TWI704180B - Cured composition, cured product and composite material - Google Patents
Cured composition, cured product and composite material Download PDFInfo
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- TWI704180B TWI704180B TW108114644A TW108114644A TWI704180B TW I704180 B TWI704180 B TW I704180B TW 108114644 A TW108114644 A TW 108114644A TW 108114644 A TW108114644 A TW 108114644A TW I704180 B TWI704180 B TW I704180B
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- epoxy resin
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- bisphenol
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- isocyanate
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- 239000000203 mixture Substances 0.000 title claims abstract description 34
- 239000002131 composite material Substances 0.000 title claims abstract description 14
- 239000003822 epoxy resin Substances 0.000 claims abstract description 82
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 82
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229930185605 Bisphenol Natural products 0.000 claims abstract description 19
- 239000012948 isocyanate Substances 0.000 claims abstract description 12
- 239000004814 polyurethane Substances 0.000 claims abstract description 12
- 229920002635 polyurethane Polymers 0.000 claims abstract description 12
- 239000004848 polyfunctional curative Substances 0.000 claims abstract description 9
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 9
- 239000002657 fibrous material Substances 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- -1 isocyanate modified epoxy resins Chemical class 0.000 claims description 7
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical group NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 6
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 4
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- 239000002557 mineral fiber Substances 0.000 claims description 2
- 150000002513 isocyanates Chemical class 0.000 abstract description 8
- 230000000052 comparative effect Effects 0.000 description 13
- 238000005452 bending Methods 0.000 description 10
- 238000000465 moulding Methods 0.000 description 10
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 4
- 229920006287 phenoxy resin Polymers 0.000 description 4
- 239000013034 phenoxy resin Substances 0.000 description 4
- 238000010561 standard procedure Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920000271 Kevlar® Polymers 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Epoxy Resins (AREA)
Abstract
一種固化組成物包含環氧樹脂組分及硬化劑,其中,該環氧樹脂組分包括熱塑性聚合物、雙酚環氧樹脂、聚胺酯改質環氧樹脂及異氰酸酯改質環氧樹脂,且以該環氧樹脂組分的總量為100wt%計,該雙酚環氧樹脂的用量範圍為30wt%至50wt%、該聚胺酯改質環氧樹脂的用量範圍為10wt%至20wt%,且該異氰酸酯改質環氧樹脂的用量範圍為30wt%以上且小於60wt%。本發明亦提供一種具有優異強度及伸長率的固化物及複合材。A curing composition includes an epoxy resin component and a hardener, wherein the epoxy resin component includes a thermoplastic polymer, a bisphenol epoxy resin, a polyurethane-modified epoxy resin, and an isocyanate-modified epoxy resin. The total amount of the epoxy resin component is 100wt%, the amount of the bisphenol epoxy resin ranges from 30wt% to 50wt%, the amount of the polyurethane modified epoxy resin ranges from 10wt% to 20wt%, and the isocyanate modified The amount of high-quality epoxy resin ranges from 30wt% to less than 60wt%. The present invention also provides a cured product and composite material with excellent strength and elongation.
Description
本發明是有關於一種固化材料,特別是指一種包含環氧樹脂組分的固化組成物,其中,該環氧樹脂組分包括熱塑性聚合物、雙酚環氧樹脂、聚胺酯改質環氧樹脂及異氰酸酯改質環氧樹脂。The present invention relates to a curing material, in particular to a curing composition containing an epoxy resin component, wherein the epoxy resin component includes a thermoplastic polymer, a bisphenol epoxy resin, a polyurethane modified epoxy resin and Isocyanate modifies epoxy resin.
環氧樹脂因具有優異的耐熱性、耐藥品性及成形性等優點,而常被廣泛地應用於電子材料或光學材料等領域中。在環氧樹酯中,由於雙酚環氧樹脂具有良好的黏結特性,因而常被使用,且通常會與熱塑性聚合物及硬化劑搭配,而配置成固化組成物來進行後續的應用。Epoxy resin is often widely used in electronic materials or optical materials because of its excellent heat resistance, chemical resistance and formability. Among epoxy resins, bisphenol epoxy resins are often used due to their good bonding properties, and are usually combined with thermoplastic polymers and hardeners to be configured into cured compositions for subsequent applications.
