TWI684305B - Intermediate connector and substrate inspecting apparatus - Google Patents

Abstract

The present invention provides a relay connector, which can easily reduce mutual interference of a plurality of terminal components and increase the arrangement density of the terminal components. The relay connector includes a board, a covering conductor layer, a plurality of terminal parts, and an insulating layer. The board is formed with a through hole; the covering conductor layer is provided to cover the inner surface of the through hole; a plurality of terminal parts are installed through the inside of the covering conductor layer, and the plurality of terminal parts are rod-shaped and have conductivity; an insulating layer is formed on the cover Between the conductor layer and the terminal member, each covering conductor layer is insulated from the terminal member; a first connection portion is provided at one end of each of the plurality of terminal members, and a second connection portion is provided at the other end of the plurality of terminal members, respectively.

Description

Relay connector and substrate inspection device

The present invention relates to a relay connector suitable for relaying between connection terminals as connection objects and a board inspection device including the relay connector.

Conventionally, there has been known a relay connector in which through holes are formed in a matrix on a base plate and a pin-shaped terminal member is inserted into the through holes (for example, refer to Patent Document 1). In this relay connector, the through-hole adjacent to the through-hole into which the terminal member is inserted is not inserted into the terminal member, but is a cavity. A conductor layer is formed on the inner peripheral surface of the cavity, and the conductor layer can be in contact with the ground. Therefore, the two terminal members are not adjacent, and a grounded cavity is arranged between the two terminal members. Thereby, the mutual interference of a plurality of terminal members can be reduced.

Prior technical literature

Patent Literature

Patent Document 1: Japanese Patent Laid-Open No. 2013-214376

However, according to the above-mentioned technique, since holes are arranged between the two terminal members, there is a problem that it is not easy to increase the arrangement density of the terminal members.

The present invention provides a relay connector that reduces mutual interference of a plurality of terminal components and easily increases the arrangement density of terminal components, and a board inspection device including the relay connector.

The invention discloses a relay connector, which is suitable for relaying between a plurality of first connection terminals as connection objects and a plurality of second connection terminals as connection objects. The relay connector includes a board, a conductive covering conductor layer, a terminal part, and an insulating layer. The board is a plate-shaped member formed with a plurality of through-holes penetrating in the thickness direction; the conductive covering conductor layer is provided to cover the inner surface of each through-hole; the terminal member is installed through the covering conductor layer of each through-hole Inside, and the terminal member is rod-shaped and has conductivity; an insulating layer is formed between each cover conductor layer and the terminal member penetratingly installed inside each cover conductor layer, and each cover conductor layer and each The terminal part is insulated. At one end of the plurality of terminal members, first connection portions configured to be connectable to the plurality of first connection terminals are provided, respectively, and at the other end of the plurality of terminal members, respectively configured to be connectable to the plurality of second connections The second connection part of the terminal connection.

Preferably, the relay connector is provided with a plurality of boards, the plurality of boards is laminated into a plurality of through holes of each board to form mutually adjacent boards and a plurality of through holes communicate with each other to form a plurality of communication holes; a plurality of terminal parts It is installed through a plurality of communication holes.

Preferably, among the plate surfaces of the plurality of plates, the plate surface facing the plate surface of the adjacent plate is formed with openings provided so as to avoid the end of the insulating layer in each through hole on the plate surface Conductor portion; the conductor portion is provided to be connected to the covering conductor layer formed in each through-hole; the conductor portions formed on the plate surfaces facing each other are in contact with each other, so that the plurality of connecting holes are connected in the plate thickness direction in each communication hole The covering conductor layer conducts.

Preferably, the conductor portion is formed in a planar shape on the opposite plate surface so as to be connected to the end portions of the plurality of covered conductor layers and to make conduction between the plurality of covered conductor layers.

Preferably, in at least one of the two plate surfaces located at both ends in the stacking direction among the plurality of stacked plates, an opening is formed so as to avoid the end of each insulating layer on one side and expand into a planar shape The conductive layer is connected to the end of one side of each covering conductor layer.

The present invention discloses a substrate inspection device including the above-mentioned relay connector.

