以下，對用以實施本發明之形態進行詳細說明。但本發明並不限定於以下之實施形態。又，有時省略不必要之詳細說明。例如有時省略公知事項之詳細說明、及對實質上同一構成之重複說明。其原因在於避免以下說明過於冗長而便於業者理解。再者，本發明者提供以下說明之目的在於使業者充分理解本發明，而非意欲藉此限定申請專利範圍中所記載之主題。 於本說明書中，作為「承載帶」，例如可列舉用於搬送或保管電子零件(例如記憶微晶片、IC晶片、電阻器、連接器、處理器、電容器、閘陣列、電晶體、二極體、繼電器及LED(Light Emitting Diode，發光二極體))等對象物(構成要素。搬送對象物、保管對象物等)之承載帶。承載帶例如可作為於長條狀之任意寬度之片材上隔開一定間隔地配置有用以收容對象物(電子零件等)之凹部(稱為袋狀部之凹部)的包裝材料(對象物(電子零件等)之包裝材料)使用。亦可於將對象物(電子零件等)收容於凹部後，使稱為覆帶之具有黏著性或熱熔性之膜沿連續設置有袋狀部之方向連續黏著或接著於承載帶之上部，而覆蓋袋狀部之開口面，藉此形成蓋部。 於本說明書中，所謂「(甲基)丙烯酸」意指丙烯酸、及與此對應之甲基丙烯酸中之至少一者。「(甲基)丙烯醯基」等其他類似表達亦同樣。本說明書中，關於組合物中之各成分之含量，於組合物中相當於各成分之物質存在複數個之情形時，只要無特別說明，則意指組合物中所存在之該複數個物質之合計量。以下例示之材料可單獨使用一種，亦可併用兩種以上。 本實施形態之聚碳酸酯樹脂組合物含有聚碳酸酯樹脂、聚對苯二甲酸烷二醇酯樹脂、碳材料及接枝共聚物。上述接枝共聚物具有具備芯部與被覆該芯部之至少一部分之被覆部的結構。上述碳材料之含量相對於上述聚碳酸酯樹脂及上述聚對苯二甲酸烷二醇酯樹脂之合計100質量份為10~45質量份。上述接枝共聚物相對於上述聚碳酸酯樹脂及上述聚對苯二甲酸烷二醇酯樹脂之合計100質量份為0.5~35質量份。本實施形態之聚碳酸酯樹脂組合物可用作導電性聚碳酸酯樹脂組合物。 本實施形態之聚碳酸酯樹脂組合物即便於經反覆成形之情形時亦可抑制導電性之降低。本發明者推測獲得此種效果之原因如下。即，推測於使用具有具備芯部及被覆部之結構之接枝共聚物及碳材料之情形時，碳材料易存在於上述接枝共聚物之表面，碳材料彼此間變得容易接觸。並且，推測藉由於含有聚碳酸酯樹脂及聚對苯二甲酸烷二醇酯樹脂之樹脂組合物中使用特定量之具有具備芯部及被覆部之結構之接枝共聚物及碳材料，而於接枝共聚物之表面上碳材料相互接觸，藉此易形成導電路徑。又，推測藉由接枝共聚物具有具備被覆部之結構，而於含有聚碳酸酯樹脂及聚對苯二甲酸烷二醇酯樹脂之樹脂組合物中接枝共聚物彼此之凝集得到抑制，從而獲得優異之分散性，因此易維持導電路徑。推測基於以上原因，樹脂組合物即便於經反覆成形之情形時亦抑制導電性之降低。 ＜聚碳酸酯樹脂組合物＞ ((A)成分：聚碳酸酯樹脂) 作為(A)成分之聚碳酸酯樹脂，可列舉例如利用使各種二羥基二芳基化合物與碳醯氯反應之光氣法、及使二羥基二芳基化合物與碳酸酯(碳酸二苯酯等)反應之酯交換法等所得之聚合物。製造(A)成分時根據需要可使用分子量調節劑、觸媒等。 作為二羥基二芳基化合物，可列舉：雙(4-羥基苯基)甲烷、1,1-雙(4-羥基苯基)乙烷、2,2-雙(4-羥基苯基)丙烷(別名：雙酚A)、2,2-雙(4-羥基苯基)丁烷、2,2-雙(4-羥基苯基)辛烷、雙(4-羥基苯基)苯甲烷、2,2-雙(4-羥基苯基-3-甲基苯基)丙烷、1,1-雙(4-羥基-3-第三丁基苯基)丙烷、2,2-雙(4-羥基-3-溴苯基)丙烷、2,2-雙(4-羥基-3,5-二溴苯基)丙烷、2,2-雙(4-羥基-3,5-二氯苯基)丙烷等雙(羥基芳基)烷烴類；1,1-雙(4-羥基苯基)環戊烷、1,1-雙(4-羥基苯基)環己烷等雙(羥基芳基)環烷烴類；4,4'-二羥基二苯醚、4,4'-二羥基-3,3'-二甲基二苯醚等二羥基二芳基醚類；4,4'-二羥基二苯硫醚等二羥基二芳基硫醚類；4,4'-二羥基二苯基亞碸、4,4'-二羥基-3,3'-二甲基二苯基亞碸等二羥基二芳基亞碸類；4,4'-二羥基二苯碸、4,4'-二羥基-3,3'-二甲基二苯碸等二羥基二芳基碸類等。二羥基二芳基化合物可單獨使用一種，亦可併用兩種以上。 亦可將二羥基二芳基化合物與哌𠯤、二哌啶基對苯二酚、間苯二酚、4,4'-二羥基聯苯等併用。 亦可將二羥基二芳基化合物與3價以上之酚化合物併用。作為3價以上之酚化合物，可列舉：間苯三酚、4,6-二甲基-2,4,6-三(4-羥基苯基)庚烯、2,4,6-三甲基-2,4,6-三(4-羥基苯基)庚烷、1,3,5-三(4-羥基苯基)苯、1,1,1-三(4-羥基苯基)乙烷、2,2-雙[4,4-(4,4'-二羥基二苯基)環己基]丙烷等。 (A)成分之黏度平均分子量就易獲得優異成形性之觀點而言，較佳為10000以上，更佳為15000以上，進而較佳為17000以上，特佳為20000以上。(A)成分之黏度平均分子量就易獲得成形體(片材等)之表面之優異外觀之觀點而言，較佳為100000以下，更佳為35000以下，進而較佳為28000以下，特佳為25000以下。就該等觀點而言，(A)成分之黏度平均分子量較佳為10000~100000，更佳為15000~35000，進而較佳為17000~28000，特佳為20000~25000。 (A)成分之黏度平均分子量可藉由以下程序獲得。首先，使用二氯甲烷作為溶劑而獲得0.5質量%之聚碳酸酯樹脂溶液。繼而，利用坎農-芬斯克型黏度管於溫度20℃下測定比黏度(ηsp
)。進而，藉由濃度換算而求出極限黏度[η]，根據下述SCHNELL式而可算出黏度平均分子量M。 [η]=1.23×10-4
M0.83
(A)成分之含量以(A)成分與(B)成分之合計量為基準計較佳為下述範圍。(A)成分之含量就易獲得優異成形性之觀點而言，較佳為90質量%以上，更佳為93質量%以上，進而較佳為95質量%以上，特佳為97質量%以上。(A)成分之含量就易獲得成形體(片材等)之表面之優異外觀之觀點而言，較佳為99.94質量%以下，更佳為99.9質量%以下，進而較佳為99.5質量%以下，特佳為99質量%以下。就該等觀點而言，(A)成分之含量較佳為90~99.94質量%，更佳為93~99.9質量%，進而較佳為95~99.5質量%，特佳為97~99質量%。 ((B)成分：聚對苯二甲酸烷二醇酯樹脂) 作為(B)成分之聚對苯二甲酸烷二醇酯樹脂，可列舉：聚對苯二甲酸乙二酯樹脂、聚對苯二甲酸丙二酯樹脂、聚對苯二甲酸丁二酯樹脂等。 根據JIS K7233而測定之(B)成分之固有黏度較佳為下述範圍。上述固有黏度就易獲得優異導電性(較低電阻值。以下同樣)之觀點而言，較佳為0.6以上，更佳為0.7以上，進而較佳為0.9以上，特佳為1.0以上。上述固有黏度就(B)成分相對於其他樹脂成分((A)成分等)之分散性提高之觀點而言，較佳為1.5以下，更佳為1.4以下，進而較佳為1.2以下。就該等觀點而言，上述固有黏度較佳為0.6~1.5，更佳為0.7~1.4，進而較佳為0.9~1.2，特佳為1.0~1.2。 (B)成分之含量以(A)成分與(B)成分之合計量為基準計較佳為下述範圍。(B)成分之含量就易獲得優異導電性之觀點而言，較佳為0.06質量%以上，更佳為0.5質量%以上，進而較佳為1.0質量%以上，特佳為1.5質量%以上，極佳為2.0質量%以上。(B)成分之含量就易獲得成形體之優異外觀之觀點而言，較佳為10質量%以下，更佳為5.0質量%以下，進而較佳為3.0質量%以下。就該等觀點而言，(B)成分之含量較佳為0.06~10質量%，更佳為0.5~5.0質量%，進而較佳為1.0~3.0質量%，特佳為1.5~3.0質量%，極佳為2.0~3.0質量%。 ((C)成分：碳材料) 作為(C)成分之碳材料，可列舉：碳黑、石墨、碳纖維、奈米碳管、奈米碳卷、奈米碳球等。 作為碳黑之分類，可列舉：爐型、乙炔型、科琴型等。其中，就易獲得優異再利用性之觀點而言，較佳為爐型碳黑。 碳黑之比表面積就易獲得優異導電性之觀點而言，較佳為30 m2
/g以上，更佳為40 m2
/g以上，進而較佳為50 m2
/g以上。碳黑之比表面積就易獲得碳黑之優異分散性、成形體(片材等)之表面之優異外觀之觀點而言，較佳為90 m2
/g以下，更佳為75 m2
/g以下，進而較佳為60 m2
/g以下。就該等觀點而言，碳黑之比表面積較佳為30~90 m2
/g，更佳為40~75 m2
/g，進而較佳為50~60 m2
/g。碳黑之比表面積亦可為50~90 m2
/g。 比表面積可依據JIS K6217橡膠用碳黑之基本性能之試驗法進行測定。比表面積係以每單位質量(g)之碳黑之表面積(m2
)表示。比表面積可藉由將經脫氣之碳黑浸漬於液態氮中，測定平衡時碳黑表面所吸附之氮量而獲得。 碳黑之DBP吸油量就易獲得優異導電性之觀點而言，較佳為100 ml/100 g以上，更佳為130 ml/100 g以上，進而較佳為150 ml/100 g以上，特佳為超過150 ml/100 g，極佳為160 ml/100 g以上，極其佳為170 ml/100 g。碳黑之DBP吸油量就易獲得碳黑之優異分散性、成形體(片材等)之表面之優異外觀之觀點而言，較佳為300 ml/100 g以下，更佳為220 ml/100 g以下，進而較佳為200 ml/100 g以下。就該等觀點而言，碳黑之DBP吸油量較佳為100~300 ml/100 g，更佳為130~300 ml/100 g，進而較佳為150~300 ml/100 g，特佳為超過150 ml/100 g且為300 ml/100 g以下，極佳為160~220 ml/100 g，極其佳為170~200 ml/100 g。 DBP(鄰苯二甲酸正二丁酯，Di-butylphthalate)吸油量可依據JIS K6217橡膠用碳黑之基本性能之試驗法進行測定。DBP吸油量與碳黑粒子彼此間之接合力有關，DBP吸油量較大則表示結構較長。 就易獲得優異導電性之觀點，及易獲得碳黑之優異分散性、成形體(片材等)之表面之優異外觀之觀點而言，較佳為碳黑之上述比表面積及上述DBP吸油量兩者滿足上述較佳範圍。例如較佳為比表面積為30~90 m2
/g，且DBP吸油量為100~300 ml/100 g之態樣。 (C)成分之含量相對於(A)成分與(B)成分之合計100質量份為10~45質量份。若(C)成分之含量未達10質量份，則成形體無法獲得充分之導電性。若(C)成分之含量超過45質量份，則黏度增大、成形穩定性降低。(C)成分之含量就易獲得優異導電性之觀點而言，相對於(A)成分與(B)成分之合計100質量份，較佳為13質量份以上，更佳為15質量份以上，進而較佳為17質量份以上，特佳為20質量份以上，極佳為21質量份以上。(C)成分之含量就成形穩定性易提高之觀點而言，相對於(A)成分與(B)成分之合計100質量份，較佳為40質量份以下，更佳為30質量份以下，進而較佳為27質量份以下，特佳為25質量份以下。就該等觀點而言，(C)成分之含量相對於(A)成分與(B)成分之合計100質量份，較佳為10~40質量份，更佳為13~30質量份，進而較佳為15~27質量份，特佳為15~25質量份，極佳為17~25質量份，尤佳為20~25質量份，進而較佳為21~25質量份。 ((D)成分：接枝共聚物) (D)成分之接枝共聚物具有具備芯部(芯材)與被覆該芯部之至少一部分之被覆部的結構。(D)成分亦可具有例如具備核心層(芯部)與包覆該核心層之殼層(被覆部)之核殼型結構。芯部及被覆部可由互不相同之聚合物構成。芯部及被覆部亦可分別具有複數層。被覆部可被覆芯部之一部分，亦可被覆整個芯部。(D)成分可藉由於芯部之構成成分之存在下使被覆部之構成成分反應，而使被覆部之構成成分與芯部之構成成分接枝聚合而獲得。 芯部就進一步抑制再利用時之導電性降低之觀點而言，較佳為包含選自由丙烯酸系橡膠(具有源自含丙烯醯基之單體之結構單元的聚合物)及矽酮系橡膠所組成之群中之至少一種，更佳為包含丙烯酸系橡膠。作為芯部之構成成分，不限於丙烯酸系橡膠及矽酮系橡膠，亦可使用聚丁二烯等。 作為丙烯酸系橡膠，可使用具有源自含丙烯醯基之單體之結構單元作為主結構單元之聚合物。源自含丙烯醯基之單體之結構單元之含量就易獲得優異再利用性之觀點而言，以丙烯酸系橡膠之總質量為基準計，較佳為50~100質量%，更佳為70~100質量%。 作為含丙烯醯基之單體，可使用丙烯酸酯。作為丙烯酸酯，可列舉烷基之碳數為2~8之丙烯酸烷基酯等，可列舉：丙烯酸乙酯、丙烯酸正丁酯、丙烯酸2-乙基己酯等。 丙烯酸系橡膠亦可具有源自丙烯酸酯以外之其他成分之結構單元。作為此種成分，就易低價獲得共聚物之觀點而言，較佳為能夠與丙烯酸酯共聚合之乙烯基系單體。 作為能夠與丙烯酸酯共聚合之乙烯基系單體，可列舉：苯乙烯、α-甲基苯乙烯等芳香族乙烯基化合物；甲基丙烯酸甲酯、甲基丙烯酸乙酯等甲基丙烯酸烷基酯；丙烯腈、甲基丙烯腈等不飽和腈；甲基乙烯醚、丁基乙烯醚等乙烯醚；氯乙烯、溴乙烯等鹵化乙烯；偏二氯乙烯、偏二溴乙烯等偏二鹵乙烯；丙烯酸縮水甘油酯、甲基丙烯酸縮水甘油酯、烯丙基縮水甘油醚、乙二醇縮水甘油醚等具有縮水甘油基之乙烯基系單體等。 作為丙烯酸系橡膠，可使用矽酮-丙烯酸系橡膠(具有源自含丙烯醯基之單體(丙烯酸系成分)之結構單元、及源自矽酮成分之結構單元的複合聚合物。例如具有源自丙烯酸烷基酯之結構單元、及聚有機矽氧烷骨架的聚合物)。 作為矽酮系橡膠，可使用聚有機矽氧烷，例如可使用有機矽氧烷鍵之單元達數千以上之作為線性聚合物之聚有機矽氧烷。矽酮系橡膠藉由何種方法製造均可，較佳為利用乳化聚合法所得之橡膠。 作為聚有機矽氧烷，並無特別限制，較佳為具有乙烯基聚合性官能基之聚有機矽氧烷。聚有機矽氧烷可使用二甲基矽氧烷而獲得。二甲基矽氧烷可為鏈狀，亦可為環狀。作為二甲基矽氧烷，可列舉3員環以上之二甲基矽氧烷系環狀體等，較佳為3~7員環之二甲基矽氧烷系環狀體。具體而言，可列舉：六甲基環三矽氧烷、八甲基環四矽氧烷、十甲基環五矽氧烷、十二甲基環六矽氧烷等。二甲基矽氧烷可單獨使用一種，亦可併用兩種以上。 構成(D)成分之被覆部就(D)成分相對於其他樹脂成分((A)成分、(B)成分等)之分散性提高之觀點而言，較佳為包含如下聚合物，該聚合物具有選自由源自不飽和羧酸酯之結構單元、源自乙烯基化合物(不飽和羧酸酯除外)之結構單元、源自順丁烯二醯亞胺化合物之結構單元、源自不飽和二羧酸之結構單元、及源自不飽和二羧酸酸酐之結構單元所組成之群中之至少一種。 作為乙烯基化合物，可列舉：含縮水甘油基之乙烯基化合物、脂肪族乙烯基化合物、芳香族乙烯基化合物、氰化乙烯基化合物等。將相當於含縮水甘油基之乙烯基化合物、且同時相當於脂肪族乙烯基化合物、芳香族乙烯基化合物或氰化乙烯基化合物之化合物歸類為含縮水甘油基之乙烯基化合物。 就(D)成分相對於其他樹脂成分((A)成分、(B)成分等)之分散性提高之觀點而言，較佳為具有選自由源自不飽和羧酸酯之結構單元、源自含縮水甘油基之乙烯基化合物之結構單元、及源自不飽和二羧酸酸酐之結構單元所組成之群中之至少一種的聚合物，更佳為具有源自不飽和羧酸酯之結構單元的聚合物。提供構成被覆部之聚合物之結構單元的化合物可單獨使用一種，亦可併用兩種以上。 作為不飽和羧酸酯，可列舉：不飽和羧酸烷基酯、不飽和羧酸芳基酯等。作為不飽和羧酸酯，可使用(甲基)丙烯酸酯。作為(甲基)丙烯酸酯，可列舉：(甲基)丙烯酸烷基酯、(甲基)丙烯酸芳基酯等。 作為不飽和羧酸烷基酯，就(D)成分相對於其他樹脂成分((A)成分、(B)成分等)之分散性提高之觀點而言，較佳為(甲基)丙烯酸烷基酯。作為(甲基)丙烯酸烷基酯，可列舉：(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸正己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸氯甲酯、(甲基)丙烯酸2-氯乙酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸2,3,4,5,6-五羥基己酯、(甲基)丙烯酸2,3,4,5-四羥基戊酯、(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸(丙基胺基)乙酯、(甲基)丙烯酸(二甲基胺基)乙酯、(甲基)丙烯酸(乙基胺基)丙酯、(甲基)丙烯酸(苯基胺基)乙酯、(甲基)丙烯酸(環己基胺基)乙酯等。