KR20180097932A - Touch sensor film manufacturing method using tension and temperature control - Google Patents

Abstract

The present invention relates to a method for manufacturing a touch sensor film using a control of temperature and tension. The method of the present invention comprises the steps of: supplying a touch sensor unit formed on a carrier substrate to a protection film bonding roller unit; applying heat to the protection film unit and increasing tension thereof to expand the same, and supplying the same to the protection film bonding roller unit; bonding the expanded protection film unit to the touch sensor unit by the protection film bonding roller unit; shrinking the protection film unit bonded to the touch sensor unit to supply a first bonded body including the protection film unit and the touch sensor unit to a substrate film bonding roller unit; applying heat to the substrate film unit and increasing tension thereof to expand the same, and supplying the same to the substrate film bonding roller unit; and bonding the expanded substrate film unit to the touch sensor unit included in the first bonded body by the substrate film bonding roller unit. According to the present invention, it is possible to prevent a decrease in structural stability occurring on the interface between components constituting the touch sensor film due to difference in shrinkage rates of the components, and durability of the touch sensor film can be enhanced.

Description

TECHNICAL FIELD [0001] The present invention relates to a touch sensor film manufacturing method using temperature and tension control,

The present invention relates to a method of manufacturing a touch sensor film using temperature and tension control. More particularly, the present invention relates to a touch sensor which can prevent deterioration of structural stability occurring at the interface between components due to a difference in shrinkage ratio of components constituting the touch sensor film, and which can improve the durability of the touch sensor film, And a sensor film manufacturing method.

In general, when a user touches an image displayed on a screen with a finger or a touch pen, the touch sensor detects the touch point in response to the touch. The touch sensor is classified into a capacitive type, a resistive type, And a surface wave method using an ultrasonic wave or the like.

Such a touch sensor is generally manufactured by mounting on a display device such as a liquid crystal display (LCD), an organic EL (Organic light-Emitting Diode), etc. Recently, a polymer film replacing a glass substrate Researches on film-type touch sensors that are thinner, lighter and bendable using base film have been actively conducted.

The conventional manufacturing method of the touch sensor film will be described as follows.

The conventional touch sensor film is formed by forming a large number of unit touch sensors on a large-area circular plate continuously supplied using a roll-to-roll process or the like, joining necessary functional films, It is manufactured by cutting each sensor.

Such a touch sensor film includes a transparent conductive pattern that performs the function of a sensing electrode, a functional layer that functions as a matrix on which a transparent conductive pattern is formed, and a functional layer that performs a function of protecting the transparent conductive pattern.

On the other hand, since the coefficient of thermal expansion of the various functional layers constituting the touch sensor film is different, the structural stability is deteriorated at the interface between the functional layers due to the difference in shrinkage ratio due to the difference in the thermal expansion coefficient of the functional layers in an environment where the touch sensor film is actually used And the durability of the touch sensor film is deteriorated.

Korean Patent Laid-Open Publication No. 10-2007-0009724 (Published Date: Jan. 18, 2007, titled: Conductive Film for Touch Panel and Method for Producing Conductive Film for Touch Panel)

The present invention relates to a touch sensor film manufacturing method using a temperature and tension control capable of preventing deterioration of structural stability occurring at the interface between components due to a difference in shrinkage factor of components constituting the touch sensor film and improving durability of the touch sensor film And to provide a method of manufacturing the same.

According to an aspect of the present invention, there is provided a method of manufacturing a touch sensor film using temperature and tension control, the method comprising: supplying a touch sensor unit formed on a carrier substrate to a protective film bonding roller unit; A protective film joining step of joining the expanded protective film part to the touch sensor part, a step of joining the protective film joining roller part to the protective film joining roller part, Supplying a first bonding body including the protective film portion and the touch sensor portion to a base film bonding roller portion while shrinking the protective film portion while applying heat to the base film portion and expanding the base film portion by increasing tension, A base film supplying step of supplying the base film to the roller portion, Described in the joining roller are added to parts of the expansion film comprises a base film bonding step of bonding a touch sensor included in the first conjugate.

The method for manufacturing a touch sensor film using temperature and tension control according to the present invention further includes a second bonding body shrinking step for shrinking the second bonding body including the substrate film portion bonded to the touch sensor portion after the base film bonding step .

