TWI722250B - Beam scanning device and pattern drawing device - Google Patents

Beam scanning device and pattern drawing device Download PDF

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Publication number
TWI722250B
TWI722250B TW106134123A TW106134123A TWI722250B TW I722250 B TWI722250 B TW I722250B TW 106134123 A TW106134123 A TW 106134123A TW 106134123 A TW106134123 A TW 106134123A TW I722250 B TWI722250 B TW I722250B
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light beam
light
reflected
scanning
mirror
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TW106134123A
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TW201827887A (en
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加藤正紀
鬼頭義昭
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日商尼康股份有限公司
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10Scanning systems
    • G02B26/12Scanning systems using multifaceted mirrors
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10Scanning systems

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Mechanical Optical Scanning Systems (AREA)

Abstract

本發明之描繪單元(Un)具備使經角度可變之多面鏡(PM)之反射面(RP)偏向之加工用光束(LBn)入射,並使加工用光束(LBn)於基板(P)聚光為點光(SP)之fθ透鏡系統(FT),且根據多面鏡(PM)之反射面(RP)之角度變化而使點光(SP)進行掃描。描繪單元(Un)具備:光束送光部(60a),其將用以檢測多面鏡(PM)之反射面(RP)成為既定角度之原點之光束(Bga)投射至多面鏡(PM)之反射面(RP);反射鏡(MRa),其使於反射面(RP)反射之光束(Bgb)入射,並反射向反射面(RP);及檢測部(60b),其基於在反射面(RP)再次反射之光束(Bgd)輸出原點訊號(SZn)。 The drawing unit (Un) of the present invention is provided with a processing light beam (LBn) that deflects the reflective surface (RP) of a polygon mirror (PM) with a variable angle, and causes the processing light beam (LBn) to be focused on the substrate (P). The light is the fθ lens system (FT) of the spot light (SP), and the spot light (SP) is scanned according to the angle change of the reflecting surface (RP) of the polygon mirror (PM). The drawing unit (Un) is equipped with: a light beam transmitting part (60a), which projects the light beam (Bga) used to detect the origin of the polygon mirror (PM) as the origin of a predetermined angle (Bga) onto the polygon mirror (PM) The reflecting surface (RP); the reflecting mirror (MRa), which makes the light beam (Bgb) reflected on the reflecting surface (RP) incident and reflecting to the reflecting surface (RP); and the detection part (60b), which is based on the reflecting surface ( RP) The reflected beam (Bgd) again outputs the origin signal (SZn).

Description

光束掃描裝置及圖案描繪裝置 Beam scanning device and pattern drawing device

本發明係關於一種使照射至對象物之被照射面上之光束之點光進行掃描之光束掃描裝置、及使用此種光束掃描裝置描繪曝光既定之圖案之圖案描繪裝置。 The present invention relates to a beam scanning device that scans the spot light of a beam irradiated on an irradiated surface of an object, and a pattern drawing device that uses this beam scanning device to draw a predetermined pattern for exposure.

以往,已知例如使用如下文所示之日本特開2005-262260號公報之雷射加工裝置(光掃描裝置)來實現如下操作,即,將雷射光束之點光投射至被照射體(加工對象物),且一面藉由掃描反射鏡(多面鏡)使點光於一維方向上進行主掃描,一面使被照射體於與主掃描方向正交之副掃描方向上移動,而於被照射體上形成所期望之圖案或圖像(文字、圖形等)。 In the past, it has been known, for example, to use the laser processing device (optical scanning device) of Japanese Patent Laid-Open No. 2005-262260 as shown below to realize the following operation, that is, to project the spot light of the laser beam to the irradiated body (processing Object), and one side uses a scanning mirror (polygon mirror) to make the spot light perform main scanning in a one-dimensional direction, and the other side moves the illuminated object in the sub-scanning direction orthogonal to the main scanning direction to be illuminated The desired pattern or image (text, graphics, etc.) is formed on the body.

於日本特開2005-262260號公報中揭示有設置如下構件:檢流計鏡,其使來自振盪器1之雷射光反射並對照射至被加工物之雷射光於被加工物上之照射位置在Y方向(副掃描方向)上進行修正;多面鏡,其將由檢流計鏡反射之雷射光反射並使其於被加工物上在X方向(主掃描方向)上進行掃描;fθ透鏡,其使由檢流計鏡反射之雷射光聚光於被加工物上;及控制部,其應對雷射光通過fθ透鏡時產生之畸變像差,以修正雷射光於被加工物上之Y方向之照射位置誤差的方式控制檢流計鏡之反射角度,並且以修正雷射光於被加工物上之X方向之照射位置誤差的方式控制利用振盪器所產生之雷射光之脈衝振盪間隔。進而,於日本特開2005-262260號公報之圖8中表示設置雷射光源及檢測器,並基於端部檢測訊號而如圖9所示般控制振盪器之脈衝振盪之時序之構成,該雷射光源射出 用以於多面鏡之旋轉中檢測多面鏡之各反射面之端部的檢測雷射光,該檢測器接收於多面鏡之各反射面之端部反射之檢測雷射光的反射光並產生端部檢測訊號。 Japanese Patent Laid-Open No. 2005-262260 discloses the installation of the following components: a galvanometer mirror that reflects the laser light from the oscillator 1 and irradiates the laser light to the workpiece at the position where the laser light is irradiated on the workpiece Correction is performed in the Y direction (sub-scanning direction); a polygon mirror, which reflects the laser light reflected by the galvanometer mirror and makes it scan in the X direction (main scanning direction) on the workpiece; fθ lens, which makes The laser light reflected by the galvanometer mirror is condensed on the workpiece; and the control unit, which deals with the distortion aberration generated when the laser light passes through the fθ lens, to correct the Y-direction irradiation position of the laser light on the workpiece The error method controls the reflection angle of the galvanometer mirror, and the pulse oscillation interval of the laser light generated by the oscillator is controlled by the method of correcting the irradiation position error of the laser light on the workpiece in the X direction. Furthermore, Fig. 8 of Japanese Patent Application Laid-Open No. 2005-262260 shows a configuration in which a laser light source and a detector are set, and the pulse oscillation timing of the oscillator is controlled as shown in Fig. 9 based on the end detection signal. The light source emits detection laser light for detecting the end of each reflecting surface of the polygon mirror during the rotation of the polygon mirror. The detector receives the reflected light of the detection laser light reflected by the end of each reflecting surface of the polygon mirror and generates End detection signal.

就如日本特開2005-262260號公報般之使用多面鏡之雷射加工裝置(光束掃描裝置)而言,使多面鏡之旋轉越高速,則越可縮短被加工物之加工處理時間,而可提高生產性。另一方面,有使多面鏡之旋轉越高速,則主掃描方向上之加工位置之偏差越明顯之情況。 Regarding the laser processing device (beam scanning device) using a polygon mirror as in Japanese Patent Laid-Open No. 2005-262260, the higher the rotation of the polygon mirror, the more the processing time of the processed object can be shortened. Improve productivity. On the other hand, the higher the rotation speed of the polygon mirror, the more obvious the deviation of the processing position in the main scanning direction.

本發明之第1態樣係一種光束掃描裝置,其係具備使經角度可變之掃描構件之反射面偏向之加工用光束入射,並使上述加工用光束於被照射體聚光為光點之掃描用光學系統,且以與上述掃描構件之反射面之角度變化相應之掃描速度使上述光點進行掃描,且具備:光束送光部,其將用以檢測上述掃描構件之反射面成為既定角度之原點的檢測用光束投射至上述掃描構件之反射面;光束反射部,其使於上述掃描構件之反射面反射之上述檢測用光束入射,並反射向上述掃描構件之反射面;及光束受光部,其接收於上述掃描構件之反射面第2次反射之上述檢測用光束之反射光束,並輸出表示上述原點之原點訊號。 The first aspect of the present invention is a beam scanning device, which is provided with a beam for processing which deflects the reflective surface of a scanning member with a variable angle to enter, and the beam for processing is focused on an irradiated body into a light spot A scanning optical system that scans the light spot at a scanning speed corresponding to the change in the angle of the reflection surface of the scanning member, and is equipped with a light beam transmission unit that detects that the reflection surface of the scanning member becomes a predetermined angle The light beam for detection at the origin is projected to the reflecting surface of the scanning member; a light beam reflecting portion that makes the light beam for detection reflected on the reflecting surface of the scanning member incident and reflected to the reflecting surface of the scanning member; and the light beam is received by the light beam. A portion that receives the reflected light beam of the detection light beam that is secondly reflected on the reflective surface of the scanning member, and outputs an origin signal indicating the origin.

本發明之第2態樣係一種圖案描繪裝置,其係具備使經角度可變之掃描構件之反射面偏向之描繪用光束入射,並使上述描繪用光束於基板聚光為光點之掃描用光學系統,且一面以與上述掃描構件之反射面之角度變化相應之掃描速度使上述光點進行掃描,一面將上述描繪用光束之強度根據圖案進行調變,而於上述基板描繪圖案,且具備:光束送光部,其將用以檢測上述掃描構件之反射面成為既定角度之原點的檢測用光束投射至上述掃描構件之反射 面;光束反射部,其使於上述掃描構件之反射面反射之上述檢測用光束入射,並反射向上述掃描構件之反射面;光束受光部,其接收於上述掃描構件之反射面第2次反射之上述檢測用光束之反射光束,並輸出表示上述原點之原點訊號;及控制部,其基於上述原點訊號而控制利用上述光點所進行之上述圖案之描繪。 The second aspect of the present invention is a pattern drawing device, which is provided with a scanning light beam that deflects the reflective surface of a scanning member whose angle is variable, and makes the drawing light beam incident on the substrate to be condensed into a light spot. The optical system is used to scan the light spot at a scanning speed corresponding to the angle change of the reflective surface of the scanning member, and the intensity of the drawing beam is adjusted according to the pattern, and the pattern is drawn on the substrate, and has :Beam transmission part, which projects the detection beam used to detect the origin of the scanning member's reflection surface at a predetermined angle to the reflection surface of the scanning member; beam reflection part, which reflects on the reflection surface of the scanning member The detection light beam enters and is reflected to the reflecting surface of the scanning member; the light beam receiving part receives the reflected light beam of the detection light beam that is secondly reflected by the reflecting surface of the scanning member, and outputs the reflected light beam representing the origin An origin signal; and a control unit that controls the drawing of the pattern performed by the light spot based on the origin signal.

本發明之第3態樣係一種光束掃描裝置,其係利用掃描用光學系統使藉由旋轉多面鏡之複數個反射面之中之一者而偏向之加工用光束於被照射體聚光為光點,且藉由上述旋轉多面鏡之旋轉而使上述光點進行掃描,且具備:光束送光部,其將用以檢測上述旋轉多面鏡之複數個反射面之各者成為既定角度之原點的檢測用光束投射至上述旋轉多面鏡之反射面;光束反射部,其使於上述旋轉多面鏡之反射面反射之上述檢測用光束入射,並反射向上述旋轉多面鏡之反射面;及光束受光部,其接收於上述旋轉多面鏡之反射面第2次反射之上述檢測用光束之反射光束,並輸出表示上述原點之原點訊號。 The third aspect of the present invention is a beam scanning device which uses a scanning optical system to condense a processing beam deflected by one of a plurality of reflecting surfaces of a rotating polygon mirror on an irradiated body into light The light spot is scanned by the rotation of the rotating polygon mirror, and it is equipped with: a light beam transmitting unit that detects each of the plurality of reflecting surfaces of the rotating polygon mirror as the origin of a predetermined angle The detection light beam is projected to the reflecting surface of the rotating polygon mirror; a beam reflecting portion that makes the detection light beam reflected on the reflecting surface of the rotating polygon mirror incident, and reflected to the reflecting surface of the rotating polygon mirror; and the light beam is received by the light beam. Section, which receives the reflected light beam of the detection light beam that is secondly reflected by the reflecting surface of the rotating polygon mirror, and outputs an origin signal indicating the origin.

60a‧‧‧光束送光部 60a‧‧‧Beam delivery part

60b‧‧‧光束受光部 60b‧‧‧Beam receiving part

A1、A2、Aw‧‧‧箭頭 A1, A2, Aw‧‧‧Arrow

AX1、AXf、AXj、AXv‧‧‧光軸 AX1, AXf, AXj, AXv‧‧‧Optical axis

AXo‧‧‧中心軸 AXo‧‧‧Central axis

AXp‧‧‧旋轉軸 AXp‧‧‧Rotation axis

Bga‧‧‧雷射光束 Bga‧‧‧Laser beam

Bgb、Bgb'‧‧‧反射光束 Bgb, Bgb'‧‧‧reflected beam

Bgc、Bgc'、Bgd、Bgd'、LBn‧‧‧光束 Bgc, Bgc', Bgd, Bgd', LBn‧‧‧Beam

BS1‧‧‧偏振分光鏡(第1光分割元件) BS1‧‧‧Polarization beam splitter (first light splitting element)

BS2‧‧‧偏振分光鏡(第2光分割元件) BS2‧‧‧Polarization beam splitter (second light splitting element)

BSd‧‧‧偏振分光鏡 BSd‧‧‧Polarization beam splitter

CE、CE1‧‧‧再反射光學系統 CE, CE1‧‧‧Re-reflecting optical system

CMa、CMb‧‧‧反射面 CMa、CMb‧‧‧Reflecting surface

CMw‧‧‧角隅鏡 CMw‧‧‧Corner mirror

CYa‧‧‧第1柱面透鏡 CYa‧‧‧The first cylindrical lens

CYb‧‧‧第2柱面透鏡 CYb‧‧‧The second cylindrical lens

DR‧‧‧旋轉筒 DR‧‧‧Rotating drum

DTc‧‧‧光檢測器 DTc‧‧‧Photodetector

DTo‧‧‧光電轉換元件 DTo‧‧‧Photoelectric conversion element

EX‧‧‧曝光裝置(圖案描繪裝置) EX‧‧‧Exposure device (pattern drawing device)

Fgs、fo‧‧‧焦點距離 Fgs、fo‧‧‧focus distance

FT‧‧‧fθ透鏡系統(描繪用掃描透鏡) FT‧‧‧fθ lens system (scanning lens for drawing)

GLa‧‧‧準直透鏡 GLa‧‧‧Collimating lens

GLb、GLe‧‧‧透鏡系統 GLb, GLe‧‧‧lens system

GLc‧‧‧第1透鏡系統 GLc‧‧‧The first lens system

GLd‧‧‧第2透鏡系統 GLd‧‧‧Second lens system

IC1、IC2‧‧‧電流放大部 IC1, IC2‧‧‧Current Amplifier

IC3‧‧‧比較器部 IC3‧‧‧Comparator section

IM1~IM6、IMn‧‧‧入射鏡 IM1~IM6, IMn‧‧‧ incident mirror

LDo‧‧‧半導體雷射光源 LDo‧‧‧Semiconductor laser light source

Lpa、Lpb、Lpc、Lpd‧‧‧主光線 Lpa, Lpb, Lpc, Lpd‧‧‧Main light

LS‧‧‧光源裝置 LS‧‧‧Light source device

M1~M12、M20~M24、M20a、M34、MRa、MRb、MRw‧‧‧反射鏡 M1~M12, M20~M24, M20a, M34, MRa, MRb, MRw‧‧‧Mirror

M33‧‧‧鏡 M33‧‧‧Mirror

Mcc‧‧‧旋轉基準標記 Mcc‧‧‧Rotating fiducial mark

OS1~OS6、OSn‧‧‧選擇用光學元件 OS1~OS6, OSn‧‧‧Optical components for selection

P‧‧‧基板(被照射體) P‧‧‧Substrate (irradiated body)

pb1、pb2‧‧‧偏振分離面 pb1, pb2‧‧‧polarization separation surface

PD1、PD2‧‧‧受光面 PD1, PD2‧‧‧Light-receiving surface

PM‧‧‧多面鏡 PM‧‧‧Polygon mirror

QP1、QP2‧‧‧1/4波長板 QP1, QP2‧‧‧1/4 wavelength plate

RM‧‧‧旋轉馬達 RM‧‧‧Rotating Motor

RP、RPa~RPh‧‧‧反射面 RP、RPa~RPh‧‧‧Reflecting surface

SL1~SL6、SLn‧‧‧描繪線 SL1~SL6, SLn‧‧‧Drawing line

SP、SPr、SPr'‧‧‧點光 SP, SPr, SPr'‧‧‧point light

STa、STb‧‧‧輸出訊號 STa, STb‧‧‧output signal

SZn、SZn(a)1~SZn(a)7‧‧‧原點訊號 SZn, SZn(a)1~SZn(a)7‧‧‧origin signal

TDa~TDh‧‧‧轉動時間 TDa~TDh‧‧‧Rotation time

Tog、Tog1、Tog2‧‧‧原點時刻 Tog, Tog1, Tog2‧‧‧origin time

TR‧‧‧吸收體 TR‧‧‧Absorber

U1~U6、Un‧‧‧描繪單元 U1~U6, Un‧‧‧Drawing unit

Vh‧‧‧速度 Vh‧‧‧Speed

Vref‧‧‧偏移電壓(基準電壓) Vref‧‧‧Offset voltage (reference voltage)

X、Y、Z‧‧‧方向 X, Y, Z‧‧‧direction

△Te‧‧‧偏差量 △Te‧‧‧Tolerance

△Tm1~△Tm7、△Tma~△Tmh‧‧‧原點間隔時間 △Tm1~△Tm7、△Tma~△Tmh‧‧‧Origin interval time

△θe、θβ‧‧‧角度 △θe、θβ‧‧‧Angle

圖1係表示對第1實施形態之基板(被照射體)實施曝光處理之曝光裝置(圖案描繪裝置)之概略構成的立體圖。 Fig. 1 is a perspective view showing a schematic configuration of an exposure device (pattern drawing device) that performs exposure processing on a substrate (irradiated body) of the first embodiment.

圖2係表示圖1所示之描繪單元之光學構成之圖。 Fig. 2 is a diagram showing the optical structure of the drawing unit shown in Fig. 1.

圖3係於與XY平面平行之面內觀察圖2所示之描繪單元內之多面鏡、fθ透鏡系統之光軸、構成原點感測器之光束送光部及光束受光部等之配置而得之圖。 Figure 3 is to observe the configuration of the polygon mirror in the drawing unit shown in Figure 2, the optical axis of the fθ lens system, and the beam transmitting part and the beam receiving part that constitute the origin sensor in a plane parallel to the XY plane. Get the picture.

圖4係表示設置於光束受光部之光電轉換元件(光電檢測器)之詳細構成之圖。 Fig. 4 is a diagram showing the detailed structure of a photoelectric conversion element (photodetector) provided in the light beam receiving portion.

圖5係表示用於使原點檢測用光束於多面鏡之反射面反射1次,接收該反射光束並輸出原點訊號之光束送光部及光束受光部之圖。 Fig. 5 is a diagram showing a beam transmitting part and a beam receiving part for reflecting the light beam for origin detection on the reflecting surface of the polygon mirror once, receiving the reflected light beam and outputting the origin signal.

圖6係圖1~圖3所示之8面多面鏡之俯視圖。 Figure 6 is a top view of the 8-sided polygon mirror shown in Figures 1 to 3.

圖7係說明測量原點訊號之產生時序之再現性(偏差)之方法的圖。 FIG. 7 is a diagram illustrating a method of measuring the reproducibility (deviation) of the origin signal generation timing.

圖8係示意性地表示預測由多面鏡之速度變動所致之時間誤差量之方法的圖。 FIG. 8 is a diagram schematically showing a method of predicting the amount of time error caused by the speed variation of the polygon mirror.

圖9係表示於既定之條件下,利用如圖7、圖8之方法實測與多面鏡之反射面之各者對應地產生的原點訊號之再現性而得之結果之圖。 Fig. 9 is a graph showing the results obtained by measuring the reproducibility of the origin signal corresponding to each of the reflecting surfaces of the polygon mirror by using the methods shown in Figs. 7 and 8 under the established conditions.

圖10係表示於與圖9不同之既定之條件下,利用如圖7、圖8之方法實測與多面鏡之反射面之各者對應地產生的原點訊號之再現性而得之結果之圖。 Fig. 10 is a graph showing the results obtained by using the methods shown in Figs. 7 and 8 to measure the reproducibility of the origin signal generated corresponding to each of the reflecting surfaces of the polygon mirror under predetermined conditions different from Fig. 9 .

圖11係表示第2實施形態之原點感測器之構成之圖。 Fig. 11 is a diagram showing the structure of the origin sensor of the second embodiment.

圖12係表示第3實施形態之原點感測器之構成之圖。 Fig. 12 is a diagram showing the structure of the origin sensor of the third embodiment.

圖13係於與XY平面平行之面內觀察圖12之構成而得之示意圖。 Fig. 13 is a schematic view obtained by observing the structure of Fig. 12 in a plane parallel to the XY plane.

圖14係表示第4實施形態之原點感測器之構成之圖。 Fig. 14 is a diagram showing the structure of the origin sensor of the fourth embodiment.

圖15係示意性地表示圖14之各光束之光路之圖。 Fig. 15 is a diagram schematically showing the optical paths of the light beams in Fig. 14.

圖16係表示第5實施形態之原點感測器之構成之圖。 Fig. 16 is a diagram showing the structure of the origin sensor of the fifth embodiment.

圖17係表示第5實施形態之原點感測器之構成之變形例的圖。 Fig. 17 is a diagram showing a modification example of the structure of the origin sensor of the fifth embodiment.

圖18係表示第6實施形態之原點感測器之構成之圖。 Fig. 18 is a diagram showing the structure of the origin sensor of the sixth embodiment.

關於本發明之態樣之光束掃描裝置及圖案描繪裝置,舉出較佳之實施形態,一面參照隨附圖式,一面於下文詳細地進行說明。再者,本發明之態樣並不限定於該等實施形態,亦包含添加有多種變更或改良者。即,以下所記載之構成要素中包含業者能夠容易地假設者及實質上相同者,以下所記載之構成要素可適當組合。又,可於不脫離本發明之主旨之範圍內進行構成要素之各種省略、置換或變更。 With regard to the beam scanning device and the pattern drawing device of the aspect of the present invention, preferred embodiments are given, referring to the accompanying drawings, and a detailed description is given below. Furthermore, the aspects of the present invention are not limited to these embodiments, and include those with various changes or improvements added. That is, the constituent elements described below include those that can be easily assumed by the manufacturer and those that are substantially the same, and the constituent elements described below can be appropriately combined. In addition, various omissions, substitutions, or changes of the constituent elements can be made without departing from the spirit of the present invention.

[第1實施形態] [First Embodiment]

圖1係表示對第1實施形態之基板(被照射體)P實施曝光處理之曝光裝置(圖案描繪裝置)EX的概略構成之立體圖。再者,於以下之說明中,只要未特別說明,則設定以重力方向為Z方向之XYZ正交座標系,並按照圖中所示之箭頭說明X方向、Y方向、及Z方向。 FIG. 1 is a perspective view showing a schematic configuration of an exposure device (pattern drawing device) EX that performs exposure processing on a substrate (irradiated body) P of the first embodiment. Furthermore, in the following description, unless otherwise specified, an XYZ orthogonal coordinate system with the direction of gravity as the Z direction is set, and the X direction, Y direction, and Z direction are described according to the arrows shown in the figure.

曝光裝置EX係對基板P實施既定之處理(曝光處理等)而製造電子元件之元件製造系統中所使用的基板處理裝置。元件製造系統係例如構築有製造作為電子元件之軟性顯示器、膜狀之觸控面板、液晶顯示面板用之膜狀之彩色濾光片、軟性配線、或軟性感測器等之生產線的製造系統。以下,作為電子元件以軟性顯示器為前提進行說明。作為軟性顯示器,有例如有機EL顯示器、液晶顯示器等。元件製造系統具有所謂之輥對輥(Roll To Roll)方式之生產方式,即,自將軟性(可撓性)之片狀之基板(薄片基板)P捲成輥狀之未圖示之供給輥送出基板P,且對所送出之基板P連續地實施各種處理之後,利用未圖示之回收輥捲取各種處理後之基板P。因此,各種處理後之基板P成為複數個元件(顯示面板)以於基板P之搬送方向上相連之狀態排列之多倒角用之基板。自供給輥搬送之基板P依序通過前步驟之製程裝置、曝光裝置EX、及後步驟之製程裝置而被實施各種處理,且被回收輥捲取。基板P具有基板P之移動方向(搬送方向)成為長邊方向(長條方向),寬度方向成為短邊方向(短條方向)之帶狀之形狀。 The exposure apparatus EX is a substrate processing apparatus used in a component manufacturing system that performs predetermined processing (exposure processing, etc.) on the substrate P to manufacture electronic components. The device manufacturing system is, for example, a manufacturing system constructed with a production line for manufacturing flexible displays as electronic components, film-shaped touch panels, film-shaped color filters for liquid crystal display panels, flexible wiring, or soft sensors. Hereinafter, the description will be made on the premise of a flexible display as an electronic component. As flexible displays, there are, for example, organic EL displays, liquid crystal displays, and the like. The component manufacturing system has a so-called roll-to-roll (Roll To Roll) production method, that is, a supply roll (not shown) that rolls a soft (flexible) sheet substrate (sheet substrate) P into a roll. After the substrate P is sent out, and various treatments are continuously performed on the sent substrate P, the substrate P after various treatments is taken up by a recovery roller (not shown). Therefore, the substrate P after various treatments becomes a substrate for multiple chamfering in which a plurality of elements (display panels) are arranged in a state connected in the conveying direction of the substrate P. The substrate P conveyed from the supply roller passes through the processing device of the previous step, the exposure device EX, and the processing device of the subsequent step in order to be subjected to various processes, and is taken up by the recovery roller. The substrate P has a strip shape in which the moving direction (conveying direction) of the substrate P becomes the long side direction (long direction), and the width direction becomes the short side direction (short direction).

基板P係使用例如樹脂膜、或者由不鏽鋼等金屬或合金構成之箔(foil)等。作為樹脂膜之材質,亦可使用例如包含聚乙烯樹脂、聚丙烯樹脂、聚酯樹脂、乙烯-乙烯酯共聚物樹脂、聚氯乙烯樹脂、纖維素樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚碳酸酯樹脂、聚苯乙烯樹脂、及乙酸乙烯酯樹脂中之至少一種以上。又,基板P之厚度或剛性(楊氏模數)只要為如於通過元件製造系統或曝光裝置EX之搬送路徑時基板P不會產生由屈曲所致之折痕或不可逆之皺褶之 範圍便可。作為基板P之母材,厚度為25μm~200μm左右之PET(聚對苯二甲酸乙二酯)或PEN(聚萘二甲酸乙二醇酯)等之膜係較佳之薄片基板之代表。 The substrate P uses, for example, a resin film, or a foil made of metal or alloy such as stainless steel. As the material of the resin film, for example, polyethylene resins, polypropylene resins, polyester resins, ethylene-vinyl ester copolymer resins, polyvinyl chloride resins, cellulose resins, polyamide resins, and polyimide resins can also be used. , At least one of polycarbonate resin, polystyrene resin, and vinyl acetate resin. In addition, the thickness or rigidity (Young's modulus) of the substrate P should be such that the substrate P does not produce creases or irreversible wrinkles caused by buckling when passing through the transport path of the component manufacturing system or the exposure device EX. can. As the base material of the substrate P, a film such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) with a thickness of about 25 μm to 200 μm is representative of the preferred sheet substrate.

