CN111472964B

CN111472964B - Micro-electromechanical pump module

Info

Publication number: CN111472964B
Application number: CN201910067428.0A
Authority: CN
Inventors: 莫皓然; 余荣侯; 张正明; 戴贤忠; 廖文雄; 黄启峰; 韩永隆; 李伟铭
Original assignee: Microjet Technology Co Ltd
Current assignee: Microjet Technology Co Ltd
Priority date: 2019-01-24
Filing date: 2019-01-24
Publication date: 2022-02-11
Anticipated expiration: 2039-01-24
Also published as: CN111472964A

Abstract

A MEMS pump module comprises a MEMS chip, at least one signal electrode, a plurality of MEMS pumps, a plurality of switch units and a plurality of control electrodes. The micro-electro-mechanical chip has a rectangular chip body having long sides and short sides. At least one signal electrode is arranged on the chip body and is adjacent to the short edge. The MEMS pumps are provided with a first electrode and a second electrode, and the second electrode is electrically connected with at least one signal electrode. The plurality of switching units are electrically connected to the first electrodes of the plurality of microelectromechanical pumps. The control electrodes are arranged on the chip body, are adjacent to the long edges and are respectively and electrically connected with the switch units. The switch units are used for controlling the opening and closing of the MEMS pumps.

Description

Micro-electromechanical pump module

[ technical field ] A method for producing a semiconductor device

The present invention relates to a micro-electromechanical pump module, and more particularly, to a micro-electromechanical pump module, which uses signal electrodes to reduce the number of contacts of a microprocessor, and uses a switch unit to control a micro-electromechanical pump, thereby simplifying the contacts and wiring of the micro-electromechanical pump.

[ background of the invention ]

With the development of technology, the applications of fluid delivery devices are becoming more diversified, such as industrial applications, biomedical applications, medical care, electronic heat dissipation, etc., and even recently, the image of a wearable device is seen in a hot-door wearable device, which shows that the conventional pump tends to be miniaturized, but the conventional pump is difficult to reduce the size to the centimeter level, so that the conventional micro fluid delivery device can only use a piezoelectric pump structure as the micro fluid delivery device.

Although the micro-electromechanical pump can miniaturize the volume of the pump to the micron level, the micro-electromechanical pump limits the fluid transmission amount due to the small volume, so that a plurality of micro-electromechanical pumps are needed to be used in combination, as shown in fig. 1, each micro-electromechanical pump is currently controlled by a high-level microprocessor 1, however, the high-level microprocessor 1 has high cost, and each of the micro-electromechanical pumps 2 must be connected to two microprocessor connection pins 11 of the high-level microprocessor 1, and then the high-level microprocessor 1 controls each of the micro-electromechanical pumps 2 to achieve the precise control effect, but will greatly increase the cost of the high-level microprocessor 1, resulting in high cost of the MEMS pump module, increased difficulty in packaging and wire bonding, and difficulty in popularization, therefore, how to reduce the cost of the mems pump module is a difficulty that is first overcome by the current mems pump.

[ summary of the invention ]

The main objective of the present invention is to provide a micro electromechanical pump module, which transmits a modulation voltage for driving a micro electromechanical pump through a signal electrode, and controls the micro electromechanical pump to open and close through a switch unit, so as to reduce the number of contacts of a microprocessor, reduce the number of contacts and wiring of the micro electromechanical pump module, and further simplify the micro electromechanical pump module.

To achieve the above object, a microelectromechanical pump module is provided in a broader aspect of the present disclosure, including: a micro-electromechanical chip, which is provided with a chip body which is rectangular and is provided with a long side and a short side; at least one signal electrode arranged on the chip body and adjacent to the short side; a plurality of MEMS pumps, each having a first electrode and a second electrode electrically connected to the at least one signal electrode; a plurality of switch units electrically connected to the first electrodes of the plurality of MEMS pumps; and a plurality of control electrodes which are arranged on the chip body, are adjacent to the long edge and are respectively electrically connected with the plurality of switch units; the at least one signal electrode receives a modulation voltage to be transmitted to the second electrodes of the plurality of MEMS pumps, and the plurality of switch units control the plurality of MEMS pumps to be opened and closed.

[ description of the drawings ]

Fig. 1 is a schematic diagram of a prior art microelectromechanical pump module.

Fig. 2 is a schematic view of a first embodiment of the microelectromechanical pump module of the present disclosure.

Fig. 3 is a schematic view of a second embodiment of the microelectromechanical pump module of the present disclosure.

Fig. 4 is a schematic view of a third embodiment of the microelectromechanical pump module of the present disclosure.

Fig. 5 is a schematic view of a fourth embodiment of the microelectromechanical pump module of the present disclosure.

Fig. 6 is a schematic diagram of a fifth embodiment of the microelectromechanical pump module of the present disclosure.

Fig. 7 is a schematic view of a sixth embodiment of the microelectromechanical pump module of the present disclosure.

Fig. 8 is a schematic view of a seventh embodiment of the microelectromechanical pump module of the present disclosure.

Fig. 9 is a schematic view of an eighth embodiment of the microelectromechanical pump module of the present disclosure.

Fig. 10A is a schematic diagram of the switch unit of the mems pump connected to the mems pump.

Fig. 10B is a schematic diagram of another embodiment of the switch unit of the mems pump connected to the mems pump.

[ detailed description ] embodiments

Exemplary embodiments that embody features and advantages of this disclosure are described in detail below in the detailed description. It will be understood that the present disclosure is capable of various modifications without departing from the scope of the disclosure, and that the description and drawings are to be regarded as illustrative in nature, and not as restrictive.

Referring to fig. 2, fig. 2 is a schematic view of a first embodiment of the mems pump module. The microelectromechanical pump module 100 includes: a micro-electromechanical chip 3, at least one signal electrode 4, a plurality of micro-electromechanical pumps 5, a plurality of switch units 6 and a plurality of control electrodes 7, wherein the micro-electromechanical chip 3 has a chip body 31, the chip body 31 is a rectangle having a long side 31a and a short side 31b, the signal electrode 4 is disposed on the chip body 31 and adjacent to the short side 31b, the micro-electromechanical pumps 5 are disposed on the chip body 31, each micro-electromechanical pump 5 has a first electrode 51, a second electrode 52 and a piezoelectric element 53, the second electrode 52 of each micro-electromechanical pump 5 is electrically connected to the signal electrode 4, the piezoelectric element 53 of the micro-electromechanical pump 5 generates deformation by using piezoelectric effect to change the internal pressure of the micro-electromechanical pump 5 and further draw fluid to achieve the effect of fluid transmission, one end of the switch unit 6 is connected to the first electrode 51 of the micro-electromechanical pump 5, the other end is connected to the control electrode 7, the control electrode 7 is also disposed on the chip body 31 and adjacent to the long side 31a, the signal electrode 4 receives a modulation voltage from a microprocessor 8 and transmits the modulation voltage to the second electrode 52 of the micro-electromechanical pump 5, the modulation voltage is a square wave of ± 1.8, ± 3.3, ± 3.6, ± 5 volts, in addition, the waveform of the modulation voltage can also be an alternating voltage of a sine wave or a triangular wave, but not limited to this, the switching unit 6 is turned on or off by receiving a control signal of the microprocessor 8 through the control electrode 7, and is used for further controlling the on/off operation of the micro-electromechanical pump 5 connected with the switching unit. When the switch unit 6 is turned off, the first electrode 51 of the mems pump 5 connected thereto is disconnected, so that the mems pump 5 stops operating, and when the switch unit 6 is turned on, the first electrode 51 of the mems pump 5 connected thereto is regarded as being grounded, and the modulation voltage received by the second electrode 52 is used to drive the piezoelectric element 53 in the mems pump 5. In addition, in the first embodiment of the present disclosure, the number of the at least one signal electrode 4 includes a first signal electrode 4a, the number of the signal electrodes 4 in this embodiment is one, the second electrodes 52 of all the micro electromechanical pumps 5 are electrically connected to the first signal electrode 4a, and the first signal electrode 4a transmits the modulation voltage to the second electrodes 52 of each micro electromechanical pump 5.

Referring to fig. 3, fig. 3 is a schematic view of a second embodiment of the mems pump module of the present disclosure, in which at least one signal electrode 4 includes a first signal electrode 4a and a second signal electrode 4B, the mems pumps 5 are divided into a first mems pump group 5A and a second mems pump group 5B according to their positions, wherein the second electrodes 52 of the mems pumps 5 in the first mems pump group 5A are electrically connected to the first signal electrode 4a, the second electrodes 52 of the mems pumps 5 in the second mems pump group 5B are electrically connected to the second signal electrode 4B, so as to achieve the effect of zone control, and the number of the signal electrodes 4 in this embodiment is two.

Referring to fig. 4, fig. 4 is a schematic view of a third embodiment of the mems pump module of the present disclosure, in which the number of the signal electrodes 4 is the same as that of the second embodiment, and the third embodiment and the second embodiment are the same, so that the signal electrode 4 has a first signal electrode 4a and a second signal electrode 4b, the first signal electrode 4a and the second signal electrode 4b are separately disposed at two ends (such as the upper end and the lower end) of the chip body 31, and the first signal electrode 4a is electrically connected to the second signal electrode 4b, and the second electrodes 52 of the mems pumps 5 are electrically connected to the first signal electrode 4a and the second signal electrode 4b at the two ends, and the third embodiment can reduce the impedance between the second electrode 52 of the mems pump 5 and the signal electrode 4, so as to reduce the power loss of the second electrode 52 far away from the signal electrode 4 during transmission.

Referring to fig. 5, fig. 5 is a schematic view of a fourth embodiment of the micro electromechanical pump module of the present disclosure, in which at least one signal electrode 4 includes a first signal electrode 4a, a second signal electrode 4B, a third signal electrode 4C and a fourth signal electrode 4D, the first signal electrode 4a and the third signal electrode 4C are disposed at one end (e.g., upper end) of the chip body 31 at an interval, the second signal electrode 4B and the fourth signal electrode 4D are disposed at the other end (e.g., lower end) of the chip body 31 at an interval, in this embodiment, the plurality of micro electromechanical pumps 5 are divided into a first micro electromechanical pump group 5A, a second micro electromechanical pump group 5B, a third micro electromechanical pump group 5C and a fourth micro electromechanical pump group 5D according to a position region, the first micro electromechanical pump group 5A is composed of micro electromechanical pumps 5 adjacent to the first signal electrode 4a, and the first signal electrode 4a is used for electrically connecting to a second electrode 52 of all micro electromechanical pumps 5 in the first micro electromechanical pump group 5A Connecting; the second mems pump group 5B is formed by the mems pumps 5 adjacent to the second signal electrode 4B, and the second signal electrode 4B is used for electrically connecting the second electrodes 52 of all the mems pumps 5 in the second mems pump group 5B; the third mems pump group 5C is formed by the mems pumps 5 adjacent to the third signal electrode 4C, and the third signal electrode 4C is used for electrically connecting the second electrodes 52 of all the mems pumps 5 in the third mems pump group 5C; the fourth mems pump group 5D is formed by the mems pumps 5 adjacent to the fourth signal electrode 4D, and the fourth signal electrode 4D is used for electrically connecting the second electrodes 52 of all the mems pumps 5 in the fourth mems pump group 5D, so as to achieve the effect of zone control.

Referring to fig. 6, fig. 6 is a schematic diagram of a micro electromechanical pump module according to a fifth embodiment of the present disclosure, which has a first signal electrode 4a, a second signal electrode 4B, a third signal electrode 4c and a fourth signal electrode 4d in the same manner as in the fourth embodiment, and the difference is that the first signal electrode 4a is electrically connected to the second signal electrode 4B, the third signal electrode 4c is electrically connected to the fourth signal electrode 4d, and the micro electromechanical pumps 5 are divided into a first micro electromechanical pump group 5A and a second micro electromechanical pump group 5B, the first micro electromechanical pump group 5A is composed of micro electromechanical pumps 5 adjacent to the first signal electrode 4a or the second signal electrode 4B, the second micro electromechanical pump group 5B is composed of micro electromechanical pumps 5 adjacent to the third signal electrode 4c or the fourth signal electrode 4d, therefore, the effect of zone control is achieved, the distance between the signal electrode 4 and the second electrode 52 is reduced, and the loss of power transmission is reduced.

Referring to fig. 7, fig. 7 is a schematic diagram of a sixth embodiment of the mems pump module, in which the first signal electrode 4a, the second signal electrode 4b, the third signal electrode 4c and the fourth signal electrode 4d are the same as those in the fourth embodiment, and the positions of the first signal electrode 4a, the second signal electrode 4b, the third signal electrode 4c and the fourth signal electrode 4d are all electrically connected to each other, so that the second electrodes 52 of the mems pumps 5 are electrically connected to the closer signal electrodes 4, for example, the second electrode 52 of the mems pump 5 adjacent to the first signal electrode 4a is electrically connected to the first signal electrode 4a, the second electrode 52 of the mems pump 5 adjacent to the second signal electrode 4b is electrically connected to the second signal electrode 4b, and so on, the signal electrodes 4 are electrically connected to the similarly located mems pumps 5, to reduce the loss of the transmission power of each micro-electromechanical pump 5.

Referring to fig. 8, fig. 8 is a diagram of a seventh embodiment of the mems pump, in which the mems pump 5 has a small volume, so that the transmission capacity is low, and multiple synchronous switches are often used to improve the transmission capacity and transmission efficiency, so in this embodiment, the multiple switch units 6 include a first switch unit 61 and a second switch unit 62, the first switch unit 61 and the second switch unit 62 are respectively located at two sides (e.g. left and right sides) of the chip body 31, the multiple mems pumps 5 are divided into a first mems active area 5E and a second mems active area 5F by regions, the multiple mems pumps 5 adjacent to the first switch unit 61 form the first mems active area 5E, and the first electrodes 51 thereof are electrically connected to the first switch unit 61, and similarly, the multiple mems pumps 5 adjacent to the second switch unit 62 form the second mems active area 5F, and the first electrode 51 is electrically connected to the second switch unit 62, so that the microprocessor 8 controls all the mems pumps 5 in the first mems active area 5E and the second mems active area 5F respectively by controlling the first switch unit 61 and the second switch unit 62 to achieve the effect of partition and synchronous control, and the pins 81 of the microprocessor 8 can be reduced during synchronous control, in this embodiment, the microprocessor 8 only needs two pins 81 to connect the first switch unit 61 and the second switch unit 62 respectively to control the mems pump module 100, and then the other pin 81 is used to transmit the modulation voltage to the signal electrode 4, so that the control of the mems pump module 100 can be completed by 3 pins, the pins 81 of the microprocessor 8 in this embodiment are greatly reduced, and the overall cost of the electromechanical micro pump module 100 is reduced accordingly.

Referring to fig. 9, fig. 9 is a schematic view of an eighth embodiment of the micro electromechanical pump of the present invention, in this embodiment, the plurality of switch units 6 includes a first switch unit 61, a second switch unit 62, a third switch unit 63 and a fourth switch unit 64, the first switch unit 61, the second switch unit 62, the third switch unit 63 and the fourth switch unit 64 are respectively adjacent to 4 corners of the chip body 31, so that the plurality of micro electromechanical pumps 5 are divided into a first micro electromechanical actuation area 5E, a second micro electromechanical actuation area 5F, a third micro electromechanical actuation area 5G and a fourth micro electromechanical actuation area 5H according to their positions, the first micro electromechanical actuation area 5E is composed of a plurality of micro electromechanical pumps 5 adjacent to the first switch unit 61, and the first electrodes 51 thereof are electrically connected to the first switch unit 61, the second micro electromechanical actuation area 5F is composed of a plurality of micro electromechanical pumps 5 adjacent to the second switch unit 62, the first electrodes 51 of the micro-electromechanical actuation areas are electrically connected to the second switch unit 62, the third micro-electromechanical actuation area 5G is composed of a plurality of micro-electromechanical pumps 5 adjacent to the third switch unit 63, the first electrodes 51 of the micro-electromechanical actuation areas are electrically connected to the third switch unit 63, the fourth micro-electromechanical actuation area 5H is composed of a plurality of micro-electromechanical pumps 5 adjacent to the fourth switch unit 64, the first electrodes 51 of the micro-electromechanical actuation areas are electrically connected to the fourth switch unit 64, the microprocessor 8 is electrically connected to the first switch unit 61, the second switch unit 62, the third switch unit 63 and the fourth switch unit 64 through 4 pins, and the first micro-electromechanical actuation area 5E, the second micro-electromechanical actuation area 5F, the third micro-electromechanical actuation area 5G and the fourth micro-electromechanical actuation area 5H are controlled to be turned on or turned off through the plurality of switch units 6, so that the microprocessor 8 can control the first micro-electromechanical actuation area 5E, the second micro-electromechanical actuation area 5F, the third micro-electromechanical actuation area 5G and the fourth micro-electromechanical actuation area 5H respectively with 4 pins 81 only, A second micro-electro-mechanical actuation area 5F, a third micro-electro-mechanical actuation area 5G, and a fourth micro-electro-mechanical actuation area 5H, wherein the plurality of signal electrodes 4 includes a first signal electrode 4a, a second signal electrode 4b, a third signal electrode 4c, and a fourth signal electrode 4d, the first signal electrode 4a is adjacent to the first switch unit 61 and electrically connected to the second electrode 52 of the micro-electro-mechanical pump 5 in the first micro-electro-mechanical actuation area 5E, the second signal electrode 4b is adjacent to the second switch unit 62 and electrically connected to the second electrode 52 of the micro-electro-mechanical pump 5 in the second micro-electro-mechanical actuation area 5F, the third signal electrode 4c is adjacent to the third switch unit 63 and electrically connected to the second electrode 52 of the micro-electro-mechanical pump 5 in the third micro-electro-mechanical actuation area 5G, the fourth signal electrode 4d is adjacent to the fourth switch unit 64 and electrically connected to the second electrode 52 of the micro-electro-mechanical pump 5 in the fourth micro-electro-mechanical actuation area 5H, so as to achieve the zone control, reduce the resistance between the signal electrode 4 and the micro-electromechanical pump 5, and reduce the loss of the modulation voltage during transmission.

The switch unit 6 of the present invention can be a semiconductor switch unit, for example, a Metal Oxide Semiconductor Field Effect Transistor (MOSFET) is used as the switch unit 6, and can be directly integrated with the mems pump 5 by a semiconductor process, so as to reduce the steps and cost of wire bonding packaging, improve the yield and reduce the cost, as shown in fig. 10A, fig. 10A is a switch unit schematic diagram of the present invention, the switch unit 6 of the present invention can be a MOSFET, the following switch unit 6 will use N-type MOSFET (NMOSFET) as an example, the switch units 6 each have a gate G, a drain D, and a source S, the gate G is electrically connected to the corresponding control electrode 7, the control electrode 7 is electrically connected to the microprocessor 8, the drain D is electrically connected to the first electrode 51 of the mems pump 5, the source S is grounded, the gate G of the switch unit 6 receives the control signal of the microprocessor 8 through the control electrode 7, to be turned on or off. When the switch unit 6 is turned off, the first electrode 51 of the mems pump 5 is turned off, and at this time, the mems pump 5 is also turned off; on the contrary, when the switch unit 6 is turned on, the first electrode 51 of the micro-electromechanical pump 5 is regarded as the ground to form a loop, the micro-electromechanical pump 5 will continue to operate, and the modulation voltage received by the second electrode 52 deforms the piezoelectric element 53 to adjust the internal pressure to transmit the fluid. The switch unit 6 may be connected to one micro-electromechanical pump 5 in a one-to-one manner, or may be connected to a plurality of micro-electromechanical pumps 5 in a one-to-many manner (as shown in fig. 10B), but is not limited thereto.

In addition, when the switch unit 6 is a semiconductor switch device, the semiconductor switch devices may be one of a P-type metal-oxide-semiconductor field-effect transistor (PMOSFET), an N-type metal-oxide-semiconductor field-effect transistor (NMOSFET), a complementary metal-oxide-semiconductor field-effect transistor (CMOSFET), a double-diffused metal-oxide-semiconductor field-effect transistor (DMOSFET), a lateral-diffused metal-oxide-semiconductor field-effect transistor (LDMOSFET), or a combination thereof; the plurality of semiconductor devices may also be Bipolar Junction Transistors (BJTs), but not limited thereto.

In summary, the present disclosure provides a micro electromechanical pump module, in which the second electrodes of all the micro electromechanical pumps are connected to a signal electrode for receiving a modulation voltage transmitted by a microprocessor, and the second electrodes of all the micro electromechanical pumps do not need to be connected to the microprocessor together, so that the number of pins of the microprocessor can be greatly reduced, and then the switching unit is used to control the on/off operation of the micro electromechanical pump, so that the microprocessor can control the whole micro electromechanical pumps to operate only by controlling the switching unit, thereby reducing the burden of the microprocessor, simplifying the packaging steps of the micro electromechanical pump module, further reducing the cost of the micro electromechanical pump module, reducing the number of pins of the microprocessor, and reducing the cost of the microprocessor; if the partition control is needed, the switch unit controls a plurality of micro-electromechanical pumps simultaneously, the overall control efficiency can be improved, fewer switch units are needed, the burden of more microprocessors is reduced, the cost can be reduced, the wire bonding and packaging steps can be completed easily due to the reduction of elements, and the yield is effectively improved.

Various modifications may be made by those skilled in the art without departing from the scope of the invention as defined by the appended claims.

[ notation ] to show

100: micro-electromechanical pump module

1: high-level microprocessor

11: microprocessor connecting pin

2: MEMS pump

3: micro-electromechanical chip

31: chip body

31 a: long side

31 b: short side

4: signal electrode

4 a: a first signal electrode

4 b: second signal electrode

4 c: third signal electrode

4 d: a fourth signal electrode

5: MEMS pump

51: a first electrode

52: second electrode

53: piezoelectric element

5A: first micro-electromechanical pump group

5B: second MEMS pump group

5C: third MEMS pump group

5D: fourth MEMS pump group

5E: a first micro-electromechanical active region

5F: the second micro-electromechanical active region

5G: third micro-electromechanical active area

5H: fourth micro-electro-mechanical active area

6: switch unit

61: first switch unit

62: second switch unit

63: third switch unit

64: fourth switch unit

7: control electrode

8: microprocessor

81: pin

G: grid electrode

D: drain electrode

S: source electrode

Claims

1. A microelectromechanical pump module, comprising:

the micro-electromechanical chip is provided with a chip body, wherein the chip body is rectangular and is provided with a long side and a short side;

at least one signal electrode arranged on the chip body and adjacent to the short side;

a plurality of MEMS pumps, each having a first electrode and a second electrode electrically connected to the at least one signal electrode;

a plurality of switch units electrically connected to the first electrodes of the plurality of MEMS pumps; and

the control electrodes are arranged on the chip body, are adjacent to the long edge and are respectively electrically connected with the switch units;

the at least one signal electrode receives a modulation voltage to be transmitted to the second electrodes of the plurality of MEMS pumps, and the plurality of switch units control the plurality of MEMS pumps to be opened and closed.

2. The microelectromechanical pump module of claim 1 wherein the at least one signal electrode comprises a first signal electrode.

3. The mems pump module of claim 2, wherein the second electrode of the plurality of mems pumps is electrically connected to the first signal electrode.

4. The mems pump module of claim 2, wherein the at least one signal electrode further comprises a second signal electrode.

5. The mems pump module of claim 4, wherein the mems pumps are divided into a first mems pump group and a second mems pump group, the second electrodes of the first mems pump group are electrically connected to the first signal electrode, and the second electrodes of the second mems pump group are electrically connected to the second signal electrode.

6. The mems pump module of claim 4, wherein the second electrode of the plurality of mems pumps electrically connects the first signal electrode and the second signal electrode.

7. The microelectromechanical pump module of claim 4, wherein the at least one signal electrode further comprises a third signal electrode and a fourth signal electrode.

8. The mems module as recited in claim 7, wherein the plurality of mems pumps are divided into a first group of mems pumps, a second group of mems pumps, a third group of mems pumps and a fourth group of mems pumps, the plurality of second electrodes of the first group of mems pumps are electrically connected to the first signal electrode, the plurality of second electrodes of the second group of mems pumps are electrically connected to the second signal electrode, the plurality of second electrodes of the third group of mems pumps are electrically connected to the third signal electrode, and the plurality of second electrodes of the fourth group of mems pumps are electrically connected to the fourth signal electrode.

9. The mems pump module of claim 7, wherein the mems pumps are divided into a first mems pump group and a second mems pump group, the second electrodes of the first mems pump group are electrically connected to the first signal electrode and the second signal electrode, and the second electrodes of the second mems pump group are electrically connected to the third signal electrode and the fourth signal electrode.

10. The mems pump module of claim 7, wherein the second electrode of the plurality of mems pumps is electrically connected to the first signal electrode, the second signal electrode, the third signal electrode, and the fourth signal electrode.

11. The mems pump module of claim 1, wherein the mems pumps are connected to the switch units in a one-to-one correspondence.

12. The mems pump module of claim 1, wherein the plurality of switch units comprises a first switch unit and a second switch unit, the plurality of mems pumps adjacent to the first switch unit form a first mems active area, the plurality of mems pumps in the first mems active area are all electrically connected to the first switch unit, the plurality of mems pumps adjacent to the second switch unit form a second mems active area, and the plurality of mems pumps in the second mems active area are all electrically connected to the second switch unit.

13. The mems pump module of claim 12 wherein the plurality of switch units includes a third switch unit and a fourth switch unit, the plurality of mems pumps adjacent to the third switch unit form a third mems active area, the plurality of mems pumps in the third mems active area are all electrically connected to the third switch unit, the plurality of mems pumps adjacent to the fourth switch unit form a fourth mems active area, and the plurality of mems pumps in the fourth mems active area are all electrically connected to the fourth switch unit.

14. The mems pump module of claim 13 wherein the at least one signal electrode comprises a first signal electrode, a second signal electrode, a third signal electrode and a fourth signal electrode, the first signal electrode is adjacent to the first switch unit and electrically connected to the second electrodes of the mems pumps in the first mems active area, the second signal electrode is adjacent to the second switch unit and electrically connected to the second electrodes of the mems pumps in the second mems active area, the third signal electrode is adjacent to the third switch unit and electrically connected to the second electrodes of the mems pumps in the third mems active area, and the fourth signal electrode is adjacent to the fourth switch unit and electrically connected to the second electrodes of the mems pumps in the fourth mems active area.

15. The mems pump module of any one of claims 1-14, wherein each of the plurality of switch units is a semiconductor switch unit.

16. The mems pump module of claim 15 wherein the semiconductor switching element is a Metal Oxide Semiconductor Field Effect Transistor (MOSFET).

17. The microelectromechanical pump module of claim 16 wherein the plurality of semiconductor switching devices are one of a P-type metal-oxide-semiconductor field-effect transistor (PMOSFET), an N-type metal-oxide-semiconductor field-effect transistor (NMOSFET), a complementary metal-oxide-semiconductor field-effect transistor (CMOSFET), a double diffused metal-oxide-semiconductor field-effect transistor (DMOSFET), or a laterally diffused metal-oxide-semiconductor field-effect transistor (LDMOSFET), or a combination thereof.

18. The mems pump module of claim 16 wherein the semiconductor switching element is a bipolar transistor (BJT).

19. The mems pump module of claim 1 wherein the modulated voltage is one of a square wave, a triangular wave, or a sinusoidal wave.