TWI703752B - Electrically actuated light emitting device - Google Patents
Electrically actuated light emitting device Download PDFInfo
- Publication number
- TWI703752B TWI703752B TW108134637A TW108134637A TWI703752B TW I703752 B TWI703752 B TW I703752B TW 108134637 A TW108134637 A TW 108134637A TW 108134637 A TW108134637 A TW 108134637A TW I703752 B TWI703752 B TW I703752B
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- emitting
- printed circuit
- emitting element
- electroluminescent device
- Prior art date
Links
Images
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
Description
本發明係關於一種電致發光裝置,特別係關於一種設置發光元件及電路佈線於電池上的電致發光裝置。 The present invention relates to an electroluminescence device, in particular to an electroluminescence device with light-emitting elements and circuit wiring on a battery.
小型的出光體例如發光二極體(Light-Emitting Diode,LED)等的使用在市面上越趨普遍,且因其體積較小的特性,讓發光二極體經常被應用於小型的裝置,例如在手機、手電筒、液晶顯示器的背光面板或其他可攜帶式光源等。 The use of small light-emitting diodes such as Light-Emitting Diodes (LEDs) is becoming more and more common in the market, and because of their small size, light-emitting diodes are often used in small devices, such as Backlight panels of mobile phones, flashlights, LCD displays or other portable light sources, etc.
然而,發光二極體通常需由電子裝置或發光裝置的內建電源電力驅動以發出光線,且該些裝置內部除了設置發光二極體及內建電源之外,更需要配置驅動電路以使裝置所設置的發光二極體可以如預期地運作,因此如何以更精簡的結構完成電子裝置中的發光組件及/或照明設備,實為當前微型化潮流下的一大挑戰。 However, light-emitting diodes usually need to be driven by the built-in power supply of the electronic device or the light-emitting device to emit light. In addition to the light-emitting diodes and the built-in power supply inside these devices, it is necessary to configure a driving circuit to make the device The provided light-emitting diodes can operate as expected, so how to complete the light-emitting components and/or lighting equipment in the electronic device with a more streamlined structure is a major challenge under the current trend of miniaturization.
鑒於上述,本發明提供一種以滿足上述需求的電致發光裝置。 In view of the above, the present invention provides an electroluminescent device that meets the above needs.
依據本發明一實施例的一種電致發光裝置,包含:一電池,具有:一封裝體,具有一容置空間及背向該容置空間的一設置表面;以及一電池芯,設置於該容置空間,該電池芯更具有一電極組,其中該電極組由該容置空間伸出並延伸至該設置表面上;一印刷電路,設置於該設置表面上且電性連接於該電極組;以及一發光元件,設置於該設置表面上且電性連接該印刷電路。 An electroluminescent device according to an embodiment of the present invention includes: a battery having: a package body having an accommodating space and a setting surface facing away from the accommodating space; and a battery cell disposed in the container The battery cell further has an electrode group, wherein the electrode group extends from the accommodating space and extends to the setting surface; a printed circuit is provided on the setting surface and is electrically connected to the electrode group; And a light-emitting element is arranged on the installation surface and electrically connected to the printed circuit.
以上之關於本揭露內容之說明及以下之實施方式之說明係用以示範與解釋本發明之精神與原理,並且提供本發明之專利申請範圍更進一步之解釋。 The above description of the content of the disclosure and the description of the following embodiments are used to demonstrate and explain the spirit and principle of the present invention, and to provide a further explanation of the patent application scope of the present invention.
1、1’、1”:電致發光裝置 1, 1’, 1”: electroluminescent device
10:電池 10: battery
101:封裝體 101: package body
101a:容置空間 101a: housing space
101b:設置表面 101b: Setting the surface
102:電池芯 102: battery cell
102a:電極組 102a: Electrode group
20、20’、20”:印刷電路 20, 20’, 20”: printed circuit
30:發光元件 30: Light-emitting element
301:出光面 301: Glossy Surface
R:出光區域 R: Light emitting area
L1:絕緣層 L1: insulating layer
L2:反光層 L2: reflective layer
圖1係依據本發明一實施例所繪示的電致發光裝置。 FIG. 1 is an electroluminescence device according to an embodiment of the invention.
圖2A係依據本發明另一實施例所繪示的電致發光裝置的俯視圖。 2A is a top view of an electroluminescent device according to another embodiment of the invention.
圖2B係依據圖2A的實施例所繪示的封裝體結構圖。 FIG. 2B is a structural diagram of the package shown in the embodiment of FIG. 2A.
圖2C係依據本發明另一實施例所繪示的電致發光裝置的俯視圖。 2C is a top view of an electroluminescent device according to another embodiment of the invention.
