TWI714384B - Miniature fluid actuator device - Google Patents

Abstract

A miniature fluid actuator device is disclosed and comprises a carrying plate, a miniature fluid actuator, a micro controller, an electrode pad and an ESD circuit. The miniature fluid actuator is disposed on the carrying plate for transporting fluid. The micro controller controls the miniature fluid actuator to be actuated or not. The electrode pad is disposed on the carrying plate and is electrically coupled with the miniature fluid actuator. The ESD circuit is electrically coupled with the electrode pad.

Description

Microfluidic actuator device

This case relates to a microfluidic actuator device, especially a microfluidic actuator device with an electrostatic protection circuit.

At present, in various fields, whether it is medicine, computer technology, printing, energy and other industries, products are developing in the direction of refinement and miniaturization. Among them, the microfluidic actuator contained in the micropump product is the key technology.

With the rapid development of science and technology, the applications of fluid transport structures are becoming more and more diversified. For example, industrial applications, biomedical applications, medical care, electronic heat dissipation, life electronic products, etc., even recently popular mobile wearable devices can see it It can be seen that the traditional fluid actuators have gradually become smaller and the flow rate is maximized.

A variety of microfluidic actuators made by microelectromechanical semiconductor manufacturing processes have been developed in the prior art. However, the working frequency of the miniaturized microfluidic actuators reaches more than 100KHZ. Due to the high working frequency, the microfluidic actuators During operation, constant friction with the conveyed fluid causes static electricity to accumulate on the microfluidic actuator. So how to avoid static electricity accumulation so that the microfluidic actuator device can be used normally and for a long time and protect the microfluidic The fact that the actuator device is free from the influence of static electricity is one of the problems that need to be solved urgently.

The main purpose of this case is to provide a microfluidic actuator device with an electrostatic protection circuit.

A broad implementation aspect of this case is a microfluidic actuator device, including: a carrier board, at least one microfluidic actuator, at least one microcontroller, at least one electrode pad, and at least one electrostatic protection circuit. The microfluidic actuator is arranged on the carrier plate to transport fluid. The microcontroller is used to control the opening or closing of the microfluidic actuator. The electrode pads are arranged on the carrying plate and are correspondingly electrically connected with the microfluidic actuator. The electrostatic protection circuit is electrically connected to the electrode pad.

The embodiments embodying the features and advantages of this case will be described in detail in the later description. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of the case, and the descriptions and illustrations therein are essentially for illustrative purposes, rather than limiting the case.

In the description of the embodiment of this case, it should be understood that the "and" mentioned is the same as the general logical operator which means "AND" or "∧". For example, electrode pad A and electrode pad B are simultaneously Refers to both the electrode pad A and the electrode pad B; the "or" mentioned is the same as the general logic operator that means "OR" or "∨", such as electrode pad A or electrode pad B, It includes both the finger electrode pad A and the electrode pad B, the single finger electrode pad A and the single finger electrode pad B.

For a schematic diagram of the microfluidic actuator of the microfluidic actuator device in this case, please refer to Figure 1A. The microfluidic actuator 110 is manufactured by microelectromechanical manufacturing, and the microfluidic actuator 110 includes a first oxide layer 3, the first substrate 1, the second substrate 2 and the third substrate 4 provided with the second oxide layer 5 are sequentially stacked. In this embodiment, the number of fluid inlets 11 on the first substrate 1 is two, but it is not limited to this. After the first substrate 1 and the second substrate 2 are combined, the second lower surface 23 of the second substrate 2 is connected to the first oxide layer 3 on the first substrate 1. The positions and numbers of the fluid channels 31 of the first oxide layer 3 correspond to the fluid inlets 11 of the first substrate 1. In the embodiment of this case, there are also two fluid flow channels 31. One end of the two fluid flow channels 31 is respectively connected to the two fluid inlets 11. The other end of the two fluid flow channels 31 is connected to the confluence chamber 32, so that After the fluid enters through the two fluid inlets 11 respectively, it passes through the corresponding fluid channel 31 and collects in the confluence chamber 32, and the through hole 21 of the second substrate 2 communicates with the confluence chamber 32 for fluid to pass. When the third substrate 4 is bonded to the second substrate 2, the second oxide layer 5 is adjacent to the second upper surface 22 of the second substrate 2, and the fluid chamber 51 of the second oxide layer 5 is connected to the through hole of the second substrate 2 respectively. 21 and the fluid channel 41 of the third substrate 4 are connected, so that the fluid can enter the fluid chamber 51 through the through hole 21 and then be discharged from the fluid channel 41.

