TWI679725B - Substrate processing device - Google Patents

Abstract

The substrate processing apparatus (SP) processes a substrate (W). The substrate processing apparatus (SP) includes a rotation jig (5c), a first driving unit (5a), a chamber (3), and a detection unit (SN). The rotation fixture (5c) can hold the substrate (W). The first driving part (5a) drives the rotation jig (5c) and rotates the rotation jig (5c). The chamber (3) houses a rotation jig (5c) and a first driving part (5a). The detection unit (SN) detects the vibration (vb) including the vibration (sv) of the rotation jig (5c) via the first driving unit (5a). The first driving section (5a) is arranged between the rotation jig (5c) and the detecting section (SN). The detection section (SN) is opposed to the first driving section (5a).

Description

Substrate processing device

The invention relates to a substrate processing apparatus and a vibration detection method for processing a substrate.

The substrate processing apparatus described in Patent Document 1 includes a spin chuck. The rotation fixture holds the substrate. Specifically, the rotation jig system includes four holding members. The four holding members are attached to a spin base. Of the four holding members, two holding members are fixed, and the other two holding members (hereinafter also referred to as "movable holding members") are movable. Further, by moving the movable holding member toward the substrate side, the four holding members are brought into contact with the peripheral portion of the substrate. As a result, the substrate system has a slightly horizontal posture and is held by the four holding members.

However, when the holding of the substrate by the holding member is incomplete or the substrate is held obliquely with respect to the rotation axis of the rotation jig, the substrate may fall off due to the rotation of the rotation jig.

Therefore, the substrate processing apparatus detects the position of the movable holding member that has moved toward the substrate side. Furthermore, the substrate processing apparatus detects whether the substrate is properly held or not properly held depending on the position of the movable holding member.

[Prior technical literature] [Patent Literature]

Patent Document 1: Japanese Patent Application Laid-Open No. 2016-25293.

However, in the substrate processing apparatus described in Patent Document 1, In the case where the position of the holding member shows that the substrate is properly held, the substrate may not be properly held for various reasons.

The various causes are, for example, deterioration of the holding member or warpage of the substrate. The deterioration of the holding member is, for example, that the holding member is corroded by the medicine or that the holding member is wearing.

For various reasons, for example, the rotation jig is located at a position different from the proper position due to looseness of a fixing member such as a bolt.

As described above, in the substrate processing apparatus described in Patent Document 1, it is detected that the substrate has been properly held or not properly held depending on the position of the movable holding member, and thus false detection may occur.

The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a substrate processing apparatus and a vibration detection method capable of reducing false detection when detecting that a substrate has been properly held or not properly held.

According to a first aspect of the present invention, the substrate processing apparatus processes a substrate. The substrate processing apparatus includes a rotation section, a driving section, a storage section, and a first detection section. The rotating part can hold the substrate. The driving portion drives the rotating portion and rotates the rotating portion. The accommodating portion accommodates the rotating portion and the driving portion. The first detection unit detects vibration including vibration of the rotating portion via the driving portion. The driving section is disposed between the rotating section and the first detecting section. The first detection section is opposed to the driving section.

Preferably, in the substrate processing apparatus of the present invention, the first detection unit detects the vibration while the rotation unit is rotating, and outputs a vibration signal indicating the vibration. Preferably, the substrate processing apparatus includes a determination unit and an execution unit. The determination unit determines whether the level of the vibration signal has exceeded a predetermined vibration range. The execution department follows the aforementioned judgment department If it is affirmative, a predetermined process is executed.

Preferably, in the substrate processing apparatus of the present invention, the preset processing includes processing for issuing an alarm and / or processing for controlling the driving section and stopping the rotation of the rotating section.

Preferably, the substrate processing apparatus of the present invention further includes a memory section. Preferably, the memory unit stores: a first predetermined value indicating a value at one end of the predetermined vibration range; and a second predetermined value indicating a value at the other end of the predetermined vibration range. Preferably, the vibration signal includes a vibration component in a first direction with respect to a preset reference level and a vibration component in a second direction opposite to the first direction with respect to the reference level. Preferably, the first predetermined value is established in correspondence with the vibration component in the first direction, and the second predetermined value is established in correspondence with the vibration component in the second direction.

Preferably, in the substrate processing apparatus of the present invention, the determination unit determines whether the number of times that the level of the vibration signal has exceeded the predetermined vibration range is equal to or greater than a predetermined value within a predetermined time. Preferably, the predetermined value is a plural number. Preferably, the execution unit executes the predetermined process in accordance with an affirmative determination made by the determination unit.

Preferably, in the substrate processing apparatus of the present invention, the predetermined vibration range is different depending on the number of rotations of the rotating portion per unit time.

Preferably, in the substrate processing apparatus of the present invention, the vibration signal includes a vibration component in a first direction with respect to a preset reference level and a third Vibration components in two directions. Preferably, the substrate processing apparatus further includes a memory unit. Preferably, the memory unit stores a first threshold value and a second threshold value for comparison with the level of the aforementioned vibration component. Preferably, the second threshold value is larger than the first threshold value. Preferably, the determination unit determines whether the absolute value of the level of the vibration component is larger than the first threshold value, and determines whether the absolute value is larger than the second threshold value. Compare Preferably, in a case where it is determined that the absolute value is greater than the first threshold value and it is determined that the absolute value is below the second threshold value, the execution unit executes the first process as the preset process.

Preferably, in the substrate processing apparatus of the present invention, the first processing system includes a process of stopping the rotation of the rotating portion after the processing on the substrate is completed.

Preferably, in the substrate processing apparatus of the present invention, when it is determined that the absolute value is greater than the second threshold value, the execution unit executes a second process different from the first process as the advance Set processing.

Preferably, in the substrate processing apparatus of the present invention, the second processing includes processing for stopping the rotation of the rotating portion in response to a case where it is determined that the absolute value is greater than the second threshold value.

Preferably, the substrate processing apparatus of the present invention further includes a second detection unit. Preferably, the second detection section detects the vibration including the vibration of the rotating section via the driving section. Preferably, the driving section is disposed between the rotating section and the second detecting section. Preferably, the second detection unit is opposed to the driving unit, and the detection sensitivity of the first detection unit is higher than the detection sensitivity of the second detection unit.

Preferably, in the substrate processing apparatus of the present invention, the first detection unit detects the vibration while the rotation unit is rotating and outputs a first vibration signal indicating the vibration; the second detection unit is While the rotating portion is rotating, the vibration is detected and a second vibration signal indicating the vibration is output. Preferably, the substrate processing apparatus further includes a determination unit and an execution unit. Preferably, the determination unit determines whether the level of the first vibration signal has exceeded the first vibration range, and determines whether the level of the second vibration signal has exceeded the second vibration range. Preferably, the execution unit is based on the determination result and the comparison of the first vibration signal. The combination of the determination results of the aforementioned second vibration signal determines the processing to be performed after the determination, and executes the determined aforementioned processing.

Preferably, in the substrate processing apparatus of the present invention, the first vibration signal includes a vibration component in a first direction with respect to a preset first reference level, and the vibration component with respect to the first reference level is the same as the foregoing. The vibration component in the second direction opposite to the first direction. Preferably, the second vibration signal includes a vibration component in a third direction relative to a preset second reference level and a vibration in a fourth direction opposite to the third direction relative to the second reference level. ingredient. Preferably, the substrate processing apparatus further includes a memory unit. Preferably, the memory unit stores a third threshold value for comparison with the level of the aforementioned vibration component of the first vibration signal and a fourth threshold value for comparison with the level of the aforementioned vibration component of the second vibration signal. Limit. Preferably, the determination unit determines whether the absolute value of the level of the vibration component of the first vibration signal is greater than the third threshold value, and determines the absolute value of the level of the vibration component of the second vibration signal. Whether the value is greater than the aforementioned fourth threshold. Preferably, in a case where it is determined that the absolute value is greater than the third threshold value and it is determined that the absolute value is below the fourth threshold value, the execution unit executes the third process as a result of the determination. Perform the aforementioned processing. Preferably, in a case where it is determined that the absolute value is larger than the third threshold value and it is determined that the absolute value is larger than the fourth threshold value, the execution unit executes the fourth process as a result of the determination. Perform the aforementioned processing. Preferably, in a case where it is determined that the absolute value is equal to or lower than the third threshold value and it is determined that the absolute value is greater than the fourth threshold value, the execution unit executes the fifth process as the execution after the determination. The aforementioned processing.

Preferably, in the substrate processing apparatus of the present invention, each of the third process, the fourth process, and the fifth process includes a process for issuing an alarm and / or a control for stopping the rotating part of the driving part. Processing of rotation.

Preferably, in the substrate processing apparatus of the present invention, the third processing system includes There is a process of stopping the rotation of the rotating portion after the processing in execution on the substrate is completed.

Preferably, in the substrate processing apparatus of the present invention, the fourth processing system includes the following processing: in response, it is determined that the absolute value is larger than the third threshold value and it is determined that the absolute value is larger than the fourth threshold value. When the limit is still large, the rotation of the rotating portion is stopped immediately. Preferably, the fifth processing includes the following processing: in response to a case where it is determined that the absolute value is below the third threshold and it is determined that the absolute value is greater than the fourth threshold, the rotation is stopped immediately. Rotation.

Preferably, the substrate processing apparatus of the present invention further includes a third detection unit. Preferably, the third detection section detects the vibration of the storage section. Preferably, the storage portion includes a base portion on which the driving portion is provided, and a wall portion. Preferably, the third detection portion is mounted on the wall portion.

Preferably, in the substrate processing apparatus of the present invention, the first detection unit detects the vibration including the vibration of the rotating portion while the rotating portion is rotating, and outputs a first vibration signal. Preferably, the third detection unit detects the vibration of the receiving portion while the rotating portion is rotating, and outputs a third vibration signal. Preferably, the substrate processing apparatus further includes a determination unit and an execution unit. Preferably, the determination unit determines whether the level of the first vibration signal has exceeded the third vibration range, and determines whether the level of the third vibration signal has exceeded the fourth vibration range. Preferably, the execution unit determines the processing to be executed after the determination based on a combination of the determination result for the first vibration signal and the determination result for the third vibration signal, and executes the determined processing.

Preferably, in the substrate processing apparatus of the present invention, the first vibration signal includes a vibration component in a first direction with respect to a preset first reference level, and the vibration component is the same as the first reference level The vibration component in the second direction opposite to the first direction. Better The third vibration signal includes a vibration component in a fifth direction relative to a predetermined third reference level and a vibration component in a sixth direction opposite to the fifth direction relative to the third reference level. . Preferably, the substrate processing apparatus further includes a memory unit. Preferably, the memory unit stores: a fifth threshold value for comparison with the level of the aforementioned vibration component of the first vibration signal; and a sixth threshold value for comparison with the aforementioned third vibration signal. Level comparison of the aforementioned vibration components. Preferably, the determination unit determines whether the absolute value of the level of the vibration component of the first vibration signal is greater than the fifth threshold value, and determines whether the level of the vibration component of the third vibration signal is Whether the absolute value is greater than the aforementioned sixth threshold. In a case where it is determined that the absolute value is greater than the fifth threshold value and it is determined that the absolute value is below the sixth threshold value, the execution unit executes the sixth process as the aforementioned process to be executed after the judgment. . Preferably, in a case where it is determined that the absolute value is larger than the fifth threshold value and it is determined that the absolute value is larger than the sixth threshold value, the execution unit executes the seventh process as the judgment. The aforementioned processing performed. Preferably, in a case where it is determined that the absolute value is equal to or smaller than the fifth threshold value and it is determined that the absolute value is greater than the sixth threshold value, the execution unit executes the eighth process as a result of the determination. The aforementioned processing is performed.

Preferably, in the substrate processing apparatus of the present invention, each of the sixth process, the seventh process, and the eighth process includes a process for issuing an alarm and / or a control for stopping the rotating part of the driving part. Processing of rotation.

Preferably, in the substrate processing apparatus of the present invention, the sixth processing system includes a process of stopping the rotation of the rotating portion after the processing on the substrate is completed.

Preferably, in the substrate processing apparatus of the present invention, the seventh processing system includes processing in response to determining that the absolute value is greater than the fifth threshold value and determining that the absolute value is greater than the sixth threshold When the limit is still large, the rotation of the rotating portion is stopped immediately. Better For the eighth processing, the following processing is included: in response to a case where it is determined that the absolute value is below the fifth threshold value and it is determined that the absolute value is greater than the sixth threshold value, the Spin.

Preferably, in the substrate processing apparatus of the present invention, the first detection section is mounted on an outer surface of the storage section so as to face the drive section through the storage section.

Preferably, in the substrate processing apparatus of the present invention, the first detection section is a portion of the driving section that is exposed from the receiving section.

According to a second aspect of the present invention, the vibration detection method detects a vibration of a substrate processing apparatus for processing a substrate. The vibration detection method includes a rotation step of rotating a rotating portion capable of holding the substrate, and a detection step of detecting vibration including the vibration of the rotating portion via a driving portion for driving the rotating portion. In the detecting step, the vibration is detected at a predetermined position while the rotating portion is rotating. The rotating portion and the driving portion are housed in a receiving portion. The driving portion is disposed between the rotating portion and the predetermined position. The predetermined position indicates a position facing the driving section.

Preferably, in the vibration detection method of the present invention, in the rotating step, the rotating portion is rotated in a state where the substrate is not present in the rotating portion.

According to a third aspect of the present invention, the vibration detection method detects a vibration of a substrate processing apparatus for processing a substrate. The vibration detection method includes a rotation step of rotating the rotating portion capable of holding the substrate without the substrate in the rotation portion, and a detection step of detecting the inclusion of the rotation portion while the rotation portion is rotating. Vibration of the rotating part.

[Inventive effect]

According to the present invention, it is possible to reduce false detection when it is detected that the substrate has been properly held or the substrate has not been properly held.

1.1A, 1B‧‧‧‧Processing device

3‧‧‧ Chamber (Containment Section)

3A, 41a‧‧‧ Underside

3a‧‧‧ base

3aa‧‧‧First Zone

3ab‧‧‧Second Zone

3b‧‧‧side wall part (wall part)

3c‧‧‧Top wall part (wall part)

5‧‧‧ rotation unit

5a‧‧‧First drive unit (drive unit)

5b‧‧‧axis

5c‧‧‧rotation fixture (rotary part)

5d‧‧‧Second driving unit

5e‧‧‧ cover member

9a‧‧‧first nozzle

9b‧‧‧Second nozzle

9c‧‧‧Third nozzle

10a‧‧‧first nozzle arm

10b‧‧‧Second nozzle arm

10c‧‧‧Third nozzle arm

11a‧‧‧First nozzle arm driving unit

11b‧‧‧Second nozzle arm driving unit

11c‧‧‧Third nozzle arm driving unit

13a‧‧‧First protective cover

13b‧‧‧Second protective cover

13c‧‧‧Third protective cover

15a‧‧‧First protective cover driving unit

15b‧‧‧Second protective cover driving unit

15c‧‧‧Third protective cover drive unit

17a‧‧‧Motor body

17b‧‧‧shell

19‧‧‧rotation base

21‧‧‧ holding member

23‧‧‧ Bolt

31‧‧‧arm

33‧‧‧Detected components

35‧‧‧The first magnetic sensor

37‧‧‧Second magnetic sensor

39‧‧‧Third magnetic sensor

41‧‧‧Exposed part (partial)

51‧‧‧Control Department

51a‧‧‧Judgment Division

51b‧‧‧Execution Department

53‧‧‧Memory Department

55‧‧‧Output Department

100‧‧‧ substrate processing system

A1‧‧‧First predetermined value

A2‧‧‧Second predetermined value

A3‧‧‧ third predetermined value

A4‧‧‧ Fourth predetermined value

AX‧‧‧rotation axis

B1‧‧‧First specific value

B2‧‧‧Second Specific Value

B3‧‧‧ third specific value

B4‧‧‧ Fourth specific value

B5‧‧‧ fifth specific value

B6‧‧‧sixth specific value

B7‧‧‧seventh specific value

B8‧‧‧eighth specific value

BL, BL‧‧‧ benchmark

C‧‧‧ Substrate receiving container

CR‧‧‧handling robot

D1‧‧‧ first direction

D2‧‧‧ Second direction

D3‧‧‧ Third direction

D4‧‧‧ Fourth direction

dv, sv, vb‧‧‧vibration

EV‧‧‧Extreme

FC, MC‧‧‧ holding member

FPS‧‧‧first scheduled location

GP‧‧‧Group

IR‧‧‧ Index Robot

P‧‧‧Abutting Department

PS‧‧‧Receiving Department

PSN‧‧‧Position Detection Department

R1‧‧‧First vibration range

R2‧‧‧Second vibration range

R3‧‧‧The third vibration range

R4‧‧‧Fourth vibration range

RG‧‧‧ predetermined vibration range

RG1‧‧‧First predetermined vibration range

RG2‧‧‧Second predetermined vibration range

Sc, Sc1, Sc2, Sc3‧‧‧vibration components

SP‧‧‧ substrate processing equipment

SP1, SP2

SPS‧‧‧Second Scheduled Position

SN‧‧‧ Detection Section (First Detection Section)

SN1‧‧‧First Inspection Department

SN2‧‧‧Second Detection Department

SN3‧‧‧Third Inspection Department

Sv‧‧‧Vibration signal

Sv1‧‧‧First vibration signal

Sv2‧‧‧Second vibration signal

Sv3‧‧‧Third vibration signal

From t0 to t1‧‧‧

T1 to T5‧‧‧

Tc‧‧‧ scheduled time

TH1‧‧‧First Threshold

TH2‧‧‧Second Threshold

TH3‧‧‧three threshold

TH4‧‧‧ Fourth threshold

TH5‧‧‧Fifth Threshold

TH6‧‧‧threshold

Na‧‧‧times

Nb‧‧‧ Reservation

U1‧‧‧ Index Unit

U2‧‧‧processing unit

U3‧‧‧Computer Unit

UD‧‧‧ Lifting direction

W‧‧‧ substrate

FIG. 1 is a plan view showing a substrate processing system according to a first embodiment of the present invention.

