CN111427479A

CN111427479A - Display device

Info

Publication number: CN111427479A
Application number: CN202010290076.8A
Authority: CN
Inventors: 陈志成; 刘贵文
Original assignee: AU Optronics Corp
Current assignee: AU Optronics Corp
Priority date: 2019-12-06
Filing date: 2020-04-14
Publication date: 2020-07-17
Anticipated expiration: 2040-04-14
Also published as: TWI704482B; CN111427479B; TW202122977A

Abstract

A display device comprises a plurality of scanning lines, a plurality of data lines, a plurality of pixel structures, a driving element and a circuit board. The pixel structures are electrically connected to the scanning lines and the data lines. The driving element is electrically connected to the plurality of data lines. The driving element comprises a crystal grain, a second connecting pad and a conductive shielding layer. The die has an integrated circuit and a first pad electrically connected to the integrated circuit, wherein the first pad has a first ground potential. The second pad is spaced apart from the first pad and the integrated circuit. The conductive shielding layer is electrically connected to the second pad and shields the die. The circuit board is electrically connected to the driving element, wherein the second pad of the driving element and the conductive shielding layer have a second ground potential of the circuit board.

Description

Display device

Technical Field

The present invention relates to an electronic device, and more particularly, to a display device.

Background

The touch display device can be divided into an Out-cell (Out-cell), an On-cell (On-cell) and an In-cell (In-cell) structure according to the relative position between the touch sensing pad and the display panel. Generally, in a touch display device adopting an Out-cell (Out-cell) structure, a backside indium tin oxide (backstieito) is plated on an outer surface of an upper substrate of a display panel to shield the display panel from noise interference. However, in a touch display device adopting an in-cell (in-cell) architecture, the touch sensing pad is also a common electrode for display, and in order to detect the capacitance change, it is a challenge how to shield the noise of the display panel because the outer surface of the substrate on the display panel cannot be plated with a layer of backside indium tin oxide.

Disclosure of Invention

The invention provides a display device with good performance.

The invention provides a display device which comprises a first substrate, a plurality of scanning lines, a plurality of data lines, a plurality of pixel structures, a second substrate, a display medium, a driving element and a circuit board. The plurality of scanning lines and the plurality of data lines are arranged on the first substrate. The pixel structures are arranged on the first substrate and are electrically connected to the scanning lines and the data lines. The second substrate is arranged opposite to the first substrate. The display medium is arranged between the first substrate and the second substrate. The driving element is electrically connected to the plurality of data lines. The driving element comprises a crystal grain, a second connecting pad and a conductive shielding layer. The die has an integrated circuit and a first pad electrically connected to the integrated circuit, wherein the first pad has a first ground potential. The second pad is spaced apart from the first pad and the integrated circuit. The conductive shielding layer is electrically connected to the second pad and shields the integrated circuit of the die. The circuit board is electrically connected to the driving element, wherein the second pad of the driving element and the conductive shielding layer have a second ground potential of the circuit board.

In an embodiment of the invention, the display device further includes a gate driving circuit electrically connected to the scan line, wherein the first pad of the die is electrically connected to the gate driving circuit.

In an embodiment of the invention, the die further has a through-silicon via, and the second pad is electrically connected to the conductive shielding layer through a conductive object disposed in the through-silicon via.

In an embodiment of the invention, the driving device further includes a package body covering the die and having a package through hole outside the die, wherein the second pad is electrically connected to the conductive shielding layer through a conductive material disposed in the package through hole.

In an embodiment of the invention, the conductive shielding layer includes a metal sub-layer disposed on the die and a metal oxide sub-layer disposed on the metal sub-layer.

In an embodiment of the invention, the conductive shielding layer includes a metal sub-layer disposed on the die and an insulating sub-layer disposed on the metal sub-layer.

The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.

Drawings

Fig. 1 is a schematic top view of a display device 10 according to an embodiment of the invention.

Fig. 2 is a schematic cross-sectional view of a display device 10 according to an embodiment of the invention.

Fig. 3 is a schematic cross-sectional view of a display device 10A according to another embodiment of the invention.

Reference numerals

10. 10A: display device

110: first substrate

120: gate drive circuit

130: common electrode layer

132: electrode for electrochemical cell

141. 142, 143: connecting pad

200: second substrate

300: display medium

400: frame glue

500. 500A, 500B: driving element

510: die

511: semiconductor substrate

511 a: component

511 b: through silicon via

512: interconnection structure

513: integrated circuit with a plurality of transistors

514: dielectric layer

515: first pad

520: second pad

530: conductive shielding layer

531: metallic sublayer

532: sub-layer of metal oxide

533: insulating sublayer

540: conductive object

550: package body

551: through-hole for packaging

600: circuit board

D L data line

S L scanning line

PX: pixel structure

I-I': cutting line

Detailed Description

The invention will be described in detail with reference to the following drawings, which are provided for illustration purposes and the like:

reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.

It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connections. Further, "electrically connected" or "coupled" may mean that there are additional elements between the elements.

As used herein, "about", "approximately", or "substantially" includes the stated value and the average value within an acceptable range of deviation of the specified value as determined by one of ordinary skill in the art, taking into account the measurement in question and the specified amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the stated value, or within ± 30%, ± 20%, ± 10%, ± 5%. Further, as used herein, "about", "approximately" or "substantially" may be selected based on optical properties, etch properties, or other properties, with a more acceptable range of deviation or standard deviation, and not all properties may be applied with one standard deviation.

Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Fig. 2 corresponds to the section line i-i' of fig. 1. Fig. 1 omits illustration of the display medium 300 and the sealant 400 of fig. 2.

Referring to fig. 1 and 2, the display device 10 includes a first substrate 110, a second substrate 200 disposed opposite to the first substrate 110, and a display medium 300 disposed between the first substrate 110 and the second substrate 200. In this embodiment, the display device 10 further includes a sealant (sealant)400, and the display medium 300 is disposed in a space enclosed by the first substrate 110, the second substrate 200 and the sealant 400.

For example, in the present embodiment, the material of the first substrate 110 and the second substrate 200 may be selected from glass, quartz, organic polymer, or opaque/reflective material (e.g., wafer, ceramic, etc.), or other suitable materials.

However, the present invention is not limited thereto, and the display medium 300 may also be an organic light emitting diode layer (O L ED), a micro-light emitting diode (micro-L ED), a sub-millimeter light emitting diode (mini-L ED), a quantum dot light emitting diode (quantum dot), or other kinds of display media according to other embodiments.

Referring to fig. 1, the display device 10 further includes a plurality of scan lines S L and a plurality of data lines D L disposed on the first substrate 110, wherein the scan lines S L and the data lines D L are disposed alternately, in other words, the data lines D L2 and S L3 are not parallel to each other, preferably, the data lines D L and S L are perpendicular to each other, but the invention is not limited thereto.

The display device 10 further includes a plurality of pixel structures PX disposed on the first substrate 110, the plurality of pixel structures PX being electrically connected to the plurality of scan lines S L and the plurality of data lines D L. for example, in the present embodiment, each pixel structure PX may include a thin film transistor (not shown) and a pixel electrode (not shown), wherein a source of the thin film transistor is electrically connected to a corresponding data line D L, a gate of the thin film transistor is electrically connected to a corresponding scan line S L, and a drain of the thin film transistor is electrically connected to the pixel electrode.

The display device 10 further includes a gate driving circuit 120 electrically connected to the plurality of scan lines S L, for example, in the present embodiment, the gate driving circuit 120 may be disposed on the first substrate 110, and the process of the gate driving circuit 120 may be integrated with the process of the pixel structure PX.

In this embodiment, the display device 10 further includes a common electrode layer 130. The common electrode layer 130 may be selectively disposed on the first substrate 110, but the invention is not limited thereto. In a display time interval, the common electrode layer 130 and the plurality of pixel structures PX jointly drive the display medium 300 (shown in fig. 2), so that the display device 10 can display a picture. In the present embodiment, the common electrode layer 130 may include a plurality of electrodes 132; in the touch time interval, the electrodes 132 of the common electrode layer 130 can be used as sensing pads for touch control, so that the display device 10 has a touch function. That is, the display device 10 of the present embodiment may be a touch display device adopting an in-cell (in-cell) architecture. However, the invention is not limited thereto, and according to other embodiments, the display device 10 may also adopt an off-cell (Out-cell) or an On-cell (On-cell) architecture.

Referring to fig. 1 and fig. 2, the display device 10 further includes a driving element 500, wherein the driving element 500 includes a source driving circuit, and the source driving circuit of the driving element 500 is electrically connected to the data lines D L.

In the embodiment, the display device 10 further includes a plurality of

pads

141, 142, and 143 disposed in the peripheral region of the first substrate 110, wherein the plurality of pads 141 are electrically connected to the plurality of data lines D L, the plurality of pads 142 are electrically connected to the gate driving circuit 120, and the plurality of pads 143 are electrically connected to the circuit board 600.

For example, in the present embodiment, the driving device 500 may be bonded to the plurality of

pads

141, 142, and 143 on the first substrate 110 by a Chip On Glass (COG) bonding process, and the Circuit board 600 is, for example, a Flexible Printed Circuit (FPC). However, the invention is not limited thereto, and in another embodiment, the driving device 500 may be electrically connected to the plurality of

pads

141, 142 On the first substrate 110 by a Chip On Film (COF) process.

The display device 10 further includes a circuit board 600 electrically connected to the driving element 500. For example, in the embodiment, the Circuit board 600 may be a Flexible Printed Circuit (FPC), and the Circuit board 600 may be electrically connected to the second pads 520 of the driving device 500 through the pads 143 disposed on the first substrate 110.

The driving element 500 includes a die 510. The die 510 includes an integrated circuit 513 and a first pad 515 electrically connected to the integrated circuit 513. In the embodiment, the first pads 515 of the die 510 may be electrically connected to the gate driving circuit 120 through the pads 142 disposed on the first substrate 110, but the invention is not limited thereto.

