TWI699086B - Micro-electromechanical system pump module - Google Patents

Abstract

A micro-electromechanical system pump module is disclosed and comprises a micro-electromechanical system chip, at least one signal electrode, a plurality of micro-electromechanical system pumps, a plurality of switch units and a plurality of control electrodes. The micro-electromechanical system chip comprises a rectangular main body, and the main body comprises a long side and a short side. The at least one signal electrode is disposed on the main body and adjacent to the short side. Each of the plural micro-electromechanical system pumps comprises a first electrode and a second electrode, and the second electrode is electronically coupled with the at least one signal electrode. The plural switch units are electronically coupled with the plural first electrodes of the plural micro-electromechanical system pumps. The plural control electrodes are disposed on the main body and adjacent to the long side, the plural control electrodes are and electronically coupled with the plural switch units, respectively. Wherein, the at least one signal electrode receives a modulated voltage and provides the modulated voltage to the second electrodes of the plural micro-electromechanical system pumps, and the plural switch units control the plural micro-electromechanical system pumps to be switched on or off.

Description

MEMS Pump Module

This case is about a micro-electromechanical pump module, especially one that uses signal electrodes to reduce the contacts of the microprocessor, and then uses a switch unit to control the microelectromechanical pump, thereby simplifying the contacts and wiring of the microelectromechanical pump.

With the rapid development of science and technology, the applications of fluid delivery devices have become more and more diversified. For example, industrial applications, biomedical applications, medical care, electronic heat dissipation, etc., and even recent popular wearable devices can be seen in its traces, and can be seen in tradition. The pump has gradually become a trend toward miniaturization of the device, but the traditional pump is difficult to reduce the size to the millimeter level, so the current micro fluid delivery device can only use the piezoelectric pump structure as a micro fluid delivery device.

Although the MEMS pump can miniaturize the pump volume to the micron level, the micro-level MEMS pump will limit the fluid transfer due to its small size, so multiple MEMS pumps are required to be used together. Please refer to As shown in Figure 1, at present, each MEMS pump is controlled separately through a high-end microprocessor 1, but the high-end microprocessor 1 itself is expensive, and each MEMS pump 2 must be connected to a high-end microprocessor The two microprocessor pins 11 of 1 are connected, and the high-end microprocessor 1 controls each micro-electromechanical pump 2 separately to achieve precise control. However, this will greatly increase the cost of the high-end microprocessor 1, resulting in The high cost of the MEMS pump module will also increase the difficulty of packaging and wiring, making it difficult to popularize. Therefore, how to reduce the cost of the MEMS pump module is the first difficulty that the current MEMS pump can overcome.

The main purpose of this case is to provide a micro-electro-mechanical pump module that transmits the modulated voltage for driving the micro-electro-mechanical pump through a signal electrode, and then controls the opening and closing actions of the micro-electro-mechanical pump through a switch unit, so as to reduce the contact points of the microprocessor and reduce The contacts and wiring of the MEMS pump module further simplify the MEMS pump module.

To achieve the above objective, the broader implementation aspect of this case is to provide a MEMS pump module, which includes: a MEMS chip with a chip and a rectangle with a long side and a short side; at least one signal electrode, Are arranged on the chip body and adjacent to the short side; a plurality of microelectromechanical pumps all have a first electrode and a second electrode, the second electrode is electrically connected to the at least one signal electrode; a plurality of switch units are electrically connected to the plurality of The first electrode of a microelectromechanical pump; and a plurality of control electrodes, which are arranged on the chip body and adjacent to the long side and electrically connected to the plurality of switch units; wherein the at least one signal electrode receives a modulated voltage to transmit To the second electrode of the plurality of microelectromechanical pumps, the plurality of switch units control the opening and closing actions of the plurality of microelectromechanical pumps.

100: MEMS pump module

1: High-end microprocessor

11: Microprocessor pin

2: MEMS pump

3: MEMS chip

31: chip body

31a: Long side

31b: short side

4: Signal electrode

4a: The first signal electrode

4b: The second signal electrode

4c: The third signal electrode

4d: Fourth signal electrode

5: MEMS pump

51: first electrode

52: second electrode

53: Piezoelectric

5A: The first MEMS pump group

5B: The second MEMS pump group

5C: The third MEMS pump group

5D: The fourth MEMS pump group

5E: The first MEMS actuation area

5F: The second MEMS actuation area

5G: The third MEMS actuation area

5H: The fourth MEMS actuation area

6: Switch unit

61: The first switch unit

62: The second switch unit

63: The third switch unit

64: The fourth switch unit

7: Control electrode

8: Microprocessor

81: pin

G: Gate

D: Dip pole

S: source

Figure 1 is a schematic diagram of a MEMS pump module in the prior art.

Figure 2 is a schematic diagram of the first embodiment of the microelectromechanical pump module of the present invention.

Figure 3 is a schematic diagram of the second embodiment of the micro-electromechanical pump module in this case.

Figure 4 is a schematic diagram of the third embodiment of the micro-electromechanical pump module of the present invention.

Figure 5 is a schematic diagram of the fourth embodiment of the microelectromechanical pump module of the present invention.

Figure 6 is a schematic diagram of the fifth embodiment of the micro-electromechanical pump module of the present invention.

Figure 7 is a schematic diagram of the sixth embodiment of the micro-electromechanical pump module in this case.

Figure 8 is a schematic diagram of the seventh embodiment of the micro-electromechanical pump module of the present invention.

Figure 9 is a schematic diagram of the eighth embodiment of the micro-electromechanical pump module in this case.

Figure 10A is a schematic diagram of the switch unit of the MEMS pump connected to the MEMS pump.

Figure 10B is a schematic diagram of another embodiment of the micro-electro-mechanical pump's switch unit connected to the micro-electro-mechanical pump.

Some typical embodiments embodying the features and advantages of this case will be described in detail in the following description. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of the case, and the descriptions and diagrams therein are essentially for illustrative purposes rather than limiting the case.

Please refer to Figure 2. Figure 2 is a schematic diagram of the first embodiment of the MEMS pump module in this case. The MEMS pump module 100 includes: a MEMS chip 3, at least one signal electrode 4, a plurality of MEMS pumps 5, a plurality of switch units 6 and a plurality of control electrodes 7. The MEMS chip 3 has a chip body 31, and the chip The body 31 is a rectangle with a long side 31a and a short side 31b. The signal electrode 4 is arranged on the chip body 31 and adjacent to the short side 31b. The microelectromechanical pumps 5 are all arranged on the chip body 31. Each microelectromechanical pump 5 has a The first electrode 51, a second electrode 52, and a piezoelectric element 53, the second electrode 52 of each MEMS pump 5 is electrically connected to the signal electrode 4, and the piezoelectric element 53 of the MEMS pump 5 is deformed by the piezoelectric effect , Change the internal pressure of the MEMS pump 5, and then draw fluid to achieve the effect of transferring fluid. One end of the switch unit 6 is connected to the first electrode 51 of the MEMS pump 5, and the other end is connected to the control electrode 7. The control electrode 7 is also arranged on the chip The main body 31 is adjacent to the long side 31a. The signal electrode 4 receives a modulated voltage from a microprocessor 8 and transmits it to the second electrode 52 of the microelectromechanical pump 5. The modulated voltage is ±1.8, ±3.3, and ±3.6 , ±5 volts square wave, in addition, the waveform of the modulated voltage can also be sine wave, triangle wave AC voltage, but not limited to this, the switch unit 6 receives the control signal of the microprocessor 8 through the control electrode 7 to turn on Or closed, used to further control the opening and closing of the MEMS pump 5 connected to it. When the switch list When the element 6 is closed, the first electrode 51 of the microelectromechanical pump 5 connected to it will be disconnected, so that the microelectromechanical pump 5 stops operating. In addition, when the switch unit 6 is turned on, the first electrode 51 of the microelectromechanical pump 5 connected to it will be disconnected. It will be regarded as grounding. At this time, the modulated voltage received by the second electrode 52 is used to drive the piezoelectric element 53 in the MEMS pump 5. In addition, in the first embodiment of the present application, the number of at least one signal electrode 4 includes a first signal electrode 4a, the number of signal electrode 4 in this embodiment is one, and the second electrode 52 of all MEMS pumps 5 is electrically connected. It is connected to the first signal electrode 4a, and the modulated voltage is transferred from the first signal electrode 4a to the second electrode 52 of each microelectromechanical pump 5.

Please refer to Figure 3. Figure 3 is a schematic diagram of the second embodiment of the MEMS pump module. At least one signal electrode 4 includes a first signal electrode 4a and a second signal electrode 4b. The electromechanical pump 5 is divided into a first microelectromechanical pump group 5A and a second microelectromechanical pump group 5B according to location. The microelectromechanical pump 5 located in the first microelectromechanical pump group 5A has a second electrode 52 that is electrically powered. Connected to the first signal electrode 4a, and the second electrode 52 of the microelectromechanical pump 5 in the second microelectromechanical pump group 5B is electrically connected to the second signal electrode 4b to achieve the effect of zone control. In this embodiment The number of signal electrodes 4 is two.

Please refer to Figure 4. Figure 4 is a schematic diagram of the third embodiment of the MEMS pump module. The third embodiment and the second embodiment have two signal electrodes 4, so the signal electrode 4 has a first The signal electrode 4a and the second signal electrode 4b, the first signal electrode 4a and the second signal electrode 4b are separately arranged at two ends (such as the upper and lower ends) of the chip body 31, and the first signal electrode 4a and the second signal electrode 4b The second electrodes 52 of the aforementioned plurality of MEMS pumps 5 are electrically connected to the first signal electrode 4a and the second signal electrode 4b at both ends. The third embodiment can reduce the distance from the second electrode 52 of the MEMS pump 5 The impedance between the signal electrode 4 and the signal electrode 4 reduces the power loss of the second electrode 52 which is far from the signal electrode 4 during transmission.

Please refer to Figure 5. Figure 5 is a schematic diagram of the fourth embodiment of the micro-electromechanical pump module of the present invention. At least one signal electrode 4 includes a first signal electrode 4a, a second signal electrode 4b, and a third signal electrode. The signal electrode 4c and a fourth signal electrode 4d. The first signal electrode 4a and the third signal electrode 4c are arranged on one end (such as the upper end) of the chip body 31 at intervals, and the second signal electrode 4b and the fourth signal electrode 4d are arranged on the chip at intervals The other end of the main body 31 (the lower end), and in this embodiment, the aforementioned plurality of MEMS pumps 5 are divided into a first MEMS pump group 5A, a second MEMS pump group 5B, and a third The MEMS pump group 5C and the fourth MEMS pump group 5D. The first MEMS pump group 5A is composed of the MEMS pump 5 adjacent to the first signal electrode 4a. The first signal electrode 4a is for the first MEMS pump. The second electrodes 52 of all the microelectromechanical pumps 5 in the pump group 5A are electrically connected; the second microelectromechanical pump group 5B is composed of the microelectromechanical pumps 5 adjacent to the second signal electrode 4b, and the second signal electrode 4b is provided for the second signal electrode 4b. 2. The second electrodes 52 of all the MEMS pumps 5 in the MEMS pump group 5B are electrically connected; the third MEMS pump group 5C is composed of the MEMS pumps 5 adjacent to the third signal electrode 4c, and the third signal electrode 4c It is electrically connected to the second electrodes 52 of all MEMS pumps 5 located in the third MEMS pump group 5C; the fourth MEMS pump group 5D is composed of the MEMS pumps 5 adjacent to the fourth signal electrode 4d, and the fourth The signal electrode 4d is electrically connected to the second electrodes 52 of all the microelectromechanical pumps 5 in the fourth microelectromechanical pump group 5D to achieve the effect of zone control.

Please refer to Figure 6. Figure 6 is a schematic diagram of the fifth embodiment of the MEMS pump module in this case. This embodiment has the same first signal electrode 4a, second signal electrode 4b, and third signal electrode 4a as in the fourth embodiment. The signal electrode 4c and the fourth signal electrode 4d have the same positions. The difference is that the first signal electrode 4a is electrically connected to the second signal electrode 4b in this embodiment, and the third signal electrode 4c is electrically connected to the fourth signal electrode 4d. And divide the aforementioned plural MEMS pumps 5 into a first MEMS pump group 5A and a second MEMS pump group 5B. The first MEMS pump group 5A is adjacent to the first signal electrode 4a or adjacent to the second signal. The electrode 4b is composed of the microelectromechanical pump 5, and the second microelectromechanical pump group 5B is composed of the microelectromechanical pump 5 adjacent to the third signal electrode 4c or adjacent to the fourth signal electrode 4d, thereby achieving the effect of zone control, and The distance between the signal electrode 4 and the second electrode 52 is reduced, and the loss of power transmission is reduced.

Please refer to Figure 7. Figure 7 is a schematic diagram of the sixth embodiment of the micro-electromechanical pump module in this case. This embodiment and the fourth embodiment have the same first signal electrode 4a, second signal electrode 4b, and third embodiment. The signal electrode 4c and the fourth signal electrode 4d are arranged at the same position. In this embodiment, the first signal electrode 4a, the second signal electrode 4b, the third signal electrode 4c, and the fourth signal electrode 4d are all electrically connected to each other. The second electrodes 52 of the aforementioned plurality of microelectromechanical pumps 5 can be electrically connected to their closer signal electrodes 4. For example, the second electrode 52 of the microelectromechanical pump 5 adjacent to the first signal electrode 4a is electrically connected to the first signal electrode 4a, the second electrode 52 of the microelectromechanical pump 5 adjacent to the second signal electrode 4b is electrically connected to the second signal electrode 4b, and so on, the signal electrode 4 is electrically connected to the microelectromechanical pump 5 located close to each other to reduce The electromechanical pump 5 transmits power loss.

Please refer to Figure 8. Figure 8 is a schematic diagram of the seventh embodiment of the MEMS pump in this case. Due to the small size of the MEMS pump 5, its transmission volume is low, and multiple simultaneous uses are often used to increase its transmission volume. Therefore, in this embodiment, the plurality of switch units 6 include a first switch unit 61 and a second switch unit 62. The first switch unit 61 and the second switch unit 62 are respectively located on both sides of the chip body 31 (E.g., the left and right sides), the aforementioned plural MEMS pumps 5 are divided into a first MEMS actuation area 5E and a second MEMS actuation area 5F according to areas, and are composed of a plurality of MEMS pumps 5 adjacent to the first switch unit 61 The first microelectromechanical actuation area 5E, and the first electrodes 51 thereof are all electrically connected to the first switching unit 61. Similarly, the plurality of microelectromechanical pumps 5 adjacent to the second switching unit 62 constitute the second microelectromechanical actuation area 5F. And the first electrode 51 is also electrically connected to the second switch unit 62, so that the microprocessor 8 controls the first MEMS actuation area 5E and the second MEMS actuation area by controlling the first switch unit 61 and the second switch unit 62, respectively. All the micro-electromechanical pumps 5 in the area 5F achieve the effect of partitioning and synchronous control, and can reduce the pins 81 of the microprocessor 8 during synchronous control. In this embodiment, the microprocessor 8 only needs two connections Pin 81 is connected to the first switch unit 61 and the second switch unit 62 to control the MEMS pump module 100. Another pin 81 is used to deliver the modulated voltage to the signal electrode 4. The control of the MEMS pump module 100 can be completed through three pins. The pin 81 of the microprocessor 8 in this embodiment This greatly reduces the overall cost of the MEMS pump module 100.

Please refer to Figure 9. Figure 9 is a schematic diagram of the eighth embodiment of the micro-electromechanical pump in this case. In this embodiment, the plurality of switch units 6 include a first switch unit 61, a second switch unit 62, and a third switch unit. The switch unit 63 and a fourth switch unit 64, the first switch unit 61, the second switch unit 62, the third switch unit 63, and the fourth switch unit 64 are respectively adjacent to the 4 corners of the chip body 31, so that a plurality of microelectromechanical devices The pump 5 is divided into a first microelectromechanical actuation zone 5E, a second microelectromechanical actuation zone 5F, a third microelectromechanical actuation zone 5G, and a fourth microelectromechanical actuation zone 5H according to its location. The first microelectromechanical actuation zone 5E is adjacent to the A switch unit 61 is composed of a plurality of microelectromechanical pumps 5, and the first electrode 51 is electrically connected to the first switch unit 61, and the second microelectromechanical actuation area 5F is composed of a plurality of microelectromechanical pumps adjacent to the second switch unit 62 5, and the first electrode 51 is electrically connected to the second switch unit 62, the third microelectromechanical actuation area 5G is composed of a plurality of microelectromechanical pumps 5 adjacent to the third switch unit 63, the first electrode 51 All are electrically connected to the third switch unit 63. The fourth microelectromechanical actuation area 5H is composed of a plurality of microelectromechanical pumps 5 adjacent to the fourth switch unit 64. The first electrodes 51 are all electrically connected to the fourth switch unit 64. The processor 8 is then electrically connected to the first switch unit 61, the second switch unit 62, the third switch unit 63, and the fourth switch unit 64 through 4 pins, and controls the first micro-electromechanical system through the switch units 6 respectively. The actuation zone 5E, the second microelectromechanical actuation zone 5F, the third microelectromechanical actuation zone 5G, and the fourth microelectromechanical actuation zone 5H are turned on or off, so that the microprocessor 8 can control the first microelectromechanical system with only 4 pins 81, respectively. The electromechanical actuation area 5E, the second microelectromechanical actuation area 5F, the third microelectromechanical actuation area 5G, and the fourth microelectromechanical actuation area 5H. In addition, in this embodiment, the plurality of signal electrodes 4 include a first signal electrode 4a, a second The signal electrode 4b, the third signal electrode 4c and the fourth signal electrode 4d. The first signal electrode 4a is adjacent to the first switch unit 61 and is electrically connected to the first microelectromechanical actuation area The second electrode 52 of the microelectromechanical pump 5 in 5E, the second signal electrode 4b is adjacent to the second switch unit 62, and is electrically connected to the second electrode 52 of the microelectromechanical pump 5 in the second microelectromechanical actuation area 5F, the third The signal electrode 4c is adjacent to the third switch unit 63 and is electrically connected to the second electrode 52 of the microelectromechanical pump 5 in the third microelectromechanical actuation area 5G. The fourth signal electrode 4d is adjacent to the fourth switch unit 64 and is electrically connected to the The second electrode 52 of the micro-electro-mechanical pump 5 in the four micro-electro-mechanical actuation area 5H achieves partition control while reducing the resistance between the signal electrode 4 and the micro-electro-mechanical pump 5, and reduces the loss of the modulated voltage during transmission.

The switch unit 6 of the MEMS module in this case can be a semiconductor switch unit, for example, a metal oxide half field effect transistor (MOSFET) is used as the switch unit 6, and it can be directly integrated with the MEMS pump 5 by a semiconductor process, reducing wire bonding and packaging. The steps and costs can improve the yield and reduce the cost. Please refer to Figure 10A. Figure 10A is a schematic diagram of the switch unit of the MEMS pump module in this case. The switch unit 6 in this case can be a metal oxide half field effect transistor. The switch unit 6 below will use an N-type metal oxide half field effect transistor (NMOSFET) as an example. The switch units 6 each have a gate G, a drain D, and a source S. The gate G is electrically connected to the corresponding The control electrode 7 is electrically connected to the microprocessor 8, the drain electrode D is electrically connected to the first electrode 51 of the microelectromechanical pump 5, the source electrode S is grounded, and the gate electrode G of the switch unit 6 receives the microelectrode through the control electrode 7. The control signal of the processor 8 can be turned on or off. When the switch unit 6 is turned off, the first electrode 51 of the MEMS pump 5 will be disconnected. At this time, the MEMS pump 5 will also be turned off at the same time; on the contrary, when the switch unit 6 is turned on, the first electrode 51 of the MEMS pump 5 It will be regarded as grounding and forming a loop, the MEMS pump 5 will continue to operate, and the modulated voltage received by the second electrode 52 will deform the piezoelectric element 53 and adjust the internal pressure to transmit fluid. In addition to the one-to-one connection of one micro-electro-mechanical pump 5, the switch unit 6 in this case can also connect multiple micro-electro-mechanical pumps 5 one-to-many (as shown in FIG. 10B), and it is not limited thereto.

In addition, when the switching unit 6 in this case is a semiconductor switching element, the semiconductor switching elements can be a P-type metal oxide half field effect transistor (PMOSFET), an N-type metal oxide half field effect transistor (NMOSFET), a complementary gold Oxygen Half Field Effect Transistor (CMOSFET), Double Diffusion Metal Oxide Half Field Effect Transistor (DMOSFET), Lateral Diffusion Metal Oxide Half Field Effect Transistor (LDMOSFET), one of them or a combination thereof; these semiconductor elements can also be bipolar Transistor (BJT) is not limited to this.

In summary, this project provides a MEMS pump module, which connects the second electrodes of all MEMS pumps to the signal electrode to receive the modulated voltage transmitted by the microprocessor, without the need to connect the second electrodes of all MEMS pumps. The two electrodes are connected to the microprocessor together, which will greatly reduce the pins of the microprocessor, and then use the switch unit to control the opening and closing of the micro-electromechanical pump, so that the microprocessor only needs to control the switch unit to control the entire micro The electromechanical pump is actuated to reduce the burden on the microprocessor, which can simplify the packaging steps of the MEMS pump module and further reduce its cost. It can also reduce the pins of the microprocessor and reduce the cost of the microprocessor; if partition control is required, Controlling multiple MEMS pumps through one switch unit at the same time will improve the overall control efficiency, and fewer switch units will reduce the burden on more microprocessors, which not only reduces costs, but also makes it easier to complete due to the reduction of components The steps of wire bonding and packaging have effectively improved the yield rate.

This case can be modified in many ways by those who are familiar with this technology, but it is not deviated from the protection of the scope of the patent application.

100: MEMS pump module

3: MEMS chip

31: chip body

31a: Long side

31b: short side

4: Signal electrode

4a: The first signal electrode

5: MEMS pump

51: first electrode

52: second electrode

53: Piezoelectric

6: Switch unit

7: Control electrode

8: Microprocessor

81: pin

Claims (19)

A micro-electro-mechanical pump module includes: a micro-electro-mechanical chip with a chip body, the chip has a rectangular shape, and has a long side and a short side; at least one signal electrode is arranged on the chip body and adjacent to the short side Side; a plurality of micro-electromechanical pumps, all have a first electrode and a second electrode, the second electrode is electrically connected to the at least one signal electrode; a plurality of switch units are electrically connected to the first electrode of the plurality of microelectromechanical pumps And a plurality of control electrodes disposed on the chip body and adjacent to the long side and electrically connected to the plurality of switching units; wherein the at least one signal electrode receives a modulated voltage to be transmitted to the plurality of microelectromechanical pumps The second electrode, the plurality of switch units control the opening and closing actions of the plurality of microelectromechanical pumps. According to the MEMS pump module described in item 1 of the patent application, the at least one signal electrode includes a first signal electrode. The MEMS pump module described in item 2 of the scope of patent application, wherein the second electrodes of the plurality of MEMS pumps are electrically connected to the first signal electrode. In the microelectromechanical pump module described in item 2 of the scope of patent application, the at least one signal electrode further includes a second signal electrode. For example, the micro-electromechanical pump module described in item 4 of the scope of patent application, wherein the plurality of microelectromechanical pumps can be divided into a first microelectromechanical pump group and a second microelectromechanical pump group, the first microelectromechanical pump The plurality of second electrodes of the group are electrically connected to the first signal electrode, and the plurality of second electrodes of the second MEMS pump group are electrically connected to the second signal electrode. The MEMS pump module described in item 4 of the scope of patent application, wherein the second electrodes of the plurality of MEMS pumps are electrically connected to the first signal electrode and the second signal electrode. According to the MEMS pump module described in item 4 of the scope of patent application, the at least one signal electrode further includes a third signal electrode and a fourth signal electrode. For example, the MEMS pump module described in item 7 of the scope of patent application, wherein the plurality of MEMS pumps can be divided into a first MEMS pump group, a second MEMS pump group, and a third MEMS pump Group and a fourth microelectromechanical pump group, the plurality of second electrodes of the first microelectromechanical pump group are electrically connected to the first signal electrode, and the plurality of second electrodes of the second microelectromechanical pump group Are electrically connected to the second signal electrode, the plurality of second electrodes of the third MEMS pump group are electrically connected to the third signal electrode, and the plurality of second electrodes of the fourth MEMS pump group are electrically connected to the first Four signal electrodes. For example, the MEMS pump module described in item 7 of the scope of patent application, wherein the plurality of MEMS pumps can be divided into a first MEMS pump group and a second MEMS pump group, the first MEMS pump The plurality of second electrodes of the group are electrically connected to the first signal electrode and the second signal electrode, and the plurality of second electrodes of the second microelectromechanical pump group are electrically connected to the third signal electrode and the fourth signal electrode. For example, the MEMS pump module described in item 7 of the scope of patent application, wherein the second electrodes of the plurality of MEMS pumps are electrically connected to the first signal electrode, the second signal electrode, the third signal electrode, and the first signal electrode. Four signal electrodes. For the micro-electromechanical pump module described in item 1 of the scope of patent application, the plurality of microelectromechanical pumps and the plurality of switch units are respectively connected in one-to-one correspondence. For example, in the micro-electromechanical pump module described in item 1 of the scope of patent application, the plurality of switch units includes a first switch unit and a second switch unit, and the plurality of microelectromechanical pumps adjacent to the first switch unit form a first A microelectromechanical actuation area, and the plurality of microelectromechanical pumps in the first microelectromechanical actuation area are electrically connected to the first switch unit, and the plurality of microelectromechanical pumps adjacent to the second switch unit form a second microelectromechanical pump The actuation area, and the plurality of MEMS pumps in the second MEMS actuation area are electrically connected to the second switch unit. For the micro-electromechanical pump module described in item 12 of the scope of patent application, the plurality of switch units include a third switch unit and a fourth switch unit, and the plurality of microelectromechanical pumps adjacent to the third switch unit form a The third microelectromechanical actuation area, and the plurality of microelectromechanical pumps in the third microelectromechanical actuation area are all electrically connected to the third switch unit, and the plurality of microelectromechanical pumps adjacent to the fourth switch unit form a first Four micro-electro-mechanical operation areas, and the plurality of micro-electro-mechanical pumps in the fourth micro-electro-mechanical operation area are electrically connected to the fourth switch unit. For example, in the MEMS pump module described in the scope of patent application, the at least one signal electrode includes a first signal electrode, a second signal electrode, a third signal electrode, and a fourth signal electrode. The signal electrode is adjacent to the first switch unit and electrically connected to the second electrode of the plurality of MEMS pumps in the first microelectromechanical actuation area, and the second signal electrode is adjacent to the second switch unit and electrically connected to the second micro The second electrode of the plurality of microelectromechanical pumps in the electromechanical actuation area, the third signal electrode is adjacent to the third switch unit and electrically connected to the second electrode of the plurality of microelectromechanical pumps in the third microelectromechanical actuation area An electrode, the fourth signal electrode is adjacent to the fourth switch unit and electrically connected to the second electrode of the plurality of MEMS pumps in the fourth MEMS actuation area. For the MEMS pump module described in any one of items 1 to 14 of the scope of patent application, the plurality of switch units are all semiconductor switch units. The micro-electromechanical pump module described in item 15 of the scope of patent application, wherein the semiconductor switch unit is a metal oxide half field effect transistor (MOSFET). For example, the MEMS pump module described in item 16 of the scope of patent application, wherein the plurality of semiconductor switching elements are a P-type metal oxide half field effect transistor (PMOSFET), an N-type metal oxide half field effect transistor (NMOSFET), A complementary metal-oxygen half-field-effect transistor (CMOSFET), double-diffused metal-oxide half-field-effect transistor (DMOSFET), or laterally diffused metal-oxide half-field-effect transistor (LDMOSFET) or a combination thereof. The micro-electromechanical pump module described in item 16 of the scope of patent application, wherein the semiconductor switch unit is a bipolar transistor (BJT). For the MEMS pump module described in item 1 of the scope of the patent application, the modulating voltage is one of a square wave, a triangle wave, or a sine wave.

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