TWI709734B - 具有熱隔離的溫度檢測器探針 - Google Patents
具有熱隔離的溫度檢測器探針 Download PDFInfo
- Publication number
- TWI709734B TWI709734B TW108110118A TW108110118A TWI709734B TW I709734 B TWI709734 B TW I709734B TW 108110118 A TW108110118 A TW 108110118A TW 108110118 A TW108110118 A TW 108110118A TW I709734 B TWI709734 B TW I709734B
- Authority
- TW
- Taiwan
- Prior art keywords
- sensor
- temperature detector
- detector probe
- pair
- housing
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims abstract description 84
- 238000002955 isolation Methods 0.000 title 1
- 238000012545 processing Methods 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 14
- WABPQHHGFIMREM-FTXFMUIASA-N lead-202 Chemical compound [202Pb] WABPQHHGFIMREM-FTXFMUIASA-N 0.000 description 7
- 238000009529 body temperature measurement Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- WABPQHHGFIMREM-AKLPVKDBSA-N lead-210 Chemical compound [210Pb] WABPQHHGFIMREM-AKLPVKDBSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- -1 polydimethylsiloxane Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
- G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862647094P | 2018-03-23 | 2018-03-23 | |
| US62/647,094 | 2018-03-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201940851A TW201940851A (zh) | 2019-10-16 |
| TWI709734B true TWI709734B (zh) | 2020-11-11 |
Family
ID=66041707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108110118A TWI709734B (zh) | 2018-03-23 | 2019-03-22 | 具有熱隔離的溫度檢測器探針 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US11280684B2 (https=) |
| EP (1) | EP3769060B1 (https=) |
| JP (1) | JP7309744B2 (https=) |
| KR (1) | KR102925276B1 (https=) |
| TW (1) | TWI709734B (https=) |
| WO (1) | WO2019183353A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102020103915A1 (de) * | 2020-02-14 | 2021-08-19 | Schlaeger Kunststofftechnik Gmbh | Vorrichtung zur Erfassung der Temperatur eines Objekts |
| US11583141B2 (en) | 2020-04-30 | 2023-02-21 | Weber-Stephen Products Llc | Mountable trays for temperature probe hubs |
| EP3951339B1 (en) * | 2020-08-06 | 2022-10-05 | Qnami AG | Nanoscale thermometry |
| CN111855000B (zh) * | 2020-08-21 | 2025-08-29 | 深圳市敏杰电子科技有限公司 | 防热辐射温度传感器 |
| CN114107923B (zh) * | 2021-11-02 | 2022-09-09 | 西北工业大学 | 一种金属基薄膜热流微传感器及其制备方法 |
| CN115691844A (zh) * | 2022-10-26 | 2023-02-03 | 连云港杰瑞电子有限公司 | 一种用于核电站冷却剂泄漏监测的温湿度探头 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3151484A (en) * | 1961-02-03 | 1964-10-06 | Gulf Oil Corp | Thermocouple support |
| US7473031B2 (en) * | 2002-04-01 | 2009-01-06 | Palo Alto Research Center, Incorporated | Resistive thermal sensing |
| DE202013007490U1 (de) * | 2013-08-23 | 2013-11-19 | Elth S.A. | Temperatursensor für ein Fluid |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2588014A (en) * | 1949-04-27 | 1952-03-04 | Lewis Eng Co | Resistance thermometer bulb |
| CH447652A (de) * | 1965-02-04 | 1967-11-30 | Ceskoslovenska Akademie Ved | Elektrischer Temperatur-Messfühler |
| JPS5127140B1 (https=) * | 1970-12-18 | 1976-08-11 | ||
| CA1040746A (en) | 1976-06-30 | 1978-10-17 | Robert W. Bertram | Thin film resistance temperature detector |
| US4242659A (en) * | 1979-10-15 | 1980-12-30 | Leeds & Northrup Company | Thin film resistance thermometer detector probe assembly |
| GB2062860A (en) * | 1979-11-06 | 1981-05-28 | Iss Clorius Ltd | Temperature sensing assembly |
| US4492948A (en) * | 1981-09-02 | 1985-01-08 | Leeds & Northrup Company | Fast response surface contact temperature sensor |
| US4454370A (en) * | 1982-09-07 | 1984-06-12 | Wahl Instruments, Inc. | Thermocouple surface probe |
| FR2580806B1 (fr) * | 1985-04-19 | 1987-06-26 | Gouault Jean | Sonde thermometrique pour la mesure de temperatures superficielles notamment cutanees |
| US4749415A (en) * | 1987-01-28 | 1988-06-07 | Westinghouse Electric Corp. | Fast response thermocouple element |