基板P有於在元件製造系統內實施之各處理中受熱之情況,故而較佳為選定熱膨脹係數不太大之材質之基板P。例如可藉由將無機填料混合於樹脂膜而抑制熱膨脹係數。無機填料亦可為例如氧化鈦、氧化鋅、氧化鋁、或氧化矽等。又,基板P可為利用浮製法等製造之厚度100μm左右之極薄玻璃之單層體,亦可為於該極薄玻璃貼合上述樹脂膜、箔等而成之積層體。 The substrate P is subject to heat during various processes implemented in the device manufacturing system, so it is preferable to select a substrate P made of a material with a low thermal expansion coefficient. For example, the thermal expansion coefficient can be suppressed by mixing an inorganic filler in the resin film. The inorganic filler may also be, for example, titanium oxide, zinc oxide, aluminum oxide, or silicon oxide. In addition, the substrate P may be a single layer body of ultra-thin glass with a thickness of about 100 μm manufactured by a float method or the like, or may be a laminate body formed by bonding the above-mentioned resin film, foil, etc., to the ultra-thin glass.

此外,所謂基板P之可撓性(flexibility)係指即便對基板P施加自重程度之力亦不會剪切或斷裂而能夠使該基板P彎曲之性質。又,因自重程度之力而屈曲之性質亦包含於可撓性。又,可撓性之程度係根據基板P之材質、大小、厚度、成膜於基板P上之層構造、溫度、或濕度等環境等而變化。總之,只要於在設置於元件製造系統(曝光裝置EX)內之搬送路徑之各種搬送用滾筒、旋轉筒等之搬送方向轉換用之構件正確地捲繞有基板P之情形時,可不屈曲而帶有折痕或破損(產生破碎或裂紋)地順利搬送基板P,便可稱為可撓性之範圍。 In addition, the so-called flexibility of the substrate P refers to the property that the substrate P can be bent without shearing or breaking even if a force of its own weight is applied to the substrate P. In addition, the nature of buckling due to the force of its own weight is also included in flexibility. In addition, the degree of flexibility varies depending on the material, size, thickness, layer structure of the film formed on the substrate P, temperature, humidity, and other environments. In short, as long as the substrate P is correctly wound around the various conveying rollers, rotating drums and other conveying direction switching members installed in the conveying path of the component manufacturing system (exposure apparatus EX), the substrate P can be wound without buckling. The smooth transfer of the substrate P with creases or breakages (cracks or cracks) can be referred to as the range of flexibility.

前步驟之製程裝置(包含單一處理部或複數個處理部)係一面將自供給輥送來之基板P朝向曝光裝置EX以既定之速度沿著長條方向搬送,一面對搬送至曝光裝置EX之基板P進行前步驟之處理。藉由該前步驟之處理,搬送至曝光裝置EX之基板P成為於其表面形成有感光性功能層(光感應層)之基板(感光基板)。 The process device of the previous step (including a single processing unit or a plurality of processing units) transports the substrate P sent from the supply roller toward the exposure device EX at a predetermined speed along the longitudinal direction, and the other side is transported to the exposure device EX The substrate P is processed in the previous step. Through the processing of this previous step, the substrate P conveyed to the exposure apparatus EX becomes a substrate (photosensitive substrate) on which a photosensitive functional layer (photosensitive layer) is formed.

該感光性功能層係藉由以溶液之形式塗佈於基板P上且進行乾燥而成為層(膜)。感光性功能層之代表者為光阻劑(液狀或乾燥膜狀),但作為無需顯影處理之材料,有受到紫外線之照射之部分之親液/撥液性被改質之感光性矽烷偶合劑(SAM)、或於受到紫外線之照射之部分顯露出鍍覆還原基之感光性還原劑等。於使用感光性矽烷偶合劑作為感光性功能層之情形時,基板P上之 經紫外線曝光之圖案部分自撥液性改質為親液性。因此,藉由於成為親液性之部分之上選擇塗佈含有導電性油墨(含有銀或銅等導電性奈米粒子之油墨)或半導體材料之液體等,可形成成為構成薄膜電晶體(TFT)等之電極、半導體、絕緣或連接用之配線之圖案層。於使用感光性還原劑作為感光性功能層之情形時,於基板P上之經紫外線曝光之圖案部分顯露鍍覆還原基。因此,曝光後,將基板P直接於包含鈀離子等之鍍覆液中浸漬固定時間,藉此形成(析出)鈀之圖案層。此種鍍覆處理係加成(additive)之製程,但此外,亦可以作為減成(subtractive)之製程之蝕刻處理為前提。於此情形時,被送至曝光裝置EX之基板P宜為將母材設為PET或PEN,並於其表面全面或選擇性地蒸鍍鋁(Al)或銅(Cu)等之金屬性薄膜,進而於其上積層光阻劑層而成者。 This photosensitive functional layer becomes a layer (film) by coating on the substrate P in the form of a solution and drying. The representative of the photosensitive functional layer is photoresist (liquid or dry film), but as a material that does not require development processing, there are lyophilic/liquid-repellent modified photosensitive silane couples that are irradiated by ultraviolet rays Mixture (SAM), or a photosensitive reducing agent that exposes a plating reducing group on the part irradiated by ultraviolet rays. In the case of using a photosensitive silane coupling agent as the photosensitive functional layer, the pattern portion exposed to ultraviolet rays on the substrate P is transformed from liquid repellency to lyophilicity. Therefore, by selectively applying a liquid containing conductive ink (an ink containing conductive nanoparticles such as silver or copper) or a semiconductor material on the lyophilic part, it can be formed into a thin film transistor (TFT). Pattern layer for electrodes, semiconductors, insulation or wiring used for connection. When a photosensitive reducing agent is used as the photosensitive functional layer, the pattern portion exposed to ultraviolet rays on the substrate P reveals the plating reducing base. Therefore, after exposure, the substrate P is directly immersed in a plating solution containing palladium ions or the like for a fixed period of time, thereby forming (precipitating) a patterned layer of palladium. This plating process is an additive process, but in addition, it can also be used as a prerequisite for the etching process of a subtractive process. In this case, the substrate P sent to the exposure device EX is preferably made of PET or PEN as the base material, and a metallic thin film such as aluminum (Al) or copper (Cu) is deposited on the entire surface or selectively , And then laminated a photoresist layer on it.

曝光裝置(處理裝置)EX係一面將自前步驟之製程裝置搬送來之基板P朝後步驟之製程裝置(包含單一處理部或複數個處理部)以既定之速度進行搬送,一面對基板P進行曝光處理之處理裝置。曝光裝置EX對基板P之表面(感光性功能層之表面、即感光面)照射與電子元件用之圖案(例如構成電子元件之TFT之電極或配線等之圖案)相應之光圖案。藉此,於感光性功能層形成與上述圖案對應之潛像(改質部)。 Exposure device (processing device) EX is a process device (including a single processing section or multiple processing sections) that transports the substrate P transported from the process device of the previous step at a predetermined speed, and the substrate P is transported at the same time. Processing device for exposure processing. The exposure device EX irradiates the surface of the substrate P (the surface of the photosensitive functional layer, that is, the photosensitive surface) with a light pattern corresponding to the pattern for the electronic component (for example, the pattern of the electrode or wiring of the TFT constituting the electronic component). Thereby, a latent image (modified part) corresponding to the above-mentioned pattern is formed on the photosensitive functional layer.

於本實施形態中,曝光裝置EX係如圖1所示般未使用光罩之直描方式之曝光裝置、即所謂之光點掃描方式之曝光裝置(描繪裝置)。曝光裝置EX具備:旋轉筒DR,其為實現副掃描而對基板P予以支持並於長條方向上進行搬送;及複數個(此處為6個)描繪單元Un(U1~U6),其等對利用旋轉筒DR呈圓筒面狀予以支持之基板P之每個部分進行圖案曝光;複數個描繪單元Un(U1~U6)之各者一面使曝光用之脈衝狀之光束LB(脈衝光束)之點光SP於基板P之被照射面(感光面)上在既定之掃描方向(Y方向)上利用多面鏡一維地進行掃描(主掃描),一面根據圖案資料(描繪資料、圖案信息)高速地調變(接通 /斷開)點光SP之強度。藉此,於基板P之被照射面描繪曝光與電子元件、電路或配線等之既定之圖案相應之光圖案。即,利用基板P之副掃描及點光SP之主掃描使點光SP於基板P之被照射面(感光性功能層之表面)上相對地進行二維掃描,而於基板P之被照射面描繪曝光既定之圖案。又,由於基板P被沿著長條方向搬送,故而藉由曝光裝置EX曝光圖案之被曝光區域係沿著基板P之長條方向隔開既定之間隔而設置有複數個。由於在該被曝光區域形成有電子元件,故而被曝光區域亦為元件形成區域。 In this embodiment, the exposure device EX is a direct-drawing method exposure device that does not use a mask as shown in FIG. 1, that is, a so-called spot scanning method exposure device (drawing device). The exposure device EX is equipped with: a rotating drum DR, which supports the substrate P for sub-scanning and conveys it in the longitudinal direction; and a plurality of (here, 6) drawing units Un (U1~U6), etc. Pattern exposure is performed on each part of the substrate P supported by the rotating drum DR in the shape of a cylindrical surface; each of the plurality of drawing units Un (U1~U6) uses a pulsed light beam LB (pulse beam) for exposure on one side The spot light SP is scanned one-dimensionally (main scanning) on the illuminated surface (photosensitive surface) of the substrate P in the predetermined scanning direction (Y direction) using a polygon mirror, and one side is based on the pattern data (drawing data, pattern information) High-speed modulation (on/off) of the intensity of the spot light SP. Thereby, a light pattern corresponding to a predetermined pattern of electronic components, circuits, wirings, etc., is drawn and exposed on the illuminated surface of the substrate P. That is, using the sub-scanning of the substrate P and the main scanning of the spot light SP, the spot light SP is relatively two-dimensionally scanned on the illuminated surface of the substrate P (the surface of the photosensitive functional layer), and the spot light SP is scanned on the illuminated surface of the substrate P. Describe the pattern of the exposure set. In addition, since the substrate P is transported in the longitudinal direction, the exposed regions of the pattern exposed by the exposure device EX are provided at a predetermined interval along the longitudinal direction of the substrate P and are provided in plural. Since electronic components are formed in the exposed area, the exposed area is also an element formation area.

如圖1所示,旋轉筒DR具有於Y方向上延伸並且於與重力起作用之方向交叉之方向上延伸之中心軸AXo、及自中心軸AXo起為固定半徑之圓筒狀之外周面。旋轉筒DR一面沿著該外周面(圓周面)將基板P之一部分於長條方向上呈圓筒面狀彎曲地予以支持(保持),一面以中心軸AXo為中心旋轉而將基板P朝長條方向搬送。旋轉筒DR利用其外周面對被投射來自複數個描繪單元Un(U1~U6)之各者之光束LB(點光SP)之基板P上的區域(部分)予以支持。旋轉筒DR自與形成電子元件之面(形成有感光面之側之面)為相反側之面(背面)側支持(密接保持)基板P。再者,於旋轉筒DR之Y方向之兩側,設置有以使旋轉筒DR繞中心軸AXo旋轉之方式由軸承支持之未圖示之軸。對該軸賦予來自未圖示之旋轉驅動源(例如馬達或減速機構等)之旋轉轉矩,旋轉筒DR繞中心軸AXo以固定之旋轉速度旋轉。 As shown in FIG. 1, the rotating drum DR has a central axis AXo extending in the Y direction and extending in a direction intersecting the direction in which gravity acts, and a cylindrical outer peripheral surface having a fixed radius from the central axis AXo. The rotating drum DR supports (holds) a part of the substrate P in the shape of a cylindrical surface along the outer peripheral surface (circumferential surface) in the longitudinal direction, and rotates around the central axis AXo to extend the substrate P. Convey in the same direction. The rotating drum DR is supported by its outer peripheral surface on the area (part) on the substrate P on which the light beam LB (point light SP) from each of the plurality of drawing units Un (U1 to U6) is projected. The rotating drum DR supports (holds in close contact) the substrate P from the surface (back surface) opposite to the surface on which the electronic component is formed (the surface on which the photosensitive surface is formed). Furthermore, on both sides of the Y-direction of the rotating drum DR, there are provided shafts, not shown, supported by bearings in such a way that the rotating drum DR rotates around the central axis AXo. A rotation torque from a rotation driving source (for example, a motor or a deceleration mechanism, etc.) is applied to this shaft, and the rotating drum DR rotates at a fixed rotation speed around the central axis AXo.

光源裝置LS產生並射出脈衝狀之光束(脈衝光束、脈衝光、雷射)LB。該光束LB為具有對基板P之感光層之感度且於370nm以下之波長頻帶具有峰值波長之紫外線光。光源裝置LS按照文中未圖示之描繪控制裝置之控制,以頻率(振盪頻率、既定頻率)Fa發出並射出脈衝狀之光束LB。該光源裝置LS係設為光纖放大雷射光源,其由產生紅外波長區域之脈衝光之半導體雷射元件、光纖放大器、及將經放大之紅外波長區域之脈衝光轉換為紫外波長區域 之脈衝光的波長轉換元件(諧波產生元件)等構成。藉由如此構成光源裝置LS,可獲得振盪頻率Fa為數百MHz且1脈衝光之發光時間為數十微微秒以下之高亮度之紫外線之脈衝光。再者,自光源裝置LS射出之光束LB成為光束徑為1mm左右或其以下之較細之平行光束。關於將光源裝置LS設為光纖放大雷射光源並根據構成描繪資料之像素之狀態(以邏輯值計為「0」或「1」)使光束LB之脈衝產生高速地接通/斷開之構成,揭示於國際公開公報第2015/166910號中。 The light source device LS generates and emits a pulse-shaped beam (pulse beam, pulse light, laser) LB. The light beam LB is ultraviolet light having sensitivity to the photosensitive layer of the substrate P and having a peak wavelength in the wavelength band below 370 nm. The light source device LS emits and emits a pulsed light beam LB at a frequency (oscillation frequency, predetermined frequency) Fa under the control of a drawing control device not shown in the text. The light source device LS is set as a fiber-amplified laser light source, which consists of a semiconductor laser element that generates pulsed light in the infrared wavelength region, an optical fiber amplifier, and converts the amplified pulsed light in the infrared wavelength region into pulsed light in the ultraviolet wavelength region The wavelength conversion element (harmonic generation element) and other components. By configuring the light source device LS in this way, high-intensity ultraviolet pulse light with an oscillation frequency Fa of several hundred MHz and a luminous time of one pulse light of tens of picoseconds or less can be obtained. Furthermore, the light beam LB emitted from the light source device LS becomes a relatively thin parallel light beam with a beam diameter of about 1 mm or less. Regarding the configuration that the light source device LS is set as a fiber-amplified laser light source and the pulse of the light beam LB is turned on/off at a high speed according to the state of the pixels constituting the drawing data (the logical value is "0" or "1") , Disclosed in the International Public Bulletin No. 2015/166910.

自光源裝置LS射出之光束LB係透過光束切換部而選擇性(擇一性)地供給至描繪單元Un(U1~U6)之各者,該光束切換部係由作為複數個開關元件之選擇用光學元件OSn(OS1~OS6)、複數個反射鏡M1~M12、複數個入射鏡IMn(IM1~IM6)、及吸收體TR等構成。選擇用光學元件OSn(OS1~OS6)係對光束LB具有透過性,且由聲光調變元件(AOM:Acousto-Optic Modulator)構成,該聲光調變元件係由超音波訊號驅動,使入射之光束LB之1次繞射光以既定之角度偏向地射出。複數個選擇用光學元件OSn及複數個入射鏡IMn係對應於複數個描繪單元Un之各者而設置。例如,選擇用光學元件OS1與入射鏡IM1係對應於描繪單元U1而設置,同樣地,選擇用光學元件OS2~OS6及入射鏡IM2~IM6係分別對應於描繪單元U2~U6而設置。 The light beam LB emitted from the light source device LS is selectively (selectively) supplied to each of the drawing units Un (U1~U6) through the beam switching part, which is used as a selection of a plurality of switching elements The optical element OSn (OS1~OS6), a plurality of reflecting mirrors M1~M12, a plurality of incident mirrors IMn (IM1~IM6), and an absorber TR are composed. The optical element OSn (OS1~OS6) for selection is transparent to the light beam LB, and is composed of an acousto-optic modulator (AOM: Acousto-Optic Modulator), which is driven by an ultrasonic signal to make the incident light The primary diffracted light of the light beam LB is emitted at a predetermined angle. The plural optical elements OSn for selection and the plural incident mirrors IMn are provided corresponding to each of the plural drawing units Un. For example, the selection optical element OS1 and the incident mirror IM1 are provided corresponding to the drawing unit U1, and similarly, the selection optical elements OS2 to OS6 and the incident mirror IM2 to IM6 are provided corresponding to the drawing units U2 to U6, respectively.

來自光源裝置LS之光束LB藉由反射鏡M1~M12使其光路彎曲成曲折狀地被引導至吸收體TR。以下,於選擇用光學元件OSn(OS1~OS6)均為斷開狀態(未施加有超音波訊號,而未產生1次繞射光之狀態)之情形時進行詳細敍述。再者,圖1中雖省略圖示,但於自反射鏡M1至吸收體TR為止之光束光路中設置有複數個透鏡,該等複數個透鏡係將光束LB自平行光束收斂或使收斂後發散之光束LB恢復為平行光束。該構成將於下文使用圖4進行說明。 The light beam LB from the light source device LS is guided to the absorber TR by bending its optical path in a zigzag shape by the mirrors M1 to M12. Hereinafter, it will be described in detail when the optical elements OSn (OS1~OS6) for selection are all in an off state (a state where ultrasonic signals are not applied and no primary diffracted light is generated). In addition, although illustration is omitted in FIG. 1, a plurality of lenses are provided in the light beam path from the mirror M1 to the absorber TR. The plurality of lenses converge the light beam LB from the parallel light beam or diverge after converging. The beam LB is restored to a parallel beam. This structure will be explained using FIG. 4 below.

於圖1中,來自光源裝置LS之光束LB與X軸平行地朝-X方向行進並入射至反射鏡M1。由反射鏡M1朝-Y方向反射之光束LB入射至反射鏡M2。由 反射鏡M2朝+X方向反射之光束LB直接透過選擇用光學元件OS5並到達反射鏡M3。由反射鏡M3朝-Y方向反射之光束LB入射至反射鏡M4。由反射鏡M4朝-X方向反射之光束LB直接透過選擇用光學元件OS6並到達反射鏡M5。由反射鏡M5朝-Y方向反射之光束LB入射至反射鏡M6。由反射鏡M6朝+X方向反射之光束LB直接透過選擇用光學元件OS3並到達反射鏡M7。由反射鏡M7朝-Y方向反射之光束LB入射至反射鏡M8。由反射鏡M8朝-X方向反射之光束LB直接透過選擇用光學元件OS4並到達反射鏡M9。由反射鏡M9朝-Y方向反射之光束LB入射至反射鏡M10。由反射鏡M10朝+X方向反射之光束LB直接透過選擇用光學元件OS1並到達反射鏡M11。由反射鏡M11朝-Y方向反射之光束LB入射至反射鏡M12。由反射鏡M12朝-X方向反射之光束LB直接透過選擇用光學元件OS2並被引導至吸收體TR。該吸收體TR係為抑制光束LB之向外部之洩漏而吸收光束LB之光陷阱。 In FIG. 1, the light beam LB from the light source device LS travels in the -X direction parallel to the X axis and is incident on the mirror M1. The light beam LB reflected in the -Y direction by the mirror M1 is incident on the mirror M2. The light beam LB reflected in the +X direction by the mirror M2 directly passes through the selection optical element OS5 and reaches the mirror M3. The light beam LB reflected in the -Y direction by the mirror M3 is incident on the mirror M4. The light beam LB reflected in the -X direction by the mirror M4 directly passes through the selection optical element OS6 and reaches the mirror M5. The light beam LB reflected in the -Y direction by the mirror M5 is incident on the mirror M6. The light beam LB reflected in the +X direction by the mirror M6 directly passes through the selection optical element OS3 and reaches the mirror M7. The light beam LB reflected in the -Y direction by the mirror M7 is incident on the mirror M8. The light beam LB reflected in the -X direction by the mirror M8 directly passes through the selection optical element OS4 and reaches the mirror M9. The light beam LB reflected in the -Y direction by the mirror M9 is incident on the mirror M10. The light beam LB reflected in the +X direction by the mirror M10 directly passes through the selection optical element OS1 and reaches the mirror M11. The light beam LB reflected in the -Y direction by the mirror M11 is incident on the mirror M12. The light beam LB reflected in the -X direction by the mirror M12 directly passes through the selection optical element OS2 and is guided to the absorber TR. The absorber TR is a light trap that absorbs the light beam LB in order to suppress the leakage of the light beam LB to the outside.

各選擇用光學元件OSn係當被施加超音波訊號(高頻訊號)時,產生使入射之光束(0次光)LB以與高頻之頻率相應之繞射角繞射而得之1次繞射光作為射出光束(光束LBn)。因此,自選擇用光學元件OS1作為1次繞射光射出之光束成為LB1,同樣地,自選擇用光學元件OS2~OS6作為1次繞射光射出之光束成為LB2~LB6。如此,各選擇用光學元件OSn(OS1~OS6)發揮使來自光源裝置LS之光束LB之光路偏向之功能。但,實際之聲光調變元件由於1次繞射光之產生效率為0次光之80%左右,故而藉由選擇用光學元件OSn之各者而偏向之光束LBn(LB1~LB6)較原本之光束LB之強度降低。又,於本實施形態中,以選擇用光學元件OSn(OS1~OS6)中之被選擇之一者僅以固定時間成為接通狀態之方式,藉由未圖示之描繪控制裝置進行控制。於被選擇之1個選擇用光學元件OSn為接通狀態時,未藉由該選擇用光學元件OSn進行繞射而直行之0次光殘存20%左右,但其最終會被吸收體TR吸收。 Each optical element OSn for selection is a primary winding obtained by diffracting the incident light beam (zero-order light) LB at a diffraction angle corresponding to the high-frequency frequency when an ultrasonic signal (high-frequency signal) is applied. The emitted light is an emitted light beam (light beam LBn). Therefore, the light beam emitted from the optical element for selection OS1 as the primary diffracted light becomes LB1, and similarly, the light beam emitted from the optical element for selection OS2 to OS6 as the primary diffracted light becomes LB2 to LB6. In this way, each optical element OSn (OS1 to OS6) for selection functions to deflect the optical path of the light beam LB from the light source device LS. However, since the actual acousto-optic modulating element generates about 80% of the first-order diffracted light, the light beam LBn (LB1~LB6) deflected by selecting each of the optical elements OSn is better than the original one. The intensity of the light beam LB decreases. In addition, in the present embodiment, the selected one of the optical elements OSn (OS1 to OS6) for selection is controlled by a drawing control device not shown in such a way that the selected one is turned on only for a fixed time. When the one selected optical element OSn for selection is in the ON state, about 20% of the zero-order light traveling straight without being diffracted by the optical element OSn for selection remains about 20%, but it is eventually absorbed by the absorber TR.

選擇用光學元件OSn之各者係以使作為經偏向之1次繞射光之光 束LBn(LB1~LB6)相對於入射之光束LB朝-Z方向偏向之方式設置。藉由選擇用光學元件OSn之各者而偏向並射出之光束LBn(LB1~LB6)被投射至設置於與選擇用光學元件OSn之各者隔開既定距離之位置的入射鏡IMn(IM1~IM6)。各入射鏡IMn藉由將入射之光束LBn(LB1~LB6)朝-Z方向反射,而將光束LBn(LB1~LB6)引導至各自對應之描繪單元Un(U1~U6)。 Each of the optical elements OSn for selection is set in such a way that the light beams LBn (LB1 to LB6) as the deflected primary diffracted light are deflected in the -Z direction with respect to the incident light beam LB. The light beams LBn (LB1~LB6) deflected and emitted by each of the selection optical elements OSn are projected to the incident mirror IMn (IM1~IM6) which is provided at a position separated from each of the selection optical elements OSn by a predetermined distance. ). Each incident mirror IMn guides the light beam LBn (LB1~LB6) to the corresponding drawing unit Un (U1~U6) by reflecting the incident light beam LBn (LB1~LB6) in the -Z direction.

亦可使用各選擇用光學元件OSn之構成、功能、作用等相互相同者。複數個選擇用光學元件OSn之各者係按照來自描繪控制裝置之驅動訊號(超音波訊號)之接通/斷開,將使入射之光束LB繞射之繞射光之產生接通/斷開。例如,選擇用光學元件OS5於未被施加來自描繪控制裝置之驅動訊號(高頻訊號)而為斷開狀態時,使所入射之來自光源裝置LS之光束LB不繞射地透過。因此,透過選擇用光學元件OS5之光束LB入射至反射鏡M3。另一方面,於選擇用光學元件OS5為接通狀態時,使所入射之光束LB繞射並朝向入射鏡IM5。即,根據該驅動訊號之接通/斷開而控制利用選擇用光學元件OS5所進行之切換(光束選擇)動作。如此,藉由各選擇用光學元件OSn之切換動作,可將來自光源裝置LS之光束LB引導至任一個描繪單元Un,且可切換光束LBn所入射之描繪單元Un。如此,關於相對於來自光源裝置LS之光束LB依序串聯(串列)地配置複數個選擇用光學元件OSn並向對應之描繪單元Un分時地供給光束LBn之構成,揭示於國際公開公報第2015/166910號中。 It is also possible to use those having the same configuration, function, and function of each optical element OSn for selection. Each of the plurality of optical elements OSn for selection is turned on/off according to the on/off of the driving signal (ultrasonic signal) from the drawing control device, which turns on/off the generated diffracted light that is diffracted by the incident light beam LB. For example, the optical element OS5 for selection transmits the incident light beam LB from the light source device LS without being diffracted when it is in an off state without applying a driving signal (high-frequency signal) from the drawing control device. Therefore, the light beam LB transmitted through the optical element OS5 for selection enters the mirror M3. On the other hand, when the optical element OS5 for selection is in the ON state, the incident light beam LB is diffracted and directed toward the incident mirror IM5. That is, the switching (beam selection) operation performed by the selection optical element OS5 is controlled based on the on/off of the drive signal. In this way, by the switching operation of each optical element OSn for selection, the light beam LB from the light source device LS can be guided to any drawing unit Un, and the drawing unit Un into which the light beam LBn is incident can be switched. In this way, regarding the configuration in which a plurality of optical elements OSn for selection are arranged in series (tandem) in order with respect to the light beam LB from the light source device LS, and the light beam LBn is supplied to the corresponding drawing unit Un in a time-sharing manner, it is disclosed in International Publication No. No. 2015/166910.