Fig. 2 is a side view showing a substrate processing system according to the first embodiment.

Fig. 3 is a side sectional view showing a processing apparatus according to the first embodiment.

Fig. 4 is a bottom view showing the processing apparatus of the first embodiment.

In FIG. 5, (a) is a diagram showing a waveform of a vibration signal when a vibration signal from the detection unit of the first embodiment is vibrating within a predetermined vibration range; (b) is a diagram showing a waveform from the first embodiment A diagram of the waveform of a vibration signal when the vibration signal of the detection unit exceeds a predetermined vibration range and is vibrating.

In FIG. 6, (a), (c), and (e) are used to display the rotation jig of the first embodiment, and (b), (d), and (f) are used to display the rotation jig of the first embodiment. Top view of the position detection section.

FIG. 7 is a flowchart showing a vibration detection method executed by the substrate processing apparatus according to the first embodiment.

8 is a flowchart showing a vibration analysis process performed by the substrate processing apparatus according to the first embodiment.

FIG. 9 is a diagram showing a waveform of a vibration signal analyzed by a substrate processing apparatus according to a first modification of the first embodiment.

(A) and (b) of FIG. 10 are diagrams showing a first predetermined vibration range and a second predetermined vibration range in a second modification of the first embodiment.

11 is a flowchart showing a vibration analysis process performed by the substrate processing apparatus according to the second modification of the first embodiment.

FIG. 12 is a flowchart showing a vibration analysis process performed by the substrate processing apparatus according to the third modification of the first embodiment.

FIG. 13 is a flowchart showing a vibration detection method executed by the substrate processing apparatus according to the fourth modification of the first embodiment.

In FIG. 14, (a) is a side cross-sectional view showing a part of the processing apparatus of the fifth modification example of the first embodiment; (b) is a bottom view showing the processing apparatus of the second embodiment.

In FIG. 15, (a) is a side sectional view showing a part of a processing apparatus of a substrate processing system according to a second embodiment of the present invention; and (b) is a bottom view showing a processing apparatus according to the second embodiment.

In FIG. 16, (a) is a diagram showing a first vibration range of the second embodiment, and (b) is a diagram showing a second vibration range of the second embodiment.

17 is a flowchart showing a vibration analysis process performed by the substrate processing apparatus according to the second embodiment.

18 is a side cross-sectional view showing a processing apparatus of a substrate processing system according to a third embodiment of the present invention.

In FIG. 19, (a) is a diagram showing a third vibration range of the third embodiment, and (b) is a diagram showing a fourth vibration range of the third embodiment.

FIG. 20 is a flowchart showing a vibration analysis process performed by the substrate processing apparatus according to the third embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, a three-dimensional orthogonal coordinate system including X-axis, Y-axis, and Z-axis orthogonal to each other is used for description. The X-axis and Y-axis systems are parallel to the horizontal direction, and the Z-axis system is parallel to the vertical direction. In addition, in the drawings, the same or corresponding parts are denoted by the same reference numerals, and descriptions thereof are omitted.

(First Embodiment)

A substrate processing system 100 according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 8. Figure 1 is used A top view of the substrate processing system 100 is shown. As shown in FIG. 1, the substrate processing system 100 includes an indexer unit U1, a processing unit U2, and a computer unit U3. The computer unit U3 controls the index unit U1 and the processing unit U2. The indexing unit U1 includes a plurality of substrate storage containers C and an indexing robot IR. The processing unit U2 includes a plurality of processing devices 1, a transfer robot CR, and a receiving and receiving unit PS.

Each of the substrate storage containers C is a plurality of substrates W stacked and stored. In the first embodiment, the substrate W has a substantially circular plate shape. The indexing robot IR takes out an unprocessed substrate W from any one of the plurality of substrate storage containers C, and transfers the substrate W to the receiving and receiving unit PS. The receiving and receiving unit PS receives the substrate W and transfers it to the transfer robot CR. The transfer robot CR picks up the substrate W, and transfers the substrate W to any one of a plurality of processing devices 1.

Next, the processing apparatus 1 processes an unprocessed substrate W. The processing device 1 has a blade type for processing the substrates W one by one. For example, the processing apparatus 1 processes the substrate W using a processing liquid or a processing gas. For example, the processing apparatus 1 processes the substrate W using a contact member such as a brush and a liquid such as water. For example, the processing apparatus 1 processes the substrate W using electromagnetic waves such as ultraviolet rays. Hereinafter, in the first embodiment, the processing apparatus 1 processes the substrate W using a processing liquid.

After processing by the processing apparatus 1, the transfer robot CR takes out the processed substrate W from the processing apparatus 1 and transfers the substrate W to the receiving and receiving unit PS. The receiving and receiving unit PS receives the substrate W and transfers it to the indexing robot IR. The indexing robot IR receives the substrate W and stores the substrate W in any one of the plurality of substrate storage containers C.

Next, the arrangement of the plurality of processing devices 1 will be described with reference to FIGS. 1 and 2. FIG. 2 is a side view of the substrate processing system 100. As shown in FIG. 1 and FIG. 2, the processing unit U2 includes a plurality of group GPs (four group GPs in the first embodiment). Each group GP is composed of a predetermined number of processing devices 1 (three processing devices 1 in the first embodiment). In each group GP, a predetermined number of processing devices 1 are laminated on a straight line along the lead direction. this In addition, a plurality of groups are arranged to face each other.

Next, the processing device 1 will be described in detail with reference to FIG. 3. FIG. 3 is a side sectional view showing the processing device 1. As shown in FIG. 3, the processing apparatus 1 and the computer unit U3 constitute a substrate processing apparatus SP. The substrate processing apparatus SP processes a substrate W.

The processing device 1 includes a detection section SN (first detection section), a chamber 3 (containment section), a spin unit 5, a first nozzle 9a, a second nozzle 9b, a third nozzle 9c, a first A nozzle arm 10a, a second nozzle arm 10b, a third nozzle arm 10c, a first nozzle arm driving portion 11a, a second nozzle arm driving portion 11b, a third nozzle arm driving portion 11c, a first guard 13a, The second protective cover 13b, the third protective cover 13c, the first protective cover driving portion 15a, the second protective cover driving portion 15b, the third protective cover driving portion 15c, and a plurality of bolts 23.

The chamber 3 is slightly box-shaped and houses the rotation unit 5, the first nozzles 9a to 3c, the first nozzle arms 10a to 10c, and the first nozzle arm driving portions 11a to 3rd nozzle arm driving portions. 11c. The first to third protective covers 13a to 13c and the first to third protective cover driving portions 15a to 15c. By containing the various elements (9a to 9c, 10a to 10c, 11a to 11c, 13a to 13c, 15a to 15c) in the chamber 3, the stacking of the processing device 1 shown in FIG. 2 becomes easy and each processing device Exchange and repair of 1 become easy.

Specifically, the chamber 3 includes a base portion 3a, a side wall portion 3b (wall portion), and a top wall portion 3c (wall portion). The base portion 3a has a substantially plate shape and is slightly parallel to the horizontal direction. The side wall portion 3b has a slightly angular tube shape and is slightly parallel to the vertical direction. The top wall portion 3c is slightly plate-shaped and is slightly parallel to the horizontal direction.

The rotation unit 5 holds the substrate W and rotates the substrate W. Specifically, the rotation unit 5 includes a first driving portion 5a (driving portion), a rotation jig 5c (rotating portion), a second driving portion 5d, and a cover member 5e. The first driving portion 5a includes a motor body 17a and a case 17b for receiving the motor body 17a. Therefore, the first driving section 5a is a motor. The rotation jig 5 c includes a rotation base 19 having a substantially circular plate shape and a plurality of holding members 21.

The first driving section 5a is disposed between the rotation jig 5c and the detection section SN. The first driving portion 5a is provided on the base portion 3a. Specifically, the first driving portion 5 a is attached to the base portion 3 a by a plurality of bolts 23. In addition, since the first driving portion 5a is supported by the base portion 3a, the installation state of the first driving portion 5a is stable. Therefore, the rotation jig 5c can be stably rotated.

The first driving portion 5a drives the rotation jig 5c and rotates the rotation jig 5c about the rotation axis AX of the first driving portion 5a. Specifically, the motor body 17a rotates the shaft 5b and rotates the rotation base 19 connected to the shaft 5b.

The rotation jig 5c can hold the substrate W. Specifically, the plurality of holding members 21 (at least three or more holding members 21) are arranged on the upper surface of the rotation base 19 so as to surround the rotation axis AX. The plurality of holding members 21 hold the substrate W. Since the rotation base 19 is slightly parallel to the horizontal direction, the substrate W has a slightly horizontal posture and maintains a slightly horizontal posture.

When the plurality of holding members 21 hold the substrate W, all or a part of the holding members 21 of the plurality of holding members 21 are driven by the second driving portion 5d and rotated until they abut the peripheral edge portion of the substrate W. As a result, the substrate W is held by all the holding members 21. For example, the second drive unit 5d includes a drive source such as a motor or an air cylinder, and a motion conversion mechanism. Next, the second driving portion 5d drives the motion conversion mechanism by a driving source, and converts the lifting motion into the rotational motion of the holding member 21.

The rotation jig 5c is driven by the first driving unit 5a, and rotates about the rotation axis AX while the substrate W is held. As a result, the substrate W is rotated together with the rotation jig 5c. On the other hand, the rotation jig 5c can also be driven by the first driving unit 5a, and rotates about the rotation axis AX in a state where the rotation jig 5c does not have the substrate W.

The cover member 5e has a substantially cylindrical shape and surrounds the first driving portion 5a. The cover member 5e suppresses the adhesion of the processing liquid to the first driving portion 5a. In addition, in FIG. 3, the cover member 5e is shown by a two-dot chain line for the sake of simplicity of the drawing.

The detection section SN detects the vibration vb via the first driving section 5a. Specifically, the detection unit SN detects the vibration vb while the rotation jig 5c is rotating, and outputs a vibration signal Sv indicating the vibration vb. The vibration vb includes a vibration sv of the rotation jig 5c and a vibration dv directly caused by the rotation operation of the first driving portion 6a itself.

In the first embodiment, the vibration vb is detected as acceleration. Therefore, the vibration signal Sv is used to indicate the acceleration signal of the vibration vb. The acceleration signal is expressed, for example, as a unit "G (gravity)" using a standard gravity as a reference, or as a voltage value "V (volt)" which is proportional to acceleration. For example, the detection unit SN includes an acceleration sensor.

The acceleration sensor is, for example, a capacitive-type contact-type acceleration sensor or a piezoresistance-type contact-type acceleration sensor. The acceleration sensor is, for example, an acceleration sensor using a non-contact method using an optical method. The acceleration sensor can be, for example, a mechanical displacement measurement method, a vibration method, or a semiconductor method.

The detection section SN is disposed outside the chamber 3 and faces the first driving section 5a. The exterior of the chamber 3 shows a case other than the interior of the chamber 3, for example, the outer surface of the chamber 3 is included. Specifically, the detection section SN is attached to the outer surface of the chamber 3 (specifically, the base section 3a) so as to face the first driving section 5a through the chamber 3. Preferably, the detection section SN faces the first driving section 5a on the rotation axis AX. A part of the detection section SN may be opposed to the first driving section 5a.

As described above with reference to FIG. 3, according to the first embodiment, the inspection unit SN detects the vibration vb including the vibration sv of the rotation jig 5 c while the rotation jig 5 c is rotating. Moreover, the vibration sv of the rotation jig 5c changes depending on the holding state of the substrate W which the rotation jig 5c is. Therefore, the vibration vb (specifically, the vibration signal Sv) including the vibration sv is analyzed, thereby detecting the holding state of the substrate W which the rotation jig 5c is. In this specification, the substrate W The detection of the holding state indicates that the detection substrate W has been properly held by the rotation jig 5c or the substrate W has not been properly held by the rotation jig 5c.

The reason why the holding state of the substrate W can be detected by the analysis of the vibration vb is as follows.

That is, when the holding member 21 is deteriorated or the substrate W is warped, the holding member 21 cannot properly hold the substrate, and the center of gravity of the substrate W may be eccentric with respect to the rotation axis AX.

Further, in a case where the center of gravity of the substrate W is eccentric with respect to the rotation axis AX, the vibration sv of the rotation jig 5c during rotation becomes larger than that in a case where the center of gravity of the substrate W is not eccentric. When the vibration sv becomes larger, the vibration vb becomes larger. That is, abnormal vibration is caused. Therefore, the eccentricity of the center of gravity of the substrate W can be detected by analyzing the vibration vb. In the case where the center of gravity of the substrate W is eccentric, since the possibility that the substrate W is not properly held is high, the case where the center of gravity of the substrate W is detected to be eccentric is a condition in which the substrate W is not properly maintained by the rotation jig 5c. .

In addition, when the connection portion between the rotation base 19 and the shaft 5b is loose or the bolt 23 of the base portion 3a is loose and the installation of the first driving portion 5a is not stable, the rotation fixture 5c is not set well, the rotation fixture 5c may be It will be located at a position different from the position specified by the rotation fixture. The predetermined position of the rotation jig indicates a specific position when the rotation jig 5c is installed on the base portion 3a, and is set relative to the chamber 3. When the rotation jig 5c is located at a position different from the predetermined position of the rotation jig, even when the substrate W is placed on the rotation jig 5c at the substrate predetermined position, the holding member 21 may not be able to properly hold the substrate W. . The predetermined substrate position indicates a specific position when the substrate W is placed on the rotation jig 5 c, and is set relative to the chamber 3.

Further, in a case where the installation state of the rotation jig 5c is not good, compared with a case where the installation state is good, the vibration sv of the rotation jig 5c during rotation becomes larger. When the vibration sv becomes larger, the vibration vb becomes larger. That is, abnormal vibration is caused. Therefore, it is possible to detect that the installation state of the rotation jig 5c is not good by analyzing the vibration vb. When the installation state of the rotation jig 5c is not good Since the possibility that the substrate W is not properly held is high, it has been detected that the installation state of the rotation jig 5c is not good, which indicates that the substrate W is not properly held by the rotation jig 5c.

In particular, in the first embodiment, the holding state of the substrate W can be detected by analyzing the vibration vb of the vibration sv including the rotation jig 5c. Therefore, the holding state of the substrate W can be detected based on the position of the holding member 21. In comparison with this case, it is possible to reduce false detection when detecting that the substrate W has been properly held or the substrate W has not been properly held.

