TWI689380B - 研磨墊及研磨墊的製造方法 - Google Patents

研磨墊及研磨墊的製造方法 Download PDF

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Publication number
TWI689380B
TWI689380B TW105114249A TW105114249A TWI689380B TW I689380 B TWI689380 B TW I689380B TW 105114249 A TW105114249 A TW 105114249A TW 105114249 A TW105114249 A TW 105114249A TW I689380 B TWI689380 B TW I689380B
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TW
Taiwan
Prior art keywords
polishing
layer
polishing layer
polishing pad
regions
Prior art date
Application number
TW105114249A
Other languages
English (en)
Chinese (zh)
Other versions
TW201639664A (zh
Inventor
高木大輔
西藤和夫
田浦歳和
Original Assignee
日商阪東化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商阪東化學股份有限公司 filed Critical 日商阪東化學股份有限公司
Publication of TW201639664A publication Critical patent/TW201639664A/zh
Application granted granted Critical
Publication of TWI689380B publication Critical patent/TWI689380B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B24D7/08—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental with reinforcing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/08—Circular back-plates for carrying flexible material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW105114249A 2015-05-13 2016-05-09 研磨墊及研磨墊的製造方法 TWI689380B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015098355 2015-05-13
JP2015-098355 2015-05-13

Publications (2)

Publication Number Publication Date
TW201639664A TW201639664A (zh) 2016-11-16
TWI689380B true TWI689380B (zh) 2020-04-01

Family

ID=57247949

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105114249A TWI689380B (zh) 2015-05-13 2016-05-09 研磨墊及研磨墊的製造方法

Country Status (5)

Country Link
JP (1) JP6046865B1 (ko)
KR (1) KR102045370B1 (ko)
CN (1) CN107614202B (ko)
TW (1) TWI689380B (ko)
WO (1) WO2016181751A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10471567B2 (en) 2016-09-15 2019-11-12 Entegris, Inc. CMP pad conditioning assembly
TWI625195B (zh) * 2017-03-31 2018-06-01 台灣積體電路製造股份有限公司 研磨頭及研磨半導體晶圓的背側的方法
CN110177654B (zh) * 2017-12-19 2021-03-16 阪东化学株式会社 研磨材
CN109015435A (zh) * 2018-09-10 2018-12-18 台山市远鹏研磨科技有限公司 一种金刚石塔型砂纸

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102601747A (zh) * 2011-01-20 2012-07-25 中芯国际集成电路制造(上海)有限公司 一种研磨垫及其制备方法、使用方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6179576A (ja) * 1984-09-28 1986-04-23 Kouyoushiya:Kk 研磨ベルト
JPH0518055Y2 (ko) * 1986-05-09 1993-05-13
JP2868772B2 (ja) * 1988-09-20 1999-03-10 大日本印刷株式会社 研磨テープの製造方法
JPH09193023A (ja) * 1996-01-16 1997-07-29 Asahi Daiyamondo Kogyo Kk 電着工具及びその製造方法
US6458018B1 (en) 1999-04-23 2002-10-01 3M Innovative Properties Company Abrasive article suitable for abrading glass and glass ceramic workpieces
JP2002292573A (ja) * 2001-03-30 2002-10-08 Dainippon Printing Co Ltd 研磨フィルムおよびその製造方法
JP2005159203A (ja) * 2003-11-28 2005-06-16 Hitachi Ltd 膜厚計測方法及びその装置、研磨レート算出方法並びにｃｍｐ加工方法及びその装置
US7410413B2 (en) * 2006-04-27 2008-08-12 3M Innovative Properties Company Structured abrasive article and method of making and using the same
SG184735A1 (en) * 2007-09-14 2012-10-30 Sanyo Chemical Ind Ltd Cleaning agent for electronic material
US9067299B2 (en) * 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
CN108447507B (zh) * 2013-09-28 2020-07-28 Hoya株式会社 磁盘用玻璃基板的制造方法和磁盘的制造方法、以及磨削工具

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102601747A (zh) * 2011-01-20 2012-07-25 中芯国际集成电路制造(上海)有限公司 一种研磨垫及其制备方法、使用方法

Also Published As

Publication number Publication date
WO2016181751A1 (ja) 2016-11-17
CN107614202A (zh) 2018-01-19
JPWO2016181751A1 (ja) 2017-05-25
CN107614202B (zh) 2019-12-03
TW201639664A (zh) 2016-11-16
KR20180004765A (ko) 2018-01-12
KR102045370B1 (ko) 2019-11-15
JP6046865B1 (ja) 2016-12-21

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