TWI695159B - Temperature measuring device, ambient temperature measuring method, and ambient temperature measuring program - Google Patents

Abstract

The terminal temperature measuring element (30) is arranged in the housing (90) in the vicinity of the terminal connected to the thermocouple (600), and the first internal temperature measuring element (31) and the second internal temperature measuring element (32) are arranged in the housing (90) is closer to the heat source than the terminal temperature measuring element (30). The difference between the thermal influence of the first internal temperature measuring element (31) from the heat source and the thermal influence of the second internal temperature measuring element (32) from the heat source varies according to the posture of the housing (90). The main control unit (20) uses the temperatures measured by the three temperature measuring elements to calculate the ambient temperature of the housing (90).

Description

Temperature measuring device, ambient temperature measuring method, and ambient temperature measuring program

The invention relates to a technique for measuring the surrounding temperature of a temperature measuring device using a thermocouple.

When measuring and adjusting the temperature of an object or an object device, the use of a thermocouple is disclosed in Patent Document 1, for example.

The structure of Patent Document 1 includes a thermocouple and a temperature adjustment device. The thermocouple is connected to the connection terminal of the temperature adjustment device provided on the casing.

The thermocouple is arranged on the object or the object device. The temperature adjustment device is arranged at a different position from the target device. The temperature adjustment device calculates the temperature based on the voltage generated by the thermocouple and obtained through the connection terminal, and performs temperature adjustment.

In this case, the calculated temperature will be affected by the temperature of the connection terminal (cold junction). Therefore, in the configuration of Patent Document 1, a temperature sensor that measures the temperature of the connection terminal is provided in the housing of the temperature adjustment device. Then, the temperature adjustment device calculates the temperature of the object by adding the temperature of the cold junction measured by the temperature sensor and the temperature measured by the thermocouple. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2001-124636

[Problems to be solved by the invention]

As a temperature adjustment device, it is required not only to measure the temperature of the object to be measured, but also to measure the temperature around the casing. The surrounding temperature of the housing is close to the cold junction temperature, so it is conventional to consider using the cold junction temperature as the ambient temperature.

However, the temperature of the cold junction will be affected by the heat source disposed inside the housing of the temperature adjustment device. Therefore, the temperature of the cold junction and the surrounding temperature may not necessarily match. Furthermore, the influence will vary according to the arrangement direction (configuration aspect) of the housing of the temperature adjustment device.

Therefore, in the conventional temperature measurement method using the cold junction temperature as the ambient temperature, the influence cannot be sufficiently cancelled, and there will be an error in the ambient temperature.

Therefore, an object of the present invention is to provide a temperature measurement technology that can suppress the influence of the internal heat source and the influence of the arrangement state, thereby measuring the surrounding temperature more accurately. [Technical means to solve the problem]

According to an example of the present invention, the temperature measuring device includes a terminal temperature measuring element, a first internal temperature measuring element, a second internal temperature measuring element, and a control unit. The terminal temperature measuring element is arranged near the terminal connected to the thermocouple in the housing. The first internal temperature measuring element is arranged in the housing and is located closer to the heat source than the terminal temperature measuring element. The second internal temperature measuring element is located in the housing at a position closer to the heat source than the terminal temperature measuring element, and is arranged at a position different from the first internal temperature measuring element. In addition, the difference between the thermal influence of the first internal temperature measuring element and the second internal temperature measuring element arranged in the first internal temperature measuring element from the heat source and the thermal influence of the second internal temperature measuring element from the heat source is based on The position of the housing changes. The control unit uses the terminal temperature measured by the terminal temperature measuring element, the first internal temperature measured by the first internal temperature measuring element, and the second internal temperature measured by the second internal temperature measuring element to calculate the ambient temperature of the case.

In this configuration, by using the internal temperature, the influence of the heat of the heat source on the terminal temperature is suppressed. Furthermore, the measurement location of the internal temperature is a plurality of different locations within the housing, thereby suppressing the influence of the posture of the housing on the calculation result of the surrounding temperature.

According to an example of the present invention, the second internal temperature measuring element is disposed in the first posture of the casing having the same thermal influence as the first internal temperature measuring element, and in the second posture of the casing and the first internal temperature measuring element The heat affects different locations.

In this configuration, it is easy to use the setting of the correction terms for the first internal temperature and the second internal temperature that are useful for calculating the ambient temperature.