雖該雙酚環氧樹脂具有良好的黏結特性,但由該雙酚環氧樹脂所形成的固化物在強度(例如拉伸強度或彎曲強度)及伸長率上仍不符合所需,甚至在提升強度時,往往會造成伸長率的損失。此外,當應用至高功能性(例如彈性、強度或力量回饋)產品,例如運動用品,在長期使用下存在有變形或斷裂的問題。Although the bisphenol epoxy resin has good bonding characteristics, the cured product formed by the bisphenol epoxy resin still does not meet the requirements in terms of strength (such as tensile strength or bending strength) and elongation, and even improves When it is strong, it tends to cause the loss of elongation. In addition, when applied to products with high functionality (such as elasticity, strength, or strength feedback), such as sports goods, there is a problem of deformation or breakage after long-term use.
因此,本發明的第一目的,即在提供一種能夠提供優異強度及伸長率的固化組成物。Therefore, the first object of the present invention is to provide a cured composition that can provide excellent strength and elongation.
於是,本發明固化組成物包含環氧樹脂組分及硬化劑,其中,該環氧樹脂組分包括熱塑性聚合物、雙酚環氧樹脂、聚胺酯改質環氧樹脂及異氰酸酯改質環氧樹脂,且以該環氧樹脂組分的總量為100wt%計,該雙酚環氧樹脂的用量範圍為30wt%至50wt%、該聚胺酯改質環氧樹脂的用量範圍為10wt%至20wt%,且該異氰酸酯改質環氧樹脂的用量範圍為30wt%以上且小於60wt%。Therefore, the cured composition of the present invention includes an epoxy resin component and a hardener, wherein the epoxy resin component includes a thermoplastic polymer, a bisphenol epoxy resin, a polyurethane modified epoxy resin, and an isocyanate modified epoxy resin, And based on the total amount of the epoxy resin component being 100wt%, the amount of the bisphenol epoxy resin ranges from 30wt% to 50wt%, and the amount of the polyurethane modified epoxy resin ranges from 10wt% to 20wt%, and The amount of the isocyanate-modified epoxy resin ranges from 30 wt% to less than 60 wt%.
本發明的第二目的,即在提供一種具有優異強度及伸長率的固化物。The second objective of the present invention is to provide a cured product with excellent strength and elongation.
本發明固化物,是由上述的固化組成物經固化反應所形成。The cured product of the present invention is formed by the curing reaction of the above-mentioned cured composition.
本發明的第三目的,即在提供一種具有優異強度及伸長率的複合材。The third objective of the present invention is to provide a composite material with excellent strength and elongation.
本發明複合材包含固化物,其中,該固化物是由上述的固化組成物經固化反應所形成。The composite material of the present invention includes a cured product, wherein the cured product is formed from the above-mentioned cured composition through a curing reaction.
本發明的功效在於:透過該環氧樹脂組分及其用量的搭配,該固化組成物能夠使該固化物及該複合材具有優異的強度及伸長率。The effect of the present invention is that through the combination of the epoxy resin component and the amount thereof, the cured composition can make the cured product and the composite material have excellent strength and elongation.
本發明固化組成物包含環氧樹脂組分及硬化劑,其中,該環氧樹脂組分包括熱塑性聚合物、雙酚環氧樹脂、聚胺酯改質環氧樹脂及異氰酸酯改質環氧樹脂,且以該環氧樹脂組分的總量為100wt%計,該雙酚環氧樹脂的用量範圍為30wt%至50wt%、該聚胺酯改質環氧樹脂的用量範圍為10wt%至20wt%,且該異氰酸酯改質環氧樹脂的用量範圍為30wt%以上且小於60wt%。The cured composition of the present invention includes an epoxy resin component and a hardener, wherein the epoxy resin component includes a thermoplastic polymer, a bisphenol epoxy resin, a polyurethane modified epoxy resin, and an isocyanate modified epoxy resin, and The total amount of the epoxy resin component is 100wt%, the amount of the bisphenol epoxy resin ranges from 30wt% to 50wt%, the amount of the polyurethane modified epoxy resin ranges from 10wt% to 20wt%, and the isocyanate The amount of modified epoxy resin ranges from 30wt% to less than 60wt%.
[環氧樹脂組分][Epoxy resin component]
<雙酚環氧樹脂><Bisphenol epoxy resin>
該雙酚環氧樹脂例如環氧當量(epoxide equialent weight,簡稱EEW)為180至600的雙酚A二縮水甘油醚(bisphenol A diglycidyl ether)。The bisphenol epoxy resin is, for example, bisphenol A diglycidyl ether with an epoxide equialent weight (EEW) of 180 to 600.
