TWI704180B - Cured composition, cured product and composite material - Google Patents

Cured composition, cured product and composite material Download PDF

Info

Publication number
TWI704180B
TWI704180B TW108114644A TW108114644A TWI704180B TW I704180 B TWI704180 B TW I704180B TW 108114644 A TW108114644 A TW 108114644A TW 108114644 A TW108114644 A TW 108114644A TW I704180 B TWI704180 B TW I704180B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
cured
bisphenol
modified
isocyanate
Prior art date
Application number
TW108114644A
Other languages
Chinese (zh)
Other versions
TW202039685A (en
Inventor
羅智暉
蔡清山
Original Assignee
明安國際企業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 明安國際企業股份有限公司 filed Critical 明安國際企業股份有限公司
Priority to TW108114644A priority Critical patent/TWI704180B/en
Application granted granted Critical
Publication of TWI704180B publication Critical patent/TWI704180B/en
Publication of TW202039685A publication Critical patent/TW202039685A/en

Links

Landscapes

  • Epoxy Resins (AREA)

Abstract

一種固化組成物包含環氧樹脂組分及硬化劑,其中,該環氧樹脂組分包括熱塑性聚合物、雙酚環氧樹脂、聚胺酯改質環氧樹脂及異氰酸酯改質環氧樹脂,且以該環氧樹脂組分的總量為100wt%計,該雙酚環氧樹脂的用量範圍為30wt%至50wt%、該聚胺酯改質環氧樹脂的用量範圍為10wt%至20wt%,且該異氰酸酯改質環氧樹脂的用量範圍為30wt%以上且小於60wt%。本發明亦提供一種具有優異強度及伸長率的固化物及複合材。A curing composition includes an epoxy resin component and a hardener, wherein the epoxy resin component includes a thermoplastic polymer, a bisphenol epoxy resin, a polyurethane-modified epoxy resin, and an isocyanate-modified epoxy resin. The total amount of the epoxy resin component is 100wt%, the amount of the bisphenol epoxy resin ranges from 30wt% to 50wt%, the amount of the polyurethane modified epoxy resin ranges from 10wt% to 20wt%, and the isocyanate modified The amount of high-quality epoxy resin ranges from 30wt% to less than 60wt%. The present invention also provides a cured product and composite material with excellent strength and elongation.

Description

固化組成物、固化物及複合材Cured composition, cured product and composite material

本發明是有關於一種固化材料,特別是指一種包含環氧樹脂組分的固化組成物,其中,該環氧樹脂組分包括熱塑性聚合物、雙酚環氧樹脂、聚胺酯改質環氧樹脂及異氰酸酯改質環氧樹脂。The present invention relates to a curing material, in particular to a curing composition containing an epoxy resin component, wherein the epoxy resin component includes a thermoplastic polymer, a bisphenol epoxy resin, a polyurethane modified epoxy resin and Isocyanate modifies epoxy resin.

環氧樹脂因具有優異的耐熱性、耐藥品性及成形性等優點,而常被廣泛地應用於電子材料或光學材料等領域中。在環氧樹酯中,由於雙酚環氧樹脂具有良好的黏結特性,因而常被使用,且通常會與熱塑性聚合物及硬化劑搭配,而配置成固化組成物來進行後續的應用。Epoxy resin is often widely used in electronic materials or optical materials because of its excellent heat resistance, chemical resistance and formability. Among epoxy resins, bisphenol epoxy resins are often used due to their good bonding properties, and are usually combined with thermoplastic polymers and hardeners to be configured into cured compositions for subsequent applications.

雖該雙酚環氧樹脂具有良好的黏結特性,但由該雙酚環氧樹脂所形成的固化物在強度(例如拉伸強度或彎曲強度)及伸長率上仍不符合所需,甚至在提升強度時,往往會造成伸長率的損失。此外,當應用至高功能性(例如彈性、強度或力量回饋)產品,例如運動用品,在長期使用下存在有變形或斷裂的問題。Although the bisphenol epoxy resin has good bonding characteristics, the cured product formed by the bisphenol epoxy resin still does not meet the requirements in terms of strength (such as tensile strength or bending strength) and elongation, and even improves When it is strong, it tends to cause the loss of elongation. In addition, when applied to products with high functionality (such as elasticity, strength, or strength feedback), such as sports goods, there is a problem of deformation or breakage after long-term use.

因此,本發明的第一目的,即在提供一種能夠提供優異強度及伸長率的固化組成物。Therefore, the first object of the present invention is to provide a cured composition that can provide excellent strength and elongation.