In addition, according to the first embodiment, the first driving section 5a is disposed between the rotation jig 5c and the detecting section SN, and the detecting section SN is not opposed to the first driving section 5a. Therefore, the detection section SN is not connected to a driving section other than the first driving section 5a (the first nozzle arm driving section 11a to the third nozzle arm driving section 11c and the first shield driving section 15a to the third shield driving section 15c). Opposite. As a result, it is possible to suppress vibrations of the driving portions (11a to 11c, 15a to 15c) other than the first driving portion 5a from being superimposed as noise on the vibration signal Sv indicating the vibration vb. Since the overlap of noise can be suppressed, the analysis accuracy of the vibration signal Sv can be improved, so the detection reliability can be improved when the holding state of the substrate W is detected.

Furthermore, according to the first embodiment, before the rotation jig 5c is rotated in the state where the substrate W is present, the rotation jig 5c can be rotated and the vibration vb can be analyzed without the substrate W in the rotation jig 5c. As a result, it is possible to lock the cause of the abnormal vibration from the vibration vb from a plurality of causes.

That is, the reason why the vibration vb becomes abnormal vibration is that either the rotation jig 5c is not set well or the substrate W is eccentric. Therefore, in a case where the rotation jig 5c has been rotated in a state where the substrate W is not present, the possibility that the vibration vb causes the abnormal vibration is that the rotation jig 5c is not set well. Therefore, the rotation jig 5c can be rotated and the installation state of the rotation jig 5c can be detected in a state where the substrate W is not present, whereby the rotation jig 5c can be set well in advance.

Therefore, in a case where the rotation jig 5c has been rotated in a state where the substrate W is not present after the rotation jig 5c has been properly installed, the possibility of abnormal vibration caused by the vibration vb is the eccentricity of the substrate W. In particular, since the eccentricity of the substrate W is highly likely to be caused by the deterioration of the holding member 21 or the warpage of the substrate W, it is possible to lock the cause of the abnormal vibration caused by the vibration vb to the deterioration of the holding member 21 or the warpage of the substrate W song. Therefore, for example, the holding member 21 can be prepared, repaired, or replaced, and the substrate W can be replaced.

In addition, according to the first embodiment, since the vibration vb can be locked from a plurality of causes and the cause of the abnormal vibration can be locked, the preparation, repair, or replacement of the part causing the abnormal vibration can be performed quickly.

Next, the processing device 1 will be described in detail with reference to FIG. 3. The first nozzle 9a ejects a first processing liquid (for example, a sulfuric acid-containing liquid) toward the substrate W while it is rotating. Specifically, the first nozzle 9a is attached to a front end portion of the first nozzle arm 10a. The first nozzle arm driving portion 11 a drives the first nozzle arm 10 a and rotates the first nozzle arm 10 a about an axis extending in a slightly vertical direction. For example, the first nozzle arm driving portion 11a includes a driving source such as a motor and a rotation mechanism, and drives the rotation mechanism by the driving source to rotate the first nozzle arm 10a. The first nozzle arm driving portion 11a is attached to the base portion 3a.

The second nozzle 9b ejects a second processing liquid (for example, a cleaning liquid) toward the substrate W in rotation. The third nozzle 9c ejects a third processing liquid (for example, an organic solvent) toward the substrate W in rotation. The second nozzle arm 10b and the third nozzle arm 10c have the same configuration and function as the first nozzle arm 10a. The second nozzle arm driving portion 11b and the third nozzle arm driving portion 11c have the same configuration and function as the first nozzle arm driving portion 11a, and are mounted on the base portion 3a.

The first protective cover 13a receives the first processing liquid scattered from the substrate W. Specifically, the first protective cover 13a has a substantially cylindrical shape and surrounds the rotation jig 5c around the rotation axis AX. In FIG. 3, the first protective cover 13a is located at the standby position. Standby position shows the first protective cover 13a The position of the first protective cover 13a when the upper end is located below the holding member 21.

The first protective cover 13a is connected to the first protective cover driving portion 15a. The first shield driving portion 15a is attached to the base portion 3a. The first protective cover driving portion 15a drives the first protective cover 13a and raises or lowers the first protective cover 13a in the vertical direction UD. The lifting direction UD is slightly parallel to the vertical direction.

Specifically, before the substrate W is processed with the first processing liquid, the first shield driving section 15 a raises the first shield 13 a from the standby position to the shield position. The protective cover position indicates the position of the first protective cover 13 a when the upper end of the first protective cover 13 a is positioned above the holding member 21. After the entire processing of the substrate W is completed, the first shield driving section 15a lowers the first shield 13a from the shield position to the standby position.

For example, the first protective cover driving unit 15a includes a driving source such as a motor and a lifting mechanism, and the driving source drives the lifting mechanism to raise or lower the first protective cover 13a.

The second protective cover 13b catches the second processing liquid scattered from the substrate W. The third protective cover 13c catches the third processing liquid scattered from the substrate W. Except for this, the second protective cover 13b and the third protective cover 13c have the same structure and function as those of the first protective cover 13a. The second shield driving portion 15b and the third shield driving portion 15c have the same structure and function as those of the first shield driving portion 15a, and are attached to the base portion 3a.

Next, referring to FIG. 4, the arrangement of the detection section SN will be described in association with drive sections (11 a to 11 c and 15 a to 15 c) other than the first drive section 5 a. FIG. 4 is a bottom view of the processing device 1. As shown in FIG. 4, the bottom surface 3A of the base portion 3 a includes a first region 3 aa and a second region 3 ab. The bottom surface 3A is an outer surface of the inner surface and the outer surface of the base portion 3a. The first region 3aa is a region on the bottom surface 3A that faces the first driving portion 5a. The second area 3ab is an area other than the first area 3aa in the bottom surface 3A. The second region 3ab is opposed to the first to third nozzle arm driving portions 11a to 11c and the first to third shield driving portions 15a to 15c.

The detection section SN is attached to the first area 3aa of the base section 3a. The plurality of bolt portions 23 surround the detection portion SN on the first area 3aa.

Hereinafter, the position where the detection section SN is arranged may be described as "predetermined position SP1". The first driving unit 5a is disposed between the rotation jig 5c and the predetermined position SP1. It should be noted that the predetermined position SP1 is a position where the outside of the chamber 3 faces the first driving portion 5a. Specifically, the predetermined position SP1 is a position on the first area 3aa.

As described above with reference to FIG. 4, according to the first embodiment, the first region 3aa where the detection section SN is mounted is different from the second region 3ab, and the second region 3ab is a driving section other than the first driving section 5a. (11a to 11c, 15a to 15c). Therefore, there is a possibility that vibrations of the driving portions (11a to 11c, 15a to 15c) other than the first driving portion 5a may reach the first region 3aa. As a result, it is possible to suppress the detection section SN from detecting vibrations of driving sections (11a to 11c, 15a to 15c) other than the first driving section 5a as noise.

In addition, according to the first embodiment, the detection section SN is mounted on the outer surface of the chamber 3 (specifically, the first region 3aa). Therefore, it is possible to suppress the processing liquid (the first processing liquid to the third processing liquid) ejected from the inside of the chamber 3 from splashing to the detection section SN. As a result, the deterioration of the detection section SN can be suppressed, and the reliability of the detection section SN can be maintained.

Next, the computer unit U3 will be described with reference to FIG. 3. The computer unit U3 includes a control unit 51, a memory unit 53, and an output unit 55. The control unit 51 executes a computer program stored in the memory unit 53, and controls the rotation unit 5, the first nozzle arm drive unit 11a to the third nozzle arm drive unit 11c, and the first shield drive unit 15a to the third shield drive unit. 15c. The control unit 51 includes a processor such as a CPU (Central Processing Unit).

The memory unit 53 includes a memory device for memorizing data and computer programs. The memory unit 53 may include a memory such as a semiconductor memory, and may also include a hard disk drive. In addition, the storage unit 53 may include removable media. Output section 55 series The image is displayed according to the image data generated by the control unit 51, and / or the sound is output according to the audio data generated by the control unit 51. For example, the output unit 55 includes a display and / or a speaker.

Next, the analysis of the vibration vb by the computer unit U3 will be described with reference to FIGS. 3 and 5. As shown in FIG. 3, the control unit 51 includes a determination unit 51a and an execution unit 51b. Specifically, the processor of the control unit 51 executes a computer program stored in a memory device of the storage unit 53 and functions as a determination unit 51 a and an execution unit 51 b.

The determination unit 51a receives the vibration signal Sv indicating the vibration vb from the detection unit SN during the rotation period of the rotation jig 5c, and analyzes the vibration signal Sv. Specifically, the determination unit 51a determines whether the level of the vibration signal Sv has exceeded a predetermined vibration range RG, and detects the holding state of the substrate W. Hereinafter, the analysis of the vibration signal Sv will be described by taking a specific example.

(A) in FIG. 5 shows the waveform of the vibration signal Sv when the vibration signal Sv vibrates within a predetermined vibration range RG. (B) in FIG. 5 shows the waveform of the vibration signal Sv when the vibration signal Sv exceeds a predetermined vibration range RG. In FIG. 5 (a) and FIG. 5 (b), the horizontal axis indicates time, and the vertical axis indicates the level (G or V) of the vibration signal Sv.

As shown in (a) of FIG. 5, during the period T1, the rotation jig 5c is stopped. In the period T2, the rotation jig 5c is accelerated. In the period T3, the rotation jig 5c is rotated at a fixed rotation speed. The rotation speed of the rotation jig 5c is represented by the number of rotations of the rotation jig 5c per unit time. In the period T4, the rotation jig 5c is decelerated. In the period T5, the rotation jig 5c is stopped. Hereinafter, in this specification, the periods T1 to T5 are defined to be the same.

The determination unit 51a analyzes the vibration signal Sv received in the period T3. The vibration signal Sv includes a vibration signal with a first direction D1 (for example, a positive direction) relative to a preset reference level BL (for example, a zero level) and a first Vibration component in two directions D2 (for example, negative direction). However, the reference level BL can also be in rotation Permissible vibration level before rotation of the jig 5c. Hereinafter, the vibration component in the first direction D1 and the vibration component in the second direction may be collectively referred to as "vibration component Sc".

The memory section 53 stores: a first predetermined value A1 for displaying the value at one end of the predetermined vibration range RG; and a second predetermined value A2 for displaying the value at the other end of the predetermined vibration range RG. The first predetermined value A1 is established in correspondence with the vibration component in the first direction D1. The second predetermined value A2 is established in correspondence with the vibration component in the second direction D2. In the first embodiment, the absolute value of the first predetermined value A1 is the same as the absolute value of the second predetermined value A2. Specifically, the first predetermined value A1 indicates a first threshold value TH1 for comparison with the level of the vibration component Sc; the memory unit 53 stores the first threshold value TH1. In addition, the predetermined vibration range RG is determined experimentally and / or empirically considering the installation environment of the processing device 1.

The predetermined vibration range RG does not depend on the rotation speed of the rotation jig 5c, but is fixed. However, the predetermined vibration range RG may be different depending on the rotation speed of the rotation jig 5c. That is, the first predetermined value A1, the second predetermined value A2, and the first threshold value TH1 may be different depending on the rotation speed of the rotation jig 5c. For example, the predetermined vibration range RG (also like the first threshold value TH1) is set to be large so that the rotation speed of the rotation jig 5c is large. Since the magnitude of the vibration vb varies depending on the rotation speed of the rotation jig 5c, by setting the predetermined vibration range RG to the rotation speed of each rotation jig 5c, the detection accuracy of the holding state of the substrate W can be improved.

The determination unit 51a determines whether the level of the vibration signal Sv has exceeded a predetermined vibration range RG. With respect to the vibration signal Sv shown in FIG. 5 (a), the determination unit 51a determines whether the level of the vibration signal Sv is within a predetermined vibration range RG. The case where it is determined that the level of the vibration signal Sv is within the predetermined vibration range RG is equivalent to the case where it is detected that the substrate W is properly held by the rotation jig 5c.

On the other hand, with respect to the vibration signal Sv shown in FIG. 5 (b), the determination unit 51a determines that the level of the vibration signal Sv has exceeded the predetermined vibration range RG. The case where it is determined that the level of the vibration signal Sv has exceeded the predetermined vibration range RG is equivalent to that the substrate W is not suitable for the rotation jig 5c. Locally maintained situation. This is because when the level of the vibration signal Sv has exceeded the predetermined vibration range RG, the possibility that the substrate W is eccentric or the installation state of the rotation jig 5c is not good and the substrate W is not properly maintained is high.

Therefore, the execution unit 51b executes a predetermined process in accordance with the affirmative determination made by the determination unit 51a. The positive determination indicates that the level of the vibration signal Sv has exceeded the predetermined vibration range RG. The predetermined processing includes processing for controlling the output of the alarm by the output section 55 and / or processing for stopping the rotation of the rotation jig 5c by the first driving section 5a. The output unit 55 issues an alarm by video or audio. The alarm is, for example, a notification that the substrate W is not properly held by the rotation jig 5c. The alarm is, for example, a notification including the intention to stop the rotation of the rotation jig 5c.

In addition, the user can recognize the situation where the substrate W is not held by the alarm, and can take corrective measures to the processing device 1. In addition, by stopping the rotation of the rotation jig 5c, the substrate W can be prevented from falling out of the rotation jig 5c because the substrate W is not properly held.

As described above with reference to FIGS. 3 and 5, according to the first embodiment, the determination unit 51 a determines whether the level of the vibration signal Sv has exceeded a predetermined vibration range RG, and detects the holding state of the substrate W. Therefore, compared with the case where the holding state of the substrate W is detected based on the position of the holding member 21, the erroneous detection of the holding state of the substrate W can be reduced. As a result, the execution unit 51b can be suppressed from performing a predetermined process (such as an alarm or a stop of the rotation) by mistake, so that a series of steps for processing the substrate W can be smoothly performed.

In addition, according to the first embodiment, the predetermined vibration range RG is a range from a first predetermined value A1 corresponding to the first direction D1 to a second predetermined value corresponding to the second direction D2. Therefore, when any one of the vibration component in the first direction D1 and the vibration component in the second direction D2 exceeds the predetermined vibration range RG, it is detected that the substrate W is not properly held. As a result, it is possible to reduce leakage detection when the substrate W is not held properly.

Next, an example of the rotation jig 5c will be described with reference to FIG. 6. (A) in Fig. 6 and Fig. 6 (C) and (e) in FIG. 6 are top views showing the rotation jig 5c. As shown in (a) of FIG. 6, a plurality of holding members 21 (four holding members 21 in the first embodiment) are arranged on a predetermined circumference of the upper surface of the rotation base 19 at a certain interval. The predetermined circumference corresponds to the peripheral edge of the substrate W. Each of the holding members 21 includes, for example, a substantially cylindrical contact portion P.

The holding member FC of the plurality of holding members 21 is fixed to the rotation base 19 so as not to be rotatable. A holding member MC of the plurality of holding members 21 is rotatably supported by a rotation base 19. The holding member MC is driven by the second driving portion 5d (FIG. 3), and rotates about an axis slightly parallel to the rotation axis AX.

As shown in (a) of FIG. 6, the holding member MC is located in the closed position. The closed position indicates the position of the holding member MC when the contact portion P is closest to the rotation axis AX. As shown in FIG. 6 (c), the holding member MC is located in the open position. The open position indicates the position of the holding member MC when the contact portion P is farthest from the rotation axis AX, and is the standby position of the holding member MC.

As shown in FIG. 6 (e), the holding member MC is located at the holding position. The holding position indicates the position of the holding member MC when the abutting portion P comes into contact with the peripheral edge portion of the substrate W located at a predetermined position of the substrate. The contact portion P of the holding member MC and the contact portion of the holding member FC located at the holding position are in contact with the peripheral edge portion of the substrate W and hold the substrate W.

In addition, as shown in (a) of FIG. 6, the rotation jig 5 c includes a plurality of position detection sections PSN corresponding to the plurality of holding members MC, respectively. The position detection unit PSN detects the position of the holding member MC.

6 (b), 6 (d), and 6 (f) are top views for displaying the position detecting section PSN. As shown in FIG. 6 (b), the position detection section PSN includes a resin arm 31, a metal detection member 33, a first magnetic sensor 35, a second magnetic sensor 37, and Third magnetic gas sensor 39.

The arm 31 rotates together with the holding member MC. The arm 31 is located more than the rotation base 19 The upper surface is also below. The detection member 33 is attached to the front end portion of the arm 31. The first magnetic sensor 35, the second magnetic sensor 37, and the third magnetic sensor 39 are spaced apart from the arm 31 and the member to be detected 33, and are located further than the arm 31 and the member 33 to be detected. Below.

