TWI715138B - Bessel laser system with variable zoom mechanism - Google Patents

Abstract

The present invention relates to a Bessel laser system with a zoom-length mechanism, which generates a laser beam with a fixed diameter for a laser light-emitting device, and achieves the zoom effect by changing the diameter of the laser beam; one is through adjustment The diameter module changes the diameter of the laser beam, and then changes the laser beam to a gradual radially symmetrical gradual diameter through the phase conversion module. Finally, the focusing lens module focuses the laser beam on the working point; , After adjusting the phase conversion module to change the laser beam to a gradual radially symmetrical gradual diameter, and then through the variable curvature lens module to change the diameter of the laser beam, and finally the focusing lens module focuses the laser beam on Working point; you can also mix the above to achieve a better zoom effect.

Description

Bessel laser system with variable zoom mechanism

The present invention relates to a Bessel laser system, which is concerned with changing the focal length to achieve laser processing of processed parts, and particularly uses an adjustable focal length module to quickly change the focal length, thereby completing the control of the focus distance.

The recent development of advanced packaging technologies for applications such as smart phones, 5G communications, and the Internet of Things must meet the following design requirements: a) high performance; b) miniaturization; c) low cost; d) multifunction. However, due to the following reasons, there are basic difficulties in implementing all system functions in one chip: a) interference between separated functional blocks; b) design complexity and process limitations of different technology nodes; c) cost considerations; therefore, the current A 3D IC stack vertically interconnected with the interposer is proposed to achieve higher performance, lower power consumption and smaller footprint than traditional 2D packaging technology.

Current methods are mainly based on silicon or plastic interposers; among them, silicon interposers made of Through-Silicon Via (TSV) can achieve the required wiring and input/output density, but are not cost-effective; The plastic interposer provides a cost-effective solution, but it faces several challenges due to its poor dimensional stability and the coefficient of thermal expansion (CTE) that does not match that of silicon wafers; therefore, glass has favorable material properties , Use it as an alternative intermediary layer. The coefficient of thermal expansion (CTE) of glass is low and similar to silicon, which provides good thermal stability; in addition, glass has a high resistivity, which leads to lower insertion loss and crosstalk compared with silicon; ,glass Excellent mechanical strength provides the possibility of ultra-thin and flexible substrates, and glass is cost-effective; as mentioned above, all these characteristics indicate that glass will be an excellent electronic insertion material.

Although glass has many advantages as described above, there are still many glass challenges that need to be solved; for example, the basic material of glass is limited to brittle materials and has very low thermal conductivity; a lot has been done to improve the performance of the glass interposer Efforts include the formation of small-diameter through holes with small spacing without cracks, thermal management through low thermal conductivity glass substrates, and reliable metallization of through glass via (TGV) with good adhesion.

The most important thing is to reduce the formation of cracks, because it has a profound impact on the performance and reliability of the product; and glass cracks can be produced in a variety of ways, such as processing and through-hole formation; usually, the cracks in the glass withstand high-power lightning Radiation ablation is used to form through holes; therefore, different types of lasers and beam formation must be studied in depth to reduce crack formation.

Through Glass Via (TGV) requirements for short distances and high through hole density provide the feasibility of product design, and improve thermal management through the low thermal conductivity of the glass substrate; for this reason, it further improves the crack-free communication The challenge of hole formation; in addition, the coefficient of thermal expansion (CTE) mismatch between glass and copper metallization leads to high thermomechanical stress at the interface; this stress may cause fatigue-related failure modes during reliability testing, Especially in the presence of surface cracks.

In addition, voids can be formed in through holes during metallization, which are affected by the surface roughness of the through holes and the geometry of the through holes; through the deposition of the metal layer, the metal atoms face the target surface within a certain cone angle Mobile, so it is more difficult to obtain complete coverage of the metallization at the deep trench. This kind of void or so-called "nail-head" forming metallization in the via will cause current crowding and additional "hot spots". According to research, these thermo-mechanical stresses can cause the degeneration of the via; Therefore, there is a need for a tapered through hole with a certain inclined side wall at the through hole.

