TWI702192B - Bend-breaking method and bend-breaking apparatus - Google Patents
Bend-breaking method and bend-breaking apparatus Download PDFInfo
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- TWI702192B TWI702192B TW106132067A TW106132067A TWI702192B TW I702192 B TWI702192 B TW I702192B TW 106132067 A TW106132067 A TW 106132067A TW 106132067 A TW106132067 A TW 106132067A TW I702192 B TWI702192 B TW I702192B
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Abstract
折斷分斷裝置1具備:噴霧出口15,其向玻璃板3之預定折斷分斷之切割線2區域噴霧、吹附由超音波霧產生裝置17產生之霧;噴霧抽吸口18,其抽吸回收經噴霧、吹附至切割線2區域之霧。The breaking and breaking device 1 is provided with a spray outlet 15 which sprays and blows the mist generated by the ultrasonic mist generating device 17 to the area of the cutting line 2 where the glass plate 3 is scheduled to be broken and broken; and the spray suction port 18, which sucks Recover the mist sprayed and blown onto the cutting line 2 area.
Description
本發明係關於一種玻璃板、玻璃基板、碳化矽基板及矽基板等脆性材料板之折斷分斷方法及折斷分斷裝置。 本發明又關於一種接受於前步驟中形成切割線之玻璃板、玻璃基板、碳化矽基板及矽基板等脆性材料板之搬入,並沿切割線折斷分斷脆性材料板之方法及折斷分斷裝置。The invention relates to a method and device for breaking and breaking brittle material plates such as glass plates, glass substrates, silicon carbide substrates and silicon substrates. The present invention also relates to a method and device for receiving brittle material plates such as glass plates, glass substrates, silicon carbide substrates, and silicon substrates forming cutting lines in the previous step, and breaking and breaking the brittle material plates along the cutting lines .
於生產包含脆性材料板之製品之方法中,一般係將形成有切割線之脆性材料板於切割線之下方以支點支持之狀態,自上部按壓切割線外域,沿切割線折斷、分離之方法。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利第4449084號公報In the method of producing a product containing a fragile material plate, the fragile material plate formed with a cutting line is generally supported by a fulcrum below the cutting line, and the outer area of the cutting line is pressed from the top to break and separate along the cutting line. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent No. 4449084
[發明所欲解決之問題] 然而,於如此之以往之折斷、分斷方法中,於彎折斷裂時產生微細片玻璃屑,產生之微細片玻璃屑飛散,該飛散之微細片玻璃屑附著於脆性材料板之表面,該附著之微細片玻璃屑有對其後之步驟造成缺陷之虞。 本發明係鑑於此等觀點而完成者,其目的在於提供一種防止於劃線後之分斷時產生而飛散於玻璃表面且附著於玻璃板之微細片玻璃屑之該飛散的折斷分斷方法及折斷分斷裝置。 [解決問題之技術手段] 本發明之折斷分斷方法係將由超音波產生機產生之霧(微細液滴)噴霧至脆性材料板之切割線區域,且一邊對切割線區域吹送該霧,一邊進行脆性材料板於切割線之折斷分斷。 又,本發明之折斷分斷方法係將由超音波產生機產生之霧(微細液滴)噴霧並吹附至脆性材料板之切割線區域,且一邊將吹送之霧抽吸回收一邊進行脆性材料板於切割線之折斷分斷。 本發明之折斷分斷裝置具備:噴霧出口,其向脆性材料板之預定折斷分斷之切割線區域噴出、吹附由超音波產生裝置產生之霧(微細液滴);噴霧抽吸口,其抽吸回收經噴霧、吹附至切割線區域之霧。 [發明之效果] 根據本發明,因藉由超音波產生裝置產生噴出之噴霧,使預定折斷分斷之切割線區域成濕潤(wet)狀態並覆蓋,故防止折斷分斷中產生之微細片玻璃屑飛散,且由於產生之微細片玻璃屑與霧一同被回收,故可防止對脆性材料板表面之附著。[Problem to be solved by the invention] However, in such conventional breaking and breaking methods, fine glass chips are generated during bending and fracture, and the generated fine glass chips scatter, and the scattered fine glass chips adhere to On the surface of the brittle material board, the attached fine glass chips may cause defects in subsequent steps. The present invention was made in view of these viewpoints, and its object is to provide a method for breaking and breaking fine pieces of glass chips that are scattered on the glass surface and adhered to the glass plate during breaking after scribing, and Break off the breaking device. [Technical Means to Solve the Problem] The breaking and breaking method of the present invention sprays the mist (fine droplets) generated by the ultrasonic generator to the cutting line area of the brittle material plate, and blows the mist to the cutting line area while performing The brittle material board is broken at the cutting line. In addition, the breaking and breaking method of the present invention sprays the mist (fine droplets) generated by the ultrasonic generator and blows it to the cutting line area of the fragile material plate, and performs the fragile material plate while sucking and recovering the blown mist. Break off at the cutting line. The breaking and breaking device of the present invention is provided with: a spray outlet that sprays and blows the mist (fine droplets) generated by the ultrasonic wave generator to the cut line area of the brittle material plate that is scheduled to be broken and broken; the spray suction port, which Suction and recover the mist that is sprayed and blown onto the cutting line area. [Effects of the Invention] According to the present invention, since the sprayed spray generated by the ultrasonic generating device makes the area of the cutting line scheduled to be broken and divided into a wet state and covered, it is prevented from breaking and breaking the fine glass sheet The chips are scattered, and the fine glass chips produced are recovered together with the mist, so it can prevent adhesion to the surface of the brittle material board.