構成光束切換部之選擇用光學元件OSn(OS1~OS6)之各者以固定時間成為接通狀態之順序例如預先決定為OS1→OS2→OS3→OS4→OS5→OS6→OS1→…。該順序係根據對描繪單元Un(U1~U6)之各者設定之利用點光之掃描開始時序的順序而決定。即,於本實施形態中,使設置於6個描繪單元U1~U6之各者之多面鏡之旋轉速度同步,並且使旋轉角度之相位亦同步,藉此,描繪單元U1~U6中之任一者之多面鏡之1 個反射面能以於基板P上進行1次光點掃描方式分時地切換。因此,只要描繪單元Un之各者之多面鏡之旋轉角度的相位為以既定之關係同步之狀態,則描繪單元Un之光點掃描之順序可為任意。於圖1之構成中,在基板P之搬送方向(旋轉筒DR之外周面於圓周方向上移動之方向)之上游側,3個描繪單元U1、U3、U5在Y方向上排列地配置,在基板P之搬送方向之下游側,3個描繪單元U2、U4、U6在Y方向上排列地配置。 The order in which the optical elements OSn (OS1~OS6) for selection constituting the light beam switching unit are turned on at a fixed time is predetermined, for example, OS1→OS2→OS3→OS4→OS5→OS6→OS1→…. The sequence is determined according to the sequence of the start sequence of scanning with spot light set for each of the drawing units Un (U1~U6). That is, in this embodiment, the rotation speeds of the polygon mirrors provided in each of the six drawing units U1 to U6 are synchronized, and the phases of the rotation angles are also synchronized, whereby any one of the drawing units U1 to U6 is synchronized. One reflecting surface of the polygon mirror can be switched in a time-sharing manner by performing a spot scan on the substrate P once. Therefore, as long as the phases of the rotation angles of the polygon mirrors of the drawing unit Un are synchronized with a predetermined relationship, the order of the light spot scanning of the drawing unit Un can be arbitrary. In the configuration of FIG. 1, on the upstream side of the conveying direction of the substrate P (the direction in which the outer peripheral surface of the rotating drum DR moves in the circumferential direction), three drawing units U1, U3, and U5 are arranged side by side in the Y direction. On the downstream side of the conveyance direction of the substrate P, three drawing units U2, U4, and U6 are arranged side by side in the Y direction.

於此情形時,向基板P之圖案描繪係自上游側之第奇數個描繪單元U1、U3、U5開始,且基板P被搬送固定長度後,下游側之第偶數個描繪單元U2、U4、U6亦開始圖案描繪,故而可將描繪單元Un之光點掃描之順序設定為U1→U3→U5→U2→U4→U6→U1→…。因此,選擇用光學元件OSn(OS1~OS6)之各者以固定時間成為接通狀態之順序被決定為OS1→OS3→OS5→OS2→OS4→OS6→OS1→…。再者,即便於與沒有須描繪之圖案之描繪單元Un對應之選擇用光學元件OSn成為接通狀態之順序時,亦可基於描繪資料而進行選擇用光學元件OSn之接通/斷開之切換控制,藉此,可強制性地維持於斷開狀態,因此不會進行利用該描繪單元Un之光點掃描。 In this case, the pattern drawing on the substrate P starts from the odd-numbered drawing units U1, U3, U5 on the upstream side, and after the substrate P is transported for a fixed length, the even-numbered drawing units U2, U4, U6 on the downstream side The pattern drawing is also started, so the order of the light spot scanning of the drawing unit Un can be set as U1→U3→U5→U2→U4→U6→U1→... Therefore, the order in which each of the selection optical elements OSn (OS1 to OS6) is turned on at a fixed time is determined as OS1→OS3→OS5→OS2→OS4→OS6→OS1→.... Furthermore, even in the sequence in which the selection optical element OSn corresponding to the drawing unit Un that does not have a pattern to be drawn is turned on, the selection optical element OSn can be switched on/off based on the drawing data. By this control, it can be forcibly maintained in the off state, so that the light spot scanning using the drawing unit Un is not performed.

如圖1所示,於描繪單元U1~U6之各者,設置有用以使所入射之光束LB1~LB6進行主掃描之多面鏡PM(掃描構件)。於本實施形態中,各描繪單元Un之多面鏡PM之各者被以如下方式進行同步控制,即,一面以相同之旋轉速度精密地旋轉,一面相互保持固定之旋轉角度相位。藉此,能以互不重複之方式設定自描繪單元U1~U6之各者投射至基板P之光束LB1~LB6之各者之主掃描的時序(點光SP之主掃描期間)。因此,藉由與6個多面鏡PM之各者之旋轉角度位置同步地控制設置於光束切換部之選擇用光學元件OSn(OS1~OS6)之各者之接通/斷開之切換,可實現將來自光源裝置LS之光束LB分時地分配至複數個描繪單元Un之各者之有效率之曝光處理。 As shown in FIG. 1, each of the drawing units U1 to U6 is provided with a polygon mirror PM (scanning member) for main scanning of the incident light beams LB1 to LB6. In this embodiment, each of the polygon mirrors PM of each drawing unit Un is synchronously controlled in such a way that one side precisely rotates at the same rotation speed, and the other side maintains a fixed rotation angle phase with each other. Thereby, the main scanning timing of each of the light beams LB1 to LB6 projected from each of the drawing units U1 to U6 to the substrate P (the main scanning period of the spot light SP) can be set in a manner that does not overlap each other. Therefore, by synchronously controlling the on/off switching of each of the selection optical elements OSn (OS1~OS6) provided in the beam switching part with the rotation angle position of each of the 6 polygon mirrors PM, it can be realized An efficient exposure process for distributing the light beam LB from the light source device LS to each of the plurality of drawing units Un in a time-sharing manner.

關於6個多面鏡PM之各者之旋轉角度之相位對準與選擇用光學元件OSn(OS1~OS6)之各者之接通/斷開之切換時序的同步控制,揭示於國際公開公報第2015/166910號中,但於8面多面鏡PM之情形時,作為掃描效率,相應於1個反射面之旋轉角度(45度)中之1/3左右對應於描繪線SLn上之點光SP之1次掃描,故而以如下方式控制選擇用光學元件OSn(OS1~OS6)之各者之接通/斷開之切換,即,使6個多面鏡PM相對地令旋轉角度之相位各偏移15度而旋轉,並且將各多面鏡PM之8個反射面跳過一面而使光束LBn進行掃描。如此,關於將多面鏡PM之反射面跳過一面而使用之描繪方式,亦揭示於國際公開公報第2015/166910號中。 The synchronization control of the phase alignment of the rotation angle of each of the 6 polygon mirrors PM and the on/off switching timing of each of the selection optical elements OSn (OS1~OS6) is disclosed in International Publication No. 2015 /166910, but in the case of 8-plane polygon mirror PM, as the scanning efficiency, about 1/3 of the rotation angle (45 degrees) corresponding to one reflecting surface corresponds to the point light SP on the drawing line SLn One scan, therefore, the switching of ON/OFF of each of the selection optical elements OSn (OS1~OS6) is controlled in the following way, that is, the 6 polygon mirrors PM are relatively shifted in the phase of the rotation angle by 15 The light beam LBn is scanned by rotating the 8 reflecting surfaces of each polygon mirror PM over one surface. In this way, the drawing method used to skip the reflective surface of the polygon mirror PM is also disclosed in International Publication No. 2015/166910.

如圖1所示,曝光裝置EX成為排列有相同構成之複數個描繪單元Un(U1~U6)之所謂多讀頭型之直描曝光方式。描繪單元Un之各者對由旋轉筒DR之外周面(圓周面)支持之基板P之於Y方向上經劃分之每個局部區域描繪圖案。各描繪單元Un(U1~U6)一面將來自光束切換部之光束LBn投射至基板P上(基板P之被照射面上),一面使光束LBn聚光(收斂)於基板P上。藉此,投射至基板P上之光束LBn(LB1~LB6)成為點光SP。又,藉由各描繪單元Un之多面鏡PM之旋轉,而使投射至基板P上之光束LBn(LB1~LB6)之點光SP於主掃描方向(Y方向)上進行掃描。藉由該點光SP之掃描,而於基板P上規定出用於描繪1行量之圖案之線性之描繪線(掃描線)SLn(再者,n=1、2、…、6)。描繪線SLn亦為光束LBn之點光SP之基板P上之掃描軌跡。 As shown in FIG. 1, the exposure apparatus EX adopts a so-called multi-head type direct-drawing exposure method in which a plurality of drawing units Un (U1 to U6) of the same configuration are arranged. Each of the drawing units Un draws a pattern for each local area divided in the Y direction of the substrate P supported by the outer peripheral surface (circumferential surface) of the rotating drum DR. Each drawing unit Un (U1 to U6) projects the light beam LBn from the light beam switching unit onto the substrate P (the illuminated surface of the substrate P), and condenses (converges) the light beam LBn on the substrate P. Thereby, the light beam LBn (LB1 to LB6) projected on the substrate P becomes the spot light SP. In addition, by the rotation of the polygon mirror PM of each drawing unit Un, the spot light SP of the light beam LBn (LB1 to LB6) projected on the substrate P is scanned in the main scanning direction (Y direction). By the scanning of the spot light SP, a linear drawing line (scanning line) SLn (n=1, 2, ..., 6) for drawing a pattern of one line is defined on the substrate P. The drawing line SLn is also the scanning track on the substrate P of the spot light SP of the light beam LBn.

描繪單元U1使點光SP沿著描繪線SL1進行掃描,同樣地,描繪單元U2~U6使點光SP沿著描繪線SL2~SL6進行掃描。如圖1所示,複數個描繪單元Un(U1~U6)之描繪線SLn(SL1~SL6)係隔著包含旋轉筒DR之中心軸AXo且與YZ面平行之中心面,於旋轉筒DR之圓周方向上呈2行錯位排列地配置。第奇數個描繪線SL1、SL3、SL5位於相對於中心面為基板P之搬送方向之上游側(-X 方向側)之基板P的被照射面上,且沿著Y方向隔開既定之間隔配置成1行。第偶數個描繪線SL2、SL4、SL6位於相對於中心面為基板P之搬送方向之下游側(+X方向側)之基板P的被照射面上,且沿著Y方向隔開既定之間隔配置成1行。因此,複數個描繪單元Un(U1~U6)亦隔著中心面於基板P之搬送方向上呈2行錯位排列地配置,若於XZ平面內觀察,則第奇數個描繪單元U1、U3、U5與第偶數個描繪單元U2、U4、U6相對於中心面對稱地設置。 The drawing unit U1 scans the spot light SP along the drawing line SL1, and similarly, the drawing units U2 to U6 scan the spot light SP along the drawing lines SL2 to SL6. As shown in Figure 1, the drawing lines SLn (SL1~SL6) of the plurality of drawing units Un (U1~U6) are separated by the center plane including the central axis AXo of the rotating drum DR and parallel to the YZ plane, and are located on the center plane of the rotating drum DR. It is arranged in a staggered arrangement in two rows in the circumferential direction. The odd-numbered drawing lines SL1, SL3, SL5 are located on the irradiated surface of the substrate P on the upstream side (-X direction side) of the conveying direction of the substrate P with respect to the center surface, and are arranged at a predetermined interval along the Y direction Into 1 row. The even-numbered drawing lines SL2, SL4, SL6 are located on the irradiated surface of the substrate P on the downstream side (+X direction side) in the conveying direction of the substrate P with respect to the center surface, and are arranged at predetermined intervals along the Y direction Into 1 row. Therefore, a plurality of drawing units Un (U1 to U6) are also arranged in a staggered arrangement in two rows in the conveying direction of the substrate P across the center plane. If viewed in the XZ plane, the odd-numbered drawing units U1, U3, U5 The even-numbered drawing units U2, U4, U6 are arranged symmetrically with respect to the center plane.

設定為於X方向(基板P之搬送方向)上第奇數個描繪線SL1、SL3、SL5與第偶數個描繪線SL2、SL4、SL6相互隔開,但於Y方向(基板P之寬度方向、主掃描方向)上未相互分離地接合。描繪線SL1~SL6與基板P之寬度方向、即旋轉筒DR之中心軸AXo大致平行。再者,使描繪線SLn於Y方向上接合意味著如使描繪線SLn之端部彼此之Y方向之位置鄰接或局部重複的關係。於使描繪線SLn之端部彼此重複之情形時,例如宜在相對於各描繪線SLn之長度而言包含描繪開始點或描繪結束點在內於Y方向以數%以下之範圍重複。 It is set so that the odd-numbered drawing lines SL1, SL3, SL5 and the even-numbered drawing lines SL2, SL4, SL6 are separated from each other in the X direction (the transport direction of the substrate P), but in the Y direction (the width direction of the substrate P, the main In the scanning direction), they are joined without being separated from each other. The drawing lines SL1 to SL6 are substantially parallel to the width direction of the substrate P, that is, the central axis AXo of the rotating drum DR. In addition, joining the drawing line SLn in the Y direction means a relationship in which the positions of the ends of the drawing line SLn in the Y direction are adjacent to each other or partially overlapped. When the ends of the drawing lines SLn are overlapped with each other, for example, it is preferable to repeat the drawing start point or the drawing end point with respect to the length of each drawing line SLn by a few% or less in the Y direction.

如此,複數個描繪單元Un(U1~U6)以全部覆蓋基板P上之曝光區域之寬度方向之尺寸之方式分擔Y方向之掃描區域(主掃描範圍之劃分)。例如,若將1個描繪單元Un之Y方向之主掃描範圍(描繪線SLn之長度)設為30~60mm左右,則藉由於Y方向上配置共計6個描繪單元U1~U6,而將可描繪之曝光區域之Y方向之寬度擴寬至180~360mm左右。再者,各描繪線SLn(SL1~SL6)之長度(描繪範圍之長度)原則上設為相同。即,沿著描繪線SL1~SL6之各者進行掃描之光束LBn之點光SP之掃描距離原則上設為相同。 In this way, the plurality of drawing units Un (U1 to U6) share the scanning area in the Y direction (division of the main scanning area) in a manner that all covers the size of the exposure area on the substrate P in the width direction. For example, if the main scanning range (length of the drawing line SLn) in the Y direction of one drawing unit Un is set to about 30-60 mm, a total of 6 drawing units U1 to U6 in the Y direction will be able to be drawn. The width of the exposure area in the Y direction is expanded to about 180~360mm. In addition, the length of each drawing line SLn (SL1 to SL6) (the length of the drawing range) is set to be the same in principle. That is, the scanning distance of the spot light SP of the light beam LBn scanning along each of the drawing lines SL1 to SL6 is set to be the same in principle.

於本實施形態中,當來自光源裝置LS之光束LB為發光時間為數十微微秒以下之脈衝光時,於主掃描期間投射至描繪線SLn上之點光SP根據光束LB之振盪頻率Fa(例如400MHz)而離散。因此,必須使藉由光束LB之1脈衝光而投射之點光SP與藉由接下來之1脈衝光而投射之點光SP於主掃描方向重疊。該 重疊之量係根據點光SP之大小Φ、點光SP之掃描速度(主掃描之速度)Vs、及光束LB之振盪頻率Fa而設定。於點光SP之強度分佈以高斯分佈近似之情形時,點光SP之有效大小(直徑)Φ由成為點光SP之波峰強度之1/e2(或1/2)之強度的寬度尺寸決定。於本實施形態中,以點光SP相對於有效大小(尺寸)Φ而言重疊Φ×1/2左右之方式,設定點光SP之掃描速度Vs(多面鏡PM之旋轉速度)及振盪頻率Fa。因此,脈衝狀之點光SP之沿著主掃描方向之投射間隔成為Φ/2。因此,較理想為以於副掃描方向(與描繪線SLn正交之方向)上,於沿著描繪線SLn之點光SP之1次掃描與下一次掃描之間,基板P亦移動點光SP之有效大小Φ之大致1/2之距離的方式設定。進而,較理想為於使在Y方向上相鄰之描繪線SLn於主掃描方向上連續之情形時,亦使其重疊Φ/2。於本實施形態中,將點光SP之大小(尺寸)Φ設為3~4μm左右。 In this embodiment, when the light beam LB from the light source device LS is pulsed light with a light emission time of tens of picoseconds or less, the spot light SP projected on the drawing line SLn during the main scanning period is based on the oscillation frequency Fa( For example, 400MHz) and discrete. Therefore, it is necessary to overlap the spot light SP projected by one pulse light of the light beam LB and the spot light SP projected by the next pulse light in the main scanning direction. The amount of overlap is set according to the size Φ of the spot light SP, the scanning speed of the spot light SP (the speed of the main scanning) Vs, and the oscillation frequency Fa of the light beam LB. When the intensity distribution of the spot light SP is approximated by a Gaussian distribution, the effective size (diameter) Φ of the spot light SP is determined by the width of the intensity that becomes 1/e 2 (or 1/2) of the peak intensity of the spot light SP . In this embodiment, the scanning speed Vs (rotation speed of the polygon mirror PM) and the oscillation frequency Fa of the spot light SP are set such that the spot light SP overlaps Φ×1/2 with respect to the effective size (size) Φ. . Therefore, the projection interval of the pulse-shaped spot light SP along the main scanning direction becomes Φ/2. Therefore, it is preferable that in the sub-scanning direction (direction orthogonal to the drawing line SLn), the substrate P also moves the spot light SP between the first scan and the next scan of the spot light SP along the drawing line SLn The effective size Φ is approximately 1/2 of the distance. Furthermore, it is more desirable to also overlap Φ/2 when the drawing lines SLn adjacent in the Y direction are continuous in the main scanning direction. In this embodiment, the size (dimension) Φ of the spot light SP is set to approximately 3 to 4 μm.

各描繪單元Un(U1~U6)係以於XZ平面內觀察時,各光束LBn朝向旋轉筒DR之中心軸AXo行進之方式設定。藉此,自各描繪單元Un(U1~U6)朝向基板P行進之光束LBn之光路(光束主光線)於XZ平面與基板P之被照射面之法線平行。又,自各描繪單元Un(U1~U6)照射至描繪線SLn(SL1~SL6)之光束LBn係以相對於呈圓筒面狀彎曲之基板P之表面之描繪線SLn處的切面始終垂直之方式朝向基板P投射。即,於點光SP之主掃描方向上,投射至基板P之光束LBn(LB1~LB6)以遠心之狀態進行掃描。 Each drawing unit Un (U1~U6) is set in such a way that when viewed in the XZ plane, each light beam LBn travels toward the central axis AXo of the rotating drum DR. Thereby, the optical path of the light beam LBn (beam chief ray) traveling from each drawing unit Un (U1 to U6) toward the substrate P is parallel to the normal line of the illuminated surface of the substrate P on the XZ plane. In addition, the light beam LBn irradiated from each drawing unit Un (U1~U6) to the drawing line SLn (SL1~SL6) is always perpendicular to the cutting plane at the drawing line SLn of the surface of the substrate P curved in a cylindrical shape. Projected toward the substrate P. That is, in the main scanning direction of the spot light SP, the light beams LBn (LB1 to LB6) projected to the substrate P are scanned in a telecentric state.

圖1所示之描繪單元(光束掃描裝置)Un成為相同構成,故而僅簡單地說明描繪單元U1。描繪單元U1之詳細構成將於下文參照圖2進行說明。描繪單元U1至少具備反射鏡M20~M24、多面鏡PM、及fθ透鏡系統(描繪用掃描透鏡)FT。再者,於圖1中,雖然未圖示,但自光束LB1之行進方向觀察,於多面鏡PM之近前配置有第1柱面透鏡CYa(參照圖2),於fθ透鏡系統FT之後設置有第2柱面透鏡CYb(參照圖2)。藉由第1柱面透鏡CYa與第2柱面透鏡CYb而修 正由多面鏡PM之各反射面之傾斜誤差所致之點光SP(描繪線SL1)之朝副掃描方向之位置變動。 The drawing unit (beam scanning device) Un shown in FIG. 1 has the same configuration, so only the drawing unit U1 will be briefly described. The detailed structure of the drawing unit U1 will be described below with reference to FIG. 2. The drawing unit U1 includes at least mirrors M20 to M24, a polygon mirror PM, and an fθ lens system (scanning lens for drawing) FT. Furthermore, in FIG. 1, although not shown, when viewed from the traveling direction of the light beam LB1, a first cylindrical lens CYa (refer to FIG. 2) is arranged in front of the polygon mirror PM, and a first cylindrical lens CYa (refer to FIG. 2) is arranged behind the fθ lens system FT. The second cylindrical lens CYb (refer to FIG. 2). The first cylindrical lens CYa and the second cylindrical lens CYb correct the positional change of the spot light SP (drawing line SL1) in the sub-scanning direction caused by the tilt error of each reflecting surface of the polygon mirror PM.

由入射鏡IM1朝-Z方向反射之光束LB1入射至設置於描繪單元U1內之反射鏡M20,於反射鏡M20反射之光束LB1朝-X方向行進並入射至反射鏡M21。利用反射鏡M21朝-Z方向反射之光束LB1入射至反射鏡M22,於反射鏡M22反射之光束LB1朝+X方向行進並入射至反射鏡M23。反射鏡M23將入射之光束LB1以朝向多面鏡PM之反射面RP於與XY平面平行之面內彎折之方式反射。 The light beam LB1 reflected by the incident mirror IM1 in the -Z direction is incident on the mirror M20 arranged in the drawing unit U1, and the light beam LB1 reflected by the mirror M20 travels in the -X direction and is incident on the mirror M21. The light beam LB1 reflected in the -Z direction by the mirror M21 enters the mirror M22, and the light beam LB1 reflected in the mirror M22 travels in the +X direction and enters the mirror M23. The reflecting mirror M23 reflects the incident light beam LB1 in a way that the reflecting surface RP of the polygon mirror PM is bent in a plane parallel to the XY plane.

多面鏡PM將所入射之光束LB1反射向fθ透鏡系統FT朝+X方向側。多面鏡PM為使光束LB1之點光SP於基板P之被照射面上進行掃描,而使入射之光束LB1於與XY平面平行之面內一維地偏向(反射)。具體而言,多面鏡(旋轉多面鏡、可動偏向構件)PM係具有於Z軸方向上延伸之旋轉軸AXp、及形成於旋轉軸AXp之周圍之複數個反射面RP(本實施形態中將反射面RP之數量Np設為8)之旋轉多面鏡。可藉由使該多面鏡PM以旋轉軸AXp為中心朝既定之旋轉方向旋轉,而使照射至反射面之脈衝狀之光束LB1之反射角連續地變化。藉此,可藉由1個反射面RP使光束LB1偏向,而使照射至基板P之被照射面上之光束LB1之點光SP沿著主掃描方向(基板P之寬度方向、Y方向)進行掃描。因此,於多面鏡PM旋轉1圈中,點光SP於基板P之被照射面上掃描之描繪線SL1之數量最大為與反射面RP之數量相同之8條。 The polygon mirror PM reflects the incident light beam LB1 toward the +X direction side of the fθ lens system FT. The polygon mirror PM scans the spot light SP of the light beam LB1 on the illuminated surface of the substrate P, and deflects (reflects) the incident light beam LB1 one-dimensionally in a plane parallel to the XY plane. Specifically, the polygon mirror (rotating polygon mirror, movable deflection member) PM has a rotation axis AXp extending in the Z-axis direction, and a plurality of reflection surfaces RP formed around the rotation axis AXp (in this embodiment, the reflection The number Np of the surface RP is set to 8) the rotating polygon mirror. By rotating the polygon mirror PM in a predetermined rotation direction with the rotation axis AXp as the center, the reflection angle of the pulse-shaped light beam LB1 irradiated on the reflecting surface can be continuously changed. Thereby, the light beam LB1 can be deflected by one reflecting surface RP, and the spot light SP of the light beam LB1 irradiated on the irradiated surface of the substrate P along the main scanning direction (the width direction of the substrate P, the Y direction) scanning. Therefore, in one rotation of the polygon mirror PM, the number of drawing lines SL1 scanned by the spot light SP on the illuminated surface of the substrate P is at most 8 the same as the number of the reflecting surface RP.

fθ透鏡系統(掃描系統透鏡、掃描用光學系統)FT係將由多面鏡PM反射之光束LB1投射至反射鏡M24之遠心系統之掃描透鏡。透過fθ透鏡系統FT之光束LB1透過反射鏡M24成為點光SP並投射至基板P上。此時,反射鏡M24係以於XZ平面內光束LB1朝向旋轉筒DR之中心軸AXo行進之方式,將光束LB1反射向基板P。光束LB1之朝fθ透鏡系統FT之入射角θ係根據多面鏡PM之旋轉角(θ/2)而變化。fθ透鏡系統FT係透過反射鏡M24而將光束LB1投射至與該入射角 θ成比例之基板P之被照射面上之像高位置。若將fθ透鏡系統FT之焦點距離設為fo,將像高位置設為yo,則fθ透鏡系統FT被設計成滿足yo=fo×θ之關係(畸變像差)。因此,可藉由該fθ透鏡系統FT而使光束LB1於Y方向上準確地勻速進行掃描。再者,入射至fθ透鏡系統FT之光束LB1藉由多面鏡PM而一維地偏向之面(與XY平面平行)成為包含fθ透鏡系統FT之光軸AXf之面。 The fθ lens system (scanning system lens, scanning optical system) FT is a scanning lens of the telecentric system that projects the light beam LB1 reflected by the polygon mirror PM to the mirror M24. The light beam LB1 that has passed through the fθ lens system FT passes through the mirror M24 to become a spot light SP and is projected onto the substrate P. At this time, the mirror M24 reflects the light beam LB1 toward the substrate P in a manner that the light beam LB1 travels toward the central axis AXo of the rotating drum DR in the XZ plane. The incident angle θ of the light beam LB1 toward the fθ lens system FT changes according to the rotation angle (θ/2) of the polygon mirror PM. The fθ lens system FT transmits the mirror M24 to project the light beam LB1 to the image height position on the illuminated surface of the substrate P proportional to the incident angle θ. If the focal distance of the fθ lens system FT is set to fo and the image height position is set to yo, the fθ lens system FT is designed to satisfy the relationship of yo=fo×θ (distortion aberration). Therefore, the light beam LB1 can be accurately scanned in the Y direction at a uniform speed by the fθ lens system FT. Furthermore, the surface (parallel to the XY plane) to which the light beam LB1 incident to the fθ lens system FT is one-dimensionally deflected by the polygon mirror PM becomes a surface including the optical axis AXf of the fθ lens system FT.

其次,參照圖2、圖3對描繪單元Un(U1~U6)之光學構成進行說明。如圖2所示,於描繪單元Un內,沿著自光束LBn之入射位置至被照射面(基板P)為止之光束LBn之行進方向設置有反射鏡M20、反射鏡M20a、偏振分光鏡BSd、反射鏡M21、反射鏡M22、第1柱面透鏡CYa、反射鏡M23、多面鏡PM、fθ透鏡系統FT、反射鏡M24及第2柱面透鏡CYb。進而,於描繪單元Un內,為檢測描繪單元Un之可開始描繪之時序(點光SP之掃描開始時序),如圖3所示般設置有作為偵測多面鏡PM之各反射面之角度位置之原點感測器(原點檢測器)的光束送光部60a及光束受光部60b(光電檢測器)。原點感測器(光束送光部60a、光束受光部60b)之構成將於下文詳細地進行說明。又,於描繪單元Un內設置有光檢測器DTc,該光檢測器DTc用於透過fθ透鏡系統FT、多面鏡PM、及偏振分光鏡BSd等而檢測於基板P之被照射面(或旋轉筒DR之表面)反射之光束LBn之反射光。 Next, the optical configuration of the drawing unit Un (U1 to U6) will be described with reference to FIGS. 2 and 3. As shown in FIG. 2, in the drawing unit Un, a mirror M20, a mirror M20a, a polarization beam splitter BSd, and a mirror M20, a mirror M20a, a polarization beam splitter BSd, The reflecting mirror M21, the reflecting mirror M22, the first cylindrical lens CYa, the reflecting mirror M23, the polygon mirror PM, the fθ lens system FT, the reflecting mirror M24, and the second cylindrical lens CYb. Furthermore, in the drawing unit Un, in order to detect the drawing start timing of the drawing unit Un (the scanning start timing of the spot light SP), as shown in FIG. 3, the angular position of each reflecting surface of the detecting polygon mirror PM is provided. The origin sensor (origin detector) of the light beam transmitting part 60a and the light beam receiving part 60b (photodetector). The structure of the origin sensor (the beam transmitting part 60a and the beam receiving part 60b) will be described in detail below. In addition, a photodetector DTc is provided in the drawing unit Un. The photodetector DTc is used to detect the irradiated surface (or rotating drum) of the substrate P through the fθ lens system FT, the polygon mirror PM, and the polarization beam splitter BSd. The surface of the DR) the reflected light of the reflected light beam LBn.

