TWI694886B - Welded structure and welding method - Google Patents

Abstract

The present invention relates to a soldering jig and a soldering method thereof. The soldering method comprises the steps of providing a substrate having a soldering area and at least one positioning area in which a positioning part is disposed in the positioning area, placing a workpiece on the substrate, positioning the workpiece through the positioning part, using a heating method to remove an isolating film on the workpiece, and placing a piece of solder in the soldering area of the substrate and then melting the piece of solder such that the workpiece is soldered to the soldering area through the piece of solder.

Description

Welded structure and welding method

The invention relates to a welding structure and a welding method thereof, in particular to a welding jig applied to an enameled wire and a welding method thereof.

The soldering process is widely used in various fields. The purpose is to fix the enameled wire on another object through solder. When manually soldering, such as enameled wire, the welding person needs to hold the soldering iron in one hand and the tin wire or fix the enameled wire in the other hand.

The current manual manual welding will have the following disadvantages: 1. Higher technical requirements for welding personnel and professional training to achieve better performance; 2. Manual welding is prone to fracture of the enameled wire; 3. Welding is easy Missing, such as open circuit, poor contact or excessive impedance, etc.; 4. Welding specifications cannot be unified, such as excessive height and interference with other components; 5. Low efficiency.

Therefore, how to solve the above-mentioned problems and deficiencies is where the inventors of the present case and related manufacturers engaged in this industry are desperate to study the direction of improvement.

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a welding structure and a welding method that reduce the technical requirements of the operator.

Another main object of the present invention is to provide a welding structure and a welding method to avoid the problem of fracture of the enameled wire.

Another main object of the present invention is to provide a welding structure and a welding method that avoid bad welding.

Another main object of the present invention is to provide a welding structure and welding method in which the specifications of the welding joint are uniform and facilitate subsequent operations.

Another main object of the present invention is to provide a welding structure and welding method that improve the overall efficiency.

To achieve the above object, the present invention provides a welding structure, including: a substrate having a welding zone and at least one positioning zone located outside the welding zone; and at least one positioning member disposed in the positioning zone to position an enameled wire , Wherein the enameled wire is placed and connected to the welding zone and the positioning zone, and has a positioning part with a welding part corresponding to the welding zone and a non-welding part corresponding to the positioning zone.

The invention also provides a welding method, comprising: providing a substrate with a welding area and at least one positioning area, the positioning area having a positioning element; placing an enameled wire on the substrate; positioning the enameled wire through the positioning element; using a heating element Means to remove an insulating lacquer layer of the enameled wire; place a solder on the soldering area of the substrate, then melt the solder, and solder the enameled wire to the soldering area through the solder.

In one implementation, a ring wall is provided on the outer edge of the substrate, and the positioning area has a first protruding groove protruding from the ring wall.

In one implementation, the positioning area has a second protruding groove protruding from the ring wall, and the second protruding groove and the first protruding groove are located on a straight line.

In one implementation, the positioning member is any one of double-sided tape or adhesive.

1: substrate

11: Welding area

12: Positioning area

13: Ring wall

131: first protruding groove

132: second protruding groove

2: positioning piece

3: enameled wire

31: Welded parts

32: Non-welded parts

4: Solder

S1, S2, S21, S22, S3, S4, S5: steps

Figure 1A is a perspective schematic view of the first embodiment of the present invention; Figure 1B is a schematic cross-sectional view of the first embodiment of the present invention; Figure 1C is a schematic view of the first embodiment of the present invention (1); Figure 1D is a first embodiment of the present invention Example use schematic (2); Figure 2A is a perspective view of the second embodiment of the present invention; Figure 2B is a use schematic view of the second embodiment of the present invention; Figure 3A is a perspective view of the third embodiment of the present invention; Figure 3B A schematic diagram of the use of the third embodiment of the present invention; FIG. 4 is a schematic flowchart of the welding method of the present invention.

The above objects, structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings.