As shown in FIG. 6 (b), when the holding member MC is in the closed position, the first magnetic sensor 35 detects the detected member 33 and outputs a detection signal. As shown in (d) of FIG. 6, when the holding member MC is in the open position, the third magnetic sensor 39 detects the detected member 33 and outputs a detection signal. As shown in (f) of FIG. 6, when the holding member MC is located at the holding position, the second magnetic sensor 37 detects the detected member 33 and outputs a detection signal.

When each of the second magnetic sensors 37 has detected the detected member 33, the display substrate W is appropriately held. On the other hand, a case where the at least one first magnetic sensor 35 has detected the detected member 33 is that the display substrate W is not properly held. It is precisely because when the substrate W is not properly held and the substrate W is eccentric, the holding member MC is located in the closed position and the first magnetic sensor 35 detects the detected member 33.

As described above with reference to FIG. 6, according to the first embodiment, in addition to detecting the holding state of the substrate W based on the vibration signal Sv, the holding state of the substrate W is also detected based on the position of the holding member MC. Therefore, it is possible to further reduce the erroneous detection when the detection substrate W is properly held or not properly held.

Next, a vibration detection method according to the first embodiment executed by the substrate processing apparatus SP will be described with reference to FIGS. 3, 7, and 8. FIG. 7 is a flowchart showing a vibration detection method according to the first embodiment. As shown in FIG. 7, the vibration detection method includes steps S1 to S15 and detects vibration of the substrate processing apparatus SP. Steps S1 to S15 constitute a main routine.

As shown in FIGS. 3 and 7, in step S1, the control unit 51 controls the transfer robot CR so that the substrate W is placed on the rotation jig 5 c.

In step S3, the control unit 51 controls the second driving unit 5d such that the holding member MC is rotated from the open position to the holding position.

In step S5, the control unit 51 detects the holding state of the substrate W based on the position of the holding member MC detected by the position detecting unit PSN (FIG. 6).

Specifically, in a case where the control section 51 receives the intended detection signal of the detected member 33 from the at least one first magnetic sensor 35 (No in step S5), since the substrate W is not Since it is appropriately maintained, the process proceeds to step S7.

On the other hand, in the case where the control unit 51 has received the detection signal of the intention of the detected member 33 from all of the second magnetic sensors 37 (YES in step S5), it is temporarily Since the ground display substrate W is appropriately held, the process proceeds to step S9.

In step S7, the control unit 51 executes specific processing, and ends the processing. In the first embodiment, the specific processing is the issuance of an alarm. Therefore, the control unit 51 controls the output unit 55 by issuing an alarm.

On the other hand, in step S9 (rotation step), the control unit 51 controls the first driving unit 5a so that the rotation jig 5c starts to rotate. That is, the rotation jig 5c is rotated.

In step S11, the control unit 51 executes a vibration analysis process. Specifically, the control unit 51 analyzes the vibration signal Sv and detects the holding state of the substrate W, and executes a preset process according to the detection result.

In step S13, the control unit 51 determines whether all the processing steps have ended. In the first embodiment, all the processing steps include a first processing step, a second processing step, a third processing step, and a fourth processing step.

In the first processing step, the first processing liquid is ejected from the first nozzle 9a, and the substrate W in rotation is processed. In the second processing step, the second processing liquid is ejected from the second nozzle 9b to process the substrate W in rotation. In the third processing step, the third nozzle 9c is ejected from the third nozzle 9c. Management of the substrate W in rotation. The rotation speeds of the rotation jigs in the first to third processing steps are the same. In the fourth processing step, the rotation speed of the rotation jig 5c is set to be greater than the rotation speed of the rotation jig 5c in the third processing step, and the substrate W is dried.

The control unit 51 executes the vibration analysis processing in parallel with the execution of the first to fourth processing steps (step S11).

Therefore, following the negative determination made by the control unit 51 (NO in step S13), the process proceeds to step S11. As a result, the vibration analysis process is repeated (step S11) until the control unit 51 makes an affirmative determination (YES in step S13).

On the other hand, following the affirmative determination made by the control unit 51 (YES in step S13), the process proceeds to step S15.

In step S15, the control unit 51 controls the first driving unit 5a so that the rotation of the rotation jig 5c stops. As a result, the rotation jig 5c is stopped. Then, the process ends.

FIG. 8 is a flowchart showing a vibration analysis process performed in step S11 in FIG. 7. In the vibration analysis process, in order to determine whether the level of the vibration signal Sv has exceeded the predetermined vibration range RG, the first threshold value TH1 is used.

As shown in FIG. 8, the vibration analysis processing system includes steps S20 to S27. In step S20 (detection step), the detection unit SN detects the vibration vb including the vibration sv of the rotation jig 5c via the first driving unit 5a. In step S20, the detection unit SN detects vibration at a predetermined position SP1 while the rotation jig 5c is rotating.

In step S21, the determination unit 51a receives a vibration signal Sv including a vibration component Sc from the detection unit SN.

In step S23, the determination unit 51a determines whether the absolute value of the level of the vibration component Sc is greater than the first threshold value TH1, and detects the holding state of the substrate W.

Following a negative determination (NO in step S23), the processing returns to the main routine. no The determination is a case where the level of the vibration signal Sv is within a predetermined vibration range RG, and corresponds to a case where it has been detected that the substrate W is properly held.

On the other hand, following an affirmative determination (YES in step S23), the process proceeds to step S25. The affirmative determination is a case where the level of the vibration signal Sv is shown to have exceeded a predetermined vibration range RG, and corresponds to a case where the substrate W has not been properly held.

In step S25, the execution unit 51b controls the output unit 55 to issue an alarm.

In step S27, the execution unit 51b controls the first driving unit 5a so as to stop the rotation of the rotation jig 5c. Then, the process ends.

As described above with reference to FIG. 3, FIG. 7, and FIG. 8, according to the first embodiment, before the rotation jig 5c is rotated, the holding state of the substrate W is detected (step S5). Therefore, it is possible to detect a case where the substrate W is not properly held in an earlier stage of one of a series of steps for processing the substrate W (NO in step S5). As a result, generation of useless processing can be reduced.

In addition, according to the first embodiment, the holding state of the substrate W can be easily detected by using the first threshold value TH1 (step S23).

In addition, it is preferable to set the first threshold value TH1 (predetermined vibration range RG) in the vibration analysis processing performed in parallel with the fourth processing step to a vibration that is performed in parallel with the first processing step to the third processing step. The first threshold value TH1 (predetermined vibration range RG) in the analysis process is also large. This is because the rotation speed of the rotation jig 5c in the fourth processing step is greater than the rotation speed of the rotation jig 5c in the first to third processing steps and the normal vibration becomes large in the fourth processing step.

Next, a first modification to a fifth modification of the first embodiment of the present invention will be described with reference to FIGS. 3, 7, and 9 to 14. In particular, when describing the determination unit 51a, the execution unit 51b, the memory unit 53, and the output unit 55, please refer to FIG.

(First Modification)

A substrate processing apparatus SP according to a first modified example of the first embodiment will be described with reference to FIGS. 3 and 9. In the first modification, although abnormal vibration is continuously detected for a predetermined time or longer, it is different from the first embodiment described with reference to FIGS. 1 to 8 in that it corresponds to a case where the substrate W is not properly held. . As for other points, as shown in FIG. 3, the configuration of the substrate processing apparatus SP of the first modification is the same as that of the substrate processing apparatus SP of the first embodiment. Hereinafter, differences between the first modification and the first embodiment will be mainly described.

FIG. 9 shows the waveform of the vibration signal Sv output from the detection section SN. The horizontal axis shows time, and the vertical axis shows the level (G or V) of the vibration signal Sv.

As shown in FIG. 9, in the period T3, the determination unit 51a determines whether the level of the vibration signal Sv has exceeded the predetermined vibration range RG. Next, at time t0, when the determination unit 51a determines that the level of the vibration signal Sv has exceeded the predetermined vibration range RG, the counter starts. Next, the counter starts measuring at a predetermined time Tc. The predetermined time Tc indicates the time from time t0 to time t1.

Further, the determination unit 51a determines whether the number of times Na at which the level of the vibration signal Sv has exceeded the predetermined vibration range RG is determined to be a predetermined number Nb or more within a predetermined time Tc from the start of the counter. Times Na indicates the number of times that abnormal vibration has been detected. The predetermined number Nb is a complex number (for example, an integer of 2 or more). The case where it is determined that the number of times Na is equal to or more than the predetermined number Nb within the predetermined time Tc indicates that the abnormal vibration continues to occur. The predetermined time Tc and the predetermined number Nb are determined experimentally and / or empirically in consideration of the installation environment of the processing device 1.

For example, the determination unit 51a determines whether the level of the vibration signal Sv exceeds the predetermined vibration range RG every time the vibration signal Sv is received at a certain interval. Alternatively, for example, the determination unit 51a determines whether the extreme value EV of the vibration signal Sv has exceeded a predetermined vibration range RG. The number of times Na indicates the number of times that it is determined that the extreme value EV has exceeded the predetermined vibration range RG. Extreme value EV refers to the local maximum or minimum of the vibration signal Sv.

In accordance with the affirmative determination made by the determination section 51a, the execution section 51b executes a predetermined process (for example, issuing an alarm or stopping rotation). The positive determination is a case where the display number Na is equal to or more than a predetermined number Nb within a predetermined time Tc, and corresponds to a case where it has been detected that the substrate W is not properly held.

On the other hand, the determination unit 51a resets the counter when it is determined that the number of times Na is less than the predetermined number Nb within a predetermined time Tc as a negative determination. The negative determination corresponds to a case where the substrate W has not been properly held.

As described above with reference to FIG. 9, according to the first variation, it is determined whether the number of times Na where abnormal vibration has been detected is equal to or greater than a predetermined number Nb within a predetermined time Tc, and the holding state of the substrate W is detected. Therefore, erroneous detection caused by sudden abnormal vibration or noise can be reduced, and the reliability of detection can be further improved when detecting the holding state of the substrate W.

In addition, according to the first variation, the holding state of the substrate W can also be easily detected using the first threshold value TH1.

That is, the determination unit 51a determines whether the absolute value of the level of the vibration component Sc is greater than the first threshold value TH1. Next, the determination unit 51a determines whether the absolute value of the level of the vibration component Sc is greater than the first threshold value TH1 a number of times Na is greater than a predetermined number Nb within a predetermined time Tc, and detects the holding state of the substrate W .

(Second Modification)

A substrate processing apparatus SP according to a second modification of the first embodiment will be described with reference to FIGS. 3, 7, 10, and 11. The difference from the first embodiment described with reference to FIGS. 1 to 8 is that, in the second modification, in order to detect the holding state of the substrate W, a first predetermined vibration range RG1 and a second predetermined vibration range RG2 are established. . In other directions, as shown in FIG. 3, the configuration of the substrate processing apparatus SP of the second modification is the same as that of the substrate processing apparatus SP of the first embodiment. Hereinafter, differences between the second modification and the first embodiment will be mainly described.

(A) and (b) of FIG. 10 show the first predetermined vibration range RG1 and the second predetermined vibration range RG2 of the second modification. The horizontal axis shows time, and the vertical axis shows the level (G or V) of the vibration signal Sv.

As shown in (a) of FIG. 10, a first predetermined vibration range RG1 and a second predetermined vibration range RG2 are established. The memory unit 53 stores: a first predetermined value A1, which displays a value at one end of the first predetermined vibration range RG1; a second predetermined value A2, which displays a value at the other end of the first predetermined vibration range RG1; a third predetermined value A3 is a value showing one end of the second predetermined vibration range RG2; and a fourth predetermined value A4 is a value showing the other end of the second predetermined vibration range RG2.

The first predetermined value A1 and the third predetermined value A3 are established in correspondence with the vibration component in the first direction D1. The second predetermined value A2 and the fourth predetermined value A4 are established in correspondence with the vibration component in the second direction D2. In the second variation, the absolute value of the first predetermined value A1 is the same as the absolute value of the second predetermined value A2, and the absolute value of the third predetermined value A3 is the same as the absolute value of the fourth predetermined value A4. The absolute value of the third predetermined value A3 is larger than the absolute value of the first predetermined value A1. Therefore, the second predetermined vibration range RG2 is larger than the first predetermined vibration range RG1.

Specifically, the first predetermined value A1 is a first threshold value TH1 for comparison with the level of the vibration component Sc; the third predetermined value A3 is a second threshold value for comparison with the level of the vibration component Sc. Limit TH2. The memory unit 53 stores a first threshold value TH1 and a second threshold value TH2. The second threshold value TH2 is larger than the first threshold value TH1. The first predetermined vibration range RG1 and the second predetermined vibration range RG2 are determined experimentally and / or empirically in consideration of the installation environment of the processing device 1.

Next, the determination unit 51 a and the execution unit 51 b will be described with reference to FIG. 10. The determination unit 51a determines whether the level of the vibration signal Sv has exceeded the first predetermined vibration range RG1, and determines whether the level of the vibration signal Sv has exceeded the second predetermined vibration range RG2.

The determination unit 51a determines that the level of the vibration signal Sv is within the first predetermined vibration range The situation in RG1 corresponds to a situation where it has been detected that the substrate W is properly held by the rotation jig 5c.

On the other hand, with respect to the vibration signal Sv shown in (a) of FIG. 10, the determination unit 51a determines that the level of the vibration signal Sv exceeds the first predetermined vibration range RG1 and the level of the vibration signal Sv is the second predetermined Within the vibration range RG2. Such a judgment is described as a "first judgment". The case where the determination unit 51a makes the first determination corresponds to a case where it has been detected that the substrate W is not properly held by the rotation jig 5c. In the case where the first determination is made, the degree of the inappropriate holding state of the substrate W is small, and the urgency is also small. This is because the level of the vibration signal Sv is within the second predetermined vibration range RG2 and the abnormal vibration is small.

The execution unit 51b executes the first process according to the first determination as a preset process. The first process includes, for example, a process for issuing a first alert. The first alert is, for example, a notification including a content that has responded to a lower urgency.

The first process includes, for example, a process for stopping the rotation of the rotation jig 5c after the process on the substrate W is completed. This is because the degree of improper holding of the substrate W is small, and the processing in execution can be terminated. In addition, this is because the re-execution of the processing in execution is suppressed, which leads to an increase in processing time. The processing being executed is, for example, any one of the first to fourth processing steps.

The first processing system includes, for example, processing for controlling the transfer robot CR so that a new substrate W is not loaded into the processing apparatus 1. This is to prevent the carrying-in operation and to ensure the working time for the part that is used for the preparation, repair, or replacement of the substrate W that is not properly held.

In addition, with respect to the vibration signal Sv shown in FIG. 10 (b), the determination unit 51a determines that the level of the vibration signal Sv has exceeded the second predetermined vibration range RG2. Such a judgment is described as a "second judgment". The case where the determination unit 51a makes the second determination corresponds to a case where it has been detected that the substrate W is not properly held by the rotation jig 5c. In the case where the second judgment is made, the failure of the substrate W The degree of proper maintenance is greater, and the urgency is also higher. This is because the level of the vibration signal Sv exceeds the second predetermined vibration range RG2 and the abnormal vibration is large.

The execution unit 51b executes a second process different from the first process as a preset process in accordance with the second determination. The second process includes, for example, a process for issuing a second alert. The second alert is, for example, a notification including a content that has responded to a higher urgency.

The second processing includes, for example, the following processing: In response to the second determination, the rotation of the rotation jig 5c is stopped immediately. This is because the degree of improper holding of the substrate W is large and the urgency is high.

The second process includes, for example, a process of controlling the first to third shields so that at least one of the first to third shields 13a to 13c does not descend from the shield position. At least one of the driving sections 15c. This is to prevent the substrate W from colliding with each of the components in the chamber 3 by at least one of the first protective cover 13a to the third protective cover 13c when the substrate W has come off.

As described above with reference to FIG. 10, according to the second modification, in order to detect the holding state of the substrate W, the first predetermined vibration range RG1 and the second predetermined vibration range RG2 are set. Therefore, it is possible to take corrective measures (first processing or second processing) in accordance with the degree of the inappropriate holding state of the substrate W.

