TWI690691B - Surface measurement system - Google Patents
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- TWI690691B TWI690691B TW107111369A TW107111369A TWI690691B TW I690691 B TWI690691 B TW I690691B TW 107111369 A TW107111369 A TW 107111369A TW 107111369 A TW107111369 A TW 107111369A TW I690691 B TWI690691 B TW I690691B
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本案是有關於一種表面量測系統,尤指一種用於量測透明組件的表面量測系統。 This case is about a surface measurement system, especially a surface measurement system for measuring transparent components.
隨著科技的進步,越來越多的電子產品使用透明材質(如玻璃或壓克力)作為產品組件(如手機面板、手機機殼、透鏡)。為了確保品質,透明組件可經由量測裝置量測而得到其表面形貌。然而,透明材質具有低反射率的問題,若要量到足夠準確的透明組件影像,需要增加對透明組件的曝光時間與/或光源強度。若透明組件的內部或表面具有瑕疵,也可能被量測裝置量測到,而導致訊號誤判。此外,若透明組件的表面為曲面,在量測時也易有多重反射的情況發生,增加量測的困難。 With the advancement of technology, more and more electronic products use transparent materials (such as glass or acrylic) as product components (such as mobile phone panels, mobile phone cases, lenses). In order to ensure quality, the transparent component can be measured by a measuring device to obtain its surface morphology. However, transparent materials have the problem of low reflectivity. To measure a sufficiently accurate image of a transparent component, it is necessary to increase the exposure time and/or light source intensity of the transparent component. If the inside or surface of the transparent component is flawed, it may also be measured by the measuring device, resulting in a false signal judgment. In addition, if the surface of the transparent component is a curved surface, multiple reflections are likely to occur during measurement, which increases the difficulty of measurement.
另外,若將透明組件先置入低溫腔體中降溫後,接著移入高溫高濕的腔體中進行結露,之後才使用量測裝置量進行量測,則會有設備成本高、製程時間長與腔體支撐力不足等問題。 In addition, if the transparent component is first placed in a low-temperature cavity to cool down, and then moved into a high-temperature and high-humidity cavity for dew condensation, and then measured by a measuring device, there will be high equipment cost and long process time. Problems such as insufficient support of the cavity.
本發明之一技術態樣為一種表面量測系統。 One technical aspect of the present invention is a surface measurement system.
根據本發明一實施方式,一種表面量測系統,位於開放空間。表面量測系統包含移動平台、至少一結露裝置與量測裝置。移動平台用以沿一方向傳送待測物。結露裝置選擇性地位於移動平台上方與下方,用以形成液體層於待測物的表面上。結露裝置包含流道、迴風道、溫度濕度控制組件與風機。流道具有朝向移動平台的出風口。迴風道具有朝向移動平台的至少一進風口。溫度濕度控制組件具有進風口與出風口。溫度濕度控制組件的進風口連通於迴風道。風機具有進風口與出風口,其分別連通溫度濕度控制組件的出風口與流道。量測裝置位於移動平台上方,包含光源與影像擷取模組。光源用以照射移動平台上具有液體層的待測物。影像擷取模組電性連接光源,用以偵測從具有液體層的待測物散射的光線。 According to an embodiment of the invention, a surface measurement system is located in an open space. The surface measurement system includes a mobile platform, at least one condensation device and a measurement device. The mobile platform is used to transfer the test object in one direction. The dew condensation device is selectively located above and below the mobile platform to form a liquid layer on the surface of the object to be measured. Condensation devices include flow channels, return air channels, temperature and humidity control components and fans. The flow channel has an air outlet toward the mobile platform. The return air passage has at least one air inlet toward the mobile platform. The temperature and humidity control assembly has an air inlet and an air outlet. The air inlet of the temperature and humidity control module communicates with the return air channel. The fan has an air inlet and an air outlet, which respectively connect the air outlet and the flow channel of the temperature and humidity control component. The measurement device is located above the mobile platform and includes a light source and an image capture module. The light source is used to irradiate the test object with a liquid layer on the mobile platform. The image capture module is electrically connected to the light source, and is used to detect the light scattered from the test object with the liquid layer.
