TWI690487B - Method for manufacturing graphite sheet and polyimide film for graphite sheet - Google Patents
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Abstract
本發明提供一種用以製造熱擴散性及柔軟性良好之石墨片的石墨片之製造方法及石墨片用之聚醯亞胺膜。本發明之石墨片之製造方法包含對磷之含量為0.025重量%以上且0.032重量%以下之聚醯亞胺膜進行熱處理至2400℃以上之步驟。The invention provides a method for manufacturing a graphite sheet for manufacturing a graphite sheet with good thermal diffusibility and flexibility, and a polyimide film for graphite sheets. The method for manufacturing a graphite sheet of the present invention includes the step of heat-treating a polyimide film having a phosphorus content of 0.025% by weight or more and 0.032% by weight or less to 2400°C or more.
Description
本發明係關於一種石墨片之製造方法及石墨片用之聚醯亞胺膜。The invention relates to a method for manufacturing graphite sheets and a polyimide film for graphite sheets.
石墨片由於具有優異之散熱特性,故而作為散熱零件用於搭載於電腦等各種電子設備或電氣設備之半導體元件、其他發熱零件等。Graphite sheet has excellent heat dissipation characteristics, so it is used as a heat dissipation component for semiconductor components and other heat-generating components mounted on various electronic equipment or electrical equipment such as computers.
此種石墨片可煅燒聚醯亞胺膜而獲得。例如,專利文獻1中記載有一種對含有無機粒子之聚醯亞胺膜進行煅燒而製造石墨片之技術。 [先前技術文獻] [專利文獻]Such graphite flakes can be obtained by calcining polyimide film. For example, Patent Document 1 describes a technique for producing graphite sheets by calcining a polyimide film containing inorganic particles. [Prior Technical Literature] [Patent Literature]
[專利文獻1]日本專利特開2014-136721號公報[Patent Document 1] Japanese Patent Laid-Open No. 2014-136721
[發明所欲解決之問題][Problems to be solved by the invention]
先前,已知有各種石墨片,但為獲得兼具熱擴散性及柔軟性之石墨片,尚有改善之餘地。Previously, various graphite sheets have been known, but there is room for improvement in order to obtain graphite sheets having both thermal diffusibility and flexibility.
本發明之一態樣之目的在於提供一種用以製造熱擴散性及柔軟性良好之石墨片的石墨片之製造方法及石墨片用之聚醯亞胺膜。 [解決問題之技術手段]An object of one aspect of the present invention is to provide a method for manufacturing a graphite sheet for manufacturing a graphite sheet having good thermal diffusibility and flexibility, and a polyimide film for a graphite sheet. [Technical means to solve the problem]
本發明者等人為解決上述課題而努力研究,結果發現:藉由將磷之含量為特定之範圍內之聚醯亞胺膜作為原料,可製造兼具熱擴散性及柔軟性之石墨片,從而完成了本發明。本發明包含以下者。 [1]一種石墨片之製造方法,其包含對磷之含量為0.025重量%以上且0.032重量%以下之聚醯亞胺膜進行熱處理至2400℃以上之步驟。 [2]一種石墨片用之聚醯亞胺膜,其中磷之含量為0.025重量%以上且0.032重量%以下。 [發明之效果]The inventors of the present invention worked hard to solve the above-mentioned problems, and as a result, found that by using a polyimide film having a phosphorus content within a specific range as a raw material, a graphite sheet having both thermal diffusibility and flexibility can be manufactured, thereby The present invention has been completed. The present invention includes the following. [1] A method of manufacturing a graphite sheet, which includes the step of heat-treating a polyimide film having a phosphorus content of 0.025% by weight or more and 0.032% by weight or less to 2400°C or more. [2] A polyimide film for graphite sheets, wherein the phosphorus content is 0.025% by weight or more and 0.032% by weight or less. [Effect of invention]
根據本發明之一態樣,可獲得熱擴散性及柔軟性良好之石墨片。According to one aspect of the present invention, a graphite sheet having good thermal diffusibility and flexibility can be obtained.
以下對本發明之一實施形態進行說明,但本發明並不限定於此。本發明並不限定於以下所說明之各構成,可於申請專利範圍所示之範圍內進行各種變更,將於不同之實施形態或實施例中分別揭示之技術手段適當組合而獲得之實施形態或實施例亦包含於本發明之技術範圍內。又,本說明書中記載之學術文獻及專利文獻全部係於本說明書中作為參考文獻而引用。又,於本說明書中,只要無特別說明,則表示數值範圍之「A~B」係意指「A以上且B以下」。An embodiment of the present invention will be described below, but the present invention is not limited to this. The present invention is not limited to the configurations described below. Various changes can be made within the scope shown in the scope of the patent application, and the technical means disclosed in different embodiments or embodiments can be appropriately combined to obtain an embodiment or The embodiments are also included in the technical scope of the present invention. In addition, all the academic documents and patent documents described in this specification are cited as references in this specification. In this specification, unless otherwise specified, "A to B" indicating a numerical range means "A or more and B or less".
<1.石墨片之製造方法> 本發明之一態樣之石墨片之製造方法只要包含對磷之含量為0.025重量%以上、且0.032重量%以下之聚醯亞胺膜進行熱處理至2400℃以上之步驟即可。<1. Manufacturing method of graphite sheet> The method for manufacturing a graphite sheet according to one aspect of the present invention may include the step of heat-treating a polyimide film having a phosphorus content of 0.025% by weight or more and 0.032% by weight or less to 2400°C or more.
本製造方法係對聚醯亞胺膜於惰性氣體氛圍下或減壓下進行熱處理之所謂高分子熱分解法。具體而言,經過如下步驟而獲得石墨片:碳化步驟,將聚醯亞胺膜預加熱至1000℃左右之溫度,獲得碳質膜;石墨化步驟,將碳化步驟中製作之碳質膜加熱至2400℃以上之溫度,進行石墨化;及壓縮步驟,對其進行壓縮。再者,碳化步驟與石墨化步驟可連續進行,亦可結束碳化步驟,其後僅單獨進行石墨化步驟。又,於本發明之一實施形態之石墨片之製造方法中,進行、不進行壓縮步驟均可。This manufacturing method is a so-called polymer thermal decomposition method in which the polyimide film is heat-treated in an inert gas atmosphere or under reduced pressure. Specifically, graphite sheets are obtained through the following steps: carbonization step, preheating the polyimide film to a temperature of about 1000°C to obtain a carbonaceous film; graphitization step, heating the carbonaceous film produced in the carbonization step to Graphitize at temperatures above 2400°C; and compress it in the compression step. Furthermore, the carbonization step and the graphitization step may be performed continuously, or the carbonization step may be ended, and then only the graphitization step is performed separately. In addition, in the manufacturing method of the graphite sheet according to an embodiment of the present invention, the compression step may be performed or not.