Next, a vibration detection method according to a second modification will be described with reference to FIGS. 7 and 11. As shown in FIG. 7, the vibration detection method according to the second modification includes steps S1 to S15. However, the substrate processing apparatus SP of the second modified example performs the vibration analysis process shown in FIG. 11 in the vibration analysis process of step S1. In addition, in the vibration analysis processing of the second modification, in order to determine whether the level of the vibration signal Sv exceeds the first predetermined vibration range RG1 or the second predetermined vibration range RG2, the first threshold value TH1 and the second threshold value are used Value TH2.

FIG. 11 is a flowchart showing a vibration analysis process of the second modification. As shown As shown in FIG. 11, the vibration analysis processing system includes steps S40 to S53. Steps S40 and S41 are the same as steps S20 and S21 shown in FIG. 8, respectively.

As shown in FIG. 11, in step S43, the determination unit 51 a determines whether the absolute value of the level of the vibration component Sc is greater than the first threshold value TH1 and detects the holding state of the substrate W.

Following a negative determination (NO in step S43), the processing returns to the main routine. The negative determination indicates that the level of the vibration signal Sv is within the first predetermined vibration range RG1 and corresponds to a case where the substrate W is appropriately held.

On the other hand, following an affirmative determination (YES in step S43), the process proceeds to step S45. The affirmative determination indicates that the level of the vibration signal Sv has exceeded the first predetermined vibration range RG1, and corresponds to the case where the substrate W has not been properly held.

In step S45, the determination unit 51a determines whether the absolute value of the level of the vibration component Sc is greater than the second threshold value TH2, and detects the holding state of the substrate W.

Following a negative determination (NO in step S45), the process proceeds to step S47. The negative determination indicates a case where the level of the vibration signal Sv is within the second predetermined vibration range RG2, and corresponds to a case where the degree of the inappropriate holding state of the substrate W is small.

In step S47, the execution unit 51b controls the output unit 55 to issue a first alert.

In step S49, the execution unit 51b controls the first driving unit 5a so as to stop the rotation of the rotation jig 5c after the execution of the processing for the substrate W is completed. Then, the process ends.

On the other hand, following a positive determination (YES in step S45), the process proceeds to step S51. The affirmative determination is a case where the level of the vibration signal Sv is shown to have exceeded the second predetermined vibration range RG2, and corresponds to a case where the inappropriate holding state of the substrate W has been detected to a large extent.

In step S51, the execution unit 51b controls the output unit 55 so as to issue a second alert.

In step S53, the execution unit 51b responds to a positive determination (YES in step S45), and controls the first driving unit 5a so as to stop the rotation of the rotation jig 5c immediately.

As described above with reference to FIG. 11, according to the second modification, the determination unit 51 a determines that the absolute value of the level of the vibration component Sc is greater than the first threshold value TH1 and determines that the absolute value is the second threshold value. In the case of the limit value TH2 or less, the execution unit 51b executes the first process as a preset process (step S47, step S49). Therefore, in a case where the degree of the inappropriate holding state of the substrate W is small, it is possible to take corrective measures corresponding to the degree.

In addition, according to the second variation, when it is determined that the absolute value of the level of the vibration component Sv is greater than the second threshold value TH2, the execution unit 51b executes the second process as a preset process (step S51, Step S53). Therefore, in a case where the degree of the inappropriate holding state of the substrate W is large, it is possible to take a correct measure corresponding to the degree.

(Third Variation)

A substrate processing apparatus SP according to a third modification of the first embodiment will be described with reference to Figs. 3, 7, 10, and 12. The difference from the first embodiment described with reference to FIGS. 1 to 8 is that the first modification and the second modification are combined in the third modification. In other respects, as shown in FIG. 3, the configuration of the substrate processing apparatus SP of the third modification is the same as that of the substrate processing apparatus SP of the first embodiment. Hereinafter, differences between the third modification and the first embodiment, the first modification, and the second modification will be mainly described.

As shown in FIG. 10, the determination unit 51a determines whether the level of the vibration signal Sv has exceeded the first predetermined vibration range RG1, and determines whether the level of the vibration signal Sv has exceeded the second predetermined vibration range RG2.

The determination unit 51a determines whether or not the number of times that the level of the vibration signal Sv has exceeded the first predetermined vibration range RG1 within the second predetermined vibration range RG2 is equal to or greater than the predetermined number Nb within the predetermined time Tc. The predetermined number Nb is a complex number (for example, an integer of 2 or more).

Specifically, when the substrate processing apparatus SP executes the vibration detection method according to the third modification, the determination unit 51a determines whether the level of the vibration signal Sv exceeds the first threshold value using the first threshold value TH1 and the second threshold value TH2. The predetermined vibration range RG1 or the second predetermined vibration range RG2.

Next, a vibration detection method according to a third modification will be described with reference to FIGS. 7 and 12. As shown in FIG. 7, the vibration detection method according to the third modification includes steps S1 to S15. However, the substrate processing apparatus SP of the third modification executes the vibration analysis process shown in FIG. 12 in the vibration analysis process of step S11.

FIG. 12 is a flowchart showing a vibration analysis process according to a third modification. As shown in FIG. 12, the vibration analysis process includes steps S60 to S75. Steps S60 and S61 are the same as steps S20 and S21 shown in FIG. 8, respectively. Steps S69 to S75 are the same as steps S47 to S53 shown in FIG. 11, respectively.

As shown in FIG. 12, in step S63, the determination unit 51 a determines whether the absolute value of the level of the vibration component Sc is greater than the first threshold value TH1 and detects the holding state of the substrate W.

Following a negative determination (NO in step S63), the processing returns to the main routine. The negative determination indicates that the level of the vibration signal Sv is within the first predetermined vibration range RG1, and corresponds to the case where it has been detected that the substrate W is properly held.

On the other hand, following a positive determination (YES in step S63), the process proceeds to step S65. The affirmative determination indicates that the level of the vibration signal Sv has exceeded the first predetermined vibration range RG1.

In step S65, the determination unit 51a determines whether the absolute value of the level of the vibration component Sc is greater than the second threshold value TH2, and detects the holding state of the substrate W.

Following a negative determination (NO in step S65), the process proceeds to step S67. The negative determination is a case where the level of the vibration signal Sv is displayed within the second predetermined vibration range RG2.

In step S67, the determination unit 51a determines whether it has been completed within a predetermined time Tc. Affirmative determination of a predetermined number Nb or more (YES in step S63).

Following a negative determination (NO in step S67), the processing returns to the main routine. The negative determination corresponds to a case where it has been detected that the substrate W is properly held.

On the other hand, following a positive determination (YES in step S67), the process proceeds to step S69. The affirmative determination is a case where the level of the vibration signal Sv is within the second predetermined vibration range RG2 and the number of times Na is equal to or more than the predetermined number Nb within the predetermined time Tc, and it is equivalent to detecting that the continuous generation exceeding the first predetermined vibration range RG1 The case of smaller abnormal vibration. That is, the affirmative determination corresponds to a case where it has been detected that the substrate W is not properly held. The degree of the inappropriate holding state of the substrate W is small.

According to the third variation, a condition in which a small abnormal vibration continues (YES in step S67) is used to detect a case where the substrate W is not properly held. Therefore, in a case where a small abnormal vibration is generated alone, erroneous detection of the holding state of the substrate W can be suppressed.

Further, in accordance with an affirmative determination (YES in step S65), the processing proceeds to step S73. The affirmative determination is a case where the level of the vibration signal Sv is shown to have exceeded the second predetermined vibration range RG2, and is equivalent to a case where it has been detected that the substrate W is not properly held. The degree of the inappropriate holding state of the substrate W is large.

According to the third modification, even if the level of the vibration signal Sv temporarily exceeds the second predetermined vibration range RG2, the processing proceeds to steps S73 and S75, and the second processing similar to the second modification is executed. Therefore, in a case where the degree of the inappropriate holding state of the substrate W is large, the second process can be performed quickly.

(Fourth modification)

A substrate processing apparatus SP according to a fourth modification of the first embodiment will be described with reference to FIGS. 3, 8, and 13. The difference from the first embodiment described with reference to FIGS. 1 to 8 is that in the fourth modification, the rotation jig 5c is rotated in a state where the rotation jig 5c does not have the substrate W. on Otherwise, as shown in FIG. 3, the configuration of the substrate processing apparatus SP of the fourth modification is the same as that of the substrate processing apparatus SP of the first embodiment. The differences between the fourth modification and the first embodiment will be mainly described below.

The first driving unit 5a shown in FIG. 3 drives the rotation jig 5c in a state where the substrate W is not present, and rotates the rotation jig 5c in a state where the substrate W is not present. Next, the detection unit SN detects the vibration vb including the vibration sv of the rotation jig 5c while the rotation jig 5c is rotating. On the other hand, in a case where the rotation jig 5c has been rotated in a state where the substrate W is not present, it is highly likely that the abnormal vibration caused by the vibration vb is that the rotation jig 5c is not properly set.

Therefore, according to the fourth modified example, by rotating the rotation jig 5c and analyzing the vibration vb in a state where the substrate W is not present in the rotation jig 5c, the installation state of the rotation jig 5c can be detected. The detection of the installation state of the rotation jig 5c shows a case where the rotation jig 5c is set well or the rotation jig 5c is not set well.

In particular, the fourth modification is effective for inspection before shipment of the substrate processing system 100, the substrate processing apparatus SP, or the processing apparatus 1. For example, as one of the inspections before shipment of the processing device 1, the rotation jig 5 c is rotated in a state where the substrate W is not present, and the installation state of the rotation jig 5 c is detected. Then, in a case where it has been detected that the rotation jig 5c is not set well, the processing device 1 can be shipped after the rotation jig 5c has been set well. For example, the bolt 23 is fastened and the first driving portion 5a connected to the rotation jig 5c is well provided. For example, a connection portion between the rotation base 19 and the shaft 5b is prepared.

Next, a vibration detection method performed by the substrate processing apparatus SP according to a fourth modified example will be described with reference to FIG. 13. FIG. 13 is a flowchart illustrating a vibration detection method according to a fourth modification. As shown in FIG. 13, the vibration detection method includes steps S141 to S147 and detects vibration of the substrate processing apparatus SP.

As shown in FIG. 13, in step S141 (rotation step), the control unit 51 controls the first driving unit 5 a so that the rotation jig 5 c starts to rotate in a state where the rotation jig 5 c does not have the substrate W.

In step S143, the control unit 51 executes a vibration analysis process as a pre-process. Specifically, the determination unit 51a determines whether the level of the vibration signal Sv has exceeded a predetermined vibration range RG ((a) in FIG. 5), detects the setting state of the rotation jig 5c, and performs a preset setting according to the detection result Processing.

The vibration analysis processing of step S143 is the same as the vibration analysis processing shown in FIG. 8. However, as shown in FIG. 8, in step S23 of the fourth modification example, the determination unit 51 a determines whether the absolute value of the level of the vibration component Sc is greater than the first threshold value TH1 and detects whether the rotation fixture 5 c Set the status. Further, the negative determination (NO in step S23) is a case where the level of the vibration signal Sv is displayed within a predetermined vibration range RG, and corresponds to a case where it has been detected that the rotation jig 5c is well set. On the other hand, an affirmative determination (YES in step S23) is a case where the level of the display vibration signal Sv has exceeded the predetermined vibration range RG, and corresponds to a case where it has been detected that the rotation jig 5c is not set well.

Returning to FIG. 13, in step S145, the control unit 51 determines whether or not the vibration analysis processing as the pre-processing has ended.

Following a negative determination (NO in step S145), the control unit 51 proceeds to step S143.

On the other hand, in accordance with an affirmative determination (YES in step S145), the control unit 51 proceeds the process to step S147.

In step S147, the control unit 51 controls the first driving unit 5a so that the rotation of the rotation jig 5c stops. As a result, the rotation jig 5c is stopped. Then, the process ends.

As described above with reference to FIG. 13, the vibration analysis method according to the fourth modification If the substrate W is not present, the rotation jig 5c is rotated (step S141). As a result, the installation state of the rotation jig 5c can be detected.

In addition, in the fourth modification, the position of the detection unit SN is not particularly limited as long as the detection unit SN can detect the vibration sv of the rotation jig 5c or a vibration including the vibration sv. For example, the detection section SN may not be located at the predetermined position SP1.

(Fifth modification)

A substrate processing apparatus SP according to a fifth modification of the first embodiment will be described with reference to FIGS. 3 and 14. The difference from the first embodiment described with reference to FIGS. 1 to 8 is that in the fifth modification, the detection section SN is attached to the first driving section 5a. In other respects, as shown in FIG. 3, the configuration of the substrate processing apparatus SP of the fifth modification is the same as that of the substrate processing apparatus SP of the first embodiment. Hereinafter, differences between the fifth modification and the first embodiment will be mainly described.

(A) of FIG. 14 is a side cross-sectional view showing a part of the processing apparatus 1 according to the fifth modification. (B) in FIG. 14 is a bottom view showing the processing apparatus 1 according to the fifth modification.

As shown in FIG. 14 (a), the detection section SN is disposed outside the chamber 3 and faces the first driving section 5 a. The first driving section 5a is disposed between the rotation jig 5c and the detection section SN.

Specifically, the detection portion SN is a portion 41 (hereinafter referred to as "exposed portion 41") that is attached to the first drive portion 5a and is exposed from the chamber 3. Furthermore, the detection portion SN is attached to the bottom surface 41 a of the exposed portion 41. Further, as shown in (a) in FIG. 14 and (b) in FIG. 14, the exposed portion 41 projects from the first region 3aa. The detection portion SN is preferably attached to the exposed portion 41 on the rotation axis AX.

Hereinafter, in the fifth modification, the position where the detection unit SN is arranged may be described as “predetermined position SP2”. The predetermined position SP2 is the same as the predetermined position SP1 described with reference to FIG. 4. However, the predetermined position SP2 is a position on the exposed portion 41 (specifically, a position on the bottom surface 41a).

As described above with reference to FIG. 14, according to the fifth modification, since the detection section SN faces the first driving section 5 a, the first embodiment can be suppressed in the same manner as the first embodiment described with reference to FIGS. 3 and 4. Vibration of a driving portion other than one of the driving portions 5a is superimposed as noise on a vibration signal Sv for indicating the vibration vb.

In particular, according to the fifth modification, the detection section SN is attached to the exposed portion 41 of the first driving section 5a. Therefore, the detection unit SN can directly detect the vibration vb. As a result, since the detection accuracy of the vibration vb can be improved, the detection reliability can be further improved when the holding state of the substrate W is detected. The exposed portion 41 projects from the base portion 3a. Therefore, it is possible to suppress transmission of vibrations of the driving portions other than the first driving portion 5a to the detection portion SN via the base portion 3a. As a result, it is possible to further suppress the detection section SN from detecting vibration of a driving section other than the first driving section 5a as noise.

In addition, according to a fifth modification, the detection section SN is attached to the exposed section 41. Therefore, it is possible to suppress the processing liquid (the first processing liquid to the third processing liquid) ejected from the inside of the chamber 3 from being splashed onto the detection unit SN. As a result, the deterioration of the detection section SN can be suppressed, and the reliability of the detection section SN can be maintained.

(Second Embodiment)

A substrate processing system 100 according to a second embodiment of the present invention will be described with reference to FIGS. 1, 2, 7, and 15 to 17. The difference from the substrate processing system 100 of the first embodiment is that the substrate processing system 100 of the second embodiment has a first detection unit SN1 having a high sensitivity and a second detection unit SN2 having a low sensitivity. In other respects, as shown in FIGS. 1 and 2, the configuration of the substrate processing system 100 according to the second embodiment is the same as the configuration of the substrate processing system 100 according to the first embodiment. The processing apparatus 1 according to the second embodiment is described as "processing apparatus 1A". Therefore, the substrate processing system 100 according to the second embodiment includes a processing device 1A instead of the processing device 1 according to the first embodiment. Hereinafter, differences between the second embodiment and the first embodiment will be mainly described.

(A) of FIG. 15 is a side cross-sectional view showing a part of the processing apparatus 1A of the substrate processing system 100 according to the second embodiment. As shown in FIG. 15 (a), the processing device 1A is a package A first detection unit SN1 and a second detection unit SN2 are included instead of the detection unit SN of the processing device 1 shown in FIG. 3. The other components of the processing device 1A are the same as those of the processing device 1 shown in FIG. 3. The processing device 1A and the computer unit U3 constitute a substrate processing device SP.