As mentioned above, the fluid channel 41 of the third substrate 4 divides the third substrate 4 into three parts, which are the vibrating part 44, the outer peripheral part 45 and the connecting part 46, respectively. The outer peripheral portion 45 is arranged around the vibrating portion 44, the fluid channel 41 is formed between the outer peripheral portion 45 and the vibrating portion 44, and the connecting portion 46 is elastically connected between the vibrating portion 44 and the outer peripheral portion 45. Among them, the area of the vibration part 44 corresponds to the fluid chamber 51 of the second oxide layer 5. In addition, the microfluidic actuator 110 further disposes the piezoelectric element 6 on the third substrate 4, and the piezoelectric element 6 is located in the area of the vibrating part 44, so that when the piezoelectric element 6 drives the vibrating part 44 to vibrate and move, it can be compressed or expanded The volume of the fluid chamber 51 allows fluid to flow.

In addition, the peripheral area of the perforation 21 of the second substrate 2 is a resonance portion 24, and the periphery of the resonance portion 24 is the fixing portion 25. The resonance portion 24 and the confluence chamber 32 of the first oxide layer 3 and the second oxide layer 5 The fluid chambers 51 correspond to each other, so that the resonance part 24 can vibrately shift between the confluence chamber 32 and the fluid chamber 51.

For the schematic diagram of the operation of the microfluidic actuator of the microfluidic actuator device in this case, please refer to Figures 1B to 1D. When the lower electrode layer 61 and the upper electrode layer 64 of the piezoelectric element 6 receive the driving voltage transmitted from the outside and After the driving signal (not shown), the lower electrode layer 61 and the upper electrode layer 64 will receive the driving voltage and driving signal transmitted from the outside to the piezoelectric layer 62. At this time, the piezoelectric layer 62 will receive the driving voltage and driving signal. , Due to the influence of the piezoelectric effect, the deformation begins to occur, and the amount and frequency of the deformation are controlled by the driving voltage and the driving signal. When the piezoelectric layer 62 starts to be deformed by the driving voltage and the driving signal, the vibrating portion 44 of the third substrate 4 is driven to start to shift, and the piezoelectric component 6 drives the vibrating portion 44 to vibrate and shift in a first direction to pull The first direction is the vibration direction of the vibration part 44 away from the second oxide layer 5. In this way, the volume of the fluid chamber 51 of the second oxide layer 5 is increased, so that a negative pressure is formed in the fluid chamber 51, so that the fluid outside the microfluidic actuator 110 can be sucked into it through the fluid inlet 11 and introduced into the first oxide layer. In the confluence chamber 32 of layer 3.

Please continue to refer to Figure 1C. When the vibrating portion 44 is displaced by the piezoelectric element 6, the resonant portion 24 of the second substrate 2 will be displaced in the first direction due to the principle of resonance, and when the resonant portion 24 is oriented in the first direction During displacement, the space of the fluid chamber 51 can be compressed, and the gas in the fluid chamber 51 is pushed to move to the fluid channel 41 of the third substrate 4 so that the fluid can be discharged through the fluid channel 41. At the same time, when the resonance part 24 is displaced in the first direction to compress the fluid chamber 51, the volume of the confluence chamber 32 is increased due to the displacement of the resonance part 24, causing a negative pressure inside to continuously absorb the outside of the microfluidic actuator 110 The fluid enters it from the fluid inlet 11.

