TWI721247B - 顯示裝置製造用光罩、及顯示裝置之製造方法 - Google Patents
顯示裝置製造用光罩、及顯示裝置之製造方法 Download PDFInfo
- Publication number
- TWI721247B TWI721247B TW107104933A TW107104933A TWI721247B TW I721247 B TWI721247 B TW I721247B TW 107104933 A TW107104933 A TW 107104933A TW 107104933 A TW107104933 A TW 107104933A TW I721247 B TWI721247 B TW I721247B
- Authority
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- Taiwan
- Prior art keywords
- pattern
- main
- photomask
- display device
- manufacturing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 87
- 230000010363 phase shift Effects 0.000 claims abstract description 86
- 238000012546 transfer Methods 0.000 claims abstract description 72
- 238000002834 transmittance Methods 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 230000005540 biological transmission Effects 0.000 claims description 44
- 230000007547 defect Effects 0.000 claims description 21
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- 230000003287 optical effect Effects 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 13
- 230000005484 gravity Effects 0.000 claims description 9
- 230000007812 deficiency Effects 0.000 claims 1
- 239000010408 film Substances 0.000 description 145
- 229920002120 photoresistant polymer Polymers 0.000 description 19
- 239000000463 material Substances 0.000 description 12
- 238000005530 etching Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- 238000004088 simulation Methods 0.000 description 8
- 238000001039 wet etching Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000013459 approach Methods 0.000 description 5
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- 238000013041 optical simulation Methods 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
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- 239000000203 mixture Substances 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
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- 230000035945 sensitivity Effects 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- XMPZTFVPEKAKFH-UHFFFAOYSA-P ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 description 1
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- 238000000576 coating method Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
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- 229910052735 hafnium Inorganic materials 0.000 description 1
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- 238000010030 laminating Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/76—Patterning of masks by imaging
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
- H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017046175 | 2017-03-10 | ||
JP2017-046175 | 2017-03-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201843523A TW201843523A (zh) | 2018-12-16 |
TWI721247B true TWI721247B (zh) | 2021-03-11 |
Family
ID=63625803
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110104097A TWI777402B (zh) | 2017-03-10 | 2018-02-12 | 顯示裝置製造用光罩、及顯示裝置之製造方法 |
TW107104933A TWI721247B (zh) | 2017-03-10 | 2018-02-12 | 顯示裝置製造用光罩、及顯示裝置之製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110104097A TWI777402B (zh) | 2017-03-10 | 2018-02-12 | 顯示裝置製造用光罩、及顯示裝置之製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP6808665B2 (ja) |
KR (2) | KR102209088B1 (ja) |
CN (2) | CN108594594B (ja) |
TW (2) | TWI777402B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7383490B2 (ja) * | 2020-01-07 | 2023-11-20 | 株式会社エスケーエレクトロニクス | フォトマスク |
CN113260178B (zh) * | 2021-06-16 | 2021-09-28 | 广东科翔电子科技股份有限公司 | 一种刚挠结合板高精密线路的制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004012260A1 (ja) * | 2002-07-30 | 2004-02-05 | Tamura Corporation | 精密加工用ステージ装置 |
US7448503B2 (en) * | 2001-05-18 | 2008-11-11 | Milliken & Company | Multi-patterned surface covering sample elements, display systems, and methods |
TW201604643A (zh) * | 2014-07-17 | 2016-02-01 | Hoya股份有限公司 | 光罩、光罩之製造方法、光罩基底及顯示裝置之製造方法 |
TW201627751A (zh) * | 2014-09-29 | 2016-08-01 | Hoya股份有限公司 | 光罩及顯示裝置之製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3257232B2 (ja) * | 1994-02-16 | 2002-02-18 | ソニー株式会社 | 位相シフトマスク |
JP3577363B2 (ja) * | 1994-06-29 | 2004-10-13 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
US6022644A (en) * | 1998-03-18 | 2000-02-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mask containing subresolution line to minimize proximity effect of contact hole |
JP3746497B2 (ja) * | 2003-06-24 | 2006-02-15 | 松下電器産業株式会社 | フォトマスク |
JP2006338057A (ja) * | 2006-09-25 | 2006-12-14 | Matsushita Electric Ind Co Ltd | フォトマスク |
KR20090045493A (ko) * | 2007-11-02 | 2009-05-08 | 주식회사 동부하이텍 | 반도체 소자 제조용 마스크 및 이를 이용한 반도체 소자의제조 방법과, 상기 마스크 및 제조 방법에 의해 제조되는반도체 소자 |
JP6022644B2 (ja) * | 2015-07-14 | 2016-11-09 | 株式会社タイトー | ゲーム機 |
-
2018
- 2018-01-29 JP JP2018012734A patent/JP6808665B2/ja active Active
- 2018-02-12 TW TW110104097A patent/TWI777402B/zh active
- 2018-02-12 TW TW107104933A patent/TWI721247B/zh active
- 2018-03-07 CN CN201810185361.6A patent/CN108594594B/zh active Active
- 2018-03-07 CN CN202310372114.8A patent/CN116500854A/zh active Pending
- 2018-03-08 KR KR1020180027587A patent/KR102209088B1/ko active IP Right Grant
-
2020
- 2020-12-09 JP JP2020203848A patent/JP2021047449A/ja active Pending
-
2021
- 2021-01-22 KR KR1020210009641A patent/KR102245531B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7448503B2 (en) * | 2001-05-18 | 2008-11-11 | Milliken & Company | Multi-patterned surface covering sample elements, display systems, and methods |
WO2004012260A1 (ja) * | 2002-07-30 | 2004-02-05 | Tamura Corporation | 精密加工用ステージ装置 |
TW201604643A (zh) * | 2014-07-17 | 2016-02-01 | Hoya股份有限公司 | 光罩、光罩之製造方法、光罩基底及顯示裝置之製造方法 |
TW201627751A (zh) * | 2014-09-29 | 2016-08-01 | Hoya股份有限公司 | 光罩及顯示裝置之製造方法 |
TW201740184A (zh) * | 2014-09-29 | 2017-11-16 | Hoya股份有限公司 | 圖案轉印方法及顯示裝置之製造方法 |
TW201743129A (zh) * | 2014-09-29 | 2017-12-16 | Hoya股份有限公司 | 光罩及顯示裝置之製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN108594594B (zh) | 2023-05-02 |
TW202129402A (zh) | 2021-08-01 |
KR102209088B1 (ko) | 2021-01-28 |
KR20210011481A (ko) | 2021-02-01 |
CN108594594A (zh) | 2018-09-28 |
JP2021047449A (ja) | 2021-03-25 |
CN116500854A (zh) | 2023-07-28 |
TW201843523A (zh) | 2018-12-16 |
KR20180103743A (ko) | 2018-09-19 |
JP6808665B2 (ja) | 2021-01-06 |
TWI777402B (zh) | 2022-09-11 |
JP2018151618A (ja) | 2018-09-27 |
KR102245531B1 (ko) | 2021-04-29 |
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