TWI704482B - Display apparatus - Google Patents
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- TWI704482B TWI704482B TW108144808A TW108144808A TWI704482B TW I704482 B TWI704482 B TW I704482B TW 108144808 A TW108144808 A TW 108144808A TW 108144808 A TW108144808 A TW 108144808A TW I704482 B TWI704482 B TW I704482B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
Description
本發明是有關於一種電子裝置,且特別是有關於一種顯示裝置。The present invention relates to an electronic device, and more particularly to a display device.
根據觸控用之感測墊與顯示面板的相對位置,觸控顯示裝置的架構可分為晶胞外(Out-cell)、晶胞上(On-cell) 和晶胞內(In-cell)。一般而言,採晶胞外(Out-cell)架構的觸控顯示裝置,其顯示面板之上基板的外表面上會鍍上一背側銦錫氧化物(Backside ITO),以遮蔽顯示面板的雜訊干擾。然而,採晶胞內(in-cell)架構的觸控顯示裝置,其觸控用的感測墊也是顯示用的共用電極,為了要偵測電容的變化,顯示面板之上基板的外表面上不能鍍一層背側銦錫氧化物,如何遮蔽顯示面板的雜訊是個挑戰。According to the relative position of the sensor pad for touch and the display panel, the architecture of the touch display device can be divided into Out-cell, On-cell and In-cell . Generally speaking, in a touch display device with an out-cell architecture, the outer surface of the substrate on the display panel is plated with a backside ITO to shield the display panel. Noise interference. However, in a touch display device with an in-cell structure, the sensing pad for touch is also a common electrode for display. In order to detect the change of capacitance, the outer surface of the substrate on the display panel It is not possible to plate a layer of indium tin oxide on the back side, and how to shield the noise of the display panel is a challenge.
本發明提供一種顯示裝置,性能佳。The invention provides a display device with good performance.
本發明的一種顯示裝置,包括第一基板、多條掃描線、多條資料線、多個畫素結構、第二基板、顯示介質、驅動元件及電路板。多條掃描線及多條資料線設置於第一基板上。多個畫素結構設置於第一基板上,且電性連接至多條掃描線及多條資料線。第二基板設置於第一基板的對向。顯示介質設置於第一基板與第二基板之間。驅動元件電性連接至多條資料線。驅動元件包括晶粒、第二接墊及導電屏蔽層。晶粒具有積體電路及與積體電路電性連接的第一接墊,其中第一接墊具有第一接地電位。第二接墊與第一接墊及積體電路隔開。導電屏蔽層電性連接至第二接墊且遮蔽晶粒的積體電路。電路板電性連接至驅動元件,其中驅動元件的第二接墊及導電屏蔽層具有電路板的第二接地電位。A display device of the present invention includes a first substrate, a plurality of scan lines, a plurality of data lines, a plurality of pixel structures, a second substrate, a display medium, a driving element and a circuit board. A plurality of scan lines and a plurality of data lines are arranged on the first substrate. The pixel structures are arranged on the first substrate and are electrically connected to the scan lines and the data lines. The second substrate is disposed opposite to the first substrate. The display medium is disposed between the first substrate and the second substrate. The driving element is electrically connected to a plurality of data lines. The driving element includes a die, a second pad and a conductive shielding layer. The die has an integrated circuit and a first pad electrically connected to the integrated circuit, wherein the first pad has a first ground potential. The second pad is separated from the first pad and the integrated circuit. The conductive shielding layer is electrically connected to the second pad and shields the integrated circuit of the die. The circuit board is electrically connected to the driving element, wherein the second pad and the conductive shielding layer of the driving element have the second ground potential of the circuit board.
在本發明的一實施例中,上述的顯示裝置更包括閘極驅動電路,電性連接至掃描線,其中晶粒之第一接墊電性連接至閘極驅動電路。In an embodiment of the present invention, the above-mentioned display device further includes a gate driving circuit electrically connected to the scan line, wherein the first pad of the die is electrically connected to the gate driving circuit.
在本發明的一實施例中,上述的晶粒還具有直通矽穿孔,且第二接墊是透過設置於直通矽穿孔中的導電物電性連接至導電屏蔽層。In an embodiment of the present invention, the above-mentioned die further has through silicon vias, and the second pad is electrically connected to the conductive shielding layer through a conductive object disposed in the through silicon vias.
在本發明的一實施例中,上述的驅動元件還包括封裝體,包覆晶粒,且具有位於晶粒外的封裝穿孔,其中第二接墊是透過設置於封裝穿孔中的導電物電性連接至導電屏蔽層。In an embodiment of the present invention, the above-mentioned driving element further includes a package body that covers the die, and has a package through hole located outside the die, wherein the second pad is electrically conductive through a conductive object disposed in the package through hole. Connect to the conductive shield.