According to an example of the present invention, the calculation formula for calculating the ambient temperature by the control unit includes a difference term between the terminal temperature and the first internal temperature, and the correction coefficient of the difference term is calculated based on the first internal temperature and the second internal temperature value.

In this configuration, the ambient temperature is not calculated using a complicated calculation formula.

According to an example of the present invention, the correction coefficient is a value corresponding to the ratio of the first internal temperature to the second internal temperature.

In this configuration, the ambient temperature is calculated using a simple calculation formula. [Effect of invention]

According to the present invention, the influence of the internal heat source and the influence of the configuration can be suppressed, so that the surrounding temperature can be measured more accurately.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

∙Application examples First, an application example of the temperature adjusting device according to the embodiment of the present invention will be described. FIG. 1 is a functional block diagram of a temperature adjustment device according to an embodiment of the present invention.

As shown in FIG. 1, the temperature adjustment device 10 includes a main control unit 20, a terminal temperature measurement element 30, a first internal temperature measurement element 31, and a second internal temperature measurement element 32. In addition, the temperature adjustment device 10 has a heat source 110 that generates heat by driving. The heat source 110 includes, for example, a main control unit 20, a communication unit 51, a control output unit 52, and a power supply unit 70. In addition, the composition of the heat source 110 is not limited to these, and is not limited to a combination of these.

The terminal temperature measuring element 30 is arranged near the thermocouple connection terminal 60. The terminal temperature measuring element 30 measures the terminal temperature Tb and outputs it to the main control unit 20.

The first internal temperature measuring element 31 is arranged at a position more susceptible to the influence of the heat of the heat source 110 than the terminal temperature measuring element 30. The first internal temperature measuring element 31 measures the first internal temperature Tin1 and outputs it to the main control unit 20.

The second internal temperature measuring element 32 is arranged at a position different from the first internal temperature measuring element 31 according to the posture of the housing of the temperature adjustment device 10 due to the heat from the heat source 110. The second internal temperature measuring element 32 measures the second internal temperature Tin2 and outputs it to the main control unit 20.

The main control unit 20 uses the terminal temperature Tb, the first internal temperature Tin1, and the second internal temperature Tin2 to calculate the ambient temperature Ta according to the following formula.

Ta＝Tb－Tg (Formula 1) Tg=(Tin1-Tb)×a+b (Equation 2) In addition, a and b are correction values set based on the first internal temperature Tin1 and the second internal temperature Tin2. In addition, (Tin1-Tb) corresponds to the difference term mentioned in the present invention, and a corresponds to the correction coefficient mentioned in the present invention. Furthermore, as described below, a is a value corresponding to the ratio of the first internal temperature Tin1 and the second internal temperature Tin2.

By using such a configuration and processing, the thermal influence from the heat source 110 in the temperature adjustment device 10 can be suppressed in the calculation formula, and the change of the thermal influence from the heat source 110 due to the posture of the housing to the surrounding temperature can be suppressed The impact of Ta's calculation. Thereby, the temperature adjustment device 10 can calculate the ambient temperature Ta with higher accuracy.

∙Configuration example The temperature adjusting device according to the embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a functional block diagram of a temperature adjustment device according to an embodiment of the present invention.

(Function block) As shown in FIG. 1, the temperature adjustment device 10 includes a main control unit 20, a terminal temperature measurement element 30, a first internal temperature measurement element 31, a second internal temperature measurement element 32, a temperature detection signal generation unit 41, and a temperature detection signal generation unit 42. Temperature detection signal generation unit 43, temperature detection signal generation unit 44, communication unit 51, control output unit 52, notification unit 53, memory unit 54, thermocouple connection terminal 60, and power supply unit 70.

The main control unit 20 is composed of arithmetic processing elements such as a CPU, and executes a program for temperature measurement or temperature adjustment processing described below. The memory section 54 is composed of volatile and non-volatile memory devices. The memory unit 54 is connected to the main control unit 20. In the non-volatile memory device, the above program and the following correction values are memorized. The volatile memory device can be used as a work area when the main control unit 20 executes a program.

The terminal temperature measuring element 30, the first internal temperature measuring element 31, and the second internal temperature measuring element 32 can be realized by, for example, a thermistor, a thermistor, or a temperature sensor using a semiconductor or the like.

The terminal temperature measuring element 30 is connected to the temperature detection signal generating unit 42. The temperature detection signal generating unit 42 is connected to the main control unit 20.

The terminal temperature measuring element 30 generates a measured voltage of the terminal temperature corresponding to the sensed temperature. The measured voltage of the terminal temperature corresponds to the terminal temperature Tb. The temperature detection signal generating unit 42 amplifies the measured voltage of the terminal temperature, converts the A/D (analog/digital), for example, and outputs it to the main control unit 20.

The first internal temperature measuring element 31 is connected to the temperature detection signal generating section 43. The temperature detection signal generating unit 43 is connected to the main control unit 20.

The first internal temperature measuring element 31 generates a measured voltage of the first internal temperature corresponding to the sensed temperature. The measured voltage of the first internal temperature corresponds to the first internal temperature Tin1. The temperature detection signal generation unit 43 amplifies the measured voltage of the first internal temperature, converts it to A/D (analog/digital), and outputs it to the main control unit 20.

The second internal temperature measuring element 32 is connected to the temperature detection signal generating unit 44. The temperature detection signal generation unit 44 is connected to the main control unit 20.

The second internal temperature measuring element 32 generates a measured voltage of the second internal temperature corresponding to the sensed temperature. The measured voltage of the second internal temperature corresponds to the second internal temperature Tin2. The temperature detection signal generation unit 44 amplifies the measured voltage of the second internal temperature, converts the A/D (analog/digital), for example, and outputs it to the main control unit 20.

The thermocouple connection terminal 60 is connected to an external thermocouple 600 and is connected to the temperature detection signal generator 41. The temperature detection signal generating unit 41 is connected to the main control unit 20.

The thermocouple connection terminal 60 generates a measured voltage corresponding to the temperature sensed by the thermocouple 600. The measured voltage corresponds to the temperature of the detected body before correction. The temperature detection signal generation unit 41 amplifies the measured voltage of the detected object before correction, converts it by A/D (analog/digital), and outputs it to the main control unit 20.

The main control unit 20 calculates the ambient temperature Ta using the terminal temperature Tb, the first internal temperature Tin1, and the second internal temperature Tin2. The surrounding temperature Ta corresponds to the temperature near the thermocouple connection terminal 60 of the temperature adjustment device 10. The specific calculation method of the ambient temperature Ta will be described below.

In addition, the main control unit 20 uses the calculated terminal temperature Tb to correct the temperature of the detected body before the correction according to a known method to calculate the temperature of the detected body. Furthermore, the main control unit 20 generates a temperature control signal using the calculated difference between the temperature of the detected body and the target temperature, and outputs it to the control output unit 52. The temperature control signal is a signal that controls the control output unit 52 so that the calculated difference between the temperature of the detected body and the target temperature is close to zero.

The communication unit 51 is composed of, for example, an interface IC for communication. The communication unit 51 is connected to the main control unit 20 and to an external control network or the like. The communication unit 51 transmits, for example, at least one of the ambient temperature Ta calculated by the main control unit 20 and the corrected temperature of the detected body to other control devices, databases, etc. via the control network.

The control output unit 52 is composed of, for example, a transistor for power control. The control output unit 52 is connected to the main control unit 20 and to an externally known power control device that controls the energization of a heater or the like that heats the object to be detected. The temperature of the detected body is adjusted by the control of the power output device through the control output unit 52.

The notification unit 53 is configured by, for example, an LED, a liquid crystal display panel, or the like. The notification unit 53 is connected to the main control unit 20. The notification unit 53 displays any one of the ambient temperature Ta calculated by the main control unit 20, the temperature of the detected object after correction, the state of temperature adjustment, and the like.

The power supply unit 70 is connected to the external power supply 700 via a bus bar for power supply or the like. The power supply unit 70 receives the power supply from the external power source 700, converts it into a voltage corresponding to each functional unit, and supplies the power to the necessary functional units (the part enclosed by the thick broken line shown in FIG. 1) .

In such a configuration, the portion that generates heat by driving becomes the heat source 110 of the temperature adjustment device 10. For example, in the example of FIG. 1, the heat source 110 is equivalent to the hatched part shown in FIG. 1 surrounded by a thin dashed line, and includes the main control unit 20, the communication unit 51, the control output unit 52, and the power supply部70.

(structure) FIG. 2(A) is a front view of the temperature adjusting device, and FIG. 2(B) is a side cross-sectional view showing a schematic internal structure of the temperature adjusting device.

As shown in FIGS. 2(A) and 2(B), the temperature adjustment device 10 includes a housing 90 and a substrate 900. The housing 90 includes a front wall 901, a back wall 902, a top wall 903, a bottom wall 904, a side wall 905, and a side wall 906. The housing 90 has an internal space surrounded by the walls. A thermocouple connection terminal 60 is arranged on the front wall 901.

On the substrate 900, the above-described main control unit 20, terminal temperature measuring element 30, first internal temperature measuring element 31, second internal temperature measuring element 32, temperature detection signal generating section 41, temperature detection signal generating section 42, The temperature detection signal generation part 43, the temperature detection signal generation part 44, the communication part 51, the control output part 52, the notification part 53, the memory part 54, and the device which implements the power supply part 70. In addition, the notification unit 53 may not be directly mounted on the substrate 900.

At this time, as shown in FIG. 2(B), the terminal temperature measuring element 30 is arranged near the front wall 901 of the substrate 900, that is, near the thermocouple connection terminal 60.

The first internal temperature measuring element 31 and the second internal temperature measuring element 32 are arranged at positions that are easily affected by the heat of the heat source 110 compared to the terminal temperature measuring element 30. The so-called position that is easily affected by the heat of the heat source 110 is, for example, a position close to the heat source 110 in a physical distance, and it is a position where the heat conduction of the heat source 110 is high.

Furthermore, the first internal temperature measuring element 31 and the second internal temperature measuring element 32 are arranged in a posture other than the first posture of the housing 90 in the first posture of the housing 90 with the heat effect from the heat source 110 being substantially the same and outside the first posture of the housing 90 ( In the second posture and the third posture, the heat from the heat source 110 affects different positions. In addition, here, the first posture is that the top wall 903 shown in FIG. 2(B) becomes the posture above the housing 90, and the second posture is that the front wall 901 shown in FIG. 3(A) becomes the housing 90 The upper posture, the so-called third posture, is a posture in which the back wall 902 shown in FIG. 3(B) becomes the upper side of the housing 90.

Furthermore, as a specific example, as shown in FIGS. 2(B), 3(A), and 3(B), the first internal temperature measuring element 31 and the second internal temperature measuring element 32 are on top of the connection housing 90 The directions of the face wall 903 and the bottom face wall 904 are arranged on the same side with respect to the heat source 110, and the distance from the heat source 110 in this direction is also substantially the same. Furthermore, the second internal temperature measuring element 32 is disposed at a position separated from the first internal temperature measuring element 31 by a predetermined distance toward the front wall 901 side. In other words, the second internal temperature measuring element 32 is arranged between the terminal temperature measuring element 30 and the first internal temperature measuring element 31.

With such a structure, in the first posture shown in FIG. 2(B), the first internal temperature measuring element 31 and the second internal temperature measuring element 32 are almost the same under the influence of heat from the heat source 110. In the second posture shown in FIG. 3(A), the second internal temperature measuring element 32 is more susceptible to the heat of the heat source 110 than the first internal temperature measuring element 31, like the terminal temperature measuring element 30. In the third posture shown in FIG. 3(B), the second internal temperature measuring element 32 is less likely to be affected by the heat of the heat source 110 than the first internal temperature measuring element 31, like the terminal temperature measuring element 30.

FIG. 4(A) is a diagram showing the influence of internal heat on the ambient temperature, terminal temperature, and internal temperature (first internal temperature) in a front-facing configuration (first posture). FIG. 4(B) is a graph showing the influence of internal heat on the ambient temperature, terminal temperature, and internal temperature (first internal temperature) in the upward arrangement (second posture). FIG. 4(C) is a graph showing the influence of internal heat on the ambient temperature, terminal temperature, and internal temperature (first internal temperature) in the downward arrangement (third posture).

As shown in FIGS. 4(A), 4(B), and 4(C), the ambient temperature Ta hardly changes regardless of the arrangement (posture). On the other hand, the terminal temperature Tb and the first internal temperature Tin1 change according to the posture. For example, as shown in FIG. 4(A), in the front-facing configuration (first posture), the terminal temperature Tb and the first internal temperature Tin1 are similarly affected according to the magnitude of the load. As shown in FIG. 4(B), in the upward arrangement (second posture), the terminal temperature Tb is more affected by heat than the first internal temperature Tin1. Conversely, as shown in FIG. 4(C), in the downward arrangement (third posture), the first internal temperature Tin1 is more affected by heat than the terminal temperature Tb.

When the heat source 110 is located in the temperature adjusting device 10, the terminal temperature Tb is affected by the heat generated by the heat source 110, which may cause an error.

In order to correct the error caused by the heat effect of the heat source 110, the temperature adjustment device 10 executes the following configuration and processing.

FIG. 5 is a diagram showing the relationship between the difference between the first internal temperature Tin1 and the second internal temperature Tin2 and each posture.

As shown in FIGS. 2(B), 3(A), and 3(B) described above, the second internal temperature measuring element 32 is disposed between the terminal temperature measuring element 30 and the first internal temperature measuring element 31. Therefore, the second internal temperature measuring element 32 is more affected by heat generation than the first internal temperature measuring element 31 is due to heat generation, and the terminal temperature measuring element 30 is more affected by heat generation.

By this, as shown in FIG. 5, the value obtained by subtracting the second internal temperature Tin2 from the first internal temperature Tin1 becomes approximately 0 in the front-facing configuration (first posture), and becomes in the upward-facing configuration (second posture) A negative value becomes a positive value in the downward arrangement (third posture).

That is, by using the value obtained by the subtraction for the correction of the calculation formula of the ambient temperature Ta, it is possible to suppress errors due to posture.

The main control unit 20 calculates the ambient temperature Ta using the following equations.

Ta＝Tb－Tg (Formula 1) Tg=(Tin1-Tb)×a+b (Equation 2) a=(Tin2/Tin1)×c (Equation 3) b=(Tin2/Tin1)×d (Equation 4) As described above, Tb is the terminal temperature, Tg is the thermal error, Tin1 is the first internal temperature, and Tin2 is the second internal temperature. In addition, c and d are correction values determined in advance by experiments or the like. As is clear from Equation 3, a is a value corresponding to the ratio of the first internal temperature Tin1 and the second internal temperature Tin2.

The thermal error Tg due to the heat source 110 included in the terminal temperature Tb is corrected by using this equation. In addition, the influence of the thermal error Tg due to the heat source 110 can be suppressed.

Thereby, the main control unit 20 is not affected by the heat generation state of the heat source 110 and the posture of the housing 90, so that the ambient temperature Ta can be accurately calculated.

The correction values c and d may be set as follows, for example. In addition, the following method is performed under the condition that there is no adjacent machine or is not affected by heat from the adjacent machine.

(A) Method 1 (method set according to two different temperature conditions) (A-1) It is fixed in a posture (the above-mentioned arrangement toward the front (first posture)), and the state of minimum heat generation of the heat source 110 is achieved. The temperature at this time is arbitrary, but it is constant. The terminal temperature Tb and the first internal temperature Tin1 at this time are measured and recorded. In addition, the ambient temperature Ta is measured and recorded using another temperature measuring device or the like. Here, the so-called minimum heat generation state of the heat source 110 is, for example, a state where the control output unit 52 is in an operation-off state and the communication load of the communication unit 51 is minimum.

(A-2) Under the same operating state as the above (A-1), set to a state of a different constant temperature. The terminal temperature Tb and the first internal temperature Tin1 at this time are measured and recorded. In addition, the ambient temperature Ta is measured and recorded using another temperature measuring device or the like.

(A-3) Substitute the measurement results of (A-1) and (A-2) above into (Equation 1) and (Equation 2), and calculate a and b from the simultaneous equations. Then, the calculated a is set as the correction value c, and the calculated b is set as the correction value d.

(B) The second method (method set according to the condition where the difference in heat generation becomes maximum) (B-1) In the same manner as in (A-1) above, it is fixed in a posture (the above-mentioned arrangement toward the front (first posture)) to achieve a state where the heat generation of the heat source 110 is minimized. The temperature at this time is arbitrary, but it is constant. The terminal temperature Tb and the first internal temperature Tin1 at this time are measured and recorded. In addition, the ambient temperature Ta is measured and recorded using another temperature measuring device or the like.

(B-2) It is fixed in a posture (the above-mentioned arrangement toward the front (first posture)) to achieve the state where the heat generation of the heat source 110 is maximized. The temperature at this time is arbitrary, but it is constant. The terminal temperature Tb and the first internal temperature Tin1 at this time are measured and recorded. In addition, the ambient temperature Ta is measured and recorded using another temperature measuring device or the like. Here, the state where the heat generation of the heat source 110 is the largest is, for example, the state where the control output unit 52 is in an operation-on state and the communication load of the communication unit 51 is the largest.

(B-3) Substitute the measurement results of (B-1) and (B-2) above into (Equation 1) and (Equation 2), and calculate a and b from the simultaneous equations. Then, the calculated a is set as the correction value c, and the calculated b is set as the correction value d.

By using such processing, the ambient temperature Ta can be accurately calculated without using a complicated calculation formula.

In the above description, although the calculation of the ambient temperature Ta is divided into a plurality of functional blocks, the calculation of the ambient temperature Ta only needs to have at least the processing shown in the flow shown in FIG. 6. Fig. 6 is a flowchart showing a temperature measurement method according to an embodiment of the present invention.

The temperature adjustment device 10 acquires the terminal temperature Tb (S11). The temperature adjustment device 10 acquires the first internal temperature Tin1 and the second internal temperature Tin2 (S12). The temperature adjustment device 10 substitutes the terminal temperature Tb, the first internal temperature Tin1, and the second internal temperature Tin2 into the above (Expression 1) and (Expression 2) to calculate the ambient temperature Ta.

In the above description, although the configuration of the temperature adjustment device 10 is shown, when the processing for temperature adjustment described above is not performed, for example, when the configuration of the control output unit 52 is not provided, it can also be used as the temperature Measuring device.

In the above description, the ratio of the first internal temperature Tin1 to the second internal temperature Tin2 is used as the correction coefficient for calculating the ambient temperature Ta. However, as long as a value corresponding to the ratio between the first internal temperature Tin1 and the second internal temperature Tin2 is used, it can be used as a correction coefficient.

10‧‧‧Temperature adjustment device 20‧‧‧Main Control Department 30‧‧‧Terminal temperature measuring element 31‧‧‧First internal temperature measuring element 32‧‧‧Second internal temperature measuring element 41, 42, 43, 44 ‧‧‧ temperature detection signal generation section 51‧‧‧Communications Department 52‧‧‧Control output 53‧‧‧Notification Department 54‧‧‧ Memory Department 60‧‧‧thermocouple connection terminal 70‧‧‧Power Supply Department 90‧‧‧Shell 110‧‧‧Fever 600‧‧‧thermocouple 700‧‧‧External power supply 900‧‧‧ substrate 901‧‧‧Front wall 902‧‧‧Back wall 903‧‧‧Top wall 904‧‧‧Bottom wall 905、906‧‧‧Side wall

FIG. 1 is a functional block diagram of a temperature adjustment device according to an embodiment of the present invention. FIG. 2 (A) is a front view of the temperature adjusting device, and (B) is a side cross-sectional view showing a schematic internal structure of the temperature adjusting device. 3(A) and (B) are diagrams showing an example of a plurality of postures of the temperature adjustment device. Figure 4 (A), (B), (C) are graphs showing the effect of posture on temperature. 5 is a graph showing the relationship between the difference between the first internal temperature Tin1 and the second internal temperature Tin2 and each posture. Fig. 6 is a flowchart showing a temperature measurement method according to an embodiment of the present invention.

10‧‧‧Temperature adjustment device

20‧‧‧Main Control Department

30‧‧‧Terminal temperature measuring element

31‧‧‧First internal temperature measuring element

32‧‧‧Second internal temperature measuring element

41, 42, 43, 44 ‧‧‧ temperature detection signal generation section

51‧‧‧Communications Department

52‧‧‧Control output

53‧‧‧Notification Department

54‧‧‧ Memory Department

60‧‧‧thermocouple connection terminal

70‧‧‧Power Supply Department

110‧‧‧Fever

600‧‧‧thermocouple

700‧‧‧External power supply

Claims (5)

A temperature measuring device includes: a terminal temperature measuring element arranged near a thermocouple connecting terminal in a housing; a first internal temperature measuring element arranged in the housing more than the terminal temperature measuring element A position close to the heat source; a second internal temperature measuring element, which is located in the housing, at a position closer to the heat generating source than the terminal temperature measuring element, at a position different from the first internal temperature measuring element; and The control unit calculates the case using the terminal temperature measured by the terminal temperature measuring element, the first internal temperature measured by the first internal temperature measuring element, and the second internal temperature measured by the second internal temperature measuring element The ambient temperature of the body; and the first internal temperature measuring element and the second internal temperature measuring element are disposed in the first internal temperature measuring element, the thermal influence from the heat source, and the second internal temperature measuring element The position where the difference in the thermal influence of the heat source changes according to the posture of the case; the second internal temperature measuring element is arranged in the first posture of the case and the thermal influence of the first internal temperature measuring element It is the same position, and in the second posture of the case, the position is different from the heat influence of the first internal temperature measuring element. A temperature measuring device includes: a terminal temperature measuring element arranged near a thermocouple connecting terminal in a housing; a first internal temperature measuring element arranged in the housing more than the terminal temperature measuring element A position close to the heat source; a second internal temperature measuring element, which is located in the housing, is closer to the heat generating source than the terminal temperature measuring element, and is arranged at a different position from the first internal temperature measuring element; And a control unit that calculates the above using the terminal temperature measured by the terminal temperature measuring element, the first internal temperature measured by the first internal temperature measuring element, and the second internal temperature measured by the second internal temperature measuring element The ambient temperature of the housing; and the first internal temperature measuring element and the second internal temperature measuring element are arranged in the first internal temperature measuring element, the thermal influence from the heat source of the first internal temperature measuring element, and the second internal temperature measuring element The position where the difference in thermal influence from the heat source changes according to the posture of the case; when the ambient temperature is Ta, the terminal temperature is Tb, and the first internal temperature is Tin1, In the calculation formula for the control unit to calculate the ambient temperature, Ta=Tb-Tg, Tg=(Tin1-Tb)×a+b, where (Tin1-Tb) is the difference between the terminal temperature and the first internal temperature And a and b are correction values, and the correction coefficient of the difference term, a, is a value calculated based on the first internal temperature and the second internal temperature. The temperature measurement device according to claim 2, wherein the correction coefficient is a value corresponding to a ratio of the first internal temperature to the second internal temperature. A method for measuring ambient temperature, which includes the following processes: measuring the terminal temperature of a terminal connected to a thermocouple in the casing; measuring the first internal temperature in the casing closer to the heat source than the measurement position of the terminal temperature ; The measurement position in the housing is closer to the position of the heat source than the measurement position of the terminal temperature, and in The second internal temperature is measured at a position different from the first internal temperature measurement position; and the surrounding temperature of the housing is calculated using the terminal temperature, the first internal temperature, and the second internal temperature; and the first The measurement position of the internal temperature and the measurement position of the second internal temperature are the thermal influence from the heat source at the measurement position of the first internal temperature, and the thermal influence from the heat source at the measurement position of the second internal temperature The position where the difference will change according to the posture of the housing; the second internal temperature measuring element that measures the second internal temperature is arranged in the first posture of the housing and the first interior that measures the first internal temperature The thermal influence of the temperature measuring element is the same, and it is different from the thermal influence of the first internal temperature measuring element in the second posture of the case. An ambient temperature measurement program that causes the arithmetic processing device to perform the following processing, that is, to measure the terminal temperature of the terminal connected to the thermocouple in the casing; the measurement position in the casing is closer to the heat source than the measurement position of the terminal temperature , Measure the first internal temperature; measure the second internal temperature in the case closer to the heat source than the terminal temperature measurement position, and at a position different from the first internal temperature measurement position; and use The terminal temperature, the first internal temperature, and the second internal temperature calculate the ambient temperature of the case; and the first internal temperature measurement position and the second internal temperature measurement position are the first internal temperature The position where the difference between the thermal effect of the heat source from the measurement source and the thermal effect from the heat source from the measurement position of the second internal temperature changes according to the posture of the housing; the measurement of the second internal temperature The second internal temperature measuring element is arranged in the first posture of the housing and measures the first internal temperature of the first internal temperature. The thermal influence of the fixed element is the same, and it is different from the thermal influence of the first internal temperature measuring element in the second posture of the case.

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