以下在實施方式中詳細敘述本發明之詳細特徵以及優點,其內容足以使任何熟習相關技藝者了解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。 The detailed features and advantages of the present invention are described in detail in the following embodiments, and the content is sufficient to enable anyone familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of patent application and the drawings Anyone who is familiar with the relevant art can easily understand the related purpose and advantages of the present invention. The following examples further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.
請參考圖1,圖1係依據本發明一實施例所繪示的電致發光裝置。本實施例的電致發光裝置1包含電池10、印刷電路20及發光元件30,其中電池10更包含封裝體(Film Package)101及電池芯(Battery Core)102。
Please refer to FIG. 1, which is an electroluminescent device according to an embodiment of the present invention. The
請繼續參考圖1,封裝體101內形成一容置空間101a,且封裝體101的外側係包含一設置表面101b,而設置表面101b係背向容置空間101a的表面。所述的電池10的厚度可為不大於20mm,且厚度較佳是1mm、3mm、6mm、9mm或15mm之一。關於本實施例的封裝體101的細部實現方式,將於下方的實施例參照圖式進行更詳細的說明。
Please continue to refer to FIG. 1, an
請繼續參考圖1,所述的電池芯102係設置於容置空間101a,電池芯102具有電極組102a,且電極組102a由容置空間101a伸出
並延伸至設置表面101b上。換句話說,電極組102a由與電池芯102的連接處開始延伸,並從容置空間101a(封裝體101)伸出,且位於容置空間101a外的電極組102a的部份延伸到設置表面101b上。其中電池芯102例如是鋰離子電池芯(Lithium-Ion Battery Core)或是紙電池芯(Paper Battery Core),然本發明不以此為限。
Please continue to refer to FIG. 1, the
請繼續參考圖1,所述的印刷電路20及發光元件30係設置於設置表面101b上,且印刷電路20電性連接於電極組102a以接收由電極組102a輸出的驅動電力。其中,印刷電路20的佈線較佳為單層結構,且印刷電路20的導線較佳係直接接合於設置表面101b上。換句話說,印刷電路20的全部導線較佳皆位在同一表面(設置表面101b)上,而沒有任兩段導線形成重疊的結構。在實現單層結構的設計時,可以將需要跨線的部位設置在具有絕緣外殼的電子元件(例如電阻或電感等被動元件)處,利用此電子元件跨過導線而完成跨線結構,使全部導線仍維持在相同表面上。其中,印刷電路20可以設有一開關以控制電池芯102的供電狀況。
Please continue to refer to FIG. 1, the printed
請繼續參考圖1,所述的發光元件30係設置於設置表面101b上,且發光元件30電性連接印刷電路20以由印刷電路20致動及控制。其中要特別說明的是,圖1所繪示的發光元件30僅為示例性說明,即發光元件30可以是一或多個發光元件,其中圖1所示的發光元件30的出光面301是朝背離設置表面101b的方向。此外,多個發光元件30可以是集中或分散設置在設置表面101b上的一個或多個區塊,此外,發光元件30的設置位置可以是在電池芯102的長邊及/或短邊的位置,不以圖1所揭示的設置位置為限。所述的發光元件30較佳係發光二極體(Light-Emitting Diode,LED)、微型發光二極體(Micro LED)、有機發光二極體(Organic Light-Emitting Diode,OLED),或是其他體積較小且可以應用於手電筒等的可攜帶式光源的發光元件,然本發明不以此為限。其中,若發光元件30是微型發光二極體,則其出光面301較佳是側向設置表
面101b。
Please continue to refer to FIG. 1, the light-emitting
請一併參考圖2A至圖2C,圖2A係依據本發明另一實施例所繪示的電致發光裝置的俯視圖;圖2B係依據圖2A的實施例所繪示的封裝體結構圖;圖2C係依據本發明另一實施例所繪示的電致發光裝置的俯視圖。圖2A揭示的電致發光裝置1’相似於圖1所揭示的電致發光裝置1。惟不同處在於,圖2A的電致發光裝置1’的設置表面101b更具有出光區域R。其中,依據本發明的一或多個實施例所示出的出光區域R的形狀為矩形,然本發明的出光區域R的形態(例如,形狀或尺寸等)不以此為限。
Please refer to FIGS. 2A to 2C together. FIG. 2A is a top view of an electroluminescent device according to another embodiment of the present invention; FIG. 2B is a structure diagram of a package according to the embodiment of FIG. 2A; 2C is a top view of an electroluminescent device according to another embodiment of the invention. The electroluminescent device 1'disclosed in FIG. 2A is similar to the
於圖2A的實施例中,發光元件30係設置於出光區域R內,且發光元件30的出光面301對應出光區域R,以由出光區域R有效均勻地導出發光元件30發出的光,並且藉由將發光元件30設置於出光區域R內,以更有效地利用(反射)發光元件30出射的光線。其中,出光區域R中可包含折射、反射或導光結構,以使發光元件30的出光面所發出的光線可由出光區域R的整個佈設範圍均勻地朝遠離該封裝體101的方向出射,所述的導光結構可以是以導光板實現。舉例而言,當所述的導光結構是以導光板實現時,發光元件30的出光面301面較佳是朝向導光板。由發光元件30的出光面301出射的光,會入射到出光區域R的導光板的側邊(垂直於設置表面101b的一邊),並藉由導光板的結構破壞光的全反射,以將光線由出光區域R射出。
In the embodiment of FIG. 2A, the light-emitting
請繼續參考圖2A及2B,更詳細而言,封裝體101可以具有絕緣層L1以及反光層L2,其中絕緣層L1為透明的絕緣層,而反光層L2則可以反射由發光元件30發出的光線,以使反射後的光線反射於設置表面101b,並且朝向遠離設置表面101b的方向射出,且反光層L2係設置於絕緣層L1及電池芯102之間。此外,反光層L2的設置區域至少涵蓋出光區域R的設置區域。絕緣層L1的一面(背向反光層L2的一側)為設置表面101b,因此縱使設置印刷電路20’及反光層L2在設置表面101b上的投
影具有重疊時,仍可藉由絕緣層L1使設置表面101b上的印刷電路20’與反光層L2彼此電性隔絕。
Please continue to refer to FIGS. 2A and 2B. In more detail, the
請繼續參考圖2B,其中所述的絕緣層L1較佳係耐熱的樹脂薄膜,例如是以尼龍(Polyamide,PA)、聚醯亞胺(Polyimide,PI)、聚對酞酸乙二酯(Polyethylene Terephthalate,PET)或聚醚醚酮(Polyetheretherketone,PEEK)等的其中一種或兩者以上實現。並且,絕緣層L1可以包含加強板(Stiffener)以避免將印刷電路20’/20設置到設置表面101b上時,導致封裝體101受損。此外,絕緣層L1可以加入具有高導熱係數的導熱材料,以及/或在絕緣層L1增加可以增益熱輻射的導熱結構,以避免在設置印刷電路20/20’於設置表面101b上時導致電池芯102承受高溫而受損,然本發明不以此為限。
Please continue to refer to FIG. 2B, where the insulating layer L1 is preferably a heat-resistant resin film, such as nylon (Polyamide, PA), polyimide (PI), polyethylene terephthalate (Polyethylene terephthalate) One or more of Terephthalate (PET) or Polyetheretherketone (PEEK) etc. are realized. In addition, the insulating layer L1 may include a stiffener to avoid damage to the
而所述的反光層L2,在可見光區間其反光功能較佳係以鋁及/或其合金實現;對於出光的波段,反光層L2內具有高反射率的物質,可以是以鎳、金、鉑、銀或含有任何上述金屬的合金或用表面結構實現,然本發明不以此為限。 And the reflective layer L2, in the visible light range, its reflective function is preferably realized by aluminum and/or its alloy; for the light emission wavelength band, the reflective layer L2 has high reflectivity substances, which can be nickel, gold, platinum , Silver or alloys containing any of the above metals or realized by surface structure, but the present invention is not limited to this.
請繼續參考圖2A及2B,並一併參考圖1,圖1所揭示的封裝體101至少包含絕緣層L1;而圖2A所揭示的封裝體101至少包含絕緣層L1,較佳係更包含反光層L2。
Please continue to refer to FIGS. 2A and 2B, and also refer to FIG. 1. The
請參考圖2C,其所揭示的電致發光裝置1”相似於圖2A所揭示的電致發光裝置1’,且圖2C的封裝體101亦可以藉由上述的圖2B的方式實現。惟不同處在於,圖2C的發光元件30係設置於出光區域R外,且印刷電路20’與出光區域R彼此相間隔,故由圖2C所揭示的電致發光裝置1”的出光區域R所出射的光可以更為均勻。
Please refer to FIG. 2C, the
藉由上述內容,本發明的一或多個實施例所提出之電致發光裝置可以將印刷電路及發光元件設置於同個表面上,以在不增加或是降低電子裝置及/或照明設備的前提下,仍能於其內部裝設運作所需的電池、印刷電 路及發光元件等。此外,依據本發明的一或多個實施例,更可以調整發光元件的設置位置,以再進一步降低電致發光裝置的整體體積,或是使反射出的光線更均勻。 Based on the above content, the electroluminescent device proposed by one or more embodiments of the present invention can arrange the printed circuit and the light-emitting element on the same surface, so as not to increase or decrease the electronic device and/or lighting equipment. Under the premise, it can still install the batteries and printed circuit Road and light-emitting elements, etc. In addition, according to one or more embodiments of the present invention, the position of the light-emitting element can be adjusted to further reduce the overall volume of the electroluminescent device or to make the reflected light more uniform.