在本發明一實施方式中,上述溫度濕度控制組件包含加濕器、蒸發器與加熱器。加濕器鄰近於溫度濕度控制組件的進風口。蒸發器位於加濕器上方。加熱器位於蒸發器上方。 In an embodiment of the invention, the temperature and humidity control assembly includes a humidifier, an evaporator, and a heater. The humidifier is adjacent to the air inlet of the temperature and humidity control assembly. The evaporator is located above the humidifier. The heater is located above the evaporator.
在本發明一實施方式中,上述溫度濕度控制組件更包含壓縮機。壓縮機連通蒸發器。 In an embodiment of the invention, the temperature and humidity control assembly further includes a compressor. The compressor communicates with the evaporator.
在本發明一實施方式中,上述溫度濕度控制組件具有連通迴風道的進風口,從溫度濕度控制組件的進風口進入的氣流經過加濕器與蒸發器後具有介於40%至95%範圍的相對濕度。 In an embodiment of the present invention, the temperature and humidity control assembly has an air inlet communicating with the return air passage, and the airflow entering from the air inlet of the temperature and humidity control assembly passes through a humidifier and an evaporator and has a range of 40% to 95% Relative humidity.
在本發明一實施方式中,上述從溫度濕度控制組件的進風口進入的氣流經過加熱器後具有介於0℃至90℃範 圍的溫度。 In an embodiment of the present invention, the airflow entering from the air inlet of the temperature and humidity control assembly passes through the heater and has a range between 0°C and 90°C. Ambient temperature.
在本發明一實施方式中,上述從溫度濕度控制組件的進風口進入的氣流經過風機後具有大於0m/s且小於等於5m/s的流速。 In an embodiment of the present invention, the airflow entering from the air inlet of the temperature and humidity control module has a flow velocity greater than 0 m/s and less than or equal to 5 m/s after passing through the fan.
在本發明一實施方式中,上述結露裝置更包含整流板。整流板位於流道中且鄰近流道的出風口,且整流板具有複數個穿孔。 In an embodiment of the invention, the dew condensation device further includes a rectifying plate. The rectifying plate is located in the flow channel and adjacent to the air outlet of the flow channel, and the rectifying plate has a plurality of perforations.
在本發明一實施方式中,上述迴風道的進風口位於流道之出風口旁邊。 In an embodiment of the present invention, the air inlet of the return air channel is located beside the air outlet of the flow channel.
在本發明一實施方式中,上述迴風道具有兩進風口,流道之出風口位於迴風道的兩進風口之間。 In an embodiment of the invention, the return air channel has two air inlets, and the air outlet of the flow channel is located between the two air inlets of the return air channel.
在本發明一實施方式中,上述表面量測系統包含兩結露裝置。兩結露裝置分別位於移動平台上方與下方,且彼此大致對齊。 In an embodiment of the invention, the surface measurement system includes two dew condensation devices. The two condensation devices are located above and below the mobile platform, respectively, and are substantially aligned with each other.
在本發明一實施方式中,上述結露裝置位於移動平台下方。移動平台更具有鏤空區。鏤空區位於結露裝置上方。 In an embodiment of the invention, the dew condensation device is located below the mobile platform. The mobile platform also has a hollow area. The hollow area is located above the condensation device.
在本發明一實施方式中,上述從該流道的該出風口流出的氣流的溫度大於該待測物的溫度。 In an embodiment of the present invention, the temperature of the airflow flowing out of the air outlet of the flow channel is greater than the temperature of the object to be measured.