於是,本發明固化組成物包含環氧樹脂組分及硬化劑,其中,該環氧樹脂組分包括熱塑性聚合物、雙酚環氧樹脂、聚胺酯改質環氧樹脂及異氰酸酯改質環氧樹脂,且以該環氧樹脂組分的總量為100wt%計,該雙酚環氧樹脂的用量範圍為30wt%至50wt%、該聚胺酯改質環氧樹脂的用量範圍為10wt%至20wt%,且該異氰酸酯改質環氧樹脂的用量範圍為30wt%以上且小於60wt%。Therefore, the cured composition of the present invention includes an epoxy resin component and a hardener, wherein the epoxy resin component includes a thermoplastic polymer, a bisphenol epoxy resin, a polyurethane modified epoxy resin, and an isocyanate modified epoxy resin, And based on the total amount of the epoxy resin component being 100wt%, the amount of the bisphenol epoxy resin ranges from 30wt% to 50wt%, and the amount of the polyurethane modified epoxy resin ranges from 10wt% to 20wt%, and The amount of the isocyanate-modified epoxy resin ranges from 30 wt% to less than 60 wt%.

本發明的第二目的,即在提供一種具有優異強度及伸長率的固化物。The second objective of the present invention is to provide a cured product with excellent strength and elongation.

本發明固化物,是由上述的固化組成物經固化反應所形成。The cured product of the present invention is formed by the curing reaction of the above-mentioned cured composition.

本發明的第三目的,即在提供一種具有優異強度及伸長率的複合材。The third objective of the present invention is to provide a composite material with excellent strength and elongation.

本發明複合材包含固化物,其中,該固化物是由上述的固化組成物經固化反應所形成。The composite material of the present invention includes a cured product, wherein the cured product is formed from the above-mentioned cured composition through a curing reaction.

本發明的功效在於:透過該環氧樹脂組分及其用量的搭配,該固化組成物能夠使該固化物及該複合材具有優異的強度及伸長率。The effect of the present invention is that through the combination of the epoxy resin component and the amount thereof, the cured composition can make the cured product and the composite material have excellent strength and elongation.

本發明固化組成物包含環氧樹脂組分及硬化劑,其中,該環氧樹脂組分包括熱塑性聚合物、雙酚環氧樹脂、聚胺酯改質環氧樹脂及異氰酸酯改質環氧樹脂,且以該環氧樹脂組分的總量為100wt%計,該雙酚環氧樹脂的用量範圍為30wt%至50wt%、該聚胺酯改質環氧樹脂的用量範圍為10wt%至20wt%,且該異氰酸酯改質環氧樹脂的用量範圍為30wt%以上且小於60wt%。The cured composition of the present invention includes an epoxy resin component and a hardener, wherein the epoxy resin component includes a thermoplastic polymer, a bisphenol epoxy resin, a polyurethane modified epoxy resin, and an isocyanate modified epoxy resin, and The total amount of the epoxy resin component is 100wt%, the amount of the bisphenol epoxy resin ranges from 30wt% to 50wt%, the amount of the polyurethane modified epoxy resin ranges from 10wt% to 20wt%, and the isocyanate The amount of modified epoxy resin ranges from 30wt% to less than 60wt%.

[環氧樹脂組分][Epoxy resin component]

<雙酚環氧樹脂><Bisphenol epoxy resin>

該雙酚環氧樹脂例如環氧當量(epoxide equialent weight,簡稱EEW)為180至600的雙酚A二縮水甘油醚(bisphenol A diglycidyl ether)。The bisphenol epoxy resin is, for example, bisphenol A diglycidyl ether with an epoxide equialent weight (EEW) of 180 to 600.

<聚胺酯改質環氧樹脂><Polyurethane modified epoxy resin>

該聚胺酯改質環氧樹脂例如環氧當量為200至300的聚胺酯改質環氧樹脂(polyurethane-modified epoxy resin)。該聚胺酯改質環氧樹脂例如聚胺酯改質雙酚環氧樹脂。該聚胺酯改質雙酚環氧樹脂例如聚胺酯改質雙酚A環氧樹脂。The polyurethane-modified epoxy resin is, for example, a polyurethane-modified epoxy resin having an epoxy equivalent of 200 to 300. The polyurethane-modified epoxy resin is, for example, polyurethane-modified bisphenol epoxy resin. The polyurethane-modified bisphenol epoxy resin, for example, the polyurethane-modified bisphenol A epoxy resin.