雖然本發明以前述之實施例揭露如上,然其並非用以限定本發明。在不脫離本發明之精神和範圍內,所為之更動與潤飾,均屬本發明之專利保護範圍。關於本發明所界定之保護範圍請參考所附之申請專利範圍。 Although the present invention is disclosed in the foregoing embodiments, it is not intended to limit the present invention. All changes and modifications made without departing from the spirit and scope of the present invention fall within the scope of patent protection of the present invention. For the scope of protection defined by the present invention, please refer to the attached patent scope.
1:電致發光裝置 1: Electroluminescent device
10:電池 10: battery
20:印刷電路 20: printed circuit
30:發光元件 30: Light-emitting element
101:封裝體 101: package body
101a:容置空間 101a: housing space
101b:設置表面 101b: Setting the surface
102:電池芯 102: battery cell
102a:電極組 102a: Electrode group
301:出光面 301: Glossy Surface
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108134637A TWI703752B (en) | 2019-09-25 | 2019-09-25 | Electrically actuated light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108134637A TWI703752B (en) | 2019-09-25 | 2019-09-25 | Electrically actuated light emitting device |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI703752B true TWI703752B (en) | 2020-09-01 |
TW202114266A TW202114266A (en) | 2021-04-01 |
Family
ID=73644079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108134637A TWI703752B (en) | 2019-09-25 | 2019-09-25 | Electrically actuated light emitting device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI703752B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1206749C (en) * | 2002-01-21 | 2005-06-15 | 诠兴开发科技股份有限公司 | Method for package of high power LED |
CN2873923Y (en) * | 2006-02-24 | 2007-02-28 | 武汉日新科技有限公司 | Solar energy generation and light emitting tile |
CN203746366U (en) * | 2013-09-22 | 2014-07-30 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | LED display screen |
WO2015180391A1 (en) * | 2014-05-30 | 2015-12-03 | 浙江明磊工具实业有限公司 | Battery pack charging/discharging system and method for electric tool, and electric tool |
CN109643767A (en) * | 2016-08-26 | 2019-04-16 | 株式会社村田制作所 | Battery and electronic equipment |
-
2019
- 2019-09-25 TW TW108134637A patent/TWI703752B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1206749C (en) * | 2002-01-21 | 2005-06-15 | 诠兴开发科技股份有限公司 | Method for package of high power LED |
CN2873923Y (en) * | 2006-02-24 | 2007-02-28 | 武汉日新科技有限公司 | Solar energy generation and light emitting tile |
CN203746366U (en) * | 2013-09-22 | 2014-07-30 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | LED display screen |
WO2015180391A1 (en) * | 2014-05-30 | 2015-12-03 | 浙江明磊工具实业有限公司 | Battery pack charging/discharging system and method for electric tool, and electric tool |
CN109643767A (en) * | 2016-08-26 | 2019-04-16 | 株式会社村田制作所 | Battery and electronic equipment |
Also Published As
Publication number | Publication date |
---|---|
TW202114266A (en) | 2021-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7538340B2 (en) | Low side emitting light source and method of making the same | |
JP6058351B2 (en) | LIGHT SOURCE MODULE AND LIGHTING DEVICE HAVING THE SAME | |
US9029878B2 (en) | Lighting device | |
US7682053B2 (en) | Light-emitting device with a long lifespan | |
JP2007073968A (en) | Thin light source using flexible circuit support | |
US8368110B2 (en) | Side view LED package structure | |
JP2011014535A (en) | Lighting system | |
US9964287B2 (en) | LED support, LED and backlight module | |
US20140328082A1 (en) | Lighting panel | |
CN100388092C (en) | Heat radiation structure of backlight module | |
JP2012203997A5 (en) | ||
KR101255671B1 (en) | Led package module and manufacturing method thereof | |
KR20110129273A (en) | Led light source module and illuminating device having the same | |
JP4600668B2 (en) | Surface lighting device | |
JP5685863B2 (en) | Light source device | |
JP5685865B2 (en) | Light source device | |
KR101734539B1 (en) | Light emitting device, method for fabricating the light emitting device, lighting unit comprising the light emitting device, and lighting device | |
TWI703752B (en) | Electrically actuated light emitting device | |
KR20120080366A (en) | Light-emitting module, method of manufacturing the same and display apparatus havng the same and | |
JP5685862B2 (en) | Light source device | |
US8581278B2 (en) | Light-emitting diode packaging structure | |
KR102110477B1 (en) | Light emitting device and lighting system having the same | |
KR102101367B1 (en) | Light emitting device | |
KR20130073471A (en) | Printed-circuit board and back light unit including the same | |
KR101916037B1 (en) | Light emitting module and light emitting apparatus having thereof |