TWI686584B - Fluid cooling device - Google Patents
Fluid cooling device Download PDFInfo
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- TWI686584B TWI686584B TW108107093A TW108107093A TWI686584B TW I686584 B TWI686584 B TW I686584B TW 108107093 A TW108107093 A TW 108107093A TW 108107093 A TW108107093 A TW 108107093A TW I686584 B TWI686584 B TW I686584B
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Abstract
Description
本發明與流體冷卻有關,特別是指一種無縫結合固定式的流體冷卻裝置。 The invention relates to fluid cooling, and particularly refers to a fluid cooling device which is seamlessly combined with a fixed type.
關於利用例如水等流體來傳遞熱的流體冷卻裝置,包括一吸熱結構以及用以汲取吸熱結構內的流體循環流動的一流體泵。吸熱結構內具單一腔室,流體則在單一腔室內流動。 Regarding a fluid cooling device that uses a fluid such as water to transfer heat, it includes a heat absorption structure and a fluid pump used to draw fluid circulating in the heat absorption structure. The heat-absorbing structure has a single cavity, and the fluid flows in the single cavity.
由於吸熱結構所吸的熱會傳導到流體泵,使流體泵處於高熱工作環境,導致流體泵內的所有電子零件長期在高熱環境下工作,除了會影響電子零件本身的機能,日久甚至還會使電子零件受損進而引發故障。 Because the heat absorbed by the heat absorbing structure is transmitted to the fluid pump, the fluid pump is placed in a high-heat working environment, which causes all electronic parts in the fluid pump to work in a high-temperature environment for a long time. In addition to affecting the function of the electronic parts themselves, it will even Damage electronic components and cause malfunctions.
現有流體冷卻裝置則將流體泵與吸熱結構之間改採局部連接,以對吸熱結構隔絕大部分的熱。 The existing fluid cooling device changes the local connection between the fluid pump and the heat absorption structure to isolate most of the heat from the heat absorption structure.
然而,流體泵與吸熱結構之間的現有局部連接結構,卻反而出現流體易於外漏的縫隙,因此必須在現有局部連接結構增設防水墊圈,只是防水墊圈本身會有一段時日之後易於劣化的問題,一旦防水墊圈劣化,現有局部連接結構仍將出現流體外漏的情況。 However, the existing local connection structure between the fluid pump and the heat absorbing structure, instead, has a gap where the fluid is prone to leak. Therefore, a waterproof gasket must be added to the existing local connection structure, but the waterproof gasket itself will have a problem that it is easy to deteriorate after a period of time. Once the waterproof gasket deteriorates, the existing local connection structure will still leak fluid.
本發明的目的在於提供一種流體冷卻裝置,能克服吸熱器的熱會傳導並影響到流體泵運作的問題;還能在不使用防水墊圈的情形下,順利解決局部連接時所產生的流體外漏問題。 The purpose of the present invention is to provide a fluid cooling device, which can overcome the problem of heat conduction of the heat absorber and affect the operation of the fluid pump; it can also successfully solve the fluid leakage caused by local connection without using a waterproof gasket problem.
為了達成上述目的,本發明係提供一種流體冷卻裝置,包括:一吸熱上蓋,開設有一銜接口;一吸熱底座,具有一熱交換腔和設置於該熱交換腔內的一熱交換單元,該熱交換腔形成於該吸熱上蓋與該吸熱底座之間,且該吸熱底座與該吸熱上蓋彼此縱向貼接,該銜接口則縱向開設於該吸熱上蓋;以及一流體泵,包含一泵殼體和設置於該泵殼體的一驅動組件,該泵殼體係內具一泵內空間,該驅動組件具有收容於該泵內空間內的一葉輪,該泵殼體還具有朝外凸伸且連通該泵內空間的一銜接管,該銜接管縱向插接於該銜接口且彼此無縫結合固定,該泵殼體經由該銜接管而與該吸熱上蓋彼此維持一隔熱間隙。 In order to achieve the above object, the present invention provides a fluid cooling device, including: a heat-absorbing upper cover with an interface; a heat-absorbing base with a heat exchange cavity and a heat exchange unit disposed in the heat exchange cavity, the heat An exchange cavity is formed between the heat-absorbing upper cover and the heat-absorbing base, and the heat-absorbing base and the heat-absorbing upper cover are longitudinally attached to each other, and the interface is opened longitudinally on the heat-absorbing upper cover; and a fluid pump includes a pump housing and a setting A driving component in the pump housing, the pump housing is provided with an inner space of the pump, the driving component has an impeller accommodated in the inner space of the pump, the pump housing also has an outward protrusion and communicates with the pump An adaptor tube in the inner space, the adaptor tube is longitudinally inserted into the adaptor interface and is seamlessly combined and fixed with each other. The pump housing maintains an insulation gap with the heat-absorbing upper cover through the adaptor tube.
