JP3243955U - Robotic arm with vibration detection function and image identification function - Google Patents

Abstract

The present invention provides a robot arm equipped with a vibration detection function and an image identification function, which also has functions such as wafer preservation state detection, collision detection, and life prediction. A robot arm of the present invention includes a wafer transport device, a robot arm pivotally mounted on the wafer transport device, an image capture device provided on the robot arm, and at least one first image capture device provided on the robot arm. It consists of a vibration sensor, a second vibration sensor provided within the wafer transport device, and a monitoring device provided on one side of the wafer transport device. The monitoring device includes a state detection section whose information is connected to the image capturing device, and a vibration detection section whose information is connected to the first vibration sensor and the second vibration sensor. With the above structure, the robot arm can have functions such as wafer preservation state detection, collision detection, and life prediction, and prevents the mutual influence of unstable operation of the mechanical structure and erroneous detection factors. This prevents problems and improves the accuracy of movement and judgment. [Selection diagram] Figure 1

Description

The present invention relates to a robot arm, and more particularly to a robot arm having a vibration detection function and an image identification function, which also have functions such as wafer preservation state detection, collision detection, and life prediction.

When taking out wafers, first check the storage condition to ensure that the wafers installed in the wafer cassette are not missing, overlapping, distorted, or warped to prevent wafers from being damaged during the loading and unloading process. There is a need. Therefore, if none of the wafers in the entire wafer cassette have been taken out, the state of storage of the wafers in the wafer cassette is detected, and if the wafers are not placed properly, they are removed until the user clears the error state. Interrupt.

Furthermore, since the wafer manufacturing process involves multiple different processes, a robotic arm must be used to transport the wafers between different facilities. In order to prevent accidental breakage of the wafer, methods for detecting the accuracy of the movements of the robot arm are known, but in general, monitoring devices that can ensure conditions such as operating frequency and behavior in the machine body are known. Therefore, it is not possible to prevent the risk of quality deterioration due to wafers being affected by abnormalities in the machine operation itself.

Therefore, abnormal operation of the robot arm increases the probability of wafer breakage during the wafer transportation process, reduces the working efficiency of the machine, and even causes operation errors, thereby causing the wafer inside the wafer cassette to This also affects the work of detecting the state of wafer storage. On the other hand, the accuracy of identifying the storage state of the wafer also affects the operating frequency of the robot arm, path planning, work efficiency, etc.

However, when using the above-mentioned robot arm, the following problems and drawbacks exist, and improvements are expected.

Because the work of detecting the storage state of the wafer and the work of determining abnormal operation of the machine itself are not integrated, unstable operation in the machine structure and erroneous detection factors mutually influence each other.

By using an image capture device, a first vibration sensor, and a second vibration sensor, the present invention enables a robot arm to have functions such as wafer storage state detection, collision detection, and life prediction. To provide a robot arm equipped with a vibration detection function and an image identification function that can thereby prevent unstable operation and erroneous detection factors in the mechanical structure from interacting with each other and improve accuracy of movement and judgment. With the goal.

To achieve the above objectives, the main structures of the present invention include a wafer transport device, a robot arm, an image capture device, at least one first vibration sensor, a second vibration sensor, a monitoring device, and a status monitoring device. It consists of a detection section and a vibration detection section. The robot arm is pivotally mounted on the wafer transport device, and the image capturing device is installed on the robot arm, and the image capture direction is kept in the same direction as the gripping direction of the robot arm. Accordingly, a wafer image can be acquired, the first vibration sensor is provided on the robot arm, the second vibration sensor is provided in the wafer transport device, and the monitoring device is configured to obtain a wafer image. The state detection section is provided on one side of the transportation device, and the state detection section is connected to the image capture device, and the vibration detection section is connected to the first vibration sensor and the second vibration sensor, and the state detection section is connected to the first vibration sensor and the second vibration sensor. The detection unit determines the state of preservation of the wafer, such as missing, tilted, overlapping, position, and curvature of the wafer based on the wafer image.

