TWI697091B - Semiconductor package having outer metal element and fabricating method thereof - Google Patents

Abstract

The present invention relates to a semiconductor package having outer metal element and fabricating method thereof. The semiconductor package has a circuit substrate having a plurality of first and second pads. A plurality of electronic devices electrically connected to the first pads. An encapsulation is formed on the circuit substrate to encapsulate the electric devices. A plurality of openings are formed through the encapsulation and the second pads are exposed to the openings. A previously-formed metal element plugs into the openings to electrically connect the second pads. Therefore, the metal element is placed outside the encapsulation and isn’t encapsulated in the encapsulation. A unique mold is not required to form the encapsulation. In addition, a thickness of the capsulation is not increased to encapsulate the metal element to ensure a production yield of the semiconductor package.

Description

Semiconductor packaging structure with external metal element and its manufacturing method

The invention relates to a semiconductor packaging structure and its manufacturing process, in particular to a semiconductor packaging structure with external metal components and its manufacturing method.

In special application semiconductor packaging structures, it is necessary to integrate the antenna into the semiconductor packaging structure; however, at present, in the manufacturing process of a semiconductor packaging structure with an antenna, the antenna element is soldered to the substrate together with the chip and the passive element, Then the mold is filled with glue to encapsulate the antenna, the chip and the passive components in one package at a time.

Although the current process is no different from the general semiconductor packaging process, in fact, the antenna position must be higher than the chip and passive components, so that the thickness of the package increases. In addition to the increase in the amount of glue, a special stamping mold must be prepared separately to successfully Antennas, chips and passive components are packaged in one package at a time. For subsequent cutting steps, cutting thicker encapsulants also has problems such as shortened tool life, reduced cutting speed, and reduced yield. The semiconductor package after cutting The structure may also have problems such as too large tolerances, skewed cutting surfaces, offsets, etc.

Therefore, it is necessary to further improve the current manufacturing process of the semiconductor packaging structure with an antenna.

In view of the fact that the current manufacturing process of the semiconductor packaging structure with an antenna causes many problems, the main object of the present invention is to provide a new semiconductor packaging structure with an external metal element and a manufacturing method thereof to overcome the problem of the previous disclosure.

The main technical means used to achieve the above purpose is that the semiconductor package structure with external metal components includes: a circuit substrate on which a plurality of first pads and a plurality of second pads are formed on the surface; a plurality of electronic components, each of which The pins of the electronic components are respectively electrically connected to the corresponding component pads; an adhesive layer is formed on the surface of the circuit substrate to cover the electronic components therein, and the sealing layer corresponds to each A through hole is formed at the position of the second pad to expose each of the second pads; an outer metal element is pre-formed and electrically connected to the circuit board, and includes: a metal outer plate, which is located at the seal Above the adhesive layer, the metal outer plate is not flat on the upper surface of the sealing body; and a plurality of metal pillars extend vertically downward from the bottom surface of the metal outer plate and are electrically connected to the second pads, respectively; and A protective layer is filled in each of the through holes to be flush with the upper surface of the sealant.

As can be seen from the above description, the semiconductor package structure with an external metal element of the present invention is mainly used to encapsulate the external metal element after forming the encapsulant; thus, the encapsulant of the semiconductor package structure of the present invention does not need to separately prepare a special stamper The mold is used to thicken the sealant layer to cover the outer metal component, which can maintain the life of the cutting tool and the semiconductor package structure after cutting without skew or deviation, ensuring the yield of the process.

The main technical means used to achieve the above purpose is to make the manufacturing method of the semiconductor package structure with external metal components include the following steps: (a) prepare a circuit substrate and a plurality of pre-formed outer metal components, the circuit substrate includes a plurality of component regions; wherein in each component region, a first surface of the circuit substrate includes a plurality of first pads, respectively And a plurality of second pads; (b) electrically connect the plurality of electronic components to the corresponding first pads; (c) a gel is formed on the first surface of the circuit substrate to cover the electronic components therein ; (D) A through hole is formed downward from the upper surface of the sealing body corresponding to each second pad position; (e) The pre-formed metal components are respectively disposed in the sealing body of each of the component regions And electrically connect to the second pad through the through holes, and each of the metal outer plates is not flat on the upper surface of the sealant; and (f) a protective layer is filled in each of the through holes; Wherein, the protective layer in each of the through holes is flush with the sealant layer; and (g) Based on the adjacent part of the device area of the circuit substrate, a cutting tool is used to cut down from the sealant to form a plurality of An independent half-body package structure with external metal components.

It can be seen from the above description that the manufacturing method of the present invention mainly forms the encapsulant first, and then encapsulates the outer metal components; thus, the encapsulant of the semiconductor package structure of the present invention does not need to prepare a special stamper mold to thicken the encapsulant The layer covers the outer metal component, which can maintain the life of the cutting tool and the semiconductor package structure after cutting without skew or deviation, ensuring the yield of the process.

1. 1’: Half body package structure

10: circuit board

100: component area

11: First pad

12: second pad

20: Electronic components

30: Sealant

31: through hole

32: protective layer

40, 40’: outer metal components

41: Metal outer plate

42: Metal pillar

43: Tin

43’: Tin ball

FIGS. 1A to 1H are cross-sectional views of a semiconductor package structure corresponding to a method of manufacturing a semiconductor package structure of the present invention.

FIG. 2 is a cross-sectional view of a semiconductor package structure made by the manufacturing method of FIGS. 1A to 1D.

FIG. 3 is a cross-sectional view of another semiconductor package structure made by the manufacturing method of FIGS. 1A to 1D.

4A to 4H are cross-sectional views of a semiconductor package structure corresponding to another method of manufacturing a semiconductor package structure of the present invention.

The present invention is to improve the semiconductor packaging structure with external metal components and its manufacturing method, avoiding the use of special stamper molds to form excessively thick encapsulants, so as to maintain normal packaging yield. The following is a detailed description of the technical contents of the semiconductor package structure with an external metal element and its manufacturing method according to the present invention in conjunction with a plurality of embodiments.

Please refer to FIG. 1A to FIG. 1H, the first preferred embodiment of the manufacturing method of the semiconductor package structure of the present invention is introduced first, which includes the following steps:

As shown in FIG. 1A, in step (a), a circuit substrate 10 is first prepared. The circuit substrate 10 includes a plurality of device regions 100. In each device region 100, a first surface of the circuit substrate 10 is respectively A plurality of first pads 11 and a plurality of second pads 12 are included.

As shown in FIG. 1B, in step (b), a plurality of electronic components 20 are electrically connected to the corresponding first pads 11; in this embodiment, the electronic components 20 are soldered to the corresponding first pads 11. The electronic components 20 include chips and passive components.

As shown in FIG. 1C, in step (c), a sealant 30 is formed on the first surface of the circuit substrate 10, and the sealant 30 is used to cover the electronic components 20 therein. In this embodiment, a liquid mold is poured on the circuit substrate 10 by a stamper mold, and the sealing body 30 is formed after the liquid gel is cured.

As shown in FIG. 1D, in step (d), a through hole 31 is formed downward from the upper surface of the sealing body 30 corresponding to the position of each second pad 12. In this embodiment, the through holes 31 are formed on the upper surface of the sealing body 30 by a laser opening method.

As shown in FIG. 1E, in step (e), a plurality of pre-formed outer metal elements 40 are respectively disposed on the encapsulant 30 of each element area 100, and each of the outer metal elements 40 passes through the through holes 31 is electrically connected to the second pad 12. In this embodiment, the outer metal element 40 includes a metal outer plate 41 and a plurality of metal posts 42; wherein each of the metal posts 42 extends vertically downward from the bottom surface of the metal outer plate 41, and one of each metal post 42 The free end is pre-dipped with tin 43 and then inserted into the corresponding through-hole 31 to be soldered with the second pad 12; in addition, the outer metal element 40 is an antenna element, and the metal outer plate 41 is formed with an antenna pattern The metal pillars 42 are used as the signal feeding pin and the power signal pin of the antenna element.

As shown in FIG. 1F, in step (f), each of the through holes 31 is filled with a protective layer 32 to isolate the metal pillars 42 from the second pad 12 from the outside world, and the protective layer 32 is connected to the The upper surface of the sealant layer 30 is flush.

As shown in FIG. 1G and FIG. 1H, in step (g), the adjacent area L of the device region 100 of the circuit substrate 10 is used as a standard, and a cutting tool is used to cut down from the sealing compound 30 to form a plurality of independent The half body packaging structure 1 with external metal components.

That is, as shown in FIG. 2, the semiconductor package structure 1 manufactured by the first preferred embodiment of the previously disclosed manufacturing method includes a circuit substrate 10, a plurality of electronic components 20, an adhesive layer 30, an outer metal component 40, and a protection Layer 32.

The first surface of the circuit board 10 includes a plurality of first pads 11 and a plurality of second pads 12.

The electronic components 20 are electrically connected to the corresponding first pads 11 respectively. In this embodiment, the electronic components 20 include a chip and a passive component.

The sealant layer 30 is formed on the first surface of the circuit substrate 10 to cover the electronic components 20 therein, and the sealant layer 30 is formed with a through hole 31 corresponding to the position of each second pad 12 So that each second pad 12 is exposed.

The outer metal element 40 is electrically connected to the circuit board 10 and includes a metal outer plate 41 and a plurality of metal pillars 42; wherein the metal outer plate 41 is located on the sealing layer 30 and is in contact with the sealing body 30 The upper surface of the metal is kept at a distance, and the metal pillars 42 extend vertically downward from the bottom surface of the metal outer plate 41 and are electrically connected to the second pads 12 respectively; in this embodiment, the metal pillars 42 are Solder to the second pad 12.

The protective layer is filled in each of the through-holes 31 with a protective layer 32 that is flush with the upper surface of the sealant layer 30 to isolate the metal pillars 42 from the second pad 12 from the outside world.

Please refer to FIG. 3 again. Another semiconductor package structure 1'made by the first preferred embodiment of the previously disclosed manufacturing method also includes a circuit substrate 10, a plurality of electronic components 20, an adhesive layer 30, a The outer metal element 40' and a protective layer 34, but the outer metal element 40' is a metal shell, so the metal outer plate 41 is fully flat on the upper surface of the sealing body 30 for heat dissipation; and The metal post 42 is in the shape of a plate and is formed downward from around the metal outer plate 41 to be electrically connected to the second pad 12 and fixed on the circuit substrate 10. In addition, in order to make the metal shell have the function of resisting electromagnetic interference, the second pads 12 electrically connected to them are ground signal pads.

Please refer to FIGS. 4A to 4H again, which is the second preferred embodiment of the manufacturing method of the semiconductor package structure of the present invention, which includes the following steps:

As shown in FIG. 4A, in step (a), a circuit substrate 10 is first prepared. The circuit substrate 10 includes a plurality of device regions 100. In each device region 100, a first surface of the circuit substrate 10 is respectively A plurality of first pads 11 and a plurality of second pads 12 are included.

As shown in FIG. 4B, in step (b), a plurality of electronic components 20 are electrically connected to corresponding first pads 11, and solder balls 43' are formed on each second pads 12; Examples, the electricity The sub-components 20 are soldered to the corresponding first pads 11, and the electronic components 20 include chips and passive components.

As shown in FIG. 4C, in step (c), a sealant 30 is formed on the first surface of the circuit substrate 10, and the sealant 30 is used to cover the electronic components 20 and the solder balls 43' therein. In this embodiment, a stamper mold is used to fill the circuit board with liquid glue, and the sealing body 30 is formed after the liquid glue is cured.

As shown in FIG. 4D, in step (d), a through hole 31 is formed downward from the upper surface of the sealing body 30 corresponding to the position of each second pad 12. In this embodiment, the through holes 31 are formed in the upper surface of the sealing body 30 by a laser opening method. Since the laser opening has high heat, the solder balls 43' can be melted together.

As shown in FIG. 4E, in step (e), a plurality of pre-formed outer metal elements 40 are respectively disposed on the encapsulant 30 of each element area 100, and the outer metal elements 40 pass through the through holes 31 is electrically connected to the second pad 12. In this embodiment, the outer metal element 40 includes a metal outer plate 41 and a plurality of metal posts 42; wherein each of the metal posts 42 extends vertically downward from the bottom surface of the metal outer plate 41, and one of each metal post 42 The free end is directly inserted into the corresponding through hole 31 to make contact with the molten solder ball 43'. After the solder ball 43' is solidified, the soldering with the second pad 12 is completed.

As shown in FIG. 4F, in step (f), each of the through holes 31 is filled with a protective layer 32 to isolate the metal pillars and 42 from the second pad 12 from the outside world.

As shown in FIGS. 4G and 4H, in step (g), the adjacent area of the device region 100 of the circuit board 10 is used as a standard, and a cutting tool is used to cut down from the encapsulant 30 to form an independent tool. Metal component half package structure 1.

In summary, from the first and second preferred embodiments of the manufacturing method of the present invention, it can be seen that the step of forming the sealant by the die-casting is before the provision of a plurality of pre-formed external metal components, so the existing semiconductor can be used For the component's stamping die, no special stamping die is required, and the thickness of the sealant is also As long as it is enough to cover the chip, passive components, etc., it can maintain the existing thickness; after that, it is only necessary to increase the opening step of the encapsulant to smoothly connect the external metal component and the second pad of the circuit substrate The electrical connection and the opening step are already the existing process technology of the packaging process. There is no need to separately prepare or set up corresponding machines, and it does not affect the process yield. Therefore, the metal outer plate of the outer metal element of the semiconductor package structure of the present invention is exposed outside the encapsulant without being covered by the encapsulant.

The above is only an embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed in the above embodiment, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field belongs to, Within the scope of not departing from the technical solution of the present invention, when the technical contents disclosed above can be used to make some changes or modifications to equivalent embodiments of equivalent changes, but any content that does not depart from the technical solution of the present invention is based on the technical essence of the present invention Any simple modifications, equivalent changes and modifications made to the above embodiments still fall within the scope of the technical solution of the present invention.

1: Half body packaging structure

10: circuit board

11: First pad

12: second pad

20: Electronic components

30: Sealant

31: through hole

32: protective layer

40: outer metal element

41: Metal outer plate

42: Metal pillar

43: Tin

Claims (10)

A semiconductor packaging structure with external metal components includes: a circuit substrate whose first surface includes a plurality of first pads and a plurality of second pads; a plurality of electronic components, each of which is electrically connected to a corresponding A component pad; an adhesive layer is formed on the first surface of the circuit substrate to cover the electronic components therein, and the sealing layer is formed with a through hole corresponding to each second pad position, Each of the second pads is exposed; an outer metal element is pre-formed and electrically connected to the circuit board, and includes: a metal outer plate, which is located on the sealant layer, the metal outer plate is not flat It is attached to the upper surface of the encapsulant; and a plurality of metal posts extending vertically downward from the bottom surface of the metal outer plate and are electrically connected to the second pads respectively; and a protective layer filled in each through hole Wear it to be flush with the upper surface of the sealant. The semiconductor packaging structure with an external metal element as described in claim 1, wherein the external metal element is an antenna element, the metal outer plate is formed with an antenna pattern, and includes a plurality of metal pillars as a signal of the antenna element The feeding pin and the power signal pin; and the metal outer plate is kept at a distance from the upper surface of the sealing body. The semiconductor packaging structure with an external metal element as described in claim 1, wherein: the external metal element is a metal shell, the metal outer plate is fully flat on the upper surface of the encapsulant, and each of the metal pillars is It is in the form of a plate and is formed downward from the periphery of the metal outer plate to be electrically connected to the second pad. As described in claim 3, in the semiconductor package structure with external metal elements, the second pad is a ground signal pad. As described in any one of claims 1 to 4, the semiconductor package structure with an external metal element, each of the metal pillars is soldered to the corresponding second pad with solder. A method for manufacturing a semiconductor packaging structure with external metal components includes the following steps: (a) preparing a circuit substrate and a plurality of pre-formed external metal components, the circuit substrate includes a plurality of component regions; wherein in each component region, the A first surface of the circuit substrate respectively includes a plurality of first pads and a plurality of second pads; (b) electrically connects the plurality of electronic components to the corresponding first pads; (c) on the circuit board A gel is formed on a surface to cover the electronic components therein; (d) a through hole is formed downward from the upper surface of the gel to correspond to each second pad position; (e) the pre-molds The external metal components are respectively disposed on the sealing body in each of the component regions, and are electrically connected to the second pad through the through holes, and each metal outer plate is not flat on the upper surface of the sealing body ; And (f) a protective layer is filled in each of the through-holes; wherein, the protective layer in each of the through-holes is flush with the sealant layer; and (g) the adjacent area of the circuit board element area is It is accurate to use a cutting tool to cut down from the sealing body to form a plurality of independent half-body packaging structures with external metal components. The method for manufacturing a semiconductor package structure with an external metal element as described in claim 6, in step (e), each of the external metal elements includes a metal outer plate and a plurality of metal pillars; wherein each of the metal pillars is derived from the metal The bottom surface of the outer plate extends vertically downward, and a free end of each metal post is pre-dipped with tin and then placed into a corresponding through hole to be welded with the second pad. The method for manufacturing a semiconductor package structure with an external metal element as described in claim 6, wherein: the above step (b) further forms solder balls on each of the second pads; The sealing system in the step (c) covers the solder balls; in the step (d), the through holes are formed by laser opening and the solder balls are melted together; and in the step ( In e), each of the outer metal components includes a metal outer plate and a plurality of metal pillars; wherein each of the metal pillars extends vertically downward from the bottom surface of the metal outer plate, and a free end of each metal pillar is placed into the corresponding After the through hole, to weld with the second pad. The method for manufacturing a semiconductor package structure with an external metal element as described in claim 7 or 8, wherein each of the external metal elements is an antenna element, the metal outer plate is formed with an antenna pattern, and the metal pillars are used as The signal feeding pin of the antenna element and the power signal pin; and the metal outer plate is kept at a distance from the upper surface of the sealing compound. The method for manufacturing a semiconductor packaging structure with an external metal element as described in claim 7 or 8, the external metal element is a metal shell, the metal outer plate is fully flat on the upper surface of the encapsulant, and each metal The column is in the form of a plate and extends vertically downward from the periphery of the metal outer plate.

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