<異氰酸酯改質環氧樹脂><Isocyanate modified epoxy resin>

該異氰酸酯改質環氧樹脂例如環氧當量為300至400的異氰酸酯改質環氧樹脂(isocyanate epoxy)。該異氰酸酯改質環氧樹脂例如異氰酸酯改質雙酚環氧樹脂。該異氰酸酯改質雙酚環氧樹脂例如異氰酸酯改質雙酚A環氧樹脂。The isocyanate-modified epoxy resin is, for example, an isocyanate epoxy having an epoxy equivalent of 300 to 400. The isocyanate-modified epoxy resin is, for example, isocyanate-modified bisphenol epoxy resin. The isocyanate-modified bisphenol epoxy resin, for example, the isocyanate-modified bisphenol A epoxy resin.

<熱塑性聚合物><Thermoplastic polymer>

該熱塑性聚合物的目的在於使該固化組成物具有防垂流性並提高該固化物的韌性。為能夠提高與該環氧樹脂組分中其他成分間的相容性,該熱塑性聚合物例如聚酯(polyester)、苯氧基樹脂(phenoxy resin)、聚醚碸(polyethersulfone),或聚醚(polyether)等。The purpose of the thermoplastic polymer is to make the cured composition have anti-sagging properties and to improve the toughness of the cured product. In order to be able to improve the compatibility with other components in the epoxy resin component, the thermoplastic polymer such as polyester, phenoxy resin, polyethersulfone, or polyether ( polyether) and so on.

[硬化劑][hardener]

該硬化劑例如雙氰胺(dicyandiamide,簡稱DICY)。The hardening agent is, for example, dicyandiamide (DICY).

<固化物及複合材><Cured products and composite materials>

本發明固化物是由上述的固化組成物經固化反應所形成。本發明複合材包含上述固化物。在本發明的一些實施例中,該固化物的拉伸強度在80MPa以上、彎曲強度在150MPa以上、拉伸伸長率在6%以上,而彎曲伸長率在10%以上,在這樣的特性下,所應用的運動用品(例如運動鞋件)能夠具有優異的彈性、耐彎折性,且不易脆裂。The cured product of the present invention is formed by the curing reaction of the above-mentioned cured composition. The composite material of the present invention contains the above-mentioned cured product. In some embodiments of the present invention, the tensile strength of the cured product is above 80 MPa, the bending strength is above 150 MPa, the tensile elongation is above 6%, and the bending elongation is above 10%. Under such characteristics, The applied sports goods (such as sports shoes) can have excellent elasticity, bending resistance, and not easy to be brittle.

在該複合材中,除包含該固化物外,進一步還可包含其它原料。該原料例如作為補強用的纖維材料。該纖維材料可單獨一種使用或混合多種使用,且該纖維材料例如碳纖維材料、玻璃纖維材料、礦物纖維材料,或聚對苯二甲酸苯酯醯胺纖維材料等。該聚對苯二甲酸苯酯醯胺纖維材料例如杜邦公司的Kevlar ®纖維。以結構型態來說明,該纖維材料例如連續纖維(continuous filament)或短纖維(亦稱切斷纖維,staple fiber),且在使用上,是可混合不同結構型態的纖維材料。該複合材能夠應用於運動用品(例如運動鞋件)上。 In addition to the cured product, the composite material may further include other raw materials. This raw material is used as a fiber material for reinforcement, for example. The fiber material can be used alone or in combination of multiple types, and the fiber material is for example carbon fiber material, glass fiber material, mineral fiber material, or polyphenylene terephthalate fiber material. The polyphenylene terephthalate fiber material is, for example, Kevlar ® fiber from DuPont. In terms of structure, the fiber material is, for example, continuous filament or staple fiber (also known as staple fiber), and in use, it can be mixed with fiber materials of different structure types. The composite material can be applied to sports goods (such as sports shoes).

本發明將就以下實施例來作進一步說明,但應瞭解的是,該等實施例僅為例示說明之用,而不應被解釋為本發明實施之限制。The present invention will be further described with reference to the following examples, but it should be understood that these examples are for illustrative purposes only and should not be construed as limiting the implementation of the present invention.