Please refer to FIG. 1A, FIG. 1B, FIG. 1C and FIG. 1D, which are a three-dimensional schematic diagram, a cross-sectional schematic diagram, a usage schematic diagram (1) and (2) of the first embodiment of the present invention. The present invention includes a substrate 1, a substrate 1 has a welding area 11 and at least one positioning area 12, the positioning area 12 is located around the outside of the welding area 11, the positioning area 12 is provided with at least one positioning element 2, the positioning element 2 is a double-sided tape Or any of the adhesives, the shape of the substrate 1 may be any shape such as a circular shape, a regular polygonal shape, or an irregular polygonal shape.

An enameled wire 3 is, for example but not limited to, an enameled wire, and has a welding portion 31 and at least one non-welding portion 32, the welding portion 31 corresponds to the welding area 11, and the non-welding portion 32 corresponds to the positioning area 12.

Please refer to FIG. 1C. During operation, the enameled wire 3 is placed on the substrate 1 and the soldering portion 31 is aligned with the soldering area 11 instead of the soldering portion 32 with the positioning area 12, and the positioning member on the positioning area 12 2 will stick to these non-welded parts 32, so that the enameled wire 3 cannot be easily moved to achieve the purpose of fixing the enameled wire 3.

Please refer to FIG. 1D. When soldering, the enameled wire 3 is first removed by a heating means (such as but not limited to laser or bump welding or other equivalent means) to remove the outer insulating lacquer layer, and a solder 4 is placed on the substrate 1 On the soldering zone 11 and then heating (for example, but not limited to laser or reflow soldering or other equivalent means) to melt the solder 4 on the soldering zone 11 and fix the enameled wire 3.

In addition to the above-mentioned positioning member 2 fixing the object to be welded 3 with double-sided adhesive tape or adhesive, the positioning member 2 may also be made of magnetic material such as a magnet or an electromagnet to position the enameled wire 3 by magnetic fixing.

Please refer to FIG. 2A and FIG. 2B, which are a three-dimensional schematic diagram and a schematic diagram of the use of the second embodiment of the present invention. The partial structure is the same as the first embodiment described above, so it will not be repeated here, but this embodiment is as described above The main difference of the first embodiment is that the outer edge of the substrate 1 is provided with a ring wall 13 having a first protruding groove 131 corresponding to the positioning area 12 and By protruding the ring wall 13, the length and width of the first protruding groove 131 can be changed according to the specifications (such as wire diameter) and use requirements of the enameled wire 3, and the first protruding groove 131 produces a level to the enameled wire 3 Limit of direction.

Please refer to FIG. 3A and FIG. 3B, which is a three-dimensional schematic diagram and a schematic diagram of the use of the third embodiment of the present invention, the partial structure is the same as the first embodiment described above, so it will not be repeated here, but this embodiment is as described above The main difference of the first embodiment is that the outer edge of the substrate 1 is provided with a ring wall 13 having a first protruding groove 131 and a second protruding groove 132, the first protruding groove 131 and the second The protruding groove 132 corresponds to the positioning area 12 and protrudes from the ring wall 13, and the second protruding groove 132 and the first protruding groove 131 are located on a straight line, and the first and second protruding grooves The length and width of the grooves 131 and 132 can be changed according to the specifications (such as wire diameter) and use requirements of the enameled wire 3. The first and second protruding grooves 131 and 132 have a horizontal limit to the enameled wire 3, It is also determined that the enameled wire 3 is in a straight line.

Please refer to FIG. 4 and refer to FIGS. 1A to 1D above. FIG. 4 is a schematic flow chart of the welding method of the present invention including the following steps:

Step S1: providing a substrate with a soldering area and at least one positioning area, the positioning area having a positioning element. As mentioned above, the substrate 1 has a soldering area 11 and at least one positioning area 12. A positioning element 2 is provided on the positioning area 12, such as double-sided adhesive or coated adhesive, and a ring wall 13 is provided on the outer edge of the substrate 1 for positioning. The area 12 has a first protruding groove 131 and a second protruding groove 132 protruding from the ring wall 13, and the first protruding groove 131 and the second protruding groove 132 are located on a straight line.

Step S2: Place an enameled wire on the substrate. The enameled wire 3 (enameled wire) is placed on the substrate 1 as described above.

Step S21: Make a welding portion of the enameled wire correspond to the welding area of the substrate. The welding portion 31 of the enameled wire 3 is aligned with the welding area 11 as described above.

Step S22: Make a non-welded portion of the enameled wire correspond to the positioning area of the substrate. The non-welded portion 32 of the enameled wire 3 is aligned with the positioning area 12 as described above.

Step S3: Position the enameled wire through the positioning member. As described above, the non-welded portion 32 of the enameled wire 3 will be fixed by the positioning member 2 so that the enameled wire 3 is firmly fixed on the substrate 1, and the first and second protruding grooves 131 and 132 produce horizontal direction to the enameled wire 3 Limit.

Step S4: Using a heating means to remove an insulating lacquer layer of the enameled wire. As mentioned above, a heating means (such as laser heating or butt welding or other similar or equivalent heating methods) is used to melt and remove the insulating lacquer layer on the enameled wire 3 (enameled wire).

Step S5: Place a solder on the soldering area of the substrate, then melt the solder, and solder the enameled wire to the soldering area through the solder. After placing a solder 4 such as solder paste or tin on the soldering zone 11 as described above, the soldering zone 11 is heated to melt the solder 4, and the melted solder 4 will coat and fix the enameled wire 3 to the soldering zone 11.

The heating means in the above step S4 can remove the insulating lacquer layer by a manual hand soldering iron, or can remove the insulating lacquer layer by laser heating through automatic equipment; the above step S5 controls the amount of solder 4 and uses automatic equipment (such as a reflow furnace or Laser welding processing machine) Precise control of heating temperature time and related values can ensure that each welding place has the same quality.

With the above structure and method, the present invention has the following advantages over the current manual manual welding: 1. The technical requirements are reduced, and only ordinary operators need to follow the steps to operate the automatic processing machine heating or welding equipment; 2. Avoid enameled wire The problem of fracture; 3. Reduce the quality of the welded joint; 4. Uniform specifications of the welded joint, effectively control the height to avoid interference with other components; 5. Improve efficiency.

The present invention has been described in detail above, but the above is only one of the preferred embodiments of the present invention, and cannot limit the scope of the present invention. That is, all changes and modifications made within the scope of the application of the present invention shall still fall within the scope of the patent of the present invention.

1: substrate

11: Welding area

12: Positioning area

2: positioning piece

Claims (4)

A welding structure includes: a substrate having a welding area and at least one positioning area located outside the welding area, a ring wall is provided on an outer edge of the substrate, the positioning area has a first protruding groove and a second protrusion The groove protrudes from the ring wall, and the second protruding groove and the first protruding groove are located on a straight line; and at least one magnetic positioning member is provided in the positioning area to magnetically position an enameled wire, the first, The two protruding grooves produce a horizontal limit to the enameled wire, wherein the enameled wire is placed and connected to the welding area and the positioning area, and has a welding portion corresponding to the welding area and at least one non-welding portion corresponding to the positioning area, the The soldering area of the enameled wire is fixed to the soldering area of the substrate through solder. A welding method includes: providing a substrate with a welding area and at least one positioning area, the positioning area having a magnetic positioning element, a ring wall is provided on an outer edge of the substrate, the positioning area having a first protruding groove and a second The protruding groove protrudes from the ring wall, and the second protruding groove and the first protruding groove are located on a straight line; placing an enameled wire on the substrate; magnetically positioning the enameled wire through the positioning member, the first 2. The two protruding grooves produce a horizontal limit to the enameled wire; use a heating means to remove an insulating lacquer layer of the enameled wire; A solder is placed on the soldering area of the substrate, and then the solder is melted, and the enameled wire is connected to the soldering area through the solder. The welding method as described in item 2 of the patent application scope further includes: making a welding part of the enameled wire correspond to the welding area of the substrate. The soldering method as described in item 2 of the patent application scope further includes: making a non-welded part of the enameled wire correspond to the positioning area of the substrate.

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