於圖1及圖2中,本發明之一實施例之折斷分斷裝置1具備:輸送帶裝置4,其水平地支持作為於上表面形成有切割線2之脆性材料板之玻璃板3,並沿搬送方向A進行直線搬送;折斷裝置5,其與玻璃板3之搬送方向A平行地設置。 於本例中,切割線2自搬送方向A之玻璃板3之一邊緣直線延伸至搬送方向A之玻璃板3之另一邊緣而形成於玻璃板3之上表面。 將玻璃板3水平地支持並沿搬送方向A直線搬送之輸送帶裝置4具備:複數條環狀帶6,其水平地支持玻璃板3,藉由繞行而沿搬送方向A直線搬送該玻璃板3;驅動裝置7,其使環狀帶6繞行;且各環狀帶6以自如地繞行之方式水平地架設支持於複數個支持體8之各者。 於輸送帶裝置4之一側區域9中沿輸送帶裝置4設置之折斷裝置5具備:支撐桿10,其自下方支持自搬送方向A之玻璃板3之一邊緣至搬送方向A之玻璃板3之另一邊緣之玻璃板3之切割線2;噴霧裝置11,其於支撐桿10之上方,平行於支撐桿10而設置;噴霧抽吸裝置12,其鄰設於噴霧裝置11並平行於噴霧裝置11而設置;折斷桿14,其平行於支持桿10而設置,且於支持桿10之外側區域13中,相對於支持桿10及玻璃板3設置於上方區域。 噴霧裝置11具備:噴霧出口體16,其將使霧(微細液滴)向下方噴出之噴霧出口15備設於下端;複數個超音波霧產生裝置17,其連接於霧噴出口體16。 噴霧裝置11係於霧噴出口體16中經由托架32安裝於架設框架31。 於玻璃板3之上方之必要高度位置配置且遍及搬送方向A之切割線2之全長開口之噴霧出口15,係朝向支持桿10且沿支持桿10而開口。 噴霧抽吸裝置12具備:霧抽吸口體19,其於下端具備遍及搬送方向A之切割線2之全長而開口之噴霧抽吸口18;集塵裝置21,其經由複數個導管20連接於霧抽吸口體19;且噴霧抽吸口18與霧噴出口15平行而並設。 又,噴霧抽吸口18亦朝向玻璃板3之上表面,且遍及支持桿10之全長開口,換言之,遍及切割線2之全長而開口。 噴霧抽吸裝置12係於霧抽吸口體19中藉由托架32安裝於架設框架31。 支持桿10經由升降裝置22安裝於基台框架23,藉由升降裝置22之動作進行升降動作。若搬送來之玻璃板3到達折斷區域,定位並停止,支持桿10便藉由升降裝置22之動作而上升,且自下方支持玻璃板3之預定折斷之切割線2之位置。 又,折斷桿14亦經由升降裝置24安裝於經架設於輸送帶裝置4上方之框架25,藉由升降裝置24之動作進行升降動作。若搬送來之玻璃板3到達折斷區域,定位並停止,則折斷桿14便藉由升降裝置24之動作下降,且因該下降而向下方按壓玻璃板3,以支持桿10為支點,按壓折彎玻璃板3使玻璃板3自切割線2折斷分斷。 於折斷裝置5之下方,設置有斜接收台28,其接收經折斷分斷之玻璃屑26,並引導玻璃屑26斜向滑落;集料箱27,其接收斜接收台28之玻璃屑26。 於折斷分斷裝置1中,將預先於上表面形成有預定折斷分斷之切割線2之玻璃板3,以使該切割線2位於輸送帶裝置4之側區域並平行於搬送方向A且對準折斷裝置5之支持桿10之姿勢,搬入輸送帶裝置4,並以輸送帶裝置4之動作將此姿勢之玻璃板3朝搬送方向搬送,搬送後,使玻璃板3於折斷裝置5區域定位並停止。玻璃板3定位並停止時,支持桿10上升、停止,上升、停止後之支持桿10沿切割線2支持玻璃板3之切割線2之下方。同時,藉由超音波霧產生裝置17產生之霧,經由噴霧出口15自上方向切割線2區域之玻璃板3噴霧。 切割線2區域之玻璃板3藉由噴霧而成為濕潤狀態,且切割線2區域成為被噴霧覆蓋之狀態,於該狀態中,折斷桿14下降,下降後之折斷桿14將支持切割線2下方之支持桿10作為支點,按壓折彎玻璃板3,並於切割線2折斷分斷。 與藉由折斷分斷產生之玻璃屑26一起產生之微細片玻璃屑,藉由濕潤膜與噴霧之覆蓋而被抑制向周圍飛散,混合於噴霧中之微細片玻璃屑與該噴霧一起被抽吸至噴霧吸引口18,通過噴霧吸引口體19、導管20被回收至集塵裝置21而去除之結果,可防止微細片玻璃屑附著於成為完成折斷後製品之玻璃板3。In FIGS. 1 and 2, a breaking and breaking
1‧‧‧折斷分斷裝置2‧‧‧切割線3‧‧‧玻璃板4‧‧‧輸送帶裝置5‧‧‧折斷裝置6‧‧‧複數條環狀帶8‧‧‧支持體9‧‧‧側區域10‧‧‧支撐桿11‧‧‧噴霧裝置12‧‧‧噴霧抽吸裝置13‧‧‧外側區域14‧‧‧折斷桿15‧‧‧噴霧出口16‧‧‧噴霧出口體17‧‧‧超音波霧產生裝置18‧‧‧噴霧抽吸口19‧‧‧霧抽吸口體20‧‧‧導管21‧‧‧集塵裝置22‧‧‧升降裝置23‧‧‧基台框架24‧‧‧升降裝置25‧‧‧框架26‧‧‧玻璃屑27‧‧‧集料箱28‧‧‧斜接收台31‧‧‧架設框架32‧‧‧托架A‧‧‧方向I‧‧‧線1‧‧‧Break and
圖1係本發明之玻璃板之折斷分斷方法及折斷分斷裝置之一實施例之說明圖,圖2之I-I線箭頭所視剖面說明圖。 圖2係圖1所示之一實施例之俯視圖。Fig. 1 is an explanatory diagram of an embodiment of the glass plate breaking and breaking method and breaking and breaking device of the present invention, and Fig. 2 is a cross-sectional explanatory diagram as viewed by the arrow on the line I-I. FIG. 2 is a top view of an embodiment shown in FIG. 1. FIG.
1‧‧‧折斷分斷裝置 1‧‧‧Break off device
2‧‧‧切割線 2‧‧‧Cutting line
3‧‧‧玻璃板 3‧‧‧Glass plate
4‧‧‧輸送帶裝置 4‧‧‧Conveyor belt device
5‧‧‧折斷裝置 5‧‧‧Break device
6‧‧‧環狀帶 6‧‧‧Annular belt
8‧‧‧支持體 8‧‧‧Support
9‧‧‧側區域 9‧‧‧Side area
10‧‧‧支撐桿 10‧‧‧Support Rod
11‧‧‧噴霧裝置 11‧‧‧Spray device
12‧‧‧噴霧抽吸裝置 12‧‧‧Spray suction device
13‧‧‧外側區域 13‧‧‧Outer area
14‧‧‧折斷桿 14‧‧‧Break bar
15‧‧‧噴霧出口 15‧‧‧Spray outlet
16‧‧‧噴霧出口體 16‧‧‧Spray outlet body
17‧‧‧超音波霧產生裝置 17‧‧‧Ultrasonic fog generator
18‧‧‧噴霧抽吸口 18‧‧‧Spray suction port
19‧‧‧霧抽吸口體 19‧‧‧Mist suction mouth
20‧‧‧導管 20‧‧‧Conduit
21‧‧‧集塵裝置 21‧‧‧Dust collection device
22‧‧‧升降裝置 22‧‧‧Lifting device
23‧‧‧基台框架 23‧‧‧Abutment frame
24‧‧‧升降裝置 24‧‧‧Lifting device
25‧‧‧框架 25‧‧‧Frame
26‧‧‧玻璃屑 26‧‧‧Glass shavings
27‧‧‧集料箱 27‧‧‧Collection box
28‧‧‧斜接收台 28‧‧‧Slanted receiving station
31‧‧‧架設框架 31‧‧‧Erection frame
32‧‧‧托架 32‧‧‧Bracket
Claims (4)
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JP??2016-193366 | 2016-09-30 | ||
JP2016193366 | 2016-09-30 | ||
JP2017176803A JP2018058353A (en) | 2016-09-30 | 2017-09-14 | Breaking and splitting method, and breaking and dividing apparatus |
JP??2017-176803 | 2017-09-14 |
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TW201815703A TW201815703A (en) | 2018-05-01 |
TWI702192B true TWI702192B (en) | 2020-08-21 |
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TW106132067A TWI702192B (en) | 2016-09-30 | 2017-09-19 | Bend-breaking method and bend-breaking apparatus |
TW108122011A TW201936528A (en) | 2016-09-30 | 2017-09-19 | Bend-breaking method and bend-breaking apparatus |
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TW (2) | TWI702192B (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200704605A (en) * | 2005-04-29 | 2007-02-01 | Corning Inc | Process and apparatus for scoring a brittle material incorporating moving optical assembly |
TW201408608A (en) * | 2012-07-27 | 2014-03-01 | Nippon Electric Glass Co | Glass plate, manufacturing method and manufacturing device of the same |
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JP2002126891A (en) * | 2000-10-25 | 2002-05-08 | Ricoh Microelectronics Co Ltd | Laser beam machining method and laser beam device |
JP2006089325A (en) * | 2004-09-22 | 2006-04-06 | Pioneer Electronic Corp | Method and apparatus for cutting glass plate and method and apparatus for manufacturing plasma display panel |
JP2007308334A (en) * | 2006-05-18 | 2007-11-29 | Sharp Corp | Method and apparatus for manufacturing liquid crystal display panel |
JP5414983B2 (en) * | 2007-10-19 | 2014-02-12 | 株式会社ジャパンディスプレイセントラル | Manufacturing method of liquid crystal display device and glass substrate cutting device |
JP5376282B2 (en) * | 2008-03-25 | 2013-12-25 | 日本電気硝子株式会社 | Glass plate folding method and glass plate folding device |
JP3144719U (en) * | 2008-06-27 | 2008-09-11 | 第一カッター興業株式会社 | Wall saw |
CN201241007Y (en) * | 2008-07-25 | 2009-05-20 | 华映视讯(吴江)有限公司 | Glass cutting machine |
JP4960405B2 (en) * | 2009-04-28 | 2012-06-27 | 川崎重工業株式会社 | Sheet material cutting unit |
JP5161926B2 (en) * | 2010-07-05 | 2013-03-13 | 三星ダイヤモンド工業株式会社 | Cutting device |
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- 2017-09-14 JP JP2017176803A patent/JP2018058353A/en active Pending
- 2017-09-19 TW TW106132067A patent/TWI702192B/en not_active IP Right Cessation
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200704605A (en) * | 2005-04-29 | 2007-02-01 | Corning Inc | Process and apparatus for scoring a brittle material incorporating moving optical assembly |
TW201408608A (en) * | 2012-07-27 | 2014-03-01 | Nippon Electric Glass Co | Glass plate, manufacturing method and manufacturing device of the same |
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JP2018058353A (en) | 2018-04-12 |
TW201815703A (en) | 2018-05-01 |
TW201936528A (en) | 2019-09-16 |
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