CN110429457B - Water-cooling heat sink assembly for laser crystal - Google Patents
Water-cooling heat sink assembly for laser crystal Download PDFInfo
- Publication number
- CN110429457B CN110429457B CN201910764014.3A CN201910764014A CN110429457B CN 110429457 B CN110429457 B CN 110429457B CN 201910764014 A CN201910764014 A CN 201910764014A CN 110429457 B CN110429457 B CN 110429457B
- Authority
- CN
- China
- Prior art keywords
- water
- heat sink
- water inlet
- lower heat
- laser crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 52
- 238000001816 cooling Methods 0.000 title claims abstract description 34
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 125
- 238000007789 sealing Methods 0.000 claims abstract description 44
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000011148 porous material Substances 0.000 abstract description 21
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 10
- 229910052738 indium Inorganic materials 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 239000002352 surface water Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The invention relates to a water-cooling heat sink assembly for laser crystals, which comprises an upper heat sink and a lower heat sink, wherein at least one crystal groove is arranged on the lower heat sink, a plurality of closely arranged longitudinal pore canals are longitudinally arranged in the lower heat sink, a water inlet and a water outlet are arranged at the bottom of the lower heat sink, one ends of the longitudinal pore canals are communicated with the water inlet, the other ends of the longitudinal pore canals are communicated with the water outlet, a plurality of closely arranged transverse pore canals are arranged below the crystal groove, the transverse pore canals are vertically communicated with the longitudinal pore canals, the water inlet is in sealing connection with a water supply port of a water cooling plate, and the water outlet is in sealing connection with a water return port of the water cooling plate. According to the invention, a water pipe and a water pipe connector are not used, so that the risk of vapor volatilization is reduced, the occupied space is reduced, and the heat sink assembly structure is smaller.
Description
Technical Field
The invention relates to the technical field of cooling devices of laser crystals, in particular to a water-cooling heat sink assembly for laser crystals.
Background
In the design of a laser, the laser crystal absorbs pump light, so that heating power is high, if the laser crystal is not cooled, obvious thermal lens effect can be generated, the stability of a laser resonant cavity is affected, the output power, the beam quality and the like of the laser are further affected, and the laser crystal is damaged in severe cases.
At present, the heat dissipation technology of the laser crystal mainly comprises air cooling, thermoelectric refrigeration, water cooling and other modes.
The laser cavity requires very high cleanliness, and the adoption of an air cooling mode can complicate structural design, reduce system stability, and influence the cleanliness in the cavity due to the introduction of external air flow.
The temperature of the laser crystal can be controlled by adopting a thermoelectric refrigeration mode, but the heat power generated by the thermoelectric refrigerator is overlapped with the heat generated by the laser crystal, so that the heat dissipation is brought to a larger pressure, and the thermoelectric refrigerator is not suitable for heat dissipation of the high-power laser crystal.
By adopting a water cooling mode, referring to fig. 6, a waterway is formed by connecting the upper heat sink 1a and the lower heat sink 2a through a hose, the two ends of the hose are connected with water pipe connectors 4a, the cooling effect is obvious, but the waterway in the laser cavity is complex in design, the sealing property of the common hose to water is unreliable, once water in the hose leaks, the humidity in the laser cavity is increased, and destructive effects are caused on the laser crystal 3a and optical components in the laser cavity.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a water-cooling heat sink component for laser crystals, wherein a longitudinal pore canal and a transverse pore canal are arranged in a lower heat sink and are in sealing connection with a water supply port and a water return port on a water-cooling plate through a water inlet and a water outlet. The water pipe and the water pipe connector are not used, the risk of vapor volatilization is reduced, the occupied space is reduced, and the heat sink assembly structure is smaller.
The invention provides the following technical scheme:
The utility model provides a water-cooling heat sink subassembly for laser crystal, includes heat sink, lower heat sink, be equipped with at least one crystal groove on the heat sink down, the inside of heat sink down is equipped with many closely arranged longitudinal duct along vertically, the bottom of heat sink down is equipped with water inlet and delivery port, a plurality of longitudinal duct one end with the water inlet intercommunication, a plurality of the longitudinal duct the other end with the delivery port intercommunication, the below of crystal groove is equipped with many closely arranged horizontal duct, a plurality of horizontal duct with a plurality of longitudinal duct communicates perpendicularly, water inlet and the water supply mouth sealing connection of water-cooling plate, delivery port and the return water mouth sealing connection of water-cooling plate.
In another specific embodiment, a plurality of fixing holes are formed in the lower heat sink, and the lower heat sink is fixed on the water cooling plate through fasteners penetrating through the fixing holes.
In another embodiment, the water inlet is racetrack shaped and the water outlet is racetrack shaped.