In the method of manufacturing a touch sensor film using temperature and tension control according to the present invention, the tension applied to the protective film portion and the base film portion is 50 N or more and 1,500 N or less.

In the method of manufacturing a touch sensor film using temperature and tension control according to the present invention, the shrinkage percentage of the protective film portion and the substrate film portion is 0.01% or more and 10% or less.

In the method of manufacturing a touch sensor film using temperature and tension control according to the present invention, in the protective film supplying step, heat is transmitted to the protective film part by heating the protective film bonding roller part to expand the protective film part.

In the method of manufacturing a touch sensor film using temperature and tension control according to the present invention, in the protective film supplying step, the protective film feed roller portion for supplying the protective film portion and the protective film portion Thereby expanding.

In the method of manufacturing a touch sensor film using temperature and tension control according to the present invention, in the protective film supplying step, the rotation speed of the protective film feed roller portion for supplying the protective film portion is adjusted, And the tension of the protective film portion supplied to the film joining roller portion is controlled.

In the method of manufacturing a touch sensor film using temperature and tension control according to the present invention, in the base film supplying step, heat is transmitted to the base film portion by heating the base film film joining roller portion to expand the base film portion.

In the method of manufacturing a touch sensor film using temperature and tension control according to the present invention, in the supplying step of the base film, a base film feed roller portion for feeding the base film portion and a base film portion Thereby expanding.

In the method of manufacturing a touch sensor film using the temperature and tension control according to the present invention, in the supplying of the base film, the rotation speed of the base film feed roller portion for feeding the base film portion is controlled, And the tension of the base film portion supplied to the film joining roller portion is controlled.

In the method of manufacturing a touch sensor film using temperature and tension control according to the present invention, a bonding agent is formed on a surface of the base film portion supplied to the base film bonding roller portion, the surface being bonded to the touch sensor portion.

In the method of manufacturing a touch sensor film using temperature and tension control according to the present invention, in the protective film bonding step, the touch sensor unit is separated from the carrier substrate while bonding the protective film unit to the touch sensor unit .

In the method of manufacturing a touch sensor film using temperature and tension control according to the present invention, the base film part may include at least one selected from the group consisting of COP (Cyclo Olefin Polymer), TAC (Tri Acetyl Cellulose) do.

According to the present invention, there is provided a touch sensor film using a temperature and tension control capable of preventing deterioration in structural stability occurring at the interface between components due to a difference in shrinkage factor of components constituting the touch sensor film and improving durability of the touch sensor film There is an effect that a manufacturing method is provided.

1 is a view illustrating a method of manufacturing a touch sensor film using temperature and tension control according to an embodiment of the present invention,
FIG. 2 is a view illustrating a device configuration in which a method of manufacturing a touch sensor film using temperature and tension control according to an embodiment of the present invention is performed,
Figure 3 shows experimental data on the relationship between temperature, tension and shrinkage in one embodiment of the present invention.

It is to be understood that the specific structural or functional description of embodiments of the present invention disclosed herein is for illustrative purposes only and is not intended to limit the scope of the inventive concept But may be embodied in many different forms and is not limited to the embodiments set forth herein.

The embodiments according to the concept of the present invention can make various changes and can take various forms, so that the embodiments are illustrated in the drawings and described in detail herein. It should be understood, however, that it is not intended to limit the embodiments according to the concepts of the present invention to the particular forms disclosed, but includes all modifications, equivalents, or alternatives falling within the spirit and scope of the invention.

The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms may be named for the purpose of distinguishing one element from another, for example, without departing from the scope of the right according to the concept of the present invention, the first element may be referred to as a second element, The component may also be referred to as a first component.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that no other element exists in between. Other expressions that describe the relationship between components, such as "between" and "between" or "neighboring to" and "directly adjacent to" should be interpreted as well.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises" or "having" and the like are used to specify that there are features, numbers, steps, operations, elements, parts or combinations thereof described herein, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning of the context in the relevant art and, unless explicitly defined herein, are to be interpreted as ideal or overly formal Do not.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 illustrates a method of manufacturing a touch sensor film using temperature and tension control according to an embodiment of the present invention. FIG. 2 illustrates a method of manufacturing a touch sensor film using temperature and tension control according to an embodiment of the present invention. Fig. 6 is a diagram exemplarily showing a device configuration to be performed; Fig.