| US4962765A (en) * | 1987-03-12 | 1990-10-16 | Abiomed, Inc. | Diagnostic temperature probe |
| US5215597A (en) * | 1989-08-08 | 1993-06-01 | The United States Of America As Represented By The United States Department Of Energy | Method for bonding thin film thermocouples to ceramics |
| EP0764837A1 (en) * | 1995-09-25 | 1997-03-26 | Isuzu Ceramics Research Institute Co., Ltd. | Thermocouple structure |
| US6257758B1 (en) | 1998-10-09 | 2001-07-10 | Claud S. Gordon Company | Surface temperature sensor |
| JP2001201402A (ja) * | 2000-01-20 | 2001-07-27 | Kawaso Denki Kogyo Kk | 温度センサ及び接触式温度検出装置 |
| GB0103886D0 (en) * | 2001-02-16 | 2001-04-04 | Baumbach Per L | Temperature measuring device |
| US6821015B2 (en) * | 2002-01-25 | 2004-11-23 | Robert Hammer | Conducted heat vector sensor |
| KR100464133B1 (ko) * | 2003-03-27 | 2005-01-03 | 주식회사 대양계기 | 온도센서장치 |
| US7000478B1 (en) * | 2005-01-31 | 2006-02-21 | Texas Instruments Incorporated | Combined pressure and temperature transducer |
| DE102005038466B4 (de) | 2005-08-13 | 2007-12-13 | Sitronic Gesellschaft für elektrotechnische Ausrüstung mbH. & Co. KG | Sensoranordnung zur Temperaturmessung |
| CN101038214B (zh) * | 2006-03-14 | 2010-12-01 | 美亚铝厂有限公司 | 测量温度的装置和方法 |
| JP2007300065A (ja) * | 2006-04-05 | 2007-11-15 | Mitsui Mining & Smelting Co Ltd | 薄膜センサ、薄膜センサモジュール及び薄膜センサの製造方法 |
| EP1843138B1 (en) * | 2006-04-06 | 2012-05-16 | Sauer-Danfoss ApS | A bolt having a layer of conducting material forming a sensor |
| JP5027573B2 (ja) * | 2006-07-06 | 2012-09-19 | 株式会社小松製作所 | 温度センサおよび温調装置 |
| DE102006062115B4 (de) | 2006-12-22 | 2010-08-19 | Sitronic Ges. für elektrotechnische Ausrüstung GmbH & Co. KG | Sensoranordnung zur Temperaturmessung |
| US7651269B2 (en) * | 2007-07-19 | 2010-01-26 | Lam Research Corporation | Temperature probes having a thermally isolated tip |
| JP2009109313A (ja) * | 2007-10-30 | 2009-05-21 | Denso Corp | 圧力温度複合センサ |
| US8118486B2 (en) * | 2008-09-04 | 2012-02-21 | AGlobal Tech, LLC | Very high speed temperature probe |
| US9341522B2 (en) * | 2013-05-01 | 2016-05-17 | Rosemount Inc. | Spring-loaded temperature sensor |
| US9417138B2 (en) | 2013-09-10 | 2016-08-16 | Varian Semiconductor Equipment Associates, Inc. | Gas coupled probe for substrate temperature measurement |
| US10393592B2 (en) * | 2016-12-21 | 2019-08-27 | Intel Corporation | Systems and methods for measuring surface temperature |
-
2019
- 2019-03-21 US US16/360,669 patent/US11280684B2/en active Active
- 2019-03-21 EP EP19715681.3A patent/EP3769060B1/en active Active
- 2019-03-21 JP JP2020550750A patent/JP7309744B2/ja active Active
- 2019-03-21 KR KR1020207030502A patent/KR102925276B1/ko active Active
- 2019-03-21 WO PCT/US2019/023364 patent/WO2019183353A1/en not_active Ceased
- 2019-03-22 TW TW108110118A patent/TWI709734B/zh active
-
2022
- 2022-03-22 US US17/700,582 patent/US12372416B2/en active Active
-
2025
- 2025-07-28 US US19/282,660 patent/US20250354875A1/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3151484A (en) * | 1961-02-03 | 1964-10-06 | Gulf Oil Corp | Thermocouple support |
| US7473031B2 (en) * | 2002-04-01 | 2009-01-06 | Palo Alto Research Center, Incorporated | Resistive thermal sensing |
| DE202013007490U1 (de) * | 2013-08-23 | 2013-11-19 | Elth S.A. | Temperatursensor für ein Fluid |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201940851A (zh) | 2019-10-16 |
| WO2019183353A1 (en) | 2019-09-26 |
| US20250354875A1 (en) | 2025-11-20 |
| KR102925276B1 (ko) | 2026-02-06 |
| US20220214225A1 (en) | 2022-07-07 |
| KR20200131330A (ko) | 2020-11-23 |
| EP3769060B1 (en) | 2025-03-12 |
| JP2021518546A (ja) | 2021-08-02 |
| US11280684B2 (en) | 2022-03-22 |
| EP3769060A1 (en) | 2021-01-27 |
| JP7309744B2 (ja) | 2023-07-18 |
| US12372416B2 (en) | 2025-07-29 |
| US20190293495A1 (en) | 2019-09-26 |
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