實施例1Example 1

將10克的聚胺酯改質雙酚A環氧樹脂(廠牌:南亞;型號:NPER-133M;環氧當量為220±25)、30克的雙酚A二縮水甘油醚(廠牌:南亞;型號:NPEL-134;環氧當量為250±20)、50克的異氰酸酯改質雙酚A環氧樹脂(廠牌:南亞;型號:NPEX-152M;環氧當量為310±10)及10克的苯氧基樹脂(廠牌:日本新日鐵;型號:YP-50;分子量為50000)混合,形成環氧樹脂組分。將100克的環氧樹脂組分及10克的雙氰胺混合,形成固化組成物。Modified bisphenol A epoxy resin with 10 grams of polyurethane (brand: Nanya; model: NPER-133M; epoxy equivalent 220±25), and 30 grams of bisphenol A diglycidyl ether (brand: Nanya; Model: NPEL-134; epoxy equivalent of 250±20), 50 grams of isocyanate modified bisphenol A epoxy resin (brand: Nanya; Model: NPEX-152M; epoxy equivalent of 310±10) and 10 grams The phenoxy resin (brand: Nippon Steel; model: YP-50; molecular weight is 50,000) is mixed to form an epoxy resin component. 100 grams of epoxy resin component and 10 grams of dicyandiamide are mixed to form a cured composition.

實施例2至3及比較例1至14Examples 2 to 3 and Comparative Examples 1 to 14

實施例2至3及比較例1至14是以與該實施例1相同步驟進行,不同主要在於:改變環氧樹脂組分中的各成分的用量。Examples 2 to 3 and Comparative Examples 1 to 14 were carried out in the same steps as in Example 1, with the main difference being: changing the amount of each component in the epoxy resin component.

評價項目Evaluation item

拉伸強度量測:將實施例1至3及比較例1至14的固化組成物經過真空除泡後,接著,置於模具中,然後,利用一台熱壓成型機在溫度為200℃進行30分鐘的熱壓成型處理,而獲得固化成型片,其中,在該熱壓成型處理過程中伴隨進行固化反應。將該固化成型片裁切適當大小後,利用一台萬能試驗機並依據ASTM D638的標準方法進行量測。Tensile strength measurement: the cured compositions of Examples 1 to 3 and Comparative Examples 1 to 14 were vacuum defoamed, and then placed in a mold, and then a thermocompression molding machine was used at a temperature of 200°C. A 30-minute hot press molding process is performed to obtain a cured molded sheet, wherein a curing reaction is accompanied by the hot press molding process. After cutting the cured sheet to an appropriate size, use a universal testing machine to measure it in accordance with the ASTM D638 standard method.

彎曲強度量測:將實施例1至3及比較例1至14的固化組成物經過真空除泡後,接著,置於模具中,然後,利用一台熱壓成型機在溫度為200℃進行30分鐘的熱壓成型處理,而獲得固化成型片,其中,在該熱壓成型處理過程中伴隨進行固化反應。將該固化成型片裁切適當大小後,利用一台萬能試驗機並依據ASTM D790的標準方法進行量測。Bending strength measurement: The cured compositions of Examples 1 to 3 and Comparative Examples 1 to 14 were vacuum defoamed, and then placed in a mold, and then a thermocompression molding machine was used for 30 Minutes of the hot press molding process to obtain a cured molded sheet, wherein the curing reaction is accompanied by the hot press molding process. After cutting the cured sheet to an appropriate size, use a universal testing machine to measure it according to the ASTM D790 standard method.

拉伸伸長率量測:將實施例1至3及比較例1至14的固化組成物經過真空除泡後,接著,置於模具中,然後,利用一台熱壓成型機在溫度為200℃進行30分鐘的熱壓成型處理,而獲得固化成型片,其中,在該熱壓成型處理過程中伴隨進行固化反應。將該固化成型片裁切適當大小後,利用一台萬能試驗機並依據ASTM D638的標準方法進行量測。Tensile elongation measurement: the cured compositions of Examples 1 to 3 and Comparative Examples 1 to 14 were vacuum defoamed, and then placed in a mold, and then a thermocompression molding machine was used at a temperature of 200°C A thermo-compression molding process is performed for 30 minutes to obtain a cured molded sheet, wherein a curing reaction is accompanied by the thermo-compression molding process. After cutting the cured sheet to an appropriate size, use a universal testing machine to measure it in accordance with the ASTM D638 standard method.