Referring to FIGS. 1 and 2, a method of manufacturing a touch sensor film using temperature and tension control according to an embodiment of the present invention includes a step of supplying a touch sensor S10, a step of supplying a protective film S20, S30), a first junction body supplying step (S40), a base film supplying step (S50), a base film bonding step (S60), and a second junction body contracting step (S70).

In the touch sensor supply step S10, a process of supplying the touch sensor unit 20 formed on the carrier substrate 10 to the protective film bonding roller unit 120 is performed.

For example, the touch sensor unit 20 may include a first transparent conductive pattern, a second transparent conductive pattern, an insulating layer, and a bridge pattern formed in a direction intersecting with each other, have.

 The first transparent conductive pattern may be formed along the first direction while being electrically connected to each other, the second transparent conductive pattern may be formed along the second direction in a state where the first transparent conductive pattern is electrically isolated from each other, The direction may be a direction intersecting with the first direction. For example, when the first direction is the X direction, the second direction may be the Y direction.

The insulating layer may be formed between the first transparent conductive pattern and the second transparent conductive pattern, and electrically insulates the first transparent conductive pattern from the second transparent conductive pattern.

The bridge pattern electrically connects the adjacent second transparent conductive pattern.

As the first and second transparent conductive patterns, any transparent conductive material can be used without limitation, and examples thereof include indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), aluminum zinc oxide Indium zinc oxide (AZO), gallium zinc oxide (GZO), flintine oxide (FTO), indium tin oxide-silver-indium tin oxide (ITO-Ag-ITO), indium zinc oxide- ), Indium zinc tin oxide-silver-indium zinc-tin oxide (IZTO-Ag-IZTO) and aluminum zinc oxide-silver-aluminum zinc oxide (AZO-Ag-AZO); Metals selected from the group consisting of gold (Au), silver (Ag), copper (Cu), molybdenum (Mo) and APC; Nanowires of metals selected from the group consisting of gold, silver, copper and lead; Carbon-based materials selected from the group consisting of carbon nanotubes (CNT) and graphene; And conductive polymer materials selected from the group consisting of poly (3,4-ethylenedioxythiophene) (PEDOT) and polyaniline (PANI). These materials may be used singly or in combination of two or more. Preferably, indium tin oxide may be used. Both crystalline and amorphous indium tin oxides are available.

For example, the first and second transparent conductive patterns may be polygonal patterns of triangular, tetragonal, pentagonal, hexagonal, or hexagonal or more independent of each other.

Further, for example, the first and second transparent conductive patterns may include a regular pattern. A rule pattern means that the pattern form has regularity. For example, the sensing patterns may include a mesh shape such as a rectangle or a square, or a pattern such as a hexagon, independently of each other.

Also, for example, the first and second transparent conductive patterns may include an irregular pattern. The irregular pattern means that the shape of the pattern does not have regularity.

Further, for example, when the sensing patterns constituting the first and second transparent conductive patterns are formed of a material such as a metal nanowire, a carbon-based material, or a polymer material, the sensing patterns may have a network structure. When the sensing patterns have a network structure, signals are sequentially transmitted to adjacent patterns in contact with each other, so that a pattern having high sensitivity can be realized.

For example, the first and second transparent conductive patterns may be formed of a single layer or a plurality of layers.

As the material of the insulating layer for insulating the first and second transparent conductive patterns, an insulating material known in the art may be used without limitation. For example, a photosensitive resin composition containing a metal oxide such as silicon oxide or an acrylic resin, A thermosetting resin composition may be used. Alternatively, the insulating layer may be formed using an inorganic material such as silicon oxide (SiOx). In this case, the insulating layer may be formed by vapor deposition, sputtering or the like.

In the protective film supply step S20, heat is applied to the protective film part 30, the protective film part 30 is moved from the protective film feeding roller part 110 to the protective film joining roller part 120 The process of supplying is performed. The protection film unit 30 functions to insulate and protect the touch sensor unit 20 from the outside.

2, the protection film portion 30 is heated and the tension applied to the protection film portion 30 is increased in the protection film supply step S20, Is expanded relative to the touch sensor unit 20 and the expanded protective film unit 30 shrinks to a steady state through the first joint body supply step S40 described later.

For example, the tension applied to the protective film portion 30 may be 50 N or more and 1500 N or less, and more preferably 50 N or more and 700 N or less.

In addition, for example, the shrinkage percentage of the protective film portion 30 may be 0.01% or more and 10% or less, and more preferably 0.01% or more and 1.5% or less.

As one example, the protective film supply step S20 may be configured to heat the protective film joining roller part 120 to transfer heat to the protective film part 30 to expand it. More specifically, in this example, the roller 122 (or 122) which contacts the protective film portion 30 and presses the protective film portion 30 out of the pair of rollers 122 and 124 constituting the protective film joining roller portion 120 ) In a manner that generates heat.

In another example, the protective film supply step S20 may include a step of supplying heat to the protective film part 30 located between the protective film supplying roller part 110 for supplying the protective film part 30 and the protective film bonding roller part 120, To expand and inflate.

For example, in the protective film supply step S20, the rotation speed of the protective film feed roller unit 110 for supplying the protective film unit 30 is adjusted so that the protective film feed roller unit 110, The tension of the protective film portion 30 supplied to the protective film portion 120 may be adjusted.

In the protective film joining step S30, the protective film joining roller unit 120 presses the protective film unit 30 supplied in a state of being expanded from the protective film feed roller unit 110 to be bonded to the touch sensor unit 20 Is performed.

For example, in the protective film bonding step S30, the touch sensor unit 20 may be separated from the carrier substrate 10 while the protective film unit 30 is bonded to the touch sensor unit 20. [

The first bonding body including the protective film portion 30 and the touch sensor portion 20 is formed on the substrate 30 while the protective film portion 30 bonded to the touch sensor portion 20 is contracted in the first bonding body supplying step S40. To the film joining roller unit 170 is performed. For example, the first bonding member may be supplied from the protective film bonding roller unit 120 to the base film bonding roller unit 170 via the first intermediate roller 130, and in the first bonding member supplying step S40 , The ambient temperature atmosphere of the first junction body is kept at a relatively low temperature state as compared with the normal temperature state or the protective film supplying step S20 and the tension applied to the protective film portion 30 in the protective film feeding step S20 Is applied to the first junction body, the first junction body, more specifically, the protection film portion 30 constituting the first junction body, can be shrunk.

In the base film supply step (S50), heat is applied to the base film portion 40 to expand the tension of the base film portion 40 to expand the base film portion 40 from the base film feed roller portion 140 To the base film joining roller unit 170 is performed.

For example, the tension applied to the base film portion 40 may be 50 N or more and 1500 N or less, and more preferably 50 N or more and 700 N or less.

For example, the shrinkage percentage of the base film portion 40 may be 0.01% or more and 10% or less, and more preferably 0.01% or more and 1.5% or less.

As one example, the substrate film supply step (S50) can be configured to heat the substrate film joining roller unit (170) to transfer heat to the substrate film unit (40) to expand it. More specifically, in this example, a pair of rollers 172 and 174 constituting the base film bonding roller unit 170 are provided with rollers 172 for pressing the base film part 40 in contact with the base film part 40 ) In a manner that generates heat.

As another example, the base film supplying step (S50) may include a step of supplying heat to the base film portion 40 located between the base film supplying roller portion 140 for supplying the base film portion 40 and the base film bonding roller portion 170 To expand and inflate.

For example, in the substrate film supply step (S50), the rotating speed of the base film feed roller unit 140 for supplying the base film unit 40 is adjusted to move the base film feed roller unit 140, And adjust the tension of the base film portion 40 supplied to the base film portion 170.

2, since the base film portion 40 is heated and the tension applied to the base film portion 40 is increased in the base film feed step S50, Is expanded relative to the first joined body including the touch sensor unit 20 and the protective film unit 30 and the expanded base film unit 40 is subjected to the second joined body shrinking step S70 Thereby contracting to a normal state.

For example, the bonding agent layer 50 may be formed on the surface of the base film portion 40 supplied to the base film bonding roller portion 170, which is bonded to the touch sensor portion 20 constituting the first bonded body . The bonding agent supplying roller 150 on which the bonding agent is formed presses the base film portion 40 supplied from the base film film feeding roller portion 140 so as to bond the base film portion 40 to the base film portion 40. [ The layer 50 can be formed.

The base film part 40 is bonded to the touch sensor part 20 via the bonding agent layer 50 to perform the function of the touch sensor part 20 as a base.

For example, the base film portion 40 may include at least one selected from the group consisting of COP (Cyclo Olefin Polymer), TAC (Tri Acetyl Cellulose), and acrylic, but the base film portion 40 is not limited thereto Do not.

For example, the base film portion 40 may be a transparent optical film or a polarizing plate.

As the transparent optical film, a film excellent in transparency, mechanical strength and thermal stability can be used. Specific examples thereof include polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate and polybutylene terephthalate; Cellulose-based resins such as diacetylcellulose and triacetylcellulose; Polycarbonate resin; Acrylic resins such as polymethyl (meth) acrylate and polyethyl (meth) acrylate; Styrene resins such as polystyrene and acrylonitrile-styrene copolymer; Polyolefin resins such as polyethylene, polypropylene, cyclo- or norbornene-structured polyolefins, ethylene-propylene copolymers; Vinyl chloride resin; Amide resins such as nylon and aromatic polyamide; Imide resin; Polyether sulfone type resin; Sulfone based resin; Polyether ether ketone resin; A sulfided polyphenylene resin; Vinyl alcohol-based resin; Vinylidene chloride resins; Vinyl butyral resin; Allylate series resin; Polyoxymethylene type resin; Epoxy resin, and the like, and a film composed of the blend of the thermoplastic resin may also be used. Further, a film made of a thermosetting resin such as (meth) acrylic, urethane, acrylic urethane, epoxy, or silicone or a film made of an ultraviolet curable resin may be used. The thickness of such a transparent optical film can be suitably determined, but in general, it can be determined to be 1 to 500 占 퐉 in consideration of workability such as strength and handling property, thin layer property, and the like. Particularly preferably 1 to 300 mu m, and more preferably 5 to 200 mu m.

Such a transparent optical film may contain one or more suitable additives. Examples of the additive include an ultraviolet absorber, an antioxidant, a lubricant, a plasticizer, a release agent, a coloring inhibitor, a flame retardant, a nucleating agent, an antistatic agent, a pigment and a colorant. The transparent optical film may be a structure including various functional layers such as a hard coating layer, an antireflection layer, and a gas barrier layer on one side or both sides of the film. The functional layer is not limited to the above, and various functional layers .

Further, if necessary, the transparent optical film may be surface-treated. Examples of the surface treatment include a chemical treatment such as a plasma treatment, a corona treatment, a dry treatment such as a primer treatment, and an alkali treatment including a saponification treatment.

Further, the transparent optical film may be an isotropic film or a retardation film.

In the case of an isotropic film, the in-plane retardation (Ro, Ro = [(nx-ny) xd], nx and ny is the main refractive index in the plane of the film and d is the film thickness) is preferably 40 nm or less, Nz is the main refractive index in the film plane, nz is the refractive index in the film thickness direction, and d is the film thickness) is in the range of -90 nm to + Preferably from -80 nm to +60 nm, particularly preferably from -70 nm to +45 nm.

The retardation film is a film produced by the uniaxial stretching, biaxial stretching, polymer coating and liquid crystal coating method of a polymer film, and is generally used for improving the viewing angle of the display, improving the color feeling, improving the light leakage, do. Examples of the type of the retardation film include a wave plate of 1/2 or 1/4, a positive C plate, a negative C plate, a positive A plate, a negative A plate, and a biaxial wave plate.

As the polarizing plate, any known one used in the display panel can be used. Specifically, it is preferable that a protective layer is provided on at least one surface of a polarizer obtained by stretching a polyvinyl alcohol film to dye iodine or a dichroic dye, a film obtained by orienting a liquid crystal to have a polarizer performance, A film formed by coating an orientation resin such as alcohol and stretching and dyeing the film, but the present invention is not limited thereto.

In the substrate film joining step (S60), a process of bonding the base film portion 40, in which the base film joining roller portion 170 is expanded, to the touch sensor portion 20 included in the first assembly body is performed.

When the base film bonding step S60 is performed, the second bonded body, that is, the touch sensor film in which the protective film portion 30, the touch sensor portion 20, and the base film portion 40 are sequentially stacked is obtained, The portion 40 and the touch sensor portion 20 are bonded together by the bonding agent layer 50.

In the second junction body contraction step S70, a process of contracting the second junction body including the base film portion 40 bonded to the touch sensor portion 20 is performed.