入射至描繪單元Un之光束LBn沿著與Z軸平行之光軸AX1朝-Z方向行進,且入射至相對於XY平面傾斜45°之反射鏡M20。於反射鏡M20反射之光束LBn朝向自反射鏡M20朝-X方向遠離之反射鏡M20a並朝-X方向行進。反射鏡M20a相對於YZ平面傾斜45°而配置,且將所入射之光束LBn朝向偏振分光鏡BSd朝-Y方向反射。偏振分光鏡BSd之偏振分離面相對於YZ平面傾斜45°而配置,且將P偏光之光束反射,並使朝與P偏光正交之方向偏光之直線偏光(S偏光)之光束透過。若將入射至描繪單元Un之光束LBn設為P偏光之光束,則偏振分光鏡BSd 將來自反射鏡M20a之光束LBn朝-X方向反射並引導至反射鏡M21側。反射鏡M21相對於XY平面傾斜45°而配置,將所入射之光束LBn朝向自反射鏡M21朝-Z方向遠離之反射鏡M22朝-Z方向反射。由反射鏡M21反射之光束LBn入射至反射鏡M22。反射鏡M22相對於XY平面傾斜45°而配置,將所入射之光束LBn朝向反射鏡M23並朝+X方向反射。於反射鏡M22反射之光束LBn透過未圖示之λ/4波長板及柱面透鏡CYa而入射至反射鏡M23。反射鏡M23將所入射之光束LBn反射向多面鏡PM。 The light beam LBn incident on the drawing unit Un travels in the -Z direction along the optical axis AX1 parallel to the Z axis, and is incident on the mirror M20 inclined by 45° with respect to the XY plane. The light beam LBn reflected by the mirror M20 moves toward the mirror M20a away from the mirror M20 in the -X direction and travels in the -X direction. The mirror M20a is arranged at an angle of 45° with respect to the YZ plane, and reflects the incident light beam LBn toward the polarization beam splitter BSd in the -Y direction. The polarization separation surface of the polarization beam splitter BSd is arranged at an angle of 45° with respect to the YZ plane, and reflects the P-polarized light beam and transmits the linearly polarized (S-polarized light) light beam that is polarized in the direction orthogonal to the P polarization. If the light beam LBn incident on the drawing unit Un is set as a P-polarized light beam, the polarization beam splitter BSd reflects the light beam LBn from the mirror M20a in the -X direction and guides it to the mirror M21 side. The mirror M21 is arranged at an angle of 45° with respect to the XY plane, and reflects the incident light beam LBn in the -Z direction toward the mirror M22 that is away from the mirror M21 in the -Z direction. The light beam LBn reflected by the mirror M21 is incident on the mirror M22. The mirror M22 is arranged at an angle of 45° with respect to the XY plane, and the incident light beam LBn is directed toward the mirror M23 and reflected in the +X direction. The light beam LBn reflected by the mirror M22 passes through the λ/4 wave plate and the cylindrical lens CYa (not shown), and is incident on the mirror M23. The mirror M23 reflects the incident light beam LBn to the polygon mirror PM.

多面鏡PM將所入射之光束LBn朝向具有與X軸平行之光軸AXf之fθ透鏡系統FT朝+X方向側反射。多面鏡PM為使光束LBn之點光SP於基板P之被照射面上進行掃描,而使入射之光束LBn於與XY平面平行之面內一維地偏向(反射)。多面鏡PM具有形成於在Z軸方向上延伸之旋轉軸AXp之周圍之複數個反射面(本實施形態中為正八邊形之各邊),且藉由與旋轉軸AXp同軸之旋轉馬達RM而旋轉。旋轉馬達RM係藉由未圖示之描繪控制裝置而以固定之旋轉速度(例如3萬~4萬rpm左右)旋轉。如上文所作說明般,描繪線SLn(SL1~SL6)之有效長度(例如50mm)被設定為可藉由該多面鏡PM使點光SP進行掃描之最大掃描長度(例如52mm)以下之長度,就初始設定(設計上)而言,於最大掃描長度之中央設定有描繪線SLn之中心點(fθ透鏡系統FT之光軸AXf通過之點)。 The polygon mirror PM reflects the incident light beam LBn toward the fθ lens system FT having an optical axis AXf parallel to the X axis toward the +X direction side. The polygon mirror PM scans the spot light SP of the light beam LBn on the illuminated surface of the substrate P, and deflects (reflects) the incident light beam LBn one-dimensionally in a plane parallel to the XY plane. The polygon mirror PM has a plurality of reflecting surfaces (each side of the regular octagon in this embodiment) formed around the rotation axis AXp extending in the Z-axis direction, and is formed by the rotation motor RM coaxial with the rotation axis AXp Spin. The rotation motor RM is rotated at a fixed rotation speed (for example, about 30,000 to 40,000 rpm) by a drawing control device not shown. As explained above, the effective length (for example, 50mm) of the drawing lines SLn (SL1~SL6) is set to a length below the maximum scanning length (for example, 52mm) that can be scanned by the polygon mirror PM. In the initial setting (design), the center point of the drawing line SLn (the point through which the optical axis AXf of the fθ lens system FT passes) is set at the center of the maximum scanning length.

柱面透鏡CYa於與利用多面鏡PM之主掃描方向(旋轉方向)正交之副掃描方向(Z方向)上,將所入射之光束LBn收斂於多面鏡PM之反射面上。即,柱面透鏡CYa將光束LBn於多面鏡PM之反射面上收斂成於與XY平面平行之方向上延伸之狹縫狀(長橢圓狀)。藉由母線與Y方向平行之柱面透鏡CYa、及下述柱面透鏡CYb,即便於多面鏡PM之反射面自與Z軸平行之狀態傾斜之情形時,亦可抑制照射至基板P之被照射面上之光束LBn(描繪線SLn)之照射位置於副掃描方向上偏移。 The cylindrical lens CYa converges the incident light beam LBn on the reflecting surface of the polygon mirror PM in the sub-scanning direction (Z direction) orthogonal to the main scanning direction (rotation direction) of the polygon mirror PM. That is, the cylindrical lens CYa converges the light beam LBn on the reflecting surface of the polygon mirror PM into a slit shape (oblong shape) extending in a direction parallel to the XY plane. With the cylindrical lens CYa whose generatrix is parallel to the Y direction and the cylindrical lens CYb described below, even when the reflecting surface of the polygon mirror PM is tilted from the state parallel to the Z axis, the substrate P can be prevented from being irradiated The irradiation position of the light beam LBn (drawing line SLn) on the irradiation surface is shifted in the sub-scanning direction.

光束LBn之朝fθ透鏡系統FT之入射角θ(相對於光軸AXf之角度)係根據多面鏡PM之旋轉角(θ/2)而變化。於光束LBn之朝fθ透鏡系統FT之入射角θ為0度時,入射至fθ透鏡系統FT之光束LBn沿著光軸AXf上行進。來自fθ透鏡系統FT之光束LBn由反射鏡M24朝-Z方向反射,透過柱面透鏡CYb而朝基板P投射。藉由fθ透鏡系統FT及母線與Y方向平行之柱面透鏡CYb,投射至基板P之光束LBn於基板P之被照射面上收斂成直徑為數μm左右(例如3~4μm)之微小之點光SP。如上所述,於XZ平面內觀察時,入射至描繪單元Un之光束LBn沿著自反射鏡M20至基板P為止呈

Figure 106134123-A0202-12-0019-19
字狀彎曲之光路彎折,且朝-Z方向行進並投射至基板P。一面使6個描繪單元U1~U6之各者將光束LB1~LB6之各點光SP於主掃描方向(Y方向)上一維地進行掃描,一面將基板P於長條方向上進行搬送,藉此,利用點光SP將基板P之被照射面相對地進行二維掃描,於基板P上使利用描繪線SL1~SL6之各者所描繪之圖案以於Y方向上接合之狀態曝光。 The incident angle θ of the light beam LBn toward the fθ lens system FT (the angle relative to the optical axis AXf) changes according to the rotation angle (θ/2) of the polygon mirror PM. When the incident angle θ of the light beam LBn toward the fθ lens system FT is 0 degrees, the light beam LBn incident on the fθ lens system FT travels along the optical axis AXf. The light beam LBn from the fθ lens system FT is reflected by the mirror M24 in the -Z direction, passes through the cylindrical lens CYb, and is projected toward the substrate P. With the fθ lens system FT and the cylindrical lens CYb whose generatrix is parallel to the Y direction, the light beam LBn projected to the substrate P converges on the illuminated surface of the substrate P into a tiny spot light with a diameter of about several μm (for example, 3~4 μm) SP. As described above, when viewed in the XZ plane, the light beam LBn incident on the drawing unit Un follows from the mirror M20 to the substrate P.
Figure 106134123-A0202-12-0019-19
The curved light path in the shape of a letter is bent, travels in the -Z direction and is projected onto the substrate P. While allowing each of the six drawing units U1 to U6 to scan each spot light SP of the beams LB1 to LB6 one-dimensionally in the main scanning direction (Y direction), while conveying the substrate P in the longitudinal direction, Here, the illuminated surface of the substrate P is relatively scanned two-dimensionally by the spot light SP, and the pattern drawn by each of the drawing lines SL1 to SL6 is exposed on the substrate P in a state of being joined in the Y direction.

作為一例,於將描繪線SLn(SL1~SL6)之有效掃描長度LT設為50mm,將點光SP之有效直徑Φ設為4μm,將來自光源裝置LS之光束LB之脈衝發光之振盪頻率Fa設為400MHz,沿著描繪線SLn(主掃描方向)使點光SP以每次重疊直徑Φ之1/2之方式脈衝發光之情形時,點光SP之脈衝發光之主掃描方向之間隔於基板P上成為2μm,該間隔對應於振盪頻率Fa之週期Tf(=1/Fa)即2.5nS(1/400MHz)。又,於此情形時,描繪資料上所規定之像素大小Pxy於基板P上被設定為4μm見方,於主掃描方向與副掃描方向之各者以點光SP之2脈衝量曝光1像素。因此,點光SP之主掃描方向之掃描速度Vsp與振盪頻率Fa被設定為Vsp=(Φ/2)/Tf之關係。另一方面,掃描速度Vsp係基於多面鏡PM之旋轉速度VR(rpm)、有效掃描長度LT、多面鏡PM之反射面之數量Np(=8)、及多面鏡PM之1個反射面RP之掃描效率1/α,以如下方式決定。 As an example, the effective scanning length LT of the drawing line SLn (SL1~SL6) is set to 50mm, the effective diameter Φ of the spot light SP is set to 4μm, and the oscillation frequency Fa of the pulse emission of the light beam LB from the light source device LS is set to For 400MHz, when the spot light SP is pulsed along the drawing line SLn (main scanning direction) in a manner that overlaps 1/2 of the diameter Φ each time, the pulse light emission of the spot light SP is separated from the substrate P in the main scanning direction The upper part becomes 2 μm, and this interval corresponds to the period Tf (=1/Fa) of the oscillation frequency Fa, that is, 2.5 nS (1/400 MHz). In this case, the pixel size Pxy specified on the drawing data is set to a 4 μm square on the substrate P, and one pixel is exposed with 2 pulses of the spot light SP in each of the main scanning direction and the sub scanning direction. Therefore, the scanning speed Vsp in the main scanning direction of the spot light SP and the oscillation frequency Fa are set to a relationship of Vsp=(Φ/2)/Tf. On the other hand, the scanning speed Vsp is based on the rotation speed VR (rpm) of the polygon mirror PM, the effective scanning length LT, the number of reflection surfaces of the polygon mirror PM Np (=8), and one reflection surface RP of the polygon mirror PM. The scanning efficiency 1/α is determined as follows.

Vsp=(8.α.VR.LT)/60[mm/sec] Vsp=(8.α.VR.LT)/60[mm/sec]

因此,振盪頻率Fa與旋轉速度VR(rpm)被設定為以下關係。 Therefore, the oscillation frequency Fa and the rotation speed VR (rpm) are set in the following relationship.

(Φ/2)/Tf=(8.α.VR.LT)/60…式(1) (Φ/2)/Tf=(8.α.VR.LT)/60...Equation (1)

於將振盪頻率Fa設為400MHz(Tf=2.5nS),將點光SP之直徑Φ設為4μm時,根據振盪頻率Fa而規定之掃描速度Vsp成為0.8μm/nS(=2μm/2.5nS)。為應對該掃描速度Vsp,於將掃描效率1/α設為0.3(α≒3.33),且將掃描長度LT設為50mm時,根據式(1)之關係,只要將8面之多面鏡PM之旋轉速度VR設定為36000rpm便可。再者,該情形時之掃描速度Vsp=0.8μm/nS若換算為時速則為2880Km/h。如此,若掃描速度Vsp成為高速,則亦必須提高來自決定圖案之描繪開始時序之原點感測器(光束送光部60a與光束受光部60b)之原點訊號之產生時序的再現性。例如,於將1像素之大小設為4μm,將應描繪之圖案之最小尺寸(最小線寬)設為8μm(相當於2像素之量)時,於已形成於基板P上之圖案重疊曝光新圖案之二次曝光時之重疊精度(所容許之位置誤差之範圍)必須設為最小線寬之1/4~1/5左右。即,於最小線寬為8μm之情形時,位置誤差之容許範圍成為2μm~1.6μm。該值為與來自光源裝置LS之光束LB之振盪週期Tf(2.5nS)對應之點光SP之2脈衝量之間隔以下,且意味著不容許點光SP之1脈衝量之誤差。因此,決定圖案之描繪開始時序(開始位置)之原點訊號之產生時序的再現性必須設定為週期Tf(2.5nS)以下。 When the oscillation frequency Fa is set to 400 MHz (Tf=2.5nS) and the diameter Φ of the spot light SP is set to 4 μm, the scanning speed Vsp prescribed by the oscillation frequency Fa becomes 0.8 μm/nS (=2 μm/2.5nS). In order to cope with the scanning speed Vsp, when the scanning efficiency 1/α is set to 0.3 (α≒3.33) and the scanning length LT is set to 50mm, according to the relationship of formula (1), only the 8-sided polygon mirror PM The rotation speed VR can be set to 36000rpm. Furthermore, the scanning speed Vsp=0.8μm/nS in this case is 2880Km/h if converted to a speed per hour. In this way, if the scanning speed Vsp becomes high, it is necessary to improve the reproducibility of the origin signal generation timing from the origin sensor (the light beam transmitting portion 60a and the light beam receiving portion 60b) that determines the start timing of the drawing of the pattern. For example, when the size of 1 pixel is set to 4μm, and the minimum size (minimum line width) of the pattern to be drawn is set to 8μm (equivalent to the amount of 2 pixels), the pattern that has been formed on the substrate P is overlapped and exposed to a new The overlap accuracy (the allowable position error range) of the pattern during the second exposure must be set to about 1/4~1/5 of the minimum line width. That is, when the minimum line width is 8μm, the allowable range of position error becomes 2μm~1.6μm. This value is equal to or less than the interval of 2 pulses of the spot light SP corresponding to the oscillation period Tf (2.5 nS) of the light beam LB from the light source device LS, and means that the error of 1 pulse of the spot light SP is not allowed. Therefore, the reproducibility of the generation timing of the origin signal that determines the drawing start timing (start position) of the pattern must be set to the period Tf (2.5nS) or less.

圖3係於與XY平面平行之面內觀察描繪單元Un內之多面鏡PM、fθ透鏡系統FT之光軸AXf、構成原點感測器之光束送光部60a、及光束受光部60b等之配置而得之圖。於圖3中,朝向多面鏡PM之反射面RP中之1個反射面RPa投射描繪用光束LBn,朝多面鏡PM之反射面RPa之1個相鄰(前1個)之反射面RPb投射來自光束送光部60a之雷射光束(原點檢測用光束、檢測用光束)Bga。又,圖3中之反射面RPa之角度位置係表示描繪用光束LBn之點光SP即將位於描繪線SLn之描繪開始點之前之狀態。此處,多面鏡PM之反射面RP(RPa)係以 位於與fθ透鏡系統FT之光軸AXf正交之入射瞳面之方式配置。嚴格而言,於入射至fθ透鏡系統FT之光束LBn之主光線成為與光軸AXf同軸之瞬間之反射面RP(RPa)的角度位置,於自反射鏡M23朝向多面鏡PM之光束LBn之主光線與光軸AXf交叉之位置設定反射面RP(RPa)。又,自fθ透鏡系統FT之主面至基板P之表面(點光SP之聚光點)為止之距離為焦點距離fo。 Fig. 3 is to observe the polygon mirror PM in the drawing unit Un, the optical axis AXf of the fθ lens system FT, the beam transmitting part 60a and the beam receiving part 60b constituting the origin sensor in a plane parallel to the XY plane Figure obtained from configuration. In Fig. 3, the drawing beam LBn is projected toward one of the reflective surfaces RP of the polygon mirror PM, and the light beam LBn is projected toward one of the reflective surfaces RPa of the polygon mirror PM. The laser beam (beam for origin detection, beam for detection) Bga of the beam transmitting unit 60a. In addition, the angular position of the reflective surface RPa in FIG. 3 indicates a state where the point light SP of the drawing light beam LBn is located immediately before the drawing start point of the drawing line SLn. Here, the reflecting surface RP (RPa) of the polygon mirror PM is arranged so as to be located on the entrance pupil surface orthogonal to the optical axis AXf of the fθ lens system FT. Strictly speaking, the principal ray of the light beam LBn incident on the fθ lens system FT becomes the angular position of the reflective surface RP (RPa) at the moment when it is coaxial with the optical axis AXf, and the principal ray of the light beam LBn from the mirror M23 toward the polygon mirror PM The position where the light crosses the optical axis AXf sets the reflecting surface RP (RPa). In addition, the distance from the main surface of the fθ lens system FT to the surface of the substrate P (the condensing point of the spot light SP) is the focal distance fo.

來自光束送光部60a之雷射光束Bga係作為對基板P之感光性功能層為非感光性之波長區域之平行光束而被投射至多面鏡PM之反射面RPb。於反射面RPb反射之雷射光束Bga之反射光束Bgb朝向具有與XY平面垂直之反射面之反射鏡(光束反射部)MRa。於反射鏡MRa反射之光束Bgb之反射光束Bgc被再次朝向多面鏡PM之反射面RPb投射。於反射面RPb反射之光束Bgc之反射光束Bgd被光束受光部60b接收。光束受光部60b係於多面鏡PM之反射面RPb(及其他各反射面RP)在與XY平面平行之面(XY面)內成為特定之角度位置之瞬間,使光束Bga、Bgb、Bgc、Bgd如圖3般行進,光束受光部60b輸出呈脈衝狀發生波形變化之原點訊號SZn。於圖3中,將光束Bga簡單地表示為線,但實際上,為使其成為於XY面內在多面鏡PM之反射面RP之旋轉方向上具有既定之寬度之平行光束,光束送光部60a具有半導體雷射光源及準直透鏡。同樣地,於圖3中將光束Bgd簡單地表示為線,但實際上成為於XY面內具有既定之寬度之平行光束,光束Bgd相應於多面鏡PM之旋轉而對光束受光部60b如箭頭Aw般進行掃描。因此,光束受光部60b具有:光電轉換元件,其於接收光束Bgd時輸出原點訊號SZn;及聚光透鏡,其將光束Bgd於光電轉換元件之受光面上聚光為光點。 The laser beam Bga from the beam transmitting portion 60a is projected to the reflective surface RPb of the polygon mirror PM as a parallel beam of a wavelength region that is non-photosensitive to the photosensitive functional layer of the substrate P. The reflected beam Bgb of the laser beam Bga reflected on the reflective surface RPb faces the mirror (beam reflection part) MRa having a reflective surface perpendicular to the XY plane. The reflected light beam Bgc of the light beam Bgb reflected by the mirror MRa is again projected toward the reflection surface RPb of the polygon mirror PM. The reflected light beam Bgd of the light beam Bgc reflected on the reflective surface RPb is received by the light beam receiving portion 60b. The light beam receiving portion 60b is located at the moment when the reflecting surface RPb (and other reflecting surfaces RP) of the polygon mirror PM becomes a specific angular position in the plane parallel to the XY plane (XY plane), so that the light beams Bga, Bgb, Bgc, Bgd As shown in Fig. 3, the light beam receiving unit 60b outputs an origin signal SZn that changes in a pulse shape. In FIG. 3, the light beam Bga is simply expressed as a line, but in fact, in order to make it a parallel light beam having a predetermined width in the XY plane in the rotation direction of the reflecting surface RP of the polygon mirror PM, the light beam transmitting section 60a With semiconductor laser light source and collimating lens. Similarly, in Fig. 3, the light beam Bgd is simply expressed as a line, but actually becomes a parallel light beam having a predetermined width in the XY plane. The light beam Bgd responds to the rotation of the polygon mirror PM and responds to the light beam receiving portion 60b as an arrow Aw Normally scan. Therefore, the light beam receiving portion 60b has: a photoelectric conversion element, which outputs the origin signal SZn when receiving the light beam Bgd; and a condenser lens, which condenses the light beam Bgd on the light receiving surface of the photoelectric conversion element into a light spot.

圖4係表示設置於光束受光部60b之光電轉換元件(光電檢測器)DTo之詳細構成,於本實施形態中例如使用Hamamatsu Photonics股份有限公司製造之作為雷射光束同步檢測用光電IC銷售之S9684系列。該光電IC係如圖4般將於利用聚光透鏡聚光而得之光束Bgd之點光SPr之掃描方向上隔著狹窄之間隙 (不感帶)而排列之2個PIN光電二極體之受光面PD1、PD2、電流放大部IC1、IC2、及比較器部IC3封裝成一體而得者。若如圖3所示之箭頭Aw般使光束Bgd進行掃描,則點光SPr按照受光面PD1、PD2之順序橫穿,電流放大部IC1、IC2之各者產生如圖4(A)所示般之輸出訊號STa、STb。對將來自最初接收點光SPr之受光面PD1之光電流放大的電流放大部IC1施加固定之偏移電壓(基準電壓)Vref,使電流放大部IC1之輸出訊號STa以於受光面PD1產生之光電流為零時成為基準電壓Vref之方式偏壓。如圖4(B)所示,比較器部IC3將輸出訊號STa、STb之位準加以比較,將STa>STb時成為H位準且STa<STb時成為L位準之邏輯訊號輸出作為原點訊號SZn。於本實施形態中,將原點訊號SZn自H位準轉變為L位準之時間點設為原點時刻(原點位置)Tog,所謂原點訊號SZn之產生時序意味著原點時刻Tog。再者,此處之原點位置(原點時刻Tog)例如並非意味著於將fθ透鏡系統FT之光軸AXf所通過之基板P上之點設為基準點時,作為以自該基準點起於點光SP之主掃描方向上始終以固定距離設定於近前之絕對位置的原點,而是相對地表示相對於沿著描繪線SLn之圖案描繪之開始時序的既定距離前(或既定時間前)者。 Fig. 4 shows the detailed structure of the photoelectric conversion element (photodetector) DTo provided in the light beam receiving portion 60b. In this embodiment, for example, S9684 manufactured by Hamamatsu Photonics Co., Ltd. is used as a photoelectric IC for laser beam synchronization detection. series. This photo-IC is the light receiving of two PIN photodiodes arranged in the scanning direction of the spot light SPr of the beam Bgd collected by the condensing lens as shown in Figure 4 with a narrow gap (non-sensitive band). The surface PD1, PD2, the current amplifying parts IC1, IC2, and the comparator part IC3 are packaged as a single unit. If the light beam Bgd is scanned like the arrow Aw shown in FIG. 3, the spot light SPr traverses in the order of the light-receiving surfaces PD1 and PD2, and each of the current amplifying parts IC1 and IC2 generates as shown in FIG. 4(A) The output signal STa, STb. A fixed offset voltage (reference voltage) Vref is applied to the current amplifying part IC1 that amplifies the photocurrent from the light-receiving surface PD1 that first receives the spot light SPr, so that the output signal STa of the current amplifying part IC1 is the light generated on the light-receiving surface PD1 When the current is zero, the bias voltage becomes the reference voltage Vref. As shown in Figure 4(B), the comparator IC3 compares the levels of the output signals STa and STb, and outputs the logic signal that becomes the H level when STa>STb and becomes L when STa<STb is the origin. Signal SZn. In this embodiment, the time point when the origin signal SZn changes from the H level to the L level is the origin time (origin position) Tog, and the so-called generation timing of the origin signal SZn means the origin time Tog. In addition, the origin position (origin time Tog) here does not mean that when the point on the substrate P through which the optical axis AXf of the fθ lens system FT passes is set as the reference point, it is taken as the reference point In the main scanning direction of the spot light SP, it is always set at a fixed distance to the origin of the immediate absolute position, and it represents relatively before a predetermined distance (or before a predetermined time) with respect to the start timing of the pattern drawing along the drawing line SLn )By.

原點時刻Tog成為於輸出訊號STa之位準下降且輸出訊號STb之位準上升之中途,輸出訊號STa、STb之位準一致之瞬間。輸出訊號STa、STb之位準變化(上升或下降之波形)可根據受光面PD1、PD2之寬度尺寸與點光SPr之大小之關係、點光SPr之掃描速度Vh與受光面PD1、PD2之應答性等而變化,但只要點光SPr之直徑大於不感帶之寬度尺寸且小於受光面PD1之寬度尺寸,則輸出訊號STa、STb之各者成為如圖4(A)般之利用位準變化所得之波形,可獲得穩定之原點訊號SZn。 The origin time Tog becomes the moment when the levels of the output signals STa and STb coincide in the middle of the decrease of the level of the output signal STa and the increase of the level of the output signal STb. The level change of the output signal STa, STb (rising or falling waveform) can be based on the relationship between the width of the light receiving surface PD1, PD2 and the size of the spot light SPr, the scanning speed Vh of the spot light SPr and the response of the light receiving surface PD1, PD2 However, as long as the diameter of the spot light SPr is larger than the width of the non-sensitive band and smaller than the width of the light-receiving surface PD1, each of the output signals STa and STb becomes the result of using level changes as shown in Figure 4(A) The waveform can obtain a stable origin signal SZn.

於本實施形態中,如圖3所示,以如下方式構成:利用光電轉換元件DTo接收使用反射鏡MRa使原點檢測用光束Bga在多面鏡PM之反射面RP (RPb)反射2次後之光束Bgd的點光SP。因此,可使受光面PD1、PD2上之點光SPr之掃描速度Vh與使原點檢測用光束Bga於多面鏡PM之反射面RP(RPb)反射1次並利用光電轉換元件DTo接收之情形相比成為2倍以上。藉此,於本實施形態中,與描繪用光束LBn(點光SP)之基板P上之掃描速度Vsp相比,可使光電轉換元件DTo上之原點檢測用光束Bgd(點光SPr)之掃描速度Vh加快為2倍左右,而可使原點訊號SZn之產生時序之再現性良好(使表示偏差之分佈範圍之3σ值變小)。 In the present embodiment, as shown in FIG. 3, it is configured as follows: the light beam Bga for origin detection is reflected twice on the reflecting surface RP (RPb) of the polygon mirror PM using the photoelectric conversion element DTo to receive the mirror MRa. Spot light SP of light beam Bgd. Therefore, the scanning speed Vh of the spot light SPr on the light-receiving surfaces PD1 and PD2 can be made comparable to the case where the origin detection light beam Bga is reflected once on the reflecting surface RP (RPb) of the polygon mirror PM and received by the photoelectric conversion element DTo. The ratio becomes more than twice. Accordingly, in this embodiment, compared with the scanning speed Vsp on the substrate P of the drawing beam LBn (spot light SP), the origin detection beam Bgd (spot light SPr) on the photoelectric conversion element DTo can be The scanning speed Vh is accelerated by about twice, and the reproducibility of the generation timing of the origin signal SZn can be improved (the 3σ value representing the distribution range of the deviation is reduced).

因此,如圖5所示,使用利用光束受光部60b之光電轉換元件DTo接收使原點檢測用光束Bga於多面鏡PM之反射面RP(RPb)反射1次所得之反射光束Bgb的構成,於使描繪用光束LBn之點光SP之掃描速度Vsp與原點檢測用光束Bgb之點光SPr之掃描速度Vh相同之情形時與使點光SPr之掃描速度Vh相對於點光SP之掃描速度Vsp加快為2倍左右之情形時,嘗試比較原點訊號SZn之再現性。 Therefore, as shown in FIG. 5, a configuration in which the photoelectric conversion element DTo of the light beam receiving portion 60b receives the reflected light beam Bgb obtained by reflecting the origin detection light beam Bga on the reflecting surface RP (RPb) of the polygon mirror PM once is used. When the scanning speed Vsp of the spot light SP of the drawing light beam LBn is the same as the scanning speed Vh of the spot light SPr of the origin detection light beam Bgb, the scanning speed Vh of the spot light SPr is relative to the scanning speed Vsp of the spot light SP When the speed is about 2 times, try to compare the reproducibility of the origin signal SZn.

於圖5中,光束送光部60a具備:半導體雷射光源LDo,其連續發出雷射光束Bga;及準直透鏡GLa(具有折射能力之第1光學元件),其使來自該光源之光束Bga成為平行光束。將光束Bga設為於反射面RP(RPb)之旋轉方向(與XY面平行之主掃描方向)上具有某種程度之寬度之平行光束。另一方面,於光束受光部60b中,設置有使反射光束Bgb於與圖4相同之光電轉換元件DTo上聚光為在主掃描方向上收縮得較小之點光SPr之焦點距離Fgs之透鏡系統GLb(具有折射能力之第2光學元件)。圖4所示之光電轉換元件DTo之受光面PD1、PD2配置於透鏡系統GLb之後側之焦點距離Fgs之位置。設定為於在反射面RP(RPb)反射之反射光束Bgb與透鏡系統GLb之光軸同軸地入射時,反射光束Bgb之點光SPr位於光電轉換元件DTo之受光面之大致中央(受光面PD1、PD2間之不感帶)。再者,光束受光部60b係藉由光電轉換元件DTo及透鏡系統GLb而構成用以產生 原點訊號SZn之檢測部。 In FIG. 5, the light beam sending unit 60a includes: a semiconductor laser light source LDo, which continuously emits a laser beam Bga; and a collimator lens GLa (the first optical element with refractive power), which makes the light beam Bga from the light source Become a parallel beam. The light beam Bga is a parallel light beam having a certain width in the rotation direction of the reflecting surface RP (RPb) (the main scanning direction parallel to the XY plane). On the other hand, in the light beam receiving portion 60b, a lens is provided for condensing the reflected light beam Bgb on the photoelectric conversion element DTo which is the same as that in FIG. System GLb (the second optical element with refractive power). The light-receiving surfaces PD1 and PD2 of the photoelectric conversion element DTo shown in FIG. 4 are arranged at the position of the focal distance Fgs behind the lens system GLb. It is set so that when the reflected light beam Bgb reflected on the reflective surface RP (RPb) is incident coaxially with the optical axis of the lens system GLb, the spot light SPr of the reflected light beam Bgb is located approximately in the center of the light-receiving surface of the photoelectric conversion element DTo (light-receiving surface PD1, No sense zone between PD2). Furthermore, the light beam receiving portion 60b is constituted by the photoelectric conversion element DTo and the lens system GLb to form a detection portion for generating the origin signal SZn.

即便當相對於透鏡系統GLb之光軸在主掃描方向上略微傾斜之反射光束Bgb'入射時,反射光束Bgb'亦成為點光SPr而聚光於與光電轉換元件DTo之受光面大致相同之面內。自透鏡系統GLb朝向光電轉換元件DTo之反射光束Bgb'無需為遠心。於如上所述之構成中,若使透鏡系統GLb之焦點距離Fgs與fθ透鏡系統FT之焦點距離fo相同,則描繪用光束LBn之點光SP之掃描速度Vsp與原點檢測用光束Bgb之點光SPr之掃描速度Vh大致相同。又,若使透鏡系統GLb之焦點距離Fgs為fθ透鏡系統FT之焦點距離fo之2倍左右,則使原點檢測用光束Bgb之點光SPr之掃描速度Vh相對於描繪用光束LBn之點光SP之掃描速度Vsp加快為2倍左右。 Even when the reflected light beam Bgb' which is slightly inclined in the main scanning direction with respect to the optical axis of the lens system GLb is incident, the reflected light beam Bgb' becomes a spot light SPr and focuses on the same surface as the light-receiving surface of the photoelectric conversion element DTo Inside. The reflected light beam Bgb′ from the lens system GLb toward the photoelectric conversion element DTo does not need to be telecentric. In the above configuration, if the focal distance Fgs of the lens system GLb is made the same as the focal distance fo of the fθ lens system FT, the scanning speed Vsp of the point light SP of the drawing beam LBn and the point of the origin detection beam Bgb The scanning speed Vh of the light SPr is approximately the same. In addition, if the focal distance Fgs of the lens system GLb is set to be approximately twice the focal distance fo of the fθ lens system FT, the scanning speed Vh of the spot light SPr of the origin detection light beam Bgb is relative to the point light of the drawing light beam LBn The scanning speed Vsp of SP is accelerated by about 2 times.

其次,參照圖6~圖8,說明對來自以圖5之方式構成之原點感測器之原點訊號SZn的產生時序之再現性(偏差誤差)進行測量及運算的方法。該測量或運算可利用總體地控制曝光裝置EX之電腦、或為圖案描繪而控制多面鏡PM之旋轉、來自光源裝置LS之光束LB之相應於描繪資料之脈衝振盪、選擇用光學元件OS1~OS6之切換等之描繪控制裝置之處理器(CPU)等而實施。又,亦可將原點訊號SZn發送至外部之波形測量機器等而實施。圖6係圖1~圖3所示之8面之多面鏡PM之俯視圖,此處,關於8個反射面RP之各者求出如圖4(B)般產生之原點訊號SZn之再現性,故而可將8個反射面RP與多面鏡PM之旋轉方向(順時針方向)反向地設為RPa、RPb、RPc、RPd、RPe、RPf、RPg、RPh。又,於多面鏡PM之上表面(或下表面),形成有用以檢測多面鏡PM之旋轉之原點之旋轉基準標記Mcc。旋轉基準標記Mcc係藉由每當多面鏡PM旋轉1圈時便輸出脈衝狀之檢測訊號之反射型光電感測器(亦稱為轉動檢測感測器)而檢測出。於測量原點訊號SZn之再現性時,必須特定出原點感測器所檢測之多面鏡PM之反射面,故而以來自轉動檢測感測器之檢測訊號(旋轉基準標記Mcc)為基準,特定 出多面鏡PM之各反射面RPa~RPh。 Next, referring to FIGS. 6-8, the method of measuring and calculating the reproducibility (deviation error) of the generation timing of the origin signal SZn from the origin sensor constructed in the manner of FIG. 5 will be described. The measurement or calculation can be performed by a computer that controls the exposure device EX as a whole, or controls the rotation of the polygon mirror PM for pattern drawing, the pulse oscillation of the light beam LB from the light source device LS corresponding to the drawing data, and the optical elements OS1~OS6 for selection. The switching, etc., is implemented by the processor (CPU) of the drawing control device, etc. Moreover, it can also be implemented by sending the origin signal SZn to an external waveform measuring device or the like. Fig. 6 is a plan view of the 8-sided polygon mirror PM shown in Figs. 1 to 3. Here, the reproducibility of the origin signal SZn generated as shown in Fig. 4(B) is obtained for each of the 8 reflecting surfaces RP Therefore, the rotation direction (clockwise) of the eight reflecting surfaces RP and the polygon mirror PM can be reversed to RPa, RPb, RPc, RPd, RPe, RPf, RPg, RPh. In addition, on the upper surface (or lower surface) of the polygon mirror PM, a rotation reference mark Mcc useful for detecting the origin of the rotation of the polygon mirror PM is formed. The rotation reference mark Mcc is detected by a reflection type photoelectric sensor (also called a rotation detection sensor) that outputs a pulse-shaped detection signal every time the polygon mirror PM rotates one turn. When measuring the reproducibility of the origin signal SZn, the reflecting surface of the polygon mirror PM detected by the origin sensor must be specified. Therefore, the detection signal from the rotation detection sensor (rotation reference mark Mcc) is used as the reference to specify Each reflecting surface RPa~RPh of the polygon mirror PM is shown.

進而,於測量原點訊號SZn之產生時序之再現性時,必須考慮由多面鏡PM之速度變動(速度不均)所致之影響。多面鏡PM之速度變動亦可藉由上述轉動檢測感測器而測量,但於本實施形態中,基於原點訊號SZn對多面鏡PM之速度變動進行測量。如上文所例示般,若設為以使多面鏡PM之馬達RM以36000rpm旋轉之方式,利用描繪控制裝置進行伺服控制,則多面鏡PM會於1秒內旋轉600圈,設計上之旋轉1圈之轉動時間TD成為1/600秒(≒1666.667μS)。因此,使用較光源裝置LS用於脈衝發光之振盪頻率Fa高之頻率之時脈脈衝等重複測量自原點訊號SZn中的任一個脈衝之原點時刻Tog進行計數至第9個脈衝之原點時刻Tog為止之實際之轉動時間TD。多面鏡PM伴有慣性地高速旋轉,故而旋轉1圈之過程中產生速度不均之可能性較低,根據伺服控制之特性等,有於數mS~數十mS之週期內設計上之轉動時間TD微妙地變動之情況。 Furthermore, when measuring the reproducibility of the generation timing of the origin signal SZn, the influence caused by the speed variation (speed unevenness) of the polygon mirror PM must be considered. The speed variation of the polygon mirror PM can also be measured by the above-mentioned rotation detection sensor, but in this embodiment, the speed variation of the polygon mirror PM is measured based on the origin signal SZn. As exemplified above, if the motor RM of the polygon mirror PM is set to rotate at 36000 rpm and the drawing control device is used for servo control, the polygon mirror PM will rotate 600 times in 1 second, which is designed to rotate 1 turn The rotation time TD becomes 1/600 second (≒1666.667μS). Therefore, a clock pulse with a higher frequency than the oscillation frequency Fa of the light source device LS for pulsed light emission is used to repeatedly measure the origin time Tog of any pulse in the origin signal SZn and count to the origin of the 9th pulse. The actual rotation time TD until the time Tog. The polygon mirror PM rotates at a high speed with inertia, so the possibility of uneven speed during one rotation is low. According to the characteristics of the servo control, there is a design rotation time within a period of several mS to tens of mS. The situation where the TD changes subtly.

圖7係說明測量原點訊號SZn之產生時序之再現性(偏差)之方法的圖。此處,為簡化說明,例示與圖6所示之多面鏡PM之反射面RPa對應地產生之原點訊號SZn之原點時刻Tog2之再現性的謀求方法,對於其他反射面RPb~RPh之各者亦可同樣地進行測量。於圖6之情形時,於原點時刻Tog2之前一個時序產生之原點時刻Tog1可作為與多面鏡PM之反射面RPh對應地產生之原點訊號SZn而獲得。因此,於使多面鏡PM以規定之速度旋轉之狀態下,多面鏡PM每旋轉1圈便多次(例如10次以上)重複測量自對應於反射面RPh而產生之原點時刻Tog1至對應於下一反射面RPa之原點時刻Tog2為止之原點間隔時間△Tmn(n=1、2、3…之轉動數)。於圖7中,為簡化說明,以將對應於反射面RPh而獲得之原點時刻Tog1於時間軸上對齊地排列之方式表示出於多面鏡PM旋轉7圈之期間產生的原點訊號SZn(a)1~SZn(a)7之各者之波形。 FIG. 7 is a diagram illustrating a method of measuring the reproducibility (deviation) of the generation timing of the origin signal SZn. Here, in order to simplify the description, an example of the method of seeking the reproducibility of the origin time Tog2 of the origin signal SZn generated corresponding to the reflecting surface RPa of the polygon mirror PM shown in FIG. 6 is shown for each of the other reflecting surfaces RPb~RPh. The same can also be done for measurement. In the case of FIG. 6, the origin time Tog1 generated one time sequence before the origin time Tog2 can be obtained as the origin signal SZn generated corresponding to the reflecting surface RPh of the polygon mirror PM. Therefore, in the state that the polygon mirror PM is rotated at a predetermined speed, the polygon mirror PM repeats the measurement multiple times (for example, more than 10 times) every time the polygon mirror PM rotates one revolution from the origin time Tog1 generated corresponding to the reflecting surface RPh to the corresponding The origin interval time △Tmn (the number of rotations of n=1, 2, 3...) to the origin time Tog2 of the next reflecting surface RPa. In FIG. 7, to simplify the description, the origin time Tog1 obtained corresponding to the reflecting surface RPh is aligned on the time axis to represent the origin signal SZn( a) The waveform of each of 1~SZn(a)7.

此處,若假定多面鏡PM之旋轉速度之變動為零,則原本理應為 固定之原點間隔時間△Tmn之各者之測量值產生偏差。該偏差成為與反射面RPa對應之原點時刻Tog2之產生時序之偏差量△Te,原點訊號SZn之再現性係設為分佈於偏差量△Te內之複數個原點時刻Tog2之標準偏差值σ、或標準偏差值σ之3倍之3σ值而求出。如上文所作說明般,於光源裝置LS使光束LB以週期Tf進行脈衝振盪之情形時,作為再現性之3σ值宜較週期Tf小。於以上之說明中,雖將多面鏡PM之旋轉速度之變動(速度不均)假定為零,但若使用以奈秒以下之解析度對訊號波形進行取樣之波形測定器來分析原點訊號SZn之波形,並嘗試測量多面鏡PM之轉動時間(旋轉1圈之時間),則判斷因轉動而導致轉動時間TD變動±數nS左右。因此,必須將以圖7之方式進行測量之原點間隔時間△Tmn(n=1、2、3…之轉動數)相應於因於該原點間隔時間△Tmn之測量期間內之多面鏡PM之速度變動而產生之誤差量進行修正。 Here, if it is assumed that the variation of the rotation speed of the polygon mirror PM is zero, the measured value of each of the original interval time ΔTmn, which should have been fixed, will deviate. This deviation becomes the deviation amount △Te of the generation sequence of the origin time Tog2 corresponding to the reflecting surface RPa, and the reproducibility of the origin signal SZn is set as the standard deviation value of the plural origin time Tog2 distributed within the deviation amount △Te σ, or a 3σ value that is three times the standard deviation value σ. As explained above, when the light source device LS pulses the light beam LB with the period Tf, the 3σ value as the reproducibility is preferably smaller than the period Tf. In the above description, although the rotation speed variation (speed unevenness) of the polygon mirror PM is assumed to be zero, if a waveform tester that samples the signal waveform with a resolution below nanoseconds is used to analyze the origin signal SZn And try to measure the rotation time of the polygon mirror PM (the time of one rotation), and it is judged that the rotation time TD varies by ± nS due to the rotation. Therefore, the origin interval time ΔTmn (the number of rotations for n=1, 2, 3...) measured in the manner shown in Fig. 7 must be corresponded to the polygon mirror PM during the measurement period due to the origin interval time ΔTmn The amount of error caused by the speed change is corrected.

圖8係示意性地表示預測由多面鏡PM之速度變動所致之時間誤差量之方法的圖。於來自圖5所示之原點感測器之原點訊號SZn之再現性的測量中,針對多面鏡PM之多次轉動之每一次,測量對應於8個反射面RPa~RPh之各者之原點間隔時間△Tmn。於圖8中,示意性地表示將多面鏡PM之1圈旋轉中之初始位置(最初之原點時刻Tog)設為反射面RPa,自反射面RPa起多面鏡PM旋轉2圈之期間內產生之原點訊號SZn之波形。此處,將自對應於原點訊號SZn之反射面RPa而產生之原點時刻Tog至對應於相鄰之反射面RPb而產生之原點時刻Tog為止的原點間隔時間設為△Tma,以下同樣地,將自相鄰之反射面RPb至反射面RPc為止之原點間隔時間設為△Tmb、......、將自相鄰之反射面RPh至反射面RPa為止之原點間隔時間設為△Tmh。於多面鏡PM之第1週中,將對應於8個反射面RPa~RPh之各者而產生之各個原點時刻Tog設為起始點,測量多面鏡PM之反射面RPa~RPh之各者之轉動時間TDa、TDb、…TDh。轉動時間TDa~TDh之各者亦可利用與8個反射面RPa~RPh之各者對應之8個原點間隔時間△Tma~△Tmh 之合計值而求出。轉動時間TDa~TDh(或原點間隔時間△Tma~△Tmh)之各者係於多面鏡PM例如旋轉N圈之期間重複測量。藉此,自與8個反射面RPa~RPh之各者相應之原點時刻Tog計時的轉動時間TDa~TDh之各者之資料可持續N圈而獲得。 FIG. 8 is a diagram schematically showing a method of predicting the amount of time error caused by the speed variation of the polygon mirror PM. In the measurement of the reproducibility of the origin signal SZn from the origin sensor shown in Fig. 5, for each of the multiple rotations of the polygon mirror PM, the measurement corresponds to each of the 8 reflecting surfaces RPa~RPh The origin interval time △Tmn. In FIG. 8, it is schematically shown that the initial position (initial origin time Tog) in one rotation of the polygon mirror PM is set to the reflective surface RPa, and the polygon mirror PM is generated within the period of 2 rotations from the reflective surface RPa. The waveform of the origin signal SZn. Here, the origin time interval from the origin time Tog generated by the reflection surface RPa corresponding to the origin signal SZn to the origin time Tog generated corresponding to the adjacent reflection surface RPb is set as △Tma, the following In the same way, the origin interval time from the adjacent reflecting surface RPb to the reflecting surface RPc is set to △Tmb..., the origin interval from the adjacent reflecting surface RPh to the reflecting surface RPa The time is set to △Tmh. In the first week of the polygon mirror PM, set each origin time Tog corresponding to each of the 8 reflecting surfaces RPa~RPh as the starting point, and measure each of the reflecting surfaces RPa~RPh of the polygon mirror PM The rotation time TDa, TDb,...TDh. Each of the rotation time TDa~TDh can also be calculated by the total value of the 8 origin interval time △Tma~△Tmh corresponding to each of the 8 reflecting surfaces RPa~RPh. Each of the rotation time TDa ~ TDh (or the origin interval time △Tma ~ △Tmh) is repeatedly measured during the period of N rotation of the polygon mirror PM, for example. Thereby, the data of each of the rotation time TDa~TDh counted from the origin time Tog corresponding to each of the 8 reflecting surfaces RPa~RPh can be obtained continuously for N revolutions.

其次,對持續N圈所獲得之轉動時間TDa~TDh之各者之平均轉動時間ave(TDa)~ave(TDh)進行計算。例如,轉動時間TDa係對應於轉動數N(N=1、2、3…)而記憶為TDa(1)、TDa(2)、TDa(3)、…TDa(N),故而平均轉動時間ave(TDa)可利用[TDa(1)+TDa(2)+TDa(3)+、…+TDa(N)]/N求出。 Secondly, calculate the average rotation time ave(TDa)~ave(TDh) of each of the rotation times TDa~TDh obtained for N cycles. For example, the rotation time TDa corresponds to the number of rotations N (N=1, 2, 3...) and is memorized as TDa(1), TDa(2), TDa(3),...TDa(N), so the average rotation time ave (TDa) can be calculated using [TDa(1)+TDa(2)+TDa(3)+,...+TDa(N)]/N.

其次,假設圖8所示之第2圈之後所測量之原點間隔時間△Tma~△Tmh之各者包含由之前之多面鏡PM之轉動的速度變動之影響所造成之誤差,例如,關於第2圈之後實測之原點間隔時間△Tma,預測僅以此前之轉動中所實測之轉動時間TDa與平均轉動時間ave(TDa)之比率變動,而計算原點間隔時間△Tma之預測間隔時間△Tma'。此時,求出於第2圈之後之各轉動中所實測之N-1個原點間隔時間△Tma之平均間隔時間ave(△Tma)。繼而,對平均轉動時間ave(TDa)與經實測之轉動時間TDa之比乘以平均間隔時間ave(△Tma),算出修正速度變動量後之預測間隔時間△Tma'。藉此,經實測之原點間隔時間△Tma與預測間隔時間△Tma'之差量值係設為對應於反射面RPa而產生之原點訊號SZn之原點時刻Tog之更準確之偏差量(σ值)而求出。與其他反射面RPb~RPh之各者對應之原點訊號SZn之原點時刻Tog的偏差量亦藉由相同之計算而求出。如此,僅藉由於多面鏡PM之多次旋轉中重複實測原點訊號SZn之原點時刻Tog之產生間隔即原點間隔時間△Tma~△Tmh之各者,便可求出使由多面鏡PM之速度變動引起之誤差減少的準確之再現性(3σ值等)。 Secondly, suppose that each of the origin interval time △Tma~△Tmh measured after the second circle shown in Fig. 8 includes the error caused by the influence of the speed change of the previous polygon mirror PM, for example, regarding the first The measured interval time between the origins △Tma after 2 laps, the prediction is only based on the ratio of the measured rotation time TDa and the average rotation time ave(TDa) in the previous rotation, and the predicted interval time △Tma of the initial interval time △Tma is calculated. Tma'. At this time, find the average interval time ave (ΔTma) of the N-1 origin interval time ΔTma measured in each rotation after the second turn. Then, the ratio of the average rotation time ave (TDa) to the measured rotation time TDa is multiplied by the average interval time ave (ΔTma) to calculate the predicted interval time ΔTma' after the amount of speed variation is corrected. Thereby, the difference between the measured origin interval time ΔTma and the predicted interval time ΔTma' is set to correspond to the more accurate deviation of the origin time Tog of the origin signal SZn generated by the reflecting surface RPa ( σ value). The deviation amount of the origin time Tog of the origin signal SZn corresponding to each of the other reflecting surfaces RPb~RPh is also calculated by the same calculation. In this way, only by repeating the generation interval of the origin time Tog of the actual measured origin signal SZn during the multiple rotations of the polygon mirror PM, that is, the origin interval time △Tma~△Tmh, the use of the polygon mirror PM can be obtained. Accurate reproducibility (3σ value, etc.) of the error reduction caused by the speed change.

[實測例] [Measured example]

作為一例,將圖5所示之光束受光部60b內之透鏡系統GLb之焦點距離Fgs設為與fθ透鏡系統FT之焦點距離fo(例如100mm)相同程度,將光電轉換元件DTo配置於透鏡系統GLb之焦點距離Fgs之位置,使多面鏡PM以約38000rpm旋轉,並利用如圖7、圖8之方法實測與多面鏡PM之反射面RPa~RPh之各者對應地產生之原點訊號SZn(原點時刻Tog2)之再現性後,可獲得如圖9所示之結果。於圖9中,橫軸表示所測量之反射面間之各位置(RPa→RPb、RPb→RPc、…RPh→RPa),縱軸表示對轉動時間TD之變動進行修正計算之後之各反射面間之間隔時間△Tma~△Tmh(μS)。間隔時間△Tma~△Tmh係利用具有2.5GHz(0.4nS)之取樣頻率之波形記憶裝置記憶經過多面鏡PM旋轉10圈中連續地產生之原點訊號SZn之波形資料,並對該波形資料進行分析而實測出。 As an example, the focal distance Fgs of the lens system GLb in the light beam receiving portion 60b shown in FIG. 5 is set to be the same as the focal distance fo (for example, 100 mm) of the fθ lens system FT, and the photoelectric conversion element DTo is arranged in the lens system GLb The position of the focal point distance Fgs makes the polygon mirror PM rotate at about 38000 rpm, and the origin signal SZn (original point signal SZn) generated corresponding to each of the reflecting surfaces RPa~RPh of the polygon mirror PM is measured by the method shown in Figure 7 and Figure 8. After clicking the reproducibility at time Tog2), the result shown in Figure 9 can be obtained. In Figure 9, the horizontal axis represents the positions between the measured reflecting surfaces (RPa→RPb, RPb→RPc,...RPh→RPa), and the vertical axis represents the positions between the reflecting surfaces after the change in the rotation time TD is corrected and calculated. The interval time between △Tma~△Tmh(μS). The interval time △Tma~△Tmh is to use a waveform memory device with a sampling frequency of 2.5GHz (0.4nS) to memorize the waveform data of the origin signal SZn generated continuously during 10 rotations of the polygon mirror PM, and perform processing on the waveform data. Analysis and actual measurement.

如圖9般,將轉動時間TD之變動進行修正後之間隔時間△Tma~△Tmh於197.380μS~197.355μS之間產生偏差。於多面鏡PM以38000rpm之旋轉速度精密地旋轉之情形時,計算上之間隔時間△Tma~△Tmh之各者為197.368μS。此種間隔時間△Tma~△Tmh之偏差例如因多面鏡PM之各反射面RPa~RPh中之相鄰之反射面彼此所成的8個頂角之各者未精密地成為135度、或自旋轉軸AXp至反射面RPa~RPh之各者為止之距離未精密地成為固定等加工上之形狀誤差而產生。又,間隔時間△Tma~△Tmh之偏差亦會根據多面鏡PM相對於旋轉軸AXp之偏心誤差之程度而產生。於圖9中,根據間隔時間△Tma~△Tmh之各者之偏差之分佈所計算之3σ值成為2.3nS~5.9nS,但該值意味著於將來自光源裝置LS之光束LB之脈衝振盪頻率設為400MHz(週期2.5nS)時,能夠產生大致3脈衝以上之點光之掃描位置之誤差。如上文所例示般,於將點光SP之直徑Φ設為4μm,將1像素大小Pxy於基板P上設為4μm見方,以點光SP之2脈衝量描繪1像素量之情形時,若3σ值為6nS左右,則意味著沿著描繪線SLn描繪之圖案之位置於主掃描方向上產生5μm左右(準確而言為4.8μm)之偏差。 As shown in Figure 9, the interval time △Tma~△Tmh after correcting the variation of the rotation time TD has a deviation between 197.380μS~197.355μS. When the polygon mirror PM rotates precisely at a rotation speed of 38000 rpm, the calculated interval time △Tma~△Tmh is 197.368μS. The deviation of this interval time △Tma~△Tmh, for example, is due to the fact that each of the 8 vertex angles formed by the adjacent reflective surfaces of the polygonal mirror PM's reflective surfaces RPa~RPh does not accurately become 135 degrees, or self The distance from the rotation axis AXp to each of the reflective surfaces RPa to RPh does not precisely become a shape error in processing such as fixation. Moreover, the deviation of the interval time △Tma~△Tmh will also be generated according to the degree of the eccentricity error of the polygon mirror PM with respect to the rotation axis AXp. In Fig. 9, the 3σ value calculated from the distribution of the deviation of each of the interval time △Tma~△Tmh becomes 2.3nS~5.9nS, but this value means that the pulse oscillation frequency of the light beam LB from the light source device LS When set to 400MHz (period 2.5nS), the error of the scanning position of the spot light of approximately 3 pulses or more can be generated. As exemplified above, when the diameter Φ of the spot light SP is set to 4 μm, the size of 1 pixel Pxy is set to 4 μm square on the substrate P, and the amount of 1 pixel is drawn with 2 pulses of the spot light SP, if 3σ The value is about 6nS, which means that the position of the pattern drawn along the drawing line SLn has a deviation of about 5 μm (to be precise, 4.8 μm) in the main scanning direction.

於將fθ透鏡系統FT之焦點距離設為fo,將基板P上之點光SP之脈衝間隔之距離(光點直徑之1/2)設為△Yp時,對應於脈衝間隔距離△Yp之多面鏡PM(反射面)之角度變化△θp成為△θp≒△Yp/fo。另一方面,若將與角度變化△θp對應之光電轉換元件DTo上之雷射光束Bgb(點光SPr)的移動距離設為△Yg,則根據光束受光部60b側之透鏡系統GLb之焦點距離Fgs,移動距離△Yg成為△Yg≒△θp×Fgs。原點訊號SZn之原點時刻Tog之產生精度較理想為對應於點光SP之脈衝間隔距離△Yp之1/2以下之精度(解析度)。因此,使光電轉換元件DTo上之光束Bgb(點光SPr)之掃描速度Vh加快為基板P上之點光SP之掃描速度Vsp之2倍左右。即,宜設為△Yg≒2.△Yp之關係。因此,將透鏡系統GLb之焦點距離Fgs設定為fθ透鏡系統FT之焦點距離fo之2倍左右,同樣地嘗試測量原點訊號SZn之再現性。 When the focal distance of the fθ lens system FT is set to fo, and the pulse interval distance of the spot light SP on the substrate P (1/2 of the spot diameter) is set to △Yp, it corresponds to the multi-faceted pulse interval distance △Yp The angle change Δθp of the mirror PM (reflecting surface) becomes Δθp≒ΔYp/fo. On the other hand, if the moving distance of the laser beam Bgb (spot light SPr) on the photoelectric conversion element DTo corresponding to the angle change △θp is set to △Yg, the focal distance of the lens system GLb on the side of the beam receiving unit 60b is Fgs, the moving distance △Yg becomes △Yg≒△θp×Fgs. The generation accuracy of the origin time Tog of the origin signal SZn is preferably an accuracy (resolution) corresponding to less than 1/2 of the pulse interval distance ΔYp of the spot light SP. Therefore, the scanning speed Vh of the light beam Bgb (spot light SPr) on the photoelectric conversion element DTo is accelerated to about twice the scanning speed Vsp of the spot light SP on the substrate P. That is, it should be set as △Yg≒2. The relationship between △Yp. Therefore, the focal distance Fgs of the lens system GLb is set to about 2 times the focal distance fo of the fθ lens system FT, and the reproducibility of the origin signal SZn is similarly measured.

圖10係表示使用與於圖9中所實測之描繪單元Un相同構成之另一描繪單元,將透鏡系統GLb之焦點距離Fgs變化為2Fgs≒fo,以與圖9相同之方式實測再現性而得之結果。圖10之縱軸與橫軸表示與圖9相同者,但圖10之縱軸之刻度尺之1刻度成為2nS(圖9中為5nS)。藉由使點光SPr於光電轉換元件DTo上之掃描速度Vh為點光SP於基板P上之掃描速度Vsp的2倍左右,根據間隔時間△Tma~△Tmh之各者之偏差之分佈而計算之3σ值成為1.3nS~2.5nS,與圖9之情形相比改善為大致一半。因此,於此情形時,若將點光SP之直徑Φ設為4μm,將1像素大小Pxy於基板P上設為4μm見方,以點光SP之2脈衝量描繪1像素量,則沿著描繪線SLn所描繪之圖案之主掃描方向之位置之偏差減半為2.5μm左右。再者,圖10所示之間隔時間△Tma~△Tmh之偏差之傾向與上文之圖9所示之間隔時間△Tma~△Tmh之偏差之傾向若以奈秒級來看則差別較大,假設其原因為於圖9與圖10之各者之再現性之實測中所使用之多面鏡PM間各頂角之角度誤差之傾向不同的個體差異(加工誤差)或旋轉時之偏心誤差不同。 Fig. 10 shows another drawing unit with the same structure as the drawing unit Un measured in Fig. 9, and the focal distance Fgs of the lens system GLb is changed to 2Fgs≒fo, and the reproducibility is measured in the same manner as in Fig. 9的结果。 The result. The vertical axis and the horizontal axis of FIG. 10 indicate the same as those of FIG. 9, but the 1 scale of the scale of the vertical axis of FIG. 10 is 2nS (5nS in FIG. 9). By making the scanning speed Vh of the spot light SPr on the photoelectric conversion element DTo approximately twice the scanning speed Vsp of the spot light SP on the substrate P, it is calculated based on the distribution of the deviation of each of the interval time △Tma~△Tmh The 3σ value becomes 1.3nS~2.5nS, which is about half the improvement compared with the situation in Fig. 9. Therefore, in this case, if the diameter Φ of the spot light SP is set to 4 μm, the size of 1 pixel Pxy is set to a 4 μm square on the substrate P, and 1 pixel is drawn with 2 pulses of the spot light SP, then the drawing is drawn along The deviation of the position in the main scanning direction of the pattern drawn by the line SLn is halved to about 2.5 μm. Furthermore, the tendency of the deviation of the interval time △Tma~△Tmh shown in Fig. 10 and the tendency of the deviation of the interval time △Tma~△Tmh shown in Fig. 9 above are quite different if viewed in nanoseconds. , Assuming that the reason is that the angle error tendency of each vertex angle between the polygon mirror PM used in the actual measurement of the reproducibility of each of Fig. 9 and Fig. 10 is different. The individual difference (processing error) or the eccentricity error during rotation are different. .

以上,如圖5所示,將投射至多面鏡PM之反射面RPa~RPh之原點感測器用之光束Bga設為如相對於反射面RPa~RPh之旋轉方向之尺寸成為既定之粗度(例如直徑為1~2mm)之平行光束,藉此,可減少由反射面RPa~RPh之各者之表面之粗糙度(研磨痕跡等)所造成之影響,而可精密地檢測平均之表面之角度變化。另一方面,於圖5中,聚光於光電轉換元件DTo上之反射光束Bgb之點光SPr之直徑尺寸係根據光束掃描方向之受光面PD1、PD2之寬度尺寸、及受光面PD1與PD2之間之不感帶之寬度而適當地設定。為獲得如圖4[A]般之訊號波形,點光SPr之掃描方向之直徑尺寸被設定為如較受光面PD1、PD2中之較小之寬度尺寸小且較不感帶之寬度大之條件。 Above, as shown in Fig. 5, the beam Bga for the origin sensor projected on the reflecting surfaces RPa~RPh of the polygon mirror PM is set such that the dimension relative to the rotation direction of the reflecting surfaces RPa~RPh becomes a predetermined thickness ( For example, a parallel beam with a diameter of 1~2mm) can reduce the influence caused by the surface roughness (grinding marks, etc.) of each of the reflective surfaces RPa~RPh, and can accurately detect the average surface angle Variety. On the other hand, in FIG. 5, the diameter of the spot light SPr of the reflected light beam Bgb condensed on the photoelectric conversion element DTo is based on the width of the light receiving surfaces PD1, PD2 in the scanning direction of the beam, and the light receiving surfaces PD1 and PD2. The width of the belt is not affected by it, and it is set appropriately. In order to obtain the signal waveform as shown in Fig. 4[A], the diameter of the spot light SPr in the scanning direction is set to be smaller than the width of the light-receiving surfaces PD1 and PD2 and larger than the width of the insensitive zone.

再者,來自設置於圖3之光束送光部60a之如圖5般之半導體雷射光源LDo的光束Bga之剖面內之強度分佈成為縱橫比為1:2左右之橢圓形,故而宜使橢圓形之長軸方向與多面鏡PM之各反射面RPa~RPh之旋轉方向(主掃描方向)一致,且使橢圓形之短軸方向與多面鏡PM之旋轉軸AXp之方向一致。如此一來,即便多面鏡PM之各反射面RPa~RPh之高度(旋轉軸AXp之方向之尺寸)較小,亦可將光束Bga有效地發射為反射光束Bgb,並且可使到達光電轉換元件DTo之反射光束Bgb之掃描方向之開口數(NA)大於非掃描方向之開口數(NA),故而可提高點光SPr之掃描方向(圖4之橫穿受光面PD1、PD2之方向)上之解析,並使對比度變得銳利。 Furthermore, the intensity distribution in the cross-section of the beam Bga from the semiconductor laser light source LDo as shown in FIG. 5 provided in the beam transmitting portion 60a of FIG. 3 becomes an ellipse with an aspect ratio of about 1:2, so it is preferable to use an ellipse The long axis direction of the shape is consistent with the rotation direction (main scanning direction) of each reflecting surface RPa~RPh of the polygon mirror PM, and the short axis direction of the ellipse is consistent with the direction of the rotation axis AXp of the polygon mirror PM. In this way, even if the height of each reflecting surface RPa~RPh of the polygon mirror PM (the size in the direction of the rotation axis AXp) is small, the light beam Bga can be effectively emitted as the reflected light beam Bgb, and can reach the photoelectric conversion element DTo The number of openings (NA) in the scanning direction of the reflected light beam Bgb is greater than the number of openings (NA) in the non-scanning direction, so the analysis in the scanning direction of the spot light SPr (the direction across the light-receiving surface PD1 and PD2 in Figure 4) can be improved , And make the contrast sharper.

根據以上內容,圖3所示之本實施形態之原點感測器(光束送光部60a、光束受光部60b、反射鏡MRa)係設為如下構成:利用光束受光部60b(包含與圖5相同之透鏡系統GLb及光電轉換元件DTo)接收來自光束送光部60a(包含與圖5相同之半導體雷射光源LDo及準直透鏡GLa)之光束Bga由反射鏡MRa於多面鏡PM之反射面RP反射2次後之反射光束Bgd。因此,即便於使反射光束Bgd所入射之透鏡系統GLb之焦點距離Fgs與fθ透鏡系統FT之焦點距離fo相同之 情形時,亦可使於光電轉換元件DTo上移動之反射光束Bgd之點光SPr之掃描速度Vh加快為描繪用光束LBn之點光SP之掃描速度Vsp之2倍左右。進而,若使設置於光束受光部60b之聚光透鏡(透鏡系統GLb)之焦點距離Fgs長於fθ透鏡系統FT之焦點距離fo(即,使透鏡系統GLb之折射能力低於fθ透鏡系統FT之折射能力),則亦可將橫穿光電轉換元件DTo上之點光SPr之掃描速度Vh設定為基板P上之點光SP之掃描速度Vsp之2倍以上。 Based on the above, the origin sensor (beam light transmitting unit 60a, light beam receiving unit 60b, and mirror MRa) of the present embodiment shown in FIG. 3 is configured as follows: using the light beam receiving unit 60b (including those shown in FIG. 5 The same lens system GLb and photoelectric conversion element DTo) receive the light beam Bga from the light beam transmitting unit 60a (including the same semiconductor laser light source LDo and collimator lens GLa as in FIG. 5) by the reflecting mirror MRa on the reflecting surface of the polygon mirror PM The reflected beam Bgd after being reflected twice by the RP. Therefore, even when the focal distance Fgs of the lens system GLb into which the reflected light beam Bgd enters is the same as the focal distance fo of the fθ lens system FT, the spot light SPr of the reflected light beam Bgd moving on the photoelectric conversion element DTo can be made The scanning speed Vh is increased to approximately twice the scanning speed Vsp of the spot light SP of the drawing beam LBn. Furthermore, if the focal distance Fgs of the condenser lens (lens system GLb) provided in the light beam receiving portion 60b is longer than the focal distance fo of the fθ lens system FT (that is, the refractive power of the lens system GLb is lower than that of the fθ lens system FT). Ability), the scanning speed Vh of the spot light SPr across the photoelectric conversion element DTo can be set to be more than twice the scanning speed Vsp of the spot light SP on the substrate P.

以上,根據本實施形態,由於以如下方式構成,即,於藉由反射鏡MRa使原點檢測用光束Bga在多面鏡PM之反射面RP反射2次之後,藉由聚光透鏡(透鏡系統GLb)使其於光電轉換元件DTo上聚光為點光SPr,故而來自光電轉換元件DTo之原點訊號SZn之產生時序之再現性提高,而可精密地控制主掃描方向上之圖案之描繪位置。再者,關於光電轉換元件DTo,亦可代替如圖4般將來自2個受光面PD1、PD2之輸出訊號STa、STb之大小加以比較而產生原點訊號SZn之類型,使用將來自1個狹縫狀之受光面之訊號位準與基準電壓加以比較而產生原點訊號SZn之類型。於該類型之情形時,原點訊號SZn之原點時刻Tog之再現性有訊號波形之上升部或下降部之傾斜越陡峭(響應時間越短)則越良好之可能性,故而宜使橫穿狹縫狀之受光面之點光SPr之掃描速度Vh較描繪用之點光SP之掃描速度Vsp快,並且藉由聚光透鏡(透鏡系統GLb)使點光SPr儘可能小地聚光而而提高每單位面積之強度。 As described above, according to the present embodiment, it is constructed in such a way that after the origin detection light beam Bga is reflected twice on the reflecting surface RP of the polygon mirror PM by the mirror MRa, the light beam Bga is passed through the condenser lens (lens system GLb ) Make it focus on the photoelectric conversion element DTo into a spot light SPr, so the reproducibility of the generation timing of the origin signal SZn from the photoelectric conversion element DTo is improved, and the drawing position of the pattern in the main scanning direction can be precisely controlled. Furthermore, as for the photoelectric conversion element DTo, it can be used instead of comparing the magnitudes of the output signals STa and STb from the two light-receiving surfaces PD1 and PD2 to generate the origin signal SZn as shown in Figure 4. The signal level of the slit-shaped light-receiving surface is compared with the reference voltage to generate the type of origin signal SZn. In this type of situation, the reproducibility of the origin time Tog of the origin signal SZn has the possibility that the steeper the slope of the rising or falling part of the signal waveform (the shorter the response time), the better, so it is better to make the cross The scanning speed Vh of the point light SPr of the slit-shaped light-receiving surface is faster than the scanning speed Vsp of the point light SP for drawing, and the spot light SPr is concentrated as small as possible by the condenser lens (lens system GLb) Improve the strength per unit area.

[第2實施形態] [Second Embodiment]

圖11係表示第2實施形態之原點感測器之構成,於本實施形態中,多面鏡PM亦具有8面之反射面RPa~RPh。又,對與上文之第1實施形態相同功能之構件附上相同之符號。於圖11中,作為原點感測器之檢測部之光束受光部60b具備將被多面鏡PM之反射面RP(RPa)第2次反射之反射光束Bgd反射之反射鏡MRb、作為聚光透鏡之透鏡系統GLb(具有折射能力之第2光學元件)、及光電轉換元件(光 電檢測器)DTo。於多面鏡PM之反射面RPa成為產生原點訊號SZn之時序(原點時刻Tog)之角度位置的瞬間,來自如圖5所示之光束送光部60a(圖11中未圖示)之光束Bga被反射面RPa反射,成為反射光束Bgb而入射至再反射光學系統CE。再反射光學系統CE由沿著光軸AXv自多面鏡PM側配置之第1透鏡系統GLc、第2透鏡系統GLd、反射鏡MRa所構成,入射至再反射光學系統CE之反射光束Bgb被反射鏡MRa反射後成為反射光束Bgc再次被投射至多面鏡PM之反射面RPa。反射光束Bgc之反射面RPa上之反射光成為反射光束Bgd,並入射至光束受光部60b之反射鏡MRb,利用透鏡系統GLb於光電轉換元件DTo上聚光為點光SPr。 FIG. 11 shows the structure of the origin sensor of the second embodiment. In this embodiment, the polygon mirror PM also has eight reflecting surfaces RPa to RPh. In addition, the same reference numerals are attached to the members having the same functions as those of the first embodiment described above. In FIG. 11, the light beam receiving part 60b as the detection part of the origin sensor is equipped with a mirror MRb that reflects the reflected light beam Bgd reflected by the reflecting surface RP (RPa) of the polygon mirror PM for the second time, as a condenser lens The lens system GLb (the second optical element with refractive power), and the photoelectric conversion element (photodetector) DTo. At the moment when the reflecting surface RPa of the polygon mirror PM becomes the angular position of the timing sequence (origin time Tog) that generates the origin signal SZn, the light beam comes from the light beam sending unit 60a shown in FIG. 5 (not shown in FIG. 11) Bga is reflected by the reflection surface RPa, becomes a reflected light beam Bgb, and enters the re-reflection optical system CE. The re-reflection optical system CE is composed of a first lens system GLc, a second lens system GLd, and a mirror MRa arranged from the side of the polygon mirror PM along the optical axis AXv. The reflected light beam Bgb incident on the re-reflection optical system CE is reflected by the mirror After the MRa is reflected, the reflected beam Bgc is projected to the reflecting surface RPa of the polygon mirror PM again. The reflected light on the reflective surface RPa of the reflected light beam Bgc becomes the reflected light beam Bgd, and is incident on the mirror MRb of the light beam receiving portion 60b, and is condensed into the spot light SPr on the photoelectric conversion element DTo by the lens system GLb.

再反射光學系統CE之第1透鏡系統GLc之前側焦點係設定於多面鏡PM之反射面RPa之位置(光軸AXv與反射面RPa交叉之位置),第1透鏡系統GLc之後側焦點係設定於成為瞳面之面ep之位置。第2透鏡系統GLd之前側焦點係設定於面ep之位置,第2透鏡系統GLd之後側焦點係設定於與光軸AXv垂直之反射鏡MRa之反射面的位置。因此,來自多面鏡PM之反射面RPa之反射光束Bgb(平行光束)於被第1透鏡系統GLc聚光並於面ep成為光束腰之後發散,入射至第2透鏡系統GLd,再次成為平行光束而到達反射鏡MRa。於入射至第1透鏡系統GLc之反射光束Bgb之主光線在XY面內相對於光軸AXv具有角度之情形時,入射至反射鏡MRa之反射光束Bgb之主光線亦相對於光軸AXv保持其角度。於反射鏡MRa反射之反射光束Bgc(平行光束)通過關於光軸AXv與反射光束Bgb對稱之光路而入射至第2透鏡系統GLd,於面ep成為光束腰之後發散並入射至第1透鏡系統GLc,再次成為平行光束後被投射至多面鏡PM之反射面RPa。自反射面RPa朝向第1透鏡系統GLc之反射光束Bgb之主光線與自第1透鏡系統GLc朝向反射面RPa之反射光束Bgc之主光線於XY面內關於光軸AXv對稱。投射至反射面RPa之反射光束Bgc被反射面RPa反射後成為反射光束Bgd(平行光束)而朝向反射鏡MRb。 The front focal point of the first lens system GLc of the re-reflective optical system CE is set at the position of the reflecting surface RPa of the polygon mirror PM (the position where the optical axis AXv crosses the reflecting surface RPa), and the rear focal point of the first lens system GLc is set at Become the position of the pupil face ep. The front focal point of the second lens system GLd is set at the position of the plane ep, and the rear focal point of the second lens system GLd is set at the position of the reflecting surface of the mirror MRa perpendicular to the optical axis AXv. Therefore, the reflected light beam Bgb (parallel light beam) from the reflective surface RPa of the polygon mirror PM diverges after being condensed by the first lens system GLc and becomes the beam waist at the surface ep, enters the second lens system GLd, and becomes a parallel light beam again And reach the mirror MRa. When the principal ray of the reflected light beam Bgb incident on the first lens system GLc has an angle with respect to the optical axis AXv in the XY plane, the principal ray of the reflected light beam Bgb incident on the mirror MRa also maintains its angle with respect to the optical axis AXv angle. The reflected light beam Bgc (parallel light beam) reflected on the mirror MRa enters the second lens system GLd through an optical path symmetrical to the reflected light beam Bgb about the optical axis AXv, diverges and enters the first lens system after the surface ep becomes the beam waist GLc becomes a parallel beam again and is projected to the reflecting surface RPa of the polygon mirror PM. The chief ray of the reflected light beam Bgb from the reflective surface RPa toward the first lens system GLc and the chief ray of the reflected light beam Bgc from the first lens system GLc toward the reflective surface RPa are symmetrical about the optical axis AXv in the XY plane. The reflected light beam Bgc projected on the reflecting surface RPa is reflected by the reflecting surface RPa and becomes a reflected light beam Bgd (parallel light beam), and faces the reflecting mirror MRb.

若使多面鏡PM(反射面RPa)自如圖11般之狀態朝順時針方向旋轉角度△θe,則反射光束Bgb自圖11之狀態朝與光軸AXv所成之角度變大角度2.△θe之程度之方向傾斜,而入射至第1透鏡系統GLc。因此,投射至反射鏡MRa之反射光束Bgb之入射角自圖11之狀態變大角度2.△θe之程度,其結果,自第1透鏡系統GLc朝向反射面RPa之反射光束Bgc與光軸AXv所成之角度自圖11之狀態變大角度2.△θe之程度。多面鏡PM之反射面RPa朝順時針方向自圖11之狀態傾斜角度△θe之程度,故而被反射面RPa第2次反射之反射光束Bgd自圖11之狀態傾斜角度4.△θe之程度。因此,相對於被多面鏡PM之反射面RPa最初反射之反射光束Bgb之斜率變化之速度,第2次反射之反射光束Bgd之斜率變化之速度成為2倍。藉此,可使橫穿光電轉換元件DTo上之反射光束Bgd之點光SPr之掃描速度Vh為描繪用光束LBn之點光於基板P上之掃描速度Vsp之2倍左右。再者,光束受光部60b之透鏡系統GLb之焦點距離Fgs係設定為與fθ透鏡系統FT之焦點距離fo大致相同,但亦可長於焦點距離fo。又,透鏡系統GLb亦可不設置反射鏡MRb,而靠近多面鏡PM之反射面RP配置。 If the polygon mirror PM (reflecting surface RPa) is rotated clockwise from the state shown in Fig. 11 by an angle Δθe, the reflected light beam Bgb becomes larger from the state shown in Fig. 11 toward the angle formed by the optical axis AXv 2. The direction of the degree of Δθe is inclined and enters the first lens system GLc. Therefore, the incident angle of the reflected light beam Bgb projected to the mirror MRa becomes larger from the state shown in Fig. 11. 2. As a result, the angle formed by the reflected light beam Bgc from the first lens system GLc toward the reflective surface RPa and the optical axis AXv becomes larger from the state of Fig. 11 as a result of the degree of Δθe. 2. The degree of △θe. The reflecting surface RPa of the polygon mirror PM is tilted by the angle Δθe in the clockwise direction from the state of FIG. 11, so the reflected light beam Bgd reflected for the second time by the reflecting surface RPa is tilted from the state of FIG. 11 by an angle of 4. The degree of △θe. Therefore, with respect to the rate of change of the slope of the reflected light beam Bgb first reflected by the reflecting surface RPa of the polygon mirror PM, the rate of change of the slope of the reflected light beam Bgd of the second reflection becomes twice. As a result, the scanning speed Vh of the spot light SPr that traverses the reflected light beam Bgd on the photoelectric conversion element DTo can be about twice the scanning speed Vsp of the spot light of the drawing light beam LBn on the substrate P. Furthermore, the focal distance Fgs of the lens system GLb of the light beam receiving portion 60b is set to be approximately the same as the focal distance fo of the fθ lens system FT, but may be longer than the focal distance fo. In addition, the lens system GLb may not be provided with a mirror MRb, and may be arranged close to the reflecting surface RP of the polygon mirror PM.

以上,於本實施形態中,亦與上文之第1實施形態同樣地以如下方式構成,即,於藉由包含反射鏡MRa之再反射光學系統CE使原點檢測用光束Bga在多面鏡PM之反射面RP反射2次之後,藉由透鏡系統GLb使其於光電轉換元件DTo上聚光為點光SPr,故而來自光電轉換元件DTo之原點訊號SZn之產生時序之再現性提高,而可精密地控制主掃描方向上之圖案之描繪位置。 As described above, in the present embodiment, the same as the above-mentioned first embodiment is also configured in such a way that the light beam Bga for origin detection is placed on the polygon mirror PM by the re-reflection optical system CE including the mirror MRa. After the reflective surface RP is reflected twice, the lens system GLb condenses the light on the photoelectric conversion element DTo into a point light SPr. Therefore, the reproducibility of the generation timing of the origin signal SZn from the photoelectric conversion element DTo is improved, and the Precisely control the drawing position of the pattern in the main scanning direction.

[第3實施形態] [Third Embodiment]

圖12係表示第3實施形態之原點感測器之構成,對與上文之第1、第2實施形態相同功能之構件附上相同之符號。本實施形態之原點感測器由偏振分光鏡BS1(第1光分割元件)、偏振分光鏡BS2(第2光分割元件)、1/4波長板QP1、QP2、透鏡系統GLe(兼具具有折射能力之第1光學元件與第2光學元件之功能的光學元 件)、及光電轉換元件DTo所構成。圖12中之多面鏡PM之反射面RPa之角度位置係表示來自光電轉換元件DTo之原點訊號SZn成為如圖4(B)般之原點時刻Tog之瞬間的狀態。於使多面鏡PM之旋轉軸AXp與座標系XYZ之Z軸平行時,透鏡系統GLe以其光軸AXj之延長線與多面鏡PM之旋轉軸AXp交叉之方式與X軸平行地配置。整形為立方體之偏振分光鏡BS1相對於光軸AXj配置於+Y方向側,且具有相對於YZ面與XZ面之各者傾斜45度之偏振分離面pb1。來自未圖示之光束送光部60a之光束Bga以於入射至偏振分光鏡BS1之入射端面(與YZ面平行)之近前之面ep成為光束腰的方式聚光,且與X軸平行地行進。入射至偏振分光鏡BS1之光束Bga被設定為透過偏振分離面pb1之直線偏光。1/4波長板QP1係以於與偏振分光鏡BS1之光束Bga之入射端面平行之射出面側與光軸AXj垂直之方式配置。 Fig. 12 shows the structure of the origin sensor of the third embodiment, and the same reference numerals are attached to the components with the same functions as the first and second embodiments described above. The origin sensor of this embodiment consists of polarization beam splitter BS1 (first light splitting element), polarization beam splitter BS2 (second light splitting element), quarter-wavelength plates QP1, QP2, and lens system GLe (both with It is composed of a first optical element and a second optical element with refractive power, and a photoelectric conversion element DTo. The angular position of the reflecting surface RPa of the polygon mirror PM in FIG. 12 represents the state at which the origin signal SZn from the photoelectric conversion element DTo becomes the origin time Tog as shown in FIG. 4(B). When the rotation axis AXp of the polygon mirror PM is parallel to the Z axis of the coordinate system XYZ, the lens system GLe is arranged parallel to the X axis such that the extension line of the optical axis AXj intersects the rotation axis AXp of the polygon mirror PM. The polarization beam splitter BS1 shaped as a cube is arranged on the +Y direction side with respect to the optical axis AXj, and has a polarization separation surface pb1 inclined at 45 degrees with respect to each of the YZ plane and the XZ plane. The light beam Bga from the light beam sending part 60a not shown is condensed so that the front surface ep of the incident end surface (parallel to the YZ surface) of the polarization beam splitter BS1 becomes the beam waist, and is parallel to the X axis March. The light beam Bga incident on the polarization beam splitter BS1 is set to be linearly polarized light passing through the polarization separation surface pb1. The quarter-wave plate QP1 is arranged so that the exit surface side parallel to the incident end surface of the light beam Bga of the polarization beam splitter BS1 is perpendicular to the optical axis AXj.