彎曲伸長率量測:將實施例1至3及比較例1至14的固化組成物經過真空除泡後,接著,置於模具中,然後,利用一台熱壓成型機在溫度為200℃進行30分鐘的熱壓成型處理,而獲得固化成型片,其中,在該熱壓成型處理過程中伴隨進行固化反應。將該固化成型片裁切適當大小後,利用一台萬能試驗機並依據ASTM D790的標準方法進行量測。Measurement of bending elongation: The cured compositions of Examples 1 to 3 and Comparative Examples 1 to 14 were vacuum defoamed, and then placed in a mold, and then a thermocompression molding machine was used at a temperature of 200°C. A 30-minute hot press molding process is performed to obtain a cured molded sheet, wherein a curing reaction is accompanied by the hot press molding process. After cutting the cured sheet to an appropriate size, use a universal testing machine to measure it according to the ASTM D790 standard method.

表1 固化組成物 實施例 比較例 1 2 3 1 2 3 4 5 6 環氧樹脂組分 克 (wt%) 聚胺酯改質雙酚A環氧樹脂 (EEW為220±25) 10 (10) 20 (20) 10 (10) 50 (50) 0 (0) 50 (50) 5 (5) 30 (30) 10 (10) 雙酚A二縮水甘油醚 (EEW為250±20) 30 (30) 30 (30) 50 (50) 40 (40) 40 (40) 0 (0) 50 (50) 50 (50) 55 (55) 異氰酸酯改質雙酚A環氧樹脂 (EEW為310±10) 50 (60) 40 (40) 30 (30) 0 (0) 50 (50) 40 (40) 35 (35) 10 (10) 25 (25) 苯氧基樹脂 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) 硬化劑 (克) 雙氰胺 10 10 10 10 10 10 10 10 10 評價項目 拉伸強度(MPa) 82.3 80.4 87.2 74.4 71.4 65.7 79.8 78.9 83.3 彎曲強度(MPa) 153.2 150.2 156.3 138.2 139.1 126.7 143.8 148.2 150.4 拉伸伸長率(%) 6.6 6.7 6.5 5.2 4.9 7.1 5.8 6.1 3.2 彎曲伸長率(%) 10.34 11.12 10.78 8.01 8.01 11.9 9.4 9.8 5.8 Table 1 Curing composition Example Comparative example 1 2 3 1 2 3 4 5 6 Epoxy resin composition g (wt%) Polyurethane modified bisphenol A epoxy resin (EEW is 220±25) 10 (10) 20 (20) 10 (10) 50 (50) 0 (0) 50 (50) 5 (5) 30 (30) 10 (10) Bisphenol A diglycidyl ether (EEW is 250±20) 30 (30) 30 (30) 50 (50) 40 (40) 40 (40) 0 (0) 50 (50) 50 (50) 55 (55) Isocyanate modified bisphenol A epoxy resin (EEW is 310±10) 50 (60) 40 (40) 30 (30) 0 (0) 50 (50) 40 (40) 35 (35) 10 (10) 25 (25) Phenoxy resin 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) Hardener (g) Dicyandiamide 10 10 10 10 10 10 10 10 10 Evaluation item Tensile strength (MPa) 82.3 80.4 87.2 74.4 71.4 65.7 79.8 78.9 83.3 Flexural strength (MPa) 153.2 150.2 156.3 138.2 139.1 126.7 143.8 148.2 150.4 Tensile elongation (%) 6.6 6.7 6.5 5.2 4.9 7.1 5.8 6.1 3.2 Bending elongation (%) 10.34 11.12 10.78 8.01 8.01 11.9 9.4 9.8 5.8