作為(甲基)丙烯酸烷基酯，就(D)成分相對於其他樹脂成分((A)成分、(B)成分等)之分散性提高效果較顯著之觀點而言，較佳為選自由(甲基)丙烯酸甲酯及(甲基)丙烯酸正丁酯所組成之群中之至少一種。 作為不飽和羧酸芳基酯，就(D)成分相對於其他樹脂成分((A)成分、(B)成分等)之分散性提高之觀點而言，較佳為(甲基)丙烯酸芳基酯。作為(甲基)丙烯酸芳基酯，可列舉：(甲基)丙烯酸苯酯、(甲基)丙烯酸二甲基苯酯、(甲基)丙烯酸萘酯等。 作為含縮水甘油基之乙烯基化合物，可列舉：(甲基)丙烯酸縮水甘油酯、伊康酸縮水甘油酯、伊康酸二縮水甘油酯、烯丙基縮水甘油醚、苯乙烯-4-縮水甘油醚、4-縮水甘油基苯乙烯等。作為含縮水甘油基之乙烯基化合物，就耐衝擊性提高效果較顯著之觀點而言，較佳為(甲基)丙烯酸縮水甘油酯。含縮水甘油基之乙烯基化合物可單獨使用一種，亦可併用兩種以上。 作為脂肪族乙烯基化合物，可列舉：乙烯、丙烯、丁二烯等。作為芳香族乙烯基化合物，可列舉：苯乙烯、α-甲基苯乙烯、對胺基苯乙烯、1-乙烯基萘、4-甲基苯乙烯、4-丙基苯乙烯、4-環己基苯乙烯、4-十二烷基苯乙烯、2-乙基-4-苄基苯乙烯、4-(苯基丁基)苯乙烯、鹵化苯乙烯、2-苯乙烯-㗁唑啉等。作為氰化乙烯基化合物，可列舉：丙烯腈、甲基丙烯腈、乙基丙烯腈等。 作為其他乙烯基化合物，可列舉：丙烯醯胺、甲基丙烯醯胺、N-甲基丙烯醯胺、丁氧基甲基丙烯醯胺、N-丙基甲基丙烯醯胺、N-乙烯基二乙基胺、N-乙醯基乙烯基胺、烯丙基胺、甲基烯丙基胺、N-甲基烯丙基胺、2-異丙烯基㗁唑啉、2-乙烯基㗁唑啉等。 作為順丁烯二醯亞胺化合物，可列舉：順丁烯二醯亞胺、N-甲基順丁烯二醯亞胺、N-乙基順丁烯二醯亞胺、N-丙基順丁烯二醯亞胺、N-異丙基順丁烯二醯亞胺、N-環己基順丁烯二醯亞胺、N-苯基順丁烯二醯亞胺、N-(對溴苯基)順丁烯二醯亞胺、N-(氯苯基)順丁烯二醯亞胺等。作為不飽和二羧酸，可列舉：順丁烯二酸、伊康酸、苯二甲酸等。 作為芯部及被覆部之構成成分之組合，就抑制再利用時之導電性之降低之效果更優異之觀點而言，較佳為具有具備芯部與被覆部之結構之接枝共聚物，上述芯部包含丙烯酸系橡膠(具有源自含丙烯醯基之單體之結構單元之聚合物)，上述被覆部包含如下聚合物，該聚合物具有選自由源自不飽和羧酸酯之結構單元及源自乙烯基化合物之結構單元所組成之群中之至少一種。更佳為選自由下述(D-I)成分及下述(D-II)成分所組成之群中之至少一種，進而較佳為(D-II)成分。 (D-I)成分：具有具備芯部與被覆部之核殼型結構之接枝共聚物，上述芯部包含矽酮-丙烯酸系橡膠，上述被覆部包含如下聚合物，該聚合物具有選自由源自不飽和羧酸酯之結構單元及源自乙烯基化合物之結構單元所組成之群中之至少一種。 (D-II)成分：具有具備芯部與被覆部之核殼型結構之接枝共聚物，上述芯部包含丙烯酸系橡膠，上述被覆部包含具有源自不飽和羧酸酯之結構單元之聚合物。 作為(D-I)成分，就抑制再利用時導電性之降低之效果更優異之觀點而言，較佳為具備包含如下聚合物之被覆部，該聚合物具有選自由源自不飽和羧酸烷基酯之結構單元及源自乙烯基化合物之結構單元所組成之群中之至少一種，更佳為具備包含如下聚合物之被覆部，該聚合物具有選自由源自(甲基)丙烯酸甲酯之結構單元及源自含縮水甘油基之乙烯基化合物之結構單元所組成之群中之至少一種。作為(D-I)成分之市售品，可列舉Mitsubishi Rayon股份有限公司製造之Metablen S-2001、Metablen S-2006、Metablen S-2200等。 作為(D-II)成分，就抑制再利用時導電性之降低之效果更優異之觀點而言，較佳為具備包含如下聚合物之被覆部，該聚合物具有源自不飽和羧酸烷基酯之結構單元，更佳為具備包含如下聚合物之被覆部，該聚合物具有源自(甲基)丙烯酸甲酯之結構單元。作為(D-II)成分之市售品，可列舉Rohm and Haas Japan股份有限公司製造之Paraloid BPM-500及Paraloid BPM-515；Mitsubishi Rayon股份有限公司製造之Metablen W-450A及Metablen W-600A等。 (D)成分之含量相對於(A)成分與(B)成分之合計100質量份為0.5~35質量份。若(D)成分之含量未達0.5質量份，則無法獲得充分之再利用性。(D)成分之含量就抑制再利用時導電性之降低之效果更優異之觀點而言，相對於(A)成分與(B)成分之合計100質量份，較佳為1質量份以上，更佳為2質量份以上，進而較佳為5質量份以上，特佳為7質量份以上，極佳為8質量份以上，尤佳為10質量份以上。若(D)成分之含量超過35質量份，無法獲得充分之再利用性，且成形體之外觀變差。(D)成分之含量就抑制再利用時導電性之降低之效果更優異之觀點，及獲得成形體之更優異外觀之觀點而言，相對於(A)成分與(B)成分之合計100質量份，較佳為30質量份以下，更佳為20質量份以下，進而較佳為18質量份以下，特佳為15質量份以下，極佳為12質量份以下。就該等觀點而言，(D)成分之含量相對於(A)成分與(B)成分之合計100質量份，較佳為0.5~30質量份，更佳為1~20質量份，進而較佳為2~20質量份，特佳為5~18質量份，極佳為7~15質量份，尤佳為8~12質量份，進而較佳為10~12質量份。 (其他成分) 本實施形態之聚碳酸酯樹脂組合物根據需要可含有上述成分以外之公知樹脂(聚醯胺樹脂、聚醯亞胺樹脂、聚苯乙烯樹脂、ABS(Acrylonitrile-Butadiene-Styrene，丙烯腈-丁二烯-苯乙烯)樹脂、聚烯烴樹脂(聚乙烯樹脂、聚丙烯樹脂等)、酚樹脂、環氧樹脂等)。 本實施形態之聚碳酸酯樹脂組合物根據需要可含有上述成分以外之公知添加劑。作為此種添加劑，可列舉：抗氧化劑(磷系抗氧化劑、酚系抗氧化劑等)、脫模劑(甘油脂肪酸酯等)、潤滑劑(石蠟、硬酯酸正丁酯、合成蜜蠟、天然蜜蠟、甘油單酯、褐煤酸蠟、聚乙烯蠟、季戊四醇四硬脂酸酯等)、著色劑(氧化鈦、染料、顏料等)、填充劑(碳酸鈣、黏土、二氧化矽、玻璃纖維、玻璃球、玻璃碎片、滑石、雲母、各種晶鬚類等)、流動性改良劑、展佈劑(環氧化大豆油、液態石蠟等)、阻燃劑(溴系化合物、磷系化合物、有機金屬鹽系化合物、矽酮系化合物等)等。 (樹脂組合物之製作方法) 本實施形態之聚碳酸酯樹脂組合物可藉由將構成成分加以混合而獲得。作為本實施形態之聚碳酸酯樹脂組合物之構成成分之混合方法，並無特別限制，例如可列舉使用任意混合機(滾筒混合機、帶式混合機、高速混合機等)混合後，使用擠出機等進行熔融混練之方法。 ＜成形體及其製造方法＞ 本實施形態之成形體(成形品)包含本實施形態之聚碳酸酯樹脂組合物。本實施形態之成形體可為膜狀，亦可為平板狀。作為本實施形態之成形體，可列舉：膜、帶、片材等。作為本實施形態之成形體，例如可列舉收容電子零件之容器(例如電子零件之搬送或保管用容器)。 作為本實施形態之成形體，例如可列舉承載帶。本實施形態之承載帶包含本實施形態之聚碳酸酯樹脂組合物。本實施形態之承載帶可為膜狀，亦可為平板狀。本實施形態之承載帶亦可具有能夠收容對象物(電子零件等)之收容部，例如具有於帶之長度方向上隔開間隔而形成之複數個袋狀部(用以收容對象物之凹部)。 作為膜，例如可列舉寬度(膜寬度)為100~1500 mm且厚度為0.05~0.5 mm之成形體。作為帶(承載帶等)，例如可列舉寬度(帶寬度)為3~100 mm(較佳為10~50 mm)且厚度為0.05~0.5 mm之成形體。作為片材，例如可列舉寬度(片材寬度)為100~1500 mm且厚度為0.7~10 mm之成形體。 本實施形態之成形體之製造方法具備使本實施形態之聚碳酸酯樹脂組合物成形而獲得成形體之成形步驟。本實施形態之成形體之製造方法可具備複數個成形步驟，例如亦可進而具備使包含本實施形態之聚碳酸酯樹脂組合物之成形體熔融而獲得樹脂組合物之步驟、與使該樹脂組合物成形而獲得成形體之步驟。作為本實施形態之聚碳酸酯樹脂組合物之成形方法，並無特別限制，可使用公知之擠出成形法(T模成形法、壓延成形法等)、射出成形法、射出-壓縮成形法等。 本實施形態之承載帶之製造方法具備使本實施形態之聚碳酸酯樹脂組合物成形而獲得承載帶之成形步驟。本實施形態之承載帶之製造方法亦可具備複數個成形步驟，例如亦可進而具備使本實施形態之聚碳酸酯樹脂組合物熔融而獲得樹脂組合物之步驟、與使該樹脂組合物成形而獲得承載帶之步驟。作為用以對承載帶賦予稱為袋狀部之凹部之成形方法，可列舉：壓空成形法、加壓成形法、真空旋轉成形法等。 以上說明了作為本發明之技術之例示的實施形態。為此提供詳細說明。因而，詳細說明所記載之構成要素中不僅包含用以解決課題之必需構成要素，亦可能包含用以例示上述技術但並非解決課題所必需之構成要素。因此，不該因該等非必需之構成要素記載於詳細說明中，而當即認定該等非必需之構成要素為必需。又，上述實施形態係用以例示本發明之技術者，因此可於申請專利範圍或其均等範圍中進行各種變更、置換、附加、省略等。 [實施例] 以下，藉由實施例對本發明進行說明，但本發明並非限定於該等實施例。 ＜1.顆粒之製作＞ 準備表1~3所示含量之調配成分。繼而，使用直徑37 mm之雙軸擠出機(神戶製鋼所股份有限公司製造，KTX-37)於缸體溫度280℃下對上述調配成分進行熔融混練，而獲得各種顆粒。 所使用之調配成分之詳細內容如下所示。 [聚碳酸酯樹脂] A-1：由雙酚A及碳醯氯合成之聚碳酸酯樹脂，Sumika Styron Polycarbonate股份有限公司製造，Calibre 200-13(黏度平均分子量：21000) [聚對苯二甲酸烷二醇酯樹脂] B-1：聚對苯二甲酸丁二酯樹脂，Polyplastics股份有限公司製造，Duranex 600FP(固有黏度：1.0) [碳材料] C-1：爐型碳黑，Cabot公司製造，Vulcan XC-305(比表面積：70 m2
/g，DBP吸油量：130 ml/100 g) C-2：爐型碳黑，三菱化學股份有限公司製造，#3050B(比表面積：50 m2
/g，DBP吸油量：175 ml/100 g) [接枝共聚物] D-1：核殼型接枝共聚物(核心層：矽酮-丙烯酸系橡膠，殼層：具有如下結構單元之聚合物，該結構單元係源自具有源自不飽和羧酸烷基酯之結構單元之聚合物；(D-I)成分)，Mitsubishi Rayon股份有限公司製造，Metablen S-2001 D-2：核殼型接枝共聚物(核心層：丙烯酸系橡膠，殼層：具有源自不飽和羧酸烷基酯之結構單元之聚合物；(D-II)成分)，Mitsubishi Rayon股份有限公司製造，Metablen W-450A D-3：核殼型接枝共聚物(核心層：聚丁二烯，殼層：具有源自(甲基)丙烯酸烷基酯之結構單元之聚合物)，Rohm and Haas Japan股份有限公司製造，Paraloid EXL2603 ＜2.平板之製造＞ 利用乾燥機將上述項目1之顆粒於120℃下乾燥4小時。繼而，利用小型射出成形機(日本製鋼所股份有限公司(JSW)製造，J100EII-P)，於成形溫度300℃、模具溫度90℃下，獲得尺寸為50 mm×80 mm×厚度2 mm之平板。 ＜3.導電性之評估＞ 準備5張上述項目2之平板(反覆造粒次數為零之樣品)。繼而，利用導電性測定器(三菱化學股份有限公司製造，Loresta-GP MCP-T600)測定平板表面之中央附近之表面固有電阻值(Ω/sq.)，求出5張之平均值作為導電性之值。 ＜4.再利用性之評估＞ 使用上述項目1之顆粒，利用小型單軸擠出機(Tanabe Plastics Machinery股份有限公司製造，VS-40)於擠出溫度300℃、螺桿轉數120 rpm下反覆進行5次造粒。採集經反覆5次造粒後之顆粒，藉由與上述項目2之方法相同之方法獲得平板。藉由與上述項目3相同之方法求出該平板(反覆進行5次造粒後之樣品)之導電性。 作為再利用性之判定，將反覆進行有5次造粒時(反覆造粒次數為5次)之平板之表面固有電阻值未達1×1010
(Ω/sq.)之情形評估為「A」(再利用性良好)，將表面固有電阻值為1×1010
(Ω/sq.)以上(表中記載為「≧1×1010
」)之情形評估為「B」(再利用性較差)。 ＜5.平板外觀之評估＞ 藉由目視觀察未進行反覆造粒時(反覆造粒次數為零)之平板之表面。將確認無不均之均勻表面之情形評估為「A」，將平板表面確認有不均之情形評估為「B」。 各評估結果如表1~3所示。 [表1]
[表2]
[表3]
如表1及表2所示，實施例中，導電性、再利用性及平板之外觀各項均良好。 另一方面，如表3所示，比較例中，結果各情形時均無法滿足再利用性。 比較例1為碳材料之含量較少之情形，導電性及再利用性較差。 比較例2為碳材料之含量較多之情形，黏度過高，成形其本身較為困難。 比較例3為接枝共聚物之含量較少之情形，再利用性較差。 比較例4為接枝共聚物之含量較多之情形，再利用性及平板之外觀較差。 比較例5為未使用接枝共聚物之情形，導電性、再利用性及平板之外觀較差。 比較例6為碳材料之含量較少之情形，導電性、再利用性及平板之外觀較差。 [產業上之可利用性] 根據本發明，即便於經反覆成形之情形時亦可抑制導電性之降低。例如根據本發明，即便基於再利用等目的而反覆藉由熔融擠出進行成形，亦可將導電性之降低抑制至極低程度。進而，根據本發明，不僅可實現成形體之優異外觀，且即便於經反覆成形之情形時亦可抑制導電性之降低。因此，本發明之工業利用價值極高。