在本發明上述實施方式中,由於結露裝置包含流道、迴風道、溫度濕度控制組件與風機,且風機的進風口與出風口分別連通溫度濕度控制組件的出風口與流道,因此當風機啟動時,氣流可經迴風道的進風口進入結露裝置,並經過溫度濕度控制組件,使氣流具有高溫高濕的特性,接著由風機吹出流道的出風口。從流道的出風口吹出的氣流可讓移動平台上的 待測物表面形成液體層,以增加量測裝置之光源照射於待測物表面的光線散射量,因此量測裝置之影像擷取模組所測得的影像具有高訊雜比,使待測物表面能夠被精準量測。此外,表面量測系統位於開放空間,架設簡單,具有設備成本低,對支撐結構的強度要求低,且製程時間短等功效。 In the above embodiments of the present invention, since the dew condensation device includes the flow channel, the return air channel, the temperature and humidity control component and the fan, and the air inlet and the air outlet of the fan are respectively connected to the air outlet and the flow channel of the temperature and humidity control component, the fan When starting, the airflow can enter the dew device through the air inlet of the return air channel, and pass the temperature and humidity control component, so that the airflow has the characteristics of high temperature and high humidity, and then the air outlet of the flow channel is blown by the fan. The air flow from the air outlet of the flow channel can make the mobile platform A liquid layer is formed on the surface of the object to be measured to increase the amount of light scattered by the light source of the measurement device irradiating the surface of the object to be measured The surface of the object can be accurately measured. In addition, the surface measurement system is located in an open space, with simple installation, low equipment cost, low strength requirements for the support structure, and short process time.
100‧‧‧表面量測系統 100‧‧‧Surface measurement system
102‧‧‧開放空間 102‧‧‧Open space
110‧‧‧移動平台 110‧‧‧Mobile platform
111‧‧‧鏤空區 111‧‧‧ Hollow area
112‧‧‧滾輪 112‧‧‧wheel
113‧‧‧轉軸 113‧‧‧spindle
120a、120b‧‧‧結露裝置 120a, 120b ‧‧‧ condensation device
121‧‧‧流道 121‧‧‧Stream
122‧‧‧出風口 122‧‧‧Outlet
123‧‧‧迴風道 123‧‧‧ return air channel
124‧‧‧進風口 124‧‧‧Air inlet
127‧‧‧風機 127‧‧‧Fan
128‧‧‧進風口 128‧‧‧Air inlet
129‧‧‧出風口 129‧‧‧Outlet
130‧‧‧溫度濕度控制組件 130‧‧‧Temperature and humidity control components
131‧‧‧出風口 131‧‧‧Outlet
132‧‧‧加濕器 132‧‧‧Humidifier
133‧‧‧進風口 133‧‧‧Air inlet
134‧‧‧蒸發器 134‧‧‧Evaporator
135‧‧‧整流板 135‧‧‧rectifier board
136‧‧‧加熱器 136‧‧‧heater
137‧‧‧穿孔 137‧‧‧Perforation
138‧‧‧壓縮機 138‧‧‧Compressor
140‧‧‧量測裝置 140‧‧‧Measuring device
142‧‧‧光源 142‧‧‧Light source
144‧‧‧影像擷取模組 144‧‧‧Image capture module
210‧‧‧待測物 210‧‧‧Object to be tested
212‧‧‧上表面 212‧‧‧Upper surface
214‧‧‧下表面 214‧‧‧Lower surface
216‧‧‧液體層 216‧‧‧ liquid layer
D1、D2、D3、D4、D5‧‧‧方向 D1, D2, D3, D4, D5 ‧‧‧ direction
F1、F2‧‧‧氣流 F1, F2‧‧‧ Airflow
L1、L2‧‧‧光線 L1, L2‧‧‧Light
第1圖繪示根據本發明一實施方式之表面量測系統與待測物的側視圖。 FIG. 1 is a side view of a surface measurement system and a test object according to an embodiment of the invention.
第2圖繪示第1圖之結露裝置的內部結構示意圖。 FIG. 2 is a schematic diagram of the internal structure of the dew condensation device of FIG. 1.
第3圖繪示第1圖之表面量測系統省略上結露裝置的俯視圖。 FIG. 3 illustrates a top view of the surface measurement system of FIG. 1 with the upper dew condensation device omitted.