Finally, please refer to Fig. 1D. The piezoelectric element 6 drives the vibrating portion 44 of the third substrate 4 to vibrate and shift in a second direction, where the second direction is the vibrating direction of the vibrating portion 44 approaching the second oxide layer 5. And the first direction and the second direction are two opposite directions, whereby the resonant part 24 of the second substrate 2 is also driven by the vibrating part 44 to move toward the second direction, and the fluid in the converging chamber 32 is compressed synchronously through the perforation 21 moves to the fluid chamber 51, and the fluid outside the microfluidic actuator 110 temporarily enters from the fluid inlet 11, and the fluid in the fluid chamber 51 is pushed into the fluid channel 41 of the third substrate 4, so that the fluid in the fluid channel 41 Exit the microfluidic actuator 110. The resonant part 24 of the second substrate 2 is also driven by the vibrating part 44 to move toward the second direction, and the fluid in the synchronous compression confluence chamber 32 moves to the fluid chamber 51 through the perforation 21 thereof. When the subsequent piezoelectric component 6 resumes and drives the vibrating part 44 to move in the first direction, the volume of the fluid chamber 51 will be greatly increased, and the fluid will be sucked into the fluid chamber 51 with a higher suction force (as shown in Figure 1B ). By repeating the operations shown in Figures 1B to 1D in this way, the piezoelectric element 6 can continuously drive the vibrating displacement of the vibrating part 44, and synchronously link the vibrating displacement of the resonant part 24 to change the internal pressure of the microfluidic actuator 110, so that It continuously draws and exhausts gas to complete the fluid transfer action of the microfluidic actuator 110.

Please refer to FIG. 2A. In the first embodiment of this case, the microfluidic actuator device 200A is composed of a carrier plate 100, at least one microfluidic actuator 110, at least one microcontroller 120, and at least one electrode pad. A. At least one electrode pad B, at least one electrode pad C, at least one electrode pad D, and at least one electrostatic protection circuit 140 (ESD, Electro Static Discharge) are combined.

It is worth noting that, in the first embodiment of the present case, the microfluidic actuator 110 is arranged on the carrier plate 100 to transport fluid, and the microfluidic actuator 110 is manufactured by a microelectromechanical process, but not Is limited. In other embodiments, the manufacturing method of the microfluidic actuator 110 can also be adjusted according to design requirements (for example, semiconductor manufacturing process, microelectromechanical manufacturing process, etc.).

It is worth noting that in the first embodiment of the present application, the microcontroller 120 is disposed on the carrier board 100 to control the opening or closing of the microfluidic actuator 110, but it is not limited to this. In other embodiments, the microcontroller 120 is not disposed on the carrier board 100, but is electrically connected to the carrier board 100 to control the opening or closing of the microfluidic actuator 110, but not limited to this. In addition, in the first embodiment of this case, the number of microcontroller 120 is one, but it is not limited to this. In other implementation aspects of this case, the number of microcontrollers 120 can be adjusted to two or more.

It is worth noting that in the first embodiment of the present application, the electrode layer 64 on the microfluidic actuator 110 is electrically connected to the electrode pad A on the carrier plate 100, and the electrode layer 61 under the microfluidic actuator 110 is electrically connected to The electrode pad B on the carrier board 100 is electrically connected; for the convenience of description, in the first embodiment of the present case, the microfluidic actuator 110 and the electrode pad A and the electrode pad B are electrically connected as a whole , Defined as a microfluidic actuator element 130.

It is also worth noting that in the first embodiment of this case, the static electricity protection circuit 140 is not disposed on the carrier board 100. As shown in FIG. 2A, the electrode pad A and the electrode pad B are arranged on the carrier board 100, and the static electricity protection circuit 140 is electrically connected to the electrode pad A and the electrode pad B by a wire, but not However, in other embodiments, the location and quantity of the electrostatic protection circuit 140 can be adjusted according to design requirements.

Please refer to Figure 2B. In the second embodiment of the present case, the microfluidic actuator device 200B is composed of a carrier plate 100, at least one microfluidic actuator 110, at least one microcontroller 120, and at least one electrode pad. C'is combined with at least one electrode pad D'and at least one electrostatic protection circuit 140.

It is worth noting that, in the second embodiment of the present case, the microfluidic actuator 110 is arranged on the carrier plate 100 to transport fluid, and the microfluidic actuator 110 is manufactured by a microelectromechanical process, but this is not the case. Is limited. In other embodiments, the manufacturing method of the microfluidic actuator 110 can also be adjusted according to design requirements (for example, semiconductor manufacturing process, microelectromechanical manufacturing process, etc.).

