TWI688634B - Adhesive sheets and optical components - Google Patents

Adhesive sheets and optical components Download PDF

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TWI688634B
TWI688634B TW104143004A TW104143004A TWI688634B TW I688634 B TWI688634 B TW I688634B TW 104143004 A TW104143004 A TW 104143004A TW 104143004 A TW104143004 A TW 104143004A TW I688634 B TWI688634 B TW I688634B
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adhesive
meth
layer
resin layer
acrylate
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TW201629173A (en
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片岡賢一
天野立巳
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日商日東電工股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D167/00Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/63Additives non-macromolecular organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08Homopolymers or copolymers of acrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/25Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255Polyesters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00Presence of polyester
    • C09J2467/006Presence of polyester in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

本發明提供一種能夠提高防靜電性與拾取性之黏著片材以及由上述黏著片材保護之光學構件。本發明之黏著片材之特徵在於,依序具有第一樹脂層、接著層、第二樹脂層及由黏著劑組合物形成之黏著劑層,上述接著層之厚度相對於上述第一樹脂層之厚度與上述第二樹脂層之厚度之和的比值為0.50以下,上述接著層之23℃下之儲存彈性模數為1.0×104Pa以上且未達5.0×107Pa,上述第一樹脂層之與具有上述黏著劑層之面相反側之面上具有面塗層,上述面塗層係由含有作為導電性聚合物成分之聚苯胺磺酸、作為黏合劑成分之聚酯樹脂及作為交聯劑之異氰酸酯系化合物之面塗層用組合物形成者,上述黏著劑組合物含有具有氧伸烷基鏈之有機聚矽氧烷。 The present invention provides an adhesive sheet capable of improving antistatic properties and pick-up properties, and an optical member protected by the adhesive sheet. The adhesive sheet of the present invention is characterized by sequentially having a first resin layer, an adhesive layer, a second resin layer, and an adhesive layer formed of an adhesive composition, and the thickness of the adhesive layer is relative to the thickness of the first resin layer The ratio of the thickness to the sum of the thickness of the second resin layer is 0.50 or less, the storage elastic modulus of the adhesive layer at 23° C. is 1.0×10 4 Pa or more and less than 5.0×10 7 Pa, the first resin layer The surface opposite to the surface with the adhesive layer has a topcoat layer consisting of polyaniline sulfonic acid as a conductive polymer component, polyester resin as a binder component and crosslinking In the case of a composition for a top coat of an isocyanate compound of an agent, the above-mentioned adhesive composition contains an organic polysiloxane having an oxyalkylene chain.

Description

黏著片材及光學構件 Adhesive sheets and optical components

本發明係關於一種黏著片材及光學構件。 The invention relates to an adhesive sheet and an optical member.

本發明之黏著片材作為以保護液晶顯示器、有機EL(電致發光)顯示器、觸控面板顯示器等中使用之偏光板、波長板、相位差板、光學補償膜、反射片材、增亮膜、覆蓋玻璃、覆蓋片材、硬質塗層膜、透明導電玻璃、透明導電性膜等光學構件表面之目的而使用之表面保護膜較為有用。 The adhesive sheet of the present invention is used as a polarizing plate, a wavelength plate, a retardation plate, an optical compensation film, a reflective sheet, a brightness enhancement film used in protecting a liquid crystal display, an organic EL (electroluminescence) display, a touch panel display, etc. , Cover glass, cover sheet, hard coating film, transparent conductive glass, transparent conductive film and other surface protection film used for the purpose of the optical member surface is more useful.

近年來,於光學零件、電子零件之輸送或於印字基板上安裝時,進行藉由用特定之片材包裝之狀態或者貼附有黏著帶之狀態移送各個零件。其中,於光學、電子零件之領域中特別廣泛地使用表面保護膜。 In recent years, when transporting optical parts or electronic parts or mounting them on a printed circuit board, each part is transferred in a state of being packaged with a specific sheet or in a state where an adhesive tape is attached. Among them, surface protection films are particularly widely used in the fields of optical and electronic parts.

表面保護膜一般經由塗佈於支持膜側之黏著劑貼合於被接著體上,並為了防止被接著體之加工、運送時產生之劃痕或污漬之目的而使用(專利文獻1)。例如,液晶顯示器之面板藉由經由黏著劑將偏光板或波長板等光學構件貼合於液晶單元上而形成。該等光學構件經由黏著劑貼合有表面保護膜,防止被接著體之加工、運送時產生之劃痕或污漬。 The surface protective film is generally attached to the adherend via an adhesive applied to the support film side, and is used for the purpose of preventing scratches or stains generated during the processing and transportation of the adherend (Patent Document 1). For example, a panel of a liquid crystal display is formed by bonding an optical member such as a polarizing plate or a wavelength plate to a liquid crystal cell via an adhesive. These optical components are attached with a surface protective film via an adhesive to prevent scratches or stains generated during processing and transportation of the adherend.

然後,進行將該光學構件貼合於液晶單元上等,然後於不再需要保護膜之階段將保護膜剝離除去。一般而言,保護膜或光學構件由塑膠材料構成,因此電絕緣性較高,於摩擦或剝離時產生靜電。因 此,於將保護膜自偏光板等光學構件上剝離時亦產生靜電。若於殘留有靜電之狀態下對液晶施加電壓,則液晶分子之配向損失或者產生面板之缺損。另外,靜電之存在亦可能會造成吸附塵埃或者降低作業性。鑒於上述事項,進行於表面保護膜上實施防靜電處理,例如,藉由形成防靜電層或施加防靜電塗佈層作為表面保護膜之表面層(面塗層、背面層)而賦予防靜電功能(參照專利文獻2及3)。 Then, the optical member is attached to the liquid crystal cell, etc., and then the protective film is peeled off and removed when the protective film is no longer needed. Generally speaking, the protective film or optical member is made of plastic material, so it has high electrical insulation and generates static electricity when rubbed or peeled off. because Therefore, static electricity is also generated when the protective film is peeled off from an optical member such as a polarizing plate. If a voltage is applied to the liquid crystal in a state where static electricity remains, the alignment loss of the liquid crystal molecules or the defect of the panel may occur. In addition, the presence of static electricity may also cause dust absorption or reduce workability. In view of the above, carry out anti-static treatment on the surface protective film, for example, by forming an anti-static layer or applying an anti-static coating layer as the surface layer (top coat layer, back layer) of the surface protective film to give the anti-static function (Refer to Patent Documents 2 and 3).

另外,近年來,作為用以對表面保護膜之表面層賦予防靜電功能之導電性聚合物,使用PEDOT(聚(3,4-亞乙二氧基噻吩))/PSS(聚苯乙烯磺酸鹽)(聚噻吩型)系之水分散型者。但是,於使用上述導電性聚合物形成防靜電層之情形時,隨著時間之經過,有PSS(相當於摻雜劑)自PEDOT脫離而產生表面電阻率或剝離靜電電壓之上升等,並且有產生與氧化劣化或光劣化相伴之表面電阻率之上升(劣化)等問題之虞。 In addition, in recent years, PEDOT (poly(3,4-ethylenedioxythiophene))/PSS (polystyrene sulfonic acid) has been used as a conductive polymer to impart an antistatic function to the surface layer of the surface protective film Salt) (polythiophene type) of the water-dispersed type. However, when the above-mentioned conductive polymer is used to form an antistatic layer, as time passes, PSS (equivalent to dopant) is detached from PEDOT, resulting in an increase in surface resistivity or peeling electrostatic voltage, etc., and There may be problems such as an increase (deterioration) in surface resistivity accompanying oxidative degradation or photo degradation.

另外,若產生表面電阻率等之上升(劣化),則於將表面保護膜自被接著體上剝離時產生靜電,產生出現問題之擔心。 In addition, if an increase (deterioration) in surface resistivity or the like occurs, static electricity is generated when the surface protective film is peeled off from the adherend, which may cause problems.

另外,該表面保護膜於不再需要之階段被剝離除去,但伴隨液晶顯示板之大型化、或薄層化,於剝離步驟中容易產生對偏光板或液晶單元之損傷,因此要求具有於剝離時不產生翹起等之適度之黏著力,並且要求輕剝離性、拾取性等以能夠再剝離。特別是,近年來伴隨顯示器之薄型化,構成顯示器之光學構件亦薄型化,關於厚度150μm以下、以及更薄之100μm以下之光學構件,於運送步驟中光學構件撓曲,由此無法運送。另外,亦產生不能將光學構件與其他構件完全貼合等問題。為了避免該等問題,藉由增厚表面保護膜以抑制撓曲,但由於增厚而剝離變重,因此於不再需要表面保護膜之階段利用拾取帶將表面保護膜剝離時,產生無法拾取之不良狀況。因此,要求能夠抑制撓曲、並且實現輕剝離性、拾取性以能夠再剝離之黏著片 材。 In addition, the surface protection film is peeled off and removed at a stage when it is no longer needed, but as the liquid crystal display panel becomes larger or thinner, damage to the polarizing plate or liquid crystal cell is likely to occur during the peeling step. It does not cause moderate adhesion such as warping, and requires light releasability, pick-up, etc. to enable re-peelability. In particular, in recent years, along with the thinning of the display, the optical members constituting the display have also become thinner. For optical members having a thickness of 150 μm or less and a thinner 100 μm or less, the optical member deflects during the transport step, and thus cannot be transported. In addition, there is also a problem that the optical member cannot be completely bonded to other members. In order to avoid these problems, thickening the surface protective film to suppress deflection, but due to the thickening and peeling becomes heavy, so when the surface protective film is no longer needed when the surface protective film is peeled off by the pick-up tape, it cannot be picked up Bad condition. Therefore, there is a demand for an adhesive sheet that can suppress deflection and achieve light peelability and pick-up properties so that it can be peeled off again. material.

[先前技術文獻] [Prior Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2003-334911號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2003-334911

[專利文獻2]日本專利特開2000-26817號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2000-26817

[專利文獻3]日本專利特開2008-255332號公報 [Patent Document 3] Japanese Patent Laid-Open No. 2008-255332

因此,本發明係鑒於上述事項進行廣泛深入之研究,結果提供一種能夠實現防靜電性及拾取性之提高之黏著片材、以及由上述黏著片材保護之光學構件。 Therefore, the present invention has been extensively and intensively studied in consideration of the above-mentioned matters, and as a result, an adhesive sheet capable of improving antistatic properties and pick-up properties, and an optical member protected by the adhesive sheet are provided.

即,本發明之黏著片材之特徵在於,依序具有第一樹脂層、接著層、第二樹脂層及由黏著劑組合物形成之黏著劑層,上述接著層之厚度相對於上述第一樹脂層之厚度與上述第二樹脂層之厚度之和的比值為0.50以下,上述接著層之23℃下之儲存彈性模數為1.0×104Pa以上且未達5.0×107Pa,上述第一樹脂層之與具有上述黏著劑層之面相反側之面上具有面塗層,上述面塗層係由含有作為導電性聚合物成分之聚苯胺磺酸、作為黏合劑成分之聚酯樹脂及作為交聯劑之異氰酸酯系化合物之面塗層用組合物形成者,上述黏著劑組合物含有具有氧伸烷基鏈之有機聚矽氧烷。 That is, the adhesive sheet of the present invention is characterized by sequentially having a first resin layer, an adhesive layer, a second resin layer, and an adhesive layer formed of an adhesive composition, the thickness of the adhesive layer relative to the first resin The ratio of the thickness of the layer to the sum of the thickness of the second resin layer is 0.50 or less. The storage elastic modulus of the adhesive layer at 23° C. is 1.0×10 4 Pa or more and less than 5.0×10 7 Pa. The first The surface of the resin layer opposite to the surface with the adhesive layer has a top coat, the top coat consists of a polyaniline sulfonic acid as a conductive polymer component, a polyester resin as an adhesive component and In the case of forming a composition for a top coat of an isocyanate-based compound of a cross-linking agent, the above-mentioned adhesive composition contains an organic polysiloxane having an oxyalkylene chain.

本發明之黏著片材中,較佳為上述面塗層用組合物進而含有作為潤滑劑之脂肪醯胺。 In the adhesive sheet of the present invention, it is preferable that the above composition for top coat further contains fatty amide as a lubricant.

本發明之黏著片材中,較佳為上述樹脂層中之至少一者為聚酯膜。 In the adhesive sheet of the present invention, it is preferable that at least one of the resin layers is a polyester film.

本發明之黏著片材中,較佳為上述黏著劑組合物含有丙烯酸系 黏著劑及/或胺基甲酸酯系黏著劑。 In the adhesive sheet of the present invention, it is preferable that the adhesive composition contains acrylic Adhesives and/or carbamate adhesives.

本發明之黏著片材中,較佳為上述黏著劑組合物含有防靜電成分。 In the adhesive sheet of the present invention, the adhesive composition preferably contains an antistatic component.

本發明之光學構件,較佳為由上述黏著片材保護。 The optical member of the present invention is preferably protected by the above-mentioned adhesive sheet.

根據本發明之黏著片材,具有經由接著層將樹脂層積層而成之樹脂層膜(第一樹脂層、接著層、第二樹脂層之順序。有時稱為積層膜),由此對於將黏著片材剝離時之變形,於接著層之部分實現應力緩和,能夠以低於單獨之樹脂層之剝離力(黏著力)進行拾取。另外,藉由上述積層構成,可使積層膜之撓曲量與各個樹脂層膜之撓曲量相比改進(減少撓曲量),可改善運送步驟中之折斷或變形導致之運送不良之問題,可實現製造效率之提高。另外,藉由於樹脂層膜之一個面具有含有特定原料之面塗層、於另一面具有含有特定原料之黏著劑層,可獲得防靜電性、或拾取性優異之黏著片材,為較佳之態樣。 The adhesive sheet according to the present invention has a resin layer film (the order of the first resin layer, the adhesive layer, and the second resin layer. The order of the first resin layer, the adhesive layer, and the second resin layer. The deformation when the adhesive sheet peels off, the stress is relieved at the part of the adhesive layer, and it can be picked up with a peeling force (adhesive force) lower than that of the individual resin layer. In addition, with the above-mentioned build-up structure, the deflection of the laminated film can be improved compared with the deflection of each resin layer film (reduction of the deflection), and the problem of poor transport due to breakage or deformation in the transport step can be improved , Can achieve the improvement of manufacturing efficiency. In addition, since the resin layer film has a top coat layer containing a specific raw material on one side and an adhesive layer containing a specific raw material on the other side, an adhesive sheet with excellent antistatic properties or excellent pick-up properties can be obtained. kind.

1‧‧‧黏著片材(表面保護膜) 1‧‧‧adhesive sheet (surface protective film)

1A‧‧‧面塗層之表面 1A‧‧‧Coated surface

2‧‧‧偏光板 2‧‧‧ Polarizer

3‧‧‧丙烯酸系樹脂板 3‧‧‧Acrylic resin board

4‧‧‧固定台 4‧‧‧Fixed

5‧‧‧電位測定器 5‧‧‧potentiometer

6‧‧‧第一樹脂層 6‧‧‧First resin layer

7‧‧‧接著層 7‧‧‧Next layer

8‧‧‧第二樹脂層 8‧‧‧Second resin layer

12‧‧‧樹脂層膜(第一樹脂層+接著層+第二樹脂層) 12‧‧‧Resin film (first resin layer+adhesive layer+second resin layer)

14‧‧‧面塗層 14‧‧‧Top coating

20‧‧‧黏著劑層 20‧‧‧Adhesive layer

20A‧‧‧黏著面 20A‧‧‧adhesive surface

50‧‧‧平面偏光板 50‧‧‧plane polarizer

60‧‧‧單面黏著帶 60‧‧‧Single-sided adhesive tape

62‧‧‧黏著劑層(黏著面) 62‧‧‧Adhesive layer (adhesive surface)

64‧‧‧基材 64‧‧‧Substrate

130‧‧‧雙面黏著帶 130‧‧‧ Double-sided adhesive tape

132‧‧‧不鏽鋼板 132‧‧‧Stainless steel plate

160‧‧‧單面黏著帶 160‧‧‧Single-sided adhesive tape

162‧‧‧丙烯酸系黏著劑(黏著劑層) 162‧‧‧Acrylic adhesive (adhesive layer)

162A‧‧‧黏著面 162A‧‧‧adhesive surface

164‧‧‧樹脂層膜(第一樹脂層+接著層+第二樹脂層) 164‧‧‧Resin film (first resin layer+adhesive layer+second resin layer)

G‧‧‧玻璃板 G‧‧‧Glass plate

H‧‧‧距離中心位置之高度 H‧‧‧ Height from the center

L‧‧‧荷重 L‧‧‧load

T‧‧‧No.31B膠帶 T‧‧‧No.31B tape

圖1係本發明之較佳實施形態之保護膜之概略剖視圖。 FIG. 1 is a schematic cross-sectional view of a protective film according to a preferred embodiment of the present invention.

圖2係說明剝離靜電電壓之測定方法之說明圖。 FIG. 2 is an explanatory diagram illustrating a measurement method of peeling electrostatic voltage.

圖3係說明背面黏著力(A)之測定方法之說明圖。 FIG. 3 is an explanatory diagram illustrating the measurement method of the back surface adhesive force (A).

圖4係說明一實施態樣之黏著片材之剝離方法之說明圖。 4 is an explanatory diagram illustrating a peeling method of an adhesive sheet according to an embodiment.

圖5係說明撓曲量之測定方法之說明圖。 Fig. 5 is an explanatory diagram illustrating a method of measuring the amount of deflection.

以下,對本發明之實施形態進行詳細說明。 Hereinafter, the embodiments of the present invention will be described in detail.

<黏著片材(表面保護膜)> <adhesive sheet (surface protective film)>

圖1係本發明之較佳實施形態之黏著片材之概略剖視圖。黏著片材1依序具有第一樹脂層6、接著層7、第二樹脂層8(有時將依序具有該等第一樹脂層、接著層及第二樹脂層之構成稱為「樹脂層膜」)及 黏著劑層20,並且上述第一樹脂層6之與具有上述黏著劑層20之面相反側之面上具有面塗層14。上述黏著片材1為經由接著層7將該等第一樹脂層6與第二樹脂層8積層、並且具有黏著劑層20以及面塗層14之積層體。另外,利用上述黏著劑層20貼合於被接著體(例如光學構件)上。再者,雖然未圖示,但於貼合至被接著體之前於黏著劑層20之表面貼合有隔片為較佳之態樣。 FIG. 1 is a schematic cross-sectional view of an adhesive sheet according to a preferred embodiment of the present invention. The adhesive sheet 1 has a first resin layer 6, an adhesive layer 7, and a second resin layer 8 in this order (sometimes, a structure having the first resin layer, adhesive layer, and second resin layer in this order is called a “resin layer Membrane'') and The adhesive layer 20 and the surface of the first resin layer 6 opposite to the surface having the adhesive layer 20 have a top coat layer 14. The above-mentioned adhesive sheet 1 is a layered body in which the first resin layer 6 and the second resin layer 8 are laminated via the adhesive layer 7 and has an adhesive layer 20 and a top coat layer 14. In addition, the adhesive layer 20 is bonded to the adherend (for example, an optical member). In addition, although not shown, it is preferable that a separator is bonded to the surface of the adhesive layer 20 before bonding to the adherend.

<樹脂層> <resin layer>

樹脂層較佳為由樹脂膜構成。樹脂層之厚度較佳為1μm~200μm,更佳為12μm~75μm。第一樹脂層之厚度與第二樹脂層之厚度之大小關係較佳為(第一樹脂層之厚度)

Figure 104143004-A0202-12-0005-15
(第二樹脂層之厚度),此時第一樹脂層之厚度較佳為1μm~50μm,更佳為4μm~38μm,最佳為10μm~25μm。另外,第二樹脂層之厚度較佳為10μm~200μm,更佳為25μm~130μm,最佳為38μm~75μm。若於上述範圍內,則可兼顧黏著片材之撓曲量抑制與拾取性,為較佳之態樣。 The resin layer is preferably composed of a resin film. The thickness of the resin layer is preferably 1 μm to 200 μm, and more preferably 12 μm to 75 μm. The relationship between the thickness of the first resin layer and the thickness of the second resin layer is preferably (thickness of the first resin layer)
Figure 104143004-A0202-12-0005-15
(Thickness of the second resin layer) At this time, the thickness of the first resin layer is preferably 1 μm to 50 μm, more preferably 4 μm to 38 μm, and most preferably 10 μm to 25 μm. In addition, the thickness of the second resin layer is preferably 10 μm to 200 μm, more preferably 25 μm to 130 μm, and most preferably 38 μm to 75 μm. Within the above range, it is possible to balance the deflection of the adhesive sheet and the pick-up property, which is a preferable aspect.

另外,至少一個樹脂層之MD方向(流動方向)之拉伸強度可設定為任意適當之值。樹脂層之MD方向(流動方向)之拉伸強度較佳為90MPa~350MPa,進而較佳為110MPa~320MPa,更佳為130MPa~300MPa,最佳為180MPa~250MPa。若於上述範圍內,則可抑制黏著片材之撓曲量,為較佳之態樣。 In addition, the tensile strength in the MD direction (flow direction) of at least one resin layer can be set to any appropriate value. The tensile strength of the resin layer in the MD direction (flow direction) is preferably 90 MPa to 350 MPa, further preferably 110 MPa to 320 MPa, more preferably 130 MPa to 300 MPa, and most preferably 180 MPa to 250 MPa. Within the above range, the amount of deflection of the adhesive sheet can be suppressed, which is a preferable aspect.

此處所揭示之技術中,構成樹脂層(支持體、基材)之樹脂材料,可無特別限制地使用,例如,較佳使用透明性、機械強度、熱穩定性、水分阻隔性、各向同性、可撓性、尺寸穩定性等特性優異者。特別是,由於樹脂層具有可撓性,因此可利用輥塗機等塗佈黏著劑組合物,並且可捲繞為捲筒狀,因此較為有用。 In the technology disclosed here, the resin material constituting the resin layer (support, substrate) can be used without particular limitation, for example, transparency, mechanical strength, thermal stability, moisture barrier property, isotropy are preferably used , Flexibility, dimensional stability and other characteristics are excellent. In particular, since the resin layer has flexibility, the adhesive composition can be applied by a roll coater or the like and can be wound into a roll shape, which is useful.

作為上述樹脂層,可較佳使用例如由以聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚對苯二甲酸丁二酯等聚酯系聚合 物;二乙醯纖維素、三乙醯纖維素等纖維素系聚合物;聚碳酸酯系聚合物;聚甲基丙烯酸甲酯等丙烯酸系聚合物等作為主要樹脂成分(樹脂成分中之主要成分,典型而言為占50質量%以上之成分)之樹脂材料構成之塑膠膜作為上述樹脂層。作為上述樹脂材料之其他例,可列舉:聚苯乙烯、丙烯腈-苯乙烯共聚物等苯乙烯系聚合物;聚乙烯、聚丙烯、具有環狀結構或降冰片烯結構之聚烯烴、乙烯-丙烯共聚物等烯烴系聚合物;氯乙烯系聚合物;尼龍6、尼龍6,6、芳香族聚醯胺等醯胺系聚合物等作為樹脂材料。作為上述樹脂材料之另一例,可列舉醯亞胺系聚合物、碸系聚合物、聚醚碸系聚合物、聚醚醚酮系聚合物、聚苯硫醚系聚合物、乙烯醇系聚合物、偏二氯乙烯系聚合物、乙烯醇丁醛系聚合物、芳酯系聚合物、聚甲醛系聚合物、環氧系聚合物等。亦可為包含上述聚合物中之兩種以上之摻合物之樹脂層。 As the above-mentioned resin layer, for example, polyester-based polymerization using polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate can be preferably used. Cellulose; diacetyl cellulose, triethyl cellulose cellulose and other cellulose-based polymers; polycarbonate-based polymers; polymethyl methacrylate and other acrylic polymers as the main resin component (main component of the resin component Typically, a plastic film composed of a resin material that accounts for more than 50% by mass is used as the resin layer. As other examples of the above-mentioned resin materials, styrene-based polymers such as polystyrene and acrylonitrile-styrene copolymers; polyethylene, polypropylene, polyolefins having a ring structure or norbornene structure, and ethylene- Olefin-based polymers such as propylene copolymers; vinyl chloride-based polymers; amide-based polymers such as nylon 6, nylon 6,6, and aromatic polyamides are used as resin materials. As another example of the above-mentioned resin material, there may be mentioned an imide-based polymer, a lanthanide-based polymer, a polyether lanthanide-based polymer, a polyetheretherketone-based polymer, a polyphenylene sulfide-based polymer, and a vinyl alcohol-based polymer , Vinylidene chloride polymer, vinyl alcohol butyraldehyde polymer, aryl ester polymer, polyoxymethylene polymer, epoxy polymer, etc. It may be a resin layer containing a blend of two or more of the above polymers.

另外,作為上述樹脂層,可較佳採用包含透明之熱塑性樹脂材料之塑膠膜,上述塑膠膜之中,本發明之黏著片材中之上述樹脂層之至少一者為聚酯膜為更佳之態樣。此處,聚酯膜係指以聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚對苯二甲酸丁二酯等具有以酯鍵為基本之主骨架之聚合物材料(聚酯樹脂)作為主要樹脂成分者。上述聚酯膜具有光學特性或尺寸穩定性優異等、作為黏著片材(表面保護膜)之樹脂層較佳之特性,另一方面,其本身具有容易帶電之性質。另外,作為滿足上述拉伸強度之樹脂層,可列舉以下之樹脂。可較佳使用由以聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚對苯二甲酸丁二酯等聚酯系聚合物;二乙醯纖維素、三乙醯纖維素等纖維素系聚合物;聚碳酸酯系聚合物;聚甲基丙烯酸甲酯等丙烯酸系聚合物;聚苯乙烯系聚合物;具有環狀結構或降冰片烯結構之聚烯烴;尼龍6、尼龍6,6、芳香族聚醯胺等醯胺系聚合物等作為主要樹脂成分(樹脂成分中之主要成分,典型而言為占50質量%以上 之成分)之樹脂材料構成之塑膠膜作為上述樹脂層。亦可為包含上述聚合物中之兩種以上之摻合物之樹脂層。 In addition, as the resin layer, a plastic film containing a transparent thermoplastic resin material can be preferably used. Among the plastic films, at least one of the resin layers in the adhesive sheet of the present invention is a polyester film. kind. Here, the polyester film refers to polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate, etc. having a main skeleton based on an ester bond The polymer material (polyester resin) as the main resin component. The polyester film has excellent characteristics such as optical characteristics and dimensional stability, and is preferably a resin layer as an adhesive sheet (surface protective film). On the other hand, it has the property of being easily charged. In addition, as the resin layer satisfying the above tensile strength, the following resins may be mentioned. Polyester polymers such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate, etc. can be preferably used; Cellulose polymers such as triacetyl cellulose; polycarbonate polymers; acrylic polymers such as polymethyl methacrylate; polystyrene polymers; polyolefins with a cyclic structure or a norbornene structure ; Nylon 6, nylon 6,6, aromatic amides and other amide-based polymers as the main resin component (the main component of the resin component, typically accounts for more than 50% by mass The plastic film made of the resin material of the component) is used as the resin layer. It may be a resin layer containing a blend of two or more of the above polymers.

構成上述樹脂層之樹脂材料中,可根據需要調配抗氧化劑、紫外線吸收劑、塑化劑、著色劑(顏料、染料等)等各種添加劑。另外,上述樹脂層之表面可實施例如電暈放電處理、電漿處理、紫外線照射處理、酸處理、鹼處理、塗佈底塗劑等公知或慣用之表面處理。此種表面處理可為例如用以提高樹脂層與黏著劑層或面塗層等之密著性(黏著劑層之錨固性等)之處理。可較佳採用於樹脂層之表面導入羥基等極性基之表面處理。 Various additives such as antioxidants, ultraviolet absorbers, plasticizers, colorants (pigments, dyes, etc.) may be blended in the resin material constituting the resin layer as necessary. In addition, the surface of the above-mentioned resin layer may be subjected to a known or conventional surface treatment such as corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, acid treatment, alkali treatment, coating primer, and the like. Such surface treatment may be, for example, a treatment for improving the adhesion of the resin layer to the adhesive layer or top coat (anchoring of the adhesive layer, etc.). Surface treatment in which polar groups such as hydroxyl groups are introduced on the surface of the resin layer can be preferably used.

再者,第一樹脂層及第二樹脂層之構成(例如厚度、形成材料、彈性模量、拉伸伸長率等)可相同或不同,可適當選擇。 In addition, the configurations of the first resin layer and the second resin layer (for example, thickness, forming material, elastic modulus, tensile elongation, etc.) may be the same or different, and may be appropriately selected.

<接著層> <Next Layer>

本發明中之「接著層」係指將相鄰之樹脂層之面與面接合,並以實用上充分之接著力與接著時間使其一體化之層。作為形成接著層之材料,可列舉例如:黏著劑、接著劑、增黏塗劑。接著層可為於樹脂層之表面上形成增黏塗層,並於其上形成接著層之多層構造。再者,本發明中之「黏著劑層」係指可剝離(再剝離性)者。 The "adhesive layer" in the present invention refers to a layer that joins the surfaces of adjacent resin layers and integrates them with practically sufficient adhesive force and adhesive time. Examples of the material for forming the adhesive layer include adhesives, adhesives, and tackifying coating agents. The subsequent layer may be a multilayer structure in which an adhesion-promoting coating is formed on the surface of the resin layer, and an adhesive layer is formed thereon. Furthermore, the "adhesive layer" in the present invention refers to a peelable (repeelable) one.

接著層之厚度相對於上述第一樹脂層之厚度與上述第二樹脂層之厚度之和的比值為0.50以下,較佳為0.40以下,更佳為0.35以下,最佳為0.30以下。藉由設定於此種範圍內,可極其良好地抑制被接著體(例如光學構件)之翹曲。另一方面,上述厚度之比值較佳為0.03以上。藉由設定於此種範圍內,所獲得之黏著片材之彎曲性更優異,可達成極其優異之剝離性。 The ratio of the thickness of the next layer to the sum of the thickness of the first resin layer and the thickness of the second resin layer is 0.50 or less, preferably 0.40 or less, more preferably 0.35 or less, and most preferably 0.30 or less. By setting within such a range, the warpage of the adherend (for example, optical member) can be suppressed extremely well. On the other hand, the ratio of the above thickness is preferably 0.03 or more. By setting within such a range, the obtained adhesive sheet has more excellent bendability and can achieve extremely excellent peelability.

接著層之厚度較佳為比樹脂層之厚度薄。樹脂層之厚度與接著層之厚度之差較佳為2μm以上,更佳為5μm以上。若該差過小,則有根據樹脂層之厚度,抑制被接著體(例如光學構件)之翹曲之效果變 得不充分之虞。接著層之厚度較佳為1μm~50μm,更佳為2μm~25μm,進而較佳為5μm~20μm。若接著層之厚度過厚,則有於接著層之形成中產生不良狀況(例如糊劑缺損)之虞。 The thickness of the subsequent layer is preferably thinner than the thickness of the resin layer. The difference between the thickness of the resin layer and the thickness of the adhesive layer is preferably 2 μm or more, and more preferably 5 μm or more. If the difference is too small, depending on the thickness of the resin layer, the effect of suppressing warpage of the adherend (e.g., optical member) may change. Inadequate risk. The thickness of the subsequent layer is preferably 1 μm to 50 μm, more preferably 2 μm to 25 μm, and still more preferably 5 μm to 20 μm. If the thickness of the adhesive layer is too thick, there is a possibility that a defect (for example, paste defect) may occur in the formation of the adhesive layer.

根據本發明之黏著片材,藉由設置接著層而實現應力緩和,降低所獲得之黏著片材之剝離力,可提高拾取性,可以低於單獨之樹脂層之剝離力進行拾取。另外,藉由具有經由上述接著層將樹脂層積層而成之樹脂層膜(第一樹脂層、接著層、第二樹脂層之順序),可使積層膜之撓曲量與各個樹脂層膜之撓曲量相比改進(減少撓曲量),可改善於運送步驟中之折斷或變形導致之運送不良問題,可達成製造效率之提高。再者,接著層之23℃下之儲存彈性模數為1.0×104Pa以上且未達5.0×107Pa,較佳為1.0×104Pa以上且未達1.0×107Pa,更佳為1.0×105Pa以上且未達1.0×106Pa。上述接著層之儲存彈性模數可使用動態黏彈性測定裝置於頻率1Hz之條件下進行測定。 According to the adhesive sheet of the present invention, stress relief is achieved by providing an adhesive layer, the peeling force of the obtained adhesive sheet is reduced, the pick-up property can be improved, and the pick-up can be lower than the peeling force of the resin layer alone. In addition, by having the resin layer film (the order of the first resin layer, the adhesive layer, and the second resin layer) formed by laminating the resin layers through the above-mentioned adhesive layer, the amount of deflection of the laminated film can be adjusted to that of each resin layer film. Compared with the improvement of the amount of deflection (reducing the amount of deflection), the problem of poor delivery caused by breakage or deformation during the delivery step can be improved, and an increase in manufacturing efficiency can be achieved. Furthermore, the storage elastic modulus of the adhesive layer at 23°C is 1.0×10 4 Pa or more and less than 5.0×10 7 Pa, preferably 1.0×10 4 Pa or more and less than 1.0×10 7 Pa, more preferably It is 1.0×10 5 Pa or more and does not reach 1.0×10 6 Pa. The storage elastic modulus of the adhesive layer can be measured using a dynamic viscoelasticity measuring device at a frequency of 1 Hz.

接著層代表性地由接著劑形成。作為接著劑,較佳使用丙烯酸系接著劑。丙烯酸系接著劑較佳為含有(甲基)丙烯酸系聚合物及交聯劑。作為交聯劑,只要為與(甲基)丙烯酸系聚合物反應之化合物則可無特別限制地使用,較佳為使用異氰酸酯化合物、環氧化合物、三聚氰胺系樹脂、氮丙啶衍生物及金屬螯合物。 The subsequent layer is typically formed of an adhesive. As the adhesive, an acrylic adhesive is preferably used. The acrylic adhesive preferably contains a (meth)acrylic polymer and a crosslinking agent. The crosslinking agent can be used without particular limitation as long as it is a compound that reacts with the (meth)acrylic polymer, and isocyanate compounds, epoxy compounds, melamine resins, aziridine derivatives, and metal chelates are preferably used Compound.

上述(甲基)丙烯酸系聚合物係指由丙烯酸系單體及/或甲基丙烯酸系單體(本說明書中稱為「(甲基)丙烯酸酯」)合成之聚合物或共聚物。於(甲基)丙烯酸系聚合物為共聚物之情形時,其分子之排列狀態並無特別限制,可為無規共聚物,亦可為嵌段共聚物,亦可為接枝共聚物。較佳之分子排列狀態為無規共聚物。另外,聚合方法並無特別限制,可利用溶液聚合、乳化聚合、塊狀聚合、懸浮聚合等公知之方法進行聚合。 The (meth)acrylic polymer refers to a polymer or copolymer synthesized from an acrylic monomer and/or a methacrylic monomer (referred to as "(meth)acrylate" in this specification). When the (meth)acrylic polymer is a copolymer, the arrangement state of the molecules is not particularly limited, and it may be a random copolymer, a block copolymer, or a graft copolymer. The preferred molecular arrangement is random copolymer. In addition, the polymerization method is not particularly limited, and polymerization can be carried out by known methods such as solution polymerization, emulsion polymerization, bulk polymerization, and suspension polymerization.

上述(甲基)丙烯酸系聚合物例如可藉由將(甲基)丙烯酸烷基酯均 聚或共聚而獲得。(甲基)丙烯酸烷基酯之烷基可為直鏈狀、支鏈狀或環狀。(甲基)丙烯酸烷基酯之烷基之碳數較佳為1~18左右,更佳為1~10。 The (meth)acrylic polymer can be obtained by combining Obtained by polymerization or copolymerization. The alkyl group of the (meth)acrylic acid alkyl ester may be linear, branched or cyclic. The carbon number of the alkyl group of (meth)acrylic acid alkyl ester is preferably about 1 to 18, more preferably 1 to 10.

作為上述(甲基)丙烯酸烷基酯之具體例,可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸正戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸正己酯、(甲基)丙烯酸異己酯、(甲基)丙烯酸正庚酯、(甲基)丙烯酸異庚酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸環己酯。該等可單獨使用或者將兩種以上組合使用。 Specific examples of the alkyl (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth)acrylate, Isobutyl (meth)acrylate, third butyl (meth)acrylate, n-pentyl (meth)acrylate, isoamyl (meth)acrylate, n-hexyl (meth)acrylate, (meth)acrylic acid Isohexyl, n-heptyl (meth)acrylate, isoheptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate , N-nonyl (meth)acrylate, isononyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, cyclohexyl (meth)acrylate. These can be used alone or in combination of two or more.

上述(甲基)丙烯酸系聚合物較佳為上述(甲基)丙烯酸烷基酯與含有羥基之(甲基)丙烯酸酯之共聚物。於該情形時,(甲基)丙烯酸烷基酯之烷基之碳數較佳為1~8,更佳為2~8,進而較佳為2~6,特別較佳為4~6。(甲基)丙烯酸烷基酯之烷基可為直鏈狀亦可為支鏈狀。 The (meth)acrylic polymer is preferably a copolymer of the alkyl (meth)acrylate and a (meth)acrylate containing a hydroxyl group. In this case, the carbon number of the alkyl group of (meth)acrylate is preferably 1-8, more preferably 2-8, still more preferably 2-6, and particularly preferably 4-6. The alkyl group of the (meth)acrylic acid alkyl ester may be linear or branched.

作為上述含有羥基之(甲基)丙烯酸酯之具體例,可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸3-羥基丁酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸5-羥基戊酯、(甲基)丙烯酸3-羥基-3-甲基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸7-羥基庚酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、(甲基)丙烯酸(4-羥基甲基環己基)甲酯等。該等可單獨使用或者將兩種以上組合使用。 Specific examples of the above-mentioned hydroxyl-containing (meth)acrylate include 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, and 2-hydroxypropyl (meth)acrylate. , 4-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 5-hydroxypentyl (meth)acrylate, (meth)acrylic acid 3-Hydroxy-3-methylbutyl ester, 6-hydroxyhexyl (meth)acrylate, 7-hydroxyheptyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10 (meth)acrylic acid -Hydroxydecyl ester, 12-hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl)methyl (meth)acrylate, etc. These can be used alone or in combination of two or more.

上述含有羥基之(甲基)丙烯酸酯之羥基烷基之碳數較佳為少於上述(甲基)丙烯酸烷基酯之烷基之碳數。含有羥基之(甲基)丙烯酸酯之 羥烷基之碳數較佳為1~8,更佳為2~4,進而較佳為2。藉由如此調整烷基之碳數,可提高與下述異氰酸酯系化合物之反應性,可獲得具有更優異之接著特性之接著劑。 The carbon number of the hydroxyalkyl group of the hydroxy-containing (meth)acrylate is preferably less than the carbon number of the alkyl group of the (meth)acrylate. Of (meth)acrylates containing hydroxyl groups The carbon number of the hydroxyalkyl group is preferably 1 to 8, more preferably 2 to 4, and still more preferably 2. By adjusting the carbon number of the alkyl group in this way, the reactivity with the following isocyanate-based compound can be improved, and an adhesive agent having more excellent adhesive properties can be obtained.

上述含有羥基之(甲基)丙烯酸酯之共聚量較佳為0.05~20莫耳%,更佳為0.10~8莫耳%,進而較佳為0.12~3莫耳%,更進而較佳為0.14~1.5莫耳%,最佳為0.14~0.25莫耳%。 The copolymerization amount of the above-mentioned hydroxyl group-containing (meth)acrylate is preferably 0.05 to 20 mol %, more preferably 0.10 to 8 mol %, further preferably 0.12 to 3 mol %, and still more preferably 0.14 ~1.5 mol%, the best is 0.14~0.25 mol%.

上述(甲基)丙烯酸系聚合物亦可藉由除了上述(甲基)丙烯酸烷基酯、含有羥基之(甲基)丙烯酸酯以外使其他成分共聚而獲得。作為其他成分,並無特別限制,可較佳使用(甲基)丙烯酸、(甲基)丙烯酸苄酯、(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基甲酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯醯胺、乙酸乙烯酯、(甲基)丙烯腈等。其他成分之共聚量相對於(甲基)丙烯酸烷基酯100質量份,較佳為100質量份以下,更佳為50質量份以下。 The above-mentioned (meth)acrylic polymer can also be obtained by copolymerizing other components in addition to the above-mentioned alkyl (meth)acrylate and hydroxyl-containing (meth)acrylate. The other components are not particularly limited, and (meth)acrylic acid, benzyl (meth)acrylate, methoxyethyl (meth)acrylate, ethoxymethyl (meth)acrylate, ( Phenoxyethyl methacrylate, (meth)acrylamide, vinyl acetate, (meth)acrylonitrile, etc. The copolymerization amount of other components is preferably 100 parts by mass or less, and more preferably 50 parts by mass or less with respect to 100 parts by mass of alkyl (meth)acrylate.

上述(甲基)丙烯酸系聚合物之重量平均分子量(Mw)以藉由利用四氫呋喃(THF)溶劑之凝膠滲透色譜(GPC)法測定之值計較佳為40萬以上,進而較佳為100萬~300萬,特別較佳為120萬~250萬。 The weight average molecular weight (Mw) of the (meth)acrylic polymer is preferably 400,000 or more, and more preferably 1,000,000, as measured by a gel permeation chromatography (GPC) method using tetrahydrofuran (THF) solvent. ~3 million, particularly preferably 1.2 million to 2.5 million.

作為上述異氰酸酯系化合物,可列舉:2,4-(或2,6-)甲苯二異氰酸酯、苯二亞甲基二異氰酸酯、1,3-雙(異氰酸酯基甲基)環己烷、六亞甲基二異氰酸酯、降冰片烯二異氰酸酯、氯苯二異氰酸酯、四亞甲基二異氰酸酯、異佛爾酮二異氰酸酯、二苯基甲烷二異氰酸酯、三羥甲基丙烷二甲苯二異氰酸酯、氫化二苯基甲烷二異氰酸酯等異氰酸酯單體;將該等異氰酸酯單體與三羥甲基丙烷等多元醇加成而獲得之加合型異氰酸酯化合物;異氰脲酸酯化合物;縮二脲型化合物;以及使任意適當之聚醚多元醇或聚酯多元醇、丙烯酸系多元醇、聚丁二烯多元醇、聚異戊二烯多元醇等進行加成反應而成之胺基甲酸酯預聚物型之異氰酸酯等,該等可單獨使用或者將兩種以上組合使用。 Examples of the isocyanate-based compounds include 2,4-(or 2,6-)toluene diisocyanate, xylylene diisocyanate, 1,3-bis(isocyanatomethyl)cyclohexane, and hexamethylene Diisocyanate, norbornene diisocyanate, chlorobenzene diisocyanate, tetramethylene diisocyanate, isophorone diisocyanate, diphenylmethane diisocyanate, trimethylolpropane xylene diisocyanate, hydrogenated diphenyl Isocyanate monomers such as methane diisocyanate; addition type isocyanate compounds obtained by adding these isocyanate monomers to polyols such as trimethylolpropane; isocyanurate compounds; biuret type compounds; and Urethane prepolymer type isocyanate obtained by addition reaction of suitable polyether polyol or polyester polyol, acrylic polyol, polybutadiene polyol, polyisoprene polyol, etc. Etc. These can be used alone or in combination of two or more.

作為上述異氰酸酯系化合物,可直接使用市售品。作為市售之異氰酸酯系化合物,可列舉例如:三井武田化學股份有限公司製造之Takenate系列(商品名「D-110N、500、600、700」等)、日本聚胺酯工業股份有限公司製造之Coronate系列(商品名「L、MR、EH、HL」等)。 As the isocyanate-based compound, a commercially available product can be used as it is. Examples of commercially available isocyanate-based compounds include the Takenate series (trade names "D-110N, 500, 600, 700", etc.) manufactured by Mitsui Takeda Chemical Co., Ltd. and the Coronate series (manufactured by Japan Polyurethane Industry Co., Ltd.) Trade name "L, MR, EH, HL", etc.).

作為上述環氧化合物,可列舉例如:N,N,N',N'-四縮水甘油基間苯二甲胺(商品名TETRAD-X,三菱瓦斯化學公司製造)、或1,3-雙(N,N-縮水甘油基胺基甲基)環己烷(商品名TETRAD-C,三菱瓦斯化學公司製造)等。 Examples of the epoxy compound include N,N,N',N'-tetraglycidyl m-xylylenediamine (trade name TETRAD-X, manufactured by Mitsubishi Gas Chemical Co., Ltd.), or 1,3-bis( N,N-glycidylaminomethyl)cyclohexane (trade name TETRAD-C, manufactured by Mitsubishi Gas Chemical Company), etc.

作為上述三聚氰胺系樹脂,可列舉六羥甲基三聚氰胺等。作為氮丙啶衍生物,可列舉例如作為市售品之商品名HDU、TAZM、TAZO(以上由相互藥工公司製造)等。 Examples of the melamine-based resin include hexamethylolmelamine and the like. Examples of the aziridine derivatives include commercially available product names such as HDU, TAZM, and TAZO (manufactured by Mutual Pharmaceutical Co., Ltd.).

作為上述金屬螯合物,可列舉鋁、鐵、錫、鈦、鎳等作為金屬成分,可列舉乙炔、乙醯乙酸甲酯、乳酸乙酯等作為螯合成分。 Examples of the metal chelate compound include aluminum, iron, tin, titanium, nickel, and the like as metal components, and acetylene, methyl acetoacetate, and ethyl lactate, and the like as chelate components.

本發明中使用之交聯劑之含量,例如,相對於上述(甲基)丙烯酸系聚合物100質量份,較佳為含有0.1~10質量份,更佳為含有0.2~4質量份,進而更佳為含有0.3~1.5質量份,最佳為含有0.4~0.9質量份。藉由設定為此種含量,即便於苛刻之(高溫、高濕)環境下,亦可獲得良好之密著性。另外,該等交聯劑可單獨使用,亦可將兩種以上混合使用。 The content of the crosslinking agent used in the present invention is, for example, preferably 0.1 to 10 parts by mass, more preferably 0.2 to 4 parts by mass, and more preferably 100 parts by mass of the (meth)acrylic polymer. Preferably, it contains 0.3 to 1.5 parts by mass, and most preferably 0.4 to 0.9 parts by mass. By setting to this content, even under harsh (high temperature, high humidity) environment, good adhesion can be obtained. In addition, these crosslinking agents may be used alone or in combination of two or more.

上述丙烯酸系接著劑(接著劑組合物)較佳為進而含有矽烷偶合劑或輻射硬化性成分。作為矽烷偶合劑,可選擇例如具有任意適當之官能基者。作為上述官能基,可列舉:乙烯基、環氧基、甲基丙烯醯氧基、胺基、巰基、丙烯醯氧基、乙醯乙醯基、異氰酸酯基、苯乙烯基、多硫基等。作為上述矽烷偶合劑之具體例,可列舉:乙烯基三甲氧基矽烷、γ-環氧丙氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基三乙 氧基矽烷、對苯乙烯基三甲氧基矽烷、γ-甲基丙烯醯氧基丙基三甲氧基矽烷、γ-丙烯醯氧基丙基三甲氧基矽烷、N-β(胺基乙基)γ-胺基丙基三甲氧基矽烷、γ-胺基丙基甲氧基矽烷、γ-巰基丙基甲基二甲氧基矽烷、雙(三乙氧基甲矽烷基丙基)四硫化物、γ-異氰酸酯基丙基三甲氧基矽烷等。該等之中,較佳為具有環氧基之矽烷偶合劑,進而較佳為γ-環氧丙氧基丙基三甲氧基矽烷。 The acrylic adhesive (adhesive composition) preferably further contains a silane coupling agent or a radiation hardening component. As the silane coupling agent, for example, those having any appropriate functional group can be selected. Examples of the functional groups include vinyl groups, epoxy groups, methacryl oxy groups, amine groups, mercapto groups, propenyl oxy groups, acetyl acetyl groups, isocyanate groups, styryl groups, and polysulfide groups. Specific examples of the above-mentioned silane coupling agent include vinyl trimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-glycidoxypropyltriethyl. Oxysilane, p-styryltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-acryloxypropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, γ-aminopropylmethoxysilane, γ-mercaptopropylmethyldimethoxysilane, bis(triethoxysilylpropyl) tetrasulfide , Γ-isocyanate propyl trimethoxysilane, etc. Among these, a silane coupling agent having an epoxy group is preferable, and γ-glycidoxypropyltrimethoxysilane is more preferable.

作為上述矽烷偶合劑,可直接使用市售品。作為市售品,可列舉例如:信越有機矽股份有限公司製造之KA系列(商品名「KA-1003」等)、KBM系列(商品名「KBM-303、KBM-403、KBM-503」等)及KBE系列(商品名「KBE-402、KBE-502、KBE-903」等)、東麗股份有限公司製造之SH系列(商品名「SH6020、SH6040、SH6062」等)及SZ系列(商品名「SZ6030、SZ6032、SZ6300」等)。 As the silane coupling agent, commercially available products can be used directly. Examples of commercially available products include KA series (trade name "KA-1003", etc.) and KBM series (trade name "KBM-303, KBM-403, KBM-503", etc. manufactured by Shin-Etsu Silicone Co., Ltd.) And KBE series (trade names "KBE-402, KBE-502, KBE-903", etc.), SH series (trade names "SH6020, SH6040, SH6062", etc.) manufactured by Toray Co., Ltd. and SZ series (trade name " SZ6030, SZ6032, SZ6300, etc.).

上述矽烷偶合劑之含量相對於(甲基)丙烯酸系聚合物100質量份,較佳為0.001~2.0質量份,更佳為0.005~2.0質量份,進而較佳為0.01~1.0質量份,特別較佳為0.02~0.5質量份。藉由設定為此種含量,即便於苛刻之(高溫、高濕)環境下,亦可抑制剝離或氣泡之產生。 The content of the above-mentioned silane coupling agent is preferably 0.001 to 2.0 parts by mass, more preferably 0.005 to 2.0 parts by mass, further preferably 0.01 to 1.0 parts by mass, particularly preferably 100 parts by mass of the (meth)acrylic polymer. Preferably it is 0.02~0.5 parts by mass. By setting to such a content, even under severe (high temperature, high humidity) environment, the generation of peeling or bubbles can be suppressed.

作為上述輻射硬化性成分,可使用利用輻射進行自由基聚合或陽離子聚合之單體及/或低聚物成分。作為利用輻射進行自由基聚合之單體成分,可列舉具有(甲基)丙烯醯基、乙烯基等不飽和雙鍵之單體,特別是就反應性優異之優點而言,較佳為使用具有(甲基)丙烯醯基之單體。作為具有(甲基)丙烯醯基之單體成分之具體例,可列舉:(甲基)丙烯酸烯丙酯、己內酯(甲基)丙烯酸酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸N,N-二乙基胺基乙酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸十七氟癸酯、(甲基)丙烯酸縮水甘油酯、己內酯改性(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸異冰片酯、(甲基)丙烯酸嗎啉 酯、(甲基)丙烯酸苯氧基乙酯、三丙二醇二(甲基)丙烯酸酯、雙酚A二縮水甘油基醚二(甲基)丙烯酸酯、羥基新戊酸新戊二醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、三羥甲基丙烷乙氧基三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、己內酯改性二季戊四醇六(甲基)丙烯酸酯等。 As the radiation-hardenable component, monomers and/or oligomer components that undergo radical polymerization or cationic polymerization by radiation can be used. Examples of monomer components for radical polymerization using radiation include monomers having unsaturated double bonds such as (meth)acryloyl groups and vinyl groups, and in particular, it is preferred to use a monomer having an excellent reactivity. (Meth) acrylic monomer. Specific examples of the monomer component having a (meth)acryloyl group include allyl (meth)acrylate, caprolactone (meth)acrylate, cyclohexyl (meth)acrylate, and (meth) Group) N,N-diethylaminoethyl acrylate, 2-ethylhexyl (meth)acrylate, heptafluorodecyl (meth)acrylate, glycidyl (meth)acrylate, caprolactone Modified 2-hydroxyethyl (meth)acrylate, isobornyl (meth)acrylate, morpholine (meth)acrylate Ester, phenoxyethyl (meth)acrylate, tripropylene glycol di(meth)acrylate, bisphenol A diglycidyl ether di(meth)acrylate, hydroxypivalic acid neopentyl glycol di(meth) Base) acrylate, trimethylolpropane tri(meth)acrylate, trimethylolpropane ethoxytri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate Ester, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, caprolactone modified dipentaerythritol hexa(meth)acrylate, etc.

作為利用輻射進行自由基聚合之低聚物成分,可使用於聚酯、環氧樹脂、胺基甲酸酯等之骨架上加成兩個以上(甲基)丙烯醯基、乙烯基等不飽和雙鍵作為與單體成分同樣之官能基之聚酯(甲基)丙烯酸酯、環氧(甲基)丙烯酸酯、胺基甲酸酯(甲基)丙烯酸酯等。 As an oligomer component for radical polymerization by radiation, it can be used to add more than two (meth)acryloyl, vinyl and other unsaturation to the skeleton of polyester, epoxy resin, urethane, etc. The double bond is a polyester (meth)acrylate, epoxy (meth)acrylate, urethane (meth)acrylate, etc., which have the same functional group as the monomer component.

聚酯(甲基)丙烯酸酯係使(甲基)丙烯酸與由多元醇與多元羧酸獲得之末端羥基之聚酯反應而獲得者,作為具體例,可列舉東亞合成股份有限公司製造之ARONIX M-6000、7000、8000、9000系列之聚酯丙烯酸酯。 The polyester (meth)acrylate is obtained by reacting (meth)acrylic acid with a polyester having a terminal hydroxyl group obtained from a polyhydric alcohol and a polycarboxylic acid. Specific examples include ARONIX M manufactured by Toya Synthetic Co., Ltd. -6000,7000,8000,9000 series polyester acrylate.

環氧(甲基)丙烯酸酯係藉由使(甲基)丙烯酸與環氧樹脂反應而獲得,作為具體例,可列舉昭和高分子股份有限公司製造之Ripoxy SP、VR系列或共榮社化學股份有限公司製造之EPOXYESTER系列之環氧丙烯酸酯。 Epoxy (meth)acrylate is obtained by reacting (meth)acrylic acid with an epoxy resin. Specific examples include Ripoxy SP, VR series manufactured by Showa Polymer Co., Ltd. or Kyoeisha Chemical Co., Ltd. Epoxy Yester series epoxy acrylate manufactured by Co., Ltd.

胺基甲酸酯(甲基)丙烯酸酯係藉由使多元醇、異氰酸酯、(甲基)丙烯酸羥基酯反應而獲得,作為具體例,可列舉根上工業股份有限公司製造之Art Resin UN系列、新中村化學工業股份有限公司製造之NK Oligo U系列、日本合成化學工業股份有限公司製造之SHIKOH UV系列之胺基甲酸酯丙烯酸酯。 The urethane (meth)acrylate is obtained by reacting a polyol, isocyanate, and hydroxy (meth)acrylate. Specific examples include Art Resin UN series manufactured by Genshang Industry Co., Ltd. NK Oligo U series manufactured by Nakamura Chemical Industry Co., Ltd. and SHIKOH UV series urethane acrylate manufactured by Japan Synthetic Chemical Industry Co., Ltd.

作為進行陽離子聚合之單體及/或低聚物成分,使用具有陽離子聚合性官能基例如環氧基、羥基、乙烯基醚基、環硫基、伸乙基亞胺基之化合物,特別是就反應性優異之優點而言,使用具有環氧基之化 合物。作為具有環氧基之化合物,可列舉藉由多元酚系化合物或多元醇與表氯醇之反應製造之縮水甘油醚型環氧樹脂。具體而言,可列舉雙酚A或其環氧烷加成物之二縮水甘油基醚、雙酚F或其環氧烷加成物之二縮水甘油基醚、氫化雙酚A或其環氧烷加成物之二縮水甘油基醚、乙二醇二縮水甘油基醚、丙二醇二縮水甘油基醚、新戊二醇二縮水甘油基醚、丁二醇二縮水甘油基醚、己二醇二縮水甘油基醚、環己烷二甲醇二縮水甘油基醚、聚丙二醇二縮水甘油基醚、三羥甲基丙烷聚縮水甘油基醚、季戊四醇聚縮水甘油基醚、山梨醇聚縮水甘油基醚、間苯二酚二縮水甘油基醚等。 As the monomer and/or oligomer component for cationic polymerization, compounds having cationic polymerizable functional groups such as epoxy group, hydroxyl group, vinyl ether group, episulfide group, and ethylidene group are used, especially For the advantage of excellent reactivity, use the epoxy Compound. As the compound having an epoxy group, a glycidyl ether type epoxy resin produced by the reaction of a polyhydric phenol compound or a polyhydric alcohol and epichlorohydrin can be mentioned. Specifically, diglycidyl ether of bisphenol A or its alkylene oxide adduct, diglycidyl ether of bisphenol F or its alkylene oxide adduct, hydrogenated bisphenol A or its epoxy Alkyl adducts diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, butylene glycol diglycidyl ether, hexanediol di Glycidyl ether, cyclohexane dimethanol diglycidyl ether, polypropylene glycol diglycidyl ether, trimethylolpropane polyglycidyl ether, pentaerythritol polyglycidyl ether, sorbitol polyglycidyl ether, Resorcinol diglycidyl ether, etc.

該等(甲基)丙烯酸系聚合物與輻射硬化性成分適當組合使用,就若相溶性(混合性)較差則難以取得輻射硬化後之接著性與儲存彈性模數之平衡、硬化後之透光性變差等理由而言,需要適當選擇相溶性較佳之組合。特別是,於要求透光性之用途中,進行調節使硬化後之全光線透光率為85%以上(較佳為90%以上)、霧度值為10%以下(較佳為5%以下)。另外,輻射硬化性成分之調配量根據輻射硬化後之儲存彈性模數及接著性進行適當調節,一般而言,以相對於黏著性聚合物100質量份為10~200質量份、較佳為30~150質量份之比例使用。 When these (meth)acrylic polymers are properly combined with radiation-curable components, if the compatibility (mixability) is poor, it is difficult to obtain the balance between the adhesion after radiation curing and the storage elastic modulus, and the light transmission after curing For reasons such as poor performance, it is necessary to appropriately select a combination with better compatibility. In particular, in applications requiring light transmittance, adjustment is made so that the total light transmittance after hardening is 85% or more (preferably 90% or more), and the haze value is 10% or less (preferably 5% or less ). In addition, the compounding amount of the radiation hardening component is appropriately adjusted according to the storage elastic modulus and adhesiveness after radiation hardening. Generally speaking, it is 10 to 200 parts by mass relative to 100 parts by mass of the adhesive polymer, preferably 30 ~150 parts by mass.

多官能單體之使用量根據與(甲基)丙烯酸系聚合物之平衡以及作為黏著片材之使用用途進行適當選擇。為了藉由丙烯酸系黏著劑之凝聚力獲得充分之耐熱性,一般相對於(甲基)丙烯酸系聚合物100質量份較佳為以0.1~30質量份進行調配。另外,就柔軟性、接著性之觀點而言,相對於(甲基)丙烯酸系聚合物100質量份,更佳為以10質量份以下進行調配。 The use amount of the multifunctional monomer is appropriately selected according to the balance with the (meth)acrylic polymer and the use as the adhesive sheet. In order to obtain sufficient heat resistance by the cohesive force of the acrylic adhesive, it is generally preferably 0.1 to 30 parts by mass relative to 100 parts by mass of the (meth)acrylic polymer. In addition, from the viewpoint of flexibility and adhesiveness, it is more preferably 10 parts by mass or less relative to 100 parts by mass of the (meth)acrylic polymer.

作為輻射,可列舉例如紫外線、激光射線、α射線、β射線、γ射線、x射線、電子束等,就控制性及操作性良好、成本之方面而言,較佳為使用紫外線。更佳為使用波長200~400nm之紫外線。紫外線 可使用高壓水銀燈、微波激勵燈、化學燈等適當之光源進行照射。再者,於使用紫外線作為輻射之情形時,於丙烯酸系黏著劑中添加光聚合起始劑。 As the radiation, for example, ultraviolet rays, laser rays, α rays, β rays, γ rays, x rays, electron beams, etc. may be mentioned, and it is preferable to use ultraviolet rays in terms of good controllability and operability, and cost. It is more preferable to use ultraviolet rays with a wavelength of 200 to 400 nm. Ultraviolet Appropriate light sources such as high-pressure mercury lamps, microwave excitation lamps, and chemical lamps can be used for irradiation. Furthermore, when using ultraviolet rays as radiation, a photopolymerization initiator is added to the acrylic adhesive.

作為光聚合起始劑,只要係根據輻射反應性成分之種類,藉由照射能夠作為其聚合反應之引發物之適當波長之紫外線而生成自由基或陽離子之物質即可,作為光自由基聚合起始劑,可列舉例如:苯偶姻、苯偶姻甲醚、苯偶姻乙醚、鄰苯甲醯基苯甲酸甲酯、苯偶姻乙醚、苯偶姻異丙醚、α-甲基苯偶姻等苯偶姻類、苯偶醯二甲基縮酮、三氯苯乙酮、2,2-二乙氧基苯乙酮、1-羥基環己基苯基酮等苯乙酮類、2-羥基-2-甲基苯丙酮、2-羥基-4'-異丙基-2-甲基苯丙酮等苯丙酮類、二苯甲酮、甲基二苯甲酮、對氯二苯甲酮、對二甲基胺基二苯甲酮等二苯甲酮類、2-氯噻噸酮、2-乙基噻噸酮、2-異丙基噻噸酮等噻噸酮類、雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦、2,4,6-三甲基苯甲醯基二苯基氧化膦、(2,4,6-三甲基苯甲醯基)-(乙氧基)-苯基氧化膦等醯基氧化膦類、苯偶醯、二苯并環庚烯酮、α-醯基肟酯等。作為光陽離子聚合起始劑,可列舉例如:芳香族重氮鹽、芳香族碘鎓鹽、芳香族鋶鹽等鎓鹽、或鐵-芳烴錯合物、二茂鈦錯合物、芳基矽醇鋁錯合物等有機金屬錯合物類、硝基苄基酯、磺酸衍生物、磷酸酯、磺酸衍生物、磷酸酯、酚磺酸酯、重氮萘醌、N-羥基醯亞胺磺酸酯等。 As the photopolymerization initiator, as long as it is a substance that generates radicals or cations by irradiating ultraviolet light of an appropriate wavelength that can be used as an initiator of the polymerization reaction according to the type of radiation-reactive component, it can be used as a photoradical polymerization. The starting agent may, for example, be benzoin, benzoin methyl ether, benzoin ethyl ether, methyl o-benzoyl benzoate, benzoin ethyl ether, benzoin isopropyl ether, α-methyl benzoin Acetophenones such as benzoin, benzoyl dimethyl ketal, trichloroacetophenone, 2,2-diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2- Phenylacetones such as hydroxy-2-methylbenzeneacetone, 2-hydroxy-4'-isopropyl-2-methylbenzeneacetone, benzophenone, methylbenzophenone, p-chlorobenzophenone, Benzophenones such as p-dimethylaminobenzophenone, thioxanthones such as 2-chlorothioxanthone, 2-ethylthioxanthone, 2-isopropylthioxanthone, bis(2, 4,6-trimethylbenzyl)-phenylphosphine oxide, 2,4,6-trimethylbenzyldiphenylphosphine oxide, (2,4,6-trimethylbenzoyl) Yl)-(ethoxy)-phenylphosphine oxide and other amide phosphine oxides, benzoyl amide, dibenzocycloheptenone, α-acyl oxime ester and the like. Examples of photocationic polymerization initiators include, for example, onium salts such as aromatic diazonium salts, aromatic iodonium salts, and aromatic cerium salts, or iron-aromatic hydrocarbon complexes, titanocene complexes, and aryl silicon Organometallic complexes such as aluminum alcohol complexes, nitrobenzyl esters, sulfonic acid derivatives, phosphate esters, sulfonic acid derivatives, phosphate esters, phenol sulfonate esters, diazonaphthoquinone, N-hydroxyacrylic acid Sulfamate, etc.

關於上述光聚合起始劑,亦可併用兩種以上。光聚合起始劑較佳為相對於(甲基)丙烯酸系聚合物100質量份,通常於0.1~10質量份、較佳為0.2~7質量份之範圍內進行調配。 About the said photoinitiator, you may use 2 or more types together. The photopolymerization initiator is preferably prepared in the range of 0.1 to 10 parts by mass, preferably 0.2 to 7 parts by mass relative to 100 parts by mass of the (meth)acrylic polymer.

另外,亦可併用胺類等光聚合起始助劑。作為上述光聚合起始聚合助劑,可列舉:苯甲酸2-二甲基胺基乙酯、二甲基胺基苯乙酮、對二甲基胺基苯甲酸乙酯、對二甲基胺基苯甲酸異戊酯等。關於上述光聚合起始助劑,亦可併用兩種以上。聚合起始助劑較佳為相對於 (甲基)丙烯酸系聚合物100質量份於0.05~10質量份、進而於0.1~7質量份之範圍內進行調配。 In addition, photopolymerization initiation aids such as amines may be used in combination. Examples of the photopolymerization initiation polymerization aid include 2-dimethylaminoethyl benzoate, dimethylaminoacetophenone, ethyl p-dimethylaminobenzoate, and p-dimethylamine. Isoamyl benzoate and so on. With regard to the aforementioned photopolymerization initiation aid, two or more kinds may be used in combination. The polymerization initiation aid is preferably relative to 100 parts by mass of (meth)acrylic polymer is prepared in the range of 0.05 to 10 parts by mass, and further 0.1 to 7 parts by mass.

<第一樹脂層與第二樹脂層之積層方法> <Lamination method of first resin layer and second resin layer>

作為第一樹脂層與第二樹脂層之積層方法,可採用任意適當之方法。作為較佳之實施形態,可採用於一個樹脂層上形成接著層,於上述接著層上積層另一個樹脂層之方法。另外,作為接著層之形成方法,可採用任意適當之方法。作為具體例,接著劑可藉由於樹脂層上塗佈上述接著劑(接著劑組合物溶液)並加熱而形成。塗佈時,上述丙烯酸系接著劑之聚合物濃度較佳為利用溶劑(例如乙酸乙酯、甲苯)適當進行調整。加熱溫度較佳為20℃~200℃,更佳為50℃~170℃。 As a method of laminating the first resin layer and the second resin layer, any appropriate method can be adopted. As a preferred embodiment, a method of forming an adhesive layer on one resin layer and stacking another resin layer on the adhesive layer can be used. In addition, as a method of forming the adhesive layer, any appropriate method can be adopted. As a specific example, the adhesive can be formed by applying the above adhesive (adhesive composition solution) on the resin layer and heating. At the time of coating, the polymer concentration of the acrylic adhesive is preferably adjusted appropriately using a solvent (for example, ethyl acetate or toluene). The heating temperature is preferably 20°C to 200°C, and more preferably 50°C to 170°C.

上述樹脂膜(依序具有第一樹脂層、接著層及第二樹脂層之構成)之厚度較佳為11μm~230μm,更佳為50μm~110μm。 The thickness of the resin film (composed of a first resin layer, an adhesive layer and a second resin layer in sequence) is preferably 11 μm to 230 μm, more preferably 50 μm to 110 μm.

<黏著劑層> <adhesive layer>

本發明之黏著片材具有上述黏著劑層,上述黏著劑層係由黏著劑組合物形成者,作為上述黏著劑組合物,只要為具有黏著性者,則可無特別限制地使用。可使用例如:丙烯酸系黏著劑、胺基甲酸酯系黏著劑、聚酯系黏著劑、合成橡膠系黏著劑、天然橡膠系黏著劑、聚矽氧系黏著劑等,其中,更佳為丙烯酸系黏著劑及/或胺基甲酸酯系黏著劑,特別較佳為使用利用(甲基)丙烯酸系聚合物之丙烯酸系黏著劑。 The adhesive sheet of the present invention has the above-mentioned adhesive layer, and the above-mentioned adhesive layer is formed of an adhesive composition. As the above-mentioned adhesive composition, as long as it has adhesiveness, it can be used without particular limitation. For example, acrylic adhesives, urethane adhesives, polyester adhesives, synthetic rubber adhesives, natural rubber adhesives, polysiloxane adhesives, etc., among which acrylic acid is more preferred It is particularly preferable to use an acrylic adhesive using a (meth)acrylic polymer as the adhesive and/or urethane adhesive.

於上述黏著劑層使用丙烯酸系黏著劑之情形時,構成上述丙烯酸系黏著劑之(甲基)丙烯酸系聚合物可使用具有碳數為1~14之烷基之(甲基)丙烯酸系單體作為構成該聚合物之原料單體。作為上述(甲基)丙烯酸系單體,可使用一種或兩種以上作為主要成分。藉由使用上述具有碳數為1~14之烷基之(甲基)丙烯酸系單體,容易將對被接著體(被保護物)之黏著力控制較低,可獲得輕剝離性、或再剝離性優 異之黏著片材。再者,本發明中之(甲基)丙烯酸系聚合物係指丙烯酸系聚合物及/或甲基丙烯酸系聚合物,另外,(甲基)丙烯酸酯係指丙烯酸酯及/或甲基丙烯酸酯。 When an acrylic adhesive is used for the adhesive layer, the (meth)acrylic polymer constituting the acrylic adhesive may use a (meth)acrylic monomer having an alkyl group having 1 to 14 carbon atoms As a raw material monomer constituting the polymer. As the above-mentioned (meth)acrylic monomer, one kind or two or more kinds can be used as a main component. By using the above-mentioned (meth)acrylic monomer having an alkyl group having 1 to 14 carbon atoms, it is easy to control the adhesion to the adherend (protected object) to be low, and light peelability or Excellent stripping Different sticky sheets. Furthermore, (meth)acrylic polymer in the present invention refers to acrylic polymer and/or methacrylic polymer, and (meth)acrylate refers to acrylate and/or methacrylate .

作為上述具有碳數為1~14之烷基之(甲基)丙烯酸系單體之具體例,可列舉例如:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸正癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸正十二烷基酯、(甲基)丙烯酸正十三烷基酯、(甲基)丙烯酸正十四烷基酯等。 Specific examples of the (meth)acrylic monomer having an alkyl group having 1 to 14 carbon atoms include methyl (meth)acrylate, ethyl (meth)acrylate, and (meth)acrylic acid. N-butyl ester, second butyl (meth)acrylate, third butyl (meth)acrylate, isobutyl (meth)acrylate, hexyl (meth)acrylate, 2-ethyl (meth)acrylate Hexyl ester, n-octyl (meth) acrylate, isooctyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, n-decyl (meth) acrylate, (A Group) isodecyl acrylate, n-dodecyl (meth) acrylate, n-tridecyl (meth) acrylate, n-tetradecyl (meth) acrylate, etc.

其中,於使用本發明之黏著片材作為表面保護膜之情形時,可列舉(甲基)丙烯酸己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸正癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸正十二烷基酯、(甲基)丙烯酸正十三烷基酯、(甲基)丙烯酸正十四烷基酯等具有碳數6~14之烷基之(甲基)丙烯酸系單體作為較佳者。特別是,藉由使用具有碳數6~14之烷基之(甲基)丙烯酸系單體,容易將對被接著體之黏著力控制較低,成為再剝離性優異者。 Among them, when the adhesive sheet of the present invention is used as a surface protective film, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, ( Isooctyl meth)acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, n-decyl (meth) acrylate, isodecyl (meth) acrylate, n-(meth) acrylate (Meth)acrylic monomers such as dodecyl ester, n-tridecyl (meth)acrylate, n-tetradecyl (meth)acrylate, etc. having a C 6-14 alkyl group are used as The best. In particular, by using a (meth)acrylic monomer having an alkyl group having 6 to 14 carbon atoms, it is easy to control the adhesion to the adherend to be low, and it becomes excellent in removability.

特別是,相對於構成上述(甲基)丙烯酸系聚合物之單體成分總量100質量%,較佳為含有50質量%以上、更佳為60質量%以上、進而較佳為70質量%以上、最佳為80~93質量%之具有碳數為1~14之烷基之(甲基)丙烯酸系單體。若未達50質量%,則黏著劑組合物之適度之潤濕性、或黏著劑層之凝聚力變差,因此不佳。 In particular, it is preferably 50% by mass or more, more preferably 60% by mass or more, and still more preferably 70% by mass or more with respect to 100% by mass of the total monomer components constituting the (meth)acrylic polymer. 3. The best is 80~93% by mass of (meth)acrylic monomers with a C1-C14 alkyl group. If it is less than 50% by mass, the moderate wettability of the adhesive composition or the cohesive force of the adhesive layer becomes poor, which is not good.

另外,本發明之黏著劑組合物中,較佳為上述(甲基)丙烯酸系聚合物含有具有羥基之(甲基)丙烯酸系單體作為原料單體。作為上述具 有羥基之(甲基)丙烯酸系單體,可使用一種或兩種以上作為主要成分。 In addition, in the adhesive composition of the present invention, it is preferable that the (meth)acrylic polymer contains a (meth)acrylic monomer having a hydroxyl group as a raw material monomer. As the above One or more than two (meth)acrylic monomers with hydroxyl groups can be used as the main component.

藉由使用上述具有羥基之(甲基)丙烯酸系單體,容易控制黏著劑組合物之交聯等,進而容易控制由流動造成之潤濕性之改善及剝離中黏著力之降低之平衡。另外,與一般可作為交聯部位起作用之羧基或磺酸酯基等不同,羥基與作為防靜電成分(防靜電劑)之離子性化合物、或具有氧伸烷基鏈之有機聚矽氧烷具有適度之相互作用,因此就防靜電性及拾取性之方面而言,亦可較佳使用。 By using the above-mentioned (meth)acrylic monomer having a hydroxyl group, it is easy to control the crosslinking of the adhesive composition, etc., and thus it is easy to control the balance between the improvement in wettability due to flow and the reduction in adhesion in peeling. In addition, unlike carboxyl groups or sulfonate groups that can generally function as crosslinking sites, hydroxyl groups and ionic compounds as antistatic components (antistatic agents), or organic polysiloxanes with oxyalkylene chains It has moderate interaction, so it can also be used preferably in terms of antistatic properties and pickup properties.

作為上述具有羥基之(甲基)丙烯酸系單體,可列舉例如:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、(甲基)丙烯酸(4-羥基甲基環己基)甲酯、N-羥甲基(甲基)丙烯醯胺等。特別是,藉由使用烷基之碳數為4以上之具有羥基之(甲基)丙烯酸系單體,高速剝離時之輕剝離化變得容易,因此較佳。 Examples of the (meth)acrylic monomer having a hydroxyl group include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate. , 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (meth)acrylic acid (4-hydroxymethylcyclohexyl) methyl ester, N-methylol (meth) acrylamide, etc. In particular, the use of a (meth)acrylic monomer having a hydroxyl group with an alkyl group having a carbon number of 4 or more facilitates light peeling during high-speed peeling, which is preferable.

相對於上述具有碳數為1~14之烷基之(甲基)丙烯酸系單體100質量份,較佳為含有15質量份以下之上述具有羥基之(甲基)丙烯酸系單體,更佳為1~13質量份,進而較佳為2~11質量份,最佳為3.5~10質量份。若於上述範圍內,則容易控制黏著劑組合物之潤濕性與所獲得之黏著劑層之凝聚力之平衡,因此較佳。另外,特別是,藉由調配5質量份以上,容易獲得蠕變特性較佳之黏著劑組合物。 With respect to 100 parts by mass of the (meth)acrylic monomer having an alkyl group having 1 to 14 carbon atoms, it is preferable to contain 15 parts by mass or less of the (meth)acrylic monomer having the hydroxyl group, more preferably It is 1-13 parts by mass, more preferably 2-11 parts by mass, and most preferably 3.5-10 parts by mass. Within the above range, it is easy to control the balance between the wettability of the adhesive composition and the cohesive force of the obtained adhesive layer, which is preferable. In addition, in particular, by blending 5 parts by mass or more, it is easy to obtain an adhesive composition with better creep properties.

另外,作為其他聚合性單體成分,就容易取得黏著性能之平衡之理由而言,可於不損害本發明效果之範圍內使用用以調整(甲基)丙烯酸系聚合物之玻璃轉移溫度或剝離性之聚合性單體以使Tg為0℃以下(通常為-100℃以上)。 In addition, as other polymerizable monomer components, it is possible to adjust the glass transition temperature or peeling of the (meth)acrylic polymer within a range that does not impair the effects of the present invention because it is easy to achieve a balance of adhesive properties. Polymerizable monomer so that Tg is 0°C or lower (usually -100°C or higher).

作為上述(甲基)丙烯酸系聚合物中使用之除上述具有碳數為1~ 14之烷基之(甲基)丙烯酸系單體以及上述具有羥基之(甲基)丙烯酸系單體以外之其他聚合性單體,可使用具有羧基之(甲基)丙烯酸系單體。 As the (meth)acrylic polymer used in addition to the above has a carbon number of 1 ~ The (meth)acrylic monomer of the alkyl group of 14 and other polymerizable monomers other than the above-mentioned (meth)acrylic monomer having a hydroxyl group, a (meth)acrylic monomer having a carboxyl group can be used.

作為上述具有羧基之(甲基)丙烯酸系單體,可列舉例如:(甲基)丙烯酸、(甲基)丙烯酸羧基乙酯、(甲基)丙烯酸羧基戊酯、六氫鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯、六氫鄰苯二甲酸2-(甲基)丙烯醯氧基丙酯、鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯、琥珀酸2-(甲基)丙烯醯氧基乙酯、馬來酸2-(甲基)丙烯醯氧基乙酯、羧基聚己內酯單(甲基)丙烯酸酯、四氫鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯等。 Examples of the (meth)acrylic monomer having a carboxyl group include (meth)acrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, and hexahydrophthalic acid 2- (Meth)acryloyloxyethyl, hexahydrophthalic acid 2-(meth)acryloyloxypropyl ester, phthalic acid 2-(meth)acryloyloxyethyl, succinic acid 2 -(Meth)acrylic acid ethyl ester, maleic acid 2-(meth)acrylic acid ethyl ester, carboxypolycaprolactone mono(meth)acrylate, tetrahydrophthalic acid 2-( Methyl) propylene acetylacetate and so on.

上述具有羧基之(甲基)丙烯酸系單體,相對於上述具有碳數為1~14之烷基之(甲基)丙烯酸系單體100質量份,較佳為5質量份以下,更佳為1質量份以下,進而較佳為未達0.2質量份,最佳為0.01質量份以上且未達0.1質量份。特別是,藉由將具有羧基之(甲基)丙烯酸系單體與具有羥基之(甲基)丙烯酸系單體併用使用,有時就獲得蠕變特性優異之黏著劑組合物之方面而言較佳使用。另外,若超過5質量份,則相互作用較大之羧基之酸官能基大量存在,於調配離子性化合物作為防靜電成分之情形時,羧基等酸官能基與上述離子性化合物相互作用,由此有妨礙離子傳導,導電效率降低,無法獲得充分之防靜電性之虞,因此不佳。另外,特別是於實現兼顧蠕變特性及輕剝離性之情形時,藉由含有5質量份以上之上述具有羥基之(甲基)丙烯酸系單體並且含有0.01質量份以上且未達0.1質量份之上述具有羧基之(甲基)丙烯酸系單體,可實現兼顧特性,因此較佳。 The (meth)acrylic monomer having a carboxyl group is preferably 5 parts by mass or less relative to 100 parts by mass of the (meth)acrylic monomer having an alkyl group having 1 to 14 carbon atoms, and more preferably 1 part by mass or less, more preferably less than 0.2 part by mass, and most preferably 0.01 part by mass or more and less than 0.1 part by mass. In particular, when a (meth)acrylic monomer having a carboxyl group and a (meth)acrylic monomer having a hydroxyl group are used in combination, it may be more difficult to obtain an adhesive composition having excellent creep characteristics Good use. In addition, if it exceeds 5 parts by mass, a large amount of acid functional groups of the carboxyl group having a large interaction exist. When an ionic compound is formulated as an antistatic component, the acid functional group such as a carboxyl group interacts with the ionic compound, thereby There is a risk of impeding ion conduction, reducing the conductivity efficiency, and failing to obtain sufficient antistatic properties, which is not good. In addition, especially in the case of achieving both creep characteristics and light peelability, by containing 5 parts by mass or more of the above-mentioned (meth)acrylic monomer having a hydroxyl group and containing 0.01 parts by mass or more and less than 0.1 parts by mass The above-mentioned (meth)acrylic monomer having a carboxyl group can achieve both characteristics and is therefore preferable.

另外,作為上述(甲基)丙烯酸系聚合物中使用之除上述具有碳數為1~14之烷基之(甲基)丙烯酸系單體、具有羥基之(甲基)丙烯酸系單體以及具有羧基之(甲基)丙烯酸系單體以外之其他聚合性單體,只要於不損害本發明特性之範圍內,則可無特別限制地使用。例如,可適 當使用含氰基單體、乙烯基酯單體、芳香族乙烯基單體等提高凝聚力、耐熱性之成分、或含醯胺基單體、含醯亞胺基單體、含胺基單體、含環氧基單體、N-丙烯醯嗎啉、乙烯基醚單體等提高黏著力或具有作為交聯化基點起作用之官能基之成分。該等聚合性單體可單獨使用,亦可將兩種以上混合使用。 In addition, as the (meth)acrylic polymer used in addition to the (meth)acrylic monomer having an alkyl group having 1 to 14 carbon atoms, a (meth)acrylic monomer having a hydroxyl group and having The polymerizable monomer other than the (meth)acrylic monomer of the carboxyl group can be used without particular limitation as long as it does not impair the characteristics of the present invention. For example, When using cyano group-containing monomers, vinyl ester monomers, aromatic vinyl monomers and other components that improve cohesion and heat resistance, or amide group-containing monomers, amide imine group-containing monomers, amine group-containing monomers , Epoxy group-containing monomers, N-acryl morpholine, vinyl ether monomers and other components that increase adhesion or have functional groups that act as crosslinking sites. These polymerizable monomers may be used alone or in combination of two or more.

作為含氰基單體,可列舉例如:丙烯腈、甲基丙烯腈。 Examples of the cyano group-containing monomer include acrylonitrile and methacrylonitrile.

作為乙烯基酯單體,可列舉例如:乙酸乙烯酯、丙酸乙烯酯、月桂酸乙烯酯等。 Examples of vinyl ester monomers include vinyl acetate, vinyl propionate, and vinyl laurate.

作為芳香族乙烯基單體,可列舉例如:苯乙烯、氯苯乙烯、氯甲基苯乙烯、α-甲基苯乙烯、其他取代苯乙烯等。 Examples of the aromatic vinyl monomer include styrene, chlorostyrene, chloromethylstyrene, α-methylstyrene, and other substituted styrenes.

作為含醯胺基單體,可列舉例如:丙烯醯胺、甲基丙烯醯胺、二乙基丙烯醯胺、N-乙烯基吡咯烷酮、N,N-二甲基丙烯醯胺、N,N-二甲基甲基丙烯醯胺、N,N-二乙基丙烯醯胺、N,N-二乙基甲基丙烯醯胺、N,N,-亞甲基雙丙烯醯胺、N,N-二甲基胺基丙基丙烯醯胺、N,N-二甲基胺基丙基甲基丙烯醯胺、二丙酮丙烯醯胺等。 As the amide group-containing monomer, for example, acrylamide, methacrylamide, diethylacrylamide, N-vinylpyrrolidone, N,N-dimethylacrylamide, N,N- Dimethylmethacrylamide, N,N-diethylacrylamide, N,N-diethylmethacrylamide, N,N,-methylenebisacrylamide, N,N- Dimethylaminopropylacrylamide, N,N-dimethylaminopropylmethacrylamide, diacetoneacrylamide, etc.

作為含醯亞胺基單體,可列舉例如:環己基馬來醯亞胺、異丙基馬來醯亞胺、N-環己基馬來醯亞胺、衣康醯亞胺等。 Examples of the imidate group-containing monomer include cyclohexylmaleimide, isopropylmaleimide, N-cyclohexylmaleimide, itaconic amide, and the like.

作為含胺基單體,可列舉例如:(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸N,N-二甲基胺基丙酯等。 Examples of the amine group-containing monomer include: aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, N,N-dimethyl (meth)acrylate Aminopropyl ester and so on.

作為含環氧基單體,可列舉例如:(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸甲基縮水甘油酯、烯丙基縮水甘油基醚等。 Examples of the epoxy group-containing monomer include glycidyl (meth)acrylate, methylglycidyl (meth)acrylate, allyl glycidyl ether, and the like.

作為乙烯基醚單體,可列舉例如:甲基乙烯基醚、乙基乙烯基醚、異丁基乙烯基醚等。 Examples of vinyl ether monomers include methyl vinyl ether, ethyl vinyl ether, and isobutyl vinyl ether.

本發明中,除具有碳數為1~14之烷基之(甲基)丙烯酸系單體、具有羥基之(甲基)丙烯酸系單體、具有羧基之(甲基)丙烯酸系單體以外之其他聚合性單體相對於上述具有碳數為1~14之烷基之(甲基)丙 烯酸系單體100質量份,較佳為0~40質量份,更佳為0~30質量份。藉由於上述範圍內使用上述其他聚合性單體,於使用離子性化合物作為防靜電劑之情形時,可適當調節與上述離子性化合物之良好之相互作用以及良好之再剝離性。 In the present invention, except for the (meth)acrylic monomer having an alkyl group having 1 to 14 carbon atoms, the (meth)acrylic monomer having a hydroxyl group, and the (meth)acrylic monomer having a carboxyl group Other polymerizable monomers with respect to the above (meth)propylene having an alkyl group having 1 to 14 carbon atoms 100 parts by mass of the enoic acid-based monomer, preferably 0 to 40 parts by mass, more preferably 0 to 30 parts by mass. By using the other polymerizable monomers in the above range, when an ionic compound is used as an antistatic agent, good interaction with the ionic compound and good re-peelability can be adjusted appropriately.

上述(甲基)丙烯酸系聚合物之重量平均分子量(Mw)較佳為10萬~500萬,更佳為20萬~200萬,進而較佳為30萬~100萬。於重量平均分子量小於10萬之情形時,黏著劑層之凝聚力減小,因此具有產生糊劑殘留之傾向。另一方面,於重量平均分子量超過500萬之情形時,聚合物之流動性下降,對被接著體(例如偏光板)之潤濕變得不充分,有造成被接著體與黏著片材之黏著劑層之間產生之鼓起之傾向。再者,重量平均分子量係指利用凝膠滲透色譜法(GPC)測定獲得者。 The weight average molecular weight (Mw) of the (meth)acrylic polymer is preferably 100,000 to 5 million, more preferably 200,000 to 2 million, and further preferably 300,000 to 1 million. When the weight-average molecular weight is less than 100,000, the cohesive force of the adhesive layer is reduced, so there is a tendency for the paste to remain. On the other hand, when the weight average molecular weight exceeds 5 million, the fluidity of the polymer decreases, and the wetting of the adherend (such as a polarizing plate) becomes insufficient, which may cause the adherend to adhere to the adhesive sheet The tendency to swell between the layers of the agent. Furthermore, the weight average molecular weight refers to the one obtained by gel permeation chromatography (GPC).

另外,上述(甲基)丙烯酸系聚合物之玻璃轉移溫度(Tg)較佳為0℃以下,更佳為-10℃以下(通常為-100℃以上)。於玻璃轉移溫度高於0℃之情形時,聚合物難以流動,例如對偏光板之潤濕變得不充分,有造成偏光板與黏著片材之黏著劑層之間產生之鼓起之傾向。特別是藉由將玻璃轉移溫度設為-61℃以下,容易獲得對偏光板之潤濕性及輕剝離性優異之黏著劑層。再者,(甲基)丙烯酸系聚合物之玻璃轉移溫度可藉由適當改變所使用之單體成分、或組成比而於上述範圍內進行調整。 The glass transition temperature (Tg) of the (meth)acrylic polymer is preferably 0°C or lower, more preferably -10°C or lower (usually -100°C or higher). When the glass transition temperature is higher than 0°C, the polymer is difficult to flow, for example, the wetting of the polarizer becomes insufficient, which tends to cause bulging between the polarizer and the adhesive layer of the adhesive sheet. In particular, by setting the glass transition temperature to -61°C or lower, it is easy to obtain an adhesive layer excellent in wettability and light peelability to the polarizing plate. Furthermore, the glass transition temperature of the (meth)acrylic polymer can be adjusted within the above range by appropriately changing the monomer component or composition ratio used.

上述(甲基)丙烯酸系聚合物之聚合方法並無特別限制,可藉由溶液聚合、乳化聚合、塊狀聚合、懸浮聚合等公知之方法進行聚合,特別是就作業性之觀點、或對被接著體(被保護物)之低污染性等特性方面而言,溶液聚合為更佳之態樣。另外,所獲得之聚合物可為無規共聚物、嵌段共聚合物、交替共聚物、接枝共聚物等之任意一種。另外,聚合條件、或聚合溶劑、聚合起始劑等亦可基於公知技術適當利用。 The polymerization method of the (meth)acrylic polymer is not particularly limited, and it can be polymerized by a known method such as solution polymerization, emulsification polymerization, bulk polymerization, suspension polymerization, etc., especially from the viewpoint of workability, or In terms of characteristics such as low pollution of the body (protected object), solution polymerization is more preferable. In addition, the obtained polymer may be any one of a random copolymer, a block copolymer, an alternating copolymer, and a graft copolymer. In addition, polymerization conditions, polymerization solvents, polymerization initiators, and the like can also be appropriately used based on known techniques.

於上述黏著劑層使用胺基甲酸酯系黏著劑之情形時,作為胺基甲酸酯系黏著劑,可採用任意適當之胺基甲酸酯系黏著劑。作為此種胺基甲酸酯系黏著劑,較佳為可列舉包含使多元醇與聚異氰酸酯反應而獲得之胺基甲酸酯樹脂者。作為多元醇,可列舉例如:聚醚多元醇、聚酯多元醇、聚碳酸酯多元醇、聚己內酯多元醇等。作為聚異氰酸酯系化合物,可列舉例如:二苯基甲烷二異氰酸酯、甲苯二異氰酸酯、六亞甲基二異氰酸酯等。 When a urethane-based adhesive is used for the adhesive layer, any suitable urethane-based adhesive can be used as the urethane-based adhesive. As such a urethane-based adhesive, it is preferable to include a urethane resin obtained by reacting a polyol and a polyisocyanate. Examples of the polyol include polyether polyol, polyester polyol, polycarbonate polyol, and polycaprolactone polyol. Examples of the polyisocyanate-based compound include diphenylmethane diisocyanate, toluene diisocyanate, and hexamethylene diisocyanate.

<具有氧伸烷基鏈之有機聚矽氧烷> <Organic polysiloxane with oxyalkylene chain>

本發明之黏著劑層係由黏著劑組合物形成者,上述黏著劑組合物含有具有氧伸烷基鏈之有機聚矽氧烷,較佳為含有具有氧伸烷基主鏈之有機聚矽氧烷。推測藉由使用上述有機聚矽氧烷,可降低黏著劑表面之表面自由能,即便含量較少,亦可兼顧低污染性及輕剝離化。另外,藉由使用上述有機聚矽氧烷,與被接著體之接著性降低,因此拾取性提高,即便為樹脂層之厚度較厚之構成之黏著片材,亦可表現出輕剝離,因此為較佳之態樣。 The adhesive layer of the present invention is formed of an adhesive composition. The adhesive composition contains an organic polysiloxane having an oxyalkylene chain, preferably an organic polysiloxane having an oxyalkylene main chain alkyl. It is speculated that by using the above-mentioned organic polysiloxane, the surface free energy on the surface of the adhesive can be reduced, and even if the content is small, both low pollution and light peeling can be taken into account. In addition, by using the above-mentioned organic polysiloxane, the adhesion with the adherend is reduced, so the pick-up property is improved, and even an adhesive sheet composed of a thick resin layer can exhibit light peeling, so The better way.

上述有機聚矽氧烷可適當使用公知之具有聚氧伸烷基主鏈之有機聚矽氧烷,較佳為由下式表示者。 As the above-mentioned organopolysiloxane, a well-known organopolysiloxane having a polyoxyalkylene main chain can be suitably used, and it is preferably represented by the following formula.

Figure 104143004-A0202-12-0022-1
Figure 104143004-A0202-12-0022-1

(式中,R1及/或R2具有碳數1~6之氧伸烷基鏈,上述氧伸烷基鏈中之伸烷基可為直鏈或支鏈,上述氧伸烷基鏈之末端可為烷氧基或羥基。另外,R1或R2之任意一個可為羥基、或者可為烷基、烷氧基、或 者可為上述烷基、烷氧基之一部分經雜原子取代之官能基。n為1~300之整數。) (In the formula, R 1 and/or R 2 have an oxyalkylene chain having 1 to 6 carbon atoms. The alkylene group in the oxyalkylene chain may be linear or branched. The terminal may be an alkoxy group or a hydroxyl group. In addition, either of R 1 or R 2 may be a hydroxyl group, or may be an alkyl group, an alkoxy group, or may be a part of the above alkyl group or alkoxy group substituted with a hetero atom Functional group. n is an integer from 1 to 300.)

上述有機聚矽氧烷使用以含有矽氧烷之部位(矽氧烷部位)作為主鏈、並且於該主鏈之末端鍵合有氧伸烷基鏈者。推測藉由使用上述具有氧伸烷基鏈之有機聚矽氧烷,能夠取得與(甲基)丙烯酸系聚合物之相溶性之平衡,能夠實現低污染性及輕剝離化之兼顧。 As the organic polysiloxane, a site containing a siloxane (a siloxane site) is used as the main chain, and an oxyalkylene chain is bonded to the end of the main chain. It is speculated that by using the above-mentioned organic polysiloxane having an oxyalkylene chain, the compatibility with the (meth)acrylic polymer can be balanced, and both low pollution and light peeling can be achieved.

另外,作為本發明中之上述有機聚矽氧烷,可使用例如以下之構成。具體而言,式中之R1及/或R2具有包含碳數1~6之烴基之氧伸烷基鏈,作為上述氧伸烷基鏈,可列舉氧亞甲基、氧伸乙基、氧伸丙基、氧伸丁基等,其中,較佳為氧伸乙基或氧伸丙基。另外,於R1及R2均具有氧伸烷基鏈之情形時,該氧伸烷基鏈可相同亦可不同。 In addition, as the above-mentioned organic polysiloxane in the present invention, for example, the following structure can be used. Specifically, R 1 and/or R 2 in the formula have an oxyalkylene chain containing a hydrocarbon group having 1 to 6 carbon atoms. Examples of the oxyalkylene chain include oxymethylene, oxyethyl, Oxypropylene, oxybutyl, etc., among them, oxyethyl or oxypropyl is preferred. In addition, when both R 1 and R 2 have an oxyalkylene chain, the oxyalkylene chains may be the same or different.

Figure 104143004-A0202-12-0023-3
Figure 104143004-A0202-12-0023-3

另外,上述氧伸烷基鏈之烴基可為直鏈亦可為支鏈。 In addition, the hydrocarbon group of the oxyalkylene chain may be linear or branched.

另外,上述氧伸烷基鏈之末端可為烷氧基或羥基,其中,更佳為烷氧基。以保護黏著面之目的而於黏著劑層表面貼合隔片之情形時,末端為羥基之有機聚矽氧烷有時產生與隔片之相互作用,於將隔片自黏著劑層表面剝離時之黏著(剝離)力上升。 In addition, the terminal of the above-mentioned oxyalkylene chain may be an alkoxy group or a hydroxyl group, and among them, an alkoxy group is more preferable. When the separator is attached to the surface of the adhesive layer for the purpose of protecting the adhesive surface, the organic polysiloxane with hydroxyl groups at the end sometimes interacts with the separator, when the separator is peeled off from the surface of the adhesive layer The adhesion (peeling) force rises.

另外,n為1~300之整數,較佳為10~200,更佳為20~150。若n於上述範圍內,則可取得與基礎聚合物之相溶性之平衡,為較佳之態樣。另外,分子中可具有(甲基)丙烯醯基、烯丙基、羥基等反應性取代基。上述有機聚矽氧烷可單獨使用,亦可將兩種以上混合使用。 In addition, n is an integer of 1 to 300, preferably 10 to 200, and more preferably 20 to 150. If n is within the above range, a balance of compatibility with the base polymer can be obtained, which is a preferable aspect. In addition, the molecule may have reactive substituents such as (meth)acryloyl, allyl, and hydroxyl groups. The above-mentioned organic polysiloxanes may be used alone or in combination of two or more.

作為上述具有氧伸烷基鏈之有機聚矽氧烷之具體例,可列舉例如:作為市售品之商品名為X-22-4952、X-22-4272、X-22-6266、KF-6004、KF-889(以上由信越化學工業公司製造)、BY16-201、SF8427(以上由東麗道康寧公司製造)、IM22(旭化成瓦克公司製造)等。該等化合物可單獨使用,亦可將兩種以上混合使用。 Specific examples of the above-mentioned organic polysiloxane having an oxyalkylene chain include, for example, commercially available product names X-22-4952, X-22-4272, X-22-6266, and KF- 6004, KF-889 (above manufactured by Shin-Etsu Chemical Industry Co., Ltd.), BY16-201, SF8427 (above manufactured by Toray Dow Corning Corporation), IM22 (made by Asahi Kasei Wacker Corporation), etc. These compounds can be used alone or in combination of two or more.

另外,除了主鏈具有(鍵合有)氧伸烷基鏈之有機聚矽氧烷以外,亦可使用側鏈具有(鍵合有)氧伸烷基鏈之有機聚矽氧烷,與主鏈具有氧伸烷基鏈之有機聚矽氧烷相比,使用側鏈具有氧伸烷基鏈之有機聚矽氧烷為更佳之態樣。上述有機聚矽氧烷可適當使用公知之具有聚氧伸烷基側鏈之有機聚矽氧烷,較佳為由下式表示者。 In addition, in addition to organic polysiloxanes having (bonded) oxyalkylene chains in the main chain, organic polysiloxanes having (bonded) oxyalkylene chains in the side chain can also be used. Compared with the organic polysiloxane having an oxyalkylene chain, it is better to use an organic polysiloxane having a side chain having an oxyalkylene chain. As the above-mentioned organopolysiloxane, a well-known organopolysiloxane having a polyoxyalkylene side chain can be suitably used, and it is preferably represented by the following formula.

Figure 104143004-A0202-12-0024-4
Figure 104143004-A0202-12-0024-4

(式中,R1為1價之有機基,R2、R3及R4為伸烷基,R5為氫或有機基,m及n為0~1000之整數,其中,m、n不同時為0,a及b為0~100之整數,其中,a、b不同時為0。) (In the formula, R 1 is a monovalent organic group, R 2 , R 3 and R 4 are alkylene groups, R 5 is hydrogen or an organic group, m and n are integers from 0 to 1000, where m and n are different When the time is 0, a and b are integers from 0 to 100, where a and b are not 0 at the same time.)

另外,作為本發明中之上述有機聚矽氧烷,可使用例如以下之構成。具體而言,式中之R1為以甲基、乙基、丙基等烷基、苯基、甲苯基等芳基或苄基、苯乙基等芳烷基例示之一價有機基,各自可具有羥基等取代基。R2、R3、R4可使用亞甲基、伸乙基、伸丙基等碳數1~8之伸烷基。此處,R3及R4為不同之伸烷基,R2與R3或R4可相同亦可不同。為了提高能夠溶解於該聚氧伸烷基側鏈中之防靜電性成分 (熔點100℃以下之離子液體、或鹼金屬鹽等)之濃度,較佳為R3及R4中之任意一個為伸乙基或伸丙基。R5可為以甲基、乙基、丙基等烷基或乙醯基、丙醯基等醯基例示之一價有機基,各自可具有羥基等取代基。該等化合物可單獨使用,亦可將兩種以上混合使用。另外,分子中可具有(甲基)丙烯醯基、烯丙基、羥基等反應性取代基。推測上述具有聚氧伸烷基側鏈之有機聚矽氧烷中,尤其是具備具有羥基末端之聚氧伸烷基側鏈之有機聚矽氧烷容易取得相溶性之平衡,因此較佳。 In addition, as the above-mentioned organic polysiloxane in the present invention, for example, the following structure can be used. Specifically, R 1 in the formula is a monovalent organic group exemplified by alkyl groups such as methyl, ethyl, propyl, aryl groups such as phenyl, tolyl, or aralkyl groups such as benzyl, phenethyl, etc. It may have a substituent such as a hydroxyl group. R 2 , R 3 , and R 4 can use alkylene groups having 1 to 8 carbon atoms, such as methylene, ethylidene, and propylidene groups. Here, R 3 and R 4 are different alkylene groups, and R 2 and R 3 or R 4 may be the same or different. In order to increase the concentration of antistatic components (ionic liquid with a melting point below 100°C, alkali metal salts, etc.) that can be dissolved in the side chain of the polyoxyalkylene group, it is preferable that either of R 3 and R 4 is Extend ethyl or propyl. R 5 may be a monovalent organic group exemplified by an alkyl group such as a methyl group, an ethyl group, a propyl group, or an acetyl group such as an acetyl group or a propyl group, and each may have a substituent such as a hydroxyl group. These compounds can be used alone or in combination of two or more. In addition, the molecule may have reactive substituents such as (meth)acryloyl, allyl, and hydroxyl groups. It is presumed that among the above-mentioned organic polysiloxanes having polyoxyalkylene side chains, in particular, organic polysiloxanes having polyoxyalkylene side chains having hydroxyl terminals can easily achieve a balance of compatibility, which is preferable.

Figure 104143004-A0202-12-0025-5
Figure 104143004-A0202-12-0025-5

作為上述有機聚矽氧烷之具體例,可列舉例如:作為市售品之商品名KF-351A、KF-352A、KF-353、KF-354L、KF-355A、KF-615A、KF-945、KF-640、KF-642、KF-643、KF-6022、X-22-6191、X-22-4515、KF-6004、KF-6011、KF-6012、KF-6015、KF-6017、KF-6020、X-22-2516(以上為信越化學工業公司製造)、SF8428、FZ-2162、SH3749、FZ-77、L-7001、FZ-2104、FZ-2110、L-7002、FZ-2122、FZ-2164、FZ-2203、FZ-7001、SH8400、SH8700、SH8410、SF8422(以上為東麗-道康寧公司製造)、TSF-4440、TSF-4441、TSF-4445、TSF-4450、TSF-4446、TSF-4452、TSF-4460(邁圖高新材料公司製造)、BYK-333、BYK-307、BYK-377、BYK-UV3500、BYK-UV3570(BYK-Chemie Japan公司製造)等。該等化合物可單獨使用,另外亦可將兩種以上混合使用。 Specific examples of the above-mentioned organic polysiloxanes include, for example, commercially available product names KF-351A, KF-352A, KF-353, KF-354L, KF-355A, KF-615A, KF-945, KF-640, KF-642, KF-643, KF-6022, X-22-6191, X-22-4515, KF-6004, KF-6011, KF-6012, KF-6015, KF-6017, KF- 6020, X-22-2516 (made by Shin-Etsu Chemical Industry Corporation), SF8428, FZ-2162, SH3749, FZ-77, L-7001, FZ-2104, FZ-2110, L-7002, FZ-2122, FZ -2164, FZ-2203, FZ-7001, SH8400, SH8700, SH8410, SF8422 (above manufactured by Toray-Dow Corning), TSF-4440, TSF-4441, TSF-4445, TSF-4450, TSF-4446, TSF -4452, TSF-4460 (manufactured by Meitu High-tech Materials), BYK-333, BYK-307, BYK-377, BYK-UV3500, BYK-UV3570 (manufactured by BYK-Chemie Japan), etc. These compounds can be used alone or in combination of two or more.

作為本發明中使用之上述有機聚矽氧烷,HLB(Hydrophile-Lipophile Balance,親水-親油平衡)值較佳為1~16,更佳為3~14。若HLB值偏離上述範圍內,則對被接著體之污染性變差,因此不佳。 As the above-mentioned organic polysiloxane used in the present invention, the HLB (Hydrophile-Lipophile Balance) value is preferably 1 to 16, more preferably 3 to 14. If the HLB value deviates from the above range, the pollution to the adherend becomes poor, which is not good.

另外,相對於上述(甲基)丙烯酸系聚合物100質量份,上述有機聚矽氧烷之含量較佳為0.01~5質量份,更佳為0.07~3質量份,進而較佳為0.05~1質量份。若於上述範圍內,則容易兼顧防靜電性與輕剝離性(再剝離性),因此較佳。 In addition, the content of the organic polysiloxane is preferably 0.01 to 5 parts by mass, more preferably 0.07 to 3 parts by mass, and still more preferably 0.05 to 1 with respect to 100 parts by mass of the (meth)acrylic polymer. Quality parts. Within the above range, it is easy to balance antistatic properties and light peelability (repeelability), which is preferable.

<黏著劑層中之防靜電成分> <Antistatic component in adhesive layer>

本發明之黏著片材中,構成上述黏著劑層之黏著劑組合物亦可含有防靜電成分,更佳為含有離子性化合物作為上述防靜電成分。作為上述離子性化合物,可列舉鹼金屬鹽及/或熔點100℃以下之離子液體。藉由含有該等離子液體,可賦予優異之防靜電性。另外,將如上述含有防靜電成分之黏著劑組合物交聯而成之黏著劑層(使用防靜電成分)可實現於剝離時對於未進行防靜電處理之被接著體(例如偏光板)之防靜電,成為減少對被接著體之污染之黏著片材。因此,作為於靜電或污染成為特別嚴重之問題之光學、電子零件相關之技術領域中之防靜電性黏著片材非常有用。 In the adhesive sheet of the present invention, the adhesive composition constituting the adhesive layer may contain an antistatic component, and more preferably contains an ionic compound as the antistatic component. Examples of the ionic compounds include alkali metal salts and/or ionic liquids having a melting point of 100°C or lower. By containing the plasma liquid, excellent antistatic properties can be imparted. In addition, the adhesive layer (using an antistatic component) formed by crosslinking the adhesive composition containing an antistatic component as described above can prevent the adherend (such as a polarizing plate) that has not undergone antistatic treatment during peeling Static electricity becomes an adhesive sheet that reduces contamination of the adherend. Therefore, it is very useful as an antistatic adhesive sheet in the technical field related to optical and electronic parts where static electricity or pollution becomes a particularly serious problem.

另外,相對於上述(甲基)丙烯酸系聚合物100質量份,上述防靜電成分之含量較佳為4.9質量份以下,更佳為0.001~0.9質量份,更佳為0.005~0.8質量份,最佳為0.01~0.5質量份。若於上述範圍內,則容易兼顧防靜電性及低污染性,因此較佳。 In addition, the content of the antistatic component is preferably 4.9 parts by mass or less, more preferably 0.001 to 0.9 parts by mass, more preferably 0.005 to 0.8 parts by mass, most preferably 100 parts by mass of the (meth)acrylic polymer. It is preferably 0.01 to 0.5 parts by mass. Within the above range, it is easy to achieve both antistatic properties and low pollution properties, which is preferable.

<交聯劑> <crosslinking agent>

本發明之黏著片材中,較佳為上述黏著劑組合物含有交聯劑。另外,本發明中,可使用上述黏著劑組合物製成黏著劑層。例如,於上述黏著劑含有上述(甲基)丙烯酸系聚合物之情形時,藉由適當調節上述(甲基)丙烯酸系聚合物之構成單元、構成比率、交聯劑之選擇及 添加比率等進行交聯,可獲得耐熱性更優異之黏著片材(黏著劑層)。 In the adhesive sheet of the present invention, the adhesive composition preferably contains a crosslinking agent. In addition, in the present invention, the above adhesive composition can be used to form an adhesive layer. For example, when the adhesive contains the (meth)acrylic polymer, by appropriately adjusting the constituent units of the (meth)acrylic polymer, the composition ratio, the selection of the crosslinking agent and Crosslinking by addition ratio etc. can obtain an adhesive sheet (adhesive layer) with more excellent heat resistance.

作為本發明中使用之交聯劑,可使用異氰酸酯化合物、環氧化合物、三聚氰胺系樹脂、氮丙啶衍生物以及金屬螯合物等。特別是使用異氰酸酯化合物為較佳之態樣。另外,該等化合物可單獨使用,亦可將兩種以上混合使用。 As the crosslinking agent used in the present invention, isocyanate compounds, epoxy compounds, melamine-based resins, aziridine derivatives, metal chelate compounds and the like can be used. In particular, the use of isocyanate compounds is preferred. In addition, these compounds may be used alone or in combination of two or more.

作為上述異氰酸酯化合物(異氰酸酯系交聯劑),可列舉例如:三亞甲基二異氰酸酯、亞丁基二異氰酸酯、六亞甲基二異氰酸酯(HDI)、二聚酸二異氰酸酯等脂肪族聚異氰酸酯系、亞環戊基二異氰酸酯、亞環己基二異氰酸酯、異佛爾酮二異氰酸酯(IPDI)等脂環族異氰酸酯類、2,4-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、苯二亞甲基二異氰酸酯(XDI)等芳香族異氰酸酯類、藉由脲基甲酸酯鍵、縮二脲鍵、異氰脲酸酯鍵、脲二酮鍵、脲鍵、碳二亞胺鍵、脲酮亞胺鍵、噁二嗪三酮鍵等將上述異氰酸酯化合物改性而成之聚異氰酸酯改性物。例如,作為市售品,可列舉商品名TAKENATE 300S、TAKENATE 500、TAKENATE D165N、TAKENATE D178N(以上為武田藥品工業公司製造)、Sumidur T80、Sumidur L、Desmodur N3400(以上為住化拜耳聚胺酯公司製造)、Millionate MR、Millionate MT、Coronate L、Coronate HL、Coronate HX(以上為日本聚胺酯工業公司製造)等。該等異氰酸酯化合物可單獨使用,亦可將兩種以上混合使用,亦可將2官能異氰酸酯化合物與3官能以上之異氰酸酯化合物併用使用。藉由將交聯劑併用使用,可兼顧穩定之黏著性及耐回彈性(對曲面之接著性),可獲得接著可靠性更優異之黏著片材。 Examples of the isocyanate compound (isocyanate-based cross-linking agent) include aliphatic polyisocyanates such as trimethylene diisocyanate, butylene diisocyanate, hexamethylene diisocyanate (HDI), and dimer acid diisocyanate. Alicyclic isocyanates such as cyclopentyl diisocyanate, cyclohexylene diisocyanate, isophorone diisocyanate (IPDI), 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, benzene di Aromatic isocyanates such as methylene diisocyanate (XDI), via allophanate bond, biuret bond, isocyanurate bond, uretdione bond, urea bond, carbodiimide bond, urea A polyisocyanate modified product obtained by modifying the isocyanate compound, such as a ketimine bond and an oxadiazine trione bond. For example, as a commercially available product, the trade names TAKENATE 300S, TAKENATE 500, TAKENATE D165N, TAKENATE D178N (above are manufactured by Takeda Pharmaceutical Industries Co., Ltd.), Sumidur T80, Sumidur L, Desmodur N3400 (above are manufactured by Sumitomo Bayer Polyurethane Co., Ltd.) , Millionate MR, Millionate MT, Coronate L, Coronate HL, Coronate HX (the above is manufactured by Japan Polyurethane Industry Corporation), etc. These isocyanate compounds may be used alone, or two or more kinds may be used in combination, or a difunctional isocyanate compound and a trifunctional or more isocyanate compound may be used in combination. By using a cross-linking agent in combination, stable adhesion and rebound resistance (adhesion to curved surfaces) can be taken into account, and an adhesive sheet with superior adhesion reliability can be obtained.

另外,於將2官能異氰酸酯化合物與3官能以上之異氰酸酯化合物併合使用作為上述異氰酸酯化合物之情形時,作為兩種化合物之調配比(質量比),較佳為以[2官能異氰酸酯化合物]/[3官能以上之異氰酸酯化合物](質量比)為0.1/99.9~50/50進行調配,更佳為0.1/99.9~ 20/80,進而較佳為0.1/99.9~10/90,特別較佳為0.1/99.5~5/95,最佳為0.1/99.9~1/99。藉由於上述範圍內進行調整調配,成為黏著性及耐回彈性優異之黏著劑層,為較佳之態樣。 In addition, when a difunctional isocyanate compound and a trifunctional or higher isocyanate compound are used in combination as the above isocyanate compound, the compounding ratio (mass ratio) of the two compounds is preferably [2 functional isocyanate compound]/[3 The isocyanate compound above functional level] (mass ratio) is 0.1/99.9~50/50, preferably 0.1/99.9~ 20/80, further preferably 0.1/99.9 to 10/90, particularly preferably 0.1/99.5 to 5/95, and most preferably 0.1/99.9 to 1/99. By adjusting and adjusting within the above range, it becomes an adhesive layer excellent in adhesiveness and rebound resistance, which is a better aspect.

作為上述環氧化合物,可列舉例如:N,N,N',N'-四縮水甘油基間苯二甲胺(商品名TETRAD-X,三菱瓦斯化學公司製造)、或1,3-雙(N,N-二縮水甘油基胺基甲基)環己烷(商品名TETRAD-C,三菱瓦斯化學公司製造)等。 Examples of the epoxy compound include N,N,N',N'-tetraglycidyl m-xylylenediamine (trade name TETRAD-X, manufactured by Mitsubishi Gas Chemical Co., Ltd.), or 1,3-bis( N,N-diglycidylaminomethyl)cyclohexane (trade name TETRAD-C, manufactured by Mitsubishi Gas Chemical Company), etc.

作為上述三聚氰胺系樹脂,可列舉六羥甲基三聚氰胺等。作為氮丙啶衍生物,可列舉例如:作為市售品之商品名HDU、TAZM、TAZO(以上為相互藥工公司製造)等。 Examples of the melamine-based resin include hexamethylolmelamine and the like. Examples of the aziridine derivatives include commercially available product names such as HDU, TAZM, and TAZO (above are manufactured by Mutual Pharmaceutical Co., Ltd.) and the like.

作為上述金屬螯合物,可列舉鋁、鐵、錫、鈦、鎳等作為金屬成分,可列舉乙炔、乙醯乙酸甲酯、乳酸乙酯等作為螯合成分。 Examples of the metal chelate compound include aluminum, iron, tin, titanium, nickel, and the like as metal components, and acetylene, methyl acetoacetate, and ethyl lactate, and the like as chelate components.

本發明中使用之交聯劑之含量例如相對於上述(甲基)丙烯酸系聚合物100質量份,較佳為含有0.01~10質量份,更佳為含有0.1~8質量份,進而較佳為含有0.5~5質量份,最佳為含有1~4質量份。於上述含量低於0.01質量份之情形時,利用交聯劑形成之交聯變得不充分,所獲得之黏著劑層之凝聚力變低,亦有時無法獲得充分之耐熱性,另外,具有造成糊劑殘留之傾向。另一方面,於含量超過10質量份之情形時,聚合物之凝聚力較大,流動性下降,對被接著體(例如偏光板)之潤濕變得不充分,具有造成於被接著體與黏著劑層(黏著劑組合物層)之間產生之鼓起之傾向。另外,若交聯劑量較多,則具有剝離靜電特性下降之傾向。另外,該等交聯劑可單獨使用,亦可混合兩種以上使用。 The content of the crosslinking agent used in the present invention is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 8 parts by mass, and more preferably 100 parts by mass of the (meth)acrylic polymer. Contains 0.5 to 5 parts by mass, preferably 1 to 4 parts by mass. In the case where the above content is less than 0.01 parts by mass, the crosslinking formed by the crosslinking agent becomes insufficient, the cohesive force of the adhesive layer obtained becomes low, and sometimes sufficient heat resistance cannot be obtained. The tendency of paste residue. On the other hand, when the content exceeds 10 parts by mass, the cohesive force of the polymer is large, the fluidity decreases, and the wetting of the adherend (such as a polarizing plate) becomes insufficient, which may cause the adherend and adhesion The tendency to swell between the adhesive layers (adhesive composition layers). In addition, if the amount of the cross-linking agent is large, the peeling electrostatic characteristics tend to decrease. In addition, these crosslinking agents may be used alone or in combination of two or more.

於上述黏著劑組合物中,可進而含有用以使上述之任意一種交聯反應更有效地進行之交聯觸媒。作為上述交聯觸媒,可使用例如:二月桂酸二丁基錫、二月桂酸二辛基錫等錫系觸媒、三(乙醯丙酮) 鐵、三(己烷-2,4-二酮)鐵、三(庚烷-2,4-二酮)鐵、三(庚烷-3,5-二酮)鐵、三(5-甲基己烷-2,4-二酮)鐵、三(辛烷-2,4-二酮)鐵、三(6-甲基庚烷-2,4-二酮)鐵、三(2,6-二甲基庚烷-3,5-二酮)鐵、三(壬烷-2,4-二酮)鐵、三(壬烷-4,6-二酮)鐵、三(2,2,6,6-四甲基庚烷-3,5-二酮)鐵、三(十三烷-6,8-二酮)鐵、三(1-苯基丁烷-1,3-二酮)鐵、三(六氟乙醯丙酮)鐵、三(乙醯乙酸乙酯)鐵、三(乙醯乙酸正丙酯)鐵、三(乙醯乙酸異丙酯)鐵、三(乙醯乙酸正丁酯)鐵、三(乙醯乙酸第二丁酯)鐵、三(乙醯乙酸第三丁酯)鐵、三(丙醯乙酸甲酯)鐵、三(丙醯乙酸乙酯)鐵、三(丙醯乙酸正丙酯)鐵、三(丙醯乙酸異丙酯)鐵、三(丙醯乙酸正丁酯)鐵、三(丙醯乙酸第二丁酯)鐵、三(丙醯乙酸第三丁酯)鐵、三(乙醯乙酸苄酯)鐵、三(丙二酸二甲酯)鐵、三(丙二酸二乙酯)鐵、三甲氧基鐵、三乙氧基鐵、三異丙氧基鐵、氯化鐵等鐵系觸媒。該等交聯觸媒可使用一種,亦可併用兩種以上。 The above-mentioned adhesive composition may further contain a crosslinking catalyst for making any of the above crosslinking reactions more efficient. As the above-mentioned cross-linking catalyst, for example, tin-based catalysts such as dibutyltin dilaurate and dioctyltin dilaurate, and tris(acetylacetone) can be used. Iron, tri(hexane-2,4-dione) iron, tri(heptane-2,4-dione) iron, tri(heptane-3,5-dione) iron, tri(5-methyl Hexane-2,4-dione) iron, tri(octane-2,4-dione) iron, tri(6-methylheptane-2,4-dione) iron, tri(2,6- Dimethylheptane-3,5-dione) iron, tri(nonane-2,4-dione) iron, tri(nonane-4,6-dione) iron, tri(2,2,6 ,6-tetramethylheptane-3,5-dione) iron, tri(tridecane-6,8-dione) iron, tri(1-phenylbutane-1,3-dione) iron , Tris(hexafluoroacetone acetone) iron, tris(acetate ethyl acetate) iron, tris(acetoacetate n-propyl acetate) iron, tris(acetoacetate isopropyl) iron, tris(acetoacetate n-butyl acetate) Ester) iron, tris(acetylacetate second butyl) iron, tris(acetylacetate third butyl) iron, tris(propylacetate methyl) iron, tris(ethylacetate) iron, tri( N-propyl propyl acetate) iron, tri(isopropyl propyl acetate) iron, tri(propyl propyl acetate n-butyl) iron, tri(propyl acetyl acetate second butyl) iron, tri(propyl acetyl acetate third Butyl ester) iron, tris(acetoacetate benzyl) iron, tris(dimethyl malonate) iron, tris(diethyl malonate) iron, trimethoxy iron, triethoxy iron, triiso Iron propionate, ferric chloride and other iron catalysts. One type of these crosslinking catalysts may be used, or two or more types may be used in combination.

上述交聯觸媒之含量(使用量)並無特別限制,例如,相對於上述(甲基)丙烯酸系聚合物100質量份,較佳為0.0001~1質量份,更佳為0.001~0.5質量份。若於上述範圍內,則形成黏著劑層時交聯反應之速度較快,黏著劑組合物之適用期亦變長,為較佳之態樣。 The content (usage) of the cross-linking catalyst is not particularly limited. For example, it is preferably 0.0001 to 1 part by mass, more preferably 0.001 to 0.5 part by mass relative to 100 parts by mass of the (meth)acrylic polymer. . Within the above range, the speed of the cross-linking reaction is faster when the adhesive layer is formed, and the pot life of the adhesive composition also becomes longer, which is a better aspect.

另外,上述黏著劑組合物中可進而含有其他公知之添加劑,例如可根據使用之用途適當添加著色劑、顏料等之粉體、界面活性劑、塑化劑、增黏劑、低分子量聚合物、表面潤滑劑、流平劑、抗氧化劑、緩蝕劑、光穩定劑、紫外線吸收劑、阻聚劑、矽烷偶合劑、無機或有機填充劑、金屬粉、粒子狀、箔狀物等。 In addition, the above-mentioned adhesive composition may further contain other well-known additives. For example, powders such as colorants and pigments, surfactants, plasticizers, tackifiers, low molecular weight polymers, Surface lubricants, leveling agents, antioxidants, corrosion inhibitors, light stabilizers, ultraviolet absorbers, polymerization inhibitors, silane coupling agents, inorganic or organic fillers, metal powders, particles, foils, etc.

本發明之黏著片材係藉由於第二樹脂層上形成上述黏著劑層而成者,此時,黏著劑組合物之交聯一般於黏著劑組合物之塗佈後進行,亦可將包含交聯後之黏著劑組合物之黏著劑層轉印於樹脂層等上。 The adhesive sheet of the present invention is formed by forming the above-mentioned adhesive layer on the second resin layer. At this time, the cross-linking of the adhesive composition is generally performed after the coating of the adhesive composition. The adhesive layer of the combined adhesive composition is transferred onto the resin layer and the like.

另外,於第二樹脂層上形成黏著劑層之方法並無特別限制,例如,可藉由將上述黏著劑組合物(溶液)塗佈於樹脂層上,並乾燥除去聚合溶劑等而於樹脂層上形成黏著劑層來製作。然後,以黏著劑層之成分轉移之調整或交聯反應之調整等為目的,可進行養護。另外,於將黏著劑組合物塗佈於樹脂層上製作黏著片材之情形時,可於上述黏著劑組合物中新添加聚合溶劑以外之一種以上之溶劑以能夠均勻地塗佈於樹脂層上。 In addition, the method of forming the adhesive layer on the second resin layer is not particularly limited. For example, the resin layer can be applied to the resin layer by applying the above adhesive composition (solution) to the resin layer and drying to remove the polymerization solvent. It is made by forming an adhesive layer on it. Then, for the purpose of adjusting the composition transfer of the adhesive layer or adjusting the crosslinking reaction, etc., curing can be performed. In addition, when the adhesive composition is applied on the resin layer to make an adhesive sheet, one or more solvents other than the polymerization solvent may be newly added to the adhesive composition to enable uniform application on the resin layer .

另外,作為製造本發明之黏著片材時之黏著劑層之形成方法,可使用黏著帶類之製造中使用之公知之方法。具體而言可列舉例如:輥塗、凹版塗佈、反轉塗佈、輥刷、噴塗、氣刀塗佈法、利用模嘴式塗佈機等之擠出塗佈法等。 In addition, as a method of forming the adhesive layer when manufacturing the adhesive sheet of the present invention, a well-known method used in the manufacture of adhesive tapes can be used. Specific examples include roll coating, gravure coating, reverse coating, roll brushing, spray coating, air knife coating method, extrusion coating method using a die coater, and the like.

通常,以上述黏著劑層之厚度為3μm~100μm,較佳為5μm~50μm左右之方式製作。若黏著劑層之厚度於上述範圍內,則容易獲得適度之再剝離性與黏著(接著)性之平衡,因此較佳。 Generally, the thickness of the adhesive layer is 3 μm to 100 μm, preferably 5 μm to 50 μm. If the thickness of the adhesive layer is within the above range, it is easy to obtain a proper balance between re-peelability and adhesion (adhesion), which is preferable.

<隔片> <spacer>

本發明之黏著片材中,根據需要以保護黏著面之目的,可於黏著劑層表面貼合隔片。 In the adhesive sheet of the present invention, the spacer can be attached to the surface of the adhesive layer as needed to protect the adhesive surface.

作為構成上述隔片之材料,有紙、或塑膠膜,就表面平滑性優異之方面而言,較佳為使用塑膠膜。作為該膜,只要為能夠保護上述黏著劑層之膜則無特別限制,可列舉例如:聚乙烯膜、聚丙烯膜、聚丁烯膜、聚丁二烯膜、聚甲基戊烯膜、聚氯乙烯膜、氯乙烯共聚物膜、聚對苯二甲酸乙二酯膜、聚對苯二甲酸丁二酯膜、聚胺基甲酸酯膜、乙烯-乙酸乙烯酯共聚物膜等。 As a material constituting the above-mentioned separator, there is paper or a plastic film, and in terms of excellent surface smoothness, it is preferable to use a plastic film. The film is not particularly limited as long as it can protect the adhesive layer, and examples thereof include polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, and poly Vinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polybutylene terephthalate film, polyurethane film, ethylene-vinyl acetate copolymer film, etc.

上述隔片之厚度通常為5μm~200μm,較佳為10μm~100μm左右。若於上述範圍內,則黏著劑層上之貼合作業性以及自黏著劑層之剝離作業性優異,因此較佳。上述隔片上可根據需要利用聚矽氧烷系 脫模劑、氟系脫模劑、長鏈烷基系脫模劑或脂肪醯胺系脫模劑、二氧化矽粉末等進行脫模及防污處理、或者進行塗佈型、混練型、蒸鍍型等防靜電處理。 The thickness of the separator is usually 5 μm to 200 μm, preferably about 10 μm to 100 μm. If it is within the above range, the adhesion workability on the adhesive layer and the peeling workability from the adhesive layer are excellent, which is preferable. The silicone can be used on the above separators as needed Mold release agents, fluorine-based mold release agents, long-chain alkyl-based mold release agents or fatty amide-based mold release agents, silica powder, etc. are used for mold release and antifouling treatment, or for coating type, mixing type, steaming Antistatic treatment such as plating.

<面塗層(防靜電層)> <Top coat (antistatic layer)>

本發明之黏著片材之特徵在於,依序具有第一樹脂層、接著層、第二樹脂層及由黏著劑組合物形成之黏著劑層,進而於上述第一樹脂層之與具有上述黏著劑層之面相反側之面上具有面塗層,上述面塗層係由含有作為導電性聚合物成分之聚苯胺磺酸、作為黏合劑成分之聚酯樹脂以及作為交聯劑之異氰酸酯系化合物之面塗層用組合物形成者。由於上述黏著片材具有面塗層,黏著片材之防靜電性提高,為較佳之態樣。 The adhesive sheet of the present invention is characterized by sequentially having a first resin layer, an adhesive layer, a second resin layer, and an adhesive layer formed of an adhesive composition, and further having the adhesive agent The surface opposite to the surface of the layer has a topcoat consisting of a polyaniline sulfonic acid as a conductive polymer component, a polyester resin as a binder component, and an isocyanate compound as a crosslinking agent Former for topcoat composition. Since the above-mentioned adhesive sheet has a surface coating, the anti-static property of the adhesive sheet is improved, which is a preferable aspect.

<導電性聚合物> <conductive polymer>

上述面塗層之特徵在於,含有作為導電性聚合物成分之聚苯胺磺酸。藉由使用上述導電性聚合物,可滿足基於面塗層之防靜電性以及經時之防靜電性。另外,上述聚苯胺磺酸係「水溶性」,藉由使用下述異氰酸酯系交聯劑,可固定化於面塗層中,可提高耐水性。藉由使用含有上述水溶性之導電性聚合物之水溶液,可獲得經時之表面電阻率優異之面塗層,為較佳之態樣。另一方面,於形成面塗層時使用之導電性聚合物為「水分散性」之情形時,若使用含有上述水分散性導電性聚合物之溶液形成面塗層,則容易產生凝聚物,無法均勻地塗佈,具有經時之表面電阻率顯著劣化之傾向,因此不佳。 The above top coat is characterized by containing polyaniline sulfonic acid as a conductive polymer component. By using the above conductive polymer, the antistatic property based on the top coat and the antistatic property over time can be satisfied. In addition, the above-mentioned polyaniline sulfonic acid-based "water-soluble" can be immobilized in the top coat by using the following isocyanate-based cross-linking agent, and water resistance can be improved. By using an aqueous solution containing the above-mentioned water-soluble conductive polymer, a top coat having excellent surface resistivity over time can be obtained, which is a preferable aspect. On the other hand, when the conductive polymer used in forming the top coat layer is "water-dispersible", if a solution containing the above-mentioned water-dispersible conductive polymer is used to form the top coat layer, aggregates are likely to be generated. It cannot be coated uniformly, and the surface resistivity tends to deteriorate significantly over time, which is not good.

上述導電性聚合物之使用量相對於面塗層中所含之黏合劑100質量份,較佳為10~200質量份,更佳為25~150質量份,進而較佳為40~120質量份。若上述導電性聚合物之使用量過少,則有時防靜電效果變小,若導電性聚合物之使用量過多,則有面塗層與樹脂層之密著性下降或者透明性下降之虞,因此不佳。 The amount of the conductive polymer used is preferably 10 to 200 parts by mass, more preferably 25 to 150 parts by mass, and more preferably 40 to 120 parts by mass relative to 100 parts by mass of the binder contained in the top coat. . If the amount of the conductive polymer used is too small, the antistatic effect may be reduced. If the amount of the conductive polymer used is too large, the adhesion between the top coat and the resin layer may decrease or the transparency may decrease. Therefore it is not good.

作為上述導電性聚合物成分使用之聚苯胺磺酸之按聚苯乙烯換算之重量平均分子量(Mw)較佳為5×105以下,更佳為3×105以下。另外,該等導電性聚合物之重量平均分子量通常較佳為1×103以上,更佳為5×103以上。 The polyaniline sulfonic acid used as the conductive polymer component has a weight average molecular weight (Mw) in terms of polystyrene of preferably 5×10 5 or less, more preferably 3×10 5 or less. In addition, the weight average molecular weight of these conductive polymers is usually preferably 1×10 3 or more, and more preferably 5×10 3 or more.

作為形成上述面塗層之方法,可採用於樹脂層(基材、支持體)之第一面上塗佈面塗層用組合物(面塗層形成用塗佈材料)並使其乾燥(或者硬化)之方法,作為用於製備面塗層用組合物之導電性聚合物成分,係含有聚苯胺磺酸、作為黏合劑之聚酯樹脂、以及作為交聯劑之異氰酸酯系交聯劑作為必要成分,上述必要成分可較佳使用溶解於水中之形態者(導電性聚合物水溶液、或者簡稱為水溶液)。上述導電性聚合物水溶液例如可藉由將具有親水性官能基之導電性聚合物(可藉由使分子內具有親水性官能基之單體共聚等方法來合成)溶解於水中來製備。作為上述親水性官能基,可例示磺基、胺基、醯胺基、亞胺基、羥基、巰基、肼基、羧基、四級銨基、硫酸酯基(-O-SO3H)、磷酸酯基(例如-O-PO(OH)2)等。上述親水性官能基可形成鹽。 As a method of forming the above-mentioned top coat layer, it is possible to apply a composition for top coat (coating material for forming top coat) to the first surface of the resin layer (base material, support) and dry it (or Hardening), as a conductive polymer component used in the preparation of the topcoat composition, it contains polyaniline sulfonic acid, a polyester resin as a binder, and an isocyanate-based crosslinking agent as a crosslinking agent. As the component, the above-mentioned essential component can be preferably used in a form dissolved in water (a conductive polymer aqueous solution, or simply an aqueous solution). The above-mentioned aqueous conductive polymer solution can be prepared, for example, by dissolving a conductive polymer having a hydrophilic functional group (which can be synthesized by a method such as copolymerization of a monomer having a hydrophilic functional group in the molecule) in water. Examples of the hydrophilic functional group include sulfo group, amine group, amide group, imine group, hydroxyl group, mercapto group, hydrazine group, carboxyl group, quaternary ammonium group, sulfate group (-O-SO 3 H), phosphoric acid Ester group (for example -O-PO(OH) 2 ), etc. The above-mentioned hydrophilic functional group may form a salt.

另外,作為上述聚苯胺磺酸水溶液之市售品,可例示三菱麗陽公司製造之商品名「aqua-PASS」等。 In addition, as a commercially available product of the above polyaniline sulfonic acid aqueous solution, a brand name "aqua-PASS" manufactured by Mitsubishi Rayon Co., Ltd. and the like can be exemplified.

此處所揭示之面塗層含有作為導電性聚合物成分之聚苯胺磺酸(聚苯胺型)作為必要成分,但是,例如可同時含有其他之一種或兩種以上之防靜電成分(導電性聚合物以外之有機導電性物質、無機導電性物質、防靜電劑等)。再者,作為較佳之一態樣,上述面塗層實質上不含有上述導電性聚合物以外之防靜電成分。即,可更佳實施上述面塗層中所含之防靜電成分實質上僅包含導電性聚合物之態樣。 The topcoat disclosed here contains polyaniline sulfonic acid (polyaniline type) as a conductive polymer component as an essential component, but, for example, may contain one or more antistatic components (conductive polymer) Other than organic conductive materials, inorganic conductive materials, antistatic agents, etc.). Furthermore, as a preferable aspect, the top coat layer does not substantially contain antistatic components other than the conductive polymer. In other words, the antistatic component contained in the above-mentioned top coat layer may include only a conductive polymer.

作為上述有機導電性物質,可列舉四級銨鹽、吡啶鎓鹽、第1胺基、第2胺基、第3胺基等具有陽離子性官能基之陽離子型防靜電劑;具有磺酸鹽或硫酸酯鹽、膦酸鹽、磷酸酯鹽等陰離子性官能基之陰離 子型防靜電劑;烷基甜菜鹼及其衍生物、咪唑啉及其衍生物、丙胺酸及其衍生物等兩性離子型防靜電劑;胺醇及其衍生物、甘油及其衍生物、聚乙二醇及其衍生物等非離子型防靜電劑;將具有上述陽離子型、陰離子型、兩性離子型之離子導電性基(例如四級銨鹽基)之單體聚合或共聚而獲得之離子導電性聚合物;聚噻吩、聚苯胺、聚吡咯、聚伸乙基亞胺、烯丙胺系聚合物等導電性聚合物;等。此種防靜電劑可單獨使用一種,亦可組合兩種以上使用。 Examples of the organic conductive material include cationic antistatic agents having cationic functional groups such as quaternary ammonium salts, pyridinium salts, first amine groups, second amine groups, and third amine groups; Anions of anionic functional groups such as sulfate salts, phosphonate salts, and phosphate ester salts Sub-type antistatic agent; zwitterionic antistatic agent such as alkyl betaine and its derivatives, imidazoline and its derivatives, alanine and its derivatives; amine alcohol and its derivatives, glycerin and its derivatives, poly Nonionic antistatic agents such as ethylene glycol and its derivatives; ions obtained by polymerizing or copolymerizing monomers having the above-mentioned cationic, anionic, and zwitterionic ion conductive groups (such as quaternary ammonium salt groups) Conductive polymers; conductive polymers such as polythiophene, polyaniline, polypyrrole, polyethylenimine, and allylamine-based polymers; etc. These antistatic agents may be used alone or in combination of two or more.

作為上述無機導電性物質,可列舉:氧化錫、氧化銻、氧化銦、氧化鎘、氧化鈦、氧化鋅、銦、錫、銻、金、銀、銅、鋁、鎳、鉻、鈦、鐵、鈷、碘化銅、ITO(氧化銦/氧化錫)、ATO(氧化銻/氧化錫)等。該等無機導電性物質可單獨使用一種,亦可組合兩種以上使用。 Examples of the inorganic conductive substance include tin oxide, antimony oxide, indium oxide, cadmium oxide, titanium oxide, zinc oxide, indium, tin, antimony, gold, silver, copper, aluminum, nickel, chromium, titanium, iron, Cobalt, copper iodide, ITO (indium oxide/tin oxide), ATO (antimony oxide/tin oxide), etc. These inorganic conductive substances may be used alone or in combination of two or more.

作為上述防靜電劑,可列舉陽離子型防靜電劑、陰離子型防靜電劑、兩性離子型防靜電劑、非離子型防靜電劑、將具有上述陽離子型、陰離子型、兩性離子型之離子性導電性基之單體聚合或共聚而獲得之離子導電性聚合物等。 Examples of the antistatic agent include cationic antistatic agents, anionic antistatic agents, zwitterionic antistatic agents, nonionic antistatic agents, and ionic conductive agents having the above cationic, anionic, and zwitterionic types. Ion-conducting polymer obtained by polymerizing or copolymerizing monomers with a sex group.

<黏合劑> <adhesive>

上述面塗層之特徵在於,含有作為黏合劑之聚酯樹脂,作為必要成分。上述聚酯樹脂為含有聚酯作為主要成分(典型而言為占超過50質量%,較佳為75質量%以上,例如90質量%以上之成分)之樹脂材料。上述聚酯典型而言較佳為具有選自一分子中具有兩個以上羧基之多元羧酸系(典型而言為二元羧酸系)及其衍生物(該多元羧酸之酸酐、酯化物、醯鹵等)中之一種或兩種以上之化合物(多元羧酸成分)與選自一分子中具有兩個以上羥基之多元醇系(典型而言為二元醇系)中之一種或兩種以上之化合物(多元醇成分)縮合而成之構造。 The above-mentioned top coat is characterized by containing a polyester resin as a binder as an essential component. The above-mentioned polyester resin is a resin material containing polyester as a main component (typically, it accounts for more than 50% by mass, preferably 75% by mass or more, for example, 90% by mass or more). The above-mentioned polyester is typically preferably selected from a polycarboxylic acid system (typically a dicarboxylic acid system) having two or more carboxyl groups in one molecule and its derivative (anhydride or esterified product of the polycarboxylic acid) , Acyl halide, etc.), one or two or more compounds (polycarboxylic acid components) and one or two selected from polyols (typically diols) with two or more hydroxyl groups in one molecule A structure formed by condensation of more than one compound (polyol component).

作為可用作上述多元羧酸成分之化合物之例,可列舉:草酸、 丙二酸、二氟丙二酸、烷基丙二酸、琥珀酸、四氟琥珀酸、烷基琥珀酸、(±)-蘋果酸、內消旋酒石酸、衣康酸、馬來酸、甲基馬來酸、富馬酸、甲基富馬酸、乙炔二甲酸、戊二酸、六氟戊二酸、甲基戊二酸、戊烯二酸、己二酸、二硫代己二酸、甲基己二酸、二甲基己二酸、四甲基己二酸、亞甲基己二酸、己二烯二酸、半乳糖二酸、庚二酸、辛二酸、全氟辛二酸、3,3,6,6-四甲基辛二酸、壬二酸、癸二酸、全氟癸二酸、十三烷二酸、十四烷二酸、十五烷二酸、十六烷二酸等脂肪族二元羧酸類;環烷基二羧酸(例如,1,4-環己烷二甲酸、1,2-環己烷二甲酸)、1,4-(2-降冰片烯)二甲酸、5-降冰片烯-2,3-二甲酸(納迪克酸)、金剛烷二甲酸、螺庚烷二甲酸等脂環式二元羧酸類;鄰苯二甲酸、間苯二甲酸、二硫代間苯二甲酸、甲基間苯二甲酸、二甲基間苯二甲酸、氯間苯二甲酸、二氯間苯二甲酸、對苯二甲酸、甲基對苯二甲酸、二甲基對苯二甲酸、氯對苯二甲酸、溴對苯二甲酸、萘二甲酸、氧芴二甲酸、蒽二甲酸、聯苯二甲酸、聯苯烯二甲酸、二甲基聯苯烯二甲酸、4,4"-對伸苯基二甲酸、4,4"-對四聯苯二甲酸、聯苄二甲酸、偶氮苯二甲酸、高鄰苯二酸、伸苯基二乙酸、伸苯基二丙酸、萘二甲酸、萘二丙酸、聯苯二乙酸、聯苯二丙酸、3,3'-[4,4'-(亞甲基二對聯苯基)二丙酸]、4,4'-聯苄二乙酸、3,3'-(4,4'-聯苄)二丙酸、氧基二對伸苯基二乙酸等芳香族二元羧酸類;上述任意一種多元羧酸之酸酐;上述任意一種多元羧酸之酯(例如烷基酯,可為單酯、二酯等);與上述任意一種多元羧酸對應之醯鹵(例如二元羧酸醯氯);等。 Examples of compounds that can be used as the above-mentioned polycarboxylic acid component include oxalic acid, Malonic acid, difluoromalonic acid, alkylmalonic acid, succinic acid, tetrafluorosuccinic acid, alkylsuccinic acid, (±)-malic acid, mesotartaric acid, itaconic acid, maleic acid, methyl formic acid Base maleic acid, fumaric acid, methyl fumaric acid, acetylenedicarboxylic acid, glutaric acid, hexafluoroglutaric acid, methylglutaric acid, glutaric acid, adipic acid, dithioadipic acid , Methyl adipic acid, dimethyl adipic acid, tetramethyl adipic acid, methylene adipic acid, adipic acid, galactaric acid, pimelic acid, suberic acid, perfluorooctyl Diacid, 3,3,6,6-tetramethyl suberic acid, azelaic acid, sebacic acid, perfluorosebacic acid, tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, Aliphatic dicarboxylic acids such as hexadecanedioic acid; cycloalkyl dicarboxylic acids (for example, 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid), 1,4-(2- (Norbornene) dicarboxylic acid, 5-norbornene-2,3-dicarboxylic acid (Nadic acid), adamantane dicarboxylic acid, spiroheptane dicarboxylic acid and other alicyclic dicarboxylic acids; phthalic acid, m Phthalic acid, dithioisophthalic acid, methylisophthalic acid, dimethylisophthalic acid, chloroisophthalic acid, dichloroisophthalic acid, terephthalic acid, methyl terephthalic acid Formic acid, dimethyl terephthalic acid, chloroterephthalic acid, bromoterephthalic acid, naphthalene dicarboxylic acid, oxyfluorene dicarboxylic acid, anthracene dicarboxylic acid, diphthalic acid, biphenylene dicarboxylic acid, dimethyl dicarboxylic acid Phthalic acid, 4,4"-p-phenylene dicarboxylic acid, 4,4"-p-terephthalic acid, bibenzyl dicarboxylic acid, azophthalic acid, homophthalic acid, phenylenedicarboxylic acid Acetic acid, phenylenedipropionic acid, naphthalene dicarboxylic acid, naphthalene dipropionic acid, biphenyl diacetic acid, biphenyl dipropionic acid, 3,3'-[4,4'-(methylene di-p-biphenyl) di Propionic acid], 4,4'-bibenzyl diacetic acid, 3,3'-(4,4'-bibenzyl) dipropionic acid, oxydi-p-phenylene diacetic acid and other aromatic dicarboxylic acids; above Anhydride of any kind of polycarboxylic acid; ester of any one of the above polycarboxylic acids (for example, alkyl esters, which can be monoesters, diesters, etc.); halides corresponding to any of the above polycarboxylic acids (for example, dicarboxylic acid amides) Chlorine); etc.

作為可用作上述多元羧酸成分之化合物之較佳例,可列舉對苯二甲酸、間苯二甲酸、萘二甲酸等芳香族二元羧酸系及其酸酐;己二酸、癸二酸、壬二酸、琥珀酸、富馬酸、馬來酸、納迪克酸、1,4-環己烷二甲酸等脂肪族二元羧酸系及其酸酐;以及上述二元羧酸系之低級烷基酯(例如,與碳原子數1~3之一元醇之酯)等。 Preferred examples of the compound usable as the above-mentioned polycarboxylic acid component include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, and naphthalene dicarboxylic acid and their anhydrides; adipic acid and sebacic acid , Azelaic acid, succinic acid, fumaric acid, maleic acid, nadic acid, 1,4-cyclohexanedicarboxylic acid and other aliphatic dicarboxylic acids and their anhydrides; and the lower dicarboxylic acids Alkyl esters (for example, esters with a monohydric alcohol having 1 to 3 carbon atoms), etc.

另一方面,作為可用作上述多元醇成分之化合物之例,可列舉:乙二醇、丙二醇、1,2-丙二醇、1,3-丙二醇、1,3-丁二醇、1,4-丁二醇、新戊二醇、1,5-戊二醇、1,6-己二醇、3-甲基戊二醇、二乙二醇、1,4-環己烷二甲醇、3-甲基-1,5-戊二醇、2-甲基-1,3-丙二醇、2,2-二乙基-1,3-丙二醇、2-丁基-2-乙基-1,3-丙二醇、苯二甲醇、氫化雙酚A、雙酚A等二元醇系。作為其他例,可列舉該等化合物之環氧烷加成物(例如,環氧乙烷加成物、環氧丙烷加成物等)。 On the other hand, examples of compounds that can be used as the polyol component include ethylene glycol, propylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, and 1,4-. Butylene glycol, neopentyl glycol, 1,5-pentanediol, 1,6-hexanediol, 3-methylpentanediol, diethylene glycol, 1,4-cyclohexanedimethanol, 3- Methyl-1,5-pentanediol, 2-methyl-1,3-propanediol, 2,2-diethyl-1,3-propanediol, 2-butyl-2-ethyl-1,3- Glycols such as propylene glycol, benzenedimethanol, hydrogenated bisphenol A, and bisphenol A. As other examples, alkylene oxide adducts of these compounds (for example, ethylene oxide adducts, propylene oxide adducts, etc.) may be mentioned.

上述聚酯樹脂之分子量以藉由凝膠滲透色譜法(GPC)測定之按標準聚苯乙烯換算之重量平均分子量(Mw)計可為例如5×103~1.5×105左右(較佳為1×104~6×104左右)。另外,上述聚酯樹脂之玻璃轉移溫度(Tg)可為例如0℃~120℃(較佳為10℃~80℃)。 The molecular weight of the polyester resin may be, for example, about 5×10 3 to 1.5×10 5 in terms of weight average molecular weight (Mw) in terms of standard polystyrene measured by gel permeation chromatography (GPC) (preferably 1×10 4 ~6×10 4 or so). In addition, the glass transition temperature (Tg) of the polyester resin may be, for example, 0°C to 120°C (preferably 10°C to 80°C).

作為上述聚酯樹脂,可使用市售之東洋紡公司製造之商品名「Vylonal」等。 As the above-mentioned polyester resin, a commercial name "Vylonal" manufactured by Toyobo Corporation can be used.

於不明顯損害此處所揭示之黏著片材之性能(例如防靜電性等性能)之範圍內,上述面塗層可進而含有選自聚酯樹脂以外之樹脂(例如選自丙烯酸系樹脂、丙烯酸-胺基甲酸酯樹脂、丙烯酸-苯乙烯樹脂、丙烯酸-聚矽氧樹脂、聚矽氧樹脂、聚矽氮烷樹脂、聚胺基甲酸酯樹脂、氟樹脂、聚烯烴樹脂等中之一種或兩種以上樹脂)作為黏合劑。作為此處所揭示之技術之較佳一態樣,為面塗層之黏合劑實質上僅包含聚酯樹脂之情形。例如,較佳為聚酯樹脂於黏合劑中所占之比例為98~100質量%之面塗層。黏合劑於面塗層整體中所占之比例例如可設定為50~95質量%,通常設定為60~90質量%較為適當。 To the extent that it does not significantly impair the performance of the adhesive sheet disclosed here (such as antistatic properties and the like), the above-mentioned top coat layer may further contain resins other than polyester resins (such as acrylic resins, acrylic- One of urethane resin, acrylic-styrene resin, acrylic-polysiloxane resin, polysiloxane resin, polysilazane resin, polyurethane resin, fluororesin, polyolefin resin, etc. or Two or more resins) as a binder. As a preferred aspect of the technique disclosed here, it is the case where the binder of the top coat layer essentially contains only polyester resin. For example, a top coat in which the proportion of polyester resin in the binder is 98 to 100% by mass is preferred. The proportion of the adhesive in the entire topcoat layer can be set to, for example, 50 to 95% by mass, and usually set to 60 to 90% by mass.

<潤滑劑> <Lubricant>

此處所揭示之技術中之面塗層使用脂肪醯胺作為潤滑劑為較佳之態樣。藉由使用脂肪醯胺作為潤滑劑,即便面塗層之表面不實施進一步之剝離處理(例如,塗佈聚矽氧系剝離劑、長鏈烷基系剝離劑等 公知之剝離處理劑並乾燥之處理)之態樣中,亦可獲得兼顧充分之潤滑性及印字密著性之面塗層,因此可成為較佳之態樣。如此不於面塗層之表面實施進一步之剝離處理之態樣,就可將由剝離處理劑造成之白化(例如,於加熱加濕條件下保存而造成之白化)防患於未然等方面而言較佳。另外,就耐溶劑性之方面而言亦較為有利。 It is preferable that the fatty acid amide is used as a lubricant in the topcoat in the technique disclosed here. By using fatty amide as a lubricant, even if the surface of the top coat layer is not subjected to further peeling treatment (for example, applying a silicone-based peeling agent, a long-chain alkyl-based peeling agent, etc. In the aspect of a well-known peeling treatment agent and drying treatment), a top coat that takes into account sufficient lubricity and printing adhesion can also be obtained, so it can be a better aspect. In this way, if no further peeling treatment is performed on the surface of the top coat, the whitening caused by the peeling treatment agent (for example, whitening caused by storage under heating and humidification conditions) can be prevented from occurring in the future. good. In addition, it is more advantageous in terms of solvent resistance.

作為上述脂肪醯胺之具體例,可列舉:月桂醯胺、棕櫚醯胺、硬脂醯胺、山萮醯胺、羥基硬脂醯胺、油醯胺、芥醯胺、N-油烯基棕櫚醯胺、N-硬脂基硬脂醯胺、N-硬脂基油醯胺、N-油烯基硬脂醯胺、N-硬脂基芥醯胺、羥甲基硬脂醯胺、亞甲基雙硬脂醯胺、伸乙基雙癸醯胺、伸乙基雙月桂醯胺、伸乙基雙硬脂醯胺、伸乙基雙羥基硬脂醯胺、伸乙基雙山萮醯胺、六亞甲基雙硬脂醯胺、六亞甲基雙山萮醯胺、六亞甲基雙羥基硬脂醯胺、N,N'-二硬脂基己二酸醯胺、N,N'-二硬脂基癸二酸醯胺、伸乙基雙油醯胺、伸乙基雙芥醯胺、六亞甲基雙油醯胺、N,N'-二油烯基己二酸醯胺、N,N'-二油烯基癸二酸二醯胺、間苯二亞甲基雙硬脂醯胺、間苯二亞甲基雙羥基硬脂醯胺、N,N'-二硬脂基間苯二甲酸二醯胺等。該等潤滑劑可單獨使用一種,亦可組合兩種以上使用。 As specific examples of the above-mentioned fatty amides, lauramide, palmamide, stearylamide, behenamide, hydroxystearylamide, oleamide, erucamide, N-oleyl palmitate Acetamide, N-stearyl stearamide, N-stearyl oleamide, N-oleyl stearamide, N-stearyl mustardamide, hydroxymethyl stearylamide, sub Methyl bis-stearyl amide, ethyl bis-decyl amide, ethyl bis-lauryl amide, ethyl bis-stearyl amide, ethyl bis-hydroxy-stearyl amide, ethyl bis-stilbene amide Amine, hexamethylene bis-stearyl amide, hexamethylene bis-behenamide, hexamethylene bis-hydroxy stearyl amide, N,N'-distearyl adipate amide, N, N'-distearyl sebacate amide, ethyl bis oleamide, ethyl bis erucamide, hexamethylene bis oleamide, N,N'-dioleyl adipic acid Acetamide, N,N'-dioleyl sebacate diacrylamide, m-xylylenedimethylene bisstearylamide, m-xylylenedimethylene bishydroxystearamide, N,N'-di Stearyl diisocyanate, etc. These lubricants can be used alone or in combination of two or more.

潤滑劑於上述面塗層整體中所占之比例可設定為1~50質量%,通常設定為5~40質量%較為適當。若潤滑劑之含有比例過少,則具有潤滑性容易下降之傾向。若潤滑劑之含有比例過多,則可能有時印字密著性下降。 The proportion of the lubricant in the entire topcoat layer can be set to 1 to 50% by mass, usually 5 to 40% by mass is more appropriate. If the content of the lubricant is too small, the lubricity tends to decrease. If the content of lubricant is too large, the adhesion of printing may be reduced.

此處所揭示之技術,於不明顯損害其應用效果之限定內,可以面塗層除了上述脂肪醯胺以外進而含有其他潤滑劑之態樣實施。作為上述其他潤滑劑之例,可列舉石油系蠟(石蠟等)、礦物系蠟(褐煤蠟等)、高級脂肪酸(蠟酸等)、中性脂肪(甘油三棕櫚酸酯等)等各種蠟。或者,除了上述蠟以外,可輔助地含有一般之聚矽氧系潤滑劑、氟系 潤滑劑等。此處所揭示之技術,可較佳以實質上不含有上述聚矽氧系潤滑劑、氟系潤滑劑等之態樣實施。但是,於不明顯損害此處所揭示之技術之應用效果之限度內,並不排除含有以與潤滑劑不同之目的(例如,作為下述面塗層用組合物之消泡劑)使用之聚矽氧系化合物。 The technique disclosed here can be implemented in a state where the top coat contains other lubricants in addition to the above-mentioned fatty amides, within a limit that does not significantly impair its application effect. Examples of the other lubricants mentioned above include various waxes such as petroleum waxes (paraffin wax, etc.), mineral waxes (montan wax, etc.), higher fatty acids (waxic acid, etc.), neutral fats (glycerin tripalmitate, etc.). Alternatively, in addition to the above waxes, general silicone lubricants and fluorine Lubricants, etc. The technique disclosed here can be preferably implemented without substantially containing the above-mentioned silicone lubricant, fluorine lubricant, or the like. However, to the extent that it does not significantly impair the application effect of the technology disclosed herein, it does not exclude the inclusion of polysilicon used for purposes other than lubricants (for example, as a defoamer for the composition for topcoat described below) Oxygen compounds.

<交聯劑> <crosslinking agent>

上述面塗層之特徵在於,含有作為交聯劑之異氰酸酯系交聯劑。藉由使用上述異氰酸酯系交聯劑,於形成面塗層時能夠將作為必要成分之水溶性之聚苯胺磺酸固定化於黏合劑中,可實現耐水性優異以及印字密著性提高等效果。 The above-mentioned top coat layer is characterized by containing an isocyanate-based cross-linking agent as a cross-linking agent. By using the isocyanate-based cross-linking agent, water-soluble polyaniline sulfonic acid as an essential component can be immobilized in the adhesive when forming the topcoat layer, and effects such as excellent water resistance and improved printing adhesion can be achieved.

另外,較佳之態樣為使用於水溶液中亦穩定之封端化之異氰酸酯系交聯劑作為上述異氰酸酯系交聯劑。作為上述封端化之異氰酸酯系交聯劑之具體例,可使用用醇類、酚類、硫酚類、胺類、醯亞胺類、肟類、內醯胺類、活性亞甲基化合物類、硫醇類、亞胺類、脲類、二芳基化合物類以及亞硫酸氫鈉等將一般之黏著劑層或面塗層之製備時可使用之異氰酸酯系交聯劑(例如,下述黏著劑層中使用之異氰酸酯化合物(異氰酸酯系交聯劑))封端而獲得者。 In addition, a preferred aspect is to use a blocked isocyanate-based crosslinking agent that is stable in an aqueous solution as the isocyanate-based crosslinking agent. As specific examples of the blocked isocyanate-based crosslinking agent, alcohols, phenols, thiophenols, amines, amide imines, oximes, lactams, active methylene compounds can be used , Thiols, imines, ureas, diaryl compounds, sodium bisulfite and other isocyanate-based crosslinking agents that can be used in the preparation of general adhesive layers or topcoats (for example, the following adhesive The isocyanate compound (isocyanate-based crosslinking agent) used in the agent layer is blocked and obtained.

此處所揭示之技術中之面塗層可根據需要含有抗氧化劑、著色劑(顏料、染料等)、流動性調節劑(觸變劑、增稠劑等)、成膜助劑、界面活性劑(消泡劑等)、防腐劑、紫外線吸收劑、分散劑、防黏連劑等添加劑。 The topcoat in the technology disclosed here may contain antioxidants, colorants (pigments, dyes, etc.), fluidity modifiers (thixotropic agents, thickeners, etc.), film-forming aids, surfactants ( Anti-foaming agents, etc.), preservatives, ultraviolet absorbers, dispersants, anti-blocking agents and other additives.

<面塗層之形成> <Formation of top coat>

上述面塗層可適當地利用包括將上述導電性聚合物成分等必要成分以及根據需要使用之添加劑溶解於適當之溶劑(水等)中而成之液狀組合物(面塗層用組合物)賦予於樹脂層上之方法形成。例如,可較佳採用將上述面塗層用組合物塗佈於樹脂層之第一面並乾燥,並且根據需要進行硬化處理(熱處理、紫外線處理等)之方法。上述面塗層用 組合物之NV(不揮發成分)可設為例如5質量%以下(典型而言為0.05~5質量%),通常設為1質量%以下(典型而言為0.10~1質量%)較為適當。於形成厚度較小之面塗層之情形時,較佳為將上述面塗層用組合物之NV設為例如0.05~0.50質量%(例如0.10~0.40質量%)。藉由使用如此低NV之面塗層用組合物,可形成更均勻之面塗層。 The above-mentioned top coat layer can be suitably used as a liquid composition (composition for top coat layer) including essential components such as the above-mentioned conductive polymer component and additives used as needed in a suitable solvent (water, etc.) Formed by the method applied to the resin layer. For example, a method of applying the above composition for top coat to the first surface of the resin layer and drying it, and performing hardening treatment (heat treatment, ultraviolet treatment, etc.) as necessary. For top coating The NV (nonvolatile content) of the composition may be, for example, 5 mass% or less (typically 0.05 to 5 mass%), and usually 1 mass% or less (typically 0.10 to 1 mass%). In the case of forming a top coat with a small thickness, it is preferable to set the NV of the top coat composition to, for example, 0.05 to 0.50% by mass (for example, 0.10 to 0.40% by mass). By using such a low NV composition for topcoat, a more uniform topcoat can be formed.

作為構成上述面塗層用組合物(面塗層形成用塗佈材料)之溶劑,較佳為能夠穩定地溶解面塗層之形成成分者。上述溶劑可為有機溶劑、水或者該等之混合溶劑。作為上述有機溶劑,可使用例如選自乙酸乙酯等酯類;甲基乙基酮、丙酮、環己酮等酮類;四氫呋喃(THF)、二氧雜環己烷等環狀醚類;正己烷、環己烷等脂肪族或脂環族烴類;甲苯、二甲苯等芳香族烴類;甲醇、乙醇、正丙醇、異丙醇、環己醇等脂肪族或脂環族醇類;伸烷基二醇單烷基醚(例如乙二醇單甲醚、乙二醇單乙醚)、二伸烷基二醇單烷基醚等二醇醚類;等中之一種或兩種以上。於較佳一態樣中,上述面塗層用組合物之溶劑為水或者以水作為主要成分之混合溶劑(例如水與乙醇之混合溶劑)。 As a solvent constituting the above-mentioned composition for top coat (coating material for forming a top coat), it is preferable to be capable of stably dissolving the forming component of the top coat. The above solvent may be an organic solvent, water, or a mixed solvent of these. As the organic solvent, for example, esters selected from ethyl acetate; ketones such as methyl ethyl ketone, acetone, and cyclohexanone; cyclic ethers such as tetrahydrofuran (THF) and dioxane; n-hexyl Aliphatic or alicyclic hydrocarbons such as alkanes and cyclohexane; aromatic hydrocarbons such as toluene and xylene; aliphatic or alicyclic alcohols such as methanol, ethanol, n-propanol, isopropanol and cyclohexanol; Alkyl glycol monoalkyl ethers (eg ethylene glycol monomethyl ether, ethylene glycol monoethyl ether), dialkylene glycol monoalkyl ethers and other glycol ethers; one or more of them. In a preferred aspect, the solvent of the composition for a top coat is water or a mixed solvent containing water as a main component (for example, a mixed solvent of water and ethanol).

<面塗層之性狀> <Properties of Topcoat>

此處所揭示之技術中之面塗層之厚度典型而言為3nm~500nm,較佳為10nm~100nm,更佳為20nm~60nm。若面塗層之厚度過小,則難以均勻地形成面塗層(例如,對於面塗層之厚度而言,根據部位不同,厚度之差異增大),因此可能有時黏著片材之外觀容易產生不均勻。另一方面,若厚度過厚,則有時對樹脂層之特性(光學特性、尺寸穩定性等)產生影響。 The thickness of the top coat in the technology disclosed here is typically 3 nm to 500 nm, preferably 10 nm to 100 nm, and more preferably 20 nm to 60 nm. If the thickness of the topcoat layer is too small, it is difficult to form a topcoat layer uniformly (for example, the thickness of the topcoat layer varies depending on the location, and the difference in thickness increases), so the appearance of the adhesive sheet may be easily generated Uneven. On the other hand, if the thickness is too thick, it may affect the characteristics (optical characteristics, dimensional stability, etc.) of the resin layer.

此處所揭示之黏著片材之較佳一態樣中,於面塗層之表面測定之表面電阻率(Ω/□)較佳為未達1.0×1011,更佳為未達5.0×1010,進而較佳為未達1.5×1010。顯示上述範圍內之表面電阻率之黏著片材,例如可適合用作液晶單元或半導體裝置等避忌靜電之物品之加工或運送 過程等中使用之黏著片材。再者,上述表面電阻率可由使用市售之絕緣電阻測定裝置於23℃、50%RH之氣氛下測定之表面電阻率而計算出。 In a preferred aspect of the adhesive sheet disclosed herein, the surface resistivity (Ω/□) measured on the surface of the top coat is preferably less than 1.0×10 11 , more preferably less than 5.0×10 10 It is further preferably less than 1.5×10 10 . The adhesive sheet showing the surface resistivity within the above range can be suitably used as an adhesive sheet for processing or transporting articles that avoid static electricity, such as liquid crystal cells or semiconductor devices. Furthermore, the above-mentioned surface resistivity can be calculated from the surface resistivity measured using a commercially available insulation resistance measuring device under an atmosphere of 23° C. and 50% RH.

此處所揭示之黏著片材較佳為具有其背面(面塗層之表面)可使用水性油墨或油性油墨(例如使用油性記號筆)容易地印字之性質。上述黏著片材適合於貼附有黏著片材之狀態下進行之被接著體(例如光學零件)之加工或運送等過程中將作為保護對象之被接著體之識別編號等記載於上述黏著片材上並顯示。因此,較佳為印字性優異之黏著片材。例如,較佳為對溶劑為醇系且含有顏料之類型之油性油墨具有高印字性。另外,較佳為印字後之油墨不容易因刮擦或轉印而除去(即,印字密著性優異)。此處所揭示之黏著片材進而較佳為具有於修正或消除印字時即便用醇(例如乙醇)擦拭印字外觀上亦不產生明顯變化之程度之耐溶劑性。 The adhesive sheet disclosed herein preferably has a property that the back surface (surface of the top coat) can be easily printed using water-based ink or oil-based ink (for example, using an oil-based marker). The above-mentioned adhesive sheet is suitable for describing the identification number of the adherend to be protected, etc. in the above-mentioned adhesive sheet during the processing or transportation of the adherend (e.g., optical component) in the state where the adhesive sheet is attached Go up and display. Therefore, an adhesive sheet excellent in printability is preferred. For example, it is preferable to have high printability for oil-based inks in which the solvent is an alcohol and contains pigments. In addition, it is preferable that the ink after printing is not easily removed by scratching or transfer (that is, the printing adhesion is excellent). The adhesive sheet disclosed herein preferably has solvent resistance to such an extent that it does not cause a significant change in the appearance of the printing even when alcohol (such as ethanol) is used to wipe the printing when correcting or eliminating the printing.

此處所揭示之黏著片材可以除了樹脂層、接著層、黏著劑層以及面塗層以外進而包含其他層之態樣實施。作為上述「其他層」之配置,可例示第一樹脂層之第一面(背面)與面塗層之間、第二樹脂層之第二面(正面)與黏著劑層之間等。於第一樹脂層之背面與面塗層之間配置之層例如可為含有防靜電成分之層(上述面塗層)。於第二樹脂層之正面與黏著劑層之間配置之層例如可為提高黏著劑層對上述第二面之錨固性之底塗層(錨固層)、面塗層等。可為於第二樹脂層之正面配置有面塗層、於面塗層上配置有錨固層、並於其上配置有黏著劑層之構成之黏著片材。 The adhesive sheet disclosed herein can be implemented in a manner that it includes other layers in addition to the resin layer, the adhesive layer, the adhesive layer, and the top coat. As the arrangement of the "other layers", the first resin layer between the first surface (back surface) and the topcoat layer, the second resin layer between the second surface (front surface) and the adhesive layer, etc. can be exemplified. The layer disposed between the back surface of the first resin layer and the top coat layer may be, for example, a layer containing an antistatic component (the above top coat layer). The layer disposed between the front surface of the second resin layer and the adhesive layer may be, for example, an undercoat layer (anchor layer) or a topcoat layer that improves the anchorability of the adhesive layer to the second surface. It may be an adhesive sheet composed of a topcoat layer disposed on the front surface of the second resin layer, an anchor layer disposed on the topcoat layer, and an adhesive layer disposed thereon.

本發明之光學構件較佳為由上述黏著片材保護。上述黏著片材之防靜電性、或拾取性等優異,因此可用於加工、運送、出貨時等之表面保護用途(黏著片材),對於保護上述光學構件(偏光板等)之表面較為有用。特別是可用於容易產生靜電之塑膠製品等,因此於靜電成 為特別嚴重之問題之光學、電子零件相關之技術領域中,於防靜電用途中非常有用。 The optical member of the present invention is preferably protected by the above-mentioned adhesive sheet. The above-mentioned adhesive sheet is excellent in antistatic property, pick-up property, etc., so it can be used for surface protection applications (adhesive sheet) during processing, transportation, shipping, etc., and is more useful for protecting the surface of the above optical member (polarizing plate, etc.) . In particular, it can be used for plastic products that are prone to static electricity. It is a very serious problem in the technical field related to optical and electronic parts, and is very useful in antistatic applications.

另外,本發明之黏著片材之總厚度較佳為14μm~400μm,更佳為40μm~200μm,最佳為55μm~100μm。若於上述範圍內,則黏著特性(再剝離性、接著性等)、作業性、外觀特性優異,為較佳之態樣。再者,上述總厚度係指包括樹脂層、接著層、黏著劑層以及面塗層等全部層之厚度之合計。 In addition, the total thickness of the adhesive sheet of the present invention is preferably 14 μm to 400 μm, more preferably 40 μm to 200 μm, and most preferably 55 μm to 100 μm. Within the above range, the adhesive properties (repeelability, adhesiveness, etc.), workability, and appearance characteristics are excellent, which is a preferable aspect. Furthermore, the above-mentioned total thickness refers to the total thickness of all layers including the resin layer, the adhesive layer, the adhesive layer, and the top coat layer.

[實施例] [Example]

以下,對於與本發明相關之一些實施例進行說明,但無意將本發明限定於上述具體例所示之內容。再者,以下之說明中,除非另有說明,「份」及「%」為質量基準。 Hereinafter, some embodiments related to the present invention will be described, but it is not intended to limit the present invention to the contents shown in the above specific examples. In addition, in the following description, unless otherwise stated, "parts" and "%" are quality standards.

另外,以下之說明中之各特性各自如下進行測定或評價。 In addition, each characteristic in the following description is measured or evaluated as follows.

<重量平均分子量(Mw)之測定> <Measurement of weight average molecular weight (Mw)>

重量平均分子量(Mw)使用東曹股份有限公司製造之GPC裝置(HLC-8220GPC)進行測定。測定條件如下所述。 The weight average molecular weight (Mw) was measured using a GPC device (HLC-8220GPC) manufactured by Tosoh Corporation. The measurement conditions are as follows.

樣品濃度:0.2質量%(THF溶液) Sample concentration: 0.2% by mass (THF solution)

樣品注入量:10μl Sample injection volume: 10μl

溶離液:THF Dissolution solution: THF

流速:0.6ml/min Flow rate: 0.6ml/min

測定溫度:40℃ Measuring temperature: 40℃

管柱: Column:

樣品柱:TSKguardcolumn SuperHZ-H(1根)+TSKgel SuperHZM-H(2根) Sample column: TSKguardcolumn SuperHZ-H (1 piece) + TSKgel SuperHZM-H (2 pieces)

參比管柱:TSKgel SuperH-RC(1根) Reference column: TSKgel SuperH-RC (1 piece)

檢測器:示差折射計(RI) Detector: Differential Refractometer (RI)

再者,重量平均分子量係利用聚苯乙烯換算值求出。 In addition, the weight-average molecular weight is calculated using polystyrene conversion values.

<玻璃轉移溫度(Tg)> <glass transition temperature (Tg)>

玻璃轉移溫度Tg(℃)使用下述之文獻值作為各單體之均聚物之玻璃轉移溫度Tgn(℃)並利用下式求出。 The glass transition temperature Tg (°C) was determined by the following formula using the following literature value as the glass transition temperature Tgn (°C) of the homopolymer of each monomer.

式:1/(Tg+273)=Σ[Wn/(Tgn+273)][式中,Tg(℃)表示共聚物之玻璃轉移溫度,Wn(-)表示各單體之重量分率,Tgn(℃)表示各單體之均聚物之玻璃轉移溫度,n表示各單體之種類]。 Formula: 1/(Tg+273)=Σ[Wn/(Tgn+273)] [In the formula, Tg(℃) represents the glass transition temperature of the copolymer, Wn(-) represents the weight fraction of each monomer, Tgn (°C) represents the glass transition temperature of the homopolymer of each monomer, and n represents the type of each monomer].

文獻值: Literature value:

丙烯酸2-乙基己酯(2EHA):-70℃ 2-Ethylhexyl acrylate (2EHA): -70℃

丙烯酸正丁酯(BA):-55℃ N-butyl acrylate (BA): -55℃

丙烯酸2-羥基乙酯(HEA):-15℃ 2-Hydroxyethyl acrylate (HEA): -15℃

丙烯酸(AA):106℃ Acrylic acid (AA): 106℃

另外,作為文獻值,參考「丙烯酸系樹脂之合成、設計及新用途展望」(中央經營開發中心出版部發行)以及「Polymer Handbook」(John Wiley & Sons)、單體製造商產品目錄值。 In addition, as literature values, refer to "Synthesis, Design, and New Use Prospects of Acrylic Resins" (published by the Central Business Development Center Publishing Department), "Polymer Handbook" (John Wiley & Sons), and monomer manufacturer catalog values.

另外,關於由文獻值未知之單體獲得之(甲基)丙烯酸系聚合物之玻璃轉移溫度(Tg)(℃),利用下述步驟進行動態黏彈性測定而決定。 In addition, the glass transition temperature (Tg) (°C) of the (meth)acrylic polymer obtained from a monomer whose literature value is unknown is determined by dynamic viscoelasticity measurement using the following procedure.

首先,將厚度20μm之(甲基)丙烯酸系聚合物片材積層至約2mm之厚度,將所得物體沖裁為

Figure 104143004-A0202-12-0041-16
7.9mm,製作圓柱狀之顆粒,作為玻璃轉移溫度(Tg)測定用樣品。 First, the (meth)acrylic polymer sheet with a thickness of 20 μm is laminated to a thickness of about 2 mm, and the resulting object is punched out as
Figure 104143004-A0202-12-0041-16
At 7.9mm, cylindrical particles were prepared and used as samples for measuring the glass transition temperature (Tg).

使用上述測定用樣品,將上述測定用樣品固定於

Figure 104143004-A0202-12-0041-17
7.9mm平行板夾具上,利用動態黏彈性測定裝置(Rheometrics公司製造,ARES)測定損耗彈性模量G"之溫度依賴性,將所獲得之G"曲線達到極大時之溫度作為玻璃轉移溫度(Tg)(℃)。測定條件如下所述。 Using the above measurement sample, the above measurement sample is fixed to
Figure 104143004-A0202-12-0041-17
On a 7.9mm parallel plate fixture, the temperature dependence of the loss elastic modulus G" was measured using a dynamic viscoelasticity measuring device (manufactured by Rheometrics, ARES), and the temperature at which the obtained G" curve reached the maximum was taken as the glass transition temperature (Tg )(℃). The measurement conditions are as follows.

測定:剪切模式 Measurement: shear mode

溫度範圍:-70℃~150℃ Temperature range: -70℃~150℃

升溫速度:5℃/min Heating rate: 5℃/min

頻率:1Hz Frequency: 1Hz

<厚度測定> <thickness measurement>

使用數字式千分尺(安立公司製造,製品名「KC-351C」)進行測定。 A digital micrometer (manufactured by Anritsu, product name "KC-351C") was used for measurement.

<樹脂層之拉伸強度> <Tensile strength of resin layer>

根據JIS C 2318,使用拉伸試驗機(島津製作所製造,製品名「Autograph」)進行測定。 According to JIS C 2318, the measurement was performed using a tensile tester (manufactured by Shimadzu Corporation, product name "Autograph").

<接著層之儲存彈性模數> <Storage elastic modulus of the next layer>

將接著層積層達到約2mm之厚度,將所得物體沖裁為

Figure 104143004-A0202-12-0042-18
7.9mm,製作圓柱狀之顆粒並將其作為測定用樣品。使用上述測定用樣品,將上述測定用樣品固定於
Figure 104143004-A0202-12-0042-19
7.9mm平行板夾具上,使用動態黏彈性測定裝置(Rheometrics公司製造,ARES),測定23℃下之儲存彈性模數G'。測定條件如下所述。 The next layer is laminated to a thickness of about 2mm, and the resulting object is punched into
Figure 104143004-A0202-12-0042-18
7.9 mm, making cylindrical particles and using them as samples for measurement. Using the above measurement sample, the above measurement sample is fixed to
Figure 104143004-A0202-12-0042-19
Using a dynamic viscoelasticity measuring device (manufactured by Rheometrics, ARES) on a 7.9mm parallel plate jig, the storage elastic modulus G'at 23°C was measured. The measurement conditions are as follows.

測定:剪切模式 Measurement: shear mode

頻率:1Hz Frequency: 1Hz

作為本發明中之接著層之儲存彈性模數(23℃),為1.0×104Pa以上且未達5.0×107Pa,較佳為1.0×104Pa以上且未達1.0×107Pa,更佳為1.0×105Pa以上且未達1.0×106Pa。若於上述範圍內,則黏著片材之拾取性良好,為較佳之態樣。 The storage elastic modulus (23°C) of the adhesive layer in the present invention is 1.0×10 4 Pa or more and less than 5.0×10 7 Pa, preferably 1.0×10 4 Pa or more and less than 1.0×10 7 Pa It is more preferably 1.0×10 5 Pa or more and less than 1.0×10 6 Pa. If it is within the above range, the pick-up property of the adhesive sheet is good, which is a preferable aspect.

<表面電阻率之測定> <Measurement of surface resistivity>

於溫度23℃、濕度50%RH之氣氛下,使用電阻率計(三菱化學Analytech製造,Hiresta UP MCP-HT450型),根據JIS K 6911進行測定。 Under an atmosphere of a temperature of 23° C. and a humidity of 50% RH, a resistivity meter (manufactured by Mitsubishi Chemical Analytech, Hiresta UP MCP-HT450 type) was used for measurement in accordance with JIS K 6911.

再者,作為本發明中之表面電阻率(Ω/□),初始以及於室溫(RT)(23℃×50%RH)×1週(7天)靜置之情形時均較佳為未達1.0×1011,更佳為未達5.0×1010,進而較佳為未達1.5×1010。顯示上述範圍內之表面 電阻率之黏著片材例如可適合用作於液晶單元或半導體裝置等避忌靜電之物品之加工或運送過程等中使用之黏著片材。 In addition, as the surface resistivity (Ω/□) in the present invention, the initial and the case of standing at room temperature (RT) (23°C×50%RH)×1 week (7 days) are preferably not Up to 1.0×10 11 , more preferably less than 5.0×10 10 , and even more preferably less than 1.5×10 10 . The adhesive sheet showing the surface resistivity within the above range can be suitably used as an adhesive sheet for processing or transporting articles that avoid static electricity, such as liquid crystal cells or semiconductor devices, for example.

<剝離靜電電壓(偏光板側)之測定> <Measurement of peeling electrostatic voltage (on polarizing plate side)>

將各例之黏著片材1切割為寬度70mm、長度130mm之尺寸,將剝離襯墊剝離後,如圖2所示,利用手動輥壓接於預先除電後之貼合於丙烯酸系樹脂板3(三菱麗陽公司製造,商品名「ACRYLITE」,厚度:1mm,寬度:70mm,長度:100mm)上之偏光板2(日東電工公司製造,SEG1423DU偏光板,寬度:70mm,長度:100mm)之表面上,使黏著片材1之單個端部自偏光板2之邊緣突出30mm。 The adhesive sheet 1 of each example was cut to a size of 70 mm in width and 130 mm in length, and after peeling off the release liner, as shown in FIG. 2, it was pressed onto the acrylic resin plate 3 by manual roller pressure bonding after pre-discharge. On the surface of polarizer 2 (made by Nitto Denko Corporation, SEG1423DU polarizer, width: 70mm, length: 100mm) on the surface of polarizing plate 2 (made by Nitto Denko Corporation, product name "ACRYLITE", thickness: 1mm, width: 70mm, length: 100mm) So that the single end of the adhesive sheet 1 protrudes 30 mm from the edge of the polarizing plate 2.

將該樣品於23℃×50%RH之環境下放置1天後,設置於高度20mm之樣品固定台4之特定位置。將自偏光板2突出30mm之黏著片材1之端部固定於自動捲繞機(未圖示)上,以剝離角度150°、剝離速度10m/min之條件進行剝離。利用固定於距離偏光板2之中央之高度100mm之位置之電位測定器5(春日電機公司製造,型號「KSD-0103」)測定此時產生之被接著體(偏光板)表面之電位作為「初始之偏光板剝離靜電電壓」。測定係於23℃、50%RH之環境下進行。 After the sample was placed in an environment of 23° C.×50% RH for 1 day, it was set at a specific position of the sample fixing table 4 with a height of 20 mm. The end of the adhesive sheet 1 that protruded from the polarizing plate 2 by 30 mm was fixed to an automatic winder (not shown), and peeled at a peeling angle of 150° and a peeling speed of 10 m/min. Use the potentiometer 5 (made by Kasuga Electric Co., Ltd., model "KSD-0103") fixed at a height of 100 mm from the center of the polarizing plate 2 to measure the potential of the surface of the adherend (polarizing plate) generated at this time as the "initial The polarizing plate peels off the static voltage." The measurement was carried out in an environment of 23°C and 50% RH.

本發明中之剝離靜電電壓(kV)(絕對值)較佳為1以下,更佳為0.9以下,進而較佳為0.5以下。若於上述範圍內,則例如可防止液晶驅動器之損傷,為較佳之態樣。 The peeling electrostatic voltage (kV) (absolute value) in the present invention is preferably 1 or less, more preferably 0.9 or less, and still more preferably 0.5 or less. Within the above range, for example, it is possible to prevent damage to the liquid crystal driver, which is a preferable aspect.

<背面黏著力(A)測定> <Measurement of back adhesion (A)>

如圖3所示,將各例之黏著片材1切割為寬度70mm、長度100mm之尺寸,將該黏著片材1之黏著面(設置有黏著劑層20之側)20A用雙面黏著帶130固定於SUS304不鏽鋼板132上。將於樹脂層膜(以第一樹脂層、接著層、第二樹脂層之順序)164上具有丙烯酸系黏著劑162之單面黏著帶(日東電工公司製造,商品名「No.31B」,寬度19mm)160切割為100mm之長度。將該黏著帶160之黏著面162A於0.25 MPa之壓力、0.3m/min之速度之條件下壓接於黏著片材1之背面(即,面塗層14之表面)1A。將所得物體於23℃、50%RH之條件下放置30分鐘。然後,使用萬能拉伸試驗機,於剝離速度0.3m/min、剝離角度180度之條件下將黏著帶160自黏著片材1之背面1A剝離,測定此時之黏著力(A)[N/19mm]。 As shown in FIG. 3, the adhesive sheet 1 of each example is cut into a size of 70 mm in width and 100 mm in length, and the adhesive surface (the side where the adhesive layer 20 is provided) 20A of the adhesive sheet 1 is double-sided adhesive tape 130 Fixed on SUS304 stainless steel plate 132. A single-sided adhesive tape (made by Nitto Denko Corporation, product name "No.31B") with a single-sided adhesive tape (made by Nitto Denko Corporation) on resin layer film (in the order of first resin layer, adhesive layer, and second resin layer) 164 19mm) 160 cut to a length of 100mm. Place the adhesive surface 162A of the adhesive tape 160 at 0.25 Under pressure of MPa and speed of 0.3 m/min, it is pressure-bonded to the back surface of the adhesive sheet 1 (that is, the surface of the top coat 14) 1A. The resulting object was left at 23°C and 50% RH for 30 minutes. Then, using a universal tensile testing machine, the adhesive tape 160 was peeled from the back surface 1A of the adhesive sheet 1 under the conditions of a peeling speed of 0.3 m/min and a peeling angle of 180 degrees, and the adhesion (A)[N/ 19mm].

再者,上述背面黏著力(A)較佳為3.0N/19mm以上,更佳為4.0N/19mm以上,進而較佳為5.0N/19mm以上,最佳為6.0N/19mm以上。若上述黏著力未達3.0N/19mm,則無法獲得充分之黏著力,拾取性變差,保護膜之剝離作業性降低,因此不佳。 In addition, the back surface adhesive force (A) is preferably 3.0 N/19 mm or more, more preferably 4.0 N/19 mm or more, still more preferably 5.0 N/19 mm or more, and most preferably 6.0 N/19 mm or more. If the above-mentioned adhesive force does not reach 3.0 N/19 mm, sufficient adhesive force cannot be obtained, the pick-up property is deteriorated, and the peeling workability of the protective film is reduced, which is not good.

<對偏光板黏著力(B)測定> <Measurement of adhesion to polarizing plate (B)>

準備寬度70mm、長度100mm之平面偏光板(日東電工公司製造之TAC偏光板,SEG1425DU)作為被接著體。將各例之黏著片材切割為寬度25mm、長度100mm之尺寸,將其黏著面於0.25MPa之壓力、0.3m/min之速度之條件下壓接於上述偏光板上。將所得物體於23℃、50%RH之環境下放置30分鐘後,於相同之環境下使用萬能拉伸試驗機在剝離速度0.3m/min、剝離角度180°之條件下將黏著片材自上述偏光板剝離,並測定此時之黏著力(B)[N/25mm]。 Prepare a plane polarizer with a width of 70 mm and a length of 100 mm (TAC polarizer manufactured by Nitto Denko Corporation, SEG1425DU) as the adherend. The adhesive sheet of each example was cut into a size of 25 mm in width and 100 mm in length, and its adhesive surface was pressure-bonded to the polarizing plate under the conditions of a pressure of 0.25 MPa and a speed of 0.3 m/min. After the resulting object was placed in an environment of 23°C and 50% RH for 30 minutes, the adhesive sheet was peeled from the above under the conditions of a peeling speed of 0.3 m/min and a peeling angle of 180° using a universal tensile testing machine. The polarizing plate was peeled off, and the adhesion (B) [N/25mm] at this time was measured.

再者,上述黏著力(B)較佳為2.5N/25mm以下,更佳為2.0N/25mm以下,進而較佳為1.5N/25mm以下,特別較佳為1.0N/25mm以下。若上述黏著力超過2.5N/25mm,則剝離作業性較差,因此不佳。 In addition, the adhesive force (B) is preferably 2.5 N/25 mm or less, more preferably 2.0 N/25 mm or less, further preferably 1.5 N/25 mm or less, and particularly preferably 1.0 N/25 mm or less. If the above adhesive force exceeds 2.5 N/25 mm, the peeling workability is poor, so it is not good.

<拾取性> <pickup>

如圖4所示,將各例之黏著片材1切割為寬度50mm、長度100mm之尺寸,將該黏著片材1之黏著面(設置有黏著劑層20之側)20A以0.25MPa之壓力、0.3m/min之速度壓接於平面偏光板(日東電工公司製造之TAC偏光板,SEG1425DU)50上。 As shown in FIG. 4, the adhesive sheet 1 of each example is cut into a size of 50 mm in width and 100 mm in length, and the adhesive surface (the side where the adhesive layer 20 is provided) 20A of the adhesive sheet 1 is pressed at a pressure of 0.25 MPa. The speed of 0.3m/min is crimped onto the plane polarizing plate (TAC polarizing plate made by Nitto Denko Corporation, SEG1425DU) 50.

將單面黏著帶60(日東電工公司製造,商品名「No.31B」,寬度19mm)切割為寬度10mm、長度50mm。用手將該黏著帶60之黏著劑層(黏著面)62壓接於黏著片材1之寬度50mm之背面(即,面塗層14之表面)之中心上使端部突出30mm。將所得物體於23℃、50%RH之條件下放置10秒。然後,用手將單面黏著帶60剝離,評價黏著片材1之剝離狀況(拾取性)。 The single-sided adhesive tape 60 (manufactured by Nitto Denko Corporation, trade name "No. 31B", width 19 mm) was cut into a width of 10 mm and a length of 50 mm. The adhesive layer (adhesive surface) 62 of the adhesive tape 60 is pressed against the center of the back surface of the adhesive sheet 1 with a width of 50 mm (that is, the surface of the top coat layer 14) by hand so that the end portion protrudes by 30 mm. The resulting object was placed under the conditions of 23°C and 50% RH for 10 seconds. Then, the single-sided adhesive tape 60 was peeled off by hand, and the peeling state (pickability) of the adhesive sheet 1 was evaluated.

評價基準係將黏著片材可剝離之情形評價為○,將無法剝離、黏著片材殘留之情形評價為×。 The evaluation criteria evaluated the case where the adhesive sheet can be peeled off as ○, and the case where the adhesive sheet cannot be peeled off and the adhesive sheet remains as ×.

<撓曲量> <deflection amount>

如圖5所示,將各例之黏著片材1切割為寬度20mm、長度150mm之尺寸,以該黏著片材1之黏著面朝向外側之方式利用日東電工公司製造之No.31B膠帶T將端部固定於玻璃板G上。測定此時之黏著片材之中心位置之高度H1。然後,於中心位置放置4.8g之荷重L,並測定此時之黏著片材之中心位置之高度H2。由下式求出撓曲量[mm]。 As shown in FIG. 5, the adhesive sheet 1 of each example was cut into a size of 20 mm in width and 150 mm in length, and the end of the adhesive sheet 1 was oriented outward using No. 31B tape T manufactured by Nitto Denko Corporation. The part is fixed on the glass plate G. The height H1 of the center position of the adhesive sheet at this time was measured. Then, place a load L of 4.8 g at the center position, and measure the height H2 of the center position of the adhesive sheet at this time. The amount of deflection [mm] is obtained from the following formula.

撓曲量=H1-H2[mm] Deflection = H1-H2 [mm]

再者,上述撓曲量較佳為30mm以下,更佳為25mm以下,進而較佳為20mm以下。若上述撓曲量超過30mm,則貼合有黏著片材之光學構件於運送過程中容易撓曲,因此不佳。 Furthermore, the amount of deflection is preferably 30 mm or less, more preferably 25 mm or less, and still more preferably 20 mm or less. If the above-mentioned deflection amount exceeds 30 mm, the optical member to which the adhesive sheet is attached is likely to deflect during transportation, which is not good.

<印字性(印字密著性)之評價> <Evaluation of printability (printing adhesion)>

於23℃×50%RH之測定環境下使用原子印章公司製造之X壓模於面塗層表面上實施印字後,自其印字之上方貼附米其邦公司製造之Cellotape(註冊商標),然後,於剝離速度30m/min、剝離角度180°之條件下剝離。然後,目視觀察剝離後之表面,將印字面積之50%以上被剝離之情形評價為×(印字性不良)、將印字面積之50%以上未被剝離而殘留之情形評價為○(印字性良好)。 After printing on the surface of the top coat using the X stamper manufactured by Atomic Seal Company under the measurement environment of 23°C×50%RH, attach Cellotape (registered trademark) manufactured by Michelbon from the top of the printing, and then , Peeling under the condition of peeling speed 30m/min and peeling angle 180°. Then, the surface after peeling was visually observed, and the case where 50% or more of the printing area was peeled off was evaluated as × (poor printability), and the case where 50% or more of the printing area was left without peeling off was evaluated as ○ (good printability) ).

以下,說明面塗層、黏著劑組合物(黏著劑溶液)、黏著片材(表 面保護膜)之製備方法。 Hereinafter, the top coat, the adhesive composition (adhesive solution), and the adhesive sheet (table Face protective film) preparation method.

[實施例1] [Example 1] <樹脂層膜(第一樹脂層、接著層及第二樹脂層之順序)之製備> <Preparation of resin layer film (order of first resin layer, adhesive layer and second resin layer)>

於具備冷卻管、氮氣導入管、溫度計及攪拌裝置之反應容器中加入丙烯酸丁酯(BA)100質量份、丙烯酸(AA)5.0質量份、丙烯酸2-羥基乙酯(2HEA)0.075質量份、2,2'-偶氮雙異丁腈0.3質量份及乙酸乙酯,一面於氮氣氣流下攪拌一面於60℃下反應6小時,從而獲得重量平均分子量163萬之丙烯酸系聚合物溶液。相對於該丙烯酸系聚合物溶液之聚合物固形物成分100質量份,添加異氰酸酯系多官能化合物(日本聚胺酯工業公司製造,商品名「Coronate L」)0.6質量份、矽烷偶合劑(信越化學工業公司製造,商品名:KBM403)0.08質量份,從而製備丙烯酸系接著劑1組合物溶液。 100 parts by mass of butyl acrylate (BA), 5.0 parts by mass of acrylic acid (AA), 0.075 parts by mass of 2-hydroxyethyl acrylate (2HEA), 2 0.3 mass parts of 2'-azobisisobutyronitrile and ethyl acetate were reacted at 60°C for 6 hours while stirring under a nitrogen gas flow, thereby obtaining an acrylic polymer solution having a weight average molecular weight of 1.63 million. With respect to 100 parts by mass of the polymer solid content of the acrylic polymer solution, 0.6 parts by mass of an isocyanate-based polyfunctional compound (manufactured by Japan Polyurethane Industry Co., Ltd., trade name "Coronate L") and a silane coupling agent (Shin-Etsu Chemical Industry Co., Ltd.) were added. Manufactured, trade name: KBM403) 0.08 parts by mass to prepare an acrylic adhesive 1 composition solution.

於作為樹脂層之聚酯系樹脂膜(東洋紡公司製造,商品名:E5000,厚度:38μm,拉伸強度:208MPa)上塗佈上述接著劑組合物溶液,並於90℃下加熱,從而形成厚度20μm之接著層。所獲得之接著層之23℃下之儲存彈性模數為1.0×105Pa。 A polyester resin film (manufactured by Toyobo Co., Ltd., trade name: E5000, thickness: 38 μm, tensile strength: 208 MPa) as a resin layer was coated with the above adhesive composition solution and heated at 90° C. to form a thickness Adhesive layer of 20μm. The storage elastic modulus of the obtained adhesive layer at 23° C. was 1.0×10 5 Pa.

然後,於接著層上積層聚酯系樹脂膜(東洋紡公司製造,商品名:E5000,厚度:38μm,拉伸強度:208MPa),從而獲得厚度96μm之樹脂層膜。 Then, a polyester resin film (manufactured by Toyobo Co., Ltd., trade name: E5000, thickness: 38 μm, tensile strength: 208 MPa) was laminated on the adhesive layer to obtain a resin layer film having a thickness of 96 μm.

<丙烯酸系黏著劑1溶液之製備> <Preparation of Acrylic Adhesive 1 Solution>

於具備攪拌葉片、溫度計、氮氣導入管、冷卻器之四口燒瓶中投入丙烯酸2-乙基己酯(2EHA)95質量份、丙烯酸2-羥基乙酯(HEA)5質量份、作為聚合起始劑之2,2'-偶氮雙異丁腈0.2質量份、乙酸乙酯150質量份,一面緩慢攪拌一面導入氮氣,將燒瓶內之液溫保持於65℃附近並進行6小時聚合反應,從而製備(甲基)丙烯酸系聚合物溶液(40質量%)。上述丙烯酸系聚合物之重量平均分子量為55萬,玻璃轉移溫 度(Tg)為-68℃。 Put 95 parts by mass of 2-ethylhexyl acrylate (2EHA) and 5 parts by mass of 2-hydroxyethyl acrylate (HEA) into a four-necked flask equipped with a stirring blade, thermometer, nitrogen introduction tube, and cooler as the polymerization start 0.22 parts by mass of 2,2'-azobisisobutyronitrile and 150 parts by mass of ethyl acetate, nitrogen gas was introduced while slowly stirring, and the liquid temperature in the flask was kept near 65°C and polymerization reaction was carried out for 6 hours, A (meth)acrylic polymer solution (40% by mass) was prepared. The weight average molecular weight of the above acrylic polymer is 550,000, and the glass transition temperature The degree (Tg) is -68°C.

用乙酸乙酯將上述(甲基)丙烯酸系聚合物溶液(40質量%)稀釋為20質量%,於該溶液500質量份(固形物成分100質量份)中添加作為防靜電劑之具有氧伸烷基鏈之有機聚矽氧烷(信越化學公司製造,商品名:KF-6020,HBL:4)0.1質量份(固形物成分0.1質量份)、作為交聯劑之六亞甲基二異氰酸酯之異氰脲酸酯形式(日本聚胺酯工業公司製造,商品名:Coronate HX(C/HX))3質量份(固形物成分3質量份)、作為交聯觸媒之二月桂酸二丁基錫(1質量%乙酸乙酯溶液)2質量份(固形物成分0.02質量份),並進行混合攪拌,從而製備丙烯酸系黏著劑1溶液。 The (meth)acrylic polymer solution (40% by mass) was diluted with ethyl acetate to 20% by mass, and 500 parts by mass of the solution (100 parts by mass of solid content) was added as an antistatic agent with oxygen Alkyl chain organic polysiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KF-6020, HBL: 4) 0.1 parts by mass (solid content 0.1 parts by mass), hexamethylene diisocyanate as a crosslinking agent Isocyanurate form (made by Japan Polyurethane Industry Co., Ltd., trade name: Coronate HX (C/HX)) 3 parts by mass (solid content 3 parts by mass), dibutyltin dilaurate (1 mass) as a crosslinking catalyst % Ethyl acetate solution) 2 parts by mass (solid content 0.02 parts by mass), and the mixture was stirred to prepare an acrylic adhesive 1 solution.

<面塗層用溶液(面塗層1)之製備> <Preparation of solution for top coat (top coat 1)>

將作為黏合劑之聚酯樹脂Vylonal MD-1480(25%水溶液,東洋紡公司製造)、作為導電性聚合物之聚苯胺磺酸(aqua-PASS,重量平均分子量4萬,三菱麗陽公司製造)、作為交聯劑之用二異丙胺封端之六亞甲基二異氰酸酯之異氰脲酸酯形式、作為潤滑劑之油醯胺添加於水/乙醇(1/3)之混合溶劑中,添加以固形物成分量計100質量份之黏合劑、以固形物成分量計75質量份之導電性聚合物、以固形物成分量計10質量份之交聯劑、以固形物成分量計30質量份之潤滑劑,並攪拌約20分鐘充分地進行混合。如此製備NV約0.4%之面塗層用溶液(面塗層1)。 Polyester resin Vylonal MD-1480 (25% aqueous solution, manufactured by Toyobo Co., Ltd.) as a binder, polyaniline sulfonic acid (aqua-PASS, weight average molecular weight of 40,000, manufactured by Mitsubishi Rayon) as a conductive polymer, As isocyanurate of hexamethylene diisocyanate blocked with diisopropylamine as a crosslinking agent, oleamide as a lubricant is added to a mixed solvent of water/ethanol (1/3), added with 100 parts by mass of binder based on the solid content, 75 parts by mass of conductive polymer based on the solid content, 10 parts by mass of crosslinking agent based on the solid content, and 30 parts by mass based on the solid content The lubricant, and stir for about 20 minutes to fully mix. In this way, a solution for topcoat with NV of about 0.4% (topcoat 1) was prepared.

<附面塗層之樹脂層膜(面塗層、第一樹脂層、接著層及第二樹脂層之順序)之製備> <Preparation of the resin layer film with topcoat (the order of topcoat, first resin layer, adhesive layer and second resin layer)>

對上述樹脂層膜之單面實施電暈處理,並於電暈處理面上塗佈上述面塗層用溶液使乾燥後之厚度為30nm。將該塗佈物於130℃下加熱1分鐘使其乾燥,藉此製作附面塗層之樹脂層膜(面塗層、第一樹脂層、接著層及第二樹脂層之順序)。 One side of the resin layer film was subjected to corona treatment, and the solution for the top coat was applied to the corona treated surface so that the thickness after drying was 30 nm. The coated material was heated at 130° C. for 1 minute and dried to prepare a resin layer film with a top coat (the order of top coat, first resin layer, adhesive layer, and second resin layer).

<黏著片材(表面保護膜)之製作> <Production of adhesive sheet (surface protective film)>

將上述丙烯酸系黏著劑溶液塗佈於上述附面塗層之樹脂層膜(面塗層、第一樹脂層、接著層、第二樹脂層之順序)之與面塗層相反之面上,於130℃下加熱1分鐘,從而形成厚度20μm之黏著劑層。然後,於上述黏著劑層之表面貼合單面實施聚矽氧處理之作為隔片之聚對苯二甲酸乙二酯膜(厚度25μm)之聚矽氧處理面,從而製作黏著片材(表面保護膜)。 Apply the above acrylic adhesive solution to the surface of the resin layer film of the top coat (the order of top coat, first resin layer, adhesive layer, and second resin layer) opposite to the top coat, on Heat at 130°C for 1 minute to form an adhesive layer with a thickness of 20 μm. Then, a polysiloxane-treated surface of a polyethylene terephthalate film (thickness 25 μm) as a separator, which was subjected to polysiloxane treatment on one side, was bonded to the surface of the above adhesive layer to produce an adhesive sheet (surface Protective film).

[實施例5] [Example 5] <聚胺酯系黏著劑溶液之製備> <Preparation of Polyurethane Adhesive Solution>

調配作為多元醇之具有三個羥基(OH基)之多元醇之PREMINOL S3015(旭硝子股份有限公司製造,Mn=15000)100質量份、作為多官能異氰酸酯化合物之三羥甲基丙烷/甲苯二異氰酸酯三聚物加成物(日本聚胺酯工業公司製造,商品名:Coronate L)13質量份、具有氧伸烷基鏈之有機聚矽氧烷(信越化學公司製造,商品名:KF-6004,HLB:9)0.1質量份、觸媒(日本化學產業股份有限公司製造,商品名:Nasem亞鐵)0.04質量份、作為稀釋溶劑之乙酸乙酯210質量份,於分散器中攪拌,從而獲得胺基甲酸酯系黏著劑組合物(溶液)。 100 parts by mass of PREMINOL S3015 (manufactured by Asahi Glass Co., Ltd., Mn=15000) which is a polyol having three hydroxyl groups (OH groups) as a polyol, and trimethylolpropane/toluene diisocyanate 3 as a multifunctional isocyanate compound Polymer adduct (manufactured by Japan Polyurethane Industry Co., Ltd., trade name: Coronate L) 13 parts by mass, organic polysiloxane having an oxyalkylene chain (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KF-6004, HLB: 9 ) 0.1 parts by mass, catalyst (manufactured by Nippon Chemical Industry Co., Ltd., trade name: ferrous Nasem) 0.04 parts by mass, 210 parts by mass of ethyl acetate as a dilution solvent, stirred in a disperser to obtain amino acid Ester adhesive composition (solution).

<黏著片材(表面保護膜)之製作> <Production of adhesive sheet (surface protective film)>

將上述胺基甲酸酯系黏著劑溶液塗佈於上述附面塗層之樹脂層膜(面塗層、第一樹脂層、接著層、第二樹脂層之順序)之與面塗層相反之面上,於130℃下加熱1分鐘,從而形成厚度20μm之黏著劑層。然後,於上述黏著劑層之表面貼合單面實施聚矽氧處理之作為隔片之聚對苯二甲酸乙二酯膜(厚度25μm)之聚矽氧處理面,從而製作黏著片材(表面保護膜)。 Apply the above-mentioned urethane-based adhesive solution to the resin layer film of the above-mentioned top coat (the order of top coat, first resin layer, adhesive layer, and second resin layer) opposite to the top coat On the surface, it was heated at 130°C for 1 minute to form an adhesive layer with a thickness of 20 μm. Then, a polysiloxane-treated surface of a polyethylene terephthalate film (thickness 25 μm) as a separator, which was subjected to polysiloxane treatment on one side, was bonded to the surface of the above adhesive layer to produce an adhesive sheet (surface Protective film).

[比較例1] [Comparative Example 1] <面塗層用溶液(面塗層3)之製備> <Preparation of solution for top coat (top coat 3)>

將作為黏合劑之聚酯樹脂Vylonal MD-1480(25%水溶液,東洋紡公司製造)、作為導電性聚合物之含有0.5%聚(3,4-亞乙二氧基噻吩)(PEDOT)及0.8%聚苯乙烯磺酸鹽(重量平均分子量15萬)(PSS)之水溶液(Baytron P,H.C.Stark公司製造)添加於水/乙醇(1/1)之混合溶劑中,添加以固形物成分量計100質量份之黏合劑、以固形物成分量計50質量份之導電性聚合物、及5質量份之三聚氰胺系交聯劑,並攪拌約20分鐘充分地進行混合。如此製備NV約0.4%之面塗層用溶液(面塗層3)。 Polyester resin Vylonal MD-1480 (25% aqueous solution, manufactured by Toyobo Co., Ltd.) as a binder, and 0.5% poly(3,4-ethylenedioxythiophene) (PEDOT) and 0.8% as a conductive polymer An aqueous solution of polystyrene sulfonate (weight average molecular weight 150,000) (PSS) (Baytron P, manufactured by HC Stark) was added to a mixed solvent of water/ethanol (1/1), and 100 was added based on the amount of solid content. Mass parts of the binder, 50 parts by mass of the conductive polymer based on the solid content, and 5 parts by mass of the melamine-based cross-linking agent are stirred and mixed for about 20 minutes. In this way, a solution for topcoat with NV of about 0.4% (topcoat 3) was prepared.

[比較例3] [Comparative Example 3] <面塗層用溶液(面塗層5)之製備> <Preparation of solution for top coat (top coat 5)>

製備於水-醇溶劑中、以NV為基準以100:46.7之質量比含有包含陽離子性聚合物之防靜電劑(Konishi股份有限公司製造,商品名「BONDEIP-P主劑」)及作為硬化劑之環氧樹脂(Konishi股份有限公司製造,商品名「BONDEIP-P硬化劑」)之面塗層用溶液(面塗層5)。 Prepared in a water-alcohol solvent, based on NV with an antistatic agent (manufactured by Konishi Co., Ltd., trade name "BONDEIP-P main agent") containing a cationic polymer at a mass ratio of 100:46.7 and as a hardener Topcoat solution (topcoat 5) of epoxy resin (manufactured by Konishi Corporation, trade name "BONDEIP-P hardener").

於表4中所示構成之樹脂層膜之單面上實施電暈處理,於電暈處理面上塗佈上述面塗層用溶液(面塗層5)使乾燥後之厚度為60nm,於130℃下加熱1分鐘使其乾燥,從而形成面塗層。然後,於上述面塗層之表面塗敷作為潤滑劑之長鏈烷基胺基甲酸酯系剝離處理劑(一方社油脂工業股份有限公司製品,商品名「PEELOIL 1010」)使以NV基準計為40nm,於130℃下加熱1分鐘使其乾燥,從而形成兩層構成之面塗層。 Corona treatment was performed on one side of the resin layer film of the composition shown in Table 4, and the above-mentioned topcoat solution (topcoat 5) was applied on the corona-treated surface so that the thickness after drying was 60 nm at 130 It was heated at ℃ for 1 minute and dried to form a top coat. Then, apply a long-chain alkyl carbamate-based peeling treatment agent (product of Yipiso Oil & Gas Industry Co., Ltd., trade name "PEELOIL 1010") as a lubricant on the surface of the above-mentioned top coat based on the NV standard It is 40nm, heated at 130°C for 1 minute and dried to form a two-layer topcoat.

[比較例6] [Comparative Example 6] <樹脂層膜(第一樹脂層、接著層及第二樹脂層之順序)之製備> <Preparation of resin layer film (order of first resin layer, adhesive layer and second resin layer)>

於具備冷卻管、氮氣導入管、溫度計及攪拌裝置之反應容器中加入丙烯酸2-乙基己酯(2EHA)30質量份、丙烯酸甲酯(MA)70質量份、丙烯酸(AA)10質量份、2,2'-偶氮雙異丁腈0.2質量份及乙酸乙 酯,一面於氮氣氣流下攪拌一面於60℃下反應6小時,從而獲得重量平均分子量110萬之丙烯酸系聚合物溶液。相對於該丙烯酸系聚合物溶液之聚合物固形物成分100質量份,添加環氧化合物[三菱瓦斯化學公司製造,TETRAD-C]1.0質量份、胺基甲酸酯丙烯酸酯化合物[日本合成化學工業公司製造,UV-1700B]40質量份、丙烯酸酯化合物[日本化藥公司製造,KAYARAD DPCA-120]40質量份、1-羥基環己基苯基甲酮(商品名:IRGACURE 184)[汽巴精化股份有限公司製造]7質量份,從而製備丙烯酸系接著劑2組合物溶液。 30 parts by mass of 2-ethylhexyl acrylate (2EHA), 70 parts by mass of methyl acrylate (MA), and 10 parts by mass of acrylic acid (AA) were added to the reaction vessel equipped with a cooling tube, a nitrogen introduction tube, a thermometer, and a stirring device. 2,2'-Azobisisobutyronitrile 0.2 parts by mass and ethyl acetate The ester was reacted at 60°C for 6 hours while stirring under a nitrogen gas flow, thereby obtaining an acrylic polymer solution having a weight average molecular weight of 1.1 million. To 100 parts by mass of the polymer solid content of the acrylic polymer solution, 1.0 part by mass of an epoxy compound [Mitsubishi Gas Chemical Co., Ltd., TETRAD-C], urethane acrylate compound [Nippon Synthetic Chemical Industry] is added Made by the company, UV-1700B] 40 parts by mass, acrylate compound [made by Nippon Kayaku, KAYARAD DPCA-120] 40 parts by mass, 1-hydroxycyclohexyl phenyl ketone (trade name: IRGACURE 184) [Cibagen Chemical Co., Ltd.] 7 parts by mass to prepare an acrylic adhesive 2 composition solution.

於作為樹脂層之聚酯系樹脂膜(東洋紡公司製造,商品名:E5000,厚度:38μm,拉伸強度:208MPa)上,塗佈上述接著劑組合物溶液,並於90℃下加熱,從而形成厚度12μm之接著層。 A polyester resin film (manufactured by Toyobo Co., Ltd., trade name: E5000, thickness: 38 μm, tensile strength: 208 MPa) as a resin layer was coated with the above adhesive composition solution and heated at 90° C. to form Adhesive layer with a thickness of 12 μm.

然後,於接著層上積層聚酯系樹脂膜(東洋紡公司製造,商品名:E5000,厚度:38μm,拉伸強度:208MPa),利用高壓水銀燈以累積光量0.5J/cm2進行紫外線照射使接著層硬化,從而獲得厚度88μm之樹脂層膜。所獲得之接著層之23℃下之儲存彈性模數為6.7×107Pa。 Then, a polyester resin film (manufactured by Toyobo Co., Ltd., trade name: E5000, thickness: 38 μm, tensile strength: 208 MPa) was laminated on the adhesive layer, and the adhesive layer was irradiated with ultraviolet light at a cumulative light amount of 0.5 J/cm 2 using a high-pressure mercury lamp. Hardened to obtain a resin layer film with a thickness of 88 μm. The storage elastic modulus of the obtained adhesive layer at 23° C. was 6.7×10 7 Pa.

[實施例2~7及比較例1~6] [Examples 2-7 and Comparative Examples 1-6]

基於表1及表2之調配內容,以與實施例1同樣之方式製作黏著片材(表面保護膜)。再者,實施例1中未調配之其他添加劑(例如黏著劑溶液之製備時調配之防靜電成分等)於黏著劑溶液之製備時進行調配。另外,比較例5中僅使用表4中所示之第二樹脂層代替樹脂層膜。表1及表2中之調配量表示固形物成分。 Based on the formulation contents of Table 1 and Table 2, an adhesive sheet (surface protective film) was produced in the same manner as in Example 1. Furthermore, other additives not prepared in Example 1 (for example, antistatic components formulated during the preparation of the adhesive solution, etc.) are formulated during the preparation of the adhesive solution. In Comparative Example 5, only the second resin layer shown in Table 4 was used instead of the resin layer film. The blending amounts in Table 1 and Table 2 indicate the solid content.

對於實施例及比較例之黏著片材,進行上述各種測定及評價,結果如表3及表4所示。 For the adhesive sheets of Examples and Comparative Examples, the above-mentioned various measurements and evaluations were performed. The results are shown in Table 3 and Table 4.

Figure 104143004-A0202-12-0051-6
Figure 104143004-A0202-12-0051-6

Figure 104143004-A0202-12-0051-7
Figure 104143004-A0202-12-0051-7

再者,表1及表2中之縮略語如下說明。 In addition, the abbreviations in Table 1 and Table 2 are explained below.

2EHA:丙烯酸2-乙基己酯 2EHA: 2-ethylhexyl acrylate

BA:丙烯酸正丁酯 BA: n-butyl acrylate

HEA:丙烯酸2-羥基乙酯 HEA: 2-hydroxyethyl acrylate

AA:丙烯酸 AA: Acrylic

KF352A:具有氧伸烷基鏈之有機聚矽氧烷(HLB值:7)(信越化學工業公司製造,商品名:KF-352A) KF352A: Organic polysiloxane with oxyalkylene chain (HLB value: 7) (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KF-352A)

KF353:具有氧伸烷基鏈之有機聚矽氧烷(HLB值:10)(信越化學工業公司製造,商品名:KF-353) KF353: Organic polysiloxane with oxyalkylene chain (HLB value: 10) (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KF-353)

KF355A:具有氧伸烷基鏈之有機聚矽氧烷(HLB值:12)(信越化學工業公司製造,商品名:KF-355A) KF355A: Organic polysiloxane with an oxyalkylene chain (HLB value: 12) (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KF-355A)

KF6004:具有氧伸烷基鏈之有機聚矽氧烷(HLB值:9)(信越化學工業公司製造,商品名:KF-6004) KF6004: Organic polysiloxane with an oxyalkylene chain (HLB value: 9) (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KF-6004)

KF6020:具有氧伸烷基鏈之有機聚矽氧烷(HLB值:4)(信越化學工業公司製造,商品名:KF-6020) KF6020: Organic polysiloxane with oxyalkylene chain (HLB value: 4) (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KF-6020)

C/HX:六亞甲基二異氰酸酯之異氰脲酸酯形式(日本聚胺酯公司製造,商品名:Coronate HX) C/HX: isocyanurate form of hexamethylene diisocyanate (manufactured by Japan Polyurethane Corporation, trade name: Coronate HX)

BMP:1-丁基-3-甲基吡啶鎓雙(三氟甲磺醯基)醯亞胺(離子液體,25℃下為液狀,和光純藥股份有限公司) BMP: 1-butyl-3-methylpyridinium bis(trifluoromethanesulfonyl) amide imine (ionic liquid, liquid at 25°C, Wako Pure Chemical Industries, Ltd.)

LiTFSI:雙(三氟甲磺醯基)醯亞胺鋰(鹼金屬鹽,岸田化學股份有限公司製造) LiTFSI: Lithium bis(trifluoromethanesulfonyl)imide (alkali metal salt, manufactured by Kishida Chemical Co., Ltd.)

聚萘二甲酸乙二酯樹脂12μm:(帝人杜邦公司製造,商品名:Teonex Q51、拉伸強度:311MPa) Polyethylene naphthalate resin 12μm: (manufactured by Teijin DuPont, trade name: Teonex Q51, tensile strength: 311MPa)

聚萘二甲酸乙二酯樹脂50μm:(帝人杜邦公司製造,商品名:Teonex Q51、拉伸強度:272MPa) Polyethylene naphthalate resin 50μm: (manufactured by Teijin DuPont, trade name: Teonex Q51, tensile strength: 272MPa)

聚酯系樹脂25μm:(帝人杜邦公司製造,商品名:G2、拉伸強度:261MPa) Polyester resin 25μm: (manufactured by Teijin DuPont, trade name: G2, tensile strength: 261MPa)

聚酯系樹脂38μm:(東洋紡公司製造,商品名:E5000,拉伸強度:208MPa) Polyester resin 38μm: (manufactured by Toyobo, trade name: E5000, tensile strength: 208MPa)

聚酯系樹脂75μm:(東洋紡公司製造,商品名:E5000,拉伸強度:188MPa) Polyester resin 75μm: (manufactured by Toyobo, trade name: E5000, tensile strength: 188MPa)

聚碳酸酯樹脂65μm:(Kaneka公司製造,商品名:ELMECH,拉伸強度:105MPa) Polycarbonate resin 65 μm: (manufactured by Kaneka, trade name: ELMECH, tensile strength: 105 MPa)

Figure 104143004-A0202-12-0053-8
Figure 104143004-A0202-12-0053-8

Figure 104143004-A0202-12-0054-9
Figure 104143004-A0202-12-0054-9

由上述評價結果可確認,於全部實施例中,藉由使用具有所需之厚度之比、或接著層之儲存彈性模數、黏著劑層、面塗層等之黏著片材,防靜電性、黏著特性、拾取性、撓曲量以及印字密著性優異。另一方面,於比較例中,未使用所期望之具有所需之厚度之比、或黏著劑層、面塗層等之黏著片材,因此未獲得能滿足全部特性者。 From the above evaluation results, it can be confirmed that, in all the examples, by using an adhesive sheet having a required thickness ratio, or a storage elastic modulus of the adhesive layer, an adhesive layer, a top coat, etc., the antistatic property, Excellent adhesion characteristics, pick-up properties, deflection, and printing adhesion. On the other hand, in the comparative example, the desired adhesive sheet having a desired thickness ratio, adhesive layer, top coat, or the like is not used, and therefore, those satisfying all characteristics are not obtained.

[產業上之可利用性] [Industry availability]

此處所揭示之黏著片材適合作為於作為液晶顯示面板、電漿顯示面板(PDP)、有機電致發光(EL)顯示器、觸控面板顯示器等之構成要素使用之光學構件之製造、運送時等用以保護光學構件之黏著片材(表面保護膜)。特別是,作為應用於液晶顯示面板用之偏光板(偏光膜)、波長板、相位差板、光學補償膜、增亮膜、光擴散片、反射片材等光學構件之黏著片材(光學用黏著片材)較為有用。 The adhesive sheet disclosed here is suitable for the manufacture and transportation of optical members used as constituent elements of liquid crystal display panels, plasma display panels (PDP), organic electroluminescence (EL) displays, touch panel displays, etc. Adhesive sheet (surface protective film) for protecting optical components. In particular, it is used as an adhesive sheet for optical members such as polarizing plates (polarizing films), wave plates, retardation plates, optical compensation films, brightness enhancement films, light diffusing sheets, and reflective sheets for liquid crystal display panels (optical Adhesive sheets) are more useful.

1‧‧‧黏著片材(表面保護膜) 1‧‧‧adhesive sheet (surface protective film)

6‧‧‧第一樹脂層 6‧‧‧First resin layer

7‧‧‧接著層 7‧‧‧Next layer

8‧‧‧第二樹脂層 8‧‧‧Second resin layer

14‧‧‧面塗層 14‧‧‧Top coating

20‧‧‧黏著劑層 20‧‧‧Adhesive layer

Claims (6)

一種黏著片材,其特徵在於,依序具有第一樹脂層、接著層、第二樹脂層及由黏著劑組合物形成之黏著劑層,上述接著層之厚度相對於上述第一樹脂層之厚度與上述第二樹脂層之厚度之和的比值為0.50以下,上述接著層之23℃下之儲存彈性模數為1.0×104Pa以上且未達5.0×107Pa,上述第一樹脂層之與具有上述黏著劑層之面相反側之面上具有面塗層,上述面塗層係由含有作為導電性聚合物成分之聚苯胺磺酸、作為黏合劑成分之聚酯樹脂及作為交聯劑之異氰酸酯系化合物之面塗層用組合物形成者,上述黏著劑組合物含有胺基甲酸酯系黏著劑及具有氧伸烷基鏈之有機聚矽氧烷。 An adhesive sheet comprising a first resin layer, an adhesive layer, a second resin layer, and an adhesive layer formed of an adhesive composition in sequence, the thickness of the adhesive layer relative to the thickness of the first resin layer The ratio to the sum of the thickness of the second resin layer is 0.50 or less. The storage elastic modulus of the adhesive layer at 23°C is 1.0×10 4 Pa or more and less than 5.0×10 7 Pa. The surface opposite to the surface with the adhesive layer has a topcoat layer consisting of a polyaniline sulfonic acid as a conductive polymer component, a polyester resin as a binder component and a crosslinking agent The composition for the top coat of the isocyanate-based compound, the adhesive composition contains an urethane-based adhesive and an organic polysiloxane having an oxyalkylene chain. 如請求項1之黏著片材,其中上述面塗層用組合物進而含有作為潤滑劑之脂肪醯胺。 The adhesive sheet according to claim 1, wherein the composition for top coating further contains fatty amide as a lubricant. 如請求項1之黏著片材,其中上述樹脂層中之至少一者為聚酯膜。 The adhesive sheet according to claim 1, wherein at least one of the above resin layers is a polyester film. 如請求項1之黏著片材,其中上述黏著劑組合物含有丙烯酸系黏著劑。 The adhesive sheet according to claim 1, wherein the above-mentioned adhesive composition contains an acrylic adhesive. 如請求項1至4中任一項之黏著片材,其中上述黏著劑組合物含有防靜電成分。 The adhesive sheet according to any one of claims 1 to 4, wherein the above-mentioned adhesive composition contains an antistatic component. 一種光學構件,其特徵在於,其由如請求項1至5中任一項之黏著片材保護。 An optical member characterized in that it is protected by the adhesive sheet according to any one of claims 1 to 5.
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KR102509341B1 (en) 2023-03-14

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