在本發明的一實施例中,上述的導電屏蔽層包括設置於晶粒上的金屬子層以及設置於金屬子層上的金屬氧化物子層。In an embodiment of the present invention, the aforementioned conductive shielding layer includes a metal sub-layer disposed on the crystal grain and a metal oxide sub-layer disposed on the metal sub-layer.
在本發明的一實施例中,上述的導電屏蔽層包括設置於晶粒上的金屬子層以及設置於金屬子層上的絕緣子層。In an embodiment of the present invention, the aforementioned conductive shielding layer includes a metal sub-layer disposed on the die and an insulating sub-layer disposed on the metal sub-layer.
現將詳細地參考本發明的示範性實施例,示範性實施例的實例說明於附圖中。只要有可能,相同元件符號在圖式和描述中用來表示相同或相似部分。Reference will now be made in detail to the exemplary embodiments of the present invention, and examples of the exemplary embodiments are illustrated in the accompanying drawings. Whenever possible, the same component symbols are used in the drawings and descriptions to indicate the same or similar parts.
應當理解,當諸如層、膜、區域或基板的元件被稱為在另一元件“上”或“連接到”另一元件時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反,當元件被稱為“直接在另一元件上”或“直接連接到”另一元件時,不存在中間元件。如本文所使用的,“連接”可以指物理及/或電性連接。再者,“電性連接”或“耦合”可以是二元件間存在其它元件。It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements. As used herein, "connected" can refer to physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may mean that there are other elements between two elements.
本文使用的“約”、“近似”、或“實質上”包括所述值和在本領域普通技術人員確定的特定值的可接受的偏差範圍內的平均值,考慮到所討論的測量和與測量相關的誤差的特定數量(即,測量系統的限制)。例如,“約”可以表示在所述值的一個或多個標準偏差內,或±30%、±20%、±10%、±5%內。再者,本文使用的“約”、“近似”或“實質上”可依光學性質、蝕刻性質或其它性質,來選擇較可接受的偏差範圍或標準偏差,而可不用一個標準偏差適用全部性質。As used herein, "about", "approximately", or "substantially" includes the stated value and the average value within the acceptable deviation range of the specific value determined by a person of ordinary skill in the art, taking into account the measurement in question and the The specific amount of measurement-related error (ie, the limitation of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the "about", "approximately" or "substantially" used herein can select a more acceptable range of deviation or standard deviation based on optical properties, etching properties, or other properties, instead of using one standard deviation for all properties .
除非另有定義,本文使用的所有術語(包括技術和科學術語)具有與本發明所屬領域的普通技術人員通常理解的相同的含義。將進一步理解的是,諸如在通常使用的字典中定義的那些術語應當被解釋為具有與它們在相關技術和本發明的上下文中的含義一致的含義,並且將不被解釋為理想化的或過度正式的意義,除非本文中明確地這樣定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of related technologies and the present invention, and will not be interpreted as idealized or excessive The formal meaning, unless explicitly defined as such in this article.
圖1為本發明一實施例之顯示裝置10的上視示意圖。FIG. 1 is a schematic top view of a
圖2為本發明一實施例之顯示裝置10的剖面示意圖。2 is a schematic cross-sectional view of a