整形為立方體之偏振分光鏡BS2相對於光軸AXj配置於-Y方向側,且具有相對於YZ面與XZ面之各者傾斜45度之偏振分離面pb2。1/4波長板QP2係以與光軸AXj垂直之方式配置於與偏振分光鏡BS1側之1/4波長板QP1相同之X方向之位置。偏振分光鏡BS1與1/4波長板QP1之組和偏振分光鏡BS2與1/4波長板QP2之組相對於包含光軸AXj之與X軸平行之面對稱地配置。因此,偏振分光鏡BS1之偏振分離面pb1與偏振分光鏡BS2之偏振分離面pb2於XY面內成90度之角度配置。如圖4所示般之光電轉換元件DTo係以受光面PD1、PD2位於與偏振分光鏡BS2之-X方向側之面ep相同之位置之方式配置。透鏡系統GLe之前側焦點之位置設定於面ep,前側焦點之位置設定於多面鏡PM之反射面RP(RPa)。 The polarization beam splitter BS2 shaped into a cube is arranged on the -Y direction side with respect to the optical axis AXj, and has a polarization separation surface pb2 inclined 45 degrees with respect to each of the YZ plane and the XZ plane. The quarter-wave plate QP2 is connected with The way that the optical axis AXj is vertical is arranged at the same X-direction position as the quarter-wave plate QP1 on the side of the polarization beam splitter BS1. The group of the polarization beam splitter BS1 and the quarter-wave plate QP1 and the group of the polarization beam splitter BS2 and the quarter-wave plate QP2 are arranged symmetrically with respect to a plane parallel to the X axis including the optical axis AXj. Therefore, the polarization separation surface pb1 of the polarization beam splitter BS1 and the polarization separation surface pb2 of the polarization beam splitter BS2 are arranged at an angle of 90 degrees in the XY plane. The photoelectric conversion element DTo as shown in FIG. 4 is arranged such that the light-receiving surfaces PD1 and PD2 are located at the same positions as the surface ep on the -X direction side of the polarization beam splitter BS2. The position of the front focus of the lens system GLe is set on the surface ep, and the position of the front focus is set on the reflecting surface RP (RPa) of the polygon mirror PM.

根據以上之構成,自面ep成為發散光之光束Bga入射至偏振分光鏡BS1,光束Bga透過偏振分離面pb1由1/4波長板QP1轉換為圓偏振光,與光軸AXj平行地行進並入射至透鏡系統GLe。透過透鏡系統GLe之光束Bga成為平行光束並被投射至多面鏡PM之反射面RP(RPa)。被多面鏡PM之反射面RPa反射之 光束Bga之反射光束Bgb係於反射面RPa與光軸AXj垂直時,沿著關於光軸AXj與光束Bga之光路對稱之光路入射至透鏡系統GLe,且以於與面ep相同之面成為光束腰之方式被收斂。通過透鏡系統GLe之反射光束Bgb係藉由1/4波長板QP2而轉換為與光束Bga正交之方向之直線偏光,且入射至偏振分光鏡BS2。因此,反射光束Bgb不透過偏振分光鏡BS2之偏振分離面pb2而朝+Y方向反射,並入射至偏振分光鏡BS1之側面。於偏振分離面pb2反射之反射光束Bgb以於光軸AXj之位置成為光束腰之方式收斂後,發散並入射至偏振分光鏡BS1。由於反射光束Bgb成為與光束Bga正交之方向之直線偏光,故而被偏振分光鏡BS1之偏振分離面pb1反射,再次通過1/4波長板QP1被轉換為圓偏振光,成為反射光束Bgc而入射至透鏡系統GLe。 According to the above configuration, the light beam Bga, which has become divergent light from the surface ep, enters the polarization beam splitter BS1. The light beam Bga passes through the polarization separation surface pb1 and is converted into circularly polarized light by the quarter wave plate QP1, and travels parallel to the optical axis AXj and enters. To the lens system GLe. The light beam Bga passing through the lens system GLe becomes a parallel light beam and is projected to the reflecting surface RP (RPa) of the polygon mirror PM. The reflected light beam Bgb of the light beam Bga reflected by the reflecting surface RPa of the polygon mirror PM is incident on the lens system GLe along the optical path symmetrical about the optical axis AXj and the optical path of the light beam Bga when the reflecting surface RPa is perpendicular to the optical axis AXj, and The beam waist is converged on the same surface as the surface ep. The reflected light beam Bgb passing through the lens system GLe is converted into linearly polarized light in a direction orthogonal to the light beam Bga by the quarter-wave plate QP2, and is incident on the polarization beam splitter BS2. Therefore, the reflected light beam Bgb does not pass through the polarization separation surface pb2 of the polarization beam splitter BS2, but is reflected in the +Y direction, and enters the side surface of the polarization beam splitter BS1. The reflected light beam Bgb reflected on the polarization separation surface pb2 converges so that the position of the optical axis AXj becomes the beam waist, diverges and enters the polarization beam splitter BS1. Since the reflected light beam Bgb becomes linearly polarized light in the direction orthogonal to the light beam Bga, it is reflected by the polarization separation surface pb1 of the polarization beam splitter BS1, and is converted into circularly polarized light by the quarter-wavelength plate QP1 again, and becomes the reflected light beam Bgc. To the lens system GLe.

通過透鏡系統GLe之反射光束Bgc成為通過與光束Bga大致相同之光路之平行光束而入射至多面鏡PM之反射面RPa。被反射面RPa再次反射之反射光束Bgc之反射光束Bgd沿著與反射光束Bgb大致相同之光路入射至透鏡系統GLe。反射光束Bgd藉由透鏡系統GLe而以於與面ep相同之面成為光束腰之方式收斂,且藉由1/4波長板QP2轉換為與光束Bga相同方向之直線偏光後入射至偏振分光鏡BS2。因此,反射光束Bgd係透過偏振分光鏡BS2之偏振分離面pb2,成為點光SPr而聚光於光電轉換元件DTo上。於本實施形態中,偏振分光鏡BS1、BS2、1/4波長板QP1、QP2及透鏡系統GLe構成再反射光學系統CE,垂直地配置之偏振分離面pb1、pb2作為角隅鏡發揮功能,相當於上文之第1、第2實施形態之反射鏡MRa。 The reflected light beam Bgc passing through the lens system GLe becomes a parallel light beam passing through the substantially same optical path as the light beam Bga, and is incident on the reflecting surface RPa of the polygon mirror PM. The reflected light beam Bgd of the reflected light beam Bgc again reflected by the reflection surface RPa enters the lens system GLe along the same optical path as the reflected light beam Bgb. The reflected light beam Bgd is converged by the lens system GLe to become the beam waist on the same surface as the surface ep, and is converted into linearly polarized light in the same direction as the beam Bga by the quarter-wavelength plate QP2, and then enters the polarization beam splitter. BS2. Therefore, the reflected light beam Bgd passes through the polarization separation surface pb2 of the polarization beam splitter BS2, becomes the spot light SPr, and is focused on the photoelectric conversion element DTo. In this embodiment, the polarization beam splitters BS1, BS2, quarter-wave plates QP1, QP2, and lens system GLe constitute the re-reflecting optical system CE, and the vertical polarization separation surfaces pb1 and pb2 function as corner mirrors, which are equivalent to The mirror MRa of the first and second embodiments above.

圖13係於XY面內觀察圖12之構成而得之示意性之圖,且係表示多面鏡PM之反射面RPa自與光軸AXj垂直之狀態傾斜角度△θe之情形時之各光束之行為之圖。於反射面RPa與光軸AXj垂直時,於面ep聚光為光點之光束Bga之自偏振分光鏡BS1至反射面RPa為止的光路與被偏振分離面pb1、pb2反射之反射 光束Bgc之至反射面RPa為止的光路於XY面內重疊,進而,被反射面RPa最初反射之反射光束Bgb之光路與被反射面RPa第2次反射之反射光束Bgd之光路於XY面內重疊。因此,於與光電轉換元件DTo之受光面相同之面(ep)產生點光SPr。點光SPr之Y方向之位置關於光軸AXj與光束Bga聚光之位置對稱。若多面鏡PM之反射面RPa自此種狀態傾斜角度△θe,則最初於反射面RPa反射之反射光束Bgb成為相對於原本之光路朝遠離光軸AXj之方向偏向(位移)之反射光束Bgb',被偏振分離面pb1、pb2反射之反射光束Bgc成為相對於原本之光路(與光束Bga之光路相同)朝遠離光軸AXj之方向偏向(位移)之反射光束Bgc'並朝向反射面RPa。因此,被反射面RPa第2次反射之反射光束Bgd成為相對於反射光束Bgb'之光路朝進一步遠離光軸AXj之方向偏向(位移)之反射光束Bgd'並到達光電轉換元件DTo,成為點光SPr'。 Fig. 13 is a schematic diagram obtained by observing the structure of Fig. 12 in the XY plane, and shows the behavior of each beam when the reflecting surface RPa of the polygon mirror PM is inclined at an angle Δθe from a state perpendicular to the optical axis AXj之图. When the reflective surface RPa is perpendicular to the optical axis AXj, the beam Bga condensed as a spot on the surface ep is between the optical path from the polarization beam splitter BS1 to the reflective surface RPa and the reflected beam Bgc reflected by the polarization separation surfaces pb1 and pb2 The optical path to the reflecting surface RPa overlaps in the XY plane, and the optical path of the reflected light beam Bgb first reflected by the reflecting surface RPa and the optical path of the reflected light beam Bgd secondly reflected by the reflecting surface RPa overlap in the XY plane. Therefore, spot light SPr is generated on the same surface (ep) as the light-receiving surface of the photoelectric conversion element DTo. The position of the spot light SPr in the Y direction is symmetrical about the optical axis AXj and the position where the light beam Bga condenses. If the reflecting surface RPa of the polygon mirror PM is inclined by the angle Δθe from this state, the reflected light beam Bgb initially reflected on the reflecting surface RPa becomes the reflected light beam Bgb' that is deflected (displaced) in the direction away from the optical axis AXj with respect to the original optical path , The reflected light beam Bgc reflected by the polarization separation surfaces pb1 and pb2 becomes the reflected light beam Bgc' that is deflected (displaced) in a direction away from the optical axis AXj with respect to the original optical path (the same optical path as the light beam Bga) and faces the reflection surface RPa. Therefore, the reflected light beam Bgd reflected for the second time by the reflective surface RPa becomes a reflected light beam Bgd' that is deflected (displaced) in a direction further away from the optical axis AXj with respect to the optical path of the reflected light beam Bgb', and reaches the photoelectric conversion element DTo, becoming a spot light SPr'.

於假設使被反射面RPa最初反射之反射光束Bgb'之點光形成於光電轉換元件DTo之情形時,相對於該點光自點光SPr之位置移動之距離,可使點光SPr'自點光SPr之位置移動之距離成為2倍。即,於本實施形態中,即便於使透鏡系統GLe之焦點距離Fgs與fθ透鏡系統FT之焦點距離fo相等之情形時,亦可使點光SPr'於光電轉換元件DTo上之掃描速度Vh為點光SP於基板P上之掃描速度Vsp之2倍。於本實施形態中,可使再反射光學系統CE小型化,且作為原點感測器可形成為穩定之構造。 When it is assumed that the spot light of the reflected light beam Bgb' initially reflected by the reflective surface RPa is formed in the photoelectric conversion element DTo, relative to the distance that the spot light moves from the position of the spot light SPr, the spot light SPr' can be made from the point The distance moved by the position of the light SPr is doubled. That is, in this embodiment, even when the focal distance Fgs of the lens system GLe is equal to the focal distance fo of the fθ lens system FT, the scanning speed Vh of the spot light SPr' on the photoelectric conversion element DTo can be made equal to The scanning speed Vsp of the spot light SP on the substrate P is twice as high. In this embodiment, the re-reflective optical system CE can be miniaturized, and the origin sensor can be formed into a stable structure.

[第4實施形態] [Fourth Embodiment]

圖14、圖15係表示第4實施形態之原點感測器之構成,對與上文之第1~第3實施形態相同功能之構件附上相同之符號。圖14係於XY面內觀察以與上文之各實施形態相同之方式配置之多面鏡PM、fθ透鏡系統FT、柱面透鏡CYa、CYb、反射鏡M23之各配置而得之圖。於本實施形態中,於描繪用光束LBn在主掃描方向進行掃描之最大掃描範圍之端部(掃描開始側),在自描繪線SLn偏離之位置, 將再反射光學系統CE1設置於柱面透鏡CYb與基板P之間之空間,該再反射光學系統CE1將描繪用光束LBn作為原點檢測用光束Bgd透過fθ透鏡系統FT反射向多面鏡PM。再反射光學系統CE1由反射鏡MRw及角隅鏡CMw構成,該反射鏡MRw於自描繪線SLn偏離之位置將自柱面透鏡CYb朝X方向投射之光束LBn朝主掃描方向(此處為Y方向)反射,該角隅鏡CMw具有形成為直角之反射面,以使得被反射鏡MRw反射之光束LBn兩次各反射90度後返回至反射鏡MRw。 Figures 14 and 15 show the structure of the origin sensor of the fourth embodiment, and the same symbols are attached to the components with the same functions as the first to third embodiments above. FIG. 14 is a view obtained by observing the configurations of the polygon mirror PM, the fθ lens system FT, the cylindrical lenses CYa, CYb, and the mirror M23 arranged in the same manner as the above embodiments in the XY plane. In this embodiment, at the end (scanning start side) of the maximum scanning range where the drawing light beam LBn scans in the main scanning direction, the re-reflecting optical system CE1 is provided on the cylindrical lens at a position deviated from the drawing line SLn In the space between CYb and the substrate P, the re-reflection optical system CE1 reflects the drawing light beam LBn as the origin detection light beam Bgd through the fθ lens system FT to the polygon mirror PM. The re-reflecting optical system CE1 is composed of a mirror MRw and a cube corner mirror CMw. The mirror MRw deflects the beam LBn projected from the cylindrical lens CYb in the X direction toward the main scanning direction (here Y Direction) reflection, the cube corner mirror CMw has a reflection surface formed at a right angle so that the light beam LBn reflected by the mirror MRw is reflected twice by 90 degrees and then returns to the mirror MRw.

圖14係表示多面鏡PM(反射面RPa)成為如將描繪用光束LBn於描繪線SLn之描繪開始點聚光為點光SP般之角度位置的狀態。於即將達到該狀態之前之時序,被反射面RPa反射之光束LBn作為原點檢測用反射光束Bgb入射至反射鏡MRw,藉由角隅鏡CMw成為如與光束Bgb平行之反射光束Bgc而折回,並再次入射至反射鏡MRw。被反射鏡MRw反射之反射光束Bgc透過柱面透鏡CYb、fθ透鏡系統FT而投射至多面鏡PM之反射面RPa。被反射面RPa反射之光束Bgc之反射光束Bgd以相對於自柱面透鏡CYa投射之原本之光束LBn(Bga)的光路傾斜之角度返回至反射鏡M23。反射光束Bgd由透鏡系統GLb聚光並被光電轉換元件DTo接收。自柱面透鏡CYa投射之原本之光束LBn(Bga)以於如入射至反射鏡MRw之時序自光源裝置LS振盪之方式受到控制。又,角隅鏡CMw之頂角設定於與基板P之面對應之面Pu,光束LBn(Bga)於面Pu聚光為點光。 FIG. 14 shows a state in which the polygon mirror PM (reflection surface RPa) is at an angular position such that the drawing light beam LBn is condensed at the drawing start point of the drawing line SLn as a point light SP. Immediately before reaching this state, the light beam LBn reflected by the reflecting surface RPa is incident on the mirror MRw as the origin detection reflected light beam Bgb, and the cube corner mirror CMw turns into a reflected light beam Bgc parallel to the light beam Bgb and folds back. And it is incident on the mirror MRw again. The reflected light beam Bgc reflected by the mirror MRw passes through the cylindrical lens CYb and the fθ lens system FT and is projected to the reflecting surface RPa of the polygon mirror PM. The reflected light beam Bgd of the light beam Bgc reflected by the reflective surface RPa returns to the mirror M23 at an angle inclined with respect to the optical path of the original light beam LBn(Bga) projected from the cylindrical lens CYa. The reflected light beam Bgd is condensed by the lens system GLb and received by the photoelectric conversion element DTo. The original light beam LBn (Bga) projected from the cylindrical lens CYa is controlled in such a way that it oscillates from the light source device LS at the timing when it is incident on the mirror MRw. In addition, the apex angle of the corner cube CMw is set on the surface Pu corresponding to the surface of the substrate P, and the light beam LBn (Bga) is condensed into a point light on the surface Pu.

圖15係示意性地表示圖14之各光束之光路之圖,為簡化說明,柱面透鏡CYb、反射鏡MRw省略了圖示。於圖15中,多面鏡PM之反射面RPa成為如描繪用光束LBn作為原點檢測用光束Bga入射至角隅鏡CMw之一反射面CMa之角度。此時,光束Bga之主光線Lpa之向反射面RPa之入射角成為角度θβ,於反射面RPa反射之反射光束Bgb之主光線Lpb的反射角亦成為角度θβ。反射光束Bgb於在角隅鏡CMw之反射面CMa反射並於面Pu'成為光點而聚光之後,發散並入射至另一反射面CMb。於反射面CMb反射之光束Bgb之反射光束Bgc之主光線Lpc 與反射光束Bgb之主光線Lpb平行地再入射至fθ透鏡系統FT。反射光束Bgc於通過fθ透鏡系統FT之後,於XY面內(主掃描面)成為大致平行光束,以較角度θβ大之入射角度入射至反射面RPa。因此,於反射面RPa反射之光束Bgc之反射光束Bgd(主光線Lpd)以較角度θβ大之反射角度朝向反射鏡M23。於反射鏡M23反射之反射光束Bgd係藉由透鏡系統GLb而於XY面內在光電轉換元件DTo上聚光為點光SPr。再者,透鏡系統GLb之焦點距離Fgs被設定為與fθ透鏡系統FT之焦點距離fo相同或為其以上。 FIG. 15 is a diagram schematically showing the optical paths of the light beams in FIG. 14. To simplify the description, the illustration of the cylindrical lens CYb and the mirror MRw are omitted. In FIG. 15, the reflection surface RPa of the polygon mirror PM becomes the angle at which the drawing beam LBn is used as the origin detection beam Bga and incident on the reflection surface CMa of the corner mirror CMw. At this time, the incident angle of the chief ray Lpa of the light beam Bga to the reflection surface RPa becomes an angle θβ, and the reflection angle of the chief ray Lpb of the reflected light beam Bgb reflected on the reflection surface RPa also becomes an angle θβ. The reflected light beam Bgb is reflected on the reflective surface CMa of the cube corner mirror CMw and becomes a light spot on the surface Pu' to be condensed, and then diverges and enters the other reflective surface CMb. The chief ray Lpc of the reflected light beam Bgc of the light beam Bgb reflected on the reflective surface CMb and the chief ray Lpb of the reflected light beam Bgb are incident on the fθ lens system FT in parallel. After passing through the fθ lens system FT, the reflected light beam Bgc becomes a substantially parallel light beam in the XY plane (main scanning surface), and enters the reflecting surface RPa at an incident angle larger than the angle θβ. Therefore, the reflected light beam Bgd (principal ray Lpd) of the light beam Bgc reflected on the reflection surface RPa faces the mirror M23 at a reflection angle larger than the angle θβ. The reflected light beam Bgd reflected by the mirror M23 is condensed into a spot light SPr on the photoelectric conversion element DTo in the XY plane by the lens system GLb. Furthermore, the focal distance Fgs of the lens system GLb is set to be the same as or greater than the focal distance fo of the fθ lens system FT.

如圖15所示,自fθ透鏡系統FT投射至基板P側之光束Bgb(LBn)被設定為遠心,故而自fθ透鏡系統FT朝向角隅鏡CMw之反射面CMa之主光線Lpb與fθ透鏡系統FT之光軸AXf平行,因此,自角隅鏡CMw之反射面CMb朝向fθ透鏡系統FT之光束Bgc之主光線Lpc亦與光軸AXf保持平行。若於fθ透鏡系統FT與角隅鏡CMw之間,使光束Bgb在入射至角隅鏡CMw之反射面CMa之範圍內朝箭頭A1之方向進行掃描,則被角隅鏡CMw之反射面CMb反射之光束Bgc朝與箭頭A1反向之箭頭A2之方向進行掃描。因此,如本實施形態般,即便於將描繪用光束LBn用作原點檢測用光束(Bga、Bgb、Bgc、Bgd)之情形時,亦可藉由使用配置於fθ透鏡系統FT之像面側(基板P側)之角隅鏡CMw使原點檢測用光束返回至多面鏡PM之反射面RP,而使橫穿光電轉換元件DTo之點光SPr之掃描速度Vh加快為描繪用光束LBn之點光SP之掃描速度Vsp之2倍左右。 As shown in Fig. 15, the light beam Bgb (LBn) projected from the fθ lens system FT to the side of the substrate P is set to be telecentric, so the chief ray Lpb and fθ lens system from the fθ lens system FT to the reflecting surface CMa of the corner mirror CMw The optical axis AXf of FT is parallel. Therefore, the chief ray Lpc of the light beam Bgc from the reflecting surface CMb of the corner cube CMw toward the fθ lens system FT is also parallel to the optical axis AXf. If between the fθ lens system FT and the corner mirror CMw, the light beam Bgb is incident on the reflection surface CMa of the corner mirror CMw and scanned in the direction of arrow A1, then it will be reflected by the reflection surface CMb of the corner mirror CMw The beam Bgc scans in the direction of arrow A2, which is opposite to arrow A1. Therefore, as in this embodiment, even when the drawing light beam LBn is used as the origin detection light beam (Bga, Bgb, Bgc, Bgd), it can be arranged on the image surface side of the fθ lens system FT. (Substrate P side) The corner cube CMw returns the origin detection beam to the reflecting surface RP of the polygon mirror PM, and accelerates the scanning speed Vh of the spot light SPr across the photoelectric conversion element DTo to the point of the drawing beam LBn The scanning speed of light SP is about twice that of Vsp.

於本實施形態中,由於原點檢測用光束(Bga、Bgb、Bgc)通過fθ透鏡系統FT被光電轉換元件DTo檢測出,故而原點訊號SZn之原點時刻Tog於包含fθ透鏡系統FT之主掃描方向上之光學像差之影響的時序產生。因此,包含由沿著描繪線SLn描繪之圖案中所包含之主掃描方向之光學像差所造成之誤差在內進行精密之描繪。 In this embodiment, since the origin detection light beams (Bga, Bgb, Bgc) are detected by the photoelectric conversion element DTo through the fθ lens system FT, the origin time Tog of the origin signal SZn is at the main point including the fθ lens system FT. The timing of the influence of optical aberrations in the scanning direction is generated. Therefore, precise drawing is performed including errors caused by optical aberrations in the main scanning direction included in the pattern drawn along the drawing line SLn.

[第5實施形態] [Fifth Embodiment]

圖16係表示第5實施形態之原點感測器之構成,對與上文之第1~第4實施形態相同功能之構件附上相同之符號。圖16係於XY面內觀察以與上文之各實施形態相同之方式配置之多面鏡PM、fθ透鏡系統FT、柱面透鏡CYa、CYb、及反射鏡M23之各配置而得之圖。於本實施形態中,與圖14、圖15相同之角隅鏡CMw與反射鏡MRw亦配置於柱面透鏡CYb與基板P之間之空間且描繪線SLn之點光SP之掃描開始位置側。進而,於本實施形態中,與第1、第2實施形態同樣地,將原點檢測用光束Bga(平行光束)自以與描繪用光束LBn不同之波長之連續發光進行輸出之光束送光部60a透過鏡M33投射至多面鏡PM之反射面RP(RPa)。鏡M33於圖16中相對於XY面傾斜45度而配置,來自光束送光部60a之光束Bga自Z方向投射至鏡M33。當多面鏡PM之反射面RP(RPa)成為特定之角度位置時,光束Bga之反射面RP(RPa)處之反射光束Bgb通過fθ透鏡系統FT及柱面透鏡CYb朝向反射鏡MRw。被反射鏡MRw反射且入射至角隅鏡CMw之光束Bgb成為反射光束Bgc而折回,被反射鏡MRw反射後透過柱面透鏡CYb、fθ透鏡系統FT而返回至多面鏡PM之反射面RP(RPa)。返回至反射面RP(RPa)之光束Bgc之反射光束Bgd朝相對於光束Bga傾斜之方向行進,被反射鏡M34反射,透過透鏡系統GLb以成為點光之方式聚光於光電轉換元件DTo上。 Fig. 16 shows the structure of the origin sensor of the fifth embodiment, and the same symbols are attached to the components with the same functions as the first to fourth embodiments above. 16 is a view obtained by observing the configurations of the polygon mirror PM, the fθ lens system FT, the cylindrical lenses CYa, CYb, and the mirror M23 arranged in the same manner as the above embodiments in the XY plane. In this embodiment, the corner mirror CMw and the mirror MRw similar to those in FIGS. 14 and 15 are also arranged in the space between the cylindrical lens CYb and the substrate P and on the side of the scanning start position of the spot light SP that draws the line SLn. Furthermore, in the present embodiment, similar to the first and second embodiments, the beam transmitting unit that outputs the origin detection light beam Bga (parallel light beam) from continuous light emission of a wavelength different from the drawing light beam LBn 60a is projected to the reflecting surface RP (RPa) of the polygon mirror PM through the mirror M33. The mirror M33 is arranged at an inclination of 45 degrees with respect to the XY plane in FIG. 16, and the light beam Bga from the light beam transmitting unit 60a is projected to the mirror M33 from the Z direction. When the reflecting surface RP (RPa) of the polygon mirror PM becomes a specific angular position, the reflected light beam Bgb at the reflecting surface RP (RPa) of the light beam Bga passes through the fθ lens system FT and the cylindrical lens CYb toward the reflecting mirror MRw. The light beam Bgb reflected by the mirror MRw and incident on the corner mirror CMw becomes the reflected light beam Bgc and is folded back. After being reflected by the mirror MRw, it passes through the cylindrical lens CYb and the fθ lens system FT and returns to the reflecting surface RP (RPa) of the polygon mirror PM. ). The reflected light beam Bgd of the light beam Bgc returning to the reflective surface RP (RPa) travels in a direction inclined with respect to the light beam Bga, is reflected by the mirror M34, passes through the lens system GLb, and is focused on the photoelectric conversion element DTo as a point light.

於圖16之構成之情形時,返回至多面鏡PM之反射面RP(RPa)之光束Bgc被投射至與被投射自光束送光部60a投射之光束Bga的反射面RP(RPa)上之XY面內之位置相同之位置。於本實施形態中,可使原點檢測用光束Bga(Bgb、Bgc、Bgd)之波長較描繪用光束LBn之波長更長,可減少對基板P之感光層賦予多餘之感光之情況。再者,若使原點檢測用光束Bga之波長與描繪用光束LBn之波長不同,則產生由柱面透鏡CYb與fθ透鏡系統FT所致之色像差,描繪用光束LBn之點光SP開始進行描繪之基板P上之位置(時序)與原點訊號SZn成為原點時刻Tog之時序會產生與由色像差所致之主掃描方向之誤差(倍率色像 差)相應之固定之時間誤差。然而,只要該時間誤差為固定,則可藉由以奈秒級調整自原點時刻Tog至圖案之描繪開始時間點為止之延遲時間而準確地進行修正。 In the case of the configuration of FIG. 16, the light beam Bgc returning to the reflecting surface RP (RPa) of the polygon mirror PM is projected to XY on the reflecting surface RP (RPa) of the light beam Bga projected from the light beam transmitting portion 60a The same position in the plane. In this embodiment, the wavelength of the origin detection light beam Bga (Bgb, Bgc, Bgd) can be made longer than the wavelength of the drawing light beam LBn, which can reduce the situation where excess light is imparted to the photosensitive layer of the substrate P. Furthermore, if the wavelength of the origin detection light beam Bga is different from the wavelength of the drawing light beam LBn, chromatic aberration caused by the cylindrical lens CYb and the fθ lens system FT occurs, and the point light SP of the drawing light beam LBn starts The position (timing) on the substrate P for drawing and the timing of the origin signal SZn at the time Tog will produce a fixed time error corresponding to the error in the main scanning direction (chromatic aberration of magnification) caused by chromatic aberration . However, as long as the time error is fixed, it can be accurately corrected by adjusting the delay time from the origin time Tog to the pattern drawing start time point in nanoseconds.