相較於先前技術,本發明具有以下功效:能藉由隔熱間隙而確保吸熱器的熱不會傳導到流體泵,並能藉由無縫結合固定而保證連接處或接合處(即後述的插接處或貼接處)絕無縫隙,因此不需使用易劣化的防水墊圈。 Compared with the prior art, the present invention has the following effects: it can ensure that the heat of the heat absorber is not conducted to the fluid pump by the heat insulation gap, and can ensure the connection or joint by seamlessly fixing (i.e. (Plug-in or stick-on) must have no gaps, so there is no need to use deteriorating waterproof gaskets.
100:吸熱器 100: heat sink
1:吸熱上蓋 1: endothermic cover
11:蓋本體 11: Cover body
110:貼接底面 110: Attach to the bottom
111:相鄰頂面 111: adjacent top surface
112:圍繞台階 112: Around the steps
1121:胋接頂面 1121: The top surface
113:流體吸入口 113: fluid intake
114:第一上蓋開口 114: First upper cover opening
115:第二上蓋開口 115: Second upper cover opening
116:第一凸牆 116: The first convex wall
117:第二凸牆 117: Second convex wall
118:凸部 118: convex
1181:第一凸肋 1181: The first rib
12:組合板 12: Combination board
120:貼接底面 120: Attach to the bottom
121:銜接口 121: Interface
2:吸熱底座 2: Endothermic base
21:圍繞板片 21: Around the plate
211:胋接頂面 211: The top surface
22:熱交換單元 22: heat exchange unit
500:流體泵 500: fluid pump
5:泵殼體 5: pump housing
51:泵底座 51: Pump base
510:相鄰底面 510: adjacent bottom surface
511:銜接管 511: Take over
5111:架高部 5111: Elevated section
512:第二凸肋 512: second rib
513:流體排出口 513: Fluid outlet
514:泵開口 514: pump opening
515:凹部 515: recess
52:泵上蓋 52: pump cover
53:防漏件 53: Leakproof parts
6:驅動組件 6: drive assembly
61:定子 61: stator
62:轉子 62: rotor
621:葉輪 621: Impeller
900:外罩 900: outer cover
C1:上蓋容腔 C1: upper cover cavity
C2:熱交換腔 C2: heat exchange chamber
D:隔熱間隙 D: Insulation gap
S:泵內空間 S: space in the pump
圖1為本發明流體冷卻裝置中之吸熱器於俯視時的立體分解圖。 FIG. 1 is an exploded perspective view of the heat sink in the fluid cooling device of the present invention when viewed from above.
圖2為本發明流體冷卻裝置中之吸熱器於仰視時的立體分解圖。 2 is an exploded perspective view of the heat sink in the fluid cooling device of the present invention when viewed from below.
圖3為本發明流體冷卻裝置中之吸熱器的立體組合圖。 3 is a perspective assembly view of a heat sink in a fluid cooling device of the present invention.
圖4為本發明流體冷卻裝置中之流體泵於俯視時的立體分解圖。 4 is an exploded perspective view of the fluid pump in the fluid cooling device of the present invention when viewed from above.
圖5為本發明流體冷卻裝置中之流體泵於仰視時的立體分解圖。 5 is an exploded perspective view of the fluid pump in the fluid cooling device of the present invention when viewed from below.
圖6為本發明流體冷卻裝置中之流體泵的立體組合圖。 6 is a perspective assembly view of the fluid pump in the fluid cooling device of the present invention.
圖7為本發明流體冷卻裝置的立體分解圖。 7 is an exploded perspective view of the fluid cooling device of the present invention.
圖8為本發明流體冷卻裝置的立體組合示意圖。 8 is a schematic perspective view of the fluid cooling device of the present invention.