The relay connector and the substrate inspection device of such a structure can easily reduce the mutual interference of a plurality of terminal components and increase the arrangement density of the terminal components.

According to the present invention, since the first connection portion provided at one end of the plurality of terminal members can be connected to the first connection terminal of the wiring object, the second connection portion provided at the other end of the plurality of terminal members can be connected to the The second connection terminal of the wire object is connected, so the first connection terminal and the second connection terminal are relayed by the terminal member. In other words, the signal flows through each terminal part. In addition, each terminal member is surrounded by the covering conductor layer while being insulated by the insulating layer. Thereby, each terminal member can be electromagnetically shielded by covering the conductor layer. As a result, it is possible to reduce mutual interference (crosstalk) of a plurality of terminal members. In addition, since it is not necessary to arrange holes between the two terminal members as in the conventional technique, it is easy to increase the arrangement density of the terminal members.

In addition, the distance of the signal relayed by the relay connector can be adjusted by the number of boards. Therefore, it is easy to manufacture a relay connector corresponding to the distance of the signal to be relayed.

In addition, by stacking a plurality of plates, the conductor portions of each plate are in contact with each other to conduct, and the plurality of covered conductor layers connected in the plate thickness direction are conducted in the communication holes formed by the through holes communicating with each plate. As a result, since the terminal member penetratingly attached to the communication hole can be surrounded by the continuous covering conductor layer without a gap, the electromagnetic shielding effect by the covering conductor layer, that is, the mutual interference of the plurality of terminal members can be increased ( Crosstalk).

In addition, when the conductor portion is grounded, the planar conductor portion becomes a ground conductor, and the effect of stabilizing the ground potential and the effect of reducing the impedance can be further increased, resulting in the effect of further increasing the electromagnetic shielding effect by covering the conductor layer.

In addition, when the conductive layer is grounded, the planar conductive layer becomes a ground conductor, which can increase the area of the ground conductor and stabilize the ground potential, and can reduce the impedance of the ground. The electromagnetic shielding effect of the covering conductor layer.

In addition, in the substrate inspection apparatus, the above-described effect of the relay connector can be achieved.

Hereinafter, the relay connector according to an embodiment of the present invention will be described based on the drawings. In addition, the structures denoted by the same symbols in the drawings represent the same structures, and their descriptions are omitted. FIG. 1 is a side view schematically showing the structure of a first connector and a second connector of a relay connector and a connection object connected to the relay connector according to an embodiment of the present invention.

The relay connector 1 shown in FIG. 1 is connected to the connection switching unit 2 on one side (lower side in the figure), and is connected to the connector 3 on the other side (upper side in the figure). The relay connector 1 is relayed between the connection switching unit 2 and the connector 3. The relay connector 1 is configured by a plate-shaped base plate A supporting a plurality of bar-shaped conductive terminal members 10.

The connection switching unit 2 is a scanning device of a substrate inspection device used for inspection of electrical characteristics of wiring patterns provided on a substrate. The connection switching unit 2 is used to switch the electrical connection relationship between the probe of the inspection jig and the inspection unit including the inspection power supply unit, the voltage detection unit, and the current detection unit of the inspection apparatus main body. The connection switching unit 2 is composed of a plurality of substrate units 21 each including a plurality of switching elements, and a plurality of first connection terminals 22 protrudingly provided in a pin shape are provided at a predetermined pitch at one end of each substrate unit 21.

The substrate inspection device according to an embodiment of the present invention includes the relay connector 1. The relay connector 1 relays between an inspection jig and a connection switching unit 2 (scanning device), and the inspection jig includes a probe for bringing it into contact with an inspection point such as a wiring pattern as an inspection object.

When the relay connector 1 is attached to the connection switching unit 2, one end of the plurality of terminal members 10 is connected to the plurality of first connection terminals 22, respectively.

The connector 3 is formed with a plurality of terminal accommodating holes 32 that can accommodate the other end of the terminal member 10 protruding from the relay connector 1 described later. A pin-shaped second connection terminal 31 is provided in the terminal accommodation hole 32. The plurality of second connection terminals 31 are connected to the electrode portions to which the probes of the inspection jig are connected via the leads 4 respectively.