以上,於本實施形態中,亦可藉由使用配置於fθ透鏡系統FT之像面側(基板P側)之角隅鏡CMw使原點檢測用光束Bga返回至多面鏡PM之反射面RP,而使橫穿光電轉換元件DTo之點光SPr之掃描速度Vh加快為描繪用光束LBn之點光SP之掃描速度Vsp之2倍左右。 As described above, in this embodiment, the corner mirror CMw arranged on the image surface side (substrate P side) of the fθ lens system FT can also be used to return the origin detection light beam Bga to the reflecting surface RP of the polygon mirror PM. The scanning speed Vh of the spot light SPr traversing the photoelectric conversion element DTo is increased to approximately twice the scanning speed Vsp of the spot light SP of the drawing light beam LBn.

[第5實施形態之變形例] [Variations of the fifth embodiment]

圖17係表示第5實施形態之原點感測器之變形例之構成,對與上文之第1~第5實施形態相同功能之構件附上相同之符號。於圖17中,以自角隅鏡CMw返回至fθ透鏡系統FT(柱面透鏡CYb)之反射光束Bgc之主光線Lpc自與fθ透鏡系統FT之光軸AXf平行之狀態略微地朝主掃描方向傾斜之方式,使角隅鏡CMw之2個反射面CMa、CMb中之反射面CMb相對於光軸AXf自45度傾斜少許。即,使於角隅鏡CMw之反射面CMb反射並行進之反射光束Bgc於主掃描方向上自遠心之狀態變化為非遠心之狀態。藉此,通過fθ透鏡系統FT到達多面鏡PM之反射面RP(RPa)之反射光束Bgc(於XY面內為平行光束)被投射至自於反射面RP(RPa)上投射有原本之光束Bga之部分偏離之部分。因此,於被多面鏡PM之反射面RP(RPa)反射之光束Bgc之反射光束Bgd被反射鏡M23反射並朝向光電轉換元件DTo時,原本之光束Bga之主光線Lpa與反射光束Bgd之主光線Lpd和上文之圖15之狀態相比,以更擴大之角度分離。因此,容易設置檢測反射光束Bgd之光束受光部60b之構成、尤其是使於反射鏡M23反射之反射光束Bgd朝向透鏡系統GLb進而反射之鏡等,又,透鏡系統GLb之配置之自由度提高。 Fig. 17 shows the configuration of a modified example of the origin sensor of the fifth embodiment, and the same reference numerals are attached to the components with the same functions as the first to fifth embodiments above. In FIG. 17, the chief ray Lpc of the reflected beam Bgc returning from the corner mirror CMw to the fθ lens system FT (cylindrical lens CYb) is slightly in the main scanning direction from the state parallel to the optical axis AXf of the fθ lens system FT In the method of tilting, the two reflecting surfaces CMa and CMb of the cube corner mirror CMw are slightly inclined from 45 degrees with respect to the optical axis AXf. That is, the reflected light beam Bgc, which is reflected on the reflecting surface CMb of the corner mirror CMw, is changed from the telecentric state to the non-telecentric state in the main scanning direction. Thereby, the reflected light beam Bgc (parallel light beams in the XY plane) that reaches the reflecting surface RP (RPa) of the polygon mirror PM through the fθ lens system FT is projected onto the reflecting surface RP (RPa) and the original light beam Bga is projected The part that deviates from the part. Therefore, when the reflected light beam Bgd of the light beam Bgc reflected by the reflecting surface RP (RPa) of the polygon mirror PM is reflected by the reflecting mirror M23 and faces the photoelectric conversion element DTo, the chief ray Lpa of the original light beam Bga and the chief ray of the reflected light beam Bgd Compared with the state shown in Figure 15 above, Lpd is separated at a larger angle. Therefore, it is easy to install the structure of the light beam receiving portion 60b that detects the reflected light beam Bgd, especially the mirror that causes the reflected light beam Bgd reflected by the mirror M23 to face the lens system GLb and reflect it, and the degree of freedom in the arrangement of the lens system GLb is improved.

如圖17般,使角隅鏡CMw之2個反射面CMa、CMb中之反射面CMb相對於光軸AXf自45度少許傾斜之構成亦可同樣地應用於上文之圖14、圖15 之第4實施形態。 As shown in Fig. 17, the configuration in which the two reflecting surfaces CMa and CMb of the cube corner mirror CMw are slightly inclined from 45 degrees with respect to the optical axis AXf can also be applied to the above-mentioned Figs. 14 and 15 The fourth embodiment.

[第6實施形態] [Sixth Embodiment]

圖18係表示第6實施形態之原點感測器之構成,對與上文之第1~第5實施形態相同功能之構件附上相同之符號。於本實施形態中,如圖18所示,以如下方式構成原點感測器:於如透過反射鏡M23將描繪用光束LBn投射至多面鏡PM之1個反射面RPh之狀態下,將原點檢測用光束Bga(平行光束)投射至多面鏡PM之反射面RPh之相鄰(前1個)之反射面RPa與反射面RPa之相鄰(前1個)之反射面RPb之2個反射面。自未圖示之光束送光部60a作為平行光束投射之光束Bga被多面鏡PM之反射面RPa反射,成為反射光束Bgb而投射至反射鏡MRa。光束Bgb之反射鏡MRa處之反射光束Bgc被投射至多面鏡PM之反射面RPb,光束Bgc之反射鏡MRb處之反射光束Bgd係藉由透鏡系統GLb成為點光SPr而聚光於光電轉換元件DTo上。於本實施形態中,亦使原點檢測用光束Bga以與多面鏡PM之反射面RP不同之角度反射2次,故而即便透鏡系統GLb之焦點距離Fgs與fθ透鏡系統FT之焦點距離fo大致相同,亦可使橫穿光電轉換元件DTo之點光SPr之掃描速度Vh加快為描繪用光束LBn之點光SP之掃描速度Vsp之2倍左右。 Fig. 18 shows the structure of the origin sensor of the sixth embodiment, and the same symbols are attached to the components with the same functions as the first to fifth embodiments above. In this embodiment, as shown in FIG. 18, the origin sensor is configured as follows: in a state where the drawing light beam LBn is projected to one reflecting surface RPh of the polygon mirror PM through the reflecting mirror M23, the original The spot detection beam Bga (parallel beam) is projected to the reflection surface RPh adjacent to the reflecting surface RPh of the polygon mirror PM. The reflection surface RPa and the adjacent reflecting surface RPa (the first one) reflecting surface RPb reflect two surface. The light beam Bga projected as a parallel light beam from the light beam transmitting unit 60a not shown in the figure is reflected by the reflection surface RPa of the polygon mirror PM, becomes a reflected light beam Bgb, and is projected to the mirror MRa. The reflected light beam Bgc at the reflecting mirror MRa of the light beam Bgb is projected to the reflecting surface RPb of the polygon mirror PM, and the reflected light beam Bgd at the reflecting mirror MRb of the light beam Bgc is converted into a spot light SPr by the lens system GLb and focused on the photoelectric conversion element On DTo. In this embodiment, the origin detection light beam Bga is also reflected twice at a different angle from the reflecting surface RP of the polygon mirror PM, so even if the focal distance Fgs of the lens system GLb is approximately the same as the focal distance fo of the fθ lens system FT It is also possible to increase the scanning speed Vh of the spot light SPr that traverses the photoelectric conversion element DTo to about twice the scanning speed Vsp of the spot light SP of the drawing light beam LBn.

[其他變形例] [Other Modifications]

亦可代替多面鏡PM,而於利用檢流計鏡(掃描構件)所形成之光束掃描裝置(圖案描繪裝置)中,設置例如如上文之圖12所示之原點檢測感測器(透鏡系統GLe、偏振分光鏡BS1、BS2、1/4波長板QP1、QP2、光電轉換元件DTo)作為將檢流計鏡成為既定角度之瞬間設為原點位置進行檢測之原點檢測感測器。對於利用檢流計鏡所形成之光束掃描裝置,亦以如下方式構成:經往復振動之檢流計鏡之反射面一維地偏向之描繪用(或加工用)之光束藉由fθ透鏡系統FT等掃描用光學系統而於基板P(被照射體)上聚光為點光。於檢流計鏡之情形時,亦可使反射描繪用(或加工用)之光束之反射面之背面側為反射面,故而除如 圖12般之原點檢測感測器以外,亦可容易地配置圖3、圖11所示之原點檢測感測器。此外,亦可設為如圖14、圖16所示般透過fθ透鏡系統FT等掃描用光學系統之原點檢測感測器。 It can also replace the polygon mirror PM, and in the beam scanning device (pattern drawing device) formed by the galvanometer mirror (scanning member), for example, the origin detection sensor (lens system) shown in Figure 12 above is provided GLe, polarization beam splitters BS1, BS2, quarter-wavelength plates QP1, QP2, photoelectric conversion element DTo) are used as origin detection sensors that detect the moment when the galvanometer mirror reaches a predetermined angle as the origin position. The beam scanning device formed by the galvanometer mirror is also constructed in the following way: the beam for drawing (or processing) is deflected one-dimensionally by the reflecting surface of the galvanometer mirror reciprocating through the fθ lens system FT The light is condensed into a spot light on the substrate P (irradiated body) by using an optical system for scanning. In the case of galvanometer mirrors, the back side of the reflective surface of the light beam used for reflection drawing (or processing) can also be a reflective surface, so it can be easily used in addition to the origin detection sensor as shown in Figure 12 Ground the origin detection sensor shown in Figure 3 and Figure 11. In addition, as shown in FIG. 14 and FIG. 16, it can also be set as an origin detection sensor that transmits a scanning optical system such as fθ lens system FT.

又,於上述各實施形態中,使原點檢測用光束Bga於多面鏡PM之反射面RP反射2次後利用光電轉換元件DTo接收,但亦可為反射3次以上後利用光電轉換元件DTo接收。於此情形時,例如若如圖18般將使於多面鏡PM之第1反射面(RPh)反射之光束Bga於第2反射面(RPa)反射的構成與如圖11般之再反射光學系統CE組合,則可容易地構成3次反射之原點檢測感測器。 In addition, in each of the above embodiments, the origin detection light beam Bga is reflected twice on the reflecting surface RP of the polygon mirror PM and then received by the photoelectric conversion element DTo, but it may be reflected by the photoelectric conversion element DTo after three times or more and received by the photoelectric conversion element DTo. . In this case, for example, if the light beam Bga reflected on the first reflecting surface (RPh) of the polygon mirror PM is reflected on the second reflecting surface (RPa) as shown in Fig. 18 and the re-reflecting optical system as shown in Fig. 11 The CE combination can easily form an origin detection sensor with three reflections.

AXo‧‧‧中心軸 AXo‧‧‧Central axis

AXp‧‧‧旋轉軸 AXp‧‧‧Rotation axis

DR‧‧‧旋轉筒 DR‧‧‧Rotating drum

EX‧‧‧曝光裝置(圖案描繪裝置) EX‧‧‧Exposure device (pattern drawing device)

FT‧‧‧fθ透鏡系統(描繪用掃描透鏡) FT‧‧‧fθ lens system (scanning lens for drawing)

IM1~IM6‧‧‧入射鏡 IM1~IM6‧‧‧Entrance mirror

LS‧‧‧光源裝置 LS‧‧‧Light source device

M1~M12‧‧‧反射鏡 M1~M12‧‧‧Mirror

M20~M24‧‧‧反射鏡 M20~M24‧‧‧Mirror

OS1~OS6‧‧‧選擇用光學元件 OS1~OS6‧‧‧Optical components for selection

P‧‧‧基板(被照射體) P‧‧‧Substrate (irradiated body)

PM‧‧‧多面鏡 PM‧‧‧Polygon mirror

RP‧‧‧反射面 RP‧‧‧Reflecting surface

SL1~SL6‧‧‧描繪線 SL1~SL6‧‧‧Drawing line

TR‧‧‧吸收體 TR‧‧‧Absorber

U1~U6‧‧‧描繪單元 U1~U6‧‧‧Drawing unit

X、Y、Z‧‧‧方向 X, Y, Z‧‧‧direction

Claims (18)

一種光束掃描裝置,其係具備使經角度可變之掃描構件之反射面偏向之加工用光束入射,並使上述加工用光束於被照射體聚光為光點之掃描用光學系統,且根據上述掃描構件之反射面之角度變化使上述光點進行掃描,且具備:光束送光部,其將用以檢測上述掃描構件之反射面成為既定角度之原點的檢測用光束投射至上述掃描構件之反射面;光束反射部,其使於上述掃描構件之反射面反射之上述檢測用光束入射,並反射向上述掃描構件之反射面;及檢測部,其基於在上述掃描構件之反射面再次反射之上述檢測用光束之反射光束,輸出表示上述原點之原點訊號。 A beam scanning device is provided with a scanning optical system that deflects the reflective surface of a scanning member with a variable angle to a processing beam incident, and condenses the processing beam on an irradiated body into a light spot, and according to the above The angle change of the reflective surface of the scanning member causes the light spot to be scanned, and it is equipped with a light beam sending unit that projects a detection light beam for detecting that the reflective surface of the scanning member becomes the origin of a predetermined angle to the scanning member A reflection surface; a light beam reflection portion which makes the detection light beam reflected on the reflection surface of the scanning member incident and reflects to the reflection surface of the scanning member; and a detection portion which is based on being reflected again on the reflection surface of the scanning member The reflected light beam of the detection light beam outputs an origin signal representing the origin. 如申請專利範圍第1項之光束掃描裝置,其中上述光束送光部具備第1光學元件,該第1光學元件具有用以使來自連續發光之檢測用光源之光束成形為平行光束而作為上述檢測用光束之折射能力。 For example, the light beam scanning device of the first item of the scope of patent application, wherein the light beam sending part is provided with a first optical element, and the first optical element is provided for shaping the light beam from the continuous light-emitting detection light source into a parallel light beam as the detection Use the refractive power of the beam. 如申請專利範圍第2項之光束掃描裝置,其中上述檢測部具備:光電檢測器,其接收於上述掃描構件之反射面第2次反射之上述反射光束並輸出上述原點訊號;及第2光學元件,其具有用以使上述反射光束聚光於上述光電檢測器之折射能力。 For example, the light beam scanning device of the second item of the scope of patent application, wherein the detection unit includes: a photodetector that receives the reflected light beam reflected for the second time on the reflective surface of the scanning member and outputs the origin signal; and second optics An element having refractive power for condensing the reflected light beam on the photodetector. 如申請專利範圍第3項之光束掃描裝置,其中上述光束送光部具備第1光分割元件,該第1光分割元件係以使來自上述檢測用光源之光束朝向上述第1光學元件之方式配置,上述檢測部具備第2光分割元件,該第2光分割元件係以使被上述掃描構件之反射面第2次反射而入射至上述第2光學元件之上述反射光束朝向上述光電檢測器之方式配置, 上述第2光分割元件具有將被上述掃描構件之反射面最初反射而入射至上述第2光學元件之反射光束朝向上述第1光分割元件進行分割之分離面,上述第1光分割元件具有將來自上述第2光分割元件之上述反射光束朝向上述第1光學元件進行分割之分離面。 For example, the light beam scanning device of the third item of the scope of patent application, wherein the light beam sending part is provided with a first light splitting element, and the first light splitting element is arranged in such a way that the light beam from the detection light source is directed toward the first optical element The detection section includes a second light splitting element, and the second light splitting element is configured to cause the reflected light beam incident on the second optical element to be reflected for the second time by the reflective surface of the scanning member toward the photodetector Arranged, the second light splitting element has a splitting surface for splitting the reflected light beam initially reflected by the reflective surface of the scanning member and incident on the second optical element toward the first light splitting element, and the first light splitting element has The reflected light beam from the second optical splitting element is directed toward a splitting surface where the first optical splitting element is split. 如申請專利範圍第4項之光束掃描裝置,其中上述第1光分割元件與上述第2光分割元件係以各自之上述分離面形成為直角之方式配置之偏振分光鏡。 For example, the light beam scanning device of the 4th patent application, wherein the first light splitting element and the second light splitting element are polarizing beam splitters arranged in such a way that the respective separating surfaces are formed at right angles. 如申請專利範圍第5項之光束掃描裝置,其中上述第1光學元件與上述第2光學元件分別由隔著1個聚光光學系統之光軸之2個部分構成。 For example, the light beam scanning device of the 5th item of the scope of patent application, wherein the first optical element and the second optical element are respectively composed of two parts separated by the optical axis of a condensing optical system. 如申請專利範圍第3至6項中任一項之光束掃描裝置,其中上述第2光學元件之焦點距離被設定為與上述掃描用光學系統之焦點距離相同或較長。 For example, the light beam scanning device of any one of items 3 to 6 in the scope of patent application, wherein the focal distance of the second optical element is set to be the same as or longer than the focal distance of the scanning optical system. 如申請專利範圍第1項之光束掃描裝置,其中上述掃描構件為繞旋轉中心軸旋轉之旋轉多面鏡,上述光束反射部係以被上述旋轉多面鏡之第1反射面反射之上述檢測用光束的反射光束朝向與上述第1反射面不同之上述旋轉多面鏡之第2反射面反射的方式配置。 For example, the light beam scanning device of the first item of the scope of patent application, wherein the scanning member is a rotating polygon mirror that rotates around a central axis of rotation, and the light beam reflecting part is composed of the detection light beam reflected by the first reflecting surface of the rotating polygon mirror. The reflected light beam is arranged such that it is reflected toward the second reflecting surface of the rotating polygon mirror which is different from the first reflecting surface. 一種圖案描繪裝置,其係具備使經角度可變之掃描構件之反射面偏向之描繪用光束入射,並使上述描繪用光束於基板聚光為光點之掃描用光學系統,且一面根據上述掃描構件之反射面之角度變化使上述光點進行掃描,一面根據圖案調變上述描繪用光束之強度,而於上述基板描繪圖案,且具備:光束送光部,其將用以檢測上述掃描構件之反射面成為既定角度之原點的檢測用光束投射至上述掃描構件之反射面; 光束反射部,其使於上述掃描構件之反射面反射之上述檢測用光束入射,並反射向上述掃描構件之反射面;檢測部,其基於在上述掃描構件之反射面再次反射之上述檢測用光束之反射光束,輸出表示上述原點之原點訊號;及控制部,其基於上述原點訊號而控制利用上述光點所進行之上述圖案之描繪。 A pattern drawing device is provided with a scanning optical system that deflects a light beam for drawing that is deflected by a reflective surface of a scanning member with a variable angle, and condenses the light beam for drawing on a substrate as a light spot, and one surface is based on the scanning The angle change of the reflecting surface of the component causes the light spot to scan, while the intensity of the drawing light beam is adjusted according to the pattern, and the pattern is drawn on the substrate, and it is equipped with a light beam transmitting part, which will be used to detect the scanning component. The detection light beam whose reflection surface becomes the origin of a predetermined angle is projected to the reflection surface of the scanning member; a light beam reflection portion that causes the detection light beam reflected on the reflection surface of the scanning member to enter and is reflected toward the reflection of the scanning member A detection unit, which outputs an origin signal representing the origin based on the reflected light beam of the detection beam again reflected on the reflective surface of the scanning member; and a control unit, which controls the use of the light based on the origin signal Click on the depiction of the above-mentioned pattern. 如申請專利範圍第9項之圖案描繪裝置,其中上述光束送光部具備第1光學元件,該第1光學元件具有用以使來自連續發光之檢測用光源之光束成形為平行光束而作為上述檢測用光束之折射能力。 For example, the pattern drawing device of item 9 of the scope of patent application, wherein the light beam sending part is provided with a first optical element, and the first optical element is provided for shaping the light beam from the continuous light-emitting detection light source into a parallel light beam as the detection Use the refractive power of the beam. 如申請專利範圍第10項之圖案描繪裝置,其中上述檢測部具備:光電檢測器,其接收於上述掃描構件之反射面第2次反射之上述反射光束並輸出上述原點訊號;及第2光學元件,其具有用以使上述反射光束聚光於上述光電檢測器之折射能力。 For example, the pattern drawing device of item 10 in the scope of patent application, wherein the detection unit includes: a photodetector, which receives the reflected light beam secondly reflected on the reflective surface of the scanning member and outputs the origin signal; and second optics An element having refractive power for condensing the reflected light beam on the photodetector. 如申請專利範圍第10項之圖案描繪裝置,其中上述光束送光部具備第1光分割元件,該第1光分割元件係以使來自上述檢測用光源之光束朝向上述第1光學元件之方式配置,上述檢測部具備第2光分割元件,該第2光分割元件係以使被上述掃描構件之反射面第2次反射而入射至上述第2光學元件之上述反射光束朝向上述光電檢測器之方式配置,上述第2光分割元件具有將被上述掃描構件之反射面最初反射而入射至上述第2光學元件之反射光束朝向上述第1光分割元件進行分割之分離面,上述第1光分割元件具有將來自上述第2光分割元件之上述反射光束朝向上述第1光學元件進行分割之分離面。 For example, the pattern drawing device of claim 10, wherein the light beam transmitting section includes a first light splitting element, and the first light splitting element is arranged in such a way that the light beam from the detection light source is directed toward the first optical element The detection section includes a second light splitting element, and the second light splitting element is configured to cause the reflected light beam incident on the second optical element to be reflected for the second time by the reflective surface of the scanning member toward the photodetector Arranged, the second light splitting element has a splitting surface for splitting the reflected light beam initially reflected by the reflective surface of the scanning member and incident on the second optical element toward the first light splitting element, and the first light splitting element has The reflected light beam from the second optical splitting element is directed toward a splitting surface where the first optical splitting element is split. 如申請專利範圍第12項之圖案描繪裝置,其中 上述第1光分割元件與上述第2光分割元件係以各自之上述分離面形成為直角之方式配置之偏振分光鏡。 For example, the pattern drawing device of the 12th patent application, wherein the first light splitting element and the second light splitting element are polarizing beam splitters arranged such that the respective separating surfaces are formed at right angles. 如申請專利範圍第13項之圖案描繪裝置,其中上述第1光學元件與上述第2光學元件分別由隔著1個聚光光學系統之光軸之2個部分構成。 For example, the pattern drawing device of item 13 of the scope of patent application, wherein the first optical element and the second optical element are respectively composed of two parts separated by the optical axis of a condensing optical system. 如申請專利範圍第11至14項中任一項之圖案描繪裝置,其中上述第2光學元件之焦點距離被設定為與上述掃描用光學系統之焦點距離相同或較長。 For example, the pattern drawing device of any one of the 11th to 14th items in the scope of patent application, wherein the focal distance of the second optical element is set to be the same as or longer than the focal distance of the scanning optical system. 一種光束掃描裝置,其係利用掃描用光學系統使藉由旋轉多面鏡之複數個反射面之中之一者而偏向之加工用光束於被照射體聚光為光點,且藉由上述旋轉多面鏡之旋轉而使上述光點進行掃描,且具備:光束送光部,其將用以檢測上述旋轉多面鏡之複數個反射面之各者成為既定角度之原點的檢測用光束投射至上述旋轉多面鏡之反射面;光束反射部,其使於上述旋轉多面鏡之反射面反射之上述檢測用光束入射,並反射向上述旋轉多面鏡之反射面;及光束檢測部,其接收於上述旋轉多面鏡之反射面再次反射之上述檢測用光束之反射光束,並輸出表示上述原點之原點訊號。 A beam scanning device which utilizes a scanning optical system to condense a processing beam deflected by one of a plurality of reflecting surfaces of a rotating polygon mirror into a light spot on an irradiated body, and by the above-mentioned rotating polygon The rotation of the mirror causes the light spot to be scanned, and it is provided with a light beam transmitting unit that projects a detection light beam for detecting each of the plurality of reflecting surfaces of the rotating polygonal mirror as the origin of a predetermined angle to the rotation The reflecting surface of the polygonal mirror; a beam reflecting portion that makes the detection light beam reflected on the reflecting surface of the rotating polygonal mirror incident and reflecting to the reflecting surface of the rotating polygonal mirror; and a beam detecting portion that is received by the rotating polygonal mirror The reflected light beam of the above-mentioned detection light beam reflected by the reflecting surface of the mirror again, and an origin signal representing the above-mentioned origin is output. 如申請專利範圍第16項之光束掃描裝置,其中上述光束送光部具備具有用以使上述檢測用光束成形為平行光束之折射能力之第1光學元件,上述檢測部具備:光電檢測器,其接收上述檢測用光束之上述反射光束並輸出上述原點訊號;及第2光學元件,其具有用以使上述反射光束聚光於上述光電檢測器之折射能力。 For example, the beam scanning device of the 16th patent application, wherein the light beam sending unit has a first optical element having refractive power for shaping the detection beam into a parallel beam, and the detection unit has: a photodetector, which Receiving the reflected light beam of the detection light beam and outputting the origin signal; and a second optical element having a refractive power for condensing the reflected light beam on the photodetector. 如申請專利範圍第17項之光束掃描裝置,其中 使上述檢測部之上述第2光學元件之焦點距離與上述掃描用光學系統之焦點距離相同或較長。 For example, the light beam scanning device in the scope of patent application, wherein the focal distance of the second optical element of the detection unit is the same as or longer than the focal distance of the scanning optical system.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6462855B1 (en) * 1999-09-24 2002-10-08 Toshiba Tec Kabushiki Kaisha Light beam scanning apparatus
WO2016152758A1 (en) * 2015-03-20 2016-09-29 株式会社ニコン Beam scanning device, beam scanning method, and rendering device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5386221A (en) * 1992-11-02 1995-01-31 Etec Systems, Inc. Laser pattern generation apparatus
JPH08110488A (en) * 1994-10-11 1996-04-30 Canon Inc Optical scanning device
JPH09159945A (en) * 1995-12-04 1997-06-20 Komatsu Ltd Device and method for detecting mirror angle
US6037967A (en) * 1996-12-18 2000-03-14 Etec Systems, Inc. Short wavelength pulsed laser scanner
DE19726581C5 (en) * 1997-06-23 2010-02-04 Sick Ag Method for determining the focus position of an optoelectronic device
JP2003255256A (en) * 2002-02-28 2003-09-10 Moritex Corp Light scanning device
US20050200929A1 (en) * 2004-03-15 2005-09-15 Michael Plotkin Out of plane start of scan
JP4943493B2 (en) * 2009-12-04 2012-05-30 シャープ株式会社 Optical scanning apparatus and image forming apparatus having the same
KR102164337B1 (en) * 2014-04-28 2020-10-12 가부시키가이샤 니콘 Pattern exposure device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6462855B1 (en) * 1999-09-24 2002-10-08 Toshiba Tec Kabushiki Kaisha Light beam scanning apparatus
WO2016152758A1 (en) * 2015-03-20 2016-09-29 株式会社ニコン Beam scanning device, beam scanning method, and rendering device

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