TWI709478B - Method for manufacturing touch sensor film using tension control - Google Patents

Abstract

Provided is a method for manufacturing a touch sensor film using tension control, comprising the steps of: supplying a touch sensor portion formed on a carrier substrate to a protective film bonding roller portion; supplying a protective film portion to the protective film bonding roller portion, while increasing the tension of the protective film portion such that it expands; bonding the expanded the protective film portion to the touch sensor portion via the protective film bonding roller portion; supplying a first bonding body including the protective film portion and the touch sensor portion to a base film bonding roller portion, while shrinking the protective film portion bonded to the touch sensor portion; supplying a base film portion to the base film bonding roller portion, while increasing the tension of the base film portion such that it swells; and bonding the expanded base film portion to the touch sensor portion included in the first bonding body via the base film bonding roller portion. The present invention can prevent deterioration of the structural stability at the interface among the components due to the difference in shrinkage ratio of the components constituting the touch sensor film, and improve the durability of the touch sensor film.

Description

Manufacturing method of touch sensor film using tension control

The invention relates to a method for manufacturing a touch sensor film using tension control. In more detail, the present invention relates to a method for manufacturing a touch sensor film using tension control, which can prevent a decrease in structural stability at the boundary surface of the component due to the difference in the shrinkage rate of the component constituting the touch sensor film , And improve the durability of the touch sensor film.

Generally speaking, a touch sensor is a device that responds to the touch and grasps the position of the touch when the user touches the image displayed on the screen with a finger, stylus, or the like. According to its application technology, there are electrostatic capacitance methods and resistors. Various methods such as film method, surface wave method using infrared or ultrasonic waves.

Such touch sensors are generally manufactured with structures that are installed in display devices such as liquid crystal display panels (liquid crystal displays, LCD), organic EL (organic light-emitting diodes, OLED), etc. Recently, the use of polymer films to replace glass substrates As a base film, research on thinner, lighter, and flexible film-type touch sensors is active.

The manufacturing method of such a conventional touch sensor film will be described below.

The existing touch sensor film is manufactured by the following process: a plurality of unit touch sensors are formed on a large-area original plate continuously supplied using a roll to roll process, etc., and after joining the necessary functional films, Cut into unit touch sensors by subsequent processes.

Such a touch sensor film includes a transparent conductive pattern that functions as a sensing electrode, a functional layer that functions as a base for forming the transparent conductive pattern, and a functional layer that protects the transparent conductive pattern.

On the other hand, the thermal expansion coefficients of the multiple functional layers constituting the touch sensor film are different. Therefore, in an environment where the touch sensor film is actually used, the difference in the shrinkage rate due to the difference in the thermal expansion coefficient of the functional layer causes the following problems: On the boundary surface of the functional layer, the structural stability is reduced, and the durability of the touch sensor film is reduced.

[Prior Technical Literature] [Patent Literature]

Patent Document 1: Korean Open Patent Publication No. 10-2007-0009724 (Publication Date: January 18, 2007, Name: Conductive Film for Touch Panel and Method for Manufacturing Conductive Film for Touch Panel).

The technical problem of the present invention is to provide a method for manufacturing a touch sensor film using tension control, which can prevent the structural stability from being reduced at the boundary surface of the component due to the difference in the shrinkage rate of the component constituting the touch sensor film , And improve the durability of the touch sensor film.

The method for manufacturing a touch sensor film using tension control according to the present invention for solving such technical problems includes: supplying a touch sensor part formed on a carrier substrate to a touch sensor supplying a protective film bonding roller part Step; while increasing the tension of the protective film portion to expand, while supplying the protective film portion to the protective film joining roller portion of the protective film supply step; the protective film joining roller portion joins the expanded protective film portion to the contact Control the protective film joining step of the sensor part; while shrinking the protective film joined to the touch sensor part, supply the first joint body including the protective film part and the touch sensor part to the base film The first joining body supply step of the joining roll section; the base film supply step of supplying the base film section to the base film joining roll section while increasing the tension of the base film section to expand it; The film bonding roll part bonds the expanded base film part to the base film bonding process of the touch sensor part contained in the said 1st bonded body.

According to the method of manufacturing a touch sensor film using tension control of the present invention, after the base film bonding step, a second bonding body shrinking step is further included, wherein The second joined body in the base film portion shrinks.

According to the method of manufacturing a touch sensor film using tension control according to the present invention, the tension applied to the protective film portion and the base film portion is 50 N or more and 1500 N or less.

According to the method of manufacturing a touch sensor film using tension control according to the present invention, the shrinkage rate of the protective film portion and the base film portion is 0.01% or more and 10% or less.

According to the method of manufacturing a touch sensor film using tension control according to the present invention, in the protective film supply step, the rotation speed of the protective film supply roller portion supplied to the protective film portion is adjusted to adjust the protection The tension of the protective film portion supplied by the film supply roller portion to the protective film joining roller portion.

According to the method of manufacturing a touch sensor film using tension control according to the present invention, in the base film supply step, the rotation speed of the base film supply roller section supplied to the base film section is adjusted to adjust The tension of the base film part supplied from the base film supply roll part to the base film joining roll part.

According to the method of manufacturing a touch sensor film utilizing tension control of the present invention, the surface to be bonded to the touch sensor portion is formed on both surfaces of the base film portion supplied to the base film bonding roll portion. The bonding agent layer.

According to the method of manufacturing a touch sensor film using tension control according to the present invention, in the protective film joining step, the protective film part is joined to the touch sensor part while simultaneously joining the touch sensor part Separated from the aforementioned carrier substrate.

According to the method for manufacturing a touch sensor film using tension control according to the present invention, the base film portion includes one selected from the group consisting of COP (cycloolefin polymer), TAC (triacetyl cellulose), and acrylic the above.

According to the present invention, there is an effect of providing a method for manufacturing a touch sensor film using tension control, which can prevent the formation of a structure on the boundary surface of the component due to the difference in the shrinkage rate of the component constituting the touch sensor film The stability is reduced and the durability of the touch sensor film is improved.

10‧‧‧Carrier substrate

20‧‧‧Touch sensor section

30‧‧‧Protective Film Department

40‧‧‧Substrate Film Department

50‧‧‧Cement layer

110‧‧‧Protective Film Supply Roller

120‧‧‧Protective film bonding roller

130‧‧‧The first intermediate roller

140‧‧‧Base film supply roll section

150‧‧‧Cement supply roller

170‧‧‧Substrate film joining roller section

S10‧‧‧Touch sensor supply steps

S20‧‧‧Protection film supply steps

S30‧‧‧Protection film bonding step

S40‧‧‧First assembly supply step

S50‧‧‧Substrate film supply step

S60‧‧‧Substrate film bonding step

S70‧‧‧The second joint shrinking step

FIG. 1 is a diagram showing a method of manufacturing a touch sensor film using tension control according to an embodiment of the present invention.

FIG. 2 is a diagram exemplarily showing the configuration of an apparatus for performing a method of manufacturing a touch sensor film using tension control according to an embodiment of the present invention.

Fig. 3 is a graph showing experimental data regarding the relationship between the tension of the protective film portion and the shrinkage rate in an example of the present invention.

Fig. 4 is a graph showing experimental data regarding the relationship between the tension of the base film portion and the shrinkage rate in an example of the present invention.

The description of the specific structure or function of the embodiment according to the inventive concept disclosed in this specification is to illustrate the embodiment according to the inventive concept, and the embodiment according to the inventive concept can be implemented in various ways. It is limited to the examples described in this specification.

The embodiments according to the inventive concept can be variously modified and can have various forms, so the embodiments are illustrated in the drawings and described in detail in this specification. However, this does not limit the embodiment based on the concept of the present invention to a specific disclosed form, but includes all the modifications, equivalents, or substitutions included in the idea and technical scope of the present invention.

The first or second terms can be used to describe various constituent elements, but the aforementioned constituent elements should not be limited by the aforementioned terms. The above terms are used to distinguish one component from another. For example, as long as it does not deviate from the scope of the patent application according to the present invention, the first component can be named as the second component. Similarly, the second component can be Named as the first component.

When a component is described as “connected” or “connected” with another component, it should be understood that a certain component can be directly connected or connected with another component, but there may be other components in between. . On the other hand, when it is described that a certain component is "directly connected" or "directly connected" with another component, it should be understood that there is no further component between each component. Other expressions describing the relationship between the constituent elements, that is, "between" and "directly between ~" or "adjacent to" and "directly adjacent to" should also be the same To explain.

The terms used in this specification are used to describe specific embodiments and do not limit the present invention. The singular representation includes plural representations as long as no different definition is clearly given in the context. In this specification, terms such as "include" or "have" are used to designate the existence of the features, numbers, steps, actions, constituent elements, components, or their combinations described in this specification, and it should be understood that one or more of them are not excluded in advance Other features, numbers, steps, actions, constituent elements, components, or combinations thereof, etc. exist or are additional possibilities.

As long as no different definitions are given, all terms used in this specification, including technical terms and scientific terms, have the same meaning as generally understood by those of ordinary skill in the technical field to which the present invention belongs. The terms defined in the generally used dictionaries should be understood as having meanings consistent with the meanings in the context of related technologies. As long as they are not clearly defined in this specification, they should not be interpreted as ideal or excessive formal meanings.

Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 is a diagram showing a method of manufacturing a touch sensor film using tension control according to an embodiment of the present invention, and Fig. 2 is an exemplary diagram showing a touch control using tension control according to an embodiment of the present invention. A diagram showing the structure of the device in the method of manufacturing the sensor film.

1 and 2, a method for manufacturing a touch sensor film using tension control according to an embodiment of the present invention includes: touch sensor supply step S10, protective film supply step S20, and protective film bonding step S30 , The first bonded body supply step S40, the base film supply step S50, the base film bonding step S60, and the second bonded body shrinking step S70.

In the touch sensor supply step S10, a process of supplying the touch sensor part 20 formed on the carrier substrate 10 to the protective film bonding roller part 120 is performed.

For example, the touch sensor unit 20 performs the function of sensing electrodes, and may include a first transparent conductive pattern, a second transparent conductive pattern, an insulating layer, and a bridge pattern formed in directions that cross each other. .

The first transparent conductive pattern can be formed along the first direction while being electrically connected to each other, and the second transparent conductive pattern can be formed along the second direction while the unit cells are electrically separated from each other. The second direction It may be a direction intersecting the first direction. For example, when the first direction is the X direction, the second direction may be the Y direction.

The insulating layer can be formed between the first transparent conductive pattern and the second transparent conductive pattern, and electrically insulate the first transparent conductive pattern from the second transparent conductive pattern.

The bridge pattern electrically connects the adjacent second transparent conductive patterns.

As the first transparent conductive pattern and the second transparent conductive pattern, any transparent conductive material can be used without limitation. For example, it can be selected from indium tin oxide (ITO), indium zinc oxide (IZO), and indium. Zinc tin oxide (IZTO), aluminum zinc oxide (AZO), gallium zinc oxide (GZO), fluorine doped tin oxide (FTO), indium tin oxide-silver-indium tin oxide (ITO-Ag-ITO) ), indium zinc oxide-silver-indium zinc oxide (IZO-Ag-IZO), indium zinc tin oxide-silver-indium zinc tin oxide (IZTO-Ag-IZTO) and aluminum zinc oxide-silver-aluminum Metal oxides in zinc oxide (AZO-Ag-AZO); metals selected from gold (Au), silver (Ag), copper (Cu), molybdenum (Mo) and APC; metals selected from gold, silver , Copper and lead metal nanowires; carbon-based substances selected from carbon nanotubes (CNT) and graphene (graphene); and selected from poly(3,4-ethylenedioxythiophene) (PEDOT) and polyaniline (PANI) in conductive polymer materials. These can be used alone or in combination of two or more, preferably indium tin oxide can be used. Either crystalline or amorphous indium tin oxide can be used.

For example, the first transparent conductive pattern and the second transparent conductive pattern may independently have a triangular shape, a quadrangular shape, a pentagonal shape, a hexagonal shape, or a polygonal pattern more than 7-sided polygonal shape.

In addition, for example, the first transparent conductive pattern and the second transparent conductive pattern may include regular patterns. "Regular pattern" means that the form of the pattern has regularity. For example, the sensing pattern can independently include patterns in a mesh shape such as a rectangle or a square, or patterns in a hexagonal shape.

In addition, for example, the first transparent conductive pattern and the second transparent conductive pattern may include irregular patterns. The so-called irregular pattern means that the shape of the pattern does not have regularity.

In addition, for example, when the sensing patterns constituting the first transparent conductive pattern and the second transparent conductive pattern are formed of materials such as metal nanowires, carbon-based materials, and polymer materials, the sensing patterns can have a mesh.状结构。 Like structure. In the case where the sensing patterns have a mesh structure, since they contact each other and sequentially transmit signals to adjacent patterns, a pattern with high sensitivity can be realized.

For example, the first transparent conductive pattern and the second transparent conductive pattern may be formed of a single layer or multiple layers.

As a raw material for the insulating layer that insulates the first transparent conductive pattern and the second transparent conductive pattern, insulating materials known in the technical field can be used without limitation. For example, metal oxides such as silicon oxides can be used. A photosensitive resin composition or a thermosetting composition containing an acrylic resin. Alternatively, the insulating layer may be formed using an inorganic substance such as silicon oxide (SiOx). In this case, it may be formed by methods such as vapor deposition and sputtering.

In the protective film supply step S20, a process of supplying the protective film section 30 from the protective film supply roller section 110 to the protective film bonding roller section 120 is performed while increasing the tension of the protective film section 30 to expand it. The protective film portion 30 has functions such as insulating and protecting the touch sensor portion 20 from the outside.

As shown in the component symbol A in FIG. 2, in the protective film supply step S20, since the tension applied to the protective film portion 30 increases, the protective film portion 30 becomes swollen compared to the touch sensor portion 20 The protective film portion 30 in the expanded state is shrunk to the normal state in the first bonded body supply step S40 described later.

In addition, for example, the shrinkage rate of the protective film portion 30 may be 0.01% or more and 10% or less, more preferably, 0.01% or more and 1.5% or less.

For example, in the protective film supply step S20, it may be configured as follows: by adjusting the rotation speed of the protective film supply roller portion 110 that supplies the protective film portion 30, the protective film supply roller portion 110 is adjusted to the protective film joining roller portion. The tension of the protective film portion 30 supplied by 120.

In the protective film joining step S30, the following process is performed: the protective film joining roller section 120 presses the protective film section 30 supplied from the protective film supply roller section 110 in an expanded state, and is joined to the touch sensor section 20 .

For example, in the protective film bonding step S30, it may be configured to separate the touch sensor section 20 from the carrier substrate 10 while bonding the protective film section 30 to the touch sensor section 20.

In the first bonded body supply step S40, the following process is performed: while shrinking the protective film section 30 bonded to the touch sensor section 20, the first bonded body including the protective film section 30 and the touch sensor section 20 is shrunk It is supplied to the base film bonding roll part 170. For example, by supplying the first bonded body from the protective film bonding roll section 120 to the base film bonding roll section 170 via the first intermediate roll 130, the tension applied to the protective film section 30 in the protective film supply step S20 is smaller than Tension is applied to the first bonded body, so that the first bonded body can be contracted, and more specifically, the protective film portion 30 constituting the first bonded body can be contracted.

In the base film supply step S50, the process of supplying the base film section 40 from the base film supply roll section 140 to the base film joining roll section while increasing the tension of the base film section 40 to expand it is performed 170.

For example, in the base film supply step S50, it may be configured as follows: by adjusting the rotation speed of the base film supply roll section 140 that supplies the base film section 40, the supply from the base film supply roll section 140 to The base film is bonded to the tension of the base film section 40 of the roll section 170.

As indicated by the symbol B in FIG. 2, in the base film supply step S50, since the tension applied to the base film section 40 is increased, the base film section 40 is different from the one including the touch sensor section 20 and the protective film. The first joined body of the portion 30 is compared to the expanded state, and the base film portion 40 in the expanded state is shrunk to the normal state by the second joined body shrinking step S70 described later.

In addition, for example, the shrinkage rate of the base film portion 40 may be 0.01% or more and 10% or less, and more preferably, 0.01% or more and 1.5% or less.

For example, it can be configured as follows: out of both surfaces of the base film portion 40 supplied to the base film bonding roller portion 170, the bonding agent layer 50 is formed on the surface bonded to the touch sensor portion 20 constituting the first bonded body. As an exemplary configuration for this, by pressing the base film portion 40 supplied from the base film supply roller portion 140 by the bonding agent supply roll 150 formed with the bonding agent, the base film portion 40 can be formed. Bonding agent layer 50.

The base film portion 40 is bonded to the touch sensor portion 20 via the bonding agent layer 50 and functions as a base of the touch sensor portion 20.

For example, the base film part 40 may contain one or more selected from COP (cycloolefin polymer), TAC (triacetyl cellulose), and acrylic, but the base film part 40 is not limited to this.

For example, the base film part 40 may be a transparent optical film or a polarizing plate.

As the transparent optical film, films excellent in transparency, mechanical strength, and thermal stability can be used. Specific examples include polyethylene terephthalate, polyethylene isophthalate, and poly(ethylene terephthalate). Polyester resins such as ethylene naphthalate and polybutylene terephthalate; diethyl Cellulose resins such as cellulose and triacetyl cellulose; polycarbonate resins; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; polystyrene, acrylonitrile- Styrenic resins such as styrene copolymers; polyolefin resins such as polyethylene, polypropylene, polyolefins with cyclic or norbornene structures, and ethylene-propylene copolymers; vinyl chloride resins; nylon, aromatic polyamides Amine-based resins such as amines; imine-based resins; polyether-based resins; turpentine-based resins; polyetheretherketone-based resins; polyphenylene sulfide-based resins; vinyl alcohol-based resins; vinylidene chloride-based resins; vinyl alcohol A film composed of a thermoplastic resin such as a butyral resin; an arylate resin; a polyoxymethylene resin; an epoxy resin, etc., may be a film composed of a blend of the above-mentioned thermoplastic resins. In addition, a film made of (meth)acrylic, urethane, acrylic urethane, epoxy, silicon, or other thermosetting resins or ultraviolet curable resins can be used. The thickness of such a transparent optical film can be appropriately determined, and generally, it can be determined to be 1 to 500 μm in consideration of workability such as strength and handling properties, and thin layer properties. In particular, it is preferably 1 to 300 μm, more preferably 5 to 200 μm.

Such a transparent optical film may contain one or more suitable additives. Examples of additives include ultraviolet absorbers, antioxidants, lubricants, plasticizers, mold release agents, anti-coloring agents, flame retardants, nucleating agents, antistatic agents, pigments, colorants, and the like. The transparent optical film may have a structure including various functional layers such as a hard coat layer, an anti-reflection layer, and a gas barrier layer on one or both sides of the film. The functional layer is not limited to the above-mentioned layers, and may include various functions depending on the application. Floor.

In addition, if necessary, the transparent optical film may be a surface-treated transparent optical film. Examples of such surface treatments include dry treatments such as plasma treatment, corona treatment, and primer treatment, and chemical treatments such as alkali treatment including saponification treatment.

In addition, the transparent optical film may be an isotropic film or a retardation film.

In the case of an isotropic film, the in-plane retardation (Ro, Ro=[(nx-ny)×d], where nx and ny are the principal refractive indices in the film plane, and d is the thickness of the film.) is 40 nm or less , Preferably 15nm or less, the phase difference in the thickness direction (Rth, Rth=[(nx+ny)/2-nz]×d, nx, ny are the principal refractive indices in the film plane, and nz is the refraction in the film thickness direction The ratio, d is the thickness of the film.) is -90nm~+75nm, preferably -80nm~+60nm, particularly preferably -70nm~+45nm.

Retardation film is a film manufactured by the methods of uniaxial stretching, biaxial stretching, polymer coating, and liquid crystal coating of polymer films. It is generally used for viewing angle compensation, color perception improvement, light leakage improvement, and color tone of displays. Improvement and adjustment of optical characteristics such as adjustment. As the types of retardation films, there are 1/2, 1/4 wavelength plates, positive C plates, negative C plates, positive A plates, negative A plates, biaxial wave plates, and the like.

As the polarizing plate, a known polarizing plate used in a display panel can be used. Specifically, a polarizing plate in which a protective layer is provided on at least one surface of a polarizer dyed with iodine or a dichroic dye by stretching a polyvinyl alcohol film; a method having the performance of a polarizer by aligning liquid crystals The produced polarizing plate; the polarizing plate produced by coating an oriented resin such as polyvinyl alcohol on a transparent film, stretching and dyeing it, but not limited to this.

In the base film joining step S60, a process is performed in which the base film joining roller section 170 joins the expanded base film section 40 to the touch sensor section 20 included in the first joined body.