In use, the robot arm of the wafer transport device is provided with an image capture device to keep the image capture direction and the gripping direction of the robot arm in the same direction. That is, each time a wafer is grabbed, it is determined whether the storage state of each wafer is normal or not based on the state detection unit of the monitoring device and the wafer image of each wafer. Furthermore, in the process of using the robot arm, the first vibration sensor, the second vibration sensor, and the vibration detection unit detect the collision situation of the robot arm, the vibration prediction of the wafer on the robot arm, and the operating status of the wafer transport device. , and a function to detect component life prediction, etc. is provided. In addition, monitoring equipment consolidates the occurrence of abnormal conditions to prevent unstable operation and false positive factors in the mechanical structure from interacting with each other, thereby increasing the accuracy of movements and decisions. .

With the above-mentioned technology, the work of detecting the storage state of the wafer and the work of determining abnormal operation of the machine itself, which exist in conventional robot arms, are not integrated, resulting in unstable operation and false detection in the machine structure. The problem of mutual influence of elements is solved, and the practical inventive step in the above-mentioned advantages is achieved.

1 is a perspective view of a preferred embodiment of the present invention; FIG. FIG. 3 is a diagram illustrating the storage state of a wafer in a preferred embodiment of the present invention. FIG. 3 is a diagram illustrating vibration monitoring in a preferred embodiment of the present invention; FIG. 3 is a diagram illustrating the implementation of another preferred embodiment of the present invention; FIG. 7 is a diagram showing a shape image of a wafer in another preferred embodiment of the present invention. FIG. 3 is an exploded view of yet another preferred embodiment of the present invention; FIG. 6 is a diagram illustrating the implementation of yet another preferred embodiment of the present invention.

Please refer to FIGS. 1 to 3. 1 to 3 illustrate vibration monitoring from a perspective perspective view in a preferred embodiment of the present invention. As can be seen from the figure, the present invention comprises a wafer transport device 1, a robot arm 2, an image capture device 3, at least one first vibration sensor 21, a second vibration sensor 11, and a monitoring device 4. Become.

In this embodiment, the wafer transport device 1 is an EFEM device (Equipment Front End Module, EFEM).

The robot arm 2 is pivotally installed on the wafer transport device 1 and can grip the wafer 9.

The image capturing device 3 is provided on the robot arm 2, and the image capturing direction thereof is kept in the same direction as the grasping direction of the robot arm 2, so that a wafer image 91 is obtained. The image capture device 3 of this embodiment is exemplified by a camera.

At least one first vibration sensor 21 is provided on the robot arm 2.

A second vibration sensor 11 is provided within the wafer transport device 1 . The first vibration sensor 21 and the second vibration sensor 11 of this embodiment are relative electric sensors, and are a single free vibration system mainly consisting of a spring, a damper, and an inertial mass. Its main function is to measure the vibration situation of rotating machinery, and each device has its own vibration standard, and if the vibration value exceeds the vibration standard, it will indicate that there is an abnormality in the equipment. .

A monitoring device 4 is provided on one side of the wafer transport device 1 and includes a state detection unit 41 whose information is connected to the image capture device 3, and a state detection unit 41 whose information is connected to the first vibration sensor 21 and the second vibration sensor 11. The vibration detecting section 42 is connected to the vibration detecting section 42 . Furthermore, the state detection unit 41 determines the storage state of the wafer 9 such as missing, tilted, overlapping, position, and curvature of the edge based on the wafer image 91. The monitoring device 4 of this embodiment is exemplified by a human-machine interface installed on the wafer transport device 1, and the state detection section 41 and the vibration detection section 42 are exemplified by a processor in the human-machine interface.

The structure of the present technology can be understood from the above description. By matching and combining these structures, the robot arm 2 can have functions such as detecting the storage state of the wafer 9, detecting a collision, and predicting the lifespan. As can be seen from the figure, when assembling the above-mentioned components, the image capture device 3 is structurally fixed on the robot arm 2 of the wafer transport device 1, and the image capture device 3 is controlled by the wafer transport device 1. By simply doing this, the image capturing direction of the image capturing device 3 and the grasping direction of the robot arm 2 can be kept in the same direction during installation. In this way, no matter which direction or height the robot arm 2 grips the wafer 9, the image capture device 3 moves and swings simultaneously with the robot arm 2, so that a single image capture device 3, the storage state of the wafer 9 can be easily identified.

When actually used, before the robot arm 2 actually grasps the wafers, first preparations are made to store the plurality of wafers 9, and identification is performed by checking whether there is any abnormality in the storage state. Verification information of the storage state that meets the criteria is provided to the state detection unit 41, and similarly, other possible abnormal storage states are stored in the state detection unit 41. FIG. 2 shows wafer images 91 in various storage states showing abnormalities. Among them, FIG. 2(A) is a diagram showing a storage state in which the wafer 9 is tilted, FIG. 2(B) is a diagram showing a storage state in which the wafer 9 is overlapped, and FIG. C) is a diagram showing a stored state in which the wafer 9 is missing, and FIG. 2(D) is a diagram showing a distorted stored state in which the wafer 9 is stored.

Regarding vibration sensing, the first vibration sensor 21 of this embodiment is provided at the middle stage and the end of the robot arm 2, so the number is four, and the robot arm 2 of this embodiment is arranged in two layers. As designed, the number is eight. Furthermore, since two first vibration sensors 21 are provided on the multi-axis arm where collisions are likely to occur, the number of first vibration sensors 21 is ten. The second vibration sensor 11 is installed in the elevating mechanism of the wafer transport device 1, and detects changes in the vibration frequency and behavior of both to determine whether the components are attached or whether there are any abnormalities in the settings (vibration whether the number of vibrations stably exceeds the standard), whether the parts have deteriorated over time (the frequency gradually exceeds the standard), whether there is any collision due to external force (the frequency suddenly exceeds the standard) ) will be monitored. For example, as shown in FIG. 3, (A) shows an abnormality in operation, (B) shows an abnormality in life, and (C) shows an abnormality due to external force.

Finally, all detection data is collected and recorded by the monitoring device 4, thereby ensuring quality and safety during the transportation process of the wafer 9 by the robot arm 2, and preventing any influence on the quality of the wafer 9. Instead, preventive repairs and maintenance are performed by simultaneously monitoring the status of the wafer transport device 1 and the robot arm 2. In this way, by detecting the storage state of the wafer 9 in advance before the robot arm 2 grasps it, it is possible to prevent the wafer 9 from being damaged due to the robot arm 2 not being able to grasp it properly or due to an accidental collision. Furthermore, since it is possible to prevent a situation where the robot arm 2 realizes that it cannot properly grasp the wafer 9 until it has moved to the front of the predetermined wafer 9, the unnecessary movement of the robot arm 2 can be reduced, and indirectly , the service life of the wafer transport device 1 is improved. On the other hand, functions such as collision detection of the robot arm 2, vibration prediction of the wafer 9 on the robot arm 2, detection of the operating status of the wafer transport device 1, and prediction of the lifespan of parts can prevent unstable mechanical operation during the transport process. This can prevent erroneous determination of the storage state of the wafer 9 and damage to the wafer 9 itself.

4 and 5 will be referred to together at the same time. 4 and 5 are diagrams illustrating the implementation of another preferred embodiment of the present invention and wafer shape images. As can be seen from the figure, this embodiment and the above embodiment are almost the same, but in this embodiment, a flash device 5 is provided on one side of the image capturing device 3, and the light of the flash device 5 is The direction of application is kept in the same direction as the image capture direction. Furthermore, in operation, when the image capture device 3 is driven and light is applied to the wafer 9, a reflective shape 92 is created on the wafer 9 and a wafer shape image 93 is captured by the image capture device 3. Furthermore, the image capture device 3 is provided with at least one first angle adjustment component 31 and the flash device 5 is provided with at least one second angle adjustment component 51.

Both the image capture device 3 and the flash device 5 are controlled by the wafer transport device 1, and the flash device is controlled by the wafer transport device 1, provided that the image capture direction of the image capture device 3 and the grasping direction of the robot arm 2 are kept the same. The direction of light application and the direction of image capture in step 5 are also kept the same. In this way, by moving and swinging the flash device 5 at the same time as the robot arm 2, the storage state of the wafer 9 can be easily identified using a single image capture device 3 and flash device 5. When the flash device 5 is added, its identification operation causes the wafer 9 to be irradiated with light, thereby creating a reflective shape 92 on the wafer 9. At the same time, the image capturing device 3 is driven to capture an image of the reflective shape 92. is taken in. As shown in FIG. 5, the left side of the screen is the capture range of the image capture device 3, and a reflective shape 92 is generated at the front edge of the wafer 9 within the range directly irradiated with light from the flash device 5. The image capture device 3 captures the image of the reflective shape 92, a wafer shape image 93 is generated (shown in the area surrounded by the wafer line), and finally, the state detection unit saves the wafer shape image 93 based on the standard. The state verification information is compared and the storage state of the wafer 9 is determined. The identification method using the flash device 5 can simplify the message content and amount of verification information, and in particular, the state of edge warpage can be identified by the wafer shape image 93, so that the edge warpage can be easily detected. It is possible to more accurately determine whether there is an abnormality in the storage state.

Furthermore, in this embodiment, the first angle adjustment component 31 and the second angle adjustment component 51 are connected to a metal piece, and both are in the form of a hollow circular arc track, and the image capturing device 3 and the flash device 5 are connected by screws. The angular position of can be adjusted freely. Furthermore, since only one flash device 5 of the present invention needs to be installed, the angle adjustment operation is very simple, and there is no need to match it with other light sources, so there is no need to worry about shadows affecting the accuracy of identification. There is no.

Please refer to FIGS. 6 and 7 at the same time. 6 and 7 are exploded views and implementation views of yet another preferred embodiment of the present invention. As can be seen from the figure, this embodiment is almost the same as the above-mentioned embodiment, but in this embodiment, the robot arm 2 is provided with a protective housing 6, and the image capture device 3 and the flash device 5 are provided. is provided within the protective housing 6. In the installation method of this embodiment, the image capture device 3 is installed inside the protective housing 6 via the first angle adjustment component 31, and the flash device 5 is installed inside the protective housing 6 through the second angle adjustment component 51. Ru. Therefore, the protective housing 6 includes a first positioning hole 61, a second positioning hole 62, at least one first arc-shaped hole 63 formed on one side of the first positioning hole 61, and the second positioning hole 62. At least one second arcuate hole 64 is formed on one side of the hole 62. The first angle adjustment component 31 is provided on the protective housing 6 and has a first swing shaft 311 screwed into the first positioning hole 61 and a first swing shaft 311 screwed into the first arcuate hole 63. At least one first adjustment part 312 is fixed. Further, the second angle adjustment component 51 is provided on the protective housing 6 and has a second swing shaft 511 screwed into the second positioning hole 62 and a second swing shaft 511 screwed into the second arc-shaped hole 64. and at least one second adjustment portion 512 fixed at the same time.

Among them, the first swing shaft 311 is screwed onto the first positioning hole 61 and becomes a positioning shaft for fixing the image capture device 3 on the protective housing 6. By being screwed onto the first arcuate hole 63, it becomes a second fixing point after adjusting the angle of the image capture device 3. Similarly, the second swing shaft 511 becomes a positioning shaft for fixing the flash device 5 on the protective housing 6 by being screwed onto the second positioning hole 62. By screwing and fixing onto the second arc-shaped hole 64, it becomes a second fixing point after adjusting the angle of the flash device 5. In other words, in the installation method of this embodiment, the image capture device 3 is installed inside the protective housing 6 via the first angle adjustment component 31, and the flash device 5 is installed inside the protective housing 6 through the second angle adjustment component 51. will be installed. The protective housing 6 is a gate-shaped metal housing, and is directly fixed on the robot arm 2 by being attached to the image capture device 3 and the flash device 5, and also has the advantage of having a simple structure and being easy to install. Be prepared. Furthermore, the protective housing 6 allows the image capturing device 3 and the flash device 5 to have effects such as collision prevention, dustproofing, and aesthetic appearance.

1 Wafer transport device
11 Second vibration sensor
2 Robot arm
21 First vibration sensor
3 Image capture device
31 First angle adjustment part
311 1st swing axis
312 First adjustment section
4 Monitoring device
41 Status detection section
42 Vibration detection section
5 Flash device
51 Second angle adjustment part
511 2nd swing axis
512 Second adjustment section
6 Protective housing
61 First positioning hole
62 Second positioning hole
63 First arc hole
64 Second arc hole
9 wafer
91 Wafer image
92 Reflection shape
93 Wafer shape image

Claims (9)

A robot arm comprising a vibration detection function and an image identification function, comprising a wafer transport device, a robot arm, an image capture device, at least one first vibration sensor, a second vibration sensor, and a monitoring device, the robot arm comprising:
The robot arm is pivotally mounted on the wafer transport device to grasp the wafer;
The image capturing device is provided on the robot arm, and the image capturing direction thereof is kept in the same direction as the grasping direction of the robot arm, so that a wafer image is obtained;
the at least one first vibration sensor is provided on the robot arm;
the second vibration sensor is provided within the wafer transport device;
The monitoring device is provided on one side of the wafer transport device, and includes a state detection unit having information connected to the image capturing device, and a vibration sensor having information connected to the first vibration sensor and the second vibration sensor. The wafer includes a detection unit, and the state detection unit determines storage conditions such as missing, tilted, overlapping, position, and curvature of the edge of the wafer based on the wafer image. A robot arm equipped with vibration detection and image identification functions. A flash device is provided on one side of the image capture device, and the direction of illumination thereof is kept in the same direction as the image capture direction, and further, when activated, the image capture device is driven and the light is emitted. The robot arm with vibration detection and image identification functionality according to claim 1, characterized in that when applied to a wafer, the wafer has a reflective shape and a wafer shape image is captured by the image capture device. . The robot arm with vibration detection function and image identification function according to claim 1, characterized in that the image capture device is provided with at least one first angle adjustment part. The robot arm with vibration detection function and image identification function according to claim 2, characterized in that the flash device is provided with at least one second angle adjustment component. 3. The vibration detection function and image identification function according to claim 2, wherein a protective housing is provided on the robot arm, and the image capture device and the flash device are provided within the protective housing. Robot arm equipped. The robot arm with vibration detection function and image identification function according to claim 5, characterized in that the image capture device comprises at least one first angle adjustment part provided on the protective housing. The protective housing includes a first positioning hole and at least one first arc-shaped hole formed on one side of the first positioning hole, and the first angle adjustment component is screwed into the first positioning hole. The vibration detection function and image according to claim 6, characterized in that the vibration detecting function and image comprises a first swing axis fixed in a joint and at least one first adjustment part fixed in a threaded manner in the first arcuate hole. Robotic arm with identification function. The robot arm with a vibration detection function and an image identification function according to claim 5, wherein the flash device includes at least one second angle adjustment component provided on the protective housing. The protective housing includes a second positioning hole and at least one second arc-shaped hole formed on one side of the second positioning hole, and the second angle adjustment component is screwed into the second positioning hole. The vibration detection function and image according to claim 8, characterized in that the second swing axis is fixed in a joint and at least one second adjustment part is fixed in a threaded manner in the second arc-shaped hole. Robotic arm with identification function.

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