If the connector 3 is attached to the relay connector 1, the other ends of the plurality of terminal members 10 are respectively accommodated in the plurality of terminal accommodation holes 32, and in each terminal accommodation hole 32, the other end of the plurality of terminal members 10 One end is connected to a plurality of second connection terminals 31, respectively. That is, by connecting the connection switching unit 2, the relay connector 1 and the connector 3, the plurality of probes provided in the inspection jig are electrically connected to the plurality of first connection terminals 22 of the connection switching unit 2, respectively.

In addition, although the example in which the relay connector 1 is relayed between the inspection jig of the substrate inspection device and the connection switching unit 2 (scanning device) is shown, the relay connector 1 can also be used for various purposes. The first connection terminal 22 is not limited to the connection terminal to which the switching unit 2 is connected, and the second connection terminal 31 is not limited to the connection terminal connected to the inspection jig (probe).

FIG. 2 is a plan view of the relay connector 1 shown in FIG. 1. The top view shown in FIG. 2 shows the upper surface of the relay connector 1 shown in FIG. 1. Since the upper surface and the lower surface of the relay connector 1 are configured substantially the same, the lower surface of the relay connector 1 will also be described with reference to FIG. 2. FIG. 3 is a III-III cross-sectional view of the relay connector 1 shown in FIG. 2.

The relay connector 1 shown in FIGS. 2 and 3 includes a plate-shaped base plate A and a plurality of terminal members 10 for relay connection. The bottom plate A is formed by stacking the plates 7, 8, and 9. The plates 7, 8, and 9 are formed of an insulating material such as resin or glass fiber. The plates 7, 8, and 9 are bonded and stacked by bonding means such as an adhesive, for example. In addition, the number of plates is not limited to three. The number of plates constituting the bottom plate A may be one, two, or four or more. In addition, the bottom plate A is not limited to a plate shape. The bottom plate A may be, for example, block-shaped.

According to this structure, the distance of the signal relayed by the relay connector 1 can be adjusted by the number of boards. Therefore, it is easy to manufacture the relay connector 1 corresponding to the distance of the signal to be relayed.

The number of the plurality of through-holes, for example, 1024, is arranged, for example, in a matrix and is formed on the plates 7, 8, and 9, respectively, that is, 1024 through-holes 71 are formed on the plate 7, and 1024 through-holes 81 are formed on the plate 8 In the plate 9, 1024 through holes 91 are formed. In addition, in FIGS. 2 to 4, in order to simplify the description, an example is shown in which twelve through holes 71, 81, and 91 are formed in the plates 7, 8, and 9, respectively.

The through holes 71, 81, and 91 are formed at positions corresponding to each other of the plates 7, 8, and 9. The plates 7, 8, and 9 are laminated so that the through holes of the plates adjacent to each other communicate with each other to form a plurality of communication holes. In the through hole 71, a covering conductor layer 72 is formed to cover the inner wall surface thereof. The through hole 71 and the covering conductor layer 72 form a so-called through hole. Similarly, the cover conductor layer 82 is formed in the through hole 81, and the cover conductor layer 92 is formed in the through hole 91. The covering conductor layers 72, 82, 92 are made of a plating layer formed of a conductive metal such as copper.

The thickness of the plates 7, 8, and 9 is set to 5.0 mm, for example; the inner diameter of the through holes 71, 81, and 91 is set to 2.2 mm; and the inner diameter of the covering conductor layers 72, 82, and 92 is set to 1.4 mm, for example The pitch of the through holes 71, 81, 91 is set to 2.54 mm, for example; the diameter of the terminal member 10 is set to 1.0 mm, for example.

Inside the covering conductor layers 72, 82, 92, insulating layers 73, 83, 93 formed using an insulating material such as resin are formed. The terminal member 10 having a rod shape is penetratingly installed inside the insulating layers 73, 83, and 93 so that the penetrating holes 71, 81, and 91 communicate with each other. The terminal member 10 is held in the communication hole by the insulating layers 73, 83, and 93 and is insulated from the covering conductor layers 72, 82, and 92.

