TWI699039B - Antenna carrier board structure - Google Patents

Abstract

The present invention is an antenna carrier board structure, which includes: a first circuit board with a first substrate and a conductive connector passing through the first substrate. The conductive connector has two opposite connection ends protruding from the first substrate. Two opposing surfaces of a substrate; a second circuit board includes a second substrate, the second substrate is formed with a through hole, and a through post is arranged in the through hole, and one end of the through post forms an engaging recess; One end of the conductive connecting member of the first substrate is engaged with the engaging recess of the conductive pillar; in this way, the circuit boards can be fast and stable through the fastening method and electrically connected to form a multilayer circuit The board module avoids the joint tolerances generated during welding, and ensures that the contacts are connected reliably and correctly without poor contact.

Description

Antenna carrier board structure

An antenna carrier board, especially an antenna carrier board structure.

The communications industry has been one of the key research directions in the development of modern science and technology. In recent years, mobile communications can be said to have spread to every corner of the world, and most electronic products are equipped with wireless communications for one or more frequency bands. Therefore, how to integrate wireless communication modules of multiple frequency bands into a product to maximize the use efficiency of the space in the product while avoiding the mutual interference between the wireless communication module and other modules in the device is the continuous wireless communication industry Continue to focus on the development direction of resources for research and development.

The wireless communication module mainly includes at least one antenna unit and a processing unit. Generally speaking, the design of the antenna unit depends on the frequency of the wireless signal to be transmitted or received by the antenna unit. Length, width, thickness and material to achieve the purpose of receiving wireless signals in specific frequency bands. In the prior art antenna design, a metal wire with the required length, width and thickness is arranged on an antenna carrier by circuit printing to form the antenna unit, and then the antenna carrier is connected to a printed circuit by welding The processing unit is also connected to the printed circuit board by welding, so that the antenna carrier board can be connected to the processing unit through the printed circuit board to form a wireless communication module with complete communication functions .

Furthermore, in order to achieve good transceiver efficiency of the antenna unit at the same time and avoid mutual influence with other circuit elements or modules in the electronic device, the wiring of the antenna unit is restricted by many design criteria, especially when multiple groups of different frequency bands are to be integrated. When the antenna unit is in a wireless communication module, when the wireless communication module can receive or transmit wireless signals of multiple frequency bands, the multiple antenna units must be soldered to the printed circuit board and passed through the printed circuit board. The trace is connected to the processing module.

However, when a plurality of antenna units are respectively soldered to the printed circuit board, the welding technology is limited, and there will be joint tolerances when joining. Therefore, the more antenna units that need to be joined by welding, the greater the joint tolerance will be. If there are more, the probability of poor contact will be higher, which will lead to a decrease in the production yield of the wireless communication module. Therefore, the prior art wireless communication module must be further improved.

In view of the fact that the design of the antenna unit in the existing circuit board antenna module is difficult to multiple applications due to the circuit board manufacturing process and antenna design specifications, the present invention provides an antenna carrier board structure including a first circuit board and a second circuit board. The first circuit board includes a first substrate and a conductive connector, and has a first surface and a second surface opposite to each other; the conductive connector has a first connection end and a second connection end opposite to each other; the conductive The connecting piece is penetrated through the first substrate, and the first connecting end extends and protrudes from the first surface, and the second connecting end extends and protrudes from the second surface. The second circuit board includes a second substrate and a via post. The second substrate has a first surface and a second surface opposite to each other, wherein the first surface of the second substrate faces the first surface of the first substrate , And the second substrate is formed with a through hole, the through hole communicates with the first surface and the second surface of the second substrate, and the through pillar is disposed in the through hole, and the through pillar is formed toward one end of the first substrate An engaging recess, and the engaging recess is engaged with the first connecting end of the conductive connector.

In the process of connecting the first circuit board and the second circuit board, as long as the second circuit board and the first circuit board reach the corresponding connection positions, the connecting end of the conductive connector of the first circuit board Correspondingly, it will be inserted into the engaging recess of the second circuit board. At this time, a pressing step is performed to make the connecting end and the engaging recess tightly fixed. In this way, the first circuit board and the second circuit board can be connected in a fast and stable manner to form a multi-layer circuit board module.

In this way, the first circuit board and the second circuit board can be firmly fixed and electrically connected without the need for a soldering process, avoiding joint tolerances generated during soldering, and the first connecting end of each connector The correspondence between the engaging recesses of the conductive pillars also makes the first circuit board and the second circuit board produce an automatic alignment effect, ensuring that the contacts are connected reliably and correctly without connection errors or contact bad.

Please refer to FIG. 1, the antenna carrier board structure of the present invention includes a first circuit board 11 and a second circuit board 12. The first circuit board 11 includes a first substrate 111 and a conductive connection member 112. The first substrate 111 has a first surface 1111 and a second surface 1112 opposite to each other. The conductive connection member 112 penetrates the The first surface 1111 and the second surface 1112 of the first substrate 111 have a first connection end 1121 and a second connection end 1122 opposite to each other. The first connection end 1121 and the second connection end 1122 respectively extend and protrude On the first surface 1111 and the second surface 1112 of the first substrate 111.

The second circuit board 12 is disposed on one side of the first surface 1111 of the first substrate 111 and includes a second substrate 121 and a conductive pillar 122. The second substrate 121 has a first surface 1211 and a second surface 1212 opposite to each other. The second substrate 121 is set with its first surface 1211 facing the first surface 1111 of the first substrate 111. The second substrate 121 is formed with a via hole which communicates with the first surface 1211 and the second surface 1212 of the second substrate 121, and is provided corresponding to one of the conductive connectors 112 of the first substrate 111, and the via The pillar 122 is disposed in the through hole of the second substrate 121, and the through pillar 122 faces one end of the first substrate 111, that is, the end of the through pillar 122 facing the first surface 1211 of the second substrate 121 forms a card. The engaging recess 1221 is engaged with the corresponding first connecting end 1121 of the conductive connector 112 of the first substrate 111.

Please also refer to FIG. 2, by the conductive connecting member 112 of the first circuit board 11 being engaged and arranged in the engaging recess 1221 of the conducting post 122 of the second circuit board 12, the second circuit board 12 and The first circuit boards 11 can be fixedly connected and electrically connected to each other through engagement. In this way, the first circuit board 11 and the second circuit board 12 can be firmly joined and electrically connected without the need for a soldering process, avoiding joining tolerances generated during soldering, and the first conductive connector 112 The correspondence between the connecting end 1121 and the engaging recess 1221 of the conducting post 122 also produces an automatic alignment effect between the first circuit board 11 and the second circuit board 12, ensuring that the contacts are connected reliably and correctly There will be no connection errors or poor contact.

Wherein, the conductive connecting member 112 of the first circuit board 11 can be electrically connected to the circuit layer disposed between the first surface 1111 and the second surface 1112 of the first substrate 111, and the conductive post of the second circuit board 12 122 is also used for power connection to the circuit layer provided between the first surface 1211 and the second surface 1212 of the second substrate 121. Furthermore, the connection between the conductive connector 112 of the first circuit board 11 and the conduction post 122 of the second circuit board 12 can be electrically connected to each of the first circuit board 11 and the second circuit board 12. The purpose of the circuit layer, therefore, greatly enhance the multiple applicability of antenna circuit design.

Wherein, in order to enable the conductive connecting member 112 and the engaging recess 1221 of the conductive post 122 to be firmly engaged, the following structure is preferably adopted: when the first connecting end 1121 of the conductive connecting member 112 of the first circuit board 11 has not When engaged in the engaging recess 1221 of the conducting post 122 of the second circuit board 12, the length of the engaging recess 1221 of the conducting post 122 of the second circuit board 12 along the radial direction of the conducting post 122 is smaller than the The first connecting end 1121 of the conductive connecting member 112 of the first circuit board 11 has an outer diameter along the radial direction of the conductive pillar 122. Therefore, when the first connecting end 1121 of the conductive connecting member 112 of the first circuit board 11 is clamped into the engaging recess 1221 of the conducting post 122 of the second circuit board 12 by pressing, the first circuit The first connecting end 1121 of the conductive connecting member 112 of the board 11 is deformed and forced to be tight in the engaging recess 1221 of the conductive post 122 of the second circuit board 12.

Please refer to FIGS. 1 and 2 again. In a first preferred embodiment of the present invention, a third circuit board 13 is further included. The third circuit board 13 is disposed on the second substrate 111 The surface 1112 includes a third substrate 131. The third substrate 131 has a first surface 1311 and a second surface 1312 opposite to each other. The first surface 1311 of the second substrate 131 faces the first substrate 111. Two surfaces 1112 are provided. The third substrate 131 forms a via hole which communicates with the first surface 1311 and the second surface 1312 of the third substrate 131 and is disposed corresponding to one of the conductive connectors 112 of the first substrate 111. The through hole of the third substrate 131 is provided with a conductive pillar 132, and an end of the conductive pillar 132 facing the first substrate 111, that is, an end of the conductive pillar 132 facing the first surface 1311 of the third substrate 131 is formed with a The engaging recess 1321 is engaged with the corresponding second connecting end 1121 of the conductive connector 112 of the first substrate 111.

The connecting end 1121 of the conductive connector 112 provided on the first circuit board 11 and the engaging recesses 1221 and 1321 of the conductive posts 122 and 132 of the second circuit board 12 and the third circuit board 13 not only correspond in position, but also It can be locked with each other. Therefore, in the process of connecting the first circuit board 11 and the second circuit board 12, as long as the second circuit board 12, the third circuit board 13 and the first circuit board 11 reach the corresponding connection positions respectively , The connecting end 1121 of the conductive connector 112 of the first circuit board 11 will slightly fall into the engaging recesses 1221 and 1321 of the second circuit board 12 and the third circuit board 13, and then through a pressing step , So that the first connecting end 1121 and the second connecting end 1122 are deformed to be tightly fixed to each of the engaging recesses 1221 and 1321. In this way, the first circuit board 11, the second circuit board 12, and the third circuit board 13 can be connected in a fast and low error rate manner to form a multilayer circuit board module.

Furthermore, in the design of the antenna, through the circuit design of the circuit board, the circuit layers of the first circuit board 11, the second circuit board 12, and the third circuit board 13 can be combined to form an antenna module. For example, circuit designers can respectively form antenna units of different widths, thicknesses or different materials on the second circuit board 12 and the third circuit board 13 according to requirements to receive wireless communication signals of different frequency bands, and then pass the After the conductive connecting members 112 of the first circuit board 11 are electrically connected to each other, a complete wireless communication module is formed. This increases the flexibility and diversified applicability of antenna design.

Please refer to FIG. 3, in a second preferred embodiment of the present invention, each conductive connector 112 of the first circuit board 11 is a metal pillar, for example, the same as the circuit layer of the first circuit board 11. The conductive connecting member 112 further includes a first pressing layer 1123 and a second pressing layer 1124. The first pressing layer 1123 covers the first connecting end 1121 of the conductive connecting member 112 The surface, and the second pressing layer 1124 covers the surface of the second connecting end 1122. The first pressing layer 1123 and the second pressing layer 1124 are a soft metal layer, such as a gold layer or a nickel layer. During the pressing process of the conducting post 122 of the second circuit board 12 and the conductive connecting member 112 of the first circuit board 11, since the first pressing layer 1123 and the second pressing layer 1124 are relatively soft, they are stressed It is easier to deform afterwards, so that the engaging recesses 1221 and 1321 that conduct each of the 122 and 132 and the first connecting end 1121 and the second connecting end 122 of the conductive connector 112 are easier to press and can be more tightly joined.

Please refer to FIG. 4, in a third preferred embodiment of the present invention, the first circuit board 11 includes a first circuit layer 113 and a second circuit layer 114, and the second circuit board 12 further includes A first antenna layer 123. The first antenna layer 123 is disposed on the second surface 1212 of the second substrate 121, and the first antenna layer 123 forms a first antenna unit. Wherein, the first antenna unit is electrically connected to the first circuit layer 113 of the first circuit board 112 through the conductive post 122 of the second circuit board 12 and the conductive connector 112 of the first circuit board 11.

Similarly, the third circuit board 13 further includes a second antenna layer 133. The second antenna layer 133 is disposed on the second surface 1312 of the third substrate 131 and forms a second antenna unit. Wherein, the second antenna unit is electrically connected to the second circuit layer 114 of the first circuit board 112 through the conductive post 132 of the third circuit board 13 and the conductive connector 112 of the first circuit board 11.

The first antenna layer 123 and the second antenna layer 133 respectively form an antenna unit and are disposed on the outside of the second circuit board 12 and the third circuit board 13, that is, the second surface 1212 and the second substrate 121 The second surface 1312 of the third substrate 131 is for receiving wireless signals.

The antenna carrier board structure of the present invention is connected to the separately manufactured circuit carrier boards by laminating and pressing. When the integrated circuit chip is to be electrically connected, it can be easily formed by forming a through hole on the adjacent circuit board. The processing wafer is additionally electrically connected to any substrate of the present invention.

For example, please refer to FIG. 5. In a fourth preferred embodiment of the present invention, a processing chip 14 is further included. The preferred embodiment of its arrangement is as follows: The second substrate 121 is formed with a chip accommodating Through hole 120, the processing chip 14 is disposed in the accommodating hole 120 and is disposed on the first surface 1111 of the first substrate 111 through the wafer accommodating hole 120 to electrically connect the first circuit of the first substrate 111层113.

Please refer to FIG. 6, and in the fifth preferred embodiment of the present invention, another arrangement of the processing wafer 14 is as follows: the second substrate 121, the first substrate 111, and the third substrate 131 are separately formed There is a chip receiving through hole 120, 110, 130, and the second substrate 121, the first substrate 111, and the third substrate 131 have the chip containing through holes 120, 110, 130 correspondingly arranged and interconnected, and The processing chip 14 is disposed in the chip accommodating through holes 120, 110, and 130 of the second substrate 121, the first substrate 111, and the third substrate 131 and is electrically connected to the second antenna unit of the second antenna layer 133. Sexual connection.

The above are only the preferred embodiments of the present invention, and do not limit the present invention in any form. Although the present invention has been disclosed as the preferred embodiments, it is not intended to limit the present invention. Anyone familiar with the professional technology Personnel, without departing from the scope of the technical solution of the present invention, when the technical content disclosed above can be used to make slight changes or modification into equivalent embodiments with equivalent changes, but any content that does not depart from the technical solution of the present invention, according to the present invention Any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the technical solutions of the present invention.

11‧‧‧First circuit board 110‧‧‧Chip accommodating opening 111‧‧‧First substrate 1111‧‧‧First surface 1112‧‧‧Second surface 112‧‧‧Conductive connector 1121‧‧‧First Connection end 1122‧‧‧Second connection end 1123‧‧‧First press layer 1124‧‧‧Second press layer 113‧‧‧First circuit layer 114‧‧‧Second circuit layer 12‧‧‧Second Circuit board 120‧‧‧Chip accommodating opening 121‧‧‧Second substrate 1211‧‧‧First surface 1212‧‧‧Second surface 122‧‧‧Connecting post 1221‧‧‧Clamping recess 123‧‧‧First Antenna layer 13‧‧‧Third circuit board 130‧‧‧Chip accommodating opening 131‧‧‧Third substrate 1311‧‧‧First surface 1312‧‧‧Second surface 132‧‧‧Connecting post 1321‧‧‧ Snap recess 133‧‧‧Second antenna layer 14‧‧‧Processing chip

Fig. 1 is a schematic diagram of a separated cross-section of the antenna carrier structure of the present invention. Figure 2 is a schematic cross-sectional view of the antenna carrier structure of the present invention. 3 is a schematic cross-sectional view of the second preferred embodiment of the antenna carrier structure of the present invention. 4 is a schematic cross-sectional view of a third preferred embodiment of the antenna carrier structure of the present invention. 5 is a schematic cross-sectional view of the fourth preferred embodiment of the antenna carrier structure of the present invention. 6 is a schematic cross-sectional view of a fifth preferred embodiment of the antenna carrier structure of the present invention.

11‧‧‧First circuit board

111‧‧‧First substrate

1111‧‧‧First surface

1112‧‧‧Second Surface

112‧‧‧Conductive connector

1121‧‧‧First connection

1122‧‧‧Second connection

12‧‧‧Second circuit board

121‧‧‧Second substrate

1211‧‧‧First surface

1212‧‧‧Second surface

122‧‧‧Through column

1221‧‧‧Clamping recess

13‧‧‧The third circuit board

131‧‧‧Third substrate

1311‧‧‧First surface

1312‧‧‧Second Surface

132‧‧‧Plug

1321‧‧‧Clamping recess

Claims (10)

An antenna carrier board structure, comprising: a first circuit board, comprising: a first substrate having a first surface and a second surface opposite to each other; a conductive connector having a first connecting end and a first connecting end opposite to each other Two connecting ends; the conductive connecting piece penetrates the first substrate, and the first connecting end extends to protrude from the first surface, and the second connecting end extends to protrude from the second surface; The second circuit board includes: a second substrate having a first surface and a second surface opposite to each other, wherein the first surface of the second substrate faces the first surface of the first substrate; the second substrate forms a A through hole, the through hole communicates with the first surface and the second surface of the second substrate; a through post is disposed in the through hole, the through post forms an engaging recess toward one end of the first substrate, and the The engaging recess is engaged with the first connecting end of the conductive connector. The antenna carrier board structure according to claim 1, wherein: when the first connecting end of the conductive connector of the first circuit board is not yet engaged in the engaging recess of the conducting post of the second circuit board, the second circuit board The length of the inner diameter of the engaging recess of the conduction post of the two circuit boards in the radial direction of the conduction post is smaller than the length of the outer diameter of the first connection end of the conductive connector of the first circuit board in the radial direction of the conduction post; When the first connecting end of the conductive connector of a circuit board is clamped into the engaging recess of the conductive post of the second circuit board by pressing, the first connecting end of the conductive connector of the first circuit board is The deformation is caused to be pressed tightly in the engaging recess of the conducting post of the second circuit board. The antenna carrier board structure according to claim 1, further comprising: a third circuit board, comprising: a third substrate having a first surface and a second surface opposite to each other, wherein the first surface of the third substrate The surface faces the second surface of the first substrate; the third substrate forms a via hole that communicates with the first surface and the second surface of the third substrate; a via post is arranged in the via hole, and the An end of the conductive post facing the first substrate forms a locking recess, and the locking recess is locked with the connecting end of the conductive connector. The antenna carrier board structure according to any one of claims 1 to 3, wherein the conductive connecting member is a metal pillar. The antenna carrier board structure according to any one of claims 1 to 3, wherein the conductive connection member comprises: a first pressure bonding layer covering the surface of the first connection end of the conductive connection member; a second pressure bonding A layer, covering the surface of the second connecting end of the conductive connecting piece. The antenna carrier board structure according to claim 5, wherein the laminated layer of the conductive connecting member is a nickel layer or a gold layer. The antenna carrier board structure according to claim 1, wherein: a first circuit layer is formed on the first substrate of the first circuit board, and the first circuit layer is electrically connected to the conductive connector; the second circuit The board further includes: a first antenna layer disposed on the second surface of the second substrate, the first antenna layer forming a first antenna element; wherein the first antenna element transmits through the second circuit The conductive post of the board and the conductive connection member of the first circuit board are electrically connected to the first circuit layer of the first circuit board. The antenna carrier structure according to claim 7, further comprising: a processing wafer; wherein: the second substrate forms a wafer accommodating through hole; the processing wafer is disposed in the wafer accommodating through hole of the second substrate, and It is arranged on the first surface of the first substrate to electrically connect the first circuit layer of the first substrate. The antenna carrier board structure according to claim 3, wherein: the first substrate of the first circuit board is further formed with a second circuit layer, and the second circuit layer is electrically connected to the conductive connector; the third The circuit board further includes: a second antenna layer disposed on the second surface of the third substrate, the second antenna layer forms a second antenna element, wherein the second antenna element passes through the third The conducting post of the circuit board and the conductive connecting member of the first circuit board are electrically connected to the second circuit layer of the first circuit board. The antenna carrier structure according to claim 9, further comprising: a processing chip; wherein: the second substrate, the first substrate and the third substrate respectively form a chip accommodating through hole, and the chip of the second substrate The accommodating through hole is connected with the wafer accommodating through hole of the first substrate, and the wafer accommodating through hole of the first substrate is connected with the wafer accommodating through hole of the third substrate; the processing wafer is provided on the second substrate and the first substrate. A substrate and a chip of the third substrate are accommodated in the through holes, and are electrically connected to the second antenna layer on the second surface of the third substrate.

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