圖2對應圖1的剖線Ι-Ι’。圖1省略圖2之顯示介質300及框膠400的繪示。Figure 2 corresponds to the section line Ι-Ι' of Figure 1. FIG. 1 omits the illustration of the
請參照圖1及圖2,顯示裝置10包括第一基板110、設置於第一基板110之對向的第二基板200以及設置於第一基板110與第二基板200之間的顯示介質300。在本實施例中,顯示裝置10更包括框膠(sealant)400,而顯示介質300設置於第一基板110、第二基板200與框膠400所圍出的空間內。1 and 2, the
舉例而言,在本實施例中,第一基板110及第二基板200的材質可選自玻璃、石英、有機聚合物、或是不透光/反射材料(例如:晶圓、陶瓷等)、或是其它可適用的材料。For example, in this embodiment, the materials of the
在本實施例中,顯示介質300可以是液晶。然而,本發明不限於此,根據其它實施例,顯示介質300也可以是有機發光二極體層(OLED)、微型發光二極體(micro-LED)、次毫米發光二極體(mini-LED)、量子點發光二極體(quantum dot)、或其它種類的顯示介質。In this embodiment, the
請參照圖1,顯示裝置10還包括多條掃描線SL及多條資料線DL,設置於第一基板110上。掃描線SL與資料線DL彼此交錯設置。換言之,資料線DL的延伸方向與掃描線SL的延伸方向不平行,較佳的是,資料線DL的延伸方向與掃描線SL的延伸方向垂直,但本發明不以此為限。另外,掃描線SL與資料線DL屬於不同的膜層。基於導電性的考量,掃描線SL與資料線DL一般是使用金屬材料。但本發明不限於此,根據其他實施例,掃描線SL與資料線DL也可以使用其他導電材料。例如:合金、金屬材料的氮化物、金屬材料的氧化物、金屬材料的氮氧化物、或是金屬材料與其它導電材料的堆疊層。Please refer to FIG. 1, the
顯示裝置10還包括多個畫素結構PX,設置於第一基板110上。多個畫素結構PX電性連接至多條掃描線SL及多條資料線DL。舉例而言,在本實施例中,每一畫素結構PX可包括一薄膜電晶體(未繪示)及一畫素電極(未繪示),其中薄膜電晶體的源極電性連接至對應的一資料線DL,薄膜電晶體的閘極電性連接至對應的一掃描線SL,而薄膜電晶體的汲極電性連接至畫素電極。The
顯示裝置10還包括閘極驅動電路120,電性連接至多條掃描線SL。舉例而言,在本實施例中,閘極驅動電路120可設置於第一基板110上,且閘極驅動電路120的製程可與畫素結構PX的製程整合。也就是說,在本實施例中,閘極驅動電路120可以選擇性地是整合型閘極驅動電路(gate driver-on-array;GOA)。然而,本發明不限於此,根據其它實施例,閘極驅動電路120也可以是另外製作的晶片。The
在本實施例中,顯示裝置10還包括一共用電極層130。共用電極層130可選擇性地設置於第一基板110上,但本發明不以此為限。在一顯示時間區間,所述共用電極層130與多個畫素結構PX共同驅動顯示介質300(繪於圖2),進而使顯示裝置10能顯示畫面。在本實施例中,共用電極層130可包括多個電極132;於觸控時間區間,共用電極層130的多個電極132可做為觸控用的感測墊,而使顯示裝置10具有觸控功能。也就是說,本實施例的顯示裝置10可以是採晶胞內(in-cell)架構的觸控顯示裝置。然而,本發明不限於此,根據其它實施例,顯示裝置10也可採晶胞外(Out-cell)或晶胞上(On-cell)的架構。In this embodiment, the
請參照圖1及圖2,顯示裝置10還包括驅動元件500,驅動元件500包括源極驅動電路,驅動元件500的源極驅動電路電性連接至多條資料線DL。1 and 2, the
在本實施例中,顯示裝置10還包括設置於第一基板110之周邊區的多個接墊141、142、143,其中多個接墊141與多條資料線DL電性連接,多個接墊142與閘極驅動電路120電性連接,多個接墊143用以與電路板600電性連接。In this embodiment, the
舉例而言,在本實施例中,驅動元件500可利用晶粒-玻璃接合製程(Chip On Glass;COG)與第一基板110上的多個接墊141、142、143接合,而電路板600例如是撓性印刷電路板(Flexible Printed Circuit,FPC)。然而,本發明不限於此,在另一實施例中,驅動元件500也可藉由晶粒-軟片接合製程(Chip On Film;COF)與位於第一基板110上的多個接墊141、142電性連接。For example, in this embodiment, the driving
顯示裝置10還包括電路板600,電性連接至驅動元件500。舉例而言,在本實施例中,電路板600可以是可撓性印刷電路(Flexible Printed Circuit;FPC),而電路板600可透過設置於第一基板110上的接墊143電性連接至驅動元件500的第二接墊520。The
驅動元件500包括晶粒(die)510。晶粒510包括積體電路513及與積體電路513電性連接的第一接墊515。在本實施例中,晶粒510之第一接墊515可透過設置於第一基板110上的接墊142電性連接至閘極驅動電路120,但本發明不以此為限。The driving
舉例而言,在本實施例中,晶粒510包括半導體基底511,例如但不限於:是經摻雜或未經摻雜的矽。在半導體基底511中及/或半導體基底511上可形成例如電晶體、二極體、電容器、電阻器等構件511a,且所述構件511a可藉由晶粒510的內連結構512對進行內連,藉此形成積體電路513,內連結構512可例如是由半導體基底511上的一個或多個介電層514中的導電圖案所形成。For example, in this embodiment, the
驅動元件500還包括第二接墊520及導電屏蔽層530。第二接墊520與第一接墊515及積體電路513隔開。第二接墊520與第一接墊515及積體電路513於結構上分離。也就是說,第二接墊520是電性獨立於第一接墊515及積體電路513。導電屏蔽層530電性連接至第二接墊520且遮蔽晶粒510的積體電路513。The driving