On the bottom plates A formed by stacking the plates 7, 8, and 9, the two plate surfaces (the upper surface of the plate 7 and the lower surface of the plate 9 in FIG. 3) at both ends of the stacking direction are expanded into planar conductive The layers 74 and 94 are formed with openings 77 and 97 to avoid the ends of the insulating layers 73 and 93 exposed on the respective board surfaces. The conductive layer 74 is connected to the end of the upper surface side of the plate 7 covering the conductive layer 72. The conductive layer 94 is connected to the end of the plate 9 covering the conductive layer 92 on the lower surface side. The conductive layers 74, 94 constitute a so-called full-plate pattern.

In addition, it is not necessarily limited to the example in which the conductive layers 74 and 94 are formed. Among the conductive layers 74 and 94, for example, only the conductive layer 74 may be provided, or only the conductive layer 94 may be provided, or any one of the conductive layers 74, 94 may not be provided.

Please refer to FIGS. 3 and 4. FIG. 4 is a diagram showing the surface of the plates 7, 8 and 9 that are opposite to the surface of the adjacent plate (the lower surface of the plate 7 in FIG. 3 and the plate 8 ). Top view of the upper surface and the lower surface, the upper surface of the plate 9, hereinafter referred to as the opposing plate surface).

On the opposite plate surface, an opening is formed so as to surround the end surfaces of the insulating layers 73, 83, and 93 formed in the through holes 71, 81, and 91 formed on the plate surface, and is connected to the covering conductor layers 72, 82, and 92. The conductor parts 75, 85, 95. Thus, when the plates 7, 8, and 9 are stacked to form the bottom plate A, the conductor portion 75 is in contact with the conductor portion 85, and the conductor portion 85 is in contact with the conductor portion 95. As a result, the conductive layer 74, the covering conductor layers 72, 82, 92, and the conductive layer 94 are conducted. In order to prevent an increase in contact resistance on the surfaces of the conductor portions 75, 85, and 95, for example, an oxidation prevention treatment such as gold plating is performed.

In the plates 7, 8, and 9, through holes 76, 86, and 96 are formed at positions corresponding to each other. The through holes 76, 86, 96 are connected to the conductive layers 74, 94. When the plates 7, 8, and 9 are stacked to form the bottom plate A, the through holes 76, 86, and 96 communicate with each other to form a communication hole. In the communication hole, the conductive connection pin 5 is installed through, and the covering conductor layers 72, 82, 92 on the inner surface of the through holes 76, 86, 96 and the connection pin 5 are electrically connected. Thereby, the connection pins 5 are connected to the ground by using, for example, wiring (not shown), and the conductive layers 74 and 94 and the covering conductor layers 72, 82 and 92 are grounded.

Please refer to FIGS. 1 to 5. FIG. 5 is a longitudinal sectional view showing an example of the structure of the terminal member 10 shown in FIG. 3. The terminal member 10 is configured to include a cylindrical portion 11, a plunger 12 and a compression spring 13. The cylindrical portion 11 has an elongated cylindrical shape, and a first connection portion 111 is provided at one end portion thereof. The cylindrical portion 11, the plunger 12, and the compression spring 13 are made of a conductive material such as conductive metal.

The first connection portion 111 is inserted into the first connection terminal 22 and electrically connected when the pin-shaped first connection terminal 22 connecting the switching unit 2 is inserted into the first connection portion 111. In addition, one or a plurality of conductive sliding contact pieces 112 that are in sliding contact with the side surface of the inserted first connection terminal 22 are provided on the inner peripheral surface of the first connection portion 111.

Inside the cylindrical portion 11, a partition wall-shaped fixing portion 113 for preventing the compression spring 13 described later from being removed is provided. In addition, the cylindrical portion 11 is provided with a roller caulking portion 114 that is partially reduced in diameter and engages with an engaging portion 123 provided on one side of the plunger 12 described later to prevent the plunger 12 from coming off. Further, when the terminal portion 10 is inserted (pressed) into the insulating layers 73, 83, and 93 of the through holes 71, 81, and 91 of the plates 7, 8, and 9 in the cylindrical portion 11, the insulating layer 73 is provided. The inner circumferential surfaces of the rollers 83, 93 are pressed radially outward to prevent the terminal member 10 from slipping.