Usually, a multi-pulse laser beam is focused on the surface of the object or a point inside the object, and the laser is used for ablation and surface treatment of a wide range of materials; among them, the start of ablation occurs above the threshold fluence, which depends on Material absorption mechanism and laser parameters, such as wavelength and pulse duration; when the excitation time is shorter than the thermalization time in the material, non-thermal, photochemical ablation may occur, in which direct ionization and the formation of dense electron-hole plasma It can lead to direct bond breakage and explosive disintegration of the lattice through electron repulsion (Bremsstrahlung); material removal is accompanied by a highly directional plume ejected from the illuminated area; where the vapor plume can contain clusters of solid and liquid material.

Generally, a shorter pulse laser applies energy to the material faster, resulting in a faster material ejection; the volume of material directly excited by the laser takes less time to transfer energy to the surrounding material before being ejected; therefore , The ablation volume is more accurately defined by the spatial profile and optical penetration depth of the laser, and the remaining material has less residual energy, which reduces the formation of cracks in the glass; however, when using a multi-pulse laser beam to When the material is ablated, cumulative changes in the surface texture, morphology and chemistry of the material may occur, even in a single laser pulse with excess energy above the threshold, which is usually considered as a material change caused by laser irradiation; In the glass manufacturing process, these materials can be modified for further glass processing, such as chemical etching, to produce certain patterns or through holes in the glass.

However, it is hoped to produce crack-free and precisely defined material modification areas for the glass process; however, ideally using ultra-short lasers, such as picosecond or femtosecond pulse lasers, can be used in the entire A channel is formed on the substrate, and the thermally affected volume is the smallest. The energy just exceeds the threshold energy is the best laser condition for ablating glass; according to the Rayleigh criterion, the depth of focus (DOF) is a matter of wavelength, and the numerical aperture ( numerical aperture,NA) And the beam waist diameter (beam waist diameter) is a relative discussion; therefore, the depth of focus (DOF) decreases with the beam waist diameter (or increased peak intensity) and numerical aperture (NA) values Therefore, a Gaussian beam with a high numerical aperture lens tends to focus the radiation into a micron-sized spot, and the use of Bessel beams introduces a more effective method of generating such long channels with only one pulse; that’s it It is advantageous to use Quasi-Bessel Laser Beam for ablation applications of transparent materials such as glass.

The main feature of Quasi-Bessel Laser Beam is the focal point, which is not a point but a focal line; the ideal Bessel beam requires an infinite lens diameter and contains infinite energy, so it is unrealistic , And can be approximated to Bessel beam or quasi-Bessel beam by truncating the ideal plane wave, resulting in a limited focal length. In practice, different methods have been used to generate quasi-Bessel beams; these include generating Bessel-Gaussian beams by focusing the Gaussian beam with an axicon lens, placing an annular aperture in the focal plane of the convex lens and using spatial light modulation A Spatial Light Modulator (SLM) or Diffractive Optical Beam Shaping Element (DOE) is used to apply a phase distribution on the laser beam.

Please refer to Figure 1, which is a schematic diagram of a traditional Bessel laser system. It can be seen that a laser light emitting device (10) generates a laser beam (X) with a fixed diameter (Y), and then passes through a modulated phase conversion mode The group (20) changes the diameter of the laser beam (X) to a progressively enlarged radial symmetry, and then a focusing lens module (30) focuses the laser beam (X) on a working point (Z), where the focus is The lens module (30) to the working point (Z) is the focal length W; because the traditional focal length W and the working point (Z) are fixed, the laser processing needs to be adjusted for the workpiece each time the system is used for laser processing The focus position of the beam (X), the traditional focus adjustment is mostly to replace the focusing lens module (30), which is time-consuming and inefficient depending on the processing angle.

Therefore, in order to solve the above problems, the main purpose of the present invention is to provide a Bessel laser system with a variable zoom mechanism to improve the above problems.

In view of the above problems, the present invention provides a Bessel laser system with a zoom-length mechanism, which indirectly affects the focus position by changing the diameter of the laser beam.

Therefore, the main purpose of the present invention is to provide a Bessel laser system with a zoom-length mechanism, with a module capable of changing the diameter of the laser beam, which can dynamically adjust the laser processing focal length during the laser processing process.

Another object of the present invention is to provide a Bessel laser system with a zoom-length mechanism that uses multiple modules to change the diameter of the laser beam to increase the speed of changing the focal length of the laser.

Another object of the present invention is to provide a Bessel laser system with a zoom-length mechanism that uses the beam reduction element and the beam enlargement element in the diameter adjustment module to adjust the focal length in a large range.

Another object of the present invention is to provide a Bessel laser system with a zoom and long mechanism, which can quickly complete focus adjustment in a short distance by virtue of the characteristics of the variable curvature lens module.

In order to achieve the above objective, the main technical means used in the present invention are achieved by the following technical solutions. The present invention is a Bessel laser system with a zoom-length mechanism, which is characterized in that a laser light-emitting device generates a laser beam with a fixed diameter, and then passes a straight adjustment The diameter module changes the diameter of the laser beam, and then changes the laser beam to a gradual radially symmetrical gradual diameter through a phase adjustment module. Finally, a focusing lens module focuses the laser beam on a working point .

In order to achieve the above objective, another main technical means used in the present invention is achieved by the following technical solutions. The present invention is a Bessel laser system with a zoom-length mechanism, which is characterized in that a laser light-emitting device generates a laser beam with a fixed diameter, and then changes the laser beam to a gradual change through a phase adjustment module The radially symmetrical gradient diameter of the laser beam is changed by a variable curvature lens module, and finally a focusing lens module focuses the laser beam on a working point.

In order to achieve the above objective, another main technical means used in the present invention is achieved by the following technical solutions. The present invention is a Bessel laser system with a zoom-length mechanism, which is characterized in that a laser light-emitting device generates a laser beam of a fixed diameter, and then changes the laser beam into a variable curvature lens module. The gradual radially symmetrical gradual diameter is changed, and then the gradual diameter of the laser beam is changed by a phase adjustment module, and finally the laser beam is focused on a working point by a focusing lens module.

The purpose of the present invention and the solution of its technical problems can be further achieved by adopting the following technical measures.

In the aforementioned system, a variable curvature lens module is added to either end of the adjustment phase conversion module, and the variable curvature lens module is adjusted to change the diameter of the laser beam.

In the aforementioned system, an adjustment diameter module is added between the laser light emitting device and the phase adjustment conversion module, and the diameter adjustment module is adjusted to change the diameter of the laser beam.

In the aforementioned system, the diameter-adjusting module includes a beam reduction element and a Beam amplification element.

In the aforementioned system, the beam reducing element can reduce the diameter of the laser beam to keep the working point away from the focusing lens module.

In the aforementioned system, the beam magnifying element can magnify the diameter of the laser beam to draw the working point closer to the focusing lens module.

Compared with the conventional technology, the present invention has the following effects: (1) With a module capable of changing the diameter of the laser beam, the laser processing focal length can be dynamically adjusted during the laser processing; (2) using multiple sets of tools to change the laser beam The module of the diameter of the beam can increase the speed of changing the focal length of the laser processing; (3) Use the beam reduction element and beam enlargement element in the diameter adjustment module to adjust the focal length in a large range; (4) With variable curvature The characteristics of the lens module can quickly complete the focus adjustment in a short distance.

10‧‧‧Laser light emitting device

20‧‧‧Modulation phase conversion module

30‧‧‧Focusing lens module

A‧‧‧Diameter adjustment module

B‧‧‧Variable Curvature Lens Module

W1‧‧‧focus long distance

W2‧‧‧focus long distance

W3‧‧‧focus long distance

W4‧‧‧focus long distance

W5‧‧‧focus long distance

W6‧‧‧focus long distance

W7‧‧‧Jiao Long Distance

W8‧‧‧focus long distance

W9‧‧‧focus long distance

X‧‧‧Laser beam

Y‧‧‧diameter

Y1‧‧‧diameter

Y1’‧‧‧diameter

Y2‧‧‧gradient diameter

Y2’‧‧‧gradient diameter

Y21‧‧‧gradient diameter

Y21’‧‧‧gradient diameter

Y22‧‧‧gradient diameter

Y22’‧‧‧gradient diameter

Y3‧‧‧gradient diameter

Y4‧‧‧gradient diameter

Y5‧‧‧gradient diameter

Y5’‧‧‧gradient diameter

Y5"‧‧‧gradient diameter

Y6‧‧‧gradient diameter

Z‧‧‧Working point

Figure 1: a schematic diagram of the prior art of the present invention; Figure 2a: a first schematic diagram of the first embodiment of the present invention; Figure 2b: a second schematic diagram of the first embodiment of the present invention; Figure 3a: is the first schematic diagram of the second embodiment of the present invention; Figure 3b: is the second schematic diagram of the second embodiment of the present invention; Figure 4a: is the first schematic diagram of the second embodiment of the present invention Three schematic diagrams; Figure 4b: is the fourth schematic diagram of the second embodiment of the present invention; Figure 5: is the schematic diagram of the diameter adjustment module of the present invention; Figure 6a: is the third embodiment of the present invention First schematic diagram; Figure 6b: is the second schematic diagram of the third embodiment of the present invention; Figure 7: is the schematic diagram of the fourth embodiment of the present invention

In order to make the purpose, features and effects of the present invention more comprehensible, the following specifically enumerates the best embodiment of the present invention: First, please refer to the first embodiment shown in Figures 2a and 2b. The present invention is a A Bessel laser system with zoom and long mechanism, which includes a laser light emitting device (10), a diameter adjustment module (A), a phase adjustment module (20) and a focusing lens module (30) .

Specifically, the laser light emitting device (10) is a laser emitting device, and its function is to generate a laser beam (X) with a fixed diameter (Y) as shown in Figure 2a, and the laser beam (X) processes It uses the high-intensity and high-parallelism characteristics of laser light to converge it into a light spot with a power density of 103~109 watts/cm² by focusing lens and other optical devices, and then locally heat, melt and vaporize on the surface of the workpiece. Wait for the thermal effect to achieve the purpose of processing. Since the conversion time from light energy to heat energy is very short, and the power density is quite high, it provides extremely high light energy per unit time and unit area, so that the surface of the material can obtain a large amount of heat energy in an instant. The heating rate of the surface of the material can generally reach thousands of degrees per second, and the mixing mode of "liquid/gas" or "solid/gas" is very easy to occur in the process of laser processing. Furthermore, the effect of adjusting the diameter of the module (A) is to change The original fixed diameter (Y) of the laser beam (X), as shown in Figure 2a, when the laser beam (X) passes through the diameter adjustment module (A), the fixed diameter (Y) is reduced to the diameter (Y1), or As shown in Figure 2b, when the laser beam (X) passes through the diameter adjustment module (A), the fixed diameter (Y) is enlarged to a diameter (Y1'); in addition, the phase adjustment module (20) can be like a cone Lens (AXICON), appropriately programmed Diffraction Optical Element (DOE) or Spatial Light Modulator (SLM), etc. The main function of the phase adjustment module (20) is to parallel The beam is converted into a Bessel beam, which lists when the laser beam (X) passes through the cone The diameter of the halo formed by the AXICON will also increase, while the thickness of the halo will remain unchanged. The beam has the characteristics of a Bessel beam, and the distribution along the propagation direction of the laser beam (X) is not Will change; the focusing lens module (30) is mainly used to focus the laser on the processing position of the entire workpiece.

Next, as shown in Figure 5, the diameter adjustment module (A) includes a beam reduction element (A1) and a beam enlargement element (A2); wherein, the beam reduction element (A1) can be used for the laser beam ( The diameter (Y) of X) is reduced. The beam reduction element (A1) is a laser beam reducer to keep the working point (Z) away from the focusing lens module (30); the beam amplification element (A2) can Amplify the diameter (Y) of the laser beam (X), and the beam amplifying element (A2) is a laser beam expander to draw the working point (Z) closer to the focusing lens module (30); In other words, the laser beam (X) emitted from the laser light emitting device (10) has a certain divergence angle. For laser processing, the laser beam can only be made parallel by adjusting the laser beam contractor/expander The light beam can use the focusing lens to obtain a small high-power density spot, and the beam diameter can be changed by the beam expander to be used for different optical instruments.

As mentioned above, please refer to Fig. 2a. A laser light emitting device (10) generates a laser beam (X) approaching a fixed diameter (Y), and then changes the laser beam (X) through a diameter adjustment module (A). The diameter (Y1) of the laser beam (X), and then the laser beam (X) is changed to a gradually gradual radially symmetrical gradual diameter (Y2) by a phase adjustment module (20), and finally by a focusing lens module (30) Focus the laser beam (X) on a working point (Z).

In detail, in Figure 2a, the fixed diameter (Y) of the laser beam (X) is reduced to the diameter (Y1) through the diameter adjustment module (A), and the phase adjustment module (20) Change the diameter (Y1) of the laser beam (X) to a gradient diameter (Y2), the gradient is straight The diameter (Y2) refers to the radially symmetrical gradual diameter with Bessel beam characteristics; compared to the traditional laser system shown in Figure 1, it can be found that the focal length is changed from focal length (W) to The focal length (W1), the working point (Z) becomes farther away from the focusing lens module (30).

Continuing the above, please refer to Figure 2b. A laser light emitting device (10) generates a laser beam (X) with a fixed diameter (Y), and then changes the laser beam (X) through a diameter adjustment module (A). The diameter (Y1') of X), then the laser beam (X) is changed to a gradual radially symmetrical gradual diameter (Y2') by a phase adjustment module (20), and finally a focusing lens module (30) ) Focus the laser beam (X) on a working point (Z).

In detail, in Figure 2b, the fixed diameter (Y) of the laser beam (X) is enlarged to a diameter (Y1') through the diameter adjustment module (A), and the phase adjustment module (20 ) Change the diameter (Y1') of the laser beam (X) to a gradual diameter (Y2'). The gradual diameter (Y2') refers to the radially symmetrical gradual diameter of the Bessel beam; In the traditional laser system shown in Figure 1, it can be found that the focal length is changed from focal length (W) to focal length (W2), so that the working point (Z) is farther away from the focusing lens module (30) near.

Please refer to Figures 3a, 3b, 3c, and 3d, which are the second embodiment of the Bessel laser system with variable zoom mechanism of the present invention. In the first embodiment and the first, 2a, and 2b The features that have been described in the figures are the same as those in Figures 3a, 3b, 3c, and 3d, and the symbols in Figures 3a, 3b, 3c, and 3d are marked or omitted and will not be repeated. The main difference between the second embodiment and the first embodiment is that a variable curvature lens module (B) is added between the adjusting phase conversion module (20) and the focusing lens module (30).

Specifically, the variable curvature lens module (B) can slightly adjust the zoom of the transmitted light beam, and can control the curvature of the lens through water pressure or air pressure, so it has a high-speed change Characteristics.

First, referring to Figure 3a, a laser light emitting device (10) generates a laser beam (X) approaching a fixed diameter (Y), and then changes the laser beam through a diameter adjustment module (A) The diameter (Y1) of (X), then the laser beam (X) is changed to a progressively gradual radially symmetrical gradual diameter (Y2) through a phase adjustment module (20), and then a variable curvature lens module ( B) Change the laser beam (X) to a radially symmetrical gradient diameter (Y21). Finally, a focusing lens module (30) focuses the laser beam (X) on a working point (Z).

In detail, in Figure 3a, the fixed diameter (Y) of the laser beam (X) is reduced to the diameter (Y1) through the diameter adjustment module (A), and the phase adjustment module (20) Change the diameter (Y1) of the laser beam (X) to a gradient diameter (Y2), and then the variable curvature lens module (B) reduces the diameter (Y2) of the laser beam (X) to a gradient diameter (Y21) , Gradual diameter (Y21) refers to the radially symmetrical gradual diameter with Bessel beam characteristics; compared to the laser system shown in Figure 2a, it can be found that the focal length is changed from the focal length (W1) For the focal length (W5), the working point (Z) is slightly farther away from the focusing lens module (30).

Also, referring to Figure 3b, a laser light emitting device (10) generates a laser beam (X) approaching a fixed diameter (Y), and then changes the laser beam through a diameter adjustment module (A) The diameter (Y1) of (X), then the laser beam (X) is changed to a progressively gradual radially symmetrical gradual diameter (Y2) through a phase adjustment module (20), and then a variable curvature lens module ( B) Change the laser beam (X) to a gradual radially symmetrical gradient diameter (Y21'), and finally focus the laser beam (X) on a working point (Z) by a focusing lens module (30).

In detail, as shown in Figure 3b, the diameter adjustment module (A) will The fixed diameter (Y) of the laser beam (X) is reduced to a diameter (Y1), and the diameter (Y1) of the laser beam (X) is changed to a gradual diameter (Y2) through the phase adjustment module (20), and then The variable curvature lens module (B) enlarges and changes the diameter (Y2) of the laser beam (X) to a gradient diameter (Y21'). The gradient diameter (Y21') refers to the characteristic of the Bessel beam Radially symmetrical gradual diameter; compared to the laser system shown in Figure 2a, it can be found that the focal length is changed from focal length (W1) to focal length (W6), making the working point (Z) shift away from the focus The mirror module (30) is slightly closer.

Furthermore, referring to Figure 4a, a laser light emitting device (10) generates a laser beam (X) with a fixed diameter (Y), and then changes the laser beam (X) through a diameter adjustment module (A) ) Diameter (Y1'), and then change the laser beam (X) to a gradual radially symmetric gradual gradual diameter (Y2') through a phase adjustment module (20), and then a variable curvature lens module ( B) Change the laser beam (X) to a radially symmetrical gradient diameter (Y22), and finally focus the laser beam (X) on a working point (Z) by a focusing lens module (30).

In detail, in Figure 4a, the fixed diameter (Y) of the laser beam (X) is enlarged to a diameter (Y1') through the diameter adjustment module (A), and then the phase adjustment module (20 ) Change the diameter (Y1') of the laser beam (X) to a gradient diameter (Y2'), and then the variable curvature lens module (B) reduces the diameter (Y2') of the laser beam (X) to a gradient Diameter (Y22), gradual diameter (Y22) refers to the radially symmetrical gradual diameter with Bessel beam characteristics; compared to the laser system shown in Figure 2b, it can be found that the focal length is from the focal length (W2) becomes the focal length (W3), so that the working point (Z) becomes a little farther away from the focusing lens module (30).

Finally, please refer to Figure 4b which shows that a laser light emitting device (10) generates solid A laser beam (X) of fixed diameter (Y), then the diameter (Y1') of the laser beam (X) is changed through a diameter adjustment module (A), and then a phase adjustment module (20) Change the laser beam (X) to a gradual radially symmetrical gradient diameter (Y2'), and then use a variable curvature lens module (B) to change the laser beam (X) to a gradual radially symmetrical gradient diameter ( Y22'). Finally, a focusing lens module (30) focuses the laser beam (X) on a working point (Z).

In detail, it is shown in Figure 4b that the fixed diameter (Y) of the laser beam (X) is enlarged to the diameter (Y1') through the diameter adjustment module (A), and the phase adjustment module (20 ) Change the diameter (Y1') of the laser beam (X) to a gradient diameter (Y2'), and then the variable curvature lens module (B) enlarges the diameter (Y2') of the laser beam (X) to a gradient Diameter (Y22'), gradual diameter (Y22') refers to the radially symmetrical gradual diameter with Bessel beam characteristics; compared to the laser system shown in Figure 2b, it can be found that the focal length is changed from the focal length The long distance (W2) becomes the focal length (W4), and the working point (Z) becomes slightly closer to the focusing lens module (30).

Please refer to Figures 6a and 6b, which are the third embodiment of a Bessel laser system with a variable zoom mechanism of the present invention. The features and characteristics explained in the first and second embodiments and other figures are 6a and 6b are the same, the signs or omissions in 6a and 6b will not be repeated. The main difference between the second embodiment and the first embodiment is that the diameter adjustment module (A) is removed, and a variable curvature lens module (B) is added to either end of the adjustment phase conversion module (20). ).

First, referring to Fig. 6a, a laser light emitting device (10) generates a laser beam (X) with a fixed diameter (Y), and then changes the laser beam (X) through a phase adjustment module (20) X) is the gradual radially symmetrical gradient diameter (Y3), and then a variable curvature lens module (B) changes the laser beam (X) to the gradual radially symmetrical gradient diameter (Y4), Finally, a focusing lens module (30) focuses the laser beam (X) on a working point (Z).

In detail, it is shown in Figure 6a that the diameter (Y) of the laser beam (X) is changed to a gradual diameter (Y3) through the phase adjustment module (20), and then the variable curvature lens module (B ) The diameter (Y3) of the laser beam (X) is enlarged and changed to a gradual diameter (Y4). The gradual diameter (Y4) refers to the radially symmetrical gradual diameter with the characteristics of the Bessel beam; relative to the first In the traditional laser system shown in the figure, it can be found that the focal length is changed from focal length (W) to focal length (W7), and the working point (Z) becomes slightly closer to the focusing lens module (30).

In addition, please refer to Figure 6b. A laser light emitting device (10) generates a laser beam (X) with a fixed diameter (Y), and then a variable curvature lens module (B) changes the laser beam (X) is the radially symmetrical gradient diameter (Y5) of the gradual change, and then the laser beam (X) is changed to the radially symmetrical gradual diameter (Y6) of the gradual change by a phase adjustment module (20), and finally a focus The mirror module (30) focuses the laser beam (X) on a working point (Z).

In detail, in Figure 6b, the diameter (Y) of the laser beam (X) is enlarged and changed to a gradual diameter (Y5) through the variable curvature lens module (B), and then the phase conversion module is adjusted ( 20) Change the diameter (Y5) of the laser beam (X) to a gradual diameter (Y6). The gradual diameter (Y6) refers to a radially symmetrical gradual diameter with the characteristics of Bessel Beam; relative to the first In the traditional laser system shown in the figure, it can be found that the focal length is changed from focal length (W) to focal length (W7), and the working point (Z) becomes slightly closer to the focusing lens module (30).

Please refer to Figure 7, which is the fourth embodiment of a Bessel laser system with a zoom-length mechanism of the present invention. The features and features explained in the first, second, and third embodiments and other figures are the same Those that are the same as in Fig. 7, the symbols or omitted in Fig. 7 will not be repeated. The main difference between the fourth embodiment and the first embodiment is that the laser light emitting device (10) and the adjusted phase A variable curvature lens module (B) is added between the conversion modules (20).

