TWI692639B - Ultrasonic probe - Google Patents

Abstract

An ultrasonic probe includes a Micromachined Ultrasonic Transducer (MUT) substrate and a grounding layer. The MUT substrate has an emitting surface, an acoustic wave generator array and a grounding line, and the acoustic wave generator array and the grounding line are formed on the emitting surface. The grounding layer is formed on an edge of the emitting surface. The grounding line is connected to the acoustic wave generator array and the grounding layer.

Description

Ultrasonic probe

The invention relates to an ultrasonic probe, and particularly relates to an ultrasonic probe with a ground layer.

The conventional ultrasonic probe includes a substrate, an acoustic wave generating array and at least one wire. The sound wave generating array includes several sound wave generating units, and each wire is connected to the corresponding connected sound wave generating array. In order to electrically connect the sound wave generating array and the circuit board, a bonding wire is generally used to cross the circuit board and the wire laterally to electrically connect the sound wave generating array and the circuit board. However, the use of wire bonding requires special consideration of the operability of the wire bonding tool head (such as whether the operating space is sufficient), and the wire usually has a length, which forms part of the impedance, and the wire is likely to cause electrical connection failure and reliability Degree is low.

Therefore, there is a need to propose an ultrasonic probe capable of improving the aforementioned problems and a method of manufacturing the same.

An embodiment of the present invention provides an ultrasonic probe, which can improve the above problems.

An embodiment of the present invention provides an ultrasonic probe. The ultrasonic probe includes a micromechanical ultrasonic transducer substrate and a ground layer. The micromachined ultrasonic transducer substrate has an emitting surface, an acoustic wave generating array and a ground wire, and the acoustic wave generating array and the ground wire are formed on the emitting surface. The ground layer is formed on one edge of the emitting surface. Among them, the ground wire connects the sound wave generating array and the ground layer.

In order to have a better understanding of the above and other aspects of the present invention, the following examples are specifically described in conjunction with the accompanying drawings as follows:

In order to have a better understanding of the above and other aspects of the present invention, the embodiments are specifically described below and described in detail in conjunction with the accompanying drawings.

Please refer to FIGS. 1A and 1B, FIG. 1A shows a top view of an ultrasonic probe 100 according to an embodiment of the present invention, and FIG. 1B shows a cross-sectional view of the ultrasonic probe 100 of FIG. 1 along the direction 1B-1B′ .

The ultrasonic probe 100 includes a micromachined Ultrasonic Transducer (MUT) substrate 110 (drawing the outer boundary of the micromachined Ultrasonic Transducer substrate 110 in FIG. 1A with a thick line), a ground layer 120, and a conductive adhesive 130, a circuit board 140, an acoustic wave transmission medium 150, a cover plate 155, and a package 160. The micromechanical ultrasonic transducer substrate 110 has an emitting surface 110u, an acoustic wave generating array 111, at least one ground wire 110g, and at least one signal wire 110s. The sound wave generating array 111, the ground line 110g and the signal line 110s are formed on the emitting surface 110u. The ground layer 120 is formed on the edge of the emitting surface 110u. The ground line 110g connects the sound wave generation array 111 and the ground layer 120. In this way, all the ground wires 110g extend to the ground layer 120, and are all electrically connected to a ground potential (not shown) of the circuit board 140 through the ground layer 120. In this way, the ground wire 110g can be electrically connected to the circuit board 140 without passing through a bonding wire.

In addition, the aforementioned “edge” is, for example, an area other than the acoustic wave generating array 111, and its range may extend to the outer side 110e of the micromechanical ultrasonic transducer substrate 110, but the embodiment of the present invention is not limited thereto.

As shown in FIGS. 1A and 1B, the acoustic wave generating array 111 includes at least one acoustic wave generating unit 1111. Each sound wave generating unit 1111 includes at least one resonance cavity 1111r and at least one resonance film 1112. Each resonance film 1112 is formed on the emission surface 110u and covers the corresponding resonance cavity 1111r. Each sound wave generating unit 1111 further includes at least one signal connection line 1111s and at least one ground connection line 1111g. Each resonance film 1112 is connected to the signal line 110s by a corresponding signal connection line 1111s, and each resonance film 1112 is connected to the ground line 110g by a corresponding ground connection line 1111g. Each signal line 110s connects the corresponding sound wave generating unit 1111 to the edge of the emitting surface 110u, and each ground line 110g connects the corresponding sound wave generating unit 1111 to the ground layer 120. For the control of a sound wave generating unit 1111, the control signal C1 of a controller 10 can be transmitted to the signal line 110s through the circuit board 140, and then through the signal connection line 1111s and the ground connection line 1111g connected to each resonance film 1112, Return to the controller 10 via the ground wire 110g and the circuit board 140. The control signal C1 can control all the resonance films 1112 of the sound wave generating units 1111 to oscillate up and down to emit ultrasonic waves. In addition, depending on the acoustic wave focusing characteristics, different acoustic wave generating units 1111 can be controlled by different control signals C1, for example, by different delay time control signals C1, so that all acoustic wave generating units 1111 focus on the same area as a point.

In addition, the resonant cavity 1111r, the resonant film 1112, the signal connection line 1111s, and the ground connection line 1111g may be formed using a semiconductor process, where the semiconductor process includes, for example, lithography etching technology, coating technology, and/or any other device that can form the acoustic wave generation array 111 Semiconductor technology.

As shown in FIG. 1A, the ground layer 120 has a closed ring shape. The ground layer 120 surrounds all the sound wave generating units 1111 in a closed manner. The substrate 110 has an outer side 110e. In this embodiment, the ground layer 120 abuts the outer side 110e of the substrate 110. In another embodiment, the ground layer 120 may be adjacent to the outer side 110e of the substrate 110, but spaced apart from the outer side 110e. In other embodiments, a portion of the ground layer 120 may extend to the outer side 110e of the substrate 110, and another portion of the ground layer 120 may be adjacent to the outer side 110e of the substrate 110, but at a distance from the outer side 110e.

As shown in FIG. 1A, the ground layer 120 includes a connected ground ring 120g1 and two ground pads 120g2. The two ground pads 120g2 are disposed diagonally adjacent to one of the emitting surfaces 110u, and the width W1 of each ground pad 120g2 is greater than the width W2 of the ground ring 120g1. Since the ground pad 120g2 of the ground layer 120 provides a sufficient width, the overlapping area of the ground pad (not shown) of the circuit board 140 and the ground pad 120g2 of the ground layer 120 can be increased to improve the electrical connection quality.

As shown in FIG. 1B, the entire ground layer 120 is electrically connected to the circuit board 140 through the ground pad 120g2 (the ground pad 120g2 is shown in FIG. 1A), the conductive adhesive 130, and the ground pad (not shown) of the circuit board 140. Ground potential. In the embodiment of the present invention, the circuit board 140 and the ground layer 120 are electrically connected through the conductive adhesive 130. Compared with the conventional bonding wire, the conductive adhesive has higher reliability, shorter electrical transmission paths, and lower impedance.

As shown in FIG. 1B, the conductive paste 130 is disposed on the emitting surface 110u. For example, the conductive adhesive 130 is located between the ground line 110g of the micromachined ultrasonic transducer substrate 110 and the ground pad 140g of the circuit board 140 along the acoustic emission direction E1, and is located on the signal line 110s of the micromachined ultrasonic transducer substrate 110 Between the signal pad 140s of the circuit board 140. The conductive adhesive 130 allows electrical transmission in the Z axis (the Z axis is, for example, approximately parallel to the acoustic emission direction E1), but does not allow electrical transmission in the X and Y axes (for example, approximately perpendicular to the Z axis). Therefore, even if the conductive adhesive 130 is a continuously extending conductive adhesive, the adjacent two signal lines 110s will not be electrically short-circuited through the conductive adhesive 130 and the adjacent two ground lines 110g will not be electrically short-circuited through the conductive adhesive 130. In this embodiment, the conductive adhesive 130 is an anisotropic conductive film (Anisotropic Conductive Film, ACF), or other conductive materials that only allow electrical transmission in the Z axis. One of the illustrated X axis and Y axis is, for example, the long axis emission direction of the ultrasound probe 100, and the other of the X axis and Y axis is, for example, the short axis emission direction of the ultrasound probe 100.

As shown in FIG. 1B, the conductive paste 130 has a first recess 130r. The circuit board 140 is, for example, a flexible printed circuit (FPC), but the embodiment of the present invention is not limited thereto. The circuit board 140 has an opening 140a. The circuit board 140 is disposed on the conductive adhesive 130 and the opening 140a forms a second recess 140r corresponding to the first recess 130r. The acoustic wave transmission medium 150 is formed in the first concave portion 130r and the second concave portion 140r, for example, to fill the first concave portion 130r and the second concave portion 140r. The acoustic wave transmission medium 150 is, for example, silicone oil, glycerin, or other non-conductive medium that can transmit acoustic waves. The acoustic wave transmission medium 150 can help the ultrasonic waves generated by the acoustic wave generation array 111 to be transmitted. As shown in FIG. 1A, the conductive adhesive 130 has a closed ring shape, so that the first concave portion 130r is not in communication with the outer surface of the conductive adhesive 130, and the circuit board 140 has a closed ring shape, so that the second concave portion 140r and the outer surface of the circuit board 140 The sides are not connected. In this way, the acoustic wave transmission medium 150 located in the first concave portion 130r and the second concave portion 140r does not leak outward from the conductive adhesive 130 and the circuit board 140 side.

In addition, the second recess 140r and the first recess 130r substantially overlap, for example, at least partially overlap. In one embodiment, the second concave portion 140r may be smaller than or substantially equal to the size of the first concave portion 130r (such as a top view area), but the second concave portion 140r is also larger than the size of the first concave portion 130r (such as a top view area).

The cover plate 155 is disposed on the circuit board 140 and covers the opening 140a to cover the first concave portion 130r and the second concave portion 140r, so as to avoid the leakage of the acoustic wave transmission medium 150 located in the first concave portion 130r and the second concave portion 140r from the opening 140a. In addition, although not shown in the figure, the ultrasonic probe 100 further includes an adhesive layer formed between the cover plate 155 and the circuit board 140 to fix the relative position of the cover plate 155 and the circuit board 140. In summary, the acoustic wave transmission medium 150 is enclosed in the first concave portion 130r and the second concave portion 140r by the conductive adhesive 130, the circuit board 140 and the cover plate 155. In addition, the cover plate 155 allows sound waves to pass through, which has a sound wave transmittance of, for example, 80%, 85%, 90%, or 95% or more. In an embodiment, the cover plate 155 may be a transparent or non-transparent cover plate. In terms of material, the material of the cover plate 155 includes resin, such as polyurethane.

As shown in FIG. 1B, the package body 160 covers the micromachined ultrasonic transducer substrate 110, the ground layer 120, the conductive adhesive 130, a part of the circuit board 140 and the cover plate 150. Another part of the circuit board 140 protrudes from the package body 160 and is electrically connected to the controller 10. The material of the package body 160 includes Novolac-based resin, epoxy-based resin, silicone-based resin or other suitable coating agent. The package 160 may also include a suitable filler, such as powdered silicon dioxide. In addition, several packaging techniques may be used to form the package body 160, such as compression molding, liquid encapsulation, injection molding, or transfer molding.

Please refer to FIGS. 2A~2C, FIG. 2A shows a top view of an ultrasonic probe 200 according to another embodiment of the present invention, and FIG. 2B shows a cross-sectional view of the ultrasonic probe 200 of FIG. 2A along the direction 2B-2B′ FIG. 2C shows a cross-sectional view of the ultrasonic probe 200 of FIG. 2A along the direction 2C-2C′.

The ultrasonic probe 200 includes a micromechanical ultrasonic transducer substrate 210 ((drawing the outer boundary of the micromechanical ultrasonic transducer substrate 210 in FIG. 2A with a thick line)), a ground layer 220, a conductive adhesive 230, and a circuit board 140 , Acoustic wave transmission medium 150, cover plate 155, package body 160 and conductive connection layer 270. The micromechanical ultrasonic transducer substrate 210 has an emitting surface 110u, an acoustic wave generating array 111, at least one ground wire 110g, at least one signal wire 110s, and at least one retaining wall 212. The sound wave generating array 111, the ground wire 110g, the signal wire 110s, and the blocking wall 212 are formed on the emitting surface 110u. The ground layer 120 is formed on the edge of the emitting surface 110u, wherein the ground line 110g connects the sound wave generating array 111 and the ground layer 120.

In this embodiment, the ground layer 220 is adjacent to the outer side 210e of the micromachined ultrasonic transducer substrate 210, but the embodiment of the present invention is not limited thereto. The ground layer 220 includes a connected ground ring 221 and two ground pads 120g2. The two ground pads 120g2 are arranged diagonally adjacent to one of the emitting surfaces 110u. The width W1 of each ground pad 120g2 is greater than the width W2 of the ground ring 221. Since the ground pad 120g2 of the ground layer 120 provides a sufficient width, the overlapping area of the ground pad (not shown) of the circuit board 140 and the ground pad 120g2 of the ground layer 220 can be increased to improve the electrical connection quality.

As shown in FIG. 2A, the ground ring 221 of the ground layer 220 includes several ground portions 221g separated from each other. Each ground portion 221g is adjacent to the outer side 210e of the micromachined ultrasonic transducer substrate 110, for example, extending to the outer side 210e . Each ground line 110g of the micromachined ultrasonic transducer substrate 110 is connected to the corresponding ground portion 221g. The conductive connection layer 270 is formed on the outer surface 210e of the micromachined ultrasonic transducer substrate 110, and is connected to the ground portions 221g, so that the ground portions 221g separated from each other are electrically connected through the conductive connection layer 270.

As shown in FIG. 2B, the entire ground layer 220 is electrically connected to the ground potential of the circuit board 140 through the ground pad 120g2, the conductive adhesive 230, and the ground pad (not shown) of the circuit board 140. As shown in FIG. 2A, the conductive adhesive 230 includes a plurality of separated conductive adhesive pads 231. Each conductive adhesive pad 231 covers the corresponding ground wire 110g or the corresponding signal wire 110s. The conductive adhesive pads 231 and the grounding portions 221g of the ground layer 220 are spaced apart from each other to prevent the signal line 110s from being electrically short-circuited to the grounding portion 221g through the conductive adhesive pads 231. In this embodiment, the electrical transmission of the conductive adhesive 230 is non-directional, that is, electrical transmission along the Z axis, X axis, and Y axis is allowed. Since the conductive adhesive pads 231 are separated from each other, even if the electrical transmission of the conductive adhesive 230 is non-directional, it will not cause an electrical short circuit between the two adjacent conductive adhesive pads 231. In one embodiment, the conductive adhesive 230 is, for example, silver adhesive, but it can also be other conductive materials. In addition, as shown in FIGS. 2A and 2B, the signal line 110s extends from the acoustic wave generating array 111 toward the edge of the emitting surface 110u and is a distance H1 away from the outer side surface 210e of the micromechanical ultrasonic transducer substrate 110, and the distance H1 may be The conductive connection layer 270 is prevented from contacting the signal line 110s. In one embodiment, the distance H1 is, for example, greater than 10 microns, such as between 150 microns and 250 microns. The aforementioned numerical range is sufficient to prevent the conductive connection layer 270 from contacting the signal line 110s.

As shown in FIGS. 2A-2C, the conductive adhesive pads 231 of the conductive adhesive 230 are distributed on two opposite edges of the emitting surface 110u (not shown in FIG. 2A) of the micromachined ultrasonic transducer substrate 110, and the second block The walls 212 are respectively located at two opposite edges of the emitting surface 110u. A plurality of conductive adhesive pads 231 and the second blocking wall 212 surround the first concave portion 230r. The first concave portion 230r exposes the sound wave generating array 111. The circuit board 140 has a second recess 140r. The acoustic wave transmission medium 150 is located in the first concave portion 230r and the second concave portion 140r. Due to the configuration of the blocking wall 212, the sound wave transmission medium 150 located in the first concave portion 230r and the second concave portion 140r can be blocked from leaking. In addition, since several separated conductive adhesive pads 231 are arranged adjacent to each other (but not in contact), a certain external leakage resistance is also generated for the acoustic wave transmission medium 150 located in the first concave portion 230r and the second concave portion 140r, which can reduce the external leakage Leakage or even no leakage. In addition, in an embodiment, the retaining wall 212 and the plate body of the micromechanical ultrasonic transducer substrate 110 may be an integrally formed structure. In addition, the retaining wall 212 is, for example, an insulating retaining wall, so that the signal line 110s can be prevented from being electrically short-circuited with the ground layer 220 through the conductive adhesive 230 and the retaining wall 212.

Please refer to FIGS. 3A~3B. FIG. 3A illustrates a top view of an ultrasonic probe 300 according to another embodiment of the present invention, and FIG. 3B illustrates a cross section of the ultrasonic probe 300 of FIG. 3A along the direction 3B-3B′. Figure.

The ultrasonic probe 300 includes a micromechanical ultrasonic transducer substrate 210, a ground layer 220, a conductive adhesive 230, a circuit board 140, an acoustic transmission medium 150, a cover plate 155, a package 160, and a conductive connection layer 270. The micromechanical ultrasonic transducer substrate 210 has an emitting surface 110u, an acoustic wave generating array 111, at least one ground wire 110g, at least one signal wire 110s, and at least one retaining wall 212. The sound wave generating array 111, the ground line 110g, the signal line 110s, and the blocking wall 212 are formed on the emitting surface 110u. The ground layer 120 is formed on the edge of the emitting surface 110u, wherein the ground line 110g connects the sound wave generating array 111 and the ground layer 120.

The ultrasonic probe 300 of the embodiment of the present invention has the same or similar technical features as the aforementioned ultrasonic probe 200, except that the grounding portion 221g and the outer surface 210e of the micromechanical ultrasonic transducer substrate 210 have a gap H2, the conductive connection layer 270 extends into the interval H2, that is, extends above the emission surface 110u. In addition, the conductive connection layer 270 is connected to the ground portions 221g, so that several separated ground portions 221g are electrically connected through the conductive connection layer 270.

Please refer to FIGS. 4A~4B. FIG. 4A illustrates a top view of the resonant cavity 1111r and the resonant film 1112 according to another embodiment of the present invention, and FIG. 4B illustrates the resonant cavity 1111r and the resonant film 1112 of FIG. 4A along the direction. 4B-4B' sectional view. The micromechanical ultrasonic transducer substrate 110 or 210 of any one of the foregoing ultrasonic probes 100-300 may further include a plurality of protruding walls 113. The protruding wall 113 protrudes from the emitting surface 110u, and is disposed adjacent to the resonance cavity 1111r. Several protruding walls 113 surround the corresponding resonant cavity 1111r, wherein the extending direction of each protruding wall 113 is not parallel to each side of the resonant cavity 1111r. In addition, the angle A1 between the two adjacent protruding walls 113 is, for example, between 70 degrees and 100 degrees. In one embodiment, the height L1 of each protruding wall 113 is greater than or substantially equal to the depth L2 of the resonance cavity 1111r. The protruding wall 113 can increase the strength of the micromachined ultrasonic transducer substrate, and reduce the amount of deformation of the resonance cavity 1111r and the resonance film 1112. In this way, when the ultrasonic probe is pressed against the body to be measured (such as a human body), the protruding wall 113 can reduce the amount of deformation of the resonance cavity 1111r and the resonance film 1112 under pressure, and ensure that the generated ultrasonic waves conform to the expected characteristics. In addition, the protruding wall 113 is integrally formed with the plate system of the micromechanical ultrasonic transducer substrate, but the embodiment of the present invention is not limited thereto.

Please refer to FIGS. 5A1 to 5F, which illustrate the manufacturing process diagram of the ultrasonic probe 100 of FIG. 1A.

As shown in FIGS. 5A1 and 5A2, a micromechanical ultrasonic transducer substrate 110 is provided, wherein the micromechanical ultrasonic transducer substrate 110 includes an emission surface 110u, an acoustic wave generating array 111, at least one ground wire 110g, and at least one signal wire 110s. The acoustic wave generating array 111 includes at least one acoustic wave generating unit 1111, wherein a ground line 110g and a signal line 110s extend from the corresponding acoustic wave generating unit 1111 to the edge of the emitting surface 110u. In addition, the ground layer 120 is formed on the emitting surface 110u of the micromachined ultrasonic transducer substrate 110, for example, formed on the edge of the emitting surface 110u, wherein the ground line 110g connects the sound wave generating array 111 and the ground layer 120.

As shown in FIGS. 5B1 and 5B2, for example, a coating technique may be used to form a conductive adhesive 130 to cover at least a part of the ground layer 120, a part of the ground line 110g, and a part of the signal line 110s. The conductive paste 130 has a first concave portion 130r, and the first concave portion 130r exposes the acoustic wave generating array 111, for example, exposes all the acoustic wave generating units 1111.

As shown in FIG. 5C, the circuit board 140 is disposed on the conductive adhesive 130, wherein the circuit board 140 has a second recess 140r, and the second recess 140r exposes the sound wave generating array 111 and the first recess 130r. The second recess 140r substantially overlaps the first recess 130r, for example, at least partially.

As shown in FIG. 5D, for example, an injection technique may be used to form the acoustic wave transmission medium 150 in the first concave portion 130r and the second concave portion 140r. The acoustic wave transmission medium 150 fills at least a part of the first concave portion 130r and the second concave portion 140r.

As shown in FIG. 5E, the cover plate 155 is arranged to cover the opening 140a of the second recess 140r. Although not shown, an adhesive layer may be formed between the cover 155 and the circuit board 140 to fix the relative position between the sound cover 155 and the circuit board 140.

As shown in FIG. 5F, for example, compression molding, liquid encapsulation, injection molding, or injection molding can be used to form the package body 160 to cover the micromechanical ultrasonic transducer substrate 110, the ground layer 220, the conductive adhesive 130, and the circuit board A part of 140 and the cover plate 155 to form the ultrasonic probe 100. Another part of the circuit board 140 protrudes from the package body 160 and is electrically connected to the controller 10 (the controller 10 is shown in FIG. 1B).

Please refer to FIGS. 6A1 to 6H, which illustrate the manufacturing process diagram of the ultrasonic probe 200 of FIG. 2A.

As shown in FIGS. 6A1 and 6A2, a micromechanical ultrasonic transducer substrate 210 is provided, which has an emission surface 110u, an acoustic wave generation array 111, at least one ground line 110g, at least one signal line 110s, and at least one retaining wall 212. The acoustic wave generating array 111 includes at least one acoustic wave generating unit 1111, wherein a ground line 110g and a signal line 110s extend from the corresponding acoustic wave generating unit 1111 to the edge of the emitting surface 110u. The retaining wall 212 protrudes from the emitting surface 110u and is integrally formed with the plate body of the micromechanical ultrasonic transducer substrate 210, but the embodiment of the present invention is not limited thereto.

In addition, the ground layer 220 is formed on the emitting surface 110u of the micromachined ultrasonic transducer substrate 210, for example, formed on the edge of the emitting surface 110u, wherein the ground line 110g connects the sound wave generating array 111 and the ground layer 220. The ground layer 220 includes a connected ground ring 221 and two ground pads 120g2. The two ground pads 120g2 are arranged diagonally adjacent to one of the emitting surfaces 110u.

As shown in FIG. 6B, a coating technique may be used to form a conductive adhesive 230 to cover at least a part of the ground layer 220, a part of the ground line 110g, and a part of the signal line 110s. In this step, as shown in the figure, the conductive adhesive 230 includes two continuously extending adhesive strips 230A and 230B, and the adhesive strips 230A and 230B are respectively located at two opposite edges of the emitting surface 110u. The rubber strips 230A and 230B cover the signal line 110s and the ground line 110g located on the same side edge. The two retaining walls 212 are respectively located at two opposite edges of the emitting surface 110u, wherein the conductive adhesive 230 and the retaining wall 212 surround a first concave portion 230r, and the first concave portion 230r exposes the sound wave generating array 111. In this embodiment, the electrical transmission of the conductive adhesive 230 is non-directional, that is, it allows electrical transmission along the Z axis, the X axis, and the Y axis.

As shown in FIG. 6C, for example, a cutting technique may be used to cut the conductive adhesive 230 into a plurality of separated conductive adhesive pads 231 and the ground ring 221 into a plurality of separated ground portions 221g, wherein each ground wire 110g is correspondingly conductive The rubber pad 231 is covered and each signal line 110s is covered by the corresponding conductive rubber pad 231. Since the conductive adhesive pads 231 are separated from each other, even if the electrical transmission of the conductive adhesive 230 is non-directional, it will not cause an electrical short circuit between the two adjacent conductive adhesive pads 231. In addition, the foregoing cutting process is completed by using a knife or a laser, for example.

As shown in FIG. 6D, the circuit board 140 is disposed on a plurality of conductive adhesive pads 231, wherein the circuit board 140 has a second recess 140r, and the second recess 140r exposes the sound wave generating array 111 and the first recess 130r. The second recess 140r substantially overlaps the first recess 230r, for example, at least partially.

As shown in FIG. 6E, an injection technique may be used to form the acoustic wave transmission medium 150 in the first concave portion 230r and the second concave portion 140r. The acoustic wave transmission medium 150 fills at least a part of the first concave portion 230r and the second concave portion 140r.

As shown in FIG. 6F, the cover plate 155 is arranged to cover the opening 140a of the second recess 140r. Although not shown, an adhesive layer may be formed between the cover 155 and the circuit board 140 to fix the relative position between the sound cover 155 and the circuit board 140.

As shown in FIG. 6G, the circuit board 140 is folded back to expose the outer surface 210e of the micromachined ultrasonic transducer substrate 210 and the ground portion 221g.

As shown in FIG. 6H, for example, a coating technique may be used to form a conductive connection layer 270 formed on the outer side surface 210e. Through the capillary phenomenon, the conductive connection layer 270 in a dynamic state penetrates into the gap between the ground portion 221g and the circuit board 140, and connects all the ground portions 221g exposed from the outer side surface 210e. Next, the conductive connection layer 270 may be heated to cure the conductive connection layer 270.

Then, for example, compression molding, liquid encapsulation, injection molding, or injection molding may be used to form the package body 160 to cover the micromechanical ultrasonic transducer substrate 210, ground layer 220, conductive adhesive 230, and circuit board 140 of FIG. 6H. And the cover 155 to form the ultrasonic probe 200. Another part of the circuit board 140 protrudes from the package body 160 and is electrically connected to the controller 10 (the controller 10 is shown in FIG. 1B).

The manufacturing method of the ultrasonic probe 300 is similar to or the same as that of the aforementioned ultrasonic probe 200, and will not be repeated here.

In summary, although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make various modifications and retouching without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be deemed as defined by the scope of the attached patent application.

10: Controller 100, 200, 300: Ultrasonic probe 110, 210: Micromechanical ultrasonic transducer substrate 110u: launch surface 110e, 210e: outer side 111: Sound wave generating array 1111: Sound wave generating unit 1111r: Resonant cavity 1111s: signal cable 1111g: Ground connection cable 1112: Resonance membrane 110g: ground wire 110s: signal cable 113: Highlight the wall 120, 220: ground layer 120g1: ground ring 120g2: grounding pad 130, 230: conductive adhesive 130r, 230r: first recess 140: circuit board 140a: opening 140r: second recess 140g: grounding pad 140s: signal pad 150: Acoustic transmission medium 155: Cover 160: package 212: Retaining wall 221g: Ground 221: Ground ring 230A, 230B: rubber strip 231: conductive rubber pad 270: conductive connection layer A1: Angle C1: Control signal E1: Acoustic wave emission direction H1: distance H2: interval L1: height L2: depth W1, W2: width

FIG. 1A is a top view of an ultrasonic probe according to an embodiment of the invention. FIG. 1B is a cross-sectional view of the ultrasonic probe of FIG. 1 along the direction 1B-1B'. FIG. 2A is a top view of an ultrasonic probe according to another embodiment of the invention. Figure 2B shows a cross-sectional view of the ultrasonic probe of Figure 2A along the direction 2B-2B'. Figure 2C shows a cross-sectional view of the ultrasonic probe of Figure 2A along the direction 2C-2C'. FIG. 3A shows a top view of an ultrasonic probe according to another embodiment of the invention. Figure 3B shows a cross-sectional view of the ultrasonic probe of Figure 3A along the direction 3B-3B'. FIG. 4A is a top view of a resonant cavity and a resonant membrane according to another embodiment of the invention. FIG. 4B is a cross-sectional view of the resonant cavity and the resonant membrane of FIG. 4A along the direction 4B-4B'. Figures 5A1~5F show the manufacturing process diagram of the ultrasonic probe of Figure 1A. Figures 6A1~6H show the manufacturing process of the ultrasonic probe of Figure 2A.

100: Ultrasonic probe

110: Micromechanical ultrasonic transducer substrate

110e: outer side

111: Sound wave generating array

1111: Sound wave generating unit

110g: ground wire

110s: signal cable

120: ground plane

130: conductive adhesive

130r: the first recess

140: circuit board

160: package

W1, W2: width

Claims (10)

An ultrasonic probe includes: A micromechanical ultrasonic transducer substrate having an emitting surface, an acoustic wave generating array and a ground wire, the acoustic wave generating array and the ground wire are formed on the emitting surface; and A ground layer formed on one edge of the emitting surface; Wherein, the ground wire connects the sound wave generating array and the ground layer. The ultrasonic probe according to item 1 of the patent application scope, wherein the ground layer has a closed ring shape. The ultrasonic probe according to item 1 of the patent application scope, wherein the ground layer includes a ground ring and two ground pads connected to each other, the two ground pads are disposed diagonally adjacent to one of the emission surfaces, and one of each ground pad The width is larger than a width of the ground ring. The ultrasonic probe according to item 1 of the patent application scope, wherein the sound wave generating array includes a plurality of the sound wave generating units, and the ground layer surrounds the sound wave generating units in a closed manner. The ultrasonic probe as described in item 1 of the patent application scope further includes: A conductive adhesive disposed on the emitting surface and having a first concave portion; A circuit board having an opening, the circuit board is disposed on the conductive adhesive and the opening corresponds to the first recess to form a second recess; and An acoustic wave transmission medium formed in the first concave portion and the second concave portion; Wherein, the conductive glue is located between the ground line of the micromachined ultrasonic transducer substrate and the circuit board along a sound wave emission direction. The ultrasonic probe as described in item 5 of the patent application scope, wherein the conductive adhesive is an anisotropic conductive adhesive. The ultrasonic probe according to item 1 of the patent application scope, wherein the ground layer includes a plurality of ground portions separated from each other, each of the ground portions is adjacent to a side surface of the micromechanical ultrasonic transducer substrate, the micromechanical ultrasonic wave The transducer substrate includes a plurality of the ground wires, and each of the ground wires is connected to the corresponding ground portion; the ultrasonic probe further includes: A conductive connection layer is formed on the side and connects the grounding portions. The ultrasonic probe as described in item 7 of the patent application scope, wherein the micromechanical ultrasonic transducer substrate further includes a signal line extending from the acoustic wave generating array toward the edge of the emitting surface at a distance The outer surface of one of the substrates of the micromachined ultrasonic transducer is at a distance greater than 10 microns. The ultrasonic probe according to item 1 of the patent application scope, wherein the acoustic wave generating array includes a resonant cavity, and the micromechanical ultrasonic transducer substrate further includes: A plurality of protruding walls protruding relative to the emitting surface, and arranged adjacent to the resonant cavity; Wherein, the extending direction of each protruding wall is non-parallel to each side of the resonant cavity. The ultrasonic probe according to item 9 of the patent application scope, wherein the height of each protruding wall is greater than or substantially equal to the depth of the resonant cavity.

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