Hereinafter, the mode for implementing the present invention will be described in detail. However, the present invention is not limited to the following embodiments. Also, unnecessary detailed descriptions are sometimes omitted. For example, detailed descriptions of well-known items and repeated descriptions of substantially the same configuration may be omitted. The reason is to avoid that the following description is too long and easy for the industry to understand. Furthermore, the purpose of the following description provided by the present inventor is to enable the industry to fully understand the present invention, and is not intended to limit the subject matter described in the scope of the patent application. In this specification, as the "carrier tape", for example, it can be used to transport or store electronic components (such as memory microchips, IC chips, resistors, connectors, processors, capacitors, gate arrays, transistors, and diodes). , Relay and LED (Light Emitting Diode, light-emitting diode) and other objects (components. Transport objects, storage objects, etc.) carrier belt. For example, the carrier tape can be used as a packaging material (object (object Electronic parts, etc.) packaging materials) use. After accommodating the object (electronic parts, etc.) in the recess, the adhesive or hot-melt film called the cover tape can be continuously adhered or adhered to the upper part of the carrier tape in the direction in which the bag-like part is continuously provided. The opening surface of the bag-shaped portion is covered, thereby forming a cover portion. In this specification, the so-called "(meth)acrylic acid" means at least one of acrylic acid and methacrylic acid corresponding thereto. The same applies to other similar expressions such as "(meth)acryloyl". In this specification, with regard to the content of each component in the composition, when there are multiple substances corresponding to each component in the composition, unless otherwise specified, it means the content of the plurality of substances present in the composition Total amount. The materials exemplified below may be used singly, or two or more of them may be used in combination. The polycarbonate resin composition of this embodiment contains a polycarbonate resin, a polyalkylene terephthalate resin, a carbon material, and a graft copolymer. The above-mentioned graft copolymer has a structure including a core part and a coating part covering at least a part of the core part. The content of the carbon material is 10 to 45 parts by mass relative to 100 parts by mass of the total of the polycarbonate resin and the polyalkylene terephthalate resin. The said graft copolymer is 0.5-35 mass parts with respect to the total of 100 mass parts of the said polycarbonate resin and the said polyalkylene terephthalate resin. The polycarbonate resin composition of this embodiment can be used as a conductive polycarbonate resin composition. The polycarbonate resin composition of this embodiment can suppress the decrease in conductivity even when it is repeatedly molded. The inventors speculate that the reason for obtaining such an effect is as follows. That is, it is estimated that when a graft copolymer and a carbon material having a structure having a core portion and a coating portion are used, the carbon material is likely to exist on the surface of the graft copolymer, and the carbon materials become easy to contact each other. In addition, it is estimated that a specific amount of a graft copolymer having a structure with a core and a coating and a carbon material are used in a resin composition containing a polycarbonate resin and a polyalkylene terephthalate resin. The carbon materials on the surface of the graft copolymer are in contact with each other, thereby easily forming a conductive path. In addition, it is estimated that the graft copolymer has a structure with a coating portion, and the aggregation of the graft copolymers with each other in the resin composition containing the polycarbonate resin and the polyalkylene terephthalate resin is suppressed, thereby Obtain excellent dispersibility, so it is easy to maintain a conductive path. It is presumed that for the above reasons, the resin composition suppresses the decrease in conductivity even when it is repeatedly molded. <Polycarbonate resin composition> ((A) component: polycarbonate resin) As the polycarbonate resin of the (A) component, for example, phosgene obtained by reacting various dihydroxydiaryl compounds with carbon chloride can be mentioned. Method, and the polymer obtained by the transesterification method of reacting dihydroxydiaryl compound with carbonate (diphenyl carbonate, etc.). When manufacturing (A) component, a molecular weight regulator, a catalyst, etc. can be used as needed. Examples of dihydroxydiaryl compounds include bis(4-hydroxyphenyl)methane, 1,1-bis(4-hydroxyphenyl)ethane, 2,2-bis(4-hydroxyphenyl)propane ( Alias: Bisphenol A), 2,2-bis(4-hydroxyphenyl)butane, 2,2-bis(4-hydroxyphenyl)octane, bis(4-hydroxyphenyl)phenylmethane, 2, 2-bis(4-hydroxyphenyl-3-methylphenyl)propane, 1,1-bis(4-hydroxy-3-tert-butylphenyl)propane, 2,2-bis(4-hydroxy- 3-bromophenyl)propane, 2,2-bis(4-hydroxy-3,5-dibromophenyl)propane, 2,2-bis(4-hydroxy-3,5-dichlorophenyl)propane, etc. Bis(hydroxyaryl)alkanes; 1,1-bis(4-hydroxyphenyl)cyclopentane, 1,1-bis(4-hydroxyphenyl)cyclohexane and other bis(hydroxyaryl)cycloalkanes ; 4,4'-dihydroxydiphenyl ether, 4,4'-dihydroxy-3,3'-dimethyldiphenyl ether and other dihydroxy diaryl ethers; 4,4'-dihydroxydiphenyl sulfide Dihydroxy diaryl sulfides such as ethers; 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxy-3,3'-dimethyldiphenyl sulfide and other dihydroxy diaryls Dihydroxy diphenyl sulfides; 4,4'-dihydroxydiphenyl sulfides, 4,4'-dihydroxy-3,3'-dimethyl diphenyl sulfides, etc. The dihydroxydiaryl compound may be used singly, or two or more of them may be used in combination. Dihydroxydiaryl compounds can also be used in combination with piperidine, dipiperidinyl hydroquinone, resorcinol, 4,4'-dihydroxybiphenyl, etc. It is also possible to use a dihydroxydiaryl compound in combination with a phenol compound having a valence of 3 or higher. Examples of phenol compounds having a trivalent or higher value include: phloroglucinol, 4,6-dimethyl-2,4,6-tris(4-hydroxyphenyl)heptene, 2,4,6-trimethyl -2,4,6-tris(4-hydroxyphenyl)heptane, 1,3,5-tris(4-hydroxyphenyl)benzene, 1,1,1-tris(4-hydroxyphenyl)ethane , 2,2-bis[4,4-(4,4'-dihydroxydiphenyl)cyclohexyl]propane, etc. (A) The viscosity average molecular weight of the component is preferably 10,000 or more, more preferably 15,000 or more, still more preferably 17,000 or more, particularly preferably 20,000 or more from the viewpoint of easily obtaining excellent moldability. (A) The viscosity average molecular weight of the component is preferably 100,000 or less, more preferably 35,000 or less, still more preferably 28,000 or less from the viewpoint of easily obtaining an excellent appearance on the surface of a molded body (sheet, etc.) Below 25,000. From these viewpoints, the viscosity average molecular weight of the component (A) is preferably 10,000 to 100,000, more preferably 15,000 to 35,000, still more preferably 17,000 to 28,000, particularly preferably 20,000 to 25,000. (A) The viscosity average molecular weight of the component can be obtained by the following procedure. First, dichloromethane was used as a solvent to obtain a 0.5% by mass polycarbonate resin solution. Then, the specific viscosity (η sp ) was measured using a Cannon-Fenske type viscosity tube at a temperature of 20°C. Furthermore, the limiting viscosity [η] is obtained by conversion of the concentration, and