Referring to Figure 7, a laser light emitting device (10) generates a laser beam (X) approaching a fixed diameter (Y), and then a variable curvature lens module (B) changes the laser beam (X) is the radially symmetrical gradient diameter (Y5) of the gradient, and then the diameter (Y5') of the laser beam (X) is changed by a diameter adjustment module (A), and then the diameter (Y5') of the laser beam (X) is changed by a phase adjustment module (20 ) Change the laser beam (X) to a radially symmetrical gradient diameter (Y5"), and finally focus the laser beam (X) on a working point (Z) by a focusing lens module (30).

In detail, it is shown in Figure 7 that the diameter (Y) of the laser beam (X) is reduced to a gradual diameter (Y5) through the variable curvature lens module (B), and the diameter adjustment module (A) Reduce the fixed diameter (Y5) of the laser beam (X) to a diameter (Y5'), and then change the diameter (Y5') of the laser beam (X) to a gradual diameter (Y5) through the phase adjustment module (20) ”), then, the gradual diameter (Y5”) refers to the radially symmetrical gradual diameter with Bessel beam characteristics; compared to the laser system shown in Figure 2a, it can be found that the focal length is changed from the focal length The distance (W1) becomes the focal length distance (W9), so that the working point (Z) becomes slightly farther away from the focusing lens module (30).

Therefore, the effect of the present invention is different from that of the traditional laser system. It is the first in the application of Bessel beams and meets the requirements of the invention patent.

However, it needs to be reiterated that the above are only the preferred implementation forms of the present invention. Any equivalent changes made by applying the specification, scope of patent application, or drawings of the present invention still belong to the technical scope protected by the present invention. Therefore, The scope of protection of the present invention shall be subject to those defined by the attached patent scope.

10‧‧‧Laser light emitting device

X‧‧‧Laser beam

Y‧‧‧diameter

A‧‧‧Diameter adjustment module

Y1‧‧‧diameter

Y2‧‧‧gradient diameter

Claims (10)

A Bessel laser system with a zoom-length mechanism is characterized in that a laser light-emitting device generates a laser beam of a fixed diameter, and then changes the diameter of the laser beam through a diameter adjustment module, and then passes through a Adjust the phase conversion module to change the radially symmetrical gradient diameter of the laser beam, and then adjust a variable curvature lens module to change the diameter of the laser beam, and finally a focusing lens module to change the laser beam Focus on a working point. A Bessel laser system with a variable zoom mechanism, which is characterized in that a laser light emitting device generates a laser beam of a fixed diameter, and then changes the laser beam to a gradual radial symmetry through a phase adjustment module The gradual diameter of the laser beam is changed by a variable curvature lens module. Finally, a focusing lens module focuses the laser beam on a working point. A Bessel laser system with a variable zoom mechanism, which is characterized in that a laser light emitting device generates a laser beam of a fixed diameter, and then changes the laser beam to a gradual emission through a variable curvature lens module The symmetrical gradient diameter is then changed by a phase adjustment module to change the gradient diameter of the laser beam, and finally a focusing lens module focuses the laser beam on a working point. Such as the system described in item 2 or 3 of the scope of patent application, wherein an adjusting diameter module is added between the laser light emitting device and the adjusting phase conversion module, and the adjusting diameter module is adjusted to change the diameter of the laser beam . As for the system described in item 1 of the scope of patent application, the diameter adjustment module includes a beam reduction element and a beam enlargement element. For the system described in item 4 of the scope of patent application, the diameter adjustment module includes a beam reduction element and a beam enlargement element. For the system described in item 5 of the scope of patent application, the beam reducing element can reduce the diameter of the laser beam to keep the working point away from the focusing lens module. In the system described in item 5 of the scope of patent application, the beam magnifying element can magnify the diameter of the laser beam to draw the working point closer to the focusing lens module. For the system described in item 6 of the scope of patent application, the beam reduction element can reduce the diameter of the laser beam to keep the working point away from the focusing lens module. In the system described in item 6 of the scope of patent application, the beam magnifying element can magnify the diameter of the laser beam to draw the working point closer to the focusing lens module.

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