The plunger 12 is formed of a conductive material such as a conductive metal, and has an elongated and generally rod-like shape, and one end side thereof extends from the other side of the cylindrical portion 11 into the cylindrical portion 11 in the axial direction (arrow B in FIG. 5). It is inserted in a state where it can slide in the direction indicated). At the other end of the plunger 12, a second connection portion 121 to which the pin-shaped second connection terminal 31 of the connector 3 is electrically connected is provided, and at the front end of the second connection portion 121, a second connection terminal 31 is provided The recess 122 in which the front end of the second connection terminal 31 fits during connection.

In addition, as a modification, the recessed portion 122 may be provided at the front end of the second connection terminal 31 instead of the front end of the second connection portion 121. In addition, an engagement portion 123 that engages with the roller caulking portion 114 of the cylindrical portion 11 is provided on a portion of the plunger 12 that is inserted into the cylindrical portion 11 in order to prevent detachment.

The compression spring 13 is inserted and held between the fixed portion 113 in the cylindrical portion 11 and one end of the plunger 12 in the axially compressed state, and the one end of the plunger 12 is directed to the other side (the plunger 12 pushes in the direction of pushing out of the cylindrical portion 11).

Therefore, when the second connection portion 121 of the plunger 12 and the second connection terminal 31 are connected, the plunger 12 is pressed into the cylindrical portion 11 against the urging force of the compression spring 13 due to the load during connection. At this time, since the second connection portion 121 is pressed against the second connection terminal 31 by the urging force of the compression spring 13, a stable connection state of the second connection portion 121 and the second connection terminal 31 can be obtained.

The connection between the relay connector 1 and the connection switching unit 2 configured in this manner is achieved by inserting the first connection terminals 22 of the connection switching unit 2 into the first connection portions 111 of the corresponding terminal members 10 of the relay connector 1 From within. In addition, the connection between the relay connector 1 and the connector 3 is achieved by inserting the second connecting portion 121 of each terminal member 10 of the relay connector 1 into the corresponding terminal receiving hole of the connector 3 The front end of the second connection terminal 31 in the hole is fitted into the recess 122 of the second connection portion 121. Thereby, the first connection terminal 22 of the connection switching unit 2 and the second connection terminal 31 of the connector 3 are electrically connected via the terminal member 10 of the relay connector 1.

Since the relay connector 1 configured as described above can electromagnetically shield (shield) the terminal members 10 through which signals to be relayed by covering the conductor layers 72, 82, 92, respectively, it is possible to reduce a plurality of The terminal parts 10 interfere with each other, so-called crosstalk. In addition, since the relay connector 1 does not need to provide a cavity between two terminal members as in the conventional technology, it is easy to increase the arrangement density of the terminal members 10.

In addition, since the conductor portions 75, 85, and 95 are formed on the opposing plate surfaces of the plates 7, 8, and 9, the bottom plate A is formed by stacking the plates 7, 8, and 9, so that the conductor portion 75 and the conductor portion 85 are in contact. The conductor portion 85 is in contact with the conductor portion 95. As a result, since the covering conductor layers 72, 82, and 92 related to one communication hole can be easily conducted, the covering conductor layers 72, 82, and 92 can easily function as an electromagnetic shield (shield).

Preferably, by providing at least one of the conductive layers 74, 94, the area of the ground conductor can be increased to stabilize the ground potential, and since the impedance of the ground can be reduced, the coverage based on the ground connection can be increased The electromagnetic shielding effect of the conductor layers 72, 82, 92. If the structure includes both the conductive layers 74 and 94, the effect of stabilizing the ground potential and the effect of reducing the impedance are further increased, and the electromagnetic shielding effect by covering the conductor layers 72, 82, and 92 can be further increased.

Preferably, although an example is shown in which the conductor portions 75, 85, 95 are formed corresponding to the plurality of through holes 71, 81, 91, respectively, the conductor portions 75, 85, 95 and the conductive layers 74, 94 may also be configured . Similarly, the opposing plate surface is formed in a planar shape so as to be connected to the ends of the plurality of covering conductor layers 72, 82, 92, and the plurality of covering conductor layers 72, 82, 92 is provided in the plane direction of the opposing board surface Conducting between them, and connecting the conductor parts 75, 85, 95 formed in this way to the connection pins 5. In this way, the effect of stabilizing the ground potential and the effect of reducing the impedance can be further increased, resulting in the effect of further increasing the electromagnetic shielding effect by covering the conductor layers 72, 82, 92.

FIG. 6 is an explanatory diagram for explaining the method of manufacturing the relay connector 1. First, as shown in FIG. 6(a), a plurality of through-holes and through-holes 76 that constitute the through-hole 71 and cover the conductor layer 72 are prepared, a conductive layer 74 is formed on one side, and a conductor portion 75 is formed on the other side. The two-sided through-hole substrate serves as the plate 7. In addition, although FIG. 6 (a), (b), and (c) take the board 7 as an example, FIGS. 6 (a), (b), and (c) are carried out similarly for the boards 8 and 9.

Next, as shown in FIG. 6( b ), the area within the through hole surrounded by the covered conductor layer 72 is filled with an insulating material C such as resin. Next, as shown in FIG. 6( c ), the insulating material C filled in the through hole is formed with a through hole D having an inner diameter substantially equal to the outer shape of the cylindrical portion 11 by, for example, drilling.

Next, as shown in FIG. 6( d ), the plates 7, 8, and 9 thus processed are stacked to constitute the bottom plate A. Next, as shown in FIG. 6( e ), the terminal member 10 is installed (pressed) into the communication hole in which the conductive layers 72, 82, and 92 are formed, and the through holes 76, 86, and 96 are formed in the communication. The connecting pin 5 is installed (pressed) through the communication hole. As described above, the relay connector 1 can be manufactured by the manufacturing flow shown in FIGS. 6( a) to (e ).

Next, in order to confirm the electromagnetic shielding effect between the terminal members 10, that is, the effect of reducing crosstalk, for the relay connector 1 configured as described above, the electrostatic capacitance between two adjacent terminal members 10 was experimentally measured . The smaller the electrostatic capacitance between two adjacent terminal members 10, the greater the electromagnetic shielding effect between the terminal members 10, that is, the effect of reducing crosstalk.

As a comparative example for confirming the effect, a comparative sample was produced in which the covering conductor layers 72, 82, 92, the conductive layers 74, 94, and the conductor portions 75, 85, 95 (see FIG. 2) were removed from the relay connector 1. Then, for the relay connector 1 and the comparative sample, the electrostatic capacitance between the two terminal members 10 was measured at each frequency of 20 kHz, 100 kHz, and 1 MHz. As a result, in the relay connector 1, the measurement frequency is 17.9 Ff at 20 kHz, the measurement frequency is 15.7 fF at 100 kHz, and the measurement frequency is 13.4 fF at 1 MHz. On the other hand, in the comparison sample, it is 130.4 fF at a measurement frequency of 20 kHz, 143.6 fF at a measurement frequency of 100 kHz, and 132.5 fF at a measurement frequency of 1 MHz.

Based on the above experimental results, the electrostatic capacitance between the two terminal members 10 of the relay connector 1 is reduced by approximately 1/10 of that of the comparative sample, and the electromagnetic shielding effect, that is, the crosstalk reduction effect is increased.