It is worth noting that in the second embodiment of the present invention, the microcontroller 120 is arranged on the carrier board 100 to control the opening or closing of the microfluidic actuator 110, but it is not limited to this. In other embodiments, the microcontroller 120 is not disposed on the carrier board 100, but is electrically connected to the carrier board 100 to control the opening or closing of the microfluidic actuator 110, but not limited to this. In addition, in the second embodiment of the present case, the number of the microcontroller 120 is one, but it is not limited to this. In other implementation aspects of this case, the number of microcontrollers 120 can be adjusted to two or more.

It is worth noting that in the second embodiment of the present case, the electrode layer 64 on the microfluidic actuator 110 is electrically connected to the electrostatic protection circuit 140 on the carrier board 100, and the electrostatic protection circuit 140 is electrically connected to the electrode pads. C'; the electrode layer 61 under the microfluidic actuator 110 is electrically connected to another static electricity protection circuit 140 on the carrier board 100, and the other static electricity protection circuit 140 is then electrically connected to the electrode pad D'; for convenience It is explained that in the second embodiment of the present case, the upper electrode layer 64 and the lower electrode layer 61 of the microfluidic actuator 110 are respectively electrically connected to two sets of electrostatic protection circuits 140, and the two sets of electrostatic protection circuits are electrically connected. 140 is electrically connected to the electrode pad C′ and the electrode pad D′ respectively, and the whole of the microfluidic actuator 110 is defined as a microfluidic actuator element 150.

It is also worth noting that in the second embodiment of the present case, the electrostatic protection circuit 140 is disposed on the carrier board 100, and is electrically connected to one of the electrode pads C'or the electrode pads D'on the carrier board 100, and It is electrically connected to the microfluidic actuator 110, but not limited to this. In other embodiments, the location and number of the electrostatic protection circuit 140 can be adjusted according to design requirements.

Please refer to FIG. 3A. FIG. 3A shows the first aspect of the microcontroller 120 of the first embodiment of the present invention. The number of the micro-controller 120 of the microfluidic actuator device 300A is one, which is arranged on the carrier board 100 and is electrically connected to the carrier board 100 to control the opening or closing of the microfluidic actuators 110 , But not limited to this. In other implementation aspects of this case, the number of microcontrollers 120 can be adjusted to two or more.

Please refer to FIG. 3B. FIG. 3B shows the second aspect of the microcontroller 120 of the first embodiment of the present invention. The number of the microcontroller 120A and the microcontroller 120B of the microfluidic actuator device 300B is two, which are respectively arranged on the upper and lower ends of the carrier board 100, and are electrically connected to the carrier board 100 for control The opening or closing of the microfluidic actuators 110 is not limited thereto. In other embodiments of the present case, the positions of the microcontroller 120A and the microcontroller 120B can be adjusted according to design requirements.

Please refer to FIG. 3C. FIG. 3C shows the third aspect of the microcontroller 120 of the first embodiment of the present invention. The number of the microcontroller 120A and the microcontroller 120B of the microfluidic actuator device 300C is two in total, and they are respectively arranged at the left and right ends of the carrier board 100, and are electrically connected to the carrier board 100 for control The opening or closing of the microfluidic actuators 110 is not limited thereto. In other embodiments of this case, the positions of the microcontroller 120A and the microcontroller 120B can be adjusted according to design requirements.

Please refer to Fig. 3D. Fig. 3D shows the fourth aspect of the microcontroller 120 of the first embodiment of the present invention. The number of the microcontroller 120 of the microfluidic actuator device 300D is one, which is not provided on the carrier board 100, but is electrically connected to the carrier board 100 to control the opening of the microfluidic actuators 110 Or closed, but not limited to this. In other implementation aspects of this case, the position of the microcontroller 120 can be adjusted according to design requirements. It is also worth noting that the aforementioned four different aspects of the microcontroller 120 can also be combined in the second embodiment.