表2 固化組成物 比較例 7 8 9 10 11 12 13 14 環氧樹脂組分 克 (wt%) 聚胺酯改質雙酚A環氧樹脂 (EEW為220±25) 10 (10) 10 (10) 70 (70) 10 (10) 5 (5) 90 (90) 0 (0) 0 (0) 雙酚A二縮水甘油醚 (EEW為250±20) 25 (25) 70 (70) 10 (10) 10 (10) 10 (10) 0 (0) 0 (0) 90 (90) 異氰酸酯改質雙酚A環氧樹脂 (EEW為310±10) 55 (55) 10 (10) 10 (10) 70 (70) 75 (75) 0 (0) 90 (90) 0 (0) 苯氧基樹脂 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) 硬化劑 (克) 雙氰胺 10 10 10 10 10 10 10 10 評價項目 拉伸強度(MPa) 73.3 81.3 71.2 72.1 78.4 72.1 69.4 86.9 彎曲強度(MPa) 133.3 153.4 132.1 132.2 142.1 138.2 129.1 152.9 拉伸伸長率(%) 5.6 3.4 5.3 5.8 5.2 6.8 6.9 3.4 彎曲伸長率(%) 9.01 5.6 9.01 8.92 8.01 10.98 11.01 6.8 Table 2 Curing composition Comparative example 7 8 9 10 11 12 13 14 Epoxy resin composition g (wt%) Polyurethane modified bisphenol A epoxy resin (EEW is 220±25) 10 (10) 10 (10) 70 (70) 10 (10) 5 (5) 90 (90) 0 (0) 0 (0) Bisphenol A diglycidyl ether (EEW is 250±20) 25 (25) 70 (70) 10 (10) 10 (10) 10 (10) 0 (0) 0 (0) 90 (90) Isocyanate modified bisphenol A epoxy resin (EEW is 310±10) 55 (55) 10 (10) 10 (10) 70 (70) 75 (75) 0 (0) 90 (90) 0 (0) Phenoxy resin 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) 10 (10) Hardener (g) Dicyandiamide 10 10 10 10 10 10 10 10 Evaluation item Tensile strength (MPa) 73.3 81.3 71.2 72.1 78.4 72.1 69.4 86.9 Flexural strength (MPa) 133.3 153.4 132.1 132.2 142.1 138.2 129.1 152.9 Tensile elongation (%) 5.6 3.4 5.3 5.8 5.2 6.8 6.9 3.4 Bending elongation (%) 9.01 5.6 9.01 8.92 8.01 10.98 11.01 6.8

由表1的實施例1至3的實驗數據可知,在固化組成物中加入雙酚環氧樹脂、聚胺酯改質環氧樹脂及該異氰酸酯改質環氧樹脂,且該等成分的用量皆在本發明所述的範圍內時,由該等固化阻成物所形成的固化物具有拉伸強度在80MPa以上、彎曲強度在150MPa以上、拉伸伸長率在6%以上,而彎曲伸長率在10%以上的特性。According to the experimental data of Examples 1 to 3 in Table 1, bisphenol epoxy resin, polyurethane-modified epoxy resin and the isocyanate-modified epoxy resin are added to the curing composition, and the amounts of these components are all in this Within the range stated in the invention, the cured product formed by the curing inhibitors has a tensile strength of 80 MPa or more, a bending strength of 150 MPa or more, a tensile elongation of 6% or more, and a bending elongation of 10% The above characteristics.

反觀比較例1至14的固化組成物,由表1的比較例1至3的實驗數據可知,在固化組成物中僅加入雙酚環氧樹脂、聚胺酯改質環氧樹脂及該異氰酸酯改質環氧樹脂中任兩者,或由表2的比較例12至14的實驗數據可知,在固化組成物中僅加入雙酚環氧樹脂、聚胺酯改質環氧樹脂及該異氰酸酯改質環氧樹脂中一者,該等固化物在強度及延伸率上是無法兼具,甚至強度及延伸率皆不佳。再者,由表1的比較例4至6及表2的比較例7至11的實驗數據可知,即使在固化組成物中加入雙酚環氧樹脂、聚胺酯改質環氧樹脂及該異氰酸酯改質環氧樹脂,當該等成分的用量中至少一者皆不在本發明所述的範圍內時,該等固化物在強度及延伸率上亦是無法兼具,甚至強度及延伸率皆不佳。In contrast to the cured compositions of Comparative Examples 1 to 14, from the experimental data of Comparative Examples 1 to 3 in Table 1, it can be seen that only bisphenol epoxy resin, polyurethane modified epoxy resin and the isocyanate modified ring were added to the cured composition. It can be seen from the experimental data of Comparative Examples 12 to 14 in Table 2 that only bisphenol epoxy resin, polyurethane-modified epoxy resin and the isocyanate-modified epoxy resin are added to the cured composition. First, these cured products cannot have both strength and elongation, and even strength and elongation are not good. Furthermore, from the experimental data of Comparative Examples 4 to 6 in Table 1 and Comparative Examples 7 to 11 in Table 2, it can be seen that even if bisphenol epoxy resin, polyurethane-modified epoxy resin and the isocyanate-modified epoxy resin are added to the cured composition For epoxy resin, when at least one of these components is not within the scope of the present invention, the cured products cannot have both strength and elongation, and even the strength and elongation are not good.

綜上所述,本發明透過該環氧樹脂組分及其用量的搭配,該固化組成物能夠使該固化物及該複合材具有優異的強度及伸長率,故確實能達成本發明的目的。In summary, the present invention, through the combination of the epoxy resin component and its amount, the cured composition can make the cured product and the composite material have excellent strength and elongation, so the objective of the invention can indeed be achieved.