In another specific embodiment, the water inlet is provided with a water inlet sealing groove, a water inlet sealing ring is arranged in the water inlet sealing groove, the water outlet is provided with a water outlet sealing groove, and a water outlet sealing ring is arranged in the water outlet sealing groove.
In another embodiment, the ends of the plurality of longitudinal cells are integrally sealed by a first cover and the ends of the plurality of transverse cells are integrally sealed by a second cover.
In another specific embodiment, two sides of the crystal groove are provided with solder diversion grooves.
In another embodiment, the longitudinal bore has a diameter of 2.5mm.
In another embodiment, the transverse tunnels are 2.5mm in diameter.
Compared with the prior art, the invention has the beneficial effects that:
1. The invention omits a water pipe, the heat sink component is easy and convenient to assemble and disassemble, only the fixing screw is needed to assemble and disassemble, and the operating space of a water pipe assembling and disassembling tool is not needed to be considered in the structural design, so that the risk of spilling water in the heat sink and the water pipe in the disassembling process is greatly reduced. After the water pipe is omitted, the heat sinks can be closely arranged, so that the overall size of the equipment can be greatly reduced.
2. According to the invention, a bottom surface water inlet and outlet mode is adopted, and the O-shaped sealing ring is adopted for sealing, so that the space of a water pipe and a water pipe joint is saved, and the whole occupied space of the heat sink is reduced.
3. The invention is provided with the solder diversion trench, the diversion trench can prevent excessive indium from overflowing, reduce the possibility of indium polluting the light-passing surface of the laser crystal, prevent indium from flowing out of the surface of the heat sink, and keep the whole heat sink attractive.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic bottom view of the present invention;
FIG. 3 is a schematic diagram of a waterway in a lower heat sink;
FIG. 4 is a schematic diagram of a laser crystal assembly;
FIG. 5 is a schematic view of another embodiment of the present invention;
fig. 6 is a schematic diagram of a water-cooled heat sink structure in the prior art.
The device comprises a 1-upper heat sink, a 2-lower heat sink, a 3-crystal groove, a 4-longitudinal pore canal, a 5-water inlet, a 6-water outlet, a 7-transverse pore canal, an 8-fixed hole, a 9-water inlet sealing groove, a 10-water outlet sealing groove, an 11-first sealing cover, a 12-second sealing cover, a 13-solder guiding groove, a 14-laser crystal and a 15-indium foil.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific embodiments, wherein it is apparent that the embodiments described are merely some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Embodiment one:
Referring to fig. 1 and 2, a water-cooling heat sink assembly for laser crystal comprises an upper heat sink 1 and a lower heat sink 2, wherein at least one crystal groove 3 is arranged on the lower heat sink, a plurality of closely arranged longitudinal pore channels 4 are longitudinally arranged in the lower heat sink, a water inlet 5 and a water outlet 6 are arranged at the bottom of the lower heat sink, one end of each longitudinal pore channel is communicated with the water inlet, the other end of each longitudinal pore channel is communicated with the water outlet, a plurality of closely arranged transverse pore channels 7 are arranged below the crystal groove, the transverse pore channels are vertically communicated with the longitudinal pore channels, the water inlet is in sealing connection with a water supply port of a water cooling plate, and the water outlet is in sealing connection with a water return port of the water cooling plate.
Referring to fig. 4, in this embodiment, the water-cooled heat sink assembly includes an upper heat sink 1 and a lower heat sink 2, the upper surface of the lower heat sink is designed with a crystal groove according to the size of the laser crystal 14, for mounting the laser crystal, and the upper heat sink, the lower heat sink and the laser crystal are fixed together by indium welding, where the size of the crystal groove is the sum of the size of the laser crystal plus the size of the non-transparent surface covering indium foil 15. The indium welding method of the laser crystal and the water cooling heat sink assembly can refer to the technical content disclosed in China patent 201510189271.0, and the description is omitted here. Because of the good heat conductivity of indium welding, the laser crystal can conduct heat to the upper heat sink and the lower heat sink, and the upper heat sink conducts heat to the lower heat sink, so that the heat is taken away through water flow.
Referring to fig. 3 (arrows show the flow direction of cooling water), in this embodiment, a plurality of closely arranged longitudinal channels 4 are longitudinally arranged in the lower heat sink, a water inlet 5 and a water outlet 6 are arranged at the bottom of the lower heat sink, one end of each of the plurality of longitudinal channels is communicated with the water inlet, the other end of each of the plurality of longitudinal channels is communicated with the water outlet, a plurality of closely arranged transverse channels 7 are arranged below the crystal groove, and a plurality of transverse channels are vertically communicated with a plurality of longitudinal channels. The diameter of the longitudinal duct is 2.5mm. The diameter of the transverse duct is 2.5mm. The longitudinal pore canal adopts a multi-pore close-packed mode with the diameter of 2.5mm, the contact area of the lower heat sink and water is maximized, and the transverse pore canal vertical to the longitudinal pore canal is added at the bottom of the laser crystal, so that the contact surface of the water and the lower heat sink is increased, and meanwhile, the turbulence is increased so as to more fully exchange heat.