Please refer to FIG. 4A. FIG. 4A shows the first aspect of the electrostatic protection circuit 140 of the first embodiment of the present invention. The electrostatic protection circuit 140A includes a first potential V1, a first diode D1, a second diode D2, and a reference potential V0. The first potential V1 is powered by a system power supply (not shown). The system power supply can be a DC power supply, a sine wave, a square wave, a sawtooth wave, or a pulse wave, but is not limited to this. In other embodiments, the system power supply can also be changed according to design requirements. The cathode of the first diode D1 is electrically connected to the first potential V1. The cathode of the second diode D2 is electrically connected to the anode of the first diode D1. The reference potential V0 is provided by the system power supply, which is also the reference potential of the power system, and is electrically connected to the anode of the second diode D2.

Please refer to FIG. 4B. FIG. 4B shows the second aspect of the electrostatic protection circuit 140 of the first embodiment of the present invention. The electrostatic protection circuit 140B includes a second potential V2, a third diode D3, a fourth diode D4, a resistor R, a reference potential V0, a third potential V3, a fifth diode D5, and A sixth diode D6. The second potential V2 is powered by a system power supply (not shown). The system power supply can be a DC power supply, a sine wave, a square wave, a sawtooth wave, or a pulse wave, but is not limited to this. In other embodiments, the system power supply can also be changed according to design requirements. The cathode of the third diode D3 is electrically connected to the second potential V2. The cathode of the fourth diode D4 is electrically connected to the anode of the third diode D3. The resistance R is between 25Ω and 5000Ω, and one end of the resistance R is electrically connected to the cathode of the fourth diode D4 and the anode of the third diode D3. The reference potential V0 is provided by the system power supply, which is also the reference potential of the power system, and is electrically connected to the anode of the fourth diode D4. The third potential V3 is powered by the system power supply. The system power supply can be a DC power supply, a sine wave, a square wave, a sawtooth wave, or a pulse wave, but it is not limited to this. In other embodiments, the system power supply can also be changed according to design requirements. The cathode of the fifth diode D5 is electrically connected to the third potential V3. The cathode of the sixth diode D6, the anode of the fifth diode D5 and the other end of the resistor R are electrically connected. Finally, the reference potential V0 is electrically connected to the anode of the sixth diode D6.

Please refer to FIG. 5A. In the first embodiment of the present invention, the microfluidic actuator device 400A is a schematic diagram of the first aspect of the electrostatic protection circuit 140. It is worth noting that the electrostatic protection circuit 140A is not provided on the carrier board 100 However, it is electrically connected to the electrode pad A or the electrode pad B on the carrier board 100, but not limited to this. In other embodiments of the present case, the electrode pad A of the microfluidic actuator element 130 may only be connected to a set of electrostatic protection circuit 140A, while the electrode pad B of the microfluidic actuator element 130 is not connected to the electrostatic protection circuit 140A; Or, the electrode pad A of the microfluidic actuator element 130 is not connected to the electrostatic protection circuit, while the electrode pad B of the microfluidic actuator element 130 is only connected to one set of electrostatic protection circuits 140A; or, multiple sets of micro One of the electrode pad A or the electrode pad B of the fluid actuator element 130 is connected to only one set of electrostatic protection circuit 140A; or, the electrode pad A of multiple groups of the microfluidic actuator element 130 and multiple sets of microfluidics The electrode pad B of the actuator element 130 is only connected to one set of electrostatic protection circuit 140A.

Please refer to FIG. 5B. In the first embodiment of the present invention, the microfluidic actuator device 400B is a schematic diagram of the second aspect of the electrostatic protection circuit 140. It is worth noting that the electrostatic protection circuit 140B is not disposed on the carrier board 100 , But it is electrically connected to the electrode pad A or the electrode pad B on the carrier board 100, but not limited to this. In other embodiments of this case, the electrode pad A of the microfluidic actuator element 130 may only be connected to a set of electrostatic protection circuit 140B, and the electrode pad B of the microfluidic actuator element 130 is not connected to the electrostatic protection circuit 140B; Or, the electrode pad A of the microfluidic actuator element 130 is not connected to the electrostatic protection circuit, while the electrode pad B of the microfluidic actuator element 130 is only connected to one set of electrostatic protection circuits 140B; or, multiple sets of micro The electrode pad A or the electrode pad B of the fluid actuator element 130 is connected to only one set of electrostatic protection circuit 140B; or, the electrode pad A of multiple sets of the microfluidic actuator element 130 and multiple sets of microfluidic actuation The electrode pad B of the device element 130 is connected to only one set of electrostatic protection circuit 140B.