For example, in the present embodiment, the die 510 includes a semiconductor substrate 511, such as but not limited to: is doped or undoped silicon. Components 511a, such as transistors, diodes, capacitors, resistors, etc., may be formed in and/or on the semiconductor substrate 511, and the components 511a may be interconnected by interconnect structures 512 of the die 510, thereby forming an integrated circuit 513, the interconnect structures 512 may be formed, for example, by conductive patterns in one or more dielectric layers 514 on the semiconductor substrate 511.

The driving device 500 further includes a second pad 520 and a conductive shielding layer 530. The second pad 520 is spaced apart from the first pad 515 and the integrated circuit 513. The second pad 520 is structurally separated from the first pad 515 and the integrated circuit 513. That is, the second pads 520 are electrically independent from the first pads 515 and the integrated circuit 513. The conductive shielding layer 530 is electrically connected to the second pads 520 and shields the integrated circuit 513 of the die 510.

For example, in the embodiment, the semiconductor substrate 511 of the die 510 may further have a Through Silicon Via (TSV) 511b, and the second pad 520 may be electrically connected to the conductive shielding layer 530 through a conductive object 540 disposed in the TSV 511b, but the invention is not limited thereto.

It is noted that the first pad 515 electrically connected to the integrated circuit 513 has a first ground potential of the die 510, and the second pad 520 and the conductive shielding layer 530 have a second ground potential of the circuit board 600. That is, conductive shield 530 is not grounded to integrated circuit 513 of die 510. Thereby, the conductive shielding layer 530 can more effectively shield the noise interference generated by the integrated circuit 513.

For example, in the present embodiment, the conductive shielding layer 530 may include a metal sublayer 531 disposed on the die 510 and a metal oxide sublayer 532 disposed on the metal sublayer 531; the metal oxide sublayer 532 can protect the metal sublayer 531 and is not easily degraded by environmental factors (e.g., water, oxygen, etc.); the material of the metal sub-layer 531 may be aluminum, copper, or other metal; the material of the metal oxide sub-layer 532 may be indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium germanium zinc oxide, or other suitable metal oxide; however, the present invention is not limited thereto.

It should be noted that the following embodiments follow the element references and part of the contents of the foregoing embodiments, wherein the same reference numerals are used to indicate the same or similar elements, and the description of the same technical contents is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, which will not be repeated below.

Fig. 3 is a schematic cross-sectional view of a display device 10A according to another embodiment of the invention. The display device 10A of fig. 3 is similar to the display device 10, and the same or similar points are referred to the above description, and the differences between the two will be described below.

In the embodiment of fig. 3, the driving device 500A includes a package 550 encapsulating the die 510, and the package 550 has a Through Package Via (TPV) 551 located outside the die 510, wherein the second pads 520 are electrically connected to the conductive shielding layer 530 through the conductive objects 540 disposed in the package 551.

Furthermore, in the embodiment of fig. 3, the conductive shielding layer 530 may include a metal sublayer 531 disposed on the die 510 and an insulating sublayer 533 disposed on the metal sublayer 531, wherein the insulating sublayer 533 can protect the metal sublayer 531 from being degraded by environmental factors (e.g., water, oxygen, etc.).

Furthermore, in the embodiment of fig. 3, the driving element 500A may include a plurality of dies 510; that is, the conductive shielding layer 530 that is not common to the integrated circuit 513 of the die 510 may also be applied in the driving element 500A using poly encapsulation.

The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A display device, comprising:

a first substrate;

a plurality of scanning lines and a plurality of data lines arranged on the first substrate;

a plurality of pixel structures arranged on the first substrate and electrically connected to the plurality of scanning lines and the plurality of data lines;

a second substrate disposed opposite to the first substrate;

a display medium disposed between the first substrate and the second substrate;

a driving element electrically connected to the plurality of data lines, wherein the driving element comprises:

a die having an integrated circuit and a first pad electrically connected to the integrated circuit, wherein the first pad has a first ground potential;

a second pad spaced apart from the first pad and the integrated circuit; and

a conductive shielding layer electrically connected to the second pad and shielding the integrated circuit of the die; and

a circuit board electrically connected to the driving element, wherein the second pad of the driving element and the conductive shielding layer have a second ground potential of the circuit board.

2. The display device of claim 1, further comprising:

a gate driving circuit electrically connected to the plurality of scan lines, wherein the first pad of the die is electrically connected to the gate driving circuit.

3. The display device of claim 1, wherein the die further has a through-silicon via, and the second pad is electrically connected to the conductive shielding layer through a conductive object disposed in the through-silicon via.

4. The display device of claim 1, wherein the driving element further comprises:

and a packaging body which coats the crystal grain and is provided with a packaging through hole positioned outside the crystal grain, wherein the second connecting pad is electrically connected to the conductive shielding layer through a conductive object arranged in the packaging through hole.

5. The display device of claim 1, wherein the conductive shielding layer comprises:

a metal sublayer disposed on the die; and

a metal oxide sublayer disposed on the metal sublayer.

6. The display device of claim 1, wherein the conductive shielding layer comprises:

a metal sublayer disposed on the die; and

an insulating sub-layer is arranged on the metal sub-layer.