舉例而言,在本實施例中,晶粒510的半導體基底511還可具有直通矽穿孔(through silicon via;TSV)511b,且第二接墊520可透過設置於直通矽穿孔511b中的一導電物540電性連接至導電屏蔽層530,但本發明不以此為限。For example, in this embodiment, the
值得注意的是,與積體電路513電性連接的第一接墊515是具有晶粒510的第一接地電位,而第二接墊520及導電屏蔽層530是具有電路板600的第二接地電位。也就是說,導電屏蔽層530與晶粒510的積體電路513是不共地的。藉此,導電屏蔽層530能更有效地遮蔽積體電路513所產生的雜訊干擾。It is worth noting that the
舉例而言,在本實施例中,導電屏蔽層530可包括設置於晶粒510上的金屬子層531以及設置於金屬子層531上的金屬氧化物子層532;金屬氧化物子層532能保護金屬子層531,不易被環境因子(例如:水、氧等)所劣化;金屬子層531的材料可以是鋁、銅或其它金屬;金屬氧化物子層532的材料可以是銦錫氧化物、銦鋅氧化物、鋁錫氧化物、鋁鋅氧化物、銦鍺鋅氧化物或其它合適的金屬氧化物;但本發明不以此為限。For example, in this embodiment, the
在此必須說明的是,下述實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重述。It must be noted here that the following embodiments use the element numbers and part of the content of the foregoing embodiments, wherein the same numbers are used to represent the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, refer to the foregoing embodiment, and the following embodiments will not be repeated.
圖3為本發明另一實施例之顯示裝置10A的剖面示意圖。圖3的顯示裝置10A與前述的顯示裝置10類似,兩者相同或相似處請參照前述說明,以下說明兩者的差異處。3 is a schematic cross-sectional view of a
在圖3的實施例中,驅動元件500A包括包覆晶粒510的封裝體550,且封裝體550具有位於晶粒510外的封裝穿孔(through package via;TPV)551,其中第二接墊520是透過設置於封裝穿孔551中的導電物540電性連接至導電屏蔽層530。In the embodiment of FIG. 3, the driving
此外,在圖3的實施例中,導電屏蔽層530可包括設置於晶粒510上的金屬子層531以及設置於金屬子層531上的絕緣子層533,絕緣子層533能保護金屬子層531不易被環境因子(例如:水、氧等)所劣化。In addition, in the embodiment of FIG. 3, the
再者,於圖3的實施例中,驅動元件500A可包括多個晶粒510;也就是說,與晶粒510之積體電路513不共地的導電屏蔽層530也可應用在採多晶封裝的驅動元件500A中。Furthermore, in the embodiment of FIG. 3, the driving
10、10A:顯示裝置
110:第一基板
120:閘極驅動電路
130:共用電極層
132:電極
141、142、143:接墊
200:第二基板
300:顯示介質
400:框膠
500、500A、500B:驅動元件
510:晶粒
511:半導體基底
511a:構件
511b:直通矽穿孔
512:內連結構
513:積體電路
514:介電層
515:第一接墊
520:第二接墊
530:導電屏蔽層
531:金屬子層
532:金屬氧化物子層
533:絕緣子層
540:導電物
550:封裝體
551:封裝穿孔
600:電路板
DL:資料線
SL:掃描線
PX:畫素結構
Ι-Ι’:剖線10.10A: Display device
110: first substrate
120: Gate drive circuit
130: common electrode layer
132:
圖1為本發明一實施例之顯示裝置10的上視示意圖。
圖2為本發明一實施例之顯示裝置10的剖面示意圖。
圖3為本發明另一實施例之顯示裝置10A的剖面示意圖。
FIG. 1 is a schematic top view of a
10:顯示裝置 10: Display device
110:第一基板 110: first substrate
142、143:接墊 142, 143: pads
200:第二基板 200: second substrate
300:顯示介質 300: display medium
400:框膠 400: frame glue
500:驅動元件 500: drive element
510:晶粒 510: Die
511:半導體基底 511: Semiconductor substrate
511a:構件 511a: component
511b:直通矽穿孔 511b: Through silicon via
512:內連結構 512: interconnect structure
513:積體電路 513: Integrated Circuit
514:介電層 514: Dielectric layer
515:第一接墊 515: first pad
520:第二接墊 520: second pad
530:導電屏蔽層 530: conductive shielding layer
531:金屬子層 531: Metal Sublayer
532:金屬氧化物子層 532: metal oxide sublayer
540:導電物 540: Conductive object
600:電路板 600: circuit board
I-I’:剖線 I-I’: Sectional line
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