(碳化步驟) 碳化步驟係對聚醯亞胺膜進行熱處理至1000℃左右之溫度,使聚醯亞胺膜碳化之步驟。例如最高溫度較佳為700℃~1800℃,更佳為800℃~1500℃,進而較佳為900℃~1200℃,尤佳為1000℃。(Carbonization step) The carbonization step is a step of heat-treating the polyimide film to a temperature of about 1000°C to carbonize the polyimide film. For example, the maximum temperature is preferably 700°C to 1800°C, more preferably 800°C to 1500°C, further preferably 900°C to 1200°C, and particularly preferably 1000°C.
碳化步驟之升溫速度例如可較佳地例示0.01℃/min以上且未達20℃/min、0.1℃/min~10℃/min、0.2℃/min~未達5.0℃/min、0.5℃/min~2.0℃/min。若升溫速度為上述範圍內,則可獲得熱擴散性及柔軟性良好之石墨片。The heating rate of the carbonization step can be preferably exemplified by 0.01°C/min or more and less than 20°C/min, 0.1°C/min to 10°C/min, 0.2°C/min to less than 5.0°C/min, 0.5°C/min ~2.0℃/min. If the temperature increase rate is within the above range, a graphite sheet having good thermal diffusibility and flexibility can be obtained.
碳化步驟中之保持時間(具體而言,碳化最高溫度下之保持時間)較佳為1分鐘~1小時,更佳為5分鐘~30分鐘,進而較佳為8分鐘~15分鐘。若保持時間為上述之範圍內,則可獲得熱擴散性及柔軟性良好之石墨片。The retention time in the carbonization step (specifically, the retention time at the highest carbonization temperature) is preferably 1 minute to 1 hour, more preferably 5 minutes to 30 minutes, and still more preferably 8 minutes to 15 minutes. If the holding time is within the above range, a graphite sheet having good thermal diffusibility and flexibility can be obtained.
於碳化步驟中,可將使長方形之聚醯亞胺膜積層而得之積層聚醯亞胺膜碳化,亦可將卷狀之聚醯亞胺膜直接以卷狀碳化,亦可自卷狀聚醯亞胺膜捲出膜而進行碳化。In the carbonization step, the laminated polyimide film obtained by stacking rectangular polyimide films can be carbonized, or the roll-shaped polyimide film can be directly carbonized in a roll shape, or can be self-rolled. The amide imide film is rolled out and carbonized.
(石墨化步驟) 石墨化步驟係對碳化步驟中獲得之碳質膜進行熱處理至2400℃以上之溫度,將碳質膜石墨化之步驟。例如,最高溫度可較佳地例示2400℃以上、2500℃以上、2600℃以上、2700℃以上、2800℃以上、2900℃以上、或3000℃以上。上限並無特別限定,較佳為3300℃以下,更佳為3200℃以下。再者,石墨化步驟係於減壓下或者惰性氣體中進行,作為惰性氣體,氬氣、或氦氣較適合。(Graphitization step) The graphitization step is a step of heat-treating the carbonaceous film obtained in the carbonization step to a temperature above 2400°C to graphitize the carbonaceous film. For example, the maximum temperature may preferably be exemplified by 2400°C or higher, 2500°C or higher, 2600°C or higher, 2700°C or higher, 2800°C or higher, 2900°C or higher, or 3000°C or higher. The upper limit is not particularly limited, but it is preferably 3300°C or lower, and more preferably 3200°C or lower. Furthermore, the graphitization step is performed under reduced pressure or in an inert gas. As an inert gas, argon or helium is more suitable.
石墨化步驟中之升溫速度較佳為0.01℃/min以上且未達20℃/min,更佳為0.1℃/min~10℃/min,進而較佳為0.5℃/min~5.0℃/min。若升溫速度為上述之範圍內,則可獲得熱擴散性及柔軟性良好之石墨片。The heating rate in the graphitization step is preferably 0.01°C/min or more and less than 20°C/min, more preferably 0.1°C/min to 10°C/min, and further preferably 0.5°C/min to 5.0°C/min. If the heating rate is within the above range, a graphite sheet having good thermal diffusivity and flexibility can be obtained.
石墨化步驟中之保持時間(具體而言,石墨化最高溫度下之保持時間)較佳為1分鐘~1小時,更佳為5分鐘~30分鐘,進而較佳為8分鐘~15分鐘。若保持時間為上述之範圍內,則可獲得熱擴散性及柔軟性良好之石墨片。The retention time in the graphitization step (specifically, the retention time at the highest temperature for graphitization) is preferably 1 minute to 1 hour, more preferably 5 minutes to 30 minutes, and still more preferably 8 minutes to 15 minutes. If the holding time is within the above range, a graphite sheet having good thermal diffusibility and flexibility can be obtained.
於石墨化步驟中,可將使長方形之碳化膜積層而得之積層碳化膜石墨化,亦可將卷狀之碳化膜直接以卷狀石墨化,亦可自卷狀之碳化膜捲出膜而進行石墨化。In the graphitization step, the laminated carbide film obtained by laminating rectangular carbide films can be graphitized, or the roll-shaped carbide film can be directly graphitized in a roll shape, or the film can be rolled out from the roll-shaped carbide film. Graphitize.