Please refer to FIG. 6A. The electrostatic protection circuit 140 of the microfluidic actuator element 150A of the second embodiment of the present invention is presented in the first aspect of the electrostatic protection circuit 140A. The microfluidic actuator element 150A includes a microfluidic actuator 110, two sets of electrostatic protection circuits 140A, an electrode pad C'and an electrode pad D'. It is worth noting that the first aspect of the electrostatic protection circuit 140A in the second embodiment of the present invention is the same as the first aspect of the electrostatic protection circuit 140 in the first embodiment, so it will not be described again. It is also worth noting that in the second embodiment of the present case, the microfluidic actuator 110, the two sets of electrostatic protection circuits 140A, the electrode pad C'and the electrode pad D'are modularized into a microfluidic actuator The element 150A is a microfluidic actuator 110 with electrostatic protection function.

When an abnormal voltage occurs on the upper electrode layer 64 or the lower electrode layer 61 of the microfluidic actuator 110, the first diode D1 will be turned on, causing the abnormal voltage to be introduced into the power supply system, so that the microfluidic actuator 110 is not subject to surges. The voltage is destroyed; and when the upper electrode layer 64 or the lower electrode layer 61 of the microfluidic actuator 110 is lower than the voltage of the power supply system, the second diode D2 will be turned on, so that the normal power supply reference voltage is controlled by the power system The microfluidic actuator 110 is introduced so that the microfluidic actuator 110 is not damaged by unstable voltage. In this way, the static electricity protection circuit 140 can protect the microfluidic actuator 110 from being damaged by static electricity when operating at high frequency and high speed, and can also make the microfluidic actuator 110 operate under a stable working power supply. It is also worth noting that in other implementation aspects of this case, the number of the first aspect of the electrostatic protection circuit 140 can be adjusted according to design requirements.

Please refer to FIG. 6B. The electrostatic protection circuit 140 of the microfluidic actuator element 150B of the second embodiment of the present invention is presented in the second aspect of the electrostatic protection circuit 140B. The microfluidic actuator element 150B includes a microfluidic actuator 110, two sets of electrostatic protection circuits 140B, an electrode pad C'and an electrode pad D'. It is worth noting that the second aspect of the static electricity protection circuit 140B of the second embodiment of the present case is the same as the second aspect of the static electricity protection circuit 140 of the first embodiment, so it will not be described again. It is also worth noting that in the second embodiment of the present case, the microfluidic actuator 110, the two sets of electrostatic protection circuits 140B, the electrode pad C'and the electrode pad D'are modularized into a microfluidic actuator The element 150B is the microfluidic actuator 110 with electrostatic protection function.

When an abnormal voltage occurs on the upper electrode layer 64 or the lower electrode layer 61 of the microfluidic actuator 110, the fifth diode D5 will be turned on, causing the abnormal voltage to be introduced into the power system, so that the microfluidic actuator 110 is not subject to surge The voltage is destroyed; and when the upper electrode layer 64 or the lower electrode layer 61 of the microfluidic actuator 110 is lower than the voltage of the power supply system, the sixth diode D6 will be turned on, so that the normal power reference voltage is controlled by the power system The microfluidic actuator 110 is introduced so that the microfluidic actuator 110 is not damaged by unstable voltage. Such an electrostatic protection circuit 140 can protect the microfluidic actuator 110 from damage caused by static electricity during high-frequency and high-speed operation, and can also enable the microfluidic actuator 110 to operate under a stable operating power supply. It is also worth noting that the number of the second aspect of the static protection circuit 140B of the static protection circuit 140 in other implementation aspects of this case can be adjusted according to the requirements of the calculation.

In addition, the static electricity protection circuit 140B of the second aspect further has a resistor R, which is used to isolate the internal static electricity from the external static electricity. Among them, the internal static electricity refers to the static electricity generated by the internal friction of the fluid and the microfluid actuator 110 when the microfluidic actuator 110 is actuated at high speed and high frequency during operation. In other words, the internal static electricity is emphasized on the microfluidic actuator 110. Static electricity generated when the fluid actuator 110 operates. With the arrangement of the fifth diode D5 and the sixth diode D6, the influence of internal static electricity can be reduced. However, external static electricity refers to static electricity generated by electric charges accumulated by human touch or normal physical phenomena. In other words, external static electricity emphasizes internal static electricity generated when the non-microfluidic actuator 110 is actuated. The external static electricity can be led out by the third diode D3 and the fourth diode D4. In addition, a resistor R is used to isolate internal static electricity from external static electricity, so as to improve the damage caused by static electricity to the microfluidic actuator 110.

Please refer to FIG. 7A. In the second embodiment of the present invention, the microfluidic actuator device 500A is a schematic diagram of a modularized microfluidic actuator element 150A. It is worth noting that the microfluidic actuator element 150A adopts the electrostatic protection circuit 140A of the first aspect of the electrostatic protection circuit 140 (as shown in FIG. 6A). The electrostatic protection circuit 140A is disposed on the carrier board 100 and transmits electricity through The electrode pad C′ or the electrode pad D′ on the carrier board 100 is electrically connected, and the microfluidic actuator 110 is also arranged on the same carrier board 100. It is worth noting that the arrangement of the microfluidic actuator element 150A can be single, single row, single column, multiple, multiple rows, multiple columns, arrays, etc., but it is not limited to this. The microfluidic actuator The arrangement of the device components 150A can be changed according to design requirements. It is also worth noting that in other implementation aspects of this case, the number of microcontrollers 120 can be adjusted to two or more.

Please refer to FIG. 7B. In the second embodiment of the present invention, the microfluidic actuator device 500B is a schematic diagram of a modularized microfluidic actuator element 150B. It is worth noting that the microfluidic actuator element 150B adopts the second aspect of the electrostatic protection circuit 140, the electrostatic protection circuit 140B (as shown in Figure 6B), and the electrostatic protection circuit 140B is disposed on the carrier board 100, which transmits electricity The electrode pad C′ or the electrode pad D′ on the carrier board 100 is electrically connected, and the microfluidic actuator 110 is also arranged on the same carrier board 100. It is worth noting that the arrangement of the microfluidic actuator element 150B can be single, single row, single row, multiple, multiple rows, multiple columns, arrays... etc., but it is not limited to this. The microfluidic actuator The arrangement of the device components 150B can be changed according to design requirements. It is also worth noting that the number of microcontrollers 120 can be adjusted to two or more in other implementation aspects of this case.

This case provides a microfluidic actuator device that uses a microelectromechanical semiconductor manufacturing process and has an electrostatic protection circuit. The microfluidic actuator device achieves the purpose of fluid transportation through the control of a microcontroller, which is of great industrial use value. submit application.

This case can be modified in many ways by those who are familiar with this technology, but none of them deviates from the protection of the scope of the patent application.

110: Microfluidic actuator 1: first substrate 11: fluid inlet 2: Second substrate 21: Piercing 22: second upper surface 23: second lower surface 24: Resonance part 25: Fixed part 3: The first oxide layer 31: Fluid flow path 32: Confluence chamber 4: The third substrate 41: fluid channel 44: Vibration Department 45: Peripheral 46: Connection 5: The second oxide layer 51: fluid chamber 6: Piezoelectric components 61: Lower electrode layer 62: Piezo layer 63: insulating layer 64: upper electrode layer 200A, 200B, 300A, 300B, 300C, 300D, 400A, 400B, 500A, 500B: microfluidic actuator device 100: Carrier board 120, 120A, 120B: Microcontroller 130, 150, 150A, 150B: microfluidic actuator elements 140, 140A, 140B: Electrostatic protection circuit A, B, C, C', D, D': electrode pads D1: The first diode D2: The second diode D3: The third diode D4: The fourth diode D5: Fifth diode D6: The sixth diode R: resistance V0: Reference potential V1: first potential V2: second potential V3: third potential