<聚胺酯改質環氧樹脂><Polyurethane modified epoxy resin>
該聚胺酯改質環氧樹脂例如環氧當量為200至300的聚胺酯改質環氧樹脂(polyurethane-modified epoxy resin)。該聚胺酯改質環氧樹脂例如聚胺酯改質雙酚環氧樹脂。該聚胺酯改質雙酚環氧樹脂例如聚胺酯改質雙酚A環氧樹脂。The polyurethane-modified epoxy resin is, for example, a polyurethane-modified epoxy resin having an epoxy equivalent of 200 to 300. The polyurethane-modified epoxy resin is, for example, polyurethane-modified bisphenol epoxy resin. The polyurethane-modified bisphenol epoxy resin, for example, the polyurethane-modified bisphenol A epoxy resin.
<異氰酸酯改質環氧樹脂><Isocyanate modified epoxy resin>
該異氰酸酯改質環氧樹脂例如環氧當量為300至400的異氰酸酯改質環氧樹脂(isocyanate epoxy)。該異氰酸酯改質環氧樹脂例如異氰酸酯改質雙酚環氧樹脂。該異氰酸酯改質雙酚環氧樹脂例如異氰酸酯改質雙酚A環氧樹脂。The isocyanate-modified epoxy resin is, for example, an isocyanate epoxy having an epoxy equivalent of 300 to 400. The isocyanate-modified epoxy resin is, for example, isocyanate-modified bisphenol epoxy resin. The isocyanate-modified bisphenol epoxy resin, for example, the isocyanate-modified bisphenol A epoxy resin.
<熱塑性聚合物><Thermoplastic polymer>
該熱塑性聚合物的目的在於使該固化組成物具有防垂流性並提高該固化物的韌性。為能夠提高與該環氧樹脂組分中其他成分間的相容性,該熱塑性聚合物例如聚酯(polyester)、苯氧基樹脂(phenoxy resin)、聚醚碸(polyethersulfone),或聚醚(polyether)等。The purpose of the thermoplastic polymer is to make the cured composition have anti-sagging properties and to improve the toughness of the cured product. In order to be able to improve the compatibility with other components in the epoxy resin component, the thermoplastic polymer such as polyester, phenoxy resin, polyethersulfone, or polyether ( polyether) and so on.
[硬化劑][hardener]
該硬化劑例如雙氰胺(dicyandiamide,簡稱DICY)。The hardening agent is, for example, dicyandiamide (DICY).
<固化物及複合材><Cured products and composite materials>
本發明固化物是由上述的固化組成物經固化反應所形成。本發明複合材包含上述固化物。在本發明的一些實施例中,該固化物的拉伸強度在80MPa以上、彎曲強度在150MPa以上、拉伸伸長率在6%以上,而彎曲伸長率在10%以上,在這樣的特性下,所應用的運動用品(例如運動鞋件)能夠具有優異的彈性、耐彎折性,且不易脆裂。The cured product of the present invention is formed by the curing reaction of the above-mentioned cured composition. The composite material of the present invention contains the above-mentioned cured product. In some embodiments of the present invention, the tensile strength of the cured product is above 80 MPa, the bending strength is above 150 MPa, the tensile elongation is above 6%, and the bending elongation is above 10%. Under such characteristics, The applied sports goods (such as sports shoes) can have excellent elasticity, bending resistance, and not easy to be brittle.
在該複合材中,除包含該固化物外,進一步還可包含其它原料。該原料例如作為補強用的纖維材料。該纖維材料可單獨一種使用或混合多種使用,且該纖維材料例如碳纖維材料、玻璃纖維材料、礦物纖維材料,或聚對苯二甲酸苯酯醯胺纖維材料等。該聚對苯二甲酸苯酯醯胺纖維材料例如杜邦公司的Kevlar ®纖維。以結構型態來說明,該纖維材料例如連續纖維(continuous filament)或短纖維(亦稱切斷纖維,staple fiber),且在使用上,是可混合不同結構型態的纖維材料。該複合材能夠應用於運動用品(例如運動鞋件)上。 In addition to the cured product, the composite material may further include other raw materials. This raw material is used as a fiber material for reinforcement, for example. The fiber material can be used alone or in combination of multiple types, and the fiber material is for example carbon fiber material, glass fiber material, mineral fiber material, or polyphenylene terephthalate fiber material. The polyphenylene terephthalate fiber material is, for example, Kevlar ® fiber from DuPont. In terms of structure, the fiber material is, for example, continuous filament or staple fiber (also known as staple fiber), and in use, it can be mixed with fiber materials of different structure types. The composite material can be applied to sports goods (such as sports shoes).
本發明將就以下實施例來作進一步說明,但應瞭解的是,該等實施例僅為例示說明之用,而不應被解釋為本發明實施之限制。The present invention will be further described with reference to the following examples, but it should be understood that these examples are for illustrative purposes only and should not be construed as limiting the implementation of the present invention.
實施例1Example 1
將10克的聚胺酯改質雙酚A環氧樹脂(廠牌:南亞;型號:NPER-133M;環氧當量為220±25)、30克的雙酚A二縮水甘油醚(廠牌:南亞;型號:NPEL-134;環氧當量為250±20)、50克的異氰酸酯改質雙酚A環氧樹脂(廠牌:南亞;型號:NPEX-152M;環氧當量為310±10)及10克的苯氧基樹脂(廠牌:日本新日鐵;型號:YP-50;分子量為50000)混合,形成環氧樹脂組分。將100克的環氧樹脂組分及10克的雙氰胺混合,形成固化組成物。Modified bisphenol A epoxy resin with 10 grams of polyurethane (brand: Nanya; model: NPER-133M; epoxy equivalent 220±25), and 30 grams of bisphenol A diglycidyl ether (brand: Nanya; Model: NPEL-134; epoxy equivalent of 250±20), 50 grams of isocyanate modified bisphenol A epoxy resin (brand: Nanya; Model: NPEX-152M; epoxy equivalent of 310±10) and 10 grams The phenoxy resin (brand: Nippon Steel; model: YP-50; molecular weight is 50,000) is mixed to form an epoxy resin component. 100 grams of epoxy resin component and 10 grams of dicyandiamide are mixed to form a cured composition.
實施例2至3及比較例1至14Examples 2 to 3 and Comparative Examples 1 to 14
實施例2至3及比較例1至14是以與該實施例1相同步驟進行,不同主要在於:改變環氧樹脂組分中的各成分的用量。Examples 2 to 3 and Comparative Examples 1 to 14 were carried out in the same steps as in Example 1, with the main difference being: changing the amount of each component in the epoxy resin component.
評價項目Evaluation item
拉伸強度量測:將實施例1至3及比較例1至14的固化組成物經過真空除泡後,接著,置於模具中,然後,利用一台熱壓成型機在溫度為200℃進行30分鐘的熱壓成型處理,而獲得固化成型片,其中,在該熱壓成型處理過程中伴隨進行固化反應。將該固化成型片裁切適當大小後,利用一台萬能試驗機並依據ASTM D638的標準方法進行量測。Tensile strength measurement: the cured compositions of Examples 1 to 3 and Comparative Examples 1 to 14 were vacuum defoamed, and then placed in a mold, and then a thermocompression molding machine was used at a temperature of 200°C. A 30-minute hot press molding process is performed to obtain a cured molded sheet, wherein a curing reaction is accompanied by the hot press molding process. After cutting the cured sheet to an appropriate size, use a universal testing machine to measure it in accordance with the ASTM D638 standard method.
彎曲強度量測:將實施例1至3及比較例1至14的固化組成物經過真空除泡後,接著,置於模具中,然後,利用一台熱壓成型機在溫度為200℃進行30分鐘的熱壓成型處理,而獲得固化成型片,其中,在該熱壓成型處理過程中伴隨進行固化反應。將該固化成型片裁切適當大小後,利用一台萬能試驗機並依據ASTM D790的標準方法進行量測。Bending strength measurement: The cured compositions of Examples 1 to 3 and Comparative Examples 1 to 14 were vacuum defoamed, and then placed in a mold, and then a thermocompression molding machine was used for 30 Minutes of the hot press molding process to obtain a cured molded sheet, wherein the curing reaction is accompanied by the hot press molding process. After cutting the cured sheet to an appropriate size, use a universal testing machine to measure it according to the ASTM D790 standard method.
拉伸伸長率量測:將實施例1至3及比較例1至14的固化組成物經過真空除泡後,接著,置於模具中,然後,利用一台熱壓成型機在溫度為200℃進行30分鐘的熱壓成型處理,而獲得固化成型片,其中,在該熱壓成型處理過程中伴隨進行固化反應。將該固化成型片裁切適當大小後,利用一台萬能試驗機並依據ASTM D638的標準方法進行量測。Tensile elongation measurement: the cured compositions of Examples 1 to 3 and Comparative Examples 1 to 14 were vacuum defoamed, and then placed in a mold, and then a thermocompression molding machine was used at a temperature of 200°C A thermo-compression molding process is performed for 30 minutes to obtain a cured molded sheet, wherein a curing reaction is accompanied by the thermo-compression molding process. After cutting the cured sheet to an appropriate size, use a universal testing machine to measure it in accordance with the ASTM D638 standard method.