For example, in the second junction body shrinking step (S70), the ambient temperature atmosphere of the second junction body is maintained at a relatively low temperature state compared to the room temperature state or the substrate film supplying step (S50), and in the substrate film supplying step The second bonding body, more specifically, the base film portion 40 constituting the second bonding body can be contracted to a steady state by applying a tension smaller than the tension applied to the base film portion 40 to the second bonding body.

Figure 3 shows experimental data on the relationship between temperature, tension and shrinkage.

Referring to FIG. 3, it can be seen that the base film portion 40 exhibits a significant level of shrinkage characteristics corresponding to the change in heat and tension applied to the base film portion 40, It is confirmed that the shrinkage characteristics of the base film portion 40 are strengthened.

As described above, according to the present invention, it is possible to prevent deterioration of the structural stability occurring at the interface between the components due to the difference in shrinkage ratio of the components constituting the touch sensor film and to improve the durability of the touch sensor film. There is provided an effect of providing a method of manufacturing a touch sensor film using a control.

10: carrier substrate
20: Touch sensor unit
30: protective film part
40: Base film part
50: bonding layer
110: protective film feed roller portion
120: protective film joining roller portion
140: base film feed roller portion
170: Base film bonding roller section
S10: Touch sensor supply step
S20: Step of supplying protective film
S30: Protective film bonding step
S40: First conjugate supply step
S50: substrate film supply step
S60: Base film bonding step
S70: second conjugate contraction step

Claims (13)

A touch sensor supplying step of supplying a touch sensor unit formed on a carrier substrate to a protective film bonding roller unit;
Applying a heat to the protective film portion and increasing the tension to expand the protective film to the protective film bonding roller portion;
A protective film joining step of joining the expanded protective film part to the touch sensor part by the protective film joining roller part;
Supplying a first bonding body including the protective film portion and the touch sensor portion to a base film bonding roller portion while contracting a protective film portion bonded to the touch sensor portion;
A base film feeding step of applying heat to the base film part and supplying the base film part to the base film bonding roller part while expanding the tension by increasing tension; And
And a base film bonding step of bonding the substrate film portion expanded with the base film bonding roller portion to a touch sensor portion included in the first bonded body. The method according to claim 1,
After the base film bonding step,
And a second bonding body shrinking step of contracting the second bonding body including the base film portion bonded to the touch sensor portion. The method according to claim 1,
Wherein the tension applied to the protective film portion and the base film portion is 50 N or more and 1500 N or less. 3. The method of claim 2,
Wherein the shrinkage ratio of the protective film portion and the base film portion is 0.01% or more and 10% or less. The method according to claim 1,
In the protective film supplying step,
And transferring heat to the protective film part by heating the protective film bonding roller part to expand the protective film part. The method according to claim 1,
In the protective film supplying step,
Wherein a temperature of the protective film and a temperature of the protective film are adjusted so that the temperature of the protective film reaches a predetermined temperature. The method according to claim 1,
In the protective film supplying step,
Wherein a tension of a protective film portion supplied from the protective film feed roller portion to the protective film joining roller portion is adjusted by controlling a rotation speed of a protective film feed roller portion for feeding the protective film portion, Method of manufacturing sensor film. The method according to claim 1,
In the base film supplying step,
And heating the base film bonding roller portion to transfer heat to the base film portion to expand the base film portion. The method according to claim 1,
In the base film supplying step,
Wherein the substrate film is heated by applying heat to expand the base film portion between the base film feed roller portion supplying the base film portion and the base film film portion between the base film bonding roller portion. The method according to claim 1,
In the base film supplying step,
And controlling a tension of the base film portion supplied from the base film feed roller portion to the base film bonding roller portion by adjusting a rotation speed of the base film feed roller portion for feeding the base film portion, Method of manufacturing sensor film. The method according to claim 1,
Wherein a bonding agent is formed on a surface of the base film portion to be supplied to the base film bonding roller portion and bonded to the touch sensor portion. The method according to claim 1,
In the protective film bonding step,
And separating the touch sensor unit from the carrier substrate while bonding the protective film unit to the touch sensor unit. The method according to claim 1,
Wherein the substrate film part comprises at least one selected from the group consisting of COP (Cyclo Olefin Polymer), TAC (Tri Acetyl Cellulose) and acrylic.

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