惟以上所述者,僅為本發明的實施例而已,當不能以此限定本發明實施的範圍,凡是依本發明申請專利範圍及專利說明書內容所作的簡單的等效變化與修飾,皆仍屬本發明專利涵蓋的範圍內。However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to Within the scope of the patent for the present invention.

無。no.

Claims (10)

一種固化組成物,包含: 環氧樹脂組分,包括熱塑性聚合物、雙酚環氧樹脂、聚胺酯改質環氧樹脂及異氰酸酯改質環氧樹脂,且以該環氧樹脂組分的總量為100wt%計,該雙酚環氧樹脂的用量範圍為30wt%至50wt%、該聚胺酯改質環氧樹脂的用量範圍為10wt%至20wt%,且該異氰酸酯改質環氧樹脂的用量範圍為30wt%以上且小於60wt%;及 硬化劑。 A curing composition comprising: Epoxy resin components, including thermoplastic polymers, bisphenol epoxy resins, polyurethane modified epoxy resins and isocyanate modified epoxy resins, and the total amount of the epoxy resin components is 100wt%, the bisphenol The amount of epoxy resin ranges from 30wt% to 50wt%, the amount of the polyurethane-modified epoxy resin ranges from 10wt% to 20wt%, and the amount of the isocyanate-modified epoxy resin ranges from 30wt% to less than 60wt%; and hardener. 如請求項1所述的固化組成物,其中,該雙酚環氧樹脂為環氧當量為180至600的雙酚A二縮水甘油醚。The cured composition according to claim 1, wherein the bisphenol epoxy resin is bisphenol A diglycidyl ether having an epoxy equivalent of 180 to 600. 如請求項1所述的固化組成物,其中,該聚胺酯改質環氧樹脂為環氧當量為200至300的聚胺酯改質環氧樹脂。The cured composition according to claim 1, wherein the polyurethane-modified epoxy resin is a polyurethane-modified epoxy resin having an epoxy equivalent of 200 to 300. 如請求項1所述的固化組成物,其中,該異氰酸酯改質環氧樹脂為環氧當量為300至400的異氰酸酯改質環氧樹脂。The cured composition according to claim 1, wherein the isocyanate-modified epoxy resin is an isocyanate-modified epoxy resin having an epoxy equivalent of 300 to 400. 如請求項1所述的固化組成物,其中,該硬化劑為雙氰胺。The cured composition according to claim 1, wherein the hardener is dicyandiamide. 一種固化物,是由如請求項1至5中任一項的固化組成物經固化反應所形成。A cured product is formed from the cured composition of any one of claims 1 to 5 through a curing reaction. 一種複合材,包含固化物,其中,該固化物是由如請求項1至5中任一項的固化組成物經固化反應所形成。A composite material comprising a cured product, wherein the cured product is formed from the cured composition of any one of claims 1 to 5 through a curing reaction. 如請求項7所述的複合材,還包含纖維材料。The composite material according to claim 7, further comprising fiber materials. 如請求項8所述的複合材,其中,該纖維材料選自於碳纖維材料、玻璃纖維材料、礦物纖維材料、聚對苯二甲酸苯酯醯胺纖維材料,或上述任意的組合。The composite material according to claim 8, wherein the fiber material is selected from carbon fiber material, glass fiber material, mineral fiber material, polyphenylene terephthalate fiber material, or any combination of the foregoing. 如請求項8所述的複合材,其中,該纖維材料選自於連續纖維、短纖維,或上述的組合。The composite material according to claim 8, wherein the fiber material is selected from continuous fibers, short fibers, or a combination of the foregoing.
TW108114644A 2019-04-26 2019-04-26 Cured composition, cured product and composite material TWI704180B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW108114644A TWI704180B (en) 2019-04-26 2019-04-26 Cured composition, cured product and composite material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108114644A TWI704180B (en) 2019-04-26 2019-04-26 Cured composition, cured product and composite material

Publications (2)

Publication Number Publication Date
TWI704180B true TWI704180B (en) 2020-09-11
TW202039685A TW202039685A (en) 2020-11-01

Family

ID=73644261

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108114644A TWI704180B (en) 2019-04-26 2019-04-26 Cured composition, cured product and composite material

Country Status (1)

Country Link
TW (1) TWI704180B (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101193975A (en) * 2005-06-09 2008-06-04 株式会社艾迪科 Hardenable resin composition
CN101501132A (en) * 2006-06-30 2009-08-05 东丽株式会社 Epoxy resin composition, prepreg, and fiber-reinforced composite material
CN103694644A (en) * 2013-12-30 2014-04-02 景旺电子科技(龙川)有限公司 Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof
CN104395381A (en) * 2012-02-15 2015-03-04 吉坤日矿日石能源株式会社 Fiber-reinforced composite material
TW201632563A (en) * 2015-03-13 2016-09-16 新日鐵住金化學股份有限公司 Oxazolidone ring-containing epoxy resin, method for producing thereof, epoxy resin composition, cured product thereof and application thereof
CN106414542A (en) * 2014-06-03 2017-02-15 新日铁住金化学株式会社 Polyurethane-modified epoxy resin, method for producing same, epoxy resin composition and cured product
TW201910399A (en) * 2017-07-28 2019-03-16 日商東麗股份有限公司 Prepreg and carbon fiber reinforced composite
CN109563236A (en) * 2016-07-29 2019-04-02 株式会社Adeka Hardening resin composition and the structural material engagement binder for having used the composition

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101193975A (en) * 2005-06-09 2008-06-04 株式会社艾迪科 Hardenable resin composition
CN101501132A (en) * 2006-06-30 2009-08-05 东丽株式会社 Epoxy resin composition, prepreg, and fiber-reinforced composite material
CN104395381A (en) * 2012-02-15 2015-03-04 吉坤日矿日石能源株式会社 Fiber-reinforced composite material
CN103694644A (en) * 2013-12-30 2014-04-02 景旺电子科技(龙川)有限公司 Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof
CN106414542A (en) * 2014-06-03 2017-02-15 新日铁住金化学株式会社 Polyurethane-modified epoxy resin, method for producing same, epoxy resin composition and cured product
TW201632563A (en) * 2015-03-13 2016-09-16 新日鐵住金化學股份有限公司 Oxazolidone ring-containing epoxy resin, method for producing thereof, epoxy resin composition, cured product thereof and application thereof
CN109563236A (en) * 2016-07-29 2019-04-02 株式会社Adeka Hardening resin composition and the structural material engagement binder for having used the composition
TW201910399A (en) * 2017-07-28 2019-03-16 日商東麗股份有限公司 Prepreg and carbon fiber reinforced composite

Also Published As

Publication number Publication date
TW202039685A (en) 2020-11-01

Similar Documents

Publication Publication Date Title
JP2013529709A (en) Curable epoxy resin composition and composite material produced therefrom
JP7186711B2 (en) Curable resin composition and Tuprepreg using the same
JP4821163B2 (en) Epoxy resin composition for fiber reinforced composite materials
EP3564289B1 (en) Curable epoxy resin composition, and fiber-reinforced composite material using same
WO2019026724A1 (en) Sheet molding compound, prepreg, and fiber-reinforced composite material
US20150368457A1 (en) Toughened epoxy thermosets containing core shell rubbers and polyols
TW202033659A (en) Resin composition, fiber-reinforced plastic molding material, and molded article
JP5017794B2 (en) Epoxy resin composition for fiber reinforced composite materials
US10808118B2 (en) Epoxy novolac composites
TWI704180B (en) Cured composition, cured product and composite material
JP2006291094A (en) Epoxy resin composition for reinforced composite material
JP4857587B2 (en) Epoxy resin composition for fiber reinforced composite materials
JPH0445524B2 (en)
JP2010163573A (en) Epoxy resin composition and fiber-reinforced composite material using the same
KR101838848B1 (en) Epoxy Resin Compositions for Bulk Mold Compound Dispersed Carbon Nano Tube
JP7235557B2 (en) Curable resin composition and Tuprepreg using the same
JP7059000B2 (en) Curing method of epoxy resin composition
KR102253103B1 (en) Fiber reinforced composite material and method of manufacturing the same
JP6697711B2 (en) Epoxy resin composition, prepreg, fiber-reinforced composite material and method for producing the same
JP2003206332A (en) Epoxy resin composition for composite material and composite material using the same
JP5918425B1 (en) Imido group-containing naphthol resin production method, thermosetting resin composition, cured product thereof, and use
JP4765399B2 (en) Epoxy resin composition
KR102704865B1 (en) Epoxy resin composition and carbon fiber composite material using the same
JP7182370B2 (en) Epoxy resin composition for fiber-reinforced composite material, fiber-reinforced composite material, and molded article
JP4344662B2 (en) Epoxy resin composition, prepreg and molded body, and method for producing epoxy resin composition

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees