TW202008641A - Antenna carrier plate structure wherein all contacts are guaranteed to be firmly and correctly connected without causing poor contact - Google Patents

Abstract

This invention relates to an antenna carrier plate structure including a first circuit board and a second circuit board; the first circuit board is provided with a first substrate and a conductive connecting piece penetrated into the first substrate, the conductive connecting piece has two opposite connecting ends respectively protruding out of the two opposite surfaces of the first substrate; the second circuit board includes a second substrate, a conducting hole is formed in the second substrate, a conducting column is arranged in the conducting hole, and a clamping recess is formed at one end of the conducting column; one end of the conductive connecting piece of the first substrate of the first circuit board is clamped with the clamping recess of the conducting column, in this way, the circuit boards can be fixedly connected in a rapid and stable clamping way and can be electrically connected to form a multilayer circuit board module, so that the joint tolerance generated in welding is avoided, and all contacts are guaranteed to be firmly and correctly connected without causing poor contact.

Description

Antenna carrier board structure

An antenna carrier board, especially an antenna carrier board structure.

The communication industry is one of the key research directions in the development of modern science and technology. In recent years, mobile communication has spread to every corner of the world, and most electronic products are equipped with wireless communication used in one or more frequency bands. Module, so how to integrate wireless communication modules of multiple frequency bands into one product to maximize the efficiency of space usage in the product, and at the same time avoid interference between the wireless communication module and other modules in the device, is the continuing wireless communication industry The development direction of continuous research and development of resources.

The wireless communication module mainly includes at least one antenna unit and a processing unit. Generally speaking, the design of the antenna unit depends on the frequency of the wireless signal to be transmitted or received by the antenna unit. Length, width and thickness to achieve the purpose of receiving wireless signals in specific frequency bands. In the design of the prior art antenna, the metal wires of the required length, width and thickness are arranged on an antenna carrier board in the form of circuit printing to form the antenna unit, and then the antenna carrier board is connected to a printed circuit by soldering Board, and the processing unit is also connected to the printed circuit board by soldering, so that the antenna carrier board can be connected to the processing unit through the printed circuit board to form a wireless communication module with a complete communication function .

Furthermore, in order to achieve good antenna unit transceiver efficiency at the same time, and avoid interaction with other circuit elements or modules in the electronic device, the wiring of the antenna unit is limited by many design criteria, especially when multiple sets of different frequency bands are to be integrated The antenna unit is in a wireless communication module, so that the wireless communication module can receive or send wireless signals in multiple frequency bands, multiple antenna units must be soldered to the printed circuit board separately and pass through the printed circuit board Is connected to the processing module.

However, when multiple antenna units are soldered to the printed circuit board, due to the soldering technology, there will be a joint tolerance when joining, so the more antenna units that need to be joined by soldering, the more joint tolerances will be generated If the number is too high, the probability of poor contact will be higher, which will lead to a decrease in the yield of the wireless communication module. Therefore, the wireless communication modules in the prior art must be further improved.

In view of the fact that the design of the antenna unit in the existing circuit board antenna module is limited by the circuit board manufacturing process and the antenna design specifications, it is difficult to be applied in multiple ways. The first circuit board includes a first substrate and a conductive connector, having a first surface and a second surface opposite; the conductive connector has a first connection end and a second connection end; the conductive The connecting member is penetrated on the first substrate, and the first connecting end extends and protrudes from the first surface, and the second connecting end extends and protrudes from the second surface. The second circuit board includes a second substrate and a conductive post, the second substrate has a first surface and a second surface opposite, wherein the first surface of the second substrate faces the first surface of the first substrate , And the second substrate forms a via hole, the via hole communicates with the first surface and the second surface of the second substrate, and the via post is disposed in the via hole, the via post is formed toward the end of the first substrate An engaging concave portion, and the engaging concave portion is engaged with the first connecting end of the conductive connecting member.

In the process of connecting the first circuit board and the second circuit board, as long as the second circuit board and the first circuit board reach the corresponding connection positions respectively, the connection ends of the conductive connection parts of the first circuit board It will correspondingly snap into the engaging concave portion of the second circuit board. At this time, through a pressing step, the connection end and the engaging concave portion are tightly fixed. In this way, the first circuit board and the second circuit board can be connected in a fast and stable manner to form a multi-layer circuit board module.