Figure 1A is a schematic diagram of the microfluidic actuator in this case. Figures 1B to 1D are schematic diagrams of the operation of the microfluidic actuator of the present invention. Figure 2A is a schematic diagram of the first embodiment of the microfluidic actuator device of the present invention. Figure 2B is a schematic diagram of the second embodiment of the microfluidic actuator device of the present invention. Figures 3A to 3D are schematic diagrams of different positions of the microcontroller of the microfluidic actuator device of the present invention. Figure 4A is a circuit diagram of the first aspect of the electrostatic protection circuit of the microfluidic actuator device of the present invention. Figure 4B is a circuit diagram of the second aspect of the electrostatic protection circuit of the microfluidic actuator device of the present invention. Fig. 5A and Fig. 5B are schematic diagrams of different electrostatic protection circuit states of the first embodiment of the microfluidic actuator device of the present invention. Figure 6A is a circuit diagram of the first aspect of the electrostatic protection circuit of the microfluidic actuator element of the present invention. Figure 6B is a circuit diagram of the second aspect of the electrostatic protection circuit of the microfluidic actuator element of the present invention. Fig. 7A and Fig. 7B are schematic diagrams of different electrostatic protection circuit states of the second embodiment of the microfluidic actuator device of the present invention.

200B: Microfluidic actuator device

100: Carrier board

110: Microfluidic actuator

120: Microcontroller

140: Electrostatic protection circuit

150: Microfluidic actuator element

C', D': electrode pad

Claims (11)

A microfluidic actuator device includes: a carrying plate; at least one microfluidic actuator arranged on the carrying plate to transport fluid; at least one electrode pad arranged on the carrying plate and connected to the carrying plate The microfluidic actuator is electrically connected; and at least one static electricity protection circuit is electrically connected to the at least one electrode pad, wherein the static electricity protection circuit includes: a first electric potential provided by a power supply system; a first two A polar body, the cathode of the first diode is electrically connected to the first potential; a second diode, the cathode of the second diode is electrically connected to the anode of the first diode; and a The reference potential is provided by the power supply system and is electrically connected to the anode of the second diode. The microfluidic actuator device described in the first item of the scope of patent application, wherein the microfluidic actuator is manufactured by a microelectromechanical process. The microfluidic actuator device described in claim 1 of the patent application further includes at least one microcontroller, wherein the microcontroller is electrically connected to the carrier board for controlling the opening or closing of the microfluidic actuator shut down. In the microfluidic actuator device described in item 3 of the scope of patent application, the microcontroller is arranged on the carrier board. In the microfluidic actuator device described in item 3 of the scope of patent application, the number of the microcontroller is one. For the microfluidic actuator device described in item 3 of the scope of patent application, the number of the microcontroller is two or more. According to the microfluidic actuator device described in item 1 of the scope of patent application, the electrostatic protection circuit is arranged on the carrier board. According to the microfluidic actuator device described in claim 1, wherein the electrostatic protection circuit is electrically connected to the at least one electrode pad on the carrier board. A microfluidic actuator device includes: a carrying plate; at least one microfluidic actuator arranged on the carrying plate to transport fluid; at least one electrode pad arranged on the carrying plate and connected to the carrying plate The microfluidic actuator is electrically connected; and at least one static electricity protection circuit is electrically connected to the at least one electrode pad, and the static electricity protection circuit includes: a second potential provided by a power supply system; and a third two pole Body, the cathode of the third diode is electrically connected to the second potential; a fourth diode, the cathode of the fourth diode is electrically connected to the anode of the third diode; a resistor, One end of the resistor is electrically connected to the cathode of the fourth diode and the anode of the third diode; a third potential is provided by the power supply system; a fifth diode, the fifth diode The cathode of the body is electrically connected to the third potential; A sixth diode, the cathode of the sixth diode, the anode of the fifth diode and the other end of the resistor are electrically connected; and a reference potential is provided by the power supply system and is connected to the The anode of the quadrupole and the anode of the sixth diode are electrically connected. The microfluidic actuator device described in item 9 of the scope of patent application, wherein the electrostatic protection circuit is arranged on the carrier board. The microfluidic actuator device described in claim 9, wherein the static electricity protection circuit is electrically connected to the at least one electrode pad on the carrier board.

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