Referring to fig. 1, in this embodiment, a plurality of fixing holes 8 are provided on the lower heat sink, and the lower heat sink is fixed to the water-cooling plate by fasteners penetrating through the fixing holes. The water cooling plate is fixed on the laser housing. The water inlet is in sealing connection with the inner side of a water supply port of the water cooling plate from the inside of the laser shell, the water outlet is in sealing connection with the inner side of a water return port of the water cooling plate from the inside of the laser shell, and the outer side of the water supply port and the outer side of the water return port of the water cooling plate are connected with a circulating water cooling system through pipelines. The pipeline with complex design and unreliable sealing performance is moved from the inside of the laser housing to the outside of the laser housing, so that the laser is reduced in size and the risk of water leakage is avoided.
Referring to fig. 2, in this embodiment, the water inlet 5 is in the shape of a runway, and the water outlet 6 is in the shape of a runway. The flow speed of cooling water is slowed down when flowing into the longitudinal pore canal, and the whole lower heat sink waterway can be uniformly filled, so that the occurrence of partial water flow is avoided, and the effect of heat dissipation is as uniform as possible.
Referring to fig. 2, in this embodiment, the water inlet is provided with a water inlet sealing groove 9, a water inlet sealing ring is arranged in the water inlet sealing groove, the water outlet is provided with a water outlet sealing groove 10, and a water outlet sealing ring is arranged in the water outlet sealing groove. The test shows that the leakage rate of the sealing effect can reach 10 -9, which is far better than the sealing effect of the water pipe mode. According to the invention, a bottom surface water inlet and outlet mode is adopted, and the O-shaped sealing ring is adopted for sealing, so that the space of a water pipe and a water pipe joint is saved, and the whole occupied space of the heat sink is reduced.
Referring to fig. 1, the ends of the plurality of the longitudinal cells are integrally sealed by a first cap 11, and the ends of the plurality of the lateral cells are integrally sealed by a second cap 12. And the lower heat sink integrally seals the redundant waterway openings in a large-plane welding mode, and a welding surface is machined again after sealing, so that the surface is smooth.
Referring to fig. 1, in this embodiment, solder diversion trenches 13 are provided on both sides of the crystal trench. The diversion trench can prevent excessive indium from overflowing, reduce the possibility of indium polluting the light-passing surface of the laser crystal, prevent indium from flowing out of the surface of the heat sink, and keep the whole heat sink attractive.
Referring to fig. 5, the water-cooling heat sink assembly can be flexibly changed according to the number of laser crystals, when the number of the laser crystals needs to be increased, only a crystal groove is formed in a proper position of the lower heat sink, the number of the upper heat sink is correspondingly increased, and the number of the upper heat sink is equal to the number of the laser crystals. Because the water pipe is omitted, the upper heat sinks and the heat sink components can be closely arranged, and the overall size of the laser can be greatly reduced.
The invention omits a water pipe, the heat sink component is easy and convenient to assemble and disassemble, only the fixing screws of the upper heat sink and the lower heat sink and the water cooling plate are needed to be assembled and disassembled, and the operating space of a water pipe assembling and disassembling tool is not needed to be considered in the structural design, so that the risk of spilling water in the heat sink and the water pipe in the disassembling process is greatly reduced.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced with equivalents; such modifications and substitutions do not depart from the spirit of the invention, and are intended to be included within the scope of the appended claims and description.
Claims (6)
1. The utility model provides a water-cooling heat sink subassembly for laser crystal, includes upper heat sink (1), lower heat sink (2), its characterized in that: the utility model discloses a solar heat collector, including lower heat sink, water inlet, water outlet, water inlet, heat sink, at least one crystal groove (3) is equipped with on the lower heat sink, the both sides of crystal groove are equipped with solder guiding gutter (13), the inside of lower heat sink is equipped with many closely arranged longitudinal duct (4) along vertically, the bottom of lower heat sink is equipped with water inlet (5) and delivery port (6), many longitudinal duct's one end with the water inlet intercommunication, many longitudinal duct's the other end with the delivery port intercommunication, the below of crystal groove is equipped with many closely arranged transverse duct (7), many transverse duct with many longitudinal duct communicates perpendicularly, water inlet and water cooling plate's water supply mouth sealing connection, delivery port and water cooling plate's return water mouth sealing connection, the water inlet is the runway shape, the delivery port is the runway shape.
2. A water cooled heat sink assembly for a laser crystal as claimed in claim 1, wherein: the lower heat sink is provided with a plurality of fixing holes (8), and is fixed on the water cooling plate through fasteners penetrating through the fixing holes.
3. A water cooled heat sink assembly for a laser crystal as claimed in claim 1, wherein: the water inlet is provided with a water inlet sealing groove (9), a water inlet sealing ring is arranged in the water inlet sealing groove, the water outlet is provided with a water outlet sealing groove (10), and a water outlet sealing ring is arranged in the water outlet sealing groove.
4. A water cooled heat sink assembly for a laser crystal as claimed in claim 1, wherein: the ends of a plurality of the longitudinal channels are integrally sealed by a first sealing cover (11), and the ends of a plurality of the transverse channels are integrally sealed by a second sealing cover (12).
5. A water cooled heat sink assembly for a laser crystal as claimed in claim 1, wherein: the diameter of the longitudinal duct is 2.5mm.
6. A water cooled heat sink assembly for a laser crystal as claimed in claim 1, wherein: the diameter of the transverse duct is 2.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910764014.3A CN110429457B (en) | 2019-08-19 | Water-cooling heat sink assembly for laser crystal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910764014.3A CN110429457B (en) | 2019-08-19 | Water-cooling heat sink assembly for laser crystal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110429457A CN110429457A (en) | 2019-11-08 |
| CN110429457B true CN110429457B (en) | 2024-07-12 |
Family
ID=
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485570A (en) * | 2014-12-05 | 2015-04-01 | 中国科学院上海光学精密机械研究所 | High-power slab laser amplifier |
| CN107705823A (en) * | 2017-11-13 | 2018-02-16 | 中国科学院合肥物质科学研究院 | A kind of cooling structure suitable for the wall of magnetic confinement nuclear fusion device first |
| CN210224586U (en) * | 2019-08-19 | 2020-03-31 | 北京东方锐镭科技有限公司 | Water-cooling heat sink assembly for laser crystal |
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485570A (en) * | 2014-12-05 | 2015-04-01 | 中国科学院上海光学精密机械研究所 | High-power slab laser amplifier |
| CN107705823A (en) * | 2017-11-13 | 2018-02-16 | 中国科学院合肥物质科学研究院 | A kind of cooling structure suitable for the wall of magnetic confinement nuclear fusion device first |
| CN210224586U (en) * | 2019-08-19 | 2020-03-31 | 北京东方锐镭科技有限公司 | Water-cooling heat sink assembly for laser crystal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110429457B (en) | Water-cooling heat sink assembly for laser crystal | |
| CN209598470U (en) | A kind of lens barrel cooling device and laser process equipment | |
| CN104538822B (en) | High-power laser pumping cooling sealing module system | |
| CN111318821A (en) | Multi-region liquid cooling laser cutting head | |
| CN210224586U (en) | Water-cooling heat sink assembly for laser crystal | |
| WO2020155265A1 (en) | Fluid cooling device | |
| CN207765786U (en) | A kind of semiconductor laser structure and its cooling device of directly logical coolant liquid heat dissipation | |
| CN206401706U (en) | The main power amplifier device of all solid state ultrafast laser | |
| CN111952825B (en) | Gain medium cooling device of laser | |
| CN112968342A (en) | End-pumped laser crystal microchannel water-cooling structure for heat dissipation | |
| CN110429457A (en) | A kind of hot and cold water sink component for laser crystal | |
| CN210257908U (en) | New energy automobile air conditioner gathers heat energy water-cooling board winter | |
| CN207638140U (en) | A kind of cooling structure for high power pump source | |
| CN219916147U (en) | Camera waterproof heat dissipation protection device for water-rich tunnel super-undermining detection | |
| TW202042463A (en) | Electrical connector | |
| TW202033924A (en) | Fluid cooling device | |
| CN216804264U (en) | Solenoid valve manifold block | |
| CN211782961U (en) | Novel high-efficient cooler structure | |
| CN220693623U (en) | Advertisement case with dual cycle heat dissipation pipeline | |
| CN220023458U (en) | Cooling and constant temperature side plate assembly and system | |
| CN104485570A (en) | High-power slab laser amplifier | |
| CN218763254U (en) | Waterproof LED lamp strip of initiative heat dissipation | |
| CN117220121A (en) | Solid laser crystal thermal management device and solid laser | |
| CN114025142B (en) | Liquid cooling heat dissipation cold head, liquid cooling heat dissipation system and laser television | |
| CN221080137U (en) | Battery cover plate structure and battery module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |