tb3Al5O12:Ce、Lu3Al5O12:Ce等。 Rare earth aluminate phosphors activated mainly by lanthanides such as Ce include Y 3 Al 5 O 12 : Ce, (Y 0.8 Gd 0.2 ) 3 Al 5 O 12 : Ce, Y 3 (Al 0.8 Ga 0.2 ) 5 O 12 : Ce and a YAG-based phosphor represented by the composition formula of (Y, Gd) 3 (Al, Ga) 5 O 12 . In addition, Tb 3 Al 5 O 12 : Ce, Lu 3 Al 5 O 12 : Ce, etc., in which part or all of Y is replaced by Tb, Lu, or the like.
其他螢光體,可列舉ZnS:Eu、Zn2GeO4:Mr1、MGa2S4:Eu(M為選自Sr、Ca、Ba、Mg、Zn的至少一種)等。 Other phosphors include ZnS: Eu, Zn 2 GeO 4 : Mr 1, MGa 2 S 4: Eu (M is selected from Sr, Ca, Ba, Mg, at least one of Zn) and the like.
上述螢光體中,可因應需要含有選自Tb、Cu、Ag、Au、Cr、Nd、Dy、Co、Ni、Ti的一種以上來代替Eu,或與Eu一起。 The phosphor may contain at least one selected from Tb, Cu, Ag, Au, Cr, Nd, Dy, Co, Ni, and Ti in place of Eu, or together with Eu, if necessary.
Ca-Al-Si-O-N系氧氮化物玻璃螢光體,是指以氧氮化物玻璃作為母體材料的螢光體,該氧氮化物玻璃之中,以莫耳%來表示,CaCO3以CaO換算為20~50莫耳%、Al2O3為0~30莫耳%、SiO為25~60莫耳%、AlN為5~50莫耳%、稀土類氧化物或過渡金屬氧化物為0.1~20莫耳%,五種成分合計為100莫耳%。此外,在以氧氮化物玻璃作為母體材料的螢光體中,氮含量宜為15莫耳%以下,並且除了稀土類氧化物離子之外,宜含有當作增感劑的其他稀土類元素離子以作為共活化劑,其在螢光玻璃中的含量,以稀土類氧化物而計在0.1~10莫耳%的範圍。 The Ca-Al-Si-ON-based oxynitride glass phosphor refers to a phosphor using oxynitride glass as a base material. The oxynitride glass is expressed in mole%, and CaCO 3 is CaO Conversion is 20 ~ 50 mole%, Al 2 O 3 is 0 ~ 30 mole%, SiO is 25 ~ 60 mole%, AlN is 5 ~ 50 mole%, rare earth oxide or transition metal oxide is 0.1 ~ 20 Mol%, the total of the five ingredients is 100 Mol%. In addition, in the phosphor using oxynitride glass as a base material, the nitrogen content should be 15 mol% or less, and in addition to the rare earth oxide ions, it should contain other rare earth element ions as sensitizers. As a co-activator, its content in the fluorescent glass is in the range of 0.1 to 10 mole% based on the rare earth oxide.
另外還可使用上述螢光體以外且具有同樣性能、效果的螢光體。 In addition, phosphors other than the above-mentioned phosphors and having the same performance and effects can be used.
在摻合螢光體的情況,其摻合量,相對於(A)~(D)成分100質量份,宜為0.1~2,000質量份,較佳為0.1~100質量份。在將本發明之硬化物製成含螢光體的波長轉換薄膜的情況,螢光體的摻合量,宜定在10~2,000質量份。另外,螢光體的平均粒徑宜為10nm以上,較佳為10nm~10μm,更佳為10nm~1μm。上述平均粒徑,可藉由CILAS雷射測定裝置等,利用雷射光繞射法進行的粒度分布測定來作測定。 In the case of blending phosphors, the blending amount is preferably 0.1 to 2,000 parts by mass, and more preferably 0.1 to 100 parts by mass, relative to 100 parts by mass of the components (A) to (D). When the hardened | cured material of this invention is made into the wavelength conversion film containing a phosphor, it is preferable that the compounding quantity of a phosphor is 10-2,000 mass parts. In addition, the average particle diameter of the phosphor is preferably 10 nm or more, preferably 10 nm to 10 μm, and more preferably 10 nm to 1 μm. The average particle diameter can be measured by a particle size distribution measurement using a laser light diffraction method using a CILAS laser measurement device or the like.
無機填充材,可列舉例如二氧化矽、發煙二氧化矽、 發煙二氧化鈦、氧化鋁、碳酸鈣、矽酸鈣、二氧化鈦、氧化鐵(III)、氧化鋅等。該等可單獨使用一種或併用兩種以上。在摻合無機填充材的情況,其摻合量並不受特別限制,只要以每(A)~(D)成分合計的100質量份為20質量份以下,宜為0.1~10質量份的範圍適當地摻合即可。 Examples of the inorganic filler include silica, fumed silica, Fuming titanium dioxide, aluminum oxide, calcium carbonate, calcium silicate, titanium dioxide, iron (III) oxide, zinc oxide, and the like. These can be used alone or in combination of two or more. In the case of blending an inorganic filler, the blending amount is not particularly limited, as long as 100 parts by mass per (A) to (D) component total is 20 parts by mass or less, preferably in the range of 0.1 to 10 parts by mass It can be blended appropriately.
本發明之硬化性組成物中,為了賦予接著性,可因應必要含有接著助劑。接著助劑,可列舉例如在一分子中具有由鍵結於矽原子的氫原子、烯基、烷氧基、環氧基所選出的官能性基至少兩種,宜為三種之有機矽氧烷寡聚物。該有機矽氧烷寡聚物中,矽原子數宜為4~50個,較佳為4~20個。另外,接著助劑,可使用下述一般式(5)所表示的有機氧甲矽烷基改質異氰尿酸酯化合物、及其水解縮合物(有機矽氧烷改質異氰尿酸酯化合物)。 The curable composition of the present invention may contain a bonding aid as necessary in order to impart adhesion. Examples of the auxiliary agent include, for example, at least two functional groups selected from a hydrogen atom, an alkenyl group, an alkoxy group, and an epoxy group bonded to a silicon atom in one molecule, and preferably three kinds of organic siloxanes Oligomer. In the organosiloxane oligomer, the number of silicon atoms is preferably 4 to 50, and more preferably 4 to 20. As the adjuvant, an organosilyl-modified isocyanurate compound represented by the following general formula (5) and a hydrolyzed condensate thereof (organosiloxane-modified isocyanurate compound) can be used. ).
上述式(5)中,R3互相獨立地為下述式(6)所表示的有機基、或可具有氧原子的脂肪族不飽和一價烴基。但是,R3的至少1個為下述式(6)所表示之基。 In the formula (5), R 3 is independently an organic group represented by the following formula (6) or an aliphatic unsaturated monovalent hydrocarbon group which may have an oxygen atom. However, at least one of R 3 is a group represented by the following formula (6).
上述式(5)之中,R3之可具有氧原子的一價脂肪族不飽和烴基,宜為碳數2~8、更佳為碳數2~6之直鏈狀或分支之烯基,可列舉例如乙烯基、烯丙基、1-丁烯基、1-己烯基、2-甲基丙烯基、或(甲基)丙烯酸基等。 In the above formula (5), the monovalent aliphatic unsaturated hydrocarbon group of R 3 which may have an oxygen atom is preferably a linear or branched alkenyl group having 2 to 8 carbon atoms, more preferably 2 to 6 carbon atoms, Examples include vinyl, allyl, 1-butenyl, 1-hexenyl, 2-methacryl, and (meth) acryl.
在摻合接著助劑的情況,其摻合量,相對於(A)~(D)成分的合計100質量份,宜為10質量份以下,較佳為0.1~8質量份,特佳為0.2~5質量份。摻合量只要在上述上限值以下,則硬化物硬度高,亦可抑制表面沾黏性。 In the case of blending an adjuvant, the blending amount is preferably 10 parts by mass or less, more preferably 0.1 to 8 parts by mass, and particularly preferably 0.2 based on 100 parts by mass of the total of (A) to (D) components. ~ 5 parts by mass. As long as the blending amount is below the above upper limit value, the hardness of the cured product is high, and the surface stickiness can be suppressed.
另外,在摻合接著助劑的情況,其摻合量,係以使含有本接著助劑的全組成物中的氫矽烷基合計個數相對於全組成物中的烯基合計個數之比成為0.4~4的量為佳,0.6~3的量為較佳,0.8~2的量為更佳。 In addition, in the case of blending an adjuvant, the blending amount is a ratio of the total number of hydrosilyl groups in the entire composition containing the adhesive agent to the total number of alkenyl groups in the entire composition. An amount of 0.4 to 4 is preferable, an amount of 0.6 to 3 is preferable, and an amount of 0.8 to 2 is more preferable.
本發明之硬化性組成物中,為了控制反應性,提高貯藏安定性,可含有硬化抑制劑。硬化抑制劑,可列舉選自 異氰尿酸三烯丙酯、馬來酸烷基酯、乙炔醇類、及其矽烷改質物及矽氧烷改質物、過氧化氫、四甲基乙二胺、苯并三唑、及該等的混合物所構成的群組之化合物。在摻合硬化抑制劑的情況,其摻合量,相對於(E)成分之氫矽烷化觸媒中的觸媒有效量,以莫耳比而計,宜為5~100倍的量,較佳為5~50倍的量。 The curable composition of the present invention may contain a hardening inhibitor in order to control reactivity and improve storage stability. Hardening inhibitor, which can be selected from Triallyl isocyanurate, alkyl maleate, acetylene alcohols, and their silane modifiers and siloxane modifiers, hydrogen peroxide, tetramethylethylenediamine, benzotriazole, and the like A mixture of compounds. In the case of blending a hardening inhibitor, the blending amount is preferably 5 to 100 times the molar effective ratio of the catalyst in the hydrosilylation catalyst of the (E) component. It is preferably 5 to 50 times the amount.
在本發明之硬化性組成物中,除了上述成分之外,還可摻合其他添加劑。其他添加劑,可列舉例如抗老化劑、自由基禁止劑、阻燃劑、界面活性劑、臭氧劣化防止劑、光安定劑、增黏劑、可塑劑、抗氧化劑、熱安定劑、導電性賦予劑、抗靜電劑、放射線遮蔽劑、核劑、磷系過氧化物分解劑、潤滑劑、顏料、金屬失活劑、物性調整劑、有機溶劑等。這些任意成分可單獨使用一種或併用兩種以上。 The curable composition of the present invention may contain other additives in addition to the aforementioned components. Other additives include, for example, anti-aging agents, free radical inhibitors, flame retardants, surfactants, ozone deterioration inhibitors, light stabilizers, tackifiers, plasticizers, antioxidants, heat stabilizers, and conductivity imparting agents. , Antistatic agent, radiation shielding agent, nuclear agent, phosphorus peroxide decomposing agent, lubricant, pigment, metal deactivator, physical property adjusting agent, organic solvent, etc. These arbitrary components can be used individually by 1 type or in combination of 2 or more types.
本發明之硬化性組成物最單純的實施形態,是由(A)成分、(B)成分、(C)成分、(D)成分及(E)成分所構成的組成物。宜為由(A)成分、(B)成分、(C)成分、(D)成分、(E)成分及螢光體所構成的組成物。尤其為了得到具有高透明性的硬化物,宜不含二氧化矽等的無機填充材。該無機填充材的例子如上述。 The simplest embodiment of the curable composition of the present invention is a composition composed of (A) component, (B) component, (C) component, (D) component, and (E) component. Preferably, it is a composition consisting of (A) component, (B) component, (C) component, (D) component, (E) component, and a phosphor. In particular, in order to obtain a hardened material having high transparency, an inorganic filler such as silicon dioxide is preferably not contained. Examples of the inorganic filler are as described above.
本發明之硬化性組成物的調製方法並不受特別限制,只要依據以往周知的方法即可。例如可將(A)、 (B)、(C)、(D)及(E)成分藉由任意方法混合而調製。或者只要將(A)、(B)、(C)、(D)、(E)成分與螢光體、或(A)、(B)、(C)、(D)、(E)成分、及任意成分藉由任意方法混合而調製即可。例如可藉由裝入市售的攪拌機(THINKY CONDITIONING MIXER(Thinky股份有限公司製)等),均勻混合1~5分鐘左右而調製。 The method for preparing the curable composition of the present invention is not particularly limited as long as it is based on a conventionally known method. For example, (A), The components (B), (C), (D), and (E) are prepared by mixing them by any method. Or just combine (A), (B), (C), (D), (E) components with phosphors, or (A), (B), (C), (D), (E) components, And arbitrary components may be mixed and prepared by any method. For example, a commercially available blender (THINKY CONDITIONING MIXER (manufactured by Thinky Co., Ltd.), etc.) can be incorporated into the blender for uniform mixing for about 1 to 5 minutes.
使本發明之硬化性組成物硬化的方法不受特別限制,只要依照以往周知的方法即可。例如可在60~180℃硬化1~12小時左右。尤其以在60~180℃,宜為60~150℃下藉由分段硬化來使其硬化為佳。在分段硬化時,以經過以下的兩階段為較佳。首先,將硬化性組成物在60~100℃的溫度下加熱0.5~2小時,使其充分脫泡。接下來使硬化性組成物在120~180℃的溫度下加熱硬化1~10小時。藉由經過這些階段,即使在硬化物厚的情況,也能夠充分硬化,氣泡不會發生,而呈無色透明。此外,在本發明中無色透明的硬化物,意指厚度為1mm時,在450nm的透光率為80%以上,宜為85%以上,特佳為90%以上的硬化物。透光率的測定如後述。 The method for hardening the curable composition of the present invention is not particularly limited as long as it is in accordance with a conventionally known method. For example, it can be hardened at 60 to 180 ° C for about 1 to 12 hours. Especially, it is better to harden it by step hardening at 60 ~ 180 ℃, preferably 60 ~ 150 ℃. In the case of stage hardening, it is preferable to pass through the following two stages. First, the curable composition is heated at a temperature of 60 to 100 ° C. for 0.5 to 2 hours to sufficiently defoam. Next, the curable composition is heat-hardened at a temperature of 120 to 180 ° C. for 1 to 10 hours. By passing through these stages, even when the hardened material is thick, it can be sufficiently hardened, and bubbles do not occur, and it is colorless and transparent. In addition, in the present invention, a colorless and transparent hardened material means a hardened material having a light transmittance at 450 nm of 80% or more, preferably 85% or more, and particularly preferably 90% or more when the thickness is 1 mm. The measurement of the light transmittance will be described later.
本發明之硬化性組成物可產生具有高光學透過率的硬化物。所以,本發明之硬化性組成物,在LED元件密封用途方面,尤其是藍色LED或紫外LED的元件密封用途方面,是有用的物品。以本發明之硬化性組成物來密封LED元件等的方法,只要依照以往周知的方法即可。例如可藉由點膠法、壓縮模製法等來進行。 The curable composition of the present invention can produce a cured product having a high optical transmittance. Therefore, the curable composition of the present invention is a useful article in terms of LED element sealing applications, especially in blue LED or ultraviolet LED element sealing applications. A method of sealing the LED element or the like with the curable composition of the present invention may be any method that is conventionally known. For example, it can be performed by a dispensing method, a compression molding method, or the like.
本發明之硬化性組成物及硬化物,其他方面,由於其具有優異的耐龜裂性、耐熱性、耐光性、透明性等的特性,因此在顯示材料、光記錄媒體材料、光學機器材料、光學零件材料、光纖維材料、光電機能性有機材料、半導體積體電路周邊材料等的用途也很有用。 The hardenable composition and hardened product of the present invention, among other things, have excellent properties such as crack resistance, heat resistance, light resistance, transparency, etc., and are therefore used in display materials, optical recording medium materials, optical machine materials, Optical component materials, optical fiber materials, photoelectromechanical organic materials, and semiconductor integrated circuit peripheral materials are also useful.
以下揭示實施例及比較例對本發明作更詳細的說明,然而本發明不受下述實施例限制。 The present invention will be described in more detail by the following examples and comparative examples. However, the present invention is not limited by the following examples.
下述實施例中所揭示的重量平均分子量(Mw),是藉由以聚苯乙烯為標準物質的凝膠滲透層析(GPC)所測得之值。以下揭示測定條件。 The weight average molecular weight (Mw) disclosed in the following examples is a value measured by gel permeation chromatography (GPC) using polystyrene as a standard substance. The measurement conditions are described below.
展開溶劑:四氫呋喃 Development solvent: tetrahydrofuran
流速:0.6mL/min Flow rate: 0.6mL / min
管柱:TSK Guardcolumn SuperH-L Column: TSK Guardcolumn SuperH-L
TSKgel SuperH4000(6.0mm I.D.×15cm×1) TSKgel SuperH4000 (6.0mm I.D. × 15cm × 1)
TSKgel SuperH3000(6.0mm I.D.×15cm×1) TSKgel SuperH3000 (6.0mm I.D. × 15cm × 1)
TSKgel SuperH2000(6.0mm I.D.×15cm×2) TSKgel SuperH2000 (6.0mm I.D. × 15cm × 2)
(任一者皆為東曹公司製) (Either is made by Tosoh Corporation)
管柱溫度:40℃ Column temperature: 40 ℃
試樣注入量:20μL(試樣濃度:0.5質量%-四氫呋喃溶液)偵測器;示差折射率計(RI) Sample injection volume: 20 μL (sample concentration: 0.5% by mass-tetrahydrofuran solution) detector; differential refractive index meter (RI)
下述實施例所示的Vi(乙烯基)價(莫耳/100g)及SiH價(莫耳/100g),是測定化合物在400MHz的1H-NMR光譜,並以二甲亞碸作為內標準品,由所得到的乙烯基或氫矽烷基的氫原子積分值來作計算。 The Vi (vinyl) valence (Moore / 100g) and SiH valence (Moore / 100g) shown in the following examples are the 1 H-NMR spectra of a compound at 400 MHz, and dimethylarsine is used as the internal standard. The product is calculated from the integral value of the hydrogen atom of the obtained vinyl or hydrosilyl group.
將實施例及比較例之中所使用的(C)成分揭示如下。此外,下述式中Me表示甲基。 The (C) component used in an Example and a comparative example is shown below. In the following formula, Me represents a methyl group.
(C-1)1,3,5,7-四甲基-1,3,5,7-四乙烯基環四矽氧烷(Vi價=1.16莫耳/100g) (C-1) 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane (Vi value = 1.16 mol / 100g)
(C-2)1,3,5-三甲基-1,3,5-三乙烯基環三矽氧烷(Vi價=1.16莫耳/100g) (C-2) 1,3,5-trimethyl-1,3,5-trivinylcyclotrisiloxane (Vi value = 1.16 mol / 100g)
(C-1’)下述式所表示的兩末端乙烯基二甲基聚矽氧油(信越化學工業股份有限公司製,Vi價=0.217莫耳/100g) (C-1 ') Two-terminal vinyl dimethyl silicone oil represented by the following formula (manufactured by Shin-Etsu Chemical Industry Co., Ltd., Vi price = 0.217 mole / 100g)
(C-2’)下述式所表示之兩末端乙烯基(二甲基)(甲基乙烯基)聚矽氧油(信越化學工業股份有限公司製,Vi價=1.14莫耳/100g) (C-2 ') Both terminal vinyl (dimethyl) (methyl vinyl) silicone oils represented by the following formula (manufactured by Shin-Etsu Chemical Industry Co., Ltd., Vi price = 1.14 moles / 100 g)
(C-3’)1,3,5,7-四甲基環四矽氧烷(SiH價=1.18莫耳/100g) (C-3 ’) 1,3,5,7-tetramethylcyclotetrasiloxane (SiH value = 1.18 mole / 100g)
以下揭示實施例及比較例之中所使用的(A)成分、(B)成分、(D)成分及(E)成分。此外,下述式中Me表示甲基。 The components (A), (B), (D), and (E) used in the examples and comparative examples are described below. In the following formula, Me represents a methyl group.
(A)下述式所表示之甲基系聚矽氧樹脂(信越化學工業股份有限公司製,Vi價=9.12×10-2莫耳/100g) (A) Methyl polysiloxane resin (manufactured by Shin-Etsu Chemical Industry Co., Ltd., Vi price = 9.12 × 10 -2 mole / 100g)
(B)下述式所表示之兩末端乙烯基二甲基聚矽氧油(信越化學工業股份有限公司製,Vi價=5.12×10-3莫耳/100g) (B) Two-terminal vinyl dimethyl silicone oil represented by the following formula (manufactured by Shin-Etsu Chemical Industry Co., Ltd., Vi price = 5.12 × 10 -3 mole / 100g)
(D)下述式所表示之含SiH基的直鏈狀聚矽氧油(信越化學工業股份有限公司製,SiH價=1.63莫耳/100g) (D) SiH group-containing linear silicone oil represented by the following formula (manufactured by Shin-Etsu Chemical Co., Ltd., SiH price = 1.63 moles / 100g)
(E)氯鉑酸的二乙烯基矽氧烷錯合物 (E) Divinylsiloxane complex of chloroplatinic acid
將53質量份的(A)、36質量份的(B)、4質量份的(C)、7質量份的(D)混合,並加入以鉑量而計5ppm的(E)氯鉑酸的二乙烯基矽氧烷錯合物,加以混合,調製出硬化性組成物。 53 parts by mass of (A), 36 parts by mass of (B), 4 parts by mass of (C), and 7 parts by mass of (D) were mixed, and 5 ppm by weight of platinum (E) of chloroplatinic acid was added A divinylsiloxane complex is mixed to prepare a hardenable composition.
將各成分的摻合量如表1所記載般變更,除此之外重覆與實施例1同樣的操作,調製出硬化性組成物。 Except that the blending amount of each component was changed as described in Table 1, the same operation as in Example 1 was repeated to prepare a curable composition.
對於上述實施例1~4及比較例1~5所調製 出的硬化性組成物,進行以下所示的測試。 Modulated for the above Examples 1 to 4 and Comparative Examples 1 to 5 The resulting curable composition was subjected to the tests shown below.
依據JIS Z 8803:2011,使用B型黏度計,測定在23℃下的硬化性組成物的黏度。將結果記載於表1。 According to JIS Z 8803: 2011, the viscosity of the curable composition at 23 ° C. was measured using a B-type viscometer. The results are described in Table 1.
在50mm徑×10mm厚的鋁製淺皿中灌入調製好的硬化性組成物,依照60℃×1小時、100℃×1小時、150℃×4小時的順序進行分段硬化,製作出樣品。依據JIS K 6253-3:2012所記載的方法測定所得到的硬化物的硬度(硬度計Shore A或Shore D)。將結果記載於表1。 A 50 mm diameter × 10 mm thick aluminum shallow dish was filled with the prepared hardening composition, and the samples were hardened in stages in the order of 60 ° C × 1 hour, 100 ° C × 1 hour, and 150 ° C × 4 hours to produce samples . The hardness of the obtained hardened product (Shore A or Shore D) was measured in accordance with the method described in JIS K 6253-3: 2012. The results are described in Table 1.
在兩枚50mm×20mm×1mm厚的載玻片之間夾著凹字型的1mm厚的鐵氟龍(註冊商標)間隔件,將該等固定之後,灌入硬化性組成物,依照60℃×1小時、100℃×1小時、150℃×4小時的順序進行分段硬化,製作出透過率測定樣品。以分光光度計U-4100(股份有限公司日立HighTechnologies製)測定所得到的樣品在450nm的透光率。將結果記載於表1。 A 1mm thick Teflon (registered trademark) spacer with a concave shape is sandwiched between two 50mm × 20mm × 1mm thick glass slides. After fixing these, a hardening composition is poured and the temperature is 60 ° C. × 1 hour, 100 ° C. × 1 hour, and 150 ° C. × 4 hours were sequentially cured in stages to produce a transmittance measurement sample. The light transmittance of the obtained sample at 450 nm was measured with a spectrophotometer U-4100 (manufactured by Hitachi High Technologies). The results are described in Table 1.
在150mm×200mm×2mm厚的凹型鐵氟龍(註冊商標)金 屬模具中灌入調製好的硬化性組成物,依照60℃×1小時、100℃×1小時、150℃×4小時的順序進行分段硬化,製作出測試樣品。依據JIS K 6251:2010,使用EZ TEST(EZ-L、島津製作所股份有限公司製),在測試速度500mm/min、夾具間距離80mm、標點問距離40mm的條件下,測定樣品的拉伸強度與切斷時的延伸率。將結果記載於表1。 150mm x 200mm x 2mm thick Teflon (registered trademark) gold A prepared hardening composition is poured into a mold, and the sample is hardened in stages in the order of 60 ° C. × 1 hour, 100 ° C. × 1 hour, and 150 ° C. × 4 hours. According to JIS K 6251: 2010, EZ TEST (EZ-L, manufactured by Shimadzu Corporation) was used to measure the tensile strength of the sample at a test speed of 500 mm / min, a distance between fixtures of 80 mm, and a punctuation distance of 40 mm Elongation at cutting. The results are described in Table 1.
以姆指按壓在硬化物的表面1秒鐘,對於拉開時的抵抗進行官能評估。將感到抵抗的情況評為「有」、沒有感到抵抗的情況評為「無」。將結果揭示於表1。 The thumb was pressed against the surface of the hardened material for 1 second, and the resistance when pulled apart was evaluated. Those who felt resistance were rated "yes" and those who did not feel resistance were rated "no". The results are shown in Table 1.
在凹型鐵氟龍(註冊商標)金屬模具中灌入調製好的硬化性組成物,依照60℃×1小時、100℃×1小時、150℃×4小時的順序進行分段硬化,製作出100mm×100mm×2mm厚的硬化物薄片。對於所得到的薄片,藉由ZP07-SD2000-F1B333NBC-ZB1050(DISCO股份有限公司)的刀片進行刀片切割來作評估。評估是將切割後的部分沒有凹陷的情況評為「良」、切割後的部分凹陷的情況評為「不良」。將結果揭示於表1。 The prepared Teflon (registered trademark) metal mold was filled with the prepared hardening composition, and then stepwise hardened in the order of 60 ° C × 1 hour, 100 ° C × 1 hour, and 150 ° C × 4 hours to produce 100 mm. × 100mm × 2mm thick hardened sheet. The obtained sheet was evaluated by blade cutting with a blade of ZP07-SD2000-F1B333NBC-ZB1050 (DISCO Co., Ltd.). The evaluation was rated as "good" for the case where there was no dent after cutting, and as "bad" for the part after cutting. The results are shown in Table 1.
如表1所示般,適量使用本發明之環狀乙烯基矽氧烷的硬化性聚矽氧樹脂組成物,可產生具有充足的強度,切割性良好,不會沾黏的硬化物。另外還可降低樹脂組成物的黏度,並且可期待作業效率的提升。 As shown in Table 1, the curable polysiloxane resin composition using the cyclic vinyl siloxane of the present invention in an appropriate amount can produce a hardened material having sufficient strength, good cutting properties, and no stickiness. In addition, the viscosity of the resin composition can be reduced, and an improvement in work efficiency can be expected.
此外,本發明不受限於上述實施形態。上述實施形態為例示,任何與本發明之申請專利範圍所記載的技術思想實質上具有相同的構成、發揮同樣的作用效果的物品,皆被包含在本發明之技術範圍。 The present invention is not limited to the embodiments described above. The above embodiment is an example, and any article having substantially the same structure and exhibiting the same effect as the technical idea described in the patent application scope of the present invention is included in the technical scope of the present invention.
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- 2017-03-22 TW TW106109568A patent/TWI728074B/en active
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TWI728074B (en) | 2021-05-21 |
JP2017193702A (en) | 2017-10-26 |
JP6776954B2 (en) | 2020-10-28 |
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