圖9為本發明流體冷卻裝置針對流體吸入口的縱剖示意圖。 9 is a schematic longitudinal sectional view of the fluid cooling device of the present invention with respect to a fluid suction port.
圖10為本發明流體冷卻裝置針對流體排出口的縱剖示意圖。 10 is a schematic longitudinal cross-sectional view of a fluid discharge device of the fluid cooling device of the present invention.
圖11為本發明流體冷卻裝置針對泵內空間的橫剖示意圖。 11 is a schematic cross-sectional view of the fluid cooling device of the present invention with respect to the space inside the pump.
圖12為本發明流體冷卻裝置針對熱交換腔的橫剖示意圖。 12 is a schematic cross-sectional view of the fluid cooling device of the present invention directed to the heat exchange chamber.
有關本發明的詳細說明和技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,非用以限制本發明。 The detailed description and technical content of the present invention are described as follows in conjunction with the drawings. However, the drawings are provided for reference and explanation only, and are not intended to limit the present invention.
本發明提供一種流體冷卻裝置,如圖8所示,主要在於以流體做為媒介帶走來自發熱源(圖中未示)的熱,並將熱經由散熱排(圖中未示)而散熱,所述流體本發明並未限制,於本實施例中則以水為例進行說明。 The present invention provides a fluid cooling device, as shown in FIG. 8, mainly in that the fluid is used as a medium to take away heat from a heat source (not shown), and dissipate the heat through a heat dissipation row (not shown). The fluid of the present invention is not limited. In this embodiment, water is used as an example for description.
如圖7和圖8所示,本發明流體冷卻裝置包括:一吸熱器100以及一流體泵500,較佳還包括一外罩900。
As shown in FIGS. 7 and 8, the fluid cooling device of the present invention includes: a
如圖1至圖3並搭配圖7至圖10所示,吸熱器100包含一吸熱上蓋1以及一吸熱底座2。吸熱器100用以對圖中未示的發熱源吸熱,一般而言是將吸熱器100的底面貼接於發熱源上。
As shown in FIGS. 1 to 3 together with FIGS. 7 to 10, the
吸熱上蓋1內部具有一上蓋容腔C1,且吸熱上蓋1開設有連通上蓋容腔C1的一銜接口121。
The heat-absorbing
吸熱底座2具有一熱交換腔C2以及一熱交換單元22。熱交換腔C2形成於吸熱上蓋1與吸熱底座2之間,熱交換單元22則設置於熱交換腔C2內。因此,吸熱器100具有雙腔體,也就是:上蓋容腔C1和熱交換腔C2,所述流體則
經由流道先通過下層的熱交換腔C2再通過上層的上蓋容腔C1,最後則朝上從銜接口121輸出。
The
吸熱上蓋1與吸熱底座2彼此縱向貼接,所述銜接口121則是縱向開設於吸熱上蓋1。
The heat-absorbing
如圖4至圖6並搭配圖7至圖10所示,流體泵500包含一泵殼體5以及一驅動組件6。流體泵500用以汲取吸熱器100內的流體循環流動,從而以流體做為媒介帶走熱。
As shown in FIGS. 4 to 6 together with FIGS. 7 to 10, the
泵殼體5內部具有一泵內空間S。驅動組件6設置於泵殼體5,且驅動組件6具有一葉輪621,葉輪621則收容於泵內空間S內。
The
泵殼體5還具有朝外凸伸的一銜接管511,並使銜接管511連通泵內空間S,且銜接管511較佳是縱向凸伸。如圖9所示,銜接管511縱向插接於前述銜接口121,並在銜接管511外周緣與銜接口121內周緣之間的插接處彼此無縫結合固定,因此在這插接處將完全沒有縫隙而無需使用防水墊圈。同時,泵殼體5還能經由所插接的銜接管511而與吸熱上蓋1彼此維持一隔熱間隙D(見圖9),以藉由隔熱間隙D而隔絕吸熱器100絕大部分的熱,進而使驅動組件6內部所具有的多數電子零件不會受到熱的影響。
The
銜接管511的外周緣還可形成有一架高部5111(如圖5和圖9所示),且架高部5111也是從泵殼體5沿縱向朝外凸出,使架高部5111能穩固地支撐於泵殼體5與吸熱上蓋1之間,以確保在泵殼體5的相鄰底面510與吸熱上蓋1的相鄰頂面111之間能夠產生所需的隔熱間隙D。
An elevated portion 5111 (as shown in FIGS. 5 and 9) can also be formed on the outer periphery of the connecting
較佳而言,泵殼體5包含一泵底座51、一泵上蓋52和一防漏件53。泵上蓋52縱向蓋合於泵底座52上,並將防漏件53設置於泵底座51與泵上蓋52之間,至於前述泵內空間S則形成於泵底座51與泵上蓋52之間。
Preferably, the
至於流體泵500的流道設計,則是在泵底座51的相鄰底面510縱向凸出有前述銜接管511(具有架高部5111);泵底座51還橫向開設有彼此相通的一流體排出口513和一泵開口514,並使泵開口514能經由泵內空間S而與銜接管511相通,也就是銜接管511與流體排出口513經由泵內空間S而彼此相通。
As for the design of the flow channel of the
較佳而言,驅動組件6包含一定子61以及一轉子62,轉子62具有前述葉輪621。定子61(內具圖中未示的前述多數電子零件)設置於泵上蓋52的一面,轉子62則對應泵內空間S可旋轉地樞設於泵上蓋52的另一面,使定子61與轉子62隔著泵上蓋52彼此相對(見圖9)。
Preferably, the driving
本發明並未限定前述的無縫結合固定採用何種方式,可為3D列印、鑄造或焊接等皆可。當選擇採用3D列印或鑄造方式時,即能一次成型出流體泵5、吸熱上蓋1和吸熱底座2,進而使銜接管511與銜接口121之間彼此無縫結合固定。於本實施例中則以焊接為例進行說明,因此,為了提供焊接,吸熱上蓋1和泵殼體5皆必須是金屬材質製成。
The present invention does not limit which method is used for the above-mentioned seamless joint fixation, which can be 3D printing, casting or welding. When the 3D printing or casting method is selected, the
本發明中的吸熱器100較佳而言也可採用焊接固定,以具有同前所述的沒有縫隙以及無需使用防水墊圈的效果,詳述如下。
Preferably, the
如圖1至圖3並搭配圖7至圖10所示,吸熱器100中的吸熱底座2也是金屬材質製成,以利於縱向貼接於前述同樣是金屬材質製成的吸熱上蓋1,並在貼接處彼此焊接固定。
As shown in FIGS. 1 to 3 together with FIGS. 7 to 10, the
為了方便焊接,吸熱底座2具有對應熱交換腔C2圍繞的一圍繞板片21,圍繞板片21具有一貼接頂面211。熱交換腔C2的一面是將貼接頂面211的局部區域凹陷而成型,詳細而言,則是相對於貼接頂面211朝遠離吸熱上蓋1的方向凹陷而成。吸熱上蓋1具有對應熱交換腔C2和貼接頂面211遮蓋的一貼接底面110,此時,就能以吸熱上蓋1的貼接底面110貼接於吸熱底座2的貼接頂面211上,並在貼接處彼此焊接固定。
In order to facilitate welding, the heat-absorbing
此外,吸熱上蓋1較佳而言還可包含有彼此縱向組合的一蓋本體11和一組合板12,前述上蓋容腔C1形成於蓋本體11與組合板12之間,至於銜接口121則開設於組合板12。組合板12係貼接於蓋本體11,並在貼接處彼此焊接固定。因此,為了方便焊接,吸熱上蓋1具有如下所述的結構。
In addition, the heat-absorbing
蓋本體11具有一相鄰頂面111以及一圍繞台階112。圍繞台階112對應上蓋容腔C1圍繞且在上蓋容腔C1內朝上凸出成型,詳細而言,圍繞台階112是朝靠近組合板12的方向凸出於上蓋容腔C1內,使圍繞台階112具有一貼接頂面1121。組合板12具有對應上蓋容腔C1和貼接頂面1121遮蓋的一貼接底面120,此時,就能以組合板12的貼接底面120貼接於蓋本體11的貼接頂面1121上,並在貼接處彼此焊接固定。必須說明的是,上蓋容腔C1的一面是相對於貼接頂面1121朝遠離組合板12的方向凹陷而成。
The
如此一來,本發明藉由焊接而能固定成無法拆卸的一體式結構,也就是具有吸熱器100和流體泵500的單一結構件。再者,本發明藉由焊接固定,還能具有以下效果:能無需過多組裝,因此省時、省力;能減少因為組裝所產生的連接處或接合處,因此減少流體外漏的機率;全金屬焊接結構,因此能有效提升抗蒸散率,且減少因為組裝所產生的連接處或接合處,也能大幅降低蒸散。
In this way, the present invention can be fixed into an integral structure that cannot be removed by welding, that is, a single structural member having the
至於吸熱器100的流道設計,則是在吸熱上蓋1橫向開設有一流體吸入口113,且吸熱上蓋1還縱向開設有彼此遠離的一第一上蓋開口114和一第二上蓋開口115。流體吸入口113連通於第一上蓋開口114,第一上蓋開口114經由下層的熱交換腔C2而與第二上蓋開口115相通,第二上蓋開口115經由上層的上蓋容腔C1而朝上與前述銜接口121相通。
As for the flow path design of the
如圖9和圖10所示,吸熱上蓋1的貼接底面110以及吸熱底座2的腔內底面(熱交換腔C2的內底面,未標示元件符號)分別貼接於熱交換單元22的
兩相對面,也就是熱交換單元22被縱向夾置於吸熱上蓋1與吸熱底座2之間而利於導熱。再如圖11和圖12所示,熱交換單元22於本實施例中包含彼此間隔並排的兩排熱交換排,每排熱交換排包含多數散熱鰭片;前述第一上蓋開口114則相對於熱交換單元22錯開而利於流體通過,於本實施例中則讓第一上蓋開口114對應於兩排熱交換排之間的間隔處。
As shown in FIGS. 9 and 10, the
再如圖1、圖2和圖12所示,蓋本體11的貼接底面110還可縱向凸伸有彼此相對的兩個凸牆,這兩個凸牆包含一第一凸牆116和一第二凸牆117。這兩個凸牆凸伸到熱交換腔C2內,且是凸伸到抵接吸熱底座2為止。熱交換單元22則橫向夾置於這兩個凸牆之間,且穿孔狀的前述第一上蓋開口114係位於這兩個凸牆之間且靠近第一凸牆116,至於長條狀的前述第二上蓋開口115則位於這兩個凸牆之外且鄰接於第二凸牆117,第一凸牆116貼靠於熱交換腔C2的內周緣,第二凸牆117的長度以及第二上蓋開口115的長度則皆對應於熱交換單元22的寬度。如此,以讓流體從第一上開口114輸出,接著以多流道方式流經各散熱鰭片進行熱交換,最後則在第二上開口115匯集並朝上流入上蓋容腔C1內。
As shown in FIGS. 1, 2 and 12, the
另如圖3、圖6以及圖7至圖9所示,為了在流體泵500以銜接管511對應插接於吸熱器100的銜接口121內時,能具有平衡、穩定且不偏斜的效果,特別在吸熱上蓋1的相鄰頂面111縱向凸出有一第一凸肋1181,並在泵殼體5的相鄰底面510縱向凸出有一第二凸肋512,第一凸肋1181和第二凸肋512係對應銜接管511配置,於本實施例中則是讓第一凸肋1181和第二凸肋512對應配置於銜接管511的兩相對位置,使第一凸肋1181和第二凸肋512支撐於相鄰底面510與相鄰頂面111之間,從而保證組合後的流體泵500與吸熱器100之間不會相對偏斜。再者,吸熱器100的吸熱上蓋1以及流體泵500的泵殼體5,還可分別具有一凸部118和一凹部515,凸部118則對應凹部515彼此間隔地組合,以在將流
體泵500組合於吸熱器100時,能具有定位的效果。其中,凸部118係自相鄰頂面111朝上凸出,第一凸肋1181則在凸部118的頂面朝上凸出。又,外罩900係縱向罩覆並固定於流體泵500上。
In addition, as shown in FIGS. 3, 6 and 7 to 9, in order to have a balanced, stable and non-deflecting effect when the
吸熱器100和流體泵500還可皆為矩形體,以利於組裝及焊接。
The
綜上所述,本發明流體冷卻裝置確可達到預期的使用目的,進而解決現有技術的缺失,並因具有專利性,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障發明人之權利。 In summary, the fluid cooling device of the present invention can indeed achieve the intended purpose, and then solve the lack of existing technology, and because of its patentability, the application is made in accordance with the Patent Law, please check and grant the patent in this case to protect Inventor's rights.
以上所述者,僅為本發明之較佳可行實施例而已,非因此即侷限本發明之專利範圍,舉凡運用本發明說明書及圖式內容所為之等效結構變化,均理同包含於本發明之權利範圍內,合予陳明。 The above are only the preferred and feasible embodiments of the present invention, and therefore do not limit the scope of the patent of the present invention. Any equivalent structural changes in the description and drawings of the present invention are equally included in the present invention. Within the scope of the rights, Chen Ming.
100:吸熱器 100: heat sink
1:吸熱上蓋 1: endothermic cover
11:蓋本體 11: Cover body
110:貼接底面 110: Attach to the bottom
113:流體吸入口 113: fluid intake
114:第一上蓋開口 114: First upper cover opening
115:第二上蓋開口 115: Second upper cover opening
116:第一凸牆 116: The first convex wall
117:第二凸牆 117: Second convex wall
1181:第一凸肋 1181: The first rib
12:組合板 12: Combination board
121:銜接口 121: Interface
2:吸熱底座 2: Endothermic base
211:胋接頂面 211: The top surface
22:熱交換單元 22: heat exchange unit
500:流體泵 500: fluid pump
5:泵殼體 5: pump housing
51:泵底座 51: Pump base
511:銜接管 511: Take over
5111:架高部 5111: Elevated section
512:第二凸肋 512: second rib
52:泵上蓋 52: pump cover
53:防漏件 53: Leakproof parts
6:驅動組件 6: drive assembly
61:定子 61: stator
62:轉子 62: rotor
900:外罩 900: outer cover
C1:上蓋容腔 C1: upper cover cavity
C2:熱交換腔 C2: heat exchange chamber
D:隔熱間隙 D: Insulation gap
S:泵內空間 S: space in the pump
Claims (11)
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TW108107093A TWI686584B (en) | 2019-03-04 | 2019-03-04 | Fluid cooling device |
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TWI686584B true TWI686584B (en) | 2020-03-01 |
TW202033924A TW202033924A (en) | 2020-09-16 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI737344B (en) * | 2020-06-11 | 2021-08-21 | 其陽科技股份有限公司 | Heating device and heat dissipation structure thereof |
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CN200966200Y (en) * | 2006-10-30 | 2007-10-24 | 万在工业股份有限公司 | Water-cooled heat radiation device |
TWM324810U (en) * | 2007-06-05 | 2008-01-01 | Gigazone Int Co Ltd | Water-cooled circulating heat dissipation device of computer motherboard |
TWM530421U (en) * | 2015-10-12 | 2016-10-11 | Power Logic Tech Dongguan Inc | Water-cooling heat dissipation mechanism |
TWM535934U (en) * | 2016-08-26 | 2017-01-21 | 雙鴻科技股份有限公司 | Liquid cooler module |
US20180139865A1 (en) * | 2016-11-17 | 2018-05-17 | Nathanael Draht | Microstructure water cooling unit for cooling of an electrical or electronic component that already includes a flow diverter and a flow distributor |
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CN200966200Y (en) * | 2006-10-30 | 2007-10-24 | 万在工业股份有限公司 | Water-cooled heat radiation device |
TWM324810U (en) * | 2007-06-05 | 2008-01-01 | Gigazone Int Co Ltd | Water-cooled circulating heat dissipation device of computer motherboard |
TWM530421U (en) * | 2015-10-12 | 2016-10-11 | Power Logic Tech Dongguan Inc | Water-cooling heat dissipation mechanism |
TWM535934U (en) * | 2016-08-26 | 2017-01-21 | 雙鴻科技股份有限公司 | Liquid cooler module |
US20180139865A1 (en) * | 2016-11-17 | 2018-05-17 | Nathanael Draht | Microstructure water cooling unit for cooling of an electrical or electronic component that already includes a flow diverter and a flow distributor |
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TWI737344B (en) * | 2020-06-11 | 2021-08-21 | 其陽科技股份有限公司 | Heating device and heat dissipation structure thereof |
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