The detection sensitivity of the first detection section SN1 is higher than the detection sensitivity of the second detection section SN2. The detection sensitivity of the first detection unit SN1 is represented by the resolution of the first detection unit SN1 (hereinafter referred to as "first resolution"). The detection sensitivity of the second detection unit SN2 is expressed by the resolution of the second detection unit SN2 (hereinafter referred to as "second resolution"). Since the detection sensitivity of the first detection section SN1 is higher than the detection sensitivity of the second detection section SN2, the first resolution is higher than the second resolution.

Each of the first detection section SN1 and the second detection section SN2 detects the vibration vb including the vibration sv of the rotation jig 5c via the first driving section 5a. Specifically, the first detection unit SN1 detects the vibration vb while the rotation jig 5c is rotating, and outputs a first vibration signal Sv1 indicating the vibration vb. The second detection unit SN2 detects the vibration vb while the rotation jig 5c is rotating, and outputs a second vibration signal Sv2 indicating the vibration vb.

In the second embodiment, the vibration vb is detected as acceleration. Therefore, each of the first vibration signal Sv1 and the second vibration signal Sv2 is an acceleration signal used to indicate the vibration vb. For example, each of the first detection unit SN1 and the second detection unit SN2 includes an acceleration sensor.

The first vibration signal Sv1 includes a vibration component in a first direction D1 (for example, a positive direction) with respect to a preset first reference level BL1 (for example, a zero level), and the first reference level BL1 is equal to the first reference level BL1. Vibration components in the second direction D2 (for example, the negative direction) in which the one direction D1 is opposite. Hereinafter, the vibration component in the first direction D1 and the vibration component in the second direction D2 may be collectively referred to as “vibration component Sc1”.

The second vibration signal Sv2 includes a second reference level relative to a preset second reference level. BL2 (for example, the zero level) is a vibration component in the third direction D3 (for example, the positive direction) and vibration component in the fourth direction D4 (for example, the negative direction) opposite to the third direction D3 with respect to the second reference level BL2. Hereinafter, the vibration component in the third direction D3 and the vibration component in the fourth direction D4 may be collectively referred to as "vibration component Sc2".

In addition, the first reference level BL1 and the second reference level BL2 are not limited to the zero level, and may be vibration levels that are allowable before the rotation of the rotation jig 5c.

Each of the first detection section SN1 and the second detection section SN2 is disposed outside the chamber 3 and faces the first driving section 5a. The first driving unit 5a is disposed between the rotation jig 5c and the first detection unit SN1, and is disposed between the rotation jig 5c and the second detection unit SN2.

Specifically, the first detection section SN1 and the second detection section SN2 are mounted on the outer surface of the chamber 3 (specifically, the base section 3a) so as to face the first drive section 5a through the chamber 3. . The first detection section SN1 and the second detection section SN2 are preferably opposed to the first drive section 5a and symmetrically arranged with respect to the rotation axis AX. The first detection section SN1 is close to the second detection section SN2. In addition, part of the first detection section SN1 and / or part of the second detection section SN2 may face the first driving section 5a.

(B) in FIG. 15 is a bottom view showing the processing device 1A. As shown in FIG. 15 (b), the first detection section SN1 and the second detection section SN2 are attached to the first area 3aa of the base section 3a. The plurality of bolts 23 surround the first detection section SN1 and the second detection section SN2 in the first area 3aa.

Hereinafter, the position where the first detection unit SN1 is arranged will be described as "first predetermined position FPS" and the position where the second detection unit SN2 is arranged will be described as "second predetermined position SPS". The first driving unit 5a is disposed between the rotation jig 5c and the first predetermined position FPS, and is disposed between the rotation jig 5c and the second predetermined position SPS. In addition, each of the first predetermined position FPS and the second predetermined position SPS is displayed at a position facing the first driving section 5 a in the outside of the chamber 3. Home. Specifically, each of the first predetermined position FPS and the second predetermined position SPS displays the position on the first area 3aa.

As described above with reference to FIG. 15, according to the second embodiment, each of the first detection section SN1 and the second detection section SN2 detects the vibration vb including the vibration sv of the rotation jig 5 c. The vibration sv of the rotation jig 5c changes depending on the holding state of the substrate W. Therefore, by analyzing the first vibration signal Sv1 and the second vibration signal Sv2, the holding state of the substrate W can be detected similarly to the first embodiment. In addition, in the second embodiment, compared with the case where the holding state of the substrate W is detected based on the position of the holding member 21, it is possible to reduce false detection when detecting the holding state of the substrate W in the same manner as in the first embodiment. In addition, in the second embodiment, since the first detection section SN1 and the second detection section SN2 are disposed facing the first driving section 5a in the same manner as the detection section SN of the first embodiment, they have the same configuration as the first embodiment. The same effect.

In addition, according to the second embodiment, the small abnormal vibration included in the vibration vb can be detected by the first detection portion SN1 having a high detection sensitivity, and the vibration vb can be detected by the second detection portion SN2 having a low detection sensitivity. The larger abnormal vibration. That is, the characteristics of the first detection unit SN1 and the second detection unit SN2 can be effectively utilized.

Furthermore, according to the second embodiment, the cost of the processing device 1A can be reduced by providing the second detection unit SN2 having a low detection sensitivity compared to the case where two first detection units SN1 having a high detection sensitivity are provided. This is because the second detection section SN2 having a low detection sensitivity is much cheaper than the first detection section SN1 having a high detection sensitivity.

In addition, according to the second embodiment, in a case where the detection unit of any of the first detection unit SN1 and the second detection unit SN2 does not function normally, the analysis is performed from the detection functioning normally. It can detect the holding state of the substrate W by the vibration signal of the unit. Therefore, it is possible to avoid a situation in which the holding state of the substrate W cannot be completely detected.

Next, referring to (a) in FIG. 15, the description of the vibration of the vb by the computer unit U3 will be described. Parsing. The determination unit 51a determines whether the level of the first vibration signal Sv1 has exceeded the first vibration range R1, and detects the holding state of the substrate W. In addition, the determination unit 51a determines whether the level of the second vibration signal Sv2 has exceeded the second vibration range R2, and detects the holding state of the substrate W.

Furthermore, the execution unit 51b determines the processing to be executed after the determination and executes the determined processing based on a combination of the determination result for the first vibration signal Sv1 and the determination result for the second vibration signal Sv2.

Specifically, any one of the third process, the fourth process, and the fifth process is determined as a process to be executed after the determination unit 51a makes a determination. Each of the third process, the fourth process, and the fifth process includes a process for controlling the output unit 55 and issuing an alarm, and / or a process for controlling the first driving unit 5a and stopping the rotation of the rotation jig 5c. In the third process, the fourth process, and the fifth process, all processes may be different, some processes may be different, and all processes may be the same. For example, the third process is the same as the first process of the second modification of the first embodiment, and the fourth process and the fifth process are the same as the second process of the second modification of the first embodiment.

As described above with reference to (a) in FIG. 15, according to the second embodiment, the combination of the determination result for the first vibration signal Sv1 and the determination result for the second vibration signal Sv2 is used to determine the execution to be performed after the determination. deal with. Therefore, it is possible to adopt a correct result which has reflected the detection results of the holding state of the substrate W according to the two detection sections (the first detection section SN1 and the second detection section SN2) and the states (normal / abnormal) of the two detection sections. Measures (third process, fourth process, or fifth process).

Next, the first vibration range R1 and the second vibration range R2 related to the resolutions of the first detection section SN1 and the second detection section SN2 will be described with reference to FIG. 16. Hereinafter, a case where the first resolution is "m (G or V)" and the second resolution is "2m (G or V)" will be described as an example.

(A) in FIG. 16 shows the first vibration range R1. Horizontal axis shows time, vertical The shaft system displays the level (G or V) of the first vibration signal Sv1. In addition, in order to facilitate the explanation of the first resolution, the first vibration signal Sv1 is omitted, and the vibration vb to be detected by the first detection unit SN1 is described. A scale corresponding to the first resolution is attached to the vertical axis.

(B) in FIG. 16 shows the second vibration range R2. The horizontal axis shows time, and the vertical axis shows the level (G or V) of the second vibration signal Sv2. In addition, in order to facilitate the explanation of the second resolution, the second vibration signal Sv2 is omitted, and the vibration vb to be detected by the second detection unit SN2 is described. A scale corresponding to the second resolution is attached to the vertical axis.

As shown in FIGS. 16 (a) and 16 (b), the waveform of the vibration vb input to the first detection section SN1 is the same as the waveform of the vibration vb input to the second detection section SN2. This is because both the first detection section SN1 and the second detection section SN2 are installed in the first area 3aa ((b) in FIG. 15).

Therefore, considering the first resolution and the second resolution and formulating the first vibration range R1 and the second vibration range R2, the high-resolution first detection unit SN1 and the low-resolution second detection unit can be effectively utilized. SN2.

Specifically, as shown in (a) of FIG. 16, a first vibration range R1 is established for the first vibration signal Sv1. The memory unit 53 stores a first specific value B1 for displaying a value at one end of the first vibration range R1 and a second specific value B2 for displaying a value at the other end of the first vibration range R1. The first specific value B1 is established in correspondence with the vibration component in the first direction D1 in the first vibration signal Sv1. The second specific value B2 is established corresponding to the vibration component in the second direction D2 in the first vibration signal Sv1. In the second embodiment, the absolute value of the first specific value B1 is the same as the absolute value of the second specific value B2. Specifically, the first specific value B1 indicates a third threshold value TH3 for comparison with the level of the vibration component Sc1 of the first vibration signal Sv1; the memory unit 53 stores the third threshold value TH3.

In addition, the third threshold TH3 is set to a value higher than the first resolution "m (G)". value. This is because the first resolution is the lowest value of the signal level that can be output by the first detection section SN1.

Specifically, as shown in (b) of FIG. 16, a second vibration range R2 is established for the second vibration signal Sv2. The memory unit 53 stores a third specific value B3 for displaying a value at one end of the second vibration range R2 and a fourth specific value B4 for displaying a value at the other end of the second vibration range R2. The third specific value B3 is established corresponding to the vibration component in the third direction D3 in the second vibration signal Sv2. The fourth specific value B4 is established in correspondence with the vibration component in the fourth direction D4 in the second vibration signal Sv2. In the second embodiment, the absolute value of the third specific value B3 is the same as the absolute value of the fourth specific value B4. Specifically, the third specific value B3 indicates a fourth threshold value TH4 for comparison with the level of the vibration component Sc2 of the second vibration signal Sv2; the memory unit 53 stores the fourth threshold value TH4.

The fourth threshold value TH4 is set to a value of the second resolution "2m (G)" or more. This is because the second resolution is the lowest value of the signal level that can be output by the second detection section SN2.

The first vibration range R1 and the second vibration range R2 are determined experimentally and / or empirically in consideration of the installation environment of the processing device 1A.

In addition, as shown in (a) and (b) of FIG. 16, the third threshold value TH3 for the first detection section SN1 is smaller than the fourth threshold value TH4 for the second detection section SN2 small. This is because the first resolution of the first detection unit SN1 is higher than the second resolution of the second detection unit SN2, so the third threshold value TH3 can be set smaller than the fourth threshold value TH4. This makes it possible to effectively utilize the high-resolution first detection unit SN1.

Furthermore, it is preferable that the third threshold value TH3 for the first detection section SN1 is smaller than the second resolution "2m (G)" for the second detection section SN2. This is due to the vibration that cannot be detected by the second detection unit SN2 with a low resolution and can be detected by the high-resolution first detection unit SN1. The reason that the level corresponding to vb is set to the third threshold is to use the high-resolution first detection section SN1 more effectively.

On the other hand, it is preferable that the fourth threshold value TH4 for the second detection section SN2 is set to the same value as the second resolution “2m (G)” of the second detection section SN2. This is because the fourth threshold value TH4 is set to the lowest value "2m (G)" that can be output by the second detection unit SN2, so that the second detection unit SN2 with a low resolution can be effectively utilized.

Next, a vibration detection method performed by the substrate processing apparatus SP will be described with reference to FIGS. 7 and 17. As shown in FIG. 7, the vibration detection method according to the second embodiment includes steps S1 to S15. However, the substrate processing apparatus SP of the second embodiment performs the vibration analysis process shown in FIG. 17 in the vibration analysis process in step S11. In addition, in the vibration analysis process of the second embodiment, in order to determine whether the level of the first vibration signal Sv1 has exceeded the first vibration range R1, a third threshold value TH3 is used. Furthermore, in order to determine whether the level of the second vibration signal Sv2 has exceeded the second vibration range R2, a fourth threshold value TH4 is used.

FIG. 17 is a flowchart showing a vibration analysis process according to the second embodiment. As shown in FIG. 17, the vibration analysis processing system includes steps S80 to S101.

In step S80 (detection step), the first detection unit SN1 detects the vibration vb including the vibration sv of the rotation jig 5c via the first driving unit 5a. In step S80, the first detection unit SN1 detects vibration at the first predetermined position FPS (predetermined position) while the rotation jig 5c is rotating.

In step S81, the determination unit 51a receives the first vibration signal Sv1 including the vibration component Sc1 from the first detection unit SN1.

In step S82 (detection step), the second detection unit SN2 detects the vibration vb including the vibration sv of the rotation jig 5c via the first driving unit 5a. In step S82, the second detection unit SN2 detects the second predetermined position SPS (predetermined position) while the rotation jig 5c is rotating. vibration.

In step S83, the determination unit 51a receives the second vibration signal Sv2 including the vibration component Sc2 from the second detection unit SN2.

In step S85, the determination unit 51a determines whether the absolute value of the level of the vibration component Sc1 is greater than the third threshold value TH3, and detects the holding state of the substrate W.

Following the affirmative determination (YES in step S85), the processing proceeds to step S87. The affirmative determination indicates that the case where the first vibration signal Sv1 has exceeded the first vibration range R1 is equivalent to the case where the substrate W has not been properly held.

In step S87, the determination unit 51a determines whether the absolute value of the level of the vibration component Sc2 is greater than the fourth threshold value TH4, and detects the holding state of the substrate W.

Following a negative determination (NO in step S87), the process proceeds to step S89. The negative determination indicates that the second vibration signal Sv2 is within the second vibration range R2, and corresponds to a case where the degree of holding state of the substrate W has been detected to be small.

In step S89, the execution unit 51b controls the output unit 55 (equivalent to the third process) so as to issue a third alert. The third alarm is the same as the first alarm in the second modification of the first embodiment.

In step S91, the execution unit 51b controls the first driving unit 5a (corresponding to the third process) so that the rotation and rotation jig 5c is stopped after the processing in execution on the substrate W is finished. Therefore, it is possible to suppress re-execution of the processing being performed, which leads to an increase in processing time, and it is possible to suppress falling of the substrate W.

On the other hand, following an affirmative determination (YES in step S87), the process proceeds to step S93. The affirmative determination indicates a case where the second vibration signal Sv2 has exceeded the second vibration range R2, and corresponds to a case where the inappropriate holding state of the substrate W has been detected to a large extent.

In step S93, the execution unit 51b controls the output by issuing a fourth alarm. Unit 55 (equivalent to the fourth process). The fourth alarm is the same as the second alarm in the second modification of the first embodiment.

In step S95, the execution unit 51b controls the first driving unit 5a (corresponding to the fourth process) in response to an affirmative determination (YES in step S87) and immediately stops the rotation of the rotation jig 5c. This is because the degree of improper holding of the substrate W is large and the urgency is high.

In addition, in accordance with the determination determination (NO in step S85), the process proceeds to step S97. The negative determination indicates that the first vibration signal Sv1 is within the first vibration range R1, and corresponds to the case where it has been detected that the substrate W is properly held.

In step S97, the determination unit 51a determines whether the absolute value of the level of the vibration component Sc2 is larger than the fourth threshold value TH4.

Following a negative determination (NO in step S97), the processing returns to the main routine.

On the other hand, following a positive determination (YES in step S97), the processing proceeds to step S99. The positive determination corresponds to a case where it has been detected that the first detection section SN1 and / or the second detection section SN2 are not functioning normally. This is because the fourth threshold value TH4 is larger than the third threshold value TH3, so that the absolute value of the level of the vibration component Sc1 cannot be theoretically obtained. If it is larger than the fourth threshold (YES in step S97).