第4圖繪示第1圖之待測物通過結露裝置後且量測裝置量測待測物時的側視圖。 FIG. 4 shows a side view of the test object of FIG. 1 after passing through the dew condensation device and the measuring device measuring the test object.
以下將以圖式揭露本發明之複數個實施方式,為明確說明,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 In the following, a plurality of embodiments of the present invention will be disclosed in the form of diagrams. For clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is to say, in some embodiments of the present invention, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventional structures and elements will be shown in a simple schematic manner in the drawings.
第1圖繪示根據本發明一實施方式之表面量測系
統100與待測物210的側視圖。如圖所示,表面量測系統100位於開放空間102。表面量測系統100包含移動平台110、結露裝置120a、120b與量測裝置140。移動平台110用以沿方向D1傳送待測物210。結露裝置120a、120b選擇性地位於移動平台110上方與下方。雖然第1圖繪示分別位於移動平台110上方與下方且彼此大致對齊的結露裝置120a、120b,但在其他實施方式中,表面量測系統100可僅具有單一的結露裝置120a或結露裝置120b,並不用以限制本發明。結露裝置120a可朝方向D2產生高溫高濕的氣流,且具有回收氣流的功能,例如以方向D3抽回氣流。結露裝置120b可朝方向D4產生高溫高濕的氣流,且具有回收的功能,例如以方向D5抽回氣流。當移動平台110帶動待測物210往方向D1移動而通過結露裝置120a、120b之間的區域後,結露裝置120a、120b產生方向D2、D4的氣流可分別於待測物210的上表面212與下表面214上形成液體層。
FIG. 1 illustrates a surface measurement system according to an embodiment of the invention
Side view of the
量測裝置140位於移動平台110上方。量測裝置140包含光源142與影像擷取模組144。待液體層形成於待測物210上後,移動平台110可帶動待測物210往方向D1移動至量測裝置140下方。量測裝置140的光源142可用來照射移動平台110上具有液體層的待測物210。影像擷取模組144電性連接光源142,可用來偵測從具有液體層的待測物210散射的光線。有關表面量測系統100量測具液體層之待測物210的狀態將於第4圖詳細描述。
The measuring
在以下敘述中,將說明結露裝置120a、120b的
結構。由於結露裝置120a、120b的結構相似,以下將以結露裝置120a為例作說明。
In the following description, the
第2圖繪示第1圖之結露裝置120a的內部結構示意圖。結露裝置120a包含流道121、迴風道123、溫度濕度控制組件130與風機127。流道121具有朝向移動平台110(見第1圖)的出風口122。迴風道123具有朝向移動平台110的至少一進風口124,迴風道123的進風口124位於流道121之出風口122旁邊。在本實施方式中,迴風道123具有兩進風口124,流道121之出風口122位於迴風道123的兩進風口124之間,但進風口124的數量並不用以限制本發明。此外,溫度濕度控制組件130具有進風口133與出風口131,且溫度濕度控制組件130的進風口133連通於迴風道123。風機127具有進風口128與出風口129,且風機127的進風口128連通溫度濕度控制組件130的出風口131,而風機127的出風口129連通流道121。當風機127啟動時,可形成氣流F1、F2。
FIG. 2 is a schematic diagram of the internal structure of the
由於結露裝置120a包含流道121、迴風道123、溫度濕度控制組件130與風機127,且風機127的進風口128與出風口129分別連通溫度濕度控制組件130的出風口131與流道121,因此當風機127啟動時,氣流F2可經迴風道123的進風口124進入迴風道123,並經過溫度濕度控制組件130,使氣流F2具有高溫高濕的特性。接著,由風機127吸入氣流F2並吹出氣流F1至流道121。如此一來,氣流F1沿流道121流動而從出風口122吹出。
Since the
同時參閱第1圖與第2圖,當待測物210被移動平
台110傳送至結露裝置120a下方時,從流道121的出風口122吹出具有方向D2的氣流F1可讓移動平台110上的待測物210上表面212形成液體層,且氣流F1在接觸待測物210後,迴風道123能以方向D3抽回高溫高濕的氣流,以節省溫度濕度控制組件130之電力與水的消耗。結露裝置120b可視為結露裝置120a的倒置狀態。相似地,當待測物210被移動平台110傳送至結露裝置120b上方時,從結露裝置120b之流道121的出風口122吹出具有方向D4的氣流可讓移動平台110上的待測物210下表面214形成液體層,且氣流在接觸待測物210後,迴風道123能以方向D5抽回高溫高濕的氣流。藉由在待測物210的上表面212與下表面214形成液體層,可讓量測裝置140精準量測出待測物210的形貌。
Referring to Figures 1 and 2 at the same time, when the object to be measured 210 is moved flat
When the
在本實施方式中,溫度濕度控制組件130包含加濕器132、蒸發器134與加熱器136。加濕器132鄰近於溫度濕度控制組件130的進風口133。蒸發器134位於加濕器132上方。加熱器136位於蒸發器134上方,且蒸發器134位於加熱器136與加濕器132之間。此外,溫度濕度控制組件130還可包含連通蒸發器134的壓縮機138。結露裝置120a、120b可電性連接監控系統,監控系統可經由控制加濕器132、蒸發器134與加熱器136來調整氣流的濕度與溫度,以及經由控制風機127來調整氣流的流速,並監測從出風口122流出之氣流F1的濕度、溫度與流速,確保氣流F1的流體特性維持在一定穩定度。當待測物210透過移動平台110移動時,便可在待測物210的上表面212與下表面214分別產生均勻且等高的結露厚度,成為
液體層。
In this embodiment, the temperature and
結露現象是凝結核溫度低於大氣環境的露點溫度,大氣的水蒸氣便會液化附著在凝結核上,即會從飽和狀態的空氣中凝結出液態的小水珠,因此溫度與濕度是結露現象須控制的因素。在本實施方式中,從流道121的出風口122流出的氣流F1的溫度大於待測物210的溫度。從溫度濕度控制組件130的進風口133進入的氣流F2經過加濕器132與蒸發器134後具有介於40%至95%範圍的相對濕度。氣流F2經過加熱器136後具有介於0℃至90℃範圍的溫度。氣流F2經過風機127後產生的氣流F1具有大於0m/s且小於等於5m/s的流速。
The condensation phenomenon is that the temperature of the condensation tuberculosis is lower than the dew point temperature of the atmospheric environment, and the atmospheric water vapor will liquefy and adhere to the condensation tuberculosis, that is, liquid small water droplets will condense from the saturated air, so the temperature and humidity are condensation phenomena Factors to be controlled. In this embodiment, the temperature of the air flow F1 flowing out of the
此外,結露裝置120a還可包含整流板135。整流板135位於流道121中且鄰近流道121的出風口122,且整流板135具有複數個穿孔137。整流板135的穿孔137可供氣流F1通過,具有整流與均流的效果。
In addition, the
第3圖繪示第1圖之表面量測系統100省略上結露裝置120a的俯視圖。同時參閱第1圖與第3圖,移動平台110可沿方向D1傳送待測物210至結露裝置120b上方。第3圖兩虛線間的範圍可視為待測物210。在本實施方式中,移動平台110具有鏤空區111,且鏤空區111位於結露裝置120b上方。當移動平台110傳送待測物210至結露裝置120b上方時,鏤空區111位於結露裝置120b與待測物210之間。如此一來,結露裝置120b之方向D4、D5的氣流便能通過移動平台110底部。
FIG. 3 illustrates a top view of the
此外,在本實施方式中,移動平台110可具有滾輪112與轉軸113。滾輪112固定於轉軸113上。當轉軸113轉
動時,滾輪112可隨轉軸轉動而帶動待測物210往方向D1移動。
In addition, in this embodiment, the
本發明之表面量測系統100位於開放空間102,架設簡單,具有設備成本低,對支撐結構的強度要求低,且製程時間短等功效。應瞭解到,已敘述過的元件連接關係將不再重複贅述,合先敘明。在以下敘述中,將說明表面量測系統100量測待測物210時的狀態。
The
第4圖繪示第1圖之待測物210通過結露裝置120a、120b後且量測裝置140量測待測物210時的側視圖。同時參閱第1圖與第4圖,當待測物210通過結露裝置120a、120b之間的區域後,液體層216會形成在待測物210的上表面212與下表面214。此時,結露裝置120a、120b可關閉以節省電力與水的消耗,但並不用以限制本發明,在其他實施方式中,結露裝置120a、120b亦可保持開啟狀態。待液體層216形成後,移動平台110可帶動待測物210繼續往方向D1移動至量測裝置140下方。
FIG. 4 shows a side view of the
量測裝置140的光源142可產生光線L1照射移動平台110上具有液體層216的待測物210。影像擷取模組144電性連接光源142,可偵測從具有液體層216的待測物210散射的光線(例如光線L2)。在本實施方式中,光源142可以為雷射光源,影像擷取模組144可為相機,但並不用以限制本發明。液體層216可增加量測裝置140之光源142照射於待測物210表面的光線散射量,改善透明待測物210反射率不足與反射方向不一的問題,因此能降低影像雜訊,提升影像擷取的品質。也
就是說,量測裝置140之影像擷取模組144所測得的影像具有高訊雜比,使待測物210表面能夠被精準量測。
The
雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed as above in an embodiment, it is not intended to limit the present invention. Anyone who is familiar with this art can make various modifications and retouching without departing from the spirit and scope of the present invention, so the protection of the present invention The scope shall be as defined in the appended patent application scope.
100‧‧‧表面量測系統 100‧‧‧Surface measurement system
102‧‧‧開放空間 102‧‧‧Open space
110‧‧‧移動平台 110‧‧‧Mobile platform
120a、120b‧‧‧結露裝置 120a, 120b ‧‧‧ condensation device
140‧‧‧量測裝置 140‧‧‧Measuring device
142‧‧‧光源 142‧‧‧Light source
144‧‧‧影像擷取模組 144‧‧‧Image capture module
210‧‧‧待測物 210‧‧‧Object to be tested
212‧‧‧上表面 212‧‧‧Upper surface
214‧‧‧下表面 214‧‧‧Lower surface
D1、D2、D3、D4、D5‧‧‧方向 D1, D2, D3, D4, D5 ‧‧‧ direction
Claims (10)
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TW107111369A TWI690691B (en) | 2018-03-30 | 2018-03-30 | Surface measurement system |
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Citations (5)
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TW337550B (en) * | 1997-01-07 | 1998-08-01 | She-Yow Lin | Measurements of dynamic/advancing/receding contact angle by using a video-enhanced sessile drop tensiometry |
TW201305551A (en) * | 2011-06-13 | 2013-02-01 | Nippon Steel Chemical Co | Sensor element, dew sensor, humidity sensor, method for detecting dew and device for measuring dew point |
TW201319478A (en) * | 2011-11-11 | 2013-05-16 | Delta Electronics Inc | Energy saving air condition system |
TWI553304B (en) * | 2015-08-17 | 2016-10-11 | 財團法人工業技術研究院 | Highly reflective surface profile measurement system with air condensation and method thereof |
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TW337550B (en) * | 1997-01-07 | 1998-08-01 | She-Yow Lin | Measurements of dynamic/advancing/receding contact angle by using a video-enhanced sessile drop tensiometry |
TW201305551A (en) * | 2011-06-13 | 2013-02-01 | Nippon Steel Chemical Co | Sensor element, dew sensor, humidity sensor, method for detecting dew and device for measuring dew point |
TW201319478A (en) * | 2011-11-11 | 2013-05-16 | Delta Electronics Inc | Energy saving air condition system |
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TWI553304B (en) * | 2015-08-17 | 2016-10-11 | 財團法人工業技術研究院 | Highly reflective surface profile measurement system with air condensation and method thereof |
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