In this way, the first circuit board and the second circuit board can be firmly fixed and electrically connected without a soldering process, to avoid joint tolerances generated during welding, and the first connection end of each of the connection members Correspondence between the engaging recesses of the conducting posts also causes an automatic alignment effect between the first circuit board and the second circuit board, ensuring that the contacts are connected reliably and correctly without connection errors or contact bad.

Please refer to FIG. 1, the antenna carrier structure of the present invention includes a first circuit board 11 and a second circuit board 12. The first circuit board 11 includes a first substrate 111 and a conductive connector 112. The first substrate 111 has a first surface 1111 and a second surface 1112 opposite to each other. The conductive connector 112 penetrates the The first surface 1111 and the second surface 1112 of the first substrate 111 have a first connection end 1121 and a second connection end 1122 opposite to each other, and the first connection end 1121 and the second connection end 1122 extend and protrude respectively On the first surface 1111 and the second surface 1112 of the first substrate 111.

The second circuit board 12 is disposed on one side of the first surface 1111 of the first substrate 111 and includes a second substrate 121 and a conductive post 122. The second substrate 121 has a first surface 1211 and a second surface 1212 opposite to each other. The second substrate 121 is disposed with the first surface 1211 facing the first surface 1111 of the first substrate 111. The second substrate 121 forms a via hole, the via hole communicates with the first surface 1211 and the second surface 1212 of the second substrate 121, and corresponds to one of the conductive connectors 112 of the first substrate 111, and the conduction The post 122 is disposed in the through hole of the second substrate 121, and the conductive post 122 faces an end of the first substrate 111, that is, an end of the conductive post 122 facing the first surface 1211 of the second substrate 121 is formed with a card The concave portion 1221 is engaged, and the engaging concave portion 1221 is engaged with the corresponding first connection end 1121 of the conductive connector 112 of the first substrate 111.

Please also refer to FIG. 2, the conductive connection member 112 of the first circuit board 11 is engaged with the engaging recess 1221 of the conductive post 122 of the second circuit board 12, the second circuit board 12 and The first circuit board 11 can be fixed and electrically connected to each other by snapping. In this way, the first circuit board 11 and the second circuit board 12 can be firmly joined and electrically connected without a soldering process, to avoid the joining tolerance generated in the welding, and the first of the conductive connecting member 112 The correspondence between the connecting end 1121 and the engaging recess 1221 of the conducting post 122 also causes an automatic alignment effect between the first circuit board 11 and the second circuit board 12 to ensure that the contacts are connected accurately and correctly No connection errors or poor connections will occur.

Wherein, the conductive connecting members 112 of the first circuit board 11 can be electrically connected to the circuit layers disposed between the first surface 1111 and the second surface 1112 of the first substrate 111 respectively, and the conducting posts of the second circuit board 12 122 is also a power supply connecting the circuit layer disposed between the first surface 1211 and the second surface 1212 of the second substrate 121. Further, the connection between the conductive connector 112 of the first circuit board 11 and the conductive post 122 of the second circuit board 12 can achieve electrical connection between the first circuit board 11 and the second circuit board 12 The purpose of the circuit layer is to greatly enhance the diverse applicability of antenna circuit design.

Among them, in order to enable the engaging recess 1221 of the conductive connecting member 112 and the conducting post 122 to be firmly engaged, the following structure is preferably adopted: when the first connecting end 1121 of the conductive connecting member 112 of the first circuit board 11 has not been When being engaged in the engaging recess 1221 of the conducting post 122 of the second circuit board 12, the inner diameter length of the engaging recess 1221 of the conducting post 122 of the second circuit board 12 along the radial direction of the conducting post 122 is smaller than the The outer diameter length of the first connection end 1121 of the conductive connection member 112 of the first circuit board 11 is along the radial direction of the conducting post 122. Therefore, when the first connecting end 1121 of the conductive connecting member 112 of the first circuit board 11 is engaged with the engaging recess 1221 of the conducting post 122 of the second circuit board 12 by pressing, the first circuit The first connecting end 1121 of the conductive connecting member 112 of the board 11 is deformed and is forced to be tightly engaged in the engaging recess 1221 of the conducting post 122 of the second circuit board 12.

Referring again to FIGS. 1 and 2, in a first preferred embodiment of the present invention, it further includes a third circuit board 13 disposed on the second of the first substrate 111 The surface 1112 includes a third substrate 131 having a first surface 1311 and a second surface 1312 opposite to each other, wherein the first surface 1311 of the second substrate 131 is directed toward the first surface of the first substrate 111 Two surfaces 1112 are provided. The third substrate 131 forms a via hole, the via hole communicates with the first surface 1311 and the second surface 1312 of the third substrate 131, and is disposed corresponding to one of the conductive connectors 112 of the first substrate 111. A conductive post 132 is provided in the through hole of the third substrate 131, and the end of the conductive post 132 facing the first substrate 111, that is, the end of the conductive post 132 facing the first surface 1311 of the third substrate 131 is formed with The concave portion 1321 is engaged, and the concave portion 1321 is engaged with the second connection end 1121 of the conductive connector 112 of the corresponding first substrate 111.

The connection ends 1121 of the conductive connection members 112 provided on the first circuit board 11 correspond to not only the positions of the engaging recesses 1221 and 1321 of the conduction posts 122 and 132 of the second circuit board 12 and the third circuit board 13, but also Departments can be engaged with each other. Therefore, in the process of connecting the first circuit board 11 and the second circuit board 12, as long as the second circuit board 12, the third circuit board 13 and the first circuit board 11 reach the corresponding connection positions respectively , The connecting end 1121 of the conductive connecting member 112 of the first circuit board 11 will slightly fall into the engaging recesses 1221 and 1321 of the second circuit board 12 and the third circuit board 13, and then a step of pressing , So that the first connecting end 1121 and the second connecting end 1122 are deformed to be tightly connected to each of the engaging recesses 1221 and 1321. In this way, the first circuit board 11, the second circuit board 12 and the third circuit board 13 can be connected through a fast and low error rate to form a multi-layer circuit board module.

Further, in the antenna design, through the circuit design of the circuit board, the circuit layers of the first circuit board 11, the second circuit board 12, and the third circuit board 13 can be combined to form an antenna module. For example, a circuit designer can form antenna units of different widths, thicknesses, or different materials on the second circuit board 12 and the third circuit board 13 according to requirements, respectively, to receive wireless communication signals in different frequency bands, and then pass the After the conductive connectors 112 of the first circuit board 11 are electrically connected to each other, a complete wireless communication module is formed. In this way, the flexibility of antenna design and the multiple applicability are increased.

Please refer to FIG. 3. In a second preferred embodiment of the present invention, each conductive connection 112 of the first circuit board 11 is a metal post, for example, the same circuit layer as the first circuit board 11 Copper pillar of material, and the conductive connecting member 112 further includes a first pressing layer 1123 and a second pressing layer 1124, the first pressing layer 1123 covers the first connecting end 1121 of the conductive connecting member 112 The second press-fit layer 1124 covers the surface of the second connection end 1122. The first pressing layer 1123 and the second pressing layer 1124 are a soft metal layer, such as a gold layer or a nickel layer. During the press-fitting of the conductive post 122 of the second circuit board 12 and the conductive connecting member 112 of the first circuit board 11, the first press-fit layer 1123 and the second press-fit layer 1124 are soft and stressed Later, it is easier to deform, so that the engaging recesses 1221, 1321 of each of the conducting holes 122, 132 and the first connection end 1121 and the second connection end 122 of the conductive connection member 112 are easier to press and can be more tightly joined.

Referring to FIG. 4, in a third preferred embodiment of the present invention, the first circuit board 11 includes a first circuit layer 113 and a second circuit layer 114, and the second circuit board 12 further includes One first antenna layer 123. The first antenna layer 123 is disposed on the second surface 1212 of the second substrate 121. The first antenna layer 123 forms a first antenna unit. The first antenna unit is electrically connected to the first circuit layer 113 of the first circuit board 112 through the conductive post 122 of the second circuit board 12 and the conductive connection member 112 of the first circuit board 11.

Similarly, the third circuit board 13 further includes a second antenna layer 133, which is disposed on the second surface 1312 of the third substrate 131 and forms a second antenna unit. The second antenna unit is electrically connected to the second circuit layer 114 of the first circuit board 112 through the conductive post 132 of the third circuit board 13 and the conductive connection member 112 of the first circuit board 11.

The first antenna layer 123 and the second antenna layer 133 respectively form an antenna unit and are disposed outside the second circuit board 12 and the third circuit board 13, that is, the second surface 1212 of the second substrate 121 and The second surface 1312 of the third substrate 131 receives wireless signals.

The antenna carrier board structure of the present invention connects the separately manufactured circuit carrier boards in a layered press-fit manner, and when it is desired to connect the electrically connected integrated circuit wafer, it can be easily formed by forming a through hole in the adjacent circuit board The processing wafer is additionally electrically connected to any substrate of the present invention.

For example, referring to FIG. 5, a fourth preferred embodiment of the present invention further includes a processing wafer 14, and the preferred embodiment of the arrangement is as follows: The second substrate 121 is formed with a chip housing Through hole 120, the processing wafer 14 is disposed in the receiving through hole 120 and is disposed on the first surface 1111 of the first substrate 111 through the wafer receiving through hole 120 to electrically connect the first circuit of the first substrate 111 Layer 113.

Please refer to FIG. 6, and in the fifth preferred embodiment of the present invention, another processing method of the processing wafer 14 is as follows: the second substrate 121, the first substrate 111, and the third substrate 131 are formed separately There is a chip accommodating through hole 120, 110, 130, and the chip accommodating through holes 120, 110, 130 of the second substrate 121, the first substrate 111, and the third substrate 131 are correspondingly arranged and interconnected, and the The processing wafer 14 is disposed in the wafer receiving holes 120, 110, 130 of the second substrate 121, the first substrate 111, and the third substrate 131 and electrically connected to the second antenna unit of the second antenna layer 133 Sexual connection.

The above is only the preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed in the preferred embodiment as above, it is not intended to limit the present invention. Anyone who is familiar with this technology Personnel, within the scope of not departing from the technical solutions of the present invention, when the technical contents disclosed above can be used to make some changes or modifications to equivalent embodiments of equivalent changes, but any content that does not depart from the technical solutions of the present invention, according to the present invention Any simple modifications, equivalent changes, and modifications made to the above embodiments by the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

11‧‧‧ First circuit board 110‧‧‧Chip accommodating opening 111‧‧‧ First substrate 1111‧‧‧First surface 1112‧‧‧Second surface 112‧‧‧Conductive connector 1121‧‧‧First Connecting end 1122‧‧‧ Second connecting end 1123‧‧‧ First press layer 1124‧‧‧ Second press layer 113‧‧‧ First circuit layer 114‧‧‧ Second circuit layer 12‧‧‧ Second Circuit board 120‧‧‧Chip accommodating opening 121‧‧‧Second substrate 1211‧‧‧First surface 1212‧‧‧Second surface 122‧‧‧Conducting post 1221‧‧‧Engage recess 123‧‧‧First Antenna layer 13‧‧‧ Third circuit board 130‧‧‧ Chip receiving opening 131‧‧‧ Third substrate 1311‧‧‧ First surface 1312‧‧‧Second surface 132‧‧‧Conducting post 1321‧‧‧ Engagement recess 133‧‧‧second antenna layer 14‧‧‧ processing chip

FIG. 1 is a schematic diagram of an isolated cross section of the antenna carrier board structure of the present invention. 2 is a schematic cross-sectional view of the antenna carrier board structure of the present invention. 3 is a schematic cross-sectional view of a second preferred embodiment of the antenna carrier structure of the present invention. 4 is a schematic cross-sectional view of a third preferred embodiment of the antenna carrier structure of the present invention. 5 is a schematic cross-sectional view of a fourth preferred embodiment of the antenna carrier structure of the present invention. 6 is a schematic cross-sectional view of a fifth preferred embodiment of the antenna carrier structure of the present invention.

11‧‧‧ First circuit board

111‧‧‧The first substrate

1111‧‧‧First surface

1112‧‧‧Second surface

112‧‧‧Conductive connector

1121‧‧‧ First connection

1122‧‧‧Second connector

12‧‧‧ Second circuit board

121‧‧‧Second substrate

1211‧‧‧First surface

1212‧‧‧Second surface

122‧‧‧Conducting column

1221‧‧‧Snap recess

13‧‧‧ Third circuit board

131‧‧‧The third substrate

1311‧‧‧First surface

1312‧‧‧Second surface

132‧‧‧conducting column

1321‧‧‧Snap recess

Claims (10)

An antenna carrier board structure includes: a first circuit board, including: a first substrate having a first surface and a second surface opposite; a conductive connector having a first connection end and a first Two connection ends; the conductive connection piece is penetrated on the first substrate, and the first connection end extends out of the first surface, and the second connection end extends out of the second surface; a The second circuit board includes: a second substrate having a first surface and a second surface opposite to each other, wherein the first surface of the second substrate faces the first surface of the first substrate; the second substrate forms a A via hole, the via hole communicates with the first surface and the second surface of the second substrate; a via post is disposed in the via hole, an end of the via post toward the first substrate forms an engaging recess, and the The engaging concave portion is engaged with the first connecting end of the conductive connecting member. The antenna carrier structure according to claim 1, wherein: when the first connection end of the conductive connector of the first circuit board has not been engaged in the engaging recess of the conducting post of the second circuit board, the first The length of the inner diameter of the engaging recess of the conducting column of the two circuit boards along the radial direction of the conducting column is smaller than the outer diameter length of the first connecting end of the conductive connector of the first circuit board along the radial direction of the conducting column; when the first When the first connection end of the conductive connection piece of a circuit board is clamped in the engaging recess of the conducting post of the second circuit board by pressing, the first connection end of the conductive connection piece of the first circuit board is It is deformed and pressed tightly into the engaging recess of the conducting post of the second circuit board. The antenna carrier structure according to claim 1, further comprising: a third circuit board, comprising: a third substrate having a first surface and a second surface opposite to each other, wherein the first of the third substrate The surface faces the second surface of the first substrate; the third substrate forms a via hole, the via hole communicates with the first surface and the second surface of the third substrate; a via post is disposed in the via hole, and the An engaging recess is formed at an end of the conducting post facing the first substrate, and the engaging recess is engaged with the connection end of the conductive connector. The antenna carrier structure according to any one of claims 1 to 3, wherein the conductive connection member is a metal post. The antenna carrier structure according to any one of claims 1 to 3, wherein the conductive connection member comprises: a first press-fit layer covering the surface of the first connection end of the conductive connection member; a second press-fit Layer covering the surface of the second connection end of the conductive connector. The antenna carrier structure according to claim 5, wherein the pressing layer of the conductive connection member is a nickel layer or a gold layer. The antenna carrier structure according to claim 1, wherein: the first substrate of the first circuit board is formed with a first circuit layer, and the first circuit layer is electrically connected to the conductive connector; the second circuit The board further includes: a first antenna layer disposed on the second surface of the second substrate, the first antenna layer forming a first antenna unit; wherein the first antenna unit passes through the second circuit The conducting post of the board and the conductive connection member of the first circuit board are electrically connected to the first circuit layer of the first circuit board. The antenna carrier structure according to claim 7, further comprising: a processing wafer; wherein: the second substrate forms a chip-receiving through-hole; the processing chip is disposed in the chip-receiving through-hole of the second substrate, and The first circuit layer disposed on the first surface of the first substrate is electrically connected to the first substrate. The antenna carrier structure according to claim 3, wherein: the first substrate of the first circuit board is further formed with a second circuit layer, and the second circuit layer is electrically connected to the conductive connector; the third The circuit board further includes: a second antenna layer disposed on the second surface of the third substrate, the second antenna layer forming a second antenna unit, wherein the second antenna unit passes through the third The conducting post of the circuit board and the conductive connection member of the first circuit board are electrically connected to the second circuit layer of the first circuit board. The antenna carrier structure according to claim 9, further comprising: a processing chip; wherein: the second substrate, the first substrate and the third substrate respectively form a chip accommodating through hole, and the chip of the second substrate The accommodating through hole is connected to the wafer accommodating through hole of the first substrate, and the wafer accommodating through hole of the first substrate is through the accommodating hole of the third substrate; the processing wafer is disposed on the second substrate A substrate and a chip of the third substrate are accommodated in the through holes, and are electrically connected to the second antenna layer on the second surface of the third substrate.

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