When the base film bonding step S60 is performed, a second bonded body in which the protective film section 30, the touch sensor section 20, and the base film section 40 are sequentially laminated, that is, the touch sensor film, the base film section 40 is obtained. It is bonded to the touch sensor part 20 with the bonding agent layer 50.

In the second assembly shrinking step S70, a process of shrinking the second assembly including the base film section 40 joined to the touch sensor section 20 is performed.

For example, by applying a tension weaker than the tension applied to the base film portion 40 in the base film supply step S50 to the second bonded body, the second bonded body, more specifically, the base of the second bonded body can be formed. The material film portion 40 shrinks to a normal state.

Fig. 3 shows experimental data on the relationship between the tension of the protective film portion 30 and the shrinkage rate, and Fig. 4 shows experimental data on the relationship between the tension of the base film portion 40 and the shrinkage rate. With reference to Figs. 3 and 4, it can be confirmed that the protective film section 30 and the base film section 40 show a certain level of shrinkage characteristics according to changes in the tension applied to the protective film section 30 and the base film section 40.

As described in detail above, according to the present invention, there is an effect of providing a method for manufacturing a touch sensor film using tension control, which can prevent the difference in shrinkage of the components constituting the touch sensor film from causing damage to the components. The structural stability generated by the boundary surface of the sensor is reduced, and the durability of the touch sensor film is improved.

S10‧‧‧Supply the touch sensor part formed on the carrier substrate to the protective film bonding roller part

S20‧‧‧Supply the above-mentioned protective film to the protective film joining roller while increasing the tension of the protective film to expand it

S30‧‧‧The protective film joining roller part joins the expanded protective film part to the touch sensor part

S40‧‧‧Supply the first bonded body including the protection film and the touch sensor to the base film bonding roller while shrinking the protective film bonded to the touch sensor part

S50‧‧‧Supplying the base film section to the base film joining roller section while increasing the tension of the base film section to expand it

S60‧‧‧The base film joining roller section joins the expanded base film section to the touch sensor section of the first joint body

S70‧‧‧Shrink the second joint body including the base film part joined to the touch sensor part

Claims (7)

A method of manufacturing a touch sensor film using tension control includes: a touch sensor supply step of supplying a touch sensor part formed on a carrier substrate to a protective film bonding roller part; The protective film supply step of increasing the tension to expand and supplying the protective film portion to the protective film joining roller portion; the protective film joining roller portion joins the expanded protective film portion to the protective film of the touch sensor portion Step: Apply a tension lower than the tension applied to the protective film portion in the protective film supply step to the first bonded body, shrink the protective film portion bonded to the touch sensor portion, and include the protective film The first joining body supplying step of supplying the first joined body of the part and the touch sensor part to the base film joining roller section; while increasing the tension applied to the base film section to expand it, while making the base film section The step of supplying a substrate film in which the substrate film portion is in an expanded state compared to the first joined body and the substrate film portion is supplied to the substrate film joining roll portion; the substrate film portion that the substrate film joining roll portion swells The step of joining the base film of the touch sensor part contained in the first joint body; and the second joint body that shrinks the second joint body including the base film part joined to the touch sensor part Shrinking step; the touch sensing portion has the protective film portion and the base film portion Each has a different coefficient of thermal expansion. The manufacturing method according to claim 1, wherein the shrinkage rate of the protective film portion and the base film portion is 0.01% or more and 10% or less. The manufacturing method according to claim 1, wherein, in the protective film supply step, by adjusting the rotation speed of the protective film supply roll section that supplies the protective film section, the protective film supply roll section is adjusted The tension of the protective film part supplied to this protective film joining roll part. The manufacturing method according to claim 1, wherein, in the substrate film supply step, the rotation speed of the substrate film supply roller portion supplied to the substrate film portion is adjusted to adjust the substrate The tension of the base film part supplied by the film supply roll part to this base film joining roll part. The manufacturing method according to claim 1, wherein a bonding agent layer is formed on both surfaces of the base film portion supplied to the base film bonding roll portion to be bonded to the touch sensor portion . The manufacturing method according to claim 1, wherein, in the protective film bonding step, the protective film portion is bonded to the touch sensor portion while removing the touch sensor portion from the carrier substrate Separate. The manufacturing method according to claim 1, wherein the base film portion contains one or more selected from the group consisting of COP (cycloolefin polymer), TAC (triacetyl cellulose), and acrylic.

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