彎曲伸長率量測:將實施例1至3及比較例1至14的固化組成物經過真空除泡後,接著,置於模具中,然後,利用一台熱壓成型機在溫度為200℃進行30分鐘的熱壓成型處理,而獲得固化成型片,其中,在該熱壓成型處理過程中伴隨進行固化反應。將該固化成型片裁切適當大小後,利用一台萬能試驗機並依據ASTM D790的標準方法進行量測。Measurement of bending elongation: The cured compositions of Examples 1 to 3 and Comparative Examples 1 to 14 were vacuum defoamed, and then placed in a mold, and then a thermocompression molding machine was used at a temperature of 200°C. A 30-minute hot press molding process is performed to obtain a cured molded sheet, wherein a curing reaction is accompanied by the hot press molding process. After cutting the cured sheet to an appropriate size, use a universal testing machine to measure it according to the ASTM D790 standard method.
表1
表2
由表1的實施例1至3的實驗數據可知,在固化組成物中加入雙酚環氧樹脂、聚胺酯改質環氧樹脂及該異氰酸酯改質環氧樹脂,且該等成分的用量皆在本發明所述的範圍內時,由該等固化阻成物所形成的固化物具有拉伸強度在80MPa以上、彎曲強度在150MPa以上、拉伸伸長率在6%以上,而彎曲伸長率在10%以上的特性。According to the experimental data of Examples 1 to 3 in Table 1, bisphenol epoxy resin, polyurethane-modified epoxy resin and the isocyanate-modified epoxy resin are added to the curing composition, and the amounts of these components are all in this Within the range stated in the invention, the cured product formed by the curing inhibitors has a tensile strength of 80 MPa or more, a bending strength of 150 MPa or more, a tensile elongation of 6% or more, and a bending elongation of 10% The above characteristics.
反觀比較例1至14的固化組成物,由表1的比較例1至3的實驗數據可知,在固化組成物中僅加入雙酚環氧樹脂、聚胺酯改質環氧樹脂及該異氰酸酯改質環氧樹脂中任兩者,或由表2的比較例12至14的實驗數據可知,在固化組成物中僅加入雙酚環氧樹脂、聚胺酯改質環氧樹脂及該異氰酸酯改質環氧樹脂中一者,該等固化物在強度及延伸率上是無法兼具,甚至強度及延伸率皆不佳。再者,由表1的比較例4至6及表2的比較例7至11的實驗數據可知,即使在固化組成物中加入雙酚環氧樹脂、聚胺酯改質環氧樹脂及該異氰酸酯改質環氧樹脂,當該等成分的用量中至少一者皆不在本發明所述的範圍內時,該等固化物在強度及延伸率上亦是無法兼具,甚至強度及延伸率皆不佳。In contrast to the cured compositions of Comparative Examples 1 to 14, from the experimental data of Comparative Examples 1 to 3 in Table 1, it can be seen that only bisphenol epoxy resin, polyurethane modified epoxy resin and the isocyanate modified ring were added to the cured composition. It can be seen from the experimental data of Comparative Examples 12 to 14 in Table 2 that only bisphenol epoxy resin, polyurethane-modified epoxy resin and the isocyanate-modified epoxy resin are added to the cured composition. First, these cured products cannot have both strength and elongation, and even strength and elongation are not good. Furthermore, from the experimental data of Comparative Examples 4 to 6 in Table 1 and Comparative Examples 7 to 11 in Table 2, it can be seen that even if bisphenol epoxy resin, polyurethane-modified epoxy resin and the isocyanate-modified epoxy resin are added to the cured composition For epoxy resin, when at least one of these components is not within the scope of the present invention, the cured products cannot have both strength and elongation, and even the strength and elongation are not good.
綜上所述,本發明透過該環氧樹脂組分及其用量的搭配,該固化組成物能夠使該固化物及該複合材具有優異的強度及伸長率,故確實能達成本發明的目的。In summary, the present invention, through the combination of the epoxy resin component and its amount, the cured composition can make the cured product and the composite material have excellent strength and elongation, so the objective of the invention can indeed be achieved.
惟以上所述者,僅為本發明的實施例而已,當不能以此限定本發明實施的範圍,凡是依本發明申請專利範圍及專利說明書內容所作的簡單的等效變化與修飾,皆仍屬本發明專利涵蓋的範圍內。However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to Within the scope of the patent for the present invention.
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