TWI695402B - Chip fuse and method for producing the same - Google Patents

Abstract

The present invention provides a chip fuse that is improved to release impact or steam generated during fusing in a well-balanced manner and a method for manufacturing the same. The chip fuse is formed by a fuse body and a pair of metal covers. The fuse body has a pair of upper and lower ceramic substrates, a fuse support, and fuses. The pair of upper and lower ceramic substrates It is arranged upside down; the fuse support is sandwiched between ceramic substrates and has a through hole in the vertical direction in the center; the fuse is passed between the two ends of the fuse support through the through hole carrier, so The metal cover is fitted on both ends of the fuse body; the upper ceramic substrate and the fuse support and the lower ceramic substrate and the fuse support, respectively, the opposite surfaces are adhered to each other and the through holes are closed, and at the same time A non-adhesive part is formed on a part of.

Description

Chip fuse and its manufacturing method

The present invention relates to a small-sized chip fuse, and relates to a chip fuse used for erecting a fuse in a main body in a power supply device having the same rated current and voltage as a general household, and a manufacturing method thereof.

As the fuse (primary fuse) used in the protection circuit on the primary side of a transformer suitable for a power supply device, a tube fuse mounted on a fuse holder is generally used. However, recently, in accordance with market requirements such as miniaturization and weight reduction of power supply devices, a method of directly surface-mounting a fuse on a wiring board is used. Therefore, instead of using a cylinder made of glass, a square-shaped fuse formed by stretching a fuse element such as a wire or a ribbon in a box-shaped case made of ceramic or the like is stretched between the two electrodes. Fuse in the shape of a shell. As a prior art example of a box-shaped case, in Japanese Patent Publication No. 2012-174443, a fuse holder made of ceramic, a fuse, a cylindrical case made of ceramic, and a metal cover are known A chip fuse, wherein the ceramic fuse support is provided with a through hole in the center, the fuse spans the through hole and is linearly erected at opposite ends of the fuse support, and the cylindrical ceramic The housing is inserted into the fuse as a fuse support with fuses In the combined body, the metal cover puts the fuses protruding from both ends of the fuse holder into a conducting state and is provided at both ends of the cylindrical body of the housing.

Patent Literature

Patent Document 1: Japanese Patent Publication No. 2012-174443

However, in the above-mentioned conventional chip fuse, since a fuse combination composed of a fuse and a fuse support is inserted into a cylindrical ceramic case to form a fuse, the fuse is not interrupting current. The place where the impact generated during operation is released may damage or deform the case. In addition, since there is no place to release evaporative substances (steam) and the like of the fuse element generated at the time of fusing, and vapor remains in the case after fusing, there are fuse terminals or fuses between which fuse cannot be ensured The insulation resistance between the fuse ends is such a defect.

The present invention has been made to solve such conventional shortcomings, and an object of the present invention is to provide a chip fuse that can be improved to release impact or steam generated during fusing in a balanced manner and a method for manufacturing the same.

According to the present invention, as a means for solving the above-mentioned technical problem, there is provided a chip fuse including a fuse body and a pair of metal covers, the fuse body having a pair of upper and lower ceramic substrates arranged vertically opposite each other , A fuse holder sandwiched between the upper and lower ceramic substrates and having a through hole in the vertical direction at the center, and a fuse supported between the two ends of the fuse holder through the through hole carrier , The pair of metal covers are fitted to both ends of the fuse body in a conducting state with the fuses protruding from both ends of the fuse holder, the upper The side ceramic substrate and the fuse support, and the lower ceramic substrate and the fuse support, respectively, the opposite surfaces are adhered to each other and close the through-hole, and at the same time, a non-adhesive portion is formed on a part of the adhesive surface .

In one embodiment, the non-adhesion portion may be formed on both sides of the through hole in the longitudinal direction.

The fuse support may be composed of an upper fuse support division body and a lower fuse support division body stacked in the up-down direction, and a through hole penetrates the upper fuse support division body and the lower fuse in the up-down direction The split body is supported, and the fuse passes through the through hole in the longitudinal direction of the fuse support and is carried by the carrier. In addition, the non-adhesive portions may be formed between the upper ceramic substrate and the upper fuse support division body, between the upper fuse support division body and the lower fuse support division body, and the lower fuse support division body and Between the lower ceramic substrates.

As another method, the fuse support may have a single structure, and the fuse may be passed through the through hole of the fuse support, and may be mounted on the upper end and the lower end of the two ends of the fuse support in an inclined state. between.

In addition, according to the present invention, there is provided a method for manufacturing a chip fuse, which is a method for manufacturing the above-mentioned chip fuse, which passes through the through hole between the two ends of the fuse support having a through hole in the vertical direction at the center Carrier fuse, which holds a fuse carrier with a fuse carrier between a pair of ceramic substrates facing up and down, and bonds the pair of ceramic substrates and the fuse support between opposing surfaces At the same time, a non-adhesive portion is formed on a part of the adhesive surface to form a fuse body, and a metal cover is fitted to the both ends of the fuse body in a state of conduction with the fuse.

In one embodiment, the non-adhesive portions may be formed on both sides of the through hole in the longitudinal direction.

The fuse support body may be composed of an upper fuse support division body and a lower fuse support division body stacked in the up-down direction, and a through hole vertically penetrates the upper fuse support division body and the lower fuse support division body Between the upper fuse support division body and the lower fuse support division body, the fuse passes through the through hole in the longitudinal direction of the fuse support body and is carried. In addition, non-adhesive portions may be formed between the upper ceramic substrate and the upper fuse support division body, between the upper fuse support division body and the lower fuse support division body, and the lower fuse support division body, respectively With the lower ceramic substrate.

As another method, the fuse support may have a single structure, and the fuse may pass through the through hole of the fuse support, and the inclined carrier may be placed between the upper end and the lower end of the opposite ends of the fuse support. between.

Furthermore, according to the present invention, there is provided a method for manufacturing a chip fuse, which is a method for manufacturing the above chip fuse, characterized in that an upper fuse having a through hole in the vertical direction at the center supports a divided body and an upper ceramic substrate, And the lower fuse supporting split body and the lower ceramic substrate having through holes in the center in the vertical direction are adhered between the respectively opposed surfaces, and at the same time, a non-adhesive portion is formed on a part of the adhesion surface to fuse on the lower side The two ends of the support split body pass through the through-hole and carry the fuse, and the lower fuse support split body carrying the fuse and the upper fuse support split body are arranged up and down relative to each other, on the opposite surface At the same time, at the same time, a non-adhesive portion is formed on a part of the bonding surface to form a fuse body, and a metal cover is fitted to the both ends of the fuse body in a state of conducting with the fuse.

In one embodiment, each non-adhesive portion may be formed on both sides of the through hole in the longitudinal direction.

According to the present invention, a fuse body having a pair of upper and lower ceramic substrates, a fuse support, and a fuse provided on the fuse support is the main structural element. Between the lower ceramic substrate and the fuse support, the opposing surfaces are adhered to seal the through-hole, and a non-adhesive portion is formed on a part of the adhesive surface. Impact and steam are released from the inside of the chip fuse to the outside through the non-adhesive part. Therefore, the deformation and damage of the chip fuse can be avoided. In addition, since the vapor does not stay in the chip fuse, the insulation resistance between the blown fuse terminals or the fuse ends can be ensured, and the effect of improving the performance of the chip fuse can also be obtained.

The present invention realizes a fuse that does not break the fuse when it fuse and ensures the insulation resistance between the fuse terminals after fusing or between the fuse ends of the fuse. Each element of the electronic circuit used in the current distribution board is protected to further ensure the safety of fire.

1.31: Upper side ceramic substrate

2, 6, 20, 33, 40: adhesive

3: The upper fuse supports the split body

4: The upper fuse supports split body

5.32: Lower ceramic substrate

7: The lower fuse supports the split body

8: Lower fuse supports split body

9, 36: Fuse

10, 14: sheet

11, 15: slit

12: Mark

16, 37: through hole

17, 38, 39: fuse holding groove

18: Width end face

21, 41: middle part

22, 42: fuse body

23: Metal cover

24: solder paste

25, 43: chip fuse

26, 27, 28, 44, 45: Non-adhesive part

35: Fuse support

36a, 36b: end of fuse

Fig. 1 is an exploded perspective view showing the fuse body of the chip fuse according to the first embodiment of the present invention.

FIG. 2 is a schematic perspective view illustrating a step of cutting out a ceramic substrate from a material sheet in the manufacturing method of the first embodiment.

Fig. 3 is a schematic perspective view illustrating a step of cutting out the fuse support division body from the material sheet in the manufacturing method of the above embodiment.

4 is a diagram showing that the upper fuse support split body and the lower fuse support split body are arranged up and down in the manufacturing method of the above embodiment, and the fuse and the adhesive are arranged between the two fuse support split bodies Exploded perspective view of the state.

Fig. 5 is a perspective view showing a state in which a binder and a fuse are arranged on the lower fuse support division body in the manufacturing method of the above embodiment.

Fig. 6 is a perspective view showing a state in which the lower fuse support divided body and the upper fuse support divided body are overlapped and bonded in the manufacturing method of the above embodiment.

FIG. 7 is a perspective view of the fuse body manufactured through the steps up to FIG. 6.

FIG. 8 is a perspective view showing a state where metal covers are fitted at both ends of the fuse body shown in FIG. 7.

Fig. 9 is a perspective view of metal covers fitted to both ends of the fuse body in the above-described embodiment.

Fig. 10 is a perspective view showing a completed state of the chip fuse in the above embodiment.

FIG. 11 is a longitudinal cross-sectional view of the chip fuse of the above embodiment.

FIG. 12 is an exploded cross-sectional view showing the chip fuse of the above embodiment exploded and shown by the same cross-section as FIG. 11.

Fig. 13 is an exploded perspective view showing the fuse body of the chip fuse according to the second embodiment of the present invention.

FIG. 14 is a perspective view of a state where fuses are arranged on a fuse support in the arrangement of FIG. 13.

Fig. 15 is a perspective view showing a state in which a fuse support having fuses arranged on the upper surface of the lower ceramic substrate is adhered in the manufacturing method of the second embodiment.

FIG. 16 is a perspective view showing a state where the upper ceramic substrate and the fuse support are overlapped and bonded in the manufacturing method of the above embodiment.

FIG. 17 is a perspective view of the fuse body produced through the steps up to FIG. 16.

FIG. 18 is a perspective view showing a state when a metal cover is fitted to both ends of the fuse body shown in FIG. 17.

Fig. 19 is a perspective view showing a completed state of the chip fuse in the above embodiment.

Fig. 20 is a longitudinal cross-sectional view of the chip fuse of the above embodiment.

FIG. 21 is an exploded cross-sectional view showing the chip fuse of the above embodiment exploded and shown by the same cross-section as FIG. 20.

Fig. 1 is an exploded perspective view showing the main body part (as a fuse body) of the chip fuse according to the first embodiment of the present invention. The fuse body is provided with an upper ceramic substrate 1 arranged at the uppermost portion, an upper fuse support division 3 adhered to the lower surface of the upper ceramic substrate 1 with an adhesive, and a lower ceramic arranged at the lowermost portion of the fuse body The substrate 5 and the lower fuse bonded to the upper surface of the lower ceramic substrate 5 by the adhesive 6 support the four-layer structure of the divided body 7. After that, the upper fuse support division body 3 and the lower fuse support division body 7 are adhered by the adhesive 20, thereby forming a fuse support body. In addition, the upper ceramic substrate 1 and the upper fuse supporting divided body 3 that are adhered to each other with the adhesive 2 constitute an upper fuse supporting divided body 4, and the lower ceramic substrate 5 and the lower fuse that are adhered to each other with the adhesive 6 The support split body 7 constitutes the lower fuse support split body 8. The upper fuse supports split body 4 and lower fuse The fuse 9 is interposed between the fuse supporting divided body 8, that is, between the upper fuse supporting divided body 3 and the lower fuse supporting divided body 7.

)等工序的操作，如第2圖中的(b)所示，可以設置標記12等。將進行了這樣的加工的片材10沿狹縫11分割，得到陶瓷基板1、5。 The upper ceramic substrate 1 and the lower ceramic substrate 5 have a thin flat plate structure, and are cut out from ceramic sheets having a larger area than these ceramic substrates 1 and 5. FIG. 2 is a perspective view illustrating the process of cutting out the ceramic substrates 1 and 5 from the ceramic sheet 10 as a raw material. (A) in FIG. 2 shows a state where the slit 11 is provided in the sheet 10. Each section divided by the slit 11 is the size of one ceramic substrate 1, 5. In the state where the slit 11 is provided on the sheet 10, each section is marked (

) And other steps, as shown in (b) of FIG. 2, a mark 12 etc. may be provided. The sheet 10 subjected to such processing is divided along the slit 11 to obtain ceramic substrates 1 and 5.

)在各貫通孔16的長度方向兩端形成熔絲保持溝槽17。將進行了這樣的加工的片材14沿狹縫15進行分割，得到熔絲支援分割體3、7。另外，熔絲保持溝槽17在上側熔絲支持分割體3上經過其下面的寬度方向端面18而形成，在下側熔絲支持分割體7上，經過其上面的寬度方向端面18而形成。 The upper fuse support split body 3 and the lower fuse support split body 7 have a thin flat plate structure, and are cut out from a sheet having a larger area than these fuse support split bodies 3 and 7, for example, a sheet made of alumina ceramics. FIG. 3 is a perspective view illustrating a process of cutting out the fuse support divisions 3 and 7 from the sheet 14 as a raw material. (A) in FIG. 3 shows a state where the slit 15 is provided in the sheet 14. Each section divided by the slit is the size of one fuse supporting divided body 3,7. The sheet 14 provided with the slit 15 is subjected to an operation such as press working, and a through hole 16 is formed in each section. Each section where the through hole 16 is formed is further subjected to a processing operation, as shown in (b) of FIG. 3, by cutting (

) Fuse holding grooves 17 are formed at both ends of each through hole 16 in the longitudinal direction. The sheet 14 subjected to such processing is divided along the slit 15 to obtain fuse support divided bodies 3 and 7. In addition, the fuse holding groove 17 is formed on the upper fuse supporting divided body 3 through the widthwise end surface 18 on the lower surface thereof, and is formed on the lower fuse supporting divided body 7 through the widthwise end surface 18 on the upper surface thereof.

The fuse 9 is made of a metal material in the form of a wire or a thin rod, and is produced by, for example, silver-plating a soft copper wire or an iron-nickel alloy wire. The fuse 9 is connected to the circuit of an electrical instrument or device, and a fusing current value is set so that it blows at a prescribed current value.

字狀的薄板或薄膜。

字形狀的一對的臂部的長度也形成為，即使將一對

字狀的黏結劑以

字形狀的開口相對的方式，配置在上側熔絲支持分割體3的上面兩端部，也比上面的長度方向尺寸更短。由此，在將上側陶瓷基板1與上側熔絲支持分割體3重疊黏接的情況下，在該黏接面上，在相對的一對黏結劑2的

字形狀的臂部的前端之間形成非黏接部26。同樣地，在下側熔絲支持分割體7的下面兩端部，使一對

字狀的黏結劑6以

字形狀的開口相對的方式配置，若將下側熔絲支持分割體7與下側陶瓷基板5重疊並黏接，則在該黏接面上形成非黏接部28。在本實施方式中，黏結劑2、6形成為

字狀，但黏結劑2、6的形狀及尺寸可以進行各種改變。因此，根據黏結劑的形狀及尺寸的選擇方法，也存在非黏接部在一處或三處上形成的情況。 As the adhesives 2 and 6 suitable for bonding the ceramic substrates 1 and 5 and the fuse-supporting divided bodies 3 and 7, for example, an epoxy resin adhesive can be used. For example, as shown in FIG. 1, the adhesives 2 and 6 conform to the shape of the upper surface of the upper fuse supporting divided body 3 having the through hole 16 and are formed as a pair

A thin sheet or film in the shape of a word.

The length of a pair of arms in a letter shape is also formed

The shape of the adhesive

The zigzag-shaped openings are arranged on both ends of the upper surface of the upper fuse supporting divided body 3 so as to face each other, and are shorter than the longitudinal dimension of the upper surface. Thus, when the upper ceramic substrate 1 and the upper fuse support divided body 3 are overlapped and bonded, on the bonding surface, on the opposing pair of adhesive 2

A non-adhesive portion 26 is formed between the front ends of the arm portions in the shape of a letter. Similarly, the lower fuse supports the lower ends of the divided body 7 so that a pair of

The shape of the adhesive 6

The word-shaped openings are arranged so as to face each other, and if the lower fuse support divided body 7 is overlapped and bonded to the lower ceramic substrate 5, the non-adhesion portion 28 is formed on the adhesion surface. In this embodiment, the adhesives 2, 6 are formed as

Word shape, but the shape and size of the adhesive 2, 6 can be changed in various ways. Therefore, depending on the method of selecting the shape and size of the adhesive, there may be cases where the non-adhesive portion is formed at one or three places.

字狀的黏結劑20的狀態的立體圖。黏結劑20與上述的黏結劑2、6同樣。根據第4圖的狀態，在下側熔斷器支援分割體8的下側熔絲支持分割體7的上面兩端部及熔絲保持溝槽 17上，以

字形狀的開口相對的方式配置一對黏結劑20，在該黏結劑20固化前，將熔絲9以其兩端從熔絲保持溝槽17向外方延伸的狀態，架設於熔絲保持溝槽17之間。該狀態示於第5圖。進一步地，在黏結劑2固化前，將配置有熔絲9的下側熔斷器支持分割體8的上方重疊並黏接同一形狀的上側熔斷器支持分割體4，形成本實施方式的熔斷器主體的中間部件21。此時，與上述同樣地，在上側熔斷器支持分割體4的上側熔絲支持分割體3與下側熔斷器支持分割體8的熔絲支持分割體7之間的黏接面形成有非黏接部27。另外，通過這樣將上側熔絲支持分割體3與下側熔絲支持分割體7黏接，形成載架有熔絲9的熔絲支持體。 FIG. 4 shows the upper fuse supporting divided body 4 obtained by bonding the upper ceramic substrate 1 and the upper fuse supporting divided body 3 with the adhesive 2, and bonding the lower ceramic substrate 5 and the lower side with the adhesive 6 The lower fuse supporting divided body 8 obtained by fuse supporting the divided body 7 is arranged to face each other vertically, and the fuse 9 and a pair are arranged between the two fuse supporting divided bodies 4 and 8

A perspective view of the state of the adhesive 20 in the shape of a letter. The adhesive 20 is the same as the adhesives 2 and 6 described above. According to the state of FIG. 4, on the lower fuse supporting divided body 8 of the lower fuse supporting divided body 7 at both ends of the upper surface and the fuse holding groove 17,

A pair of adhesives 20 are arranged so that the openings in the shape of a letter face each other. Before the adhesives 20 are cured, the fuse 9 is erected on the fuse holding groove in a state that both ends of the fuse 9 extend outward from the fuse holding groove 17. Groove 17. This state is shown in Figure 5. Further, before the adhesive 2 is cured, the upper fuse supporting divided body 4 of the same shape is overlapped and bonded to the upper side of the lower fuse supporting divided body 8 on which the fuse 9 is arranged to form the fuse body of the present embodiment的zhongli 21. At this time, in the same way as above, a non-adhesive surface is formed between the upper fuse supporting divided body 3 of the upper fuse supporting divided body 4 and the fuse supporting divided body 7 of the lower fuse supporting divided body 8.接部27。 Connection 27. In addition, by bonding the upper fuse support divided body 3 and the lower fuse support divided body 7 in this way, a fuse support body carrying the fuse 9 is formed.

As described above, the non-adhesion portions 26, 28, and 27 are formed on the adhesion surface between the component 1 and the component 3, the component 7 and the component 5, the component 3, and the component 7 in the longitudinal direction of the through hole 26. However, by overlapping and bonding the components of each group, they are fastened as a whole, and the through-holes 16 of the fuse-supporting split bodies 3 and 7 form an internal space, which remains sealed until the normal state, that is, the interruption.

The intermediate member 21 is shown in Fig. 6. In the state of the intermediate member 21, the end of the fuse 9 also protrudes from both end surfaces. The protruding portion is cut and removed to obtain the fuse body 22 shown in FIG. 7.

FIG. 8 is a perspective view showing a state before the metal cover 23 is fitted to both ends of the fuse body 22 of FIG. 7. In FIG. 8, at both ends of the fuse body 22, a metal cover 23 having tin-copper plating on a copper-zinc alloy having the structure shown in FIG. 9 is connected to the fuse 9 through the solder paste 24. The fitting is performed in the conductive state. Thus, the chip fuse 25 as shown in FIG. 10 is completed.

FIG. 11 is a longitudinal cross-sectional view of the chip fuse 25 of the present embodiment, and FIG. 12 is an exploded view of the chip fuse 25 and is shown in the same cross-section as FIG. 11. As shown in these figures, the chip fuse 25 of this embodiment has a four-layer structure. Further, through the bonding surface between the four layers The non-adhesive portions 26, 27, and 28 are partially formed on the upper portion, and the non-adhesive portions are formed in three layers on both sides of the fuse body 22 in the longitudinal direction.

Due to the above structure, in this embodiment, the impact (pressure) or steam generated when the overload current flows through the chip fuse 25 and the fuse 9 is blown is not only buffered by the capacity of the through hole 16 but also from the side The non-adhesive parts 26, 27, and 28 are released, so that current interruption can be performed safely. That is, in the present embodiment, the chip fuse body, which is a conventional chip fuse, is not damaged or deformed. In addition, by releasing the vapor generated during fusing to the outside of the chip fuse 25, the insulation resistance between the fuse terminals after fusing or between the fuse ends of the fuse becomes extremely high. In addition, the vapor released through the non-adhesive portions 26, 27, and 28 can be adjusted by variously changing the shapes and sizes of the adhesives 2, 6, and 20.

In this embodiment, a fuse support divided body formed by bonding a ceramic substrate and a fuse support is paired and arranged up and down, and a fuse is sandwiched between these pair of fuse support divided bodies to make a combined fuse. The main body is then covered with metal covers at both ends of the fuse body, so that the current interruption characteristic of the fuse and the insulation resistance between the fuse terminal after interruption or the fuse end of the fuse can be improved.

In the above-described manufacturing method, the upper ceramic substrate 1 and the upper fuse support divided body 3 are bonded to make the upper fuse support divided body 4, and the lower ceramic substrate 5 and the lower fuse support divided body 7 are bonded After the lower fuse support split body 8 is formed, the fuse 9 is interposed between the two fuse support split bodies 4, 8, but the upper fuse support split body 3 and the lower fuse support split may also be provided After the fuse 9 is interposed between the bodies 7, the upper fuse supporting divided body 3 and the lower fuse supporting divided body 7 are adhered to the upper ceramic substrate 1 and the lower ceramic substrate 5, respectively.

Fig. 13 is an exploded perspective view showing the fuse body of the chip fuse according to the second embodiment of the present invention. The fuse body is formed to have an upper ceramic substrate 31 arranged at the uppermost portion, a lower ceramic substrate 32 arranged at the lowermost portion, and a fuse support 35 bonded to the upper surface of the lower ceramic substrate 32 by an adhesive 33 Three-tier structure. The fuse 36 is interposed between the fuse support 35 and the upper ceramic substrate 31.

Regarding the fact that the upper ceramic substrate 31 and the lower ceramic substrate 32 have a thin flat-plate structure, and these ceramic substrates 31 and 32 are subjected to various processes in comparison with their larger-area ceramic sheets as shown in FIG. 2, this is cut out One point is the same as the first embodiment. The production of the fuse support 35 is also the same as in the first embodiment, and a through hole 37 is formed. In this embodiment, the fuse holding groove is formed on the upper and lower sides of the fuse holder 35, the fuse holding groove 38 is formed on the upper side, and the fuse holding groove is formed on the lower side槽39。 Groove 39. In addition, the structure, material, characteristics, etc. of the fuse 36 and the materials of the adhesives 33 and 40 are also the same as those of the first embodiment. Further, since the adhesives 33 and 40 are formed in a predetermined shape, the non-adhesive portions 44 and 45 are partially formed on each adhesive surface between the upper ceramic substrate 31, the fuse support 35 and the lower ceramic substrate 32. This point is the same as the first embodiment. Furthermore, in addition, the non-adhesion parts 44 and 45 are formed on both sides in the longitudinal direction of the through-hole 37 on the adhesion surface between the component 31 and the component 35, and between the component 35 and the component 32, respectively Fastened as a whole, the through-hole 37 forms an internal space, and the point of maintaining the seal until the normal state, that is, the interruption is the same as the first embodiment.

FIG. 14 is a perspective view showing a state where the fuse 36 is arranged on the fuse support 35 from the state of FIG. 13. The fuse 36 is inserted into the through-hole 37 of the fuse holder 35, and the fuse end 36a on one side is arranged in the fuse holding groove 38 formed on the upper surface of the fuse holder 35 One end in the longitudinal direction and the other end of the fuse end 36 b are arranged in the fuse holding groove 39 formed at the other end in the longitudinal direction of the lower surface of the fuse holder 35.

FIG. 15 is a perspective view showing a state where the fuse support 35 on which the fuse 36 is arranged is adhered to the upper surface of the lower ceramic substrate 32 by the adhesive 33 as shown in FIG. 14. By bonding the lower ceramic substrate 32 to the fuse holder 35, the end 36 b of the fuse 36 is fixed to the lower surface side of the fuse holder 35.

FIG. 16 is a perspective view showing a state where the adhesive 40 is placed on the upper surface of the fuse support 35 and the upper ceramic substrate 31 is superimposed and bonded before curing, which is the intermediate member 41 of the fuse body of the present embodiment. In the state of the intermediate member 41, the end portions 36a and 36b of the fuse 36 also protrude from both end surfaces. The protruding portion is cut and removed to obtain the fuse body 42 shown in FIG. 17.

FIG. 18 is a perspective view showing a state before the metal cover 23 is fitted to both ends of the fuse body 42 of FIG. 17. In FIG. 18, both ends of the fuse body 42 are, as in the first embodiment, a metal cover 23 made of tin-silver-copper alloy having the structure shown in FIG. The fuse 9 is fitted in a state of conduction. Thus, the chip fuse 43 as shown in FIG. 19 is completed.

FIG. 20 is a longitudinal cross-sectional view of the chip fuse 43 of the present embodiment, and FIG. 21 is an exploded view of the chip fuse 43 and is shown in the same cross section as FIG. 20. As shown in these figures, the chip fuse 43 of this embodiment has a three-layer structure. Further, by locally forming the non-adhesive portions 26 on the adhesive surface between the three layers, two layers of non-adhesive portions 26 are formed on both sides of the fuse body 42 in the longitudinal direction.

Due to the above structure, in this embodiment, the impact (pressure) or vapor generated when the overload current flows through the chip fuse 43 and the fuse 36 is blown is not only buffered by the capacity of the through hole 37, but also from the side The non-adhesive parts 44, 45 are released, so the current shielding can be performed safely Break. In other words, in the present embodiment, the chip fuse body that has occurred in the conventional chip fuse is not damaged or deformed. In addition, by releasing the vapor generated during the fusing to the outside of the chip fuse 43, the insulation resistance between the fuse terminals after the fuse or between the fuse ends of the fuse becomes extremely high. In addition, the vapor is released by the non-adhesive portions 44 and 45 and can be adjusted by variously changing the shapes and sizes of the adhesives 33 and 40.

In addition, in the first and second embodiments described above, in the stage of manufacturing the fuse body, between the upper ceramic substrate and the fuse support and between the lower ceramic substrate and the fuse support, Adhere and seal the through holes between the surfaces, and at the same time, form a non-adhesive part on a part of the adhesive surface, and as a normal state, the internal through holes will be kept sealed. However, in other methods, in the stage of manufacturing the fuse body, an impact and a shock generated when the interruption is released may be formed between the upper ceramic substrate and the fuse support and between the lower ceramic substrate and the fuse support. Vapor vents.

Implementation

Examples

A four-layer chip fuse according to the first embodiment of the present invention is produced. Production of upper and lower ceramic substrates and upper and lower fuse support divisions from ceramic sheets, using fuses made of silver plating on soft copper wires, epoxy resin adhesives, and implementation on copper-zinc alloys The metal cover and the solder paste obtained by tin-copper plating obtained chip fuses No. 1 to No. 10 with a resistance value of 0.011Ω. Each piece of fuse obtained was energized with 100V (phase angle 60°) and 100A alternating current to fuse it, and a current interruption experiment was conducted. The measured value of resistance and the interruption time are shown in Table 1. Next, the blown chip fuse was energized at 500 V for 1 minute, and the residual resistance value between the fuse terminals was measured using a digital multimeter (manufactured by Kikusui Electronics Industry Co., Ltd.). The results are shown in Table 1. Also in Table 1, the residual resistance The value column "O.L." (Over Load; Overload) indicates that the residual resistance value exceeds the measurable range of the multimeter (1200 MΩ).

In the provisions of the Electrical Appliance and Material Safety Law of Japan, the residual resistance value after the short-circuit breaking performance test is specified to be 200 kΩ or more. It can be seen from Table 1 that the residual resistance values of all the chip fuses No. 1 to No. 10 meet the standards of the above-mentioned Japan Electrical Appliances Safety Law. In addition, in all chip fuses, due to the impact (pressure) or steam generated during the interruption operation is released from the non-adhesive part on the side, a small three-layer gap appears on the side of the chip fuse, but the fuse The main body of the device is not damaged.

Comparative example

The prior art chip fuse disclosed in Japanese Patent Publication No. 2012-174443 is produced. As in the above embodiment, a fuse support provided with a central through hole and a fuse holding groove was produced, and an epoxy resin adhesive was coated on the fuse holding groove of the support in the same manner as in the embodiment. In the same manner, the fuse is spanned through the through hole and linearly erected at opposite ends of the fuse, thereby obtaining a fuse combination. Insert the fuse combination in a rectangular tube-shaped alumina ceramic casing, And at both ends thereof, the metal cover was fixed with solder paste in the same manner as in the above embodiment, thereby obtaining chip fuses No. 1 to No. 5 having a resistance value of 0.011Ω. For each of the obtained chip fuses, a current interruption experiment was conducted in the same manner as in the example, and the residual resistance value after interruption was measured. The results are shown in Table 2.

According to Table 2, the residual resistance values of the chip fuses No. 1 to No. 5 of the comparative examples are all lower than those of the chip fuses of the examples. In addition, only the chip fuse No. 1 satisfies the standards of the Electrical Appliances Safety Law. In the chip fuse Nos. 2 to 5, there is a residual resistance that exceeds the reference value. In addition, in all chip fuses, impact (pressure) or steam scorching caused by the blocking operation was confirmed on the surface.

1: Upper side ceramic substrate

2, 6, 20: Adhesive

3: The upper fuse supports the split body

4: The upper fuse supports split body

5: Lower ceramic substrate

7: The lower fuse supports the split body

8: Lower fuse supports split body

9: Fuse

16: through hole

17: fuse holding groove

Claims (9)

A chip fuse includes: a fuse body and a pair of metal covers; the fuse body has a pair of upper ceramic substrates and lower ceramic substrates arranged vertically opposite each other, sandwiched between the upper ceramic substrates and the A fuse support between the lower ceramic substrate and having a through hole in the vertical direction in the center, and a fuse passing between the two ends of the fuse support through the through hole; the pair of metal covers are Fitted to both ends of the fuse body in a conducting state with the fuse protruding from both ends of the fuse support; the upper ceramic substrate and the fuse support and the lower ceramic substrate and the fuse support The respective opposite surfaces are flat, and have an adhesive portion adhered to each other with an adhesive and a non-adhesive portion that is not mutually adhered, and the through hole is supported by the upper and lower ceramic substrates and fuses The body is closed, and the non-adhesive portion is formed on both sides of the through hole in the longitudinal direction. The chip fuse as described in item 1 of the patent application range, wherein the fuse support is composed of an upper fuse support division body and a lower fuse support division body stacked in the up-down direction, and the through hole is located at The upper fuse support division body and the lower fuse support division body penetrate up and down, and the fuse passes through the through hole in the longitudinal direction of the fuse support body and is carried by the carrier. The chip fuse as described in item 2 of the patent application range, wherein the non-adhesive parts are respectively formed between the upper ceramic substrate and the upper fuse support division body, the upper fuse support division body and the lower side fuse Between the wire supporting divided body, and between the lower fuse supporting divided body and the lower ceramic substrate. The chip fuse as described in item 1 of the patent application scope, wherein the fuse support has a single structure, and the fuse passes through the through hole of the fuse support to incline The state carrier is between the upper end and the lower end of the two ends of the fuse holder. A method for manufacturing a chip fuse as described in item 1 of the patent application scope, comprising: arranging the fuse support having a through hole in the center in the vertical direction; passing the fuse through the through hole carrier on the fuse support Between the two ends of the body; the fuse support carrying the fuse is sandwiched between a pair of upper and lower ceramic substrates facing up and down; the pair of ceramic substrates and the fuse support are opposite At the same time, the non-adhesive part is formed on a part of the adhesive surface, and the adhering part and the non-adhesive part which are not mutually adhering are provided on the opposite surface Forming the fuse body, the non-adhesive parts are formed on both sides of the through hole in the longitudinal direction; at both ends of the fuse body, a metal cover is fitted in a state of conducting with the fuse. The manufacturing method as described in item 5 of the patent application range, wherein the fuse support is composed of an upper fuse support division body and a lower fuse support division body stacked in the up-down direction, and the through-hole is in the up-down direction Penetrating the upper fuse support division body and the lower fuse support division body; wherein the fuse passes through the through-hole carrier between both ends of the fuse support body includes: The fuse passes through the through hole in the longitudinal direction and is carried between the upper fuse support division body and the lower fuse support division body. The manufacturing method as described in item 6 of the patent application scope, wherein forming the non-adhesive portion includes: forming the non-adhesive portion on the upper ceramic substrate and the upper side fuse Between the wire supporting divided body, between the upper fuse supporting divided body and the lower fuse supporting divided body, and between the lower fuse supporting divided body and the lower ceramic substrate. The manufacturing method as described in item 5 of the patent application scope, wherein the fuse support has a single structure; wherein passing the fuse through the through-hole carrier between the two ends of the fuse support includes: The fuse passes through the through hole of the fuse support, and the inclined carrier is placed between the upper end and the lower end of the opposite ends of the fuse support. A method for manufacturing a chip fuse as described in item 2 of the patent application scope, comprising: arranging an upper fuse supporting divided body and an upper ceramic substrate having a vertical through hole in the center, and a lower side having a vertical through hole in the center The side fuse supports the divided body and the lower ceramic substrate; the upper fuse supports the divided body and the upper ceramic substrate, and the lower fuse supports the divided body and the lower ceramic substrate are bonded between respectively opposed surfaces At the same time, the non-adhesive portion is formed on a part of the adhesive surface, and an adhesive portion and an non-adhesive portion that are not mutually adhered with an adhesive are provided on the opposite surface; The through-hole carrier fuse is passed between the two ends of the support split body; the lower fuse support split body with the fuse carrier and the upper fuse support split body are arranged up and down in a relatively flat At the same time, the non-adhesive part is formed on a part of the adhering surface, and the adhering part and the non-adhesive part which are not mutually adhering with an adhesive are provided on the opposite face, thereby The fuse body is formed, and the non-adhesive portion is formed on both sides of the through hole in the longitudinal direction; at both ends of the fuse body, the metal is fitted in a state of conduction with the fuse cover.

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