In step S99, the execution unit 51b controls the output unit 55 (equivalent to the fifth process) so as to issue a fifth alert. The fifth alert is, for example, a notification that the first detection unit SN1 and / or the second detection unit SN2 is not functioning normally.

In step S101, the execution unit 51b controls the first driving unit 5a (corresponding to the fifth process) in response to an affirmative determination (YES in step S97) and immediately stops the rotation of the rotation jig 5c. This is because the first detection unit SN1 and / or the second detection unit SN2 do not function normally and have high urgency.

As described above with reference to FIG. 17, according to the second embodiment, the absolute value of the level determined as the vibration component Sc1 is larger than the third threshold TH3 and the absolute value of the level determined as the vibration component Sc2 is determined. In the case below the fourth threshold TH4, the execution unit 51b executes the third process as a process to be executed after the determination (step S89, step S91). Therefore, in a case where the degree of the inappropriate holding state of the substrate W by the rotation jig 5c is small, it is possible to take corrective measures corresponding to the degree.

In addition, according to the second embodiment, the absolute value of the level determined as the vibration component Sc1 is larger than the third threshold TH3 and the absolute value of the level determined as the vibration component Sc2 is larger than the fourth threshold TH4 In this case, the execution unit 51b executes the fourth process as the process to be executed after the determination (step S93, step S95). Therefore, in a case where the degree of the inappropriate holding state of the substrate W caused by the rotation jig 5c is large, it is possible to take corrective measures corresponding to the degree.

Furthermore, according to the second embodiment, the fourth process includes the following processes: in response to determining that the absolute value of the level of the vibration component Sc1 is larger than the third threshold TH3 and determining the level of the vibration component Sc2 When the absolute value is larger than the fourth threshold value TH4, the rotation of the rotation jig 5c is stopped immediately (step S95). Therefore, the substrate W can be prevented from falling off immediately.

Furthermore, according to the second embodiment, the absolute value of the level determined as the vibration component Sc1 is equal to or smaller than the third threshold value TH3 and the absolute value of the level determined as the vibration component Sc2 is greater than the fourth threshold value TH4. In this case, the execution unit 51b executes the fifth process as the process executed after the determination (step S99, step S101). Therefore, in a case where the first detection section SN1 and / or the second detection section SN2 do not function normally, correct measures can be taken.

In addition, according to the second embodiment, the fifth process includes the following processes: in response to determining that the absolute value of the level of the vibration component Sc1 is equal to or less than the third threshold TH3 and determining the absolute level of the vibration component Sc1 When the value is larger than the fourth threshold TH4, the rotation of the rotation jig 5c is stopped immediately. Therefore, the first detection section SN1 and / or the second detection section SN2 do not normally operate. When it works, the first detection unit SN1 and / or the second detection unit SN2 can be stopped, inspected, repaired, or replaced.

(Third Embodiment)

A substrate processing system 100 according to a third embodiment of the present invention will be described with reference to FIGS. 1, 2, 7, and 18 to 20. The difference from the substrate processing system 100 according to the first embodiment is that the substrate processing system 100 according to the third embodiment includes a third detection unit SN3 located in the side wall portion 3b of the chamber 3. In other respects, as shown in FIGS. 1 and 2, the configuration of the substrate processing system 100 according to the third embodiment is the same as that of the substrate processing system 100 according to the first embodiment. The processing device 1 according to the third embodiment is described as "processing device 1B". Therefore, the substrate processing system 100 according to the third embodiment includes a processing device 1B instead of the processing device 1 according to the first embodiment. Hereinafter, differences between the third embodiment and the first embodiment will be mainly described.

FIG. 18 is a side cross-sectional view showing the processing apparatus 1B of the substrate processing system 100 according to the third embodiment. As shown in FIG. 18, the processing device 1B further includes a third detection unit SN3 instead of the configuration of the processing device 1 shown in FIG. 3. The other components of the processing device 1B are the same as those of the processing device 1 shown in FIG. 3. The processing device 1B and the computer unit U3 constitute a substrate processing device SP.

The third detection unit SN3 detects the vibration cv of the chamber while the rotation jig 5c is rotating, and outputs a third vibration signal Sv3 indicating the vibration cv. The third detection portion SN3 is attached to the side wall portion 3 b (wall portion) of the chamber 3. For example, it is preferable that the third detection portion SN3 is mounted on or slightly above the central portion in the vertical direction of the side wall portion 3b. This is because the vibration cv of the chamber 3 is larger and the vibration cv is easier to detect in the slightly central portion or the position above the slightly central portion compared to the position further below the slightly central portion. In addition, the third detection portion SN3 may be mounted on a ceiling wall portion (wall portion) of the chamber 3.

According to the third embodiment, the vibration of the chamber 3 can be detected by the third detection section SN3. cv. Therefore, by analyzing the vibration cv, it is possible to take a correct measure corresponding to the degree of the vibration cv of the chamber 3. For example, when the vibration cv of the chamber 3 becomes large, the processing apparatus 1B as a whole is highly likely to vibrate significantly. Therefore, when the vibration cv of the chamber 3 is detected to be large, for example, the processing device 1B can be stopped urgently.

In the third embodiment, the vibration cv system is detected as acceleration. Therefore, the third vibration signal Sv3 is used to indicate the acceleration signal of the vibration cv. For example, the third detection unit SN3 includes an acceleration sensor.

The arrangement, configuration, and operation of the first detection unit SN1 are the same as those of the detection unit SN of the first embodiment. However, in the description of the detection unit SN of the first embodiment, the “vibration signal Sv” is replaced with the “first vibration signal Sv1”. That is, the first detection unit SN1 detects the vibration vb while the rotation jig 5c is rotating, and outputs a first vibration signal Sv1 indicating the vibration vb. The first vibration signal Sv1 is analyzed in the same manner as the vibration signal Sv of the first embodiment, and the holding state of the substrate W is detected.

In the description of the "vibration signal Sv" in the first embodiment, the "reference level BL" is replaced with the "first reference level BL1" and the "vibration component Sc" is replaced with the "vibration component Sc1". That is, the first vibration signal Sv1 includes a vibration component in a first direction D1 with respect to a preset first reference level BL1 and a second direction opposite to the first direction D1 with respect to the first reference level BL1. The vibration component of D2. In addition, the vibration component in the first direction D1 and the vibration component in the second direction may be collectively referred to as "vibration component Sc1".

According to the third embodiment, since the processing device 1B includes the first detection section SN1 that is the same as the detection section SN of the first embodiment, it can be detected by analyzing the first vibration signal Sv1 similarly to the first embodiment. Holding state of the substrate W. In addition, in the third embodiment, as compared with the case where the holding state of the substrate W is detected based on the position of the holding member 21, erroneous detection can be reduced when detecting the holding state of the substrate W in the same manner as in the first embodiment. other aspects, In the third embodiment, the first detection section SN1 similar to the detection section SN of the first embodiment has the same effect as that of the first embodiment.

Next, the analysis of the vibration vb and the vibration cv by the computer unit U3 will be described with reference to FIG. 18. The determination unit 51a determines whether the level of the first vibration signal Sv1 has exceeded the third vibration range R3, and detects the holding state of the substrate W. In addition, the determination unit 51 a determines whether the level of the third vibration signal Sv3 has exceeded the fourth vibration range R4 and detects the vibration state of the chamber 3. The detection of the vibration state of the chamber 3 indicates that the vibration of the chamber 3 is detected as abnormal or the vibration of the chamber 3 is normal.

In addition, the execution unit 51b determines the processing to be executed after the determination and executes the determined processing based on the combination of the determination result for the first vibration signal Sv1 and the determination result for the third vibration signal Sv3.

Specifically, any one of the sixth process, the seventh process, and the eighth process is determined as a process to be executed after the determination unit 51a makes a determination. Each of the sixth process, the seventh process, and the eighth process includes a process for controlling the output unit 55 and issuing an alarm, and / or a process for controlling the first driving unit 5a and stopping the rotation of the rotation jig 5c. In the sixth process, the seventh process, and the eighth process, all processes may be different, some processes may be different, and all processes may be the same. For example, the sixth process is the same as the first process of the second modification of the first embodiment, and each of the seventh process and the eighth process is the same as the second process of the second modification of the first embodiment.

As described above with reference to FIG. 18, according to the third embodiment, the processing to be performed after the determination is determined based on the combination of the determination result for the first vibration signal Sv1 and the determination result for the third vibration signal Sv3. Therefore, it is possible to take corrective measures according to the detection result based on the holding state of the substrate W of the first detection section SN1 and the detection result based on the vibration state of the chamber 3 of the third detection section SN3.

Next, a third vibration range R3 and a fourth vibration range R4 will be described with reference to FIG. 19. (A) in FIG. 19 shows the third vibration range R3. The horizontal axis shows time, and the vertical axis shows the level (G or V) of the first vibration signal Sv1.

As shown in (a) of FIG. 19, a third vibration range R3 is established for the first vibration signal Sv1. The memory unit 53 stores a fifth specific value B5 for displaying the value at one end of the third vibration range R3 and a sixth specific value B6 for displaying the value at the other end of the third vibration range R3. The fifth specific value B5 is established in correspondence with the vibration component in the first direction D1 in the first vibration signal Sv1. The sixth specific value B6 is established in correspondence with the vibration component in the second direction D2 in the first vibration signal Sv1. In the third embodiment, the absolute value of the fifth specific value B5 is the same as the absolute value of the sixth specific value B6. Specifically, the fifth specific value B5 indicates a fifth threshold value TH5 for comparison with the level of the vibration component Sc1 of the first vibration signal Sv1; the memory unit 53 stores the fifth threshold value TH5.

(B) in FIG. 19 shows the fourth vibration range R4. The horizontal axis shows time, and the vertical axis shows the level (G or V) of the third vibration signal Sv3. As shown in FIG. 19 (b), a fourth vibration range R4 is established for the third vibration signal Sv3. The third vibration range Sv3 includes a vibration signal in a fifth direction D5 (for example, a positive direction) relative to a preset third reference level BL3 (for example, zero), and the third reference level BL3 is equal to the third reference level BL3. The vibration component of the sixth direction D6 (for example, the negative direction) opposite to the five directions D5. The third reference level BL3 is not limited to zero, and may be a vibration level that is allowable before the rotation jig 5c rotates. Hereinafter, the vibration component in the fifth direction D5 and the vibration component in the sixth direction D6 may be collectively referred to as "vibration component Sc3".

The memory unit 53 stores a seventh specific value B7 for displaying the value at one end of the fourth vibration range R4 and an eighth specific value B8 for displaying the value at the other end of the fourth vibration range R4. The seventh specific value B7 is established in correspondence with the vibration component in the fifth direction D5 in the third vibration signal Sv3. The eighth specific value B8 is established in correspondence with the vibration component in the sixth direction D6 in the third vibration signal Sv3. In the third embodiment, the absolute value of the seventh specific value B7 and the eighth specific value B8 The absolute values are the same. Specifically, the seventh specific value B7 indicates a sixth threshold value TH6 for comparison with the level of the vibration component Sc3 of the third vibration signal Sv3; the memory unit 53 stores the sixth threshold value TH6.

The third vibration range R3 and the fourth vibration range R4 are determined experimentally and / or empirically by considering the installation environment of the processing device 1B.

Next, a vibration detection method performed by the substrate processing apparatus SP will be described with reference to FIGS. 7, 18, and 20. As shown in FIG. 7, the vibration detection method according to the third embodiment includes steps S1 to S15. However, the substrate processing apparatus SP of the third embodiment performs the vibration analysis process shown in FIG. 20 in the vibration analysis process of step S11. In addition, in the vibration analysis processing of the third embodiment, in order to determine whether the level of the first vibration signal Sv1 has exceeded the third vibration range R3, a fifth threshold value TH5 is used. In addition, in order to determine whether the level of the third vibration signal Sv3 has exceeded the fourth vibration range R4, a sixth threshold value TH6 is used.

FIG. 20 is a flowchart showing a vibration analysis process according to the third embodiment. As shown in FIG. 20, the vibration analysis process includes steps S110 to S131.

In step S110 (detection step), the first detection unit SN1 detects the vibration vb including the vibration sv of the rotation jig 5c via the first driving unit 5a. In step S110, the first detection unit SN1 detects vibration at a predetermined position SP1 while the rotation jig 5c is rotating.

In step S111, the determination unit 51a receives the first vibration signal Sv1 including the vibration component Sc1 from the first detection unit SN1.

In step S112, the third detection unit SN3 detects the vibration cv of the chamber 3. In step S112, the third detection unit SN3 detects vibration at a specific position while the rotation jig 5c is rotating. The specific position indicates the position on the side wall portion 3b or the top wall portion 3c.

In step S113, the determination unit 51a receives the third vibration signal Sv3 including the vibration component Sc3 from the third detection unit SN3.

In step S115, the determination unit 51a determines whether the absolute value of the level of the vibration component Sc1 is greater than the fifth threshold value TH5, and detects the holding state of the substrate W.

Following the positive determination (YES in step S115), the process proceeds to step S117. The affirmative determination indicates a case where the first vibration signal Sv1 has exceeded the third vibration range R3, and corresponds to a case where the substrate W is not properly held.

In step S117, the determination unit 51a determines whether the absolute value of the level of the vibration component Sc3 is greater than the sixth threshold value TH6, and detects the vibration state of the chamber 3.

Following a negative determination (NO in step S117), the process proceeds to step S119. The negative determination indicates that the third vibration signal Sv3 is within the fourth vibration range R4, which is equivalent to the case where the vibration cv of the chamber 3 has been detected to be normal.

In step S119, the execution unit 51b controls the output unit 55 (equivalent to the sixth process) so as to issue a sixth alert. The sixth alarm is the same as the first alarm in the second modification of the first embodiment.

In step S121, the execution unit 51b controls the first drive unit 5a (corresponding to the sixth process) so as to stop the rotation of the rotation jig 5c after the processing of the substrate W is completed. Therefore, it is possible to suppress the re-execution of the processing being performed, which leads to an increase in processing time, and to suppress the falling of the substrate W.

On the other hand, following a positive determination (YES in step S117), the processing proceeds to step S123. The affirmative determination indicates that the third vibration signal Sv3 has exceeded the fourth vibration range R4, and is equivalent to the case where the vibration cv of the chamber 3 has been detected to be abnormal. The case where the vibration cv of the chamber 3 is abnormal is equivalent to the case where the vibration of the chamber 3 is large, and shows that the entire vibration of the processing device 1B is large.

In step S123, the execution unit 51b controls the output unit 55 (equivalent to the seventh process) so as to issue a seventh alarm. The seventh alarm system includes, for example, the intention of a large vibration of the chamber 3 Notice.

In step S125, the execution unit 51b controls the first driving unit 5a (corresponding to the seventh process) in response to an affirmative determination (YES in step S117) and immediately stops the rotation of the rotation jig 5c. This is because the vibration of the entire processing device 1B is large and the urgency is high.

In addition, in accordance with a negative determination (NO in step S115), the process proceeds to step S127. The negative determination indicates that the first vibration signal Sv1 is within the third vibration range R3, and is equivalent to the case where it has been detected that the substrate W is properly held.

In step S127, the determination unit 51a determines whether the absolute value of the level of the vibration component Sc3 is larger than the sixth threshold value TH6.

Following a negative determination (NO in step S127), the processing returns to the main routine.

On the other hand, following a positive determination (YES in step S127), the processing proceeds to step S129. The affirmative determination indicates that the third vibration signal Sv3 has exceeded the fourth vibration range R4, and is equivalent to the case where the vibration cv of the chamber 3 has been detected to be abnormal.

In step S129, the execution unit 51b controls the output unit 55 (equivalent to the eighth process) so as to issue an eighth alarm. The eighth alarm is the same as the seventh alarm, for example.

In step S131, the execution unit 51b controls the first driving unit 5a (equivalent to the eighth process) in response to an affirmative determination (YES in step S127) and immediately stops the rotation of the rotation jig 5c. This is because the vibration of the entire processing device 1B is large and the urgency is high.

As described above with reference to FIG. 20, according to the third embodiment, the determination unit 51 a determines that the absolute value of the level of the vibration component Sc1 is larger than the fifth threshold value TH5 and determines that the absolute level of the vibration component Sc3 is When the value is equal to or smaller than the sixth threshold value TH6, the execution unit 51b executes the sixth process as the process to be executed after the determination (step S119, step S121). That is, in a case where the substrate W is not held properly, correct measures can be taken. As a result, the substrate W can be prevented from falling off in advance.

In addition, according to the third embodiment, the absolute value of the level determined as the vibration component Sc1 is larger than the fifth threshold value TH5 and the absolute value of the level determined as the vibration component Sc3 is larger than the sixth threshold value TH6. In this case, the execution unit 51b executes the seventh process as the process to be executed after the determination (step S123, step S125). That is, in a case where the substrate W is not properly held and the vibration cv of the chamber 3 is abnormal, correct measures can be taken. As a result, the substrate W can be prevented from falling off in advance, and damage to the movable portion of the processing apparatus 1B can be suppressed.

Furthermore, according to the third embodiment, the seventh process includes the following processes: in response to determining that the absolute value of the level of the vibration component Sc1 is larger than the fifth threshold value TH5 and determining the level of the vibration component Sc3 When the absolute value is larger than the sixth threshold value TH6, the rotation of the rotation jig 5c is stopped immediately (step S125). Therefore, the substrate W can be prevented from falling off immediately.

Furthermore, according to the third embodiment, the absolute value of the level determined as the vibration component Sc1 is equal to or smaller than the fifth threshold value TH5 and the absolute value of the level determined as the vibration component Sc3 is greater than the sixth threshold value TH6. In this case, the execution unit 51b executes the eighth process as the process to be executed after the determination (step S129, step S131). That is, in a case where the vibration cv of the chamber 3 is abnormal, correct measures can be taken. As a result, the substrate W can be prevented from falling off in advance, and damage to the movable portion of the processing apparatus 1B can be suppressed.

In addition, according to the third embodiment, the eighth processing includes the following processing: in response to determining that the absolute value of the level of the vibration component Sc1 is equal to or lower than the third threshold TH3 and determining the absolute level of the vibration component Sc3 When the value is larger than the sixth threshold value TH6, the rotation of the rotation jig 5c is stopped immediately. Therefore, the substrate W can be immediately prevented from falling off.

The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above-mentioned embodiments, and various aspects (for example, the following (1) to (4)) can be implemented without departing from the scope of the present invention. In addition, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above embodiments. For example, all structures disclosed in the embodiments may be used. Remove several constituent elements from the constituent elements. Furthermore, the constituent elements of the three different embodiments may be appropriately combined. The drawings are subjective and schematic representations of each constituent element for easy understanding, and the thickness, length, number, and interval of each constituent element of the diagram may be different from the actual situation for the convenience of drawing. In addition, the materials, shapes, sizes, and the like of the respective constituent elements shown in the above-described embodiment are merely examples, and are not particularly limited, and various changes can be made within a range that does not substantially depart from the effects of the present invention.

(1) Each of the detection units SN, SN1, SN2, and SN3 of the first embodiment (including the modified example) to the third embodiment may include a speed sensor and use the vibration vb as a speed detection. Therefore, the vibration signals Sv, Sv1, Sv2, and Sv3 are velocity signals used to indicate vibration. The speed sensor is, for example, a non-contact sensor using the principle of eddy current.

In addition, each of the detection sections SN, SN1, SN2, and SN3 may include a displacement sensor, and use the vibration vb as a displacement detection. Therefore, the vibration signals Sv, Sv1, Sv2, and Sv3 are displacement signals used to indicate vibration. The displacement sensor is, for example, a non-contact sensor using the principle of eddy current. The displacement sensor is, for example, a non-contact sensor using laser light, ultrasonic waves, or infrared rays.

In addition, each of the detection sections SN, SN1, and SN2 may be opposed to the first driving section 5a, may be separated from the base section 3a or the first driving section 5a, or may be located inside the chamber 3. The detection section SN3 can be separated from the chamber 3 or can be located inside the chamber 3.

(2) In the first to fifth modifications, the second embodiment, and the third embodiment of the first embodiment, the predetermined vibration range RG (first threshold value TH1) and the first predetermined vibration range RG1 ( First threshold value TH1), second predetermined vibration range RG2 (second threshold value TH2), first vibration range R1 (third threshold value TH3), second vibration range R2 (fourth threshold value TH4) The third vibration range R3 (the fifth threshold value TH5) and the fourth vibration range R4 (the sixth threshold value TH6) may be different depending on the rotation speed of the rotation jig 5c in the same manner as in the first embodiment. In addition, the value A1 The absolute value of and the absolute value of value A2 may be different. The absolute value of value A3 and the absolute value of value A4 may also be different. The absolute value of value B1 and the absolute value of value B2 may also be different. The absolute value of the value B4 may also be different, the absolute value of the value B5 and the absolute value of the value B6 may also be different, and the absolute value of the value B7 and the absolute value of the value B8 may also be different (Figure 5, Figure 10, Figure 16, Figure 19). ).

(3) The determination unit 51a of the first embodiment (including the modified example) to the third embodiment may also analyze the vibration vb based on the speed signal calculated by integrating the acceleration signal once, and may also be calculated based on the second integration of the acceleration signal. Displacement signal to analyze vibration vb.

(4) The first to third variations of the first embodiment can be applied to each of the first detection section SN1 and the second detection section SN2 of the second embodiment, and can be applied to the first detection section SN1 of the third embodiment. Each of a detection unit SN1 and a third detection unit SN3. The fifth modification of the first embodiment can be applied to each of the first detection section SN1 and the second detection section SN2 of the second embodiment, and can be applied to the first detection section SN1 of the third embodiment. The third detection unit SN3 of the third embodiment may be provided in the processing apparatus 1A of the second embodiment.

In the fourth modification of the first embodiment, the first to third modifications of the first embodiment can be applied to step S143 in FIG. 13. In addition, steps S141 to S147 of FIG. 13 can be performed before step S1 of FIG. 7. In addition, different vibration analysis processing may be performed in step S143 and step S11. In addition, different vibration ranges may be set in steps S143 and S11 as the vibration ranges for detecting the holding state of the substrate W, and different threshold values may also be set in steps S143 and S11 as Thresholds for level comparison of vibration components.

[Industrial availability]

The present invention relates to a substrate processing apparatus and a vibration detection method for processing a substrate, and has industrial applicability.

Claims (26)

A substrate processing device is used for processing a substrate, and is provided with: a rotating part capable of holding the substrate; a driving part for driving the rotating part and rotating the rotating part; a receiving part for receiving the rotating part and the driving And a first detection unit that detects vibration including the vibration of the rotation unit via the driving unit; the driving unit is disposed between the rotation unit and the first detection unit; the first detection unit is disposed between The position facing the driving portion is outside the receiving portion. The substrate processing apparatus according to claim 1, wherein the first detection unit detects the vibration while the rotating unit is rotating and outputs a vibration signal indicating the vibration; the substrate processing apparatus further includes: The determination unit determines whether the level of the vibration signal has exceeded a predetermined vibration range; and the execution unit executes a predetermined process in accordance with the affirmative determination made by the determination unit. The substrate processing apparatus according to claim 2, wherein the preset processing includes processing for issuing an alarm and / or processing for controlling the driving section and stopping the rotation of the rotating section. The substrate processing apparatus according to claim 2 or 3, further comprising a memory unit that stores: a first predetermined value indicating a value at one end of the predetermined vibration range; and a second predetermined value indicating the predetermined value. Values at the other end of the vibration range; the vibration signal includes a vibration component in a first direction relative to a preset reference level and a vibration component in a second direction opposite to the first direction relative to the reference level The first predetermined value is established in correspondence with the vibration component in the first direction; the second predetermined value is established in correspondence with the vibration component in the second direction. The substrate processing apparatus according to claim 2 or 3, wherein the determination unit determines whether the number of times that the level of the vibration signal has exceeded the predetermined vibration range is greater than a predetermined value within a predetermined time; the predetermined value is The plural is displayed; the execution section executes the previously set processing in accordance with the affirmative determination made by the determination section. The substrate processing apparatus according to claim 2 or 3, wherein the predetermined vibration range is different depending on the number of rotations of the rotating portion per unit time. The substrate processing apparatus according to claim 2 or 3, wherein the vibration signal includes a vibration component in a first direction with respect to a preset reference level, and is opposite to the first direction with respect to the reference level The vibration component in the second direction; the substrate processing apparatus further includes: a memory unit that stores a first threshold value and a second threshold value for comparison with the level of the vibration component; the second threshold value Is greater than the first threshold value; the determination unit determines whether the absolute value of the level of the vibration component is greater than the first threshold value, and determines whether the absolute value is greater than the second threshold value In a case where it is determined that the absolute value is greater than the first threshold value and the absolute value is determined to be below the second threshold value, the execution unit executes the first process as the preset process. The substrate processing apparatus according to claim 7, wherein the first processing includes a process of stopping the rotation of the rotating portion after the processing on the substrate is completed. The substrate processing apparatus according to claim 7, wherein in a case where it is determined that the absolute value is greater than the second threshold value, the execution unit executes a second process different from the first process as the preset Processing. The substrate processing apparatus according to claim 9, wherein the second processing includes processing for immediately stopping the rotation of the rotating section in response to a determination that the absolute value is greater than the second threshold value. The substrate processing apparatus according to claim 1, further comprising: a second detection section that detects the vibration including the vibration of the rotating section via the driving section; the driving section is disposed between the rotating section and the first section; Between the two detection sections; the second detection section is opposed to the driving section; the detection sensitivity of the first detection section is higher than the detection sensitivity of the second detection section. The substrate processing apparatus according to claim 11, wherein the first detection unit detects the vibration and outputs a first vibration signal indicating the vibration while the rotation unit is rotating; the second detection unit is connected to the foregoing While the rotating section is rotating, the vibration is detected and a second vibration signal indicating the vibration is output; the substrate processing apparatus further includes: a determining section that determines whether the level of the first vibration signal has exceeded the first vibration Range, and determine whether the level of the second vibration signal has exceeded the second vibration range; and the execution unit determines the determination based on a combination of the determination result of the first vibration signal and the determination result of the second vibration signal. The processing performed, and the aforementioned processing determined. The substrate processing apparatus according to claim 12, wherein the first vibration signal includes a vibration component in a first direction with respect to a preset first reference level, and the vibration component with respect to the first reference level is the same as the first reference level. A vibration component in a second direction opposite to one direction; the second vibration signal includes a vibration component in a third direction with respect to a preset second reference level and a vibration component in the third direction with respect to the second reference level A vibration component in a fourth direction opposite to the direction; the substrate processing apparatus further includes: a memory unit for storing a third threshold value for comparison with the level of the vibration component of the first vibration signal, and a third threshold value for comparison with The fourth threshold value of the level comparison of the vibration component of the second vibration signal; the determination unit determines whether the absolute value of the level of the vibration component of the first vibration signal is greater than the third threshold value And determine whether the absolute value of the level of the vibration component of the second vibration signal is greater than the fourth threshold value; if it is determined to be the ratio of the absolute value In the case where the third threshold is still large and it is determined that the absolute value is below the fourth threshold, the execution unit executes the third process as the aforementioned process performed after the aforementioned judgment; when it is judged that the aforementioned absolute value is In a case where the value is larger than the third threshold value and it is determined that the absolute value is larger than the fourth threshold value, the execution unit executes the fourth process as the aforementioned process performed after the aforementioned judgment; In a case where the absolute value is below the third threshold value and it is determined that the absolute value is greater than the fourth threshold value, the execution unit executes the fifth process as the aforementioned process to be executed after the aforementioned judgment. The substrate processing apparatus according to claim 13, wherein each of the third process, the fourth process, and the fifth process includes a process for issuing an alarm and / or a process for controlling the driving section to stop the rotating section. Processing of rotation. The substrate processing apparatus according to claim 13 or 14, wherein the third processing system includes a process of stopping the rotation of the rotating unit after the processing on the substrate is completed. The substrate processing apparatus according to claim 13 or 14, wherein the fourth processing includes the following processing: in response, it is determined that the absolute value is greater than the third threshold value and it is determined that the absolute value is greater than the fourth value. When the threshold value is still large, the rotation of the rotating part is stopped immediately; the fifth processing includes the following processing: in response, it is determined that the absolute value is below the third threshold value and it is determined that the absolute value is smaller than the first When the four thresholds are still large, the rotation of the rotating part is stopped immediately. The substrate processing apparatus according to claim 1, further comprising: a third detection section for detecting vibration of the storage section; the storage section includes: a base section provided with the driving section; and a wall section; The third detection portion is mounted on the wall portion. The substrate processing apparatus according to claim 17, wherein the first detection unit detects the vibration including the vibration of the rotation unit while the rotation unit is rotating, and outputs a first vibration signal; the third detection unit The vibration detection unit detects the vibration of the storage unit while the rotation unit is rotating, and outputs a third vibration signal. The substrate processing apparatus further includes a determination unit that determines whether the level of the first vibration signal has exceeded the first Three vibration ranges, and determines whether the level of the third vibration signal has exceeded the fourth vibration range; and the execution unit is based on a combination of the determination result of the first vibration signal and the determination result of the third vibration signal The processing to be performed after the determination is determined, and the previously determined processing is performed. The substrate processing apparatus according to claim 18, wherein the first vibration signal includes a vibration component that is in a first direction with respect to a preset first reference level and that the vibration component is the same as the first reference level with respect to the first reference level. A vibration component in a second direction opposite to one direction; the third vibration signal includes a vibration component in a fifth direction with respect to a preset third reference level and a vibration component with respect to the third reference level A vibration component in a sixth direction opposite to the direction; the substrate processing apparatus further includes a memory unit, which stores: a fifth threshold value for comparison with the level of the vibration component of the first vibration signal; and The sixth threshold value is used for comparison with the level of the vibration component of the third vibration signal; the determination unit determines whether the absolute value of the level of the vibration component of the first vibration signal is higher than that of the fifth vibration signal. The limit value is still large, and it is determined whether the absolute value of the level of the vibration component of the third vibration signal is greater than the sixth threshold value; In the case where the pair is larger than the fifth threshold and it is determined that the absolute value is below the sixth threshold, the execution unit executes the sixth process as the aforementioned process performed after the aforementioned judgment; In a case where the absolute value is greater than the fifth threshold value and it is determined that the absolute value is greater than the sixth threshold value, the execution unit executes the seventh process as the aforementioned process performed after the aforementioned judgment; In a case where the absolute value is determined to be equal to or smaller than the fifth threshold value and the absolute value is determined to be greater than the sixth threshold value, the execution unit executes the eighth process as the process performed after the determination. The substrate processing apparatus according to claim 19, wherein each of the sixth processing, the seventh processing, and the eighth processing includes a processing for issuing an alarm and / or a control for controlling the driving section to stop the rotating section. Processing of rotation. The substrate processing apparatus according to claim 19 or 20, wherein the sixth process includes a process of stopping the rotation of the rotating section after the process on the substrate is completed. The substrate processing apparatus according to claim 19 or 20, wherein the seventh processing includes the following processing: in response, it is determined that the absolute value is greater than the fifth threshold value and it is determined that the absolute value is greater than the sixth value. When the threshold value is still large, the rotation of the rotating part is stopped immediately; the eighth processing includes the following processing: in response, it is determined that the absolute value is less than the fifth threshold and the absolute value is determined to be greater than the first When the six threshold value is still large, the rotation of the rotating part is stopped immediately. The substrate processing apparatus according to any one of claims 1, 2, 3, 11, 12, 13, 14, 17, 18, 19, and 20, wherein the first detection unit communicates with the foregoing via the receiving unit. The driving portion is mounted on the outer surface of the accommodating portion so as to face the driving portion. The substrate processing apparatus according to any one of claims 1, 2, 3, 11, 12, 13, 14, 17, 18, 19, and 20, wherein the first detection unit is a slave unit installed in the drive unit. The exposed portion of the receiving portion. The substrate processing apparatus according to any one of claims 1, 2, 3, 11, 12, 13, 14, 17, 18, 19, and 20, wherein the receiving portion includes a base portion and the driving portion is provided On the base portion; the first detection portion is disposed outside the base portion, and faces the driving portion via the base portion in a vertical direction. The substrate processing apparatus according to any one of claims 1, 2, 3, 11, 12, 13, 14, 17, 18, 19, and 20, wherein the receiving portion includes a base portion and the driving portion is provided The base portion; the drive portion has an exposed portion exposed from the base portion; the exposed portion protrudes to the outside of the base portion; the first detection portion is disposed outside the base portion, and It faces the said exposed part in a vertical direction.