1‧‧‧Relay connector 2‧‧‧Connect switching unit 3‧‧‧Connector 4‧‧‧Wire 5‧‧‧Connect pins 7, 8, 9‧‧‧ plate 10‧‧‧terminal parts 11‧‧‧Cylinder 12‧‧‧ Plunger 13‧‧‧Compression spring 21‧‧‧Substrate unit 22‧‧‧First connection terminal 31‧‧‧Second connection terminal 32‧‧‧terminal receiving hole 71, 81, 91 72, 82, 92‧‧‧ Cover conductor layer 73, 83, 93‧‧‧ Insulation 74, 94‧‧‧ conductive layer 75, 85, 95 ‧‧‧ Conductor 76, 86, 96 ‧‧‧ through hole 77, 97‧‧‧ opening 111‧‧‧First connection 112‧‧‧Sliding contact sheet 113‧‧‧Fixed Department 114‧‧‧Roll riveting section 115‧‧‧Press ring 121‧‧‧Second connection 122‧‧‧Depression 123‧‧‧Joint Department A‧‧‧Bottom plate C‧‧‧Insulation material D‧‧‧Through hole

FIG. 1 is a side view schematically showing the structure of a first connector and a second connector of a relay connector and a connection object connected to the relay connector according to an embodiment of the present invention.

FIG. 2 is a plan view of the relay connector shown in FIG. 1.

3 is a III-III cross-sectional view of the relay connector shown in FIG. 2.

FIG. 4 is a plan view showing a plate surface facing the plate surface of an adjacent plate among the plate surfaces of the plate.

5 is a longitudinal cross-sectional view showing an example of the structure of the terminal member shown in FIG. 3.

6 is an explanatory diagram for explaining a method of manufacturing the relay connector.

1‧‧‧Relay connector

5‧‧‧Connect pins

7, 8, 9‧‧‧ plate

10‧‧‧terminal parts

71, 81, 91

72, 82, 92‧‧‧ Cover conductor layer

73, 83, 93‧‧‧ Insulation

74, 94‧‧‧ conductive layer

75, 85, 95 ‧‧‧ Conductor

76, 86, 96 ‧‧‧ through hole

77, 97‧‧‧ opening

A‧‧‧Bottom plate

Claims (4)

A relay connector suitable for relaying between a plurality of first connection terminals as a connection object and a plurality of second connection terminals as a connection object, the relay connector includes: a board, which It is a plate-shaped member formed with a plurality of through-holes penetrating in the thickness direction of the board; a conductive covering conductor layer, which is arranged to cover the inner surface of each through-hole; a plurality of terminal parts, which The through-holes are installed inside the covered conductor layers of the through-holes, the plurality of terminal members are rod-shaped and have electrical conductivity; and an insulating layer formed on each of the covered conductor layers and through-mounted on each of the Covering between the terminal members on the inner side of the conductor layer and insulating each of the covered conductor layers from each of the terminal members; one end of each of the plurality of terminal members is provided to be able to be connected to the plurality of first connection terminals A first connection portion of the plurality; at the other ends of the plurality of terminal members, a second connection portion configured to be connected to the plurality of second connection terminals is provided, the relay connector is provided with a plurality of the boards, A plurality of the plates are stacked so that the plurality of through holes of each plate communicate between the through holes of the plates adjacent to each other to form a plurality of communication holes, and the plurality of terminal members are penetrated and mounted on the plurality of communication Hole, in each of the plurality of plate surfaces of the plate, the plate surface facing the adjacent plate surface of the plate, shaped An opening portion is provided so as to avoid a conductor portion at the end of the insulating layer in each through hole on the plate surface; the conductor portion is provided to be connected to the covering conductor layer formed in each through hole; The conductor portions on the plate surfaces facing each other are in contact with each other, so that a plurality of the covered conductor layers connected in the plate thickness direction in each of the communication holes are conducted. The relay connector as described in item 1 of the patent application range, wherein the conductor portion is formed in a planar shape on the opposite board surface so as to be connected to the ends of the plurality of covered conductor layers and to make the plurality of Conduction between covered conductor layers. The relay connector according to any one of items 1 to 2 of the patent application scope, wherein at least one of the two board surfaces located at both ends of the stacking direction among the stacked plural boards, An opening is formed so as to avoid an end of each insulating layer on one side and expand into a planar conductive layer; the conductive layer is connected to an end of one side of each of the covering conductor layers. A substrate inspection device comprising the relay connector according to any one of the items 1 to 3 of the patent application.

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