the viscosity average molecular weight M can be calculated according to the following SCHNELL equation. [η]=1.23×10 -4 M 0.83 The content of the component (A) is preferably in the following range based on the total amount of the component (A) and the component (B). (A) The content of the component is preferably 90% by mass or more, more preferably 93% by mass or more, still more preferably 95% by mass or more, and particularly preferably 97% by mass or more from the viewpoint of easily obtaining excellent moldability. (A) The content of the component is preferably 99.94% by mass or less, more preferably 99.9% by mass or less, and still more preferably 99.5% by mass or less from the viewpoint of easily obtaining an excellent appearance on the surface of the molded body (sheet, etc.) , Particularly preferably 99% by mass or less. From these viewpoints, the content of the component (A) is preferably 90 to 99.94% by mass, more preferably 93 to 99.9% by mass, still more preferably 95 to 99.5% by mass, and particularly preferably 97 to 99% by mass. ((B) component: polyalkylene terephthalate resin) Examples of the (B) component of the polyalkylene terephthalate resin include: polyethylene terephthalate resin and polyethylene terephthalate resin Propylene dicarboxylate resin, polybutylene terephthalate resin, etc. The intrinsic viscosity of the component (B) measured in accordance with JIS K7233 is preferably in the following range. The above-mentioned inherent viscosity is preferably 0.6 or more, more preferably 0.7 or more, still more preferably 0.9 or more, and particularly preferably 1.0 or more from the viewpoint of easily obtaining excellent conductivity (lower resistance value. The same applies hereinafter). The above-mentioned inherent viscosity is preferably 1.5 or less, more preferably 1.4 or less, and still more preferably 1.2 or less from the viewpoint of improving the dispersibility of the (B) component with respect to other resin components ((A) component, etc.). From these viewpoints, the above-mentioned inherent viscosity is preferably 0.6 to 1.5, more preferably 0.7 to 1.4, still more preferably 0.9 to 1.2, particularly preferably 1.0 to 1.2. The content of the (B) component is preferably in the following range based on the total amount of the (A) component and (B) component. (B) The content of the component is preferably 0.06% by mass or more, more preferably 0.5% by mass or more, still more preferably 1.0% by mass or more, and particularly preferably 1.5% by mass or more from the viewpoint of easily obtaining excellent conductivity. It is extremely preferably 2.0% by mass or more. (B) The content of the component is preferably 10% by mass or less, more preferably 5.0% by mass or less, and still more preferably 3.0% by mass or less from the viewpoint of easily obtaining an excellent appearance of the molded body. From these viewpoints, the content of component (B) is preferably 0.06-10% by mass, more preferably 0.5-5.0% by mass, still more preferably 1.0-3.0% by mass, particularly preferably 1.5-3.0% by mass, It is extremely preferably 2.0 to 3.0% by mass. (Component (C): Carbon material) As the carbon material of the component (C), carbon black, graphite, carbon fiber, carbon nanotube, carbon nanotube, carbon nanosphere, etc. can be cited. As the classification of carbon black, furnace type, acetylene type, Ketjen type, etc. can be cited. Among them, from the viewpoint of easily obtaining excellent recyclability, furnace-type carbon black is preferred. The specific surface area of carbon black is preferably 30 m 2 /g or more, more preferably 40 m 2 /g or more, and still more preferably 50 m 2 /g or more, from the viewpoint of easily obtaining excellent electrical conductivity. The specific surface area of carbon black is preferably 90 m 2 /g or less, more preferably 75 m 2 /g from the viewpoint of easily obtaining excellent dispersibility of carbon black and excellent appearance of the surface of the formed body (sheet, etc.) Hereinafter, it is more preferably 60 m 2 /g or less. From these viewpoints, the specific surface area of carbon black is preferably 30 to 90 m 2 /g, more preferably 40 to 75 m 2 /g, and still more preferably 50 to 60 m 2 /g. The specific surface area of carbon black can also be 50~90 m 2 /g. The specific surface area can be measured in accordance with the JIS K6217 basic performance test method for rubber carbon black. The specific surface area is expressed by the surface area (m 2 ) of carbon black per unit mass (g). The specific surface area can be obtained by immersing the degassed carbon black in liquid nitrogen and measuring the amount of nitrogen adsorbed on the surface of the carbon black at equilibrium. The DBP oil absorption of carbon black is preferably 100 ml/100 g or more, more preferably 130 ml/100 g or more, and even more preferably 150 ml/100 g or more from the viewpoint of easily obtaining excellent electrical conductivity. It is more than 150 ml/100 g, extremely preferably more than 160 ml/100 g, and extremely preferably 170 ml/100 g. The DBP oil absorption of carbon black is preferably 300 ml/100 g or less, and more preferably 220 ml/100 from the viewpoint of easily obtaining excellent dispersibility of carbon black and excellent appearance of the surface of the formed body (sheet, etc.) g or less, more preferably 200 ml/100 g or less. From these viewpoints, the DBP oil absorption of carbon black is preferably 100~300 ml/100 g, more preferably 130~300 ml/100 g, and still more preferably 150~300 ml/100 g, particularly preferably More than 150 ml/100 g and less than 300 ml/100 g, extremely preferably 160~220 ml/100 g, extremely preferably 170~200 ml/100 g. DBP (Di-butylphthalate) oil absorption can be measured in accordance with JIS K6217 basic performance test method for rubber carbon black. The oil absorption of DBP is related to the bonding force between the carbon black particles. The larger the oil absorption of DBP, the longer the structure. From the standpoint of easily obtaining excellent electrical conductivity, and the standpoint of easily obtaining excellent dispersibility of carbon black, and excellent appearance of the surface of the molded body (sheet, etc.), the above-mentioned specific surface area of carbon black and the above-mentioned oil absorption of DBP are preferred Both satisfy the above-mentioned preferable range. For example, it is preferable that the specific surface area is 30 to 90 m 2 /g, and the DBP oil absorption is 100 to 300 ml/100 g. The content of (C) component is 10 to 45 parts by mass with respect to 100 parts by mass of the total of (A) component and (B) component. If the content of the component (C) is less than 10 parts by mass, the molded body cannot obtain sufficient conductivity. If the content of the component (C) exceeds 45 parts by mass, the viscosity will increase and the molding stability will decrease. (C) The content of the component is preferably 13 parts by mass or more, and more preferably 15 parts by mass or more with respect to 100 parts by mass of the total of (A) component and (B) component from the viewpoint of easily obtaining excellent conductivity. More preferably, it is 17 parts by mass or more, particularly preferably 20 parts by mass or more, and extremely preferably 21 parts by mass or more. The content of (C) component is preferably 40 parts by mass or less, more preferably 30 parts by mass or less, relative to 100 parts by mass of the total of (A) component and (B) component, from the viewpoint of easy improvement in molding stability. It is more preferably 27 parts by mass or less, particularly preferably 25 parts by mass or less. From these viewpoints, the content of (C) component relative to the total of (A) component and (B) component 100 parts by mass, preferably 10-40 parts by mass, more preferably 13-30 parts by mass, and more It is preferably 15 to 27 parts by mass, particularly preferably 15 to 25 parts by mass, very preferably 17 to 25 parts by mass, particularly preferably 20 to 25 parts by mass, and more preferably 21 to 25 parts by mass. ((D) component: graft copolymer) The graft copolymer of (D) component has a structure including a core part (core material) and a coating part covering at least a part of the core part. The component (D) may have, for example, a core-shell structure including a core layer (core part) and a shell layer (coating part) covering the core layer. The core part and the covering part may be composed of different polymers. The core part and the covering part may each have a plurality of layers. The covering part may cover a part of the core part or the entire core part. The component (D) can be obtained by graft-polymerizing the component of the coating and the component of the core by reacting the component of the coating in the presence of the component of the core. From the viewpoint of further suppressing the decrease in conductivity during recycling, the core is preferably composed of acrylic rubber (a polymer having a structural unit derived from an acrylic group-containing monomer) and silicone rubber. At least one of the group of the composition, more preferably contains acrylic rubber. The core component is not limited to acrylic rubber and silicone rubber, and polybutadiene or the like may also be used. As the acrylic rubber, a polymer having a structural unit derived from an acryl group-containing monomer as a main structural unit can be used. The content of the structural unit derived from the monomer containing an acryl group is preferably 50-100% by mass, more preferably 70%, based on the total mass of the acrylic rubber, from the viewpoint of easily obtaining excellent recyclability. ~100% by mass. As the acryl group-containing monomer, acrylate can be used. Examples of acrylates include alkyl acrylates having 2 to 8 carbon atoms in the alkyl group. Examples include ethyl acrylate, n-butyl acrylate, 2-ethylhexyl acrylate, and the like. Acrylic rubber may also have structural units derived from components other than acrylate. As such a component, a vinyl monomer that can be copolymerized with an acrylate is preferable from the viewpoint of easily obtaining a copolymer at a low price. Examples of vinyl monomers that can be copolymerized with acrylate include aromatic vinyl compounds such as styrene and α-methylstyrene; alkyl methacrylates such as methyl methacrylate and ethyl methacrylate. Esters; unsaturated nitriles such as acrylonitrile and methacrylonitrile; vinyl ethers such as methyl vinyl ether and butyl vinyl ether; vinyl halides such as vinyl chloride and vinyl bromide; vinylidene halides such as vinylidene chloride and vinylidene bromide ; Glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether, ethylene glycol glycidyl ether and other vinyl monomers having glycidyl groups. As the acrylic rubber, a silicone-acrylic rubber (composite polymer having a structural unit derived from an acrylic group-containing monomer (acrylic component) and a structural unit derived from a silicone component can be used. For example, it has a source From the structural unit of alkyl acrylate and polyorganosiloxane skeleton polymer). As the silicone rubber, polyorganosiloxane can be used, for example, polyorganosiloxane which is a linear polymer with units of organosiloxane bonds of more than several thousand can be used. The silicone rubber can be produced by any method, and it is preferably a rubber obtained by an emulsion polymerization method. The polyorganosiloxane is not particularly limited, but it is preferably a polyorganosiloxane having a vinyl polymerizable functional group. Polyorganosiloxane can be obtained using dimethylsiloxane. Dimethylsiloxane can be chain or cyclic. As the dimethylsiloxane, a dimethylsiloxane cyclic body having a three-membered ring or more may be mentioned, and a dimethylsiloxane cyclic body having a 3- to 7-membered ring is preferable. Specifically, hexamethylcyclotrisiloxane, octamethylcyclotetrasiloxane, decamethylcyclopentasiloxane, dodecamethylcyclohexasiloxane, etc. are mentioned. One kind of dimethylsiloxane may be used alone, or two or more kinds may be used in combination. From the viewpoint of improving the dispersibility of the component (D) with respect to other resin components (component (A), component (B), etc.), the coating portion constituting the component (D) preferably contains the following polymer. It has a structural unit selected from structural units derived from unsaturated carboxylic acid esters, structural units derived from vinyl compounds (except unsaturated carboxylic acid esters), structural units derived from maleimide compounds, and structural units derived from unsaturated carboxylic acid esters. At least one of carboxylic acid structural units and structural units derived from unsaturated dicarboxylic acid anhydrides. Examples of vinyl compounds include glycidyl group-containing vinyl compounds, aliphatic vinyl compounds, aromatic vinyl compounds, and cyanide vinyl compounds. A compound corresponding to a glycidyl group-containing vinyl compound and at the same time an aliphatic vinyl compound, an aromatic vinyl compound, or a cyanide vinyl compound is classified as a glycidyl group-containing vinyl compound. From the viewpoint of improving the dispersibility of the component (D) with respect to other resin components (component (A), component (B), etc.), it is preferable to have structural units selected from unsaturated carboxylic acid esters and A polymer of at least one of the group consisting of a structural unit of a glycidyl group-containing vinyl compound and a structural unit derived from an unsaturated dicarboxylic acid anhydride, and more preferably has a structural unit derived from an unsaturated carboxylic acid ester Of polymers. The compound that provides the structural unit of the polymer constituting the coating portion may be used singly, or two or more of them may be used in combination. Examples of unsaturated carboxylic acid esters include unsaturated carboxylic acid alkyl esters, unsaturated carboxylic acid aryl esters, and the like. As the unsaturated carboxylic acid ester, (meth)acrylate can be used. Examples of (meth)acrylates include alkyl (meth)acrylates, aryl (meth)acrylates, and the like. As the unsaturated carboxylic acid alkyl ester, from the viewpoint of improving the dispersibility of the component (D) with respect to other resin components (component (A), component (B), etc.), the alkyl (meth)acrylate is preferred ester. Examples of the alkyl (meth)acrylate include: methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, n-butyl (meth)acrylate, (meth) ) Tert-butyl acrylate, n-hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, cyclohexyl (meth)acrylate, stearyl (meth)acrylate, (meth)acrylic acid Stearyl ester, benzyl (meth)acrylate, chloromethyl (meth)acrylate, 2-chloroethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, (meth)acrylic acid 3-hydroxypropyl ester, 2,3,4,5,6-pentahydroxyhexyl (meth)acrylate, 2,3,4,5-tetrahydroxypentyl (meth)acrylate, amine (meth)acrylate Ethyl (meth)acrylate, (propylamino)ethyl (meth)acrylate, (dimethylamino)ethyl (meth)acrylate, (ethylamino)propyl (meth)acrylate, (methyl) ) (Phenylamino)ethyl acrylate, (cyclohexylamino)ethyl (meth)acrylate, etc. As the (meth)acrylic acid alkyl ester, from the viewpoint that the dispersibility improvement effect of the component (D) with respect to other resin components (component (A), component (B), etc.) is more significant, it is preferably selected from ( At least one of the group consisting of methyl meth)acrylate and n-butyl (meth)acrylate. As the unsaturated carboxylic acid aryl ester, from the viewpoint of improving the dispersibility of the component (D) with respect to other resin components (component (A), component (B), etc.), aryl (meth)acrylate is preferred ester. As aryl (meth)acrylate, phenyl (meth)acrylate, dimethylphenyl (meth)acrylate, naphthyl (meth)acrylate, etc. are mentioned. Examples of glycidyl group-containing vinyl compounds include: glycidyl (meth)acrylate, glycidyl itaconic acid, diglycidyl itaconic acid, allyl glycidyl ether, and styrene-4-glycidyl Glyceryl ether, 4-glycidyl styrene, etc. As the glycidyl group-containing vinyl compound, glycidyl (meth)acrylate is preferable from the viewpoint that the impact resistance improvement effect is more significant. The glycidyl group-containing vinyl compound may be used singly or in combination of two or more. As an aliphatic vinyl compound, ethylene, propylene, butadiene, etc. are mentioned. Examples of aromatic vinyl compounds include: styrene, α-methylstyrene, p-aminostyrene, 1-vinylnaphthalene, 4-methylstyrene, 4-propylstyrene, 4-cyclohexyl Styrene, 4-dodecylstyrene, 2-ethyl-4-benzylstyrene, 4-(phenylbutyl)styrene, halogenated styrene, 2-styrene-oxazoline, etc. Examples of vinyl cyanide compounds include acrylonitrile, methacrylonitrile, and ethacrylonitrile. Examples of other vinyl compounds include: acrylamide, methacrylamide, N-methacrylamide, butoxymethacrylamide, N-propylmethacrylamide, and N-vinyl Diethylamine, N-acetylvinylamine, allylamine, methallylamine, N-methylallylamine, 2-isopropenyl oxazoline, 2-vinyl azole Morpho etc. Examples of the maleimide compound include: maleimide, N-methyl maleimide, N-ethyl maleimide, N-propyl cis Butylene diimide, N-isopropyl maleimide, N-cyclohexyl maleimide, N-phenyl maleimide, N-(p-bromobenzene Group) maleimide, N-(chlorophenyl) maleimide and the like. Examples of unsaturated dicarboxylic acids include maleic acid, itaconic acid, and phthalic acid. As a combination of the constituent components of the core part and the covering part, from the viewpoint that the effect of suppressing the decrease in conductivity at the time of reuse is more excellent, it is preferable to have a graft copolymer having a structure of the core part and the covering part. The core part contains acrylic rubber (a polymer having structural units derived from a monomer containing an acrylic acid group), and the above-mentioned covering part comprises a polymer having structural units selected from unsaturated carboxylic acid esters and At least one of the group consisting of structural units derived from vinyl compounds. It is more preferably at least one selected from the group consisting of the following (DI) component and the following (D-II) component, and still more preferably the (D-II) component. (DI) component: a graft copolymer having a core-shell structure with a core and a coating, the core includes a silicone-acrylic rubber, and the coating includes a polymer selected from At least one of the group consisting of structural units of unsaturated carboxylic acid esters and structural units derived from vinyl compounds. (D-II) Component: a graft copolymer having a core-shell structure with a core and a coating, the core contains acrylic rubber, and the coating contains a polymer having structural units derived from unsaturated carboxylic acid esters Things. As the (DI) component, from the viewpoint that the effect of suppressing the decrease in conductivity at the time of recycling is more excellent, it is preferable to have a coating portion containing a polymer selected from an alkyl group derived from an unsaturated carboxylic acid At least one of the structural unit of the ester and the structural unit derived from the vinyl compound is more preferably provided with a coating part comprising a polymer selected from the group consisting of methyl (meth)acrylate At least one of the structural unit and the structural unit derived from the glycidyl group-containing vinyl compound. Examples of commercially available products of the (DI) component include Metablen S-2001, Metablen S-2006, and Metablen S-2200 manufactured by Mitsubishi Rayon Co., Ltd. As the component (D-II), from the viewpoint that the effect of suppressing the decrease in conductivity during recycling is more excellent, it is preferable to have a coating portion containing a polymer having an alkyl group derived from an unsaturated carboxylic acid The structural unit of the ester is more preferably provided with a coating portion including a polymer having a structural unit derived from methyl (meth)acrylate. Commercial products of (D-II) ingredients include Paraloid BPM-500 and Paraloid BPM-515 manufactured by Rohm and Haas Japan Co., Ltd.; Metablen W-450A and Metablen W-600A manufactured by Mitsubishi Rayon Co., Ltd. . (D) The content of the component is 0.5 to 35 parts by mass with respect to 100 parts by mass of the total of the (A) component and (B) component. If the content of the component (D) is less than 0.5 parts by mass, sufficient reusability cannot be obtained. (D) The content of the component is preferably 1 part by mass or more with respect to 100 parts by mass of the total of (A) component and (B) component from the viewpoint that the effect of suppressing the decrease in conductivity during recycling is more excellent, and more It is preferably 2 parts by mass or more, more preferably 5 parts by mass or more, particularly preferably 7 parts by mass or more, extremely preferably 8 parts by mass or more, and particularly preferably 10 parts by mass or more. If the content of the component (D) exceeds 35 parts by mass, sufficient recyclability cannot be obtained, and the appearance of the molded body deteriorates. (D) The content of the component is relative to the total 100 mass of the (A) component and (B) component in terms of the viewpoint that the effect of suppressing the decrease in conductivity during recycling is more excellent, and the viewpoint of obtaining a more excellent appearance of the molded body Parts, preferably 30 parts by mass or less, more preferably 20 parts by mass or less, still more preferably 18 parts by mass or less, particularly preferably 15 parts by mass or less, and extremely preferably 12 parts by mass or less. From these viewpoints, the content of (D) component relative to the total of (A) component and (B) component 100 parts by mass, preferably 0.5-30 parts by mass, more preferably 1-20 parts by mass, and more Preferably it is 2-20 parts by mass, particularly preferably 5-18 parts by mass, extremely preferably 7-15 parts by mass, particularly preferably 8-12 parts by mass, and more preferably 10-12 parts by mass. (Other components) The polycarbonate resin composition of this embodiment may contain known resins (polyamide resin, polyimide resin, polystyrene resin, ABS (Acrylonitrile-Butadiene-Styrene, acrylic Nitrile-butadiene-styrene) resin, polyolefin resin (polyethylene resin, polypropylene resin, etc.), phenol resin, epoxy resin, etc.). The polycarbonate resin composition of this embodiment may contain well-known additives other than the above-mentioned components as needed. Examples of such additives include antioxidants (phosphorus antioxidants, phenolic antioxidants, etc.), mold release agents (glycerin fatty acid esters, etc.), lubricants (paraffin wax, n-butyl stearate, synthetic beeswax, etc.) Natural beeswax, monoglyceride, montanic acid wax, polyethylene wax, pentaerythritol tetrastearate, etc.), colorants (titanium oxide, dyes, pigments, etc.), fillers (calcium carbonate, clay, silica, glass Fibers, glass balls, glass fragments, talc, mica, various whiskers, etc.), fluidity improvers, spreading agents (epoxidized soybean oil, liquid paraffin, etc.), flame retardants (bromine compounds, phosphorus compounds, etc.) Organometallic salt-based compounds, silicone-based compounds, etc.). (Production method of resin composition) The polycarbonate resin composition of this embodiment can be obtained by mixing constituent components. The method of mixing the constituent components of the polycarbonate resin composition of the present embodiment is not particularly limited. For example, it may be mixed with any mixer (drum mixer, belt mixer, high-speed mixer, etc.), and then extruded. The method of melting and kneading out of the machine. <Molded body and its manufacturing method> The molded body (molded product) of this embodiment contains the polycarbonate resin composition of this embodiment. The molded body of this embodiment may be in the shape of a film or in the shape of a flat plate. As the molded body of this embodiment, a film, a tape, a sheet, etc. can be mentioned. As the molded body of the present embodiment, for example, a container for accommodating electronic parts (for example, a container for conveyance or storage of electronic parts) can be cited. As a molded body of this embodiment, a carrier tape is mentioned, for example. The carrier tape of this embodiment contains the polycarbonate resin composition of this embodiment. The carrier tape of this embodiment may be in the form of a film or in the form of a flat plate. The carrier tape of this embodiment may also have a accommodating portion capable of accommodating objects (electronic components, etc.), such as a plurality of pockets (recesses for accommodating objects) formed at intervals in the longitudinal direction of the tape . As the film, for example, a molded body having a width (film width) of 100 to 1500 mm and a thickness of 0.05 to 0.5 mm can be cited. As the belt (carrier belt etc.), for example, a molded body having a width (belt width) of 3 to 100 mm (preferably 10 to 50 mm) and a thickness of 0.05 to 0.5 mm can be cited. As the sheet, for example, a molded body having a width (sheet width) of 100 to 1500 mm and a thickness of 0.7 to 10 mm can be cited. The method for producing a molded body of this embodiment includes a molding step of molding the polycarbonate resin composition of this embodiment to obtain a molded body. The method for producing a molded body of this embodiment may include a plurality of molding steps, for example, it may further include a step of melting a molded body containing the polycarbonate resin composition of this embodiment to obtain a resin composition, and combining the resin The step of forming a shaped body to obtain a shaped body. The molding method of the polycarbonate resin composition of this embodiment is not particularly limited, and known extrusion molding methods (T-die molding method, calender molding method, etc.), injection molding method, injection-compression molding method, etc. can be used . The manufacturing method of the carrier tape of this embodiment is equipped with the shaping|molding process of shaping|molding the polycarbonate resin composition of this embodiment, and obtaining a carrier tape. The manufacturing method of the carrier tape of this embodiment may include a plurality of molding steps, for example, it may further include a step of melting the polycarbonate resin composition of this embodiment to obtain a resin composition, and molding the resin composition. Steps to obtain the carrier tape. As a molding method for providing a recessed portion called a bag-like portion to the carrier tape, a pressure molding method, a pressure molding method, a vacuum rotary molding method, and the like can be cited. The embodiments exemplified as the technology of the present invention have been described above. Provide detailed instructions for this. Therefore, the constituent elements described in the detailed description include not only the necessary constituent elements to solve the problem, but may also include constituent elements that illustrate the above-mentioned technology but are not necessary to solve the problem. Therefore, these non-essential components should not be recorded in the detailed description, and the non-essential components should be deemed necessary immediately. In addition, the above-mentioned embodiment is for exemplifying the technology of the present invention, so various changes, substitutions, additions, omissions, etc. can be made within the scope of the patent application or its equivalent scope. [Examples] Hereinafter, the present invention will be described with examples, but the present invention is not limited to these examples. <1. Production of pellets> Prepare the blending ingredients with the contents shown in Tables 1 to 3. Then, a 37 mm diameter twin-screw extruder (manufactured by Kobe Steel Co., Ltd., KTX-37) was used to melt and knead the above-mentioned blended ingredients at a cylinder temperature of 280°C to obtain various pellets. The details of the ingredients used are as follows. [Polycarbonate resin] A-1: Polycarbonate resin synthesized from bisphenol A and carbon chloride, manufactured by Sumika Styron Polycarbonate Co., Ltd., Calibre 200-13 (viscosity average molecular weight: 21000) [Polyterephthalic acid Alkyl glycol ester resin] B-1: Polybutylene terephthalate resin, manufactured by Polyplastics Co., Ltd., Duranex 600FP (intrinsic viscosity: 1.0) [Carbon material] C-1: Furnace type carbon black, manufactured by Cabot Corporation , Vulcan XC-305 (specific surface area: 70 m 2 /g, DBP oil absorption: 130 ml/100 g) C-2: Furnace type carbon black, manufactured by Mitsubishi Chemical Co., Ltd., #3050B (specific surface area: 50 m 2 /g, DBP oil absorption: 175 ml/100 g) [Graft copolymer] D-1: Core-shell type graft copolymer (core layer: silicone-acrylic rubber, shell layer: polymerization with the following structural units The structural unit is derived from a polymer having structural units derived from unsaturated carboxylic acid alkyl esters; (DI) component), manufactured by Mitsubishi Rayon Co., Ltd., Metablen S-2001 D-2: core-shell type Branch copolymer (core layer: acrylic rubber, shell layer: polymer having structural units derived from unsaturated carboxylic acid alkyl ester; (D-II) component), manufactured by Mitsubishi Rayon Co., Ltd., Metablen W-450A D-3: Core-shell type graft copolymer (core layer: polybutadiene, shell layer: polymer having structural units derived from alkyl (meth)acrylate), manufactured by Rohm and Haas Japan Co., Ltd. , Paraloid EXL2603 <2. Production of flat plates> Use a dryer to dry the pellets of item 1 above at 120°C for 4 hours. Then, a small injection molding machine (manufactured by Japan Steel Works Co., Ltd. (JSW), J100EII-P) was used to obtain a flat plate with a size of 50 mm × 80 mm × thickness 2 mm at a molding temperature of 300°C and a mold temperature of 90°C . <3. Evaluation of conductivity> Prepare 5 plates of item 2 above (samples with zero repeated granulation times). Then, the surface specific resistance value (Ω/sq.) near the center of the surface of the plate was measured with a conductivity measuring device (manufactured by Mitsubishi Chemical Co., Ltd., Loresta-GP MCP-T600), and the average value of 5 sheets was determined as the conductivity The value. <4. Evaluation of recyclability> Using the pellets of item 1 above, use a small single-screw extruder (manufactured by Tanabe Plastics Machinery Co., Ltd., VS-40) at an extrusion temperature of 300°C and a screw rotation of 120 rpm. Perform 5 granulation times. Collect the granules after 5 times of repeated granulation, and obtain the flat plate by the same method as the method in item 2 above. The conductivity of the flat plate (sample after repeated granulation 5 times) was determined by the same method as in item 3 above. As a judgment of reusability, the case where the surface resistance value of the flat plate does not reach 1×10 10 (Ω/sq.) when repeated granulation is repeated 5 times (the number of repeated granulation is 5 times) is evaluated as "A ”(Good recyclability), the surface specific resistance value is 1×10 10 (Ω/sq.) or higher (in the table as “≧1×10 10 ”), the case is evaluated as “B” (the recyclability is poor ). <5. Evaluation of the appearance of the flat panel> The surface of the flat panel when repeated granulation is not performed (the number of repeated granulation is zero) is visually observed. The case where it is confirmed that there is no unevenness on the uniform surface is evaluated as "A", and the case where the flat surface is confirmed as unevenness is evaluated as "B". The evaluation results are shown in Tables 1 to 3. [Table 1] [Table 2] [table 3] As shown in Table 1 and Table 2, in the examples, the electrical conductivity, recyclability, and the appearance of the flat panel were all good. On the other hand, as shown in Table 3, in the comparative example, as a result, the reusability cannot be satisfied in each case. Comparative Example 1 is a case where the content of the carbon material is small, and the conductivity and recyclability are poor. Comparative Example 2 is a case where the content of the carbon material is large, the viscosity is too high, and the molding itself is difficult. Comparative Example 3 is a case where the content of the graft copolymer is small, and the reusability is poor. Comparative Example 4 is a case where the content of the graft copolymer is large, and the reusability and the appearance of the flat plate are poor. Comparative Example 5 is a case where no graft copolymer is used, and the conductivity, reusability, and the appearance of the flat plate are poor. Comparative Example 6 is a case where the content of the carbon material is small, and the conductivity, recyclability, and the appearance of the flat plate are poor. [Industrial Applicability] According to the present invention, even in the case of repeated molding, the decrease in conductivity can be suppressed. For example, according to the present invention, even if molding is repeatedly performed by melt extrusion for the purpose of recycling, etc., the decrease in conductivity can be suppressed to an extremely low level. Furthermore, according to the present invention, not only the excellent appearance of the molded body can be realized, but also the decrease in conductivity can be suppressed even when the molded body is repeatedly molded. Therefore, the industrial utility value of the present invention is extremely high.