(壓縮步驟) 亦可對石墨化後之碳質膜實施壓縮步驟。藉由實施壓縮步驟,可對所獲得之石墨片賦予柔軟性。壓縮步驟可使用壓縮成面狀之方法、或使用金屬輥等進行壓延之方法等。壓縮步驟可於室溫下進行,亦可於石墨化步驟中進行。(Compression step) A compression step can also be performed on the graphitized carbonaceous film. By performing the compression step, the obtained graphite sheet can be given flexibility. For the compression step, a method of compressing into a flat shape, or a method of rolling using a metal roller or the like can be used. The compression step can be performed at room temperature or in the graphitization step.
<2.石墨片> 由上述製造方法所得之石墨片之熱擴散率較佳為8.0 cm2 /s以上,更佳為8.3 cm2 /s以上,進而較佳為8.5 cm2 /s以上。<2. Graphite sheet> The graphite sheet obtained by the above manufacturing method preferably has a thermal diffusivity of 8.0 cm 2 /s or more, more preferably 8.3 cm 2 /s or more, and even more preferably 8.5 cm 2 /s or more.
又,石墨片之柔軟性於下述之實施例之柔軟性評價中,較佳為「C」以上,更佳為「B」以上,進而較佳為「A」以上。In addition, the flexibility of the graphite sheet is preferably "C" or more, more preferably "B" or more, and even more preferably "A" or more in the softness evaluation of the following examples.
又,石墨片之厚度較佳為5 μm~60 μm,更佳為10 μm~50 μm,進而較佳為15 μm~40 μm。In addition, the thickness of the graphite sheet is preferably 5 μm to 60 μm, more preferably 10 μm to 50 μm, and still more preferably 15 μm to 40 μm.
石墨片之密度較佳為1.0 g/cm3 ~2.26 g/cm3 ,更佳為1.3 g/cm3 ~2.2 g/cm3 ,進而較佳為1.6 g/cm3 ~2.18 g/cm3 。The density of the graphite sheet is preferably 1.0 g/cm 3 to 2.26 g/cm 3 , more preferably 1.3 g/cm 3 to 2.2 g/cm 3 , and further preferably 1.6 g/cm 3 to 2.18 g/cm 3 .
<3.石墨片用之聚醯亞胺膜> 以下,對可用於本發明之一實施形態之聚醯亞胺膜進行詳細說明。用於上述製造方法之石墨片用之聚醯亞胺膜為以酸二酐成分、及二胺成分為原料之聚醯亞胺膜,且含有特定量之磷。<3. Polyimide film for graphite sheet> Hereinafter, a polyimide film that can be used in an embodiment of the present invention will be described in detail. The polyimide film for the graphite sheet used in the above manufacturing method is a polyimide film using an acid dianhydride component and a diamine component as raw materials, and contains a specific amount of phosphorus.
(磷) 聚醯亞胺膜較佳為磷之含量為0.025重量%~0.032重量%,更佳為0.027重量%~0.030重量%。若為該範圍內,則最終獲得之石墨片之熱擴散性及柔軟性此兩物性優異。(phosphorus) The polyimide film preferably has a phosphorus content of 0.025% by weight to 0.032% by weight, and more preferably 0.027% by weight to 0.030% by weight. Within this range, the graphite sheet finally obtained has excellent thermal diffusivity and flexibility.
磷可作為無機粒子(即填料)添加至聚醯亞胺膜中。作為可於本發明之一實施形態中使用之填料,可列舉CaHPO4 、(NH4 )2 HPO4 、Ca2 P2 O7 等。其中,包含磷酸之CaHPO4 及(NH4 )2 HPO4 藉由自聚醯亞胺膜內部昇華時產生之氣體而發生良好之膨脹,獲得導熱性優異之良好之石墨,因此可較佳地使用。Phosphorus can be added to the polyimide film as inorganic particles (ie filler). Examples of the filler that can be used in one embodiment of the present invention include CaHPO 4 , (NH 4 ) 2 HPO 4 , and Ca 2 P 2 O 7 . Among them, CaHPO 4 and (NH 4 ) 2 HPO 4 containing phosphoric acid expand well due to the gas generated during sublimation from the inside of the polyimide film, and obtain good graphite with excellent thermal conductivity, so it can be used preferably .
(酸二酐成分) 可使用之酸二酐成分可列舉:均苯四甲酸二酐、2,3,6,7-萘四羧酸二酐、3,3',4,4'-聯苯四羧酸二酐、1,2,5,6-萘四羧酸二酐、2,2',3,3'-聯苯四羧酸二酐、3,3',4,4'-二苯甲酮四羧酸二酐、2,2-雙(3,4-二羧基苯基)丙烷二酐、3,4,9,10-苝四羧酸二酐、1,1-(3,4-二羧基苯基)乙烷二酐、1,1-雙(2,3-二羧基苯基)乙烷二酐、1,1-雙(3,4-二羧基苯基)乙烷二酐、雙(2,3-二羧基苯基)甲烷二酐、雙(3,4-二羧基苯基)甲烷二酐、氧二鄰苯二甲酸二酐、雙(3,4-二羧基苯基)碸二酐、對伸苯基雙(偏苯三甲酸單酯酸酐)、伸乙基雙(偏苯三甲酸單酯酸酐)、雙酚A雙(偏苯三甲酸單酯酸酐)及該等之類似物。可將該等以任意之比率混合。其中,較佳為使用均苯四甲酸二酐或3,3',4,4'-聯苯四羧酸二酐。藉由使用該酸二酐成分,最終獲得之石墨片之物性變得良好。(Acid dianhydride component) Usable acid dianhydride components include pyromellitic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 1,2,5,6-Naphthalenetetracarboxylic dianhydride, 2,2',3,3'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic acid Dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 3,4,9,10-perylenetetracarboxylic dianhydride, 1,1-(3,4-dicarboxyphenyl ) Ethane dianhydride, 1,1-bis (2,3-dicarboxyphenyl) ethane dianhydride, 1,1-bis (3,4-dicarboxyphenyl) ethane dianhydride, bis (2, 3-dicarboxyphenyl)methane dianhydride, bis(3,4-dicarboxyphenyl)methane dianhydride, oxydiphthalic dianhydride, bis(3,4-dicarboxyphenyl) benzene dianhydride, P-phenylene bis (trimellitic acid monoester anhydride), ethyl bis (trimellitic acid monoester anhydride), bisphenol A bis (trimellitic acid monoester anhydride) and the like. These can be mixed in an arbitrary ratio. Among them, pyromellitic dianhydride or 3,3',4,4'-biphenyltetracarboxylic dianhydride is preferably used. By using this acid dianhydride component, the physical properties of the graphite sheet finally obtained become good.
(二胺成分) 可使用之二胺成分可列舉:4,4'-二胺基二苯基醚、對伸苯基二胺、4,4'-二胺基二苯甲烷、聯苯胺、3,3'-二氯聯苯胺、4,4'-二胺基二苯硫醚、3,3'-二胺基二苯基碸、4,4'-二胺基二苯基碸、3,3'-二胺基二苯基醚、3,4'-二胺基二苯基醚、1,5-二胺基萘、4,4'-二胺基二苯基二乙基矽烷、4,4'-二胺基二苯基矽烷、4,4'-二胺基二苯基乙基氧化膦、4,4'-二胺基二苯基N-甲基胺、4,4'-二胺基二苯基N-苯基胺、1,3-二胺基苯、1,2-二胺基苯及該等之類似物。可將該等以任意之比率混合。其中,較佳為使用4,4'-二胺基二苯基醚或對伸苯基二胺。藉由使用該二胺成分,最終獲得之石墨片之物性變得良好。(Diamine component) The diamine components that can be used include: 4,4'-diaminodiphenyl ether, p-phenylene diamine, 4,4'-diaminodiphenylmethane, benzidine, 3,3'-di Chlorobenzidine, 4,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfide, 3,3'-diamine Diphenyl ether, 3,4'-diaminodiphenyl ether, 1,5-diaminonaphthalene, 4,4'-diaminodiphenyldiethylsilane, 4,4'-di Aminodiphenylsilane, 4,4'-diaminodiphenylethylphosphine oxide, 4,4'-diaminodiphenyl N-methylamine, 4,4'-diaminodiphenyl N-phenylamine, 1,3-diaminobenzene, 1,2-diaminobenzene and the like. These can be mixed in an arbitrary ratio. Among them, 4,4'-diaminodiphenyl ether or p-phenylene diamine is preferably used. By using this diamine component, the physical properties of the graphite sheet finally obtained become good.
(聚醯亞胺膜之厚度) 聚醯亞胺膜之厚度為12.5 μm~125 μm,較佳為25 μm~100 μm,更佳為35 μm~75 μm。若為上述範圍內,則於厚度方向均勻地進行熱處理,因此熱擴散性提高。(Thickness of Polyimide Film) The thickness of the polyimide film is 12.5 μm to 125 μm, preferably 25 μm to 100 μm, and more preferably 35 μm to 75 μm. Within the above range, the heat treatment is performed uniformly in the thickness direction, so the thermal diffusivity is improved.
(醯亞胺化方法) 關於聚醯亞胺之醯亞胺化方法,可使用下述方法之任一種:對作為前驅物之聚醯胺酸進行加熱而進行醯亞胺轉化之熱處理法;或使用乙酸酐等酸酐所代表之脫水劑或甲基吡啶、喹啉、異喹啉、吡啶等三級胺類所代表之醯亞胺化促進劑,使作為前驅物之聚醯胺酸進行醯亞胺轉化之化學處理法。作為使用化學處理法之情形之醯亞胺化促進劑,較佳為上文所列舉之三級胺類。(Method of imidization) Regarding the method of amidimation of polyimide, any one of the following methods can be used: a heat treatment method of heating the amidic acid as a precursor to convert the imide; or using an anhydride such as acetic anhydride Chemical dehydration agent or amide imidization accelerator represented by tertiary amines such as picoline, quinoline, isoquinoline, pyridine, etc., a chemical treatment method for amide imine conversion of polyamic acid as a precursor. As the amide imidization accelerator when the chemical treatment method is used, the tertiary amines listed above are preferable.
尤其就所獲得之聚醯亞胺膜之線膨脹係數較小,彈性模數較高,雙折射容易變大,又,於相對低溫下可進行迅速之石墨化,可獲得品質良好之石墨片之觀點而言,較佳為化學處理法。尤其是併用脫水劑與醯亞胺化促進劑之情況由於所獲得之聚醯亞胺膜之線膨脹係數較小,彈性模數較大,雙折射可變大,故而較佳。又,化學處理法更快速地進行醯亞胺化反應,因此可於加熱處理中於短時間內結束醯亞胺化反應,為生產性優異之工業上有利之方法。Especially for the obtained polyimide film, the coefficient of linear expansion is small, the elastic modulus is high, and the birefringence tends to become large. Furthermore, it can be rapidly graphitized at a relatively low temperature to obtain good quality graphite sheets. From a viewpoint, a chemical treatment method is preferable. In particular, the use of a dehydrating agent and an imidization accelerator together is preferred because the obtained polyimide film has a low linear expansion coefficient, a large elastic modulus, and a large birefringence. In addition, the chemical treatment method performs the amide imidization reaction more quickly. Therefore, the amide imidization reaction can be completed in a short time during the heat treatment, which is an industrially advantageous method with excellent productivity.
(聚醯胺酸之製造方法) 作為聚醯胺酸之製造方法,並無特別限制,例如將芳香族酸二酐與二胺以實質上等莫耳量溶解於有機溶劑中,於經控制之溫度條件下攪拌該有機溶液直至芳香族酸二酐與二胺之聚合完成,藉此可製造聚醯胺酸。作為聚合方法,並無特別限制,例如較佳為如下所述之聚合方法(1)-(5)中之任一者。再者,於(1)-(5)中,例示使用芳香族四羧酸二酐作為芳香族酸二酐、使用芳香族二胺化合物作為二胺之情況。(Manufacturing method of polyamide) The method for producing polyamic acid is not particularly limited. For example, the aromatic acid dianhydride and diamine are dissolved in an organic solvent in substantially equal molar amounts, and the organic solution is stirred under controlled temperature conditions until aromatic The polymerization of the family acid dianhydride and the diamine is completed, whereby polyamic acid can be produced. The polymerization method is not particularly limited, and for example, any of the polymerization methods (1) to (5) described below is preferable. In addition, in (1)-(5), the case where an aromatic tetracarboxylic dianhydride is used as an aromatic acid dianhydride and an aromatic diamine compound is used as a diamine is exemplified.
(1)將芳香族二胺化合物溶解於有機極性溶劑中,使芳香族二胺化合物、與實質上與其等莫耳之芳香族四羧酸二酐進行反應而聚合之方法。(1) A method of dissolving an aromatic diamine compound in an organic polar solvent, and reacting the aromatic diamine compound with an aromatic tetracarboxylic dianhydride substantially equivalent to its molar equivalent to polymerize.
(2)使芳香族四羧酸二酐、與相對於其而為過小莫耳量之芳香族二胺化合物於有機極性溶劑中進行反應,獲得於兩末端具有酸酐基之預聚物。繼而,使相對於芳香族四羧酸二酐而實質上為等莫耳之芳香族二胺化合物與該預聚物聚合之方法。(2) The aromatic tetracarboxylic dianhydride is reacted with an aromatic diamine compound that is too small in molar amount relative thereto in an organic polar solvent to obtain a prepolymer having acid anhydride groups at both ends. Then, a method of polymerizing the prepolymer with an aromatic diamine compound that is substantially equal to the molar ratio of the aromatic tetracarboxylic dianhydride.
上述(2)之方法之具體例與下述方法相同:使用二胺與酸二酐合成於兩末端具有上述酸二酐之預聚物,使與用於合成上述預聚物之二胺同種之二胺或不同種類之二胺與上述預聚物進行反應而合成聚醯胺酸。於(2)之方法中,與預聚物進行反應之芳香族二胺化合物可為與用於合成上述預聚物之芳香族二胺化合物同種之芳香族二胺化合物、或不同種類之芳香族二胺化合物。The specific example of the method of (2) above is the same as the following method: using diamine and acid dianhydride to synthesize a prepolymer having the above acid dianhydride at both ends, the same as the diamine used to synthesize the above prepolymer Diamine or different kinds of diamine react with the above prepolymer to synthesize polyamic acid. In the method of (2), the aromatic diamine compound that reacts with the prepolymer may be the same kind of aromatic diamine compound as the aromatic diamine compound used to synthesize the above prepolymer, or a different kind of aromatic Diamine compounds.
(3)使芳香族四羧酸二酐、與相對於其而為過剩莫耳量之芳香族二胺化合物於有機極性溶劑中進行反應,獲得於兩末端具有胺基之預聚物。繼而,於該預聚物中追加添加芳香族二胺化合物後,以芳香族四羧酸二酐與芳香族二胺化合物成為實質上等莫耳之方式,使預聚物與芳香族四羧酸二酐聚合之方法。(3) The aromatic tetracarboxylic dianhydride and the aromatic diamine compound in excess molar amount relative thereto are reacted in an organic polar solvent to obtain a prepolymer having amine groups at both ends. Then, after adding an additional aromatic diamine compound to the prepolymer, the prepolymer and the aromatic tetracarboxylic acid are made in such a manner that the aromatic tetracarboxylic dianhydride and the aromatic diamine compound become substantially equivalent. The method of dianhydride polymerization.
(4)於使芳香族四羧酸二酐溶解及/或分散於有機極性溶劑中後,以相對於該酸二酐而實質上成為等莫耳之方式添加芳香族二胺化合物,使芳香族四羧酸二酐與芳香族二胺化合物聚合之方法。(4) After dissolving and/or dispersing the aromatic tetracarboxylic dianhydride in an organic polar solvent, the aromatic diamine compound is added in such a way that it becomes substantially equivalent to the acid dianhydride to make the aromatic Method for polymerizing tetracarboxylic dianhydride and aromatic diamine compound.
(5)使實質上等莫耳之芳香族四羧酸二酐與芳香族二胺化合物之混合物於有機極性溶劑中進行反應而聚合之方法。(5) A method of polymerizing a mixture of an aromatic tetracarboxylic dianhydride and an aromatic diamine compound that are substantially equal to moles in an organic polar solvent.
再者,本發明亦可設為如下所述之構成。 [1]一種石墨片之製造方法,其包含對磷之含量為0.025重量%以上且0.032重量%以下之聚醯亞胺膜進行熱處理至2400℃以上之步驟。 [2]如[1]之石墨片之製造方法,其中上述聚醯亞胺膜之磷之含量為0.027重量%以上且0.030重量%以下。 [3]一種石墨片用之聚醯亞胺膜,其中磷之含量為0.025重量%以上且0.032重量%以下。 [4]如[3]之石墨片用之聚醯亞胺膜,其中磷之含量為0.027重量%以上且0.030重量%以下。In addition, the present invention may be configured as described below. [1] A method of manufacturing a graphite sheet, which includes the step of heat-treating a polyimide film having a phosphorus content of 0.025% by weight or more and 0.032% by weight or less to 2400°C or more. [2] The method for manufacturing a graphite sheet according to [1], wherein the phosphorus content of the polyimide film is 0.027% by weight or more and 0.030% by weight or less. [3] A polyimide film for graphite sheets, wherein the phosphorus content is 0.025% by weight or more and 0.032% by weight or less. [4] The polyimide film for graphite sheets as in [3], wherein the phosphorus content is 0.027% by weight or more and 0.030% by weight or less.
以下,藉由實施例進而詳細地說明本發明,但本發明並非僅限定於下述實施例。 [實施例]Hereinafter, the present invention will be described in more detail by examples, but the present invention is not limited to the following examples. [Example]
<聚醯亞胺膜之磷之含量> 根據所使用之磷酸鹽之分子量與磷之原子量之比,計算並求出聚醯亞胺膜之磷之含量。<Phosphorus content of polyimide film> According to the ratio of the molecular weight of the phosphate used to the atomic weight of phosphorus, calculate and calculate the phosphorus content of the polyimide film.
<MIT耐折曲試驗中之彎折次數之測定(柔軟性評價)> 對利用下述方法獲得之石墨片之MIT耐折曲試驗中之彎折次數進行測定,作為柔軟性之評價方法。關於試驗方法,示於以下。於MIT耐折曲試驗中,使用東洋精機股份有限公司製造之MIT耐揉疲勞試驗機型D。試驗條件設為R=2 mm、左右之彎折角度:135°、彈簧:14 mm。<Measurement of Bending Times in MIT Bending Resistance Test (Flexibility Evaluation)> The number of bending times in the MIT bending test of graphite sheets obtained by the following method was measured as an evaluation method of flexibility. The test method is shown below. In the MIT bending resistance test, the MIT Kneading Fatigue Test Model D manufactured by Toyo Seiki Co., Ltd. was used. The test conditions are set to R = 2 mm, left and right bending angle: 135°, spring: 14 mm.
耐折曲試驗中之彎折次數(MIT)係次數越多,則意指石墨片越柔軟,耐折曲性越優異。因此,即便將MIT之次數較多之石墨片用於折曲部分,亦不易被破壞。The greater the number of bending times (MIT) in the bending resistance test, the more flexible the graphite sheet and the better the bending resistance. Therefore, even if a graphite sheet with a higher number of MITs is used for the bent portion, it is not easily damaged.
再者,評價基準係如以下般設定。 A:彎折次數為50000次以上 B:彎折次數為40000次以上且未達50000次 C:彎折次數為30000次以上且未達40000次 D:彎折次數為20000次以上且未達30000次 E:彎折次數未達20000次 <熱擴散性> 利用以下之方法對藉由下述方法獲得之石墨片之熱擴散率進行測定。具體而言,使用基於光交流法之熱擴散率測定裝置(ULVAC理工股份有限公司之「LaserPit」),對於經切割為4 mm×40 mm之形狀之石墨片之樣品,於20℃之環境下於10 Hz之交流條件下進行測定。In addition, the evaluation criterion is set as follows. A: The number of bending times is more than 50000 times B: The number of bending times is more than 40,000 and less than 50,000 C: The number of bending times is more than 30,000 and less than 40,000 D: The number of bending times is more than 20,000 and less than 30,000 E: The number of bending times is less than 20,000 <Thermal diffusivity> The thermal diffusivity of the graphite sheet obtained by the following method was measured by the following method. Specifically, using a thermal diffusivity measuring device based on optical communication method ("LaserPit" of ULVAC Science and Technology Co., Ltd.), for a sample of graphite sheet cut into a shape of 4 mm × 40 mm, under an environment of 20°C Measured under AC conditions of 10 Hz.
<聚醯亞胺膜之製作方法> (製造例1) 於溶解有4,4'-二胺基二苯基醚(ODA)之二甲基甲醯胺溶液中,以ODA與PMDA成為當莫耳量之方式溶解均苯四甲酸二酐(PMDA),獲得包含聚醯胺酸18.5重量%之聚醯胺酸溶液。於所獲得之聚醯胺酸溶液中,以磷酸氫鈣之濃度相對於聚醯胺酸之固形物成分成為0.11重量%之方式添加磷酸氫鈣。一面冷卻該溶液,一面添加相對於聚醯胺酸中所含之羧酸基包含1當量之乙酸酐、1當量之異喹啉、及二甲基甲醯胺之醯亞胺化觸媒,進行消泡。繼而,以乾燥後厚度成為75 μm之方式將該混合溶液塗佈於鋁箔上,獲得混合溶液層。鋁箔上之混合溶液層係使用熱風烘箱及遠紅外線加熱器進行乾燥。<Method of making polyimide film> (Production Example 1) In a solution of 4,4'-diaminodiphenyl ether (ODA) in dimethylformamide, pyromellitic dianhydride (PMDA) is dissolved in such a way that ODA and PMDA become equivalent molar amounts, A solution of polyamic acid containing 18.5% by weight of polyamic acid was obtained. Calcium hydrogen phosphate was added to the obtained polyamic acid solution so that the concentration of calcium hydrogen phosphate was 0.11% by weight relative to the solid content of the polyamic acid. While cooling the solution, add an imidization catalyst containing 1 equivalent of acetic anhydride, 1 equivalent of isoquinoline, and dimethylformamide to the carboxylic acid group contained in the polyamic acid. Defoaming. Then, the mixed solution was coated on the aluminum foil so that the thickness after drying became 75 μm to obtain a mixed solution layer. The mixed solution layer on the aluminum foil is dried using a hot air oven and a far-infrared heater.
乾燥條件如下所述。首先,利用熱風烘箱於120℃下對鋁箔上之混合溶液層進行240秒乾燥,製成具有自持性之凝膠膜。將該凝膠膜自鋁箔剝離,並固定於框架上。進而,對凝膠膜利用熱風烘箱於120℃下加熱30秒,於275℃下加熱40秒,於400℃下加熱42秒,於450℃下加熱50秒,及利用遠紅外線加熱器於460℃下加熱22秒,階段性地加熱而進行乾燥。以上述方式製作磷之含量0.025重量%、厚度75 μm之聚醯亞胺膜(A-1)。The drying conditions are as follows. First, the mixed solution layer on the aluminum foil was dried in a hot air oven at 120°C for 240 seconds to prepare a self-sustaining gel film. The gel film was peeled from the aluminum foil and fixed on the frame. Furthermore, the gel film was heated in a hot air oven at 120°C for 30 seconds, at 275°C for 40 seconds, at 400°C for 42 seconds, at 450°C for 50 seconds, and at 460°C using a far-infrared heater It was heated for 22 seconds and heated stepwise to dry. A polyimide film (A-1) having a phosphorus content of 0.025% by weight and a thickness of 75 μm was produced in the above manner.
(製造例2) 於所獲得之聚醯胺酸溶液中,以磷酸氫鈣之濃度相對於聚醯胺酸之固形物成分成為0.12重量%之方式添加磷酸氫鈣,除此以外,以與製造例1相同之方式製作磷之含量0.027重量%、厚度75 μm之聚醯亞胺膜(A-2)。(Production Example 2) To the obtained polyamic acid solution, calcium hydrogen phosphate was added in such a manner that the concentration of calcium hydrogen phosphate was 0.12% by weight relative to the solid content of the polyamic acid, except that it was the same as in Production Example 1. A polyimide film (A-2) with a phosphorus content of 0.027% by weight and a thickness of 75 μm was produced.
(製造例3) 於所獲得之聚醯胺酸溶液中,以磷酸氫鈣之濃度相對於聚醯胺酸之固形物成分成為0.13重量%之方式添加磷酸氫鈣,除此以外,以與製造例1相同之方式製作磷之含量0.030重量%、厚度75 μm之聚醯亞胺膜(A-3)。(Production Example 3) To the obtained polyamic acid solution, calcium hydrogen phosphate was added in such a manner that the concentration of calcium hydrogen phosphate was 0.13% by weight relative to the solid content of the polyamic acid, except that it was the same as in Production Example 1. A polyimide film (A-3) with a phosphorus content of 0.030% by weight and a thickness of 75 μm was produced.
(製造例4) 於所獲得之聚醯胺酸溶液中,以磷酸氫鈣之濃度相對於聚醯胺酸之固形物成分成為0.14重量%之方式添加磷酸氫鈣,除此以外,以與製造例1相同之方式製作磷之含量0.032重量%、厚度75 μm之聚醯亞胺膜(A-4)。(Production Example 4) To the obtained polyamic acid solution, calcium hydrogen phosphate was added in such a manner that the concentration of calcium hydrogen phosphate was 0.14% by weight relative to the solid content of the polyamic acid, except that it was the same as in Production Example 1. A polyimide film (A-4) with a phosphorus content of 0.032% by weight and a thickness of 75 μm was produced.
(製造例5) 於所獲得之聚醯胺酸溶液中,以磷酸氫二銨之濃度相對於聚醯胺酸之固形物成分成為0.12重量%之方式添加磷酸氫二銨,除此以外,以與製造例1相同之方式製作磷之含量0.028重量%、厚度75 μm之聚醯亞胺膜(A-5)。(Production Example 5) To the obtained polyamic acid solution, diammonium hydrogen phosphate was added so that the concentration of diammonium phosphate was 0.12% by weight relative to the solid content of polyamic acid, except that it was the same as in Production Example 1. A polyimide film (A-5) with a phosphorus content of 0.028% by weight and a thickness of 75 μm was prepared by the method.
(製造例6) 於所獲得之聚醯胺酸溶液中,以磷酸氫鈣之濃度相對於聚醯胺酸之固形物成分成為0.10重量%之方式添加磷酸氫鈣,除此以外,以與製造例1相同之方式製作磷之含量0.023重量%、厚度75 μm之聚醯亞胺膜(A-6)。(Production Example 6) To the obtained polyamic acid solution, calcium hydrogen phosphate was added in such a manner that the concentration of calcium hydrogen phosphate was 0.10% by weight relative to the solid content of the polyamic acid, except that it was the same as in Production Example 1. A polyimide film (A-6) with a phosphorus content of 0.023% by weight and a thickness of 75 μm was produced.
(製造例7) 於所獲得之聚醯胺酸溶液中,以磷酸氫鈣之濃度相對於聚醯胺酸之固形物成分成為0.15重量%之方式添加磷酸氫鈣,除此以外,以與製造例1相同之方式製作磷之含量0.034重量%、厚度75 μm之聚醯亞胺膜(A-7)。(Production Example 7) To the obtained polyamic acid solution, calcium hydrogen phosphate was added in such a manner that the concentration of calcium hydrogen phosphate was 0.15% by weight relative to the solid content of the polyamic acid, except that it was the same as in Production Example 1. A polyimide film (A-7) with a phosphorus content of 0.034% by weight and a thickness of 75 μm was produced.
(製造例8) 於所獲得之聚醯胺酸溶液中,以碳酸鈣之濃度相對於聚醯胺酸之固形物成分成為0.15重量%之方式添加碳酸鈣代替磷酸氫鈣,除此以外,以與製造例1相同之方式製作磷之含量0重量%、厚度75 μm之聚醯亞胺膜(A-8)。(Production Example 8) To the obtained polyamic acid solution, calcium carbonate was added in place of calcium hydrogen phosphate so that the concentration of calcium carbonate was 0.15% by weight relative to the solid content of polyamic acid, except that it was the same as in Production Example 1. A polyimide film (A-8) with a phosphorus content of 0% by weight and a thickness of 75 μm was produced by the method.
<石墨片之製造方法> (實施例1) 利用尺寸220 mm×220 mm之石墨片夾住尺寸200 mm×200 mm、厚度75 μm之聚醯亞胺膜(A-1)(交替地積層1片聚醯亞胺膜與石墨片),於氮氣氛圍下,以0.5℃/min之升溫速度升溫至1000℃後,於1000℃下進行10分鐘熱處理而碳化。<Manufacturing method of graphite sheet> (Example 1) Use a graphite sheet with a size of 220 mm × 220 mm to sandwich a polyimide film (A-1) with a size of 200 mm × 200 mm and a thickness of 75 μm (laminate 1 polyimide film and graphite sheet alternately), Under a nitrogen atmosphere, the temperature was raised to 1000°C at a heating rate of 0.5°C/min, followed by heat treatment at 1000°C for 10 minutes to carbonize.
其後,於室溫~2200℃之溫度區域中於減壓下,於高於2200℃之溫度區域中於氬氣氛圍下,以升溫速度1℃/min升溫至2800℃(石墨化最高溫度)後,於2800℃下保持10分鐘而製作石墨片。利用尺寸200 mm×200 mm×厚度400 μm之PET膜夾住所獲得之石墨片1片,使用壓縮成型機實施壓縮處理。施加之壓力係設為10 MPa。壓縮後之石墨片之厚度為36 μm,密度為1.87 g/cm3 。對於壓縮後之石墨片,藉由上述試驗研究特性。After that, the temperature is increased to 2800°C (graphitization maximum temperature) at a temperature increase rate of 1°C/min under a reduced pressure in a temperature range of room temperature to 2200°C under a argon atmosphere in a temperature range above 2200°C. After that, it was kept at 2800°C for 10 minutes to produce graphite sheets. One obtained graphite sheet was sandwiched with a PET film with a size of 200 mm×200 mm×thickness of 400 μm, and compressed using a compression molding machine. The applied pressure is set to 10 MPa. The compressed graphite sheet has a thickness of 36 μm and a density of 1.87 g/cm 3 . For the graphite sheet after compression, the characteristics were studied by the above test.
(實施例2) 使用聚醯亞胺膜(A-2)代替聚醯亞胺膜(A-1),除此以外,以與實施例1相同之方式製作實施例2之石墨片。壓縮後之石墨片之厚度為36 μm,密度為1.87 g/cm3 。對於壓縮後之石墨片,藉由上述試驗研究特性。(Example 2) A graphite sheet of Example 2 was produced in the same manner as in Example 1 except that the polyimide film (A-2) was used instead of the polyimide film (A-1). The compressed graphite sheet has a thickness of 36 μm and a density of 1.87 g/cm 3 . For the graphite sheet after compression, the characteristics were studied by the above test.
(實施例3) 使用聚醯亞胺膜(A-3)代替聚醯亞胺膜(A-1),除此以外,以與實施例1相同之方式製作實施例3之石墨片。壓縮後之石墨片之厚度為37 μm,密度為1.92 g/cm3 。對於壓縮後之石墨片,藉由上述試驗研究特性。(Example 3) A graphite sheet of Example 3 was produced in the same manner as in Example 1 except that the polyimide film (A-3) was used instead of the polyimide film (A-1). The compressed graphite sheet has a thickness of 37 μm and a density of 1.92 g/cm 3 . For the graphite sheet after compression, the characteristics were studied by the above test.
(實施例4) 使用聚醯亞胺膜(A-4)代替聚醯亞胺膜(A-1),除此以外,以與實施例1相同之方式製作實施例4之石墨片。壓縮後之石墨片之厚度為37 μm,密度為1.92 g/cm3 。對於壓縮後之石墨片,藉由上述試驗研究特性。(Example 4) A graphite sheet of Example 4 was produced in the same manner as Example 1 except that the polyimide film (A-4) was used instead of the polyimide film (A-1). The compressed graphite sheet has a thickness of 37 μm and a density of 1.92 g/cm 3 . For the graphite sheet after compression, the characteristics were studied by the above test.
(實施例5) 使用聚醯亞胺膜(A-5)代替聚醯亞胺膜(A-1),除此以外,以與實施例1相同之方式製作實施例5之石墨片。壓縮後之石墨片之厚度為36 μm,密度為1.87 g/cm3 。對於壓縮後之石墨片,藉由上述試驗研究特性。(Example 5) A graphite sheet of Example 5 was produced in the same manner as in Example 1, except that the polyimide film (A-5) was used instead of the polyimide film (A-1). The compressed graphite sheet has a thickness of 36 μm and a density of 1.87 g/cm 3 . For the graphite sheet after compression, the characteristics were studied by the above test.
(比較例1) 使用聚醯亞胺膜(A-6)代替聚醯亞胺膜(A-1),除此以外,以與實施例1相同之方式製作比較例1之石墨片。壓縮後之石墨片之厚度為35 μm,密度為1.97 g/cm3 。對於壓縮後之石墨片,藉由上述試驗研究特性。(Comparative Example 1) A graphite sheet of Comparative Example 1 was produced in the same manner as in Example 1 except that the polyimide film (A-6) was used instead of the polyimide film (A-1). The thickness of the compressed graphite sheet is 35 μm, and the density is 1.97 g/cm 3 . For the graphite sheet after compression, the characteristics were studied by the above test.
(比較例2) 使用聚醯亞胺膜(A-7)代替聚醯亞胺膜(A-1),除此以外,以與實施例1相同之方式製作比較例2之石墨片。壓縮後之石墨片之厚度為38 μm,密度為1.82 g/cm3 。對於壓縮後之石墨片,藉由上述試驗研究特性。(Comparative Example 2) A graphite sheet of Comparative Example 2 was produced in the same manner as in Example 1 except that the polyimide film (A-7) was used instead of the polyimide film (A-1). The compressed graphite sheet has a thickness of 38 μm and a density of 1.82 g/cm 3 . For the graphite sheet after compression, the characteristics were studied by the above test.
(比較例3) 使用聚醯亞胺膜(A-8)代替聚醯亞胺膜(A-1),除此以外,以與實施例1相同之方式製作比較例3之石墨片。壓縮後之石墨片之厚度為34 μm,密度為2.03 g/cm3 。對於壓縮後之石墨片,藉由上述試驗研究特性。(Comparative Example 3) A graphite sheet of Comparative Example 3 was produced in the same manner as in Example 1 except that the polyimide film (A-8) was used instead of the polyimide film (A-1). The compressed graphite sheet has a thickness of 34 μm and a density of 2.03 g/cm 3 . For the graphite sheet after compression, the characteristics were studied by the above test.
將實施例1~5及比較例1~3之石墨片之製造條件及物性示於表1。Table 1 shows the production conditions and physical properties of the graphite sheets of Examples 1 to 5 and Comparative Examples 1 to 3.
[表1]
根據實施例1~5可知,由磷之含量為0.025重量%以上且0.032重量%以下之聚醯亞胺膜獲得之石墨片係熱擴散性及柔軟性此兩物性優異。另一方面,根據比較例1及比較例3可知,由磷之含量未達0.025重量%之聚醯亞胺膜獲得之石墨片雖然熱擴散性優異,但柔軟性較差。又,根據比較例2可知,由磷之含量超過0.032重量%之聚醯亞胺膜獲得之石墨片雖然柔軟性優異,但熱擴散性較差。 [產業上之可利用性]It can be seen from Examples 1 to 5 that the graphite sheet obtained from the polyimide film having a phosphorus content of 0.025% by weight or more and 0.032% by weight or less is excellent in both thermal diffusibility and flexibility. On the other hand, according to Comparative Example 1 and Comparative Example 3, it can be seen that although the graphite sheet obtained from the polyimide film having a phosphorus content of not more than 0.025% by weight is excellent in thermal diffusivity, it is inferior in flexibility. In addition, it is known from Comparative Example 2 that although the graphite sheet obtained from the polyimide film having a phosphorus content of more than 0.032% by weight is excellent in flexibility, it has poor thermal diffusivity. [Industry availability]
本發明中獲得之石墨片例如具有良好之熱擴散性及柔軟性,因此可較佳地用作電子設備之散熱構件。The graphite sheet obtained in the present invention has good thermal diffusivity and flexibility, for example, and therefore can be preferably used as a heat dissipation member of electronic equipment.
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